TW202217983A - Die bonding device - Google Patents

Abstract

The present invention provides a die bonding device, which includes a carrier and a bonding platform spaced apart from the carrier, a die ejector arranged at one side of the carrier, a bonder, and a correction module, the latter two of which are arranged between the carrier and the bonding platform. The carrier is configured to hold a soft film and a plurality of dies disposed on the soft film. The die ejector can be repeatedly operated to push the dies onto the bonder, and the bonder can hold the dies by suction and gravity. The correction module is configured to adjust the dies on the bonder to be located at a predetermined position. The bonder can be moved to the bonding platform, and the bonder can synchronously place the dies at the predetermined position onto the bonding platform.

Description

Die bonding device

The present invention relates to a crystal-bonding device, in particular to a crystal grain-bonding device.

As the structure of electronic products is becoming more and more complex, and the demand for various types of die is also increasing, a large number of die are also derived. In the process of manufacturing, a large number of die-bonding operations are required. However, it is difficult for the existing die-bonding device to load more and more die-bonding operations.

Therefore, the inventor believes that the above-mentioned defects can be improved. Nate has devoted himself to research and application of scientific principles, and finally proposes an invention with reasonable design and effective improvement of the above-mentioned defects.

The embodiment of the present invention is to provide a die-bonding device, which can effectively improve the defects that may occur in the existing die-bonding device.

An embodiment of the present invention discloses a die-bonding device, which includes: a supporting table and a die-bonding table, which are spaced apart from each other in a predetermined direction; wherein, the supporting table is used for holding a soft film and arranged on the a plurality of dies on the soft film; a die ejector, located on the side of the bearing platform away from the die bonding platform, and the die ejector includes at least one die ejector capable of operating in the predetermined direction an ejector pin for pushing against the soft film and then pushing against at least one of the die; and a die bonder and a calibration module, which are located between the bearing platform and the die bonder, and the die The die bonder can move between a suction position, a calibration position and a die bond position in sequence, and the die bonder includes at least one suction head; wherein, when the die bonder is in the suction position , at least one of the suction heads faces the die ejector, and at least one of the ejector pins operates repeatedly along the predetermined direction to push a plurality of the dies against the at least one of the suction heads, so that at least one of the dies is pushed against the at least one suction head. One of the suction heads can hold a plurality of the die by gravity and its suction; wherein, when the die bonder is in the calibration position, at least one of the suction heads faces the calibration module, and all The calibration module is used to adjust a plurality of the die held by at least one of the suction heads to a predetermined arrangement position; wherein, when the die bonder is located at the die bond position, at least one of the suction heads Facing the die-bonding stage, and at least one of the suction heads can be used to fix the plurality of the die held by the calibration module on the die-bonding stage.

To sum up, the die bonding device disclosed in the embodiment of the present invention uses the structure matching among the supporting table, the die bonding table, the die ejector, and the die bonding device. , so that the die bonder can effectively use gravity and its suction force to hold a plurality of the die, and then realize the massive transfer of the die between the loading table and the die bonder Therefore, it can meet the requirements of more and more die solidification operations today.

Furthermore, in the die bonding device disclosed in the embodiment of the present invention, the calibration module is further provided, so that a plurality of the dies are arranged on the die bonding stage by the die bonder before they are set on the die bonding table. , a plurality of the die can be fine-tuned to the predetermined arrangement position through the calibration module, so as to meet the requirements of high-precision die bonding operations.

In order to further understand the features and technical content of the present invention, please refer to the following detailed description and accompanying drawings of the present invention, but these descriptions and drawings are only used to illustrate the present invention, rather than make any claims to the protection scope of the present invention. limit.

The following are specific specific examples to illustrate the embodiments of the "die solidification device" disclosed in the present invention, and those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to the actual size, and are stated in advance. The following embodiments will further describe the related technical contents of the present invention in detail, but the disclosed contents are not intended to limit the protection scope of the present invention.

It should be understood that although terms such as "first", "second" and "third" may be used herein to describe various elements or signals, these elements or signals should not be limited by these terms. These terms are primarily used to distinguish one element from another element, or a signal from another signal. In addition, the term "or", as used herein, should include any one or a combination of more of the associated listed items, as the case may be.

[Example 1]

Please refer to FIG. 1 to FIG. 5 , which are Embodiment 1 of the present invention. The present embodiment discloses a die bonding apparatus 100, which is used for performing a die bonding operation on a plurality of dies 300 disposed on a soft film 200 according to actual requirements. In this embodiment, the soft film 200 refers to a carrier that can be elastically deformed, and the type of the die 300 can be a miniature light-emitting diode (mini LED), but the actual type of the die 300 can be determined according to Adjustments and changes (eg, semiconductor die) are made according to design requirements, which are not limited in the present invention.

The die-bonding device 100 in this embodiment includes a supporting table 1 and a die-bonding table 2 that are spaced apart from each other, a die ejector 3 located on one side of the supporting table 1 , an electrical A stage camera 4 coupled to the die ejector 3 , a die bonder 5 and a calibration module 6 located between the carrier stage 1 and the die bonder 2 , and an electrical A die bonder camera 7 is coupled to the die bonder 5 . Wherein, although the die bonding apparatus 100 is described in this embodiment as including the above components, the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the die-bonding device 100 may also omit the stage camera 4 and the die-bonding stage camera 7, or be replaced by other components The stage camera 4 and the die bonding stage camera 7 are provided.

The carrying table 1 and the die bonding table 2 are arranged spaced apart from each other in a predetermined direction H, and the predetermined direction H in this embodiment refers to a plumb-weight direction that is substantially perpendicular to the horizontal plane; The word "vertical" is not limited to only correspond to 90 degrees in this embodiment, and it may correspond to 85 degrees to 95 degrees. Furthermore, the supporting table 1 is used for holding the soft film 200 and the plurality of the die 300 disposed on the soft film 200, so that the plurality of the die 300 face the die bonding table 2; and The die bonding table 2 is used for supporting at least some of the die 300 among the plurality of die 300 arranged according to a predetermined rule according to die bonding requirements.

In more detail, in this embodiment, the support table 1 can move relative to the die ejector 3 and the die bonder 5 along a plane (eg, a horizontal plane) perpendicular to the predetermined direction H. That is to say, the carrier 1 that can move along the plane can be pushed out relative to the die by including (or being connected to) a moving mechanism (not shown, such as a motor and a linear slide rail). The die bonder 3 and the die bonder 5 move, but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the carrying table 1 may also remain stationary, but the die ejector 3 and/or the die bonder 5 are included (or connected to) ) can be moved by a moving mechanism.

The die ejector 3 is located on the side of the carrier table 1 away from the die bonding table 2 (eg, the upper side of the carrier table 1 in FIG. 1 ), and the die ejector 3 includes a A plurality of ejector pins 31 that can operate in the predetermined direction H. In this embodiment, the distance between a plurality of the ejector pins 31 can be maintained within a predetermined range (eg, the distance is kept fixed or slightly adjusted), and each of the ejector pins 31 can operate independently, However, the present invention is not limited to this.

Furthermore, any one of the ejector pins 31 is used for (operating along the predetermined direction H) to push against the soft film 200 and then push against one of the die 300 . It should be noted that the number of the ejector pins 31 included in the die ejector 3 is described in this embodiment as two, but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the number of the ejector pins 31 included in the die ejector 3 may be at least one, which is used to push against the soft film 200 and further Pushing against at least one of the die 300 .

The stage camera 4 is located on a side away from the die ejector 3 of the stage 1 (eg, the upper side of the die ejector 3 in FIG. 1 ). Further, the stage camera 4 may be selectively configured according to design requirements, for example, when the die ejector 3 is at least translucent, the stage camera 4 may be located at the Or, when the die ejector 3 is non-transparent, the stage camera 4 may be located obliquely above the die ejector 3, but The present invention is not limited here. For example, in other embodiments not shown in the present invention, the stage camera 4 may also be located at substantially the same height as the die ejector 3 .

Furthermore, the stage camera 4 can be used to detect the positions of the plurality of dies 300 disposed on the soft film 200, and the die ejector 3 can obtain the stage camera. The result measured by device 4. Wherein, the stage camera 4 detects the positions of the plurality of die 300 disposed on the soft film 200 through the soft film 200 (at least translucent) in this embodiment, However, the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the stage camera 4 may also be disposed between the stage 1 and the die bonding stage 2, and take pictures through the stage The positions of the plurality of dies 300 disposed on the soft film 200 are directly measured by the relative movement between the device 4 and the carrier 1 .

Accordingly, the die ejector 3 can pass the die ejector 3 and the carrier 1 on the basis of the plurality of positions of the die 300 obtained by the carrier camera 4 . The relative movement between the thimbles 31 is used to push the corresponding die 300 that meets the die bonding requirements (for example, the multiple thimbles 31 push against the die 300 belonging to the good product), but the present invention Not limited to this.

The die bonder 5 located between the carrier table 1 and the die bonder table 2 can (by being included or connected to a moving mechanism) sequentially move in a suction position (eg, FIG. 1 and FIG. 2 ), Move between a calibration position (eg: Figure 3) and a die bonding position (eg: Figure 4 and Figure 5). In this embodiment, the die bonder 5 includes a driving part 51 and at least one suction head 52 connected to the driving part 51 , and the at least one suction head 52 can operate along the predetermined direction H. Wherein, the die bonder 5 is rotated by the driving part 51 , so as to change the position of at least one of the suction heads 52 . It should be additionally noted that, the number of the at least one suction head 52 included in the die bonder 5 is described as one in this embodiment, but the present invention is not limited to this.

In more detail, as shown in FIGS. 1 and 2 , when the die bonder 5 is located at the suction position, the suction head 52 faces the plurality of ejector pins 31 of the die ejector 3 ( ), and any one of the ejector pins 31 operates repeatedly along the predetermined direction H to push a plurality of the die 300 against the suction head 52 , so that the suction head 52 can be held by gravity and its suction a plurality of the die 300 .

Furthermore, as shown in FIG. 3 , when the die bonder 5 is in the calibration position, the suction head 52 faces the calibration module 6 , and the calibration module 6 is used to adjust the suction head A plurality of the dies 300 held by 52 are moved to a predetermined arrangement position. Wherein, when the die bonder 5 moves from the suction position to the calibration position, the suction device 52 preferably does not rotate.

More specifically, the calibration module 6 in this embodiment includes a calibration camera 61 and a calibration device 62 (eg, a robotic arm or a suction nozzle) electrically coupled to the calibration camera 61 . The calibration camera 61 faces the suction head 52 at the calibration position and the plurality of the die 300 held thereon, and is used to detect the plurality of the die 300 disposed on the soft film 200 position, and the die bonder 5 can obtain the results measured by the calibration camera 61 . The corrector 62 is adjacent to the die bonder 5 , and the corrector 62 can adjust the suction by contacting and adjusting the position of the die 300 obtained by the correction camera 61 . The plurality of dies 300 held by the head 52 are moved to the predetermined arrangement position.

It should be noted that the calibration camera 61 is located on the upper side of the calibration device 62 in this embodiment, but the position of the calibration camera 61 can be selectively configured according to design requirements. For example: when the corrector 62 is at least translucent, the correction camera 61 may be located directly above the corrector 62; or, when the corrector 62 is non-transparent, the corrector 62 The corrector 62 may be moved directly below the correction camera 61 after the detection is completed, or the correction camera 61 may be located obliquely above the corrector 62 , but the invention is not limited herein. For example, in other embodiments not shown in the present invention, the calibration camera 61 can also be located at approximately the same height as the calibration device 62 .

Furthermore, as shown in FIG. 3 to FIG. 5 , when the die bonder 5 moves from the calibration position to the die bond position, the suction unit 52 (which can be driven by the driving part 51 ) rotates 180 degrees. That is to say, when the die bonder 5 is located at the die bond position, the suction head 52 rotates 180 degrees from facing the die ejector 3 , and then faces the die bonder 2 . When the die bonder 5 is located at the die bond position, the suction head 52 faces the die bonder 2 , and the suction head 52 can be used to hold it and be adjusted by the calibration module 6 The subsequent plurality of the die 300 (in the predetermined direction H by the driving unit 51 ) are synchronously arranged on the die bonding table 2 .

In more detail, the camera 7 of the die bonding table is located on the upper side of the bonding table 2 in this embodiment, but the position of the camera 7 of the bonding table can be selectively configured according to design requirements. The die-bonding stage camera 7 faces the die-bonding stage 2 and is used to provide the position of the die-bonding stage 2 required by the suction head 52 to fix the plurality of dies 300 . That is to say, the die bonder 5 can make the suction head 52 hold a plurality of the die at the predetermined arrangement position according to the information provided by the die bonder camera 7 . 300 is synchronously arranged on a predetermined position of the die bonding table 2 .

Accordingly, the die bonding device 100 disclosed in this embodiment passes through the connection between the supporting table 1 , the die bonding table 2 , the die ejector 3 , and the die bonding device 5 . The structure is matched, so that the die bonder 5 can effectively use gravity and its suction to hold a plurality of the die 300 , so as to realize a plurality of the die 300 between the carrying table 1 and the die bonding table 2 The mass transfer effect of the die 300 can thus meet the requirements of more and more die bonding operations nowadays. Wherein, the die ejector 3 and the die bonder 5 can be individually adjusted according to the positions of the plurality of die 300 obtained by the stage camera 4, so that the die The die ejector 3 can accurately eject the corresponding die 300 and enable the die bonder 5 to accurately receive the corresponding die 300 .

Furthermore, the die bonding apparatus 100 is further provided with the calibration module 6 , so that the plurality of dies 300 can be The calibration module 6 enables a plurality of the die 300 to be fine-tuned to the predetermined arrangement position, so as to meet the requirements of high-precision die bonding operations.

In addition, the die bonding device 100 in this embodiment is based on the supporting table 1 and the die bonding table 2 being matched with one of the die ejectors 3 and one of the die bonders 5 but the present invention is not limited to this. For example, in other embodiments not shown in the present invention, the carrying table 1 and the die bonding table 2 can also be divided into a plurality of regions, and each of the regions is matched with one of the die The ejector 3 and one of the die bonders 5.

[Example 2]

Please refer to FIG. 6 to FIG. 10 , which is the second embodiment of the present invention. Since this embodiment is similar to the above-mentioned first embodiment, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the above-mentioned first embodiment will be roughly described below:

In this embodiment, the number of the ejector pins 31 included in the die ejector 3 is described as two, and each ejector pin 31 can operate independently; The number of the suction heads 52 included is further limited to two, but the present invention is not limited thereto.

In more detail, since they are located on the soft film 200 and meet the requirements of die bonding and will be transferred to the die bonding table 2 corresponding to any two of the dies 300 (eg, the dies 300 belonging to good products), Their positions on the soft film 200 may be arranged adjacent to each other. Accordingly, in order to enable the die bonding apparatus 100 to have better operating performance, the die bonding apparatus 100 may have at least one of the following conditions, but the invention is not limited thereto.

The die ejector 3 can adjust the distance G31 between the two ejector pins 31 , and the distance G31 between the two ejector pins 31 can preferably be adjusted to be fixed on the carrying table 1 The distance G300 between two adjacent dies 300 is N times (N is a positive integer), so that the two thimbles 31 can push against any two thimbles located on the soft film 200 synchronously. Die 300. For example, when N is equal to 1, the two ejector pins 31 are used to push the two adjacent die 300 synchronously; but when N is not equal to 1, the two ejector pins 31 are used to synchronize The two non-adjacent die 300 are pushed against each other.

Furthermore, the die bonder 5 can adjust the distance G52 between the two suction heads 52 . Wherein, as shown in FIG. 6 , the distance G52 between the two suction heads 52 located at the suction position corresponds to (eg, is approximately equal to) the distance G31 between the two ejector pins 31 , And the two suction heads 52 are respectively used for receiving the plurality of the die 300 pushed by the two ejector pins 31 (repetitive operation).

As shown in FIG. 6 and FIG. 10 , the distance G52 between the two suction heads 52 at the die bonding position may be different from the distance G31 between the two ejector pins 31 (eg: The distance G52 between the two suction heads 52 located at the die-bonding position is approximately equal to the distance G300 between any two of the die 300 located on the soft film 200 ), so that the The suction head 52 can be used to synchronously dispose a plurality of the dies 300 held by it on the die bonding table 2 according to a predetermined rule.

[Example 3]

Please refer to FIG. 11 and FIG. 12 , which are Embodiment 2 of the present invention. Since this embodiment is similar to the above-mentioned first embodiment, the similarities between the two embodiments will not be repeated, and the differences between this embodiment and the above-mentioned first embodiment will be roughly described below:

In this embodiment, the number of the die bonders 5 included in the die bonding apparatus 100 may be two, and the two die bonders 5 are respectively located at the suction position and the calibration position. , and two of the classification positions, so that the die bonding apparatus 100 can operate more smoothly and efficiently. In more detail, when one of the two die bonders 5 moves to the correction position, the other of the two die bonders 5 moves to the suction position, so that the two The die bonder 5 can be maintained in an operating state synchronously, but the present invention is not limited thereto. For example, in other embodiments not shown in the present invention, the number of the die bonders 5 included in the die bonding apparatus 100 may also be three, which are located at the suction position, the The correction position and the classification position are used to achieve the effect of synchronous operation.

[Technical effects of the embodiments of the present invention]

To sum up, the die bonding device disclosed in the embodiment of the present invention uses the structure matching among the supporting table, the die bonding table, the die ejector, and the die bonding device. , so that the die bonder can effectively use gravity and its suction force to hold a plurality of the die, and then realize the massive transfer of the die between the loading table and the die bonder Therefore, it can meet the requirements of more and more die solidification operations today.

Further, the die bonding device disclosed in the embodiment of the present invention is further provided with the calibration module, so that a plurality of the dies are set on the die bonding table by the die bonder. Previously, a plurality of the die can be fine-tuned to the predetermined arrangement position through the calibration module, so as to meet the requirements of high-precision die bonding operations.

Furthermore, in the die bonding device disclosed in the embodiment of the present invention, the die ejector can pass the The relative movement between the die ejector and the bearing platform, and the plurality of thimbles are used to push against the corresponding die that meet the requirements of die bonding (for example, a plurality of the thimbles are used to push the die belonging to the good product). grain).

In addition, the die bonding device disclosed in the embodiment of the present invention can also be designed through the structural collocation between the various components (for example, the distance between the two thimbles can be adjusted to be fixed on the bearing N times the distance between two adjacent crystal grains of the stage; the distance between the two suction heads located at the suction position corresponds to the distance between the two ejectors; The distance between the two suction heads located at the die-bonding position is different from the distance between the two ejector pins), so as to have better operation performance.

The content disclosed above is only a preferred feasible embodiment of the present invention, and is not intended to limit the patent scope of the present invention. Therefore, any equivalent technical changes made by using the contents of the description and drawings of the present invention are included in the patent scope of the present invention. Inside.

100: Die bonding device 1: Bearing platform 2: Die bonding table 3: Die ejector 31: Thimble 4: Bearing platform camera 5: Die bonder 51: Drive Department 52: suction head 6: Calibration module 61: Correct the camera 62: Corrector 7: Die-bonding camera 200: soft film 300: grain H: predetermined direction G31: Spacing G52: Spacing G300: Spacing

FIG. 1 is a schematic diagram (1) of the operation of the die bonding apparatus according to the first embodiment of the present invention.

FIG. 2 is a schematic diagram (2) of the operation of the die bonding apparatus according to the first embodiment of the present invention.

FIG. 3 is a schematic diagram (3) of the operation of the die bonding apparatus according to the first embodiment of the present invention.

FIG. 4 is a schematic diagram (4) of the operation of the die bonding apparatus according to the first embodiment of the present invention.

FIG. 5 is a schematic diagram (5) of the operation of the die bonding apparatus according to the first embodiment of the present invention.

FIG. 6 is a schematic diagram (1) of the operation of the die bonding apparatus according to the second embodiment of the present invention.

FIG. 7 is a schematic diagram (2) of the operation of the die bonding apparatus according to the second embodiment of the present invention.

FIG. 8 is a schematic diagram (3) of the operation of the die bonding apparatus according to the second embodiment of the present invention.

FIG. 9 is a schematic diagram (4) of the operation of the die bonding apparatus according to the second embodiment of the present invention.

FIG. 10 is a schematic diagram (5) of the operation of the die bonding apparatus according to the second embodiment of the present invention.

FIG. 11 is a schematic diagram (1) of the operation of the die bonding apparatus according to the third embodiment of the present invention.

FIG. 12 is a schematic diagram (2) of the operation of the die bonding apparatus according to the third embodiment of the present invention.

100: Die bonding device

1: Bearing platform

2: Die bonding table

3: Die ejector

31: Thimble

4: Bearing platform camera

5: Die bonder

51: Drive Department

52: suction head

6: Calibration module

61: Correct the camera

62: Corrector

7: Die-bonding camera

200: soft film

300: grain

H: predetermined direction

Claims (10)

A crystal grain solidification device, comprising: A carrying table and a die bonding table, which are arranged in a predetermined direction with an interval from each other; wherein, the carrying table is used for holding a soft film and a plurality of dies arranged on the soft film; A die ejector is located on the side of the bearing platform away from the die bonding platform, and the die ejector includes at least one ejector pin that can operate in the predetermined direction and is used to push against the die ejector. the soft film, and then push against at least one of the die; and A die bonder and a calibration module are located between the support table and the die bonder, and the die bonder can be sequentially between a suction position, a calibration position, and a die bonding position moving, the die bonder includes at least one suction head; Wherein, when the die bonder is located at the suction position, at least one of the suction heads faces the die ejector, and at least one of the ejector pins operates repeatedly along the predetermined direction to eject a plurality of the die ejectors. pellets are pushed against at least one of said suction heads, so that at least one of said suction heads can hold a plurality of said dies by gravity and its suction; Wherein, when the die bonder is at the calibration position, at least one of the suction heads faces the calibration module, and the calibration module is used to adjust the plurality of the suction heads held by the at least one suction head. Die to a predetermined arrangement position; Wherein, when the die bonder is located at the die bond position, at least one of the suction heads faces the die bonder, and at least one of the suction heads can be used to hold it and be held by the calibration module The adjusted plurality of the die is fixed on the die bonding table. The die die bonding device according to claim 1, wherein the die die die bonding device further comprises: a stage camera electrically coupled to the die ejector, and the stage camera is used to detect the positions of the plurality of dies disposed on the soft film; and a die bonder camera electrically coupled to the die bonder, and the die bonder camera is used to provide the die bonder for at least one suction head to fix a plurality of the die Location. The die-bonding device according to claim 1, wherein the number of the die-bonding devices included in the die-die-bonding device is further limited to two, and the two die-bonding devices are respectively located in the Two of the suction position, the calibration position, and the die bonding position. The die bonding device according to claim 1, wherein the calibration module comprises: a calibration camera facing at least one of the pickup heads at the calibration position and a plurality of the dies it holds; and A calibrator, electrically coupled to the calibration camera, is used for contacting and adjusting the plurality of dies held by at least one of the suction heads to the predetermined arrangement position. The die-bonding device according to claim 1, wherein the predetermined direction is further defined as a plumb-weight direction, and the bearing platform can be perpendicular to the die ejector and the die-bonder. A plane movement in the predetermined direction; when the die bonder moves from the suction position to the calibration position, at least one of the suction heads does not rotate, and the die bonder moves from the calibration position When reaching the die-bonding position, at least one of the suction heads rotates 180 degrees. The die bonding device according to claim 1, wherein the number of at least one of the ejector pins included in the die ejector is further limited to a plurality, and the distance between the plurality of ejector pins can be determined by Maintained within a predetermined range, each of the ejector pins can operate independently. The die bonding device according to claim 1, wherein the number of at least one of the ejector pins included in the die ejector is further limited to two, and the die ejector can be adjusted to two The spacing between the thimbles, each of the thimbles can operate independently. The die-bonding device according to claim 7, wherein the distance between the two ejector pins can be adjusted to be equal to the distance between the two adjacent die held on the supporting platform N times, and N is a positive integer. The die bonding device according to claim 6, wherein the number of at least one suction head included in the die bonder is further limited to two, and the die bonder can adjust two suction heads The distance between the heads; wherein, the distance between the two suction heads located at the suction position corresponds to the distance between the two ejectors, and the two suction heads are used for A plurality of the die pushed against by the two thimbles are received. The die-bonding device according to claim 9, wherein the distance between the two suction heads located at the die-bonding position is different from the distance between the two ejector pins.

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