TW202137429A - Modular mold and method for manufacturing fingerprint sensing module using the same - Google Patents
Modular mold and method for manufacturing fingerprint sensing module using the same Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 238000004806 packaging method and process Methods 0.000 claims description 52
- 238000000059 patterning Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 238000012858 packaging process Methods 0.000 description 20
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- 230000004888 barrier function Effects 0.000 description 3
- 239000005022 packaging material Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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Abstract
Description
本發明是有關於一種模具及其使用方法,且特別是有關於一種模組化模具及使用其製作指紋感測模組的方法。The present invention relates to a mold and a method of using the same, and more particularly to a modular mold and a method of using the same to make a fingerprint sensing module.
隨著可攜式電子裝置(例如智慧型手機或平板電腦)朝向大屏佔比或全面屏發展,傳統位於螢幕旁的電容式指紋感測模組無法再配置於電子裝置的正面。於是,配置於電子裝置側面或背面的電容式指紋感測模組的方案便被採用。然而,放置於側面或背面的電容式指紋感測模組在使用上有其不便之處,所以近來發展出放置於螢幕下方的方案的光學式指紋感測模組。With the development of portable electronic devices (such as smart phones or tablet computers) toward larger screen-to-body ratios or full screens, the traditional capacitive fingerprint sensor module located next to the screen can no longer be placed on the front of the electronic device. Therefore, the solution of capacitive fingerprint sensing module arranged on the side or back of the electronic device is adopted. However, the capacitive fingerprint sensor module placed on the side or the back has its inconvenience in use. Therefore, an optical fingerprint sensor module placed under the screen has recently been developed.
目前指紋模組主要是透過透明膠材保護金線,但由於透明膠材無法達到有效隔絕環境光源漏光,故將使得環境光源進入感測元件,進而造成指紋影像曝光時間錯誤而無法取出清晰之指紋。因此,需要提出一個阻隔層結構的製作方法。然而,在目前的生產超薄指紋模組的製程中,封裝圖形一旦更改,則將花費巨額的模具費用,且更換模具需花費大量時間。故製作具有不同封裝材料的指紋感測模組,將會大量提高模具開模時的花費成本。At present, the fingerprint module mainly protects the gold thread through transparent plastic material, but because the transparent plastic material cannot effectively isolate the ambient light source from leaking, it will cause the ambient light source to enter the sensing element, which will cause the fingerprint image exposure time to be wrong and the clear fingerprint cannot be taken out. . Therefore, it is necessary to propose a method for manufacturing the barrier layer structure. However, in the current manufacturing process of producing ultra-thin fingerprint modules, once the package pattern is changed, it will cost a huge amount of mold costs, and it takes a lot of time to replace the mold. Therefore, the production of fingerprint sensing modules with different packaging materials will greatly increase the cost of mold opening.
本發明提供一種模組化模具及使用其製作指紋感測模組的方法,可減低製程成本,且減低開模的難易度。The invention provides a modular mold and a method for manufacturing a fingerprint sensing module using the modular mold, which can reduce the manufacturing process cost and reduce the difficulty of mold opening.
本發明提供一種模組化模具,適於製作指紋感測模組。模組化模具包括上模、下模、離模組件、至少一支撐柱以及圖案化組件。下模與上模平行設置。離模組件配置於上模。至少一支撐柱配置於上模與下模之間。圖案化組件配置於離模組件。離模組件位於上模與圖案化組件之間,其中上模及下模皆不具圖案化。The invention provides a modular mold suitable for making fingerprint sensing modules. The modular mold includes an upper mold, a lower mold, a mold release component, at least one supporting column, and a patterned component. The lower mold and the upper mold are arranged in parallel. The mold release component is arranged on the upper mold. At least one supporting column is arranged between the upper mold and the lower mold. The patterned component is disposed on the release component. The mold release component is located between the upper mold and the patterned component, and neither the upper mold nor the lower mold is patterned.
本發明另提供一種使用模組化模具製作指紋感測模組的方法,包括:提供上模、下模以及離模組件的步驟;配置軟性電路板、感光元件以及電路結構的組合至下模的步驟;組裝至少一支撐柱至下模,以及組裝第一圖案化組件至離模組件的步驟;壓合上模、離模組件以及第一圖案化組件至下模及至少一支撐柱以形成第一封裝空間的步驟;提供第一膠體至第一封裝空間以形成第一封裝結構的步驟;更換第一圖案化組件為第二圖案化組件的步驟;壓合上模、離模組件以及第二圖案化組件至下模及至少一支撐柱以形成第二封裝空間的步驟;提供第二膠體至第二封裝空間以形成第二封裝結構的步驟的步驟;以及移除上模、下模、離模組件、第二圖案化組件以及至少一支撐柱以形成指紋感測模組。The present invention also provides a method for manufacturing a fingerprint sensing module using a modular mold, which includes the steps of providing an upper mold, a lower mold, and a mold release component; configuring a combination of a flexible circuit board, a photosensitive element, and a circuit structure to the lower mold The steps of assembling at least one supporting column to the lower mold, and assembling the first patterned component to the release component; pressing the upper mold, the releasing component and the first patterned component to the lower mold and at least one supporting column The step of forming the first packaging space; the step of providing the first glue to the first packaging space to form the first packaging structure; the step of replacing the first patterned component with the second patterned component; pressing the upper mold and separating the mold The step of forming the second packaging space by providing the second glue to the second packaging space to form the second packaging structure; and removing the upper mold, The lower mold, the mold release component, the second patterned component and at least one supporting column form a fingerprint sensing module.
基於上述,在本發明的模組化模組以及使用其製作指紋感測模組的方法中,模組化模具包括上模、下模、離模組件、至少一支撐柱以及圖案化組件。其中,指紋感測模組中的封裝結構外型可由模組化模具中所使用的支撐柱及圖案化組件所定義,且模組化模組的上模及下模皆不具圖案化。因此,模組化模具中可替換式的支撐柱以及圖案化組件可取代傳統使用具有圖案化且造價昂貴的上模進行封裝製程。如此一來,可減低製程成本,且減低開模的難易度,同時可減少製程花費時間。Based on the above, in the modularized module of the present invention and the method for manufacturing a fingerprint sensing module using the same, the modularized mold includes an upper mold, a lower mold, a mold release component, at least one support column, and a patterned component. Among them, the package structure in the fingerprint sensing module can be defined by the supporting pillars and patterned components used in the modular mold, and the upper mold and the lower mold of the modular module are not patterned. Therefore, the replaceable support pillars and patterned components in the modular mold can replace the traditional use of a patterned and expensive upper mold for the packaging process. In this way, the process cost can be reduced, and the difficulty of mold opening can be reduced, and the process time can be reduced at the same time.
為讓本發明的上述特徵和優點能更明顯易懂,下文特舉實施例,並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.
請參考圖1及圖2。本實施例提供一種模組化模具100,適於製作指紋感測模組200。指紋感測模組200適於配置在電子裝置中,例如是智慧型手機、平板電腦、筆記型電腦或觸控型顯示裝置等。指紋感測模組200用以感測使用者的指紋資訊,以執行運作、認證等指令。舉例而言,指紋感測模組200配置於電子裝置中顯示面板的下方,適於接收由手指所反射的感測光束,以進行指紋辨識。在本實施例中,指紋感測模組200為超薄感測模組,其厚度僅約300微米,故可應用於薄型的電子裝置中。Please refer to Figure 1 and Figure 2. This embodiment provides a
請先參考圖2。在本實施例所製作出來的指紋感測模組200,例如包括軟性電路板210、感光元件220、電路結構230、聚光元件240、第一封裝結構250以及第二封裝結構260,但本發明並不限於此。軟性電路板210用以乘載電子元件並供應電源。Please refer to Figure 2 first. The
感光元件220例如是互補式金氧半導體(complementary metal oxide semiconductor, CMOS)影像感測器,而感測單元則為這些影像感測晶器中的感測畫素。The
電路結構230例如是以金製成的電線,連接於感光元件220與軟性電路板210,以使感光元件220與軟性電路板210電性連接。The
聚光元件240配置於感光元件220的感光面上,用以導引感測光束至感光元件220的感光面。聚光元件240例如是微透鏡陣列元件。因此,進而提升感光元件220的感測效果。The
第一封裝結構250以及第二封裝結構260為不同材料且為不同時序的封裝製程所形成的封裝結構。舉例而言,第一封裝結構250以及第二封裝結構260的材料例如可選用矽氧樹脂(silicone)、環氧樹脂(epoxy)或其他種類膠材。在本實施例中,第一封裝結構250為透光,且第二封裝結構260為不透光。舉例而言,第一封裝結構250例如選用黑色膠材製作而成。如此一來,可進一步避免非感測光傳遞至感光元件220的感光面,從而可提高指紋感測模組200的感測效果。The
此外,第一封裝結構250的高度H3大於感光元件220的高度H1以及電路結構H2的高度,而第二封裝結構260的高度H4大於第一封裝結構250的高度H3。換句話說,由第一道封裝製程所形成的第一封裝結構250可先保封裝保護感光元件220以及電路結構230,而由第二道封裝製程所形成的第二封裝結構260則可以填補第一道封裝製程所無法進行封裝的空間。In addition, the height H3 of the
請再參考圖1。模組化模具100包括上模110、下模120、離模組件130、至少一支撐柱140以及圖案化組件150。上模110及下模120,用以作為模組化模具100的承載。Please refer to Figure 1 again. The
上模110與下模120彼此呈平行設置,且上模110及下模120皆不具圖案化。具體而言,上模110中朝向下模120的表面S1以及下模120中朝向上模110的表面S2皆為平坦表面。因此,本實施例模組化模具100的上模110與下模120可簡單製作,且可降低成本。The
離模組件130配置於上模110,用以暫時性地連接可替換的圖案化組件150。具體而言,在本實施例中,離模組件130包括離模紙132以及黏著件134。黏著件134用以黏接圖案化組件150,而黏著件134藉由離模紙132連接於上模110。The
支撐柱140配置於上模110與下模120之間,用以在封裝製程中配置於空間中以形成阻隔物,從而定義出指紋感測模組200的封裝結構外型或定義出內部空間裡預留其他製程用的空間。舉例而言,支撐柱140的數量可以是多個,且分別配置於預製作指紋感測模組200的周圍或內部空間,以使封裝材料可被阻擋或隔開,進而藉由支撐柱140的高度而定義出指紋感測模組200的封裝厚度。支撐柱140的材料例如使用不鏽鋼,且其形狀可以是任意幾何形狀。在不同的實施例中,可依據封裝製程的次數及個封裝結構的分佈而設計並提供不同形狀或數量的支撐柱140,從而在封裝製程過程中替換,本發明並不限於此。The supporting
圖案化組件150配置於離模組件130,離模組件130位於上模110與圖案化組件150之間。圖案化組件150用以在封裝的製程中配置於空間中以形成阻隔物,從而定義出指紋感測模組200的封裝結構外型或為內部空間裡預留其他製程用空間。具體而言,圖案化組件150藉由黏著件134黏著於離模紙132,並藉由離模紙132連接於上模110。因此,在製程中可藉由從上模110移除離模組件130而更換不同結構或外型的圖案化組件150。The
舉例而言,圖案化組件150朝向下模120的一側具有圖案化結構A,且配置於預製作指紋感測模組200的頂側空間,以使封裝材料可被圖案化組件150的結構形狀而圖案化或限制其厚度,進而藉由圖案化組件150的圖案形成出指紋感測模組200的封裝頂側封裝結構圖案。圖案化組件150的材料可類似於支撐柱140使用不鏽鋼,且其形狀可以是任意幾何形狀。在不同的實施例中,可依據封裝製程的次數及個封裝結構的分佈而設計並提供不同形狀或數量的圖案化組件150,從而在封裝製程過程中替換,本發明並不限於此。由於進行不同封裝製程僅需更換支撐柱140或圖案化組件150,故不需重新對上下模進行預熱即可進行下一階段封裝製程。For example, the
值得一提的是,在製作第一封裝結構250以及第二封裝結構260的製程中,藉由不同的圖案化組件150的圖案可於第一封裝結構250以及第二封裝結構260的頂側分別具有不同的結構。舉例而言,在本實施例中,第一封裝結構250具有第一凹槽C1,第二封裝結構260具有第二凹槽C2,且第二封裝結構250填充於第一凹槽C1。換句話說,第一凹槽C1及第二凹槽C2的形狀分別適配於不同或相同的圖案化組件150。It is worth mentioning that in the process of manufacturing the
請先參考圖3A、圖3B及圖4。以製作流程說明為例,本實施例提供一種使用模組化模具100(如圖1所顯示)製作指紋感測模組200(如圖2所顯示)的方法。首先,執行步驟S300,提供上模110、下模120以及離模組件130,其中,離模組件130包括離模紙132以及黏著件134。接著,執行步驟S301,配置軟性電路板210、感光元件220以及電路結構230的組合至下模120。在本實施例中,還可配置聚光元件240於感光元件220的感光面上,用以導引感測光束至感光元件220的感光面,但本發明並不限於此。Please refer to Figure 3A, Figure 3B and Figure 4 first. Taking the description of the manufacturing process as an example, this embodiment provides a method for manufacturing a fingerprint sensing module 200 (shown in FIG. 2) using a modular mold 100 (shown in FIG. 1). First, step S300 is performed to provide an
請參考圖3C、圖3D及圖4。接著,執行步驟S302,組裝至少一支撐柱140A至下模120,以及組裝第一圖案化組件150A至離模組件130。接著,執行步驟S303,壓合上模110、離模組件130以及第一圖案化組件150A至下模120及至少一支撐柱140以形成第一封裝空間E1。其中,第一封裝空間E1的高度大於感光元件220的高度以及電路結構230的高度。Please refer to Figure 3C, Figure 3D and Figure 4. Then, step S302 is performed to assemble at least one supporting
請參考圖3E、圖3F及圖4。接著,執行步驟S304,提供第一膠體至第一封裝空間E1以形成第一封裝結構250。意即,此步驟完成第一次封裝製程。值得一提的是,第一封裝結構250的頂側會藉由第一圖案化組件150A而形成第一凹槽C1。接著,執行步驟S305,更換第一圖案化組件150A為第二圖案化組件150B。在本實施例中,還可包括更換不同高度的支撐柱140B,如圖3F所顯示。換句話說,在不同的製程中,可更換不同圖案的圖案化組件或不同高度的支撐柱以進行後續不同的封裝製程。Please refer to Figure 3E, Figure 3F and Figure 4. Then, step S304 is performed to provide the first glue to the first packaging space E1 to form the
請參考圖3G、圖3H及圖4。接著,執行步驟S306,壓合上模110、離模組件130以及第二圖案化組件150B至下模120及至少一支撐柱140B以形成第二封裝空間E2。其中,第二封裝空間E2的高度大於第一封裝空間E1的高度。接著,執行步驟S307,提供第二膠體至第二封裝空間E2以形成第二封裝結構260。意即,此步驟完成第二次封裝製程。值得一提的是,第二封裝結構260的頂側會藉由第二圖案化組件150B而形成第二凹槽C2,且在本實施例中,第一凹槽C1的延伸方向與第二凹槽C2的延伸方向不同,如圖3H所顯示。Please refer to Figure 3G, Figure 3H and Figure 4. Then, step S306 is performed to press-fit the
請參考圖1、圖3H、圖3I及圖4。最後,執行步驟S308,移除上模110、下模120、離模組件130、第二圖案化組件150B以及支撐柱140以形成指紋感測模組200。意即,完成第二次封裝製程後,即可拆卸模組化模具100以取出製作完成的指紋感測模組200。使用此一設計模組化模具100所製作出的指紋感測模組200能達到薄型化的目的,並可藉由設計封裝結構材料以有效減少環境光干擾。Please refer to Figure 1, Figure 3H, Figure 3I and Figure 4. Finally, step S308 is performed to remove the
因此,由上述的製程可知,本實施例所提供的模組化模具100包含有可替換式的支撐柱140以及圖案化組件150,進而取代傳統使用具有圖案化且造價昂貴的上模進行封裝製程。此外,由於進行不同封裝製程僅需更換支撐柱140或圖案化組件150,故不需對上下模進行預熱即可進行下一階段封裝製程。如此一來,可減低製程成本,且減低開模的難易度,同時可減少製程花費時間。Therefore, it can be seen from the above-mentioned manufacturing process that the
綜上所述,在本發明的模組化模組以及使用其製作指紋感測模組的方法中,模組化模具包括上模、下模、離模組件、至少一支撐柱以及圖案化組件。其中,指紋感測模組中的封裝結構外型可由模組化模具中所使用的支撐柱及圖案化組件所定義,且模組化模組的上模及下模皆不具圖案化。因此,模組化模具中可替換式的支撐柱以及圖案化組件可取代傳統使用具有圖案化且造價昂貴的上模進行封裝製程。如此一來,可減低製程成本,且減低開模的難易度,同時可減少製程花費時間。To sum up, in the modularized module of the present invention and the method for manufacturing a fingerprint sensing module using the same, the modularized mold includes an upper mold, a lower mold, a mold release component, at least one support column, and a patterned mold. Components. Among them, the package structure in the fingerprint sensing module can be defined by the supporting pillars and patterned components used in the modular mold, and the upper mold and the lower mold of the modular module are not patterned. Therefore, the replaceable support pillars and patterned components in the modular mold can replace the traditional use of a patterned and expensive upper mold for the packaging process. In this way, the process cost can be reduced, and the difficulty of mold opening can be reduced, and the process time can be reduced at the same time.
雖然本發明已以實施例揭露如上,然其並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明的精神和範圍內,當可作些許的更動與潤飾,故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The protection scope of the present invention shall be subject to those defined by the attached patent application scope.
100:模組化模具
110:上模
120:下模
130:離模組件
132:離模紙
134:黏著件
140,140A,140B:支撐柱
150:圖案化組件
150A:第一圖案化組件
150B:第二圖案化組件
200:指紋感測模組
210:軟性電路板
220:感測元件
230:電路結構
240:聚光元件
250:第一封裝結構
260:第二封裝結構
C1:第一凹槽
C2:第二凹槽
E1:第一封裝空間
E2:第二封裝空間
H1,H2,H3,H4:高度
S300~S308:步驟100: Modular mold
110: upper die
120: Lower die
130: Release component
132: Release paper
134:
圖1為本發明一實施例的模組化模具的剖面示意圖。 圖2為由圖1的模組化模具所製作出的指紋感測模組的剖面示意圖。 圖3A至圖3I分別為本發明一實施例使用模組化模具製作指紋感測模組的剖面示意圖。 圖4為本發明一實施例使用模組化模具製作指紋感測模組的方法流程圖。FIG. 1 is a schematic cross-sectional view of a modular mold according to an embodiment of the present invention. 2 is a schematic cross-sectional view of a fingerprint sensing module manufactured by the modular mold of FIG. 1. 3A to 3I are respectively schematic cross-sectional views of using a modular mold to make a fingerprint sensing module according to an embodiment of the present invention. 4 is a flowchart of a method for manufacturing a fingerprint sensing module using a modular mold according to an embodiment of the present invention.
100:模組化模具100: Modular mold
110:上模110: upper die
120:下模120: Lower die
130:離模組件130: Release component
132:離模紙132: Release paper
134:黏著件134: Adhesive Parts
140:支撐柱140: support column
150:圖案化組件150: Patterned components
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JP4443334B2 (en) * | 2004-07-16 | 2010-03-31 | Towa株式会社 | Resin sealing molding method of semiconductor element |
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