TW202138200A - Method for producing multilayer body and liquid composition - Google Patents

Method for producing multilayer body and liquid composition Download PDF

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Publication number
TW202138200A
TW202138200A TW110104169A TW110104169A TW202138200A TW 202138200 A TW202138200 A TW 202138200A TW 110104169 A TW110104169 A TW 110104169A TW 110104169 A TW110104169 A TW 110104169A TW 202138200 A TW202138200 A TW 202138200A
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polymer
liquid composition
tetrafluoroethylene
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mentioned
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TW110104169A
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Chinese (zh)
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山邊敦美
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日商Agc股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/082Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising vinyl resins; comprising acrylic resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/34Layered products comprising a layer of synthetic resin comprising polyamides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/01Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013Fillers, pigments or reinforcing additives
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00Compositions of unspecified rubbers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08L27/18Homopolymers or copolymers or tetrafluoroethene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L35/00Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical, and containing at least one other carboxyl radical in the molecule, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

To provide: a multilayer body which has a polymer layer that is provided with the physical properties of a tetrafluoroethylene polymer and the physical properties of a maleimide compound; and a liquid composition which contains a tetrafluoroethylene polymer and a maleimide compound. A method for producing a multilayer body according to the present invention forms a polymer layer by: applying a liquid composition, which contains a powder of a tetrafluoroethylene polymer having a melting temperature of 260 DEG C or more and a thermosetting compound having a maleimide group and an arylene group, to the surface of a base material layer; heating the liquid composition at a temperature that is not less than 100 DEG C but less than the melting temperature of the tetrafluoroethylene polymer; and further heating the liquid composition at a temperature that is not less than the melting temperature of the tetrafluoroethylene polymer. A liquid composition according to the present invention contains a powder of a specific tetrafluoroethylene polymer and the above-described thermosetting compound.

Description

積層體之製造方法及液狀組合物Manufacturing method of laminated body and liquid composition

本發明係關於一種積層體之製造方法及液狀組合物。The present invention relates to a method for manufacturing a laminate and a liquid composition.

對於用以傳輸高頻信號之印刷配線基板,要求優異之傳輸特性。作為傳輸特性較高之印刷配線基板之絕緣層材料,相對介電常數及介電損耗因數較低之四氟乙烯系聚合物備受關注。作為形成包含四氟乙烯系聚合物之絕緣層之材料,已知有包含四氟乙烯系聚合物粉末之分散液。於專利文獻1中記載有一種附帶聚合物層之銅箔之製造方法,其將含有包含聚四氟乙烯粉末及馬來醯亞胺化合物之液狀組合物之膜貼附於銅箔之表面,並進行加熱。 先前技術文獻 專利文獻For printed wiring boards used to transmit high-frequency signals, excellent transmission characteristics are required. As the insulating layer material of printed wiring boards with higher transmission characteristics, tetrafluoroethylene polymers with lower relative permittivity and dielectric loss factor have attracted much attention. As a material for forming an insulating layer containing a tetrafluoroethylene-based polymer, a dispersion liquid containing a tetrafluoroethylene-based polymer powder is known. Patent Document 1 describes a method for producing a copper foil with a polymer layer, in which a film containing a liquid composition containing polytetrafluoroethylene powder and a maleimide compound is attached to the surface of the copper foil. And heat it up. Prior art literature Patent literature

專利文獻1:國際公開2018/051715號Patent Document 1: International Publication No. 2018/051715

[發明所欲解決之問題][The problem to be solved by the invention]

然而,專利文獻1之附帶聚合物層之銅箔不僅存在由液狀組合物之膜所形成之聚合物層(絕緣層)與銅箔容易剝離這一問題,而且還存在容易翹曲這一問題,而且對其進行加工所獲得之印刷配線基板之可靠性亦不足。 本發明人等進行了銳意研究,結果得出以下見解:於使用包含具有特定熔融溫度之四氟乙烯系聚合物粉末、及特定之馬來醯亞胺化合物之液狀組合物,在特定之不同溫度條件下進行加熱而形成聚合物層之情形時,可獲得不易剝離且不易翹曲之附帶聚合物層之銅箔(積層體),而且可獲得傳輸特性優異之印刷配線基板。 又,本發明人等還得出以下見解:包含特定粉末及特定馬來醯亞胺化合物之液狀組合物之分散性優異,且處理性優異。 本發明之目的在於提供該積層體及該液狀組合物。 [解決問題之技術手段]However, the copper foil with a polymer layer of Patent Document 1 not only has the problem that the polymer layer (insulating layer) formed by the film of the liquid composition and the copper foil are easily peeled off, but also has the problem that it is easy to warp And the reliability of the printed wiring board obtained by processing it is also insufficient. The inventors conducted intensive research, and as a result, obtained the following insights: When using a liquid composition containing a tetrafluoroethylene polymer powder with a specific melting temperature and a specific maleimide compound, the specific difference When the polymer layer is formed by heating under temperature conditions, a copper foil with a polymer layer (laminated body) that is not easily peeled and not easily warped can be obtained, and a printed wiring board with excellent transmission characteristics can be obtained. In addition, the inventors of the present invention have also found that a liquid composition containing a specific powder and a specific maleimide compound has excellent dispersibility and excellent handling properties. The object of the present invention is to provide the laminate and the liquid composition. [Technical means to solve the problem]

本發明具有下述形態。 <1>一種積層體之製造方法,其對基材層之表面賦予包含熔融溫度為260℃以上之四氟乙烯系聚合物粉末、與具有馬來醯亞胺基及伸芳基之熱固性化合物之液狀組合物,於100℃以上且未達上述四氟乙烯系聚合物之熔融溫度之溫度下進行加熱,進而,於上述四氟乙烯系聚合物之熔融溫度以上之溫度下進行加熱而形成聚合物層,從而獲得具有上述基材層及上述聚合物層之積層體。 <2>如上述<1>之製造方法,其中上述四氟乙烯系聚合物係包含基於全氟(烷基乙烯基醚)之單元或基於六氟丙烯之單元之四氟乙烯系聚合物。 <3>如上述<1>或<2>之製造方法,其中上述四氟乙烯系聚合物係包含基於全氟(烷基乙烯基醚)之單元,且具有極性官能基之四氟乙烯系聚合物;或者,上述四氟乙烯系聚合物係相對於總單元包含2.0~5.0莫耳%之基於全氟(烷基乙烯基醚)之單元,且不具有極性官能基之四氟乙烯系聚合物。 <4>如上述<1>至<3>中任一項之製造方法,其中上述液狀組合物進而包含無機填料。 <5>如上述<1>至<4>中任一項之製造方法,其中上述液狀組合物進而包含彈性體。 <6>如上述<1>至<5>中任一項之製造方法,其中上述液狀組合物中之上述熱固性化合物之含量相對於上述四氟乙烯系聚合物之含量之比為0.2以下。 <7>如上述<1>至<6>中任一項之製造方法,其中上述熱固性化合物之硬化物之玻璃轉移溫度為上述四氟乙烯系聚合物之熔融溫度以下。 <8>如上述<1>至<7>中任一項之製造方法,其中上述基材層為金屬箔或聚合物膜。 <9>一種液狀組合物,其含有包含基於全氟(烷基乙烯基醚)之單元之四氟乙烯系聚合物粉末、與具有馬來醯亞胺基及伸芳基之熱固性化合物,且上述四氟乙烯系聚合物具有極性官能基,或者相對於總單元包含2.0~5.0莫耳%之基於上述全氟(烷基乙烯基醚)之單元且不具有極性官能基。 <10>如上述<9>之液狀組合物,其中上述熱固性化合物之分子量為300~2000。 <11>如上述<9>或<10>之液狀組合物,其中上述四氟乙烯系聚合物粉末之平均粒徑為40 μm以下。 <12>如上述<9>至<11>中任一項之液狀組合物,其進而包含無機填料。 <13>如上述<9>至<12>中任一項之液狀組合物,其進而包含彈性體。 <14>如上述<9>至<13>中任一項之液狀組合物,其中上述液狀組合物中之上述熱固性化合物之含量相對於上述四氟乙烯系聚合物之含量之比為0.2以下。 <15>如上述<9>至<14>中任一項之液狀組合物,其中上述液狀組合物在25℃下之黏度為100~5000 mPa・s。 [發明之效果]The present invention has the following aspects. <1> A method for manufacturing a laminate, wherein the surface of the substrate layer is provided with a combination of tetrafluoroethylene polymer powder with a melting temperature of 260°C or higher, and a thermosetting compound having a maleimide group and an arylene group The liquid composition is heated at a temperature above 100°C and below the melting temperature of the above-mentioned tetrafluoroethylene-based polymer, and further heated at a temperature above the melting temperature of the above-mentioned tetrafluoroethylene-based polymer to form polymerization The object layer is obtained to obtain a laminate having the above-mentioned base layer and the above-mentioned polymer layer. <2> The manufacturing method of the above <1>, wherein the tetrafluoroethylene-based polymer is a tetrafluoroethylene-based polymer containing perfluoro(alkyl vinyl ether)-based units or hexafluoropropylene-based units. <3> The manufacturing method as in the above <1> or <2>, wherein the above-mentioned tetrafluoroethylene-based polymer contains a unit based on perfluoro(alkyl vinyl ether) and a tetrafluoroethylene-based polymer with a polar functional group Or, the above-mentioned tetrafluoroethylene-based polymer is a tetrafluoroethylene-based polymer that contains 2.0-5.0 mol% of perfluoro(alkyl vinyl ether)-based units relative to the total unit and does not have a polar functional group . <4> The production method according to any one of the above <1> to <3>, wherein the liquid composition further contains an inorganic filler. <5> The production method according to any one of the above <1> to <4>, wherein the liquid composition further contains an elastomer. <6> The production method according to any one of the above <1> to <5>, wherein the ratio of the content of the thermosetting compound in the liquid composition to the content of the tetrafluoroethylene-based polymer is 0.2 or less. <7> The production method according to any one of the above <1> to <6>, wherein the glass transition temperature of the cured product of the thermosetting compound is less than the melting temperature of the tetrafluoroethylene-based polymer. <8> The manufacturing method according to any one of the above <1> to <7>, wherein the substrate layer is a metal foil or a polymer film. <9> A liquid composition containing a tetrafluoroethylene polymer powder containing a unit based on perfluoro(alkyl vinyl ether), and a thermosetting compound having a maleimide group and an arylene group, and The tetrafluoroethylene-based polymer has a polar functional group, or contains 2.0 to 5.0 mol% of the unit based on the perfluoro(alkyl vinyl ether) with respect to the total unit and does not have a polar functional group. <10> The liquid composition according to the above <9>, wherein the molecular weight of the thermosetting compound is 300-2000. <11> The liquid composition according to the above <9> or <10>, wherein the average particle size of the tetrafluoroethylene polymer powder is 40 μm or less. <12> The liquid composition of any one of the above-mentioned <9> to <11>, which further contains an inorganic filler. <13> The liquid composition of any one of the above-mentioned <9> to <12>, which further contains an elastomer. <14> The liquid composition of any one of the above <9> to <13>, wherein the ratio of the content of the thermosetting compound in the liquid composition to the content of the tetrafluoroethylene polymer is 0.2 the following. <15> The liquid composition according to any one of the above <9> to <14>, wherein the viscosity of the liquid composition at 25°C is 100 to 5000 mPa·s. [Effects of Invention]

根據本發明,可獲得具有基材層及聚合物層,且剝離強度及電氣特性優異之積層體,上述聚合物層包含四氟乙烯系聚合物及特定之熱固性化合物之硬化物。又,可獲得包含特定之四氟乙烯系聚合物粉末及特定之馬來醯亞胺化合物,且分散性及處理性優異之液狀組合物。According to the present invention, it is possible to obtain a laminate having a base layer and a polymer layer and excellent in peel strength and electrical properties. The polymer layer includes a cured product of a tetrafluoroethylene-based polymer and a specific thermosetting compound. In addition, a liquid composition containing a specific tetrafluoroethylene polymer powder and a specific maleimide compound and having excellent dispersibility and handling properties can be obtained.

以下用語具有以下含義。 「平均粒徑(D50)」係藉由雷射繞射散射法所求出之對象物(粉末或填料)粉末之體積基準累積50%直徑。即,藉由雷射繞射散射法而測定對象物之粒度分佈,將對象物粒子之集群之總體積設為100%,求出累積曲線,上述「平均粒徑(D50)」係於該累積曲線上累積體積達到50%之點之粒徑。 「D90」係同樣地測得之對象物之體積基準累積90%直徑。 「熔融溫度(熔點)」係與藉由示差掃描熱量測定(DSC)法所測得之聚合物之融解峰之最大值對應之溫度。 「玻璃轉移溫度(Tg)」係藉由動態黏彈性測定(DMA)法對聚合物、硬化物或彈性體進行分析而測得之值。 「黏度」係使用B型黏度計,以25℃於轉速為30 rpm之條件下對液狀組合物進行測定而求出之值。反覆測定3次,取3次測定值之平均值。 所謂「觸變比」係指於轉速為30 rpm之條件下測定液狀組合物而求出黏度η1 ,於轉速為60 rpm之條件下測定液狀組合物而求出黏度η2 ,η1 除以η2 而算出之值(η12 )。 聚合物中之「單元」可為由單體直接形成之原子團,亦可為藉由特定方法對所獲得之聚合物進行處理而轉換結構之一部分所得之原子團。亦將聚合物中所包含之基於單體A之單元簡記為「單體A單元」。The following terms have the following meanings. "Average particle size (D50)" is the cumulative 50% diameter of the object (powder or filler) powder determined by the laser diffraction scattering method. That is, the particle size distribution of the object is measured by the laser diffraction scattering method, the total volume of the cluster of object particles is set to 100%, and the cumulative curve is obtained. The above-mentioned "average particle diameter (D50)" is based on the cumulative The particle size at the point where the cumulative volume reaches 50% on the curve. "D90" is the cumulative 90% diameter of the object measured in the same way. The "melting temperature (melting point)" is the temperature corresponding to the maximum value of the melting peak of the polymer measured by the differential scanning calorimetry (DSC) method. "Glass transition temperature (Tg)" is the value measured by analyzing the polymer, hardened product, or elastomer by the dynamic viscoelasticity measurement (DMA) method. "Viscosity" is a value obtained by measuring a liquid composition at 25°C and a rotation speed of 30 rpm using a B-type viscometer. Repeat the measurement 3 times and take the average of the 3 measurements. The so-called "thixotropy ratio" refers to the viscosity η 1 of the liquid composition measured at a rotation speed of 30 rpm, and the viscosity η 2 , η 1 of the liquid composition measured at a rotation speed of 60 rpm. The value calculated by dividing by η 2 (η 12 ). The "unit" in the polymer can be an atomic group formed directly from a monomer, or an atomic group obtained by converting a part of the structure by processing the obtained polymer by a specific method. The monomer A-based unit contained in the polymer is also abbreviated as "monomer A unit".

本發明之製造方法(以下,亦記為「本法」)係如下方法,即,對基材層之表面賦予包含熔融溫度為260℃以上之四氟乙烯系聚合物(以下,亦記為「F聚合物」)粉末、與具有馬來醯亞胺基及伸芳基之熱固性化合物(以下,亦記為「馬來醯亞胺系化合物」)之液狀組合物,於100℃以上且未達F聚合物之熔融溫度之溫度下進行加熱(以下,亦記為「初期加熱」),進而,於F聚合物之熔融溫度以上之溫度下進行加熱(以下,亦記為「後期加熱」)而形成聚合物層,從而製造具有基材層及聚合物層之積層體。The production method of the present invention (hereinafter, also referred to as "this method") is a method in which a tetrafluoroethylene-based polymer containing a melting temperature of 260°C or higher (hereinafter, also referred to as " F polymer") powder, and a liquid composition of a thermosetting compound having a maleimide group and an arylene group (hereinafter, also referred to as "maleimide compound"), at a temperature above 100°C and no Heat at a temperature that reaches the melting temperature of the F polymer (hereinafter, also referred to as "initial heating"), and then heat at a temperature above the melting temperature of the F polymer (hereinafter, also referred to as "post-heating") The polymer layer is formed to produce a laminate having a base layer and a polymer layer.

根據本法,可獲得如下積層體,其高程度地具備F聚合物之物性(電氣特性等)及馬來醯亞胺系化合物之物性(黏著性、低線膨脹性等),剝離強度及電氣特性優異且不易翹曲。關於其原因,雖未必明確但本發明人等認為如下。 若對基材層賦予包含極性較高之馬來醯亞胺系化合物與極性較低之F聚合物粉末之液狀組合物,並藉由一次加熱而形成聚合物層,則於聚合物層中,F聚合物與馬來醯亞胺系化合物之硬化物分別被定域化。因此,所獲得之積層體之剝離強度會因已定域化之F聚合物之線膨脹性而降低,從而容易翹曲,且電氣特性容易因已定域化之馬來醯亞胺系化合物之硬化物而降低。According to this method, the following laminates can be obtained, which possess the physical properties of F polymer (electrical properties, etc.) and the physical properties of maleimide compounds (adhesiveness, low linear expansion, etc.), peel strength, and electrical properties to a high degree. Excellent properties and not easy to warp. Although the reason is not necessarily clear, the inventors of the present invention consider it as follows. If a liquid composition containing a maleimide compound with a higher polarity and a F polymer powder with a lower polarity is given to the base layer, and the polymer layer is formed by one heating, then the polymer layer , The hardened products of F polymer and maleimide-based compound are respectively localized. Therefore, the peel strength of the obtained laminate is reduced due to the linear expansion of the localized F polymer, which is easy to warp, and the electrical properties are easily affected by the localized maleimide compound. The hardened material is reduced.

對此,本法藉由初期加熱使馬來醯亞胺系化合物部分地硬化(反應)而降低其極性,然後藉由後期加熱使F聚合物之微粒子狀粉末熔融而焙燒,從而形成聚合物層。即,於後期加熱中,一面使F聚合物與馬來醯亞胺系化合物之硬化物高程度地相溶一面形成聚合物層。其結果為,形成F聚合物與馬來醯亞胺系化合物之硬化物得到均勻分佈之聚合物層。因此,根據本法,可獲得具有高程度地具備各者之物性(F聚合物之電氣特性、馬來醯亞胺系化合物之硬化物之黏著性、低線膨脹性等)之聚合物層之積層體。又,由於在該積層體之聚合物層中,馬來醯亞胺系化合物之硬化物高程度地分散於具有阻燃性之F聚合物中,故而該積層體之阻燃性亦優異。 本法中之F粉末較佳為包含F聚合物。粉末中之F聚合物之含量較佳為80質量%以上,更佳為100質量%。 作為F粉末中可包含之其他成分,可例舉與F聚合物不同之聚合物及無機物。In this way, in this method, the maleimide compound is partially hardened (reacted) by initial heating to reduce its polarity, and then the fine particles of the F polymer powder are melted and fired by the latter heating to form a polymer layer. . That is, in the later heating, the polymer layer is formed while the F polymer and the cured product of the maleimide-based compound are highly compatible with each other. As a result, a polymer layer in which the cured product of the F polymer and the maleimide compound is uniformly distributed is formed. Therefore, according to this method, it is possible to obtain a polymer layer with a high degree of physical properties (electrical properties of F polymer, adhesion of hardened maleimide compounds, low linear expansion, etc.) Layered body. In addition, in the polymer layer of the laminate, the cured product of the maleimide compound is dispersed in the flame-retardant F polymer to a high degree, so the laminate is also excellent in flame retardancy. The F powder in this method preferably contains F polymer. The content of the F polymer in the powder is preferably 80% by mass or more, more preferably 100% by mass. As other components that can be included in the F powder, polymers and inorganic substances different from the F polymer can be mentioned.

作為與F聚合物不同之聚合物,可例舉:芳香族聚酯、聚醯胺醯亞胺、熱塑性聚醯亞胺、聚苯醚、聚氧二甲苯。 作為無機物,可例舉:氧化矽(silica)、金屬氧化物(氧化鈹、氧化鈰、氧化鋁、鹼氧化鋁、氧化鎂、氧化鋅、氧化鈦等)、氮化硼、偏矽酸鎂(塊滑石)。 包含上述成分之F粉末較佳為具有以F聚合物作為核且具有上述成分作為殼之核殼結構;或者,具有以F聚合物作為殼且具有上述成分作為核之核殼結構。該F粉末例如係使F聚合物粉末與上述成分之粉末黏聚(碰撞、凝集等)而獲得。Examples of polymers different from the F polymer include aromatic polyester, polyamide imide, thermoplastic polyimide, polyphenylene ether, and polyoxyxylene. Examples of inorganic substances include: silicon oxide (silica), metal oxides (beryllium oxide, cerium oxide, aluminum oxide, alkali aluminum oxide, magnesium oxide, zinc oxide, titanium oxide, etc.), boron nitride, magnesium metasilicate ( Talc). The F powder containing the above-mentioned components preferably has a core-shell structure with an F polymer as a core and the above-mentioned components as a shell; or a core-shell structure with an F polymer as a shell and the above-mentioned components as a core. This F powder is obtained, for example, by cohesive (collision, aggregation, etc.) between F polymer powder and the powder of the above-mentioned components.

F粉末之D50較佳為40 μm以下,更佳為25 μm以下,進而較佳為8 μm以下。F粉末之D50較佳為0.01 μm以上,更佳為0.1 μm以上,進而較佳為1 μm以上。於該情形時,液狀組合物之分散性及處理性得到提高,容易進一步促進形成聚合物層時之F聚合物與馬來醯亞胺系化合物之硬化物之相溶。 F粉末之D90較佳為15 μm以下,更佳為10 μm以下。換言之,F粉末較佳為不含粗大粒子(粒徑為10 μm以上或15 μm以上之F聚合物之粒子)。於該情形時,容易進一步促進形成聚合物層時之F聚合物與馬來醯亞胺系化合物之硬化物之相溶。 本法中之液狀組合物中之F粉末之含量較佳為5質量%以上,更佳為10質量%以上。F粉末之含量較佳為50質量%以下,更佳為30質量%以下。於該情形時,液狀組合物之分散性及處理性變得優異,又,容易進一步促進形成聚合物層時之F聚合物與馬來醯亞胺系化合物之硬化物之相溶。The D50 of the F powder is preferably 40 μm or less, more preferably 25 μm or less, and still more preferably 8 μm or less. The D50 of the F powder is preferably 0.01 μm or more, more preferably 0.1 μm or more, and still more preferably 1 μm or more. In this case, the dispersibility and handleability of the liquid composition are improved, and it is easy to further promote the compatibility of the F polymer and the cured product of the maleimide compound when the polymer layer is formed. The D90 of the F powder is preferably 15 μm or less, more preferably 10 μm or less. In other words, the F powder preferably does not contain coarse particles (particles of F polymer with a particle size of 10 μm or more or 15 μm or more). In this case, it is easy to further promote the compatibility of the F polymer and the cured product of the maleimide compound when forming the polymer layer. The content of the F powder in the liquid composition in this method is preferably 5% by mass or more, more preferably 10% by mass or more. The content of the F powder is preferably 50% by mass or less, more preferably 30% by mass or less. In this case, the dispersibility and handleability of the liquid composition become excellent, and it is easy to further promote the compatibility of the F polymer and the cured product of the maleimide compound when the polymer layer is formed.

本法中之F聚合物係熔融溫度為260℃以上且包含基於四氟乙烯(TFE)之單元(TFE單元)之聚合物。 作為F聚合物,可例舉:聚四氟乙烯(PTFE)、TFE與乙烯之共聚物(ETFE)、TFE與丙烯之共聚物、TFE與全氟(烷基乙烯基醚)(PAVE)之共聚物(PFA)、TFE與六氟丙烯(HFP)之共聚物(FEP)。上述共聚物可進而包含基於其他共聚單體之單元。 再者,PTFE除包含TFE之均聚物以外,還包含極微量之共聚單體(PAVE、HFP、FAE等)與TFE之共聚物(所謂之改性PTFE)。改性PTFE較佳為相對於總單元包含99.5莫耳%以上TFE單元,更佳為包含99.9莫耳%以上TFE單元。The F polymer in this method is a polymer having a melting temperature of 260°C or higher and containing units (TFE units) based on tetrafluoroethylene (TFE). Examples of F polymers include: polytetrafluoroethylene (PTFE), copolymer of TFE and ethylene (ETFE), copolymer of TFE and propylene, copolymer of TFE and perfluoro(alkyl vinyl ether) (PAVE) (PFA), TFE and hexafluoropropylene (HFP) copolymer (FEP). The above-mentioned copolymer may further include units based on other comonomers. Furthermore, in addition to homopolymers containing TFE, PTFE also contains a very small amount of copolymers of comonomers (PAVE, HFP, FAE, etc.) and TFE (so-called modified PTFE). The modified PTFE preferably contains 99.5 mol% or more of TFE units relative to the total unit, and more preferably contains 99.9 mol% or more of TFE units.

作為F聚合物,較佳為包含基於全氟(烷基乙烯基醚)之單元(PAVE單元)、及基於六氟丙烯之單元(HFP單元)之四氟乙烯系聚合物。該情形之F聚合物可包含PAVE單元及HFP單元兩者,亦可僅包含任意一者。 作為PAVE,較佳為CF2 =CFOCF3 、CF2 =CFOCF2 CF3 及CF2 =CFOCF2 CF2 CF3 (PPVE),更佳為PPVE。 F聚合物可具有極性官能基(含氧極性基)。極性官能基可包含在F聚合物中之單元中,亦可包含在聚合物之主鏈之末端基中。作為後者之形態,可例舉:具有極性官能基作為源自聚合起始劑、鏈轉移劑等之末端基之F聚合物;對F聚合物進行電漿處理或電離輻射處理而獲得之具有極性官能基之F聚合物。As the F polymer, a tetrafluoroethylene-based polymer containing a perfluoro(alkyl vinyl ether)-based unit (PAVE unit) and a hexafluoropropylene-based unit (HFP unit) is preferred. The F polymer in this case may include both the PAVE unit and the HFP unit, or only any one of them. As PAVE, CF 2 =CFOCF 3 , CF 2 =CFOCF 2 CF 3 and CF 2 =CFOCF 2 CF 2 CF 3 (PPVE) are preferred, and PPVE is more preferred. The F polymer may have a polar functional group (oxygen-containing polar group). The polar functional group may be contained in the unit in the F polymer, or may be contained in the terminal group of the main chain of the polymer. As the latter form, examples include: F polymer having a polar functional group as a terminal group derived from a polymerization initiator, chain transfer agent, etc.; Functional group F polymer.

自形成聚合物層時之F聚合物與馬來醯亞胺系化合物之硬化物之相溶性方面考慮,極性官能基較佳為含有羥基之基及含有羰基之基,自液狀組合物之分散性方面考慮,更佳為含有羰基之基。 含有羥基之基較佳為含有醇性羥基之基,更佳為-CF2 CH2 OH及-C(CF3 )2 OH。 含有羰基之基係包含羰基(>C(O))之基,較佳為:羧基、烷氧羰基、醯胺基、異氰酸基、胺基甲酸酯基(-OC(O)NH2 )、酸酐殘基(-C(O)OC(O)-)、醯亞胺殘基(-C(O)NHC(O)-等)及碳酸酯基(-OC(O)O-)。 F聚合物中之含有羰基之基之數量較佳為主鏈之碳數每1×106 個中具有10~5000個,更佳為100~3000個,進而較佳為800~1500個。再者,F聚合物中之含有羰基之基之數量可根據聚合物之組成或國際公開2020/145133號中所記載之方法進行定量。Considering the compatibility between the F polymer and the cured product of the maleimide compound when forming the polymer layer, the polar functional group is preferably a hydroxyl group-containing group and a carbonyl group-containing group, and is dispersed from a liquid composition In terms of sex, a carbonyl group-containing group is more preferable. The hydroxyl group-containing group is preferably an alcoholic hydroxyl group-containing group, more preferably -CF 2 CH 2 OH and -C(CF 3 ) 2 OH. The group containing a carbonyl group is a group containing a carbonyl group (>C(O)), preferably: a carboxyl group, an alkoxycarbonyl group, an amide group, an isocyanate group, a urethane group (-OC(O)NH 2 ), acid anhydride residues (-C(O)OC(O)-), imine residues (-C(O)NHC(O)- etc.) and carbonate groups (-OC(O)O-). The number of carbonyl-containing groups in the F polymer is preferably 10 to 5000 per 1×10 6 carbons in the main chain, more preferably 100 to 3000, and still more preferably 800 to 1500. Furthermore, the number of carbonyl-containing groups in the F polymer can be quantified according to the composition of the polymer or the method described in International Publication No. 2020/145133.

作為F聚合物,較佳為如下聚合物,其包含TFE單元及PAVE單元,相對於總單元包含1.5~5.0莫耳%之PAVE單元,且熔融溫度為280~320℃。 作為F聚合物,較佳為聚合物(1)及聚合物(2),更佳為聚合物(1),上述聚合物(1)包含TFE單元及PAVE單元,且具有極性官能基;上述聚合物(2)包含TFE單元及PAVE單元,相對於總單元包含2.0~5.0莫耳%之PAVE單元,且不具有極性官能基。 於該情形時,在形成聚合物時容易形成微晶,容易進一步促進形成聚合物層時之F聚合物與馬來醯亞胺系化合物之硬化物之相溶。The F polymer is preferably a polymer that contains TFE units and PAVE units, contains 1.5-5.0 mol% of PAVE units relative to the total units, and has a melting temperature of 280-320°C. As the F polymer, the polymer (1) and the polymer (2) are preferred, and the polymer (1) is more preferred. The polymer (1) includes a TFE unit and a PAVE unit, and has a polar functional group; The substance (2) contains TFE units and PAVE units, contains 2.0-5.0 mol% of PAVE units relative to the total units, and does not have a polar functional group. In this case, it is easy to form crystallites when the polymer is formed, and it is easy to further promote the compatibility of the F polymer and the cured product of the maleimide-based compound when the polymer layer is formed.

作為聚合物(1),較佳為如下聚合物,其包含TFE單元、PAVE單元及基於具有極性官能基之單體之單元。該聚合物較佳為相對於總單元分別含有:90~99莫耳%之TFE單元,0.5~9.97莫耳%之PAVE單元及0.01~3莫耳%之基於具有極性官能基之單體之單元。 又,作為具有極性官能基之單體,較佳為:伊康酸酐、檸康酸酐及5-降𦯉烯-2,3-二甲酸酐(別稱:雙環庚烯二甲酸酐;以下亦記為「NAH」)。 作為聚合物(1)之具體例,可例舉國際公開第2018/16644號中所記載之聚合物。As the polymer (1), a polymer containing a TFE unit, a PAVE unit, and a unit based on a monomer having a polar functional group is preferred. The polymer preferably contains 90-99 mol% of TFE units, 0.5-9.97 mol% of PAVE units, and 0.01-3 mol% of units based on monomers with polar functional groups, relative to the total units. . In addition, as the monomer having a polar functional group, preferably: itaconic acid anhydride, citraconic acid anhydride, and 5-norene-2,3-dicarboxylic acid anhydride (another name: bicycloheptene dicarboxylic acid anhydride; hereinafter also referred to as "NAH"). As a specific example of the polymer (1), the polymer described in International Publication No. 2018/16644 can be cited.

聚合物(2)較佳為僅由TFE單元及PAVE單元構成,且相對於總單元含有95.0~98.0莫耳%之TFE單元、2.0~5.0莫耳%之PAVE單元。 聚合物(2)中之PAVE單元之含量較佳為相對於總單元為2.1莫耳%以上,更佳為2.2莫耳%以上。 再者,所謂聚合物(2)不具有極性官能基,意指構成聚合物主鏈之碳原子數之每1×106 個中,聚合物所具有之極性官能基之數量未達500個。上述極性官能基之數量較佳為100個以下,更佳為未達50個。上述極性官能基之數量之下限通常為0個。 聚合物(2)可使用不產生極性官能基作為聚合物鏈之末端基之聚合起始劑或鏈轉移劑等來製造,亦可對具有極性官能基之F聚合物(於聚合物之主鏈之末端基具有源自聚合起始劑之極性官能基之F聚合物等)進行氟化處理來製造。作為氟化處理之方法,可例舉使用氟氣之方法(參照日本專利特開2019-194314號公報等)。The polymer (2) is preferably composed only of TFE units and PAVE units, and contains 95.0-98.0 mol% of TFE units and 2.0-5.0 mol% of PAVE units relative to the total units. The content of the PAVE unit in the polymer (2) is preferably 2.1 mol% or more with respect to the total units, more preferably 2.2 mol% or more. Furthermore, the so-called polymer (2) without polar functional groups means that the number of polar functional groups contained in the polymer is less than 500 per 1×10 6 carbon atoms constituting the main chain of the polymer. The number of the aforementioned polar functional groups is preferably 100 or less, more preferably less than 50. The lower limit of the number of the aforementioned polar functional groups is usually zero. Polymer (2) can be produced by using polymerization initiators or chain transfer agents that do not generate polar functional groups as the end groups of the polymer chain, and can also be used for F polymers with polar functional groups (in the main chain The terminal group has a polar functional group derived from the polymerization initiator, etc.) by fluorination treatment. As a method of fluorination treatment, a method using fluorine gas can be exemplified (refer to Japanese Patent Laid-Open No. 2019-194314, etc.).

F聚合物之熔融溫度為260℃以上,較佳為275~325℃,更佳為280~320℃。於該情形時,F聚合物與馬來醯亞胺系化合物均勻地分佈於聚合物層中,積層體之電氣特性、剝離強度及低線膨脹性變得優異。 F聚合物之玻璃轉移溫度較佳為75~125℃,更佳為80~100℃。The melting temperature of the F polymer is 260°C or higher, preferably 275 to 325°C, more preferably 280 to 320°C. In this case, the F polymer and the maleimide-based compound are uniformly distributed in the polymer layer, and the electrical properties, peel strength, and low linear expansion of the laminate become excellent. The glass transition temperature of the F polymer is preferably 75 to 125°C, more preferably 80 to 100°C.

本法中之馬來醯亞胺系化合物係具有馬來醯亞胺基(下式(1)所表示之一價基)及伸芳基之化合物。 [化1]

Figure 02_image001
The maleimine compound in this method is a compound having a maleimine group (a monovalent group represented by the following formula (1)) and an aryl group. [化1]
Figure 02_image001

馬來醯亞胺系化合物較佳為包含2個以上馬來醯亞胺基,更佳為包含2~10個馬來醯亞胺基,進而較佳為包含2~4個馬來醯亞胺基。馬來醯亞胺系化合物可為低聚物狀,亦可為聚合物狀。於該情形時,馬來醯亞胺基可僅存在於末端基,亦可僅存在於側鏈,亦可存在於末端基及側鏈兩處。The maleimide compound preferably contains 2 or more maleimine groups, more preferably 2-10 maleimine groups, and still more preferably 2 to 4 maleimine groups. base. The maleimide-based compound may be in the form of an oligomer or in the form of a polymer. In this case, the maleimide group may exist only in the terminal group, may exist only in the side chain, or may exist in both the terminal group and the side chain.

作為馬來醯亞胺系化合物之伸芳基,較佳為伸苯基及伸萘基,更佳為伸苯基。馬來醯亞胺系化合物之伸芳基之氫原子可被其他原子或原子團取代。又,伸芳基之氫原子亦可被馬來醯亞胺基取代。 馬來醯亞胺系化合物較佳為包含2個以上伸苯基。於該情形時,藉由初期加熱,容易使馬來醯亞胺系化合物及其硬化物之極性進一步降低,後期加熱中之與F聚合物之相溶性得到提高,從而容易提高積層體之物性。又,積層體之UV(Ultraviolet,紫外線)吸收性提高,UV雷射加工性提高,從而容易將積層體加工成印刷配線基板。As the arylene group of the maleimide compound, phenylene and naphthylene are preferred, and phenylene is more preferred. The hydrogen atom of the aryl group of the maleimide compound can be replaced by other atoms or groups of atoms. In addition, the hydrogen atom of the aryl group may be substituted by a maleimino group. The maleimide-based compound preferably contains two or more phenylene groups. In this case, it is easy to further reduce the polarity of the maleimide-based compound and its cured product by the initial heating, and the compatibility with the F polymer in the later heating is improved, thereby easily improving the physical properties of the laminate. In addition, the UV (Ultraviolet) absorption of the laminate is improved, and the UV laser processability is improved, making it easy to process the laminate into a printed wiring board.

馬來醯亞胺系化合物可為一種,亦可為兩種以上之混合物。 馬來醯亞胺系化合物較佳為下式(2)所表示之化合物。 [化2]

Figure 02_image003
[式(2)中,Q為具有伸芳基之n價有機基,n為2~4之整數]The maleimide compound may be one type or a mixture of two or more types. The maleimide-based compound is preferably a compound represented by the following formula (2). [化2]
Figure 02_image003
[In formula (2), Q is an n-valent organic group having an aryl extension, and n is an integer of 2 to 4]

液狀組合物中之馬來醯亞胺系化合物之含量較佳為0.01質量%以上,更佳為0.1質量%以上。馬來醯亞胺系化合物之含量較佳為10質量%以下,更佳為5質量%以下。 液狀組合物中之馬來醯亞胺系化合物之含量相對於F聚合物之含量之比(質量比)較佳為0.001以上,更佳為0.01以上。上述比較佳為0.2以下,更佳為0.15以下。於該情形時,於形成聚合物層時,容易形成如下聚合物層,其具有馬來醯亞胺系化合物之硬化物被已熔融之F聚合物包圍,從而以F聚合物為海,以硬化物為島之緻密之海島結構。其結果為,於積層體中,F聚合物之物性與馬來醯亞胺系化合物之熱硬化物之物性更加平衡,積層體之電氣特性、剝離強度、不易翹曲性、阻燃性等物性容易提高。The content of the maleimide compound in the liquid composition is preferably 0.01% by mass or more, more preferably 0.1% by mass or more. The content of the maleimide-based compound is preferably 10% by mass or less, and more preferably 5% by mass or less. The ratio (mass ratio) of the content of the maleimine compound in the liquid composition to the content of the F polymer is preferably 0.001 or more, more preferably 0.01 or more. The above-mentioned comparison is preferably 0.2 or less, and more preferably 0.15 or less. In this case, when the polymer layer is formed, it is easy to form a polymer layer in which the hardened product of the maleimide compound is surrounded by the molten F polymer, so that the F polymer is used as the sea to harden The thing is the dense island structure of the island. As a result, in the laminate, the physical properties of the F polymer and the thermosetting product of the maleimide compound are more balanced, and the electrical properties, peel strength, warpage resistance, flame retardancy and other physical properties of the laminate are more balanced. Easy to improve.

馬來醯亞胺系化合物較佳為其硬化物之玻璃轉移溫度為F聚合物之熔融溫度以下。具體而言,馬來醯亞胺系化合物之硬化物之玻璃轉移溫度較佳為100~250℃。於該情形時,F聚合物與馬來醯亞胺系化合物均勻地分佈於聚合物層中,積層體之電氣特性、剝離強度及低線膨脹性變得優異。 馬來醯亞胺系化合物之分子量較佳為300~2000,更佳為500~1500。於該情形時,F聚合物與馬來醯亞胺系化合物之硬化物均勻地分佈於聚合物層中,積層體之電氣特性、剝離強度及低線膨脹性變得優異。It is preferable that the maleimide-based compound has a glass transition temperature of the cured product below the melting temperature of the F polymer. Specifically, the glass transition temperature of the cured product of the maleimide compound is preferably 100 to 250°C. In this case, the F polymer and the maleimide-based compound are uniformly distributed in the polymer layer, and the electrical properties, peel strength, and low linear expansion of the laminate become excellent. The molecular weight of the maleimide compound is preferably 300-2000, more preferably 500-1500. In this case, the cured product of the F polymer and the maleimide compound is uniformly distributed in the polymer layer, and the electrical properties, peel strength, and low linear expansion of the laminate become excellent.

本法中之液狀組合物較佳為包含液狀分散介質。液狀分散介質係作為F粉末及馬來醯亞胺系化合物之分散介質發揮功能且於25℃下為惰性之液體化合物。液狀分散介質可為一種,亦可為兩種以上之混合物。於混合物之情形時,較佳為不同種類之液體化合物相溶。 液狀分散介質之沸點較佳為125~250℃。於該情形時,在初期加熱時自液狀組合物中去除液狀分散介質時,F粉末會流動而容易緻密地填充。 作為液狀分散介質,自液狀組合物之液體物性(黏度、觸變比等)之調整及馬來醯亞胺系化合物之溶解性方面考慮,較佳為有機溶劑(有機化合物),自液狀組合物之分散穩定性方面考慮,較佳為選自由醯胺、酮及酯所組成之群中之一種以上之液體化合物,更佳為N-甲基-2-吡咯啶酮、γ-丁內酯、環己酮及環戊酮。 液狀組合物中之液狀分散介質之含量較佳為30質量%以上,更佳為50質量%以上。液狀分散介質之含量較佳為90質量%以下。The liquid composition in this method preferably contains a liquid dispersion medium. The liquid dispersion medium is a liquid compound that functions as a dispersion medium of the F powder and the maleimide compound and is inert at 25°C. The liquid dispersion medium may be one type or a mixture of two or more types. In the case of a mixture, it is preferable that different types of liquid compounds are compatible. The boiling point of the liquid dispersion medium is preferably 125 to 250°C. In this case, when the liquid dispersion medium is removed from the liquid composition during the initial heating, the F powder flows and is easily densely filled. As a liquid dispersion medium, considering the adjustment of the liquid properties (viscosity, thixotropy ratio, etc.) of the liquid composition and the solubility of the maleimide-based compound, an organic solvent (organic compound) is preferred. In consideration of the dispersion stability of the composition, it is preferably one or more liquid compounds selected from the group consisting of amides, ketones and esters, more preferably N-methyl-2-pyrrolidone and γ-butanone. Lactone, cyclohexanone and cyclopentanone. The content of the liquid dispersion medium in the liquid composition is preferably 30% by mass or more, more preferably 50% by mass or more. The content of the liquid dispersion medium is preferably 90% by mass or less.

想要進一步提高積層體之低線膨脹性,本法中之液狀組合物較佳為進而包含無機填料。 作為無機填料,較佳為氮化物填料及無機氧化物填料,更佳為氮化硼填料、氧化鈹填料(鈹之氧化物填料)、矽酸鹽填料(氧化矽填料、矽灰石填料、滑石填料)、及金屬氧化物(氧化鈰、氧化鋁、氧化鎂、氧化鋅、氧化鈦等)填料,進而較佳為氧化矽填料。 無機填料中之氧化矽之含量較佳為50質量%以上,更佳為75質量%。氧化矽之含量較佳為100質量%以下。In order to further improve the low linear expansion of the laminate, the liquid composition in this method preferably further contains an inorganic filler. As inorganic fillers, nitride fillers and inorganic oxide fillers are preferred, and boron nitride fillers, beryllium oxide fillers (beryllium oxide fillers), silicate fillers (silica fillers, wollastonite fillers, and talc) are more preferred. Filler), and metal oxide (cerium oxide, aluminum oxide, magnesium oxide, zinc oxide, titanium oxide, etc.) fillers, and more preferably silica fillers. The content of silica in the inorganic filler is preferably 50% by mass or more, more preferably 75% by mass. The content of silicon oxide is preferably 100% by mass or less.

無機填料較佳為其表面之至少一部分經表面處理。作為用於該表面處理之表面處理劑,可例舉:多元醇(三羥甲基乙烷、季戊四醇、丙二醇等)、飽和脂肪酸(硬脂酸、月桂酸等)、其酯、烷醇胺、胺(三甲胺、三乙胺等)、石蠟、矽烷偶合劑、矽酮、聚矽氧烷。 作為矽烷偶合劑,較佳為:3-胺基丙基三乙氧基矽烷、乙烯基三甲氧基矽烷、3-巰丙基三甲氧基矽烷、3-縮水甘油氧基丙基甲基二乙氧基矽烷、3-甲基丙烯醯氧基丙基三乙氧基矽烷及3-異氰酸基丙基三乙氧基矽烷。The inorganic filler is preferably surface-treated at least a part of its surface. The surface treatment agent used for the surface treatment may, for example, be polyols (trimethylolethane, pentaerythritol, propylene glycol, etc.), saturated fatty acids (stearic acid, lauric acid, etc.), esters, alkanolamines, Amine (trimethylamine, triethylamine, etc.), paraffin, silane coupling agent, silicone, polysiloxane. As the silane coupling agent, preferred are: 3-aminopropyltriethoxysilane, vinyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-glycidoxypropylmethyldiethyl Oxysilane, 3-methacryloxypropyltriethoxysilane and 3-isocyanatopropyltriethoxysilane.

無機填料之平均粒徑較佳為20 μm以下,更佳為10 μm以下。平均粒徑較佳為0.1 μm以上,更佳為1 μm以上。 作為無機填料之形狀,可為粒狀、針狀(纖維狀)、板狀中之任一種。作為無機填料之具體形狀,可例舉:球狀、鱗片狀、層狀、葉片狀、杏仁狀、柱狀、雞冠狀、等軸狀、葉狀、雲母狀、塊狀、平板狀、楔狀、玫瑰花狀、網狀、角柱狀。 作為無機填料之具體例,可例舉:氧化矽填料(ADMATECHS公司製造之「ADMAFINE」系列等)、經二癸酸丙二醇酯等酯進行表面處理之氧化鋅(堺化學工業股份有限公司製造之「FINEX」系列等)、球狀熔融氧化矽(DENKA公司製造之「SFP」系列等)、經多元醇及無機物進行被覆處理之(石原產業公司製造之「TIPAQUE」系列等)、經烷基矽烷進行表面處理之金紅石型二氧化鈦(帝國化工公司製造之「JMT」系列等)、中空狀氧化矽填料(太平洋水泥公司製造之「E-SPHERES」系列、日鐵礦業公司製造之「SILINAX」系列、EMERSON & CUMING公司製造之「ECCO SPHERE」系列等)、滑石填料(日本滑石公司製造之「SG」系列等)、塊滑石填料(日本滑石公司製造之「BST」系列等)、氮化硼填料(昭和電工公司製造之「UHP」系列、DENKA公司製造之「DENKA BORON NITRIDE」系列(「GP」、「HGP」等級)等)。The average particle size of the inorganic filler is preferably 20 μm or less, more preferably 10 μm or less. The average particle size is preferably 0.1 μm or more, more preferably 1 μm or more. The shape of the inorganic filler may be any of granular, needle-shaped (fibrous), and plate-shaped. The specific shape of the inorganic filler can be exemplified: spherical, scaly, layered, leaf-shaped, almond-shaped, columnar, chicken crown, equiaxed, leaf-shaped, mica-shaped, massive, flat, wedge-shaped Shaped, rosette-shaped, net-shaped, angular columnar. Specific examples of inorganic fillers include: silica fillers ("ADMAFINE" series manufactured by ADMATECHS, etc.), zinc oxide surface-treated with esters such as propylene glycol dicaprate (manufactured by Sakai Chemical Industry Co., Ltd.) FINEX” series, etc.), spherical fused silica (“SFP” series manufactured by DENKA, etc.), coated with polyols and inorganic substances (“TIPAQUE” series manufactured by Ishihara Sangyo Co., Ltd.), and treated with alkyl silane Surface treatment of rutile titanium dioxide ("JMT" series manufactured by Teikoku Chemical Co., Ltd.), hollow silica filler ("E-SPHERES" series manufactured by Pacific Cement Co., Ltd., "SILINAX" series manufactured by Nippon Steel Mining Co., Ltd., "ECCO SPHERE" series manufactured by EMERSON & CUMING), talc fillers ("SG" series manufactured by Japanese Talc Company, etc.), lump talc fillers ("BST" series manufactured by Japanese Talc Company, etc.), boron nitride fillers ( "UHP" series manufactured by Showa Denko Corporation, "DENKA BORON NITRIDE" series manufactured by Denka Corporation ("GP", "HGP" grades, etc.).

液狀組合物中之無機填料之含量較佳為1質量%以上,更佳為3質量%以上。無機填料之含量較佳為30質量%以下,更佳為20質量%以下。 液狀組合物中之無機填料之含量相對於F聚合物之含量之比(質量比)較佳為0.01以上,更佳為0.1以上。上述比較佳為1以下,更佳為0.8以下。The content of the inorganic filler in the liquid composition is preferably 1% by mass or more, more preferably 3% by mass or more. The content of the inorganic filler is preferably 30% by mass or less, more preferably 20% by mass or less. The ratio (mass ratio) of the content of the inorganic filler to the content of the F polymer in the liquid composition is preferably 0.01 or more, more preferably 0.1 or more. The above-mentioned comparison is preferably 1 or less, and more preferably 0.8 or less.

想要進一步提高積層體之折彎性,本法中之液狀組合物較佳為進而包含彈性體。 作為彈性體,較佳為熱塑性彈性體,更佳為:丁烯系彈性體、二烯系彈性體(異戊二烯系彈性體、丁二烯系彈性體等)、苯乙烯系彈性體、丙烯酸系彈性體、矽酮系彈性體及氟系彈性體。In order to further improve the bendability of the laminate, the liquid composition in this method preferably further contains an elastomer. The elastomer is preferably a thermoplastic elastomer, more preferably: butene-based elastomer, diene-based elastomer (isoprene-based elastomer, butadiene-based elastomer, etc.), styrene-based elastomer, Acrylic elastomer, silicone elastomer and fluorine elastomer.

作為苯乙烯系彈性體,可例舉:苯乙烯-丁二烯共聚物、氫化-苯乙烯-丁二烯共聚物、氫化-苯乙烯-異戊二烯共聚物、苯乙烯-丁二烯-苯乙烯嵌段共聚物、苯乙烯-異戊二烯-苯乙烯嵌段共聚物、苯乙烯-丁二烯-苯乙烯嵌段共聚物之氫化物、及苯乙烯-異戊二烯-苯乙烯嵌段共聚物之氫化物等。 為了提高與F聚合物之密接性,彈性體較佳為被改性而具有官能基。作為該官能基,可例舉:環氧基、含有羰基之基、羥基、異氰酸基、胺基。 彈性體之玻璃轉移溫度較佳為10℃以下,更佳為5℃以下。於該情形時,容易進一步改善積層體之折彎性。 又,彈性體可相對於液狀分散介質具有可溶性,亦可為非可溶性,較佳為具有溶劑可溶性。The styrene-based elastomer may, for example, be styrene-butadiene copolymer, hydrogenated-styrene-butadiene copolymer, hydrogenated-styrene-isoprene copolymer, styrene-butadiene- Styrene block copolymer, styrene-isoprene-styrene block copolymer, hydrogenated styrene-butadiene-styrene block copolymer, and styrene-isoprene-styrene Hydrogenated block copolymers, etc. In order to improve the adhesion with the F polymer, the elastomer is preferably modified to have a functional group. The functional group may, for example, be an epoxy group, a carbonyl group-containing group, a hydroxyl group, an isocyanate group, or an amino group. The glass transition temperature of the elastomer is preferably 10°C or less, more preferably 5°C or less. In this case, it is easy to further improve the bendability of the laminate. In addition, the elastomer may be soluble in the liquid dispersion medium or may be insoluble, but preferably has solvent solubility.

作為彈性體之具體例,可例舉:聚丁二烯、聚苯乙烯、丁二烯-丙烯腈共聚物(NBR)等液態橡膠;兩末端羧基丁二烯-丙烯腈共聚物(CTBN)、兩末端胺基丁二烯-丙烯腈共聚物(ATBN)等反應性液態橡膠;兩末端或側鏈具有胺基或環氧基之聚二甲基矽氧烷等矽酮橡膠;交聯NBR粒子、交聯矽酮粒子、丙烯酸系核殼粒子等粒子狀橡膠。 液狀組合物中之彈性體之含量較佳為0.01質量%以上,更佳為0.1質量%以上。彈性體之含量較佳為10質量%以下,更佳為5質量%以下。 液狀組合物中之彈性體之含量相對於F聚合物之含量之比(質量比)較佳為0.001以上,更佳為0.01以上。上述比較佳為0.2以下,更佳為0.15以下。Specific examples of elastomers include liquid rubbers such as polybutadiene, polystyrene, butadiene-acrylonitrile copolymer (NBR); two-terminal carboxyl butadiene-acrylonitrile copolymer (CTBN), Reactive liquid rubber such as aminobutadiene-acrylonitrile copolymer (ATBN) at both ends; silicone rubber such as polydimethylsiloxane with amine groups or epoxy groups on both ends or side chains; cross-linked NBR particles , Cross-linked silicone particles, acrylic core-shell particles and other particulate rubbers. The content of the elastomer in the liquid composition is preferably 0.01% by mass or more, more preferably 0.1% by mass or more. The content of the elastomer is preferably 10% by mass or less, more preferably 5% by mass or less. The ratio (mass ratio) of the content of the elastomer to the content of the F polymer in the liquid composition is preferably 0.001 or more, more preferably 0.01 or more. The above-mentioned comparison is preferably 0.2 or less, and more preferably 0.15 or less.

本法中之液狀組合物可進而包含促進馬來醯亞胺系化合物之硬化之成分(自由基聚合起始劑、咪唑系硬化劑、陽離子系硬化劑或共聚性之其他交聯性單體等)。於該情形時,容易控制初期加熱時之馬來醯亞胺系化合物之部分硬化(反應),而在後期加熱時形成F聚合物與馬來醯亞胺系化合物之硬化物相溶而成之聚合物層。The liquid composition in this method may further include components that promote the hardening of the maleimide compound (radical polymerization initiator, imidazole hardener, cationic hardener, or copolymerizable other crosslinking monomer Wait). In this case, it is easy to control the partial hardening (reaction) of the maleimide-based compound during the initial heating, and the formation of the F polymer and the cured product of the maleimine-based compound are mutually dissolved during the later heating. Polymer layer.

作為該成分,可例舉:咪唑(2-甲基咪唑、2-乙基咪唑、2-苯基咪唑、2-乙基-4-甲基咪唑、2-十一烷基咪唑、1-氰乙基-2-乙基-4-甲基咪唑等)、二級或三級胺(三乙胺、三伸乙基二胺、2-(二甲胺甲基)苯酚、三(二甲胺甲基)苯酚、二甲苄胺等)、脒(1,8-二氮-雜雙環(5,4,0)-7-十一烯等)、膦(三苯基膦、三丁基膦、三辛基膦等)、有機金屬鹽(辛酸亞錫、辛酸鋅、二馬來酸二丁基錫、環烷酸鋅、環烷酸鈷、油酸錫等)、金屬氯化物(氯化鋰、氯化鋅、氯化鋁、氯化錫等)、有機過氧化物(第三丁基過氧化物、二異丙苯基過氧化物等)、偶氮化合物(偶氮二異丁腈、偶氮雙二甲基戊腈等)、礦酸(鹽酸、硫酸、磷酸等)、鹼金屬碳酸鹽(碳酸鈉等)。Examples of the component include imidazole (2-methylimidazole, 2-ethylimidazole, 2-phenylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 1-cyano Ethyl-2-ethyl-4-methylimidazole, etc.), secondary or tertiary amines (triethylamine, triethylenediamine, 2-(dimethylaminomethyl)phenol, tris(dimethylamine) Methyl)phenol, dimethylbenzylamine, etc.), amidines (1,8-diaza-heterobicyclo(5,4,0)-7-undecene, etc.), phosphines (triphenylphosphine, tributylphosphine, etc.) , Trioctyl phosphine, etc.), organic metal salts (stannous octoate, zinc octoate, dibutyl tin dimaleate, zinc naphthenate, cobalt naphthenate, tin oleate, etc.), metal chlorides (lithium chloride, Zinc chloride, aluminum chloride, tin chloride, etc.), organic peroxides (tertiary butyl peroxide, dicumyl peroxide, etc.), azo compounds (azobisisobutyronitrile, azo Nitrogen bisdimethylvaleronitrile, etc.), mineral acids (hydrochloric acid, sulfuric acid, phosphoric acid, etc.), alkali metal carbonates (sodium carbonate, etc.).

想要提高分散性及處理性,本法中之液狀組合物可進而包含界面活性劑。 界面活性劑較佳為非離子性。 界面活性劑之親水部位較佳為具有氧伸烷基或醇性羥基。 氧伸烷基可包含一種,亦可包含兩種以上。於後者之情形時,種類不同之氧伸烷基可呈無規狀配置,亦可呈嵌段狀配置。 氧伸烷基較佳為氧伸乙基。To improve dispersibility and handling properties, the liquid composition in this method may further include a surfactant. The surfactant is preferably nonionic. The hydrophilic part of the surfactant preferably has an oxyalkylene group or an alcoholic hydroxyl group. The oxyalkylene group may contain one kind or two or more kinds. In the latter case, the oxyalkylene groups of different types can be arranged randomly or in block. The oxyethylene group is preferably oxyethylene group.

界面活性劑之疏水部位較佳為具有乙炔基、聚矽氧烷基、全氟烷基或全氟烯基。換言之,界面活性劑較佳為乙炔系界面活性劑、矽酮系界面活性劑或氟系界面活性劑。 其中,界面活性劑更佳為氟系界面活性劑,進而較佳為具有羥基(尤其是醇性羥基)或氧伸烷基、及全氟烷基或全氟烯基之氟系界面活性劑。 作為該界面活性劑之具體例,可例舉:「FTERGENT」系列(NEOS公司製造)、「SURFLON」系列(AGC清美化學公司製造)、「MEGAFAC」系列(DIC公司製造)、「UNIDYNE」系列(大金工業公司製造)。 液狀組合物中之界面活性劑之含量較佳為1~15質量%。於該情形時,成分間之親和性容易急劇提高。The hydrophobic part of the surfactant preferably has an ethynyl group, a polysiloxyalkyl group, a perfluoroalkyl group or a perfluoroalkenyl group. In other words, the surfactant is preferably an acetylene-based surfactant, a silicone-based surfactant, or a fluorine-based surfactant. Among them, the surfactant is more preferably a fluorine-based surfactant, and still more preferably a fluorine-based surfactant having a hydroxyl group (especially an alcoholic hydroxyl group) or an oxyalkylene group, and a perfluoroalkyl group or a perfluoroalkenyl group. Specific examples of the surfactant include: "FTERGENT" series (manufactured by NEOS), "SURFLON" series (manufactured by AGC Seimi Chemical Co., Ltd.), "MEGAFAC" series (manufactured by DIC Corporation), "UNIDYNE" series ( Daikin Industry Co., Ltd.). The content of the surfactant in the liquid composition is preferably 1 to 15% by mass. In this case, the affinity between the components is likely to increase sharply.

本法中之液狀組合物在25℃下之黏度較佳為50 mPa・s以上,更佳為100 mPa・s以上。液狀組合物之黏度較佳為5000 mPa・s以下,更佳為1000 mPa・s以下。 本法中之液狀組合物之觸變比較佳為1.0~2.0。 想要控制馬來醯亞胺系化合物之硬化(反應),本法中之液狀組合物之pH值較佳為7以下。The viscosity of the liquid composition in this method at 25°C is preferably 50 mPa·s or more, more preferably 100 mPa·s or more. The viscosity of the liquid composition is preferably 5000 mPa·s or less, more preferably 1000 mPa·s or less. The thixotropic ratio of the liquid composition in this method is preferably 1.0 to 2.0. In order to control the hardening (reaction) of the maleimide compound, the pH of the liquid composition in this method is preferably 7 or less.

本法中之液狀組合物可進而包含其他樹脂。其他樹脂可為熱固性樹脂,亦可為熱塑性樹脂。 作為其他樹脂,可例舉:環氧樹脂、馬來醯亞胺樹脂、聚胺酯樹脂、聚醯亞胺、聚醯胺酸、聚醯胺醯亞胺、聚苯醚、聚氧二甲苯、液晶聚酯、除F聚合物以外之含氟聚合物。 液狀組合物亦可除上述成分以外還包含:觸變性賦予劑、消泡劑、矽烷偶合劑、脫水劑、塑化劑、耐候劑、抗氧化劑、熱穩定劑、潤滑劑、抗靜電劑、增白劑、著色劑、導電劑、脫模劑、表面處理劑、黏度調節劑、阻燃劑等添加劑。The liquid composition in this method may further contain other resins. Other resins can be thermosetting resins or thermoplastic resins. Examples of other resins include epoxy resin, maleimide resin, polyurethane resin, polyimide, polyamide acid, polyamide imide, polyphenylene ether, polyoxyxylene, liquid crystal poly Ester, fluorine-containing polymer other than F polymer. The liquid composition may also contain in addition to the above-mentioned components: a thixotropy imparting agent, a defoamer, a silane coupling agent, a dehydrating agent, a plasticizer, a weathering agent, an antioxidant, a heat stabilizer, a lubricant, an antistatic agent, Additives such as brighteners, colorants, conductive agents, mold release agents, surface treatment agents, viscosity regulators, flame retardants, etc.

作為本法中之基材層,較佳為金屬基板(銅、鎳、鋁、鈦、其等之合金等金屬箔等)、聚合物膜(聚醯亞胺、聚芳酯、聚碸、聚芳碸、聚醯胺、聚醚醯胺、聚苯硫醚、聚芳醚酮、聚醯胺醯亞胺、液晶性聚酯、液晶性聚酯醯胺等膜)、預浸體(纖維強化樹脂基板之前驅物),更佳為金屬箔及聚合物膜。 關於對基材層之表面賦予液狀組合物,較佳為藉由塗佈來進行。作為塗佈方法,可例舉:噴霧法、輥塗法、旋轉塗佈法、凹版塗佈法、微凹版塗佈法、凹版膠版法、刮塗法、接觸塗佈法、棒式塗佈法、模嘴塗佈法、噴注麥勒棒法、狹縫式模嘴塗佈法。As the substrate layer in this method, a metal substrate (metal foil such as copper, nickel, aluminum, titanium, alloys thereof, etc., etc.), a polymer film (polyimide, polyarylate, polyether, poly Arylene, polyamide, polyetheramide, polyphenylene sulfide, polyaryletherketone, polyamideimide, liquid crystal polyester, liquid crystal polyesteramide, etc. film), prepreg (fiber reinforced The resin substrate precursor), more preferably metal foil and polymer film. The application of the liquid composition to the surface of the substrate layer is preferably performed by coating. The coating method may, for example, be spray method, roll coating method, spin coating method, gravure coating method, micro gravure coating method, gravure offset method, knife coating method, contact coating method, bar coating method , Die nozzle coating method, injection-Meller bar method, slit die nozzle coating method.

本法中之初期加熱之溫度為100℃以上且未達F聚合物之熔融溫度之溫度。初期加熱之溫度較佳為150~250℃,更佳為180~220℃。於該情形時,更容易控制初期加熱中之馬來醯亞胺系化合物之部分硬化(反應)。再者,作為馬來醯亞胺系化合物之部分硬化(反應),可例舉伴隨著馬來醯亞胺基之開環反應之反應(縮合反應、加成反應等)。 初期加熱之加熱時間較佳為1~10分鐘。 本法中之後期加熱之溫度為F聚合物之熔融溫度以上之溫度。後期加熱之溫度較佳為300~400℃,更佳為320~380℃。於該情形時,容易使F聚合物粉末更高程度地熔融,並且容易使其與馬來醯亞胺系化合物之硬化物進一步相溶而形成聚合物層。 後期加熱之加熱時間較佳為1~10分鐘。The initial heating temperature in this method is a temperature above 100°C and below the melting temperature of the F polymer. The initial heating temperature is preferably 150 to 250°C, more preferably 180 to 220°C. In this case, it is easier to control the partial hardening (reaction) of the maleimide compound in the initial heating. Furthermore, as the partial hardening (reaction) of the maleimide-based compound, a reaction (condensation reaction, addition reaction, etc.) accompanied by a ring-opening reaction of the maleimine group can be exemplified. The heating time for the initial heating is preferably 1 to 10 minutes. In this method, the subsequent heating temperature is a temperature above the melting temperature of the F polymer. The later heating temperature is preferably 300-400°C, more preferably 320-380°C. In this case, it is easy to melt the F polymer powder to a higher degree, and it is easy to further dissolve it with the cured product of the maleimide compound to form a polymer layer. The heating time of the post-heating is preferably 1-10 minutes.

作為初期加熱及後期加熱中之加熱方法,可例舉:使用烘箱之方法、使用通風乾燥爐之方法、照射紅外線等熱線之方法。 本法中之聚合物層之厚度較佳為0.1~150 μm。具體而言,若基材層為金屬箔,則聚合物層之厚度較佳為1~30 μm。若基材層為聚合物膜,則聚合物層之厚度較佳為5~50 μm。As the heating method in the initial heating and the post heating, there can be mentioned: the method of using an oven, the method of using a ventilated drying furnace, the method of irradiating hot rays such as infrared rays. The thickness of the polymer layer in this method is preferably 0.1-150 μm. Specifically, if the substrate layer is a metal foil, the thickness of the polymer layer is preferably 1-30 μm. If the substrate layer is a polymer film, the thickness of the polymer layer is preferably 5-50 μm.

可僅對基材層之一表面賦予本法中之液狀組合物,亦可對基材層之兩面賦予本法中之液狀組合物。於前者之情形時,可獲得具有基材層、及形成於基材層之一表面之聚合物層之積層體,於後者之情形時,可獲得具有基材層、及形成於基材層之兩表面之聚合物層之積層體。後者之積層體更不易發生翹曲,故其加工性優異。 作為該積層體之具體例,可例舉:覆金屬積層體,其具有金屬箔、及形成於該金屬箔之至少一表面之聚合物層;多層膜,其具有聚醯亞胺膜、及形成於該聚醯亞胺膜之兩表面之聚合物層。 該等積層體之電氣特性等諸物性優異,故適合作為印刷基板材料等。具體而言,該積層體可用於製造撓性印刷基板或剛性印刷基板。The liquid composition in this method may be applied to only one surface of the substrate layer, or the liquid composition in this method may be applied to both surfaces of the substrate layer. In the former case, a laminate having a substrate layer and a polymer layer formed on one surface of the substrate layer can be obtained. In the latter case, a laminate having a substrate layer and a polymer layer formed on the substrate layer can be obtained. A laminate of polymer layers on both surfaces. The latter laminate is less likely to warp, so it has excellent workability. As a specific example of the laminate, a metal-clad laminate having a metal foil and a polymer layer formed on at least one surface of the metal foil; a multilayer film having a polyimide film and forming Polymer layers on both surfaces of the polyimide film. These laminates are excellent in various physical properties such as electrical characteristics, and are therefore suitable as printed circuit board materials and the like. Specifically, the laminate can be used to manufacture a flexible printed circuit board or a rigid printed circuit board.

本發明之液狀組合物(以下,亦記為「本組合物」)係含有包含TFE單元及PAVE單元之四氟乙烯系聚合物粉末、與馬來醯亞胺系化合物之液狀組合物。 本組合物中之四氟乙烯系聚合物係包含TFE單元及PAVE單元,且具有極性官能基之聚合物;或者,本組合物中之四氟乙烯系聚合物係包含TFE單元及PAVE單元,相對於總單元包含2.0~5.0莫耳%之基於上述PAVE之單元,且不具有極性官能基之聚合物(以下,亦統稱為「PFA系聚合物」)。 本組合物係使PFA系聚合物之粉末分散,且使馬來醯亞胺系化合物高程度地分散或溶解而成之分散液。 本組合物之分散性及處理性優異。關於其原因,雖未必明確但本發明人等認為如下。The liquid composition of the present invention (hereinafter, also referred to as "this composition") is a liquid composition containing a tetrafluoroethylene-based polymer powder containing a TFE unit and a PAVE unit, and a maleimide-based compound. The tetrafluoroethylene-based polymer in this composition contains TFE units and PAVE units, and has a polar functional group; or, the tetrafluoroethylene-based polymer in this composition contains TFE units and PAVE units. A polymer containing 2.0-5.0 mol% of the above-mentioned PAVE-based unit in the total unit and having no polar functional group (hereinafter, also collectively referred to as "PFA-based polymer"). This composition is a dispersion liquid obtained by dispersing the powder of the PFA-based polymer and dispersing or dissolving the maleimide-based compound to a high degree. The composition has excellent dispersibility and handling properties. Although the reason is not necessarily clear, the inventors of the present invention consider it as follows.

馬來醯亞胺系化合物不僅可謂是極性化合物,而且亦可謂是具有親水部位(馬來醯亞胺基)及疏水部位(伸芳基)之化合物,故認為其具有液狀組合物之增黏作用、及降低液狀組合物之表面張力之作用(界面活性作用)。 若處於包含該化合物之狀態下之液狀組合物中包含極性及表面張力大體較低之四氟乙烯系聚合物中具有特定結構之PFA系聚合物(具有極性官能基之PFA系聚合物;或者PAVE單元之含量較高,不具有極性官能基,且聚合物鏈之自由度較高之PFA系聚合物)粉末,則認為容易協同且平衡地表現出藉由馬來醯亞胺系化合物所獲得之上述作用(增黏作用及界面活性作用)。 其結果為,粉末之沈澱及起泡得到抑制,組合物之增黏結束,因此認為可獲得分散性及處理性優異之液狀組合物(本組合物)。又,PFA系聚合物於形成成形物(本法中之聚合物層等)時,容易形成微小球晶,與馬來醯亞胺系化合物之硬化物高程度地相溶,因此若使用本組合物,則容易獲得高程度地具備PFA系聚合物及馬來醯亞胺系化合物之物性之成形物。Maleimine compounds can be described as not only polar compounds, but also compounds with hydrophilic sites (maleimine groups) and hydrophobic sites (aryl groups), so they are considered to have the viscosity of a liquid composition The effect and the effect of reducing the surface tension of the liquid composition (interface activity effect). If the liquid composition in a state containing the compound contains a PFA-based polymer with a specific structure among a tetrafluoroethylene-based polymer with a substantially lower polarity and surface tension (PFA-based polymer with a polar functional group; or PAVE unit content is higher, does not have polar functional group, and the degree of freedom of the polymer chain is higher (PFA polymer) powder, it is considered that it is easy to synergistically and balancely show the obtained by maleimide compound The above-mentioned effects (tackification and interfacial activity). As a result, the precipitation and foaming of the powder are suppressed, and the thickening of the composition is completed. Therefore, it is considered that a liquid composition (this composition) excellent in dispersibility and handling properties can be obtained. In addition, when PFA-based polymers are formed into molded products (polymer layers in this method, etc.), they are easy to form tiny spherulites and are highly compatible with the cured products of maleimide-based compounds. Therefore, if you use this combination It is easy to obtain a molded product having the physical properties of a PFA-based polymer and a maleimide-based compound to a high degree.

本組合物中之PFA系聚合物粉末之形態與上述本法中之粉末之形態相同,其較佳之形態亦相同。 本組合物中之PFA系聚合物係上述本法中之聚合物(1)或聚合物(2),較佳之範圍亦與其等之範圍相同。 想要更容易表現出上述作用效果,聚合物(1)中之極性官能基較佳為含有羥基之基及含有羰基之基,更佳為含有羰基之基。 本組合物中之馬來醯亞胺系化合物之形態與上述本法中之馬來醯亞胺系化合物之形態相同,其較佳之形態亦相同。The form of the PFA-based polymer powder in the composition is the same as the form of the powder in the above-mentioned method, and its preferred form is also the same. The PFA-based polymer in the composition is the polymer (1) or the polymer (2) in the above-mentioned method, and the preferred range is also the same as its equivalent range. In order to more easily exhibit the above-mentioned effects, the polar functional group in the polymer (1) is preferably a hydroxyl group-containing group and a carbonyl group-containing group, and more preferably a carbonyl group-containing group. The form of the maleimine compound in this composition is the same as the form of the maleimine compound in the above-mentioned method, and its preferred form is also the same.

若馬來醯亞胺系化合物分別具有2個以上馬來醯亞胺基及2個以上伸芳基,則更容易表現出上述作用效果。 本組合物中之馬來醯亞胺系化合物之含量相對於PFA系聚合物之含量之比(質量比)較佳為0.001以上,更佳為0.01以上。上述比較佳為0.2以下,更佳為0.15以下。若以該比含有馬來醯亞胺系化合物,則不僅更容易表現出上述作用效果,而且容易在所形成之成形物中形成以PFA系聚合物為海,以馬來醯亞胺系化合物之硬化物為島之緻密之海島結構,從而容易獲得高程度地具備兩者之物性之成形物。If the maleimine-based compound has two or more maleimine groups and two or more arylene groups, it is easier to exhibit the above-mentioned effects. The ratio (mass ratio) of the content of the maleimide-based compound in the composition to the content of the PFA-based polymer is preferably 0.001 or more, more preferably 0.01 or more. The above-mentioned comparison is preferably 0.2 or less, and more preferably 0.15 or less. If a maleimide-based compound is contained in this ratio, it is not only easier to exhibit the above-mentioned effects, but also it is easy to form a PFA-based polymer as a sea in the formed molded product, and a maleimine-based compound The hardened product is the dense sea-island structure of the island, so it is easy to obtain a molded product with a high degree of physical properties of both.

本組合物較佳為包含液狀分散介質。液狀分散介質之形態包括較佳之形態在內均與本法中之液狀分散介質相同。 本組合物較佳為進而包含無機填料。無機填料之形態包括較佳之形態在內均與本法中之無機填料相同。 本組合物較佳為進而包含彈性體。彈性體之形態包括較佳之形態在內均與本法中之彈性體相同。The present composition preferably contains a liquid dispersion medium. The form of the liquid dispersion medium, including preferred forms, is the same as the liquid dispersion medium in this method. The present composition preferably further contains an inorganic filler. The form of the inorganic filler, including the preferred form, is the same as that of the inorganic filler in this method. The present composition preferably further contains an elastomer. The shape of the elastomer, including the preferred shape, is the same as that of the elastomer in this method.

本組合物可進而包含:進一步促進馬來醯亞胺系化合物之硬化反應之成分、界面活性劑、其他樹脂、其他添加劑(觸變性賦予劑、消泡劑、矽烷偶合劑、脫水劑、塑化劑、耐候劑、抗氧化劑、熱穩定劑、潤滑劑、抗靜電劑、增白劑、著色劑、導電劑、脫模劑、表面處理劑、黏度調節劑、阻燃劑等)。該等成分之形態包括較佳之形態在內均與本法中之其等相同。 本組合物中之成形物之形成成分(於除PFA系聚合物及馬來醯亞胺系化合物以外,還包含無機填料、彈性體、其他樹脂(聚合物)或其他添加成分之情形時,包含其等)之總含量較佳為30質量%以上,更佳為50質量%以上。上述總含量較佳為80質量%以下。即便成形物之形成成分之含量較多,本組合物之分散性及處理性亦因上述作用效果而優異。The composition may further include: components to further promote the curing reaction of the maleimide compound, surfactants, other resins, and other additives (thixotropy imparting agent, defoaming agent, silane coupling agent, dehydrating agent, plasticizing agent, etc.) Agents, weathering agents, antioxidants, heat stabilizers, lubricants, antistatic agents, brighteners, colorants, conductive agents, mold release agents, surface treatment agents, viscosity regulators, flame retardants, etc.). The forms of these components, including preferred forms, are the same as those in this law. The forming components of the molded article in this composition (when it contains inorganic fillers, elastomers, other resins (polymers) or other additives in addition to PFA-based polymers and maleimide-based compounds, it includes The total content of them) is preferably 30% by mass or more, more preferably 50% by mass or more. The above-mentioned total content is preferably 80% by mass or less. Even if the content of the forming components of the molded article is large, the dispersibility and handling properties of the composition are excellent due to the above-mentioned effects.

本組合物在25℃下之黏度較佳為50 mPa・s以上,更佳為100 mPa・s以上。本組合物在25℃下之黏度較佳為5000 mPa・s以下,更佳為1000 mPa・s以下。 本組合物在25℃下之觸變比較佳為1.0~2.0。 自馬來醯亞胺系化合物之硬化(反應)性方面考慮,本組合物較佳為酸性。The viscosity of the composition at 25°C is preferably 50 mPa·s or more, more preferably 100 mPa·s or more. The viscosity of the composition at 25°C is preferably 5000 mPa·s or less, more preferably 1000 mPa·s or less. The thixotropy ratio of the composition at 25°C is preferably 1.0 to 2.0. In view of the curability (reactivity) of the maleimide-based compound, the present composition is preferably acidic.

可由本組合物形成具備源自馬來醯亞胺系化合物之硬化物之黏著性及源自F聚合物之較高之阻氣性之層。因此,本組合物亦可用作包裝用膜(枕形包裝用膜等)等之熱密封劑。本組合物尤其可用作容易因水蒸氣或氧而產生品質劣化之製品(食品、化學品等)之包裝材料之熱密封劑。具體而言,本組合物可用作點心等食品之包裝材料、或食品杯、食品托盤等包裝材料、或醫藥農藥製品之包裝材料、或化學製品之包裝材料、或半導體等精密電子零件之包裝材料之熱密封劑。此時之本組合物可包含黏著劑、抗靜電劑。The composition can be used to form a layer with the adhesiveness of the cured product derived from the maleimide compound and the higher gas barrier properties derived from the F polymer. Therefore, the present composition can also be used as a heat sealant for packaging films (pillow packaging films, etc.) and the like. The composition is particularly useful as a heat sealant for packaging materials for products (food, chemicals, etc.) that are prone to quality deterioration due to water vapor or oxygen. Specifically, the composition can be used as packaging materials for snacks and other foods, or packaging materials for food cups and food trays, or packaging materials for pharmaceutical and agricultural products, or packaging materials for chemical products, or packaging for precision electronic parts such as semiconductors. Heat sealant for materials. At this time, the composition may contain an adhesive and an antistatic agent.

於使用本組合物作為熱密封劑時,只要對包裝材料之基材賦予本組合物而使用即可。例如,只要準備2片包裝材料,將本組合物塗佈於至少一密封部,然後將二者重疊,並使用熱封機進行加熱,便可將2片包裝材料加以熱密封。 作為基材之材質,可例舉紙漿、金屬、塑膠、玻璃。 基材之構成較佳為具有基材層及阻氣層之構成。阻障層可包含水溶性聚合物(聚乙烯醇等)及交聯劑。 基材層可僅由上述基材之材質形成,亦可包含複數種上述基材之材質。作為前者之具體例,可例舉紙、金屬箔、塑膠膜。作為後者之形態,可例舉紙與塑膠之層壓紙、塑膠膜與鋁箔之積層體、不同種類之塑膠膜之積層體。基材層亦可進而具有鋁、氧化矽、氧化鋁等無機氧化物之蒸鍍層。 實施例When using this composition as a heat sealant, it is only necessary to apply the composition to the base material of the packaging material and use it. For example, as long as two pieces of packaging materials are prepared, the present composition is applied to at least one sealing part, and the two pieces are overlapped and heated with a heat sealer, the two pieces of packaging materials can be heat-sealed. As the material of the substrate, paper pulp, metal, plastic, and glass can be cited. The structure of the substrate is preferably a structure having a substrate layer and a gas barrier layer. The barrier layer may include a water-soluble polymer (polyvinyl alcohol, etc.) and a crosslinking agent. The substrate layer may be formed of only the material of the above-mentioned substrate, or may include a plurality of materials of the above-mentioned substrate. Specific examples of the former include paper, metal foil, and plastic film. As the latter form, a laminate of paper and plastic, a laminate of plastic film and aluminum foil, and a laminate of different types of plastic films can be mentioned. The base material layer may further have a vapor-deposited layer of inorganic oxides such as aluminum, silicon oxide, and aluminum oxide. Example

以下,藉由實施例對本發明詳細地進行說明,但本發明並不受其等限定。 實施例中使用以下材料。 [粉末] 粉末1:由包含97.9莫耳%之TFE單元、0.1莫耳%之NAH單元、及2.0莫耳%之PPVE單元,且具有極性官能基之聚合物1(熔融溫度:300℃)所構成之粉末(D50:2.1 μm) 粉末2:由包含98.7莫耳%之TFE單元及1.3莫耳%之PPVE單元,且不具有極性官能基之聚合物2(熔融溫度305℃)所構成之粉末(D50:1.8 μm) 再者,聚合物1係主鏈碳數每1×106 個中具有1000個含有羰基之基。Hereinafter, the present invention will be described in detail with examples, but the present invention is not limited by them. The following materials are used in the examples. [Powder] Powder 1: Containing 97.9 mol% of TFE units, 0.1 mol% of NAH units, and 2.0 mol% of PPVE units, and having a polar functional group polymer 1 (melting temperature: 300 ℃) Composition powder (D50: 2.1 μm) Powder 2: A powder composed of polymer 2 (melting temperature 305°C) that contains 98.7 mol% of TFE units and 1.3 mol% of PPVE units and does not have polar functional groups (D50: 1.8 μm) In addition, the polymer 1 system has 1000 carbonyl-containing groups per 1×10 6 carbon atoms in the main chain.

[馬來醯亞胺系化合物] 馬來醯亞胺1:具有馬來醯亞胺基及伸苯基之化合物 再者,馬來醯亞胺1係具有2~4個馬來醯亞胺基及複數個伸苯基之化合物之混合物,其數量平均分子量為800,其硬化物之玻璃轉移溫度為280℃。 [液狀分散介質] NMP:N-甲基-2-吡咯啶酮[Maleimide compounds] Maleimide 1: Compound with maleimide group and phenylene Furthermore, maleimide 1 is a mixture of compounds having 2 to 4 maleimide groups and a plurality of phenylene groups, and its number average molecular weight is 800, and the glass transition temperature of its cured product is 280°C. [Liquid dispersion medium] NMP: N-methyl-2-pyrrolidone

[界面活性劑] 界面活性劑1:CH2 =C(CH3 )C(O)OCH2 CH2 (CF2 )6 F與CH2 =C(CH3 )C(O)(OCH2 CH2 )23 OH之共聚物 [無機填料] 填料1:氧化矽填料(D50:5.2 μm) [彈性體] 彈性體1:胺改性苯乙烯系彈性體(SEBS,旭化成公司製造,「TUFTEC MP10」)[Surfactant] Surfactant 1: CH 2 =C(CH 3 )C(O)OCH 2 CH 2 (CF 2 ) 6 F and CH 2 =C(CH 3 )C(O)(OCH 2 CH 2 ) 23 OH copolymer [inorganic filler] Filler 1: Silica filler (D50: 5.2 μm) [Elastomer] Elastomer 1: Amine modified styrene elastomer (SEBS, manufactured by Asahi Kasei Corporation, "TUFTEC MP10")

(例1)液狀組合物之製造例 (例1-1) 向包含馬來醯亞胺1及NMP之溶液中投入界面活性劑1,進而依序投入彈性體1及填料1,進行攪拌而製備混合液。 另外,向NMP中投入界面活性劑1及粉末1,進行攪拌而製備分散液。 將該等混合液與分散液混合,進行攪拌而獲得液狀組合物1(黏度:500 mPa・s),其包含:粉末1(30質量份)、馬來醯亞胺1(3質量份)、彈性體1(3質量份)、填料1(15質量份)、界面活性劑1(4質量份)、及NMP(45質量份)。液狀組合物1係分散有粉末1之分散液。 (例1-2~例1-5) 將各成分之種類及量如下表1所示進行變更,除此以外,藉由與例1-1相同之方式獲得液狀組合物2~5。(Example 1) Manufacturing example of liquid composition (Example 1-1) Surfactant 1 is put into a solution containing maleimine 1 and NMP, and elastomer 1 and filler 1 are put in order, and stirred to prepare a mixed solution. In addition, surfactant 1 and powder 1 were put into NMP and stirred to prepare a dispersion. These mixed liquids and dispersion liquids are mixed and stirred to obtain a liquid composition 1 (viscosity: 500 mPa·s), which contains: powder 1 (30 parts by mass) and maleimide 1 (3 parts by mass) , Elastomer 1 (3 parts by mass), Filler 1 (15 parts by mass), Surfactant 1 (4 parts by mass), and NMP (45 parts by mass). The liquid composition 1 is a dispersion in which the powder 1 is dispersed. (Example 1-2~Example 1-5) Except for changing the type and amount of each component as shown in Table 1 below, the liquid compositions 2 to 5 were obtained in the same manner as in Example 1-1.

[表1] 液狀組合物編號 粉末 馬來醯亞胺系化合物 無機填料 彈性體 界面活性劑 NMP 1 1(30) 1(3) 1(15) 1(3) 1(4) 45 2 1(30) 1(3) -(0) -(0) 1(4) 63 3 1(30) 1(3) -(0) -(0) -(0) 67 4 2(30) 1(3) -(0) -(0) 1(4) 63 5 2(30) 1(3) 1(15) 1(3) 1(4) 45 ※各欄括號內之數值係於液狀組合物中之含量(單位:質量%)。 [Table 1] Liquid composition number powder Maleimide compounds Inorganic filler Elastomer Surfactant NMP 1 1(30) 1(3) 1(15) 1(3) 1(4) 45 2 1(30) 1(3) -(0) -(0) 1(4) 63 3 1(30) 1(3) -(0) -(0) -(0) 67 4 2(30) 1(3) -(0) -(0) 1(4) 63 5 2(30) 1(3) 1(15) 1(3) 1(4) 45 ※The value in the brackets in each column refers to the content in the liquid composition (unit: mass%).

將所獲得之液狀組合物之分散穩定性、處理性、黏度及觸變比之相關評估結果彙總示於以下之表2。 再者,分散穩定性及處理性係依據以下之方法而評估。The relevant evaluation results of the dispersion stability, handling properties, viscosity, and thixotropy ratio of the obtained liquid composition are summarized and shown in Table 2 below. Furthermore, the dispersion stability and handling properties were evaluated according to the following methods.

[分散穩定性] 於25℃下保管儲存液狀組合物後,以目視確認其分散性,依據下述基準評估分散穩定性。 [評估基準] ○:未視認到沈澱物。 △:雖視認到沈澱物,但可容易地再次分散。 ×:視認到沈澱物,且難以再次分散。[Dispersion stability] After storing the storage liquid composition at 25°C, the dispersibility was confirmed visually, and the dispersion stability was evaluated based on the following criteria. [Assessment criteria] ○: No deposit is recognized. △: Although the precipitate is visually recognized, it can be easily dispersed again. ×: A precipitate is visually recognized, and it is difficult to disperse again.

[處理性] 於製備液狀組合物時,以目視確認混合液與分散液之混合時之起泡狀態,依據下述基準進行評估。 [評估基準] ○:製備後,未達3小時起泡便消失。 ×:製備後,即便經過3小時起泡亦未消失。[Handling] When preparing the liquid composition, visually confirm the foaming state when the mixed liquid and the dispersion liquid are mixed, and evaluate it based on the following criteria. [Assessment criteria] ○: Foaming disappeared within 3 hours after preparation. ×: After preparation, foaming did not disappear even after 3 hours.

[表2] 液狀組合物編號 分散穩定性 處理性 黏度 (mPa.s) 觸變比 1 500 1.2 2 400 1.1 3 800 1.1 4 × 600 1.1 5 × × >5000 - [Table 2] Liquid composition number Dispersion stability Handleability Viscosity (mPa.s) Thixotropy ratio 1 500 1.2 2 400 1.1 3 800 1.1 4 X 600 1.1 5 X X >5000 -

(例2)積層體之製造例 (例2-1)積層體1之製造例 使用棒式塗佈機將液狀組合物1塗佈於長條銅箔(厚度:18 μm)之表面而形成濕式膜。繼而,將初期加熱之溫度設為200℃,於氮氣烘箱中將形成有該濕式膜之金屬箔加熱5分鐘。然後,將後期加熱之溫度設為380℃,於氮氣烘箱中加熱3分鐘。藉此,獲得具有金屬箔及聚合物層1(厚度:5 μm)之積層體1,該聚合物層1係金屬箔之表面之包含F聚合物1、馬來醯亞胺1之硬化物、填料1及彈性體1者。(Example 2) Manufacturing example of laminated body (Example 2-1) Manufacturing example of laminated body 1 The liquid composition 1 was applied to the surface of a long copper foil (thickness: 18 μm) using a bar coater to form a wet film. Then, the initial heating temperature was set to 200° C., and the metal foil formed with the wet film was heated in a nitrogen oven for 5 minutes. Then, set the post-heating temperature to 380°C and heat it in a nitrogen oven for 3 minutes. Thereby, a laminate 1 having a metal foil and a polymer layer 1 (thickness: 5 μm), which is a cured product of the F polymer 1, maleimide 1, and the surface of the metal foil, was obtained. Filler 1 and elastomer 1.

(例2-2)積層體2之製造例 將所使用之液狀組合物之種類變更為液狀組合物2,除此以外,藉由與例2-1相同之方式由液狀組合物2獲得積層體2。 (例2-3)積層體5之製造例 將初期加熱之溫度設為100℃,除此以外,藉由與例2-1相同之方式獲得積層體5。 (例2-4)積層體6之製造例 省略初期加熱,除此以外,藉由與例2-1相同之方式獲得積層體6。(Example 2-2) Manufacturing example of laminate 2 Except that the type of the liquid composition used was changed to the liquid composition 2, the layered product 2 was obtained from the liquid composition 2 in the same manner as in Example 2-1. (Example 2-3) Manufacturing example of laminate 5 Except that the temperature of the initial heating was set to 100°C, a laminate 5 was obtained in the same manner as in Example 2-1. (Example 2-4) Manufacturing example of laminated body 6 Except for omitting the initial heating, a laminate 6 was obtained in the same manner as in Example 2-1.

將各個積層體之介電損耗因數、剝離強度、線膨脹係數及折彎性之評估結果、以及加工各個積層體所獲得之印刷配線基板之傳輸特性之評估結果彙總示於表3。再者,各者之評估係依據以下之方法而實施。Table 3 summarizes the evaluation results of the dielectric loss factor, peel strength, linear expansion coefficient, and bendability of each laminate, and the evaluation results of the transmission characteristics of the printed wiring board obtained by processing each laminate. Furthermore, the evaluation of each is carried out according to the following methods.

[介電損耗因數] 利用氯化鐵水溶液藉由蝕刻去除積層體之銅箔而製作單一之聚合物層,藉由SPDR(分離柱電介質諧振)法以測定頻率10 GHz進行測定。 [評估基準] ○:介電損耗因數未達0.0012。 △:介電損耗因數為0.0012以上0.0024以下。 ×:介電損耗因數超過0.0024。[Dielectric loss factor] The copper foil of the laminate was removed by etching with a ferric chloride aqueous solution to produce a single polymer layer, and the measurement was performed by SPDR (Separation Column Dielectric Resonance) method at a measurement frequency of 10 GHz. [Assessment criteria] ○: The dielectric loss factor is less than 0.0012. △: The dielectric loss factor is 0.0012 or more and 0.0024 or less. ×: The dielectric loss factor exceeds 0.0024.

[剝離強度] 自積層體切出矩形狀(長度100 mm,寬度10 mm)之試片。然後,將距試片之長邊方向之一端50 mm之位置加以固定,於拉伸速度50 mm/分鐘下,自長邊方向之一端以相對於試片為90°之角度剝離銅箔與聚合物層。測定此時之最大負載作為剝離強度(N/cm)。 [評估基準] ○:剝離強度為8 N/cm以上。 △:剝離強度為4 N/cm以上且未達8 N/cm。 ×:剝離強度未達4 N/cm。[Peel strength] Cut out a rectangular test piece (length 100 mm, width 10 mm) from the laminate. Then, fix the position 50 mm away from one end of the long side direction of the test piece, and at a stretching speed of 50 mm/min, peel off the copper foil and polymer at an angle of 90° with respect to the test piece from one end of the long side direction.物层。 The material layer. The maximum load at this time was measured as the peel strength (N/cm). [Assessment criteria] ○: The peel strength is 8 N/cm or more. △: The peel strength is 4 N/cm or more and less than 8 N/cm. ×: The peel strength is less than 4 N/cm.

[線膨脹係數] 利用氯化鐵水溶液藉由蝕刻去除積層體之銅箔而製作單一之聚合物層,切出180 mm見方之四方形試片。然後,依據JIS C 6471:1995中所規定之測定方法測定25℃以上260℃以下之範圍內之試片之線膨脹係數。 [評估基準] ○:30 ppm/℃以下。 △:超過30 ppm/℃且為50 ppm/℃以下。 ×:超過50 ppm/℃。[Linear expansion coefficient] The copper foil of the laminate was removed by etching with ferric chloride aqueous solution to produce a single polymer layer, and a 180 mm square test piece was cut out. Then, the coefficient of linear expansion of the test piece within the range of 25°C to 260°C is measured according to the measurement method specified in JIS C 6471:1995. [Assessment criteria] ○: 30 ppm/℃ or less. △: More than 30 ppm/°C and 50 ppm/°C or less. ×: More than 50 ppm/°C.

[折彎性] 利用氯化鐵水溶液藉由蝕刻去除積層體之銅箔而製作單一之聚合物層,切出5 mm見方之試片之四方形試片。然後,於曲率半徑(300 μm)之條件下彎折180°,自上方施加負載(50 mN,1分鐘)後使彎折恢復,依據以下之基準來評估試片之外觀。 [評估基準] ○:折縫部分未見外觀異常。 △:折縫部分發現變白。 ×:折縫處發生斷裂。[Bendability] The copper foil of the laminate was removed by etching with ferric chloride aqueous solution to produce a single polymer layer, and a square test piece of 5 mm square test piece was cut out. Then, bend 180° under the condition of the radius of curvature (300 μm), apply a load (50 mN, 1 minute) from above to restore the bending, and evaluate the appearance of the test piece according to the following criteria. [Assessment criteria] ○: No abnormal appearance is seen in the crease. △: Whitening is found in the crease part. ×: Breakage occurred at the crease.

對於加工所獲得之積層體而獲得之印刷基板之傳輸特性,依據以下之方法進行測定及評估。 [傳輸特性] 於積層體之銅箔形成傳輸線路而製成印刷配線基板。傳輸線路之形成係使用微帶線。使用向量網路分析儀(KEYSIGHT TECHNOLOGIE公司製造,「E8361A」)處理印刷配線基板中之28 GHz之信號,以Universal Test Fixture作為探針,測定表示傳輸損耗之S21參數。此時,將線路之特性阻抗設為50 Ω,將印刷配線基板之傳輸線路之長度設為50 mm而測定傳輸損耗。 將傳輸損耗之尺度設為用於表示高頻電子電路或高頻電子零件之特性之網路參數之一即「S21-parameter」,將其作為傳輸損耗值。再者,該值越接近0,則表示傳輸損耗越小。 [評估基準] ○:-0.7以上且0以下。 △:未達-0.7且為-1.0以上。 ×:未達-1.0。The transmission characteristics of the printed circuit board obtained by processing the laminated body obtained are measured and evaluated according to the following methods. [Transmission characteristics] A transmission line is formed on the copper foil of the laminate to make a printed wiring board. The formation of the transmission line uses a microstrip line. A vector network analyzer (manufactured by KEYSIGHT TECHNOLOGIE, "E8361A") was used to process the 28 GHz signal in the printed wiring board, and the Universal Test Fixture was used as a probe to measure the S21 parameter representing the transmission loss. At this time, the characteristic impedance of the line is set to 50 Ω, and the length of the transmission line of the printed wiring board is set to 50 mm to measure the transmission loss. Set the transmission loss scale to one of the network parameters used to express the characteristics of high-frequency electronic circuits or high-frequency electronic parts, namely "S21-parameter", and use it as the transmission loss value. Furthermore, the closer the value is to 0, the smaller the transmission loss. [Assessment criteria] ○: -0.7 or more and 0 or less. △: Less than -0.7 and greater than -1.0. ×: It did not reach -1.0.

[表3] 積層體編號 介電損耗因數 剝離強度 線膨脹係數(ppm/℃) 可撓性 傳輸特性 1 2 5 6 × × × - - [table 3] Layered body number Dielectric loss factor Peel strength Coefficient of linear expansion (ppm/℃) Flexibility Transmission characteristics 1 2 5 6 X X X - -

利用氯化鐵水溶液藉由蝕刻去除積層體之銅箔而製作單一之聚合物層,評估聚合物層是否滿足阻燃性之UL94-V0標準。其結果為,積層體1及2之聚合物層滿足標準,積層體5及6之聚合物層不滿足標準。 [產業上之可利用性]The copper foil of the laminate was removed by etching with ferric chloride aqueous solution to produce a single polymer layer, and it was evaluated whether the polymer layer meets the UL94-V0 standard for flame retardancy. As a result, the polymer layers of laminates 1 and 2 met the standards, and the polymer layers of laminates 5 and 6 did not meet the standards. [Industrial availability]

根據本發明,可獲得具備基於四氟乙烯系聚合物之物性、及基於馬來醯亞胺系化合物之物性之成形品。藉由本發明所獲得之成形品可用作天線零件、印刷基板、飛機用零件、汽車用零件、體育用品、食品工業用品、塗料、化妝品等,具體而言,可用作:電線被覆材(飛機用電線等)、電氣絕緣性膠帶、石油挖掘用絕緣膠帶、印刷基板用材料、分離膜(微濾膜、超過濾膜、逆滲透膜、離子交換膜、透析膜、氣體分離膜等)、電極黏合劑(鋰二次電池用、燃料電池用等)、複製輥、傢俱、汽車儀錶板、家電製品等之外殼、滑動構件(負載軸承、滑動軸、閥、軸承、齒輪、凸輪、帶式輸送機、食品搬送用傳送帶等)、工具(鏟、銼、錐子、鋸等)、鍋爐、漏斗、管道管、烘箱、烤模、滑槽、模嘴、馬桶、容器被覆材。According to the present invention, a molded product having physical properties based on a tetrafluoroethylene-based polymer and physical properties based on a maleimide-based compound can be obtained. The molded product obtained by the present invention can be used as antenna parts, printed circuit boards, aircraft parts, automotive parts, sports goods, food industry products, paints, cosmetics, etc., specifically, can be used as: wire coating materials (aircraft Electrically insulating tapes, insulating tapes for petroleum mining, materials for printed circuit boards, separation membranes (microfiltration membranes, ultrafiltration membranes, reverse osmosis membranes, ion exchange membranes, dialysis membranes, gas separation membranes, etc.), electrodes Adhesives (for lithium secondary batteries, fuel cells, etc.), replica rollers, furniture, automobile dashboards, home appliances, etc., housings, sliding members (load bearings, sliding shafts, valves, bearings, gears, cams, belt conveyors, etc.) Machines, conveyor belts for food conveying, etc.), tools (shovels, files, awls, saws, etc.), boilers, funnels, pipes, ovens, baking molds, chutes, mold nozzles, toilets, container covering materials.

Claims (15)

一種積層體之製造方法,其對基材層之表面賦予包含熔融溫度為260℃以上之四氟乙烯系聚合物粉末、與具有馬來醯亞胺基及伸芳基之熱固性化合物之液狀組合物,於100℃以上且未達上述四氟乙烯系聚合物之熔融溫度之溫度下進行加熱,進而,於上述四氟乙烯系聚合物之熔融溫度以上之溫度下進行加熱而形成聚合物層,從而獲得具有上述基材層及上述聚合物層之積層體。A method for manufacturing a laminate, which provides a liquid combination of a tetrafluoroethylene polymer powder with a melting temperature of 260°C or higher and a thermosetting compound having a maleimide group and an arylene group to the surface of a substrate layer The material is heated at a temperature above 100°C and below the melting temperature of the above-mentioned tetrafluoroethylene-based polymer, and further heated at a temperature above the melting temperature of the above-mentioned tetrafluoroethylene-based polymer to form a polymer layer, Thus, a laminate having the above-mentioned base material layer and the above-mentioned polymer layer is obtained. 如請求項1之製造方法,其中上述四氟乙烯系聚合物係包含基於全氟(烷基乙烯基醚)之單元或基於六氟丙烯之單元之四氟乙烯系聚合物。The manufacturing method of claim 1, wherein the above-mentioned tetrafluoroethylene-based polymer is a tetrafluoroethylene-based polymer containing perfluoro(alkyl vinyl ether)-based units or hexafluoropropylene-based units. 如請求項1或2之製造方法,其中上述四氟乙烯系聚合物係包含基於全氟(烷基乙烯基醚)之單元,且具有極性官能基之四氟乙烯系聚合物;或者,上述四氟乙烯系聚合物係相對於總單元包含2.0~5.0莫耳%之基於全氟(烷基乙烯基醚)之單元,且不具有極性官能基之四氟乙烯系聚合物。The manufacturing method of claim 1 or 2, wherein the above-mentioned tetrafluoroethylene-based polymer is a tetrafluoroethylene-based polymer containing a unit based on perfluoro(alkyl vinyl ether) and having a polar functional group; or, the above-mentioned tetrafluoroethylene-based polymer The vinyl fluoride polymer is a tetrafluoroethylene polymer that contains 2.0-5.0 mol% of perfluoro(alkyl vinyl ether)-based units with respect to the total unit and does not have a polar functional group. 如請求項1至3中任一項之製造方法,其中上述液狀組合物進而包含無機填料。The production method according to any one of claims 1 to 3, wherein the liquid composition further includes an inorganic filler. 如請求項1至4中任一項之製造方法,其中上述液狀組合物進而包含彈性體。The manufacturing method according to any one of claims 1 to 4, wherein the liquid composition further comprises an elastomer. 如請求項1至5中任一項之製造方法,其中上述液狀組合物中之上述熱固性化合物之含量相對於上述四氟乙烯系聚合物之含量之比為0.2以下。The production method according to any one of claims 1 to 5, wherein the ratio of the content of the thermosetting compound in the liquid composition to the content of the tetrafluoroethylene-based polymer is 0.2 or less. 如請求項1至6中任一項之製造方法,其中上述熱固性化合物之硬化物之玻璃轉移溫度為上述四氟乙烯系聚合物之熔融溫度以下。The manufacturing method according to any one of claims 1 to 6, wherein the glass transition temperature of the cured product of the thermosetting compound is lower than the melting temperature of the tetrafluoroethylene-based polymer. 如請求項1至7中任一項之製造方法,其中上述基材層為金屬箔或聚合物膜。The manufacturing method according to any one of claims 1 to 7, wherein the substrate layer is a metal foil or a polymer film. 一種液狀組合物,其含有包含基於全氟(烷基乙烯基醚)之單元之四氟乙烯系聚合物粉末、與具有馬來醯亞胺基及伸芳基之熱固性化合物,且上述四氟乙烯系聚合物具有極性官能基,或者相對於總單元包含2.0~5.0莫耳%之基於上述全氟(烷基乙烯基醚)之單元且不具有極性官能基。A liquid composition containing a tetrafluoroethylene polymer powder containing a unit based on perfluoro(alkyl vinyl ether), and a thermosetting compound having a maleimide group and an aryl group, and the above-mentioned tetrafluoroethylene The ethylene-based polymer has a polar functional group, or contains 2.0 to 5.0 mol% of the unit based on the above-mentioned perfluoro(alkyl vinyl ether) with respect to the total unit and does not have a polar functional group. 如請求項9之液狀組合物,其中上述熱固性化合物之分子量為300~2000。The liquid composition according to claim 9, wherein the molecular weight of the thermosetting compound is 300-2000. 如請求項9或10之液狀組合物,其中上述四氟乙烯系聚合物粉末之平均粒徑為40 μm以下。The liquid composition of claim 9 or 10, wherein the average particle size of the tetrafluoroethylene polymer powder is 40 μm or less. 如請求項9至11中任一項之液狀組合物,其進而包含無機填料。The liquid composition according to any one of claims 9 to 11, which further contains an inorganic filler. 如請求項9至12中任一項之液狀組合物,其進而包含彈性體。The liquid composition according to any one of claims 9 to 12, which further comprises an elastomer. 如請求項9至13中任一項之液狀組合物,其中上述液狀組合物中之上述熱固性化合物之含量相對於上述四氟乙烯系聚合物之含量之比為0.2以下。The liquid composition according to any one of claims 9 to 13, wherein the ratio of the content of the thermosetting compound in the liquid composition to the content of the tetrafluoroethylene-based polymer is 0.2 or less. 如請求項9至14中任一項之液狀組合物,其中上述液狀組合物在25℃下之黏度為100~5000 mPa・s。The liquid composition according to any one of claims 9 to 14, wherein the viscosity of the liquid composition at 25°C is 100 to 5000 mPa·s.
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