TWM601382U - Image capturing device and electronic device using the same - Google Patents

Abstract

An image capturing device includes an image capturing chip, and the image capturing chip has an image capturing chip body, a plurality of pixel sensors, a light-transmitting material, and a plurality of color filter stacks. The pixel sensors are formed on the image capturing chip body. The light-transmitting material is formed on the image capturing chip body and covers the pixel sensors. The color filter stacks are arranged in the light-transmitting material in an array, and the two adjacent color filter stacks form a light channel, and each of the light channels corresponds to one of the pixel sensors, wherein each of the color filter stacks is composed of a plurality of color filters.

Description

Image capturing device and electronic device using it

The present invention relates to an image capturing device for obtaining biometric images, and in particular to an image capturing device that can be installed under a cover (for example, a display panel, a touch panel, a touch display panel or a finger pressure plate) and its use This image capturing device is an electronic device with a biological feature recognition function.

Fingerprint recognition devices are divided into capacitive and optical types. Capacitive fingerprint recognition devices mainly record fingerprint characteristics through the capacitance changes of multiple touch points, while optical fingerprint recognition devices directly obtain fingerprint images to record fingerprint characteristics . Capacitive fingerprint recognition devices are susceptible to moisture or other electronic noise, and have misjudgment problems. Furthermore, if electronic devices (such as smartphones or tablets) using capacitive fingerprint recognition devices have items such as protective stickers or tempered glass attached, the capacitive fingerprint recognition devices may not be able to recognize fingerprints.

Although the optical fingerprint recognition device can solve the technical problem that fingerprints cannot be recognized due to the attachment of protective stickers or tempered glass, the existing optical fingerprint recognition device is mostly provided with a collimator layer in order to avoid light crosstalk. To solve the problem of light crosstalk. However, once the collimating layer has a multi-layer structure, it is difficult to accurately align the light channel in the collimating layer at the center of the pixel sensor, which leads to difficulty and complexity in the manufacturing process and lower product yield.

Please refer to FIG. 1. FIG. 1 is a schematic diagram of a stacked structure of an electronic device using a conventional image capturing device. In FIG. 1, the electronic device 1 includes a cover plate 10 and an image capturing device 16. The cover plate 10 is disposed on the image capturing device 16, and the cover plate 16 can be a fingerboard, a display panel, a touch panel, or a touch display panel. . The image capturing device 10 includes a filter plate 11, a collimating layer 12, an image capturing wafer 14 and a substrate 15. The imaging wafer 14 is disposed on the substrate 15, the collimating layer 12 is disposed on the imaging wafer 14, and the filter plate 11 is disposed between the collimating layer 12 and the cover plate 10.

When the user brings a part with biological characteristics (for example, fingers, wrists, or eyes, not shown) close to the cover 10, the light source (for example, natural light, the light source of the display panel, or the light source provided by the image capturing device 16 ( The light of )) will be reflected to the filter plate 11 by the parts with biological characteristics. The filter plate 11 is used to filter light of a specific wavelength range, for example, infrared rays or ultraviolet rays. Then, the collimating layer 12 receives the light passing through the filter plate 11 and provides a light channel to allow the light to pass through collimatedly without light crosstalk. After that, the imaging chip 14 is used to sense the light passing through the collimating layer 12 and thereby generate a biometric image.

Furthermore, the collimating layer 12 includes a micro-structure lens 121, light-shielding materials 122, 124, and a light-transmitting material 123. The micro-structure lens 121 is arranged on top of the light-transmitting material 123, and the light-shielding materials 122 and 124 are arrayed on different planes. The ground is disposed in the light-transmitting material 123 to form multiple light channels, and each light channel corresponds to a microstructure lens 121. The imaging wafer 14 includes a pixel sensor 141 and an imaging wafer body 142. The pixel sensors 141 are arranged on the surface of the imaging wafer body 142 in an array to receive light passing through the corresponding light channel. Generally, the light channel needs to be accurately centered on the image capturing area on the surface of the pixel sensor 141. However, the above alignment is not easy to achieve for the existing manufacturing process, or it may result in a lower product yield. Furthermore, in order to obtain better fingerprints from the imaging device 16, designers or manufacturers often hope that the collimating layer can be formed with a thicker light-shielding material, so that the whole has a deeper optical channel, but with the current existing technology It is difficult to realize this technology, and the light-shielding material is used in multiple manufacturing processes on the existing imaging wafer, which often reduces the collimation. The job is, how to form a thicker light-shielding material to achieve a deeper optical channel under the existing process technology is an area that needs to be improved. On the other hand, the thickness of the imaging chip 14 of the existing fingerprint imaging device 16 is thinner than that of the substrate 15 and the collimating layer 12. Therefore, during the assembly process of the imaging device 16 and the cover 10, it is easy to cause The imaging chip 14 is broken.

Based on at least one of the foregoing objectives, embodiments of the present invention provide an imaging device having an imaging chip, and the imaging chip has an imaging chip body, a plurality of pixel sensors, a first light-transmitting material, and a A first color filter set. A plurality of pixel sensors are formed on the body of the imaging chip. The first light-transmitting material is formed on the body of the imaging chip and covers the plurality of pixel sensors. A plurality of first color filter groups are arranged in the first light-transmitting material in an array, the two adjacent first color filter groups form a first light channel, and each first The light channel corresponds to one of the plurality of pixel sensors, wherein each of the first color filter groups is composed of a plurality of first color filters.

In an embodiment of the present invention, the plurality of first color filters of each first color filter set are selected from filters of red light, green light and blue light, and the plurality of first color filters A color filter is identical, partially identical or completely different.

In an embodiment of the present invention, the cross-sectional shape of the plurality of first light channels is circular or square.

In an embodiment of the present invention, the image capturing device further includes at least one collimation layer. The collimating layer is disposed on the imaging wafer, and includes a plurality of microstructure lenses, a second light-transmitting material, and a plurality of light-shielding materials, wherein the micro-structure lens is formed on the second light-transmitting material On the surface, the plurality of light-shielding materials are arranged in an array in the second light-transmitting material, and a plurality of second light channels are formed, and the plurality of second light channels correspond to the plurality of first lights Channel and the plurality of pixel sensors.

In an embodiment of the present invention, the image capturing device further includes at least one microstructure layer. The microstructure layer is arranged on the imaging wafer, and a plurality of microstructure lenses are formed on the surface of the microstructure layer.

In an embodiment of the present invention, the imaging device further includes the microstructure layer and the collimation layer at the same time.

In an embodiment of the present invention, the image capturing device includes at least one filter plate, and the filter plate is disposed on the image capturing chip.

In an embodiment of the present invention, the imaging chip further includes a plurality of second color filter sets located under the plurality of first color filter sets, and the plurality of second color filter sets The groups are arranged in the first light-transmitting material in an array, the two adjacent second color filter groups form a second light channel, and each of the second light channels corresponds to the plurality of One of the pixel sensor and one of the plurality of first light channels, wherein each of the second color filter groups is composed of a plurality of second color filters.

In an embodiment of the present invention, the area of the first light channel is less than or equal to the area of the corresponding second light channel, and the area of the second light channel is less than the projected area of the corresponding microstructure lens, And the projection area of the microstructure lens is smaller than the sensing area of the corresponding pixel sensor.

In an embodiment of the present invention, the thickness HC of the first and second optical channels, the thickness H and the rule diameter WM of the microstructure lens satisfy the following relationship: HC≦π((WM/2) ² +H ² )/2H.

In an embodiment of the present invention, the thickness HC of the first and second optical channels, the thickness H and the rule diameter WM of the microstructure lens satisfy the following relationship: HC≦π((WM/2) ² +H ² )/4H.

In an embodiment of the present invention, the image capturing device further includes a peripheral protrusion structure formed on the periphery of the collimation layer or the surface of the microstructure layer and surrounding the plurality of microstructures A lens, wherein the height of the peripheral protrusion structure is greater than the height of the plurality of microstructure lenses.

In an embodiment of the present invention, the peripheral protrusion structure is a wall or another micro-structure lens.

In an embodiment of the present invention, the image capturing device further includes an encapsulation layer. The encapsulation layer is formed around the imaging chip and the alignment layer or the microstructure layer.

In an embodiment of the present invention, the peripheral protrusion structure is a part of the alignment layer, the microstructure layer, or the encapsulation layer.

In an embodiment of the present invention, the imaging device further includes a substrate and at least one elastic support, wherein the imaging chip is disposed on the substrate, and the elastic support is disposed on the substrate On the periphery of the surface.

In an embodiment of the present invention, the elastic support member is in the shape of a straight column or an inverted L-shaped column.

Based on at least one of the foregoing objectives, an embodiment of the present invention provides an electronic device, which includes any of the aforementioned image capturing devices and a cover plate, and the image capturing device is disposed under the cover plate.

In an embodiment of the present invention, the electronic device further includes a middle frame. The middle frame is used for combining with the image capturing device, and the image capturing device is combined with the cover plate through the middle frame to form the electronic device.

In short, the imaging device and its electronic device provided by an embodiment of the present invention have an imaging chip with a thicker light-shielding material (formed by a color filter set), which is based on the existing stacking method of color filters To improve the above technical problems, in addition to the light channel that can be used to produce the collimation effect, the thickness of the overall light-shielding material (formed by the color filter set) is also used to obtain a better aspect ratio of the light channel.

In order to make the above and other objectives, features and advantages of the present invention more obvious and understandable, detailed descriptions are made as follows with the accompanying drawings.

In order to fully understand the purpose, features and effects of the present invention, a detailed description of the present invention is given with the following specific embodiments and accompanying drawings. The description is as follows.

One of the embodiments of the present invention provides an imaging device that can be installed under a cover and used to obtain biometric images (for example, fingerprint images, vein images, blood oxygen images, palmprint images, pupil images, iris images, or blood glucose images) . Compared with the prior art imaging device, the imaging chip of the imaging device of the present invention has a thicker thickness, so it can avoid the technical problem that the imaging chip may be damaged during the assembly process of the imaging device and the cover. . In addition, the thickness of the color filter set of the imaging chip can be increased according to requirements to achieve a better aspect ratio of the light channel.

The imaging device of the embodiment of the present invention includes an imaging chip, wherein the imaging chip is formed on a substrate. The imaging chip includes a light-transmitting material, a plurality of color filter groups, an imaging chip body and a plurality of pixel sensors, wherein the light-transmitting material and the pixel sensors are arranged on the imaging chip body, and the The optical material covers the plurality of pixel sensors, and the plurality of color filter groups are arranged in the light-transmitting material in an array to form a plurality of light channels corresponding to the plurality of pixel sensors. Each color filter group includes a plurality of color filters stacked in the vertical direction, wherein each of the plurality of color filters can be selected from filters of red light, blue light, green light or other color light, And the present invention is not limited by this.

The arrangement of multiple color filters can increase the thickness of the imaging chip. For example, a single color filter is about 0.6 to 0.8 micrometers (μm). If the color filter set includes three color filters, the thickness of the imaging chip can be increased by 1.8 to 2.4 micrometers, thereby avoiding picking up during the assembly process. Technical problems like chip breakage. On the other hand, the pixel sensor of the imaging chip of the existing camera is correspondingly provided with a color filter set. Therefore, only a slight modification to the existing process is required to allow the light between two adjacent color filter sets The channel corresponds to the imaging area on the surface of the pixel sensor, which can realize the imaging chip of the imaging device of the present invention.

Compared with the traditional method of forming a collimation layer with multiple light channels by arranging multiple light-shielding materials in a light-transmitting material, it is necessary to precisely align the light channels of the collimating layer on the surface of the pixel sensor. However, the new type of imaging device does not need the above-mentioned alignment, so the manufacturing process can be simpler and the product yield can be increased. Furthermore, when an additional collimating layer is required to be provided on the imaging chip of the imaging device of the present invention, only the optical channel of the collimating layer is to be aligned with the optical channel on the imaging chip. The bit complexity is not more complicated than directly aligning the light channel of the collimation layer with the image capturing area on the surface of the pixel sensor.

Incidentally, an embodiment of the present invention also provides an electronic device, which includes the aforementioned image capturing device and a cover plate, wherein the cover plate is located on the image capturing device. The cover can be a display panel (for example, quantum dot, LCD, LED or OLED display panel), touch panel (for example, capacitive, resistive or ultrasonic touch panel), touch display panel (for example, On Cell or In Cell touch panel). Control display panel) or finger pressure plate (for example, acrylic plate, glass plate, polymethyl methacrylate (PMMA) plate or polycarbonate (PI) plate). In addition, the imaging device can be fixed to the middle frame of the cover (for example, by direct sticking, clamping or locking), or the imaging device can be set in an independent middle frame to support the elastic support Come to contact the lower surface of the cover and the upper surface of the wall of the middle frame to complete the assembly of the electronic device.

First of all, please refer to FIGS. 2 and 3. FIG. 2 is a schematic diagram of the stacked structure of the electronic device and its image capturing device according to the first embodiment of the present invention, and FIG. 3 is a schematic perspective plan view of the image capturing device of the first embodiment of the present invention . The electronic device 2 includes a cover 20 and an image capturing device 29, and the cover 20 is disposed on the image capturing device 29. The image capturing device 29 includes a filter plate 21, a collimating layer 22, an image capturing wafer 23, and a substrate 24. The image capturing wafer 23 is disposed on the substrate 24, the collimating layer 22 is disposed on the image capturing wafer 23, and a filter plate 21 is arranged on the collimation layer 22. When the user brings a part with biological characteristics (for example, fingers, wrists or eyes, not shown in the figure) close to the cover 20, the light source (for example, natural light, the light source of the display panel, or the light source provided by the image capturing device 29 ( The light of )) will be reflected to the filter plate 21 by the part with biological characteristics. The filter plate 21 is used to filter out light in a specific wavelength range. Then, the collimating layer 22 receives the light passing through the filter plate 21 and provides a light channel to allow the light to pass through collimatedly without crosstalk of light. After that, the image capturing chip 23 is used to sense the light passing through the collimating layer 22 and thereby generate a biometric image.

The collimation layer 22 includes a micro-structure lens 221, a light-transmitting material 223 and a plurality of light-shielding materials 222. The light-transmitting material 223 has high light-transmitting properties, for example, the light transmittance is greater than 80%, and a plurality of microstructure lenses 221 are formed on the top surface thereof. A plurality of light-shielding materials 222 are arranged in the light-transmitting material 223 in an array to serve as a black matrix, thereby shielding light. A light channel is formed between two adjacent light shielding materials 222. The plurality of microstructure lenses 221 are used to focus the light passing through the filter plate 21 to pass through corresponding multiple light channels, so that the light passing through the filter plate 21 can pass through the collimating layer 22 collimatedly.

The imaging chip 23 includes a plurality of color filter groups (each composed of three color filters 231 to 233), a light-transmitting material 234, a plurality of pixel sensors 235, and an imaging chip body 236. A plurality of pixel sensors 235 are formed on the upper surface of the imaging chip body 236, and the imaging chip body 236 also has other circuits or chips disposed therein, such as filter circuits, amplifiers, and/or microcontroller circuits. The light-transmitting material 234 covers the upper surface of the imaging chip body 236 and the imaging area of the surface of the plurality of pixel sensors 235. A plurality of color filter groups are arranged in an array on the transparent material 234 to form a plurality of light channels OP. Each optical channel OP corresponds to one pixel sensor 235, one optical channel of the collimating layer 22, and one micro-structure lens 221. The color filter set composed of three color filters 231 to 233 will have the effect of blocking light, so the light can only pass through the optical channel OP and be received by the image capturing area on the surface of the pixel sensor 235 and converted into The corresponding electrical signal. Then, the electrical signals of the plurality of pixel sensors 235 can form a biometric image.

In this embodiment, the three color filters 231 to 233 are filters for red light, blue light, and green light, respectively, and the stacking order is not limited thereto. On the other hand, the three color filters 231 to 233 can also be two red light and one blue light filters, and the stacking order is not limited by this, but correspondingly, the filter plate 21 needs to filter out green The filtering effect of the wavelength of light or the pixel sensor 235 is designed to be unable to receive light of the green wavelength. In addition, the number of the color filters 231 to 233 of the color filter set may not be three, as long as there are more than one. For example, each color filter group can be composed of one red light and one green light filter, or two green light filters. It should be noted that, in any embodiment of the present invention, the filter plate 21 may be additionally provided on the upper surface of the pixel sensor 235, or (also formed on) the bottom of the color filter 233. In any feasible solution of the present invention, the number and position of the filter plates 21 are not limited.

Since the imaging chip 23 in the imaging device 29 uses a plurality of color filter groups formed by a plurality of color filters 231 to 233 to replace the light shielding material of the black matrix, and the color filters 231 to 233 are the imaging chips A part of 23 is formed during the manufacturing process of the imaging chip 23. Therefore, the alignment between the optical channel OP and the imaging area on the surface of the pixel sensor 235 is easier. On the other hand, the thickness of the multiple color filters 231 to 233 can increase the total thickness of the imaging chip 23. Therefore, during the assembly process of the electronic device 2, the imaging chip 23 is less likely to be damaged. Furthermore, although the optical channel of the collimating layer 22 still needs to be aligned with the optical channel OP in this embodiment, it is compared with the conventional method of aligning the optical channel of the collimating layer with the imaging area on the surface of the pixel sensor. In practice, the alignment complexity has been reduced a lot. The reason is that the color filters 231 to 233 have colors, and the optical channel OP can be clearly defined (as shown in Figure 3) to facilitate the collimation layer 22 The optical channel needs to be aligned with the optical channel OP.

In the embodiment of the present invention, the cover 20 can be a display panel, a touch panel, a touch display panel, or a finger pressure pad as appropriate. The main material of the cover plate 20 is a rigid material or a flexible material with a visible light transmittance greater than 80%, and the present invention is not limited by the material and type of the cover plate 20. Furthermore, the filter plate 21 can be an infrared filter plate or a band pass or band rejection filter plate in a specific wavelength range depending on the application. The substrate 24 can be a multilayer or a single layer, flexible or inflexible, transparent or opaque, depending on the application. The material of the circuit board can be silicon, acrylic, glass, etc., and the type of the filter plate 21 and the substrate 24 is not limited in the present invention. In addition, the collimating layer 22 can not only realize multiple light channels by arranging the light-shielding material 222 on the light-transmitting material 221, but also can pass the arrangement of optical fibers, collimators, pinholes, patterned holes or gratings To realize the optical channel, in a word, the present invention is not limited by the type of the collimating layer 22.

Please refer to FIG. 4, which is a schematic diagram of the stacked structure of the electronic device and its image capturing device according to the second embodiment of the present invention. The second embodiment is different from the first embodiment in that the collimating layer 41 of the image capturing device 45 in the electronic device 4 has a multilayer structure. The collimation layer 41 includes a first sub-collimation layer 418 and a second sub-collimation layer 419. The first sub-collimation layer 418 includes a plurality of first microstructure lenses 411, a light-transmitting material 413 and a plurality of light-shielding materials 412, and The second sub-collimation layer 419 includes a plurality of second microstructure lenses 414, a light-transmitting material 416, and a plurality of light-shielding materials 416. The light-transmitting materials 413 and 415 have high light-transmitting properties, for example, the light transmittance is greater than 80%, and a plurality of first microstructure lenses 411 and second microstructure lenses 414 are respectively formed on the top surfaces thereof. A plurality of light-shielding materials 412 and 415 are arranged in an array in the light-transmitting materials 413 and 416, respectively, to serve as a black matrix, thereby shielding light. A light channel is formed between two adjacent light-shielding materials 412, and a light channel is formed between two adjacent light-shielding materials 415. The first sub-collimation layer 418 and the second sub-collimation layer 419 are The light channels correspond to each other. The imaging device 41 of the second embodiment can effectively enhance the collimation effect, so as to improve the quality of the biometric image.

Next, please refer to FIG. 5. FIG. 5 is a schematic diagram of a stacked structure of an electronic device and its image capturing device according to a third embodiment of the present invention. Compared with the first embodiment, the image capturing device 55 of the electronic device 5 of the third embodiment has two filter plates 21 and 51, and the position of the filter plate 21 of the third embodiment is the same as that of the first embodiment The position of 21 is the same, and the filter plate 51 is disposed between the collimating layer 22 and the imaging wafer 23. The advantage of providing two filter plates 21 and 51 in the third embodiment is that it can more effectively filter out light in a specific wavelength range. For example, in a strong light environment, ambient light has a greater impact on the image quality of the biometric image, so it passes through An additional filter plate 51 can be provided to effectively solve the technical problem that has a greater impact on the image quality of the biometric image in a strong light environment.

After that, please refer to FIG. 6, which is a schematic diagram of the stacked structure of the electronic device and the image capturing device according to the fourth embodiment of the present invention. Compared with the first embodiment, the image capturing device 65 of the electronic device 6 of the fourth embodiment does not have a collimation layer, but has a microstructure layer 61 formed on the image capturing wafer 23. Since the multiple optical channels OP formed by multiple color filter groups already have the effect of collimating light, in the fourth embodiment, no additional collimation layer is added, but the imaging chip 23 is provided with The microstructure layer 61 of a plurality of microstructure lenses 611, wherein the microstructure layer 61 itself is made of a light-transmitting material with high light transmittance. In this embodiment, although the microstructure lens 611 of the microstructure layer 61 still needs to be aligned with the optical channel OP, it is compared with the existing practice of aligning the optical channel of the collimating layer with the image capturing area on the surface of the pixel sensor. , The complexity of its alignment has been reduced a lot

Next, please refer to FIG. 7, which is a schematic diagram of the stacked structure of the electronic device and the image capturing device according to the fifth embodiment of the present invention. The image capturing device 75 of the electronic device 7 of the fifth embodiment does not have a collimation layer, and compared with the fourth embodiment, the image capturing device 75 of the fifth embodiment has two microstructure layers 71 and 72, with multiple The microstructure layer 72 of the microstructure lens 721 is arranged on the imaging wafer 23, and the microstructure layer 71 with a plurality of microstructure lenses 711 is arranged on the microstructure layer 72, wherein the microstructure layers 71 and 72 themselves are made of high Transparent material with light transmittance. In the fifth embodiment, two microstructure layers 71 and 72 with a plurality of microstructure lenses 711 and 721 are provided to make the light focusing effect better, thereby improving the image quality of the biometric image.

Please refer to FIG. 8, which is a schematic diagram of a stack structure of an electronic device and its image capturing device according to a sixth embodiment of the present invention. Compared with the first embodiment, the image capturing device 85 of the electronic device 8 of the sixth embodiment further includes a microstructure layer 81 between the collimating layer 22 and the image capturing chip 23. By additionally providing a microstructure layer 81 with a plurality of microstructure lenses 811, the light focusing effect can be better, thereby improving the image quality of the biometric image. Incidentally, the positions between the microstructure layer 81 and the collimation layer 22 can also be interchanged.

Then, please refer to FIG. 9, which is a schematic diagram of the stacked structure of the electronic device and the image capturing device of the seventh embodiment of the present invention. In the seventh embodiment, the imaging chip 92 of the imaging device 95 of the electronic device 9 is different from the imaging chip 23 of the first embodiment. The imaging chip 92 has a plurality of first color filter groups and a plurality of first color filter groups. Two color filter groups. The second color filter group is composed of color filters 923 and 924 and is located on the transparent material 925. The first color filter group is composed of color filters 921 and 922 and is located On the corresponding second color filter group. A plurality of first color filter groups and a plurality of second color filter groups are respectively arranged in a light-transmitting material 925 in different horizontal planes, and adjacent first color filter groups form a light channel CH1, and The adjacent second color filter group forms a light channel CH2. In the vertical direction, each pixel sensor 926 on the imaging chip body 927 corresponds to a set of optical channels CH1 and CH2. In addition, the microstructure layer 91 is disposed on the imaging wafer 92, and each of the plurality of microstructure lenses 911 corresponds to a set of pixel sensors 926 and light channels CH1 and CH2.

In order to make the image quality of the biometric image better, the area A1 of the light channel CH1, the area A2 of the light channel CH2, the sensing area As of the pixel sensor 926, and the projection area Am of the microstructure lens 911 need to be designed so that The relation of "A1≦A2>Am>As" is established, where the area A1 of the optical channel CH1 and the area A2 of the optical channel CH2 are respectively related to the ruler diameter W1 of the optical channel CH1 (according to its cross-sectional shape (for example, circular or Square, and not limited by this), may be diameter or width) and the ruler diameter W2 of the light channel CH2 (depending on its cross-sectional shape, may be diameter or width), the projection area Am of the microstructure lens 911 is related to the microstructure The rule diameter WM of the lens 911 (depending on its cross-sectional shape, may be diameter or width), and the sensing area As of the pixel sensor 926 are related to the rule diameter WS of the pixel sensor 926 (depending on its cross-sectional shape, it may be Is the diameter or width). Overall, compared with the prior art, the illuminance of the light obtained by the pixel sensor 926 is increased by about 10 times.

In addition, the thickness HC of the light channels CH1 and CH2 and the thickness H of the microstructure lens 911 also affect the image quality of the biometric image. Through experiments and simulations of optical software, when the relationship of "HC≦π((WM/2) ² +H ² )/2H" is established, the biometric image will have better image quality, and when "HC≦π When the relationship of ((WM/2) ² +H ² )/4H” is established, the image quality of the biometric image is better. Simply put, it is possible to obtain a biometric image with better image quality by designing the relationship between the thickness and/or area. Furthermore, in this embodiment, the imaging device 95 may not be provided with a collimating layer, so as to reduce the overall thickness of the imaging device 95.

Please refer to FIG. 10. FIG. 10 is a schematic diagram of a stacked structure of an electronic device and its image capturing device according to an eighth embodiment of the present invention. The electronic device A0 of the eighth embodiment only includes the image capturing device A05, and optionally does not include the cover plate. Simply put, for applications under special circumstances, the electronic device A0 may not be provided with a cover. Moreover, unlike the image capturing device 25 of the first embodiment, the image capturing device A05 of the eighth embodiment is not provided with a collimating layer, and the filter plate 21 is formed on the image capturing wafer 23. In addition, the filter plate 21 of the image capturing device A05 can be selectively removed, and the electronic device A0 may include a cover plate on the image capturing device A05.

Next, please refer to FIG. 11, which is a schematic diagram of the stacked structure of the image capturing device according to the ninth embodiment of the present invention. The imaging device A1 of the ninth embodiment includes a microstructure layer A11, a filter plate A12, an imaging chip A13, an encapsulation layer A14, and a substrate 24. The imaging chip A13 is disposed on the substrate 24 and has metal wires WR for electrical conductivity. Connect the electrical components on the imaging chip A13 and the substrate 24, the filter plate A12 is arranged on the imaging chip A13, the microstructure layer A11 is arranged on the filter plate A12, and the encapsulation layer A14 surrounds the imaging chip A13 and the filter plate A12 And the outer side of the microstructure layer A11, and cover the periphery of the substrate 24, part of the periphery of the imaging chip A13 and the metal wire WR.

Furthermore, the imaging chip A13 includes an imaging chip body A136, a pad A137, a plurality of pixel sensors A135, a light-transmitting material A134, and a plurality of color filter groups (each color filter group By three color filters A131 ~ A133). The pad A137 and the plurality of pixel sensors A135 are disposed on the imaging chip body A136, and two ends of the metal wire WR are respectively connected to the pad A137 and the wiring on the substrate 24. The light-transmitting material A134 is disposed on the main body A136 of the imaging chip and covers the plurality of pixel sensors A135. A plurality of color filter groups are arranged in an array in the light-transmitting material A134, and adjacent color filter groups form an optical channel OP corresponding to a pixel sensor A135. The microstructure layer A11 includes a plurality of microstructure lenses A111 formed on the surface thereof, and each microstructure lens A111 corresponds to an optical channel OP and a pixel sensor A135. The microstructure layer A11 also includes a periphery of the peripheral protrusion structure A112 formed on the surface of the microstructure layer A11 and surrounds the microstructure lens A111.

The height of the peripheral protrusion structure A112 is greater than the height of each microstructure lens A111, and the height of the peripheral protrusion structure A112 is the same as the height of the encapsulation layer A14. Therefore, when the cover plate and the image capturing device A1 are joined, the peripheral protrusion structure A112 becomes In order to protect it, the cover plate will not touch the microstructure lens A111, causing damage to the microstructure lens A111. Please note here that in this embodiment, the peripheral protrusion structure A112 is a part of the microstructure layer A11 (that is, the microstructure lens A111 and the peripheral protrusion structure A112 are integrally formed), but in other embodiments, the peripheral protrusion structure A112 It can be a part of the encapsulation layer A14, and the present invention is not limited to this. In addition, the height of the encapsulation layer A14 can also be different from the height of the peripheral protrusion structure A112, but is higher or lower than the height of the peripheral protrusion structure A112, but preferably needs to be greater than the height of the microstructure lens A111. In addition, the peripheral protruding structure A112 in the embodiment may be a fence or other micro-structure lenses, and the present invention is not limited thereto.

After that, please refer to FIG. 12, which is a schematic diagram of the stacked structure of the electronic device and its image capturing device according to the tenth embodiment of the present invention. In the tenth embodiment, the image capturing device A25 of the electronic device A2 is similar to the image capturing device A1 of the ninth embodiment, except that the filter plate 21 is located between the image capturing device A25 and the cover 20 and may not belong to Part of the image capturing device A25. In addition, the electronic device A2 includes a cover 20 and a middle frame MF, and the middle frame MF of the electronic device A2 can be attached to the surface of the packaging layer A14. The electronic device A2 can be a smart phone, a tablet computer, a bank ATM or a work machine. The type of electronic device A2 is not used to limit the present invention.

Next, please refer to FIG. 13, which is a schematic diagram of a stacked structure of an electronic device and its image capturing device according to an eleventh embodiment of the present invention. Compared with the tenth embodiment, the middle frame MF' of the electronic device A3 of the eleventh embodiment is attached to the surface of the encapsulation layer A14 of the image capturing device A35 and part of the surface of the peripheral protrusion structure A112. Simply put, whether the inner edge of the middle frame MF' extends beyond the inner edge of the encapsulation layer A14 to the peripheral protrusion structure A112 is not intended to limit the present invention.

After that, please refer to FIG. 14, which is a schematic diagram of a stacked structure of an electronic device and its image capturing device according to a twelfth embodiment of the present invention. Compared with the eleventh embodiment, the electronic device A4 of the twelfth embodiment does not have a filter plate arranged between the microstructure layer A11 and the cover plate 20, but the image capturing device A45 has a filter plate arranged on the microstructure layer A11 and Take the filter plate A12 between the chips A13. Simply put, the positions of the filter plate A12 of the electronic device A4 in this embodiment and the filter plates of other embodiments are not intended to limit the present invention.

Next, please refer to FIG. 15. FIG. 15 is a schematic diagram of the stacked structure of the electronic device and the image capturing device according to the thirteenth embodiment of the present invention. Compared with the twelfth embodiment, the electronic device A5 of the thirteenth embodiment further includes a filter plate 21 disposed between the microstructure layer A11 and the cover 20, that is, the electronic device A5 is provided with two filter plates twenty one. Simply put, the number of the filter plates 21 and A12 of the electronic device A5 in this embodiment and the filter plates of other embodiments are not used to limit the present invention.

Please refer to FIG. 16, which is a schematic diagram of the stacked structure of the electronic device and its image capturing device according to the fourteenth embodiment of the present invention. Compared with the thirteenth embodiment, the image capturing device A65 of the electronic device A6 of the fourteenth embodiment does not have a microstructure layer, but has a collimation layer A11', and does not have the collimation layer A11' and the image capturing device. The filter plate between the wafer A13. The collimation layer A11' includes a light-transmitting material, a plurality of light-shielding materials A113 arrayed on the light-transmitting material, a plurality of micro-structure lenses A111 formed on the surface of the light-transmitting material, and peripheral protrusion structures A112. In this embodiment, the micro-structure lens A111 and the peripheral protrusion structure A112 are not integrally formed. The adjacent light-shielding materials A113 of this embodiment form a light channel to increase the collimation effect of the imaging device A65.

After that, please refer to FIG. 17, which is a schematic diagram of the stacked structure of the electronic device and the image capturing device according to the fifteenth embodiment of the present invention. Compared with the fourteenth embodiment, the electronic device of the electronic device A7 of the fifteenth embodiment does not include a filter plate, the collimation layer A11' does not have the peripheral protrusion structure A112, and the type of the middle frame BF is different, and its cross section is one Concave font. In addition, the image capturing device A75 of the electronic device A7 is substantially the same as the image capturing device of the fourteenth embodiment. It does not have an encapsulation layer but additionally has an elastic support BS arranged on the periphery of the upper surface of the substrate 24. The elastic support BS is in the shape of a straight bar and is used to support the cover plate 20. In any embodiment of the present invention, the elastic support BS (or BS' in FIG. 18) may be foam or foam rubber material And so on, the present model is not limited.

Next, please refer to FIG. 18. FIG. 18 is a schematic diagram of a stack structure of an electronic device and its image capturing device according to a sixteenth embodiment of the present invention. Compared with the sixteenth embodiment, the elastic support BS' of the image capturing device A85 of the electronic device A8 is designed in an inverted L-shaped column shape, that is, has a protruding part extending outward. When assembling the electronic device A8, the image capturing device A85 will be placed in the middle frame BF first, and the lower surface of the protruding part of the elastic support BS' will first contact the upper surface of the wall of the middle frame BF, and then Assemble with the cover plate 20 so that the upper surface of the protruding part of the elastic support BS′ will contact the periphery of the lower surface of the cover plate 20. Under different circumstances, the shape of the elastic support BS' may be different, and the present invention is not limited by the shape of the elastic support BS'.

Based on the above, the imaging chip used in the imaging device and its electronic device of the embodiment of the present invention is provided with a plurality of color filters as a plurality of light-shielding materials, and thereby forms a plurality of pixels located on a plurality of pixel sensors. Therefore, in addition to effectively increasing the thickness of the imaging chip to avoid the problem of chip damage caused by assembly, it can also reduce the complexity of alignment, making the manufacturing process of the entire imaging device easy to implement, and thereby improving the product Yield rate. In other words, the image capturing device and its electronic device of the embodiment of the present invention have a high market value, and can be effectively applied in the industry.

The present invention has been disclosed in preferred embodiments above, but those familiar with the art should understand that the above-mentioned embodiments are only used to describe the present invention and should not be interpreted as limiting the scope of the present invention. It should be noted that all changes and replacements equivalent to the foregoing embodiments should be included in the scope of the present invention.

1: Electronic device 10: Cover 11: Filter plate and substrate 12: Collimation layer 121: Microstructure lens 122, 124: shading material 123: Translucent material 14: Acquisition chip 141: Pixel Sensor 142: Capture the body of the chip 15: substrate 16: Capture device 2: electronic device 20: cover 29: Capture device 21: filter plate 22: collimation layer 221: Microstructure lens 222: Shading material 223: Transparent material 23: Acquisition chip 231～233: Color filter 234: Transparent material 235: pixel sensor 236: Take image chip body 24: substrate OP: Optical channel 4: Electronic device 45: Capture device 41: collimation layer 418: first sub-collimation layer 419: second sub-collimation layer 411, 414: Microstructure lens 412, 415: shading materials 413, 416: Transparent materials 5: Electronic device 55: Capture device 51: filter plate 6: Electronic device 65: Capture device 61: Microstructure layer 611: Microstructure lens 7: Electronic device 75: Capture device 71, 72: Microstructure layer 711, 721: Microstructure lens 8: Electronic device 85: Capture device 81: Microstructure layer 811: Microstructure lens 9: Electronic device 95: Capture device 91: Microstructure layer 911: Microstructure lens 92: Acquisition chip 921～924: Color filter 925: Transparent material 926: Pixel Sensor 927: Take the chip body CH1, CH2: optical channel W1, W2, WM, WS: ruler diameter H, HC: thickness A0: Electronic device A05: Capture device A1: Capture device A11: Microstructure layer A12: filter plate A13: Acquisition chip A14: Encapsulation layer WR: Metal wire A131～A133: Color filter A134: Transparent material A135: Pixel sensor A136: Capture the body of the chip A137: Pad A111: Microstructure lens A112: Peripheral protrusion structure A2: Electronic device A25: Capture device MF: Middle frame A3: Electronic device A35: Capture device MF’: Middle frame A4: Electronic device A45: Capture device A5, A6: electronic device A65: Capture device A11’: Collimation layer A113: Shading material A7: Electronic device BF: Middle frame A75: Capture device BS: Elastic support A8: Electronic device A85: Capture device BS’: Elastic support

Fig. 1 is a schematic diagram of a stacked structure of an electronic device using a conventional image capturing device.

2 is a schematic diagram of the stacked structure of the electronic device and its image capturing device according to the first embodiment of the present invention.

Fig. 3 is a schematic plan perspective view of the imaging device of the first embodiment of the present invention.

4 is a schematic diagram of a stack structure of an electronic device and its image capturing device according to a second embodiment of the present invention.

FIG. 5 is a schematic diagram of the stacked structure of the electronic device and its image capturing device according to the third embodiment of the present invention.

6 is a schematic diagram of a stacked structure of an electronic device and its image capturing device according to a fourth embodiment of the present invention.

FIG. 7 is a schematic diagram of a stacked structure of an electronic device and its image capturing device according to a fifth embodiment of the present invention.

FIG. 8 is a schematic diagram of a stacked structure of an electronic device and its image capturing device according to a sixth embodiment of the present invention.

9 is a schematic diagram of a stack structure of an electronic device and its image capturing device according to a seventh embodiment of the present invention.

FIG. 10 is a schematic diagram of a stacked structure of an electronic device and its image capturing device according to an eighth embodiment of the present invention.

11 is a schematic diagram of the stacked structure of the image capturing device according to the ninth embodiment of the present invention.

FIG. 12 is a schematic diagram of the stacked structure of the electronic device and its image capturing device according to the tenth embodiment of the present invention.

FIG. 13 is a schematic diagram of a stacked structure of an electronic device and its image capturing device according to an eleventh embodiment of the present invention.

14 is a schematic diagram of the stacked structure of the electronic device and its image capturing device in the twelfth embodiment of the present invention.

15 is a schematic diagram of a stacked structure of an electronic device and its image capturing device according to a thirteenth embodiment of the present invention.

16 is a schematic diagram of the stacked structure of the electronic device and its image capturing device according to the fourteenth embodiment of the present invention.

FIG. 17 is a schematic diagram of a stacked structure of an electronic device and its image capturing device according to a fifteenth embodiment of the present invention.

18 is a schematic diagram of the stacked structure of the electronic device and its image capturing device according to the sixteenth embodiment of the present invention.

2: electronic device

20: cover

29: Capture device

21: filter plate

22: collimation layer

221: Microstructure lens

222: Shading material

223: Transparent material

23: Acquisition chip

231~233: Color filter

234: Transparent material

235: pixel sensor

236: Take image chip body

24: substrate

OP: Optical channel

Claims (20)

An image capturing device, including: An imaging chip, including: One takes the chip body; A plurality of pixel sensors are formed on the body of the imaging chip; A first light-transmitting material formed on the body of the imaging chip and covering the plurality of pixel sensors; and A plurality of first color filter groups are arranged in an array in the first light-transmitting material, the two adjacent first color filter groups form a first light channel, and each of the first color filter groups One light channel corresponds to one of the plurality of pixel sensors, wherein each of the first color filter groups is composed of a plurality of first color filters. The imaging device according to claim 1, wherein the plurality of first color filters of each of the first color filter groups are selected from filters of a red light, a green light and a blue light The light sheet, the plurality of first color filters are completely identical, partially identical or completely different. The imaging device according to claim 1, wherein the shape of the cross section of the plurality of first light channels is a circle or a square. The imaging device as described in item 1 of the request, further including: At least one collimation layer is disposed on the imaging wafer, and includes a plurality of microstructure lenses, a second light-transmitting material, and a plurality of light-shielding materials, wherein the microstructure lens is formed on the second light-transmitting material On the surface of the material, the plurality of light-shielding materials are arranged in the second light-transmitting material in an array, and a plurality of second light channels are formed, and the plurality of second light channels correspond to the plurality of first light channels A light channel and the plurality of pixel sensors. The imaging device as described in item 1 of the request, further including: At least one microstructure layer is arranged on the imaging wafer, and a plurality of microstructure lenses are formed on the surface of the microstructure layer. The imaging device as described in item 1 of the request, further including: At least one microstructure layer is disposed on the imaging wafer, and has a plurality of microstructure lenses formed on the surface of the microstructure layer; and At least one collimation layer is disposed on the imaging wafer, and includes a plurality of microstructure lenses, a second light-transmitting material, and a plurality of light-shielding materials, wherein the microstructure lens is formed on the second light-transmitting material On the surface of the material, the plurality of light-shielding materials are arranged in an array in the second light-transmitting material, and a plurality of second light channels are formed, and the plurality of second light channels correspond to the plurality of first light channels. An optical channel and the plurality of pixel sensors; Wherein the microstructure layer is located above or below the collimation layer. The imaging device as described in one of items 1 to 6 of the request, further including: At least one filter plate is arranged on the imaging chip. The imaging device according to claim 5, wherein the imaging chip further includes a plurality of second color filter groups located under the plurality of first color filter groups, and the plurality of first color filter groups Two color filter groups are arranged in an array in the first light-transmitting material, the two adjacent second color filter groups form a second light channel, and each of the second light channels corresponds to In one of the plurality of pixel sensors and one of the plurality of first light channels, each of the second color filter groups is composed of a plurality of second color filters. The imaging device according to claim 8, wherein the area of the first light channel is less than or equal to the area of the corresponding second light channel, and the area of the second light channel is smaller than the corresponding microstructure The projection area of the lens and the projection area of the microstructure lens are smaller than the sensing area of the corresponding pixel sensor. The imaging device according to claim 8 or 9, wherein the thickness HC of the first and second optical channels, the thickness H and the rule diameter WM of the microstructure lens satisfy the following relationship: HC≦π(( WM/2) ² +H ² )/2H. The imaging device according to claim 8 or 9, wherein the thickness HC of the first and second optical channels, the thickness H and the rule diameter WM of the microstructure lens satisfy the following relationship: HC≦π(( WM/2) ² +H ² )/4H. The imaging device according to claim 1, wherein the imaging chip further includes a plurality of second color filter groups located under the plurality of first color filter groups, and the plurality of first color filter groups Two color filter groups are arranged in an array in the first light-transmitting material, the two adjacent second color filter groups form a second light channel, and each of the second light channels corresponds to In one of the plurality of pixel sensors and one of the plurality of first light channels, each of the second color filter groups is composed of a plurality of second color filters. The imaging device according to one of claims 4 to 6, wherein the imaging device further comprises a peripheral protrusion structure formed on the collimation layer or the microstructure layer The surface is peripheral and surrounds the plurality of microstructure lenses, wherein the height of the peripheral protrusion structure is greater than the height of the plurality of microstructure lenses. The imaging device according to claim 13, wherein the peripheral protrusion structure is a wall or another microstructure lens. The imaging device as described in item 13 of the request, further including: An encapsulation layer is formed around the imaging chip and the alignment layer or the microstructure layer. The imaging device according to claim 15, wherein the peripheral protrusion structure is a part of the collimation layer, the microstructure layer or the encapsulation layer. The imaging device according to claim 13, further comprising a substrate and at least one elastic support, wherein the imaging chip is disposed on the substrate, and the elastic support is disposed on the substrate On the periphery of the surface. The imaging device according to claim 17, wherein the elastic support member is in the shape of a straight column or an inverted L-shaped column. An electronic device, including; The imaging device described in any one of claims 1 to 18; and A cover plate, wherein the image capturing device is arranged under the cover plate. The electronic device described in item 19 of the claim, including; A middle frame is used to combine with the image capturing device, and the image capturing device is combined with the cover through the middle frame to form the electronic device.

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