TW202135265A - Semiconductor package having emi shielding layer and packaging method thereof - Google Patents

Abstract

The present invention relates to a semiconductor package having EMI shielding layer and packaging method thereof. In the packaging method, a metal casing covers a wireless communication component mounted on a substrate, so a molding compound does not encapsulate the wireless communication component after a step of forming the encapsulation. And then a top of the metal casing is removed to expose the wireless communication component and at least one side wall of the metal casing between the wireless communication component and a chip mounted on the substrate prevents the chip from being interfered by EMI generated by the wireless communication component transceiving a wireless signal.

Description

Semiconductor packaging structure with electromagnetic shielding layer and its manufacturing method

The present invention relates to a semiconductor packaging structure, in particular to a semiconductor packaging structure with an electromagnetic shielding layer.

With the introduction of integrated circuit (IC) products that integrate wireless communication functions, the semiconductor packaging structure must integrate wireless communication chips or related electronic components; however, the semiconductor packaging structure must integrate wireless communication chips or related electronic components, and electromagnetic The shielding structure isolates the wireless communication chip or related electronic components to ensure the normal operation of the semiconductor package structure.

Please refer to FIG. 6, which is a semiconductor package structure 50 with an electromagnetic shielding layer, which includes a substrate 51, a package body 52, an antenna element 53 and an outer metal layer 54; wherein the package body 52 and the antenna The components 53 are respectively electrically connected to the substrate 51, and the package body 52 contains at least one chip 521, which is covered by a encapsulant 522.

Since the outer metal layer 54 is provided on the upper surface of the package body 52, the chip 521 can avoid interference from external electromagnetic signals; however, because the outer metal layer 54 does not extend to the side of the sealing compound 522, plus The antenna element 53 is arranged on the side of the package body 52, and the chip 521 cannot avoid being interfered by the electromagnetic wave signal transmitted and received by the antenna element 53, so it is necessary to further improve it.

In view of the fact that the above-mentioned semiconductor package structure cannot effectively isolate the interference of electromagnetic signals generated by the wireless communication chip or related electronic components integrated therein, the main purpose of the present invention is to provide a semiconductor package structure with an electromagnetic shielding layer and a manufacturing method thereof.

The main technical means used to achieve the above purpose is to make the semiconductor package structure with electromagnetic shielding layer include: A substrate including a first device area and a second device area; A package body is arranged on the first element area of the substrate; A wireless communication element arranged on the second element area of the substrate; and A signal isolation board is vertically arranged between the first and second component regions of the substrate.

It can be seen from the above description that the present invention mainly arranges a signal isolation board between the first and second component areas of the substrate to isolate the wireless communication component from transmitting and receiving wireless signals, and to prevent the package from electromagnetic interference of the wireless signals.

The main technical means used to achieve the above purpose is to make the semiconductor package structure with electromagnetic shielding layer include the following steps: (a) Provide a substrate, which includes a first element area and a second element area; (b) At least one chip is bonded to the first element area on the substrate, and a wireless communication element is bonded to the second element area; (c) aligning the opening of a metal shell with the second element area and placing it on the substrate to cover the wireless communication element; wherein the metal shell includes a top plate and a plurality of side plates; (d) forming a sealant to cover the at least one chip; and (e) Remove the part of the top plate of the metal shell that corresponds to the opening, so that the wireless communication element is exposed.

It can be seen from the above description that in the present invention, a metal shell corresponding to the wireless communication element is covered on the substrate to avoid covering the wireless communication element when the sealing compound is subsequently formed, and then only the top plate of the metal shell is removed. , The wireless communication element can be exposed, and the side plate of the metal shell located between the wireless communication element and the chip allows the chip to isolate the electromagnetic interference generated by the wireless communication element when sending and receiving wireless signals.

The present invention proposes an improvement of the electromagnetic shielding function for a semiconductor package structure integrated with wireless communication components. The technical content of the present invention will be described in detail with a number of embodiments and drawings.

First, please refer to FIGS. 1A and 1B, which are a three-dimensional appearance view of a first embodiment of a semiconductor package structure with an electromagnetic shielding layer of the present invention. The semiconductor package structure includes a substrate 10, a package body, and a wireless communication element. 12 and a signal isolation board 20.

The above-mentioned substrate 10 includes a first device area 101 and a second device area 102; in this embodiment, the substrate 10 is a circuit substrate for packaging, and may also be a redistribution layer, but is not limited to this. In this embodiment, the second device region 102 is located at one of the corners of the substrate 10.

The above-mentioned packaging system is arranged in the first device area 101 of the substrate 10, which includes at least one chip 11 and a sealant 30, and may also further include a passive component 13; in this embodiment, the chip 11 is electrically connected in a wire bonding manner. It can also be bonded on the substrate 10 in a flip-chip manner, but not limited to this; in addition, the packaging system is formed on the first device area 101 of the substrate 10 to cover the at least one The chip 11 or its passive component 13.

The above-mentioned wireless communication element 12 is joined to the second element area 102 of the substrate 10; in this embodiment, the wireless communication element 12 may be an antenna element, but is not limited to this.

The above-mentioned signal isolation plate 20 is disposed on the substrate 10 and is located between the first and second element regions 101 and 102; in this embodiment, the signal isolation plate 20 includes two adjacent metal vertical plates 201, The metal vertical plates 201 are integrally formed in advance, and are flatly attached to the two adjacent outer sides of the package body 30. In this embodiment, the sealant 30 extends to the top of the signal isolation plate 20, that is, the sealant 30 is formed on the top surface of the metal vertical plates 201.

It can be seen from the above description that the semiconductor package structure of the present invention mainly flatly attaches a signal isolation plate 20 to the two adjacent outsides of the package body 30, that is, between the first and second element regions 101 and 102 of the substrate 10. Therefore, when the wireless communication component 12 is transmitting and receiving wireless signals, the chip 11 in the package can be free from electromagnetic interference generated by the wireless signals.

Please refer to FIGS. 2A and 2B, which are a three-dimensional appearance view of a second embodiment of a semiconductor package structure with an electromagnetic shielding layer according to the present invention. The semiconductor package structure also includes a substrate 10, a package body, and a wireless communication element. 12 and a signal isolation board 20; however, in this embodiment, the top surface of the sealing compound 30 of the package is flush with the top surface of the signal isolation board 20, that is, compared to the semiconductor package structure shown in FIG. In the embodiment, the top surface of the two adjacent metal vertical plates 201 of the signal isolation plate 20 is not formed with the sealing compound. In addition, this embodiment further includes a metal layer 40 formed on the top surface of the molding compound 30 and its multiple exposed sides and the top surfaces of the metal vertical plates 201 of the signal isolation board 20.

The manufacturing method of the semiconductor package structure with electromagnetic shielding layer of the present invention will be further described below. First, please refer to FIGS. 3A to 3F, which are the first embodiment of the manufacturing method of the semiconductor package structure of the present invention, which includes the following steps (a) to (e).

In the above step (a), as shown in FIG. 3A, a substrate 10' is provided, and the substrate 10' includes a first device region 101 and a second device region 102. In this embodiment, the second device region 102 is located at one of the corners of the substrate 10'.

In the above step (b), as shown in FIG. 3B, the first device area 101 on the substrate 10' is bonded with at least one chip 11, and the second device area 102 is bonded with a wireless communication device 12.

In the above step (c), as shown in FIGS. 3B and 3C, the opening 21 of a metal shell 20' is aligned with the second device area 102 and then disposed on the substrate 10' to cover the wireless communication device 12; Wherein the metal shell 20' includes a top plate 22 and a plurality of side plates 23a, 23b. In this embodiment, the metal shell 20' is in a rectangular shape, a plurality of side plates 23a, 23b are integrally extended downward from the top plate 22, and two of the side plates 23a are adjacent to the corners of the substrate 10' Side 103,104.

In the above step (d), as shown in FIG. 3C and FIG. 3D, a sealant 30 is formed to cover the at least one chip 11 and the metal shell 20'.

In the above step (e), as shown in FIGS. 3E and 3F, the part of the top plate 22 of the metal shell 20' corresponding to the opening 21 is removed, so that the wireless communication element 12 is exposed. In this embodiment, laser light is aligned with the opening 21 of the metal shell 20', that is, the laser light moves along the cutting path L as shown in FIG. 3E, and the top plate 22 of the metal shell 20' is removed at the same time. The part of the opening 21 and the part of the sealing compound 30 extending thereon. In addition, since the two side plates 23a of the metal shell 20' are adjacent to the two adjacent sides 103, 104 at the corners of the substrate 10' (as shown in FIG. 3C), as shown in FIG. 3D, the substrate can be cut first in this step The two adjacent sides 103 and 104 of the corner 10' to remove the two side plates 23a of the metal shell 10' that are adjacent to the two adjacent sides 103, 104 of the corner of the substrate 10, that is, the two side plates 23a of the metal shell 10' are kept flat on the sealing body 30 The two side plates 23b on the side, as shown in FIG. 3E, use laser light to cut the part of the top plate 22 of the metal shell 20' corresponding to the opening 21 thereof.

Please refer to FIGS. 4A to 4C again, which is a second embodiment of the method for manufacturing a semiconductor package structure of the present invention, which also includes steps (a) to (e) of the first embodiment shown in FIGS. 3A to 3F, In addition, steps (a) to (c) are the same, and step (d) and step (e) of this embodiment are further described below.

In the above step (d), as shown in FIGS. 3C and 4A, a sealant 30 is formed to cover the at least one chip 11, and the top surface of the sealant 30 is connected to the top of the top plate 22 of the metal shell 20' The surface is flush, that is, in this step, the top plate 22 of the metal shell 20' is exposed. Alternatively, after the molding compound 30 is formed as shown in FIG. 3F, the top plate 22 of the metal shell may be exposed in a grinding manner.

In the above step (e), as shown in FIG. 4A, since the two side plates 23a of the metal shell 20' are adjacent to the two adjacent sides 103 and 104 at the corners of the substrate 10' (as shown in FIG. 3C), As shown in FIG. 4B, in this step, the two adjacent sides 103 and 104 of the corners of the substrate 10' can be cut first to remove the metal shells adjacent to the two adjacent sides 103, 104 of the corners of the substrate 10 and the two side plates 23a , That is, keep the two side plates 23b flatly attached to the sides of the sealing compound 30, and then cut the part of the top plate 22 of the metal shell 20' corresponding to the opening 21 with a laser light, that is, the laser light follows the cutting as shown in FIG. 4B When the path L moves, as shown in FIG. 4C, the wireless communication element 12 is exposed from the side.

Please refer to FIGS. 5A to 5C, which are the third embodiment of the method for manufacturing the semiconductor package structure of the present invention, which is substantially the same as the second embodiment shown in FIGS. 4A to 4C, and steps (a) to ( d) are all the same, and step (d) and step (e) of this embodiment are further described below.

In the above step (d), as shown in FIG. 5A, a sealant 30 is formed to cover the at least one chip 11, and the top surface of the sealant 30 is flush with the top surface of the top plate 22 of the metal shell 20' That is, in this step, the top plate 22 of the metal shell 20' is exposed. Alternatively, after the molding compound 30 is formed as shown in FIG. 3F, the top plate 22 of the metal shell may be exposed in a grinding manner. In this embodiment, in this step, after the molding compound 30 is formed, a metal layer 40 is formed by coating or sputtering. That is, the metal layer 40 covers the top and outer sides of the molding compound 30 and the metal The top surface 22 of the shell 20' is shown in FIG. 5B.

In the above step (e), as shown in FIG. 5B and FIG. 3C, a laser beam is used to move along the cutting path L as shown in FIG. 5B to cut and remove the metal shell 20' immediately adjacent to the substrate 10'. The two side plates 23a of the two adjacent sides 103, 104 and the top plate 22 of the corner correspond to the part of the opening 21 (as shown in FIG. 5A). Shown in 5C.

To sum up, in the present invention, a metal shell corresponding to the wireless communication component is covered on the substrate to prevent the wireless communication component from being covered when the sealing compound is formed subsequently, and then only the top plate of the metal shell is removed. , The wireless communication element can be exposed, and the side plate of the metal shell located between the wireless communication element and the chip allows the chip to isolate the electromagnetic interference generated by the wireless communication element when sending and receiving wireless signals; After the molding compound is formed, a metal layer is further formed to fully cover the package body and the top surface of the side plate of the metal shell exposed on the package body, so that the chips in the package body can prevent external electromagnetic wave interference.

The above are only the embodiments of the present invention and do not limit the present invention in any form. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field, Without departing from the scope of the technical solution of the present invention, when the technical content disclosed above can be used to make slight changes or modification into equivalent embodiments with equivalent changes, but any content that does not depart from the technical solution of the present invention is based on the technical essence of the present invention Any simple modifications, equivalent changes and modifications made to the above embodiments still fall within the scope of the technical solution of the present invention.

10: substrate 101: The first component area 102: The second component area 103: side 104: side 11: chip 12: Wireless communication components 13: Passive components 20: Signal isolation board 20’: Metal shell 201: Metal vertical plate 21: opening 22: top plate 23a: side panel 23b: side panel 30: Package body 40: metal layer 50: Semiconductor package structure 51: substrate 52: Package body 521: Chip 522: package body 53: Antenna element

Fig. 1A: A perspective view of the first embodiment of a semiconductor package structure with an electromagnetic shielding layer according to the present invention. Fig. 1B: A partial cross-sectional view of Fig. 1A along the line A-A. 2A: A perspective view of a second embodiment of a semiconductor package structure with an electromagnetic shielding layer according to the present invention. Fig. 2B: A partial cross-sectional view of Fig. 2A along the line B-B. Figures 3A to 3F: cross-sectional views of different steps of the manufacturing method of Figure 1A of the present invention. 4A to 4C: cross-sectional views of different steps of another manufacturing method of the present invention. Figures 5A to 5C: cross-sectional views of different steps of the manufacturing method of Figure 2A of the present invention. Figure 6: A three-dimensional appearance view of a semiconductor package structure with an electromagnetic shielding layer.

10: substrate

102: The second component area

11: chip

12: Wireless communication components

13: Passive components

20: Signal isolation board

201: Metal vertical plate

30: Package body

Claims (10)

A semiconductor packaging structure with electromagnetic shielding layer, including: A substrate including a first device area and a second device area; A package body is arranged on the first element area of the substrate; A wireless communication element arranged on the second element area of the substrate; and A signal isolation board is vertically arranged between the first and second component regions of the substrate. The semiconductor package structure according to claim 1, wherein: The signal isolation plate includes two adjacent metal vertical plates, the metal vertical plates are integrally formed and flatly attached to the two adjacent outer sides of the package body; and The packaging system includes: At least one chip is electrically bonded to the substrate; and The sealant is formed on the first device area of the substrate to cover the at least one chip. The semiconductor package structure according to claim 2, wherein the encapsulant system extends to the top of the signal isolation board. The semiconductor package structure according to claim 2, wherein the top end of the signal isolation plate is flush with the top surface of the molding compound. The semiconductor package structure according to claim 4, wherein the top surface of the signal isolation plate, the top surface of the molding compound and the plurality of exposed sides are covered with a metal layer. A manufacturing method of a semiconductor packaging structure with an electromagnetic shielding layer includes: (a) Providing a substrate, the substrate including a first element area and a second element area; (b) At least one chip is bonded to the first element area on the substrate, and a wireless communication element is bonded to the second element area; (c) aligning the opening of a metal shell with the second element area and placing it on the substrate to cover the wireless communication element; wherein the metal shell includes a top plate and a plurality of side plates; (d) forming a sealant to cover the at least one chip; and (e) Remove the part of the top plate of the metal shell that corresponds to the opening, so that the wireless communication element is exposed. The method for manufacturing a semiconductor package structure as described in claim 6, wherein: In the above step (c), a plurality of side plates of the metal shell are integrally extended from the top plate; In the above step (d), the sealing compound system further covers the metal shell; and In the above step (e), the part of the top plate of the metal shell corresponding to the opening and the part of the sealing compound extending to the top plate are removed at the same time. The method for manufacturing a semiconductor package structure according to claim 6, wherein in the above step (d), the top surface of the molding compound is flush with the top surface of the top plate of the metal shell. The method for manufacturing a semiconductor package structure as described in claim 8, wherein: In the above step (d), after the molding compound is formed, a metal layer is formed, which covers the top surface and the outside of the molding compound and the top surface of the top plate of the metal shell; and In the above step (e), the part of the top plate of the metal shell corresponding to the opening and the metal layer covering it are removed at the same time. The method for manufacturing a semiconductor package structure according to any one of claims 5 to 8, wherein: In the above step (b), the wireless communication element is close to one corner of the substrate; In the above step (c), the metal shell has a rectangular shape; and In the above step (e), the two side plates of the metal shell adjacent to the two adjacent sides of the corner of the substrate are cut and removed.

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