TW202132738A - Substrate heating device and substrate treating system which can suppress the adhesion of the sublimate to a top surface of a chamber and a substrate heating part - Google Patents

Abstract

The subject of this invention is to suppress the adhesion of the sublimate to a top surface of a chamber and a substrate heating part. A substrate heating device comprises a chamber in which a receiving space capable of receiving a substrate is formed; a substrate heating part disposed on one side of the substrate and using infrared rays to heat the substrate; and a plurality of shield plates disposed between the substrate and the substrate heating part for allowing the infrared rays to pass through and shield the sublimate when the substrate is heated.

Description

Substrate heating device and substrate processing system

The present invention relates to a substrate heating device and a substrate processing system.

Conventionally, there is an apparatus equipped with an infrared heater that irradiates infrared rays to the coating film applied on the upper surface of the sheet (for example, refer to Patent Document 1). For example, an infrared heater is hung on a frame installed in a space in a house. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] International Publication No. 2017/169784 Patent Gazette

[The problem to be solved by the invention]

However, in the case where the sublimation during heating adheres to the ceiling of the house or the infrared heater, the sublimation is likely to fall to the coating film.

In view of the above-mentioned circumstances, an object of the present invention is to provide a substrate heating device and a substrate processing system that can suppress the adhesion of sublimates to the ceiling surface of the chamber and the substrate heating section. [Means to solve the problem]

The substrate heating device according to one aspect of the present invention includes: a chamber in which a receiving space capable of accommodating a substrate is formed; and a substrate heating part, which is arranged on one side of the substrate, and can use infrared rays to The substrate is heated; and a plurality of shielding plates are provided between the substrate and the substrate heating portion to allow the infrared rays to pass through and block the sublimation when the substrate is heated. According to this configuration, by providing the shielding plate between the substrate and the substrate heating section, the shielding plate can shield the sublimation from the substrate toward the ceiling surface of the chamber and the substrate heating section. Therefore, it is possible to suppress adhesion of the sublimate to the ceiling surface of the chamber and the substrate heating portion. In addition, by suppressing the adhesion of the sublimate to the ceiling surface of the chamber, it is possible to save the time and effort of removing the substrate heating unit and the like in order to clean the ceiling surface of the chamber. Furthermore, by providing a plurality of shielding plates, it is easier to replace the shielding plate compared to a case where a single shielding plate (for example, a large-sized shielding plate of G6 size) is provided, and therefore, the maintainability is excellent. In addition, by suppressing the adhesion of the sublimated product to the ceiling surface of the chamber and the substrate heating portion, it is possible to suppress the sublimation product from directly falling onto the substrate. Even in the case where it is assumed that the sublimate adheres to the ceiling surface of the chamber or the substrate heating section, by providing a plurality of shielding plates between the substrate and the substrate heating section, it is possible to prevent the sublimate from directly falling onto the substrate.

In the above-mentioned substrate heating device, the shielding plate may extend so as to cross the irradiation direction of the infrared rays. According to this configuration, it is possible to suppress the loss caused by the transmission of infrared rays through the shielding plate as much as possible.

In the substrate heating device described above, the shielding plate may be curved in an arc shape when viewed from the longitudinal direction of the shielding plate. According to this structure, the rigidity of the shielding plate can be improved compared with the case where the shielding plate has a rectangular plate shape. In addition, when the shielding plate is supported by a plurality of straddling members, the number of straddling members can be reduced as much as possible.

In the substrate heating device described above, the shielding plate may be curved so as to be convex toward the substrate heating portion. According to this configuration, since the flow of the sublimate can be produced in the curved portion of the shielding plate in the longitudinal direction of the shielding plate, it is possible to more effectively suppress the adhesion of the sublimate to the ceiling surface of the chamber and the substrate heating section. In addition, when the sublimation is attached to the curved portion of the shielding plate, it is easy to remove the sublimation, and therefore, it is excellent in maintainability. Furthermore, even if there is a gap between two adjacent shielding plates, it is difficult for the sublimate to leak from the gap.

In the above-mentioned substrate heating device, the shielding plate includes a first end surface formed at one end of the shielding plate in the short-side direction, and a second end surface formed at the other end of the shielding plate in the short-side direction, and the first end surface And the said 2nd end surface may be arrange|positioned so that it may mutually orthogonally cross when it sees from the said longitudinal direction of the said shielding board. According to this configuration, since infrared rays can be diffused from the substrate heating portion toward the substrate by the first end surface and the second end surface, the entire substrate can be heated.

In the above-mentioned substrate heating device, a gap may be provided between the two adjacent shielding plates. According to this configuration, compared with the case where two adjacent shielding plates are in contact with each other, shadows are less likely to be generated, and therefore, uneven heating of the substrate can be suppressed.

In the above-mentioned substrate heating device, a plurality of straddling members are further provided, which are provided between the substrate and the substrate heating portion and extend so as to cross the irradiation direction of the infrared rays; the shielding plate may also be supported on the Multiple span members. According to this configuration, the shielding plate can be stably supported by the plurality of straddling members.

In the above-mentioned substrate heating device, the shielding plate extends so as to intersect with the longitudinal direction of the transverse member, and the plurality of transverse members may be a first transverse member provided at one end of the longitudinal direction of the shielding plate. A member, and a second spanning member provided at the other end of the shielding plate in the longitudinal direction. According to this structure, since the both ends of the longitudinal direction of the shielding plate are supported by the 1st span member and the 2nd spanning member, the shielding board can be supported more stably. In addition, in the case of supporting only both ends of the shielding plate in the longitudinal direction, compared with the case where the center portion of the shielding plate in the longitudinal direction is supported by a cross member, it is possible to suppress uneven heating of the substrate due to the generation of shadows. .

In the above-mentioned substrate heating device, a solution for forming polyimide may be applied to one surface of the substrate. According to this configuration, when polyimide is formed, it is possible to suppress the adhesion of the sublimated product to the ceiling surface of the chamber and the substrate heating portion.

One aspect of the substrate processing system of the present invention is characterized by including the above-mentioned substrate heating device. According to this configuration, in the substrate processing system, it is possible to suppress the adhesion of the sublimated product to the ceiling surface of the chamber and the substrate heating unit. [Effects of the invention]

According to the present invention, it is possible to provide a substrate heating device and a substrate processing system that can suppress the adhesion of sublimates to the ceiling surface of the chamber and the substrate heating portion.

Hereinafter, referring to the drawings, embodiments of the present invention will be described. In the following description, an XYZ rectangular coordinate system is set, and the positional relationship of each member is described while referring to the XYZ rectangular coordinate system. The predetermined direction in the horizontal plane is the X direction, the direction orthogonal to the X direction in the horizontal plane is the Y direction, and the directions (that is, the vertical direction) orthogonal to the X direction and the Y direction are respectively the Z direction.

＜Substrate heating device＞ FIG. 1 is a perspective view of a substrate heating device 1 according to the embodiment. As shown in FIG. 1, the substrate heating device 1 includes a chamber 2, a pressure adjustment unit 3, a gas supply unit 4, a heater unit 6 (substrate heating unit), a base plate 7, a temperature detection unit 9, a pressure detection unit 14, and gas The liquefaction recovery part 11, the cooling part 17 (see FIG. 2 ), the heat shielding part 30, the shielding part 40, the shielding support part 50 and the control part 15. The control unit 15 overall controls the constituent elements of the substrate heating device 1. In addition, the chamber 2 is shown by a double-dot chain line in FIG. 1.

＜Chamber＞ A housing space 2S capable of housing the substrate 10 is formed inside the chamber 2. The substrate 10 and the heater unit 6 are housed in a common chamber 2. The chamber 2 is formed in a rectangular parallelepiped box shape.

As shown in Fig. 2, the chamber 2 has a split structure that can be separated up and down. The chamber 2 includes an upper structure 21 formed in a box shape opened below, a lower structure 22 formed in a box shape opened above, and a connecting portion 23 that detachably connects the upper structure 21 and the lower structure 22 .

The upper structure 21 includes a rectangular plate-shaped top plate 25 and a rectangular frame-shaped upper peripheral wall 26 in contact with the outer peripheral edge of the top plate 25. The lower structure 22 includes a rectangular plate-shaped bottom plate 27 opposed to the top plate 25 and a rectangular frame-shaped lower peripheral wall 28 in contact with the outer peripheral edge of the bottom plate 27. A valve 29 for supplying inert gas into the chamber 2 is provided on the lower peripheral wall 28.

For example, if the upper structure 21 and the lower structure 22 are disconnected and the upper structure 21 is separated, the lower structure 22 opens upward. In a state where the lower structure 22 is opened upward, the substrate 10 can be carried in and out. After the substrate 10 is carried into the lower structure 22, the upper structure 21 and the lower structure 22 are connected, so that the substrate 10 can be housed in a sealed space. For example, by connecting the upper structure 21 and the lower structure 22 via a sealing member or the like without a gap, the airtightness in the chamber 2 can be improved.

＜Pressure adjustment department＞ The pressure adjusting part 3 can adjust the pressure in the chamber 2. As shown in FIG. 1, the pressure adjusting part 3 includes a vacuum pipe 3 a connected to the chamber 2. The vacuum duct 3a is a cylindrical duct extending in the Z direction. For example, a plurality of vacuum ducts 3a are arranged at intervals in the X direction. In Fig. 1, only one vacuum pipe 3a is shown. In addition, the number of vacuum ducts 3a to be installed is not limited. The vacuum pipe 3a only needs to be connected to the chamber 2, and the connection location of the vacuum pipe 3a is not limited. In the example of FIG. 2, the vacuum pipeline is provided on the bottom plate 27 of the chamber 2 (the arrow vacuum in FIG. 2 ).

For example, the pressure adjustment unit 3 includes a pressure adjustment mechanism such as a pump mechanism. The pressure adjustment mechanism includes a vacuum pump 13. The vacuum pump 13 is connected to a pipeline that extends from a portion (lower end) on the opposite side to the connection portion (upper end) of the chamber 2 in the vacuum pipe 3a.

The pressure adjustment part 3 can adjust the pressure of the ambient gas in the housing space 2S of the substrate 10 coated with a solution for forming a polyimide film (polyimide) (hereinafter referred to as "polyimide formation Liquid"). For example, the polyimide formation liquid contains polyimide acid or polyimide powder. The polyimide forming liquid is applied only on the first surface 10a (upper surface) of the substrate 10 having a rectangular plate shape. In addition, the coating material (object to be processed) applied to the substrate 10 is not limited to the solution for forming polyimide, as long as it is a solution for forming a predetermined film on the substrate 10.

In addition, although the pressure adjusting part 3 can adjust the pressure of the ambient gas in the containing space 2S, it may also be provided in the pressure adjusting part 3 to supply nitrogen (N ₂ ), helium (He), and argon to the containing space 2S. (Ar) and other inert gas mechanisms (hereinafter also referred to as "inert gas supply mechanism"). Thereby, the storage space 2S can be adjusted to a desired pressure condition. In addition, like the gas supply unit 4 described later, an inert gas supply mechanism separate from the pressure adjustment unit 3 may be provided.

＜Gas supply department＞ The gas supply part 4 can adjust the state of the internal atmosphere of the chamber 2. The gas supply part 4 includes a gas supply pipe 4 a connected to the chamber 2. The gas supply pipe 4a is a cylindrical pipe extending in the Z direction. For example, a plurality of gas supply pipes 4a are arranged at intervals in the X direction. In FIG. 1, only one gas supply pipe 4a is shown. In addition, the installation number of the gas supply pipe 4a is not limited. The vacuum pipe 3a only needs to be connected to the chamber 2, and the connection location of the gas supply pipe 4a is not limited.

The gas supply part 4 can adjust the state of the storage space 2S by supplying inert gas to the storage space 2S. The gas supply unit 4 supplies _{inert gases such as nitrogen (N 2} ), helium (He), and argon (Ar) into the chamber 2. _{In the example of FIG. 2, two N 2} supply parts (arrow N _{2 in} FIG. 2) are respectively provided on the ceiling 25 and the lower peripheral wall 28 of the chamber 2. In addition, the gas supply unit 4 may use the gas for cooling the substrate by supplying gas when the temperature of the substrate is lowered.

The gas supply unit 4 can adjust the state of the storage space 2S by supplying compressed dry air (CDA) to the storage space 2S. In the example of FIG. 2, two CDA supply units (arrow CDA in FIG. 2) are respectively provided on the top plate 25 and the bottom plate 27 of the chamber. For example, the gas supply unit 4 may include a dust filter for removing fine dust in the gas passing through the gas supply pipe 4a and a mist filter for removing moisture.

The gas supply unit 4 can be used to adjust the oxygen concentration of the internal ambient gas of the chamber 2. The oxygen concentration (quality standard) of the internal atmosphere of the chamber 2 is preferably as low as possible. Specifically, it is preferable that the oxygen concentration of the internal atmosphere of the chamber 2 be 100 ppm or less, and more preferably 20 ppm or less. For example, in the ambient gas when curing the polyimide forming liquid applied to the substrate 10, it is possible to easily cure the polyimide forming liquid by making the oxygen concentration below the preferred upper limit in this manner. In addition, the arrow EXH in FIG. 2 shows an exhaust line provided on the lower peripheral wall 28 for exhausting the gas in the chamber 2 to the outside of the chamber 2.

＜Heater unit＞ As shown in FIG. 1, the heater unit 6 is arranged above the inside of the chamber 2. As shown in FIG. 2, the heater unit 6 is supported on the top plate 25. A support member 19 supporting the heater unit 6 is provided between the heater unit 6 and the top plate 25. The heater unit 6 is fixed at a fixed position near the top plate 25 in the chamber 2. The infrared heater 140 of the heater unit 6 is suspended from the top plate 25 by the support member 19.

FIG. 3 is a plan view of the heater unit 6 according to the embodiment. FIG. 4 is a plan view of the infrared heater 140 according to the embodiment. As shown in FIG. 3, the heater unit 6 includes a plurality of (for example, 20 in this embodiment) infrared heaters 140. The plurality of infrared heaters 140 can be individually controlled. The control unit 15 (see FIG. 1) can individually control a plurality of infrared heaters 140.

As shown in FIG. 1, the infrared heater 140 can use infrared rays to heat the substrate 10. The infrared heater 140 can heat the substrate 10 in stages. For example, the heating temperature range of the substrate 10 is a range of 200° C. or more and 600° C. or less. The infrared heater 140 is arranged on the first surface 10 a (one surface) side of the substrate 10. The infrared heater 140 is arranged on the ceiling 25 side of the chamber 2.

For example, the peak wavelength range of the infrared heater 140 is a range of 1.5 μm or more and 4 μm or less. In addition, the peak wavelength range of the infrared heater 140 is not limited to the above-mentioned range, and can be set to various ranges according to required specifications.

As shown in FIG. 4, the infrared heater 140 has a tube shape bent at a plurality of places. The outer shape of the infrared heater 140 has a rectangular shape in a plan view. For example, the length of each side of the infrared heater 140 is about 250 mm. For example, the infrared heater 140 is formed of a quartz tube.

The infrared heater 140 includes a straight side part group 141, a curled side part group 142, a first cover part 143, a second cover part 144, a first introduction part 145, and a second introduction part 146.

The straight side portion group 141 includes a plurality of (for example, 9 in this embodiment) straight side portions 141a to 141i. The straight side portions 141a to 141i have a straight tube shape having a long side in the first direction V1. A plurality of straight side portions 141a to 141i are arranged side by side in a second direction V2 orthogonal (crossing) to the first direction V1. The plurality of straight side portions 141a to 141i are arranged at substantially the same interval U1 (the pitch between the central axes) in the second direction V2. The straight side portions 141a, 141b, 141c, 141d, 141e, 141f, 141g, 141h, 141i are arranged in this order from one side to the other side in the second direction V2.

The curled part group 142 includes a plurality of (for example, eight in this embodiment) curled parts 142a to 142h. The crimping portions 142a to 142h are bent so as to protrude outward. The curled portions 142a to 142h connect the ends of two adjacent straight side portions 141a to 141i. For example, the crimping portion 142a connects one end of the straight side portion 141a to one end of the straight side portion 141b. That is, the crimped portions 142a to 142h are bent portions that bend so as to connect the ends of the two adjacent straight side portions 141a to 141i in the infrared heater 140. In a plan view, the crimping portions 142a to 142h have a U-shaped tubular shape that protrudes outward. The curled portions 142a, 142b, 142c, 142d, 142e, 142f, 142g, and 142h are arranged in this order from one side in the second direction V2 to the other side.

The first cover portion 143 and the second cover portion 144 extend linearly in the second direction V2 so as to cover the plurality of curled portions 142a to 142h from the outside. The first cover portion 143 covers the four curled portions 142b, 142d, 142f, and 142h from one side in the first direction V1. The second cover portion 144 covers the four curled portions 142a, 142c, 142e, and 142g from the other side in the first direction V1.

The first cover portion 143 is connected to one end portion of the straight side portion 141a on one side in the second direction V2. The first cover portion 143 has a straight tube shape having a long side in the second direction V2. The size of the interval U2 (the interval between the central axis) between the first cover portion 143 and the curled edge portions 142b, 142d, 142f, 142h and the size of the interval U1 between the two adjacent straight side portions 141a to 141i are substantially Same as above.

The second cover portion 144 is connected to one end portion of the straight side portion 141i on the other side in the second direction V2. The second cover portion 144 has an L-shaped tubular shape. That is, the second cover portion 144 includes a cover main body 144a having a long side in the second direction V2, and an extension portion 144b connected to one end of the cover main body 144a and having a long side in the first direction V1. The interval U3 (the interval between the central axis) between the second cover portion 144 and the curled edge portions 142a, 142c, 142e, 142g and the interval U1 between the two adjacent straight side portions 141a to 141i are substantially the same size.

The first introduction part 145 is provided at one end of the infrared heater 140. The first introduction part 145 is arranged on one side of the infrared heater 140. Specifically, the first introduction portion 145 is provided at one end of the first cover portion 143. A part of the first introduction part 145 enters the outer shape of the infrared heater 140 in a plan view.

The second introduction part 146 is provided at the other end of the infrared heater 140. The second introduction part 146 is arranged on the other side of one side of the infrared heater 140. The second introduction portion 146 is arranged on the opposite side of the first introduction portion 145 in the second direction V2. Specifically, the second introduction portion 146 is provided at one end of the extension portion 144 b in the second cover portion 144. A part of the second introduction part 146 enters the outer shape of the infrared heater 140 in a plan view.

As shown in FIG. 3, the heater unit 6 is constructed by laying a plurality of (for example, 20 in this embodiment) infrared heaters 140. The heater unit 6 includes a pair of first infrared heater groups 140A and a pair of second infrared heater groups 140B. The first infrared heater group 140A and the second infrared heater group 140B are arranged alternately in the second direction V2.

The first infrared heater group 140A includes a plurality of (for example, five in this embodiment) first infrared heaters 140a1 to 140a5. The pair of first infrared heater groups 140A includes a total of ten first infrared heaters 140a1 to 140a5. The plurality of first infrared heaters 140a1 to 140a5 are laid and arranged in the first direction V1 (one direction). The first infrared heaters 140a1, 140a2, 140a3, 140a4, and 140a5 are arranged in this order from one side to the other side in the first direction V1.

The second infrared heater group 140B includes a plurality of (for example, five in this embodiment) second infrared heaters 140b1 to 140b5. The pair of second infrared heater groups 140B includes a total of ten second infrared heaters 140b1 to 140b5. The plurality of second infrared heaters 140b1 to 140b5 are laid and arranged in the first direction V1. The second infrared heaters 140b1, 140b2, 140b3, 140b4, and 140b5 are arranged in this order from one side in the direction parallel to the first direction V1 to the other side.

The second infrared heaters 140b1 to 140b5 have the same shape as the first infrared heaters 140a1 to 140a5 in a plan view. The second infrared heaters 140b1 to 140b5 have a shape in which the first infrared heaters 140a1 to 140a5 are inverted (rotated by 180 degrees) in a plan view. Specifically, the second infrared heaters 140b1 to 140b5 have a shape in which the first infrared heaters 140a1 to 140a5 are rotated 180 degrees to the right (clockwise) from the center of the first infrared heaters 140a1 to 140a5 in a plan view.

＜Base plate＞ As shown in FIG. 1, the base plate 7 is arranged below the chamber 2. The base plate 7 is arranged on the second surface 10b (lower surface) side of the substrate 10 opposite to the first surface 10a. As shown in FIG. 2, the base plate 7 is arranged on the side of the bottom plate 27 of the chamber 2. The base plate 7 has a rectangular plate shape. The base plate 7 is provided with support pins 8 that support the substrate 10 from below.

The support pin 8 can support the second surface 10 b of the substrate 10. The support pin 8 is a rod-shaped member extending up and down. The end (upper end) of the support pin 8 abuts on the second surface 10 b of the substrate 10. A plurality of support pins 8 are provided at intervals in a direction (X direction and Y direction) parallel to the second surface 10b. The plurality of support pins 8 are respectively formed to have substantially the same length. The ends of the plurality of support pins 8 are arranged in a plane parallel to the second surface 10b (in the XY plane).

＜Temperature detection department＞ The temperature detection unit 9 is arranged in the housing space 2S. The temperature detection unit 9 can detect the temperature of the substrate 10. For example, the temperature detection unit 9 is a thermocouple. The temperature detection part 9 is mounted on the support pin 8. The temperature detection part 9 extends substantially in the horizontal direction. The tip of the temperature detection part 9 is opposed to the second surface 10 b of the substrate 10.

The tip of the temperature detection unit 9 is arranged between the substrate 10 and the base plate 7. The position of the tip of the temperature detection part 9 is closer to the substrate 10 than the base plate 7. The tip of the temperature detection part 9 is close to the second surface 10 b of the substrate 10. The separation distance between the tip of the temperature detection portion 9 and the second surface 10 b of the substrate 10 is substantially the same in each of the plurality of temperature detection portions 9.

A plurality of temperature detection units 9 are arranged at intervals in each of the X direction and the Y direction. In the present embodiment, the temperature detection units 9 are arranged in three rows and three columns (that is, three in the X direction and three in the Y direction), a total of nine. In FIG. 2, three temperature detection units 9 arranged at intervals in the X direction are shown. The temperature detection unit 9 is arranged in a plurality of (for example, 9) sections set on the substrate 10 each. The tip of the temperature detection unit 9 functions as a sensor that detects the temperature of each zone of the substrate 10.

In addition, the number of temperature detection units 9 is not limited to nine. The number of temperature detection parts 9 can be set to any number. For example, it is preferable that the plurality of temperature detection units 9 are arranged at positions corresponding to the respective sections of the substrate 10. In addition, the temperature detection part 9 is not limited to a thermocouple. For example, the temperature detection unit 9 may be a non-contact temperature sensor such as a radiation thermometer. For example, the temperature detection unit 9 is not limited to a non-contact temperature sensor, and may be a contact type temperature sensor.

＜Pressure detection department＞ The pressure detecting unit 14 (refer to FIG. 1) can detect the pressure of the storage space 2S (hereinafter also referred to as "pressure in the chamber"). For example, the main body (sensor) of the pressure detection unit 14 is arranged in the chamber 2. For example, the display unit (pressure indicator) of the pressure detection unit 14 is arranged outside the chamber 2. For example, the pressure detection unit 14 is a digital pressure sensor. In addition, although only one pressure detection unit 14 is illustrated in FIG. 1, the number of pressure detection units 14 is not limited to one, and may be more than one.

＜Gas liquefaction recovery department＞ As shown in FIG. 1, the gas liquefaction recovery part 11 is connected to the pipeline of the pressure adjustment part 3 (vacuum pump 13). The gas liquefaction recovery unit 11 is arranged on the downstream side of the vacuum pump 13 in the pipeline of the pressure adjustment unit 3. The gas liquefaction recovery unit 11 liquefies the gas passing through the vacuum line 3 a, and can recover the solvent volatilized from the polyimide forming liquid coated on the substrate 10.

Assuming that the gas liquefaction recovery unit 11 is arranged in the pipeline of the pressure adjustment unit 3 closer to the upstream side than the vacuum pump 13, the liquid liquefied on the upstream side may be vaporized during the next decompression, and the time to vacuum There may be delays. In contrast, according to the present embodiment, since the gas liquefaction recovery unit 11 is arranged in the pipeline of the pressure adjustment unit 3 closer to the downstream side than the vacuum pump 13, the liquid liquefied on the downstream side will not be vaporized during the next decompression. , So it can avoid the delay of vacuuming time.

＜Cooling part＞ The cooling part 17 can cool the chamber 2. As shown in FIG. 2, the cooling portion 17 includes a refrigerant passage portion 18 which is arranged inside the constituent members of the chamber 2 and allows the passage of refrigerant. For example, the refrigerant is a liquid such as water. In the refrigerant passage portion 18, the refrigerant flows by a pump not shown. Although not shown, a supply port and a discharge port for the refrigerant are provided in the refrigerant passage portion 18. In addition, the refrigerant is not limited to liquids such as water. For example, the refrigerant may be a gas such as air.

A plurality of refrigerant passage parts 18 are provided in the chamber 2. In the example of FIG. 2, the refrigerant passage portion 18 is provided on the top plate 25, the bottom plate 27, and the lower peripheral wall 28 (valve 29) of the chamber 2, respectively. Thereby, the respective temperatures of the top plate 25, the bottom plate 27, and the lower peripheral wall 28 (valve 29) of the chamber 2 can be kept constant. In addition, the refrigerant passage portion 18 is not provided on the upper peripheral wall 26. This is because a bolt (not shown) for fixing the cavity is provided on the upper peripheral wall 26.

＜Heat shielding part＞ The heat shield 30 is arranged between the heater unit 6 and the chamber 2. As a result, it is possible to prevent the infrared rays from the heater unit 6 from directly irradiating the chamber 2. The heat shielding portion 30 includes a plurality of heat shielding plates 31. The heat shielding portion 30 is a structure in which a plurality of heat shielding plates 31 are arranged at intervals in the thickness direction. In this embodiment, the heat shielding portion 30 includes three heat shielding plates 31. For example, the heat shielding plate 31 is formed of metal such as stainless steel (SUS). In addition, the heat shielding plate 31 is not limited to metal, and can be formed of various materials according to required specifications.

A plurality of heat shielding parts 30 are provided in the chamber 2. In the example of FIG. 2, the heat shielding portion 30 is provided so as to face the top plate 25, the upper peripheral wall 26, the bottom plate 27 (base plate 7), and the lower peripheral wall 28 (valve 29) of the chamber 2, respectively. Thereby, it is possible to prevent the infrared rays from the heater unit 6 from directly irradiating the top plate 25, the upper peripheral wall 26, the bottom plate 27, and the lower peripheral wall 28 (valve 29) of the chamber 2.

Although not shown, in the heat shielding portion 30 facing the ceiling 25 of the chamber 2, a through hole is formed in a portion overlapping the support member 19. On the other hand, in the heat shielding portion 30 facing the bottom plate 27 (base plate 7), a through hole is formed in a portion overlapping the support pin 8.

＜Shielding part＞ The shielding part 40 is provided between the substrate 10 and the heater unit 6. The shielding portion 40 is arranged so as to cover the substrate 10 from above. As shown in FIG. 5, the shielding part 40 is equipped with the some shielding plate 41 which transmits infrared rays and shields the sublimation material when a board|substrate is heated. The plurality of shielding plates 41 are common to each other. Each of the plurality of shielding plates 41 is provided at approximately the same height.

For example, the thickness of the shielding plate 41 is 0.5 mm or more and 3 mm or less. In this embodiment, the thickness of the shielding plate 41 is about 1.8 mm. For example, the shielding plate 41 is formed of quartz glass. In addition, the shielding plate 41 is not limited to quartz glass, and can be formed of various materials according to required specifications. In addition, the thickness of the shielding plate 41 is not limited to the above-mentioned thickness, and can be changed according to required specifications.

As shown in FIG. 2, the shielding plate 41 extends so as to intersect with the irradiation direction J1 of infrared rays. In FIG. 2, the irradiation direction J1 of infrared rays is shown as a vertical downward direction. The shielding plate 41 extends so as to be substantially orthogonal to the irradiation direction J1 of infrared rays. The shielding plate 41 extends linearly in the X direction.

As shown in FIG. 6, when viewed from the longitudinal direction (X direction) of the shielding plate 41, the shielding plate 41 is curved in an arc shape. The shielding plate 41 is curved in a convex manner toward the heater unit 6 (refer to FIG. 1). For example, the shielding plate 41 can be produced by cutting a quartz pipe (a cylindrical member formed of quartz glass) into a quarter of the pipe each having a central angle of 90 degrees. In addition, the manufacturing method of the shielding plate 41 is not limited to this, It can also manufacture by other methods using a mold, etc..

The shielding plate 41 includes a first end surface 41 a formed at one end of the shielding plate 41 in the short-side direction, and a second end surface 41 b formed at the other end of the shielding plate 41 in the short-side direction. Here, the short-side direction of the shielding plate 41 refers to a direction along the arc of the shielding plate 41 when viewed from the long-side direction of the shielding plate 41. The first end surface 41 a and the second end surface 41 b are arranged so as to be orthogonal to each other when viewed from the longitudinal direction of the shielding plate 41. The reference symbol Cp in FIG. 6 denotes a point where the extension line of the first end surface 41a and the extension line of the second end surface 41b intersect (the center point of the arc of the shielding plate 41).

As shown in FIG. 6, a gap 42 is provided between two adjacent shielding plates 41. For example, the gap 42 is provided to cover the entire length of the shielding plate 41 in the longitudinal direction. For example, the size of the gap 42 (the interval in the Y direction) is equal to or less than the thickness of the shielding plate 41. The gap 42 is provided between the respective shielding plates of the plurality of shielding plates 41.

＜Shielding support part＞ As shown in FIG. 2, the shielding support part 50 is provided between the substrate 10 and the heater unit 6. The shielding support portion 50 includes a plurality of straddling members 51 and 52 that support the shielding plate 41. The plurality of cross members 51 and 52 are common to each other.

The cross members 51 and 52 extend so as to cross the irradiation direction J1 of infrared rays. The cross members 51 and 52 extend so as to be substantially orthogonal to the irradiation direction J1 of infrared rays and the longitudinal direction of the shielding plate 41, respectively. The cross members 51 and 52 extend linearly in the Y direction. The cross members 51 and 52 have a cylindrical shape. In addition, the shape of the cross members 51 and 52 is not limited to a cylindrical shape, and may be another shape such as a rectangular plate shape.

The shielding plate 41 is supported by a plurality of cross members 51 and 52. The shielding plate 41 extends so as to be substantially orthogonal (intersecting) with respect to the longitudinal direction of the cross members 51 and 52. The plurality of spanning members 51 and 52 are a first spanning member 51 provided at one end of the shielding plate 41 in the longitudinal direction, and a second spanning member 52 provided at the other end of the shielding plate 41 in the longitudinal direction.

Both end portions of the first span member 51 and the second span member 52 are respectively supported on both side surfaces of the lower peripheral wall 28 in the Y direction. The first cross member 51 and the second cross member 52 are provided at substantially the same height. In this embodiment, the shielding plate 41 is supported only by two of the first cross member 51 and the second cross member 52. The interval between the first cross member 51 and the second cross member 52 (the interval in the X direction) is longer than the length of the substrate 10 in the longitudinal direction.

＜The role of the shielding plate＞ FIG. 7 is a diagram for explaining the function of the shielding plate 41 according to the embodiment. As described above, the shielding plate 41 is provided between the substrate 10 and the heater unit 6. Therefore, the shielding plate 41 can shield the sublimate from the substrate 10 toward the top surface of the chamber 2 (the lower surface of the top plate 25) and the heater unit 6 (the sublimate flowing in the direction of the arrow W1 in FIG. 7).

In the present embodiment, the shielding plate 41 is curved in an arc shape so as to be convex upward. Therefore, the sublimate flowing in the direction of arrow W1 in FIG. 7 can be guided to the uppermost part (center in the Y direction) of the shielding plate 41 along the curved portion (arc-shaped concave surface) of the shielding plate 41 (in the direction of arrow W2 in FIG. 7 ), and guide along the longitudinal direction of the shielding plate 41 to the longitudinal end (X-direction end) of the shielding plate 41 (the arrow W3 direction in FIG. 7).

In this manner, in the present embodiment, the sublimation from the substrate 10 toward the top surface of the chamber 2 and the heater unit 6 flows in the order of arrows W1, W2, and W3 in FIG. 7. Therefore, even if there is a gap 42 between two adjacent shielding plates 41, the sublimated material is guided to the inside of the concave surface of the shielding plate 41 (between the first end surface 41a and the second end surface 41 in the Y direction), and it is difficult to pass from the gap. 42 leaks.

<Effects> As described above, according to the present embodiment, the substrate heating device 1 includes: the chamber 2 in which a housing space 2S capable of accommodating the substrate 10 is formed; and the heater unit 6 is arranged on the first surface 10a side of the substrate 10 and can The substrate 10 is heated by infrared rays; a plurality of shielding plates 41 are arranged between the substrate 10 and the heater unit 6 to transmit infrared rays and shield the sublimation when the substrate is heated. According to this configuration, by providing the shielding plate 41 between the substrate 10 and the heater unit 6, the shielding plate 41 can shield the sublimate from the substrate 10 toward the top surface of the chamber 2 and the heater unit 6. Therefore, it is possible to suppress the adhesion of the sublimated material to the ceiling surface of the chamber 2 and the heater unit 6. In addition, by suppressing the attachment of the sublimated material to the ceiling surface of the chamber 2, it is possible to save the time and effort of removing the heater unit 6 and the like in order to clean the ceiling surface of the chamber 2. Furthermore, by providing a plurality of shielding plates 41, it is easier to replace the shielding plate 41 compared with a case where a single shielding plate (for example, a large-sized shielding plate of G6 size) is provided, and therefore, the maintenance performance is excellent. In addition, by suppressing the attachment of the sublimation to the ceiling surface of the chamber 2 and the heater unit 6, it is possible to suppress the sublimation from falling onto the substrate 10. Even in the case where it is assumed that the sublimation is attached to the top surface of the chamber 2 or the heater unit 6, it is possible to prevent the sublimation from directly falling onto the substrate by providing a plurality of shielding plates 41 between the substrate 10 and the heater unit 6 10.

In the present embodiment, the shielding plate 41 extends so as to intersect with the irradiation direction J1 of infrared rays, thereby achieving the following effects. The loss caused by the transmission of infrared rays through the shielding plate 41 can be suppressed as much as possible.

In this embodiment, when viewed from the longitudinal direction of the shielding plate 41, the shielding plate 41 is bent in an arc shape, and the following effects are achieved. Compared with the case where the shielding plate 41 has a rectangular plate shape, the rigidity of the shielding plate 41 can be improved. In addition, when the shielding plate 41 is supported by the plurality of cross members 51 and 52, the number of cross members 51 and 52 can be reduced as much as possible.

In the present embodiment, the shielding plate 41 is curved in a convex manner toward the heater unit 6 to achieve the following effects. Since the flow of the sublimate can be created in the curved portion of the shielding plate 41 along the longitudinal direction of the shielding plate 41, it is possible to more effectively suppress the adhesion of the sublimate to the ceiling surface of the chamber 2 and the heater unit 6. In addition, when the sublimation is attached to the curved portion of the shielding plate 41, it is easy to remove the sublimation, and therefore, it is excellent in maintainability. Furthermore, even if there is a gap 42 between two adjacent shielding plates 41, the sublimate is unlikely to leak from the gap 42.

In this embodiment, the shielding plate 41 includes a first end surface 41a formed at one end of the shielding plate 41 in the short-side direction, and a second end surface 41b formed at the other end of the shielding plate 41 in the short-side direction; In order to achieve the following effects, the first end surface 41a and the second end surface 41b are orthogonal to each other when viewed from the longitudinal direction of the shielding plate 41. Since infrared rays can be diffused from the heater unit 6 toward the substrate 10 by the first end surface 41a and the second end surface 41b, the entire substrate 10 can be heated.

In this embodiment, a gap 42 is provided between two adjacent shielding plates 41, and the following effects are achieved. Compared with the case where two adjacent shielding plates 41 are in contact with each other, shadows are less likely to be generated, and therefore, uneven heating of the substrate 10 can be suppressed.

In this embodiment, a plurality of straddling members 51 and 52 are provided, which are provided between the substrate 10 and the heater unit 6 and extend so as to cross the infrared radiation direction J1. The shielding plate 41 is covered by the plurality of straddling members 51. , 52 support, so as to achieve the following effects. The shielding plate 41 can be stably supported by the plurality of cross members 51 and 52.

In this embodiment, the shielding plate 41 extends so as to intersect the longitudinal direction of the transverse members 51, 52, and the plurality of transverse members 51, 52 are the first ones provided at one end of the shielding plate 41 in the longitudinal direction. The cross member 51 and the second cross member 52 provided at the other end in the longitudinal direction of the shielding plate 41 have the following effects. The first cross member 51 and the second cross member 52 support both ends of the shielding plate 41 in the longitudinal direction, so that the shielding plate 41 can be supported more stably. In addition, in the case of supporting only both ends of the shielding plate 41 in the longitudinal direction, compared with the case where the center portion of the shielding plate 41 in the longitudinal direction is supported by a cross member, it is possible to suppress the occurrence of shadows of the substrate 10 Uneven heating.

In this embodiment, the first surface 10a of the substrate 10 is coated with a solution for forming polyimide, thereby achieving the following effects. When the polyimide is formed, it is possible to suppress the adhesion of the sublimate to the ceiling surface of the chamber 2 and the heater unit 6.

<Modifications> In addition, the various shapes or combinations of the constituent members shown in the above examples are just examples, and various changes can be made based on design requirements and the like. In the above embodiment, the substrate heating unit is a heater unit provided with a plurality of infrared heaters, but it is not limited to this. For example, the substrate heating unit may be a single infrared heater.

In the above embodiment, the shielding plate is curved in an arc shape in a convex manner toward the heater unit, but it is not limited to this. For example, as shown in FIG. 8, the shielding plate 141 may be curved in an arc shape so as to be convex toward the opposite side (lower side) of the heater unit.

In the above embodiment, the shielding plate is curved in an arc shape when viewed from the longitudinal direction of the shielding plate, but it is not limited to this. For example, as shown in FIG. 9, the shielding plate 241 may have a V-shape when viewed from the longitudinal direction of the shielding plate 241. For example, the shielding plate 241 may have a V shape (inverted V shape) convex toward the heater unit (upper side). Although not shown, the shielding plate may have a V-shape convex toward the substrate.

In the above-mentioned embodiment, only the both ends in the longitudinal direction of the shielding plate are supported by the first cross member and the second cross member, but it is not limited to this. For example, as shown in FIG. 10, the center part of the longitudinal direction of the shielding plate 341 may be supported by the 3rd cross member 353. For example, the shielding plate 341 may have a rectangular plate shape. In addition, the number of straddling members and the shape of the shielding plate can be changed according to the required specifications.

In the above embodiment, a gap is provided between two adjacent shielding plates, but it is not limited to this. For example, it is not necessary to provide a gap between two adjacent shielding plates. For example, two adjacent shielding plates may be in contact with each other.

In addition, the present invention can also be applied to a substrate processing system including the substrate heating device of the above-described embodiment. For example, a substrate processing system is a system that is installed in a production line such as a factory and used to form a thin film on a predetermined area of a substrate. Although not shown in the figure, the substrate processing system includes, for example, a substrate processing unit including the above-mentioned substrate heating device; Unit; substrate unloading unit, that is, a unit that collects unloaded boxes containing processed substrates, and supplies empty unloaded boxes; conveying unit, conveys the unloaded boxes between the substrate processing unit and the substrate unloading unit, and transfers the boxes to the substrate The box for transporting and unloading between the processing unit and the substrate unloading unit; the control unit, which controls each unit as a whole. According to this configuration, by including the above-mentioned substrate heating device, it is possible to suppress the adhesion of the sublimated substance to the ceiling surface of the chamber and the substrate heating part in the substrate processing system.

In addition, each of the constituent elements described as the above-mentioned embodiment or its modification can be appropriately combined within a range that does not deviate from the gist of the present invention. In addition, among a plurality of constituent elements obtained by the combination, they may be appropriately combined. Use part of the constituent elements.

1: substrate heating device 2: chamber 2S: containment space 6: Heater unit (substrate heating part) 10: substrate 10a: The first side (one side of the substrate) 41,141,241,341: shielding plate 41a: first end face 41b: second end face 42: gap 51: The first cross member (cross member) 52: Second cross member (cross member) 353: Third cross member (cross member) J1: Irradiation direction of infrared rays

Fig. 1 is a perspective view of a substrate heating device according to an embodiment. [Fig. 2] is a cross-sectional view of the substrate heating device according to the embodiment. [Fig. 3] is a plan view of the heater unit according to the embodiment. [Fig. 4] is a plan view of the infrared heater according to the embodiment. Fig. 5 is a perspective view of the shielding plate according to the embodiment. [Fig. 6] is a partially enlarged view of Fig. 5. Fig. 7 is a diagram for explaining the function of the shielding plate according to the embodiment. [Fig. 8] Fig. 8 is a perspective view of a shielding plate according to a first modification of the embodiment. [Fig. 9] Fig. 9 is a perspective view of a shielding plate according to a second modification of the embodiment. [Fig. 10] Fig. 10 is a perspective view of a shielding plate according to a third modification of the embodiment.

1: substrate heating device

2: chamber

2S: containment space

3: Pressure adjustment department

3a: Vacuum pipeline

4: Gas supply part

4a: Gas supply pipeline

6: heater unit

7: Base plate

8: Support pin

9: Temperature detection department

10: Support substrate

10a: First side

10b: second surface

11: Gas Liquefaction Recovery Department

13: Vacuum pump

14: Pressure detection department

15: Control Department

30: Heat shield

31: Heat shield

40: Shading part

41: Shading plate

50: shielding support part

51: The first cross member (cross member)

52: Second cross member (cross member)

140: infrared heater

J1: Irradiation direction

Claims (10)

A substrate heating device, including: A chamber, which is formed with a receiving space capable of accommodating the substrate; The substrate heating part is arranged on one side of the substrate, and can use infrared rays to heat the substrate; A plurality of shielding plates are provided between the substrate and the substrate heating portion, and transmit the infrared rays and shield the sublimation when the substrate is heated. The substrate heating device of claim 1, wherein The shielding plate extends so as to cross the irradiation direction of the infrared rays. The substrate heating device of claim 2, wherein When viewed from the longitudinal direction of the shielding plate, the shielding plate is curved in an arc shape. The substrate heating device of claim 3, wherein, The shielding plate is curved so as to be convex toward the substrate heating portion. The substrate heating device of claim 4, wherein The aforementioned shielding plate has: The first end surface, which is formed at one end in the short-side direction of the aforementioned shielding plate; and The second end surface, which is formed at the other end of the aforementioned shielding plate in the aforementioned short-side direction; The first end surface and the second end surface are arranged so as to be orthogonal to each other when viewed from the longitudinal direction of the shielding plate. The substrate heating device according to any one of claims 1 to 5, wherein: A gap is provided between the two adjacent shielding plates. The substrate heating device according to any one of claims 1 to 6, wherein: It is further provided with a plurality of cross members, which are arranged between the substrate and the substrate heating portion, and extend in a manner to cross the irradiation direction of the infrared rays; The aforementioned shielding plate is supported by the aforementioned plurality of cross members. The substrate heating device of claim 7, wherein The aforementioned shielding plate extends in a manner of intersecting with the longitudinal direction of the aforementioned cross member; The plurality of spanning members are a first spanning member provided at one end of the shielding plate in the longitudinal direction, and a second spanning member provided at the other end of the shielding plate in the longitudinal direction. The substrate heating device according to any one of claims 1 to 8, wherein: A solution for forming polyimide is coated on one side of the aforementioned substrate. A substrate processing system includes: the substrate heating device of any one of claims 1-9.

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