TW202137390A - Factory interface system for semiconductor process tool - Google Patents

Abstract

An interface system for semiconductor process tool includes a container, a load port, a robot arm, a gas blowing system, and a gas adjusting element. The container has a shell body having a door opening. The load port is disposed outside the container and adjacent to the door opening of the shell body. The robot arm is disposed in the container. The gas blowing system is disposed in the container for creating gas flow. The gas adjusting element is disposed in the container and between the door opening and the gas blowing system. The gas adjusting element has openings allowing a portion of the gas flow to pass through. A ratio of the area of the openings of the gas adjusting element over a surface of the gas adjusting element is gradually reduced as approaching the door opening of the shell body.

Description

Device interface system for semiconductor process tools

This disclosure is about a device interface system used in a semiconductor process tool.

As integrated circuit technology continues to evolve, integrated circuit devices continue to shrink, thereby achieving low manufacturing costs, high device integration density, high speed, and high performance. With the advantages brought about by the shrinkage of integrated circuits, the tools and equipment for manufacturing integrated circuits have also evolved. The semiconductor integrated circuit is made through multiple processing procedures in the integrated circuit manufacturing plant. These processes involve related manufacturing tools including thermal oxidation, doping, ion implantation, rapid thermal processes, chemical vapor deposition, physical vapor deposition, epitaxy, etching, and optical etching technologies. During the manufacturing process, the wafers stored in the wafer transfer box can be transferred to each manufacturing tool through an appropriate equipment interface system.

Some embodiments of the present disclosure provide a device interface system for a semiconductor process tool, which includes a container, a loading port, a robotic arm, an air blowing system, and an air flow adjustment component. The container has a shell, wherein the shell has a door opening. The loading port is arranged outside the container and adjacent to the door of the shell. The robotic arm is set in the container. The blowing system is used to generate airflow in the container. The air flow adjustment element is arranged in the container and is located between the door and the air blowing system. The air flow adjustment element has a plurality of openings for the passage of part of the air flow. The opening of the air flow adjustment element accounts for the proportion of the area on the surface of the air flow adjustment element As it approaches the doorway of the housing, it gradually lowers.

Some embodiments of the present disclosure provide a device interface system for a semiconductor process tool, which includes a container, a loading port, a robotic arm, an air blowing system, and an air flow adjustment component. The container has a shell, wherein the shell has a door opening. The loading port is arranged outside the container and adjacent to the door of the shell. The robotic arm is set in the container. The blowing system is used to generate airflow in the container. The air flow adjusting element is arranged in the container and located between the door and the air blowing system. The air flow adjusting element has a plurality of openings for passing part of the air flow. The air flow adjusting element extends along the first direction, and the air flow adjusting element extends along the first direction. Two directions are adjacent to a part of the casing located above the door opening, wherein the second direction is perpendicular to the first direction, and the length of the air flow adjustment element in the first direction is greater than the width of the air flow adjustment element in the second direction.

Some embodiments of the present disclosure provide a device interface system for a semiconductor process tool, which includes a container, a loading port, a robotic arm, an air blowing system, and an air flow adjustment component. The container has a shell, wherein the shell has a door opening. The loading port is arranged outside the container and adjacent to the door of the shell. The robotic arm is set in the container. The blowing system is used to generate airflow in the container. The air flow adjustment element is arranged in the container and is located between the door and the air blowing system, wherein the air flow adjustment element has a plurality of slits for passing part of the air flow.

The following disclosure will provide many different implementations or examples to realize the different features of the provided patent objects. Many components and arrangements will be described below with specific embodiments to simplify the disclosure. Of course, these embodiments are only used as examples and should not be used to limit the disclosure. For example, the narrative that "the first feature is formed on the second feature" includes a variety of implementations, including that the first feature is in direct contact with the second feature, and that additional features are formed between the first feature and the second feature. The two are not in direct contact. In addition, in various embodiments, the present disclosure may repeat labels and/or letters. This repetition is for simplification and clear description, and is not intended to show the relationship between the various implementations and/or configurations discussed.

What's more, spatially relative words, such as "lower", "below", "below", "below", "upper", "above" and other related words are used here to simply describe elements or features The relationship with another element or feature is shown in the figure. In use or operation, in addition to the steering shown in the figure, these spatially relative words cover the different steering of the device. Alternatively, these devices can be rotated (rotated by 90 degrees or other angles), and the spatially relative descriptors used here can be interpreted accordingly.

FIG. 1 is a schematic diagram of the configuration of a semiconductor processing tool 100 according to some embodiments of the present disclosure. The semiconductor processing tool 100 may be a cluster tool, including a factory interface (FI) system 200, a load-lock chamber 700, a buffer chamber 800, and process reaction chambers 910-940.

The equipment interface system 200 may be, for example, an equipment front-end module (EFEM). The device interface system 200 includes a load port 220 and an airtight container 210. The loading port 220 is used to carry the wafer transfer box WP. The wafer transfer box WP can load multiple wafers and be transported by a suitable automated handling system, such as an overhead hoist transfer (OHT).

The airtight container 210 of the equipment interface system 200 interfaces with the load lock chamber 700. The load lock chamber 700 includes a wafer entry chamber 710 and a wafer delivery chamber 720. The airtight container 210 of the equipment interface system 200 may be provided with a robotic arm 230 (refer to FIG. 2A) to take out the wafers from the wafer transfer box WP carried by the load port 220 and transfer the wafers to the load lock chamber 700. In the chamber 710, the wafer may be taken out from the wafer delivery chamber 720 of the load lock chamber 700 and transferred to the wafer transfer box WP carried by the load port 220.

The load lock chamber 700 generates the same air pressure environment as the buffer chamber 800 or the airtight container 210 of the equipment interface system 200 according to the position where the wafer is to be transferred. The air pressure environment in the load lock chamber 700 can be adjusted by appropriate means, such as a pump, to change the gas content in the load lock chamber 700 by adding gas or creating a vacuum. When the atmospheric pressure in the load lock chamber 700 reaches the desired pressure, the wafer channel between the load lock chamber 700 and the buffer chamber 800 or the airtight container 210 of the equipment interface system 200 can be opened, and the wafer can be transferred from the load lock chamber 700 is grabbed and transferred to the buffer chamber 800 or the airtight container 210 of the equipment interface system 200 via the wafer channel.

The buffer chamber 800 is also called a transfer chamber (Transfer Chamber). The buffer chamber 800 is connected to the load lock chamber 700 and the reaction chambers 910 to 940. The buffer chamber 800 may be provided with a robotic arm 810 to transfer wafers between the load lock chamber 700 and the reaction chambers 910-940.

In some embodiments, the reaction chambers 910 to 940 can be used for chemical vapor deposition, such as high density plasma (HDP) process, atomic layer deposition, sputtering, etching, cleaning and other steps, in which chemical vapor deposition The deposition can be low pressure chemical vapor deposition, plasma chemical vapor deposition, or other appropriate processes. The number of reaction chambers 910 to 940 is for illustration only, and should not be limited to this number.

The silicon wafers in the wafer transfer box WP can be placed in the wafer entry chamber 710 through the device interface system 200, and then enter the buffer chamber 800 from the wafer entry chamber 710, and then the robotic arm 810 in the buffer chamber 800 transfers the wafers To each process reaction chamber 910~940.

2A to 2B are schematic cross-sectional views of the semiconductor process tool 100 in each operation stage according to some embodiments of the present disclosure. In some embodiments, the sealed container 210 of the device interface system 200 includes a sealed space 210S, which is surrounded by a housing 212. The housing 212 may be composed of a material with appropriate rigidity, such as stainless steel. The housing 212 may have a door 212A to connect to the wafer transfer box WP. The housing 212 may have a door opening 212B to connect to the load lock chamber 700.

The airtight container 210 may further include movable door covers 214 and 216 respectively located on the two side walls of the housing 212 and used to cover the door openings 212A and 212B of the housing 212 entering and exiting the sealed space 210S. The loading port 220 may be disposed outside the sealed space 210S and located on or adjacent to the outer side surface of the airtight container 210, wherein the loading port 220 may be adjacent to the movable door cover 214 (or the door opening 212A). The movable door cover 214 can be operated to open or close the door opening 212A, thereby communicating or separating the space WPS in the wafer transfer box WP and the sealed space 210S. Similarly, the movable door cover 216 can be operated to open or close the door opening 212B, thereby communicating or separating the sealed space 210S and the space in the load lock chamber 700.

In some embodiments, the robotic arm 230 may be installed in the airtight container 210. Through the operation of the robotic arm 230, the wafer W can be transferred between the wafer transfer box WP and the load lock chamber 700 through the door openings 212A and 210B.

In some embodiments, the device interface system 200 may further include an air blowing system 240, an air flow adjusting element 250, an air pressure detector 260, an air filter element 270, and a controller 290. The air blowing system 240, the air flow adjusting element 250, the air pressure detector 260, and the air filter element 270 may be disposed in the airtight container 210. The air blowing system 240 may be arranged above the sealed space 210S to blow air from top to bottom, thereby generating air flow. The blowing system 240 may be, for example, a fan filter unit (FFU). In some embodiments, a gas dispersing plate GP may be provided under the blowing system 240, which has a plurality of vent holes GPO to disperse the gas. The gas dispersion plate GP may be supported by the housing 212. In some embodiments, the gas dispersion plate G may be omitted. The gas filter element 270 can be arranged under the blowing system 240, or even under the gas dispersion plate GP, to filter dust particles in the gas. In some embodiments, the gas filter element 270 may be omitted. The air pressure detector 260 may be disposed under the air blowing system 240 to detect the air pressure in the sealed space 210S.

In some embodiments, a bottom plate BP may be provided under the blowing system 240, which is connected to the housing 212 and can support other elements in the airtight container 210 (for example, the robot arm 230 in FIG. 2A). In some embodiments, the bottom plate BP has a plurality of vent holes BPO, so that the air flow provided by the blowing system 240 can pass through the gas dispersion plate GP and the bottom plate BP successively and leave the sealed space 210S.

There may be dust particles in the device interface system 200. In some embodiments, a sealing element is provided between the housing 212 and the movable door cover 214 to seal the connection between the two. The sealing element is disposed on one of the housing 212, the movable door cover 214, or both. The sealing element can be, for example, a rubber strip, an O-ring, a gel, or other devices suitable for sealing the airtight container 210. In some cases, the dust particles in the device interface system 200 may come from these sealing elements.

The air blowing system 240 in the device interface system 200 continuously generates a steady air flow from top to bottom to prevent dust particles from rising. In some cases, after opening the movable door cover 214 and the front cover WPF of the wafer transfer box WP, when preparing to take out the silicon wafers from the wafer transfer box WP, the air blowing system in the equipment interface system 200 downwards The blown gas may circulate into the space WPS of the wafer transfer box WP, and transfer upward in the space WPS, and a nearly closed air flow loop is formed in the space WPS of the wafer transfer box WP. At this time, the dust particles of the device interface system 200 may be transferred to the slave space WPS through the airflow, and the space WPS repeats the flow (referred to as reflow in this text) due to the circulation of the airflow, so that the wafer transfer box WP The wafer is contaminated by dust particles.

In many embodiments of the present disclosure, by providing the air flow adjusting element 250, the air flow velocity of the device interface system 200 adjacent to the wafer transfer box WP is reduced. Thereby, when the front cover WPF of the wafer transfer box WP is opened to prepare to take out the silicon wafers therefrom, the gas blown downward by the air blowing system in the equipment interface system 200 will not circulate into the space of the wafer transfer box WP. In WPS, it can avoid forming a closed air flow loop in the space WPS. Thereby, it is possible to prevent the wafer W of the wafer transfer cassette WP from being contaminated by dust particles due to reflow in the space WPS of the wafer transfer cassette WP. Here, the movable door cover 214 can clamp the front cover WPF of the wafer transfer box WP, and the wafer transfer box WP is opened when the door 212A is opened.

In detail, the air flow adjusting element 250 can be disposed under the blowing system 240, the gas dispersion plate GP and the gas filter element 270, above the door opening 212A of the housing 212 and adjacent to the door opening 212A of the housing 212. The airflow adjusting element 250 extends along the direction D1 (the direction of the paper in and out of the paper in FIGS. 2A and 2B), and the airflow adjusting element 250 can be adjacent to a part of the housing 212 above the door 212A in the direction D2. The air flow adjusting element 250 may have a plurality of openings (for example, the openings O1 to O6 in FIGS. 3A to 3C) for gas to pass through. The opening of the air flow adjusting element 250 accounts for the area on the surface of the air flow adjusting element 250 as it approaches the door. 212A is gradually reduced to adjust the airflow distribution adjacent to the door 212A.

2A, in some embodiments, the wafer transfer box WP is placed on the loading port 220. Before opening the movable door cover 214, the strength of the blowing system 240 can be adjusted according to the gas pressure state of the sealed space 210S detected by the air pressure detector 260 so that the gas pressure state reaches a predetermined state. At this time, the airflow passes through the airflow adjusting element 250 and there is a slower airflow distribution at the door opening 212A.

2B, after the gas pressure state reaches a predetermined state, the door opening 212A can be opened through the movable door cover 214. At this time, the air flow distribution through the air flow adjusting element 250 can avoid the generation in the space WPS of the wafer transfer box WP. Reflow, so as to prevent dust particles from causing wafer defects due to reflow. In addition, the air flow adjustment element 250 can also maintain a stable flow field in the sealed space 210S of the device interface system 200. After that, wafer handling and other operations can be performed.

FIG. 3A is a three-dimensional schematic diagram of an air flow adjusting element 250 according to some embodiments of the present disclosure. FIG. 3B is a schematic top view of the air flow adjusting element 250 of FIG. 3A. FIG. 3C is a schematic side view of the air flow adjusting element 250 of FIG. 3A. In this embodiment, the air flow adjusting element 250 has solid parts 251 to 257 extending parallel to the direction D1, and the openings O1 to O6 of the air adjusting element 250 may be elongated and extend parallel to the direction D1.

In this embodiment, the centers of gravity (or centers) of the physical parts 251 to 257 are equally spaced along the direction D2, and the widths of the physical parts 251 to 257 gradually increase as they approach the door 212A (refer to FIG. 2A), so that the opening The sizes of O1 to O6 gradually decrease as they approach the door opening 212A (refer to FIG. 2A), so that the area ratio of the openings O1 to O6 on the surface of the air flow adjusting element 250 gradually decreases as they approach the door opening 212A (refer to FIG. 2A). In this context, the area ratio of the opening can be regarded as the area of the opening on the upper surface of the airflow adjusting element 250 divided by the entirety of the upper surface of the airflow adjusting element 250 (that is, the sum of the solid parts 251 to 257 and the openings O1 to O6). area. For example, here, the openings O1 to O6 are slits, and the widths of these slits (ie, the openings O1 to O6) gradually decrease as they approach the door opening 212A (refer to FIG. 2A).

In this embodiment, the airflow adjusting element 250 further has a solid part 258 to connect the two ends of each of the physical parts 251 to 257, so that the airflow adjusting element 250 can maintain a stable structure. The physical parts 251 to 258 of the air flow adjusting element 250 may be formed of a suitable plastic material, such as Teflon. Alternatively, the physical parts 251 to 258 of the air flow adjusting element 250 may be composed of other materials with appropriate rigidity.

In some embodiments of the present disclosure, the length 250L of the airflow adjusting element 250 in the direction D1 is greater than the width 250W of the airflow adjusting element 250 in the direction D2. For example, the length 250L of the air flow adjusting element 250 in the direction D1 may be in the range of about 175 cm to about 195 cm. If it exceeds this range, the structure may interfere with other devices (such as another doorway); if it is less than this range, it may not be able to effectively reduce the airflow velocity near the doorway. The width 250W of the air flow adjusting element 250 in the direction D2 may be in the range of about 50 cm to about 70 cm. If it exceeds this range, the structure may interfere with other devices; if it is less than this range, it may not be able to effectively reduce the airflow velocity near the door. In some embodiments, the direction D2 is perpendicular to the direction D1. The height 250H of the air flow adjusting element 250 may be in the range of about 35 cm to about 45 cm. If it exceeds this range, the structure may interfere with other devices; if it is less than this range, there may be insufficient structural rigidity, resulting in unstable airflow.

FIG. 4 is a three-dimensional schematic diagram of a device interface system 200 according to some embodiments of the present disclosure. The length 250L of the air flow adjustment element 250 in the direction D1 can be designed to be greater than the length 212AW of the door opening 212A of the housing 212 in the direction D1 to effectively avoid backflow in the wafer transfer box WP. For example, the length 250L of the airflow adjusting element 250 may be greater than the length 212AW of the door opening 212A by about 2 cm to about 10 cm. If the length 250L of the airflow adjusting element 250 is greater than the length 212AW of the doorway 212A, and the difference between the length 250L and the length 212AW is greater than about 10 cm, the airflow adjusting element 250 may structurally interfere with other devices (such as another doorway). If the length 250L of the airflow adjusting element 250 is less than the length 212AW of the doorway 212A, and the difference between the length 250L and the length 212AW is greater than about 2 cm, the airflow adjusting element 250 may not be able to effectively reduce the airflow velocity near the doorway. In some embodiments, the length of the slits of the air flow adjustment element 250 (ie, the openings O1 to O6 in FIGS. 3A to 3C) in the direction D1 may be greater than the length 212AW of the doorway 212A in the direction D1 to establish a uniform The airflow distribution. In some embodiments, the width 250W of the air flow adjusting element 250 in the direction D2 can be designed to be smaller than the length 212AW of the door opening 212A, so as not to occupy too much space.

FIG. 5 is a schematic top view of an air flow adjusting element 250 according to some embodiments of the present disclosure. This embodiment is similar to the embodiments of FIGS. 3A to 3C, with the difference that: in this embodiment, the air flow adjusting element 250 has a plurality of physical parts 251'-255' with the same width. In this embodiment, the distance between the centers of gravity (or centers) of the physical parts 251'~255' gradually decreases along the direction D2 as they approach the door, so that the size of the opening O1'~O4' (herein referred to as the width) increases with The area closer to the door 212A (refer to FIGS. 2A and 4) gradually decreases, so that the area ratio of the openings O1' to O4' gradually decreases as it approaches the door 212A (refer to FIGS. 2A and 4). The other details of this embodiment are roughly as described above, and will not be repeated here.

FIG. 6 is a schematic top view of an air flow adjusting element 250 according to some embodiments of the present disclosure. This embodiment is similar to the embodiments of FIGS. 3A to 3C, except that: in this embodiment, the air flow adjusting element 250 has a solid part 259 and a plurality of openings 250O thereon. Here, the openings 250O can be distributed regularly or randomly in a two-dimensional direction, and are different from the aforementioned slits (the aforementioned openings O1 to O6 in FIGS. 3A to 3C or the openings O1' to O4' in FIG. 5). The slits are only distributed in a one-dimensional direction (for example, direction D2). For example, here, the opening 250O is a round hole. In other embodiments, the opening 250O may be a square hole, a hexagonal hole, etc., and is not limited to what is depicted in the figure.

In this embodiment, the size of the opening 250O is the same, and the distribution density of the opening 250O gradually decreases as it approaches the door opening 212A (refer to FIGS. 2A and 4). The distribution density referred to here can be regarded as the number of openings 250O per unit area of the air flow adjusting element 250 (that is, the sum of the solid part 259 and the openings 250O). As a result, the area ratio of the opening 250O gradually decreases as it approaches the door opening 212A (refer to FIGS. 2A and 4), and the gas flow rate near the door opening 212A (refer to FIGS. 2A and 4) can be reduced. The other details of this embodiment are roughly as described above, and will not be repeated here.

FIG. 7 is a schematic top view of an air flow adjusting element 250 according to some embodiments of the present disclosure. This embodiment is similar to the embodiment of FIG. 6 with the difference that: in this embodiment, the distribution density of the openings 250O of the airflow adjusting element 250 is the same, and the size of the openings 250O (herein referred to as the diameter) approaches the doorway 212A (refer to FIG. 2A). As shown in Figure 4) gradually becomes smaller. As a result, the area ratio of the opening 250O gradually decreases as it approaches the door opening 212A (refer to FIGS. 2A and 4), and the gas flow rate near the door opening 212A (refer to FIGS. 2A and 4) can be reduced. The opening 250O may be a round hole, a square hole, a hexagonal hole, etc., and is not limited to what is depicted in the figure. The other details of this embodiment are roughly as described above, and will not be repeated here.

In a number of embodiments of the present disclosure, by providing an air flow adjusting element, the air flow velocity of the equipment interface system adjacent to the wafer transfer box is reduced. As a result, when the wafer transfer box is opened to prepare to take out the silicon wafers, the gas blown down by the blowing system in the equipment interface system will not circulate into the space of the wafer transfer box, and can avoid A closed air flow loop is formed in the space of the wafer transfer box. In this way, it is possible to prevent the wafers of the wafer transfer box from being contaminated by dust particles due to reflow in the space of the wafer transfer box.

Some embodiments of the present disclosure provide a device interface system for a semiconductor process tool, which includes a container, a loading port, a robotic arm, an air blowing system, and an air flow adjustment component. The container has a shell, wherein the shell has a door opening. The loading port is arranged outside the container and adjacent to the door of the shell. The robotic arm is set in the container. The blowing system is used to generate airflow in the container. The air flow adjustment element is arranged in the container and is located between the door and the air blowing system. The air flow adjustment element has a plurality of openings for the passage of part of the air flow. The opening of the air flow adjustment element accounts for the proportion of the area on the surface of the air flow adjustment element As it approaches the doorway of the housing, it gradually lowers.

In some embodiments, the air flow adjusting element is adjacent to the part of the housing located above the doorway.

In some embodiments, the size of the opening of the air flow adjusting element gradually decreases as it approaches the doorway of the housing.

In some embodiments, the distribution density of the openings of the airflow adjusting element gradually decreases as it approaches the doorway of the housing.

Some embodiments of the present disclosure provide a device interface system for a semiconductor process tool, which includes a container, a loading port, a robotic arm, an air blowing system, and an air flow adjustment component. The container has a shell, wherein the shell has a door opening. The loading port is arranged outside the container and adjacent to the door of the shell. The robotic arm is set in the container. The blowing system is used to generate airflow in the container. The air flow adjusting element is arranged in the container and located between the door and the air blowing system. The air flow adjusting element has a plurality of openings for passing part of the air flow. The air flow adjusting element extends along the first direction, and the air flow adjusting element extends along the first direction. Two directions are adjacent to a part of the casing located above the door opening, wherein the second direction is perpendicular to the first direction, and the length of the air flow adjustment element in the first direction is greater than the width of the air flow adjustment element in the second direction.

In some embodiments, the width of the air flow adjusting element in the second direction is smaller than the length of the door opening in the first direction.

In some embodiments, the length of the air flow adjusting element in the first direction is greater than the length of the doorway in the first direction.

Some embodiments of the present disclosure provide a device interface system for a semiconductor process tool, which includes a container, a loading port, a robotic arm, an air blowing system, and an air flow adjustment component. The container has a shell, wherein the shell has a door opening. The loading port is arranged outside the container and adjacent to the door of the shell. The robotic arm is set in the container. The blowing system is used to generate airflow in the container. The air flow adjustment element is arranged in the container and is located between the door and the air blowing system, wherein the air flow adjustment element has a plurality of slits for passing part of the air flow.

In some embodiments, the width of the slit gradually decreases as it approaches the doorway of the housing.

In some embodiments, the length of the slit in the direction is greater than the length of the doorway in the direction.

The features of the various embodiments are summarized above, and those with ordinary knowledge in the technical field can better understand the various aspects of the present disclosure. Those with ordinary knowledge in the technical field should understand that the present disclosure can be used as a basis for designing or modifying other programs or structures to implement the same purpose and/or achieve the same benefits mentioned in the embodiments. Those with ordinary knowledge in the technical field should also understand that these equivalent structures do not exceed the spirit and scope of this disclosure, and various changes, substitutions, and transformations can be made. Here, the spirit and scope of this disclosure cover these changes, substitutions, and transformations. .

100: Semiconductor process machine 200: Device Interface System 210: airtight container 210S: sealed space 212: Shell 212A, 212B: entrance 212AW: Length 214: Removable door cover 216: removable door cover 220: load port 230: robotic arm 240: Blowing system 250: Airflow adjustment element 250L: length 250W: width 250H: height 250O: opening 251~259: physical part 251’~255’: the physical part 260: Air pressure detector 270: Gas filter element 290: Controller 700: load lock room 710: Wafer entering chamber 720: Wafer delivery room 800: buffer room 810: Robot arm 910~940: reaction chamber WP: Wafer transfer box WPS: Space WPF: Front cover W: Wafer GP: Gas dispersion plate GPO: Vent BP: bottom plate BPO: vent O1~O6: opening O1’~O4’: Opening D1, D2: direction

FIG. 1 is a schematic diagram of the configuration of a semiconductor processing tool according to some embodiments of the present disclosure. 2A to 2B are schematic cross-sectional views of a semiconductor process tool in each operation stage according to some embodiments of the present disclosure. FIG. 3A is a three-dimensional schematic diagram of an air flow adjusting element according to some embodiments of the present disclosure. Fig. 3B is a schematic top view of the air flow adjusting element of Fig. 3A. Fig. 3C is a schematic side view of the air flow adjusting element of Fig. 3A. FIG. 4 is a three-dimensional schematic diagram of a device interface system according to some embodiments of the present disclosure. FIG. 5 is a schematic top view of an airflow adjusting element according to some embodiments of the present disclosure. Fig. 6 is a schematic top view of an air flow adjusting element according to some embodiments of the present disclosure. FIG. 7 is a schematic top view of an air flow adjusting element according to some embodiments of the present disclosure.

200: Device Interface System

210: airtight container

210S: sealed space

212: Shell

212A, 212B: doorway

214: Removable door cover

216: removable door cover

220: load port

230: robotic arm

240: Blowing system

250: Airflow adjustment element

260: Air pressure detector

270: Gas filter element

290: Controller

700: load lock room

800: buffer room

WP: Wafer transfer box

WPS: Space

WPF: Front cover

W: Wafer

GP: Gas dispersion plate

GPO: Vent

BP: bottom plate

BPO: vent

D1, D2: direction

Claims (10)

A device interface system for semiconductor process tools, including: A container having a shell, wherein the shell has a door; A loading port arranged outside the container and adjacent to the doorway of the casing; A robotic arm is set in the container; An air blowing system for generating an air flow in the container; and An airflow adjusting element is arranged in the container and located between the door and the blowing system, wherein the airflow adjusting element has a plurality of openings for a part of the airflow to pass through, and the openings of the airflow adjusting element The proportion of the area on one surface of the air flow adjusting element gradually decreases as it approaches the doorway of the housing. The device interface system according to claim 1, wherein the air flow adjusting element is adjacent to a part of the housing located above the door. The device interface system according to claim 1, wherein the size of the openings of the air flow adjusting element gradually decreases as they approach the doorway of the casing. The device interface system according to claim 1, wherein the distribution density of the openings of the air flow adjusting element gradually decreases as it approaches the doorway of the casing. A device interface system for semiconductor process tools, including: A container having a shell, wherein the shell has a door; A loading port arranged outside the container and adjacent to the doorway of the casing; A robotic arm is set in the container; An air blowing system for generating an air flow in the container; and An airflow adjusting element is arranged in the container and located between the door and the blowing system, wherein the airflow adjusting element has a plurality of openings for a part of the airflow to pass through, and the airflow adjusting element is along a first Extend in one direction, and the airflow adjusting element is adjacent to a part of the housing located above the door in a second direction, wherein the second direction is perpendicular to the first direction, and the airflow adjusting element is in the first direction A length is greater than a width of the airflow adjusting element in the second direction. The device interface system according to claim 5, wherein the width of the air flow adjusting element in the second direction is smaller than a length of the doorway in the first direction. The device interface system according to claim 5, wherein the length of the airflow adjusting element in the first direction is greater than a length of the doorway in the first direction. A device interface system for semiconductor process tools, including: A container having a shell, wherein the shell has a door; A loading port arranged outside the container and adjacent to the doorway of the casing; A robotic arm is set in the container; An air blowing system for generating an air flow in the container; and An air flow adjustment element is arranged in the container and is located between the door and the blowing system, wherein the air flow adjustment element has a plurality of slits for a part of the air flow to pass. The device interface system according to claim 8, wherein the width of the slits gradually decreases as they approach the doorway of the housing. The device interface system according to claim 8, wherein a length of the slits in one direction is greater than a length of the doorway in that direction.

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