TW202210863A - Lidar system - Google Patents
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本揭示中所述實施例內容是有關於一種光達系統,特別關於一種可即時量測發光元件功率的光達系統。The contents of the embodiments described in the present disclosure relate to a lidar system, especially a lidar system that can measure the power of a light-emitting element in real time.
隨著科技的發展,光達(LIDAR)系統已應用於許多領域。在一些相關技術中,是在組裝測試階段或出廠前對光達系統中的發光元件進行功率量測。然而,這無法確保此發光元件在後續的使用過程中不會發生異常。With the development of science and technology, the LiDAR system has been applied in many fields. In some related technologies, the power measurement of the light-emitting elements in the lidar system is performed at the stage of assembly and testing or before delivery. However, this cannot ensure that the light-emitting element will not be abnormal during subsequent use.
本揭示之一些實施方式是關於一種光達系統。光達系統包含一驅動器、一發光元件、一第一偵測器、一準直鏡、一分光鏡、一反射元件、一透鏡以及一第二偵測器。發光元件用以發出一第一光束以及一第二光束。第一偵測器設置於驅動器以及發光元件之間且用以偵測第一光束的一功率。準直鏡用以準直第二光束以產生一第一準直光。分光鏡穿透第一準直光以產生一穿透光。反射元件用以反射穿透光以產生一第一反射光,並使第一反射光打到量測物並產生散射光。透鏡用以準直量測物的散射光以產生一第二準直光。反射元件更用以反射第二準直光以產生一第二反射光。分光鏡更用以反射第二反射光以產生一第三反射光。第二偵測器用以偵測第三反射光。Some embodiments of the present disclosure relate to a lidar system. The lidar system includes a driver, a light-emitting element, a first detector, a collimating mirror, a beam splitter, a reflecting element, a lens and a second detector. The light-emitting element is used for emitting a first light beam and a second light beam. The first detector is disposed between the driver and the light-emitting element and is used for detecting a power of the first light beam. The collimating mirror is used for collimating the second light beam to generate a first collimated light. The beam splitter transmits the first collimated light to generate a transmitted light. The reflecting element is used for reflecting the penetrating light to generate a first reflected light, and the first reflected light hits the measuring object and generates scattered light. The lens is used for collimating the scattered light of the measuring object to generate a second collimated light. The reflecting element is further used for reflecting the second collimated light to generate a second reflected light. The beam splitter is further used for reflecting the second reflected light to generate a third reflected light. The second detector is used for detecting the third reflected light.
本揭示之一些實施方式是關於一種光達系統。光達系統包含一第一驅動器、一第一發光元件、一第一偵測器、一第一準直鏡、一第一分光鏡、一反射元件、一第一透鏡以及一第二偵測器。第一發光元件用以發出一第一光束以及一第二光束。第一驅動器與第一發光元件之間形成一第一區域。第一光束照射第一驅動器,使第一驅動器反射第一光束以產生一第一待測光。第一偵測器設置於第一區域之外且用以偵測第一待測光。第一準直鏡用以準直第二光線,以產生一第一準直光。第一分光鏡用以穿透第一準直光以產生一第一穿透光。反射元件用以反射第一穿透光以產生一第一反射光,並使第一反射光打到量測物並產生第一散射光。第一透鏡用以準直量測物的第一散射光以產生一第二準直光。反射元件更用以反射第二準直光以產生一第二反射光。第一分光鏡更用以反射第二反射光以產生一第三反射光。第二偵測器用以偵測第三反射光。Some embodiments of the present disclosure relate to a lidar system. The lidar system includes a first driver, a first light-emitting element, a first detector, a first collimating mirror, a first beam splitter, a reflecting element, a first lens, and a second detector . The first light-emitting element is used for emitting a first light beam and a second light beam. A first area is formed between the first driver and the first light-emitting element. The first light beam illuminates the first driver, so that the first driver reflects the first light beam to generate a first light to be measured. The first detector is disposed outside the first area and is used for detecting the first light to be measured. The first collimating mirror is used for collimating the second light to generate a first collimated light. The first beam splitter is used for penetrating the first collimated light to generate a first penetrating light. The reflecting element is used for reflecting the first transmitted light to generate a first reflected light, and the first reflected light hits the measuring object to generate a first scattered light. The first lens is used for collimating the first scattered light of the measuring object to generate a second collimated light. The reflecting element is further used for reflecting the second collimated light to generate a second reflected light. The first beam splitter is further used for reflecting the second reflected light to generate a third reflected light. The second detector is used for detecting the third reflected light.
綜上所述,本揭示中的光達系統可即時量測發光元件的功率,以提高光達系統的可靠度。另外,本揭示將偵測器設置於驅動器以及發光元件之間,可有效利用空間,以避免增加光達系統的體積且避免光路過於複雜。再者,本揭示的光達系統具有設置簡易且成本較低的優點。To sum up, the lidar system in the present disclosure can measure the power of the light-emitting element in real time, so as to improve the reliability of the lidar system. In addition, the present disclosure disposes the detector between the driver and the light-emitting element, which can effectively utilize the space, avoid increasing the volume of the lidar system and avoid the over-complexity of the light path. Furthermore, the lidar system of the present disclosure has the advantages of simple setup and low cost.
下文係舉實施例配合所附圖式作詳細說明,但所提供之實施例並非用以限制本揭示所涵蓋的範圍,而結構操作之描述非用以限制其執行之順序,任何由元件重新組合之結構,所產生具有均等功效的裝置,皆為本揭示所涵蓋的範圍。此外,圖式僅以說明為目的,並未依照原尺寸作圖。為使便於理解,下述說明中相同元件或相似元件將以相同之符號標示來說明。The following examples are described in detail in conjunction with the accompanying drawings, but the provided examples are not intended to limit the scope covered by the present disclosure, and the descriptions of structures and operations are not intended to limit the order of their execution. Any recombination of elements The structure and the resulting device with equal efficacy are all within the scope of the present disclosure. In addition, the drawings are for illustrative purposes only and are not drawn in full scale. For ease of understanding, the same or similar elements in the following description will be described with the same symbols.
在本文中所使用的用詞『耦接』亦可指『電性耦接』,且用詞『連接』亦可指『電性連接』。『耦接』及『連接』亦可指二個或多個元件相互配合或相互互動。As used herein, the term "coupled" may also refer to "electrically coupled," and the term "connected" may also refer to "electrically connected." "Coupled" and "connected" may also refer to two or more elements cooperating or interacting with each other.
參考第1A圖以及第1B圖。第1A圖是依照本揭示一些實施例所繪示光達系統100的示意圖。以第1A圖以及第1B圖示例而言,光達系統100包含驅動器110、偵測器120A、發光元件130、準直鏡140、分光鏡150、偵測器160、反射元件170、處理器180以及透鏡190。第1B圖是依照本揭示一些實施例所繪示第1A圖中的驅動器110、偵測器120A以及發光元件130的上視圖。驅動器110可利用脈衝訊號驅動發光元件130發光。在一些實施例中,驅動器110可利用特殊應用積體電路(application specific integrated circuit,ASIC)或由氮化鎵(GaN)所製作的場效電晶體實現。驅動器110需要有能忍受瞬間高電流的特性。若要正常驅動發光元件130,一般需要數十安培的電流,因此,驅動器110與發光元件130之間的距離通常為毫米等級。舉例而言,驅動器110至發光元件130的距離可小於10毫米。偵測器120A設置於驅動器110以及發光元件130之間。在一些實施例中,發光元件130為雷射二極體(laser diode,LD),但本揭示不以此為限。在一些實施例中,反射元件170為反光鏡。Refer to Figure 1A and Figure 1B. FIG. 1A is a schematic diagram of a
參考第1C圖以及第1D圖。第1C圖是依照本揭示一些實施例所繪示的發光元件130的側視圖。第1D圖是依照本揭示一些實施例所繪示的第1C圖中發光元件130的上視圖。以第1C圖以及第1D圖示例而言,發光元件130包含發光面LA1以及發光面LA2。在一些實施例中,發光元件130的中央可設有走線區域BA。其他走線可設置於走線區域BA。Refer to Figure 1C and Figure 1D. FIG. 1C is a side view of the
如上所述,偵測器120A設置於驅動器110以及發光元件130之間。以第1B圖示例而言,驅動器110以及偵測器120A設置於發光面LA1的一側(例如:圖面上的左側),且發光面LA1朝向偵測器120A的感光面LB。發光元件130包含軸線AL。驅動器110的中心與偵測器120A的中心形成連線P1,且連線P1對齊於軸線AL。As described above, the
以第1A圖示例而言,發光面LA1朝向偵測器120A設置且朝向偵測器120A發出光束L1。發光面LA2朝向準直鏡140設置且朝向準直鏡140發出光束L2。本發明實施例中,自發光面LA1發出的光束L1的光強度小於自發光面LA2發出的光束L2的光強度。In the example of FIG. 1A, the light-emitting surface LA1 is disposed toward the
偵測器120A用以偵測自發光面LA1發出的光束L1的功率,以即時量測發光元件130的功率。處理器180耦接偵測器120A。在一些實施例中,處理器180可將偵測器120A所偵測到的功率以及一門檻值進行比較,以判斷光達系統100是否異常。舉例而言,當偵測器120A所偵測到的功率小於門檻值,處理器180判斷光達系統100發生異常,且提供警示訊號。The
準直鏡140用以準直自發光面LA2發出的光束L2以產生準直光CL1。分光鏡150用以穿透準直光CL1以產生穿透光TL。反射元件170用以反射穿透光TL以產生反射光RL1。反射光RL1打到量測物OB會產生量測物OB的散射光SL。透鏡190用以準直量測物OB的散射光SL以產生準直光CL2。透鏡190亦可達到蒐集更多光的功效。反射元件170用以反射準直光CL2以產生反射光RL1。分光鏡150用以將反射光RL1反射以產生反射光RL2。偵測器160用以偵測反射光RL2。處理器180耦接偵測器160。處理器180用以依據偵測器160所偵測到的反射光RL2以及發光元件130的發光時間執行一飛行測距(time of flight measurement,ToF)程序。在一些實施例中,偵測器160設置於透鏡190的焦點。The
在一些實施例中,偵測器120A不具有放大功能,而偵測器160具有放大功能。舉例而言,偵測器120A可為光偵測器(photo diode,PD),而偵測器160可為雪崩光電二極體(avalanched photodiode,APD)。In some embodiments,
如上所述,在本揭示中,偵測器120A可偵測自發光面LA1發出的光束L1的功率,以即時量測發光元件130的功率。藉此,可即時得知發光元件130或光達系統100是否發生異常,以提高光達系統100的可靠度。As described above, in the present disclosure, the
另外,將偵測器120A設置於驅動器110以及發光元件130之間可有效利用空間。藉此配置,可避免增加光達系統100的系統體積且可避免光路過於複雜。In addition, disposing the
再者,在一些實施例中,偵測器120A可利用較便宜的光偵測器實現。藉此,亦可避免增加過多的成本。Furthermore, in some embodiments,
參考第2A圖。第2A圖是依照本揭示一些其他實施例所繪示驅動器110、偵測器120B以及發光元件130的上視圖。以第2A圖示例而言,驅動器110以及偵測器120B設置於發光面LA1的一側(例如:圖面上的左側),且偵測器120B的感光面LB朝向另一側(例如:圖面上的右側)。發光元件130包含軸線AL。驅動器110的中心與偵測器120A的中心形成連線P2,且連線P2未對齊於軸線AL。Refer to Figure 2A. FIG. 2A is a top view of the
參考第2B圖。第2B圖是依照本揭示一些其他實施例所繪示驅動器110A、偵測器120C以及發光元件130的上視圖。以第2B圖示例而言,驅動器110A以及偵測器120C設置於發光面LA1的一側(例如:圖面上的左側),且偵測器120C的感光面LB朝向另一側(例如:圖面上的右側)。驅動器110A相對於偵測器120C旋轉一個角度。發光元件130包含軸線AL。驅動器110A的中心與偵測器120C的中心形成連線P3,且連線P3未對齊於軸線AL。Refer to Figure 2B. FIG. 2B is a top view of the
參考第3A圖以及第3B圖。第3A圖是依照本揭示一些實施例所繪示的光達系統300的示意圖。第3B圖是依照本揭示一些實施例所繪示第3A圖中的驅動器110、偵測器120D以及發光元件130的上視圖。以第3A圖示例而言,驅動器110與發光元件130之間形成區域A1,該區域A1之範圍為發光元件130之上邊與下邊往驅動器110延伸包圍的區域。偵測器120D設置於區域A1外。以第3B圖示例而言,驅動器110以及偵測器120D設置於發光面LA1的一側(例如:圖面上的左側),且偵測器120D的感光面LB朝向驅動器110。發光元件130包含軸線AL。驅動器110的中心與偵測器120D的中心形成連線P4,且連線P4未對齊於軸線AL。舉例而言,連線P4與軸線AL形成銳角D。Refer to Figures 3A and 3B. FIG. 3A is a schematic diagram of a
再次參考第3A圖。驅動器110用以反射來自發光元件130的發光面LA1的光束L1以產生待測光UL1。而偵測器120D用以接收且偵測被驅動器110所反射的待測光UL1,以即時量測發光元件130的功率。Refer again to Figure 3A. The
在第3A圖的光達系統300中,由於偵測器120D並非設置於驅動器110與發光元件130之間的區域A1中,因此偵測器120D與驅動器110之間的距離可縮短。藉此配置,可達到節省空間的功效。舉例而言,驅動器110至發光元件130的距離可小於5毫米。In the
準直鏡140用以準直自發光面LA2發出的光束L2以產生準直光CL1。分光鏡150用以穿透準直光CL1以產生穿透光TL。反射元件170用以反射穿透光TL以產生反射光RL1。反射光RL1打到量測物OB會產生量測物OB的散射光SL。透鏡190用以準直量測物OB的散射光SL以產生準直光CL2。反射元件170用以反射準直光CL2以產生反射光RL2。分光鏡150用以將反射光RL2反射以產生反射光RL3。偵測器160用以偵測反射光RL3。處理器180耦接偵測器160。處理器180用以依據偵測器160所偵測到的反射光RL3以及發光元件130的發光時間執行一飛行測距程序。The
參考第4圖。第4圖是依照本揭示一些實施例所繪示的光達系統400的示意圖。以第4圖示例而言,光達系統400包含驅動器110-1以及110-2、偵測器120-1以及120-2、發光元件130-1以及130-2、準直鏡140-1以及140-2、分光鏡150-1以及150-2、偵測器160-1以及160-2、反射元件170、處理器180以及透鏡190-1以及190-2。Refer to Figure 4. FIG. 4 is a schematic diagram of a
驅動器110-1、偵測器120-1、發光元件130-1、準直鏡140-1、分光鏡150-1、反射元件170以及透鏡190-1的配置相似於第3A圖中的光達系統300且可形成第一光訊號通道(channel)。驅動器110-2、偵測器120-2、發光元件130-2、準直鏡140-2、分光鏡150-2、反射元件170以及透鏡190-2的配置亦相似於第3A圖中的光達系統300且可形成第二光訊號通道。也就是說,第4圖的光達系統400為多通道(multi-channel)的架構且包含兩個光訊號通道。在一些其他的實施中,光達系統400可包含超過兩個光訊號通道。The configuration of the driver 110-1, the detector 120-1, the light-emitting element 130-1, the collimating mirror 140-1, the beam splitter 150-1, the reflecting
第4圖中的驅動器110-1(110-2)、偵測器120-1(120-2)、發光元件130-1(130-2)的配置可相同於第3B圖中的驅動器110、偵測器120D、發光元件130的配置。以第4圖示例而言,驅動器110-1與發光元件130-1之間形成區域A1。偵測器120-1設置於區域A1外。詳細而言,驅動器110-1以及偵測器120-1設置於發光元件130-1的發光面LA1的一側(例如:圖面上的左側),且偵測器120-1的感光面LB朝向驅動器110-1。發光元件130-1包含一軸線(例如:第3B圖中的軸線AL)。驅動器110-1的中心與偵測器120-1的中心形成一連線(例如:第3B圖中的連線P4),且此連線未對齊於發光元件130-1的軸線。舉例而言,此連線(例如:第3B圖中的連線P4)與發光元件130-1的軸線(例如:第3B圖中的軸線AL)形成銳角(例如:第3B圖中的銳角D)。相似地,驅動器110-2與發光元件130-2之間形成區域A2。偵測器120-2設置於區域A2外。詳細而言,驅動器110-2以及偵測器120-2設置於發光元件130-2的發光面LA1的一側(例如:圖面上的左側),且偵測器120-2的感光面LB朝向驅動器110-2。發光元件130-2包含一軸線(例如:第3B圖中的軸線AL)。驅動器110-2的中心與偵測器120-2的中心形成一連線 (例如:第3B圖中的連線P4),且此連線未對齊於發光元件130-2的軸線。舉例而言,此連線(例如:第3B圖中的連線P4)與發光元件130-2的軸線(例如:第3B圖中的軸線AL)形成銳角(例如:第3B圖中的銳角D)。The configurations of the driver 110-1 (110-2), the detector 120-1 (120-2), and the light-emitting element 130-1 (130-2) in FIG. 4 may be the same as those of the
發光元件130-1或130-2具有兩個不同光強度的發光面LA1以及LA2。發光元件130-1的發光面LA1以及LA2分別用以發出不同光強度的光束L1以及光束L2。驅動器110-1用以反射光束L1以產生待測光UL1。偵測器120-1用以偵測待測光UL1,以即時量測發光元件130-1的功率。準直鏡140-1用以準直光束L2以產生準直光CL1。分光鏡150-1用以穿透準直光CL1以產生穿透光TL1。反射元件170用以反射穿透光TL1以產生反射光RL1。反射光RL1打到量測物OB會產生量測物OB的散射光SL1。透鏡190-1用以準直量測物OB的散射光SL1以產生準直光CL2。反射元件170用以反射準直光CL2以產生反射光RL2。分光鏡150-1用以將反射光RL2反射以產生反射光RL3。偵測器160-1用以偵測反射光RL3,以供處理器180執行飛行測距程序。相似地,發光元件130-2的發光面LA1以及LA2分別用以發出不同光強度的光束L3以及光束L4。驅動器110-2用以反射光束L3以產生待測光UL2。偵測器120-2用以偵測待測光UL2,以即時量測發光元件130-2的功率。準直鏡140-2用以準直光束L4以產生準直光CL3。分光鏡150-2用以穿透準直光CL3以產生穿透光TL2。反射元件170用以反射穿透光TL2以產生反射光RL4。反射光RL4打到量測物OB會產生量測物OB的散射光SL2。透鏡190-2用以準直量測物OB的散射光SL2以產生準直光CL4。反射元件170用以反射準直光CL4以產生反射光RL5。分光鏡150-2用以將反射光RL5反射以產生反射光RL6。偵測器160-2用以偵測反射光RL6,以供處理器180執行飛行測距程序。The light-emitting element 130-1 or 130-2 has two light-emitting surfaces LA1 and LA2 with different light intensities. The light-emitting surfaces LA1 and LA2 of the light-emitting element 130-1 are respectively used to emit light beams L1 and L2 with different light intensities. The driver 110-1 is used to reflect the light beam L1 to generate the light to be measured UL1. The detector 120-1 is used for detecting the light to be measured UL1 to measure the power of the light-emitting element 130-1 in real time. The collimating mirror 140-1 is used to collimate the light beam L2 to generate the collimated light CL1. The beam splitter 150-1 is used to transmit the collimated light CL1 to generate the transmitted light TL1. The
以第4圖示例而言,由於偵測器120-2設置於區域A1與區域A2之間(待測光UL1的光路徑上以及待測光UL2的光路徑上),因此偵測器120-2可阻擋待測光UL1以避免待測光UL1影響到第二光訊號通道,也可阻擋待測光UL2以避免待測光UL2影響到第一光訊號通道。也就是說,第4圖中的光達系統400可降低不同光訊號通道之間的串音(crosstalk)干擾。For the example of FIG. 4, since the detector 120-2 is disposed between the area A1 and the area A2 (on the light path of the light to be measured UL1 and the light path of the light to be measured UL2), the detector 120-2 The light to be measured UL1 can be blocked to prevent the light to be measured UL1 from affecting the second optical signal channel, and the light to be measured UL2 can also be blocked to prevent the light to be measured UL2 from affecting the first optical signal channel. That is, the
綜上所述,本揭示中的光達系統可即時量測發光元件的功率,以提高光達系統的可靠度。另外,本揭示將偵測器設置於驅動器以及發光元件之間,可有效利用空間,以避免增加光達系統的體積且避免光路過於複雜。再者,本揭示的光達系統具有設置簡易且成本較低的優點。To sum up, the lidar system in the present disclosure can measure the power of the light-emitting element in real time, so as to improve the reliability of the lidar system. In addition, the present disclosure disposes the detector between the driver and the light-emitting element, which can effectively utilize the space, avoid increasing the volume of the lidar system and avoid the over-complexity of the light path. Furthermore, the lidar system of the present disclosure has the advantages of simple setup and low cost.
雖然本揭示已以實施方式揭露如上,然其並非用以限定本揭示,任何本領域具通常知識者,在不脫離本揭示之精神和範圍內,當可作各種之更動與潤飾,因此本揭示之保護範圍當視後附之申請專利範圍所界定者為準。Although the present disclosure has been disclosed as above in embodiments, it is not intended to limit the present disclosure. Anyone with ordinary knowledge in the art can make various changes and modifications without departing from the spirit and scope of the present disclosure. The scope of protection shall be determined by the scope of the appended patent application.
100:光達系統
110:驅動器
110A:驅動器
110-1:驅動器
110-2:驅動器
120A:偵測器
120B:偵測器
120C:偵測器
120D:偵測器
120-1:偵測器
120-2:偵測器
130:發光元件
130-1:發光元件
130-2:發光元件
140:準直鏡
140-1:準直鏡
140-2:準直鏡
150:分光鏡
150-1:分光鏡
150-2:分光鏡
160:偵測器
170:反射元件
180:處理器
190:透鏡
190-1:透鏡
190-2:透鏡
300:光達系統
400:光達系統
L1:光束
L2:光束
L3:光束
L4:光束
AL:軸線
P1:連線
P2:連線
P3:連線
P4:連線
D:銳角
LA1:發光面
LA2:發光面
LB:感光面
BA:走線區域
OB:量測物
SL:散射光
SL1:散射光
SL2:散射光
CL1:準直光
CL2:準直光
CL3:準直光
CL4:準直光
RL0:反射光
RL1:反射光
RL2:反射光
RL3:反射光
RL4:反射光
RL5:反射光
RL6:反射光
UL1:待測光
UL2:待測光
TL:穿透光
TL1:穿透光
TL2:穿透光
A1:區域
A2:區域100: Lidar System
110:
為讓本揭示之上述和其他目的、特徵、優點與實施例能夠更明顯易懂,所附圖式之說明如下: 第1A圖是依照本揭示一些實施例所繪示一光達系統的示意圖; 第1B圖是依照本揭示一些實施例所繪示第1A圖中的驅動器、偵測器以及發光元件的上視圖; 第1C圖是依照本揭示一些實施例所繪示的一發光元件的側視圖; 第1D圖是依照本揭示一些實施例所繪示的第1C圖中發光元件的上視圖; 第2A圖是依照本揭示一些其他實施例所繪示驅動器、偵測器以及發光元件的上視圖; 第2B圖是依照本揭示一些其他實施例所繪示驅動器、偵測器以及發光元件的上視圖; 第3A圖是依照本揭示一些實施例所繪示的一光達系統的示意圖; 第3B圖是依照本揭示一些實施例所繪示第3A圖中的驅動器、偵測器以及發光元件的上視圖;以及 第4圖是依照本揭示一些實施例所繪示的一光達系統的示意圖。In order to make the above and other objects, features, advantages and embodiments of the present disclosure more clearly understood, the accompanying drawings are described as follows: 1A is a schematic diagram of a lidar system according to some embodiments of the present disclosure; FIG. 1B is a top view of the driver, detector, and light-emitting element shown in FIG. 1A according to some embodiments of the present disclosure; 1C is a side view of a light-emitting device according to some embodiments of the present disclosure; FIG. 1D is a top view of the light-emitting element shown in FIG. 1C according to some embodiments of the present disclosure; 2A is a top view of a driver, a detector, and a light-emitting element according to some other embodiments of the present disclosure; 2B is a top view of a driver, a detector, and a light-emitting element according to some other embodiments of the present disclosure; 3A is a schematic diagram of a lidar system according to some embodiments of the present disclosure; FIG. 3B is a top view of the driver, detector, and light-emitting element shown in FIG. 3A according to some embodiments of the present disclosure; and FIG. 4 is a schematic diagram of a lidar system according to some embodiments of the present disclosure.
100:光達系統100: Lidar System
110:驅動器110: Drive
120A:偵測器120A: Detector
130:發光元件130: Light-emitting element
140:準直鏡140: collimating mirror
150:分光鏡150: Beamsplitter
160:偵測器160: Detector
170:反射元件170: Reflective element
180:處理器180: Processor
190:透鏡190: Lens
L1:光束L1: Beam
L2:光束L2: Beam
LA1:發光面LA1: Luminous side
LA2:發光面LA2: Luminous side
LB:感光面LB: photosensitive surface
OB:量測物OB: measurement object
SL:散射光SL: scattered light
CL1:準直光CL1: Collimated light
CL2:準直光CL2: Collimated light
RL1:反射光RL1: Reflected Light
RL2:反射光RL2: Reflected Light
RL3:反射光RL3: Reflected Light
TL:穿透光TL: penetrating light
Claims (13)
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