TW202144241A - Laminated board module and application thereof wherein a plurality of boards are used to be laminated and combined to form a main board, and the boards constituting the main board are provided with reduced structures - Google Patents
Laminated board module and application thereof wherein a plurality of boards are used to be laminated and combined to form a main board, and the boards constituting the main board are provided with reduced structures Download PDFInfo
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- TW202144241A TW202144241A TW109117628A TW109117628A TW202144241A TW 202144241 A TW202144241 A TW 202144241A TW 109117628 A TW109117628 A TW 109117628A TW 109117628 A TW109117628 A TW 109117628A TW 202144241 A TW202144241 A TW 202144241A
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Abstract
Description
本發明係有關於一種板材模組,特別是一種採用疊合板來加以疊置結合,尤其適用於棧板及板材等。 The present invention relates to a board module, in particular to a composite board for stacking and combining, which is especially suitable for pallets and boards and the like.
人類使用木製品已有數千年的歷史,凡舉蓋屋、造橋都脫離不了木頭使用,目前主要係採木頭材料作成板材結構,板材僅需利用釘子加以釘合組裝,且木板材可重複使用故為多數人選擇;但是木板的抗撞擊與耐潮能力不佳,因此重複使用的次數並不高,且木頭佔有相當的體積及重量,故易影響其承載並運送貨物時之靈活性及便捷性,對於運輸的成本會大幅提高。 Humans have been using wood products for thousands of years. Building houses and bridges cannot be separated from the use of wood. At present, wood materials are mainly used to make board structures. The boards only need to be nailed and assembled with nails, and the wood boards can be reused. Most people choose; however, the impact resistance and moisture resistance of wooden boards are not good, so the number of repeated use is not high, and the wood occupies a considerable volume and weight, so it is easy to affect its flexibility and convenience when carrying and transporting goods. The cost of transportation will increase significantly.
近年來人口急遽膨脹,各種原物料需求與使用量大漸而日益枯乏,最具代表性的就是雨林生態與樹木間之關係與所衍生之環境問題,除直接衝擊環境與氣候,更使得已被砍筏之樹木難以逆向復原,在木製原料需求不變,所能供應的木製原物料大幅減少之下,需求大於供給必然價格大增,所以木材價格亦大幅升高使成本昂貴。 In recent years, the population has expanded rapidly, and the demand and use of various raw materials have gradually become depleted. The most representative is the relationship between the rainforest ecology and trees and the resulting environmental problems. In addition to directly impacting the environment and climate, it has also It is difficult to reverse the recovery of chopped trees. When the demand for wood raw materials remains unchanged and the wood raw materials that can be supplied are greatly reduced, the demand exceeds the supply and the price must increase greatly. Therefore, the price of wood also increases significantly, making the cost expensive.
為解決上述問題,目前如何提出一種重量輕巧且堅固的板材結構,同時成本低並易於生產,實為一值得探討之技術課題。 In order to solve the above-mentioned problems, how to propose a light-weight and strong plate structure with low cost and easy production is a technical subject worthy of discussion.
有鑒於此,本發明提出一種疊合板模組及其應用,可解決上述習知技術之缺失,係可利用板材縮減結構的設計,藉由疊合形成承載面的結構。 In view of this, the present invention proposes a laminated board module and its application, which can solve the above-mentioned deficiencies of the prior art, and can utilize the design of the reduced structure of the boards to form the structure of the bearing surface by superimposing.
本發明之另一目的在於提供一種疊合板模組及其應用,重量輕且比強度堅固,適合於各種棧板及板材等,且大幅降低製造與生產成本。 Another object of the present invention is to provide a laminated board module and its application, which are light in weight and strong in specific strength, suitable for various pallets and boards, etc., and greatly reduce the manufacturing and production costs.
根據本發明所揭露之疊合板模組及其應用,其係利用複數的板材所構成主板,其中每一板材設置有縮減結構,並每一板材與上(下)緣板材的縮減結構設置具有相異或相同尺寸、位置及形狀,如此使上下鄰近的板材形成疊置,但上下板材形成良好的承載面,使主板能提供極佳的耐重壓力。 According to the laminated board module and its application disclosed in the present invention, a main board is formed by using a plurality of boards, wherein each board is provided with a reduced structure, and each board has the same reduction structure as the upper (lower) edge board. XOR the same size, position and shape, so that the upper and lower adjacent plates are stacked, but the upper and lower plates form a good bearing surface, so that the main board can provide excellent weight resistance.
另本發明之又一目的在於板材縮減結構的材料可製作為附件,此附件可設置於主板之穿槽,如此不但具有節省材料,並提高主板的結構強度。 Another object of the present invention is that the material of the reduced structure of the plate can be made as an accessory, and the accessory can be arranged in the groove of the main board, which not only saves materials, but also improves the structural strength of the main board.
根據本發明所揭露之疊合板模組的另一實施例,可更於主板上另設置有蓋板來覆蓋其板材的穿孔,而能更進一步強化整體本體的強度,應付於需要高強度的配置與適用環境。 According to another embodiment of the laminated board module disclosed in the present invention, a cover plate can be further arranged on the main board to cover the perforations of the board, so as to further strengthen the strength of the whole body and cope with the configuration requiring high strength and applicable environment.
另一方面本發明所揭露之疊合板模組可製作為棧板或箱體,其中棧板可呈現水平與垂直相異方向形成承載面,具有強韌的厚實度也適形成良好的穩定度。 On the other hand, the laminated board module disclosed in the present invention can be made into a pallet or a box, wherein the pallet can present horizontal and vertical directions different from each other to form a bearing surface, and has a strong and strong thickness suitable for forming a good stability.
1:主板 1: Motherboard
2:側板 2: side panel
10:板材 10: Plate
11:穿孔 11: Perforation
12:主板穿槽 12: Motherboard slot
13:定位柱 13: Positioning post
14:盲孔 14: Blind hole
20:支撐腳 20: Support feet
30:蓋層 30: Cover layer
31:側層 31: Side Layer
40:木材 40: Wood
50:支撐座 50: Support seat
51:固定槽 51: Fixed slot
52:凸肋 52: Ribs
53:定位槽 53: Positioning slot
54:插孔部 54: jack part
61:強化肋 61: Reinforced ribs
62:立板槽 62: Vertical plate slot
63:定位槽 63: Positioning slot
70:直支撐板 70: Straight support plate
71:橫支撐板 71: Horizontal support plate
72:定位柱 72: Positioning post
73:定位槽 73: Positioning slot
74:插孔部 74: Jack part
75:強化肋 75: Reinforced Ribs
80:支撐條 80: support bar
81:缺槽 81: missing slot
84:插孔部 84: jack part
101:第一板材 101: The first plate
102:第二板材 102: Second plate
110:餘料 110: surplus material
111:齒槽 111: Cogging
201:下嵌板 201: Lower panel
202:上嵌板 202: Upper panel
203:固定槽 203: Fixed slot
300:外開式凹凸形 300: Outward opening concave-convex
401:一號板材 401: Plate No. 1
402:二號板材 402: Plate No. 2
403:三號板材 403: Plate No. 3
404:四號板材 404: Plate No. 4
510:鋸形齒 510: Sawtooth
511:固定件 511: Fixtures
800:口形結構 800: Mouth structure
圖1係本發明疊合板模組之第一實施例分解示意圖。 FIG. 1 is an exploded schematic view of the first embodiment of the laminated board module of the present invention.
圖2係本發明疊合板模組之第一實施例施工示意圖。 FIG. 2 is a schematic view of the construction of the first embodiment of the laminated board module of the present invention.
圖3A~3C係本發明疊合板模組之第一實施例附件示意圖。 3A to 3C are schematic diagrams of accessories of the first embodiment of the laminated board module of the present invention.
圖4係本發明疊合板模組之第一實施例安裝示意圖。 FIG. 4 is a schematic diagram of the installation of the first embodiment of the laminated board module of the present invention.
圖5係本發明疊合板模組之第一實施例正面示意圖。 FIG. 5 is a schematic front view of the first embodiment of the laminated board module of the present invention.
圖6係本發明疊合板模組之第一實施例背面示意圖。 6 is a schematic view of the back of the first embodiment of the laminated board module of the present invention.
圖7係本發明疊合板模組之外板包覆示意圖。 FIG. 7 is a schematic diagram of the outer panel coating of the laminated panel module of the present invention.
圖8係本發明疊合板模組之第二實施例施工示意圖。 FIG. 8 is a schematic view of the construction of the second embodiment of the laminated board module of the present invention.
圖9係本發明疊合板模組之第二實施例合併示意圖。 FIG. 9 is a combined schematic diagram of the second embodiment of the laminated board module of the present invention.
圖10係本發明疊合板模組之板材合併示意圖。 FIG. 10 is a schematic view of the board assembly of the laminated board module of the present invention.
圖11係本發明疊合板模組之第三實施例合併示意圖。 FIG. 11 is a combined schematic diagram of the third embodiment of the laminated board module of the present invention.
圖12係本發明疊合板模組之第四實施例合併示意圖。 FIG. 12 is a combined schematic diagram of the fourth embodiment of the laminated board module of the present invention.
圖13係本發明疊合板模組之第五實施例合併示意圖。 FIG. 13 is a combined schematic diagram of the fifth embodiment of the laminated board module of the present invention.
圖14係本發明疊合板模組之第六實施例合併示意圖。 FIG. 14 is a combined schematic diagram of the sixth embodiment of the laminated board module of the present invention.
圖15係本發明疊合板模組之第七實施例合併示意圖。 FIG. 15 is a combined schematic diagram of the seventh embodiment of the laminated board module of the present invention.
本發明所揭露之疊合板模組,其主板因為板材疊置產生更大剛性,且減輕重量並節省材料,接下來請參閱圖1,係本發明疊合板模組之第一實施例分解示意圖;圖中主板1係包含有複數板材10所疊置而成,其中板材10上更設置至少一縮減結構,其中縮減結構呈現相同及相異位置及方向形成承載面,其中縮減結構為複數穿孔11,穿孔11可為長方形及正方形,圖中的上方第一板材101之長方形穿孔11,與下方第二板材102之長方形穿孔11位置部份相異,使上下穿孔11的部份相通位置,設置為直接具備結構
用途所需,以節省減少加工程序。
In the laminated board module disclosed in the present invention, the main board of the laminated board module is more rigid due to the stacking of the plates, and the weight is reduced and the material is saved. Next, please refer to FIG. 1 , which is an exploded schematic view of the first embodiment of the laminated board module of the present invention; In the figure, the
接下來請參考圖2,係本發明疊合板模組之第一實施例施工示意圖;其中板材10疊置結合產生更大剛性時,縮減結構除了節省板材材料並減輕重量外,餘料110可以構成所需附件,或是利用於其它用途使用及回收再利用等,圖中長方形的餘料110可製作為下嵌板201,而正方形的餘料110可製作為上嵌板202。
Next, please refer to FIG. 2 , which is a schematic diagram of the construction of the first embodiment of the laminated board module of the present invention; when the
請繼續參考圖3A、3B係本發明疊合板模組之第一實施例附件示意(1)、(2)圖;圖3A中附件為板材餘料所裁成之下嵌板201,此下嵌板201同樣可以複數曡置成疊合板,而圖3B中同為附件為板材餘料所裁成之上嵌板202,一樣複數曡置結合來增加剛性,然後將下嵌板201與上嵌板202相卡合以成為支撐腳20,可作為棧板支撐或是其他的用途,請繼續參考圖3C係本發明疊合板模組之第一實施例附件示意(3)圖。
Please continue to refer to FIGS. 3A and 3B, which are schematic diagrams (1) and (2) of the accessories of the first embodiment of the laminated board module of the present invention; the accessories in FIG. The
請參考圖4,係本發明疊合板模組之第一實施例安裝示意圖;板材10產生的外形、穿孔及位置等之縮減結構,可於曡置時的相通位置,將具備結構直接置入後使用,以節省減少加工程序;如圖中板材10穿孔11的相通部份位置,可直接產生成主板穿槽12,而穿槽內恰好可容置餘料生產的支撐腳20,而支撐腳20上更有固定槽203。
Please refer to FIG. 4 , which is a schematic diagram of the installation of the first embodiment of the laminated board module of the present invention; the reduced structure of the shape, perforation and position of the
請參考圖5,係本發明疊合板模組之第一實施例正面示意圖;圖中支撐腳20更設置有至少一固定槽203,用以與板材10嵌合固定,使支撐腳20上部容置於主板穿槽12之中,而支撐腳20下部則可穩定堅固,使主板結合支撐腳成20為一棧板結構,請參考圖6,係本發明疊合板模組之第一實施例背面示意圖。
Please refer to FIG. 5 , which is a schematic front view of the first embodiment of the laminated board module of the present invention; in the figure, the
請參考圖7,係本發明疊合板模組之外板包覆示意圖;根據本發明所揭露之疊合板,係包含有複數板材所疊置構成主板,其中板材10上更設置至少一縮減結構,為了強化整體本體的強度,應付於需要高強度的配置與適用環境,故主板1上更另設置有蓋層30,來覆蓋其板材10的穿孔11;另疊合板模組可更包含有側層31,使主板1結構兩側皆具有側面覆蓋,為美觀考量應用需求。
Please refer to FIG. 7 , which is a schematic diagram of the coating of the outer panel of the laminated panel module of the present invention; the laminated panel disclosed in the present invention includes a plurality of plates stacked to form a main board, wherein the
請參考圖8,係本發明疊合板模組之第二實施例施工示意圖;此實施例中主板係包含有複數板材所疊置而成,其中板材上更設置至少一縮減結構,縮減結構更為一外開式凹凸形300,圖中左邊木材40切割為二號板材402與四號板材404,圖中右邊木材40切割為一號板材401與三號板材403,再將板材疊合組裝使層數增加並產生更大的剛性,而且節省材料並減輕重量,且木材40的餘料110也可以構成所需附件。
Please refer to FIG. 8 , which is a schematic diagram of the construction of the second embodiment of the laminated board module of the present invention; in this embodiment, the main board is formed by stacking a plurality of boards, wherein at least one reduced structure is further arranged on the board, and the reduced structure is more An outward-opening concave-
請參考圖9,係本發明疊合板模組之第二實施例合併示意圖;圖中一號板材401與二號板材402的外開式凹凸形300呈現不同位置及方向,而二號板材402、三號板材403及四號板材404也不同位置及方向,使主板1形成承載面能提供極佳的耐重壓力。
Please refer to FIG. 9 , which is a combined schematic diagram of the second embodiment of the laminated board module of the present invention; in the figure, the outward opening concave-
根據本發明所揭露之疊合板模組,係包含有複數板材所疊置構成主板,其中板材上更設置至少一縮減結構,其中縮減結構呈現不同位置及方向形成承載面,首先請參閱圖10,係本發明疊合板模組之板材正面圖;本發明所揭露之疊合板模組,其板材10之縮減結構可設置於任何形狀、尺寸或位置,圖中左上板材之縮減結構可為4個方形穿孔11,而右上板材縮減結構則為9個方形穿孔11,其中同為方形穿孔11但尺寸相異,所以板材10
疊置會呈現不同位置形成承載面。
The laminated board module disclosed in the present invention comprises a plurality of boards stacked to form a main board, wherein at least one reduced structure is further provided on the board, wherein the reduced structure presents different positions and directions to form a bearing surface, please refer to FIG. 10 first, This is the front view of the board of the laminated board module of the present invention; in the laminated board module disclosed in the present invention, the reduced structure of the
而左下板材10之縮減結構可為3個橫排長方形穿孔11,而右下板材10之縮減結構則為3個豎排長方形穿孔,其中同為長方形穿孔11但位置相異,所以板材10疊置會呈現不同位置形成承載面;而本發明所揭露之疊合板是可以利用複數板材曡置結合成主板,如左上板材與右上板材曡置結合,左上板材當然也可與左下或是右下板材曡置結合,其中板材曡置數目不限,而縮減結構的尺寸(如左上板材與右上板材)或位置(左下板材或是右下板材)亦不限制,另外縮減結構的形狀也不限,例如:方形、長方形、菱形、六角形、圓形及幾何圖形皆可,至於縮減結構也有相異或相同位置。
The reduced structure of the lower
接下來請參閱圖11,係本發明疊合板模組之第三實施例合併示意圖;圖中為一棧板結構,其中主板1係包含有複數板材10所疊置而成,且板材10上更設置有複數穿孔11,主板1下方連接有複數支撐座50,其中設置於主板1中間的支撐座50,可直接用固定槽51卡扣於穿孔11中,而主板1邊緣可利用定位柱13來與支撐座50的凸肋52組合,使凸肋52上定位槽53將定位柱13牢牢地夾固於其中,而支撐座50下部設置有插孔部54,可利用機台插入進行搬運作業,故此實施例以成為棧板形的疊合板模組。
Next, please refer to FIG. 11 , which is a combined schematic diagram of the third embodiment of the laminated board module of the present invention; the figure shows a pallet structure, wherein the
接下來請參閱圖12,係本發明疊合板模組之第四實施例合併示意圖;圖中為一箱體結構,其包含有棧板及板模等,其中主板1係包含有複數板材10所疊置而成,且主板1上更設置有複數穿孔11及盲孔14,邊緣則設置定位柱13;主板1下方中間連接有支撐座50,可直接用固定槽51上之鋸形齒510卡扣於穿孔11的齒槽111中,而主板1邊緣可利用定位柱13來與側板
2組合,側板2上設置有定位槽63、立板槽62及強化肋61,其中側板2定位槽63將定位柱13牢牢地夾固於其中,使主板1與側板2固定結合,立板槽62用以與鄰邊立板(未圖示)結合,使側板2與立板成為箱體結構的四面,側板2的強化肋61則使箱體結構更加堅固;而主板上盲孔14可與立板(未圖示)結合,以成為箱體形的疊合板模組。
Next, please refer to FIG. 12 , which is a combined schematic diagram of the fourth embodiment of the laminated board module of the present invention; the figure shows a box structure, which includes pallets and molds, etc., wherein the
接下來請參閱圖13,係本發明疊合板模組之第五實施例合併示意圖;圖中為一棧板結構,其中主板1下方連接有支撐座50,支撐座50的固定槽51穿過於穿孔11中,並可用固定件511加以組合,其中固定件511可用插銷、螺絲、卯釘、塑膠釘等,或是增加各種卡合或是固定手段,仍應不脫離本發明的範疇。
Next, please refer to FIG. 13 , which is a combined schematic diagram of the fifth embodiment of the laminated board module of the present invention; the figure shows a pallet structure, wherein a
接下來請參閱圖14,係本發明疊合板模組之第六實施例合併示意圖;舉例來說,以板材10而言除了水平方向疊置之外,亦可以垂直方向疊置,圖中為一棧板結構,其中直支撐板70及橫支撐板71係包含有複數板材10所疊置而成,且直支撐板70邊緣可利用定位柱72來與橫支撐板71的定位槽73組合,使定位槽73將定位柱72牢牢地夾固於其中,而支撐板下部設置有插孔部74,可利用機台插入進行搬運作業,故此實施例以成為棧板形的疊合板模組;而強化肋75亦可採用垂直肋、水平肋或是斜置肋方式連接,而能增加整體結構的強度,當然如圖中所繪示僅為示意,任意置換與變化皆不脫離本案精神,上述僅為舉例說明,並非限定僅能採用此些方法。
Next, please refer to FIG. 14 , which is a combined schematic diagram of the sixth embodiment of the laminated board module of the present invention; for example, the
最後請參閱圖15,係本發明疊合板模組之第七實施例合併示意圖;本發明為疊合板模組之應用,主要將疊合板模組以豎起、交疊及環繞等組合方式來實施,圖中實施例支撐條80,係以複數板材10用口形結構
800環繞所疊置形成,以增強支撐條80的立體感及厚實度,上方設有至少一缺槽81,可用以相異方向支撐條80的缺槽81相嵌合,形成良好的穩定度,圖中複數支撐條80呈現水平與垂直相異方向形成承載面的主體1,其中節省減少加工程序並補強了整體板材的結構,而支撐條80下部設置有插孔部84,亦可利用機台插入進行搬運作業,故此實施例同成為棧板形的疊合板模組。
Finally, please refer to FIG. 15 , which is a schematic diagram of the combination of the seventh embodiment of the laminated board module of the present invention; the present invention is the application of the laminated board module, and the laminated board module is mainly implemented in a combination of erecting, overlapping, and wrapping. , the
雖然本發明以前述之較佳實施例揭露如上,然其並非用以限定本發明,且本發明之各部件的連接型式在不違反同一發明精神下並不以實施例為限,只要在不脫離本發明之精神和範圍內,當可作些許之更動與潤飾,因此本發明之保護範圍當視後附之申請專利範圍所界定者為準。 Although the present invention is disclosed by the above-mentioned preferred embodiments, it is not intended to limit the present invention, and the connection types of the various components of the present invention are not limited to the embodiments unless they violate the same spirit of the invention, as long as they do not deviate from the same. Within the spirit and scope of the present invention, some changes and modifications may be made, so the protection scope of the present invention should be determined by the scope of the appended patent application.
1:主板 1: Motherboard
10:板材 10: Plate
11:穿孔 11: Perforation
101:第一板材 101: The first plate
102:第二板材 102: Second plate
Claims (20)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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TW109117628A TW202144241A (en) | 2020-05-27 | 2020-05-27 | Laminated board module and application thereof wherein a plurality of boards are used to be laminated and combined to form a main board, and the boards constituting the main board are provided with reduced structures |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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TW109117628A TW202144241A (en) | 2020-05-27 | 2020-05-27 | Laminated board module and application thereof wherein a plurality of boards are used to be laminated and combined to form a main board, and the boards constituting the main board are provided with reduced structures |
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TW202144241A true TW202144241A (en) | 2021-12-01 |
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TW109117628A TW202144241A (en) | 2020-05-27 | 2020-05-27 | Laminated board module and application thereof wherein a plurality of boards are used to be laminated and combined to form a main board, and the boards constituting the main board are provided with reduced structures |
Country Status (1)
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