TW202125125A - Mask for ball array and manufacturing method thereof in which internal protrusions do not peel off from the mask body even when the mounting head of the ball loader is rubbed during the ball loading operation - Google Patents
Mask for ball array and manufacturing method thereof in which internal protrusions do not peel off from the mask body even when the mounting head of the ball loader is rubbed during the ball loading operation Download PDFInfo
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Abstract
Description
本發明,係有關於用以裝載導電球的球陣列用遮罩及其製造方法。The present invention relates to a ball array mask for loading conductive balls and a manufacturing method thereof.
一直以來,眾所周知的球陣列用遮罩,其特徵在於包括:遮罩本體,利用鍍層形成,且形成已搭載的導電球插通的複數開口部;以及複數突起,利用鍍層形成,不是導電球植入面而是與基板的電極對向側的上述遮罩本體背面在上述開口部以外的部分突出,互相分離獨立;上述互相分離獨立的複數突起部分,由以下構成:內部突起,利用第1鍍層在不與上述基板接觸側形成;以及外部突起,在此內部突起表面上利用與上述第1鍍層不同的第2鍍層覆蓋上述內部突起的周側面及基板側下面形成,成為與基板的電極對向側;上述遮罩本體,利用上述第2鍍層與上述外部突起一體形成,上述外部突起,形成側面所視其四周邊緣部具有圓形的R形狀(例如,參照第1專利文件)。 [先行技術文獻] [專利文獻]Conventionally, a well-known mask for a ball array is characterized by including: a mask body, which is formed by plating and forming a plurality of openings through which the mounted conductive balls are inserted; and a plurality of protrusions, which are formed by plating and are not conductive ball implants. The entrance surface is the part of the back of the mask body on the side opposite to the electrode of the substrate that protrudes beyond the opening, and is separated and independent from each other; the above-mentioned multiple independent protrusions are composed of the following: internal protrusions, using the first plating layer Formed on the side that is not in contact with the substrate; and an external protrusion, on the surface of the internal protrusion, a second plating layer different from the first plating layer is formed to cover the peripheral side surface of the internal protrusion and the bottom surface of the substrate side, so as to oppose the electrode of the substrate Side; The mask body is formed integrally with the external protrusions using the second plating layer, and the external protrusions are formed into an R shape with a circular edge portion as viewed from the side (for example, refer to the first patent document). [Advanced Technical Literature] [Patent Literature]
[專利文獻1]日本專利第6500138號公報(申請專利範圍第1項)[Patent Document 1] Japanese Patent No. 6500138 (the first item in the scope of patent application)
[本發明所欲解決的課題][Problems to be solved by the present invention]
習知的球陣列用遮罩,例如,根據第7圖所示的製造方法製作。
首先,SUS母材11上壓層光阻,進行所需的曝光、顯像處理,SUS母材11上部分形成厚度t1的突起形成用光阻層12(參照第7(a)圖)。此突起形成用光阻層12,例如中空圓柱狀等。其次,例如,為了使圓柱狀內部突起13a成為既定高度(厚度)t2,藉由在SUS母材11上進行全體鍍層,形成厚度t2的第1鍍層13(參照第7(b)圖)。在此,因為突起形成用光阻層12的厚度t1與第1鍍層13的厚度t2的關係是t1>t2,不會將第1鍍層13鍍層為超過突起形成用光阻層12的厚度t1。接下來,第1鍍層13的形成結束後,除去突起形成用光阻層12(參照第7(c)圖)。其次,除去圓柱狀內部突起13a以外的全部第1鍍層13,SUS母材11上只留下利用第1鍍層13得到的圓柱狀內部突起13a(參照第7(d)圖)。接下來,SUS母材11上黏貼開口部形成用光阻14(參照第7(e)圖)。進行所需的曝光、顯像處理,SUS母材11上的圓柱狀內部突起13a間形成複數開口部形成用光阻層14a(參照第7(f)圖)。其次,為了使遮罩本體15成為指定厚度,藉由在SUS母材11上及圓柱狀內部突起13a上鍍層,形成第2鍍層15(參照第7(g)圖)。於是,除去複數開口部形成用光阻層14a時,成為圓柱狀內部突起13a間形成導電球插通的複數開口部15a的第2鍍層15(參照第7(h)圖)。利用此第2鍍層15,覆蓋遮罩本體以及內部突起13a的周側面及基板側下面形成,形成與基板的電極對向側的外部突起15b。最後,從SUS母材11剝離第1鍍層13構成的圓柱狀內部突起13a及第2鍍層15構成的圓柱狀外部突起15b與遮罩本體(參照第7(i)圖)。根據上述,完成球陣列用遮罩。導電球插通的複數開口部15a形成的部分是球裝載區域。完成的球陣列用遮罩的圓柱狀外部突起15b前端部,其四周邊緣部,如第8圖所示,不是有稜角的形狀,而是具有圓形的R形狀。The conventional mask for a ball array is manufactured according to the manufacturing method shown in FIG. 7, for example.
First, a photoresist is laminated on the
如此製作的習知球陣列用遮罩,即使第1鍍層形成的內部突起表面上進行鹽酸等的化學處理提高接合強度,受到球裝載作業時發生球裝載機的搭載頭摩擦或由於現場作業員的遮罩處理引起來自外部的衝擊之際,或進行高壓沖淋洗淨等遮罩洗淨之際,發生過不與基板接觸側形成的內部突起從遮罩本體剝離脫落的問題。The conventional ball array mask produced in this way can improve the bonding strength even if the inner protrusion surface formed by the first plating layer is chemically treated with hydrochloric acid, etc., and the ball loader's mounting head may be rubbed during the ball loading operation or due to the mask of the field operator. When an impact from the outside is caused by the treatment, or when the mask is cleaned such as high-pressure rinsing, there has been a problem that the internal protrusion formed on the side that does not come into contact with the substrate peels off from the mask body.
本發明,因為用以解決上述課題而形成,提供即使受到球裝載作業時發生球裝載機的搭載頭摩擦或由於現場作業員的遮罩處理引起來自外部的衝擊之際,或進行高壓沖淋洗淨等遮罩洗淨之際,不與基板接觸側形成的內部突起也不會從遮罩本體剝離脫落的球陣列用遮罩及其製造方法。 [用以解決課題的手段]The present invention is formed to solve the above-mentioned problems, and provides high-pressure washing even when the ball loader's mounting head rubs during the ball loading operation, or the impact from the outside is caused by the mask processing of the field operator. When the mask is cleaned such as cleaning, the inner protrusions formed on the side that is not in contact with the substrate will not peel off from the mask body and the ball array mask and its manufacturing method. [Means to solve the problem]
根據本發明的球陣列用遮罩中,包括:遮罩本體,利用鍍層形成,且形成已搭載的導電球插通的複數開口部;以及複數突起,利用鍍層形成,不是導電球植入面而是與基板的電極對向側的遮罩本體背面在上述開口部以外的部分突出,互相分離獨立;其中,分離獨立的複數突起,由以下構成:內部突起,利用第1鍍層在不與基板接觸側形成;以及外部突起,在內部突起表面上利用不同於第1鍍層的第2鍍層覆蓋內部突起的周側面及基板側下面形成,成為與基板的電極對向側;內部突起,係軀幹部以及與軀幹部的頭部接連且比軀幹部更擴大徑的傘狀部構成的蘑菇型;遮罩本體,利用第2鍍層與外部突起一體形成;外部突起,覆蓋蘑菇型內部突起的軀幹部及傘狀部形成。The ball array mask according to the present invention includes: a mask body, which is formed by plating and forming a plurality of openings through which the mounted conductive balls are inserted; The back of the mask body on the side opposite to the electrode of the substrate protrudes beyond the above-mentioned opening, and is separated and independent from each other; among them, separate and independent plural protrusions are composed of the following: internal protrusions, which are not in contact with the substrate by the first plating layer And external protrusions, formed on the inner protrusion surface with a second plating layer different from the first plating layer covering the peripheral side of the internal protrusions and the underside of the substrate side, and become the side facing the electrode of the substrate; the internal protrusions are the trunk and Mushroom-shaped umbrella-shaped part that is connected to the head of the trunk and has a larger diameter than the trunk; the mask body is formed integrally with the external protrusions by the second plating layer; the external protrusions cover the trunk and the umbrella of the mushroom-shaped internal protrusions Shaped part formed.
又,蘑菇型內部突起,係軀幹部與傘狀部的連結部防止內部突起脫落的鉤部,內部突起的鉤部卡在外部突起的中間細部上,防止內部突起脫落。In addition, the mushroom-shaped internal protrusion is a hook that prevents the internal protrusion from falling off at the connecting portion of the trunk and the umbrella-shaped portion, and the hook of the internal protrusion is caught on the middle part of the external protrusion to prevent the internal protrusion from falling off.
又,根據本發明的球陣列用遮罩的製造方法,其中陣列用遮罩包括:遮罩本體,利用鍍層形成,且形成已搭載的導電球插通的複數開口部;以及複數突起,利用鍍層形成,不是導電球植入面而是與基板的電極對向側的遮罩本體背面在上述開口部以外的部分突出,互相分離獨立;其中,分離獨立的複數突起,由以下構成:內部突起,利用第1鍍層在不與基板接觸側形成;以及外部突起,在內部突起表面上利用不同於第1鍍層的第2鍍層覆蓋內部突起的周側面及基板側下面形成,成為與基板的電極對向側;內部突起,係軀幹部以及與軀幹部的頭部接連且比軀幹部更擴大徑的傘狀部構成的蘑菇型;遮罩本體,利用第2鍍層與外部突起一體形成;外部突起,覆蓋蘑菇型內部突起的軀幹部及傘狀部形成;上述製造方法包括:SUS母材上形成厚度t1的內部突起形成用光阻層的步驟;蘑菇型內部突起超過內部突起形成用光阻層厚度t1突出,藉由在SUS母材上鍍層成比光阻層厚度t1更厚的既定高度t2,形成第1鍍層的步驟;第1鍍層形成結束後,除去蘑菇型突起以外的第1鍍層,SUS母材上留下利用此第1鍍層產生的蘑菇型內部突起的步驟;除去蘑菇型內部突起的周圍留下的內部突起形成用光阻層的步驟;SUS母材上蘑菇型內部突起間形成複數開口部形成用光阻層的步驟;藉由在SUS母材上及蘑菇型內部突起上鍍層,使遮罩本體成為指定的厚度,形成第2鍍層的步驟;第2鍍層形成結束後,除去複數開口部形成用光阻層的步驟;以及從SUS母材剝離第1鍍層構成的蘑菇型內部突起及第2鍍層構成的外部突起與遮罩本體的鍍層的步驟。 [發明效果]In addition, according to the method of manufacturing a ball array mask of the present invention, the array mask includes: a mask body formed by plating and forming a plurality of openings through which the mounted conductive balls are inserted; and a plurality of protrusions using the plating layer Formed, not the conductive ball implantation surface but the back of the mask body on the side opposite to the electrode of the substrate protruding from the part other than the above-mentioned opening, and are separated and independent from each other; wherein the separated and independent plural protrusions are composed of the following: internal protrusions, The first plating layer is formed on the side that is not in contact with the substrate; and the outer protrusions are formed on the surface of the inner protrusions to cover the peripheral side surfaces of the inner protrusions and the underside of the substrate side with a second plating layer different from the first plating layer, so as to face the electrodes of the substrate Side; internal protrusion, a mushroom-shaped part of the trunk and an umbrella part that is connected to the head of the trunk and has a larger diameter than the trunk; the main body of the mask is formed integrally with the external protrusion by the second plating layer; the external protrusion, covering Formation of the trunk and umbrella-shaped parts of mushroom-shaped internal protrusions; the above-mentioned manufacturing method includes: forming a photoresist layer of thickness t1 on the SUS base material; the mushroom-shaped internal protrusion exceeds the thickness t1 of the photoresist layer for internal protrusion formation Protruding, the step of forming the first plating layer by plating the SUS base material to a predetermined height t2 thicker than the thickness t1 of the photoresist layer; after the formation of the first plating layer is completed, the first plating layer other than the mushroom-shaped protrusions is removed, the SUS mother The step of leaving the mushroom-shaped internal protrusions produced by the first plating layer on the material; the step of removing the photoresist layer for forming the internal protrusions left around the mushroom-shaped internal protrusions; the SUS base material forms a plurality of openings between the mushroom-shaped internal protrusions The step of forming the photoresist layer for the part; the step of forming the second plating layer by plating the SUS base material and the mushroom-shaped internal protrusions so that the mask body has a specified thickness; after the second plating layer is formed, the plural openings are removed A step of forming a photoresist layer for the part; and a step of peeling the mushroom-shaped inner protrusions formed by the first plating layer and the outer protrusions formed by the second plating layer and the plating layer of the mask body from the SUS base material. [Effects of the invention]
根據本發明,球陣列用遮罩的構成為:內部突起,利用第1鍍層在不與上述基板接觸側形成;以及外部突起,在此內部突起表面上利用第2鍍層覆蓋內部突起的周側面及基板側下面形成,成為與基板的電極對向側;其中,即使受到球裝載作業時發生球裝載機的搭載頭摩擦或由於現場作業員的遮罩處理引起來自外部的衝擊之際,或進行高壓沖淋洗淨等遮罩洗淨之際,也可以得到不與基板接觸側形成的內部突起不會從遮罩本體剝離脫落的效果。According to the present invention, the ball array mask is composed of: internal protrusions, which are formed on the side not in contact with the substrate by the first plating layer; The underside of the substrate is formed on the side facing the electrode of the substrate; among them, even if the ball loader's loading head rubs during the ball loading operation, or the impact from the outside is caused by the masking process of the field operator, or high voltage is applied When the mask is cleaned such as rinsing, it is possible to obtain the effect that the internal protrusions formed on the side not in contact with the substrate will not peel off from the mask body.
為了更詳細說明本發明,根據附加的圖面說明此說明。又,各圖中,相同或相當的部分附上相同的符號,適當地不簡化而省略其重複說明。In order to explain the present invention in more detail, this description is explained based on the attached drawings. In addition, in each figure, the same or corresponding parts are denoted by the same reference numerals, and repetitive descriptions are omitted without simplification as appropriate.
第1實施例 第1圖係依步驟順序顯示本發明的第1實施例中球陣列用遮罩的製造方法之剖面圖,第2圖係依步驟順序顯示本發明的第1實施例中球陣列用遮罩的製造方法之平面圖,第3圖係顯示本發明的第1實施例中球陣列用遮罩的製造方法中途的步驟之剖面圖,第4圖係顯示本發明的第1實施例中球陣列用遮罩的製造方法中途的步驟之平面圖,第5圖係放大顯示本發明的第1實施例中球陣列用遮罩的柱狀突起的要部剖面圖。又,此第1實施例中舉圓柱狀突起為例說明,但突起形狀是多角形、橢圓形、細長的矩形或細長並水平延伸的突出狀(protrusion)等也可以,形狀也不限於圓柱狀。The first embodiment Fig. 1 is a cross-sectional view showing the manufacturing method of the ball array mask in the first embodiment of the present invention in the order of steps, and Fig. 2 shows the mask for the ball array in the first embodiment of the present invention in the order of steps A plan view of the manufacturing method. Fig. 3 is a cross-sectional view showing a step in the process of manufacturing a mask for a ball array in the first embodiment of the present invention, and Fig. 4 is a cross-sectional view showing a mask for a ball array in the first embodiment of the present invention. FIG. 5 is a plan view showing a step in the middle of the manufacturing method of the cover, and FIG. 5 is an enlarged sectional view showing the main part of the columnar protrusion of the ball array mask in the first embodiment of the present invention. In addition, in this first embodiment, a cylindrical protrusion is taken as an example. However, the shape of the protrusion may be a polygon, an ellipse, an elongated rectangle, or an elongated horizontally extending protrusion (protrusion), and the shape is not limited to a cylindrical shape. .
根據第1〜5圖說明本發明的第1實施例中球陣列用遮罩的製造方法。又,第1圖的剖面圖顯示複數開口部5a的左右兩側形成內部突起3a和外部突起5a各2個的情況,第2圖的平面圖顯示複數開口部5a的左右兩側形成內部突起3a和外部突起5a各1個的情況。
首先,SUS母材1上壓層光阻,進行所需的曝光、顯像處理,SUS母材1上部分形成厚度t1 (例如,光阻厚30μm(微米)) 的內部突起形成用光阻層2(參照第1 (a)圖、第2 (a)圖)。此內部突起形成用光阻層2,例如是中空圓柱狀等。其次,例如,蘑菇型內部突起3a超過內部突起形成用光阻層2的厚度t1突出,為了形成比光阻層2的厚度t1更厚的既定高度(厚度)t2(例如,突起高度40μm),藉由在SUS母材1上進行全體鍍層,形成突出厚度t2的頭部的第1鍍層3(參照第1(b)圖、第2(b)圖)。在此,因為內部突起形成用光阻層2的厚度t1與第1鍍層3的厚度t2的關係是t1>t2,會以超過內部突起形成用光阻層2的厚度t1突出的形狀進行第1鍍層3的鍍層。藉此,蘑菇型內部突起3a,雖然軀幹部3b是圓柱狀為止,但由於其頭部突出,形成比軀幹部3b更擴大徑的傘狀部3c,全體的形狀成為蘑菇型。蘑菇型內部突起3a的軀幹部3b與傘狀部3c的連結部成為剖面L字形的欠落防止用鉤部3d。於是,第1鍍層3的形成結束後,與習知的製造方法不同,先全部除去蘑菇型內部突起3a以外的第1鍍層3,SUS母材1上只留下第1鍍層3的蘑菇型內部突起3a的同時,留下內部突起形成用光阻層2(參照第1(c)、2(c)、3、4圖)。之後,實施膨潤剝離(胺)+溶解剝離,除去蘑菇型內部突起3a的周圍留下的內部突起用光阻層2(參照第1(d)、2(d)圖)。於是,SUS母材1上黏貼開口部形成用光阻4(參照第1(e)圖)。進行所需的曝光、顯像處理,SUS母材1上的蘑菇型內部突起3a間形成複數開口部形成用光阻層4a(參照第1(f)、2(f)圖)。其次,藉由在SUS母材1上及蘑菇型內部突起3a上將遮罩本體5鍍層成為指定厚度,形成第2鍍層5(參照第1(g)、2(g)圖)。進行第2鍍層5的鍍層以覆蓋SUS母材1上及蘑菇型內部突起3a的軀幹部3b與傘狀部3c。藉此,作為蘑菇型內部突起3a的軀幹部3b與傘狀部3c的連結部之剖面L字形脫落防止用鉤部3d,因為卡在呈現第2鍍層5形成的縱剖面Ω形狀的圓柱狀外部突起5b的中間細部上,不會從遮罩本體剝離脫落(參照第5圖)。於是,除去複數開口部形成用光阻層4a時,成為蘑菇型內部突起3a間形成導電球插通的複數開口部5a之第2鍍層5(參照第1(h)圖)。最後,從SUS母材1剝離第1鍍層3構成的蘑菇型內部突起3a及呈現第2鍍層5構成的縱剖面Ω形狀的圓柱狀外部突起5b與遮罩本體(參照第1(i)圖)。根據上述,完成球陣列用遮罩。形成導電球插通的複數開口部5a的部分是球裝載區域。完成的球陣列用遮罩的圓柱狀外部突起5b的前端部,如第5圖所示,縱剖面是具圓形的Ω形狀。因此,既使進行高壓沖淋洗淨等之際,作為蘑菇型內部突起3a的軀幹部3b與傘狀部3c的連結部之剖面L字形脫落防止用鉤部3d,因為卡在呈現第2鍍層5形成的縱剖面Ω形狀的圓柱狀外部突起5b的中間細部上,不會從遮罩本體剝離脫落。又,突起形狀是多角形、橢圓形、細長的矩形或細長並水平延伸的突出狀(protrusion)等也可以,形狀不限於圓柱狀。The method of manufacturing the mask for the ball array in the first embodiment of the present invention will be described based on FIGS. 1 to 5. In addition, the cross-sectional view of Figure 1 shows a case where two
第2實施例
第6圖係顯示本發明的第2實施例中球陣列用遮罩的製造方法中途的步驟之平面圖。
本發明的第2實施例中,即使受到球裝載作業時發生球裝載機的搭載頭摩擦或由於現場作業員的遮罩處理引起來自外部的衝擊之際,或進行高壓沖淋洗淨等遮罩洗淨之際,為了避免不與基板接觸側形成的內部突起從遮罩本體剝離脫落,內部突起3a的水平剖面形狀,例如採用第6圖所示的形狀。即,如第6圖所示,內部突起3a,儘量增大與第2鍍層5及外部突起5b的接觸部分中的接合面積,提高錨定效果。首先,第6(a)圖係內部突起3a的水平剖面形狀從周緣2處往中心形成2條橫裂口3e到中途,2條橫裂口3e未到達中心部。又,第6(b)圖係內部突起3a的水平剖面形狀從周緣4處往中心形成4條縱橫裂口3f到中途,4條縱橫裂口3f未到達中心部。又,第6(c)圖係形成內部突起3a的水平剖面形狀成甜甜圈狀,內部突起3a的中央部3g係挖空的形狀。
如上述,內部突起3a的水平剖面形狀從周緣2處往中心形成2條橫裂口3e到中途(第6(a)圖)、從周緣4處往中心形成4條縱橫裂口3f到中途(第6(b)圖)、形成中央部挖空的甜甜圈狀(第6(c)圖),都是儘量增大內部突起3a與第2二次鍍層5及外部突起5b的接觸部分中的接合面積,因為藉由提高錨定效果可以防止內部突起3a脫落,即使受到球裝載作業時發生球裝載機的搭載頭摩擦或由於現場作業員的遮罩處理引起來自外部的衝擊之際,或進行高壓沖淋洗淨等的遮罩洗淨之際,內部突起3a也不會從遮罩本體剝離脫落。Example 2
Fig. 6 is a plan view showing a step in the middle of the manufacturing method of the ball array mask in the second embodiment of the present invention.
In the second embodiment of the present invention, even when the loading head of the ball loader is rubbed during the ball loading operation, or the impact from the outside is caused by the mask processing of the field operator, or the mask is subjected to high-pressure washing, etc. During cleaning, in order to prevent the internal protrusions formed on the side not in contact with the substrate from peeling off from the mask body, the horizontal cross-sectional shape of the
1:SUS母材
2:內部突起形成用光阻層
3:第1鍍層
3a:蘑菇型內部突起
3b:內部突起的軀幹部
3c:內部突起的傘狀部
3d:內部突起的脫落防止用鉤部
3e:內部突起的2條橫裂口
3f:內部突起的4條縱橫裂口
3g:內部突起的中央部
4:開口部形成用光阻
4a:複數開口部形成用光阻層
5:第2鍍層(遮罩本體)
5a:複數開口部
5b:圓柱狀(縱剖面Ω形狀)外部突起
11:SUS母材
12:突起形成用光阻層
13:第1鍍層
13a:圓柱狀內部突起
14:開口部形成用光阻
14a:複數開口部形成用光阻層
15:第2鍍層(遮罩本體)
15a:複數開口部
15b:圓柱狀外部突起1: SUS base material
2: Photoresist layer for forming internal protrusions
3: The
[第1圖]係依步驟順序顯示本發明的第1實施例中球陣列用遮罩的製造方法之剖面圖; [第2圖]係依步驟順序顯示本發明的第1實施例中球陣列用遮罩的製造方法之平面圖; [第3圖]係顯示本發明的第1實施例中球陣列用遮罩的製造方法中途的步驟之剖面圖; [第4圖]係顯示本發明的第1實施例中球陣列用遮罩的製造方法中途的步驟之平面圖; [第5圖]係放大顯示本發明的第1實施例中球陣列用遮罩的柱狀突起的要部剖面圖; [第6圖]係顯示本發明的第2實施例中球陣列用遮罩的製造方法中途的步驟之平面圖; [第7圖]係依步驟順序顯示習知的球陣列用遮罩的製造方法之剖面圖; [第8圖]係放大顯示習知的球陣列用遮罩的柱狀突起的要部剖面圖;[Figure 1] is a cross-sectional view showing the manufacturing method of the ball array mask in the first embodiment of the present invention in the order of steps; [Figure 2] is a plan view showing the manufacturing method of the ball array mask in the first embodiment of the present invention in the order of steps; [Figure 3] is a cross-sectional view showing a step in the middle of the manufacturing method of the ball array mask in the first embodiment of the present invention; [Figure 4] is a plan view showing a step in the middle of the manufacturing method of the ball array mask in the first embodiment of the present invention; [Figure 5] An enlarged cross-sectional view showing the main part of the columnar protrusion of the ball array mask in the first embodiment of the present invention; [FIG. 6] A plan view showing a step in the middle of the manufacturing method of the mask for the ball array in the second embodiment of the present invention; [Figure 7] is a cross-sectional view showing the manufacturing method of the conventional ball array mask in the order of steps; [Figure 8] An enlarged cross-sectional view showing the main part of the columnar protrusion of the conventional ball array mask;
1:SUS母材1: SUS base material
2:內部突起形成用光阻層2: Photoresist layer for forming internal protrusions
3:第1鍍層3: The first coating
3a:蘑菇型內部突起3a: Mushroom-shaped internal protrusion
3b:內部突起的軀幹部3b: Internal protruding torso
3c:內部突起的傘狀部3c: Umbrella protruding inside
4:開口部形成用光阻4: Photoresist for forming openings
4a:複數開口部形成用光阻層4a: Photoresist layer for forming plural openings
5:第2鍍層(遮罩本體)5: The second plating layer (mask body)
5a:複數開口部5a: Plural openings
5b:圓柱狀(縱剖面Ω形狀)外部突起5b: cylindrical (longitudinal section Ω shape) external protrusion
t1:光阻厚t1: Thickness of photoresist
t2:內部突起鍍層厚t2: Thickness of inner protrusion coating
Claims (5)
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