TW202147775A - Frequency filter - Google Patents
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- 239000000463 material Substances 0.000 claims abstract description 43
- 230000010287 polarization Effects 0.000 claims abstract description 40
- 238000003475 lamination Methods 0.000 claims abstract description 5
- 239000011810 insulating material Substances 0.000 claims description 10
- 238000001914 filtration Methods 0.000 abstract description 8
- 239000010409 thin film Substances 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 description 32
- 238000002474 experimental method Methods 0.000 description 15
- 238000004364 calculation method Methods 0.000 description 13
- 230000000694 effects Effects 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000001816 cooling Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 7
- 238000012986 modification Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- 238000001755 magnetron sputter deposition Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000010897 surface acoustic wave method Methods 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- 239000007789 gas Substances 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- NKZSPGSOXYXWQA-UHFFFAOYSA-N dioxido(oxo)titanium;lead(2+) Chemical compound [Pb+2].[O-][Ti]([O-])=O NKZSPGSOXYXWQA-UHFFFAOYSA-N 0.000 description 2
- 230000005684 electric field Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 229910052451 lead zirconate titanate Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052706 scandium Inorganic materials 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 239000011701 zinc Substances 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- HFGPZNIAWCZYJU-UHFFFAOYSA-N lead zirconate titanate Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ti+4].[Zr+4].[Pb+2] HFGPZNIAWCZYJU-UHFFFAOYSA-N 0.000 description 1
- SIXSYDAISGFNSX-UHFFFAOYSA-N scandium atom Chemical compound [Sc] SIXSYDAISGFNSX-UHFFFAOYSA-N 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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- H—ELECTRICITY
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- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/46—Filters
- H03H9/54—Filters comprising resonators of piezoelectric or electrostrictive material
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
- H10N30/01—Manufacture or treatment
- H10N30/04—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning
- H10N30/045—Treatments to modify a piezoelectric or electrostrictive property, e.g. polarisation characteristics, vibration characteristics or mode tuning by polarising
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10N30/00—Piezoelectric or electrostrictive devices
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Abstract
Description
本發明係關於一種於行動電話之基地台等使用之對高頻功率進行頻率濾波之頻率濾波器。此處「高頻功率」、及下述「高頻電壓」分別係指藉由接收電磁波而獲得之高頻訊號及/或發送電磁波時使用之高頻訊號之功率及電壓。典型而言,此種高頻功率及高頻電壓之頻率包含於50 MHz~30 GHz之範圍內。The present invention relates to a frequency filter for frequency filtering of high frequency power used in base stations of mobile phones and the like. Here, "high-frequency power" and the following "high-frequency voltage" refer to the power and voltage of the high-frequency signal obtained by receiving electromagnetic waves and/or the high-frequency signal used when transmitting electromagnetic waves, respectively. Typically, the frequency of such high frequency power and high frequency voltage is included in the range of 50 MHz to 30 GHz.
關於行動電話服務,於市內設置多個與行動電話之終端之間收發電波之基地台。於終端與基地台之任一者中,均從由天線接收之電磁波所包含之多個頻率中擷取特定頻率,產生具有該特定頻率之高頻功率。For mobile phone service, multiple base stations are installed in the city to send and receive radio waves to and from mobile phone terminals. In either of the terminal and the base station, a specific frequency is extracted from a plurality of frequencies included in the electromagnetic waves received by the antenna to generate high-frequency power having the specific frequency.
關於終端,以往藉由使由天線接收之具有多個頻率之電磁波通過高頻功率頻率濾波器而擷取具有特定頻率之高頻功率。作為此種針對高頻功率之頻率濾波器,可例舉以將1對梳形電極嚙合於壓電體薄膜之表面之方式設置之表面聲波(Surface Acoustic Wave:SAW)濾波器、於壓電體薄膜之兩面設置有1對電極之體聲波(Bulk Acoustic Wave:BAW)濾波器(例如參照專利文獻1)。 [先前技術文獻] [專利文獻]Regarding terminals, conventionally, high-frequency power having a specific frequency is extracted by passing electromagnetic waves having a plurality of frequencies received by an antenna through a high-frequency power frequency filter. As such a frequency filter for high-frequency power, a surface acoustic wave (SAW) filter provided in such a manner that a pair of comb-shaped electrodes are engaged with the surface of a piezoelectric thin film, a piezoelectric A pair of electrode bulk acoustic wave (BAW) filters are provided on both surfaces of the film (for example, refer to Patent Document 1). [Prior Art Literature] [Patent Literature]
[專利文獻1]日本特開2012-049758號公報 [專利文獻2]日本特開2020-072284號公報[Patent Document 1] Japanese Patent Laid-Open No. 2012-049758 [Patent Document 2] Japanese Patent Laid-Open No. 2020-072284
[發明所欲解決之課題][The problem to be solved by the invention]
SAW濾波器或BAW濾波器中,電極間之耐電壓性較低,無法進行必須於基地台所處理之對大功率之高頻功率之頻率濾波。因此,以往於行動電話之基地台使用空腔共振器進行頻率濾波。然而,相對於SAW濾波器或BAW濾波器可小型化至數mm見方之程度,空腔共振器具有數百mm見方之大小,而難以小型化。近年來,逐漸要求於成為建築物之背陰處之場所等來自大規模基地台之電磁波難以到達之城市部設置小型基地台,但若於此種小型基地台使用空腔共振器,則會產生以下問題,即,基地台之佔有空間變大,設置成本上升。In a SAW filter or a BAW filter, the withstand voltage between electrodes is low, and the frequency filtering of high-power high-frequency power that must be processed by the base station cannot be performed. Therefore, in the past, the base station of the mobile phone used a cavity resonator for frequency filtering. However, while the SAW filter or the BAW filter can be miniaturized to several millimeters square, the cavity resonator has a size of several hundreds of millimeters, and it is difficult to miniaturize it. In recent years, it has become increasingly required to install small base stations in urban areas where electromagnetic waves from large-scale base stations are difficult to reach, such as places that are shaded by buildings. However, if a cavity resonator is used in such a small base station, the following problems will occur. The problem is that the occupied space of the base station increases, and the installation cost increases.
本發明所欲解決之課題在於,提供一種頻率濾波器,其能夠小型化,使用壓電體薄膜,且可進行於行動電話之基地台所處理之對大功率之高頻功率之頻率濾波。 [解決課題之技術手段]The problem to be solved by the present invention is to provide a frequency filter which can be miniaturized, uses a piezoelectric thin film, and can perform frequency filtering of high-power high-frequency power processed by a base station of a mobile phone. [Technical means to solve the problem]
為解決上述課題而完成之本發明之頻率濾波器,具備: a)積層體,其係將第1層與第2層交替地逐層反覆並合計積層既定數量而成者,上述第1層係第1壓電材料製之壓電層,極化朝向既定之一方向,上述第2層係由第2壓電材料製且極化之與上述第1層垂直或平行之方向之分量朝向與上述第1層之極化中之上述方向之分量相差180°之方向之壓電層、或非壓電性之絕緣材料製之非壓電層所構成,使用上述第1層內之音速v1 與上述第2層內之音速v2 ,上述第1層之厚度d1 與上述第2層之厚度d2 處於0.5×(v2 /v1 )d1 ≦d2 ≦2.0×(v2 /v1 )d1 之範圍內;及 b)1對電極,其等以於積層方向夾著上述積層體之方式設置; 其特徵在於: 以具有對10 W之高頻功率之耐功率性之方式設定上述既定數量。The frequency filter of the present invention accomplished to solve the above-mentioned problems includes: a) a layered body formed by alternately repeating the first layer and the second layer layer by layer and adding a predetermined number of layers, wherein the first layer is The piezoelectric layer made of the first piezoelectric material is polarized in a predetermined direction, and the second layer is made of the second piezoelectric material and the component of the polarization in the direction perpendicular or parallel to the first layer is oriented in the same direction as the first layer. The polarization of the first layer is composed of a piezoelectric layer in a direction in which the components in the above-mentioned directions differ by 180°, or a non-piezoelectric layer made of a non-piezoelectric insulating material, using the speed of sound v 1 in the first layer and the The speed of sound v 2 in the second layer, the thickness d 1 of the first layer and the thickness d 2 of the second layer are 0.5×(v 2 /v 1 )d 1 ≦d 2 ≦2.0×(v 2 /v 1 ) within the range of d 1 ; and b) 1 pair of electrodes, which are arranged so as to sandwich the above-mentioned laminated body in the lamination direction; characterized in that: are set in such a way as to have power resistance to a high frequency power of 10 W the above-established quantities.
本發明之頻率濾波器中,若將包含多個頻率之高頻功率輸入至1對電極間,則於該等電極間產生包含該等頻率之高頻功率、高頻電壓。藉此,構成積層體之各層中之每隔1層設置之各第1層藉由壓電效應而於上述多個頻率中之由厚度d1 及音速v1 決定之特定之多個頻率下,於每一頻率以相同之相位振動。In the frequency filter of the present invention, if high-frequency power including multiple frequencies is input between a pair of electrodes, high-frequency power and high-frequency voltage including these frequencies are generated between the electrodes. In this way, each of the first layers arranged every other layer among the layers constituting the laminated body is caused by the piezoelectric effect at a plurality of specific frequencies determined by the thickness d 1 and the speed of sound v 1 among the above-mentioned plurality of frequencies, Vibrates with the same phase at each frequency.
另一方面,第2層於由壓電層所構成之情形及由非壓電層所構成之情形時,分別以如下方式振動。On the other hand, the second layer vibrates as follows in the case of being composed of the piezoelectric layer and the case of being composed of the non-piezoelectric layer, respectively.
於第2層由壓電層所構成之情形時,藉由壓電效應而於上述多個頻率中之由厚度d2 及音速v2 決定之特定之多個頻率下振動。此處,d2 具有(v2 /v1 )d1 或與其接近之(0.5~2.0倍之)值,藉此各第2層於上述特定之多個頻率(即,與第1層相同之頻率)下,於每一頻率以相同之相位振動。又,極化之與第1層垂直或平行之方向之分量朝向與第1層之極化中之上述方向之分量相差180°之方向,藉此關於第1層之振動方向,第2層之振動之相位成為與第1層相反之相位(相差180°)。其結果,第1層與第2層之振動相輔相成,於積層體整體,產生具有每1層成為半整數之多個波數、及與該等多個波數對應之上述特定之多個頻率之共振。When the second layer is composed of a piezoelectric layer, the piezoelectric effect vibrates at a plurality of specific frequencies determined by the thickness d 2 and the speed of sound v 2 among the above-mentioned plurality of frequencies. Here, d 2 has a value of (v 2 /v 1 ) d 1 or a value close to it (0.5 to 2.0 times), whereby each second layer operates at a plurality of frequencies specified above (that is, the same frequency as the first layer) frequency), vibrate with the same phase at each frequency. Also, the component of the polarization in the direction perpendicular or parallel to the first layer is oriented in a direction that differs by 180° from the component in the above-mentioned direction in the polarization of the first layer, whereby with respect to the vibration direction of the first layer, the The phase of vibration becomes the opposite phase to that of the first layer (180° difference). As a result, the vibrations of the first layer and the second layer complement each other, and the entire layered body generates a plurality of wave numbers each of which is a half-integer number and the above-mentioned specific plurality of frequencies corresponding to the plurality of wave numbers. resonance.
於第2層由非壓電層所構成之情形時,第2層雖未產生由壓電效應引起之振動,但受到來自第1層之振動,第2層於與第1層相同之特定之多個頻率下振動。d2 具有(v2 /v1 )d1 或與其接近之(0.5~2.0倍之)值,藉此具有第1層之頻率之振動滿足第2層之共振條件。其結果,與第2層由壓電層所構成之情形同樣地,於積層體整體,產生具有上述特定之多個頻率之共振,該上述特定之多個頻率與每1層成為半整數之多個波數對應。When the second layer is composed of a non-piezoelectric layer, although the second layer does not generate vibration caused by the piezoelectric effect, but receives vibration from the first layer, the second layer has the same specific characteristics as the first layer. Vibrates at multiple frequencies. d 2 has (v 2 /v 1 ) d 1 or a value close to it (0.5 to 2.0 times), whereby the vibration with the frequency of the first layer satisfies the resonance condition of the second layer. As a result, as in the case where the second layer is constituted by the piezoelectric layer, resonance having the above-mentioned specific plurality of frequencies is generated in the entire laminate, and the above-mentioned specific plurality of frequencies is as much as a half-integer per layer. corresponding wave number.
如上所述,於由壓電層所構成之情形及由非壓電層所構成之情形之任一情形時,當輸入具有多個頻率之高頻功率時,積層體均於該等多個頻率中之特定之多個頻率下共振。其結果,由於僅具有上述特定之多個頻率之高頻功率被放大,故本發明作為高頻功率之頻率濾波器發揮功能。As described above, in either the case of a piezoelectric layer or a non-piezoelectric layer, when a high-frequency power having a plurality of frequencies is input, the laminated body is at the plurality of frequencies. Resonates at a specified number of frequencies. As a result, only the high-frequency power having the above-mentioned specific plurality of frequencies is amplified, so that the present invention functions as a frequency filter of the high-frequency power.
本發明中,第1層與第2層合計之數量(上述既定數量)越多,則電極間之絕緣體(壓電體或不具有壓電性之絕緣體)變得越厚,故可對具有更大功率之高頻功率進行頻率濾波。於行動電話之領域中,發送之電磁波之輸出於終端最大達到1 W左右,相對於此,於基地台達到10~100 W(參照例如專利文獻2)。因此,本發明之頻率濾波器中,以頻率濾波器具有與電磁波之輸出相應之10 W(或其以上)之耐功率性之方式設定上述既定數量,即第1層與第2層合計之層數。使該層數越多,則耐功率性變得越高。又,進行濾波之頻率由每1層之厚度決定,故即使增加該層數亦無影響。In the present invention, the larger the total number of the first layer and the second layer (the above-mentioned predetermined number), the thicker the insulator (piezoelectric or non-piezoelectric insulator) between the electrodes becomes, so that the thickness of the insulator (piezoelectric or non-piezoelectric insulator) between the electrodes becomes thicker. High-power high-frequency power for frequency filtering. In the field of mobile phones, the output of electromagnetic waves to be transmitted is about 1 W at the maximum at the terminal, and 10 to 100 W at the base station (see, for example, Patent Document 2). Therefore, in the frequency filter of the present invention, the above-mentioned predetermined number, that is, the total layer of the first layer and the second layer, is set so that the frequency filter has a power resistance of 10 W (or more) corresponding to the output of electromagnetic waves. number. The higher the number of layers, the higher the power resistance. In addition, the frequency of filtering is determined by the thickness of each layer, so even if the number of layers is increased, it has no effect.
一般而言,耐功率性係考慮使用中之劣化,假定於固定期間持續輸入既定之功率之情形而決定。於將本發明之頻率濾波器針對行動電話之基地台使用之情形時,該既定期間設為至少3年。Generally speaking, the power resistance is determined by considering the deterioration during use and assuming that a predetermined power is continuously input for a fixed period. When the frequency filter of the present invention is used in a base station of a mobile phone, the predetermined period is set to at least 3 years.
對第2層之材料使用上述第2壓電材料之情形時,該第2壓電材料與上述第1壓電材料可為相同材料,亦可為不同材料。又,對第2層之材料使用上述非壓電性之絕緣材料之情形時,該絕緣材料可為由並非壓電體之絕緣性材料所構成之層,亦可為如下材料,該材料雖可產生壓電性但因極化於第2層內朝向隨機方向而不會於第2層整體中產生壓電性。When the second piezoelectric material is used as the material of the second layer, the second piezoelectric material and the first piezoelectric material may be the same material or different materials. In addition, when the above-mentioned non-piezoelectric insulating material is used as the material of the second layer, the insulating material may be a layer composed of an insulating material that is not a piezoelectric body, or may be the following material, although the material may be Piezoelectricity is generated, but piezoelectricity is not generated in the entire second layer because the polarization is oriented in random directions in the second layer.
於上述第2層由非壓電層所構成之情形時,與由壓電層所構成之情形不同,於製作時無須調整第1層211與第2層212之極化方向之關係,故可相較由壓電層所構成之情形更容易地製作。When the above-mentioned second layer is composed of a non-piezoelectric layer, different from the case of a piezoelectric layer, there is no need to adjust the relationship between the polarization directions of the
本發明之頻率濾波器,較佳為,進而於上述1對電極之一側具備聲布拉格反射器。聲布拉格反射器係將聲阻抗不同之2種層交替積層而成者。以產生具有積層體內所產生之振動之頻率的音波之布拉格反射之方式,預先決定聲布拉格反射器之各層之厚度,藉此可抑制積層體之振動能量洩漏至外部。Preferably, the frequency filter of the present invention further includes an acoustic Bragg reflector on one side of the pair of electrodes. Acoustic Bragg reflectors are formed by alternately laminating two types of layers with different acoustic impedances. By predetermining the thickness of each layer of the acoustic Bragg reflector so as to generate Bragg reflection of sound waves having the frequency of the vibration generated in the laminate, the leakage of the vibration energy of the laminate to the outside can be suppressed.
再者,不拘泥於行動電話之基地台之用途,對於其他用途,此前亦未知有具備將作為壓電層之第1層與由非壓電性之絕緣材料製之非壓電層所構成之第2層交替地逐層積層而成之積層體之頻率濾波器。藉由如此使用非壓電層作為第2層,於製作時無須以於第2層於既定之方向產生極化之方式進行控制,故可容易地製作積層體。於該情形時,即使耐功率性低於行動電話之基地台用之頻率濾波器所要求之耐功率性,亦可於其他用途方面用作頻率濾波器。綜合考慮該等方面,本發明之頻率濾波器之另一態樣之特徵在於,具備: a)積層體,其係將第1層與第2層交替地逐層反覆並合計積層既定數量而成者,上述第1層係第1壓電材料製之壓電層,極化朝向既定之一方向,上述第2層係由非壓電性之絕緣材料製之非壓電層所構成,使用上述第1層內之音速v1 與上述第2層內之音速v2 ,上述第1層之厚度d1 與上述第2層之厚度d2 處於0.5×(v2 /v1 )d1 ≦d2 ≦2.0×(v2 /v1 )d1 之範圍內;及 b)1對電極,其等以於積層方向夾著上述積層體之方式設置。此處,上述既定之1方向可設為任意方向。 [發明之效果]Furthermore, it is not limited to the application of the base station of the mobile phone, and for other applications, it has not been known until now that there is a first layer as a piezoelectric layer and a non-piezoelectric layer made of a non-piezoelectric insulating material. A frequency filter of a laminated body formed by alternately laminating the second layers one by one. By using the non-piezoelectric layer as the second layer in this way, it is not necessary to control so as to generate polarization in a predetermined direction in the second layer at the time of production, so that the laminated body can be easily produced. In this case, even if the power resistance is lower than that required for a frequency filter for a base station of a mobile phone, it can be used as a frequency filter for other purposes. Taking these aspects into consideration, another aspect of the frequency filter of the present invention is characterized by comprising: a) a laminated body, which is formed by alternately repeating the first layer and the second layer layer by layer and adding up a predetermined number of layers The first layer is a piezoelectric layer made of a first piezoelectric material, and the polarization is oriented in a predetermined direction, and the second layer is a non-piezoelectric layer made of a non-piezoelectric insulating material. The speed of sound v 1 in the first layer and the speed of sound v 2 in the second layer, the thickness d 1 of the first layer and the thickness d 2 of the second layer are 0.5×(v 2 /v 1 )d 1 ≦d 2 ≤ 2.0×(v 2 /v 1 )d 1 ; and b) 1 pair of electrodes, which are arranged so as to sandwich the above-mentioned laminate in the lamination direction. Here, the above-mentioned predetermined one direction may be set to any direction. [Effect of invention]
藉由本發明,可獲得一種頻率濾波器,其可進行於行動電話之基地台所處理之對大功率之高頻功率之頻率濾波且使用壓電體薄膜。By means of the present invention, a frequency filter can be obtained which can perform frequency filtering of high-frequency high-frequency power processed by a base station of a mobile phone and uses a piezoelectric thin film.
使用圖1~圖9,對本發明之行動電話之基地台用之頻率濾波器(以下,僅稱為「頻率濾波器」)之實施形態進行說明。An embodiment of a frequency filter (hereinafter, simply referred to as a "frequency filter") for a base station of a mobile phone according to the present invention will be described with reference to FIGS. 1 to 9 .
(1)第1實施形態之頻率濾波器
(1-1)第1實施形態之頻率濾波器之構成
圖1中示出第1實施形態之頻率濾波器10之構成。該頻率濾波器10具有將第1層111與第2層112交替地逐層反覆並合計積層既定數量而成之積層體11、以及以於積層體11之積層方向(圖1之上下方向)上夾著積層體11之方式設置之第1電極121及第2電極122。(1) Frequency filter of the first embodiment
(1-1) Configuration of the frequency filter of the first embodiment
FIG. 1 shows the configuration of the
第1層111係由壓電材料所構成。又,本實施形態中,第2層112亦由壓電材料所構成。將第1層111之壓電材料稱為第1壓電材料,將第2層112之壓電材料稱為第2壓電材料。第1壓電材料與第2壓電材料可為相同壓電材料,亦可為互不相同之壓電材料。對於第1壓電材料及第2壓電材料,可使用各種壓電材料,例如氧化鋅(ZnO)、氮化鋁(AlN)、將氮化鋁中之Al(鋁)之一部分置換為Sc(鈧)之AlScN(Al1-x
Scx
N,0<x<1)、於氧化鋅中摻雜有Mg或Ca之(Zn,Mg)O或(Zn,Ca)O、鈦酸鉛(PbTiO3
:PTO)、將鈦酸鉛中之Ti(鈦)之一部分置換為Zr(鋯)之鈦酸鋯酸鉛(PbTi1-x
Zrx
O3
:PZT)等。The
第1層111及第2層112分別具有朝向以下所述之方向之極化。The
第1層111之極化P1
之方向可與第1層111垂直,亦可與第1層111平行,進而亦可相對於第1層111傾斜(即,朝向既非平行亦非垂直之方向)。The polarization direction P 1 of the first layer 1111 may be perpendicular to the
關於第2層112之極化P2
之方向,該極化P2
之與第1層111及第2層112平行之分量(平行分量)P2//
成為與第1層111之極化P1
之平行分量P1//
相差180°之方向(參照圖2),或者極化P2
之與第1層111及第2層112垂直之分量(垂直分量)P2 ⊥
成為與第1層111之極化P1
之垂直分量P1 ⊥
相差180°之方向。再者,圖1及圖2中示出極化P1
及P2
均相對於第1層111及第2層112傾斜(既非平行亦非垂直)之例,但極化P1
及/或P2
可相對於第1層111及第2層112平行,極化P1
及/或P2
亦可相對於第1層111及第2層112垂直。Respect to the direction of polarization P 2 of the
第2層112之厚度d2
設為第1層111之厚度d1
之0.5×(v2
/v1
)倍~2.0×(v2
/v1
)d1
倍之範圍內。此處,v1
為第1層111內之音速,v2
為第2層112內之音速。於第1層111與第2層112由相同壓電材料所構成之情形時,通常v1
=v2
,故只要將d2
設為d1
之0.5倍~2.0倍即可,典型而言,只要將第1層111與第2層112設為相同厚度即可。 The thickness d 2 of the
第1層111及第2層112如上所述交替地逐層反覆並合計積層既定數量。該積層數越多,則耐功率性越高。因此,頻率濾波器10中,為了確保作為於行動電話之基地台使用之頻率濾波器之耐功率性,以具有將10~100 W之範圍內作為上限值之耐功率性之方式決定第1層111及第2層112之積層數。可藉由進行模擬或預備實驗而確認滿足此種耐功率性。The
為了充分確保10 W(或其以上)之耐功率性,積層體11之層數較理想為較多,但若過多則製造需要費時費力,故只要綜合考慮該等而適當決定即可。In order to sufficiently ensure the power resistance of 10 W (or more), the number of layers of the
第1電極121及第2電極122相當於上述1對電極。第1電極121及第2電極122之材料只要具有導電性則並無特別要求。The
(1-2)第1實施形態之頻率濾波器之製造方法
使用圖3及圖4,對第1實施形態之頻率濾波器10之製造方法進行說明。圖3中示出用以製造頻率濾波器10之磁控濺射裝置30。磁控濺射裝置30具有內部由真空泵(未圖示)排氣之真空容器31。於真空容器31內,具備磁控電極32、及相對於磁控電極32之上表面傾斜之基板保持具33。將成為頻率濾波器10所具有之各層材料之板狀之靶T載置於磁控電極32之上表面。於磁控電極32,經由匹配箱341連接有高頻電源34。基板保持具33由板狀導電體所構成,且接地。於基板保持具33之一端,設置有藉由冷卻水將基板保持具33之該一端冷卻之冷卻機構35。(1-2) Manufacturing method of the frequency filter of the first embodiment
3 and 4, the manufacturing method of the
將氣體與靶一起用作第1層111及/或第2層112之材料之情形時,於真空容器31設置氣體導入口(未圖示)。例如,於製作由AlN或AlScN所構成之第1層111及/或第2層112之情形時,使用Al靶或Sc靶,並且於製作時將氮氣自氣體導入口導入至真空容器31內。When a gas is used as the material of the
於製造頻率濾波器10時,首先,將基板S安裝於基板保持具33,將由金屬所構成之靶TM載置於磁控電極32之上表面。於該狀態下對靶TM進行濺射,藉此於基板S之表面製作第1電極121(圖4(a))。When manufacturing the
其次,將成為第1層111之材料之靶T1載置於磁控電極32之上表面。於該狀態下藉由冷卻機構35將基板保持具33之一端冷卻,並且對靶T1進行濺射,藉此於基板S之表面製作1層第1層111(圖4(b))。此時,藉由基板保持具33相對於磁控電極32之上表面傾斜、及基板保持具33之一端由冷卻機構35冷卻,而於基板S之面內產生溫度梯度,由此第1層111之極化P1
相對於第1層111傾斜。Next, the target T1 serving as the material of the
其次,將基板S暫時自基板保持具33卸除,使基板S以其法線為軸旋轉180°之後再次安裝於基板保持具33(圖4(c))。與此同時,將成為第2層112之材料之靶T2載置於磁控電極32之上表面。於該狀態下藉由冷卻機構35將基板保持具33之一端冷卻,並且對靶T2進行濺射,藉此於第1層111之表面製作1層第2層112(圖4(d))。此時,藉由如上所述使基板S旋轉、以及與第1層111製作時同樣地基板保持具33傾斜及基板保持具33之一端由冷卻機構35冷卻,第2層112之極化P2
朝向相對於第2層112傾斜之方向,且與第2層112平行之極化P2
之分量成為與第1層111之極化P1
相反之方向。Next, the substrate S is temporarily removed from the
其後,反覆進行以下操作,即,藉由與第一個第1層111相同之方法於第2層112之上製作下一個第1層111,且於該第1層111之上藉由與第一個之第2層112相同之方法製作下一個第2層112。藉此,各製作既定數量之第1層111及第2層112(圖4(e))。After that, the following operations are repeated, that is, the next
最後,將由金屬所構成之靶TM載置於磁控電極32之上表面,於該狀態下對靶TM進行濺射,藉此於基板S上之第1層111及第2層112中之最後製作之層之上製作第2電極122(圖4(f))。其後,視需要去除基板S(亦可保持保留有基板S之狀態),藉此完成頻率濾波器10。Finally, the target TM made of metal is placed on the upper surface of the
(1-3)第1實施形態之頻率濾波器之動作
第1實施形態之頻率濾波器10若第1電極121與第2電極122之間被輸入包含多個頻率之高頻功率,則於該等電極間產生包含該等多個頻率且大小與該高頻功率之大小相應之高頻電壓。藉此,對積層體11所包含之各第1層111及各第2層112亦分別沿厚度方向施加包含該等多個頻率之高頻電壓(再者,施加於各層之電壓之總和相當於第1電極121與第2電極122之間之電壓)。(1-3) Operation of the frequency filter of the first embodiment
In the
因此,各第1層111藉由壓電效應而於上述多個頻率中之由第1層111之厚度d1
及音速v1
所決定之特定之多個頻率下,於每一頻率以相同之相位振動。此時,各第1層111之極化P1
朝向相同方向,藉此各第1層111沿相同方向振動。另一方面,各第2層112藉由壓電效應而於由第2層112之厚度d2
及音速v2
所決定之特定之多個頻率下振動。關於振動之相位,第2層112之極化P2
之平行分量P2//
之方向(第2方向)與第1層111之極化P1
之平行分量P1//
之方向(第1方向)相差180°,藉此第2層112以與第1層111相反之相位振動。進而,藉由d2
處於d1
之0.5×(v2
/v1
)倍~2.0×(v2
/v1
)d1
倍之範圍內,第1層111與第2層於相同之特定之多個頻率下振動而成為共振狀態。該等特定之多個頻率分別對應於每1層成為半整數之多個波數。Therefore, each
形成此種共振狀態之結果為,僅具有上述特定之多個頻率之高頻功率被放大。因此,第1實施形態之發明作為頻率濾波器發揮功能。As a result of the formation of such a resonance state, only the high-frequency power having the above-mentioned specified plurality of frequencies is amplified. Therefore, the invention of the first embodiment functions as a frequency filter.
關於第1實施形態之頻率濾波器10,以具有與10~100 W範圍內之既定之功率相關之耐功率性之方式,決定第1層111及第2層112之積層數,故可於具有與此種功率對應之輸出之行動電話之基地台使用。Regarding the
(1-4)第1實施形態之頻率濾波器之變形例
圖5中示出作為第1實施形態之變形例之頻率濾波器10A。該頻率濾波器10A於第1實施形態之頻率濾波器10中之第1電極121之與積層體11相反側之面設置有聲布拉格反射器13。聲布拉格反射器13係將聲阻抗不同之2種層131、132交替積層而成者。各層131、132之厚度係根據該等各層131、132之材料,以產生具有積層體11之振動之頻率的音波之布拉格反射之方式決定。藉由設置此種聲布拉格反射器13,可抑制積層體11振動之能量洩漏至外部。(1-4) Modification of the frequency filter of the first embodiment
FIG. 5 shows a
(1-5)關於第1實施形態之頻率濾波器之實驗及計算結果
其次,說明對第1實施形態之頻率濾波器進行之實驗及計算之結果。實驗中,製作用石英玻璃製之基板支承第1實施形態之頻率濾波器10者、及變形例之頻率濾波器10A(即,設置有聲布拉格反射器13者)。於所製作之頻率濾波器10、10A中,積層體11使用將第1層111與第2層112分別各積層6層共計積層12層者。對於第1層111及第2層112之材料,均使用Sc0.43
Al0.57
N(ScAlN,x=0.43)。第1層111之厚度d1
及第2層112之厚度d2
均以目標值為5 μm而製作,但因所獲得之積層體11整體之厚度之測定值為52 μm,故實際之d1
及d2
以平均值計為約4.3(52/12)μm。再者,計算中將d1
及d2
之值設為5 μm。該等d1
及d2
之於實驗中之目標值及於計算中使用之值「5 μm」係以頻率濾波器10A於以400 MHz為中心之頻率區域發揮功能之方式而決定。聲布拉格反射器13係以產生頻率為400 MHz之音波之布拉格反射之方式製作。(1-5) Experiments and calculation results of the frequency filter of the first embodiment Next, the results of experiments and calculations of the frequency filter of the first embodiment will be described. In the experiment, the substrate made of quartz glass for production supports the
對所製作之頻率濾波器10進行以下實驗。對第1電極121與第2電極122之間施加高頻電場。該高頻電場於積層體11中藉由逆壓電效應轉換為機械振動。機械振動於石英玻璃製之基板之底面反射,且於積層體11中藉由壓電效應轉換為高頻電壓。本實驗中測定該高頻電壓,且基於所獲得之高頻電壓,求出插入損耗。此外,將所獲得之插入損耗減去石英玻璃製之基板內所產生之機械損耗,藉此求出利用壓電效應進行之機電轉換之效率即轉換損耗。而且,藉由等效電路模型構建與實驗相同之構造,利用計算求出理論轉換損耗。將該等實驗及計算之結果示於圖6。該等實驗及計算結果意味著於包含400 MHz(0.4 GHz)附近之多個頻率下轉換損耗降低,作為頻率濾波器發揮功能。The following experiments were performed on the fabricated
圖7中,將對所製作之頻率濾波器10A測定(電)阻抗所得之結果與計算結果一起示出。實驗值、計算值均於400 MHz附近之頻率下獲得超過200 Ω之阻抗,從而頻率濾波器10A具有充分之耐功率性。In FIG. 7, the result obtained by measuring the (electrical) impedance of the produced
再者,此處為了簡化實驗而將頻率設為作為相對較小之值之400 MHz,但藉由使第1層111及第2層112之厚度更薄,且與此相對應地增多第1層111及第2層112之層數,可獲得於行動電話之基地台使用之即使於更高頻帶(例如3.5 GHz頻帶或4.5 GHz頻帶)下亦可使用之頻率濾波器。Here, in order to simplify the experiment, the frequency is set to 400 MHz, which is a relatively small value, but by making the thicknesses of the
圖8中,以曲線圖表示對第1層111及第2層112合計之層數為(a)8層、(b)4層、(c)2層之情形藉由實驗及計算求出轉換損耗之結果。各層之厚度與圖6及圖7中表示實驗及計算結果之12層之情形相同(就實驗而言為目標值)。對第1層111僅為1層且無第2層112(本發明中不包含)之情形亦進行相同之實驗及計算(圖8(a))以供參考。可知,第1層111及第2層112合計之層數越少,則轉換效率極小之曲線圖中之位置變得越少,但均於橫軸為400 MHz前後之位置存在極小值,於400 MHz前後之頻率下動作。但是,若減少層數,則耐功率性降低。因此,可綜合考慮耐功率性與成本(層數越多則越增加)來決定第1層111及第2層112合計之層數。In FIG. 8 , the conversion is obtained by experiment and calculation when the total number of layers of the
(2)第2實施形態之頻率濾波器
圖9中示出第2實施形態之頻率濾波器20之構成。該頻率濾波器20具有將第1層211與第2層212交替地逐層反覆並合計積層既定數量而成之積層體21、以及以於積層體21之積層方向夾著積層體21之方式設置之第1電極221及第2電極222。該等各構成要素中之第1電極221及第2電極222分別與第1實施形態之頻率濾波器10中之第1電極121及第2電極122相同。(2) Frequency filter of the second embodiment
FIG. 9 shows the configuration of the
第2實施形態中,對於第2層212,使用非壓電性之絕緣材料製之非壓電層。作為此種非壓電性之絕緣材料,典型而言可例舉SiO2
等不具有壓電性之介電體。此外,亦可將如下材料用作第2層212之材料,該材料雖可產生壓電性,但因極化於第2層212內朝向隨機方向而不會整體產生壓電性。In the second embodiment, as the
對於第1層211使用由壓電體所構成之材料。關於第1層211之極化方向,各第1層211為任意方向只要為相同方向即可。因此,第1層211之極化方向可與第1層211垂直,亦可與第1層211平行,進而亦可相對於第1層211傾斜(既非垂直亦非平行)。For the
再者,圖9所示之例中,將積層體21中之各層中之最靠近第1電極221之層設為第1層(壓電層)211,但亦可採取將該層設為第2層(非壓電層)212(因此,於積層體21之整體,將圖9所示之例中之第1層211與第2層212調換)之構成。Furthermore, in the example shown in FIG. 9 , the layer closest to the
第2層212之厚度d2
與第1實施形態之情形同樣地,設為第1層211之厚度d1
之0.5×(v2
/v1
)倍~2.0×(v2
/v1
)d1
倍之範圍內。As in the case of the first embodiment, the thickness d 2 of the
第1層111及第2層112之層數與第1實施形態之情形同樣地,為了確保作為於行動電話之基地台使用之頻率濾波器之耐功率性,以具有將10~100 W之範圍內作為上限值之耐功率性之方式決定。The number of layers of the
第2實施形態之頻率濾波器20可藉由基本上與第1實施形態之頻率濾波器10相同之方法製作。但是,於如圖9所示第1層211之極化P1
之方向與第1層211垂直之情形時,無需使基板相對於磁控電極之上表面傾斜或於基板之面內形成溫度梯度,只要將基板與磁控電極之上表面平行地配置之後藉由濺射法製作第1層211及第2層212即可。The
第2實施形態之頻率濾波器20若第1電極221與第2電極222之間被輸入包含多個頻率之高頻功率,則於該等電極間產生包含該等頻率且大小與該高頻功率之大小相應之高頻電壓。藉此,各第1層211藉由壓電效應而於上述多個頻率中之由第1層211之厚度d1
及音速v1
決定之特定之多個頻率下,於每一頻率以相同之相位而振動。另一方面,第2層212中雖未產生由壓電效應產生之振動,但受到來自第1層211之振動,第2層212以與第1層211相同之特定之多個頻率振動。此處,第2層212之厚度d2
與第1層211之厚度d1
相同,或處於接近d1
之0.5×(v2
/v1
)倍~2.0×(v2
/v1
)d1
倍之範圍內,藉此具有第1層211之頻率之振動滿足第2層212之共振條件。其結果,於積層體21整體,產生具有與每1層中成為半整數之多個波數對應之上述特定之多個頻率的共振。藉此,第2實施形態之發明作為與該頻率相關之頻率濾波器而動作。In the
又,頻率濾波器20,藉由第1層211及第2層212如上所述交替地逐層反覆並合計積層既定數量,而確保作為於行動電話之基地台使用之頻率濾波器之耐功率性。In addition, the
第2實施形態之頻率濾波器20與第1實施形態之頻率濾波器10不同,無需調整第1層211與第2層212之極化方向之關係,故可更容易地製造而無需使用如圖4所示之特殊之製造方法。另一方面,第1實施形態之頻率濾波器10中,不僅第1層111而且第2層112亦為壓電體,藉此第2層112亦成為振動之產生源,故可獲得相較第2實施形態之頻率濾波器20更強之輸出訊號。Unlike the
再者,亦可將第2實施形態之頻率濾波器20於行動電話之基地台以外之用途中使用。該情形時,根據用途不同(例如行動電話之終端用之情形),無需對10 W之高頻功率之耐功率性。Furthermore, the
(3)其他
以上,對第1實施形態之頻率濾波器10、其變形例之頻率濾波器10A、及第2實施形態之頻率濾波器20進行了說明,但本發明並不限定於該等3種示例,可進行各種變形。例如,於第2實施形態之頻率濾波器20中,可與第1實施形態之變形例之頻率濾波器10A同樣地設置聲布拉格反射器。(3) Others
As mentioned above, the
10、10A、20:頻率濾波器
11、21:積層體
111、211:第1層
112、212:第2層
121、221:第1電極
122、222:第2電極
13:聲布拉格反射器
131、132:構成聲布拉格反射器之層
30:磁控濺射裝置
31:真空容器
32:磁控電極
33:基板保持具
34:高頻電源
341:匹配箱
35:冷卻機構
d1
、d2
:厚度
P1
、P2
:極化
P1//
、P2//
:平行分量
S:基板
T、TM、T1、T2:靶10, 10A, 20:
[圖1]係表示本發明之行動電話之基地台用之頻率濾波器之第1實施形態的概略圖。 [圖2]係表示第1實施形態之頻率濾波器中之第1層及第2層之極化方向的圖。 [圖3]係表示用以製造第1實施形態之頻率濾波器之磁控濺射裝置之一例的概略圖。 [圖4](a)~(f)係表示第1實施形態之頻率濾波器之製造步驟之概略圖。 [圖5]係表示第1實施形態之頻率濾波器之變形例之概略圖。 [圖6]係表示藉由實驗及計算對第1實施形態之頻率濾波器(由石英玻璃製之基板支承)求出轉換損耗所得之結果之曲線圖。 [圖7]係藉由實驗及計算對第1實施形態之變形例之頻率濾波器求出阻抗所得之結果之曲線圖。 [圖8]係藉由實驗及計算對第1層及第2層之層數與圖6所示之例不同之頻率濾波器((a)~(c))及參考例之頻率濾波器((d))求出轉換損耗所得之結果的曲線圖。 [圖9]係表示本發明之行動電話之基地台用之頻率濾波器之第2實施形態的概略圖。Fig. 1 is a schematic diagram showing a first embodiment of a frequency filter for a base station of a mobile phone according to the present invention. 2 is a diagram showing the polarization directions of the first layer and the second layer in the frequency filter of the first embodiment. 3 is a schematic diagram showing an example of a magnetron sputtering apparatus for producing the frequency filter of the first embodiment. [FIG. 4] (a)-(f) are schematic diagrams which show the manufacturing process of the frequency filter of 1st Embodiment. 5 is a schematic diagram showing a modification of the frequency filter of the first embodiment. FIG. 6 is a graph showing the result of calculating the conversion loss of the frequency filter (supported by a quartz glass substrate) of the first embodiment by experiment and calculation. FIG. 7 is a graph showing the results obtained by obtaining the impedance of the frequency filter according to the modification of the first embodiment by experiments and calculations. [Fig. 8] The frequency filters ((a) to (c)) of the first layer and the second layer different from the example shown in Fig. 6 and the frequency filter of the reference example ( (d)) Graph of the result obtained by calculating the conversion loss. Fig. 9 is a schematic diagram showing a second embodiment of a frequency filter for a base station of a mobile phone according to the present invention.
10:頻率濾波器10: Frequency filter
11:積層體11: Laminate
111:第1層111:
112:第2層112: Tier 2
121:第1電極121: 1st electrode
122:第2電極122: 2nd electrode
d1 、d2 :厚度d 1 , d 2 : thickness
P1 、P2 :極化P 1 , P 2 : Polarization
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