TW202202251A - Metal composite - Google Patents

Abstract

Provided is a metal composite capable of obtaining a tool that can suppress chipping to be generated during cutting of a member to be cut. A metal composite 1 includes a metal 2, nanodiamond particles 3 and micro-diamond particles 4. For example, the metal composite 1 is such that the nanodiamond particles 3 and the micro-diamond particles 4 disperse in a metal matrix that is configured by the metal 2.

Description

metal composition

The present invention relates to a metal composition. This case claims the priority of Japanese Patent Application No. 2020-022348 filed in Japan on February 13, 2020, the contents of which are incorporated herein by reference.

Conventionally, for example, micron-sized diamond particles have been used in the dicing of semiconductor wafers on which semiconductor devices or electronic components are formed, cutting of metals or ceramics, digging, grinding, grinding, and other processing of objects to be cut. As a tool for abrasive particles. As the above-mentioned tool, for example, there is known a tool using a diamond sintered body having a first diamond particle group and a second diamond particle group, the average particle diameter of the first diamond particle group being 50 μm or more, and the second diamond particle group being 50 μm or more. The average particle size of the diamond particles is 5 times or more, and the binder phase has at least an iron group metal (see Patent Document 1). [Prior Art Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2010-228073

[The problem to be solved by the invention]

In the case of high-speed cutting with conventional tools using diamond abrasive grains, consider using large-sized diamond abrasive grains. However, when large-sized diamond abrasive grains are used, there is a problem that chips (chips) generated from the cutting object become large.

Therefore, an object of the present invention is to provide a metal composition capable of obtaining a tool capable of suppressing chips generated when machining a member to be cut. [Technical means to solve the problem]

The inventors of the present invention have made intensive studies in order to achieve the above-mentioned object, and as a result found that, according to a metal composition containing a metal, nano-diamond particles and micro-diamond particles, when machining a member to be cut using the above-mentioned metal composition, it is possible to Obtain a tool that suppresses the chips generated during this machining. The present invention is completed based on these findings.

The present invention provides a metal composition containing metal, nano-diamond particles and micro-diamond particles.

Preferably, in the above-mentioned metal composition, the above-mentioned nano-diamond particles and the above-mentioned micro-diamond particles are dispersed in a metal matrix composed of the above-mentioned metal.

Preferably, the content of the nano-diamond particles is 0.05-50 parts by volume relative to 100 parts by volume of the total amount of the metal.

The above-mentioned metal can also be used as a binder in the above-mentioned metal composition.

The above-mentioned metal is preferably a metal binder formed by a sintering method.

The above metal is preferably an alloy containing copper.

The above-mentioned metal composition may also contain secondary particles of the above-mentioned nanodiamond particles.

The average primary particle diameter (D50) of the nano-diamond particles in the metal composition is preferably 1 to 240 nm.

The average particle diameter (D50) of the micro-diamond particles in the metal composition is preferably 1 to 600 μm.

The above-mentioned nanodiamond particles preferably comprise detonation method nanodiamonds.

The above-mentioned metal composition is preferably a cutting member. [Effect of invention]

When the above-described metal composition is used to process a member to be cut, chips generated during the process can be suppressed. In addition, the yield in the above-mentioned processing steps is improved, thereby achieving the effect of improving the process capability.

The metal composition of one embodiment of the present invention contains at least metal, nano-diamond particles and micro-diamond particles.

FIG. 1 shows an enlarged schematic view of one embodiment of the above-mentioned metal composition. The metal composition 1 contains metal 2 , nano-diamond particles 3 and micro-diamond particles 4 . More specifically, in the metal composition 1 , the nano-diamond particles 3 and the micro-diamond particles 4 are dispersed in a metal matrix composed of the metal 2 .

In the above-mentioned metal composition, the above-mentioned metal functions as a binder (binder) for the above-mentioned nano-diamond particles and the above-mentioned micro-diamond particles. In the above-mentioned metal composition, the above-mentioned metal may be a metal binder formed by a sintering method, or an electroforming binder produced by plating growth by an electroforming method. Among them, a metal binder is preferable from the viewpoint of being more excellent in chip suppression.

Examples of the above-mentioned metals include lithium, magnesium, aluminum, calcium, chromium, titanium, vanadium, iron, cobalt, nickel, copper, zinc, silver, tin, antimony, tellurium, tungsten, gold, bismuth, and metals including these of alloys. As said alloy, copper-containing alloys, such as bronze and a copper-tin-zinc alloy, are preferable. Only one type of the above-mentioned metals may be used, or two or more types may be used.

The above-mentioned nano-diamond particles are nano-sized diamond particles, which are not particularly limited, and known or conventional nano-diamond particles can be used. The above-mentioned nano-diamond particles can be either surface-modified nano-diamond particles or non-surface-modified nano-diamond particles. Furthermore, the unmodified nano-diamond particles have hydroxyl groups (-OH) on the surface. Only one type of the above-mentioned nanodiamond particles may be used, or two or more types may be used.

In the above-mentioned surface-modified nano-diamond, as the compound or functional group for surface-modifying the nano-diamond particle, for example, silane compound, carboxyl group (-COOH), phosphonic acid ion or phosphonic acid residue, a vinyl group at the end can be listed. surface modification groups, amide groups, cations of cationic surfactants, groups containing polyglycerol chains, groups containing polyethylene glycol chains, etc.

The above-mentioned nano-diamond particles in the above-mentioned metal composition are preferably primary particles containing nano-diamond. Moreover, the secondary particle which aggregated (agglomerated) the said primary particle from several to several dozen may be contained. That is, the above-mentioned nano-diamond particles may be secondary particles (nano-diamond particle clusters) in the above-mentioned metal composition.

The primary particle average particle size (D50, median diameter) of the above-mentioned nano-diamond particles in the above-mentioned metal composition is, for example, 1-240 nm, preferably 2-100 nm, more preferably 3-50 nm, and more preferably It is 4 to 20 nm, particularly preferably 4 to 10 nm. The above-mentioned average particle diameter can be measured by a dynamic light scattering method.

As the above-mentioned nanodiamond particles, for example, nanodiamond produced by a detonation method (detonation method nanodiamond) or nanodiamond produced by a high temperature and high pressure method (high temperature and high pressure method nanodiamond) can be used. Among them, detonation method nanodiamonds are preferred in terms of easily obtaining nanodiamonds whose primary particle diameters are single-digit nanometers.

Examples of the above-mentioned detonation method nanodiamond include nanodiamonds produced by an air-cooled detonation method (air-cooled detonation nanodiamonds) and nanodiamonds produced by a water-cooled detonation method (water-cooled nanodiamonds). detonation method nanodiamond). Among them, the air-cooled detonation method nano-diamond is preferred because the primary particles are smaller than the water-cooled detonation method nano-diamond.

Detonation can be carried out in an atmospheric environment or in an inert gas environment such as a nitrogen environment, an argon environment, and a carbon dioxide environment.

The above-mentioned micro-diamond particles are micro-sized diamond particles, which are not particularly limited, and known or conventional micro-diamond particles can be used. Only one type of the above-mentioned microdiamond particles may be used, or two or more types may be used.

The average particle size (D50, median diameter) of the micro-diamond particles in the metal composition is, for example, 1 to 600 μm, preferably 5 to 300 μm, more preferably 7 to 100 μm, and further preferably 10 to 10 μm. 50 μm. The above-mentioned average particle diameter can be measured by a dynamic light scattering method.

The content of the above-mentioned nanodiamond in the above-mentioned metal composition can be appropriately adjusted according to the application of the above-mentioned metal composition, relative to the total amount of the above-mentioned metal 100 parts by volume, for example, 0.05-50 parts by volume, preferably 0.1-20 parts by volume The volume part is more preferably 1 to 10 volume parts.

The content of the above-mentioned micro-diamonds in the above-mentioned metal composition can be appropriately adjusted according to the application of the above-mentioned metal composition, relative to the total amount of the above-mentioned metal 100 parts by volume, for example, 1-30 parts by volume, preferably 5-20 parts by volume parts, more preferably 8 to 15 parts by volume.

The above-mentioned metal composition may also contain other components other than metal, nano-diamond particles, and micro-diamond particles. Examples of the above-mentioned other components include inorganic particles other than diamond particles, metal oxides, metal carbides, carbonates, ceramics, and the like. As said inorganic particle, the particle|grain which functions as an abrasive grain (for example, boron nitride, silicon carbide, alumina, etc.), a carbon nanotube, etc. are mentioned. Only one type of the above-mentioned other components may be used, or two or more types may be used. Furthermore, the total content ratio of metal, nano-diamond particles and micro-diamond particles in the above-mentioned metal composition may be, for example, 90% by mass or more, 95% by mass or more, 98% by mass relative to the total amount of the above-mentioned metal composition 100% by mass. mass % or more and 99 mass % or more. In addition, the total content ratio of the metal, nano-diamond particles and micro-diamond particles in the above-mentioned metal composition may be, for example, 90 vol. % or more, 95 vol. % or more, or 98 vol. % or more, 99% or more by volume.

Examples of the above-mentioned metal composition include cutting members, heat sinks, sliding members, etc., among the tools used for processing the cutting target member, such as cutting tools, grinding tools, grinding tools, and digging tools. Among them, the above-mentioned metal composition is preferably a cutting member, more preferably a cutting member for a cutting tool (eg, a cutter). When the above-mentioned metal composition is a cutting member, its shape is preferably a flake.

When the above-mentioned metal composition is a cutting member, the above-mentioned micro-diamond particles function as abrasive grains, and are designed in the same manner as the shape and arrangement of abrasive grains in known or conventional cutting members. In addition, in the above-mentioned cutting member, the nano-diamond particles are presumed to exhibit the effect of reducing friction and wear. The reason for this is presumed to be that when the micro-diamond as an abrasive grain cuts the target member, a transfer adhesive film (carbon transfer adhesive film) derived from the nano-diamond particles is formed on the surface of the target member, and the transfer adhesive film suppresses excessive wear of the abrasive grains or chips. In this way, according to the above-mentioned metal composition, chips can be suppressed. In addition, the yield in the above-mentioned processing steps is thereby improved, thereby achieving the effect of improving the process capability.

The above-mentioned metal composition can be appropriately produced by referring to a known or conventional method according to a production method according to the application. For example, the above-mentioned metal composition as a sheet cutter can be formed by sintering a composition mixed with metal, nano-diamond particles and micro-diamond particles, or by electroforming. to manufacture.

The aspects disclosed in this specification can also be combined with any other features disclosed in this specification. The respective configurations and combinations thereof in each embodiment are examples, and additions, omissions, substitutions, and other modifications of the configurations can be appropriately performed within the scope of not departing from the gist of the present invention. In addition, each invention of the present invention is not limited to the embodiments or the following examples, but is limited only by the scope of the patent application. [Example]

Hereinafter, one embodiment of the present invention will be described in more detail based on examples.

Example 1 Detonation method nanodiamond particles and cutters were fabricated through the following steps.

(Fabrication of Nanodiamond by Detonation Method) First, a step of generating nanodiamond by the detonation method is performed. In this step, first, a "conical explosive (shaped charge) with an electric detonator installed" is installed inside the pressure-resistant container for detonation, and the container is sealed. The container is made of iron, and the volume of the container is 15 m ³ . As an explosive, a mixture of 0.50 kg of TNT (Trinitrotoluene, 2,4,6-trinitrotoluene) and RDX (Research Department explosive, Hexogen) was used. The mass ratio of TNT to RDX in the explosive (TNT/RDX) is 50/50. Then, the electric detonator is detonated, and the explosive is detonated in the container (detonation method nanodiamond is generated). Then, it was left to stand at room temperature for 24 hours, thereby cooling the container and its inside. After cooling, use a scraper to scrape the rough nano-diamond product (including the agglomerates of nano-diamond particles and coal generated by the above-mentioned detonation method) attached to the inner wall of the container, so as to recover the rough nano-diamond product .

Then, an oxidation treatment step is performed. The oxidation treatment step is performed on the rough nanodiamond product obtained by performing the above-mentioned generation step for a plurality of times. Specifically, 6 L of 98 mass % sulfuric acid and 1 L of 69 mass % nitric acid were added to the obtained crude nanodiamond to prepare a slurry, and the slurry was refluxed under normal pressure conditions for 48 hours. the heat treatment. The heating temperature in the oxidation treatment is 140 to 160°C. After cooling, the solid content (including nanodiamond agglomerates) was washed with water by a decantation method. The supernatant liquid was colored at first in the water washing, and in this case, the solid content was repeatedly washed with water by the decantation method until the supernatant liquid was visually transparent. Then, by drying, nanodiamond particles including primary particles and nanodiamond agglomerates (secondary particles) are obtained in powder form. Furthermore, in a rotary kiln in which a gas of about 8 vol % of oxygen and about 92 vol % of nitrogen was blown at a flow rate of 20 L/min, it was heated at 400° C. for 6 hours to obtain a dry powder of nano-diamond.

The crystal structure of the obtained dry nanodiamond powder was analyzed using an X-ray diffraction apparatus (trade name "SmartLab", manufactured by Rigaku Co., Ltd.). As a result, a strong diffraction peak was observed at the diffraction peak position of diamond, that is, the diffraction peak position derived from the (111) plane of the diamond crystal, and the calculated crystallite size was 4.5 nm. The obtained dry powder was subjected to small-angle X-ray scattering measurement using an X-ray diffraction apparatus (trade name "SmartLab", manufactured by Rigaku Co., Ltd.), and particle size distribution analysis software (trade name "NANO-Solver") was used. , manufactured by Rigaku Co., Ltd.), the primary particle size of nanodiamond is estimated for the region of scattering angle of 1° to 3°. In this estimation, the nanodiamond primary particles are assumed to be spherical and have a particle density of 3.51 g/cm ³ . As a result, the average particle size of the primary particles of the nano-diamond obtained by this assay was 5.5 nm, and the relative standard deviation (RSD: relative standard deviation) of the primary particle distribution was 30.2.

(The making of the cutter) Bronze is used as the binder of the metal binder, and 10 parts by volume of micron diamond powder (#800, abrasive grain for cutting, D50: 18-25 μm) is mixed with 100 parts by volume of the binder to make a composition. 6.4 parts by volume of the above-mentioned dry nano-diamond powder with respect to 100 parts by volume of the binder was mixed therein, and sintered in a nitrogen atmosphere at a temperature of 750° C. to form a sheet. Then, it was punched into a ring shape, thereby producing a metal cutter (outer diameter: 56 mm, inner diameter: 40 mm, blade thickness 0.13 mm).

Furthermore, the crystal structure of the above-mentioned micro-diamond powder was analyzed using an X-ray diffraction apparatus (trade name "SmartLab", manufactured by Rigaku Co., Ltd.). As a result, the diffraction peak position of diamond was (111) derived from the diamond crystal. ) surface diffraction peak position, a strong diffraction peak was observed, and the calculated crystallite size was 20 μm.

Comparative Example 1 A metal cutter was fabricated in the same manner as in Example 1, except that the nanodiamond dry powder was not blended.

(glass cutting test) A glass cutting test was performed on the metal cutters produced in the examples and comparative examples. The metal cutters obtained in the examples and comparative examples were installed in the cutting device, and the glass plates (length 7.5 cm × width 7.5 cm × thickness 0.4 mm) were cut with the metal cutting blades, and the glass plate after cutting was confirmed. Chip size front and back. The cutting of the glass plate is carried out in the following way: the spindle speed is 20 rpm, the feed speed is 1 mm/sec twice, 2 mm/sec twice, 3 mm/sec twice, 4 mm/sec twice, 2 times at 5 mm/sec, 25 times at 6 mm/sec (35 times in total), and cut in the longitudinal direction. Moreover, the spindle rotation speed was set to 20 rpm, and the feed rate was set to 6 mm/sec 72 times, and cutting was performed in the width direction (107 times in total). After cutting, use an optical microscope to observe the chips on the cutting line on the front and back of the glass plate, and select 9 places with larger sizes on the front and back respectively. Figure 2 and Table 1 show the evaluation results of the chip size on the back surface, and the evaluation results of the chip size on the front surface are shown in Fig. In addition, cutting was performed while supplying deionized water in an amount of 1.0 L/min.

[Table 1] Comparative Example 1 Example 1 Profile 1 13.3 10.8 Profile 2 14.2 10.9 Profile 3 14.9 11.5 Profile 4 18.2 12.2 Profile 5 19.2 13.3 Profile 6 22.7 15.7 Profile 7 25.0 17.3 Profile 8 28.1 20.0 Profile 9 30.3 17.2 average value 20.7 14.3 σ 6.21 3.33

[Table 2] Comparative Example 1 Example 1 Profile 1 12.2 11.1 Profile 2 13.6 12.5 Profile 3 15.8 12.7 Profile 4 17.0 13.2 Profile 5 17.5 13.9 Profile 6 20.3 14.1 Profile 7 21.5 15.0 Profile 8 25.3 16.4 Profile 9 25.5 20.1 average value 18.7 14.3 σ 4.76 2.65

As shown in FIG. 2 and Table 1, when the metal cutter obtained in Comparative Example 1 was used, the size of the chips on the back surface of the glass plate was 13 to 30 μm, and the average value was 21 μm. On the other hand, when the metal cutter obtained in Example 1 was used, the chip size of the back surface of the glass plate was 11 to 20 μm, and the average value was 14 μm. In this way, compared with Comparative Example 1, the chip size of Example 1 is generally smaller, the average value is also smaller, the standard deviation is smaller, and the variation is smaller. Moreover, as shown in FIG.3 and Table 2, it turns out that the chip size of Example 1 is small as a whole compared with the comparative example 1 similarly to the front surface of a glass plate.

Hereinafter, other embodiments of the invention of the present disclosure will be described. [Note 1] A metal composition containing a metal, nano-diamond particles, and micro-diamond particles. [Note 2] The metal composition according to Note 1, wherein the nano-diamond particles and the micro-diamond particles are dispersed in a metal matrix composed of the metal. [Note 3] The metal composition described in Note 1 or 2, wherein the content of the nano-diamond particles is 0.05 to 50 parts by volume (preferably 0.1 to 20 parts by volume relative to 100 parts by volume of the total amount of the metal) parts, more preferably 1 to 10 parts by volume). [Note 4] The metal composition according to any one of Notes 1 to 3, wherein the metal is a binder in the metal composition. [Note 5] The metal composition according to any one of Notes 1 to 4, wherein the metal is a metal binder formed by a sintering method. [Note 6] The metal composition according to any one of Notes 1 to 5, wherein the metal includes an alloy containing copper (preferably bronze). [Note 7] The metal composition according to any one of Notes 1 to 6, which contains secondary particles of the aforementioned nanodiamond particles. [Note 8] The metal composition according to any one of Notes 1 to 7, wherein the nanodiamond particles comprise detonation method nanodiamond. [Note 9] The metal composition according to any one of Notes 1 to 7, wherein the nanodiamond particles comprise air-cooled detonation method nanodiamonds. [Note 10] The metal composition according to any one of Notes 1 to 9, wherein the average particle size of the primary particles of the nanodiamond particles is 1 to 240 nm (preferably 2 to 100 nm, more preferably 3 ~50 nm, more preferably 4 to 20 nm, particularly preferably 4 to 10 nm). [Note 11] The metal composition according to any one of Notes 1 to 10, wherein the average particle size of the micro-diamond particles is 1-600 μm (preferably 5-300 μm, more preferably 7-100 μm) , more preferably 10 to 50 μm). [Note 12] The metal composition according to any one of Notes 1 to 11, wherein the content of the micro-diamonds in the metal composition is 1 to 30 parts by volume relative to 100 parts by volume of the total amount of the metal ( It is preferably 5 to 20 parts by volume, more preferably 8 to 15 parts by volume). [Note 13] The metal composition according to any one of Notes 1 to 12, wherein the total content ratio of the metal, nano-diamond particles and micro-diamond particles in the above-mentioned metal composition is relative to the total amount of the above-mentioned metal composition 100 mass % or more is 90 mass % or more (95 mass % or more, 98 mass % or more, or 99 mass % or more). [Note 14] The metal composition according to any one of Notes 1 to 13, wherein the total content ratio of the metal, nano-diamond particles and micro-diamond particles in the above-mentioned metal composition is relative to the total amount of the above-mentioned metal composition 100% by volume, more than 90% by volume (more than 95% by volume, more than 98% by volume, or more than 99% by volume). [Note 15] The metal composition according to any one of Notes 1 to 14, which is a cutting member. [Note 16] A use of the metal composition according to any one of claims 1 to 14 as a cutting member.

1: Metal composition 2: Metal (metal matrix) 3: Nanodiamond Particles 4: Micron diamond particles

Fig. 1 is an enlarged schematic view of a metal composition according to an embodiment of the present invention. [ Fig. 2] Fig. 2 is a graph showing the results of back chip size evaluation in the glass cutting test in Examples and Comparative Examples. [ Fig. 3] Fig. 3 is a graph showing the evaluation results of the front chip size of the glass cutting test in Examples and Comparative Examples.

1: Metal composition

2: Metal (metal matrix)

3: Nanodiamond Particles

4: Micron diamond particles

Claims (11)

A metal composition contains metal, nano-diamond particles and micro-diamond particles. The metal composition of claim 1, wherein the nano-diamond particles and the micro-diamond particles are dispersed in a metal matrix composed of the metal. The metal composition of claim 1 or 2, wherein the content of the nanodiamond particles is 0.05 to 50 parts by volume relative to 100 parts by volume of the total amount of the metal. The metal composition of claim 1 or 2, wherein the metal is a binder in the metal composition. The metal composition according to claim 1 or 2, wherein the metal is a metal binder formed by a sintering method. The metal composition according to claim 1 or 2, wherein the metal includes an alloy containing copper. The metal composition according to claim 1 or 2, which contains secondary particles of the above-mentioned nanodiamond particles. The metal composition according to claim 1 or 2, wherein the average particle diameter (D50) of the primary particles of the above-mentioned nanodiamond particles in the above-mentioned metal composition is 1 to 240 nm. The metal composition of claim 1 or 2, wherein the average particle diameter (D50) of the micro-diamond particles in the metal composition is 1 to 600 μm. The metal composition according to claim 1 or 2, wherein the nanodiamond particles comprise detonation method nanodiamond. The metal composition of claim 1 or 2, which is a cutting member.

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