TW202126948A - A method of fabricating a thin vacuum insulation sheet with supporting structure - Google Patents

Abstract

A method of fabricating a thin vacuum insulation sheet with supporting structure includes following steps: mixing a fiber material and a resin to form a composite glue; deploying the composite glue on a first surface of a first sheet structure; pressurizing and heating the first sheet structure to solidify the composite glue on the first surface to form a support structure; configuring a second sheet structure on the first surface to form a gap space there between; extracting the air in the gap space and sealing around the gap space to form the thin vacuum insulation sheet. The thin vacuum insulation sheet fabricated in the present method can effectively insulate heat conduction and heat convection between the two sheet structures, and through the support structure, the vacuum insulation sheet will not be deformed and collapsed by the air pressure due to.

Description

Method for manufacturing thin vacuum heat insulation sheet with supporting structure

The present invention relates to a method of manufacturing a thin vacuum insulation sheet, and in particular, to a method of manufacturing a thin vacuum insulation sheet with a supporting structure.

The development trend of electronic and hand-held communication device products continues to be thinner and more functional, and people have higher and higher requirements for the computing speed and functions of the microprocessor (Microprocessor) in the device. Microprocessors are the core components of electronic and communication products. Under high-speed computing, they are prone to generate heat and become the main heating components of electronic devices, causing localized processing hot spots (Hot Spot). Without a good thermal management solution and cooling system, the microprocessor will often overheat and fail to perform its due function, and even affect the life and reliability of the entire electronic device system. Therefore, electronic products require excellent heat dissipation design, especially ultra-thin electronic devices such as smartphones and tablet PCs, which require excellent thermal management capabilities. At present, the effective solution for the treatment of hot spots in electronic and communication products is to contact the graphite sheet (Graphitte sheet) or flat micro heat pipe (Flatten Micro Heat Pipe) or vapor chamber (Vapor Chamber) with one side of the heat source and the other side of the heat source. The casing of the electronic device is expected to be able to quickly conduct and distribute the high-density heat generated by the microprocessor to the casing in a more effective manner, thereby radiating the heat into the air.

However, due to certain electronic or communication products, such as smart phones, product design The design is very light and thin, and the thickness of the space between the microprocessor and the case that allows the installation of heat dissipation components is often less than 1mm. Therefore, the other side of the heat dissipating element in the heat source area will directly thermally contact the casing, and the high temperature generated by the hot spot can easily be directly transferred to the casing, causing the hot spot temperature on the surface of the casing to be too high. Therefore, in order to prevent the surface temperature of the casing from being too high, it is necessary to install a layer of heat insulation sheet between the casing in the hot spot area and the part of the heat dissipation element to block the conduction of the heat flow. At the same time, it is necessary to use a layer of heat insulation sheet for proper isolation between the heating element on the circuit board and other electronic or optoelectronic elements that are more sensitive to heat. Therefore, in addition to effective heat dissipation design for light, thin and short electronic and communication devices, how to achieve high-efficiency heat insulation in the limited thickness and space of the local part of the device has also become an urgent problem to be solved.

In view of this, the present invention proposes a method for manufacturing a thin vacuum heat insulation sheet with a supporting structure to effectively block the heat insulation performance in a limited thickness space.

A method for manufacturing a thin vacuum insulation sheet with a supporting structure according to the present invention includes the following steps: mixing fiber material and resin to form a composite material gel; arranging the composite material gel on the first surface of the first sheet structure; adding Press and heat the first sheet structure to solidify the composite material gel on the first surface to form a support structure; dispose the second sheet structure on the first surface of the first sheet structure, so that the second sheet structure and A gap space is formed between the first sheet structure; the first sheet structure and the second sheet structure are welded; and the air in the gap space is extracted and the periphery of the gap space is sealed to form a thin vacuum insulation sheet.

In a specific embodiment, in the step of disposing the second sheet-like structure on the first surface of the first sheet-like structure so that a gap space is formed between the second sheet-like structure and the first sheet-like structure, further Ground, disposing the second sheet structure on the first surface of the first sheet structure, In order to form a gap space between the second sheet structure and the first sheet structure by the supporting structure, and make a pipe to communicate with the gap space; and to extract the air in the gap space and seal the periphery of the gap space to form a thin vacuum insulation sheet In the step, further, the air in the interstitial space is extracted through the duct, and then the duct is blocked to form a thin vacuum insulation sheet.

In a specific embodiment, before disposing the second sheet-like structure on the first surface of the first sheet-like structure, so that a gap space is formed between the second sheet-like structure and the first sheet-like structure, it further includes a Step: arrange a solder around the first surface; and in the step of soldering the first sheet structure and the second sheet structure, further, the solder is heated to the melting point of the solder and then the solder is cooled, so as to weld the first in an airtight manner. The sheet structure and the second sheet structure.

Wherein, the first surface of the first sheet structure has an outer ring solder resist layer and an inner ring solder resist layer, the outer ring solder resist layer surrounds the outer side of the inner ring solder resist layer; the composite material colloid is arranged on the first sheet structure In the step of the first surface, the composite material glue system is arranged on the inner side of the inner annular solder mask of the first surface; Between the outer ring solder mask and the inner ring solder mask.

Wherein, in the step of heating the solder to the melting point of the solder and then cooling the solder to airtightly weld the first sheet structure and the second sheet structure, the thermal conductivity of the support structure is lower than the thermal conductivity of the solder after cooling, and the thermal conductivity of the support structure The hardness is higher than the hardness of the solder after cooling.

In another specific embodiment, before the step of disposing the second sheet-like structure on the first surface of the first sheet-like structure so that a gap space is formed between the second sheet-like structure and the first sheet-like structure, further It includes a step: arranging solder around the second surface of the second sheet structure; placing the second sheet structure on the first surface of the first sheet structure so that the second In the step of forming a gap space between the sheet structure and the first sheet structure, further, the second surface of the second sheet structure is disposed on the first surface of the first sheet structure to make the second sheet structure A gap space is formed between the structure and the first sheet structure by the support structure; and in the step of welding the first sheet structure and the second sheet structure, further, the solder is heated to weld the first sheet structure and the second sheet structure Flake structure.

In a specific embodiment, in the step of arranging the composite material gel on the first surface of the first sheet structure, the composite material gel is further arranged on the first surface of the first sheet structure by means of steel plate printing or glue dispensing. surface.

In a specific embodiment, in the step of mixing the fiber material and the resin to form a composite material gel, the fiber material is a glass fiber material.

In a specific embodiment, the thickness of the thin vacuum insulation sheet is less than 1 mm, and the height of the gap space is less than 0.5 mm.

In summary, the present invention provides a method for manufacturing a thin vacuum heat insulation sheet with a supporting structure, which can effectively isolate the heat conduction and heat convection between the two heat insulation sheets, and the heat insulation between the two heat insulation sheets The supporting structure prevents the two heat insulation sheets from deforming and collapsing due to air pressure, so as to effectively perform the function of heat insulation.

1‧‧‧Thin vacuum insulation sheet

11‧‧‧First sheet structure

111‧‧‧First Surface

1111‧‧‧Outer ring solder mask

1112‧‧‧Inner ring solder mask

12‧‧‧Second sheet structure

122‧‧‧Second Surface

13‧‧‧Composite colloid

14‧‧‧Supporting structure

15‧‧‧Interstitial space

16‧‧‧Solder

17‧‧‧Conduit

171‧‧‧First end

172‧‧‧Second end

Fig. 1a is a schematic diagram showing the appearance of a thin vacuum heat insulating sheet according to a specific embodiment of the present invention.

Fig. 1b is a cross-sectional view according to the line A-A in Fig. 1a.

Fig. 2 shows a method of making a thin film with a supporting structure according to a specific embodiment of the present invention The flow chart of the method of the type vacuum insulation sheet.

3a to 3c are schematic diagrams showing the manufacturing process of a thin vacuum insulation sheet according to an embodiment of the present invention.

FIG. 4 is a flowchart illustrating a method of manufacturing a thin vacuum insulation sheet with a supporting structure according to a specific embodiment of the present invention.

Fig. 5a is a schematic diagram showing a simple structure of a thin vacuum insulation sheet including a duct according to an embodiment of the present invention.

Fig. 5b is a cross-sectional view according to the line B-B in Fig. 5a.

Fig. 6 is a flow chart showing the steps of a method for manufacturing a thin vacuum insulation sheet with a supporting structure according to a specific embodiment of the present invention.

Fig. 7a is a schematic diagram showing a simple structure of a thin vacuum heat insulating sheet according to a specific embodiment of the present invention.

Fig. 7b is a cross-sectional view of the outer ring solder resist layer and the inner ring solder resist layer according to the line C-C in Fig. 7a.

Fig. 7c is a cross-sectional view according to the line C-C in Fig. 7a.

FIG. 8 is a flow chart of a method of manufacturing a thin vacuum insulation sheet with a supporting structure according to a specific embodiment of the present invention.

FIG. 9 is a flowchart of a method for manufacturing a thin vacuum insulation sheet with a supporting structure according to another embodiment of the present invention.

In order to make the advantages, spirit and characteristics of the present invention easier and clearer to understand, the following will use specific embodiments and refer to the accompanying drawings for detailed and discussion. It is worth noting that These specific embodiments are only representative specific embodiments of the present invention, and the specific methods, devices, conditions, materials, etc. exemplified therein are not intended to limit the present invention or the corresponding specific embodiments. In addition, each device in the figure is only used to express its relative position and is not drawn according to its actual scale, which is explained first.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated by the terms "longitudinal, horizontal, up, down, front, back, left, right, top, bottom, inner, outer" etc. are based on the drawings. The orientation or positional relationship shown is only for the convenience of describing the present invention and simplifying the description, rather than indicating that the device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present invention.

Please refer to Figure 1a, Figure 1b, Figure 2 and Figures 3a to 3c. FIG. 1a is a schematic diagram of a simple structure of a thin vacuum insulation sheet 1 according to a specific embodiment of the present invention. Fig. 1b is a cross-sectional view according to the line A-A in Fig. 1a. FIG. 2 is a flow chart showing the steps of a method of manufacturing a thin vacuum insulation sheet with a supporting structure according to a specific embodiment of the present invention. 3a to 3c are schematic diagrams showing the manufacturing process of the thin vacuum insulation sheet 1 according to a specific embodiment of the present invention. A specific embodiment of the present invention is a method for manufacturing a thin vacuum insulation sheet with a supporting structure, which includes the following steps: mixing fiber material and resin to form a composite material gel 13 (S1); arranging the composite material gel 13 in the first The first surface 111 of the sheet structure 11 (S2); the first sheet structure 11 is pressurized and heated to solidify the composite material gel 13 on the first surface 111 to form the support structure 14 (S3); the second sheet structure 12 is disposed on the first surface 111 of the first sheet structure 11, so that a gap space 15 is formed between the second sheet structure 12 and the first sheet structure 11 (S4); the first sheet structure 11 and the first sheet structure 11 are welded Two sheet-like structures 12 (S5); and evacuating the air in the interstitial space 15 and sealing the periphery of the interstitial space 15 to form a thin vacuum insulation sheet 1 (S6).

In practice, the fiber material used in the present invention is glass fiber, but it is not limited to Therefore, the resin may be epoxy resin. The composite material colloid 13 formed by mixing the fiber material and the resin may also contain a curing agent and an organic solvent. Among them, the curing agent can easily cure the composite material colloid 13 and the organic solvent can increase the fluidity of the composite material colloid 13. The composite material gel 13 is easily arranged on the first surface 111 of the first sheet structure 11. When arranging the composite material colloid 13 on the first sheet structure 11, the composite material colloid 13 is arranged on the first surface 111. The arrangement can be steel plate printing or dispensing so that the composite material colloid 13 is added. It can be evenly distributed on the first sheet structure 11 during the pressing and heating process. When the first sheet structure 11 containing the composite material gel 13 is pressurized and heated, the curing agent in the composite material gel 13 can be fixed on the first surface 111 of the first sheet structure 11 after curing. The composite material colloid 13 is heated and pressurized to form a supporting structure 14. Furthermore, when the second sheet structure 12 is disposed on the first surface 111 of the first sheet structure 11, a gap space 15 is formed between the first sheet structure 11, the second sheet structure 12 and the supporting structure 14. The first sheet structure 11 and the second sheet structure 12 may be metal of the same material, such as a copper sheet or a stainless steel sheet plated with a weldable material layer on the surface. Next, the solder 16 is used to weld the surroundings of the first surface 111 of the first sheet structure 11 and the second surface 122 of the second sheet structure 12, and then the air in the interstitial space is extracted. At this time, the space between the first sheet structure 11 and the second sheet structure 12 is a vacuum-sealed space to form a thin vacuum insulation sheet 1. In the case of vacuum, the efficiency of heat conduction and heat convection is very poor. Therefore, the first sheet structure 11 and the second sheet structure 12 have a good thermal barrier capacity, that is to say, a thin vacuum insulation sheet 1 It can effectively isolate the heat energy in the Z-axis direction. In this embodiment, the arrangement of the thin vacuum insulation sheet 1 is shown in Fig. 1b and Fig. 3c, and the arrangement from bottom to top is the first sheet structure 11, the first surface 111 of the first sheet structure 11 , The solder 16 and the supporting structure 14, the second surface 122 of the second sheet structure 12, and the second sheet structure 12, and the subsequent embodiments are all described in this arrangement.

Please refer to Figure 3c, Figure 4, Figure 5a and Figure 5b. FIG. 4 is a flowchart illustrating a method of manufacturing a thin vacuum insulation sheet with a supporting structure according to a specific embodiment of the present invention. FIG. 5a is a schematic diagram of a simple structure of a thin vacuum insulation sheet 1 including a duct 17 according to a specific embodiment of the present invention. Fig. 5b is a cross-sectional view according to the line B-B in Fig. 5a. Wherein, when the interstitial space 15 is formed between the first sheet structure 11 and the second sheet structure 12, further, a duct 17 is made to communicate with the interstitial space (S41), and the air in the interstitial space 15 is extracted through the duct 17 , The duct 17 is blocked to form a thin vacuum insulation sheet 1 (S61). In practice, the material of the conduit 17 is the same metal as the first sheet structure 11 and the second sheet structure 12. The pipe 17 is disposed between the first sheet structure 11 and the second sheet structure 12, and the first end 171 of the pipe 17 is located in the interstitial space 15, and the second end 172 relative to the first end 171 is located in the external environment. After the first sheet structure 11 and the second sheet structure 12 are welded to form a sealed space, the air in the interstitial space 15 is drawn out from the second end 172 of the duct 17, and the interstitial space 15 can be used after being evacuated to a vacuum. The method of welding or welding seals the second end 172 of the duct 17 to prevent external air from entering the interstitial space 15 through the duct 17 again. Furthermore, the second end 172 of the catheter 17 can be crushed first, and then cut to an appropriate length. Therefore, the interstitial space 15 is evacuated by the duct 17 to achieve the heat resistance effect between the first sheet structure 11 and the second sheet structure 12.

Please refer to Figure 3c and Figure 6. Fig. 6 is a flow chart showing the steps of a method for manufacturing a thin vacuum insulation sheet with a supporting structure according to a specific embodiment of the present invention. Wherein, before soldering the first sheet structure 11 and the second sheet structure 12, the solder 16 is arranged around the first surface 111 of the first sheet structure 11 (S42); during soldering, the solder 16 is heated to the melting point of the solder After cooling, the first sheet structure 11 and the second sheet structure 12 are hermetically welded (S51). In practice, the solder 16 can be a solder material, and the solder 16 surrounds and arranges the composite material colloid in the first sheet structure 11 of the first surface 111. Next, the second sheet structure 12 is placed on the first sheet structure 11 and heated to the melting point of the solder. At this time, the solder 16 will melt and adhere to the first surface 111 of the first sheet structure 11 and the second sheet structure 12 of the second surface 122. When the solder 16 is cooled, the solder 16 welds the first sheet structure 11 and the second sheet structure 12 to form a sealed space in which the air in the gap space 15 and the outside air cannot communicate with each other.

Please refer to Figure 3c and Figure 5b again. In a specific embodiment, first, the solder 16 is arranged around the first surface 111 of the first sheet structure 11, and then the conduit 17 is arranged on the solder 16, and finally, the second sheet structure 12 is arranged on the first sheet. After the first surface 111 of the shaped structure 11 is heated, the solder 16 is heated for soldering. In another embodiment, the pipe 17 is first arranged on the first sheet structure 11, and then the solder 16 is laid on the first surface 111 of the first sheet structure 11. At this time, part of the solder 16 will be arranged on the pipe 17 on. After that, the second sheet structure 12 is placed on the first surface 111 of the first sheet structure 11 and then the solder 16 is heated for soldering. In another specific embodiment, the solder 16 is arranged around the first surface 111 of the first sheet structure 11, and then the second sheet structure 12 is placed on the first sheet structure 11 and then the catheter 17 is inserted. At this time, the conduit 17 is located in the solder. In practice, no matter whether the conduit 17 is placed on the first sheet structure 11 before or after the solder 16 is arranged, when the solder 16 heats and welds the first sheet structure 11 and the second sheet structure 12, the conduit can be completely welded to Between the first sheet structure 11 and the second sheet structure 12. Therefore, after the duct 17 evacuates the air in the interstitial space 15 to a vacuum and the duct is cut off or welded, the airtight space between the first sheet structure 11 and the second sheet structure 12 can still be formed.

Please refer to Figure 7a, Figure 7b, Figure 7c and Figure 8. FIG. 7a is a schematic diagram showing a simple structure of a thin vacuum heat insulating sheet 1 according to a specific embodiment of the present invention. Fig. 7b is a cross-sectional view of the outer ring solder resist layer 1111 and the inner ring solder resist layer 1112 according to the line C-C in Fig. 7a. Figure 7c shows According to the cross-sectional view of the line C-C in Figure 7a. FIG. 8 is a flow chart of a method of manufacturing a thin vacuum insulation sheet with a supporting structure according to a specific embodiment of the present invention. In a specific embodiment, the first surface 111 of the first sheet structure 11 has an outer ring solder resist layer 1111 and an inner ring solder resist layer 1112, and the outer ring solder resist layer 1111 wraps around the outer side of the inner ring solder resist layer 1112 . The support structure is arranged on the inner side of the inner ring solder resist layer 1112 on the first surface 111 (S21), and the solder 16 is arranged around the first surface 111 between the ring solder resist layer 1111 and the inner ring solder resist layer 1112 (S43) . In practice, after the solder 16 is heated and soldered, the layout range cannot be precisely controlled, which may result in shortage or flashing, and may cause voids or gaps to be unable to form a sealed space, thereby failing to achieve a vacuum state and affecting the heat resistance effect. Therefore, the outer ring solder resist layer 1111 and the inner ring solder resist layer 1112 can accurately control the arrangement position of the solder 16 to produce a thin vacuum heat insulating sheet 1 with better yield. In addition, due to the characteristics of the glass fiber composite material, the support structure 14 is not affected by the welding temperature and softens under normal pressure. Therefore, when the solder 16 is heated to weld the first sheet structure 11 and the second sheet structure , The supporting structure 14 can still support the first sheet structure 11 and the second sheet structure to prevent the gap space of the thin vacuum insulation sheet 1 from being extracted to the vacuum, the first sheet structure 11 and the second sheet structure Deformed inward and collapsed.

In a specific embodiment, the thermal conductivity of the support structure 14 is lower than the thermal conductivity of the solder 16 after cooling, and the hardness of the support structure 14 is higher than the hardness of the solder 16 after cooling. In practice, since the interstitial space 15 is in a vacuum condition, the gas pressure of the interstitial space 15 is less than the outside atmospheric pressure, the first sheet structure 11 and the second sheet structure 12 will be squeezed by the external pressure to the interstitial space. Therefore, the supporting structure 14 formed by the composite material gel under pressure and heating can maintain the distance between the first sheet structure 11 and the second sheet structure 12 at both ends without causing deformation and collapse. Since both ends of the support structure 14 are in contact with the first sheet structure 11 respectively And the second sheet structure 12, therefore, when the thermal conductivity of the support structure 14 is lower than the thermal conductivity of the solder 16, the heat conduction effect of the support structure 14 between the first sheet structure 11 and the second sheet structure 12 can be reduced To ensure the effect of heat resistance. When the interstitial space 15 is in a vacuum, the farther away from the solder 16, the greater the pressure from the outside. Therefore, the hardness of the support structure 14 is higher than the hardness of the solder 16 after cooling to avoid the first sheet structure 11 and the second sheet structure 12 are deformed. Since each support column in the support structure 14 supports the first sheet structure 11 and the second sheet structure 12 in a smaller volume, it needs to withstand greater pressure than the solder 16. Therefore, the hardness of the support structure 14 must be higher than The hardness of the solder 16 after cooling to maintain the supporting function.

In a specific embodiment, before welding the first sheet structure 11 and the second sheet structure 12, the solder 16 is arranged around the second surface 122 of the second sheet structure 12, and the second sheet structure 12 In the step of forming a gap space 15 between the first sheet structure 11 and the second sheet structure 11, further, the second surface 122 of the second sheet structure 12 is disposed on the first surface 111 of the first sheet structure 11, so that the second The support structure 14 forms a gap space 15 between the two sheet structures 12 and the first sheet structure 11. In practice, since the solder 16 welds the first sheet structure 11 and the second sheet structure 12 to each other during soldering, the solder 16 can be arranged around the first surface of the first sheet structure 11 except 111 In this embodiment, the solder 16 can also be arranged on the second surface 122 of the second sheet structure 12. The functions of the related units in this specific embodiment are substantially the same as those of the aforementioned corresponding units, and will not be repeated here. The method of this embodiment can simultaneously solidify the support structure 14 and arrange the solder 16, which can shorten the manufacturing time of the thin vacuum insulation sheet 1.

Since the volume and thickness of today's mobile phones or tablet computers are all pursuing lightness and thinness, the volume of internal components of the mobile phone or tablet computers is limited, and a certain heat dissipation and heat insulation function are also required. In a specific embodiment, the thickness of the thin vacuum insulation sheet 1 is less than 1 mm, the height of the clearance space is less than 0.5mm.

Refer to Figure 9. FIG. 9 is a flowchart of a method for manufacturing a thin vacuum insulation sheet with a supporting structure according to another embodiment of the present invention. In another specific embodiment, the present invention also provides a method for manufacturing a thin vacuum insulation sheet with a supporting structure, which includes the following steps: mixing fiber materials and resin to form a composite colloid (S1'); arranging the composite material Colloid on the first surface of the first sheet structure (S2'); press and heat the first sheet structure to solidify the composite material colloid on the first surface to form a support structure (S3'); The two-piece structure is arranged on the first surface of the first piece-like structure, so that a gap space (S4') is formed between the second piece-like structure and the first piece-like structure; and the first piece-like structure and the second piece-like structure are hermetically welded Sheet structure to form a thin vacuum insulation sheet (S5'). In practice, since the second sheet structure is placed on the first surface of the first sheet structure in a vacuum environment, the interstitial spaces formed by the first sheet structure, the second sheet structure and the supporting structure are also in a vacuum state And when a thin vacuum insulation sheet is formed after air-tight welding, the sealed space is also a vacuum space to achieve the effect of heat resistance. The functions of the related units in this specific embodiment and the corresponding units and steps in the production steps S1 to S3 are substantially the same as the aforementioned corresponding units and steps, and will not be repeated here.

In summary, the present invention provides a method for manufacturing a thin vacuum heat insulation sheet with a supporting structure, which can effectively isolate the heat conduction and heat convection between the two heat insulation sheets, and the heat insulation between the two heat insulation sheets The supporting structure prevents the two heat insulation sheets from deforming and collapsing due to air pressure, so as to effectively perform the function of vacuum heat insulation.

Through the detailed description of the above preferred embodiments, it is hoped that the characteristics and spirit of the present invention can be described more clearly, and the scope of the present invention is not limited by the preferred embodiments disclosed above. On the contrary, its purpose is to cover all kinds of changes and equal security It falls within the scope of the patent intended for the present invention. Therefore, the scope of the patent application for the present invention should be interpreted in the broadest way based on the above description, so as to cover all possible changes and equivalent arrangements.

1‧‧‧Thin vacuum insulation sheet

11‧‧‧First sheet structure

12‧‧‧Second sheet structure

14‧‧‧Supporting structure

15‧‧‧Interstitial space

16‧‧‧Solder

Claims (10)

A method for manufacturing a thin vacuum heat insulation sheet with a supporting structure, which comprises: Mix a fiber material and a resin to form a composite material colloid; Arranging the composite material gel on a first surface of a first sheet structure; Pressurizing and heating the first sheet structure to solidify the composite material colloid on the first surface to form a support structure; Disposing a second sheet structure on the first surface of the first sheet structure, so that a gap space is formed between the second sheet structure and the first sheet structure; Welding the first sheet structure and the second sheet structure; and The air in the interstitial space is extracted and the periphery of the interstitial space is sealed to form a thin vacuum insulation sheet. The method for manufacturing a thin vacuum insulation sheet with a supporting structure as described in the first item of the scope of patent application, wherein the second sheet structure is arranged on the first surface of the first sheet structure, so that the first sheet structure The step of forming the gap space between the two sheet-like structures and the first sheet-like structure is further as follows: The second sheet structure is disposed on the first surface of the first sheet structure, so that the interstitial space is formed between the second sheet structure and the first sheet structure by the support structure, and Making a conduit to communicate with the interstitial space; And the step of extracting the air in the interstitial space and sealing the interstitial space to form the thin vacuum insulation sheet is further as follows: The air in the interstitial space is extracted through the duct, and then the duct is blocked and sealed to form the thin vacuum insulation sheet. The method of manufacturing a thin vacuum insulation sheet with a supporting structure as described in the first item of the scope of the patent application, wherein the second sheet structure is disposed on the first surface of the first sheet structure so that the Before the step of forming the gap space between the second sheet structure and the first sheet structure, it further includes a step: Arranging a solder around the first surface; And the step of welding the first sheet structure and the second sheet structure is further as follows: The solder is heated to the melting point of the solder and then the solder is cooled to airtightly weld the first sheet structure and the second sheet structure. The method for manufacturing a thin vacuum heat insulation sheet with a supporting structure as described in item 3 of the scope of patent application, wherein the first surface of the first sheet structure has an outer ring-shaped solder resist layer and an inner ring-shaped solder resist layer, The outer ring-shaped solder resist layer surrounds the outer side of the inner ring-shaped solder resist layer; Wherein, in the step of arranging the composite material glue on the first surface of the first sheet structure, the composite material glue system is arranged on the inner side of the inner annular solder mask on the first surface; and The step of arranging the solder around the first surface further includes arranging the solder around the outer ring solder resist layer and the inner ring solder resist layer of the first surface. The method for manufacturing a thin vacuum heat insulation sheet with a supporting structure as described in item 3 of the scope of patent application, wherein the solder is heated to the melting point of the solder and then the solder is cooled to air-tightly weld the first sheet structure and the In the step of the second sheet structure, the thermal conductivity of the support structure is lower than the thermal conductivity of the solder after cooling, and the hardness of the support structure is higher than the hardness of the solder after cooling. The method of manufacturing a thin vacuum insulation sheet with a supporting structure as described in the first item of the scope of patent application, wherein the second sheet structure is disposed on the first surface of the first sheet structure so that the Before the step of forming the gap space between the second sheet structure and the first sheet structure, it further includes a step: Arranging a solder around a second surface of the second sheet structure; And disposing the second sheet-like structure on the first surface of the first sheet-like structure so that the interstitial space is formed between the second sheet-like structure and the first sheet-like structure. for: The second surface of the second sheet structure is arranged on the first surface of the first sheet structure, so that the support structure is formed between the second sheet structure and the first sheet structure The gap space. And the step of welding the first sheet structure and the second sheet structure further includes heating the solder and cooling to weld the first sheet structure and the second sheet structure. The method of manufacturing a thin vacuum insulation sheet with a supporting structure as described in the first item of the scope of patent application, wherein in the step of arranging the composite material colloid on the first surface of the first sheet structure, a steel plate is further used The composite material gel is arranged on the first surface of the first sheet structure by printing or dispensing. The method for manufacturing a thin vacuum insulation sheet with a supporting structure as described in item 1 of the scope of patent application, wherein in the step of mixing the fiber material and the resin to form the composite material colloid, the fiber material is a glass fiber material. The method for manufacturing a thin vacuum insulation sheet with a supporting structure as described in the first item of the scope of patent application, wherein the thickness of the thin vacuum insulation sheet is less than 1mm, and the height of the gap space is less than 0.5mm. A method for manufacturing a thin vacuum heat insulation sheet with a supporting structure, which comprises: Mix a fiber material and a resin to form a composite material colloid; Arranging the composite material gel on a first surface of a first sheet structure; Pressurizing and heating the first sheet structure to solidify the composite material colloid on the first surface to form a support structure; Disposing a second sheet structure on the first surface of the first sheet structure in a vacuum environment, so that a gap space is formed between the second sheet structure and the first sheet structure; and The solder is heated and cooled to air-tightly weld the first sheet structure and the second sheet structure to form a thin vacuum insulation sheet.

Images