TW202204126A - Melt surface temperature detection device in mould cavity - Google Patents

Abstract

A melt surface temperature detection device in mould cavity includes a molding unit, a main body unit, and a detection unit. The molding unit includes a mold, a cavity, and a first perforation disposed in the mold. The body unit includes a first body disposed in the first through hole, and two second perforations disposed on the first body. The detection unit includes a detection module disposed on the first body, and two transmission lines connected to the detection module. The two transmission lines respectively penetrate the two second through holes. The beneficial effect of the present invention is that, through the setting of the first body, the detection module can directly detect the temperature of the surface of the melted glue injected into the mold, and the surface of the detection module cooperates with the mold cavity To avoid flaws in the injected product.

Description

Mold cavity melt surface temperature detection device

The invention relates to a temperature detection device, in particular to a temperature detection device for the surface of mold cavity melt glue which can quickly detect the temperature change of the surface of the injection melt glue.

In general injection molding process, it is necessary to control the temperature of the molten glue injected in the mold, so that the injected molten glue can smoothly fill the cavity in the mold, and the control of the temperature of the molten glue in the mold can control the quality of the injection product. Therefore, it is very important to detect the temperature of the injection melt. The temperature of the mold can be controlled by the detected temperature, and the temperature of the injection melt can be further automatically controlled to ensure the quality of the injection molded product.

Referring to FIG. 1 , it is Taiwan Patent I674959, which illustrates a pressure and temperature sensing device 1 in a mold, which is installed in a mold 101 . The sensing device 1 includes a main body 102 and a pressing rod 103 disposed in the main body 102 , a temperature sensing element 104 arranged at the bottom end of the pressure rod 103 , a strain structure 105 connected with the pressure rod 103 , a transmission line group 106 connected with the temperature sensing element 104 , and a base connected with the strain structure 105 107 , and a controller 108 connected to the transmission line group 106 .

When the mold 101 injects the melt glue, a pressure 109 is applied to the pressure rod 103 , the strain structure 105 can buffer the pressure, and the temperature of the injected melt glue is transmitted to the temperature sensing element 104 through the pressure rod 103 , so that the controller 108 Obtain the temperature of the injected melt.

Although the prior art discloses a temperature detection technology for the injection process, it still has the following disadvantages in actual use:

1. Affect the quality of finished products: There are perforations in the mold, and the pressing rod set in the holes will be squeezed by the injection material. When the injection material is solidified, the shape of the holes will appear on the surface of the finished product, causing defects in the appearance of the injection product.

2. The temperature cannot be controlled in real time: In the conventional technology, the pressure rod is used to transmit the surface temperature of the injected melt, and some technologies are to set the temperature sensing element in the mold, but the transmission of the temperature of the mold or the pressure rod will be delayed, so that the temperature sensing element cannot be instantaneous. Detecting the temperature change on the surface of the injection melt, the thermostat delays the control of the temperature, and it is further impossible to control the temperature of the injection melt in real time.

3. Error in temperature detection: The temperature of the melt in the mold cavity will spread in the mold, so the temperature of the mold will have an error with the temperature of the melt. In the conventional technology, the temperature of the mold is directly detected by a temperature sensing element, and then the mold can be heated by a temperature controller. Therefore, the temperature value detected by the temperature sensing element is different from the actual temperature of the melt surface.

Therefore, how to accurately obtain the temperature of the injection melt and maintain the quality of the injection product is an urgent goal for relevant technicians.

In view of this, the purpose of the present invention is to provide a mold cavity melt adhesive surface temperature detection device, the mold cavity melt adhesive surface temperature detection device includes a molding unit, a main body unit, and a detection unit.

The molding unit includes a mold, a cavity defined by the mold, a first surface disposed on the mold and connected to the cavity, and a second surface disposed in the mold and spaced from the first surface, and a first through hole disposed on the mold and passing through the first surface and the second surface.

The main body unit includes a first main body disposed in the first through hole, a third surface disposed in the first main body, a fourth surface disposed in the first main body and spaced from the third surface, and two disposed A second through hole of the third surface and the fourth surface is passed through the first body, and the third surface is closer to the first surface than the fourth surface.

The detection unit includes a detection module arranged on the third surface, a detection module arranged on the fifth surface of the detection module, and two transmission lines connected with the detection module, the two transmission lines respectively pass through the detection module Two second through holes, the height of the fifth surface is matched with the height of the first surface.

Another technical means of the present invention is that the above-mentioned main body unit further comprises a second main body disposed in the first through hole, and a third through hole disposed in the second main body, and the shape of the second main body is the same as that of the second main body. The shape of the first through hole is tightly fitted, and the first body is disposed in the third through hole.

Another technical means of the present invention is that the above-mentioned main body unit further comprises a first surrounding wall disposed on the second main body, and a second surrounding wall disposed on the second main body, the first surrounding wall and The second surrounding wall cooperates to define the third through hole, the first surrounding wall is closer to the first surface than the second surrounding wall, and the shape of the first body closely matches the shape of the first surrounding wall.

Another technical means of the present invention is that the main body unit further includes a first support wall disposed between the first surrounding wall and the second surrounding wall, and the width of the second surrounding wall is smaller than that of the first surrounding wall. The width of the main body, so that the first support wall can bear against the fourth surface.

Another technical means of the present invention is that the main body unit further comprises a third main body connected with the second main body, and a fourth through hole disposed on the third main body and connected with the third through hole, the The width of the third body is larger than that of the first through hole.

Another technical means of the present invention is that the main body unit further includes a second supporting wall disposed on the third main body and connected to the second main body, and the second supporting wall is used for supporting the second surface .

Another technical means of the present invention is that the main body unit further includes a side wall disposed on the third main body and connected to the second support wall, and the fourth through hole is connected to the side wall.

Another technical means of the present invention is that the height of the second main body matches the height of the first through hole, and the height of the first main body matches the height of the first surrounding wall.

Another technical means of the present invention is that the material of the first main body is a ceramic insulating material.

Yet another technical means of the present invention is that the above-mentioned detection unit is a sheet-type electric thermocouple.

The beneficial effect of the present invention is that the first body made of ceramic insulating material can isolate the temperature of the mold, so that the temperature detection of the detection module will not be affected by the mold, and the detection module can be directly contacted Injection of molten glue to detect the temperature change of the injected molten glue in real time. The third surface of the first main body supports the detection module, so that the surface of the detection module is matched with the mold cavity, so that the appearance of the injection product can be improved. There will be no flaws, and the ceramic material itself has insulating properties. The surface of the transmission line disposed in the two second through holes does not need to be provided with an insulating material, which can prevent the insulating material from melting due to high temperature.

The features and technical contents of the related applications of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the drawings.

Referring to Figure 2, Figure 3, Figure 4, Figure 5, and Figure 6, it is a preferred embodiment of a mold cavity melt adhesive surface temperature detection device of the present invention. The mold cavity melt adhesive surface temperature detection device includes: A molding unit 3 , a main body unit 4 , and a detection unit 5 .

The molding unit 3 includes a mold 301, a mold cavity 302 surrounded and defined by the mold 301, a first surface 303 disposed on the mold 301 and connected to the mold cavity 302, a first surface 303 disposed in the mold 301 and connected with the first surface 303 A second surface 304 separated from the surface 303 , and a first through hole 305 disposed in the mold 301 and passing through the first surface 303 and the second surface 304 .

The mold 301 is composed of an upper mold and a lower mold made of metal, and there is a runner 306 in the mold 301. The runner 306 is used for the injection molding machine to inject the melt into the mold cavity 302, waiting for After the injection melt is solidified, the upper mold and the lower mold of the mold 301 are separated to obtain an injection product with the same shape as the mold cavity 302 . Since the injection molding technology is a known technology, it will not be described in detail here.

The main body unit 4 includes a first main body 401 disposed in the first through hole 305 , a third surface 402 disposed in the first main body 401 , and a spaced apart from the third surface 402 disposed in the first main body 401 . The fourth surface 403, the second body 405 disposed on the first body 401 and passing through the third surface 402 and the fourth surface 403, the second body 405 disposed in the first through hole 305, the The third through hole 406 of the second body 405 , the first surrounding wall 407 of the second body 405 , the second surrounding wall 408 of the second body 405 , the first surrounding wall 407 A first support wall 409 between the second surrounding wall 408 , a third body 410 connected to the second body 405 , a fourth through hole disposed on the third body 410 and connected to the third through hole 406 411 , a second support wall 412 disposed on the third body 410 and connected with the second body 405 , a side wall 413 disposed on the third body 410 and connected with the second support wall 412 .

The detection unit 5 includes a detection module 501 arranged on the third surface 402 , a fifth surface 502 arranged on the detection module 501 , and two transmission lines 503 connected to the detection module 501 , The two transmission lines 503 pass through the two second through holes 404 respectively. In this preferred embodiment, the detection unit 5 is a thin-film type electric thermocouple. In actual implementation, the detection unit 5 can use other temperature detection elements, which should not be limited thereto.

Referring to FIG. 3 and FIG. 6 , in the preferred embodiment, the first body 401 is a cylinder, and the third through hole 406 is a circular through hole. In actual implementation, the first body 401 and the third through hole 406 shape should not be limited by this. The third surface 402 is closer to the first surface 303 than the fourth surface 403 , so the first body 401 is inserted into the third through hole 406 .

The material of the first body 401 is ceramic insulating material, and the shape of the first body 401 matches the shape of the third through hole 406 , so the surface of the first body 401 and the side of the third through hole 406 are The surfaces of the two main bodies 405 will generate friction, and the first main body 401 can be bonded to the second main body 405 by using high temperature resistant adhesive. When the first main body 401 is disposed in the third through hole 406, the first main body 401 The main body 401 will not fall out from the third through hole 406 .

And because the material of the first main body 401 is ceramic insulating and heat-insulating material, which has an insulating effect, the transmission line 503 of the detection unit 5 disposed in the two second through holes 404 may not be provided with insulating rubber material, which can avoid rubber material. It is melted and deteriorated by the high temperature generated during injection molding, which further affects the injection product. In addition, the thermal conductivity of the ceramic material is much lower than that of ordinary metals, which can block the heat transmitted by the mold 301 around the first body 401 , so that the detection module 501 can directly detect the mold cavity 302 the temperature of the melt surface.

Referring to FIG. 4 and FIG. 6 , in the preferred embodiment, the second main body 405 and the third main body 410 are integrally formed metal structures, and the appearance of the second main body 405 and the third main body 410 is roughly It is a cylinder. In actual implementation, the appearance of the second body 405 and the third body 410 can be other shapes, which should not be limited thereto. The cylindrical diameter of the third body 410 is larger than the first through hole 305, and the cylindrical diameter of the second body 405 is matched with the cylindrical diameter of the first through hole 305, so that the second body 405 and the The second support wall 412 between the third bodies 410 is an upward plane.

The shape of the second body 405 is closely matched with the shape of the first through hole 305 , so when the second body 405 is disposed on the first through hole 305 from the second surface 304 of the mold 301 , the second support wall 412 can The second surface 304 of the mold 301 is supported, and the height of the second main body 405 is matched with the height of the first through hole 305 , so that the height of the top surface of the second main body 405 can match the height of the first surface of the mold 301 The height of 303 is consistent to avoid defects in the appearance of the finished product.

Referring to FIG. 5 and FIG. 6 , the fourth through hole 411 disposed in the third main body 410 is exposed from the side wall 413 of the third main body 410 to guide the second transmission line 503 of the detection unit 5 to the mold 301 to avoid damage to the wire due to interference from external forces. Preferably, the side wall 413 of the third main body 410 can be provided with a conduit at the fourth through hole 411 to guide the two transmission lines 503 to a temperature controller (not shown in the figure), so that the temperature controller can obtain the mode. The temperature of the melt surface in cavity 302.

The first surrounding wall 407 cooperates with the second surrounding wall 408 to define the third through hole 406 , the first surrounding wall 407 is closer to the first surface 303 than the second surrounding wall 408 , the first body 401 The shape of the first surrounding wall 407 is closely matched with the shape of the first surrounding wall 407 , and the first body 401 is disposed in the third through hole 406 surrounded and defined by the first surrounding wall 407 .

The width of the first surrounding wall 407 is greater than the width of the second surrounding wall 408, so that the first supporting wall 409 between the first surrounding wall 407 and the second surrounding wall 408 is an upward plane, and the second surrounding wall 409 is an upward plane. The width of the wall 408 is smaller than the cylindrical width of the first body 401 , so when the first body 401 is inserted into the third through hole 406 from the top surface of the second body 405 , the first support wall 409 can support the first body The fourth surface 403 of 401 is used to fix the position of the first main body 401 in the third through hole 406, and because the height of the first main body 401 matches the height of the first surrounding wall 407, the detection The height of the fifth surface 502 of the module 501 is the same as the height of the first surface 303 of the mold 301 , so that the surface of the cavity 302 in the mold 301 will not be defective.

Referring to FIG. 3 , FIG. 5 , and FIG. 6 , in the preferred embodiment, the third surface 402 of the first main body 401 has a groove structure with the same height and width as the detection module 501 . The upper opening of the second through holes 404 is connected to the groove structure, so that the two second through holes 404 communicate with the groove structure. The groove structure provides the detection module 501 to be disposed on the third surface 402. Two transmission lines 503 can be respectively disposed in the two second through holes 404, and the height of the fifth surface 502 of the detection module 501 can be matched with the height of the first surface 303, and the mold 301 can be connected to the mold cavity. The surface of the 302 connection is flat to avoid defects in the manufactured injection product.

Preferably, the height of the outer edge of the third surface 402 and the height of the top edge of the second body 405 are the same as the height of the first surface 303, so that the appearance of the injection product will not be flawed, and more Let the detection module 501 directly detect the temperature of the melt surface in the cavity 302 . In actual implementation, other technical means for making the height of the fifth surface 502 of the detection module 501 consistent with the height of the first surface 303 may be used, which should not be limited thereto.

It is worth mentioning that, in this preferred embodiment, the cylindrical height of the first body 401 is about 1.8 cm, and the cylindrical diameter is about 0.4 cm, which is a small-sized ceramic product. In actual implementation, the size of the first body 401 is different. This should be the limit.

The present invention uses the second body 405 and the third body 410 to fix the position of the first body 401 in the mold 301 . However, in actual implementation, the second body 405 and the third body 410 may not be provided, and the shape of the first through hole 305 only needs to be matched with the first body 401, and the mold 301 also has the function of supporting the first body 401. The structure of a main body can set the first main body 401 in the mold 301 and fix the position of the detection module 501 so that the height of the fifth surface 502 is the same as that of the first surface 303 of the mold 301 The height of the mold 301 is the same, so that the detection module 501 can be brought into contact with the surface of the melt, so as to directly obtain the temperature of the surface of the melt, and the inner surface of the mold 301 can be free from defects.

As can be seen from the above description, a mold cavity melt glue surface temperature detection device of the present invention does have the following effects:

1. Maintain the quality of finished products: The heights of the first surface 303 of the mold 301 , the fifth surface 502 of the detection module 501 , and the top surface of the second body 405 are the same, so that the inner surface of the mold 301 can be smoothed, and the injection product will not be damaged. Any flaws in appearance can effectively maintain the quality of the finished product.

2. Real-time temperature detection: The third surface 402 of the first body 401 can support the detection module 501 , so that the detection module 501 is in contact with the surface of the melt in the cavity 302 , and the molten metal in the cavity 302 can be detected in real time. temperature of the glue surface.

3. Accurately detect temperature: The material of the first body 401 is ceramic insulating material, and its thermal conductivity is much lower than that of the metal mold 301 , the second body 405 and the third body 410 , which can block the mold 301 , the second body 405 and the third body 410 . The heat of the main body 410 enables the detection module 501 to accurately detect the temperature of the melt surface in the mold cavity 302 , and the ceramic insulating material can isolate the signal interference from the mold 301 , so that the detection module 501 can detect the temperature Accurate detection information.

To sum up, the first support wall 409 inside the second body 405 can support the position of the first body 401, so that the first body 401 can support the position of the detection module 501, so that the detection module The group 501 directly detects the temperature of the melt surface in the mold cavity 302, and the height of the fifth surface 502 of the detection module 501 is consistent with the height of the first surface 303 of the mold 301, so that the mold 301 can be The inner surface is smooth and will not cause defects in the appearance of the injection product. The first body 401 made of ceramic insulating material has the functions of insulating and slowing down heat conduction, so that the detection module 501 can accurately detect the cavity 302 The temperature of the surface of the melted adhesive can indeed achieve the purpose of the present invention.

However, the above is only a preferred embodiment of the present invention, and should not limit the scope of implementation of the present invention, that is, simple equivalent changes and modifications made according to the scope of the patent application of the present invention and the contents of the description of the invention. , all still fall within the scope covered by the patent of the present invention.

1: Sensing device 101: Mold 102: Subject 103: Pressure rod 104: Temperature sensing element 105: Strain Structure 106: Transmission line group 107: Base 108: Controller 109: Pressure 3: Forming unit 301: Mold 302: Mould cavity 303: First Surface 304: Second Surface 305: First Piercing 306: runner 4: main unit 401: First subject 402: Third Surface 403: Fourth Surface 404: Second Perforation 405: Second Subject 406: Third Piercing 407: First Surrounding Wall 408: Second Surrounding Wall 409: First support wall 410: Third Subject 411: Fourth Piercing 412: Second support wall 413: Sidewall 5: Detection unit 501: Detection Module 502: Fifth Surface 503: Transmission Line

Fig. 1 is a cross-sectional schematic diagram, Taiwan Patent I674959, which illustrates a sensing device for pressure and temperature in a mold; 2 is a schematic cross-sectional view, which is a preferred embodiment of a mold cavity melt adhesive surface temperature detection device of the present invention, illustrating a cross-sectional aspect of a molding unit; FIG. 3 is a three-dimensional schematic diagram illustrating a three-dimensional aspect of a first main body in the preferred embodiment; 4 is a schematic three-dimensional view illustrating the three-dimensional aspect of a second body and a third body in the preferred embodiment; 5 is an exploded schematic view illustrating, in the preferred embodiment, an exploded view of a detection unit, the first body, the second body, and the third body; and FIG. 6 is a schematic cross-sectional view illustrating the combination of the detection unit, the first main body, the second main body, and the third main body in the preferred embodiment.

3: Forming unit

301: Mold

303: First Surface

304: Second Surface

305: First Piercing

4: main unit

401: First subject

402: Third Surface

403: Fourth Surface

404: Second Perforation

405: Second Subject

406: Third Piercing

407: First Surrounding Wall

408: Second Surrounding Wall

409: First support wall

410: Third Subject

411: Fourth Piercing

412: Second support wall

413: Sidewall

5: Detection unit

501: Detection Module

502: Fifth Surface

503: Transmission Line

Claims (10)

A mold cavity melt glue surface temperature detection device, comprising: A molding unit includes a mold, a mold cavity surrounded by the mold, a first surface disposed on the mold and connected to the mold cavity, and a second surface disposed in the mold and spaced from the first surface , and a first perforation disposed on the mold and passing through the first surface and the second surface; a main body unit, comprising a first main body disposed on the first through hole, a third surface disposed in the first main body, a fourth surface disposed in the first main body and spaced from the third surface, and two a second through hole disposed on the first body and passing through the third surface and the fourth surface, the third surface is closer to the first surface than the fourth surface; and A detection unit, comprising a detection module arranged on the third surface, a detection module arranged on the fifth surface of the detection module, and two transmission lines connected to the detection module, the two transmission lines are respectively threaded through The height of the two second through holes, the height of the fifth surface matches the height of the first surface. The mold cavity melt adhesive surface temperature detection device according to claim 1, wherein the main body unit further comprises a second main body disposed in the first through hole, and a third through hole disposed in the second main body, The shape of the second body closely matches the shape of the first through hole, and the first body is disposed in the third through hole. The mold cavity melt adhesive surface temperature detection device according to claim 2, wherein the main body unit further comprises a first surrounding wall disposed in the second main body, and a first surrounding wall disposed in the second main body Two surrounding walls, the first surrounding wall cooperates with the second surrounding wall to define the third through hole, the first surrounding wall is closer to the first surface than the second surrounding wall, and the shape of the first body is the same as that of the second surrounding wall. The shape of the first surrounding wall is a tight fit. The mold cavity melt adhesive surface temperature detection device according to claim 3, wherein the main unit further comprises a first support wall disposed between the first surrounding wall and the second surrounding wall, the second surrounding wall The width of the surrounding wall is smaller than the width of the first body, so that the first support wall can bear against the fourth surface. The mold cavity melt adhesive surface temperature detection device according to claim 4, wherein the main body unit further comprises a third main body connected with the second main body, and a third main body disposed on the third main body and connected with the third main body The fourth through hole is connected with the through hole, and the width of the third main body is larger than that of the first through hole. The device for detecting the surface temperature of the mold cavity melt adhesive according to claim 5, wherein the main body unit further comprises a second supporting wall disposed on the third main body and connected to the second main body, the second supporting wall for supporting against the second surface. The temperature detection device for mold cavity melt adhesive surface temperature according to claim 6, wherein the main body unit further comprises a side wall disposed on the third main body and connected to the second support wall, the fourth through hole extending from the side wall into the third body. The temperature detection device for mold cavity melt glue surface according to claim 7, wherein the height of the second main body matches the height of the first through hole, and the height of the first main body matches the height of the first surrounding wall match. The device for detecting the surface temperature of the mold cavity melt adhesive according to claim 1, wherein the material of the first body is a ceramic insulating material. The device for detecting the surface temperature of the mold cavity melt adhesive according to claim 1, wherein the detecting unit is a thin-film electric thermocouple.

Images