TW202200681A - Resin film, fiber-reinforced resin base material, multilayer body, comosite body, and production methods thereof - Google Patents

Resin film, fiber-reinforced resin base material, multilayer body, comosite body, and production methods thereof Download PDF

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TW202200681A
TW202200681A TW110109976A TW110109976A TW202200681A TW 202200681 A TW202200681 A TW 202200681A TW 110109976 A TW110109976 A TW 110109976A TW 110109976 A TW110109976 A TW 110109976A TW 202200681 A TW202200681 A TW 202200681A
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fiber
resin
reinforced resin
base material
resin film
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TW110109976A
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Chinese (zh)
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須藤健
安田浩
郡洋平
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日商出光興產股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/07Flat, e.g. panels
    • B29C48/08Flat, e.g. panels flexible, e.g. films

Abstract

A resin film which is used for the purpose of producing a fiber-reinforced resin base material, and which is an unstretched film that contains a resin (S) containing a syndiotactic polystyrene resin (A) and a polyarylene ether resin (B) that is modified with a functional group.

Description

樹脂膜、纖維強化樹脂基材、積層體及複合體、及該等之製造方法Resin film, fiber-reinforced resin substrate, laminate and composite, and method for producing the same

本發明係關於一種樹脂膜、纖維強化樹脂基材、積層體及複合體、及該等之製造方法。The present invention relates to a resin film, a fiber-reinforced resin substrate, a laminate and a composite, and a method for producing the same.

已知有一種技術(專利文獻1),其藉由使UD帶(Uni-Directional tape,單向帶)與熱塑性樹脂片材一體化,而形成纖維強化之複合片材,上述UD帶係使樹脂含浸於沿一個方向排列之纖維中且呈帶狀者。 [先前技術文獻] [專利文獻]There is known a technique (Patent Document 1) in which a fiber-reinforced composite sheet is formed by integrating a UD tape (Uni-Directional tape, unidirectional tape) with a thermoplastic resin sheet, the UD tape being a resin Impregnated in fibers arranged in one direction and in the form of ribbons. [Prior Art Literature] [Patent Literature]

[專利文獻1]日本專利特開2008-149708號公報[Patent Document 1] Japanese Patent Laid-Open No. 2008-149708

本發明人等對耐化學品性、耐水性(難以吸水之性質)及耐熱性等優異之對排聚苯乙烯(以下亦稱為「SPS」)樹脂之使用進行了研究,發現了如下問題,即,使用SPS樹脂之無延伸膜之厚度難以均勻。關於其理由,存在如下實際情況。即,隨膜之成膜所形成之端部會較中央部厚,因此藉由去除該端部,可謀求厚度之均勻化。然而,使用SPS樹脂之無延伸膜容易出現膜破裂,而無法應用開縫加工,難以使厚度均勻。The inventors of the present invention have studied the use of para-polystyrene (hereinafter also referred to as "SPS") resin which is excellent in chemical resistance, water resistance (the property of being difficult to absorb water), and heat resistance, and found the following problems: That is, the thickness of the unstretched film using the SPS resin is difficult to be uniform. As for the reason, there are the following actual situations. That is, since the edge part formed with film formation becomes thicker than the center part, by removing this edge part, the uniform thickness can be aimed at. However, the unstretched film using the SPS resin is prone to film breakage, and cannot be applied with slitting, making it difficult to make the thickness uniform.

尤其是於製造UD帶等之情形時,要求藉由開縫加工連續地去除長條狀膜之端部,但於使用SPS樹脂之情形時,難以應用此種加工。認為即便可應用開縫加工,亦因容易出現膜破裂,而無法充分獲得例如應用於UD帶等時之補強效果。In particular, in the case of manufacturing a UD tape, etc., it is required to continuously remove the end portion of the elongated film by slitting, but it is difficult to apply such a process when SPS resin is used. It is considered that even if the slitting process can be applied, film breakage is likely to occur, and it is considered that, for example, the reinforcing effect when applied to a UD tape or the like cannot be sufficiently obtained.

已知藉由使SPS樹脂之分子量變大,可在一定程度上抑制隨開縫加工出現之膜破裂,但在發揮無延伸膜於纖維中之含浸性方面,此種方法受限。It is known that by increasing the molecular weight of the SPS resin, it is possible to suppress film breakage accompanying slitting to a certain extent.

因此,本發明之課題係提供一種可使厚度均勻、於纖維中之含浸性優異之無延伸之樹脂膜、纖維強化樹脂基材、積層體及複合體、及該等之製造方法。Therefore, an object of the present invention is to provide a non-stretching resin film, a fiber-reinforced resin substrate, a laminate and a composite, and a method for producing the same, which can have a uniform thickness and have excellent impregnation into fibers.

本發明人等進而進行銳意研究,發現藉由向SPS樹脂中調配經官能基改性之聚伸芳基醚樹脂,可防止隨開縫加工出現之膜破裂。藉此,可藉由開縫加工去除無延伸膜之端部,可使厚度均勻。又,亦得知該無延伸膜於纖維中之含浸性優異。The inventors of the present invention further conducted intensive research and found that by blending a functional group-modified poly(arylene ether) resin into an SPS resin, it is possible to prevent film breakage accompanying the slitting process. Thereby, the edge part without a stretched film can be removed by slit processing, and the thickness can be made uniform. In addition, it was also found that the non-stretched film has excellent impregnation properties in fibers.

根據本發明,可提供以下之樹脂膜等。 1.一種樹脂膜,其用以製造纖維強化樹脂基材, 上述樹脂膜係無延伸膜且包含樹脂(S),該樹脂(S)包含對排聚苯乙烯樹脂(A)、及經官能基改性之聚伸芳基醚樹脂(B)。 2.如1之樹脂膜,其平均厚度為10 μm以上且未達100 μm。 3.如1或2之樹脂膜,其中上述對排聚苯乙烯樹脂(A)之MFR(melt mass-flow rate,熔體質量流率)為5~30 g/10 min。 4.如1至3中任一項之樹脂膜,其中相對於上述對排聚苯乙烯樹脂(A)100質量份,包含上述經官能基改性之聚伸芳基醚樹脂(B)1~30質量份。 5.如1至4中任一項之樹脂膜,其係長條狀,寬度方向端部之厚度相對於寬度方向中央部之厚度之差處於-10%~10%之範圍內。 6.一種樹脂膜之製造方法,其用以製造如1至5中任一項之樹脂膜,其包括: 藉由開縫加工去除包含樹脂(S)之無延伸之樹脂膜前驅物之端部,而獲得上述樹脂膜,上述樹脂(S)包含對排聚苯乙烯樹脂(A)、及經官能基改性之聚伸芳基醚樹脂(B)。 7.如6之樹脂膜之製造方法,其藉由開縫加工去除長條狀之上述樹脂膜前驅物之寬度方向之兩端部。 8.如6或7之樹脂膜之製造方法,其將長條狀之上述樹脂膜前驅物進行輥搬送,並藉由開縫加工連續地去除該樹脂膜前驅物之寬度方向之兩端部。 9.一種纖維強化樹脂基材,其包含纖維、及含浸於上述纖維中之樹脂(S); 上述樹脂(S)包含對排聚苯乙烯樹脂(A)、及經官能基改性之聚伸芳基醚樹脂(B)。 10.如9之纖維強化樹脂基材,其中上述纖維選自由碳纖維及玻璃纖維所組成之群中之1種以上。 11.如9或10之纖維強化樹脂基材,其中上述纖維係織物、不織布或沿一個方向配向之形態。 12.如9至11中任一項之纖維強化樹脂基材,其中上述纖維為連續纖維。 13.一種纖維強化樹脂基材之製造方法,其用以製造如9至12中任一項之纖維強化樹脂基材,其包括: 第1步驟,其對纖維強化樹脂基材前驅物進行加熱,該纖維強化樹脂基材前驅物包含如1至5中任一項之樹脂膜、及重疊於上述樹脂膜之纖維;以及 第2步驟,其使上述纖維強化樹脂基材前驅物冷卻,而獲得上述纖維強化樹脂基材。 14.如13之纖維強化樹脂基材之製造方法,其中於上述第1步驟中,以上述樹脂膜之熔點以上之溫度對上述纖維強化樹脂基材前驅物進行加熱。 15.如13或14之纖維強化樹脂基材之製造方法,其中於上述第1步驟中,使用輥對上述纖維強化樹脂基材前驅物進行加熱。 16.如13至15中任一項之纖維強化樹脂基材之製造方法,其中於上述第1步驟中,使用輥對上述纖維強化樹脂基材前驅物進行加壓。 17.如13至16中任一項之纖維強化樹脂基材之製造方法,其中於上述第1步驟中,同時進行上述纖維強化樹脂基材前驅物之加熱及加壓。 18.如13至17中任一項之纖維強化樹脂基材之製造方法,其中於上述第2步驟中,以未達200℃之溫度使上述纖維強化樹脂基材前驅物冷卻。 19.如13至18中任一項之纖維強化樹脂基材之製造方法,其中於上述第2步驟中,使用輥使上述纖維強化樹脂基材前驅物冷卻。 20.如13至19中任一項之纖維強化樹脂基材之製造方法,其包括:第3步驟,其於上述第2步驟之後,以1~30 m/min之速度捲取上述纖維強化樹脂基材。 21.如20之纖維強化樹脂基材之製造方法,其中於選自由上述第1步驟、上述第2步驟及上述第3步驟所組成之群中之1個以上之步驟中,於上述纖維強化樹脂基材前驅物之單面或雙面重疊有離型片材。 22.一種積層體,其係由2個以上之如9至12中任一項之纖維強化樹脂基材積層並一體化而成。 23.一種積層體之製造方法,其包括: 重疊2個以上之如9至12中任一項之纖維強化樹脂基材而形成積層體前驅物;及 對上述積層體前驅物進行加壓成形,而獲得由2個以上之上述纖維強化樹脂基材積層並一體化而成之積層體。 24.一種複合體,其包含: 第1構件,其係如9至12中任一項之纖維強化樹脂基材或如22之積層體;以及 第2構件,其係與上述第1構件一體化之射出成形體。 25.一種複合體之製造方法,其包括:於將作為如9至12中任一項之纖維強化樹脂基材或如22之積層體的第1構件插入於模具中之狀態下射出成形,獲得包含上述第1構件、及作為與上述第1構件一體化之射出成形體之第2構件之複合體。According to the present invention, the following resin films and the like can be provided. 1. A resin film for the manufacture of fiber-reinforced resin substrates, The above-mentioned resin film is a non-stretched film and contains a resin (S), and the resin (S) contains a para-polystyrene resin (A) and a functional group-modified polyarylene ether resin (B). 2. The resin film according to 1, which has an average thickness of 10 μm or more and less than 100 μm. 3. The resin film according to 1 or 2, wherein the MFR (melt mass-flow rate, melt mass flow rate) of the above-mentioned opposite-row polystyrene resin (A) is 5-30 g/10 min. 4. The resin film according to any one of 1 to 3, which comprises the above-mentioned functional group-modified polyarylene ether resin (B) 1- 30 parts by mass. 5. The resin film according to any one of 1 to 4, which is in the shape of a long strip, and the difference between the thickness of the end portion in the width direction and the thickness of the central portion in the width direction is in the range of -10% to 10%. 6. A method for producing a resin film, which is used to produce the resin film according to any one of 1 to 5, comprising: The above-mentioned resin film is obtained by removing the end portion of the non-extended resin film precursor comprising the resin (S), which comprises the opposite row polystyrene resin (A), and the functional group-modified resin film is obtained by slitting. Properties of poly(arylene ether) resin (B). 7. The method for producing a resin film according to 6, wherein both ends in the width direction of the elongated resin film precursor are removed by slitting. 8. The method for producing a resin film according to 6 or 7, wherein the above-mentioned resin film precursor in a long shape is transported by rollers, and the both ends in the width direction of the resin film precursor are continuously removed by slitting. 9. A fiber-reinforced resin substrate comprising fibers and a resin (S) impregnated in the fibers; The above-mentioned resin (S) includes a para-row polystyrene resin (A) and a functional group-modified polyarylene ether resin (B). 10. The fiber-reinforced resin substrate according to 9, wherein the fibers are at least one selected from the group consisting of carbon fibers and glass fibers. 11. The fiber-reinforced resin substrate according to 9 or 10, wherein the above-mentioned fibers are woven, non-woven, or oriented in one direction. 12. The fiber-reinforced resin substrate according to any one of 9 to 11, wherein the above-mentioned fibers are continuous fibers. 13. A method for producing a fiber-reinforced resin base material for producing the fiber-reinforced resin base material according to any one of 9 to 12, comprising: The first step, which heats a fiber-reinforced resin base material precursor, the fiber-reinforced resin base material precursor comprising the resin film as described in any one of 1 to 5, and the fibers superimposed on the resin film; and In the second step, the above-mentioned fiber-reinforced resin base material is obtained by cooling the above-mentioned fiber-reinforced resin base material precursor. 14. The method for producing a fiber-reinforced resin substrate according to 13, wherein in the first step, the fiber-reinforced resin substrate precursor is heated at a temperature equal to or higher than the melting point of the resin film. 15. The method for producing a fiber-reinforced resin base material according to 13 or 14, wherein in the first step, the fiber-reinforced resin base material precursor is heated using a roll. 16. The method for producing a fiber-reinforced resin base material according to any one of 13 to 15, wherein in the first step, the fiber-reinforced resin base material precursor is pressurized using a roll. 17. The method for producing a fiber-reinforced resin substrate according to any one of 13 to 16, wherein in the first step, heating and pressurization of the fiber-reinforced resin substrate precursor are simultaneously performed. 18. The method for producing a fiber-reinforced resin substrate according to any one of 13 to 17, wherein in the second step, the fiber-reinforced resin substrate precursor is cooled at a temperature below 200°C. 19. The method for producing a fiber-reinforced resin base material according to any one of 13 to 18, wherein in the second step, the fiber-reinforced resin base material precursor is cooled using a roll. 20. The method for producing a fiber-reinforced resin base material according to any one of 13 to 19, comprising: a third step of winding up the fiber-reinforced resin at a speed of 1 to 30 m/min after the second step substrate. 21. The method for producing a fiber-reinforced resin substrate according to 20, wherein in one or more steps selected from the group consisting of the first step, the second step, and the third step, the fiber-reinforced resin is A release sheet is overlapped on one or both sides of the substrate precursor. 22. A layered product comprising two or more fiber-reinforced resin substrates according to any one of 9 to 12, layered and integrated. 23. A method for manufacturing a laminate, comprising: Stacking 2 or more of the fiber-reinforced resin substrates of any one of 9 to 12 to form a laminate precursor; and The above-mentioned layered body precursor is press-molded to obtain a layered body in which two or more of the above-mentioned fiber-reinforced resin base materials are laminated and integrated. 24. A complex comprising: The first member, which is the fiber-reinforced resin substrate as in any one of 9 to 12 or the laminate as in 22; and The second member is an injection-molded body integrated with the first member. 25. A method for producing a composite, comprising: injection molding in a state in which the fiber-reinforced resin substrate according to any one of 9 to 12 or the first member of the laminate according to 22 is inserted into a mold to obtain A composite body including the first member and a second member that is an injection-molded body integrated with the first member.

根據本發明,可提供一種可使厚度均勻、且於纖維中之含浸性優異之無延伸之樹脂膜、纖維強化樹脂基材、積層體及複合體、及該等之製造方法。According to the present invention, a non-stretching resin film, a fiber-reinforced resin substrate, a laminate and a composite, and a method for producing the same can be provided, which can have a uniform thickness and have excellent impregnation properties in fibers.

以下,對本發明之樹脂膜、纖維強化樹脂基材、積層體及複合體、及該等之製造方法進行詳述。 再者,於本說明書中,「x~y」表示「x以上,y以下」之數值範圍。針對數值範圍所記載之上限值及下限值可任意組合。 又,將以下所記載之2個以上之本發明之各形態加以組合而得之形態亦為本發明之形態。Hereinafter, the resin film, the fiber-reinforced resin base material, the laminate and the composite of the present invention, and the production method thereof will be described in detail. In addition, in this specification, "x-y" shows the numerical range of "more than x, less than y". The upper limit value and the lower limit value described in the numerical range can be combined arbitrarily. In addition, a form obtained by combining two or more of the forms of the present invention described below is also a form of the present invention.

1.樹脂膜 本發明之一態樣之樹脂膜用以製造纖維強化樹脂基材,上述樹脂膜係無延伸膜且包含樹脂(S),該樹脂(S)包含對排聚苯乙烯樹脂(A)、及經官能基改性之聚伸芳基醚樹脂(B)。1. Resin film The resin film of one aspect of the present invention is used to manufacture a fiber-reinforced resin substrate, and the resin film is a non-stretched film and includes a resin (S), the resin (S) includes a pair of polystyrene resin (A), and a Functional group-modified poly(arylene ether) resin (B).

根據該樹脂膜,會防止隨開縫加工出現之膜破裂,又,構成該樹脂膜之樹脂(S)於纖維中之含浸性優異。進而,關於該樹脂膜,使用纖維強化樹脂基材來製作之積層體及複合體之強度(彎曲特性等)優異,上述纖維強化樹脂基材係使構成該樹脂膜之樹脂(S)含浸於纖維中而獲得者。並且,樹脂膜為無延伸膜,藉此可防止加熱熔融時之收縮,因此適宜製造纖維強化樹脂基材。According to this resin film, film breakage that occurs with slitting processing is prevented, and the resin (S) constituting the resin film is excellent in impregnation of fibers. Furthermore, the resin film is excellent in the strength (flexural properties, etc.) of a laminate and a composite produced by using a fiber-reinforced resin base material in which fibers are impregnated with the resin (S) constituting the resin film. the winner. In addition, since the resin film is a non-stretch film, shrinkage at the time of heating and melting can be prevented, and therefore, it is suitable for producing a fiber-reinforced resin base material.

(對排聚苯乙烯樹脂(A)) 對排聚苯乙烯樹脂(A)(以下亦簡稱為樹脂(A))係具有高度對排結構之結晶性聚苯乙烯系樹脂。 樹脂膜藉由包含樹脂(A),而為輕量且會發揮優異之強度。(opposite row polystyrene resin (A)) The opposite-row polystyrene resin (A) (hereinafter also simply referred to as resin (A)) is a crystalline polystyrene-based resin having a highly opposite-row structure. The resin film is lightweight and exhibits excellent strength by including the resin (A).

於本說明書中,所謂「對排」,意指相鄰之苯乙烯單元中之苯環相對於藉由聚合物嵌段之主鏈形成之平面交替地配置(以下亦稱為「對排度」)之比率高。In this specification, the so-called "parallel arrangement" means that the benzene rings in adjacent styrene units are arranged alternately with respect to the plane formed by the main chain of the polymer block (hereinafter also referred to as "parallel arrangement"). ) is high.

對排度可藉由利用碳同位素之核磁共振法(13 C-NMR法)進行定量鑑定。藉由13 C-NMR法,可針對連續之複數個結構單元,例如將連續之2個單體單元作為二元組、將3個單體單元作為三元組、將5個單體單元作為五元組,對其存在比率進行定量。The displacement can be quantitatively identified by nuclear magnetic resonance method ( 13 C-NMR method) using carbon isotopes. By the 13 C-NMR method, continuous plural structural units can be used, for example, two continuous monomer units can be regarded as a dyad, 3 monomer units can be regarded as a triad, and 5 monomer units can be regarded as a pentagram. A tuple to quantify the ratio of its presence.

所謂「具有高度對排結構之結晶性聚苯乙烯系樹脂」,意指具有如下對排度之聚苯乙烯:以外消旋二元組(r)計,通常為75莫耳%以上,較佳為85莫耳%以上;或者以外消旋五元組(rrrr)計,通常為30莫耳%以上,較佳為50莫耳%以上。The so-called "crystalline polystyrene resin with a highly parallel structure" means a polystyrene having the following parallel structure: in terms of racemic binary group (r), usually 75 mol% or more, preferably It is 85 mol% or more; or in terms of racemic pentad (rrrr), it is usually 30 mol% or more, preferably 50 mol% or more.

關於樹脂(A)之分子量,並無特別限制,但就成形時之樹脂之流動性及所獲得之成形體之機械性質的觀點而言,重量平均分子量較佳為1×104 以上1×106 以下,更佳為50,000以上500,000以下,進而較佳為50,000以上300,000以下。若重量平均分子量為1×104 以上,則可獲得具有充分之機械性質之成形品。另一方面,若重量平均分子量為1×106 以下,則成形時之樹脂之流動性亦不存在問題。The molecular weight of the resin (A) is not particularly limited, but the weight average molecular weight is preferably 1×10 4 or more and 1×10 from the viewpoint of the fluidity of the resin during molding and the mechanical properties of the obtained molded body 6 or less, more preferably 50,000 or more and 500,000 or less, still more preferably 50,000 or more and 300,000 or less. When the weight average molecular weight is 1×10 4 or more, a molded article having sufficient mechanical properties can be obtained. On the other hand, if the weight average molecular weight is 1×10 6 or less, there is no problem with the fluidity of the resin during molding.

樹脂(A)之MFR較佳為5~30 g/10 min,更佳為6~25 g/10 min,進而較佳為6~15 g/10 min。 藉由MFR為5 g/10 min以上,樹脂(S)於纖維中之含浸性會更為優異。藉由MFR為30 g/10 min以下,會進一步防止隨開縫加工出現之膜破裂。 MFR係依據JIS K 7210:2014,於溫度為300℃、負載為1.20 kg之條件下所測定之值。The MFR of the resin (A) is preferably 5 to 30 g/10 min, more preferably 6 to 25 g/10 min, still more preferably 6 to 15 g/10 min. When the MFR is 5 g/10 min or more, the impregnation property of the resin (S) in the fiber will be more excellent. By setting the MFR to be 30 g/10 min or less, the film breakage that occurs with the slitting process is further prevented. MFR is a value measured under the conditions of a temperature of 300°C and a load of 1.20 kg in accordance with JIS K 7210:2014.

(經官能基改性之聚伸芳基醚樹脂(B)) 經官能基改性之聚伸芳基醚樹脂(B)(以下亦簡稱為樹脂(B))可藉由使下述聚伸芳基醚與下述改性劑反應而獲得。 樹脂膜藉由包含樹脂(B),可抑制隨開縫加工出現之膜破裂,並可展現出優異之強度。(Polyarylene ether resin (B) modified with functional group) The functional group-modified polyarylene ether resin (B) (hereinafter also simply referred to as resin (B)) can be obtained by reacting the following polyarylene ether with the following modifier. By containing the resin (B), the resin film can suppress film breakage that occurs with slitting and can exhibit excellent strength.

用作樹脂(B)之原料之聚伸芳基醚並無特別限定。 作為聚伸芳基醚,例如可列舉:聚(2,3-二甲基-6-乙基-1,4-苯醚)、聚(2-甲基-6-氯甲基-1,4-苯醚)、聚(2-甲基-6-羥乙基-1,4-苯醚)、聚(2-甲基-6-正丁基-1,4-苯醚)、聚(2-乙基-6-異丙基-1,4-苯醚)、聚(2-乙基-6-正丙基-1,4-苯醚)、聚(2,3,6-三甲基-1,4-苯醚)、聚[2-(4'-甲基苯基)-1,4-苯醚]、聚(2-苯基-1,4-苯醚)、聚(2-氯-1,4-苯醚)、聚(2-甲基-1,4-苯醚)、聚(2-氯-6-乙基-1,4-苯醚)、聚(2-氯-6-溴-1,4-苯醚)、聚(2,6-二-正丙基-1,4-苯醚)、聚(2-甲基-6-異丙基-1,4-苯醚)、聚(2-氯-6-甲基-1,4-苯醚)、聚(2-甲基-6-乙基-1,4-苯醚)、聚(2,6-二溴-1,4-苯醚)、聚(2,6-二氯-1,4-苯醚)、聚(2,6-二乙基-1,4-苯醚)、聚(2,6-二甲基-1,4-苯醚)等。或者,美國專利第3,306,874號、美國專利第3,306,875號、美國專利第3,257,357號及美國專利第3,257,358號之各說明書中所記載之聚合物及共聚物亦適宜。進而,例如可例舉聚苯乙烯等乙烯基芳香族化合物與上述聚苯醚之接枝共聚物及嵌段共聚物。其中,尤其是使用聚(2,6-二甲基-1,4-苯醚)為佳。The polyarylene ether used as a raw material of the resin (B) is not particularly limited. Examples of poly(arylene ether) include poly(2,3-dimethyl-6-ethyl-1,4-phenylene ether), poly(2-methyl-6-chloromethyl-1,4- -phenylene ether), poly(2-methyl-6-hydroxyethyl-1,4-phenylene ether), poly(2-methyl-6-n-butyl-1,4-phenylene ether), poly(2 -Ethyl-6-isopropyl-1,4-phenylene ether), poly(2-ethyl-6-n-propyl-1,4-phenylene ether), poly(2,3,6-trimethyl ether) -1,4-phenylene ether), poly[2-(4'-methylphenyl)-1,4-phenylene ether], poly(2-phenyl-1,4-phenylene ether), poly(2- chloro-1,4-phenylene ether), poly(2-methyl-1,4-phenylene ether), poly(2-chloro-6-ethyl-1,4-phenylene ether), poly(2-chloro- 6-Bromo-1,4-phenylene ether), poly(2,6-di-n-propyl-1,4-phenylene ether), poly(2-methyl-6-isopropyl-1,4-benzene ether), poly(2-chloro-6-methyl-1,4-phenylene ether), poly(2-methyl-6-ethyl-1,4-phenylene ether), poly(2,6-dibromo -1,4-phenylene ether), poly(2,6-dichloro-1,4-phenylene ether), poly(2,6-diethyl-1,4-phenylene ether), poly(2,6- Dimethyl-1,4-phenylene ether) and so on. Alternatively, polymers and copolymers described in the respective specifications of US Pat. No. 3,306,874, US Pat. No. 3,306,875, US Pat. No. 3,257,357, and US Pat. No. 3,257,358 are also suitable. Furthermore, the graft copolymer and block copolymer of vinyl aromatic compounds, such as polystyrene, and the said polyphenylene ether, are mentioned, for example. Among them, poly(2,6-dimethyl-1,4-phenylene ether) is particularly preferably used.

聚伸芳基醚之聚合度並無特別限制,可根據使用目的等適當選定,通常可從60~400之範圍中選定。聚合度若為60以上,則可提高樹脂膜之強度。若為400以下,則可維持良好之成形性。The degree of polymerization of the polyarylene ether is not particularly limited, and can be appropriately selected according to the purpose of use and the like, and is usually selected from the range of 60 to 400. When the degree of polymerization is 60 or more, the strength of the resin film can be improved. If it is 400 or less, good formability can be maintained.

作為對聚伸芳基醚進行改性之改性劑,可列舉:酸改性劑、含胺基改性劑、磷化合物、含羥基改性劑、含鹵素改性劑、含環氧基改性劑、含不飽和烴基改性劑等。作為酸改性劑,例如可例示二羧酸及其衍生物。Examples of modifiers for modifying polyarylene ether include acid modifiers, amine group-containing modifiers, phosphorus compounds, hydroxyl group-containing modifiers, halogen-containing modifiers, epoxy group-containing modifiers Agents, modifiers containing unsaturated hydrocarbon groups, etc. As an acid modifier, dicarboxylic acid and its derivative(s) can be illustrated, for example.

作為用作改性劑之二羧酸,可列舉馬來酸酐及其衍生物、富馬酸及其衍生物。馬來酸酐之衍生物係同一分子內具有乙烯性雙鍵及諸如羧基或酸酐基之極性基之化合物。具體而言,例如可列舉:馬來酸、馬來酸單酯、馬來酸二酯、馬來醯亞胺及其N取代物(例如N-取代馬來醯亞胺、馬來酸單醯胺、馬來酸二醯胺等)、馬來酸之銨鹽、馬來酸之金屬鹽、丙烯酸、甲基丙烯酸、甲基丙烯酸酯、甲基丙烯酸縮水甘油酯等。作為富馬酸衍生物之具體例,可列舉:富馬酸二酯、富馬酸金屬鹽、富馬酸銨鹽、富馬酸鹵化物等。其中,特佳為使用富馬酸或馬來酸酐。As the dicarboxylic acid used as a modifier, maleic anhydride and its derivatives, and fumaric acid and its derivatives are exemplified. Derivatives of maleic anhydride are compounds having an ethylenic double bond and a polar group such as a carboxyl group or an acid anhydride group in the same molecule. Specifically, for example, maleic acid, maleic acid monoester, maleic acid diester, maleimide, and N-substituted products thereof (for example, N-substituted maleimide, maleic acid monoimide, amine, diamide maleate, etc.), ammonium salt of maleic acid, metal salt of maleic acid, acrylic acid, methacrylic acid, methacrylate, glycidyl methacrylate, etc. As a specific example of a fumaric acid derivative, a fumaric acid diester, a fumaric acid metal salt, a fumaric acid ammonium salt, a fumaric acid halide, etc. are mentioned. Among them, it is particularly preferable to use fumaric acid or maleic anhydride.

樹脂(B)可藉由使聚伸芳基醚與改性劑反應而獲得。作為經官能基改性之聚伸芳基醚,較佳為二羧酸改性聚伸芳基醚,更佳為富馬酸改性聚伸芳基醚或馬來酸改性聚伸芳基醚。具體而言,可列舉:(苯乙烯-馬來酸酐)-聚苯醚-接枝聚合物、馬來酸酐改性聚苯醚、富馬酸改性聚苯醚、甲基丙烯酸縮水甘油酯改性聚苯醚、胺改性聚苯醚等改性聚苯醚系聚合物等。其中較佳為改性聚苯醚,更佳為馬來酸酐改性聚苯醚或富馬酸改性聚苯醚,特佳為富馬酸改性聚苯醚。Resin (B) can be obtained by reacting polyarylene ether with a modifier. As the functional group-modified polyarylene ether, preferably dicarboxylic acid-modified polyarylene ether, more preferably fumaric acid-modified polyarylene ether or maleic acid-modified polyarylene ether ether. Specifically, (styrene-maleic anhydride)-polyphenylene ether-graft polymer, maleic anhydride-modified polyphenylene ether, fumaric acid-modified polyphenylene ether, glycidyl methacrylate modified modified polyphenylene ether-based polymers such as polyphenylene ether, amine-modified polyphenylene ether, etc. Among them, modified polyphenylene ether is preferred, maleic anhydride modified polyphenylene ether or fumaric acid modified polyphenylene ether is more preferred, and fumaric acid modified polyphenylene ether is particularly preferred.

樹脂(B)之改性程度(改性度或改性量)可藉由紅外線(IR)吸收光譜法或滴定法求出。 於根據紅外線(IR)吸收光譜法求出改性度之情形時,可根據表示用作改性劑之化合物之吸收之峰強度、與相應之表示聚伸芳基醚之吸收之峰強度的光譜之強度比而求出。例如於富馬酸改性聚苯醚之情形時,根據表示富馬酸之吸收之1790 cm-1 之峰強度(α)與表示聚苯醚之吸收之1704 cm-1 之峰強度的比(β),藉由改性度=(α)/(β)之式而求出改性度。樹脂(B)之改性度較佳為0.05~20。The modification degree (modification degree or modification amount) of resin (B) can be calculated|required by infrared (IR) absorption spectroscopy or a titration method. When the degree of modification is determined by infrared (IR) absorption spectroscopy, the intensity of the peak representing the absorption of the compound used as a modifier and the corresponding peak intensity representing the absorption of polyarylene ether can be obtained from the spectrum. The intensity ratio is obtained. For example, in the case of fumaric acid - modified polyphenylene ether, according to the ratio ( β), the modification degree is obtained by the formula of modification degree=(α)/(β). The degree of modification of the resin (B) is preferably 0.05 to 20.

於藉由滴定求出改性量之情形時,可根據依據JIS K 0070:1992所測定之中和滴定量作為酸含量而求出。使用之樹脂(B)之改性量相對於聚伸芳基醚質量較佳為0.1~20質量%、更佳為0.5~15質量%、進而較佳為1.0~10質量%、特佳為1.0~5.0質量%。When the modification amount is determined by titration, it can be determined as the acid content based on the neutralization titration amount measured in accordance with JIS K 0070:1992. The modified amount of the resin (B) to be used is preferably 0.1 to 20 mass %, more preferably 0.5 to 15 mass %, still more preferably 1.0 to 10 mass %, particularly preferably 1.0 with respect to the mass of the polyarylene ether. ~5.0 mass %.

至於樹脂(B),可於任意地存在溶劑及其他樹脂之情況下,使聚伸芳基醚與各種改性劑於存在自由基引發劑或不存在自由基引發劑之情況下反應,藉此進行製備。作為改性方法,已知溶液改性或者熔融改性。As for the resin (B), the poly(arylene ether) can be reacted with various modifiers in the presence or absence of a radical initiator in the presence or absence of a solvent and other resins, whereby the Prepare. As a modification method, solution modification or melt modification is known.

於將上述富馬酸或其衍生物用作改性劑之情形時,可於任意地存在芳香族烴溶劑及其他樹脂之情況下,使聚伸芳基醚與富馬酸或其衍生物於存在自由基引發劑或者不存在自由基引發劑之情況下反應,藉此獲得富馬酸改性聚伸芳基醚。作為芳香族烴溶劑,只要為使聚伸芳基醚、富馬酸或其衍生物、及任意使用之自由基引發劑溶解,且相對於產生的自由基為惰性者即可,並無特別限定。具體而言,例如可列舉苯、甲苯、乙苯、二甲苯、氯苯、第三丁基苯等作為適宜者。其中,較佳為使用鏈轉移常數小之苯、甲苯、氯苯、第三丁基苯。溶劑可單獨使用,亦可將2種以上混合而使用。芳香族烴溶劑之使用比率亦無特別限制,只要視狀況適當選定即可。一般而言,於相對於所使用之聚伸芳基醚為1~20倍(質量比)之範圍內選定即可。When the above-mentioned fumaric acid or its derivative is used as a modifier, the polyarylether and fumaric acid or its derivative can be made to be in the presence of an aromatic hydrocarbon solvent and other resins optionally. The reaction is carried out in the presence or absence of a free radical initiator, thereby obtaining a fumaric acid-modified polyarylene ether. The aromatic hydrocarbon solvent is not particularly limited as long as it dissolves polyarylene ether, fumaric acid or its derivatives, and a radical initiator that is optionally used, and is inert with respect to the generated radicals. . Specifically, benzene, toluene, ethylbenzene, xylene, chlorobenzene, t-butylbenzene, etc. are mentioned as suitable ones, for example. Among them, benzene, toluene, chlorobenzene, and tert-butylbenzene having a small chain transfer constant are preferably used. The solvent may be used alone or in combination of two or more. The usage ratio of the aromatic hydrocarbon solvent is also not particularly limited, and may be appropriately selected depending on the situation. Generally speaking, it may be selected within the range of 1 to 20 times (mass ratio) with respect to the poly(arylene ether) used.

關於用作改性劑之富馬酸或其衍生物之使用比率,相對於聚伸芳基醚100質量份,較佳為1~20質量份,更佳為3~15質量份。若為1質量份以上,則會獲得充分之改性量(改性度)。若為20質量份以下,可適當地進行改性後之純化等後續處理。The usage ratio of fumaric acid or its derivative used as a modifier is preferably 1 to 20 parts by mass, more preferably 3 to 15 parts by mass, with respect to 100 parts by mass of poly(arylene ether). When it is 1 part by mass or more, a sufficient modification amount (modification degree) can be obtained. If it is 20 parts by mass or less, post-processing such as purification after modification can be appropriately performed.

可任意用於聚伸芳基醚之溶液改性之自由基引發劑並無特別限定。較佳為具有適合於反應溫度之分解溫度、奪氫能力大者,上述奪氫能力大係為了有效果地使改性劑接枝於聚伸芳基醚。具體而言,例如可列舉:過氧化二第三丁基、過氧化二異丙苯、1,1-雙(第三丁基過氧基)環己烷、1,1-雙(第三丁基過氧基)-3,3,5-三甲基環己烷、過氧化苯甲醯、過氧化癸醯基等。自由基引發劑之使用比率較佳為相對於聚伸芳基醚100質量份為15質量份以下。若自由基引發劑為15質量份以下,則難以產生不溶成分,因而較佳。當於不存在自由基引發劑之情況下進行上述改性時,會獲得改性量(改性度)低(例如改性量為0.3~0.5質量%)之聚伸芳基醚。The free radical initiator that can be arbitrarily used for the solution modification of polyarylene ether is not particularly limited. Preferably, it has a decomposition temperature suitable for the reaction temperature, and has a large hydrogen abstracting ability, and the above-mentioned hydrogen abstracting ability is large in order to effectively graft the modifier to the poly(arylene ether). Specifically, for example, di-tert-butyl peroxide, dicumyl peroxide, 1,1-bis(tert-butylperoxy)cyclohexane, 1,1-bis(tertiary-butyl) Peroxy)-3,3,5-trimethylcyclohexane, benzyl peroxide, decyl peroxide, etc. The usage ratio of the radical initiator is preferably 15 parts by mass or less with respect to 100 parts by mass of the polyarylene ether. When the amount of the radical initiator is 15 parts by mass or less, it is difficult to generate insoluble components, which is preferable. When the above modification is carried out in the absence of a radical initiator, a polyarylene ether with a low modification amount (modification degree) (eg, a modification amount of 0.3 to 0.5 mass %) is obtained.

於對聚伸芳基醚進行溶液改性之情形時,具體而言,於使聚伸芳基醚及作為改性劑之例如富馬酸或其衍生物溶解於芳香族烴溶劑中而變得均勻之後使用自由基引發劑之情形時,於自由基引發劑之半衰期為1小時以下之任意溫度下加入自由基引發劑,於該溫度下進行反應。至於所使用之自由基引發劑之半衰期超過1小時這樣的溫度,因需要較長反應時間而不佳。 反應時間可適當選擇,但為了使自由基引發劑有效地發揮作用,較佳為於特定之反應溫度下以自由基引發劑之半衰期之3倍以上之時間進行改性反應。 反應結束後,將反應溶液加入至甲醇等聚伸芳基醚之不良溶劑中,回收所析出之改性聚伸芳基醚並乾燥,可獲得作為目標之經官能基改性之聚伸芳基醚。In the case of solution modification of poly(arylene ether), specifically, poly(arylene ether) and, as a modifier, such as fumaric acid or a derivative thereof, are dissolved in an aromatic hydrocarbon solvent. When a radical initiator is used after homogenization, the radical initiator is added at any temperature where the half-life of the radical initiator is 1 hour or less, and the reaction is carried out at this temperature. As for the temperature where the half-life of the free radical initiator used exceeds 1 hour, it is not preferable because a longer reaction time is required. The reaction time can be appropriately selected, but in order to make the radical initiator work effectively, the modification reaction is preferably carried out at a specific reaction temperature for three times or more of the half-life of the radical initiator. After the reaction is completed, the reaction solution is added to a poor solvent for polyarylether, such as methanol, and the precipitated modified polyarylether is recovered and dried to obtain the target polyarylether modified by functional groups. ether.

於對聚伸芳基醚進行熔融改性之情形時,可於存在自由基引發劑或者不存在自由基引發劑之情況下,使用擠出機對聚伸芳基醚、及作為改性劑之例如富馬酸或其衍生物進行熔融混練,藉此獲得經官能基改性之聚伸芳基醚。富馬酸或其衍生物之使用比率相對於聚伸芳基醚100質量份,較佳為1~5質量份,更佳為2~4質量份。若為1質量份以上,則會達到充分之改性量(改性度),若為5質量份以下,則會良好地保持富馬酸及其衍生物之改性效率,可抑制顆粒中殘留之富馬酸等之量。In the case of melt modification of poly(arylene ether), in the presence or absence of free radical initiator, an extruder can be used to modify poly(arylene ether), and as modifier. For example, fumaric acid or its derivatives are melt-kneaded to obtain functional group-modified poly(arylene ether). The usage ratio of fumaric acid or its derivative is preferably 1 to 5 parts by mass, more preferably 2 to 4 parts by mass, with respect to 100 parts by mass of the polyarylene ether. If it is 1 part by mass or more, a sufficient modification amount (modification degree) can be achieved, and if it is 5 parts by mass or less, the modification efficiency of fumaric acid and its derivatives can be maintained well, and residues in the particles can be suppressed. The amount of fumaric acid and so on.

用於聚伸芳基醚之熔融改性之自由基引發劑較佳為1分鐘半衰期溫度為300℃以上者。至於1分鐘半衰期溫度為未達300℃者,例如過氧化物及偶氮化合物等,聚伸芳基醚之改性效果並不充分。 作為自由基引發劑,具體而言,例如有2,3-二甲基-2,3-二苯基丁烷、2,3-二乙基-2,3-二苯基丁烷、2,3-二乙基-2,3-二苯基己烷、2,3-二甲基-2,3-二(對甲基苯基)丁烷等。其中,可適當地使用1分鐘半衰期溫度為330℃之2,3-二甲基-2,3-二苯基丁烷。 自由基引發劑之使用比率係於相對於聚伸芳基醚100質量份較佳為0.1~3質量份、更佳為0.5~2質量份之範圍內選定。若為0.1質量份以上,則會獲得高改性效果,若為3質量份以下,則可高效率地對聚伸芳基醚進行改性,亦難以產生不溶成分。The free radical initiator used for the melt modification of poly(arylene ether) preferably has a half-life temperature of 300°C or higher for 1 minute. As for the one-minute half-life temperature below 300°C, such as peroxides and azo compounds, the modification effect of poly(arylene ether) is not sufficient. Specific examples of the radical initiator include 2,3-dimethyl-2,3-diphenylbutane, 2,3-diethyl-2,3-diphenylbutane, 2,3-diethyl-2,3-diphenylbutane, 3-diethyl-2,3-diphenylhexane, 2,3-dimethyl-2,3-bis(p-methylphenyl)butane, etc. Among them, 2,3-dimethyl-2,3-diphenylbutane having a half-life temperature of 330°C for 1 minute can be suitably used. The usage ratio of the radical initiator is preferably selected within the range of 0.1 to 3 parts by mass, more preferably 0.5 to 2 parts by mass, with respect to 100 parts by mass of the polyarylene ether. If it is 0.1 parts by mass or more, a high modification effect is obtained, and if it is 3 parts by mass or less, the poly(arylene ether) can be modified efficiently and insoluble components are hardly generated.

作為對聚伸芳基醚進行熔融改性之方法,例如可例舉如下方法:於將聚伸芳基醚、富馬酸或其衍生物、及自由基引發劑於室溫下均勻地乾摻之後,於實質上為聚伸芳基醚之混練溫度之300~350℃之範圍內進行熔融反應。若為300℃以上,則可適當地維持熔融黏度,若為350℃以下,則可抑制聚伸芳基醚之分解。As a method of melt-modifying poly(arylene ether), for example, a method of uniformly dry blending poly(arylene ether), fumaric acid or a derivative thereof, and a radical initiator at room temperature may be exemplified. After that, the melting reaction is carried out in the range of 300 to 350° C. which is substantially the kneading temperature of the poly(arylene ether). When the temperature is 300°C or higher, the melt viscosity can be appropriately maintained, and when the temperature is 350°C or lower, the decomposition of the polyarylene ether can be suppressed.

於藉由以上詳述之方法獲得之樹脂(B)中,於特佳之富馬酸改性聚伸芳基醚之情形時,藉由上述滴定法求出之改性量(改性劑含量)較佳為0.1~20質量%,更佳為0.5~15質量%,進而較佳為1~10質量%,特佳為1.0~5.0質量%。若改性量為0.1質量%以上,則可獲得具有充分之力學物性、耐熱性之聚伸芳基醚。該改性量為20質量%以下即足夠。In the resin (B) obtained by the method described in detail above, in the case of the particularly preferred fumaric acid-modified poly(arylene ether), the modification amount (modifier content) obtained by the above-mentioned titration method Preferably it is 0.1-20 mass %, More preferably, it is 0.5-15 mass %, More preferably, it is 1-10 mass %, Especially preferably, it is 1.0-5.0 mass %. When the modification amount is 0.1 mass % or more, a polyarylene ether having sufficient mechanical properties and heat resistance can be obtained. It is sufficient that this modification amount is 20 mass % or less.

於一實施方式中,樹脂膜係相對於對排聚苯乙烯樹脂(A)100質量份包含樹脂(B)1~30質量份。 藉由樹脂(B)為1質量份以上,會進一步防止隨開縫加工出現之膜破裂。藉由樹脂(B)為30質量份以下,樹脂(S)於纖維中之含浸性會更為優異。 樹脂膜中之樹脂(B)之含量相對於對排聚苯乙烯樹脂(A)100質量份,較佳為2~25質量份,更佳為5~22質量份,進而較佳為10~20質量份。In one Embodiment, the resin film system contains 1-30 mass parts of resin (B) with respect to 100 mass parts of opposite-row polystyrene resin (A). When the resin (B) is 1 part by mass or more, film breakage accompanying slitting processing can be further prevented. When the resin (B) is 30 parts by mass or less, the impregnation property of the resin (S) in the fibers is more excellent. The content of the resin (B) in the resin film is preferably 2 to 25 parts by mass, more preferably 5 to 22 parts by mass, and still more preferably 10 to 20 parts by mass relative to 100 parts by mass of the opposite polystyrene resin (A). parts by mass.

(其他樹脂) 樹脂(S)亦可進而包含除了以上所說明之樹脂(A)及樹脂(B)以外之其他樹脂。作為其他樹脂,例如可例舉熱塑性樹脂。(other resins) The resin (S) may further contain other resins other than the resin (A) and the resin (B) described above. As another resin, thermoplastic resin is mentioned, for example.

作為其他樹脂,例如可列舉:聚(烴取代苯乙烯)、聚(鹵化苯乙烯)、聚(鹵化烷基苯乙烯)、聚(烷氧基苯乙烯)、聚(苯甲酸乙烯酯)、該等之氫化聚合物或混合物、或者以該等為主成分之共聚物。As other resins, for example, poly(hydrocarbon-substituted styrene), poly(halogenated styrene), poly(halogenated alkylstyrene), poly(alkoxystyrene), poly(vinyl benzoate), the Hydrogenated polymers or mixtures of these, or copolymers with these as the main components.

作為上述聚(烴取代苯乙烯),可列舉:聚(甲基苯乙烯)、聚(乙基苯乙烯)、聚(異丙基苯乙烯)、聚(第三丁基苯乙烯)、聚(苯基)苯乙烯、聚(乙烯基萘)及聚(乙烯基苯乙烯)等。作為聚(鹵化苯乙烯),可列舉聚(氯苯乙烯)、聚(溴苯乙烯)及聚(氟苯乙烯)等,作為聚(鹵化烷基苯乙烯),可例舉聚(氯甲基苯乙烯)等。作為聚(烷氧基苯乙烯),可列舉聚(甲氧基苯乙烯)及聚(乙氧基苯乙烯)等。Examples of the above-mentioned poly(hydrocarbon-substituted styrene) include poly(methylstyrene), poly(ethylstyrene), poly(isopropylstyrene), poly(t-butylstyrene), poly( phenyl) styrene, poly (vinyl naphthalene) and poly (vinyl styrene) and the like. Examples of poly(halogenated styrene) include poly(chlorostyrene), poly(bromostyrene), and poly(fluorostyrene), and examples of poly(halogenated alkylstyrene) include poly(chloromethylstyrene) styrene) etc. As poly(alkoxystyrene), poly(methoxystyrene), poly(ethoxystyrene), etc. are mentioned.

作為上述中特佳者,可列舉:聚(對甲基苯乙烯)、聚(間甲基苯乙烯)、聚(對第三丁基苯乙烯)、聚(對氯苯乙烯)、聚(間氯苯乙烯)、聚(對氟苯乙烯)。 進而可列舉:苯乙烯與對甲基苯乙烯之共聚物、苯乙烯與對第三丁基苯乙烯之共聚物、苯乙烯與二乙烯基苯之共聚物等。Among the above-mentioned particularly preferred ones, poly(p-methylstyrene), poly(m-methylstyrene), poly(p-tert-butylstyrene), poly(p-chlorostyrene), poly(m-methylstyrene), chlorostyrene), poly(p-fluorostyrene). Furthermore, the copolymer of styrene and p-methylstyrene, the copolymer of styrene and p-tert-butylstyrene, the copolymer of styrene and divinylbenzene, etc. are mentioned.

又,作為其他樹脂,適宜使用與樹脂(A)親和性(亦稱為相容性)高之樹脂。作為此種樹脂,例如可列舉:聚苯醚(簡稱「PPE」,係未經官能基改性者)、丙烯腈/苯乙烯共聚物(簡稱「AS」)、丙烯腈/丁二烯/苯乙烯共聚物(簡稱「ABS」)、丙烯腈/乙烯-丙烯-二烯/苯乙烯共聚物(簡稱「AES」)、丙烯腈/丙烯酸酯/苯乙烯共聚物(簡稱「AAS」)、甲基丙烯酸甲酯/丁二烯/苯乙烯共聚物(簡稱「MBS」)、苯乙烯/丁二烯共聚物(簡稱「SBR」)、苯乙烯/丁二烯苯乙烯共聚物(簡稱「SBS」)、苯乙烯/乙烯/丁二烯/苯乙烯共聚物(簡稱「SEBS」)等。Moreover, as another resin, the resin with high affinity (it is also called compatibility) with resin (A) is suitably used. Examples of such resins include polyphenylene ether (abbreviated as "PPE", which is not modified with functional groups), acrylonitrile/styrene copolymer (abbreviated as "AS"), acrylonitrile/butadiene/benzene Ethylene copolymer (abbreviated as "ABS"), acrylonitrile/ethylene-propylene-diene/styrene copolymer (abbreviated as "AES"), acrylonitrile/acrylate/styrene copolymer (abbreviated as "AAS"), methyl Methyl acrylate/butadiene/styrene copolymer (referred to as "MBS"), styrene/butadiene copolymer (referred to as "SBR"), styrene/butadiene styrene copolymer (referred to as "SBS") , Styrene/ethylene/butadiene/styrene copolymer ("SEBS"), etc.

作為其他樹脂例示之上述樹脂(其中,諸如聚苯醚等聚伸芳基醚除外)較佳為改性樹脂,尤其是酸改性樹脂。改性樹脂可藉由對具有改性基之化學物種進行共聚、例如接枝聚合而獲得。於欲獲得酸改性樹脂之情形時,作為化學物種,適宜使用不飽和羧酸或其衍生物。作為酸改性之方法之一例,藉由將羧酸或羧酸酐接枝於聚苯乙烯而獲得苯乙烯/馬來酸酐共聚物(簡稱「SMA」)。The above-mentioned resins exemplified as other resins (among them, polyarylene ethers such as polyphenylene ethers are excluded) are preferably modified resins, especially acid-modified resins. Modified resins can be obtained by copolymerizing chemical species having modified groups, such as graft polymerization. When an acid-modified resin is to be obtained, as the chemical species, an unsaturated carboxylic acid or a derivative thereof is suitably used. As an example of an acid modification method, a styrene/maleic anhydride copolymer (abbreviated as "SMA") is obtained by grafting carboxylic acid or carboxylic acid anhydride to polystyrene.

作為用於酸改性之不飽和羧酸,例如可使用馬來酸、富馬酸、伊康酸、丙烯酸、甲基丙烯酸等含有羧基之具有聚合性雙鍵之化合物。除了羧基以外,視需要可向該等化合物中導入例如羥基、胺基、環氧基等其他官能基。作為用於酸改性之不飽和羧酸之衍生物,可列舉上述化合物之酸酐、酯、醯胺、醯亞胺、金屬鹽等。作為其具體例,可列舉:馬來酸酐、伊康酸酐、丙烯酸甲酯、丙烯酸乙酯、丙烯酸丁酯、丙烯酸縮水甘油酯、甲基丙烯酸甲酯、甲基丙烯酸乙酯、甲基丙烯酸縮水甘油酯、馬來酸單乙酯、馬來酸二乙酯、富馬酸單甲酯、富馬酸二甲酯、丙烯醯胺、甲基丙烯醯胺、馬來酸單醯胺、馬來酸二醯胺、富馬酸單醯胺、馬來醯亞胺、N-丁基馬來醯亞胺、甲基丙烯酸鈉等。其中,較佳者為富馬酸及馬來酸酐。As the unsaturated carboxylic acid used for acid modification, for example, a compound having a polymerizable double bond containing a carboxyl group such as maleic acid, fumaric acid, itaconic acid, acrylic acid, and methacrylic acid can be used. In addition to the carboxyl group, other functional groups such as a hydroxyl group, an amino group, and an epoxy group can be introduced into these compounds as necessary. Examples of derivatives of unsaturated carboxylic acids used for acid modification include acid anhydrides, esters, amides, amides, metal salts, and the like of the above-mentioned compounds. Specific examples thereof include maleic anhydride, itaconic anhydride, methyl acrylate, ethyl acrylate, butyl acrylate, glycidyl acrylate, methyl methacrylate, ethyl methacrylate, glycidyl methacrylate Esters, Monoethyl Maleate, Diethyl Maleate, Monomethyl Fumarate, Dimethyl Fumarate, Acrylamide, Methacrylamide, Monoamide Maleate, Maleic Acid Diamide, monoamide fumarate, maleimide, N-butylmaleimide, sodium methacrylate, etc. Among them, preferred are fumaric acid and maleic anhydride.

其他樹脂並不限定於上述與樹脂(A)親和性高之樹脂,根據目的、用途等,亦可為親和性低之樹脂。於使用親和性低之樹脂之情形時,視需要與各種相容劑組合,藉此可提高與樹脂(A)之相容性。作為與樹脂(A)親和性低之樹脂,例如可列舉:諸如PA6、PA66、PA610等脂肪族聚醯胺;諸如PA6T、PA9T、MXD6等於主鏈具有芳香環之芳香族聚醯胺;諸如聚對苯二甲酸乙二酯(簡稱「PET」)、聚對苯二甲酸丁二醇酯(簡稱「PBT」)等聚酯;於主鏈具有芳基之聚伸芳基硫化物;於主鏈具有磺醯基鍵之聚醚碸;於主鏈具有酮基之聚醚醚酮(簡稱「PEEK」);諸如聚丙烯(簡稱「PP」)、高密度聚乙烯(簡稱「HDPE」)、直鏈狀低密度聚乙烯(簡稱「LLDPE」)、乙烯·丁烯共聚物(簡稱「EBR」)、乙烯·辛烯共聚物(簡稱「EOR」)、乙烯·己烯共聚物(簡稱「EHR」)、乙烯·丙烯共聚物(簡稱「EPR」)等聚烯烴(或者烯烴系彈性體)等。Other resins are not limited to those having high affinity with the resin (A) described above, and may be resins having low affinity depending on the purpose, application, and the like. In the case of using a resin with low affinity, the compatibility with the resin (A) can be improved by combining with various compatibilizers as necessary. Examples of resins with low affinity with the resin (A) include aliphatic polyamides such as PA6, PA66, and PA610; aromatic polyamides having aromatic rings in the main chain such as PA6T, PA9T, and MXD6; Polyesters such as ethylene terephthalate (referred to as "PET"), polybutylene terephthalate (referred to as "PBT"); polyarylene sulfides with aryl groups in the main chain; Polyether ketone with sulfonyl bond; polyether ether ketone ("PEEK") with ketone group in the main chain; such as polypropylene ("PP"), high density polyethylene ("HDPE"), straight Chain Low Density Polyethylene ("LLDPE"), Ethylene-Butene Copolymer ("EBR"), Ethylene-Octene Copolymer ("EOR"), Ethylene-Hexene Copolymer ("EHR") ), polyolefins (or olefin-based elastomers) such as ethylene-propylene copolymers (abbreviated as "EPR"), etc.

於一實施方式中,樹脂(S)之20質量%以上、25質量%以上、50質量%以上、70質量%以上、80質量%以上、95質量%以上、99質量%以上、99.5質量%以上或實質上100質量%為樹脂(A)及樹脂(B)。 又,於一實施方式中,樹脂(S)之80質量%以上、90質量%以上、95質量%以上、97質量%以上、99質量%以上、99.5質量%以上或實質上100質量%為樹脂(A)、樹脂(B)、及選自上述其他樹脂之1種以上。 再者,於「實質上100質量%」之情形時,可包含不可避免之雜質。In one embodiment, the resin (S) is 20% by mass or more, 25% by mass or more, 50% by mass or more, 70% by mass or more, 80% by mass or more, 95% by mass or more, 99% by mass or more, 99.5% by mass or more Or substantially 100 mass % are resin (A) and resin (B). Moreover, in one embodiment, 80 mass % or more, 90 mass % or more, 95 mass % or more, 97 mass % or more, 99 mass % or more, 99.5 mass % or more, or substantially 100 mass % of the resin (S) are resins (A), resin (B), and 1 or more types selected from the said other resin. In addition, in the case of "substantially 100 mass %", unavoidable impurities may be included.

(其他成分) 樹脂膜亦可進而包含除了以上所說明之樹脂(S)以外之其他成分。作為其他成分,例如可列舉一般所使用之橡膠彈性體、抗氧化劑、交聯劑、交聯助劑、成核劑、脫模劑、塑化劑、相容劑、著色劑、抗靜電劑等。(other ingredients) The resin film may further contain other components other than the resin (S) described above. Examples of other components include generally used rubber elastomers, antioxidants, crosslinking agents, crosslinking aids, nucleating agents, mold release agents, plasticizers, compatibilizers, colorants, antistatic agents, and the like. .

作為橡膠彈性體,可使用各種橡膠彈性體。例如可列舉:天然橡膠、聚丁二烯、聚異戊二烯、聚異丁烯、氯丁二烯橡膠、多硫化物橡膠、聚硫橡膠、丙烯酸橡膠、聚胺酯橡膠、聚矽氧橡膠、表氯醇橡膠、苯乙烯-丁二烯嵌段共聚物(簡稱「SBR」)、氫化苯乙烯-丁二烯嵌段共聚物(簡稱「SEB」)、苯乙烯-丁二烯-苯乙烯嵌段共聚物(簡稱「SBS」)、氫化苯乙烯-丁二烯-苯乙烯嵌段共聚物(簡稱「SEBS」)、苯乙烯-異戊二烯嵌段共聚物(簡稱「SIR」)、氫化苯乙烯-異戊二烯嵌段共聚物(簡稱「SEP」)、苯乙烯-異戊二烯-苯乙烯嵌段共聚物(簡稱「SIS」)、氫化苯乙烯-異戊二烯-苯乙烯嵌段共聚物(簡稱「SEPS」)、苯乙烯-丁二烯無規共聚物、氫化苯乙烯-丁二烯無規共聚物、苯乙烯-乙烯-丙烯無規共聚物、苯乙烯-乙烯-丁烯無規共聚物、乙丙橡膠(簡稱「EPR」)、乙烯丙烯二烯橡膠(簡稱「EPDM」)、或者丙烯腈-丁二烯-苯乙烯-核殼橡膠(簡稱「ABS」)、甲基丙烯酸甲酯-丁二烯-苯乙烯-核殼橡膠(簡稱「MBS」)、甲基丙烯酸甲酯-丙烯酸丁酯-苯乙烯-核殼橡膠(簡稱「MAS」)、丙烯酸辛酯-丁二烯-苯乙烯-核殼橡膠(簡稱「MABS」)、丙烯酸烷基酯-丁二烯-丙烯腈-苯乙烯核殼橡膠(簡稱「AABS」)、丁二烯-苯乙烯-核殼橡膠(簡稱「SBR」)、以甲基丙烯酸甲酯-丙烯酸丁酯矽氧烷為首之含矽氧烷核殼橡膠等核殼型粒子狀彈性體、或將該等改性後之橡膠等。 其中,尤其是使用SBR、SBS、SEB、SEBS、SIR、SEP、SIS、SEPS、核殼橡膠或將該等改性後之橡膠等為佳。As the rubber elastic body, various rubber elastic bodies can be used. For example, natural rubber, polybutadiene, polyisoprene, polyisobutylene, chloroprene rubber, polysulfide rubber, polysulfide rubber, acrylic rubber, polyurethane rubber, polysiloxane rubber, epichlorohydrin Rubber, styrene-butadiene block copolymer ("SBR"), hydrogenated styrene-butadiene block copolymer ("SEB"), styrene-butadiene-styrene block copolymer (referred to as "SBS"), hydrogenated styrene-butadiene-styrene block copolymer (referred to as "SEBS"), styrene-isoprene block copolymer (referred to as "SIR"), hydrogenated styrene- Isoprene block copolymer (referred to as "SEP"), styrene-isoprene-styrene block copolymer (referred to as "SIS"), hydrogenated styrene-isoprene-styrene block copolymer (referred to as "SEPS"), styrene-butadiene random copolymer, hydrogenated styrene-butadiene random copolymer, styrene-ethylene-propylene random copolymer, styrene-ethylene-butylene free Regular copolymer, ethylene propylene rubber ("EPR"), ethylene propylene diene rubber ("EPDM"), or acrylonitrile-butadiene-styrene-core-shell rubber ("ABS"), methacrylic acid Methyl methacrylate-butadiene-styrene-core-shell rubber (abbreviated as "MBS"), methyl methacrylate-butyl acrylate-styrene-core-shell rubber (abbreviated as "MAS"), octyl acrylate-butadiene - Styrene-core-shell rubber (referred to as "MABS"), alkyl acrylate-butadiene-acrylonitrile-styrene core-shell rubber (referred to as "AABS"), butadiene-styrene-core-shell rubber (referred to as "AABS") "SBR"), core-shell particulate elastomers such as siloxane-containing core-shell rubbers including methyl methacrylate-butyl acrylate siloxane, or modified rubbers, etc. Among them, it is particularly preferable to use SBR, SBS, SEB, SEBS, SIR, SEP, SIS, SEPS, core-shell rubber or modified rubbers thereof.

作為經改性之橡膠彈性體,例如可列舉將苯乙烯-丙烯酸丁酯共聚物橡膠、苯乙烯-丁二烯嵌段共聚物(簡稱「SBR」)、氫化苯乙烯-丁二烯嵌段共聚物(簡稱「SEB」)、苯乙烯-丁二烯-苯乙烯嵌段共聚物(簡稱「SBS」)、氫化苯乙烯-丁二烯-苯乙烯嵌段共聚物(簡稱「SEBS」)、苯乙烯-異戊二烯嵌段共聚物(簡稱「SIR」)、氫化苯乙烯-異戊二烯嵌段共聚物(簡稱「SEP」)、苯乙烯-異戊二烯-苯乙烯嵌段共聚物(簡稱「SIS」)、氫化苯乙烯-異戊二烯-苯乙烯嵌段共聚物(簡稱「SEPS」)、苯乙烯-丁二烯無規共聚物、氫化苯乙烯-丁二烯無規共聚物、苯乙烯-乙烯-丙烯無規共聚物、苯乙烯-乙烯-丁烯無規共聚物、乙丙橡膠(簡稱「EPR」)、乙烯丙烯二烯橡膠(簡稱「EPDM」)等藉由具有極性基之改性劑進行了改性之橡膠等。Examples of the modified rubber elastomer include styrene-butyl acrylate copolymer rubber, styrene-butadiene block copolymer (abbreviated as "SBR"), hydrogenated styrene-butadiene block copolymer ("SEB"), styrene-butadiene-styrene block copolymer ("SBS"), hydrogenated styrene-butadiene-styrene block copolymer ("SEBS"), benzene Ethylene-isoprene block copolymer ("SIR"), hydrogenated styrene-isoprene block copolymer ("SEP"), styrene-isoprene-styrene block copolymer (referred to as "SIS"), hydrogenated styrene-isoprene-styrene block copolymer (referred to as "SEPS"), styrene-butadiene random copolymer, hydrogenated styrene-butadiene random copolymer compound, styrene-ethylene-propylene random copolymer, styrene-ethylene-butylene random copolymer, ethylene propylene rubber (referred to as "EPR"), ethylene propylene diene rubber (referred to as "EPDM"), etc. by having The polar group modifier has been modified rubber, etc.

作為抗氧化劑,有各種抗氧化劑,但尤其是三(2,4-二-第三丁基苯基)亞磷酸酯、三(單及二-壬基苯基)亞磷酸酯等單亞磷酸酯及二亞磷酸酯等磷系抗氧化劑及酚系抗氧化劑為佳。 作為二亞磷酸酯,較佳為使用下述通式(1)所示之磷系化合物。 [化1]

Figure 02_image001
(式中,R30 及R31 分別獨立地表示碳數1~20之烷基、碳數3~20之環烷基或者碳數6~20之芳基)There are various antioxidants as antioxidants, but especially monophosphites such as tris(2,4-di-tert-butylphenyl)phosphite and tris(mono- and di-nonylphenyl)phosphite Phosphorus-based antioxidants such as diphosphite and phenol-based antioxidants are preferred. As the diphosphite, a phosphorus-based compound represented by the following general formula (1) is preferably used. [hua 1]
Figure 02_image001
(In the formula, R 30 and R 31 each independently represent an alkyl group having 1 to 20 carbon atoms, a cycloalkyl group having 3 to 20 carbon atoms, or an aryl group having 6 to 20 carbon atoms.)

作為上述通式所示之磷系化合物之具體例,可列舉:二硬脂基季戊四醇二亞磷酸酯、二辛基季戊四醇二亞磷酸酯、二苯基季戊四醇二亞磷酸酯、雙(2,4-二-第三丁基苯基)季戊四醇二亞磷酸酯、雙(2,6-二-第三丁基-4-甲基苯基)季戊四醇二亞磷酸酯、二環己基季戊四醇二亞磷酸酯等。Specific examples of the phosphorus-based compound represented by the above general formula include distearyl pentaerythritol diphosphite, dioctyl pentaerythritol diphosphite, diphenyl pentaerythritol diphosphite, bis(2,4 -Di-tert-butylphenyl) pentaerythritol diphosphite, bis(2,6-di-tert-butyl-4-methylphenyl) pentaerythritol diphosphite, dicyclohexyl pentaerythritol diphosphite Wait.

作為酚系抗氧化劑,可使用已知者,作為其具體例,可列舉:2,6-二-第三丁基-4-甲基苯酚、2,6-二苯基-4-甲氧基苯酚、2,2'-亞甲基雙(6-第三丁基-4-甲基苯酚)、2,2'-亞甲基雙-(6-第三丁基-4-甲基苯酚)、2,2'-亞甲基雙[4-甲基-6-(α-甲基環己基)苯酚]、1,1-雙(5-第三丁基-4-羥基-2-甲基苯基)丁烷、2,2'-亞甲基雙(4-甲基-6-環己基苯酚)、2,2'-亞甲基雙(4-甲基-6-壬基苯酚)、1,1,3-三(5-第三丁基-4-羥基-2-甲基苯基)丁烷、2,2-雙(5-第三丁基-4-羥基-2-甲基苯基)-4-正十二烷基巰基丁烷、雙[3,3-雙(3-第三丁基-4-羥基苯基)丁酸]乙二醇酯、1,1-雙(3,5-二甲基-2-羥基苯基)-3-(正十二烷硫基)-丁烷、4,4'-硫代雙(6-第三丁基-3-甲基苯酚)、1,3,5-三(3,5-二-第三丁基-4-羥基苄基)-2,4,6-三甲基苯、2,2-雙(3,5-二-第三丁基-4-羥基苄基)丙二酸雙十八烷基酯、3-(4-羥基-3,5-二-第三丁基苯基)丙酸正十八烷基酯、四[亞甲基(3,5-二-第三丁基-4-羥基氫化肉桂酸酯)]甲烷等。 除了上述磷系抗氧化劑、酚系抗氧化劑以外,可將胺系抗氧化劑、硫系抗氧化劑等單獨使用,或者將複數種混合而使用。As the phenolic antioxidant, known ones can be used, and specific examples thereof include 2,6-di-tert-butyl-4-methylphenol, 2,6-diphenyl-4-methoxyl Phenol, 2,2'-methylenebis(6-tert-butyl-4-methylphenol), 2,2'-methylenebis-(6-tert-butyl-4-methylphenol) , 2,2'-methylenebis[4-methyl-6-(α-methylcyclohexyl)phenol], 1,1-bis(5-tert-butyl-4-hydroxy-2-methyl) Phenyl)butane, 2,2'-methylenebis(4-methyl-6-cyclohexylphenol), 2,2'-methylenebis(4-methyl-6-nonylphenol), 1,1,3-Tris(5-tert-butyl-4-hydroxy-2-methylphenyl)butane, 2,2-bis(5-tert-butyl-4-hydroxy-2-methyl) Phenyl)-4-n-dodecylmercaptobutane, bis[3,3-bis(3-tert-butyl-4-hydroxyphenyl)butanoic acid]ethylene glycol ester, 1,1-bis( 3,5-Dimethyl-2-hydroxyphenyl)-3-(n-dodecylthio)-butane, 4,4'-thiobis(6-tert-butyl-3-methylphenol) ), 1,3,5-tris(3,5-di-tert-butyl-4-hydroxybenzyl)-2,4,6-trimethylbenzene, 2,2-bis(3,5-di -Dioctadecyl tert-butyl-4-hydroxybenzyl)malonate, n-octadecyl 3-(4-hydroxy-3,5-di-tert-butylphenyl)propionate , tetra[methylene (3,5-di-tert-butyl-4-hydroxyhydrocinnamate)]methane, etc. In addition to the above-mentioned phosphorus-based antioxidants and phenol-based antioxidants, amine-based antioxidants, sulfur-based antioxidants, and the like may be used alone, or a plurality of types may be mixed and used.

抗氧化劑之調配量並無特別限定,相對於樹脂(S)100質量份、或樹脂(A)及樹脂(B)之合計100質量份,例如可為0.005質量份以上、0.01質量份以上或0.02質量份以上,又,可為5質量份以下、4質量份以下或3質量份以下。The compounding amount of the antioxidant is not particularly limited, but may be, for example, 0.005 parts by mass or more, 0.01 parts by mass or more, or 0.02 parts by mass relative to 100 parts by mass of the resin (S) or 100 parts by mass of the resin (A) and the resin (B) in total. The mass part or more may be 5 mass parts or less, 4 mass parts or less, or 3 mass parts or less.

作為成核劑,可任意地從以二(對第三丁基苯甲酸)鋁為首之羧酸之金屬鹽、以亞甲基雙(2,4-二-第三丁基苯酚)酸式磷酸酯鈉為首之磷酸之金屬鹽、滑石、酞菁衍生物等公知者中選擇並使用。作為具體的商品名,可列舉:ADEKA股份有限公司製造之ADK STAB NA-10、ADK STAB NA-11、ADK STAB NA-21、ADK STAB NA-30、ADK STAB NA-35、ADK STAB NA-70;大日本油墨化學工業股份有限公司製造之PTBBA-AL等。該等成核劑可僅單獨使用一種,或將兩種以上組合而使用。As the nucleating agent, metal salts of carboxylic acids such as aluminum bis(p-tert-butylbenzoate), methylenebis(2,4-di-tert-butylphenol) acid phosphoric acid can be selected arbitrarily. Metal salts of phosphoric acid including ester sodium, talc, and phthalocyanine derivatives are selected and used. Specific trade names include: ADK STAB NA-10, ADK STAB NA-11, ADK STAB NA-21, ADK STAB NA-30, ADK STAB NA-35, ADK STAB NA-70 manufactured by ADEKA Co., Ltd. ; PTBBA-AL manufactured by Dainippon Ink Chemical Industry Co., Ltd. These nucleating agents may be used alone or in combination of two or more.

成核劑之調配量並無特別限定,相對於樹脂(S)100質量份、或樹脂(A)及樹脂(B)之合計100質量份,例如可為0.01質量份以上或0.04質量份以上,又,可為5質量份以下或2質量份以下。The compounding amount of the nucleating agent is not particularly limited, but may be, for example, 0.01 part by mass or more or 0.04 part by mass or more with respect to 100 parts by mass of the resin (S) or 100 parts by mass of the resin (A) and the resin (B) in total, Moreover, it may be 5 parts by mass or less or 2 parts by mass or less.

作為脫模劑,可任意地從聚乙烯蠟、聚矽氧油、長鏈羧酸、長鏈羧酸金屬鹽等公知者中選擇並使用。該等脫模劑可僅單獨使用一種,或將兩種以上組合而使用。As a mold release agent, well-known thing, such as a polyethylene wax, a polysiloxane oil, a long-chain carboxylic acid, a long-chain carboxylic acid, can be selected arbitrarily, and can be used. These release agents may be used alone or in combination of two or more.

脫模劑之調配量並無特別限定,相對於樹脂組成物100質量份、或樹脂(A)及樹脂(B)之合計100質量份,例如可為0.1質量份以上或0.2質量份以上,又,可為3質量份以下或1質量份以下。The compounding amount of the release agent is not particularly limited, but may be, for example, 0.1 parts by mass or more or 0.2 parts by mass or more with respect to 100 parts by mass of the resin composition or 100 parts by mass of the resin (A) and the resin (B) in total, and , can be 3 parts by mass or less or 1 part by mass or less.

於一實施方式中,樹脂膜之60質量%以上、70質量%以上、80質量%以上、90質量%以上、95質量%以上、97質量%以上、99質量%以上、99.5質量%以上或實質上100質量%為樹脂(S),或 為樹脂(S)及選自上述其他成分中之1種以上。 再者,於「實質上100質量%」之情形時,可包含不可避免之雜質。In one embodiment, 60 mass % or more, 70 mass % or more, 80 mass % or more, 90 mass % or more, 95 mass % or more, 97 mass % or more, 99 mass % or more, 99.5 mass % or more or substantially 100% by mass is resin (S), or It is a resin (S) and one or more kinds selected from the above-mentioned other components. In addition, in the case of "substantially 100 mass %", unavoidable impurities may be included.

(樹脂膜之厚度) 於一實施方式中,樹脂膜之平均厚度可為10 μm以上,又,可為未達100 μm。 樹脂膜之平均厚度係藉由記載於實施例中之方法所測定之值。 藉由平均厚度為10 μm以上,於連續纖維基材之製造時等中,可抑制樹脂膜產生皺褶,又,可抑制樹脂膜之斷裂。 又,藉由平均厚度為未達100 μm,開縫加工適性會提高,又,可精度較好地控制所獲得之纖維強化樹脂基材之厚度。要想進而顯著地發揮此種效果,樹脂膜之平均厚度可為99 μm以下、98 μm以下、95 μm以下、90 μm以下、85 μm以下、80 μm以下、70 μm以下或60 μm以下。(thickness of resin film) In one embodiment, the average thickness of the resin film may be 10 μm or more, and may be less than 100 μm. The average thickness of the resin film is a value measured by the method described in the examples. When the average thickness is 10 μm or more, the occurrence of wrinkles in the resin film can be suppressed during the production of the continuous fiber base material, and the breakage of the resin film can be suppressed. In addition, when the average thickness is less than 100 μm, the slitting processability is improved, and the thickness of the obtained fiber-reinforced resin base material can be precisely controlled. In order to further significantly exert this effect, the average thickness of the resin film may be 99 μm or less, 98 μm or less, 95 μm or less, 90 μm or less, 85 μm or less, 80 μm or less, 70 μm or less, or 60 μm or less.

於一實施方式中,樹脂膜為長條狀,寬度方向端部之厚度相對於寬度方向中央部之厚度之差處於-10%~10%的範圍內。例如,於寬度方向中央部之厚度為T μm之情形時,寬度方向端部之厚度處於T×0.9 μm~T×1.1 μm之範圍內。藉由使上述厚度之差處於-10%~10%之範圍內,可抑制使用樹脂膜製作之纖維強化樹脂基材之強度差異。 上述厚度之差係藉由記載於實施例中之方法所測定之值。In one Embodiment, the resin film is elongated, and the difference of the thickness of the width direction edge part with respect to the thickness of the width direction center part exists in the range of -10% - 10%. For example, when the thickness of the central portion in the width direction is T μm, the thickness of the end portion in the width direction is in the range of T×0.9 μm to T×1.1 μm. By making the difference of the said thickness in the range of -10% - 10%, the difference in intensity|strength of the fiber-reinforced resin base material produced using the resin film can be suppressed. The above-mentioned difference in thickness is a value measured by the method described in the examples.

2.樹脂膜之製造方法 本發明之一態樣之樹脂膜之製造方法包括:藉由開縫加工去除包含樹脂(S)之樹脂膜前驅物之端部而獲得上述樹脂膜,該樹脂膜係無延伸膜,上述樹脂(S)包含對排聚苯乙烯樹脂(A)、及經官能基改性之聚伸芳基醚樹脂(B)。 該樹脂膜之製造方法可用以製造本發明之一態樣之樹脂膜。2. Manufacturing method of resin film A method for producing a resin film according to an aspect of the present invention comprises: removing an end portion of a resin film precursor containing a resin (S) by slitting to obtain the resin film, the resin film being a non-stretched film, the resin (S) S) comprises a para-row polystyrene resin (A) and a functional group-modified polyarylene ether resin (B). The manufacturing method of the resin film can be used to manufacture the resin film of one aspect of the present invention.

「樹脂膜前驅物」意指去除端部之前之樹脂膜。 樹脂膜前驅物中所去除之「端部」較佳為隨著該樹脂膜前驅物之成膜而形成之端部(亦稱為「成膜端部」)。成膜端部通常由於為了成膜而暫時熔融之樹脂(S)之表面張力等,而具有與膜中央部不同之厚度。因此,藉由去除成膜端部,可使所獲得之樹脂膜之厚度變得均勻。"Resin film precursor" means the resin film before removal of the ends. The "end portion" removed in the resin film precursor is preferably an end portion (also referred to as "film-forming end portion") formed along with the film formation of the resin film precursor. The film-forming end portion usually has a thickness different from that of the film central portion due to the surface tension of the resin (S) temporarily melted for film-forming, or the like. Therefore, the thickness of the obtained resin film can be made uniform by removing the film-forming edge.

於開縫加工中,作為端部去除之寬度並無特別限定,例如於將樹脂膜前驅物之寬度方向之長度設為100%時,可將距離膜前驅物之末端1~10%為止之部位作為端部去除。In the slitting process, the width of the edge removal is not particularly limited. For example, when the length in the width direction of the resin film precursor is set to 100%, the part that is 1 to 10% away from the end of the film precursor can be used. Removed as ends.

於本態樣中,樹脂(S)包含樹脂(A)及樹脂(B),藉此,即便對樹脂膜前驅物進行開縫加工,亦可防止膜破裂。相對於此,於單獨使用樹脂(A)之情形時,無法防止膜破裂,於開縫加工部位之周邊產生裂紋。因此,根據本態樣,適宜使用開縫加工,藉此,可將樹脂膜前驅物之端部有效率地去除,較佳為連續地去除。In this aspect, the resin (S) includes the resin (A) and the resin (B), and thereby, even if the resin film precursor is subjected to slit processing, the film can be prevented from breaking. On the other hand, when the resin (A) is used alone, the film cannot be prevented from being broken, and cracks are generated in the periphery of the slitting portion. Therefore, according to this aspect, slitting is preferably used, whereby the end portion of the resin film precursor can be removed efficiently, preferably continuously.

於一實施方式中,藉由開縫加工去除長條狀之樹脂膜前驅物之寬度方向之兩端部。於此情形時,可將長條狀之樹脂膜前驅物進行輥搬送,並藉由開縫加工連續地去除該樹脂膜前驅物之寬度方向之兩端部。In one embodiment, both ends in the width direction of the elongated resin film precursor are removed by slitting. In this case, the long resin film precursor can be rolled and continuously removed in the width direction of the resin film precursor by slitting.

開縫加工例如可使用選自刃具及雷射光中之1種以上。可藉由使樹脂膜前驅物相對於該等開縫工具進行相對移動而實施開縫加工。例如,可將開縫工具固定於特定位置,將樹脂膜前驅物沿特定方向進行輥搬送,藉此連續地實施開縫加工。For the slitting process, one or more kinds selected from a cutting tool and a laser beam can be used, for example. The slitting process can be performed by relatively moving the resin film precursor with respect to the slitting tools. For example, the slitting process can be continuously performed by fixing a slitting tool at a specific position and rolling the resin film precursor in a specific direction.

3.纖維強化樹脂基材 本發明之一態樣之纖維強化樹脂基材包含纖維(T)、及含浸於上述纖維(T)中之樹脂(S),上述樹脂(S)包含樹脂(A)及樹脂(B)。3. Fiber-reinforced resin substrate The fiber-reinforced resin substrate of one aspect of the present invention includes fibers (T) and resin (S) impregnated in the fibers (T), and the resin (S) includes resin (A) and resin (B).

於一實施方式中,纖維強化樹脂基材所包含之纖維(T)係選自由碳纖維(C)及玻璃纖維(D)所組成之群中之1種以上。In one embodiment, the fiber (T) contained in the fiber-reinforced resin substrate is at least one selected from the group consisting of carbon fiber (C) and glass fiber (D).

(碳纖維(C)) 碳纖維(C)並無特別限定,可使用以聚丙烯腈為原料之PAN系、以石油或煤中之煤焦油瀝青為原料之瀝青系、以熱固性樹脂例如酚樹脂為原料之酚系等各種碳纖維。碳纖維(C)可為藉由氣相生長法所獲得者,亦可為再利用碳纖維(RCF)。如此,碳纖維(C)並無特別限定,較佳為選自由PAN系碳纖維、瀝青系碳纖維、熱固系碳纖維、酚系碳纖維、氣相生長碳纖維、再利用碳纖維(RCF)所組成之群中之1種以上。(Carbon Fiber (C)) The carbon fiber (C) is not particularly limited, and various carbon fibers can be used, such as PAN-based raw material polyacrylonitrile, pitch-based raw material of coal tar pitch in petroleum or coal, and phenol-based carbon fiber using thermosetting resin such as phenol resin as raw material. . The carbon fiber (C) may be obtained by a vapor phase growth method, or may be a recycled carbon fiber (RCF). Thus, the carbon fiber (C) is not particularly limited, but is preferably selected from the group consisting of PAN-based carbon fiber, pitch-based carbon fiber, thermosetting carbon fiber, phenol-based carbon fiber, vapor-grown carbon fiber, and recycled carbon fiber (RCF). 1 or more.

碳纖維(C)中存在因製造時之原料品質、燒成溫度而改變了石墨化度者,但仍可無關於石墨化度而使用。Among the carbon fibers (C), there are those whose degree of graphitization has changed depending on the quality of the raw materials and the sintering temperature at the time of production, but they can be used regardless of the degree of graphitization.

(玻璃纖維(D)) 玻璃纖維(D)之種類並無特別限定,可根據目的、用途而選定、使用例如E玻璃、低介電玻璃、二氧化矽玻璃等各種組成之玻璃纖維。(glass fiber (D)) The type of glass fiber (D) is not particularly limited, and can be selected according to the purpose and application, and glass fibers of various compositions such as E glass, low dielectric glass, and silica glass can be used.

(其他纖維) 纖維(T)並不限定於以上所說明之碳纖維(C)及玻璃纖維(D)。 作為除了碳纖維(C)及玻璃纖維(D)以外之其他纖維,例如可列舉有機合成纖維、天然植物纖維等。作為有機合成纖維之具體例,可列舉全芳香族聚醯胺纖維、聚醯亞胺纖維等。 該等其他纖維可單獨使用,亦可與選自由碳纖維(C)及玻璃纖維(D)所組成之群中之1種以上倂用。(other fibers) The fibers (T) are not limited to the carbon fibers (C) and glass fibers (D) described above. Examples of other fibers other than carbon fibers (C) and glass fibers (D) include organic synthetic fibers, natural plant fibers, and the like. As a specific example of an organic synthetic fiber, a wholly aromatic polyamide fiber, a polyimide fiber, etc. are mentioned. These other fibers may be used alone or in combination with one or more selected from the group consisting of carbon fibers (C) and glass fibers (D).

於一實施方式中,纖維(T)之60質量%以上、70質量%以上、80質量%以上、90質量%以上、95質量%以上、97質量%以上、99質量%以上、99.5質量%以上或實質上100質量%為選自由碳纖維(C)及玻璃纖維(D)所組成之群中之1種以上,或 為選自由碳纖維(C)及玻璃纖維(D)所組成之群中之1種以上及選自上述其他纖維之1種以上。 再者,於「實質上100質量%」之情形時,可包含不可避免之雜質。In one embodiment, the fiber (T) is 60 mass % or more, 70 mass % or more, 80 mass % or more, 90 mass % or more, 95 mass % or more, 97 mass % or more, 99 mass % or more, 99.5 mass % or more or substantially 100% by mass of one or more selected from the group consisting of carbon fibers (C) and glass fibers (D), or One or more kinds selected from the group consisting of carbon fibers (C) and glass fibers (D), and one or more kinds selected from the other fibers described above. In addition, in the case of "substantially 100 mass %", unavoidable impurities may be included.

(纖維之形狀、形態) 纖維(T)之形狀並無特別限定,可具有選自由將藉由下述上漿劑修飾之股線(附著有上漿劑之股線)並紗而捲取之粗紗、裁剪粗紗而製作之切股、由粗紗構成之織物(布)、不織布等所組成之群中之1種以上之形狀。(shape and form of fiber) The shape of the fiber (T) is not particularly limited, and may have a roving selected from the following sizing agent-modified strands (sizing agent-adhered strands) spooled and wound up, and cut rovings. One or more shapes from the group consisting of cut strands, woven fabrics (cloths) made of rovings, and non-woven fabrics.

於一實施方式中,纖維(T)係織物、不織布或沿一個方向配向之形態。包含沿一個方向配向之形態之纖維之纖維強化樹脂基材亦稱為「一個方向材」。In one embodiment, the fibers (T) are woven, non-woven, or oriented in one direction. A fiber-reinforced resin substrate containing fibers in a form aligned in one direction is also referred to as a "unidirectional material".

於纖維(T)為織物、不織布或沿一個方向配向之形態之情形時,可使用平均纖維直徑較佳為3~20 μm、更佳為5~20 μm之單絲纖維,亦可使用將單絲纖維沿一個方向束集之粗紗。例如可直接使用束集有3000根(3K)、6000根(6K)、12000根(12K)、24000根(24K)或60000根(60K)單絲纖維之製品,亦可進而將該等束集而使用。纖維束可為無撚紗、有撚紗、解撚紗中之任一者。該纖維束可於開纖之狀態下包含於纖維強化樹脂基材中,亦可於不開纖之狀態下作為纖維束包含於纖維強化樹脂基材中。When the fibers (T) are in the form of woven, non-woven or aligned in one direction, monofilament fibers with an average fiber diameter of preferably 3 to 20 μm, more preferably 5 to 20 μm can be used, or monofilament fibers can be used. A roving in which silk fibers are bundled in one direction. For example, products with 3,000 (3K), 6,000 (6K), 12,000 (12K), 24,000 (24K) or 60,000 (60K) monofilament fibers can be directly used, or the bundles can be further assembled. and use. The fiber bundle may be any of untwisted yarn, twisted yarn, and untwisted yarn. The fiber bundle may be contained in the fiber-reinforced resin base material in an open state, or may be contained in the fiber-reinforced resin base material as a fiber bundle in an unopened state.

於一實施方式中,纖維強化樹脂基材所包含之纖維為連續纖維。再者,所謂「連續纖維」,意指從纖維強化樹脂基材之一端到另一端連續之狀態之纖維。因此,連續纖維之長度視纖維強化樹脂基材之尺寸而異,例如為3 cm~10000 m。In one embodiment, the fibers contained in the fiber-reinforced resin substrate are continuous fibers. In addition, the so-called "continuous fiber" means a fiber in a state of being continuous from one end to the other end of the fiber-reinforced resin substrate. Therefore, the length of the continuous fibers varies depending on the size of the fiber-reinforced resin substrate, for example, 3 cm to 10,000 m.

纖維強化樹脂基材之厚度並無特別限定,例如可為20 μm以上、30 μm以上、40 μm以上、50 μm以上、60 μm以上、70 μm以上、80 μm以上、90 μm以上,又,可為500 μm以下、400 μm以下、300 μm以下、250 μm以下、200 μm以下、150 μm以下或120 μm以下。 纖維強化樹脂基材之厚度(及下述積層體之厚度)係藉由微計測器式厚度計所測定之值。The thickness of the fiber-reinforced resin base material is not particularly limited, and may be, for example, 20 μm or more, 30 μm or more, 40 μm or more, 50 μm or more, 60 μm or more, 70 μm or more, 80 μm or more, or 90 μm or more. 500 μm or less, 400 μm or less, 300 μm or less, 250 μm or less, 200 μm or less, 150 μm or less, or 120 μm or less. The thickness of the fiber-reinforced resin base material (and the thickness of the laminate described below) is a value measured by a micrometer-type thickness meter.

4.纖維強化樹脂基材之製造方法 本發明之一態樣之纖維強化樹脂基材之製造方法包括: 第1步驟,其對纖維強化樹脂基材前驅物進行加熱,該纖維強化樹脂基材前驅物包含本發明之一態樣之樹脂膜、及重疊於上述樹脂膜之纖維;以及 第2步驟,其使上述纖維強化樹脂基材前驅物冷卻,而獲得上述纖維強化樹脂基材。 該纖維強化樹脂基材之製造方法可用以製造本發明之一態樣之纖維強化樹脂基材。4. Manufacturing method of fiber-reinforced resin substrate The manufacturing method of the fiber-reinforced resin substrate of one aspect of the present invention includes: The first step is to heat a fiber-reinforced resin base material precursor, the fiber-reinforced resin base material precursor comprising the resin film of one aspect of the present invention and the fibers superimposed on the resin film; and In the second step, the above-mentioned fiber-reinforced resin base material is obtained by cooling the above-mentioned fiber-reinforced resin base material precursor. The manufacturing method of the fiber-reinforced resin base material can be used to manufacture the fiber-reinforced resin base material of one aspect of the present invention.

(第1步驟) 於第1步驟中,對藉由將樹脂膜與纖維重疊所形成之纖維強化樹脂基材前驅物進行加熱。 此時,纖維可於複數根纖維整體呈面狀擴展之狀態下重疊於樹脂膜。例如於製造包含織物或不織布之纖維強化樹脂基材之情形時,可將織物或不織布重疊於樹脂膜。又,例如於製造包含作為沿一個方向配向之形態之纖維的纖維強化樹脂基材之情形時,例如於將從粗紗(纖維束之捲繞體)捲出之纖維束以複數根纖維整體呈面狀擴展之方式開纖後,可將開纖之纖維(維持有沿一個方向配向之形態)重疊於樹脂膜。開纖例如可藉由向纖維束吹送空氣(空氣流)而進行。(Step 1) In the first step, the fiber-reinforced resin base material precursor formed by overlapping the resin film and the fibers is heated. At this time, the fibers can be overlapped on the resin film in a state in which the entire plurality of fibers spread in a planar shape. For example, in the case of manufacturing a fiber-reinforced resin substrate comprising a woven or non-woven fabric, the woven or non-woven fabric can be superimposed on the resin film. Also, for example, in the case of manufacturing a fiber-reinforced resin substrate containing fibers in a form aligned in one direction, for example, when a fiber bundle unwound from a roving (winding body of fiber bundles) is formed by a plurality of fibers as a whole After the fibers are opened in the form of expansion, the opened fibers (maintaining the shape aligned in one direction) can be overlapped on the resin film. The fiber opening can be performed, for example, by blowing air (air flow) to the fiber bundle.

於一實施方式中,於第1步驟中,以樹脂膜之熔點以上之溫度對纖維強化樹脂基材前驅物進行加熱。藉此,可較佳地使構成樹脂膜之樹脂(S)含浸於纖維中。此處,樹脂膜之熔點意指樹脂膜所包含之樹脂(A)之熔點(單獨之熔點)。 樹脂膜之熔點例如處於200~300℃之範圍內,第1步驟中之加熱溫度例如可設定為於200~350℃之範圍內且為樹脂膜之熔點以上。In one embodiment, in the first step, the fiber-reinforced resin substrate precursor is heated at a temperature equal to or higher than the melting point of the resin film. Thereby, the resin (S) constituting the resin film can be preferably impregnated into the fibers. Here, the melting point of the resin film means the melting point (melting point alone) of the resin (A) contained in the resin film. The melting point of the resin film is, for example, in the range of 200 to 300° C., and the heating temperature in the first step can be set, for example, in the range of 200 to 350° C. and higher than the melting point of the resin film.

於一實施方式中,於第1步驟中,使用輥對纖維強化樹脂基材前驅物進行加熱。藉此,可有效率地對構成樹脂膜之樹脂(S)進行加熱。於此情形時,輥(加熱輥)之溫度可設定為上述加熱溫度。 再者,於第1步驟中,亦可藉由紅外線加熱器等加熱器對纖維強化樹脂基材前驅物進行加熱。利用加熱器所進行之加熱亦可作為利用輥所進行之加熱之前步驟(預熱步驟)而實施。In one embodiment, in the first step, the fiber-reinforced resin base material precursor is heated using a roller. Thereby, the resin (S) which comprises a resin film can be heated efficiently. In this case, the temperature of the roll (heat roll) can be set to the above-mentioned heating temperature. In addition, in the first step, the fiber-reinforced resin base material precursor may be heated by a heater such as an infrared heater. Heating by a heater can also be implemented as a step (preheating step) before heating by a roll.

於一實施方式中,於第1步驟中,使用輥對纖維強化樹脂基材前驅物進行加壓。藉此,可較佳地使構成樹脂膜之樹脂(S)含浸於纖維中。於此情形時,可藉由將纖維強化樹脂基材前驅物夾持於一對輥間而進行加壓。加壓之壓力並無特別限定,可藉由調整一對輥間之距離(間隔)而進行適當設定。In one embodiment, in the first step, the fiber-reinforced resin base material precursor is pressurized using a roller. Thereby, the resin (S) constituting the resin film can be preferably impregnated into the fibers. In this case, pressurization can be performed by pinching the fiber-reinforced resin base material precursor between a pair of rolls. The pressure of pressing is not particularly limited, and can be appropriately set by adjusting the distance (interval) between a pair of rolls.

於一實施方式中,於第1步驟中,同時進行纖維強化樹脂基材前驅物之加熱及加壓。藉此,可更佳地使構成樹脂膜之樹脂(S)含浸於纖維中。於此情形時,可藉由將纖維強化樹脂基材前驅物夾持於一對加熱輥間而進行加壓。 再者,所謂「同時進行加熱及加壓」,未必限定於同時開始加熱及加壓之情形。例如,只要於某一時間點同時進行加熱及加壓即可,即便加熱及加壓係於不同時點開始。In one embodiment, in the first step, heating and pressing of the fiber-reinforced resin substrate precursor are performed simultaneously. Thereby, the resin (S) which comprises a resin film can be impregnated in a fiber more preferably. In this case, the pressure can be applied by sandwiching the fiber-reinforced resin base material precursor between a pair of heating rolls. In addition, the so-called "simultaneous heating and pressurization" is not necessarily limited to the case where heating and pressurization are started at the same time. For example, heating and pressurization may be performed simultaneously at a certain point in time, even if heating and pressurization are started at different points in time.

(第2步驟) 於第2步驟中,使第1步驟中已加熱之纖維強化樹脂基材前驅物冷卻,而獲得纖維強化樹脂基材。(Step 2) In the second step, the fiber-reinforced resin substrate precursor heated in the first step is cooled to obtain a fiber-reinforced resin substrate.

於一實施方式中,於第2步驟中,於未達200℃之溫度下使纖維強化樹脂基材前驅物冷卻。藉此,可有效率地使構成纖維強化樹脂基材前驅物之樹脂(S)冷卻。第2步驟中之冷卻可為未達樹脂膜之熔點之溫度。In one embodiment, in the second step, the fiber-reinforced resin substrate precursor is cooled at a temperature below 200°C. Thereby, the resin (S) which comprises a fiber-reinforced resin base material precursor can be cooled efficiently. The cooling in the second step may be a temperature below the melting point of the resin film.

於一實施方式中,於第2步驟中,使用輥使纖維強化樹脂基材前驅物冷卻。藉此,可有效率地使構成纖維強化樹脂基材前驅物之樹脂(S)冷卻。於此情形時,輥(冷卻輥)之溫度可設定為上述冷卻溫度。In one embodiment, in the second step, the fiber-reinforced resin base material precursor is cooled using a roll. Thereby, the resin (S) which comprises a fiber-reinforced resin base material precursor can be cooled efficiently. In this case, the temperature of the roll (cooling roll) can be set to the above-mentioned cooling temperature.

(第3步驟) 纖維強化樹脂基材之製造方法可進而包括下述第3步驟,亦可不包括下述第3步驟。 於一實施方式中,纖維強化樹脂基材之製造方法包括:第3步驟,其於第2步驟之後,捲取纖維強化樹脂基材。 於第3步驟中,捲取纖維強化樹脂基材。藉此,獲得纖維強化樹脂基材之捲筒。(Step 3) The manufacturing method of the fiber-reinforced resin base material may further include the following third step, or may not include the following third step. In one embodiment, the manufacturing method of the fiber-reinforced resin base material includes a third step of winding the fiber-reinforced resin base material after the second step. In the third step, the fiber-reinforced resin substrate is wound up. Thereby, the roll of the fiber-reinforced resin base material was obtained.

於一實施方式中,於第3步驟中,以1~30 m/min之速度捲取纖維強化樹脂基材。藉由使該捲取速度為1 m/min以上,生產效率會提高,又,可使第1步驟中之樹脂膜之加熱時間變短,可抑制樹脂之熱劣化。進而,藉由使該捲取速度為30 m/min以下,於第1步驟及第2步驟中,可實現充分之加熱冷卻,可較佳地使樹脂(S)含浸於纖維中。In one embodiment, in the third step, the fiber-reinforced resin substrate is wound at a speed of 1 to 30 m/min. By making the winding speed 1 m/min or more, the production efficiency can be improved, and the heating time of the resin film in the first step can be shortened, thereby suppressing thermal degradation of the resin. Furthermore, by making the winding speed 30 m/min or less, sufficient heating and cooling can be achieved in the first step and the second step, and the fiber can be preferably impregnated with the resin (S).

於一實施方式中,將長條狀之纖維強化樹脂基材前驅物進行輥搬送,並對該纖維強化樹脂基材前驅物連續地實施第1步驟、第2步驟及第3步驟。於此情形時,第3步驟中之上述捲取速度可與第1步驟及第2步驟中之輥搬送速度相當。In one embodiment, the long fiber-reinforced resin base material precursor is roll-conveyed, and the first step, the second step, and the third step are continuously performed on the fiber-reinforced resin base material precursor. In this case, the above-mentioned winding speed in the third step may be equivalent to the roller conveyance speed in the first step and the second step.

(離型片材) 於一實施方式中,於選自由第1步驟、第2步驟及第3步驟所組成之群中之1個以上之步驟中,於纖維強化樹脂基材前驅物之單面或雙面重疊有離型片材。藉此,防止樹脂(S)附著於製造裝置(輥等),可穩定地實施各步驟。(release sheet) In one embodiment, in one or more steps selected from the group consisting of the first step, the second step, and the third step, the fiber-reinforced resin base material precursor is superimposed on one side or both sides of the precursor. profiled sheet. Thereby, resin (S) is prevented from adhering to the manufacturing apparatus (roll etc.), and each process can be implemented stably.

於一實施方式中,於第1步驟及第2步驟中,於纖維強化樹脂基材前驅物之單面或雙面重疊離型片材,於第3步驟之前,將離型片材從纖維強化樹脂基材剝離、回收。藉此,獲得不包含離型片材之纖維強化樹脂基材之捲筒。In one embodiment, in the first step and the second step, the release sheet is overlapped on one side or both sides of the fiber-reinforced resin substrate precursor, and before the third step, the release sheet is reinforced from the fiber. Resin substrate peeling and recycling. Thereby, the roll of the fiber-reinforced resin base material which does not contain a release sheet is obtained.

於一實施方式中,纖維強化樹脂基材於重疊有離型片材之狀態下直接供給至第3步驟。藉此,獲得包含離型片材之纖維強化樹脂基材之捲筒。In one embodiment, the fiber-reinforced resin base material is directly supplied to the third step in a state where the release sheet is stacked. Thereby, the roll of the fiber-reinforced resin base material containing a release sheet was obtained.

離型片材並無特別限定,例如可包含選自由聚四氟乙烯等氟樹脂、熱固性聚醯亞胺樹脂等所組成之群中之1種以上。該等樹脂亦可藉由纖維進行補強。作為此種纖維,例如可例舉玻璃布等,但不限定於此。The release sheet is not particularly limited, but may contain, for example, one or more selected from the group consisting of fluororesins such as polytetrafluoroethylene, thermosetting polyimide resins, and the like. These resins can also be reinforced by fibers. As such a fiber, glass cloth etc. are mentioned, for example, It is not limited to this.

又,作為離型片材,亦可使用將包含上述樹脂之樹脂層積層於支持層上者。樹脂層可積層於支持層之單面或雙面。支持層並無特別限定,例如可例舉膨脹石墨片材等。膨脹石墨片材例如藉由如下方法獲得:於精選天然鱗片狀石墨之後,利用高溫急加熱而使藉由濃硫酸與酸化劑之混酸液進行了酸處理後所得者膨脹,藉由壓延成形而賦形為片材狀;但並不限定於此方法。Moreover, as a release sheet, what laminated|stacked the resin containing the said resin on a support layer can also be used. The resin layer can be laminated on one side or both sides of the support layer. The support layer is not particularly limited, and, for example, an expanded graphite sheet or the like can be mentioned. The expanded graphite sheet is obtained, for example, by the following method: after selecting natural flake graphite, the resulting product is expanded by acid treatment with a mixed acid solution of concentrated sulfuric acid and an acidulant by rapid heating at a high temperature, and is formed by rolling. Formed in sheet form; but not limited to this method.

於以上說明中,關於纖維強化樹脂基材前驅物之加熱及加壓,主要展示了使用輥之方法,但並不限定於此。纖維強化樹脂基材前驅物之加熱及加壓亦可藉由加壓成形進行。於此情形時,預先將以特定大小切下之樹脂膜與纖維重疊而形成纖維強化樹脂基材前驅物,對該纖維強化樹脂基材前驅物進行衝壓,使樹脂(S)含浸於纖維中(第1步驟),其次,可藉由冷卻獲得纖維強化樹脂基材(第2步驟)。In the above description, with regard to the heating and pressurization of the fiber-reinforced resin base material precursor, the method using a roll was mainly shown, but it is not limited to this. The heating and pressurization of the fiber-reinforced resin substrate precursor can also be performed by press molding. In this case, a fiber-reinforced resin base material precursor is formed by overlapping a resin film cut with a specific size on the fiber in advance, and the fiber-reinforced resin base material precursor is punched to impregnate the fiber with the resin (S). The first step), and secondly, the fiber-reinforced resin substrate can be obtained by cooling (the second step).

於以上說明中,於纖維(T)之表面可附著有上漿劑,亦可不附著有上漿劑。於使用附著有上漿劑之纖維(T)之情形時,該上漿劑之種類可根據纖維(T)及樹脂(S)之種類進行適當選擇,並無特別限定。藉由環氧系上漿劑、胺基甲酸酯系上漿劑、聚醯胺系上漿劑處理之纖維(T)、或者不包含上漿劑之纖維(T)等被做成了各種製品,但可無關上漿劑之種類、有無而使用纖維(T)。In the above description, the sizing agent may or may not be attached to the surface of the fiber (T). When using the fiber (T) to which the sizing agent is attached, the type of the sizing agent can be appropriately selected according to the type of the fiber (T) and the resin (S), and is not particularly limited. Fibers (T) treated with epoxy-based sizing agents, urethane-based sizing agents, polyamide-based sizing agents, or fibers (T) that do not contain sizing agents are made into various products. Products, but fibers (T) can be used regardless of the type and presence of sizing agent.

5.積層體 本發明之一態樣之積層體係由2個以上之本發明之一態樣之纖維強化樹脂基材積層並一體化而成者。5. Laminate The lamination system of one aspect of the present invention is formed by laminating and integrating two or more fiber-reinforced resin substrates of one aspect of the present invention.

於一實施方式中,積層體所包含之源自各纖維強化樹脂基材之纖維相互沿同一個方向配向。藉此,積層體相對於一個方向被顯著地強化。In one embodiment, the fibers derived from the respective fiber-reinforced resin substrates included in the laminate are aligned in the same direction. Thereby, the laminated body is remarkably strengthened with respect to one direction.

於一實施方式中,積層體所包含之源自各纖維強化樹脂基材之纖維相互沿不同方向配向。藉此,積層體與方向無關(相對於多方向)地被強化。In one embodiment, the fibers derived from the respective fiber-reinforced resin substrates included in the laminate are aligned in different directions with each other. Thereby, the laminated body is strengthened irrespective of the direction (with respect to multiple directions).

2個以上之纖維強化樹脂基材可藉由纖維強化樹脂基材所包含之樹脂(S)本身(藉由樹脂(S)之熔融)而一體化,亦可介隔不是纖維強化樹脂基材之接著層而一體化。接著層之材質並無特別限定,例如可列舉說明樹脂膜時之熱塑性樹脂及熱固性樹脂等。Two or more fiber-reinforced resin substrates may be integrated by the resin (S) itself contained in the fiber-reinforced resin substrate (by melting of the resin (S)), or it may be separated from the fiber-reinforced resin substrate. Then the layers are integrated. The material of the next layer is not particularly limited, and examples thereof include thermoplastic resins and thermosetting resins as described in the description of the resin film.

積層體之厚度並無特別限定,例如可為0.1 mm以上、0.5 mm以上或1.0 mm以上,又,可為10 mm以下、5.0 mm以下或3.0 mm以下。The thickness of the layered body is not particularly limited, but may be, for example, 0.1 mm or more, 0.5 mm or more, or 1.0 mm or more, and may be 10 mm or less, 5.0 mm or less, or 3.0 mm or less.

6.積層體之製造方法 本發明之一態樣之積層體之製造方法包括: 重疊2個以上之本發明之一態樣之纖維強化樹脂基材而形成積層體前驅物;及 對上述積層體前驅物進行加壓成形,而獲得由2個以上之上述纖維強化樹脂基材積層並一體化而成之積層體。 該積層體之製造方法可用以製造本發明之一態樣之積層體。6. Manufacturing method of laminated body A method for manufacturing a layered product of an aspect of the present invention includes: Stacking two or more fiber-reinforced resin substrates of one aspect of the present invention to form a laminate precursor; and The above-mentioned layered body precursor is press-molded to obtain a layered body in which two or more of the above-mentioned fiber-reinforced resin base materials are laminated and integrated. This method for producing a layered product can be used to produce a layered product according to an aspect of the present invention.

(積層體前驅物之形成) 於一實施方式中,以各纖維強化樹脂基材之纖維配向方向相互沿同一個方向配向之方式,重疊2個以上之纖維強化樹脂基材。藉此,所獲得之積層體於一個方向被顯著地強化。(Formation of Laminate Precursor) In one embodiment, two or more fiber-reinforced resin substrates are stacked so that the fiber orientation directions of the respective fiber-reinforced resin substrates are mutually aligned in the same direction. Thereby, the obtained laminate is remarkably strengthened in one direction.

於一實施方式中,以各纖維強化樹脂基材之纖維配向方向相互沿不同方向配向之方式,重疊2個以上之纖維強化樹脂基材。藉此,所獲得之積層體與方向無關(於多方向)地被強化。In one embodiment, two or more fiber-reinforced resin substrates are stacked so that the fiber orientation directions of the respective fiber-reinforced resin substrates are mutually aligned in different directions. Thereby, the obtained laminated body is strengthened irrespective of the direction (in multiple directions).

於積層體前驅物中,2個以上之纖維強化樹脂基材可直接積層,亦可介隔接著層而積層。In the layered product precursor, two or more fiber-reinforced resin substrates may be directly layered, or may be layered with an adhesive layer interposed therebetween.

為了形成積層體前驅物而重疊之纖維強化樹脂基材之數量並無特別限定,例如可為2~1000。The number of fiber-reinforced resin substrates to be stacked in order to form the laminate precursor is not particularly limited, and may be, for example, 2 to 1,000.

(積層體之形成) 對積層體前驅物進行加壓成形,獲得由2個以上之纖維強化樹脂基材積層並一體化而成之積層體。(Formation of laminated body) The laminate precursor is press-molded to obtain a laminate in which two or more fiber-reinforced resin base materials are laminated and integrated.

衝壓壓力係沿纖維強化樹脂基材之積層方向施加,其大小並無特別限定,例如可使用於0~100 MPa之範圍內階段性地(例如4階段)提高衝壓壓力之方法。The punching pressure is applied along the layering direction of the fiber-reinforced resin base material, and its magnitude is not particularly limited.

加壓成形之溫度可為樹脂(S)之熔點以上之溫度,又,可為纖維之熔點以下之溫度。The temperature of press molding may be a temperature higher than the melting point of the resin (S), or may be a temperature lower than the melting point of the fiber.

加壓成形例如可使用真空衝壓機等。於使用真空衝壓機之情形時,真空度並無特別限定,例如可為-0.1 MPa以下。For the press forming, for example, a vacuum press or the like can be used. In the case of using a vacuum press, the degree of vacuum is not particularly limited, but may be, for example, -0.1 MPa or less.

7.複合體 本發明之一態樣之複合體包含: 第1構件,其係本發明之一態樣之纖維強化樹脂基材或本發明之一態樣之積層體;以及 第2構件,其係與上述第1構件一體化之射出成形體。7. Complex The complex of one aspect of the present invention comprises: The first member, which is the fiber-reinforced resin substrate of one aspect of the present invention or the laminate of one aspect of the present invention; and The second member is an injection-molded body integrated with the first member.

於一實施方式中,射出成形體包含樹脂。樹脂並無特別限定,例如可列舉上述樹脂(S)、及說明樹脂膜時之其他樹脂等。In one embodiment, the injection-molded body contains resin. The resin is not particularly limited, and examples thereof include the above-mentioned resin (S) and other resins described in the description of the resin film.

射出成形體除了樹脂以外,包含或不包含除了樹脂以外之其他成分。 作為其他成分,例如可列舉上述纖維(T)、及說明樹脂膜時之其他成分等。The injection-molded body may or may not contain other components other than the resin in addition to the resin. As other components, for example, the above-mentioned fibers (T) and other components described in the description of the resin film, etc. are mentioned.

8.複合體之製造方法 至於本發明之一態樣之複合體之製造方法,於將作為本發明之一態樣之纖維強化樹脂基材或本發明之一態樣之積層體的第1構件插入於模具中之狀態下射出成形,獲得包含上述第1構件、及作為與上述第1構件一體化之射出成形體之第2構件之複合體。 該複合體之製造方法可用以製造本發明之一態樣之複合體。8. Manufacturing method of composite As for the method for producing the composite of one aspect of the present invention, the fiber-reinforced resin substrate of one aspect of the present invention or the first member of the laminate of one aspect of the present invention is inserted into a mold By injection molding, a composite body including the first member and the second member as an injection-molded body integrated with the first member is obtained. The method for producing the composite can be used to produce the composite of one aspect of the present invention.

於以上之複合體之說明中,主要對第2構件為包含樹脂之射出成形體之情形進行了展示,但並不限定於此。第2構件可包含除了樹脂以外之任意材料,又,亦可為藉由除了射出成形以外之任意方法所成形者。作為第2構件所包含之材料之例,例如可列舉金屬、發泡體等。發泡體例如可為樹脂發泡體等。樹脂發泡體之樹脂並無特別限定,例如可例舉聚苯乙烯樹脂等。聚苯乙烯樹脂可為上述樹脂A(對排聚苯乙烯樹脂),又,可為除了樹脂A以外之聚苯乙烯樹脂。In the above description of the composite body, the case where the second member is an injection-molded body containing resin has been mainly shown, but the present invention is not limited to this. The second member may contain any material other than resin, and may be formed by any method other than injection molding. As an example of the material contained in a 2nd member, a metal, a foam, etc. are mentioned, for example. The foam may be, for example, a resin foam or the like. The resin of a resin foam is not specifically limited, For example, polystyrene resin etc. are mentioned. The polystyrene resin may be the above-mentioned resin A (opposite polystyrene resin), and may be a polystyrene resin other than the resin A.

9.用途 以上所說明之本發明之一態樣之樹脂膜、纖維強化樹脂基材、積層體及複合體(以下,有時稱「物品X」作為該等之總稱)之用途並無特別限定,可用於各種用途。各種用途之各種零件可使用物品X製造、或包含物品X。9. Purpose The application of the resin film, fiber-reinforced resin substrate, laminate, and composite (hereinafter, sometimes referred to as "article X" as a general term for these) of one aspect of the present invention described above is not particularly limited, and can be used for Various uses. Various parts for various purposes can be made using Item X, or contain Item X.

參照圖1~圖4,對由物品X構成之汽車零件之例進行說明。再者,於汽車中,設置各汽車零件之位置未必限定於圖1~圖4之例。1 to 4 , an example of an automobile part composed of the article X will be described. In addition, in an automobile, the position where each automobile part is installed is not necessarily limited to the examples shown in FIGS. 1 to 4 .

如圖1所示,物品X例如適宜構成引擎蓋1、車頂(包含車頂框架)2、車門框支柱3、座椅靠背4、頭枕支架5、引擎零件6、衝撞盒7、前地板通道8、前地板9、底蓋10、底部支撐桿11、防撞樑12、擋泥板支架13、前罩14、前引擎蓋15、前橫向連接桿16、變速箱中央管道17、散熱器芯子支架18、駕駛室前壁19、前門內板20、後行李箱後板21、後行李箱側板22、後行李箱地板23、後行李箱擱板24等。As shown in FIG. 1, the article X suitably constitutes, for example, a hood 1, a roof (including a roof frame) 2, a door frame pillar 3, a seat back 4, a headrest bracket 5, an engine part 6, a crash box 7, a front floor Tunnel 8, front floor 9, bottom cover 10, bottom support rod 11, anti-collision beam 12, fender bracket 13, front cover 14, front hood 15, front cross connecting rod 16, transmission central duct 17, radiator Core bracket 18, cab front wall 19, front door inner panel 20, rear trunk rear panel 21, rear trunk side panel 22, rear trunk floor 23, rear trunk shelf 24, etc.

又,如圖2所示,物品X例如適宜構成電力電子單元25、急速充電用插頭26、車載充電器27、鋰離子電池28、電池控制單元29、電力電子/控制單元30、三相同步電動機31、家庭充電用插頭32等。Also, as shown in FIG. 2 , the article X suitably constitutes, for example, a power electronic unit 25 , a plug 26 for rapid charging, an on-board charger 27 , a lithium ion battery 28 , a battery control unit 29 , a power electronic/control unit 30 , and a three-phase synchronous motor. 31. A plug 32 for household charging, etc.

進而,如圖3所示,物品X例如適宜構成太陽能暮光感測器(solar twilight sensor)33、交流發電機34、EDU(electronic injector driver unit,電子噴射器驅動單元)35、電子節流閥36、滾流控制閥37、節流閥位置感測器38、散熱器風扇控制器39、棒狀線圈(stick coil)40、A/C(air conditioning,空氣調節裝置)管接頭41、柴油機微粒子捕獲過濾器42、頭燈反射板43、增壓空氣管道44、增壓空氣冷卻頭45、進氣溫度感測器46、汽油燃料壓力感測器47、凸輪/曲軸位置感測器48、組合閥49、機油壓力感測器50、變速箱齒輪角度感測器51、無段變速機油壓感測器52、ELCM(Evaporative Leak Check Module,蒸發洩漏檢查模組)泵53、水泵葉輪54、轉向桿連接器55、ECU(engine computer unit,發動機電腦單元)連接器56、ABS(antilock braking system,防煞鎖死系統)貯液器活塞57、致動器蓋58等。Furthermore, as shown in FIG. 3 , the article X suitably constitutes, for example, a solar twilight sensor 33, an alternator 34, an EDU (electronic injector driver unit) 35, and an electronic throttle valve. 36. Tumble flow control valve 37, throttle valve position sensor 38, radiator fan controller 39, stick coil 40, A/C (air conditioning, air conditioning device) pipe joint 41, diesel engine particles Capture filter 42, headlight reflector 43, charge air duct 44, charge air cooling head 45, intake air temperature sensor 46, gasoline fuel pressure sensor 47, cam/crankshaft position sensor 48, combination Valve 49, oil pressure sensor 50, transmission gear angle sensor 51, continuously variable transmission oil pressure sensor 52, ELCM (Evaporative Leak Check Module) pump 53, water pump impeller 54, Steering rod connector 55, ECU (engine computer unit, engine computer unit) connector 56, ABS (antilock braking system, anti-brake system) reservoir piston 57, actuator cover 58 and the like.

並且,如圖4所示,物品X例如亦適宜用作用以密封車載感測器模組所具備之感測器之密封材。此種感測器並無特別限定,例如可列舉:(例如高地修正用)大氣壓感測器59、(例如燃料噴射控制用)增壓壓力感測器60、(IC化)大氣壓感測器61、(例如氣囊用)加速度感測器62、(例如座椅調控用)表壓力感測器63、(例如燃料箱洩漏檢測用)箱內壓力感測器64、(例如空調控制用)冷媒壓力感測器65、(例如點火線圈控制用)線圈驅動66、EGR(排氣再循環)閥感測器67、(例如燃料噴射控制用)氣流感測器68、(例如燃料噴射控制用)進氣管壓力(MAP)感測器69等。該等亦可具有前端模組之形態。又,物品X適宜構成油盤70、散熱器蓋71、進氣歧管72等。In addition, as shown in FIG. 4 , the article X is also suitably used as a sealing material for sealing a sensor included in the in-vehicle sensor module, for example. Such sensors are not particularly limited, and examples thereof include the atmospheric pressure sensor 59 (for example, for altitude correction), the boost pressure sensor 60 (for example, for fuel injection control), and the atmospheric pressure sensor 61 (for IC) , (for example, for airbags) acceleration sensor 62, (for example for seat adjustment) gauge pressure sensor 63, (for example for fuel tank leak detection) tank pressure sensor 64, (for example for air conditioning control) refrigerant pressure Sensor 65, (for example for ignition coil control) coil drive 66, EGR (exhaust gas recirculation) valve sensor 67, (for example for fuel injection control) air flow sensor 68, (for example for fuel injection control) inlet Tracheal pressure (MAP) sensor 69, etc. These may also be in the form of front-end modules. In addition, the article X suitably constitutes the oil pan 70, the radiator cover 71, the intake manifold 72, and the like.

由物品X構成之汽車零件並不限定於參照圖1~圖4所例示者,例如亦適宜用於高電壓(線束)連接器、毫米波天線罩、IGBT(Insulated Gate Bipolar Transistor,絕緣閘雙極性電晶體)外殼、電池保險絲端子、散熱器格柵、儀錶罩、變頻冷卻用水泵、電池監控單元、構造零件、高電壓連接器、馬達控制ECU(發動機電腦單元)、變流器、配管零件、碳罐淨化閥、動力單元、匯流排、馬達減速機、碳罐等。又,由物品X構成之汽車零件例如亦可為堆疊框等。The automobile parts composed of the article X are not limited to those illustrated with reference to FIGS. 1 to 4 , but are also suitable for use in, for example, high-voltage (wiring harness) connectors, millimeter-wave radomes, IGBTs (Insulated Gate Bipolar Transistors, insulated gate bipolars) Transistor case, battery fuse terminal, radiator grill, instrument cover, inverter cooling water pump, battery monitoring unit, structural parts, high voltage connector, motor control ECU (engine computer unit), inverter, piping parts, Carbon canister purification valve, power unit, busbar, motor reducer, carbon canister, etc. Moreover, the automobile part which consists of the article X may be, for example, a stack frame or the like.

物品X亦適宜用於二輪車零件、自行車零件,更具體而言,可列舉機車零件、二輪車罩(cowl)等。The article X is also suitable for use in motorcycle parts and bicycle parts, and more specifically, motorcycle parts, a motorcycle cowl, and the like are exemplified.

物品X由於亦可符合輕量化、耐水性、耐化學品性、耐候性等要求,因此亦適用作例如航空器、無人機等之零件。Item X can also meet the requirements of lightweight, water resistance, chemical resistance, weather resistance, etc., so it is also suitable for parts such as aircraft and drones.

又,物品X由於耐磨性優異,因此亦適用作齒輪、軸承等滑動零件。In addition, since the article X is excellent in wear resistance, it is also suitable for sliding parts such as gears and bearings.

物品X由於耐化學品性優異,因此亦可用於各種電器。例如較佳亦為構成熱水器之零件,具體而言,係作為所謂「EcoCute(註冊商標)」等而為人所知之自然冷媒熱泵熱水器之零件。作為此種零件,例如可列舉噴水器零件、泵零件、配管零件等,更具體而言,可列舉單端型循環接頭、釋放閥、混合閥單元、耐熱阱、泵外殼、複合水閥、入水配件、樹脂接頭、配管零件、樹脂減壓閥、給水栓用彎頭等。Item X can also be used in various electrical appliances because of its excellent chemical resistance. For example, it is also preferable to use a part constituting a water heater, specifically, a part of a natural refrigerant heat pump water heater known as a so-called "EcoCute (registered trademark)" or the like. Examples of such parts include sprinkler parts, pump parts, piping parts, and the like, and more specifically, single-ended circulation joints, release valves, mixing valve units, heat-resistant traps, pump housings, composite water valves, and water inlets. Accessories, resin joints, piping parts, resin pressure reducing valves, elbows for water supply hydrants, etc.

物品X亦適用於家電用途、電子機器,更具體而言,可列舉:微波爐、電話機、行動電話、冰箱、吸塵器、OA(Office Automation,辦公自動化)設備、電動工具零件、電氣零件用途、防靜電用途、高頻電子零件、高散熱性電子零件、高電壓用零件、電磁波屏蔽用零件、通訊機器製品、AV(audiovisual,視聽)設備、電腦(包括筆記型電腦)、暫存器、電扇、排風扇、縫紉機、墨水周邊零件、色帶盒、空氣清潔器零件、溫水清洗馬桶座零件、馬桶座、馬桶蓋、電鍋零件、光學拾取器機器、照明器具用零件、DVD(Digital Versatile Disc,數位多功能光碟)、DVD-RAM(Digital Versatile Disc Random Access Memory,數位多功能光碟-隨機存取記憶體)、DVD拾取器零件、DVD用拾取器基片、硬碟零件、開關零件、插口、顯示器、攝錄影機、數位相機、長絲、插頭、高速彩色影印機(雷射印表機)、變流器、空調、鍵盤、轉換器、電視、傳真機、光連接器、半導體晶片、LED(Light Emitting Diode,發光二極體)零件、洗衣機/洗衣乾燥機零件、餐具清洗機/餐具乾燥機零件等。Item X is also suitable for home appliances, electronic equipment, and more specifically, microwave ovens, telephones, mobile phones, refrigerators, vacuum cleaners, OA (Office Automation) equipment, power tool parts, electrical parts use, antistatic Application, high frequency electronic parts, high heat dissipation electronic parts, high voltage parts, electromagnetic wave shielding parts, communication equipment, AV (audiovisual, audio-visual) equipment, computers (including notebook computers), registers, electric fans, exhaust fans , sewing machines, ink peripheral parts, ribbon cassettes, air cleaner parts, toilet seat parts for warm water cleaning, toilet seats, toilet lids, electric cooker parts, optical pickup equipment, parts for lighting fixtures, DVD (Digital Versatile Disc, digital Versatile Disc), DVD-RAM (Digital Versatile Disc Random Access Memory, Digital Versatile Disc-Random Access Memory), DVD pickup parts, DVD pickup substrates, hard disk parts, switch parts, sockets, monitors , camcorders, digital cameras, filaments, plugs, high-speed color photocopiers (laser printers), inverters, air conditioners, keyboards, converters, televisions, fax machines, optical connectors, semiconductor chips, LEDs (Light Emitting Diode, light-emitting diode) parts, washing machine/washer dryer parts, dishwasher/dishwasher dryer parts, etc.

物品X亦適用於建材,更具體而言,可列舉:外壁板、後板、間壁板、信號燈、緊急照明燈、壁材等。The article X is also suitable for building materials, and more specifically, an outer wall panel, a rear panel, a partition wall panel, a signal lamp, an emergency lighting lamp, a wall material, etc. are mentioned.

物品X亦適用於雜貨、日用品等,更具體而言,可列舉:筷子、便當盒、餐具容器、食品盤、食品包裝用材料、水槽、箱、玩具、釣具、運動用品、滑水板、門罩、門階、自動機器(自動櫃員機(ATM))零件、柏青哥台零件、遙控汽車、遙控器收納盒、文具、樂器、杯子(tumbler)、啞鈴、頭盔箱製品等。Item X is also applicable to miscellaneous goods, daily necessities, etc. More specifically, chopsticks, lunch boxes, cutlery containers, food trays, food packaging materials, sinks, boxes, toys, fishing tackle, sporting goods, water skis, doors Covers, door steps, automatic machine (ATM) parts, pachinko table parts, remote control cars, remote control storage boxes, stationery, musical instruments, tumblers, dumbbells, helmet case products, etc.

對以上所說明之各種零件之各者而言,零件之一部分或全部可使用物品X製造、或包含物品X。 [實施例]For each of the various parts described above, some or all of the parts may be made using, or contain, item X. [Example]

以下,對本發明之實施例進行說明,但本發明並不受該等實施例限定。Hereinafter, examples of the present invention will be described, but the present invention is not limited to these examples.

(實施例1) <樹脂之製備> 於將樹脂A-1(對排聚苯乙烯樹脂,外消旋五元組:98莫耳%;MFR:13 g/10 min;熔點:270℃)100質量份與樹脂B-1(富馬酸改性聚苯醚,改性量為1.7質量%,玻璃轉移點為220℃)18質量份乾摻後,使用料缸直徑為32 mm之二軸混練機(Coperion公司製造;ZSK32MC),於設定溫度300℃下熔融混練而獲得樹脂(S)。於140℃下對所獲得之樹脂(S)進行5小時乾燥。(Example 1) <Preparation of resin> 100 parts by mass of resin A-1 (opposite polystyrene resin, racemic pentad: 98 mole %; MFR: 13 g/10 min; melting point: 270°C) and resin B-1 (Fuma Acid-modified polyphenylene ether, the modification amount is 1.7% by mass, and the glass transition point is 220° C.) After 18 parts by mass of dry blending, a two-shaft kneader (manufactured by Coperion; ZSK32MC) with a cylinder diameter of 32 mm is used, and the The resin (S) was obtained by melt-kneading at a set temperature of 300°C. The obtained resin (S) was dried at 140°C for 5 hours.

<樹脂膜之製造> 圖5係對本發明之一態樣之樹脂膜之製造方法的一例進行說明之模式圖。 如圖5所示,將於上述「樹脂之製備」中獲得之樹脂(S)供給至具備單軸混練機之成膜機(創研股份有限公司製造,螺旋形狀:全螺紋;螺旋直徑:30 mm;L/D(long/diameter,長徑比):38;擠出溫度:320℃)101,擠出至設定為100℃之輥102上,按照設定為90℃之輥103、104之順序進行輥搬送,其次,藉由使用剃刀刃105之開縫加工,連續地去除正在搬送中之樹脂膜前驅物106之寬度方向之兩端,而獲得未延伸之樹脂膜107。捲取所獲得之樹脂膜107而獲得捲筒108。 於上述開縫加工中,將距離樹脂膜前驅物106之寬度方向之兩末端2.0 cm為止之部分作為端部去除,上述樹脂膜前驅物106之寬度方向之長度為25 cm。此時,已被去除之端部之寬度(2.0 cm)於將樹脂膜前驅物106之寬度方向之長度(25 cm)設為100%之情形時,相當於8%。該開縫加工之結果為,所獲得之樹脂膜107之寬度方向之長度變為21 cm。<Manufacture of resin film> FIG. 5 is a schematic diagram illustrating an example of a method for producing a resin film according to an aspect of the present invention. As shown in Fig. 5, the resin (S) obtained in the above-mentioned "Preparation of Resin" was supplied to a film forming machine (manufactured by Chuangyan Co., Ltd., spiral shape: full thread; spiral diameter: 30 mm) equipped with a uniaxial kneader. mm; L/D (long/diameter, aspect ratio): 38; extrusion temperature: 320°C) 101, extrude onto the roller 102 set at 100°C, in the order of rollers 103 and 104 set at 90°C Roll conveyance is performed, and then, by slitting using a razor blade 105, both ends in the width direction of the resin film precursor 106 being conveyed are continuously removed to obtain an unstretched resin film 107. The obtained resin film 107 is wound up to obtain a roll 108 . In the above-mentioned slitting process, the portion up to 2.0 cm from both ends in the width direction of the resin film precursor 106 was removed as an end portion, and the length in the width direction of the resin film precursor 106 was 25 cm. At this time, the width (2.0 cm) of the removed edge corresponds to 8% when the length (25 cm) in the width direction of the resin film precursor 106 is set to 100%. As a result of this slitting process, the length in the width direction of the obtained resin film 107 became 21 cm.

<樹脂膜之評價> (1)開縫加工性 藉由目視,觀察隨上述「樹脂膜之製造」中之開縫加工有無出現之膜破裂,按下述評價基準評價開縫加工性。 [評價基準] 〇:未出現膜斷裂(破裂),連續地獲得樹脂膜 ×:出現膜斷裂(破裂),未連續地獲得樹脂膜<Evaluation of resin film> (1) Slitting workability The presence or absence of film breakage accompanying the slitting process in the above-mentioned "manufacturing of resin film" was visually observed, and slitting processability was evaluated according to the following evaluation criteria. [Evaluation Criteria] ○: No film breakage (rupture) occurred, and a resin film was continuously obtained ×: Film breakage (crack) occurred, and a resin film was not continuously obtained

(2)中央部及端部之厚度 針對上述「樹脂膜之製造」中所獲得之長條狀之樹脂膜(開縫加工前之樹脂膜前驅物及開縫加工後之樹脂膜之各者),藉由微計測器式厚度計(Mitutoyo公司製造)測定寬度方向中央部之厚度、寬度方向端部之厚度、及該等之厚度之差。又,對於開縫加工後之樹脂膜之平均厚度,亦藉由上述微計測器式厚度計測定。將結果示於表1。 此處,所謂「寬度方向中央部之厚度」(表1中簡稱為「中央部」之厚度),係於樹脂膜可穩定製造之階段沿長度方向切取25 cm,再於切取之樹脂膜之寬度方向中央部分以與長度方向平行之方式進行切取而獲得切片,沿長度方向以5 cm為間隔測定該切片之5處厚度而求得的平均值。於實施例1中,於以3 m/min製造20分鐘之後,切取測定用膜。 又,所謂「寬度方向端部之厚度」(表1中簡稱為「端部」之厚度),係與上述「寬度方向中央部之厚度」之測定用膜同樣,於樹脂膜可穩定製造之階段沿長度方向切取25 cm,沿長度方向以5 cm為間隔測定距離切取之樹脂膜之寬度方向之末端於寬度方向上為5 mm的部位之5處厚度而求得的平均值。於實施例1中,使用「寬度方向中央部之厚度」之測定中所使用之測定用膜進行測定。再者,於上述平均值於切取之樹脂膜之寬度方向之兩末端處不同之情形時,採用相對於上述「寬度方向中央部之厚度」之差更大之一端之平均值。 厚度之差(寬度方向端部之厚度相對於寬度方向中央部之厚度之差)藉由厚度之差[%]=((寬度方向端部之厚度-寬度方向中央部之厚度)/寬度方向中央部之厚度)×100之式而算出。 進而,所謂開縫加工後之「樹脂膜之平均厚度」,係表示將樹脂膜沿寬度方向均等地分割為6個區域,測定各區域之5處之厚度而獲得之共30處厚度的平均值。 再者,於上述厚度之說明中,亦將開縫加工前之「樹脂膜前驅物」簡稱為「樹脂膜」。(2) Thickness of central part and end part The elongated resin film (the resin film precursor before slitting and the resin film after slitting) obtained in the above-mentioned "manufacturing of resin film" was measured by a micrometer-type thickness gauge ( Mitutoyo Co., Ltd.) measured the thickness of the center part of the width direction, the thickness of the edge part of the width direction, and the difference of these thicknesses. In addition, the average thickness of the resin film after slit processing was also measured by the said micrometer type thickness meter. The results are shown in Table 1. Here, the so-called "thickness of the central part in the width direction" (abbreviated as "the thickness of the central part" in Table 1) means that 25 cm is cut along the length direction at the stage when the resin film can be stably produced, and then the width of the cut resin film is The central part of the direction was cut parallel to the longitudinal direction to obtain a slice, and the average value was obtained by measuring the thickness of the slice at 5 cm intervals in the longitudinal direction. In Example 1, the film for measurement was cut out after 20 minutes of production at 3 m/min. In addition, the so-called "thickness at the end in the width direction" (abbreviated as "the thickness at the end" in Table 1) is the same as the film for measurement of the "thickness at the center in the width direction" described above, at the stage where the resin film can be stably produced 25 cm were cut in the longitudinal direction, and the average value was obtained by measuring the thickness of 5 locations in the width direction from the end of the cut resin film in the width direction at 5 cm intervals along the longitudinal direction. In Example 1, the measurement was performed using the film for measurement used for the measurement of "the thickness of the central part in the width direction". In addition, when the said average value differs in the both ends of the width direction of the resin film cut out, the average value of the end with the larger difference with respect to the said "thickness of the width direction center part" is used. The difference in thickness (the difference between the thickness at the end in the width direction and the thickness at the center in the width direction) is calculated by the difference in thickness [%]=((the thickness at the end in the width direction - the thickness at the center in the width direction)/the center in the width direction part thickness) × 100 formula. Furthermore, the "average thickness of the resin film" after the slitting process refers to the average thickness of a total of 30 thicknesses obtained by dividing the resin film into 6 regions equally in the width direction and measuring the thickness of 5 regions in each region. . In addition, in the description of the above-mentioned thickness, the "resin film precursor" before slitting is also abbreviated as "resin film".

<纖維強化樹脂基材之製造> 圖6係對本發明之一態樣之纖維強化樹脂基材之製造方法的一例進行說明之模式圖。 如圖6所示,於上述「樹脂膜之製造」中所獲得之樹脂膜107之雙面重疊藉由空氣流開纖之粗紗狀碳纖維(三菱Chemical公司製造之「TRH50-30M」)109而形成纖維強化樹脂基材前驅物,並於該纖維強化樹脂基材前驅物之雙面重疊離型片材(聚四氟乙烯之片材)110。對於如此形成者(輥搬送物),藉由設定為270℃之一對加熱輥111進行加熱及加壓,使樹脂膜107之樹脂(S)連續地含浸於碳纖維中,其次,藉由設定為100℃之一對冷卻輥112進行冷卻,其次,剝離雙面之離型片材110,而獲得纖維強化樹脂基材113。進而,將纖維強化樹脂基材113以10 m/min之速度捲取,而獲得捲筒114。以上之「纖維強化樹脂基材之製造」之一連串步驟係連續實施,上述捲取速度與輥搬送速度相等。 所獲得之纖維強化樹脂基材包含作為沿一個方向(輥搬送方向)配向之形態之碳纖維、及含浸於上述碳纖維中之樹脂(S),碳纖維之體積含量(Vf)為50%,厚度為100 μm。此處,纖維強化樹脂基材包含上述碳纖維作為連續纖維。<Manufacture of fiber-reinforced resin base material> FIG. 6 is a schematic diagram illustrating an example of a method for producing a fiber-reinforced resin substrate according to an aspect of the present invention. As shown in FIG. 6 , the double-sided overlapping of the resin film 107 obtained in the above-mentioned “manufacturing of the resin film” is formed by roving carbon fiber (“TRH50-30M” manufactured by Mitsubishi Chemical Corporation) 109 opened by air flow. A fiber-reinforced resin base material precursor, and a release sheet (polytetrafluoroethylene sheet) 110 is overlapped on both sides of the fiber-reinforced resin base material precursor. For the thus formed (roll conveyed), the heating roller 111 is heated and pressurized by setting one of 270° C., so that the resin (S) of the resin film 107 is continuously impregnated in the carbon fibers, and secondly, by setting the The cooling roll 112 was cooled at 100° C., and then the release sheet 110 on both sides was peeled off to obtain a fiber-reinforced resin base material 113 . Further, the fiber-reinforced resin base material 113 was wound up at a speed of 10 m/min to obtain a roll 114 . One of the series of steps of the above "fabrication of fiber-reinforced resin base material" is carried out continuously, and the above-mentioned winding speed is equal to the roller conveying speed. The obtained fiber-reinforced resin base material contains carbon fibers oriented in one direction (roll conveyance direction), and resin (S) impregnated in the carbon fibers, the volume content (Vf) of the carbon fibers is 50%, and the thickness is 100%. μm. Here, the fiber-reinforced resin base material contains the above-mentioned carbon fibers as continuous fibers.

<纖維強化樹脂基材之評價> (1)含浸性 針對上述「纖維強化樹脂基材之製造」中所獲得之纖維強化樹脂基材,藉由水浸漬法評價含浸性。具體而言,將纖維強化樹脂基材裁剪為5 cm見方,浸漬於200 ml之水(離子交換水)中,放置24小時後,取出纖維強化樹脂基材。藉由目視觀察取出纖維強化樹脂基材之後之水,按下述評價基準評價含浸性。 [評價基準] 〇:水中不存在碳纖維 ×:水中存在碳纖維<Evaluation of Fiber Reinforced Resin Base Materials> (1) Impregnation With respect to the fiber-reinforced resin base material obtained in the above-mentioned "Manufacture of fiber-reinforced resin base material", the impregnation property was evaluated by the water immersion method. Specifically, the fiber-reinforced resin substrate was cut into a 5 cm square, immersed in 200 ml of water (ion-exchanged water), and left to stand for 24 hours, and then the fiber-reinforced resin substrate was taken out. The water after taking out the fiber-reinforced resin substrate was visually observed, and the impregnation property was evaluated according to the following evaluation criteria. [Evaluation Criteria] 〇: Carbon fiber does not exist in water ×: Carbon fibers are present in water

<積層體之製造> 將於上述「纖維強化樹脂基材之製造」中獲得之纖維強化樹脂基材切下10 cm×10 cm,使纖維之方向均沿著一個方向重疊20片而形成積層體前驅物。藉由真空衝壓機,於真空度為-0.1 MPa以下、330℃之條件下,於衝壓壓力為0 MPa時進行20分鐘、為5 MPa時進行10分鐘、為15 MPa時進行28分鐘、為60 MPa時進行2分鐘之條件下,沿積層方向階段性地對該積層體前驅物進行加壓成形,其後返回至大氣壓,冷卻至20℃,而獲得積層體。所獲得之積層體之厚度為2.0 mm。<Manufacture of laminated body> The fiber-reinforced resin base material obtained in the above-mentioned "manufacturing of fiber-reinforced resin base material" was cut out to 10 cm×10 cm, and 20 sheets were superimposed along one direction to form a laminate precursor. With a vacuum press, under the conditions of vacuum degree below -0.1 MPa and 330°C, the pressing pressure is 0 MPa for 20 minutes, 5 MPa for 10 minutes, 15 MPa for 28 minutes, and 60 The layered body precursor was press-molded stepwise along the layering direction under the condition of 2 minutes at MPa, then returned to atmospheric pressure, and cooled to 20° C. to obtain a layered body. The thickness of the obtained laminate was 2.0 mm.

<積層體之評價(彎曲特性)> 使用金剛石切割器,將於上述「積層體之製造」中獲得之積層體以纖維方向之長度為10 cm、寬度為1 cm之方式切下,進行退火(於120℃下乾燥12小時),而製成試驗片。對於該試驗片,依據ISO 178:2010測定彎曲特性。具體而言,將試驗片置於沿該試驗片中之纖維配向方向空出間隔地配置之一對支持樑上,藉由壓頭從試驗片之中央部上方向下方施加力。於溫度為23℃、壓頭之半徑為5 mm、支點(支持樑)間距離為6 cm、試驗速度為3 mm/min之條件下,測定彎曲強度(MPa)及彈性率(GPa)作為彎曲特性。將結果示於表1。<Evaluation of Laminates (Bending Properties)> Using a diamond cutter, the laminated body obtained in the above-mentioned "manufacturing of laminated body" was cut so that the length in the fiber direction was 10 cm and the width was 1 cm, followed by annealing (drying at 120°C for 12 hours), and A test piece was prepared. For this test piece, the bending properties were measured in accordance with ISO 178:2010. Specifically, the test piece was placed on a pair of support beams arranged at intervals along the fiber alignment direction in the test piece, and a force was applied from the upper to the lower side of the central portion of the test piece by the indenter. Under the conditions that the temperature is 23°C, the radius of the indenter is 5 mm, the distance between the fulcrums (support beams) is 6 cm, and the test speed is 3 mm/min, the bending strength (MPa) and the elastic modulus (GPa) are measured as the bending strength. characteristic. The results are shown in Table 1.

<複合體之製造> 圖7係用以對本發明之一態樣之複合體之製造方法的一例進行說明之模式圖。 如圖7(a)所示,將於上述「纖維強化樹脂基材之製造」中獲得之纖維強化樹脂基材113(預先以沿纖維配向方向α之長度為6 cm、寬度為1 cm之方式切下;厚度為100 μm)插入至設定為160℃之模具(內部尺寸:長度為6 cm、寬度為1 cm、厚度為1 mm)115內。其次,如圖7(b)所示,將於上述「樹脂之製備」中獲得之樹脂(S)於320℃加熱熔融,以50 MPa之射出壓於模具115內射出成形。其次,如圖7(c)所示,使模具115於50 MPa下保壓15秒鐘,使射出成形體(樹脂(S))116固化。其次,卸除模具115,如圖7(d)所示,獲得複合體117。複合體117包含作為纖維強化樹脂基材113之第1構件(厚度為100 μm)、及作為與該纖維強化樹脂基材113一體化之射出成形體116之第2構件(厚度為900 μm)。<Manufacture of complexes> FIG. 7 is a schematic diagram for explaining an example of a method for producing a composite of one aspect of the present invention. As shown in FIG. 7( a ), the fiber-reinforced resin substrate 113 obtained in the above-mentioned “Manufacture of Fiber-Reinforced Resin Substrate” (preliminarily in such a way that the length along the fiber orientation direction α is 6 cm and the width is 1 cm) Cut out; thickness 100 μm) and inserted into a mold (internal dimensions: length 6 cm, width 1 cm, thickness 1 mm) 115 set at 160°C. Next, as shown in FIG. 7( b ), the resin (S) obtained in the above-mentioned “preparation of resin” is heated and melted at 320° C., and injected into the mold 115 with an injection pressure of 50 MPa. Next, as shown in FIG. 7( c ), the pressure of the mold 115 is kept at 50 MPa for 15 seconds, and the injection molded body (resin (S)) 116 is cured. Next, the mold 115 is removed, and as shown in FIG. 7( d ), a composite body 117 is obtained. The composite 117 includes a first member (thickness: 100 μm) as the fiber-reinforced resin base material 113 , and a second member (thickness: 900 μm) as an injection-molded body 116 integrated with the fiber-reinforced resin base material 113 .

<複合體之評價(彎曲特性)> 針對上述「複合體之製造」中所獲得之複合體,依據ISO 178:2010測定彎曲特性。具體而言,如作為用以對複合體之彎曲特性之試驗方法進行說明之模式圖的圖8所示,於使該複合體117中之纖維強化樹脂基材113側朝向下方之狀態下,將複合體117置於沿纖維強化樹脂基材113之纖維配向方向α空出間隔地配置之一對支持樑118上,藉由壓頭(省略圖示)從複合體117之中央部上方向下方施加力(以白箭頭表示力之方向)。於溫度為23℃、壓頭之半徑為5 mm、支點(支持樑118)間距離為3 cm、試驗速度為2 mm/min之條件下,測定彎曲強度(MPa)、彈性率(GPa)及應變(%)作為彎曲特性。 將複合體之彎曲特性、及相對於單個樹脂(複合體中省略了纖維強化樹脂基材者)之彎曲特性之提高率(將單個樹脂之彎曲特性設為100%之情形時之相對值)示於表1。<Evaluation of Composites (Bending Properties)> The flexural properties of the composite obtained in the above-mentioned "Production of the composite" were measured in accordance with ISO 178:2010. Specifically, as shown in FIG. 8 which is a schematic diagram for explaining the test method of the bending characteristics of the composite body, in the state where the fiber-reinforced resin base material 113 side in the composite body 117 faces downward, the The composite body 117 is placed on one pair of support beams 118 arranged at intervals along the fiber orientation direction α of the fiber-reinforced resin base material 113, and is applied from the upper to the downward direction of the central portion of the composite body 117 by an indenter (not shown). Force (the direction of the force is indicated by a white arrow). Under the conditions that the temperature is 23°C, the radius of the indenter is 5 mm, the distance between the fulcrums (support beam 118) is 3 cm, and the test speed is 2 mm/min, the bending strength (MPa), elastic modulus (GPa) and Strain (%) as bending characteristic. The flexural properties of the composite and the rate of improvement of the flexural properties with respect to the individual resins (in which the fiber-reinforced resin base material is omitted in the composite) (relative values when the flexural properties of the individual resins are set to 100%) are shown. in Table 1.

(實施例2) 除了使用樹脂A-2(對排聚苯乙烯樹脂,外消旋五元組:98莫耳%;MFR:9 g/10 min;熔點:270℃)代替實施例1中之樹脂A-1以外,與實施例1同樣地進行試驗、評價。將結果示於表1。(Example 2) Except using resin A-2 (para-row polystyrene resin, racemic pentad: 98 mole %; MFR: 9 g/10 min; melting point: 270°C) instead of resin A-1 in Example 1 , and the test and evaluation were carried out in the same manner as in Example 1. The results are shown in Table 1.

(比較例1) 除了省略實施例1中之樹脂B-1之調配以外,與實施例1同樣地進行試驗、評價。再者,於比較例1中,由於隨開縫加工出現破裂而未獲得樹脂膜,因此省略了纖維強化樹脂基材、積層體及複合體之試驗及評價。將結果示於表1。(Comparative Example 1) The test and evaluation were carried out in the same manner as in Example 1, except that the preparation of the resin B-1 in Example 1 was omitted. In addition, in the comparative example 1, since the resin film was not obtained by cracking with the slitting process, the test and evaluation of the fiber-reinforced resin base material, the laminate, and the composite were omitted. The results are shown in Table 1.

(比較例2) 除了省略實施例2中之樹脂B-1之調配以外,與實施例1同樣地進行試驗、評價。再者,於比較例2中,由於隨開縫加工出現破裂而未獲得樹脂膜,因此省略了纖維強化樹脂基材、積層體及複合體之試驗及評價。將結果示於表1。(Comparative Example 2) The test and evaluation were carried out in the same manner as in Example 1, except that the preparation of the resin B-1 in Example 2 was omitted. In addition, in the comparative example 2, since the resin film was not obtained by cracking with the slitting process, the test and evaluation of the fiber-reinforced resin base material, the laminate, and the composite were omitted. The results are shown in Table 1.

(比較例3) 除了使用樹脂A-3(對排聚苯乙烯樹脂,外消旋五元組:98莫耳%;MFR:4 g/10 min;熔點:270℃)代替實施例1中之樹脂A-1,省略了實施例1中之樹脂B-1之調配以外,與實施例1同樣地進行試驗、評價。將結果示於表1。(Comparative Example 3) Except using resin A-3 (para-row polystyrene resin, racemic pentad: 98 mole %; MFR: 4 g/10 min; melting point: 270°C) instead of resin A-1 in Example 1, The test and evaluation were carried out in the same manner as in Example 1, except that the preparation of the resin B-1 in Example 1 was omitted. The results are shown in Table 1.

(實施例3) 除了以成為表1所示之纖維含量之方式使用粗紗狀玻璃纖維(日東紡績公司製造之「RS24QR」)代替實施例1中之粗紗狀碳纖維以外,與實施例1同樣地進行試驗、評價。將結果示於表1。(Example 3) Tests and evaluations were carried out in the same manner as in Example 1, except that roving glass fibers (“RS24QR” manufactured by Nittobo Industries, Ltd.) were used in place of the roving carbon fibers in Example 1 so that the fiber content shown in Table 1 was obtained. The results are shown in Table 1.

[表1]    實施例1 實施例2 比較例1 比較例2 比較例3 實施例3 樹脂 A-1[質量份] 100 - 100 - - 100 A-2[質量份] - 100 - 100 - - A-3[質量份] - - - - 100 - B-1[質量份] 18 18 - - - 18 樹脂膜之評價 開縫加工前(樹脂膜前驅物)之厚度 中央部[μm] 50 50 50 50 50 50 端部[μm] 189 193 186 188 206 193 厚度之差[%] 278 286 272 276 312 286 開縫加工性 × × 開縫加工後之厚度 中央部[μm] 50 50 - - 50 50 端部[μm] 51 51 - - 53 51 厚度之差[%] 2.0 2.0 - - 6.0 2.0 平均厚度[μm] 50 50 - - 50 50 纖維強化樹脂基材 纖維種類 CF CF - - CF GF 纖維含量[vol%] 50 50 - - 50 51 纖維強化樹脂基材之評價 含浸性 - - × 積層體之評價 (彎曲特性) 強度[MPa] 100 100 - - 80 40 彈性率[GPa] 1760 1770 - - 780 1070 複合體之評價 (彎曲特性) 強度[MPa] (提高率[%]) 10.4 (270) 10.5 (273) - - 4.2 (110) 7.9 (210) 彈性率[GPa] (提高率[%]) 200 (250) 200 (250) - - 95 (119) 170 (210) 應變[%] (提高率[%]) 3.5 (160) 3.6 (165) - - 2.2 (100) 3.9 (180) [Table 1] Example 1 Example 2 Comparative Example 1 Comparative Example 2 Comparative Example 3 Example 3 resin A-1 [mass part] 100 - 100 - - 100 A-2 [mass parts] - 100 - 100 - - A-3 [mass part] - - - - 100 - B-1 [mass part] 18 18 - - - 18 Evaluation of resin films Thickness before slitting (resin film precursor) Central part [μm] 50 50 50 50 50 50 end [μm] 189 193 186 188 206 193 Thickness difference [%] 278 286 272 276 312 286 Slitting workability × × Thickness after slitting Central part [μm] 50 50 - - 50 50 end [μm] 51 51 - - 53 51 Thickness difference [%] 2.0 2.0 - - 6.0 2.0 Average thickness [μm] 50 50 - - 50 50 Fiber Reinforced Resin Base fiber type CF CF - - CF GF Fiber content [vol%] 50 50 - - 50 51 Evaluation of Fiber Reinforced Resin Substrates Impregnation - - × Evaluation of Laminates (Bending Properties) Strength [MPa] 100 100 - - 80 40 Elastic modulus [GPa] 1760 1770 - - 780 1070 Evaluation of composites (flexural properties) Strength [MPa] (Increase rate [%]) 10.4 (270) 10.5 (273) - - 4.2 (110) 7.9 (210) Elasticity rate [GPa] (increase rate [%]) 200 (250) 200 (250) - - 95 (119) 170 (210) Strain [%] (Increase rate [%]) 3.5 (160) 3.6 (165) - - 2.2 (100) 3.9 (180)

上文已對若干本發明之實施方式及/或實施例進行了詳細說明,但業者容易於不實質偏離本發明之新穎之教導及效果之情況下,對作為該等例示之實施方式及/或實施例進行多種變更。因此,該等多種變更亦包含於本發明之範圍內。 引用了該說明書中記載之文獻、及本申請案之成為巴黎公約優先權之基礎之申請案的內容全部。Several embodiments and/or examples of the present invention have been described in detail above, but it is easy for the artisan to describe such illustrative embodiments and/or examples without materially departing from the novel teachings and effects of the present invention. The examples are subject to various modifications. Therefore, these various modifications are also included within the scope of the present invention. The entire contents of the documents described in this specification and the application on which priority under the Paris Convention of the present application is based are cited.

1:引擎蓋 2:車頂 3:車門框支柱 4:座椅靠背 5:頭枕支架 6:引擎零件 7:衝撞盒 8:前地板通道 9:前地板 10:底蓋 11:底部支撐桿 12:防撞樑 13:擋泥板支架 14:前罩 15:前引擎蓋 16:前橫向連接桿 17:變速箱中央管道 18:散熱器芯子支架 19:駕駛室前壁 20:前門內板 21:後行李箱後板 22:後行李箱側板 23:後行李箱地板 24:後行李箱擱板 25:電力電子單元 26:急速充電用插頭 27:車載充電器 28:鋰離子電池 29:電池控制單元 30:電力電子/控制單元 31:三相同步電動機 32:家庭充電用插頭 33:太陽能暮光感測器 34:交流發電機 35:EDU 36:電子節流閥 37:滾流控制閥 38:節流閥位置感測器 39:散熱器風扇控制器 40:棒狀線圈 41:A/C管接頭 42:柴油機微粒子捕獲過濾器 43:頭燈反射板 44:增壓空氣管道 45:增壓空氣冷卻頭 46:進氣溫度感測器 47:汽油燃料壓力感測器 48:凸輪/曲軸位置感測器 49:組合閥 50:機油壓力感測器 51:變速箱齒輪角度感測器 52:無段變速機油壓感測器 53:ELCM泵 54:水泵葉輪 55:轉向桿連接器 56:ECU連接器 57:ABS貯液器活塞 58:致動器蓋 59:大氣壓感測器 60:增壓壓力感測器 61:大氣壓感測器 62:加速度感測器 63:表壓力感測器 64:箱內壓力感測器 65:冷媒壓力感測器 66:線圈驅動 67:EGR閥感測器 68:氣流感測器 69:進氣管壓力感測器 70:油盤 71:散熱器蓋 72:進氣歧管 101:成膜機 102:輥 103:輥 104:輥 105:剃刀刃 106:樹脂膜前驅物 107:樹脂膜 108:捲筒 109:粗紗狀碳纖維 110:離型片材 111:加熱輥 112:冷卻輥 113:纖維強化樹脂基材 114:捲筒 115:模具 116:射出成形體 117:複合體 118:支持樑 X:物品 α:纖維配向方向1: Hood 2: roof 3: door frame pillars 4: Seat back 5: Headrest bracket 6: Engine parts 7: Crash box 8: Front floor access 9: Front Floor 10: Bottom cover 11: Bottom support rod 12: Anti-collision beam 13: Fender bracket 14: Front cover 15: Front hood 16: Front transverse connecting rod 17: Transmission central pipe 18: Radiator core bracket 19: The front wall of the cab 20: Front door inner panel 21: Rear trunk rear panel 22: Rear trunk side panel 23: Rear trunk floor 24: Rear trunk shelf 25: Power Electronics Unit 26: Plug for fast charging 27: Car Charger 28: Lithium-ion battery 29: Battery Control Unit 30: Power Electronics/Control Unit 31: Three-phase synchronous motor 32: Plug for home charging 33: Solar Twilight Sensor 34: Alternator 35: EDU 36: Electronic throttle valve 37: Tumble flow control valve 38: Throttle valve position sensor 39: Radiator fan controller 40: Rod coil 41: A/C pipe joint 42: Diesel Particulate Capture Filter 43: Headlight reflector 44: Charge air duct 45: Charge air cooling head 46: Intake air temperature sensor 47: Gasoline fuel pressure sensor 48: Cam/Crankshaft Position Sensor 49: Combination valve 50: Oil pressure sensor 51: Gearbox gear angle sensor 52: CVT oil pressure sensor 53: ELCM Pump 54: Water pump impeller 55: Steering rod connector 56: ECU connector 57: ABS reservoir piston 58: Actuator Cover 59: Atmospheric pressure sensor 60: Boost pressure sensor 61: Atmospheric pressure sensor 62: Accelerometer 63: Gauge pressure sensor 64: In-box pressure sensor 65: Refrigerant pressure sensor 66: Coil Drive 67: EGR valve sensor 68: Air flow sensor 69: Intake pipe pressure sensor 70: Oil pan 71: Radiator cover 72: Intake manifold 101: Film forming machine 102: Roller 103: Roller 104: Roller 105: Razor Blade 106: Resin film precursor 107: Resin film 108: Reel 109: Roving carbon fiber 110: Release sheet 111: Heating roller 112: cooling roll 113: Fiber-reinforced resin substrate 114: Reel 115: Mold 116: Injection molding 117: Complex 118: Support beam X:Item α: fiber orientation direction

圖1係對汽車零件進行說明之模式圖。 圖2係對汽車零件進行說明之模式圖。 圖3係對汽車零件進行說明之模式圖。 圖4係對汽車零件進行說明之模式圖。 圖5係對本發明之一態樣之樹脂膜之製造方法的一例進行說明之模式圖。 圖6係對本發明之一態樣之纖維強化樹脂基材之製造方法的一例進行說明之模式圖。 圖7(a)~(d)係用以對本發明之一態樣之複合體之製造方法的一例進行說明之模式圖。 圖8係用以對複合體之彎曲特性之試驗方法進行說明之模式圖。FIG. 1 is a schematic diagram illustrating an automobile part. FIG. 2 is a schematic diagram illustrating an automobile part. FIG. 3 is a schematic diagram illustrating an automobile part. FIG. 4 is a schematic diagram illustrating an automobile part. FIG. 5 is a schematic diagram illustrating an example of a method for producing a resin film according to an aspect of the present invention. FIG. 6 is a schematic diagram illustrating an example of a method for producing a fiber-reinforced resin substrate according to an aspect of the present invention. FIGS. 7( a ) to ( d ) are schematic views for explaining an example of a method for producing a composite of one aspect of the present invention. Fig. 8 is a schematic diagram for explaining the test method of the bending properties of the composite body.

Claims (25)

一種樹脂膜,其用以製造纖維強化樹脂基材, 上述樹脂膜係無延伸膜且包含樹脂(S),該樹脂(S)包含對排聚苯乙烯樹脂(A)、及經官能基改性之聚伸芳基醚樹脂(B)。A resin film used to manufacture a fiber-reinforced resin substrate, The above-mentioned resin film is a non-stretched film and contains a resin (S), and the resin (S) contains a para-polystyrene resin (A) and a functional group-modified polyarylene ether resin (B). 如請求項1之樹脂膜,其平均厚度為10 μm以上且未達100 μm。The resin film of claim 1 has an average thickness of 10 μm or more and less than 100 μm. 如請求項1之樹脂膜,其中上述對排聚苯乙烯樹脂(A)之MFR為5~30 g/10 min。The resin film of claim 1, wherein the MFR of the above-mentioned opposite-row polystyrene resin (A) is 5-30 g/10 min. 如請求項1之樹脂膜,其中相對於上述對排聚苯乙烯樹脂(A)100質量份,包含上述經官能基改性之聚伸芳基醚樹脂(B)1~30質量份。The resin film according to claim 1, comprising 1 to 30 parts by mass of the above-mentioned functional group-modified polyarylene ether resin (B) relative to 100 parts by mass of the above-mentioned opposite-row polystyrene resin (A). 如請求項1之樹脂膜,其係長條狀,寬度方向端部之厚度相對於寬度方向中央部之厚度之差處於-10%~10%之範圍內。The resin film of claim 1 is in the shape of a long strip, and the difference between the thickness of the end portion in the width direction and the thickness of the central portion in the width direction is in the range of -10% to 10%. 一種樹脂膜之製造方法,其用以製造如請求項1至5中任一項之樹脂膜,其包括: 藉由開縫加工去除包含樹脂(S)之無延伸之樹脂膜前驅物之端部,而獲得上述樹脂膜,上述樹脂(S)包含對排聚苯乙烯樹脂(A)、及經官能基改性之聚伸芳基醚樹脂(B)。A method for producing a resin film, which is used to produce the resin film as claimed in any one of claims 1 to 5, comprising: The above-mentioned resin film is obtained by removing the end portion of the non-extended resin film precursor comprising the resin (S), which comprises the opposite row polystyrene resin (A), and the functional group-modified resin film is obtained by slitting. Properties of poly(arylene ether) resin (B). 請求項6之樹脂膜之製造方法,其藉由開縫加工去除長條狀之上述樹脂膜前驅物之寬度方向之兩端部。The manufacturing method of the resin film of Claim 6 which removes the both ends of the width direction of the said resin film precursor of elongate shape by slitting. 如請求項6之樹脂膜之製造方法,其將長條狀之上述樹脂膜前驅物進行輥搬送,並藉由開縫加工連續地去除該樹脂膜前驅物之寬度方向之兩端部。The manufacturing method of the resin film of Claim 6 which rolls the said resin film precursor of elongate shape, and removes the both ends of the width direction of this resin film precursor continuously by slit processing. 一種纖維強化樹脂基材,其包含纖維、及含浸於上述纖維中之樹脂(S); 上述樹脂(S)包含對排聚苯乙烯樹脂(A)、及經官能基改性之聚伸芳基醚樹脂(B)。A fiber-reinforced resin substrate comprising fibers and resin (S) impregnated in the fibers; The above-mentioned resin (S) includes a para-row polystyrene resin (A) and a functional group-modified polyarylene ether resin (B). 如請求項9之纖維強化樹脂基材,其中上述纖維選自由碳纖維及玻璃纖維所組成之群中之1種以上。The fiber-reinforced resin substrate according to claim 9, wherein the fibers are at least one selected from the group consisting of carbon fibers and glass fibers. 如請求項9之纖維強化樹脂基材,其中上述纖維係織物、不織布或沿一個方向配向之形態。The fiber-reinforced resin substrate according to claim 9, wherein the fibers are woven, non-woven, or oriented in one direction. 如請求項9之纖維強化樹脂基材,其中上述纖維為連續纖維。The fiber-reinforced resin substrate according to claim 9, wherein the fibers are continuous fibers. 一種纖維強化樹脂基材之製造方法,其用以製造如請求項9至12中任一項之纖維強化樹脂基材,其包括: 第1步驟,其對纖維強化樹脂基材前驅物進行加熱,該纖維強化樹脂基材前驅物包含如請求項1至5中任一項之樹脂膜、及重疊於上述樹脂膜之纖維;以及 第2步驟,其使上述纖維強化樹脂基材前驅物冷卻,而獲得上述纖維強化樹脂基材。A method for manufacturing a fiber-reinforced resin base material, which is used to manufacture the fiber-reinforced resin base material as claimed in any one of claims 9 to 12, comprising: The first step is to heat a fiber-reinforced resin base material precursor, the fiber-reinforced resin base material precursor comprising the resin film according to any one of Claims 1 to 5, and fibers overlapping the resin film; and In the second step, the above-mentioned fiber-reinforced resin base material is obtained by cooling the above-mentioned fiber-reinforced resin base material precursor. 如請求項13之纖維強化樹脂基材之製造方法,其中於上述第1步驟中,以上述樹脂膜之熔點以上之溫度對上述纖維強化樹脂基材前驅物進行加熱。The method for producing a fiber-reinforced resin substrate according to claim 13, wherein in the first step, the fiber-reinforced resin substrate precursor is heated at a temperature equal to or higher than the melting point of the resin film. 如請求項13之纖維強化樹脂基材之製造方法,其中於上述第1步驟中,使用輥對上述纖維強化樹脂基材前驅物進行加熱。The method for producing a fiber-reinforced resin base material according to claim 13, wherein in the first step, the fiber-reinforced resin base material precursor is heated using a roll. 如請求項13之纖維強化樹脂基材之製造方法,其中於上述第1步驟中,使用輥對上述纖維強化樹脂基材前驅物進行加壓。The method for producing a fiber-reinforced resin base material according to claim 13, wherein in the first step, the fiber-reinforced resin base material precursor is pressurized with a roll. 如請求項13之纖維強化樹脂基材之製造方法,其中於上述第1步驟中,同時進行上述纖維強化樹脂基材前驅物之加熱及加壓。The method for producing a fiber-reinforced resin base material according to claim 13, wherein in the first step, the heating and pressurization of the fiber-reinforced resin base material precursor are simultaneously performed. 如請求項13之纖維強化樹脂基材之製造方法,其中於上述第2步驟中,以未達200℃之溫度使上述纖維強化樹脂基材前驅物冷卻。The method for producing a fiber-reinforced resin base material according to claim 13, wherein in the second step, the fiber-reinforced resin base material precursor is cooled at a temperature below 200°C. 如請求項13之纖維強化樹脂基材之製造方法,其中於上述第2步驟中,使用輥使上述纖維強化樹脂基材前驅物冷卻。The method for producing a fiber-reinforced resin base material according to claim 13, wherein in the second step, the fiber-reinforced resin base material precursor is cooled using a roll. 如請求項13之纖維強化樹脂基材之製造方法,其包括:第3步驟,其於上述第2步驟之後,以1~30 m/min之速度捲取上述纖維強化樹脂基材。The method for producing a fiber-reinforced resin substrate according to claim 13, comprising: a third step of winding up the fiber-reinforced resin substrate at a speed of 1 to 30 m/min after the second step. 如請求項20之纖維強化樹脂基材之製造方法,其中於選自由上述第1步驟、上述第2步驟及上述第3步驟所組成之群中之1個以上之步驟中,於上述纖維強化樹脂基材前驅物之單面或雙面重疊有離型片材。The method for producing a fiber-reinforced resin substrate according to claim 20, wherein in one or more steps selected from the group consisting of the first step, the second step, and the third step, the fiber-reinforced resin is A release sheet is overlapped on one or both sides of the substrate precursor. 一種積層體,其係由2個以上之如請求項9至12中任一項之纖維強化樹脂基材積層並一體化而成。A layered product obtained by layering and integrating two or more fiber-reinforced resin substrates according to any one of claims 9 to 12. 一種積層體之製造方法,其包括: 重疊2個以上之如請求項9至12中任一項之纖維強化樹脂基材而形成積層體前驅物;及 對上述積層體前驅物進行加壓成形,而獲得由2個以上之上述纖維強化樹脂基材積層並一體化而成之積層體。A method for manufacturing a laminate, comprising: Stacking two or more fiber-reinforced resin substrates as claimed in any one of claims 9 to 12 to form a laminate precursor; and The above-mentioned layered body precursor is press-molded to obtain a layered body in which two or more of the above-mentioned fiber-reinforced resin base materials are laminated and integrated. 一種複合體,其包含: 第1構件,其係如請求項9至12中任一項之纖維強化樹脂基材或如請求項22之積層體;以及 第2構件,其係與上述第1構件一體化之射出成形體。A complex comprising: The first member, which is the fiber-reinforced resin base material according to any one of claims 9 to 12 or the laminate according to claim 22; and The second member is an injection-molded body integrated with the first member. 一種複合體之製造方法,其包括:於將作為如請求項9至12中任一項之纖維強化樹脂基材或如請求項22之積層體的第1構件插入於模具中之狀態下射出成形,獲得包含上述第1構件、及作為與上述第1構件一體化之射出成形體之第2構件之複合體。A method of manufacturing a composite, comprising: injection molding in a state where a first member serving as the fiber-reinforced resin substrate according to any one of claims 9 to 12 or the laminate according to claim 22 is inserted into a mold , to obtain a composite including the first member and the second member as an injection-molded body integrated with the first member.
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