TW202134634A - Attached re-inspection system, and attached re-inspection method - Google Patents
Attached re-inspection system, and attached re-inspection method Download PDFInfo
- Publication number
- TW202134634A TW202134634A TW109108458A TW109108458A TW202134634A TW 202134634 A TW202134634 A TW 202134634A TW 109108458 A TW109108458 A TW 109108458A TW 109108458 A TW109108458 A TW 109108458A TW 202134634 A TW202134634 A TW 202134634A
- Authority
- TW
- Taiwan
- Prior art keywords
- inspection
- image
- defect
- display device
- tested
- Prior art date
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
Abstract
Description
本發明係有關於一種共生式複檢系統、及共生式複檢方法,特別是指一種全自動化的共生式複檢系統、及共生式複檢方法。The present invention relates to a symbiosis reinspection system and a symbiosis reinspection method, in particular to a fully automated symbiosis reinspection system and a symbiosis reinspection method.
自動光學檢查(Automated Optical Inspection, AOI),係運用機器視覺做為檢測標準技術,透過機器視覺取代傳統人眼辨識以達到高精密度及高效率的檢測,作為改良傳統上以人力使用光學儀器進行檢測的缺點,應用層面包括從高科技產業之研發、製造品管、國防、民生、醫療、環保、電力等領域。Automatic optical inspection (Automated Optical Inspection, AOI) uses machine vision as the inspection standard technology to replace traditional human eye recognition through machine vision to achieve high-precision and high-efficiency inspections. As an improvement, traditional optical instruments are used by humans. The shortcomings of detection, the application level includes high-tech industry research and development, manufacturing quality control, national defense, people's livelihood, medical care, environmental protection, electric power and other fields.
一般透過機器視覺檢查,比起人眼檢測可以大幅度地增加檢測的效率,然而,機器視覺仍然經常會發生誤檢或誤判的情事。舉例而言,於面板表面上的毛髮、灰塵經常會被誤判為面板上的刮痕或是噪點,因為在形態上與面板的瑕疵相當的接近。基於上面的原因,為了降低誤檢、誤判的機率,並提升產品的良率及產能,待測物被檢出的瑕疵一般要再透過人眼進行一次複檢,透過人眼再次確認待測物的瑕疵,以減少誤宰(overkill)的可能性。Generally, machine vision inspection can greatly increase the efficiency of detection compared to human eye inspection. However, machine vision still often causes misdetection or misjudgment. For example, the hair and dust on the surface of the panel are often misjudged as scratches or noise on the panel, because they are quite close to the defects of the panel in form. Based on the above reasons, in order to reduce the probability of false detection and misjudgment, and to improve the yield and productivity of the product, the defect detected by the test object is generally re-examined through the human eye, and the test object is reconfirmed through the human eye Blemishes to reduce the possibility of overkill.
本發明的目的在於提供一種共生式複檢系統,用以配合一複檢設備實施,該共生式複檢系統包括一自動操作裝置、一影像側錄裝置、以及一影像檢測裝置。該自動操作裝置根據一待測物的瑕疵位置資訊,輸出一操作指令至該複檢設備,使該複檢設備的一複檢攝影機,移動至該待測物的瑕疵位置上方,並拍攝一瑕疵位置影像。該影像側錄裝置設置於該複檢設備,自該複檢設備上的一顯示裝置上,獲取該瑕疵位置影像。該影像檢測裝置耦合至該影像側錄裝置,根據該顯示裝置上的該瑕疵位置影像,產生一影像複檢結果。The object of the present invention is to provide a symbiosis reinspection system for implementation with a reinspection device. The symbiosis reinspection system includes an automatic operation device, an image recording device, and an image detection device. The automatic operating device outputs an operation command to the re-inspection equipment based on the defect location information of an object to be tested, so that a re-inspection camera of the re-inspection equipment moves above the defect location of the object to be tested, and photographs a defect Location image. The image skimming device is arranged on the re-inspection equipment, and obtains the defect location image from a display device on the re-inspection equipment. The image detection device is coupled to the image recording device, and generates an image review result according to the defect position image on the display device.
本發明的另一目的,在於提供一種共生式複檢系統,包括一複檢設備、一自動操作裝置、一影像側錄裝置、以及一影像檢測裝置。該複檢設備接收一自動光學檢測設備所提供的一待測物與該待測物的瑕疵位置資訊,以執行一複檢程序。該自動操作裝置根據該瑕疵位置資訊,輸出一操作指令至該複檢設備,使該複檢設備的一複檢攝影機移動至該待測物的瑕疵位置上,並拍攝一瑕疵位置影像。該影像側錄裝置設置於該複檢設備,自該複檢設備上的一顯示裝置上,獲取該瑕疵位置影像。該影像檢測裝置耦合至該影像側錄裝置,根據該顯示裝置上的該瑕疵位置影像,產生一影像複檢結果。其中該複檢設備具有一手動控制裝置,連接至該複檢攝影機,以控制該複檢攝影機的操作。其中該顯示裝置呈現該複檢攝影機拍攝的該瑕疵位置影像,以供目視檢查。Another object of the present invention is to provide a symbiosis re-inspection system, including a re-inspection equipment, an automatic operation device, an image recording device, and an image detection device. The re-inspection equipment receives an object to be tested and the defect position information of the object to be tested provided by an automatic optical inspection device to perform a re-inspection procedure. The automatic operating device outputs an operation command to the re-inspection device according to the defect location information, so that a re-inspection camera of the re-inspection device moves to the defect location of the object to be tested, and shoots an image of the defect location. The image skimming device is arranged on the re-inspection equipment, and obtains the defect location image from a display device on the re-inspection equipment. The image detection device is coupled to the image recording device, and generates an image review result according to the defect position image on the display device. The re-inspection equipment has a manual control device connected to the re-inspection camera to control the operation of the re-inspection camera. The display device presents the defect location image taken by the re-inspection camera for visual inspection.
本發明的更一目的,在於提供一種共生式複檢方法,用以配合一複檢設備實施,包括:提供一自動操作裝置,藉以該自動操作裝置根據一待測物的瑕疵位置資訊,輸出一操作指令至該複檢設備,使該複檢攝影機移動至該待測物的瑕疵位置上,並拍攝一瑕疵位置影像;提供一影像側錄裝置,耦合至該複檢設備,自該複檢設備上的一顯示裝置上,獲取該瑕疵位置影像;以及提供一影像檢測模組,耦合至至該影像側錄裝置,根據該顯示裝置上的該瑕疵位置影像,產生一影像複檢結果。A further object of the present invention is to provide a symbiosis re-inspection method for implementation in conjunction with a re-inspection device, including: providing an automatic operating device, whereby the automatic operating device outputs a defect location information of an object to be tested Operation instructions are sent to the re-inspection equipment to move the re-inspection camera to the defect position of the object to be tested, and take an image of the defect position; provide an image recording device, coupled to the re-inspection equipment, from the re-inspection equipment An image of the defect location is obtained on a display device above; and an image detection module is provided, which is coupled to the image recording device, and generates an image review result according to the defect location image on the display device.
1. 本發明可以改善傳統程序需要大量人工執行複檢的缺失,尤其是可以解決檢測軟體能力不足或是製程變更時所造成大量過檢、誤判時所產生人力負荷過重的問題,透過本發明可以提升複檢設備的檢測效率及精確度,並可以大幅縮減人員的工作負擔。1. The present invention can improve the lack of traditional procedures that require a large number of manual re-checks, especially it can solve the problem of insufficient detection software ability or excessive over-checking and misjudgment caused by excessive manpower load during process changes. Through the present invention, Improve the detection efficiency and accuracy of re-inspection equipment, and can greatly reduce the workload of personnel.
2. 本發明可以適用於各式複檢設備,增加產品的可擴充性及實用性,透過外加軟硬體或程序,有效的將傳統複檢中最耗費人力的工作予以自動化,達到大幅降低人力的目的。2. The present invention can be applied to all kinds of re-inspection equipment to increase the scalability and practicability of the product. By adding software and hardware or programs, it can effectively automate the most labor-intensive tasks in traditional re-inspection, and achieve a significant reduction in manpower. the goal of.
有關本發明之詳細說明及技術內容,現就配合圖式說明如下。再者,本發明中之圖式,為說明方便,其比例未必照實際比例繪製,該等圖式及其比例並非用以限制本發明之範圍,在此先行敘明。The detailed description and technical content of the present invention will now be described in conjunction with the drawings as follows. Furthermore, the figures in the present invention are not necessarily drawn according to actual proportions for the convenience of description, and these figures and their proportions are not used to limit the scope of the present invention, and are described here first.
以下針對本發明的其中一較佳實施例進行說明,請參閱「圖1」及「圖2」,係為本發明共生式複檢系統應用於複檢設備的方塊示意圖(一)及方塊示意圖(二),如圖所示:The following describes one of the preferred embodiments of the present invention, please refer to "Figure 1" and "Figure 2", which are the block diagrams (1) and block diagrams (1) and block diagrams ( Two), as shown in the figure:
本實施例主要包括一自動光學檢測設備10、一複檢設備20、以及一配合該複檢設備20設置的共生式複檢系統30。This embodiment mainly includes an automatic
所述的自動光學檢測設備10用以檢測待測物的瑕疵,並記錄該待測物的瑕疵座標及瑕疵種類。該自動光學檢測設備10可以為現行任意的自動光學檢測設備(Automated Optical Inspection, AOI),用以透過機器視覺的方式,對待測物H進行影像分析並評估瑕疵種類。其中,影像分析的方式,可以透過一般影像處理方式(例如高斯、傅立葉、二值化、影像相減、型態分析)獲得瑕疵的種類及位置、或是透過機器學習、深度學習等利用類神經網絡進行瑕疵種類的辨識及定位,於本發明中不予以限制。The automatic
於另一較佳實施態樣中,該共生式複檢系統30可以進一步包括複檢設備20,經由直接將該複檢設備20整合至共生式複檢系統30,藉以與自動光學檢測設備10配合,於本發明中不予以限制。In another preferred embodiment, the
請一併參閱「圖3」,係為複檢設備的外觀示意圖,如圖所示:Please also refer to "Figure 3", which is a schematic diagram of the appearance of the re-inspection equipment, as shown in the figure:
所述的複檢設備20係設置於該自動光學檢測設備10的後端,用以接收由該自動光學檢測設備10輸出被歸類為瑕疵品的待測物,並依據該等瑕疵的種類及位置進行複檢,藉以複進一步確認瑕疵是否有誤判的情事,透過複判的方式減少誤宰(Overkill)的情況,進一步提高良率。The
該複檢設備20主要包括一移載裝置21、一檢測平台22、一複檢攝影機23、一手動操作裝置24、以及一顯示裝置25。The
該檢測平台22用於承載該待測物H,該移載裝置21用以將該自動光學檢測設備10檢測完成的該待測物H移載至該檢測平台22,藉以通過該檢測平台22對該待測物H進行複判。於一可行的實施例中,在機台位置的配置上,當該複檢設備20及該自動光學檢測設備10之間有一段距離時,該自動光學檢測設備10及該複檢設備20之間可以再設置一輸送平台(例如輸送帶、線性載台等),透過該輸送平台將待測物H由自動光學檢測設備10移動至該複檢設備20;於另一可行的實施例中,當該自動光學檢測設備10與該複檢設備20的距離較為接近時,該複檢設備20的移載裝置21可以進行移載待測物H的工作;於另一可行的實施例中,可以無需設置該移載裝置21,直接透過人工上料的方式將待測物H放置於該檢測平台22上,於本發明中不予以限制。The
該複檢攝影機23用以拍攝該檢測平台22上的該待測物H。該複檢攝影機23包括攝影機本體231、以及一供該攝影機本體231設置並連接至該手動操作裝置24的複檢攝影機移動載台232。The
其中,該攝影機本體231可以為線掃描攝影機(Line Scan Camera)或面掃描攝影機(Area Scan Camera),於本發明中不予以限制。該攝影機本體231可以進一步包括一光學裝置,透過光學裝置將待測物的瑕疵影像放大,以獲取放大後更為清晰的強化瑕疵影像。於另一可行的實施例中,該攝影機本體231亦可以直接透過本身的鏡頭調整焦段藉以達到放大瑕疵影像的功能,於本發明中不予以限制。於另一可行的實施例中,可以透過光源對該瑕疵影像進行強化,藉此強化瑕疵影像中的瑕疵特徵。Wherein, the
該複檢攝影機移動載台232係用以依據該手動操作裝置24所輸入的控制指令移動該攝影機本體24至對應的位置,藉以拍攝待測物H的瑕疵。該複檢攝影機移動載台232於一較佳實施例中,可以為一XY載台(或XYZ載台),透過對應的控制指令將待測物進行X方向上或Y方向上的移動。除了XY載台外,亦不排除可以使用多軸機械手臂或其他類似的裝置用以移動複檢攝影機至對應的位置,於本發明中不予以限制。The re-inspection
該手動操作裝置24連接至該複檢攝影機23,控制該複檢攝影機23的操作。該手動操作裝置24例如可以為鍵盤、按鈕、或是其他類此的人機介面,該手動操作裝置24係包括有一電控裝置, 該電控裝置依據輸入的指令輸出控制訊號至該複檢攝影機移動載台232,以操作該攝影機本體231移動至該瑕疵位置。The
該顯示裝置25用以呈現該複檢攝影機23拍攝的該瑕疵位置影像,以供目視檢查。具體而言,該顯示裝置例如可以為液晶顯示器(Liquid Crystal Display,LCD)、有機發光二極體顯示器(Organic Light Emitting Diode display,OLED display)、電泳顯示器(Electro-Phoretic Display,EPD)、電漿顯示器(Plasma Display Panel,PDP)等用於呈現影像資訊的顯示裝置,於本發明中不予以限制。The
所述的共生式複檢系統30配合該複檢設備20設置,用以執行全自動化影像檢測功能。該共生式複檢系統30主要包括一自動操作裝置31、一影像側錄裝置32、以及一影像檢測裝置33。The
該自動操作裝置31連接或耦接至該自動光學檢測設備10或該複檢設備20的主機系統以取得該待測物H的瑕疵位置資訊,輸出一操作指令至該複檢設備10,使該複檢設備20的複檢攝影機23,移動至該待測物H的瑕疵位置上方,並拍攝一瑕疵位置影像。請一併參閱「圖4」,係為自動操作裝置的工作示意圖,如圖所示:當待測物H被移動至該檢測平台22時,該自動操作裝置31經由接收到的瑕疵位置資訊(例如座標)輸出一操作指示至該手動操作裝置24,在此所述的操作指示可以透過機械控制的方式輸入至該手動操作裝置24、或是透過電控方式輸入至該手動操作裝置24,於本發明中不予以限制。The
該手動操作裝置24於接收到操作指示後,係經由複檢攝影機移動載台232將攝影機本體231經由平面方向移動至對應的座標位置(X1
, Y1
),藉此拍攝待測物的影像,於此實施例中適合針對平面待測物進行檢測。於另一可行的實施例中,於進行多面物體影像的檢測,複檢攝影機移動載台232則可以透過多軸機械臂實施,透過輸入的三維座標(X1
, Y1
, Z1
)控制該多軸機械臂動作,藉此將攝影機本體231移動至對應的三維座標位置。After receiving the operation instruction, the
以下針對該自動操作裝置31兩種不同實施例進行說明,請先參閱「圖5」,係為本發明中自動操作裝置第一實施例的使用狀態示意圖,如圖所示:The following describes two different embodiments of the
在機械接觸的其中一可行的實施例中,請參閱「圖5」,該自動操作裝置31包括一機械控制裝置31A,連接至該手動操作裝置24,該機械控制裝置31A以機械方式(例如直接設置於鍵盤上的頂針、或壓鈕)輸入該操作指令至該手動操作裝置24,使該複檢攝影機23移動至該待測物H的瑕疵位置上方,並拍攝該瑕疵位置。In one possible embodiment of mechanical contact, please refer to "Figure 5". The
其中該手動操作裝置24的實體按鍵、虛擬按鍵分布可以直接預存於該機械控制裝置31A的控制器311A或配合該控制器311A設置的儲存單元內,該控制器311A於接收到瑕疵位置資訊時,係依據所接收到的瑕疵座標控制機械單元312A的動作,以鍵入對應的指令。於一具體實施態樣中,該機械控制裝置31A可以為一壓鈕裝置,安裝於該手動操作裝置24的操作介面上。該壓鈕裝置包括一或複數個按壓單元、驅動該按壓單元動作的驅動單元、以及一連接至該驅動單元以輸出控制指令的控制器。該驅動單元於接收到該控制器指令後驅動該按壓單元按壓操作介面上對應的按鈕,以操作該複檢攝影機移動至該瑕疵位置。The physical buttons and virtual button distributions of the
於另一實施例中,請參閱「圖6」,係為本發明中自動操作裝置第二實施例的使用狀態示意圖,如圖所示:In another embodiment, please refer to "Figure 6", which is a schematic diagram of the operating state of the second embodiment of the automatic operating device in the present invention, as shown in the figure:
在電控方式的其中一可行的實施例中,請參閱「圖6」,該自動操作裝置31包括一電控裝置31B,訊號連接至該手動控制裝置24,以電控方式輸入該操作指令至該手動操作裝置24,以操作該複檢攝影機23至該待測物的瑕疵位置上方,並拍攝該瑕疵位置。具體而言,該電控裝置31B係直接連接至該手動操作裝置24的控制電路板,以直接由電訊號操作該複檢攝影機23。In one of the feasible embodiments of the electronic control method, please refer to "Figure 6". The
上述的方式僅為自動操作裝置31具體用以操作複檢攝影機的其中幾種實施方式,除上述的方式外,亦可以透過其他方式例如直接連接至複檢攝影機移動載台232以操作攝影機本體231的位置,上述方式於本發明中不予以限制。The above-mentioned methods are only a few of the implementations of the
於複檢攝影機23移動至該待測物H的瑕疵位置時,該複檢攝影機23將依據自動操作裝置31的指令自動對該待測物H進行取像,所拍攝到的影像將轉移至該複檢設備20的顯示裝置25顯示。該影像側錄裝置32設置於該複檢設備20,自該複檢設備20上的一顯示裝置25上,獲取該瑕疵位置影像。於一可行實施例中,該影像側錄裝置22可以經由訊號連接的方式連接至該複檢攝影機23獲取所拍攝到的瑕疵位置影像;於另一可行實施例中,亦可以經由顯示器23的接收端擷取顯示器的影像獲得瑕疵位置影像;於另一可行的實施例中,則可以透過攝影機拍攝顯示裝置25的影像,以獲取該瑕疵位置影像,於本發明中不予以限制。When the
以下針對該影像側錄裝置22兩種不同實施例進行說明,請先參閱「圖7」,係為本發明中影像側錄裝置第一實施例的使用狀態示意圖,如圖所示:The following describes two different embodiments of the
於本實施例中,該影像側錄裝置32包括一外部攝影機32A,朝向該顯示裝置25拍攝,以獲取該顯示裝置25所呈現的該瑕疵位置影像。於本實施例中,該外部攝影機32A可以直接在預先調校時對準至該顯示器23上瑕疵影像的位置,或是透過影像追縱的方式由影像中擷取出瑕疵位置影像,於本發明中不予以限制。In this embodiment, the
於另一可行的實施例中,請先參閱「圖8」,係為本發明中影像側錄裝置第二實施例的使用狀態示意圖,如圖所示:In another feasible embodiment, please refer to "Figure 8" first, which is a schematic diagram of the use state of the second embodiment of the image recording device in the present invention, as shown in the figure:
該影像側錄裝置32包括一影像截圖裝置32B,訊號耦合至該顯示裝置25,以獲取該顯示裝置25所呈現的該瑕疵位置影像。具體而言,該影像截圖裝置32B可以經由訊號連接至該複檢設備20中顯示該瑕疵影像的顯示裝置25,由輸入該顯示裝置25的影像中將瑕疵影像截圖以獲取該複檢攝影機23所拍攝到的瑕疵位置影像。在此所提到的連接方式可以是透過分接器直接由輸入至該顯示裝置25的接頭分接訊號、或是直接連接至該顯示裝置25的主板以獲取訊號等,於本發明中不予以限制。The
於一可行的實施例中,該影像截圖裝置32B可以依據預設定的範圍對輸入至該顯示裝置25的顯示畫面進行截圖,例如直接依據預設定的像素座標決定截圖的範圍。 於另一可行的實施例中,可以透過影像中的顯著邊界獲取顯示畫面可能是瑕疵影像的候選影像,並對候選影像中透過影像辨識選出瑕疵位置影像,並記錄像素座標以便進行持續的追蹤。In a feasible embodiment, the
上述的方式僅為影像側錄裝置32具體用以獲取瑕疵影像的其中幾種實施方式,除上述的方式外,亦可以透過連接或耦接至設置於該複檢攝影機23及顯示裝置25之間的任意一站點截取瑕疵影像,上述方式於本發明中不予以限制。The above-mentioned methods are only a few of the specific implementations for the
以下請一併參閱「圖9」,係為本發明影像檢測裝置的方塊示意圖,如圖所示:Please also refer to "Figure 9" below, which is a block diagram of the image detection device of the present invention, as shown in the figure:
該影像檢測裝置33耦合至該影像側錄裝置32,根據該顯示裝置25上的該瑕疵位置影像,產生一影像複檢結果。具體而言,該影像檢測裝置33可以是電腦主機,包括處理器331以及連接於該處理器331的儲存單元332。在本實施例中,處理器331以及儲存單元332可共同構成一電腦或處理器,例如是個人電腦、工作站、主機電腦或其他型式之電腦或處理器,在此並不限制其種類。The
在本實施例中,處理器可耦接於儲存單元。處理器例如是中央處理器(Central Processing Unit, CPU),或是其他可程式化之一般用途或特殊用途的微處理器(Microprocessor)、數位訊號處理器(Digital Signal Processor, DSP)、可程式化控制器、特殊應用積體電路(Application Specific Integrated Circuits, ASIC)、可程式化邏輯裝置(Programmable Logic Device, PLD)或其他類似裝置或這些裝置的組合。In this embodiment, the processor may be coupled to the storage unit. The processor is, for example, a central processing unit (CPU), or other programmable general-purpose or special-purpose microprocessors (Microprocessor), digital signal processor (DSP), programmable Controller, Application Specific Integrated Circuits (ASIC), Programmable Logic Device (PLD) or other similar devices or a combination of these devices.
於一可行的實施例中,該影像檢測裝置33包括一瑕疵複檢模組33A,根據該顯示裝置25上的該瑕疵位置影像,判斷該待測物H是否為缺陷。於另一可行的實施態樣中,該影像檢測裝置33更可以包括一類別複檢模組33B,根據該顯示裝置25上的該瑕疵位置影像,分類該待測物H的缺陷類型。具體而言,該影像檢測裝置33可以透過一般影像處理方式(例如高斯、傅立葉、二值化、影像相減、型態分析)、或是透過機器學習、深度學習等利用類神經網絡對瑕疵位置影像進行判定該瑕疵位置影像是否確為缺陷、或是缺陷的種類。In a feasible embodiment, the
最終該影像檢測裝置33係將該自動光學檢測設備檢測結果所得的瑕疵種類與該影像分析結果進行比對,以輸出一複檢結果,藉此經由該複檢結果確認瑕疵判斷的正確性,以減少誤宰(Overkill)的情事。Finally, the
以下針對本發明利用共生式自動檢測設備的自動複檢方法進行詳細的說明,請一併參閱「圖10」,係為本發明共生式複檢方法的流程示意圖,如圖所示:The following is a detailed description of the automatic re-inspection method of the present invention using the symbiosis-type automatic inspection equipment, please refer to "Figure 10", which is a schematic flow diagram of the symbiosis-type re-inspection method of the present invention, as shown in the figure:
本實施例係提供一種共生式複檢方法,用以配合一複檢設備實施,所述的方法依據以下的步驟執行,以經由全自動化控制偵測待測物的瑕疵。This embodiment provides a symbiotic re-inspection method for implementation in cooperation with a re-inspection device. The method is executed according to the following steps to detect defects of the object under test through fully automated control.
首先,待測物H經由自動光學檢測設備10檢測完後,移載至檢測平台22上,以依據自動光學檢測設備10的檢測結果對待測物H的瑕疵進行複檢(步驟S01)。First, after the test object H is inspected by the automatic
接續,根據待測物H的瑕疵位置資訊,利用自動操作裝置31輸出一操作指令至該複檢設備20,使該複檢攝影機23移動至該待測物H的瑕疵位置上,並拍攝一瑕疵位置影像(步驟S02)。於一可行的實施例中,該複檢攝影機23可以透過該複檢設備20的手動操作裝置24,操作該複檢攝影機23移動至該瑕疵位置上方,並拍攝該瑕疵位置。該複檢設備可以從自動光學檢測設備10,接收該待測物H及該瑕疵位置資訊。Next, according to the defect position information of the object H to be tested, the
自該複檢設備20上的顯示裝置25上,獲取該瑕疵位置影像(步驟S03)。步驟S03可以包括利用外部攝影機32A朝向該顯示裝置25拍攝,以獲取該顯示裝置25所呈現的該瑕疵位置影像;或是於另一可行的實施例中,可以經由影像截圖裝置32B對該顯示裝置25進行截圖,以獲取該顯示裝置25所呈現的該瑕疵位置影像,於本發明中不予以限制。The defect location image is obtained from the
最終,影像檢測該顯示裝置上的該瑕疵位置影像,產生一影像複檢結果(步驟S04)。影像檢測的過程可以經由電腦裝置及影像處理軟體進行分析,根據該顯示裝置上的該瑕疵位置影像,分類該待測物的缺陷類型,以產生該複檢結果,或是根據該顯示裝置上的該瑕疵位置影像,判斷該待測物是否為缺陷,以產生該複檢結果。Finally, the image detects the defect location image on the display device to generate an image recheck result (step S04). The image inspection process can be analyzed by computer equipment and image processing software. According to the defect position image on the display device, the defect type of the object to be tested can be classified to generate the re-inspection result, or according to the display device The defect location image is used to determine whether the object to be tested is a defect, so as to generate the re-inspection result.
於獲得該影像複檢結果後,人員可以再根據該影像複檢結果,於該顯示裝置上,對該待測物位置影像進行目視檢查,最終在執行一次人檢(步驟S05),此步驟視需求可以省略,於本發明中不予以限制。After obtaining the result of the image re-examination, the personnel can perform a visual inspection of the position image of the object to be measured on the display device according to the result of the image re-examination, and finally perform a human inspection (step S05). The requirements can be omitted and are not limited in the present invention.
綜上所述,本發明可以改善傳統程序需要大量人工執行複檢的缺失,尤其是可以解決檢測軟體能力不足或是製程變更時所造成大量過檢、誤判時所產生人力負荷過重的問題,透過本發明可以提升複檢設備的檢測效率及精確度,並可以大幅縮減人員的工作負擔。此外,本發明可以適用於各式複檢設備,增加產品的可擴充性及實用性,透過外加軟硬體或程序,有效的將傳統複檢中最耗費人力的工作予以自動化,達到大幅降低人力的目的。In summary, the present invention can improve the lack of traditional procedures that require a large amount of manual re-inspection, in particular, it can solve the problem of insufficient detection software capabilities or a large number of over-inspections and misjudgments caused by changes in the manufacturing process. The invention can improve the detection efficiency and accuracy of the re-inspection equipment, and can greatly reduce the workload of personnel. In addition, the present invention can be applied to various re-inspection equipment to increase the scalability and practicability of the product. By adding software, hardware or programs, the most labor-intensive tasks in traditional re-inspection can be effectively automated, and manpower can be greatly reduced. the goal of.
以上已將本發明做一詳細說明,惟以上所述者,僅惟本發明之一較佳實施例而已,當不能以此限定本發明實施之範圍,即凡依本發明申請專利範圍所作之均等變化與修飾,皆應仍屬本發明之專利涵蓋範圍內。The present invention has been described in detail above, but what has been described above is only a preferred embodiment of the present invention. It should not be used to limit the scope of implementation of the present invention, that is, everything made in accordance with the scope of the patent application of the present invention is equal Changes and modifications should still fall within the scope of the patent of the present invention.
10:自動光學檢測設備
20:複檢設備
21:移載裝置
22:檢測平台
23:複檢攝影機
231:攝影機本體
232:複檢攝影機移動載台
24:手動操作裝置
25:顯示裝置
30:共生式複檢系統
31:自動操作裝置
31A:機械控制裝置
311A:控制器
312A:機械單元
31B:電控裝置
32:影像側錄裝置
32A:外部攝影機
32B:影像截圖裝置
33:影像檢測裝置
331:處理器
332:儲存單元
33B:類別複檢模組
H:待測物10: Automatic optical inspection equipment
20: Re-inspection equipment
21: Transfer device
22: Detection platform
23: Recheck the camera
231: Camera body
232: Recheck the camera mobile stage
24: Manual operation device
25: display device
30: Symbiosis recheck system
31:
圖1,為本發明共生式複檢系統應用於複檢設備的方塊示意圖(一)。Figure 1 is a block diagram (1) of the symbiosis re-inspection system of the present invention applied to the re-inspection equipment.
圖2,為本發明共生式複檢系統應用於複檢設備的方塊示意圖(二)。Figure 2 is a block diagram (2) of the symbiosis re-inspection system of the present invention applied to the re-inspection equipment.
圖3,為本發明中複檢設備的外觀示意圖。Figure 3 is a schematic diagram of the appearance of the re-inspection equipment in the present invention.
圖4,為本發明中自動操作裝置的工作示意圖。Figure 4 is a schematic diagram of the operation of the automatic operating device in the present invention.
圖5,為本發明中自動操作裝置第一實施例的使用狀態示意圖。Fig. 5 is a schematic diagram of the use state of the first embodiment of the automatic operating device in the present invention.
圖 6,為本發明中自動操作裝置第二實施例的使用狀態示意圖。Fig. 6 is a schematic diagram of the use state of the second embodiment of the automatic operating device in the present invention.
圖7,為本發明中影像側錄裝置第一實施例的使用狀態示意圖。FIG. 7 is a schematic diagram of the use state of the first embodiment of the video recording device in the present invention.
圖8,為本發明中影像側錄裝置第二實施例的使用狀態示意圖。FIG. 8 is a schematic diagram of the use state of the second embodiment of the video recording device in the present invention.
圖9,為本發明影像檢測裝置的方塊示意圖。Fig. 9 is a block diagram of the image detection device of the present invention.
圖10,為本發明共生式複檢方法的流程示意圖。Figure 10 is a schematic flow chart of the symbiosis re-examination method of the present invention.
10:自動光學檢測設備10: Automatic optical inspection equipment
20:複檢設備20: Re-inspection equipment
30:共生式複檢系統30: Symbiosis recheck system
Claims (18)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109108458A TW202134634A (en) | 2020-03-13 | 2020-03-13 | Attached re-inspection system, and attached re-inspection method |
CN202110054972.9A CN113390877A (en) | 2020-03-13 | 2021-01-15 | Symbiotic reinspection system and symbiotic reinspection method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109108458A TW202134634A (en) | 2020-03-13 | 2020-03-13 | Attached re-inspection system, and attached re-inspection method |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202134634A true TW202134634A (en) | 2021-09-16 |
Family
ID=77616738
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109108458A TW202134634A (en) | 2020-03-13 | 2020-03-13 | Attached re-inspection system, and attached re-inspection method |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN113390877A (en) |
TW (1) | TW202134634A (en) |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11230917A (en) * | 1998-02-12 | 1999-08-27 | Nikon Corp | Defect inspection apparatus |
JP4432011B2 (en) * | 2000-03-06 | 2010-03-17 | 東レ株式会社 | Apparatus and method for inspecting plasma display panel back plate |
JP4189307B2 (en) * | 2003-12-05 | 2008-12-03 | 新日本製鐵株式会社 | Inspection method of surface flaws on billets |
US8290239B2 (en) * | 2005-10-21 | 2012-10-16 | Orbotech Ltd. | Automatic repair of electric circuits |
JP2007265679A (en) * | 2006-03-27 | 2007-10-11 | Hitachi Kokusai Electric Inc | Phosphor inspection device |
JP2008033306A (en) * | 2006-07-03 | 2008-02-14 | Olympus Corp | Defect correcting device |
JP4970901B2 (en) * | 2006-10-30 | 2012-07-11 | 株式会社メガトレード | Computer program for operating visual inspection device and review machine for visual inspection device |
JP2016070725A (en) * | 2014-09-29 | 2016-05-09 | 大日本印刷株式会社 | Inspection system and method for circuit board, etc., and program |
TWI669519B (en) * | 2018-01-05 | 2019-08-21 | 財團法人工業技術研究院 | Board defect filtering method and device thereof and computer-readabel recording medium |
-
2020
- 2020-03-13 TW TW109108458A patent/TW202134634A/en unknown
-
2021
- 2021-01-15 CN CN202110054972.9A patent/CN113390877A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
CN113390877A (en) | 2021-09-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI689875B (en) | Defect inspection and classification apparatus and training apparatus using deep learning system | |
TWI757825B (en) | System and method for pcb inspection based on false defect detection | |
TWI787296B (en) | Optical inspection method, optical inspection device and optical inspection system | |
US11947345B2 (en) | System and method for intelligently monitoring a production line | |
KR20180095972A (en) | High-speed automated optical inspection apparatus supporting double scan approach | |
TWI502186B (en) | A bright spot detection device for filtering foreign matter noise and its method | |
CN109557098A (en) | Metal surface detection system based on machine vision | |
CN112763496A (en) | Mobile phone battery surface defect detection device and detection method thereof | |
TW202134634A (en) | Attached re-inspection system, and attached re-inspection method | |
JP4523310B2 (en) | Foreign matter identification method and foreign matter identification device | |
Du et al. | An automated optical inspection (AOI) platform for three-dimensional (3D) defects detection on glass micro-optical components (GMOC) | |
US20180176549A1 (en) | Multi-view-angle image capturing device and multi-view-angle image inspection apparatus using the same | |
CN112033971A (en) | Visual flaw detection system and method | |
WO2021203651A1 (en) | Shell side edge inspection apparatus and shell side edge inspection method for electronic product | |
TW202208831A (en) | Centralized defect reviewing system and method | |
CN105486698A (en) | AOI automatic detection device and detection method | |
CN110133000A (en) | A kind of full microscope visual imaging surface detecting machine | |
TWI662251B (en) | Three-dimensional linear detection method and system | |
TW202144765A (en) | Image recording device and inspect method thereof | |
Chen et al. | An automatic optical system for micro-defects inspection on 5 surfaces of a chip | |
TWI705242B (en) | Optical testing equipment and testing method thereof | |
Wibowo et al. | Development and implementation of novel six-sided automated optical inspection for metallic objects | |
TW202144760A (en) | Automatic pressing device | |
CN210803301U (en) | Optical defect detection system | |
JP4302028B2 (en) | Inspection apparatus and method for transparent electrode film substrate, and program |