TW202138802A - Gas sensor - Google Patents
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- TW202138802A TW202138802A TW109111124A TW109111124A TW202138802A TW 202138802 A TW202138802 A TW 202138802A TW 109111124 A TW109111124 A TW 109111124A TW 109111124 A TW109111124 A TW 109111124A TW 202138802 A TW202138802 A TW 202138802A
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Abstract
Description
本發明是有關於一種氣體感測技術,且特別是有關於一種靈敏度佳的氣體感測器。The present invention relates to a gas sensing technology, and particularly relates to a gas sensor with good sensitivity.
由於近幾年科技與技術的精進,使得智慧型裝置普及化,而科技化後的產品則越來越趨向於三大方向,智慧化、自動化以及雲端化;小如一台基本的智慧型手機,內部卻已經有諸多的感測器整合其中,大至一輛電動車,可將感測器的效能發揮至極致,帶給人們的是全自動化駕駛的體驗。Due to the advancement of technology and technology in recent years, smart devices have become popular, and technologically advanced products have increasingly tended to three major directions: intelligence, automation, and cloud; as small as a basic smart phone, However, there are already many sensors integrated in it, as large as an electric car, which can maximize the performance of the sensor and bring people the experience of fully automated driving.
各種類型的感測器已經被應用在不同的領域中,以氣體感測器為例,一般會將感測材料透過整面地塗佈方式形成於電極結構上,而使電極在感測區域內完全被覆蓋。Various types of sensors have been used in different fields. Take gas sensors as an example. Generally, the sensing material is formed on the electrode structure by coating the entire surface, so that the electrode is in the sensing area. Completely covered.
然而,目前的氣體感測器在瞬態響應(transient response)雖有明顯的變化率(variation),但也存在不可忽視的誤差干擾,而影響感測器的靈敏度(sensitivity)。However, although the current gas sensor has a significant variation in the transient response, there is also a non-negligible error interference, which affects the sensitivity of the sensor.
本發明提供一種氣體感測器,能改善氣體感測器的靈敏度,並能大幅減少氣體感測器上感測材料的使用量。The invention provides a gas sensor, which can improve the sensitivity of the gas sensor and can greatly reduce the amount of sensing materials used on the gas sensor.
本發明的一種氣體感測器,包括基板、數個電極以及至少一感測結構。電極設置於基板上並且彼此相隔一距離,其中每個電極具有一第一厚度。感測結構則是介於電極之間,且所述感測結構直接接觸電極,其中感測結構具有一第二厚度,且第二厚度是0.01倍~1.1倍的第一厚度。A gas sensor of the present invention includes a substrate, a plurality of electrodes, and at least one sensing structure. The electrodes are arranged on the substrate and separated from each other by a distance, wherein each electrode has a first thickness. The sensing structure is between the electrodes, and the sensing structure directly contacts the electrodes, wherein the sensing structure has a second thickness, and the second thickness is 0.01 times to 1.1 times the first thickness.
在本發明的一實施例中,上述感測結構的第二厚度小於所述第一厚度。In an embodiment of the present invention, the second thickness of the above-mentioned sensing structure is smaller than the first thickness.
在本發明的一實施例中,上述感測結構的第二厚度在所述第一厚度的一半以下。In an embodiment of the present invention, the second thickness of the above-mentioned sensing structure is less than half of the first thickness.
在本發明的一實施例中,上述感測結構的第二厚度高於所述第一厚度。In an embodiment of the present invention, the second thickness of the above-mentioned sensing structure is higher than the first thickness.
在本發明的一實施例中,上述感測結構部分覆蓋所述數個電極。In an embodiment of the present invention, the aforementioned sensing structure partially covers the plurality of electrodes.
在本發明的一實施例中,上述第一距離在1µm~1000µm之間。In an embodiment of the present invention, the above-mentioned first distance is between 1 μm and 1000 μm.
在本發明的一實施例中,上述感測結構可為數個感測結構,且所述數個感測結構彼此相隔一第二距離,且第二距離小於等於每個電極的寬度。In an embodiment of the present invention, the above-mentioned sensing structure may be a plurality of sensing structures, and the plurality of sensing structures are separated from each other by a second distance, and the second distance is less than or equal to the width of each electrode.
在本發明的一實施例中,上述第二距離的變化率為±20%。In an embodiment of the present invention, the rate of change of the second distance is ±20%.
在本發明的一實施例中,上述電極包括指叉狀電極。In an embodiment of the present invention, the above-mentioned electrodes include interdigitated electrodes.
在本發明的一實施例中,上述基板包括印刷電路板(PCB),且上述電極為印刷電路板的電路。In an embodiment of the present invention, the above-mentioned substrate includes a printed circuit board (PCB), and the above-mentioned electrode is a circuit of the printed circuit board.
基於上述,本發明藉由降低感測結構中不受氣體影響的區域的膜層厚度,換句話說,受氣體影響的區域的膜層相對增加,使氣體感測器的變化率提升,進而改善氣體感測器的靈敏度。而且,由於降低膜層厚度,與傳統整面覆蓋式的感測材料相比,還可大幅減少感測材料的使用量。Based on the above, the present invention reduces the thickness of the film layer in the area not affected by the gas in the sensing structure, in other words, the film layer in the area affected by the gas is relatively increased, so that the rate of change of the gas sensor is increased, thereby improving The sensitivity of the gas sensor. Moreover, due to the reduced film thickness, compared with traditional full-surface covering type sensing materials, the amount of sensing materials used can be greatly reduced.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.
以下內容提供一種以上的實驗例,用於實施本發明的不同特徵。元件與配置的特定範例之描述如下,以簡化本發明的揭示內容。當然這些僅為範例,並非用於限制本發明的範圍與應用。此外,為了清楚起見,各個區域或膜層的相對厚度、距離及位置可能縮小或放大。另外,在圖式中使用相似或相同的元件符號表示相似或相同元件或特徵的存在。The following content provides more than one experimental example for implementing different features of the present invention. Specific examples of components and configurations are described below to simplify the disclosure of the present invention. Of course, these are only examples and are not used to limit the scope and application of the present invention. In addition, for the sake of clarity, the relative thickness, distance, and position of each region or film layer may be reduced or enlarged. In addition, similar or identical element symbols are used in the drawings to indicate the existence of similar or identical elements or features.
圖1是依照本發明的一實施例的一種氣體感測器的上視示意圖。Fig. 1 is a schematic top view of a gas sensor according to an embodiment of the present invention.
請參照圖1,氣體感測器100包括基板102、數個電極104以及至少一感測結構106。電極104設置於基板102上並且彼此相隔一第一距離d1,且所述感測結構106直接接觸電極104。氣體感測器100例如電阻式感測器或電容式感測器。電阻式感測器的感測原理主要是利用導電並與電極104連接的感測結構106在吸附氣體時,感測結構106的電阻會發生對應變化,從而進行量測;電容式感測器的感測原理則是利用感測結構106吸附到氣體分子時,介電係數會發生改變而改變其電容值以進行量測。電極104例如是指叉狀電極,因此第一距離d1係表示不同的指叉狀電極的指狀部分之間的間距。在本實施例中,第一距離d1例如在1µm~1000µm之間。如果電極104是一般的塊狀電極,則兩個塊狀電極之間的間距即為第一距離d1,依此類推。在一實施例中,上述基板102可以是印刷電路板(PCB),且電極104為印刷電路板的電路。Please refer to FIG. 1, the
圖2A是圖1的A-A’線段的一種氣體感測器的剖面示意圖。Fig. 2A is a schematic cross-sectional view of a gas sensor along the line A-A' of Fig. 1.
在圖2A中,每個電極104具有一第一厚度t1,感測結構106則是介於電極104之間,且感測結構106具有一第二厚度t2,其中第二厚度t2小於第一厚度t1,且第二厚度t2例如是0.01倍以上的第一厚度t1。在一實施例中,第一厚度t1例如在100µm左右;第二厚度t2例如在1µm以上。由於感測結構106的材料會受到氣體影響電性的區域106a大致固定在其表面部位,而不受氣體影響的區域106b則在其下方,所以若是以電阻式感測器為例,兩個電極104之間的感測結構106如同是由Ra和Rb構成的等效電阻,其中Ra代表區域106a的電阻、Rb代表區域106b的電阻,所以總電阻Rtotal
= Ra×Rb/(Ra+Rb)。而Rb= Ra/t,t代表厚度參數,即t= tb/ta,其中ta代表區域106a的厚度、tb代表區域106b的厚度,因為ta幾乎是固定值,所以t正比於tb。In FIG. 2A, each
假設區域106b的厚度是10倍的區域106a的厚度(t=10)的情況,模擬得到的總變化率(total variation)對區域106a的變化率的趨勢如圖3A所示,其中Y軸(總變化率)的數值等於∆Rtotal
/Rtotal
× 100;X軸(區域106a的變化率)的數值等於∆Ra/Ra × 100。從圖3A可得到,當區域106a的變化率為10%,總變化率小於1。一旦t變小(即區域106b的厚度變小),總變化率將如圖3B所示,區域106a的變化率一樣是10%,但總變化率可從小於1(t=10)增加到3以上(t=2),足足提升400%。換句話說,區域106b的厚度愈薄,總變化率愈高。總變化率的提升能降低誤差干擾對感測結果的影響,進而提升氣體感測器100的靈敏度。在一實施例中,感測結構106可利用氣溶膠噴塗製程(Aerosol Jet Printing)之類的方式在電極104之間形成。由於感測結構106的厚度(第二厚度t2)明顯比傳統需求的要薄,所以材料用量也會隨之減少,而達到成本降低的效果。此外,本實施例不需另外增設加熱器在基板102底下,就能達到提升靈敏度的效果。Assuming that the thickness of the
圖2B是圖1的A-A’線段的另一種氣體感測器的剖面示意圖,其中與圖2A的差異在於感測結構106的第二厚度t2在第一厚度t1的一半以下,譬如感測結構106的第二厚度t2相當於區域106a的厚度時,第二厚度t2可以是0.01倍以上的第一厚度t1。2B is a schematic cross-sectional view of another gas sensor along the line AA' of FIG. 1, where the difference from FIG. 2A is that the second thickness t2 of the
圖4是依照本發明的另一實施例的一種氣體感測器的上視示意圖,其中使用圖1的元件符號來表示相同或類似的構件,且相同的構件的說明可參照上述的相關內容,於此不再贅述。Fig. 4 is a schematic top view of a gas sensor according to another embodiment of the present invention, in which the component symbols of Fig. 1 are used to denote the same or similar components, and the description of the same components can refer to the above-mentioned related content. I will not repeat them here.
在圖4中,氣體感測器400的感測結構402部分覆蓋電極104。從剖面圖(圖5)可得到,感測結構402的第二厚度t2略高於第一厚度t1,且第二厚度t2例如是1.1倍以下的第一厚度t1。在一實施例中,第一厚度t1例如在1µm以上,而第二厚度t2例如在1.1µm左右。此外,從A-A’線段的剖面來看,因為感測結構402部分覆蓋電極104,所以感測結構402之間的第二距離d2小於每個電極104的寬度w。在另一實施例中,當感測結構402的第二厚度t2與電極104的第一厚度t1等高(t2/t1= 1),則第二距離d2就等於電極104的寬度w。In FIG. 4, the
圖6是依照本發明的再一實施例的一種氣體感測器的上視示意圖,其中使用圖1的元件符號來表示相同或類似的構件,且相同的構件的說明可參照上述的相關內容,於此不再贅述。Fig. 6 is a schematic top view of a gas sensor according to still another embodiment of the present invention, in which the component symbols of Fig. 1 are used to denote the same or similar components, and the description of the same components can refer to the above-mentioned related content. I will not repeat them here.
在圖6中,氣體感測器600具有部分覆蓋電極104的數個感測結構602。因此,感測結構602之間相隔的第二距離d2會小於(或等於)電極104的寬度w,其中第二距離d2的變化率例如±20%。In FIG. 6, the
綜上所述,本發明藉由降低感測結構中不受氣體影響的區域的膜層厚度,維持受氣體影響的區域的厚度,可提升氣體感測器的總變化率,進而改善氣體感測器的靈敏度。而且,由於降低感測結構的厚度,因此與傳統整面覆蓋式的感測結構相比,還可大幅減少材料使用量,使成本降低。In summary, the present invention reduces the thickness of the film in the area not affected by the gas in the sensing structure, and maintains the thickness of the area affected by the gas, which can increase the total change rate of the gas sensor, thereby improving the gas sensing The sensitivity of the device. Moreover, since the thickness of the sensing structure is reduced, compared with the traditional full-surface covering type sensing structure, the amount of material used can be greatly reduced, and the cost can be reduced.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be subject to those defined by the attached patent application scope.
100、400、600:氣體感測器
102:基板
104:電極
106、402、602:感測結構
106a、106b:區域
d1:第一距離
d2:第二距離
t1:第一厚度
t2:第二厚度
ta、tb:厚度
w:寬度100, 400, 600: gas sensor
102: substrate
104:
圖1是依照本發明的一實施例的一種氣體感測器的上視示意圖。 圖2A是圖1的A-A’線段的一種氣體感測器的剖面示意圖。 圖2B是圖1的A-A’線段的另一種氣體感測器的剖面示意圖。 圖3A是總變化率(total variation)對受到氣體影響電性的區域的變化率的趨勢圖。 圖3B是總變化率對受到氣體影響電性的區域的變化率隨厚度參數變化的趨勢圖。 圖4是依照本發明的另一實施例的一種氣體感測器的上視示意圖。 圖5是圖4的A-A’線段的一種氣體感測器的剖面示意圖。 圖6是依照本發明的再一實施例的一種氣體感測器的上視示意圖。Fig. 1 is a schematic top view of a gas sensor according to an embodiment of the present invention. Fig. 2A is a schematic cross-sectional view of a gas sensor along the line A-A' of Fig. 1. Fig. 2B is a schematic cross-sectional view of another gas sensor along the line A-A' of Fig. 1. Figure 3A is a trend diagram of the total variation versus the variation rate of the area affected by the gas on the electrical properties. Fig. 3B is a trend diagram of the change rate of the total change rate to the area affected by the gas and the change of the thickness parameter. Fig. 4 is a schematic top view of a gas sensor according to another embodiment of the present invention. Fig. 5 is a schematic cross-sectional view of a gas sensor along the line A-A' of Fig. 4. Fig. 6 is a schematic top view of a gas sensor according to still another embodiment of the present invention.
100:氣體感測器100: Gas sensor
102:基板102: substrate
104:電極104: Electrode
106:感測結構106: sensing structure
106a、106b:區域106a, 106b: area
d1:第一距離d1: first distance
t1:第一厚度t1: first thickness
t2:第二厚度t2: second thickness
ta、tb:厚度ta, tb: thickness
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CN103630582B (en) * | 2013-12-11 | 2016-02-10 | 江苏物联网研究发展中心 | A kind of MEMS humidity sensor and preparation method |
KR20200103788A (en) * | 2018-01-04 | 2020-09-02 | 라이텐, 인코포레이티드 | Resonant gas sensor |
TWI657581B (en) * | 2018-05-08 | 2019-04-21 | 新唐科技股份有限公司 | Semiconductor device |
TWI669498B (en) * | 2018-06-28 | 2019-08-21 | 國立臺灣科技大學 | Gas sensor and manufacturing method thereof |
CN109580725B (en) * | 2018-12-10 | 2020-06-26 | 华中科技大学 | Two-dimensional transition metal sulfide gas sensor based on antenna structure and preparation |
-
2020
- 2020-04-01 TW TW109111124A patent/TWI747223B/en active
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2021
- 2021-02-18 CN CN202110187406.5A patent/CN113495088A/en active Pending
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CN113495088A (en) | 2021-10-12 |
TWI747223B (en) | 2021-11-21 |
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