TW202135265A - Semiconductor package having emi shielding layer and packaging method thereof - Google Patents
Semiconductor package having emi shielding layer and packaging method thereof Download PDFInfo
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本發明係關於一種半導體封裝結構,尤指一種具電磁遮蔽層之半導體封裝結構。The present invention relates to a semiconductor packaging structure, in particular to a semiconductor packaging structure with an electromagnetic shielding layer.
隨著整合無線通訊功能的積體電路(IC)產品的推出,其半導體封裝結構必須將無線通訊晶片或相關電子元件加以整合;然而,半導體封裝結構整合無線通訊晶片或相關電子元件,必須增加電磁遮蔽結構隔離無線通訊晶片或相關電子元件,以確保半導體封裝結構正常運作。With the introduction of integrated circuit (IC) products that integrate wireless communication functions, the semiconductor packaging structure must integrate wireless communication chips or related electronic components; however, the semiconductor packaging structure must integrate wireless communication chips or related electronic components, and electromagnetic The shielding structure isolates the wireless communication chip or related electronic components to ensure the normal operation of the semiconductor package structure.
請參閱圖6所示,係為一具電磁遮蔽層之半導體封裝結構50,其包含有一基板51、一封裝體52、一天線元件53及一外金屬層54;其中該封裝體52及該天線元件53係分別電性接合於該基板51上,而該封裝體52內至少包含有一晶片521,並由一封膠體522包覆之。Please refer to FIG. 6, which is a
由於該封裝體52的上表面設置有該外金屬層54,故其中該晶片521可避免受到外界電磁波訊號干擾;然而,由於該外金屬層54並未延伸至該封膠體522側邊,加上該天線元件53設置在該封裝體52的側邊,該晶片521無法避免受該天線元件53收發電磁波訊號的干擾,故而有必要進一步改良之。Since the
有鑑於上述半導體封裝結構無法有效隔離整合於其中之無線通訊晶片或相關電子元件所產生電磁訊號的干擾,本發明主要目的係提供一種具電磁遮蔽層之半導體封裝結構及其製法。In view of the fact that the above-mentioned semiconductor package structure cannot effectively isolate the interference of electromagnetic signals generated by the wireless communication chip or related electronic components integrated therein, the main purpose of the present invention is to provide a semiconductor package structure with an electromagnetic shielding layer and a manufacturing method thereof.
欲達上述目的所使用的主要技術手段係令該具電磁遮蔽層之半導體封裝結構,包含有: 一基板,係包含一第一元件區及一第二元件區; 一封裝體,係設置在該基板的第一元件區上; 一無線通訊元件,設置在該基板的第二元件區上;以及 一訊號隔離板,係直立設置在該基板的第一及第二元件區之間。The main technical means used to achieve the above purpose is to make the semiconductor package structure with electromagnetic shielding layer include: A substrate including a first device area and a second device area; A package body is arranged on the first element area of the substrate; A wireless communication element arranged on the second element area of the substrate; and A signal isolation board is vertically arranged between the first and second component regions of the substrate.
由上述說明可知,本發明主要將一訊號隔離板設置在該基板的第一及第二元件區之間,以隔離該無線通訊元件於收發無線訊號時,讓封裝體免除無線訊號的電磁干擾。It can be seen from the above description that the present invention mainly arranges a signal isolation board between the first and second component areas of the substrate to isolate the wireless communication component from transmitting and receiving wireless signals, and to prevent the package from electromagnetic interference of the wireless signals.
欲達上述目的所使用的主要技術手段係令該具電磁遮蔽層之半導體封裝結構,包含有以下步驟: (a) 提供一基板,該基板係包含有一第一元件區及一第二元件區; (b) 於該基板上的第一元件區係接合有至少一晶片,而該第二元件區係接合一無線通訊元件; (c) 將一金屬殼的開口對準該第二元件區後設置於該基板上,以罩住該無線通訊元件;其中該金屬殼係包含有一頂板及多個側板; (d) 形成一封膠體,以包覆該至少一晶片;以及 (e) 移除該金屬殼的頂板對應其開口的部分,使該無線通訊元件外露。The main technical means used to achieve the above purpose is to make the semiconductor package structure with electromagnetic shielding layer include the following steps: (a) Provide a substrate, which includes a first element area and a second element area; (b) At least one chip is bonded to the first element area on the substrate, and a wireless communication element is bonded to the second element area; (c) aligning the opening of a metal shell with the second element area and placing it on the substrate to cover the wireless communication element; wherein the metal shell includes a top plate and a plurality of side plates; (d) forming a sealant to cover the at least one chip; and (e) Remove the part of the top plate of the metal shell that corresponds to the opening, so that the wireless communication element is exposed.
由上述說明可知,本發明先將一金屬殼對應該無線通訊元件罩設於該基板上,避免後續形成封膠體時一併包覆了該無線通訊元件,接著只要將該金屬殼的頂板移除,該無線通訊元件即可外露,而位在該無線通訊元件與該晶片之間的金屬殼的側板,即可讓晶片隔離該無線通訊元件於收發無線訊號產生之電磁干擾。It can be seen from the above description that in the present invention, a metal shell corresponding to the wireless communication element is covered on the substrate to avoid covering the wireless communication element when the sealing compound is subsequently formed, and then only the top plate of the metal shell is removed. , The wireless communication element can be exposed, and the side plate of the metal shell located between the wireless communication element and the chip allows the chip to isolate the electromagnetic interference generated by the wireless communication element when sending and receiving wireless signals.
本發明係針對整合有無線通訊元件之半導體封裝結構提出電磁遮蔽功能的改良,以下謹以多個實施例並配合圖式詳加說明本發明技術內容。The present invention proposes an improvement of the electromagnetic shielding function for a semiconductor package structure integrated with wireless communication components. The technical content of the present invention will be described in detail with a number of embodiments and drawings.
首先請參閱圖1A及圖1B所示,係為本發明具電磁遮蔽層之半導體封裝結構第一實施例的立體外觀圖,該半導體封裝結構係包含有一基板10、一封裝體、一無線通訊元件12及一訊號隔離板20。First, please refer to FIGS. 1A and 1B, which are a three-dimensional appearance view of a first embodiment of a semiconductor package structure with an electromagnetic shielding layer of the present invention. The semiconductor package structure includes a
上述基板10係包含有一第一元件區101及一第二元件區102;於本實施例,該基板10為一封裝用的線路基板,亦可為一重佈線層,但不以此為限。又於本實施例,該第二元件區102係位在該基板10的其中一角落位置。The above-mentioned
上述封裝體係設置在該基板10的第一元件區101,其包含有至少一晶片11及一封膠體30,也可進一步包含有被動元件13;於本實施例,該晶片11係以打線方式電性接合於該基板上,亦可以覆晶方式接合於該基板10上,但不以此為限;又, 該封裝體係形成於該基板10的該第一元件區101,以包覆該至少一晶片11或其被動元件13。The above-mentioned packaging system is arranged in the
上述該無線通訊元件12係接合於該基板10的第二元件區102;於本實施例,該無線通訊元件12可為一天線元件,但不以此為限。The above-mentioned
上述訊號隔離板20係設置在該基板10上,並位在該第一及第二元件區101、102之間;於本實施例,該訊號隔離板20係包含二相鄰金屬立板201,該些金屬立板201係預先一體成型,並平貼於該封裝體30二相鄰外側。又於本實施例,該封膠體30係延伸至該訊號隔離板20頂端,即該些金屬立板201的頂面係形成有該封膠體30。The above-mentioned
由上述說明可知,本發明的半導體封裝結構係主要將一訊號隔離板20平貼於該封裝體30二相鄰外側,即位在該基板10的第一及第二元件區101、102之間,故可於該無線通訊元件12於收發無線訊號時,讓該封裝體內的晶片11免除無線訊號所產生的電磁干擾。It can be seen from the above description that the semiconductor package structure of the present invention mainly flatly attaches a
再請參閱圖2A及圖2B所示,係為本發明具電磁遮蔽層之半導體封裝結構第二實施例的立體外觀圖,該半導體封裝結構同樣包含有一基板10、一封裝體、一無線通訊元件12及一訊號隔離板20;惟於本實施例中,該封裝體的封膠體30頂面係與該訊號隔離板20的頂面齊平,即相較圖1A所示的半導體封裝結構,本實施例的該訊號隔離板20的二相鄰金屬立板201之頂面未形成有該封膠體。又本實施例係進一步包含一金屬層40,該金屬層40係形成於該封膠體30的頂面及其多個外露側邊與該訊號隔離板20的該些金屬立板201之頂面。Please refer to FIGS. 2A and 2B, which are a three-dimensional appearance view of a second embodiment of a semiconductor package structure with an electromagnetic shielding layer according to the present invention. The semiconductor package structure also includes a
以下再進一步說明本發明具電磁遮蔽層之半導體封裝結構的製法,首先請參閱圖3A至圖3F所示,係本發明半導體封裝結構的製法的第一實施例,其包含以下步驟(a)至(e)。The manufacturing method of the semiconductor package structure with electromagnetic shielding layer of the present invention will be further described below. First, please refer to FIGS. 3A to 3F, which are the first embodiment of the manufacturing method of the semiconductor package structure of the present invention, which includes the following steps (a) to (e).
於上述步驟(a)中,如圖3A所示,係提供一基板10’,該基板10’係包含有一第一元件區101及一第二元件區102。於本實施例,該第二元件區102係位在該基板10’的其中一角落位置。In the above step (a), as shown in FIG. 3A, a substrate 10' is provided, and the substrate 10' includes a
於上述步驟(b)中,如圖3B所示,於該基板10’上的第一元件區101係接合有至少一晶片11,而該第二元件區102係接合一無線通訊元件12。In the above step (b), as shown in FIG. 3B, the
於上述步驟(c)中,如圖3B及圖3C所示,將一金屬殼20’的開口21對準該第二元件區102後設置於該基板10’上,以罩住該無線通訊元件12;其中該金屬殼20’係包含有一頂板22及多個側板23a、23b。於本實施例,該金屬殼20’係呈一矩形狀,其多個側板23a、23b係自該頂板22向下一體延伸,又其中二個側板23a係緊鄰該基板10’角落的二相鄰側邊103、104。In the above step (c), as shown in FIGS. 3B and 3C, the opening 21 of a metal shell 20' is aligned with the
於上述步驟(d)中,如圖3C及圖3D所示,形成一封膠體30,以包覆該至少一晶片11及該金屬殼20’。In the above step (d), as shown in FIG. 3C and FIG. 3D, a
於上述步驟(e)中,如圖3E及圖3F所示,移除該金屬殼20’的頂板22對應其開口21的部分,使該無線通訊元件12外露。於本實施例,係以雷射光對準該金屬殼20’的開口21,即該雷射光沿著如圖3E所示的切割路徑L移動,一併移除該金屬殼20’的頂板22對應其開口21的部分及延伸至其上的封膠體30部分。又,由於該金屬殼20’的二側板23a係緊鄰該基板10’角落的二相鄰側邊103、104(如圖3C所示),故如圖3D所示,本步驟可先切割該基板10’角落的二相鄰側邊103、104,以移除緊鄰該基板10角落之二相鄰側邊103、104的該金屬殼10’之二側板23a,即保留平貼於該封膠體30側邊的二側板23b,再如圖3E所示,以雷射光切割該金屬殼20’的頂板22對應其開口21的部分。In the above step (e), as shown in FIGS. 3E and 3F, the part of the
再請參閱圖4A至圖4C所示,係本發明半導體封裝結構的製法的第二實施例,其同樣包含圖3A至圖3F所示的第一實施例之步驟(a)至(e),且其中步驟(a)至(c)相同,以下進一步說明本實施例的步驟(d)及步驟(e)。Please refer to FIGS. 4A to 4C again, which is a second embodiment of the method for manufacturing a semiconductor package structure of the present invention, which also includes steps (a) to (e) of the first embodiment shown in FIGS. 3A to 3F, In addition, steps (a) to (c) are the same, and step (d) and step (e) of this embodiment are further described below.
於上述步驟(d)中,如圖3C及圖4A所示,形成一封膠體30,以包覆該至少一晶片11,且封膠體30頂面係與該金屬殼20’之頂板22的頂面齊平,即於本步驟中,該金屬殼20’的頂板22係外露。或者,亦可於圖3F所示形成該封膠體30後,研磨方式將該金屬殼的頂板22外露。In the above step (d), as shown in FIGS. 3C and 4A, a
於上述步驟(e)中,如圖4A所示,由於該金屬殼20’的二側板23a係緊鄰該基板10’角落的二相鄰側邊103、104(如圖3C所示),故如圖4B所示,本步驟可先切割該基板10’角落的二相鄰側邊103、104,以移除該金屬殼緊鄰該基板10角落之二相鄰側邊103、104的之二側板23a,即保留平貼於該封膠體30側邊的二側板23b,再以雷射光切割該金屬殼20’的頂板22對應其開口21的部分,即該雷射光沿著如圖4B所示的切割路徑L移動,即可如圖4C所示,該無線通訊元件12自側邊外露。In the above step (e), as shown in FIG. 4A, since the two
再請參閱圖5A至圖5C所示,係本發明半導體封裝結構的製法的第三實施例,其與圖4A至圖4C所示的第二實施例大致相同,且其中步驟(a)至(d)均相同,以下進一步說明本實施例的步驟(d)及步驟(e)。Please refer to FIGS. 5A to 5C, which are the third embodiment of the method for manufacturing the semiconductor package structure of the present invention, which is substantially the same as the second embodiment shown in FIGS. 4A to 4C, and steps (a) to ( d) are all the same, and step (d) and step (e) of this embodiment are further described below.
於上述步驟(d)中,如圖5A所示,形成一封膠體30,以包覆該至少一晶片11,且封膠體30頂面係與該金屬殼20’之頂板22的頂面齊平,即於本步驟中,令該金屬殼20’的頂板22外露。或者,亦可於圖3F所示形成該封膠體30後,研磨方式將該金屬殼的頂板22外露。於本實施例,本步驟係進一步在形成該封膠體30後,再以塗佈或濺鍍方式形成一金屬層40,即該金屬層40係覆蓋該封膠體30的頂面及外側與該金屬殼20’的頂面22,如圖5B所示。In the above step (d), as shown in FIG. 5A, a
於上述步驟(e)中,如圖5B及圖3C所示,以一雷射光沿著如圖5B所示的切割路徑L移動,一併切割並移除該金屬殼20’緊鄰該基板10’角落的二相鄰側邊103、104的二側板23a及其頂板22對應其開口21的部分(如圖5A所示),只保留平貼於該封膠體30側邊的二側板23b,如圖5C所示。In the above step (e), as shown in FIG. 5B and FIG. 3C, a laser beam is used to move along the cutting path L as shown in FIG. 5B to cut and remove the metal shell 20' immediately adjacent to the substrate 10'. The two
綜上所述,本發明先將一金屬殼對應該無線通訊元件罩設於該基板上,避免後續形成封膠體時一併包覆了該無線通訊元件,接著只要將該金屬殼的頂板移除,該無線通訊元件即可外露,而位在該無線通訊元件與該晶片之間的金屬殼的側板,即可讓晶片隔離該無線通訊元件於收發無線訊號產生之電磁干擾;又,可進一步於封膠體成形後進一步形成金屬層,以全面覆該封裝體及外露於該封裝體之金屬殼之側板頂面,即可令該封裝體內的晶片一併防止外界電磁波干擾。To sum up, in the present invention, a metal shell corresponding to the wireless communication component is covered on the substrate to prevent the wireless communication component from being covered when the sealing compound is formed subsequently, and then only the top plate of the metal shell is removed. , The wireless communication element can be exposed, and the side plate of the metal shell located between the wireless communication element and the chip allows the chip to isolate the electromagnetic interference generated by the wireless communication element when sending and receiving wireless signals; After the molding compound is formed, a metal layer is further formed to fully cover the package body and the top surface of the side plate of the metal shell exposed on the package body, so that the chips in the package body can prevent external electromagnetic wave interference.
以上所述僅是本發明的實施例而已,並非對本發明做任何形式上的限制,雖然本發明已以實施例揭露如上,然而並非用以限定本發明,任何所屬技術領域中具有通常知識者,在不脫離本發明技術方案的範圍內,當可利用上述揭示的技術內容作出些許更動或修飾為等同變化的等效實施例,但凡是未脫離本發明技術方案的內容,依據本發明的技術實質對以上實施例所作的任何簡單修改、等同變化與修飾,均仍屬於本發明技術方案的範圍內。The above are only the embodiments of the present invention and do not limit the present invention in any form. Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the relevant technical field, Without departing from the scope of the technical solution of the present invention, when the technical content disclosed above can be used to make slight changes or modification into equivalent embodiments with equivalent changes, but any content that does not depart from the technical solution of the present invention is based on the technical essence of the present invention Any simple modifications, equivalent changes and modifications made to the above embodiments still fall within the scope of the technical solution of the present invention.
10:基板
101:第一元件區
102:第二元件區
103:側邊
104:側邊
11:晶片
12:無線通訊元件
13:被動元件
20:訊號隔離板
20’:金屬殼
201:金屬立板
21:開口
22:頂板
23a:側板
23b:側板
30:封裝體
40:金屬層
50:半導體封裝結構
51:基板
52:封裝體
521:晶片
522:封裝體
53:天線元件10: substrate
101: The first component area
102: The second component area
103: side
104: side
11: chip
12: Wireless communication components
13: Passive components
20: Signal isolation board
20’: Metal shell
201: Metal vertical plate
21: opening
22:
圖1A:本發明具電磁遮蔽層之半導體封裝結構第一實施例的立體外觀圖。 圖1B:圖1A沿著A-A剖面線的部分剖面圖。 圖2A:本發明具電磁遮蔽層之半導體封裝結構第二實施例的立體外觀圖。 圖2B:圖2A沿著B-B剖面線的部分剖面圖。 圖3A至圖3F:本發明圖1A的製法之不同步驟的剖面圖。 圖4A至圖4C:本發明另一製法之不同步驟的剖面圖。 圖5A至圖5C:本發明圖2A的製法之不同步驟的剖面圖。 圖6:既有一具電磁遮蔽層之半導體封裝結構的立體外觀圖。Fig. 1A: A perspective view of the first embodiment of a semiconductor package structure with an electromagnetic shielding layer according to the present invention. Fig. 1B: A partial cross-sectional view of Fig. 1A along the line A-A. 2A: A perspective view of a second embodiment of a semiconductor package structure with an electromagnetic shielding layer according to the present invention. Fig. 2B: A partial cross-sectional view of Fig. 2A along the line B-B. Figures 3A to 3F: cross-sectional views of different steps of the manufacturing method of Figure 1A of the present invention. 4A to 4C: cross-sectional views of different steps of another manufacturing method of the present invention. Figures 5A to 5C: cross-sectional views of different steps of the manufacturing method of Figure 2A of the present invention. Figure 6: A three-dimensional appearance view of a semiconductor package structure with an electromagnetic shielding layer.
10:基板10: substrate
102:第二元件區102: The second component area
11:晶片11: chip
12:無線通訊元件12: Wireless communication components
13:被動元件13: Passive components
20:訊號隔離板20: Signal isolation board
201:金屬立板201: Metal vertical plate
30:封裝體30: Package body
Claims (10)
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