TW202208152A - Thermoplastic liquid crystal polymer molded body - Google Patents

Thermoplastic liquid crystal polymer molded body Download PDF

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TW202208152A
TW202208152A TW110120727A TW110120727A TW202208152A TW 202208152 A TW202208152 A TW 202208152A TW 110120727 A TW110120727 A TW 110120727A TW 110120727 A TW110120727 A TW 110120727A TW 202208152 A TW202208152 A TW 202208152A
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liquid crystal
crystal polymer
thermoplastic liquid
molded body
plasma
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中島崇裕
平松慎二
高橋健
平昂大
小野寺稔
岡本稔
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日商可樂麗股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J7/00Chemical treatment or coating of shaped articles made of macromolecular substances
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate

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Abstract

Provided is a thermoplastic liquid crystal polymer molded body capable of maintaining adhesion even where stored for a long period of time. The thermoplastic liquid crystal polymer molded body includes an adhesive region on at least a part thereof, and the adhesive region satisfies a ratio Er(S)/Er(I) of 0 or higher and 1.50 or lower, wherein the Er(S) denotes an elastic modulus of a surface layer in an indentation depth of 20 nm and the Er(I) denotes an elastic modulus of an inner layer in an indentation depth of 200 nm, both measured in accordance with nanoindentation method.

Description

熱塑性液晶聚合物成形體Thermoplastic liquid crystal polymer molded body

本申請案主張2020年6月9日申請的日本特願2020-100180之優先權,藉由參照而將其全體作為本申請案的一部分引用。This application claims the priority of Japanese Patent Application No. 2020-100180 for which it applied on June 9, 2020, The whole is taken in as a part of this application by reference.

本發明關於接著性優異之熱塑性液晶聚合物成形體。The present invention relates to a thermoplastic liquid crystal polymer molded body having excellent adhesiveness.

熱塑性液晶聚合物成形體係源自熱塑性液晶聚合物之性質,具有優異的介電特性(低介電常數及低介電正切),因此於重視介電特性的用途中受到注目。The thermoplastic liquid crystal polymer molding system is derived from the properties of the thermoplastic liquid crystal polymer, and has excellent dielectric properties (low dielectric constant and low dielectric tangent), and thus attracts attention in applications where dielectric properties are important.

例如,近年來隨著印刷配線板的傳送訊號之高速化,訊號之高頻化正在進展。與之同時,於印刷配線板所用的基材,要求高頻區域的優異介電特性。對於如此的要求,作為印刷配線板所用的基材薄膜,代替以往的聚醯亞胺(PI)、聚對苯二甲酸乙二酯薄膜,具有優異的介電特性之熱塑性液晶聚合物薄膜係受到注目。然而,熱塑性液晶聚合物薄膜本來就有接著性低之課題。For example, in recent years, along with the speed-up of the transmission signal of a printed wiring board, the high frequency of a signal is progressing. At the same time, substrates used for printed wiring boards are required to have excellent dielectric properties in a high-frequency region. In response to such a demand, as a substrate film for printed wiring boards, instead of conventional polyimide (PI) and polyethylene terephthalate films, thermoplastic liquid crystal polymer films with excellent dielectric properties have received Attention. However, thermoplastic liquid crystal polymer films have inherently low adhesive properties.

例如,專利文獻1(日本特開平1-216824號公報)及專利文獻2(日本特開平1-236246號公報)中,作為於液晶聚合物成形體中,用於進行塗裝、印刷、接著、蒸鍍、鍍敷等的表面改質方法,揭示照射波長184.9nm的紫外線之表面處理方法。專利文獻1及2中,藉由將波長184.9nm的紫外線照射至液晶聚酯成形體表面,而生成羥基或含氧的基,將成形體表面活化。For example, in Patent Document 1 (Japanese Patent Application Laid-Open No. 1-216824) and Patent Document 2 (Japanese Patent Application Laid-Open No. 1-236246), as a liquid crystal polymer molded body, it is used for coating, printing, bonding, Surface modification methods such as vapor deposition and plating reveal a surface treatment method for irradiating ultraviolet rays with a wavelength of 184.9 nm. In Patent Documents 1 and 2, by irradiating the surface of the liquid crystal polyester molded body with ultraviolet rays having a wavelength of 184.9 nm, a hydroxyl group or an oxygen-containing group is generated, and the surface of the molded body is activated.

又,專利文獻3(日本發明專利第4892274號公報)中,揭示一種液晶聚合物成形體,其係於液晶聚合物成形體的被接著部位之表面部的X射線光電子分光分析結果中,佔C(Is)波峰強度的[-C-O-鍵]與[-COO-鍵]的波峰強度之和為21%以上,且波峰強度之比[-C-O-鍵]/[-COO-鍵]為1.5以下。又,作為其製造方法,記載一種液晶聚合物成形體之製造方法,其包含於酸性氣體環境中,於輸出:0.6W/cm2 以下且壓力:0.1托以上之條件下將電漿照射至液晶聚合物成形體的至少被接著部位而進行表面處理之步驟。於該文獻中,藉由如此的電漿處理之條件,調整成形體表面的官能基之比率,提高液晶聚合物成形體對於環氧系樹脂之接著強度。 [先前技術文獻] [專利文獻]In addition, Patent Document 3 (Japanese Patent No. 4892274) discloses a liquid crystal polymer molded body in which C (Is) The sum of the peak intensities of [-CO-bond] and [-COO-bond] is 21% or more, and the ratio of the peak intensities [-CO-bond]/[-COO-bond] is 1.5 or less . Furthermore, as a method for producing the same, a method for producing a liquid crystal polymer molded body is described, which comprises irradiating a liquid crystal with plasma under the conditions of output: 0.6 W/cm 2 or less and pressure: 0.1 Torr or more in an acidic gas atmosphere The step of subjecting at least the adhered portion of the polymer molded body to surface treatment. In this document, the ratio of the functional groups on the surface of the molded body is adjusted by such plasma treatment conditions, and the adhesion strength of the liquid crystal polymer molded body to the epoxy resin is improved. [Prior Art Literature] [Patent Literature]

專利文獻1:日本特開平1-216824號公報 專利文獻2:日本特開平1-236246號公報 專利文獻3:日本發明專利第4892274號公報Patent Document 1: Japanese Patent Laid-Open No. 1-216824 Patent Document 2: Japanese Patent Application Laid-Open No. 1-236246 Patent Document 3: Japanese Invention Patent No. 4892274

[發明欲解決之課題][The problem to be solved by the invention]

然而,於專利文獻1~3中,將熱塑性液晶聚合物成形體的表面化學地改質,於如此的表面處理方法中,雖然賦予處理後立即的接著性,但是發生因熱運動、表面污染所造成的官能基之失去活性,因此有無法確保以未接著之狀態長期間保管後的接著性之課題。又,於專利文獻1~3記載之表面處理方法中,賦予至表面者為親水性官能基,因此有與表面的化學結構中相互作用低的被接著材料之接著性差等問題。However, in Patent Documents 1 to 3, the surface of the thermoplastic liquid crystal polymer molded body is chemically modified, and in such a surface treatment method, although adhesion immediately after the treatment is imparted, thermal movement and surface contamination occur. The resulting inactivation of the functional group caused the problem that the adhesiveness after being stored for a long period of time in an unattached state could not be ensured. Moreover, in the surface treatment methods described in Patent Documents 1 to 3, since hydrophilic functional groups are imparted to the surface, there are problems such as poor adhesion to the adherend material having a low interaction with the chemical structure of the surface.

因此,本發明之目的在於提供一種即使長期間保管也能維持接著性之熱塑性液晶聚合物成形體。 [用以解決課題之手段]Therefore, the objective of this invention is to provide the thermoplastic liquid crystal polymer molded object which can maintain adhesiveness even if it is stored for a long period of time. [means to solve the problem]

本發明之發明者們為了達成上述目的而專心致力地檢討之結果,著眼於熱塑性液晶聚合物成形體的表面之物理物性,而不是在長期間保管時容易受影響的表面之化學結構。而且,發現藉由電漿處理之條件,可將熱塑性液晶聚合物成形體表面予以物理地緻密改質。再者,藉由能詳細分析表面的物理物性之奈米壓痕法,重複熱塑性液晶聚合物成形體之表面的詳細分析,結果發現於表層及內部層的彈性模數之比滿足特定關係之熱塑性液晶聚合物成形體中,即使長期間保管,也能維持接著性。The inventors of the present invention focused on the physical properties of the surface of the thermoplastic liquid crystal polymer molded body, rather than the chemical structure of the surface, which is easily affected during long-term storage, as a result of intensive research to achieve the above-mentioned object. Furthermore, it was found that the surface of the thermoplastic liquid crystal polymer molded body can be physically densely modified under the conditions of the plasma treatment. Furthermore, by repeating the detailed analysis of the surface of the thermoplastic liquid crystal polymer molded body by the nano-indentation method, which can analyze the physical properties of the surface in detail, it was found that the ratio of the elastic moduli of the surface layer and the inner layer satisfies a specific relationship. In the liquid crystal polymer molded body, the adhesiveness can be maintained even when stored for a long period of time.

即,本發明提供以下的合適形態。 [1]一種熱塑性液晶聚合物成形體,其係在至少一部分具有接著區域,該接著區域中藉由奈米壓痕法所測定之壓入深度在20nm之範圍中的表層之彈性模數Er(S)與壓入深度在200nm之範圍中的內部層之彈性模數Er(I)之比(Er(S)/Er(I))為0以上(較佳為0.5以上,更佳為0.9以上,尤佳為1.0以上,尤更佳為1.1以上)1.50以下(較佳為1.45以下,更佳為1.40以下)。 [2]如[1]記載之熱塑性液晶聚合物成形體,其中表層之彈性模數Er(S)為6.6GPa以下(較佳為6.0GPa以下)。 [3]如[1]或[2]記載之熱塑性液晶聚合物成形體,其形狀為薄膜狀。 [4]如[1]~[3]中任一項記載之熱塑性液晶聚合物成形體,其具備金屬部分。 [5]如[1]~[4]中任一項記載之熱塑性液晶聚合物成形體,其具備電路。That is, the present invention provides the following suitable forms. [1] A thermoplastic liquid crystal polymer molded body having at least a part of an adhesive region in which the elastic modulus Er (S ) to the elastic modulus Er(I) of the inner layer having an indentation depth of 200 nm (Er(S)/Er(I)) is 0 or more (preferably 0.5 or more, more preferably 0.9 or more, 1.0 or more is especially preferable, 1.1 or more is more preferable) 1.50 or less (1.45 or less is preferable, 1.40 or less is more preferable). [2] The thermoplastic liquid crystal polymer molded body according to [1], wherein the elastic modulus Er(S) of the surface layer is 6.6 GPa or less (preferably 6.0 GPa or less). [3] The thermoplastic liquid crystal polymer molded body according to [1] or [2], which is in the form of a film. [4] The thermoplastic liquid crystal polymer molded body according to any one of [1] to [3], which has a metal portion. [5] The thermoplastic liquid crystal polymer molded body according to any one of [1] to [4], which is provided with a circuit.

於本說明書中,所謂熱塑性液晶聚合物成形體,就是意指至少包含熱塑性液晶聚合物的成形體,例如於熱塑性液晶聚合物成形體中,包含與被接著材料接著前的成形體(非接合體)和與被接著材料接著後的成形體(接合體或積層體)。In this specification, a thermoplastic liquid crystal polymer molded body means a molded body containing at least a thermoplastic liquid crystal polymer. ) and the formed body (joint body or laminate) after being joined to the material to be joined.

尚且,申請專利範圍及/或說明書中所揭示的至少2個構成要素之任意組合亦被包含於本發明中。特別地,申請專利範圍中記載的請求項之2個以上的任意組合亦被包含於本發明中。 [發明之效果]Furthermore, any combination of at least two constituent elements disclosed in the scope of the patent application and/or the specification is also included in the present invention. In particular, any combination of two or more of the claims described in the scope of the patent application is also included in the present invention. [Effect of invention]

根據本發明之熱塑性液晶聚合物成形體,藉由以內部層的彈性模數與表層的彈性模數具有特定關係之方式控制,即使長期間(例如,1~6個月左右,較佳為3~6個月左右)保管也能維持接著性。因此,本發明之熱塑性液晶聚合物成形體係在形成金屬層或電路時,例如極有用作為電子電路基板的絕緣體材料。According to the thermoplastic liquid crystal polymer molded body of the present invention, by controlling the elastic modulus of the inner layer and the elastic modulus of the surface layer to have a specific relationship, even a long period of time (for example, about 1 to 6 months, preferably 3 ~ About 6 months) can maintain the adhesiveness even when stored. Therefore, the thermoplastic liquid crystal polymer forming system of the present invention is very useful, for example, as an insulator material for electronic circuit substrates when forming metal layers or circuits.

[用以實施發明的形態][Form for carrying out the invention]

[熱塑性液晶聚合物] 本發明之熱塑性液晶聚合物成形體係以熱塑性液晶聚合物所構成。此熱塑性液晶聚合物係以能熔融成形的液晶性聚合物(或能形成光學異向性的熔融相之聚合物)所構成,只要是能熔融成形的液晶性聚合物,則其化學構成係沒有特別的限定,例如可舉出熱塑性液晶聚酯或在其中導入有醯胺鍵的熱塑性液晶聚酯醯胺等。[thermoplastic liquid crystal polymer] The thermoplastic liquid crystal polymer forming system of the present invention is composed of thermoplastic liquid crystal polymer. The thermoplastic liquid crystal polymer is composed of a liquid crystal polymer that can be melt-molded (or a polymer that can form an optically anisotropic melt phase). Specifically limited, for example, thermoplastic liquid crystal polyester, thermoplastic liquid crystal polyester amide into which an amide bond is introduced, and the like can be mentioned.

又,熱塑性液晶聚合物可為在芳香族聚酯或芳香族聚酯醯胺中,進一步導入有醯亞胺鍵、碳酸酯鍵、碳二亞胺鍵或異三聚氰酸酯鍵等之源自異氰酸酯的鍵等之聚合物。In addition, the thermoplastic liquid crystal polymer may be a source in which an imide bond, a carbonate bond, a carbodiimide bond, an isocyanurate bond, or the like is further introduced into an aromatic polyester or an aromatic polyester amide. A polymer derived from isocyanate bonds, etc.

作為本發明所用的熱塑性液晶聚合物之具體例,可舉出由以下例示的分類為(1)至(4)之化合物及其衍生物所導出之眾所周知的熱塑性液晶聚酯及熱塑性液晶聚酯醯胺。惟,為了形成能形成光學異向性的熔融相之聚合物,於各種原料化合物之組合中當然有適當的範圍。Specific examples of the thermoplastic liquid crystalline polymer used in the present invention include well-known thermoplastic liquid crystalline polyesters and thermoplastic liquid crystalline polyester amides derived from compounds classified into (1) to (4) and derivatives thereof exemplified below. amine. However, in order to form a polymer capable of forming an optically anisotropic melt phase, there is of course an appropriate range in the combination of various starting compounds.

(1)芳香族或脂肪族二醇(代表例參照表1)(1) Aromatic or aliphatic diols (refer to Table 1 for representative examples)

[表1]

Figure 02_image001
[Table 1]
Figure 02_image001

(2)芳香族或脂肪族二羧酸(代表例參照表2)(2) Aromatic or aliphatic dicarboxylic acids (refer to Table 2 for representative examples)

[表2]

Figure 02_image003
[Table 2]
Figure 02_image003

(3)芳香族羥基羧酸(代表例參照表3)(3) Aromatic hydroxycarboxylic acid (refer to Table 3 for representative examples)

[表3]

Figure 02_image005
[table 3]
Figure 02_image005

(4)芳香族二胺、芳香族羥基胺或芳香族胺基羧酸(代表例參照表4)(4) Aromatic diamine, aromatic hydroxylamine or aromatic aminocarboxylic acid (refer to Table 4 for representative examples)

[表4]

Figure 02_image007
[Table 4]
Figure 02_image007

作為由此等原料化合物所得之熱塑性液晶聚合物的代表例,可舉出具有表5及6中所示的重複結構單元之共聚物。As a representative example of the thermoplastic liquid crystal polymer obtained from these raw material compounds, the copolymers having the repeating structural units shown in Tables 5 and 6 are mentioned.

[表5]

Figure 02_image009
[table 5]
Figure 02_image009

[表6]

Figure 02_image011
[Table 6]
Figure 02_image011

於此等共聚物之中,較佳為至少包含對羥基苯甲酸及/或6-羥基-2-萘甲酸作為重複單元之聚合物,特佳為(i)包含對羥基苯甲酸與6-羥基-2-萘甲酸的重複單元之共聚物,或(ii)包含:選自包含對羥基苯甲酸及6-羥基-2-萘甲酸之群組的至少一種芳香族羥基羧酸、至少一種芳香族二醇及/或芳香族羥基胺、與至少一種芳香族二羧酸的重複單元之共聚物。Among these copolymers, polymers containing at least p-hydroxybenzoic acid and/or 6-hydroxy-2-naphthoic acid as repeating units are preferred, and (i) p-hydroxybenzoic acid and 6-hydroxyl are particularly preferred. - a copolymer of repeating units of 2-naphthoic acid, or (ii) comprising: at least one aromatic hydroxycarboxylic acid, at least one aromatic hydroxycarboxylic acid, selected from the group comprising p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid Copolymers of diols and/or aromatic hydroxylamines and repeating units of at least one aromatic dicarboxylic acid.

例如,於(i)之共聚物中,熱塑性液晶聚合物至少包含對羥基苯甲酸與6-羥基-2-萘甲酸的重複單元時,重複單元(A)的對羥基苯甲酸與重複單元(B)的6-羥基-2-萘甲酸之莫耳比(A)/(B),係在熱塑性液晶聚合物中,宜為(A)/(B)=10/90~90/10左右,更佳可為(A)/(B)=15/85~85/15左右,尤佳可為(A)/(B)=20/80~80/20左右。For example, in the copolymer of (i), when the thermoplastic liquid crystal polymer contains at least the repeating units of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid, the p-hydroxybenzoic acid of the repeating unit (A) and the repeating unit (B) ), the molar ratio (A)/(B) of 6-hydroxy-2-naphthoic acid in the thermoplastic liquid crystal polymer is preferably (A)/(B)=about 10/90~90/10, more It is preferably about (A)/(B)=15/85~85/15, and especially preferable is about (A)/(B)=20/80~80/20.

又,於(ii)之共聚物的情況,選自包含對羥基苯甲酸及6-羥基-2-萘甲酸之群組的至少一種芳香族羥基羧酸(C)、選自包含4,4’-二羥基聯苯、氫醌、苯基氫醌及4,4’-二羥基二苯基醚之群組的至少一種芳香族二醇(D)、與選自包含對苯二甲酸、間苯二甲酸及2,6-萘二羧酸之群組的至少一種芳香族二羧酸(E)之熱塑性液晶聚合物中的各重複單元之莫耳比,可為前述芳香族羥基羧酸(C):前述芳香族二醇(D):前述芳香族二羧酸(E)=(30~80):(35~10):(35~10)左右,更佳可為(C):(D):(E)=(35~75):(32.5~12.5):(32.5~12.5)左右,尤佳可為(C):(D):(E)=(40~70):(30~15):(30~15)左右。Also, in the case of the copolymer of (ii), at least one aromatic hydroxycarboxylic acid (C) selected from the group consisting of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid, selected from the group consisting of 4,4' -At least one aromatic diol (D) of the group of dihydroxybiphenyl, hydroquinone, phenylhydroquinone and 4,4'-dihydroxydiphenyl ether, and selected from the group consisting of terephthalic acid, m-phenylene The molar ratio of each repeating unit in the thermoplastic liquid crystal polymer of at least one aromatic dicarboxylic acid (E) of the group of dicarboxylic acid and 2,6-naphthalenedicarboxylic acid may be the aforementioned aromatic hydroxycarboxylic acid (C ): the aforementioned aromatic diol (D): the aforementioned aromatic dicarboxylic acid (E) = (30-80): (35-10): (35-10) or so, more preferably (C): (D ):(E)=(35~75):(32.5~12.5):(32.5~12.5) or so, preferably (C):(D):(E)=(40~70):(30~ 15): (30 to 15) or so.

又,於芳香族羥基羧酸(C)之中,源自6-羥基-2-萘甲酸的重複單元之莫耳比率例如可為85莫耳%以上,較佳可為90莫耳%以上,更佳可為95莫耳%以上。於芳香族二羧酸(E)之中,源自2,6-萘二羧酸的重複單元之莫耳比率例如可為85莫耳%以上,較佳可為90莫耳%以上,更佳可為95莫耳%以上。Moreover, in the aromatic hydroxycarboxylic acid (C), the molar ratio of repeating units derived from 6-hydroxy-2-naphthoic acid may be, for example, 85 mol % or more, preferably 90 mol % or more, More preferably, it can be 95 mol% or more. Among the aromatic dicarboxylic acids (E), the molar ratio of repeating units derived from 2,6-naphthalenedicarboxylic acid may be, for example, 85 mol % or more, preferably 90 mol % or more, more preferably It can be more than 95 mol%.

又,芳香族二醇(D)可為源自選自包含氫醌、4,4’-二羥基聯苯、苯基氫醌及4,4’-二羥基二苯基醚之群組的互相不同二種芳香族二醇的重複單元(D1)與(D2),當時,二種芳香族二醇之莫耳比可為(D1)/(D2)=23/77~77/23,更佳可為25/75~75/25,尤佳可為30/70~70/30。Also, the aromatic diol (D) may be derived from a mutual bond selected from the group consisting of hydroquinone, 4,4'-dihydroxybiphenyl, phenylhydroquinone, and 4,4'-dihydroxydiphenyl ether Repeating units (D1) and (D2) of different two aromatic diols, at that time, the molar ratio of the two aromatic diols can be (D1)/(D2)=23/77~77/23, preferably It may be 25/75 to 75/25, preferably 30/70 to 70/30.

又,源自芳香族二醇(D)的重複單元與源自芳香族二羧酸(E)的重複單元之莫耳比較佳為(D)/(E)=95/100~100/95。若脫離該範圍,則有聚合度不上升而機械強度降低之傾向。Moreover, the molar ratio of the repeating unit derived from the aromatic diol (D) and the repeating unit derived from the aromatic dicarboxylic acid (E) is preferably (D)/(E)=95/100 to 100/95. When it deviates from this range, the degree of polymerization does not increase, and the mechanical strength tends to decrease.

再者,本發明中所言之能形成光學的異向性之熔融相,例如可藉由在熱載台上載置試料,於氮氣環境下升溫加熱,觀察試料的穿透光而認定。In addition, the molten phase which can form an optical anisotropy as used in the present invention can be identified by, for example, placing a sample on a hot stage, heating it under a nitrogen atmosphere, and observing the transmitted light of the sample.

作為熱塑性液晶聚合物,較佳熔點(以下稱為Tm0 )例如為200~360℃之範圍者,更佳240~350℃之範圍者,尤佳Tm0 為260~330℃者。尚且,熱塑性液晶聚合物之熔點係可使用示差掃描熱量計,觀察熱塑性液晶聚合物樣品的熱行為而得。亦即,可將熱塑性液晶聚合物樣品從室溫(例如25℃)起以10℃/min之速度升溫而使其完全熔融後,將熔融物以10℃/min之速度急速冷卻到50℃為止,再以10℃/min之速度升溫後,記錄所出現的吸熱峰之位置作為熱塑性液晶聚合物樣品之熔點。The thermoplastic liquid crystal polymer preferably has a melting point (hereinafter referred to as Tm 0 ), for example, in the range of 200 to 360°C, more preferably in the range of 240 to 350°C, and particularly preferably in the range of 260 to 330°C. Furthermore, the melting point of the thermoplastic liquid crystal polymer can be obtained by observing the thermal behavior of the thermoplastic liquid crystal polymer sample using a differential scanning calorimeter. That is, the thermoplastic liquid crystal polymer sample can be heated at a rate of 10°C/min from room temperature (for example, 25°C) to completely melt, and then the melt can be rapidly cooled to 50°C at a rate of 10°C/min. , and then increase the temperature at a rate of 10°C/min, and record the position of the endothermic peak as the melting point of the thermoplastic liquid crystal polymer sample.

又,熱塑性液晶聚合物,從熔融成形性之觀點來看,例如可具有(Tm0 +20)℃中的剪切速度1000/s下之熔融黏度30~120Pa・s,較佳可具有熔融黏度50~100Pa・s。In addition, the thermoplastic liquid crystal polymer may have, for example, a melt viscosity of 30 to 120 Pa·s at a shear rate of 1000/s in (Tm 0 +20)° C. from the viewpoint of melt moldability, and preferably has a melt viscosity 50~100Pa·s.

於前述熱塑性液晶聚合物中,在不損害本發明的效果之範圍內,可添加聚對苯二甲酸乙二酯、改質聚對苯二甲酸乙二酯、聚烯烴、聚碳酸酯、聚芳酯、聚醯胺、聚苯硫醚、聚醚醚酮、氟樹脂等之熱塑性聚合物、各種添加劑。又,視需要可添加填充劑。In the aforementioned thermoplastic liquid crystal polymer, polyethylene terephthalate, modified polyethylene terephthalate, polyolefin, polycarbonate, polyarylene can be added within the scope of not impairing the effect of the present invention. Thermoplastic polymers such as ester, polyamide, polyphenylene sulfide, polyether ether ketone, fluororesin, and various additives. Moreover, a filler can be added as needed.

[熱塑性液晶聚合物成形體] 本發明之熱塑性液晶聚合物成形體係在至少一部分具有接著區域,該接著區域中藉由奈米壓痕法所測定之壓入深度在20nm之範圍中的表層之彈性模數Er(S)與壓入深度在200nm之範圍中的內部層之彈性模數Er(I)之比(Er(S)/Er(I))為0以上1.50以下之範圍。[Thermoplastic liquid crystal polymer molded body] The thermoplastic liquid crystal polymer forming system of the present invention has at least a part of a bonding region, in which the elastic modulus Er(S) and the indentation depth of the surface layer measured by the nanoindentation method are in the range of 20 nm. The ratio (Er(S)/Er(I)) of the elastic modulus Er(I) of the inner layer in the range of the depth of 200 nm is in the range of 0 or more and 1.50 or less.

所謂壓入深度在20nm之範圍中的表層之彈性模數Er(S),就是以奈米壓痕測定熱塑性液晶聚合物成形體之表面時,於後述實施例中記載之測定條件下,將針前端從成形體最表層插入到20nm的深度時所算出的彈性模數,定義為反映極表層之狀態者。另一方面,所謂壓入深度在200nm之範圍中的內部層之彈性模數Er(I),就是將針前端從成形體最表層插入到200nm的深度時所算出的彈性模數,定義為反映比Er(S)較內部之狀態者。此處,所謂最表層,就是意指針前端與成形體的接觸點之周邊表面。The so-called elastic modulus Er(S) of the surface layer with an indentation depth in the range of 20 nm means that when the surface of the thermoplastic liquid crystal polymer molded body is measured by nanoindentation, the needle is placed under the measurement conditions described in the following examples. The elastic modulus calculated when the tip was inserted from the outermost surface layer of the molded body to a depth of 20 nm was defined as reflecting the state of the extreme surface layer. On the other hand, the elastic modulus Er(I) of the inner layer with an indentation depth in the range of 200 nm is the elastic modulus calculated when the needle tip is inserted from the outermost layer of the molded body to a depth of 200 nm, and is defined as reflecting A state that is more internal than Er(S). Here, the outermost layer means the peripheral surface of the contact point between the tip of the hand and the molded body.

關於藉由奈米壓痕法所測定之彈性模數Er(S)及Er(I),可由勁度(stiffness)S與接觸投影面積Ac,使用下述式(1)算出。The elastic moduli Er(S) and Er(I) measured by the nanoindentation method can be calculated from the stiffness S and the contact projected area Ac using the following formula (1).

Figure 02_image013
Figure 02_image013

勁度S係由荷重-位移曲線中的卸載曲線之斜率來算出。尚且,前述卸載曲線之斜率係指高位移時的卸載曲線之斜率,亦即壓入探針後,卸載之開始後立即的卸載曲線之斜率。接觸投影面積Ac係由接觸深度(由指定的壓入深度與最大荷重下的卸載曲線之梯度所求出的接觸點在周邊表面的表面位移之差)與探針的幾何學形狀固有的常數及修正項,藉由指定式而求出。The stiffness S is calculated from the slope of the unloading curve in the load-displacement curve. Furthermore, the aforementioned slope of the unloading curve refers to the slope of the unloading curve at high displacement, that is, the slope of the unloading curve immediately after the start of unloading after the probe is pressed. The contact projected area Ac is the difference between the contact depth (the difference between the surface displacement of the contact point on the peripheral surface obtained from the gradient of the specified indentation depth and the unloading curve under the maximum load) and the geometric shape of the probe. The correction term is obtained by the specified expression.

一般而言,熱塑性液晶聚合物成形體由於經高度分子配向的皮層係存在於極表層,因此可理解接著性差。本發明之熱塑性液晶聚合物成形體係藉由Er(S)/Er(I)在特定之範圍,於熱壓接時極表層容易侵入被黏體表面的凹凸,錨定效果提升,因此茲認為不論化學結構為何,都可物理地提高接著性,同時即使長期間保管時也能維持接著性。Er(S)/Er(I)之值大於1.50時,相較於熱塑性液晶聚合物成形體的接著區域之內部層,表層之彈性模數變過高,熱壓接時的接著力變不充分。Er(S)/Er(I)較佳為1.45以下,更佳為1.40以下。另一方面,熱塑性液晶聚合物成形體的接著區域之表層的彈性模數低時,成形體表面的分子配向紊亂,有介電損失變高之傾向,因此例如Er(S)/Er(I)較佳為0.5以上,更佳為0.9以上,尤佳為1.0以上,尤更佳為1.1以上。In general, since the thermoplastic liquid crystal polymer molded body has a highly molecularly aligned skin layer in the extreme surface layer, it is understood that the adhesiveness is poor. With Er(S)/Er(I) in a specific range in the thermoplastic liquid crystal polymer molding system of the present invention, the extreme surface layer easily penetrates into the unevenness of the surface of the adherend during thermocompression bonding, and the anchoring effect is improved. Therefore, it is considered that no matter whether Regardless of the chemical structure, the adhesiveness can be improved physically, and the adhesiveness can be maintained even when stored for a long period of time. When the value of Er(S)/Er(I) is greater than 1.50, the elastic modulus of the surface layer becomes too high compared to the inner layer in the bonding region of the thermoplastic liquid crystal polymer molded body, and the bonding force during thermocompression bonding becomes insufficient. . Er(S)/Er(I) is preferably 1.45 or less, more preferably 1.40 or less. On the other hand, when the elastic modulus of the surface layer of the adhering region of the thermoplastic liquid crystal polymer molded body is low, the molecular alignment on the surface of the molded body is disordered, and the dielectric loss tends to increase, so, for example, Er(S)/Er(I) It is preferably 0.5 or more, more preferably 0.9 or more, still more preferably 1.0 or more, and even more preferably 1.1 or more.

Er(S)係只要Er(S)/Er(I)成為0~1.50,則沒有特別的限制,但較佳為3.0GPa以上,更佳為4.0GPa以上,尤佳為5.0GPa以上。又,較佳為8.0GPa以下,更佳為7.0GPa以下,尤佳為6.6GPa以下,尤更佳為6.0GPa以下。Er(S) is not particularly limited as long as Er(S)/Er(I) is 0 to 1.50, but is preferably 3.0 GPa or more, more preferably 4.0 GPa or more, and particularly preferably 5.0 GPa or more. Moreover, 8.0 GPa or less is preferable, 7.0 GPa or less is more preferable, 6.6 GPa or less is especially preferable, and 6.0 GPa or less is especially preferable.

Er(I)係只要Er(S)/Er(I)成為0~1.50,則沒有特別的限制,但較佳為2.0GPa以上,更佳為3.0GPa以上,尤佳為4.0GPa以上。又,較佳為7.0GPa以下,更佳為6.0GPa以下,尤佳為4.3GPa以下。Er(I) is not particularly limited as long as Er(S)/Er(I) is 0 to 1.50, but is preferably 2.0 GPa or more, more preferably 3.0 GPa or more, and particularly preferably 4.0 GPa or more. Moreover, 7.0 GPa or less is preferable, 6.0 GPa or less is more preferable, and 4.3 GPa or less is especially preferable.

本發明之熱塑性液晶聚合物成形體,只要至少以熱塑性液晶聚合物所構成即可,也可以熱塑性液晶聚合物單獨所形成,亦可以熱塑性液晶聚合物與其它物質所構成。 例如,本發明之熱塑性液晶聚合物成形體可進一步具備導電部。導電部可以金屬構成,例如本發明之熱塑性液晶聚合物成形體可在其表面(接著區域的表面及/或非接著區域的表面)上具備金屬部分。此處,所謂非接著區域,就是意指Er(S)/Er(I)不在特定範圍之區域。具體而言,本發明之薄膜狀的熱塑性液晶聚合物成形體(以下稱為熱塑性液晶聚合物薄膜)可為積層有金屬箔的覆金屬積層板(單面覆金屬積層板或兩面覆金屬積層板)。又,本發明之熱塑性液晶聚合物成形體可為熱塑性液晶聚合物薄膜層與金屬層透過接著層(例如接著劑)積層而成之積層體,也可為熱塑性液晶聚合物薄膜層與金屬層直接積層而成的積層體。The thermoplastic liquid crystal polymer molded body of the present invention may be composed of at least the thermoplastic liquid crystal polymer, and may be formed by the thermoplastic liquid crystal polymer alone, or may be composed of the thermoplastic liquid crystal polymer and other substances. For example, the thermoplastic liquid crystal polymer molded body of the present invention may further include a conductive portion. The conductive portion may be made of metal, for example, the thermoplastic liquid crystal polymer molded body of the present invention may have a metal portion on the surface (surface of the bonded region and/or surface of the non-bonded region). Here, the so-called non-adjacent region means a region in which Er(S)/Er(I) is not within a specific range. Specifically, the film-like thermoplastic liquid crystal polymer molded body of the present invention (hereinafter referred to as a thermoplastic liquid crystal polymer film) may be a metal-clad laminate (a single-sided metal-clad laminate or a double-sided metal-clad laminate) on which metal foils are laminated. ). In addition, the thermoplastic liquid crystal polymer molded body of the present invention may be a laminate formed by laminating a thermoplastic liquid crystal polymer film layer and a metal layer through an adhesive layer (such as an adhesive), or may be a thermoplastic liquid crystal polymer film layer and a metal layer directly A layered body made of layers.

作為金屬,可按照目的來適宜決定,但較宜使用銅、鎳、鈷、鋁、金、錫、鉻等。金屬層之厚度可為0.01~200μm,較佳可為0.1~100μm,更佳可為1~80μm,特佳可為2~50μm。The metal can be appropriately determined according to the purpose, but copper, nickel, cobalt, aluminum, gold, tin, chromium, etc. are preferably used. The thickness of the metal layer can be 0.01-200 μm, preferably 0.1-100 μm, more preferably 1-80 μm, and particularly preferably 2-50 μm.

直接積層金屬箔作為金屬層時,金屬箔之厚度可為1~80μm,較佳可為2~50μm。又,與熱塑性液晶聚合物成形體接觸之側的金屬箔之表面粗糙度(Rz)例如可為2.0μm以下,較佳可為1.5μm以下。表面粗糙度(Rz)之下限例如可為0.8μm。尚且,所謂表面粗糙度(Rz),就是表示參考JIS B 0601:2001所測定之最大高度粗糙度。When the metal foil is directly laminated as the metal layer, the thickness of the metal foil may be 1-80 μm, preferably 2-50 μm. Further, the surface roughness (Rz) of the metal foil on the side in contact with the thermoplastic liquid crystal polymer molded body may be, for example, 2.0 μm or less, or preferably 1.5 μm or less. The lower limit of the surface roughness (Rz) may be, for example, 0.8 μm. In addition, the surface roughness (Rz) means the maximum height roughness measured with reference to JIS B 0601:2001.

又,本發明之熱塑性液晶聚合物成形體係可在其表面(接著區域的表面及/或非接著區域的表面)上具備電路。In addition, the thermoplastic liquid crystal polymer molding system of the present invention may be provided with a circuit on the surface (surface of the bonded region and/or surface of the non-bonded region).

特別地,本發明之熱塑性液晶聚合物成形體為薄膜狀時,由於熱塑性液晶聚合物本身介電特性優異且吸濕性低,又對於接著劑或其它材料的接著性提升,故特別有用作為電路基板材料(例如電子電路基板的絕緣體、可撓性電路基板的補強板、電路面的覆蓋膜等)。 再者,於熱塑性液晶聚合物薄膜上,積層有金屬層之積層體(例如覆金屬積層板)或形成有電路之電路基板,由於熱塑性液晶聚合物薄膜與金屬層或電路的接著性提升,而可靠性高且較宜。In particular, when the thermoplastic liquid crystal polymer molded body of the present invention is in the form of a film, since the thermoplastic liquid crystal polymer itself has excellent dielectric properties and low hygroscopicity, and the adhesion to adhesives or other materials is improved, it is particularly useful as a circuit Substrate materials (for example, insulators for electronic circuit boards, reinforcing plates for flexible circuit boards, cover films for circuit surfaces, etc.). Furthermore, on the thermoplastic liquid crystal polymer film, a laminate with a metal layer (such as a metal-clad laminate) or a circuit substrate with a circuit formed thereon, due to the improved adhesion between the thermoplastic liquid crystal polymer film and the metal layer or circuit, and Reliable and affordable.

[熱塑性液晶聚合物成形體之製造方法] 本發明之熱塑性液晶聚合物成形體之製造方法係具備在熱塑性液晶聚合物成形體的表面之至少一部分進行電漿處理之表面處理步驟,藉由調整後述的電漿處理之條件,可調整表層之彈性模數Er(S)與內部層之彈性模數Er(I)之比(Er(S)/Er(I))。為了調整熱塑性液晶聚合物成形體之表面的表層之彈性模數與內部層之彈性模數之比,特佳為設定氣體物種、壓力、輸出等之電漿處理條件。電漿處理之對象的熱塑性液晶聚合物成形體係沒有特別的限定,但例如可對於在熱塑性液晶聚合物成形體的表面之至少一部分進行了物理的研磨處理、電暈放電處理、紫外線照射處理、與經凹凸粗化的金屬箔加熱加壓而積層後進行剝離之賦形處理、積層銅箔後蝕刻去除銅箔之銅箔複製處理、腐蝕性溶液所致的表面處理等之熱塑性液晶聚合物成形體,進行電漿處理,亦可對於未進行前述表面處理之熱塑性液晶聚合物成形體,進行電漿處理。[Production method of thermoplastic liquid crystal polymer molded body] The method for producing a thermoplastic liquid crystal polymer molded body of the present invention includes a surface treatment step of performing plasma treatment on at least a part of the surface of the thermoplastic liquid crystal polymer molded body. By adjusting the plasma treatment conditions described later, the surface layer can be adjusted. The ratio of the elastic modulus Er(S) to the elastic modulus Er(I) of the inner layer (Er(S)/Er(I)). In order to adjust the ratio of the elastic modulus of the surface layer to the elastic modulus of the inner layer on the surface of the thermoplastic liquid crystal polymer molded body, it is particularly preferable to set plasma treatment conditions such as gas species, pressure, and output. The thermoplastic liquid crystal polymer molding system to be subjected to the plasma treatment is not particularly limited, but for example, at least a part of the surface of the thermoplastic liquid crystal polymer molded body may be subjected to physical polishing treatment, corona discharge treatment, ultraviolet irradiation treatment, and Thermoplastic liquid crystal polymer moldings, such as forming treatment of peeling off the roughened metal foil by heating and pressing, lamination and peeling, copper foil replication treatment of etching and removing copper foil after lamination of copper foil, surface treatment by corrosive solution, etc. , plasma treatment is performed, and plasma treatment can also be performed for the thermoplastic liquid crystal polymer molded body that has not undergone the aforementioned surface treatment.

電漿處理中的氣體物種,從調整表層之彈性模數與內部層之彈性模數之比的觀點來看,較佳為使用選自包含N2 、Ar、H2 O及CF4 之群組的至少一種。N2 、Ar及H2 O係電漿處理時的反應中之離子轟擊效果所致的蝕刻性強,CF4 係可使反應性高的F自由基產生而進行蝕刻。茲認為使用此等氣體物種,在熱塑性液晶聚合物成形體之表面進行電漿處理時,電子或離子、自由基直接碰撞表面,可選擇地切斷熱塑性液晶聚合物分子所具有的鍵,因此藉由可將表面緻密地粗化而可使表層之彈性模數降低,在表層與內部層可調整至特定的彈性模數之關係。另一方面,茲認為使用O2 作為氣體物種時,由於不論熱塑性液晶聚合物分子所具有的鍵為何,都會切斷,故會全體地蝕刻表面,因此難以在表層與內部層調整至特定的彈性模數之關係。電漿處理中所用的氣體物種,於對於熱塑性液晶聚合物成形體的表面之粗化性高之點上,更佳為N2 。又,於不損害本發明的效果之範圍內,亦可混合上述氣體物種以外的氣體物種(例如,O2 等)而使用。The gas species in the plasma treatment is preferably selected from the group consisting of N 2 , Ar, H 2 O and CF 4 from the viewpoint of adjusting the ratio of the elastic modulus of the surface layer to the elastic modulus of the inner layer at least one of. N 2 , Ar and H 2 O systems have strong etching properties due to the ion bombardment effect in the reaction during plasma treatment, and CF 4 systems can generate highly reactive F radicals and perform etching. It is considered that when these gas species are used, when the surface of the thermoplastic liquid crystal polymer molded body is subjected to plasma treatment, electrons, ions, and free radicals directly collide with the surface to selectively cut the bonds possessed by the thermoplastic liquid crystal polymer molecules. Since the surface can be densely roughened, the elastic modulus of the surface layer can be lowered, and the relationship between the surface layer and the inner layer can be adjusted to a specific elastic modulus. On the other hand, it is considered that when O 2 is used as the gas species, the entire surface is etched because the bonds of the thermoplastic liquid crystal polymer molecules are cut regardless of the bonds possessed by the molecules, so that it is difficult to adjust the specific elasticity in the surface layer and the inner layer. Modulus relationship. The gas species used in the plasma treatment is more preferably N 2 in that the surface roughness of the thermoplastic liquid crystal polymer molded body is high. Moreover, in the range which does not impair the effect of this invention, you may mix and use gas species (for example, O 2 etc.) other than the above-mentioned gas species.

電漿處理,係從調整熱塑性液晶聚合物成形體之表面的表層之彈性模數與內部層之彈性模數之比的觀點來看,較佳為真空電漿處理。若真空度上升則電漿發生效率變良好,該電漿與氣體反應,氣體電漿蝕刻聚合物表面的效果變高。真空電漿處理時,從使所產生的電子與離子之密度成為充分改質熱塑性液晶聚合物成形體的表面之範圍的觀點來看,進行處理的裝置內之壓力較佳為0.1~50Pa,更佳可為0.3~30Pa,尤佳可為0.5~15Pa。The plasma treatment is preferably vacuum plasma treatment from the viewpoint of adjusting the ratio of the elastic modulus of the surface layer to the elastic modulus of the inner layer on the surface of the thermoplastic liquid crystal polymer molded body. When the degree of vacuum increases, the plasma generation efficiency becomes good, the plasma reacts with the gas, and the effect of the gas plasma etching the polymer surface becomes high. In the vacuum plasma treatment, the pressure in the treatment apparatus is preferably 0.1 to 50 Pa, from the viewpoint of making the density of generated electrons and ions within the range to sufficiently modify the surface of the thermoplastic liquid crystal polymer molded body. It is preferably 0.3 to 30 Pa, and more preferably 0.5 to 15 Pa.

電漿處理中的輸出(output),從調整熱塑性液晶聚合物成形體之表面的表層之彈性模數與內部層之彈性模數之比的觀點來看,較佳為3.5W/cm2 以上,更佳為5.0W/cm2 以上,尤佳為6.0W/cm2 以上。藉由提高電漿處理中的輸出,而更多地生成電子或離子、自由基等氣體物種的活性物種,可提高彼等之密度或溫度,因此可使特定的氣體物種之效果發揮最大限度。電漿處理中的輸出之上限係沒有特別的限定,較佳為進行更強力的處理。例如,從抑制熱塑性液晶聚合物成形體表面的過剩之損傷的觀點來看,可為30W/cm2 以下,較佳為25W/cm2 以下,更佳為20W/cm2 以下。The output in the plasma treatment is preferably 3.5 W/cm 2 or more from the viewpoint of adjusting the ratio of the elastic modulus of the surface layer to the elastic modulus of the inner layer on the surface of the thermoplastic liquid crystal polymer molded body, More preferably, it is 5.0 W/cm 2 or more, and even more preferably 6.0 W/cm 2 or more. By increasing the output in plasma processing, more active species of gas species such as electrons, ions, and radicals can be generated, and their density or temperature can be increased, thereby maximizing the effect of a specific gas species. The upper limit of the output in the plasma treatment is not particularly limited, but it is preferable to perform a stronger treatment. For example, from the viewpoint of suppressing excessive damage on the surface of the thermoplastic liquid crystal polymer molded body, it may be 30 W/cm 2 or less, preferably 25 W/cm 2 or less, and more preferably 20 W/cm 2 or less.

藉由提高電漿處理中的輸出,可縮短熱塑性液晶聚合物成形體之電漿處理所需要的時間。具體而言,電漿處理之時間可為180秒以下,較佳可為60秒以下,更佳可為5秒以下。電漿處理的時間之下限係沒有特別的限定,但例如從充分地改質熱塑性液晶聚合物成形體之表面的觀點來看,可為0.1秒以上,較佳為0.5秒以上,更佳為1.0秒以上。尚且,電漿處理之時間係指對於熱塑性液晶聚合物成形體的同一部分,進行電漿照射之時間。By increasing the output in the plasma treatment, the time required for the plasma treatment of the thermoplastic liquid crystal polymer molded body can be shortened. Specifically, the plasma treatment time may be 180 seconds or less, preferably 60 seconds or less, and more preferably 5 seconds or less. The lower limit of the plasma treatment time is not particularly limited, but for example, from the viewpoint of sufficiently modifying the surface of the thermoplastic liquid crystal polymer molded body, it can be 0.1 second or more, preferably 0.5 second or more, more preferably 1.0 seconds or more. Also, the time for plasma treatment refers to the time for performing plasma irradiation on the same part of the thermoplastic liquid crystal polymer molded body.

於製造本發明之熱塑液晶聚合物成形體之方法中,在電漿處理中,於放電電極間放電的頻率係沒有特別的限定,但例如可為40kHz~2.45GHz之範圍,較佳可為40kHz~915MHz,更佳可為110kHz~13.56MHz。In the method for producing the thermoplastic liquid crystal polymer molded body of the present invention, in the plasma treatment, the frequency of discharge between the discharge electrodes is not particularly limited, but for example, it can be in the range of 40 kHz to 2.45 GHz, preferably 40kHz~915MHz, preferably 110kHz~13.56MHz.

作為電漿處理,於以交流電源處理者中,有(i)電容耦合電漿(CCP方式),與使用線圈,給予因磁束變化所造成的感應電場之(ii)感應耦合電漿(ICP方式)。CCP為一般使用的電漿產生方法,在一對的電極間設置被處理基材,能以電漿對被處理基材進行處理。另一方面,ICP由於藉由感應線圈的變動磁場而產生電漿,故具有電極與電漿間之電位差不變大,電漿處理的控制性高之特徵。又,一般而言,使用高頻電源,處理能力高者多。 又,近年來開發出電容耦合電漿(CCP)、感應耦合電漿(ICP)、電子迴旋共振電漿(ECP)、螺旋激發電漿(HWP)、微波激發表面波電漿(SWP),對應於高頻電源的處理方法係被認為更有效果。然而,於本發明中,可以在表層與內部層能調整至特定彈性模數的關係之範圍中,選擇處理方法、電源頻率,並沒有特別的限定。As plasma treatment, among those using AC power, there are (i) capacitively coupled plasma (CCP method), and (ii) inductively coupled plasma (ICP method) that uses a coil to apply an induced electric field caused by a change in magnetic flux ). CCP is a generally used plasma generation method, and a substrate to be treated is provided between a pair of electrodes, and the substrate to be treated can be treated with plasma. On the other hand, since the ICP generates plasma by the fluctuating magnetic field of the induction coil, the potential difference between the electrode and the plasma does not increase, and the controllability of the plasma treatment is high. In addition, generally speaking, a high-frequency power supply is used, and the processing capability is high. In addition, in recent years, capacitively coupled plasma (CCP), inductively coupled plasma (ICP), electron cyclotron resonance plasma (ECP), helical excited plasma (HWP), and microwave excited surface wave plasma (SWP) have been developed. The treatment method for high frequency power supply is considered to be more effective. However, in the present invention, the processing method and the power supply frequency can be selected within the range in which the relationship between the surface layer and the inner layer can be adjusted to a specific elastic modulus, and is not particularly limited.

尚且,於製造本發明之熱塑液晶聚合物成形體之方法中,可以使用一般的電漿處理方法之(i)電容耦合電漿(CCP)進行製造。於後述實施例中,使用CCP,在導入有氣體物種的環境中,在放電平行平板之一對的電極間進行電力之供給,使其產生電漿放電,對於熱塑性液晶聚合物成形體之表面的至少一部分,進行電漿照射。Furthermore, in the method for producing the thermoplastic liquid crystal polymer molded body of the present invention, (i) capacitively coupled plasma (CCP), which is a general plasma treatment method, can be used. In the examples to be described later, using CCP, in an environment in which gas species is introduced, power is supplied between the electrodes of a pair of discharge parallel plates to generate plasma discharge, and the surface of the thermoplastic liquid crystal polymer molded body is affected. At least a part is subjected to plasma irradiation.

電漿處理可為施加連續波形(交流波形)的電壓之放電方式,也可為施加脈衝狀波形的電壓之放電方式。從使放電穩定之觀點來看,較佳為施予脈衝狀波形的電壓之放電方式。此時,即使短時間之處理也可均勻地得到表面改質效果。Plasma treatment may be a discharge method in which a voltage of a continuous waveform (AC waveform) is applied, or a discharge method in which a voltage of a pulse waveform is applied. From the viewpoint of stabilizing the discharge, a discharge method in which a voltage of a pulse-shaped waveform is applied is preferable. In this case, the surface modification effect can be uniformly obtained even in a short-time treatment.

電漿處理中的其它條件只要適宜調節即可。例如,電漿處理裝置的照射頭與熱塑性液晶聚合物成形體表面之距離(例如,頭-薄膜間距離)可為3~50mm,較佳可為4~30mm,更佳可為5~25mm。Other conditions in the plasma treatment may be appropriately adjusted. For example, the distance between the irradiation head of the plasma processing apparatus and the surface of the thermoplastic liquid crystal polymer formed body (eg, head-film distance) may be 3-50 mm, preferably 4-30 mm, more preferably 5-25 mm.

於製造本發明之熱塑液晶聚合物成形體之方法中,可連續地進行表面處理,也可以分批式進行。為了縮短電漿處理之時間,從生產性之觀點來看,較佳為連續地進行。In the method for producing the thermoplastic liquid crystal polymer molded body of the present invention, the surface treatment can be carried out continuously or batchwise. In order to shorten the time of the plasma treatment, it is preferable to perform it continuously from the viewpoint of productivity.

特別地,熱塑性液晶聚合物成形體為能捲取時,可藉由卷對卷(roll-to-roll)連續地處理,可使用將成形體的捲出及捲取設置在內部之電漿連續處理裝置,或將成形體的捲出及捲取設置在外部之電漿連續處理裝置。In particular, when the thermoplastic liquid crystal polymer molded body is capable of being rolled, it can be continuously processed by roll-to-roll, and a plasma continuum in which unwinding and winding of the molded body are provided inside can be used. A processing device, or a plasma continuous processing device that installs the unwinding and winding of the formed body outside.

藉由卷對卷,電漿處理能捲取的熱塑性液晶聚合物成形體時,從生產性與處理時間之觀點來看,成形體的搬運速度可為0.1~10m/min左右,較佳可為0.2~8.0m/min左右,更佳可為0.3~5.0m/min。When the roll-to-roll plasma treatment of the rollable thermoplastic liquid crystal polymer molded body is performed, the conveying speed of the molded body may be about 0.1 to 10 m/min, preferably from the viewpoint of productivity and processing time. About 0.2 to 8.0 m/min, more preferably 0.3 to 5.0 m/min.

尚且,本發明之熱塑性液晶聚合物成形體的形狀係沒有特別的限定,例如可為藉由熱塑性液晶聚合物的澆鑄成形而能成形之形狀,也可為藉由射出成形或擠出成形而能成形的形狀。熱塑性液晶聚合物成形體較佳為薄膜狀、薄片狀、纖維狀、布帛狀等之形狀,更佳為薄膜狀。Moreover, the shape of the thermoplastic liquid crystal polymer molded body of the present invention is not particularly limited, for example, it may be a shape that can be formed by casting molding of a thermoplastic liquid crystal polymer, or a shape that can be formed by injection molding or extrusion molding. formed shape. The thermoplastic liquid crystal polymer molded body is preferably in a shape of a film, a sheet, a fiber, a cloth, or the like, and more preferably a film.

熱塑性液晶聚合物薄膜亦可將上述熱塑性液晶聚合物予以擠出成形而得。此時,可使用任意的擠出成形法,但周知的T字模製膜延伸法、積層體延伸法、吹脹法等係工業上有利。例如,熱塑性液晶聚合物薄膜之厚度可為10~500μm,較佳可為20~200μm,更佳可為25~125μm。特別地,使用熱塑性液晶聚合物薄膜作為電子電路基板材料時,厚度較佳為20~150μm之範圍,更佳為20~100μm之範圍。The thermoplastic liquid crystal polymer film can also be obtained by extruding the above thermoplastic liquid crystal polymer. In this case, any extrusion molding method can be used, but the well-known T-die film stretching method, laminate stretching method, and inflation method are industrially advantageous. For example, the thickness of the thermoplastic liquid crystal polymer film may be 10-500 μm, preferably 20-200 μm, and more preferably 25-125 μm. In particular, when a thermoplastic liquid crystal polymer film is used as an electronic circuit substrate material, the thickness is preferably in the range of 20 to 150 μm, more preferably in the range of 20 to 100 μm.

[被接著材料] 本發明之熱塑性液晶聚合物成形體係與被接著材料的接著性高,即使長期間保管也能維持接著性。作為被接著材料,只要能直接接著至熱塑性液晶聚合物成形體的被接著部位,則沒有特別的限定,可按照目的而適宜選擇。例如,作為被接著材料,可舉出接著劑(較佳為接著劑薄片)及熱塑性液晶聚合物被黏體(較佳為熱塑性液晶聚合物薄膜)等。尚且,對於被接著材料(例如,熱塑性液晶聚合物被黏體),亦可視需要以在上述內部層與表層中彈性模數具有特定關係之方式進行處理。[the attached material] The thermoplastic liquid crystal polymer molding system of the present invention has high adhesiveness with the material to be adhered, and can maintain the adhesiveness even when stored for a long period of time. The material to be bonded is not particularly limited as long as it can be directly bonded to the bonded portion of the thermoplastic liquid crystal polymer molded body, and can be appropriately selected according to the purpose. For example, as an adherend material, an adhesive agent (preferably an adhesive agent sheet), a thermoplastic liquid crystal polymer adherend (preferably a thermoplastic liquid crystal polymer film), etc. are mentioned. Furthermore, for the adhered material (for example, a thermoplastic liquid crystal polymer adherend), it can also be processed in a manner that the elastic modulus in the above-mentioned inner layer and surface layer has a specific relationship as required.

作為接著劑,可為環氧系接著劑或丙烯酸系接著劑等之極性接著劑,也可為在一部分含有非極性骨架的非極性接著劑。As an adhesive agent, polar adhesive agents, such as an epoxy adhesive agent and an acrylic adhesive agent, may be sufficient, and the nonpolar adhesive agent which contains a nonpolar skeleton in a part may be sufficient as it.

作為極性接著劑,例如可舉出脲樹脂系接著劑、三聚氰胺樹脂系接著劑、酚樹脂系接著劑、乙酸乙烯酯樹脂系接著劑、異氰酸酯系接著劑、環氧系接著劑、不飽和聚酯系接著劑、氰基丙烯酸酯系接著劑、聚胺基甲酸酯系接著劑、丙烯酸樹脂系接著劑等。Examples of polar adhesives include urea resin adhesives, melamine resin adhesives, phenol resin adhesives, vinyl acetate resin adhesives, isocyanate adhesives, epoxy adhesives, and unsaturated polyesters. Adhesives, cyanoacrylate-based adhesives, polyurethane-based adhesives, acrylic resin-based adhesives, and the like.

作為非極性接著劑,例如可舉出對於周知的接著劑(例如,脲樹脂系接著劑、三聚氰胺樹脂系接著劑、酚樹脂系接著劑、乙酸乙烯酯樹脂系接著劑、異氰酸酯系接著劑、環氧系接著劑、不飽和聚酯系接著劑、氰基丙烯酸酯系接著劑、聚胺基甲酸酯系接著劑、丙烯酸樹脂系接著劑等),混合有以非極性骨架為主鏈的聚合物之接著劑組成物,及於上述接著劑的主成分聚合物之化學結構中導入有非極性骨架之接著劑組成物等。Examples of the nonpolar adhesive include known adhesives (for example, urea resin-based adhesives, melamine resin-based adhesives, phenol resin-based adhesives, vinyl acetate resin-based adhesives, isocyanate-based adhesives, cyclic adhesives, etc.) Oxygen-based adhesives, unsaturated polyester-based adhesives, cyanoacrylate-based adhesives, polyurethane-based adhesives, acrylic resin-based adhesives, etc.), mixed with non-polar skeleton-based polymerization The adhesive composition of the above-mentioned adhesive agent, and the adhesive composition of the non-polar skeleton introduced into the chemical structure of the main component polymer of the adhesive agent, etc.

使用熱塑性液晶聚合物薄膜作為電子電路基板材料時,接著劑之介電特性係在頻率10GHz的比介電常數(ε)較佳為3.3以下,介電正切(tanδ)較佳為0.05以下。特別地,於基板全體要求低介電特性時,較佳為具有低介電特性的接著劑(低介電接著劑)。具有低介電特性的接著劑,例如在頻率10GHz的比介電常數(ε)較佳為3.3以下,介電正切(tanδ)較佳為0.04以下,更佳為0.03以下。When a thermoplastic liquid crystal polymer film is used as an electronic circuit substrate material, the dielectric properties of the adhesive are preferably 3.3 or less and 0.05 or less in dielectric tangent (tanδ) at a frequency of 10 GHz. In particular, when the entire substrate is required to have low dielectric properties, an adhesive having low dielectric properties (low-dielectric adhesive) is preferred. For the adhesive having low dielectric properties, for example, the specific permittivity (ε) at a frequency of 10 GHz is preferably 3.3 or less, and the dielectric tangent (tanδ) is preferably 0.04 or less, more preferably 0.03 or less.

作為較佳的低介電接著劑,例如可舉出含有烯烴骨架的接著劑組成物(例如,至少含有結晶性酸改質聚烯烴及環氧樹脂的接著劑組成物、含有烯烴骨架的改質聚醯胺接著劑組成物、使用芳香族烯烴寡聚物型改質劑與環氧樹脂的接著劑組成物等)、含有聚伸苯基醚骨架的接著劑組成物等。Preferable low-dielectric adhesives include, for example, adhesive compositions containing olefin skeletons (for example, adhesive compositions containing at least crystalline acid-modified polyolefin and epoxy resin, modified olefin skeleton-containing adhesive compositions, etc.) Polyamide adhesive composition, adhesive composition using aromatic olefin oligomer type modifier and epoxy resin, etc.), adhesive composition containing polyphenylene ether skeleton, etc.

例如,作為至少含有結晶性酸改質聚烯烴及環氧樹脂的接著劑組成物,可舉出國際公開第2016/031342號中記載之接著劑等,作為含有烯烴骨架的改質聚醯胺接著劑組成物,可舉出日本特開2007-284515號公報中記載之接著劑等,作為使用芳香族烯烴寡聚物型改質劑與環氧樹脂的接著劑組成物,可舉出日本特開2007-63306號公報中記載之接著劑等,作為含有聚伸苯基醚骨架的接著劑組成物,可舉出國際公開第2014/046014號中記載的接著層等。於此等接著劑之中,例如從介電特性之觀點來看,至少含有結晶性酸改質聚烯烴及環氧樹脂的接著劑組成物,係更佳為含有5質量%以上的該接著劑之前述結晶性酸改質聚烯烴。For example, as an adhesive composition containing at least a crystalline acid-modified polyolefin and an epoxy resin, the adhesive described in International Publication No. WO 2016/031342, etc. can be mentioned, as an olefin skeleton-containing modified polyamide adhesive As the adhesive composition, the adhesives described in JP-A No. 2007-284515 can be mentioned, and as the adhesive composition using the aromatic olefin oligomer type modifier and epoxy resin, Japanese Laid-Open Patent Application The adhesive agent etc. described in Gazette 2007-63306, as an adhesive agent composition containing a polyphenylene ether skeleton, the adhesive layer etc. which are described in International Publication No. WO 2014/046014 can be mentioned. Among these adhesives, for example, from the viewpoint of dielectric properties, an adhesive composition containing at least a crystalline acid-modified polyolefin and an epoxy resin is more preferably 5 mass % or more of the adhesive. The aforementioned crystalline acid-modified polyolefin.

接著劑可為接著劑薄片,也可為在熱塑性液晶聚合物成形體上塗布接著劑組成物而乾燥者。接著層之厚度可為1~50μm,較佳可為5~40μm,更佳可為10~30μm。The adhesive may be an adhesive sheet, or may be a thermoplastic liquid crystal polymer molded body coated with an adhesive composition and dried. The thickness of the subsequent layer can be 1-50 μm, preferably 5-40 μm, and more preferably 10-30 μm.

作為熱塑性液晶聚合物被黏體,只要至少以上述熱塑性液晶聚合物所構成即可,可為與熱塑性液晶聚合物成形體相同的成分,也可為不同的成分。The thermoplastic liquid crystalline polymer to-be-adhered body may be composed of at least the above-mentioned thermoplastic liquid crystalline polymer, and may have the same components as the thermoplastic liquid crystalline polymer molded body, or may have different components.

又,熱塑性液晶聚合物被黏體係可以在上述內部層與表層中彈性模數具有特定關係之方式進行表面處理,也可不進行,但從接著性提升之觀點來看,較佳為在熱塑性液晶聚合物被黏體中之與熱塑性液晶聚合物成形體的被接著區域之至少一部分中以在上述內部層與表層中彈性模數具有特定關係之方式進行表面處理。當時,於熱塑性液晶聚合物被黏體中,與熱塑性液晶聚合物成形體同樣地,藉由奈米壓痕法所測定的表層之彈性模數Er(S)與內部層之彈性模數Er(I)之比(Er(S)/Er(I))可為0至1.50之範圍。In addition, the thermoplastic liquid crystal polymer to be adhered can be surface-treated in such a manner that the elastic modulus of the inner layer and the surface layer has a specific relationship, or not. At least a part of the adherend and the adhered region of the thermoplastic liquid crystal polymer molded body are surface-treated in such a manner that the elastic modulus in the above-mentioned inner layer and surface layer has a specific relationship. At that time, in the thermoplastic liquid crystal polymer adherend, the elastic modulus Er(S) of the surface layer and the elastic modulus Er(I(I) of the inner layer were measured by the nanoindentation method as in the thermoplastic liquid crystal polymer molded body. ) ratio (Er(S)/Er(I)) may range from 0 to 1.50.

使相同成分或不同成分的熱塑性液晶聚合物薄膜接著時,較佳為使在各自的熱塑性液晶聚合物薄膜,以在上述內部層與表層中彈性模數具有特定關係之方式進行了表面處理的表面彼此面對面,進行熱壓接。When bonding thermoplastic liquid crystal polymer films of the same composition or different compositions, it is preferable that the respective thermoplastic liquid crystal polymer films have a surface treated so that the elastic modulus of the inner layer and the surface layer has a specific relationship. face each other for thermocompression bonding.

熱塑性液晶聚合物成形體之接著區域中的液晶聚合物面與被接著材料之接著強度可為0.6N/mm以上,較佳可為0.7N/mm以上,更佳可為0.8N/mm以上。尚且,接著強度係以藉由後述實施例中記載之方法所測定的接著強度進行評價。The bonding strength between the liquid crystal polymer surface and the bonded material in the bonding region of the thermoplastic liquid crystal polymer molded body may be 0.6 N/mm or more, preferably 0.7 N/mm or more, and more preferably 0.8 N/mm or more. In addition, the adhesive strength was evaluated by the adhesive strength measured by the method described in the Example mentioned later.

又,本發明之熱塑性液晶聚合物成形體係即使長期間保管後也能維持接著強度。例如,對於熱塑性液晶聚合物成形體進行上述表面處理後立即的接著強度(剛處理後的接著強度)與保管6個月後的接著強度(保管後的接著強度)之比(保管後的接著強度/剛處理後的接著強度)可為70%以上,較佳可為80%以上,更佳可為90%以上。 [實施例]In addition, the thermoplastic liquid crystal polymer molding system of the present invention can maintain adhesive strength even after long-term storage. For example, the ratio of the adhesive strength immediately after the above-mentioned surface treatment (the adhesive strength immediately after the treatment) to the adhesive strength after storage for 6 months (the adhesive strength after storage) (the adhesive strength after storage) /adhesion strength immediately after treatment) may be 70% or more, preferably 80% or more, and more preferably 90% or more. [Example]

以下,藉由實施例來具體地說明本發明,惟本發明完全不受此等實施例所限定。 尚且,以下顯示以下實施例及比較例中所採用之經表面處理的熱塑性液晶聚合物薄膜之各評價方法。Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited by these examples at all. Furthermore, each evaluation method of the surface-treated thermoplastic liquid crystal polymer film employed in the following Examples and Comparative Examples is shown below.

(1)SPM之奈米壓痕測定 <樣品之調整> 將實施例及比較例所製作之剛處理後的熱塑性液晶聚合物薄膜或單面覆金屬積層板(接著材料)裁切成5mm×5mm之尺寸,透過雙面膠帶,以經電漿處理的薄膜面作為測定面,固定於測定台座,於下述裝置、測定條件下,將針前端從成形體最表層插入到20nm的深度時所算出的彈性模數當作Er(S),將針前端從薄膜最表層插入到200nm的深度時所算出的彈性模數當作Er(I)。從壓入深度的荷重-位移曲線,藉由附屬於下述裝置的解析軟體,求出彈性模數。又,為了排除測定場所的場所不一致,取樣任意的10點,採用其平均值作為分析結果。 <SPM測定條件> 測定裝置:多功能型SPM裝置(日立高科技股份有限公司製) 解析軟體:裝置附屬的解析軟體 測定溫度:23℃ 測定相對濕度:40% 奈米壓痕裝置:Triboscope(HYISTRON公司製) 測定針形狀:鑽石壓頭(Berkovich型) 測定針前端直徑:150nm 設定荷重: Er(S):以10μN,3秒壓入、3秒拉出(壓入深度約20nm) Er(I):以300μN,3秒壓入、3秒拉出(壓入深度約200nm)(1) Nanoindentation determination of SPM <Sample adjustment> The thermoplastic liquid crystal polymer film or single-sided metal-clad laminate (adhesive material) produced in the examples and comparative examples was cut into a size of 5mm × 5mm, and the plasma-treated film was passed through double-sided tape. The surface was used as the measurement surface, fixed on the measurement stand, and the elastic modulus calculated when the needle tip was inserted from the outermost surface layer of the molded body to a depth of 20 nm was regarded as Er(S) under the following apparatus and measurement conditions. The elastic modulus calculated when the outermost layer of the film was inserted to a depth of 200 nm was regarded as Er(I). From the load-displacement curve of the indentation depth, the elastic modulus was obtained by the analysis software attached to the following device. In addition, in order to exclude the inconsistency of the measurement location, 10 arbitrary points were sampled, and the average value was used as the analysis result. <SPM measurement conditions> Measuring device: Multifunctional SPM device (manufactured by Hitachi High-Tech Co., Ltd.) Analysis software: Analysis software attached to the device Measurement temperature: 23℃ Determination of relative humidity: 40% Nanoindentation device: Triboscope (manufactured by HYISTRON) Measuring needle shape: diamond indenter (Berkovich type) Measuring needle tip diameter: 150nm Set load: Er(S): 10μN, push in for 3 seconds, pull out for 3 seconds (indentation depth about 20nm) Er(I): 300μN, press in for 3 seconds, pull out for 3 seconds (pressing depth is about 200nm)

(2)接著強度 將實施例及比較例所製作之剛處理後的熱塑性液晶聚合物薄膜或單面覆金屬積層板(接著材料)與被接著材料之積層體當作評價用樣品。又,作為長期保管後的接著性之評價,將處理後的接著材料在溫度:25℃、濕度:40%之條件下於恒溫室中保持6個月後,製作與被接著材料積層而成的積層體,當作評價用樣品。 由評價用樣品的積層體來製作1.0cm寬度的剝離試驗片,以雙面接著膠帶將其接著材料側固定於平板,依據JIS C 6471:1995,藉由90°法,測定以50mm/min之速度在被接著材料與接著材料之經電漿處理的熱塑性液晶聚合物薄膜面之界面進行剝離時的強度(N/mm)。(2) Adhesion strength The laminated body of the thermoplastic liquid crystal polymer film or the single-sided metal-clad laminate (adhesive material) and the material to be adhered immediately after the treatment produced in the Examples and Comparative Examples was used as a sample for evaluation. In addition, as an evaluation of the adhesiveness after long-term storage, the treated adhesive was kept in a constant temperature chamber for 6 months under the conditions of temperature: 25°C, humidity: 40%, and then a laminate of the adhesive material was produced. The laminate was used as a sample for evaluation. A release test piece with a width of 1.0 cm was prepared from the laminated body of the sample for evaluation, and the adhesive material side was fixed to a flat plate with a double-sided adhesive tape. According to JIS C 6471:1995, it was measured by the 90° method at 50 mm/min. Velocity Strength (N/mm) when peeling occurs at the interface between the adhered material and the plasma-treated thermoplastic liquid crystal polymer film side of the adherent material.

[參考例1] 將對羥基苯甲酸與6-羥基-2-萘甲酸的共聚物且熔點為280℃之熱塑性液晶聚合物,以吐出量20kg/小時熔融擠出,於橫延伸倍率4.77倍、縱延伸倍率2.09倍之條件下吹脹製膜,得到平均膜厚為50μm的熱塑性液晶聚合物薄膜。於所得之薄膜的單面上積層鋁箔,在熱風烘箱中吊下,以310℃熱處理10分鐘,冷卻後,以氯化鐵的水溶液來溶解去除鋁箔,得到熱塑性液晶聚合物薄膜。[Reference Example 1] A thermoplastic liquid crystal polymer of p-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid with a melting point of 280°C, melt extruded at a discharge rate of 20kg/hour, with a horizontal stretch ratio of 4.77 times and a vertical stretch ratio of 2.09 times Under the same conditions, the film was blown into a film to obtain a thermoplastic liquid crystal polymer film with an average film thickness of 50 μm. An aluminum foil was laminated on one side of the obtained film, hung down in a hot air oven, heat-treated at 310° C. for 10 minutes, and after cooling, the aluminum foil was dissolved and removed with an aqueous solution of ferric chloride to obtain a thermoplastic liquid crystal polymer film.

[實施例1~3] 將參考例1所得之長條的熱塑性液晶聚合物薄膜,於在真空室內部設有薄膜捲出及捲取的電漿連續裝置中,以通過平行平板電極間(電極面積5cm×60cm,頭-薄膜間距離20mm)之方式設置。藉由真空泵將真空室內排氣到2Pa為止後,以表7中所示的氣體流量將N2 氣體導入,調整至表7中所示的壓力。接著,以電源的輸出:2kW、頻率:110kHz,在電極使電漿產生。以處理時間成為如表7所示的方式,設定搬運速度,在熱塑性液晶聚合物薄膜之一表面連續地進行電漿處理。表7中所示之每單位面積的輸出(W/cm2 )係由電極的面積與電源的輸出來算出。 對於經電漿處理的單面覆金屬積層板之表面,藉由SPM測定Er(S)與Er(I)。表7中顯示結果。 然後,切出2片的已進行電漿處理的熱塑性液晶聚合物薄膜,使兩者的薄膜片之已進行電漿處理的表面各自作為被黏面疊合後,於300℃、4MPa之條件下加壓10分鐘,製作熱塑性液晶聚合物薄膜彼此的積層體。測定此積層體的接著強度,當作剛處理後的接著強度。 又,將經電漿處理的單面覆金屬積層板在恒溫室中保管6個月(溫度25℃、濕度40%)後,切出2片的薄膜,使兩者的薄膜片之已進行電漿處理的表面各自作為被黏面疊合後,於300℃、4MPa之條件下加壓10分鐘,製作熱塑性液晶聚合物薄膜彼此的積層體。測定此積層體的接著強度,當作保管6個月後的接著強度。[Examples 1 to 3] The long thermoplastic liquid crystal polymer film obtained in Reference Example 1 was placed in a continuous plasma device equipped with film unwinding and winding inside a vacuum chamber to pass between parallel plate electrodes (electrodes). The area is 5cm×60cm, and the distance between the head and the film is 20mm). After the vacuum chamber was evacuated to 2 Pa by a vacuum pump, N 2 gas was introduced at the gas flow rate shown in Table 7, and the pressure was adjusted to the pressure shown in Table 7. Next, with the output of the power supply: 2 kW, and the frequency: 110 kHz, plasma was generated in the electrodes. The conveyance speed was set so that the treatment time was as shown in Table 7, and plasma treatment was continuously performed on one surface of the thermoplastic liquid crystal polymer film. The output per unit area (W/cm 2 ) shown in Table 7 was calculated from the area of the electrode and the output of the power supply. Er(S) and Er(I) were measured by SPM on the surface of the plasma-treated single-sided metal-clad laminate. The results are shown in Table 7. Then, cut out two plasma-treated thermoplastic liquid crystal polymer films, and superimpose the plasma-treated surfaces of the two film sheets as the adhered surfaces, and put them together under the conditions of 300°C and 4MPa. The pressure was applied for 10 minutes to prepare a laminate of thermoplastic liquid crystal polymer films. The adhesive strength of this layered body was measured and regarded as the adhesive strength immediately after the treatment. In addition, after the plasma-treated single-sided metal-clad laminate was stored in a constant temperature room for 6 months (temperature 25°C, humidity 40%), two thin films were cut out, and the two thin film sheets were electrically energized. After the paste-treated surfaces were superimposed as to-be-adhered surfaces, they were pressurized under the conditions of 300° C. and 4 MPa for 10 minutes to produce a laminate of thermoplastic liquid crystal polymer films. The adhesive strength of this laminate was measured, and it was regarded as the adhesive strength after storage for 6 months.

[實施例4] 重疊參考例1所得之長條的熱塑性液晶聚合物薄膜與長條的銅箔(福田金屬箔粉工業股份有限公司製,「CF-H9A-DS-HD2」,厚度12μm、表面粗糙度Rz1.2μm),在加熱輥間將此等連續地導入,以270℃、3MPa進行壓接並積層,製作單面覆金屬積層板。 將此單面覆金屬積層板,於在真空室內部設有薄膜捲出及捲取的電漿連續裝置中,以通過平行平板電極間(電極面積5cm×60cm,頭-薄膜間距離20mm)之方式設置。藉由真空泵將真空室內排氣到2Pa為止後,以表7中所示的氣體流量將N2 氣體導入,調整至表7中所示的壓力。接著,以電源的輸出:2kW、頻率:110kHz,在電極使電漿產生。以處理時間成為如表7所示的方式,設定搬運速度,在單面覆金屬積層板的熱塑性液晶聚合物薄膜側之表面連續地進行電漿處理。表7中所示之每單位面積的輸出(W/cm2 )係由電極的面積與電源的輸出而算出。 對於經電漿處理的單面覆金屬積層板的熱塑性液晶聚合物薄膜側之表面,藉由SPM測定Er(S)與Er(I)。表7中顯示結果。 然後,切出2片的已進行電漿處理的單面覆金屬積層板,於單面覆金屬積層板之2片的切出片中,使已進行電漿處理的熱塑性液晶聚合物薄膜側之表面各自作為被黏面疊合後,於300℃、4MPa之條件下加壓10分鐘,製作使2片的單面覆金屬積層板以互相的薄膜面側疊合而成之積層體。測從此積層體的熱塑性液晶聚合物薄膜面間之界面部分的接著強度,當作剛處理後的接著強度。 又,將經電漿處理的單面覆金屬積層板在恒溫室中保管6個月(溫度25℃、濕度40%)後,切出2片,於單面覆金屬積層板之2片的切出片中,使已進行電漿處理的熱塑性液晶聚合物薄膜側之表面各自作為被黏面疊合後,於300℃、4MPa之條件下加壓10分鐘,製作使2片的單面覆金屬積層板以互相的薄膜面側疊合而成之積層體。測定此積層體的熱塑性液晶聚合物薄膜面間之界面部分的接著強度,當作保管6個月後的接著強度。[Example 4] The long thermoplastic liquid crystal polymer film obtained in Reference Example 1 and the long copper foil (manufactured by Futian Metal Foil Powder Co., Ltd., "CF-H9A-DS-HD2", thickness 12 μm, surface roughness Rz 1.2 μm), these were introduced continuously between heating rolls, and pressure-bonded and laminated at 270° C. and 3 MPa to produce a single-sided metal-clad laminate. This single-sided metal-clad laminate was placed in a continuous plasma device with film unwinding and winding inside the vacuum chamber, so as to pass between parallel plate electrodes (electrode area 5cm×60cm, head-film distance 20mm). mode setting. After the vacuum chamber was evacuated to 2 Pa by a vacuum pump, N 2 gas was introduced at the gas flow rate shown in Table 7, and the pressure was adjusted to the pressure shown in Table 7. Next, with the output of the power supply: 2 kW, and the frequency: 110 kHz, plasma was generated in the electrodes. The conveying speed was set so that the treatment time was as shown in Table 7, and the plasma treatment was continuously performed on the surface on the thermoplastic liquid crystal polymer film side of the single-sided metal-clad laminate. The output per unit area (W/cm 2 ) shown in Table 7 was calculated from the area of the electrode and the output of the power supply. For the surface of the thermoplastic liquid crystal polymer film side of the plasma-treated single-sided metal-clad laminate, Er(S) and Er(I) were measured by SPM. The results are shown in Table 7. Then, two sheets of the plasma-treated single-sided metal-clad laminate were cut out, and the plasma-treated thermoplastic liquid crystal polymer film side of the two cut sheets of the single-sided metal-clad laminate was cut out. After the surfaces were laminated as to-be-adhered surfaces, pressure was applied at 300°C and 4 MPa for 10 minutes to produce a laminate in which two single-sided metal-clad laminates were laminated on the film side of each other. The bonding strength of the interface portion between the thermoplastic liquid crystal polymer film surfaces of this laminate was measured and regarded as the bonding strength immediately after the treatment. In addition, after the plasma-treated single-sided metal-clad laminate was stored in a constant temperature room for 6 months (temperature 25°C, humidity 40%), two pieces were cut out, and two pieces of the single-sided metal-clad laminate were cut. In the filming process, the surfaces on the side of the thermoplastic liquid crystal polymer film that have been subjected to the plasma treatment are respectively laminated as the adhered surfaces, and then pressurized for 10 minutes under the conditions of 300°C and 4MPa to make two single-sided metal-coated sheets. The laminate is a laminate formed by stacking the film surfaces of each other. The adhesive strength of the interface portion between the thermoplastic liquid crystal polymer film surfaces of this laminate was measured and regarded as the adhesive strength after storage for 6 months.

[實施例5] 將參考例1所得之長條的熱塑性液晶聚合物薄膜、長條的銅箔(福田金屬箔粉工業股份有限公司製,「CF-H9A-DS-HD2」,厚度12μm、表面粗糙度Rz1.2μm)及長條的PCM箔(JX金屬股份有限公司製,「PCM」,厚度18μm、表面粗糙度Rz4.5μm、能剝離的銅箔),以成為銅箔/熱塑性液晶聚合物薄膜/PCM箔之方式重疊,在加熱輥間將此等以270℃、3MPa連續地壓接並積層後,僅剝離PCM箔,得到具有PCM箔的粗化面經轉印的熱塑性液晶聚合物薄膜面之單面覆金屬積層板。 於此粗化面經轉印的熱塑性液晶聚合物薄膜之表面,於與實施例4同樣之條件下進行電漿處理而得到單面覆金屬積層板作為接著材料。對於作為接著材料的單面覆金屬積層板之PCM箔的粗化面被轉印且經電漿處理的熱塑性液晶聚合物薄膜側之表面,藉由SPM測定Er(S)與Er(I)。表7中顯示結果。 然後,使此經電漿處理的粗化面與實施例4所製作的單面覆金屬積層板之電漿處理面疊合後,於300℃、4MPa之條件下加壓10分鐘,製作使2片的單面覆金屬積層板以互相的薄膜面側疊合而成之積層體。測定此積層體的熱塑性液晶聚合物薄膜面間之界面部分的接著強度,當作剛處理後的接著強度。 又,將此等之單面覆金屬積層板在恒溫室中保管6個月(溫度25℃、濕度40%)後,使此經電漿處理的粗化面與實施例4所製作的單面覆金屬積層板之電漿處理面疊合後,於300℃、4MPa之條件下加壓10分鐘,製作使2片的單面覆金屬積層板以互相的薄膜面側疊合而成之積層體。測定此積層體的熱塑性液晶聚合物薄膜面間之界面部分的接著強度,當作保管6個月後的接著強度。[Example 5] The long thermoplastic liquid crystal polymer film obtained in Reference Example 1 and the long copper foil (manufactured by Futian Metal Foil Powder Co., Ltd., "CF-H9A-DS-HD2", thickness 12 μm, surface roughness Rz 1.2 μm ) and a long strip of PCM foil (manufactured by JX Metal Co., Ltd., "PCM", thickness 18μm, surface roughness Rz4.5μm, peelable copper foil) to become a copper foil/thermoplastic liquid crystal polymer film/PCM foil. After the layers were continuously pressed and laminated at 270°C and 3MPa between heating rollers, only the PCM foil was peeled off to obtain a single-sided laminate with the surface of the thermoplastic liquid crystal polymer film with the roughened surface of the PCM foil transferred. Metal laminate. The surface of the thermoplastic liquid crystal polymer film transferred on the roughened surface was subjected to plasma treatment under the same conditions as in Example 4 to obtain a single-sided metal-clad laminate as an adhesive material. Er(S) and Er(I) were measured by SPM on the surface of the thermoplastic liquid crystal polymer film side to which the roughened surface of the PCM foil of the single-sided metal-clad laminate was transferred and plasma-treated as an adhesive material. The results are shown in Table 7. Then, the plasma-treated roughened surface and the plasma-treated surface of the single-sided metal-clad laminate produced in Example 4 were superimposed, and then pressurized under the conditions of 300° C. and 4 MPa for 10 minutes to prepare a 2 A laminate in which single-sided metal-clad laminates of sheets are stacked on the film side of each other. The adhesive strength of the interface portion between the thermoplastic liquid crystal polymer film surfaces of this laminate was measured and regarded as the adhesive strength immediately after the treatment. In addition, these single-sided metal-clad laminates were stored in a constant temperature room for 6 months (temperature 25° C., humidity 40%), and then the plasma-treated roughened surfaces were compared with the single-sided surfaces prepared in Example 4. After the plasma-treated surfaces of the metal-clad laminates were superimposed, pressurized for 10 minutes at 300°C and 4 MPa to produce a laminate in which two single-sided metal-clad laminates were superimposed on the film side of each other. . The adhesive strength of the interface portion between the thermoplastic liquid crystal polymer film surfaces of this laminate was measured and regarded as the adhesive strength after storage for 6 months.

[實施例6] 將參考例1所得之長條的熱塑性液晶聚合物薄膜、長條的銅箔(福田金屬箔粉工業股份有限公司製,「CF-H9A-DS-HD2」,厚度12μm、表面粗糙度Rz1.2μm)及長條的聚醯亞胺製保護薄片,以成為銅箔/熱塑性液晶聚合物薄膜/銅箔/聚醯亞胺製保護薄片之方式重疊,在加熱輥間將此等連續地導入,以300℃、3MPa進行壓接並積層,製作在一面上貼合有保護薄片之兩面覆金屬積層板。然後,使用噴淋式的蝕刻裝置,一邊搬運該兩面覆金屬積層板,一邊藉由經加熱到40℃的35%氯化鐵水溶液(SUNHAYATO股份有限公司製),蝕刻兩面覆金屬積層板之一面(非保護面)的銅箔。然後,在室溫下乾燥後,剝離保護薄片,製作具有熱塑性液晶聚合物薄膜的複製面(粗化面)之單面覆金屬積層板。 於此複製面,在與實施例4同樣之條件下進行電漿處理,得到單面覆金屬積層板作為接著材料。對於作為接著材料的單面覆金屬積層板之經電漿處理的熱塑性液晶聚合物薄膜之複製面,藉由SPM測定Er(S)與Er(I)。表7中顯示結果。 然後,使此經電漿處理的複製面與實施例4所製作的單面覆金屬積層板之電漿處理面疊合後,於300℃、4MPa之條件下加壓10分鐘,製作使2片的單面覆金屬積層板以互相的薄膜面側疊合而成之積層體。測定此積層體的熱塑性液晶聚合物薄膜面間之界面部分的接著強度,當作剛處理後的接著強度。 又,將此等之單面覆金屬積層板在恒溫室中保管6個月(溫度25℃、濕度40%)後,使此經電漿處理的複製面與實施例4所製作的單面覆金屬積層板之電漿處理面疊合後,於300℃、4MPa之條件下加壓10分鐘,製作使2片的單面覆金屬積層板以互相的薄膜面側疊合而成之積層體。測定此積層體的熱塑性液晶聚合物薄膜面間之界面部分的接著強度,當作保管6個月後的接著強度。[Example 6] The long thermoplastic liquid crystal polymer film obtained in Reference Example 1 and the long copper foil (manufactured by Futian Metal Foil Powder Co., Ltd., "CF-H9A-DS-HD2", thickness 12 μm, surface roughness Rz 1.2 μm ) and a long protective sheet made of polyimide, overlapped so as to form a copper foil/thermoplastic liquid crystal polymer film/copper foil/protective sheet made of polyimide, and these were continuously introduced between heating rollers to 300°C and 3MPa were crimped and laminated to produce a double-sided metal-clad laminate with a protective sheet attached to one side. Then, while conveying the double-sided metal-clad laminate, one surface of the double-sided metal-clad laminate was etched with a 35% ferric chloride aqueous solution (manufactured by Sunhayato Co., Ltd.) heated to 40° C. using a shower-type etching apparatus. (non-protective surface) copper foil. Then, after drying at room temperature, the protective sheet was peeled off to prepare a single-sided metal-clad laminate having a transfer surface (roughened surface) of the thermoplastic liquid crystal polymer film. Plasma treatment was performed on this transfer surface under the same conditions as in Example 4 to obtain a single-sided metal-clad laminate as an adhesive material. Er(S) and Er(I) were measured by SPM on the replication side of the plasma-treated thermoplastic liquid crystal polymer film of the single-sided metal-clad laminate as the adhesive material. The results are shown in Table 7. Then, the plasma-treated replication surface and the plasma-treated surface of the single-sided metal-clad laminate produced in Example 4 were superimposed, and then pressurized under the conditions of 300° C. and 4 MPa for 10 minutes to produce two sheets of The single-sided metal-clad laminate is a laminate formed by superimposing the film sides of each other. The adhesive strength of the interface portion between the thermoplastic liquid crystal polymer film surfaces of this laminate was measured and regarded as the adhesive strength immediately after the treatment. In addition, these single-sided metal-clad laminates were stored in a constant temperature room for 6 months (temperature 25° C., humidity 40%), and then the plasma-treated replication surface was made with the single-sided coating produced in Example 4. After the plasma-treated surfaces of the metal laminates were superimposed, they were pressurized at 300°C and 4 MPa for 10 minutes to produce a laminate in which two single-sided metal-clad laminates were superimposed on the film side of each other. The adhesive strength of the interface portion between the thermoplastic liquid crystal polymer film surfaces of this laminate was measured and regarded as the adhesive strength after storage for 6 months.

[實施例7] 除了作為電漿處理之條件,將氣體流量、壓力變更為如表7以外,與實施例4同樣地,製作經電漿處理的單面覆金屬積層板作為接著材料。對於經電漿處理的單面覆金屬積層板之熱塑性液晶聚合物薄膜側之表面,藉由SPM算出Er(S)與Er(I)。表7中顯示結果。 然後,準備未進行實施例4之電漿處理的單面覆金屬積層板作為被接著材料,使單面覆金屬積層板的電漿處理面與未進行電漿處理的單面覆金屬積層板之熱塑性液晶聚合物薄膜側之表面疊合後,於300℃、4MPa之條件下加壓10分鐘,製作使2片的單面覆金屬積層板以互相的薄膜面側疊合而成之積層體。測定此積層體的熱塑性液晶聚合物薄膜面間之界面部分的接著強度,當作剛處理後的接著強度。 又,將經電漿處理的單面覆金屬積層板在恒溫室中保管6個月(溫度25℃、濕度40%)後,切出1片,使單面覆金屬積層板的電漿處理面與未進行電漿處理的單面覆金屬積層板之熱塑性液晶聚合物薄膜側之表面疊合後,於300℃、4MPa之條件下加壓10分鐘,製作使2片的單面覆金屬積層板以互相的薄膜面側疊合而成之積層體。測定此積層體的熱塑性液晶聚合物薄膜面間之界面部分的接著強度,當作保管6個月後的接著強度。[Example 7] A plasma-treated single-sided metal-clad laminate was produced as an adhesive material in the same manner as in Example 4, except that the gas flow rate and the pressure were changed as in Table 7 as the plasma treatment conditions. For the surface of the thermoplastic liquid crystal polymer film side of the plasma-treated single-sided metal-clad laminate, Er(S) and Er(I) were calculated by SPM. The results are shown in Table 7. Then, a single-sided metal-clad laminate without the plasma treatment of Example 4 was prepared as a material to be bonded, and the plasma-treated side of the single-sided metal-clad laminate and the single-sided metal-clad laminate without plasma treatment were After the thermoplastic liquid crystal polymer film side surfaces were superimposed, pressurized at 300°C and 4 MPa for 10 minutes to produce a laminate in which two single-sided metal-clad laminates were superimposed on the film surface sides of each other. The adhesive strength of the interface portion between the thermoplastic liquid crystal polymer film surfaces of this laminate was measured and regarded as the adhesive strength immediately after the treatment. In addition, after storing the plasma-treated single-sided metal-clad laminate in a constant temperature room for 6 months (temperature 25°C, humidity 40%), one piece was cut out to make the plasma-treated surface of the single-sided metal-clad laminate. After being superimposed on the surface of the thermoplastic liquid crystal polymer film side of the single-sided metal-clad laminate that has not undergone plasma treatment, pressurized for 10 minutes at 300°C and 4 MPa to produce two single-sided metal-clad laminates. A laminate formed by stacking the film surfaces of each other. The adhesive strength of the interface portion between the thermoplastic liquid crystal polymer film surfaces of this laminate was measured and regarded as the adhesive strength after storage for 6 months.

[比較例1] 除了作為電漿處理之條件,不以真空泵進行排氣,將N2 氣體導入,在大氣壓下進行以外,與實施例1同樣地,製作熱塑性液晶聚合物薄膜彼此的積層體,測定接著強度。[Comparative Example 1] A laminate of thermoplastic liquid crystal polymer films was produced in the same manner as in Example 1, except that the conditions of the plasma treatment were not evacuated with a vacuum pump, but N 2 gas was introduced and carried out at atmospheric pressure. Adhesion strength was measured.

[比較例2] 除了作為電漿處理之條件,將氣體物種、壓力變更為如表7以外,與實施例1同樣地,製作熱塑性液晶聚合物薄膜彼此的積層體,測定接著強度。[Comparative Example 2] A laminate of thermoplastic liquid crystal polymer films was produced in the same manner as in Example 1, except that the gas species and the pressure were changed as in Table 7 as the plasma treatment conditions, and the adhesive strength was measured.

[比較例3] 將參考例1所得之長條的熱塑性液晶聚合物薄膜、長條的銅箔(福田金屬箔粉工業股份有限公司製,「CF-H9A-DS-HD2」,厚度12μm、表面粗糙度Rz1.2μm)及長條的PCM箔(JX金屬股份有限公司製,「PCM」,厚度18μm、表面粗糙度Rz4.5μm、能剝離的銅箔),以成為銅箔/熱塑性液晶聚合物薄膜/PCM箔之方式重疊,在加熱輥間將此等以270℃、3MPa連續地壓接並積層後,僅剝離PCM箔,得到具有PCM箔的粗化面經轉印的熱塑性液晶聚合物薄膜面之單面覆金屬積層板。 對於單面覆金屬積層板之PCM箔的粗化面經轉印的熱塑性液晶聚合物薄膜側之表面,藉由SPM測定Er(S)與Er(I)。表7中顯示結果。 然後,準備PCM箔的粗化面經轉印之上述單面覆金屬積層板與參考例1所得之未進行表面處理的熱塑性液晶聚合物薄膜,使單面覆金屬積層板的粗化面與熱塑性液晶聚合物薄膜疊合後,於300℃、4MPa之條件下加壓10分鐘,製作使單面覆金屬積層板的薄膜面與熱塑性液晶聚合物薄膜疊合而成的積層體。測定此積層體的熱塑性液晶聚合物薄膜面間之界面部分的接著強度,當作剛處理後的接著強度。 又,將PCM箔的粗化面經轉印之上述單面覆金屬積層板與參考例1所得之未進行表面處理的熱塑性液晶聚合物薄膜在恒溫室中保管6個月(溫度25℃、濕度40%)後,使單面覆金屬積層板的粗化面與熱塑性液晶聚合物薄膜疊合後,於300℃、4MPa之條件下加壓10分鐘,製作使單面覆金屬積層板的薄膜面與熱塑性液晶聚合物薄膜疊合而成的積層體。測定此積層體的熱塑性液晶聚合物薄膜彼此之界面部分的接著強度,當作保管6個月後的接著強度。[Comparative Example 3] The long thermoplastic liquid crystal polymer film obtained in Reference Example 1 and the long copper foil (manufactured by Futian Metal Foil Powder Co., Ltd., "CF-H9A-DS-HD2", thickness 12 μm, surface roughness Rz 1.2 μm ) and a long strip of PCM foil (manufactured by JX Metal Co., Ltd., "PCM", thickness 18μm, surface roughness Rz4.5μm, peelable copper foil) to become a copper foil/thermoplastic liquid crystal polymer film/PCM foil. After the layers were continuously pressed and laminated at 270°C and 3MPa between heating rollers, only the PCM foil was peeled off to obtain a single-sided laminate with the surface of the thermoplastic liquid crystal polymer film with the roughened surface of the PCM foil transferred. Metal laminate. Er(S) and Er(I) were determined by SPM on the surface of the transferred thermoplastic liquid crystal polymer film side of the roughened side of the PCM foil of the single-sided metal-clad laminate. The results are shown in Table 7. Then, the above-mentioned single-sided metal-clad laminate to which the roughened surface of the PCM foil was transferred and the unsurface-treated thermoplastic liquid crystal polymer film obtained in Reference Example 1 were prepared, so that the roughened surface of the single-sided metal-clad laminate and the thermoplastic liquid crystal polymer film were prepared. After the liquid crystal polymer films were laminated, pressure was applied at 300° C. and 4 MPa for 10 minutes to produce a laminate in which the film side of the single-sided metal-clad laminate was laminated with the thermoplastic liquid crystal polymer film. The adhesive strength of the interface portion between the thermoplastic liquid crystal polymer film surfaces of this laminate was measured and regarded as the adhesive strength immediately after the treatment. In addition, the above-mentioned single-sided metal-clad laminate to which the roughened surface of the PCM foil was transferred and the thermoplastic liquid crystal polymer film obtained in Reference Example 1 without surface treatment were stored in a constant temperature room (temperature 25°C, humidity) for 6 months. 40%), after superimposing the roughened surface of the single-sided metal-clad laminate with the thermoplastic liquid crystal polymer film, pressurized for 10 minutes under the conditions of 300 ° C and 4 MPa to prepare the film surface of the single-sided metal-clad laminate. A laminate formed by laminating a thermoplastic liquid crystal polymer film. The adhesive strength of the interface portion between the thermoplastic liquid crystal polymer films of this laminate was measured and regarded as the adhesive strength after storage for 6 months.

[比較例4] 對於參考例1所得之未進行表面處理的熱塑性液晶聚合物薄膜之表面,藉由SPM測定Er(S)與Er(I)。表7中顯示結果。 然後,切出2片的未進行表面處理的上述熱塑性液晶聚合物薄膜,使兩者的薄膜片疊合後,於300℃、4MPa之條件下加壓10分鐘,製作熱塑性液晶聚合物薄膜彼此的積層體。測定此積層體的接著強度,當作剛處理後的接著強度。 又,將未進行表面處理的上述熱塑性液晶聚合物薄膜在恒溫室中保管6個月(溫度25℃、濕度40%)後,切出2片的薄膜,使兩者的薄膜片疊合後,於300℃、4MPa之條件下加壓10分鐘,製作熱塑性液晶聚合物薄膜彼此的積層體。測定此積層體的接著強度,當作保管6個月後的接著強度。[Comparative Example 4] On the surface of the thermoplastic liquid crystal polymer film obtained in Reference Example 1 without surface treatment, Er(S) and Er(I) were measured by SPM. The results are shown in Table 7. Then, two sheets of the above-mentioned thermoplastic liquid crystal polymer films without surface treatment were cut out, and the two film sheets were laminated, and then pressurized under the conditions of 300° C. and 4 MPa for 10 minutes to prepare thermoplastic liquid crystal polymer films. Laminated body. The adhesive strength of this layered body was measured and regarded as the adhesive strength immediately after the treatment. In addition, after storing the above-mentioned thermoplastic liquid crystal polymer film without surface treatment in a constant temperature room for 6 months (temperature 25° C., humidity 40%), two films were cut out, and the two film sheets were laminated. It pressurized for 10 minutes under the conditions of 300 degreeC and 4 MPa, and produced the laminated body of thermoplastic liquid crystal polymer films. The adhesive strength of this laminate was measured, and it was regarded as the adhesive strength after storage for 6 months.

[表7] 氣體物種 氣體流量 (sccm) 壓力 (Pa) 頻率 (kHz) 輸出 (W/cm2 ) 處理時間 (秒) 彈性模數(GPa) Er(S)/Er(I) 接著構成 接著強度(N/mm) 接著強度 維持率 (%) Er(S) Er(I) 接著材料 被接著材料 剛處理後 保管6個月後 實施例1 N2 20 30 110 6.6 1 6.36 4.36 1.46 熱塑性液晶聚合物薄膜 熱塑性液晶聚合物薄膜 0.63 0.61 97% 實施例2 N2 20 10 110 6.6 1 5.76 4.27 1.35 熱塑性液晶聚合物薄膜 熱塑性液晶聚合物薄膜 0.81 0.80 99% 實施例3 N2 8 5 110 6.6 1 5.81 4.28 1.36 熱塑性液晶聚合物薄膜 熱塑性液晶聚合物薄膜 1.00 0.97 97% 實施例4 N2 20 10 110 6.6 1 4.20 4.30 0.98 單面覆金屬積層板 單面覆金屬積層板 1.00 0.97 97% 實施例5 N2 20 10 110 6.6 1 5.70 4.27 1.33 單面覆金屬積層板 (PCM箔的粗化面) 單面覆金屬積層板 1.20 1.15 96% 實施例6 N2 20 10 110 6.6 1 4.10 4.11 1.00 單面覆金屬積層板 (複製面) 單面覆金屬積層板 1.20 1.20 100% 實施例7 N2 8 5 110 6.6 1 4.00 4.30 0.93 單面覆金屬積層板 單面覆金屬積層板 (未處理) 0.70 0.67 96% 比較例1 N2 20 大氣壓 110 6.6 1 6.90 4.40 1.57 熱塑性液晶聚合物薄膜 熱塑性液晶聚合物薄膜 0.60 0.40 67% 比較例2 O2 20 20 110 6.6 1 7.00 4.50 1.56 熱塑性液晶聚合物薄膜 熱塑性液晶聚合物薄膜 1.00 0.20 20% 比較例3 - - - - - - 8.69 5.70 1.52 單面覆金屬積層板 (PCM箔的粗化面、未處理) 熱塑性液晶聚合物薄膜 (未處理) 0.30 0.11 37% 比較例4 - - - - - - 7.04 4.50 1.56 熱塑性液晶聚合物薄膜 (未處理) 熱塑性液晶聚合物薄膜 (未處理) 0.30 0.20 67% [Table 7] gas species Gas flow (sccm) Pressure (Pa) Frequency (kHz) Output (W/cm 2 ) Processing time (seconds) Elastic Modulus (GPa) Er(S)/Er(I) Then make up Adhesion strength (N/mm) Next Strength Retention Rate (%) Er(S) Er(I) next material material to be attached just after processing After 6 months of storage Example 1 N 2 20 30 110 6.6 1 6.36 4.36 1.46 Thermoplastic Liquid Crystal Polymer Film Thermoplastic Liquid Crystal Polymer Film 0.63 0.61 97% Example 2 N 2 20 10 110 6.6 1 5.76 4.27 1.35 Thermoplastic Liquid Crystal Polymer Film Thermoplastic Liquid Crystal Polymer Film 0.81 0.80 99% Example 3 N 2 8 5 110 6.6 1 5.81 4.28 1.36 Thermoplastic Liquid Crystal Polymer Film Thermoplastic Liquid Crystal Polymer Film 1.00 0.97 97% Example 4 N 2 20 10 110 6.6 1 4.20 4.30 0.98 Single-sided metal-clad laminate Single-sided metal-clad laminate 1.00 0.97 97% Example 5 N 2 20 10 110 6.6 1 5.70 4.27 1.33 Single-sided metal-clad laminate (roughened surface of PCM foil) Single-sided metal-clad laminate 1.20 1.15 96% Example 6 N 2 20 10 110 6.6 1 4.10 4.11 1.00 Single-sided metal-clad laminate (copy side) Single-sided metal-clad laminate 1.20 1.20 100% Example 7 N 2 8 5 110 6.6 1 4.00 4.30 0.93 Single-sided metal-clad laminate Single-sided metal-clad laminate (untreated) 0.70 0.67 96% Comparative Example 1 N 2 20 atmospheric pressure 110 6.6 1 6.90 4.40 1.57 Thermoplastic Liquid Crystal Polymer Film Thermoplastic Liquid Crystal Polymer Film 0.60 0.40 67% Comparative Example 2 O 2 20 20 110 6.6 1 7.00 4.50 1.56 Thermoplastic Liquid Crystal Polymer Film Thermoplastic Liquid Crystal Polymer Film 1.00 0.20 20% Comparative Example 3 - - - - - - 8.69 5.70 1.52 Single-sided metal-clad laminate (roughened surface of PCM foil, untreated) Thermoplastic liquid crystal polymer film (untreated) 0.30 0.11 37% Comparative Example 4 - - - - - - 7.04 4.50 1.56 Thermoplastic liquid crystal polymer film (untreated) Thermoplastic liquid crystal polymer film (untreated) 0.30 0.20 67%

如表7所示,於使用表層之彈性模數Er(S)與內部層之彈性模數Er(I)之比(Er(S)/Er(I))為0至1.50之範圍的熱塑性液晶聚合物成形體之實施例1~7中,即使保管6個月後也接著強度高,可知即使長期間保管也能維持高的接著性。As shown in Table 7, the ratio of the elastic modulus Er(S) of the surface layer to the elastic modulus Er(I) of the inner layer (Er(S)/Er(I)) of the thermoplastic liquid crystal in the range of 0 to 1.50 was used. In Examples 1 to 7 of the polymer moldings, the adhesive strength was high even after storage for 6 months, and it was found that high adhesiveness was maintained even after long-term storage.

另一方面,於使用表層之彈性模數Er(S)與內部層之彈性模數Er(I)之比(Er(S)/Er(I))超出0至1.50之範圍的熱塑性液晶聚合物成形體之比較例1~4中,接著強度低,保管6個月後的接著強度降低,可知若長期保管則無法維持接著性。 [產業上利用之可能性]On the other hand, using a thermoplastic liquid crystal polymer in which the ratio of the elastic modulus Er(S) of the surface layer to the elastic modulus Er(I) of the inner layer (Er(S)/Er(I)) exceeds the range of 0 to 1.50 In Comparative Examples 1 to 4 of the molded body, the adhesive strength was low, and the adhesive strength after storage for 6 months decreased, and it was found that the adhesiveness could not be maintained when stored for a long period of time. [Possibility of Industrial Use]

根據本發明,若為形成有內部層之彈性模數與表層之彈性模數具有特定關係的構造之熱塑性液晶聚合物成形體,則即使長期間保管也能維持接著性。因此,可配合其形狀而使用於各種用途,特別有用作為多層電路基板、電子電路基板的絕緣體、可撓性電路基板的補強板、電路面的覆蓋膜、使用接著劑的多層電路等。According to the present invention, if it is a thermoplastic liquid crystal polymer molded body having a structure in which the elastic modulus of the inner layer and the elastic modulus of the surface layer have a specific relationship, the adhesiveness can be maintained even when stored for a long period of time. Therefore, it can be used in various applications according to its shape, and is particularly useful as a multilayer circuit board, an insulator for an electronic circuit board, a reinforcing plate for a flexible circuit board, a cover film for a circuit surface, a multilayer circuit using an adhesive, and the like.

如以上,已說明本發明的合適實施例,但若為所屬技術領域中具有通常知識者,則檢視本件說明書,於不言自明的範圍內可容易設想各種的變更及修正。 因此,如此的變更及修正係被解釋為由申請專利範圍所規定的發明之範圍內者。As described above, the preferred embodiments of the present invention have been described, but those skilled in the art can easily conceive of various changes and corrections within the self-evident range by viewing this specification. Therefore, such changes and corrections are to be construed as being within the scope of the invention defined by the scope of the patent application.

無。without.

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Claims (5)

一種熱塑性液晶聚合物成形體,其係在至少一部分具有接著區域,該接著區域中藉由奈米壓痕法所測定之壓入深度在20nm之範圍中的表層之彈性模數Er(S)與壓入深度在200nm之範圍中的內部層之彈性模數Er(I)之比(Er(S)/Er(I))為0以上1.50以下。A thermoplastic liquid crystal polymer molded body having at least a part of a bonded region, in which the elastic modulus Er(S) and the pressure of the surface layer with an indentation depth in the range of 20 nm measured by a nanoindentation method The ratio (Er(S)/Er(I)) of the elastic modulus Er(I) of the inner layer in the depth of 200 nm is 0 or more and 1.50 or less. 如請求項1之熱塑性液晶聚合物成形體,其中表層之彈性模數Er(S)為6.6GPa以下。The thermoplastic liquid crystal polymer molded body according to claim 1, wherein the elastic modulus Er(S) of the surface layer is 6.6 GPa or less. 如請求項1或2之熱塑性液晶聚合物成形體,其形狀為薄膜狀。The thermoplastic liquid crystal polymer molded body according to claim 1 or 2, which is in the form of a film. 如請求項1至3中任一項之熱塑性液晶聚合物成形體,其具備金屬部分。The thermoplastic liquid crystal polymer molded body according to any one of claims 1 to 3, which has a metal portion. 如請求項1至4中任一項之熱塑性液晶聚合物成形體,其具備電路。The thermoplastic liquid crystal polymer molded body according to any one of claims 1 to 4, which has a circuit.
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