TW202203150A - 電子電氣機器零件屑之組成分析方法、電子電氣機器零件屑之處理方法、電子電氣機器零件屑之組成分析裝置及電子電氣機器零件屑之處理裝置 - Google Patents

電子電氣機器零件屑之組成分析方法、電子電氣機器零件屑之處理方法、電子電氣機器零件屑之組成分析裝置及電子電氣機器零件屑之處理裝置 Download PDF

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TW202203150A
TW202203150A TW110111897A TW110111897A TW202203150A TW 202203150 A TW202203150 A TW 202203150A TW 110111897 A TW110111897 A TW 110111897A TW 110111897 A TW110111897 A TW 110111897A TW 202203150 A TW202203150 A TW 202203150A
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Taiwan
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electronic
electrical
scraps
parts
composition
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TW110111897A
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English (en)
Chinese (zh)
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後田智也
河村寿文
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日商Jx金屬股份有限公司
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Publication of TW202203150A publication Critical patent/TW202203150A/zh

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B07SEPARATING SOLIDS FROM SOLIDS; SORTING
    • B07CPOSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
    • B07C5/00Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
    • B07C5/04Sorting according to size
    • B07C5/10Sorting according to size measured by light-responsive means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B09DISPOSAL OF SOLID WASTE; RECLAMATION OF CONTAMINATED SOIL
    • B09BDISPOSAL OF SOLID WASTE NOT OTHERWISE PROVIDED FOR
    • B09B5/00Operations not covered by a single other subclass or by a single other group in this subclass
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/25Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands
    • G01N21/27Colour; Spectral properties, i.e. comparison of effect of material on the light at two or more different wavelengths or wavelength bands using photo-electric detection ; circuits for computing concentration
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/60Analysis of geometric attributes
    • G06T7/62Analysis of geometric attributes of area, perimeter, diameter or volume

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Mathematical Physics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Geometry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Image Analysis (AREA)
  • Sorting Of Articles (AREA)
  • Processing Of Solid Wastes (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
TW110111897A 2020-04-01 2021-03-31 電子電氣機器零件屑之組成分析方法、電子電氣機器零件屑之處理方法、電子電氣機器零件屑之組成分析裝置及電子電氣機器零件屑之處理裝置 TW202203150A (zh)

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JP2020066206A JP7301783B2 (ja) 2020-04-01 2020-04-01 電子・電気機器部品屑の組成解析方法、電子・電気機器部品屑の処理方法、電子・電気機器部品屑の組成解析装置及び電子・電気機器部品屑の処理装置
JPJP2020-066206 2020-04-01

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TW202203150A true TW202203150A (zh) 2022-01-16

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WO (1) WO2021201251A1 (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7264936B2 (ja) * 2021-04-21 2023-04-25 Jx金属株式会社 電気電子部品屑の処理方法及び電気電子部品屑の処理装置
JP7351043B1 (ja) 2023-01-24 2023-09-26 三菱電機株式会社 静電選別装置の制御方法、プログラム、および、静電選別装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB0322043D0 (en) 2003-09-20 2003-10-22 Qinetiq Ltd Apparatus for,and method of,classifying objects in waste stream
JP5811159B2 (ja) 2013-11-14 2015-11-11 オムロン株式会社 電子機器分析装置、ライブラリ提供システム
JP2015232449A (ja) * 2014-06-09 2015-12-24 アサヒプリテック株式会社 廃電子基板に含まれる有価物の量を非破壊で評価する装置
JP6554148B2 (ja) * 2017-07-31 2019-07-31 荏原環境プラント株式会社 廃棄物の質を推定する装置、システム、プログラム、方法、及びデータ構造
CN108932510A (zh) 2018-08-20 2018-12-04 贵州宜行智通科技有限公司 一种垃圾检测方法及装置
KR20210087056A (ko) * 2018-10-31 2021-07-09 제이엑스금속주식회사 전자ㆍ전기 기기 부품 스크랩의 조성 해석 장치, 전자ㆍ전기 기기 부품 스크랩의 처리 장치 및 전자ㆍ전기 기기 부품 스크랩의 처리 방법
JP7328012B2 (ja) 2019-06-03 2023-08-16 Jx金属株式会社 電子・電気機器部品屑の組成解析方法、電子・電気機器部品屑の組成解析装置、及び電子・電気機器部品屑の処理方法
JP7328011B2 (ja) 2019-06-03 2023-08-16 Jx金属株式会社 電子・電気機器部品屑の組成解析方法、電子・電気機器部品屑の組成解析装置、及び電子・電気機器部品屑の処理方法
CN110717426A (zh) 2019-09-27 2020-01-21 卓尔智联(武汉)研究院有限公司 基于域自适应学习的垃圾分类方法、电子设备及存储介质

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JP7301783B2 (ja) 2023-07-03
WO2021201251A1 (ja) 2021-10-07

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