TW202125006A - Image display - Google Patents

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TW202125006A
TW202125006A TW108147044A TW108147044A TW202125006A TW 202125006 A TW202125006 A TW 202125006A TW 108147044 A TW108147044 A TW 108147044A TW 108147044 A TW108147044 A TW 108147044A TW 202125006 A TW202125006 A TW 202125006A
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Taiwan
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light
top surface
transmitting body
light source
reflective
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TW108147044A
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Chinese (zh)
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廖建碩
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台灣愛司帝科技股份有限公司
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Priority to TW108147044A priority Critical patent/TW202125006A/en
Priority to CN202010448393.8A priority patent/CN113012560A/en
Publication of TW202125006A publication Critical patent/TW202125006A/en

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    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09FDISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Planar Illumination Modules (AREA)

Abstract

The present invention provides an image display including a display module and a backlight module. The backlight module is disposed under the display module to provide a backlight source for the display module. The backlight module includes a carrier substrate and a light-emitting unit. The carrier substrate includes a light-transmitting body, a conductive circuit layer disposed on a top surface of the light-transmitting body, and a bottom light-reflecting structure disposed on a bottom surface of the light-transmitting body. The light-emitting unit includes a plurality of light-emitting elements disposed on the top surface of the light-transmitting body, and each light-emitting element is electrically connected to the conductive circuit layer. An initial light source generated by each light-emitting element passes through the top surface of the light-transmitting body so as to project onto the bottom light-reflecting structure, the initial light source is reflected by the bottom light-reflecting structure to form a reflective light source, and the reflective light source passes through the top surface of the light-transmitting body again to form a projecting light source that is projected out of the light-transmitting body. Therefore, the initial light source generated by each light-emitting element can be reflected by the bottom light-reflecting structure to form the projecting light source that is projected out of the light-transmitting body.

Description

影像顯示器Video display

本發明涉及一種影像顯示器,特別是涉及一種使用背光模組的影像顯示器。The invention relates to an image display, in particular to an image display using a backlight module.

現有的影像顯示器需要搭配背光模組來使用,但是現有的背光模組仍具有可改善空間。The existing image display needs to be used with a backlight module, but the existing backlight module still has room for improvement.

本發明所要解決的技術問題在於,針對現有技術的不足提供一種影像顯示器。The technical problem to be solved by the present invention is to provide an image display for the shortcomings of the prior art.

為了解決上述的技術問題,本發明所採用的其中一技術方案是提供一種影像顯示器,其包括一顯示模組以及一背光模組。所述背光模組設置於所述顯示模組的下方,以提供背光光源給所述顯示模組。背光模組包括一承載基板以及一發光單元。所述承載基板包括一透光本體、設置在所述透光本體的一頂面上的一導電線路層以及設置在所述透光本體的一底面上的一底面反光結構。所述發光單元包括設置在所述透光本體的所述頂面上的多個發光元件,每一所述發光元件電性連接於該導電線路層。其中,每一所述發光元件所產生的一初始光源穿過所述透光本體的所述頂面而投射到所述底面反光結構,所述初始光源透過所述底面反光結構的反射而形成一反射光源,且所述反射光源再次穿過所述透光本體的所述頂面而形成投射到所述透光本體的外部的一投射光源。In order to solve the above technical problems, one of the technical solutions adopted by the present invention is to provide an image display, which includes a display module and a backlight module. The backlight module is arranged below the display module to provide a backlight light source for the display module. The backlight module includes a carrier substrate and a light emitting unit. The carrier substrate includes a light-transmitting body, a conductive circuit layer arranged on a top surface of the light-transmitting body, and a bottom surface reflective structure arranged on a bottom surface of the light-transmitting body. The light-emitting unit includes a plurality of light-emitting elements arranged on the top surface of the light-transmitting body, and each of the light-emitting elements is electrically connected to the conductive circuit layer. Wherein, an initial light source generated by each of the light-emitting elements passes through the top surface of the light-transmitting body and is projected onto the bottom reflective structure, and the initial light source is reflected by the bottom reflective structure to form a A reflective light source, and the reflective light source passes through the top surface of the light-transmitting body again to form a projection light source projected to the outside of the light-transmitting body.

為了解決上述的技術問題,本發明所採用的另外一技術方案是提供一種影像顯示器,其包括一顯示模組以及一背光模組。所述背光模組設置於所述顯示模組的下方,以提供背光光源給所述顯示模組。背光模組包括一承載基板以及一發光單元。所述承載基板包括一透光本體、設置在所述透光本體的一頂面上的一導電線路層以及設置在所述透光本體的一底面上的一底面反光結構。所述發光單元包括多個發光元件,每一所述發光元件電性連接於該導電線路層。其中,每一所述發光元件所產生的一初始光源透過所述底面反光結構的反射而形成投射到所述透光本體的外部的一投射光源。In order to solve the above technical problems, another technical solution adopted by the present invention is to provide an image display, which includes a display module and a backlight module. The backlight module is arranged below the display module to provide a backlight light source for the display module. The backlight module includes a carrier substrate and a light emitting unit. The carrier substrate includes a light-transmitting body, a conductive circuit layer arranged on a top surface of the light-transmitting body, and a bottom surface reflective structure arranged on a bottom surface of the light-transmitting body. The light-emitting unit includes a plurality of light-emitting elements, and each of the light-emitting elements is electrically connected to the conductive circuit layer. Wherein, an initial light source generated by each of the light-emitting elements is reflected by the bottom reflective structure to form a projection light source projected to the outside of the light-transmitting body.

為了解決上述的技術問題,本發明所採用的另外再一技術方案是提供一種影像顯示器,其包括一顯示模組以及一背光模組。所述背光模組設置於所述顯示模組的下方,以提供背光光源給所述顯示模組。背光模組包括一承載基板以及一發光單元。所述承載基板包括一透光本體以及設置在所述透光本體的一底面上的一底面反光結構。所述發光單元包括設置在所述透光本體上的多個發光元件。其中,每一所述發光元件所產生的一初始光源透過所述底面反光結構的反射而形成投射到所述透光本體的外部的一投射光源。In order to solve the above technical problems, another technical solution adopted by the present invention is to provide an image display, which includes a display module and a backlight module. The backlight module is arranged below the display module to provide a backlight light source for the display module. The backlight module includes a carrier substrate and a light emitting unit. The carrier substrate includes a light-transmitting body and a bottom light-reflecting structure arranged on a bottom surface of the light-transmitting body. The light-emitting unit includes a plurality of light-emitting elements arranged on the light-transmitting body. Wherein, an initial light source generated by each of the light-emitting elements is reflected by the bottom reflective structure to form a projection light source projected to the outside of the light-transmitting body.

更進一步來說,所述承載基板包括設置在所述透光本體的所述頂面上的一頂面反光結構,所述頂面反光結構包括分別圍繞多個所述發光元件的多個頂面粗化結構,且所述頂面粗化結構包括依續相連的多個頂端反光面;其中,每一所述發光元件所產生的所述初始光源投射到相對應的所述頂面粗化結構,且所述初始光源透過相對應的所述頂面粗化結構的反射而形成投射到所述透光本體的外部的另一投射光源。Furthermore, the carrier substrate includes a top surface reflective structure disposed on the top surface of the light-transmitting body, and the top surface reflective structure includes a plurality of top surfaces surrounding a plurality of the light-emitting elements. A roughened structure, and the roughened top surface includes a plurality of top reflective surfaces that are successively connected; wherein, the initial light source generated by each light-emitting element is projected onto the corresponding roughened top structure And the initial light source forms another projection light source projected to the outside of the light-transmitting body by reflecting the corresponding roughened top surface structure.

本發明的其中一有益效果在於,本發明所提供的影像顯示器,其能通過“所述承載基板包括一透光本體以及設置在所述透光本體的一底面上的一底面反光結構”以及“所述發光單元包括設置在所述透光本體上的多個發光元件”的技術方案,以使得每一所述發光元件所產生的一初始光源能透過所述底面反光結構的反射,而形成投射到所述透光本體的外部的一投射光源,以供所述顯示模組使用。One of the beneficial effects of the present invention is that the image display provided by the present invention can pass through "the carrier substrate includes a light-transmitting body and a bottom reflective structure provided on a bottom surface of the light-transmitting body" and " The light-emitting unit includes a plurality of light-emitting elements arranged on the light-transmitting body, so that an initial light source generated by each light-emitting element can pass through the reflection of the bottom reflective structure to form a projection A projection light source to the outside of the transparent body is used by the display module.

本發明的另外一有益效果在於,本發明所提供的影像顯示器,其能通過“所述承載基板包括設置在所述透光本體的所述頂面上的一頂面反光結構”以及“所述頂面反光結構包括分別圍繞多個所述發光元件的多個頂面粗化結構”的技術方案,以使得每一所述發光元件所產生的一初始光源能透過相對應的所述頂面粗化結構的反射,而形成投射到所述透光本體的外部的另一投射光源,以供所述顯示模組使用。Another beneficial effect of the present invention is that the image display provided by the present invention can pass "the carrier substrate includes a top surface reflective structure provided on the top surface of the light-transmitting body" and "the The top surface reflective structure includes a plurality of top surface roughening structures respectively surrounding a plurality of the light-emitting elements, so that an initial light source generated by each light-emitting element can pass through the corresponding rough top surface. The reflection of the chemical structure forms another projection light source projected to the outside of the light-transmitting body for use by the display module.

為使能更進一步瞭解本發明的特徵及技術內容,請參閱以下有關本發明的詳細說明與圖式,然而所提供的圖式僅用於提供參考與說明,並非用來對本發明加以限制。In order to further understand the features and technical content of the present invention, please refer to the following detailed description and drawings about the present invention. However, the provided drawings are only for reference and description, and are not used to limit the present invention.

以下是通過特定的具體實施例來說明本發明所公開有關“顯像顯示器”的實施方式,本領域技術人員可由本說明書所公開的內容瞭解本發明的優點與效果。本發明可通過其他不同的具體實施例加以施行或應用,本說明書中的各項細節也可基於不同觀點與應用,在不悖離本發明的構思下進行各種修改與變更。另外,本發明的附圖僅為簡單示意說明,並非依實際尺寸的描繪,事先聲明。以下的實施方式將進一步詳細說明本發明的相關技術內容,但所公開的內容並非用以限制本發明的保護範圍。The following is a specific embodiment to illustrate the implementation of the "display display" disclosed in the present invention. Those skilled in the art can understand the advantages and effects of the present invention from the content disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and various details in this specification can also be based on different viewpoints and applications, and various modifications and changes can be made without departing from the concept of the present invention. In addition, the drawings of the present invention are merely schematic illustrations, and are not drawn according to actual dimensions, and are stated in advance. The following embodiments will further describe the related technical content of the present invention in detail, but the disclosed content is not intended to limit the protection scope of the present invention.

請參閱圖1至圖4所示(或者參閱圖1至圖3以及圖10至圖11所示,或者參閱圖1、圖12以及圖13所示),本發明提供一種背光模組的製作方法,其包括:首先,配合圖1與圖2所示,提供一初始基板1a(步驟S100);接著,配合圖1至圖3所示(或者配合圖1、圖2以及圖10所示,或者配合圖1、圖12以及圖13所示)對初始基板1a進行加工,以形成一承載基板1(步驟S102),承載基板1至少包括一透光本體10、設置在透光本體10的一頂面1001上的一導電線路層11以及設置在透光本體10的一底面1002上的一底面反光結構12;然後,配合圖1與圖4所示(或者配合圖1與圖11所示,或者配合圖1與圖14所示),將多個發光元件20設置在透光本體10的頂面1001上(步驟S104),每一發光元件20會電性連接於該導電線路層11。Please refer to Figures 1 to 4 (or refer to Figures 1 to 3 and Figures 10 to 11, or refer to Figures 1, 12 and 13), the present invention provides a method for manufacturing a backlight module , Which includes: first, as shown in Fig. 1 and Fig. 2, providing an initial substrate 1a (step S100); then, as shown in Fig. 1 to Fig. 3 (or as shown in Fig. 1, Fig. 2 and Fig. 10, or As shown in Figure 1, Figure 12 and Figure 13), the initial substrate 1a is processed to form a carrier substrate 1 (step S102). The carrier substrate 1 includes at least a light-transmitting body 10 and a top A conductive circuit layer 11 on the surface 1001 and a bottom reflective structure 12 disposed on a bottom surface 1002 of the light-transmitting body 10; then, as shown in FIGS. 1 and 4 (or as shown in FIGS. 1 and 11, or As shown in FIG. 1 and FIG. 14, a plurality of light-emitting elements 20 are arranged on the top surface 1001 of the light-transmitting body 10 (step S104 ), and each light-emitting element 20 is electrically connected to the conductive circuit layer 11.

舉例來說,配合圖2與圖3所示,在步驟S102中,底面反光結構12可以是“利用移除初始基板1a的部分材料”的方式所形成(移除材料的方式可以是,例如利用打磨或者切削加工等方式),或者是利用“另外增加部分材料於初始基板1a上”的方式所形成(增加材料的方式可以是,例如利用噴塗、印刷、塗佈或者半導體加工等方式)。然而,本發明不以此段落所舉的例子為限。For example, as shown in FIG. 2 and FIG. 3, in step S102, the bottom reflective structure 12 may be formed by "removing part of the material of the initial substrate 1a" (the material removal method may be, for example, using Grinding or cutting processing, etc.), or formed by "adding additional material on the initial substrate 1a" (the method of adding materials can be, for example, spraying, printing, coating, or semiconductor processing). However, the present invention is not limited to the examples given in this paragraph.

舉例來說,配合圖3與圖10所示,在步驟S102中,底面反光結構12可以是“利用移除初始基板1a的部分材料”的方式所形成(移除材料的方式可以是,例如利用打磨或者切削加工等方式),或者是利用“另外增加部分材料於初始基板1a上”的方式所形成(增加材料的方式可以是,例如利用噴塗、印刷、塗佈或者半導體加工等方式)。另外,在步驟S102中,一不透光層120可以透過噴塗、印刷、塗佈或者半導體加工等方式覆蓋在底面反光結構12上。然而,本發明不以此段落所舉的例子為限。For example, as shown in FIG. 3 and FIG. 10, in step S102, the bottom reflective structure 12 may be formed by "removing part of the material of the initial substrate 1a" (the material removal method may be, for example, using Grinding or cutting processing, etc.), or formed by "adding additional material on the initial substrate 1a" (the method of adding materials can be, for example, spraying, printing, coating, or semiconductor processing). In addition, in step S102, an opaque layer 120 may be covered on the bottom reflective structure 12 through spraying, printing, coating, or semiconductor processing. However, the present invention is not limited to the examples given in this paragraph.

舉例來說,配合圖12與圖13所示,在步驟S102中,一具有粗化表面的底面粗化結構121或者一具有平整反光面的反光結構會先形成在一不透光層120上,然後再將包括有不透光層120與底面粗化結構121的底面反光結構12設置在初始基板1a(或者透光本體10)的底面1002上。另外,底面粗化結構121可以是“利用移除不透光層120的部分材料”的方式所形成(移除材料的方式可以是,例如利用打磨或者切削加工等方式),或者是利用“另外增加部分材料於不透光層120上”的方式所形成(增加材料的方式可以是,例如利用噴塗、印刷、塗佈或者半導體加工等方式)。然而,本發明不以此段落所舉的例子為限。For example, as shown in FIG. 12 and FIG. 13, in step S102, a roughened bottom structure 121 with a roughened surface or a reflective structure with a flat reflective surface is first formed on an opaque layer 120. Then, the bottom surface reflective structure 12 including the opaque layer 120 and the bottom surface roughened structure 121 is disposed on the bottom surface 1002 of the initial substrate 1 a (or the transparent body 10 ). In addition, the bottom surface roughening structure 121 can be formed by "removing part of the material of the opaque layer 120" (the way of removing material can be, for example, by grinding or cutting), or by using "other It is formed by adding part of the material on the opaque layer 120" (the way of adding material can be, for example, spraying, printing, coating, or semiconductor processing). However, the present invention is not limited to the examples given in this paragraph.

[第一實施例][First Embodiment]

參閱圖3至圖9所示,本發明第一實施例提供一種背光模組B,其包括:一承載基板1以及一發光單元2。Referring to FIG. 3 to FIG. 9, the first embodiment of the present invention provides a backlight module B, which includes: a carrier substrate 1 and a light-emitting unit 2.

更進一步來說,配合圖3至圖5所示,承載基板1包括一透光本體10、設置在透光本體10的一頂面1001上的一導電線路層11以及設置在透光本體10的一底面1002上的一底面反光結構12。另外,發光單元2包括設置在透光本體10的頂面1001上的多個發光元件20,並且每一發光元件20電性連接於該導電線路層11。Furthermore, as shown in FIGS. 3 to 5, the carrier substrate 1 includes a light-transmitting body 10, a conductive circuit layer 11 disposed on a top surface 1001 of the light-transmitting body 10, and a conductive circuit layer 11 disposed on the light-transmitting body 10. A bottom surface reflective structure 12 on a bottom surface 1002. In addition, the light-emitting unit 2 includes a plurality of light-emitting elements 20 arranged on the top surface 1001 of the light-transmitting body 10, and each light-emitting element 20 is electrically connected to the conductive circuit layer 11.

舉例來說,配合圖4與圖8所示,底面反光結構12可為直接形成在透光本體10的底面1002上的一具有粗化表面的底面粗化結構121或者一具有平整反光面的反光結構,並且底面粗化結構121包括依續相連的多個底端反光面1211。For example, as shown in FIG. 4 and FIG. 8, the bottom reflective structure 12 may be a bottom surface roughening structure 121 with a roughened surface directly formed on the bottom surface 1002 of the light-transmitting body 10 or a reflective bottom structure with a flat reflective surface. The structure, and the bottom surface roughening structure 121 includes a plurality of bottom end reflective surfaces 1211 successively connected.

舉例來說,配合圖4與圖5所示,透光本體10可以是由任何透明或者透光的絕緣材料所製成,包括有多個導電部110的導電線路層11可以是由任何透明或者透光的導電材料所製成,並且底面反光結構12可以是由任何的反光材料所製成。再者,具有一定厚度的底面反光結構12的內部還可以另外混入多個螢光粉顆粒(圖未示),以形成一具有反光功能的底面螢光層。另外,發光元件20可以是一種微型發光二極體晶片(micro LED chip),其至少包括一n型導電層、一發光層以及一p型導電層,n型導電層可為n型氮化鎵材料層或者n型砷化鎵材料層,發光層可為多量子井結構層,並且p型導電層可為p型氮化鎵材料層或者p型砷化鎵材料層。再者,發光元件20可以是一種次毫米發光二極體晶片(mini LED chip),其至少包括一基層、一n型導電層、一發光層以及一p型導電層,基層可為藍寶石基底層、石英基底層、玻璃基底層或者矽基底層,n型導電層可為n型氮化鎵材料層或者n型砷化鎵材料層,發光層可為多量子井結構層,並且p型導電層可為p型氮化鎵材料層或者p型砷化鎵材料層。然而,本發明不以此段落所舉的例子為限。For example, as shown in FIGS. 4 and 5, the light-transmitting body 10 can be made of any transparent or light-transmitting insulating material, and the conductive circuit layer 11 including the plurality of conductive parts 110 can be made of any transparent or It is made of light-transmitting conductive material, and the bottom reflective structure 12 can be made of any reflective material. Furthermore, a plurality of phosphor particles (not shown) can be mixed into the bottom surface reflective structure 12 with a certain thickness to form a bottom surface fluorescent layer with a reflective function. In addition, the light-emitting element 20 may be a micro LED chip, which includes at least an n-type conductive layer, a light-emitting layer, and a p-type conductive layer. The n-type conductive layer may be n-type gallium nitride. The material layer or the n-type gallium arsenide material layer, the light-emitting layer may be a multi-quantum well structure layer, and the p-type conductive layer may be a p-type gallium nitride material layer or a p-type gallium arsenide material layer. Furthermore, the light-emitting element 20 may be a sub-millimeter light-emitting diode chip (mini LED chip), which includes at least a base layer, an n-type conductive layer, a light-emitting layer, and a p-type conductive layer. The base layer may be a sapphire base layer. , Quartz base layer, glass base layer or silicon base layer, the n-type conductive layer can be an n-type gallium nitride material layer or an n-type gallium arsenide material layer, the light-emitting layer can be a multi-quantum well structure layer, and a p-type conductive layer It can be a p-type gallium nitride material layer or a p-type gallium arsenide material layer. However, the present invention is not limited to the examples given in this paragraph.

舉例來說,如圖5所示,每一發光元件20可以透過至少兩個導電體W1(例如錫球)以分別電性連接於導電線路層11的兩個導電部110。或者,如圖6所示,每一發光元件20可以透過至少兩個導電線W2以分別電性連接於導電線路層11的兩個導電部110。或者,如圖7所示,每一發光元件20可以透過至少一導電體W1(例如錫膏)與至少一導電線W2,以分別電性連接於導電線路層11的兩個導電部110。然而,本發明不以此段落所舉的例子為限。For example, as shown in FIG. 5, each light-emitting element 20 can pass through at least two conductive bodies W1 (such as solder balls) to be electrically connected to the two conductive portions 110 of the conductive circuit layer 11 respectively. Alternatively, as shown in FIG. 6, each light-emitting element 20 can pass through at least two conductive wires W2 to be electrically connected to the two conductive portions 110 of the conductive circuit layer 11 respectively. Alternatively, as shown in FIG. 7, each light-emitting element 20 can pass through at least one conductive body W1 (such as solder paste) and at least one conductive wire W2 to be electrically connected to the two conductive portions 110 of the conductive circuit layer 11 respectively. However, the present invention is not limited to the examples given in this paragraph.

舉例來說,如圖8所示,每一發光元件20包括用於產生一初始光源L1的一發光層201以及用於反射初始光源L1的一反光層202。藉此,當每一發光元件20所產生的初始光源L1穿過透光本體10的頂面1001而投射到底面反光結構12時,初始光源L1會透過底面反光結構12(或是包括有多個底端反光面1211的底面粗化結構121)的反射而形成一反射光源L2,並且反射光源L2會再次穿過透光本體10的頂面1001而形成投射到透光本體10的外部的一投射光源L3。也就是說,每一發光元件20所產生的一初始光源L1能透過底面反光結構12(或是包括有多個底端反光面1211的底面粗化結構121)的反射,而形成投射到透光本體10的外部的一投射光源L3。For example, as shown in FIG. 8, each light-emitting element 20 includes a light-emitting layer 201 for generating an initial light source L1 and a light-reflecting layer 202 for reflecting the initial light source L1. Thereby, when the initial light source L1 generated by each light-emitting element 20 passes through the top surface 1001 of the light-transmitting body 10 and is projected onto the bottom reflective structure 12, the initial light source L1 will pass through the bottom reflective structure 12 (or include a plurality of The reflection of the bottom surface roughened structure 121) of the bottom reflective surface 1211 forms a reflective light source L2, and the reflective light source L2 will pass through the top surface 1001 of the light-transmitting body 10 again to form a projection projected to the outside of the light-transmitting body 10. Light source L3. That is to say, an initial light source L1 generated by each light-emitting element 20 can pass through the reflection of the bottom reflective structure 12 (or the bottom roughened structure 121 including a plurality of bottom reflective surfaces 1211) to form a projection to the transmissive light. A projection light source L3 outside the main body 10.

值得注意的是,藉由反光層202的使用,每一發光元件20所產生的初始光源L1能更有效地投向底面反光結構12,而能有效地降低光損。It is worth noting that through the use of the reflective layer 202, the initial light source L1 generated by each light-emitting element 20 can be more effectively projected to the bottom reflective structure 12, and the light loss can be effectively reduced.

值得注意的是,如圖9所示,依據不同的使用需求,承載基板1還能進一步包括設置在透光本體10的頂面1001上的一頂面反光結構13。舉例來說,頂面反光結構13包括分別圍繞多個發光元件20的多個頂面粗化結構131,並且頂面粗化結構131包括依續相連的多個頂端反光面1310。再者,具有一定厚度的頂面反光結構13的內部還可以另外混入多個螢光粉顆粒(圖未示),以形成一具有反光功能的頂面螢光層。藉此,當每一發光元件20所產生的初始光源L1投射到相對應的頂面粗化結構131(或是包括有多個頂端反光面1310的頂面粗化結構131),並且初始光源L1能透過相對應的頂面粗化結構131的反射而形成投射到透光本體10的外部的另一投射光源L4。也就是說,每一發光元件20所產生的初始光源L1還能透過相對應的頂面粗化結構131(或是包括有多個頂端反光面1310的頂面粗化結構131)的反射,而形成投射到透光本體10的外部的另一投射光源L4。It is worth noting that, as shown in FIG. 9, according to different usage requirements, the carrier substrate 1 can further include a top surface reflective structure 13 provided on the top surface 1001 of the light-transmitting body 10. For example, the top surface reflective structure 13 includes a plurality of top surface roughening structures 131 respectively surrounding the plurality of light emitting elements 20, and the top surface roughening structure 131 includes a plurality of top surface reflective surfaces 1310 connected in succession. Furthermore, a plurality of phosphor particles (not shown) can be mixed into the top surface reflective structure 13 with a certain thickness to form a top surface fluorescent layer with a reflective function. Accordingly, when the initial light source L1 generated by each light-emitting element 20 is projected onto the corresponding top surface roughening structure 131 (or the top surface roughening structure 131 including a plurality of top reflective surfaces 1310), and the initial light source L1 Another projection light source L4 projected to the outside of the light-transmitting body 10 can be formed through the reflection of the corresponding top surface roughening structure 131. That is, the initial light source L1 generated by each light-emitting element 20 can also be reflected by the corresponding top surface roughening structure 131 (or the top surface roughening structure 131 including multiple top reflective surfaces 1310), and Another projection light source L4 projected to the outside of the light-transmitting body 10 is formed.

[第二實施例][Second Embodiment]

參閱圖10與圖11所示,本發明第二實施例提供一種背光模組B,其包括:一承載基板1以及一發光單元2。由圖10與圖3的比較,以及圖11與圖4的比較可知,本發明第二實施例與第一實施例最大的差別在於:在第二實施例中,承載基板1還進一步包括一不透光層120,並且不透光層120設置在透光本體10的底面1002上,以覆蓋底面粗化結構121。Referring to FIG. 10 and FIG. 11, a second embodiment of the present invention provides a backlight module B, which includes: a carrier substrate 1 and a light emitting unit 2. From the comparison between FIG. 10 and FIG. 3 and the comparison between FIG. 11 and FIG. 4, it can be seen that the biggest difference between the second embodiment of the present invention and the first embodiment is that: in the second embodiment, the carrier substrate 1 further includes a The light-transmitting layer 120 and the opaque layer 120 are disposed on the bottom surface 1002 of the light-transmitting body 10 to cover the roughened structure 121 on the bottom surface.

藉此,藉由不透光層120的使用,每一發光元件20所產生的一初始光源(圖未示)能更有效地的透過底面反光結構12(或是底面粗化結構121)的反射,而形成投射到透光本體10的外部的一投射光源(圖未示),以有效地降低光損。Thereby, by using the opaque layer 120, an initial light source (not shown) generated by each light-emitting element 20 can more effectively transmit the reflection of the bottom reflective structure 12 (or the bottom roughened structure 121) , And form a projection light source (not shown) projected to the outside of the light-transmitting body 10 to effectively reduce light loss.

值得注意的是,與第一實施例相同的是,依據不同的使用需求,第二實施例的承載基板1還能進一步包括設置在透光本體10的頂面1001上的一頂面反光結構(圖未示)。藉此,每一發光元件20所產生的初始光源(圖未示)還能透過頂面反光結構(圖未示)的反射,而形成投射到透光本體10的外部的另一投射光源(圖未示)。It is worth noting that, similar to the first embodiment, according to different usage requirements, the carrier substrate 1 of the second embodiment can further include a top surface reflective structure ( Picture not shown). Thereby, the initial light source (not shown) generated by each light-emitting element 20 can also pass through the reflection of the top surface reflective structure (not shown) to form another projection light source (not shown) projected to the outside of the light-transmitting body 10 Not shown).

[第三實施例][Third Embodiment]

參閱圖12至圖14所示,本發明第三實施例提供一種背光模組B,其包括:一承載基板1以及一發光單元2。由圖13與圖3的比較,以及圖14與圖4的比較可知,本發明第三實施例與第一實施例最大的差別在於:在第三實施例中,底面反光結構12包括一不透光層120以及設置在不透光層120的一表面上的一具有粗化表面的底面粗化結構121或者一具有平整反光面的反光結構,並且底面粗化結構121連接於在不透光層120的表面與透光本體10的底面1002之間。舉例來說,底面粗化結構121包括依續相連的多個底端反光面1211。Referring to FIGS. 12 to 14, a third embodiment of the present invention provides a backlight module B, which includes: a carrier substrate 1 and a light emitting unit 2. From the comparison between FIG. 13 and FIG. 3 and the comparison between FIG. 14 and FIG. 4, it can be seen that the biggest difference between the third embodiment of the present invention and the first embodiment is that: in the third embodiment, the bottom surface reflective structure 12 includes an opaque The light layer 120 and a bottom surface roughening structure 121 with a roughened surface or a light reflecting structure with a flat reflective surface disposed on a surface of the opaque layer 120, and the bottom surface roughening structure 121 is connected to the opaque layer Between the surface of 120 and the bottom surface 1002 of the transparent body 10. For example, the bottom surface roughening structure 121 includes a plurality of bottom reflective surfaces 1211 connected in succession.

藉此,藉由不透光層120的使用,每一發光元件20所產生的一初始光源(圖未示)能更有效地的透過底面粗化結構121的反射,而形成投射到透光本體10的外部的一投射光源(圖未示),以有效地降低光損。Thereby, by using the opaque layer 120, an initial light source (not shown) generated by each light-emitting element 20 can more effectively penetrate the reflection of the bottom roughened structure 121 to form a projection onto the light-transmitting body A projection light source (not shown) outside of 10 to effectively reduce light loss.

值得注意的是,與第一實施例相同的是,依據不同的使用需求,第三實施例的承載基板1還能進一步包括設置在透光本體10的頂面1001上的一頂面反光結構(圖未示)。藉此,每一發光元件20所產生的初始光源(圖未示)還能透過頂面反光結構(圖未示)的反射,而形成投射到透光本體10的外部的另一投射光源(圖未示)。It is worth noting that, similar to the first embodiment, according to different usage requirements, the carrier substrate 1 of the third embodiment can further include a top surface reflective structure ( Picture not shown). Thereby, the initial light source (not shown) generated by each light-emitting element 20 can also pass through the reflection of the top surface reflective structure (not shown) to form another projection light source (not shown) projected to the outside of the light-transmitting body 10 Not shown).

[第四實施例][Fourth Embodiment]

參閱圖15所示,本發明第四實施例提供一種影像顯示器Z,其包括一顯示模組D以及一背光模組B,並且背光模組B設置於顯示模組D的下方,以提供背光光源L給顯示模組D。Referring to FIG. 15, a fourth embodiment of the present invention provides an image display Z, which includes a display module D and a backlight module B, and the backlight module B is disposed under the display module D to provide a backlight light source L is for display module D.

值得注意的是,影像顯示器Z可以使用第一實施例至第三實施例中的任一實施例的背光模組B,其包括:一承載基板1以及一發光單元2。舉例來說,背光光源L可以只有投射光源L3(如圖8所示),或者背光光源L可以包含投射光源L3與另一投射光源L4(如圖9所示)。It is worth noting that the image display Z can use the backlight module B of any one of the first embodiment to the third embodiment, which includes: a carrier substrate 1 and a light-emitting unit 2. For example, the backlight light source L may only have the projection light source L3 (as shown in FIG. 8), or the backlight light source L may include the projection light source L3 and another projection light source L4 (as shown in FIG. 9).

[實施例的有益效果][Beneficial effects of the embodiment]

本發明的其中一有益效果在於,本發明所提供的影像顯示器Z,其能通過“承載基板1包括一透光本體10以及設置在透光本體10的一底面1002上的一底面反光結構12”以及“發光單元2包括設置在透光本體10上的多個發光元件20”的技術方案,以使得每一發光元件20所產生的一初始光源L1能透過底面反光結構12的反射,而形成投射到透光本體10的外部的一投射光源L3,以供顯示模組D使用。One of the beneficial effects of the present invention is that the image display Z provided by the present invention can pass through "the carrier substrate 1 includes a light-transmitting body 10 and a bottom reflective structure 12 arranged on a bottom surface 1002 of the light-transmitting body 10." And the “light emitting unit 2 includes a plurality of light emitting elements 20 arranged on the light-transmitting body 10”, so that an initial light source L1 generated by each light emitting element 20 can pass through the reflection of the bottom reflective structure 12 to form a projection A projection light source L3 to the outside of the transparent body 10 is used by the display module D.

本發明的另外一有益效果在於,本發明所提供的影像顯示器Z,其能通過“承載基板1包括設置在透光本體10的頂面1001上的一頂面反光結構13”以及“頂面反光結構13包括分別圍繞多個發光元件20的多個頂面粗化結構131”的技術方案,以使得每一發光元件20所產生的一初始光源L1能透過相對應的頂面粗化結構131的反射,而形成投射到透光本體10的外部的另一投射光源L4,以供顯示模組D使用。Another beneficial effect of the present invention is that the image display Z provided by the present invention can pass through "the carrier substrate 1 includes a top surface reflective structure 13 provided on the top surface 1001 of the light-transmitting body 10" and "top surface reflective The structure 13 includes a technical solution that surrounds a plurality of top surface roughening structures 131" of the plurality of light emitting elements 20, so that an initial light source L1 generated by each light emitting element 20 can pass through the corresponding top surface roughening structure 131 Reflected to form another projection light source L4 projected to the outside of the light-transmitting body 10 for use by the display module D.

以上所公開的內容僅為本發明的優選可行實施例,並非因此侷限本發明的申請專利範圍,所以凡是運用本發明說明書及圖式內容所做的等效技術變化,均包含於本發明的申請專利範圍內。The content disclosed above is only the preferred and feasible embodiments of the present invention, and does not limit the scope of the patent application of the present invention. Therefore, all equivalent technical changes made using the description and schematic content of the present invention are included in the application of the present invention. Within the scope of the patent.

Z:影像顯示器 D:顯示模組 B:背光模組 1a:初始基板 1:承載基板 10:透光本體 1001:頂面 1002:底面 11:導電線路層 110:導電部 12:底面反光結構 120:不透光層 121:底面粗化結構 1211:底端反光面 13:頂面反光結構 131:頂面粗化結構 1310:頂端反光面 2:發光單元 20:發光元件 201:發光層 202:反光層 W1:導電體 W2:導電線 L1:初始光源 L2:反射光源 L3、L4:投射光源 L:背光光源Z: Video display D: Display module B: Backlight module 1a: Initial substrate 1: Carrier substrate 10: Translucent body 1001: top surface 1002: bottom surface 11: Conductive circuit layer 110: Conductive part 12: Reflective structure on the bottom surface 120: opaque layer 121: Roughened bottom structure 1211: bottom reflective surface 13: Top reflective structure 131: Top surface roughened structure 1310: Top reflective surface 2: Light-emitting unit 20: Light-emitting element 201: Emitting layer 202: reflective layer W1: Conductor W2: Conductive wire L1: Initial light source L2: Reflected light source L3, L4: projection light source L: Backlight light source

圖1為本發明背光模組的製作方法的流程圖。FIG. 1 is a flow chart of the manufacturing method of the backlight module of the present invention.

圖2為本發明初始基板的側視示意圖。Figure 2 is a schematic side view of the initial substrate of the present invention.

圖3為本發明第一實施例的背光模組的承載基板的側視示意圖。3 is a schematic side view of the supporting substrate of the backlight module according to the first embodiment of the present invention.

圖4為本發明第一實施例的背光模組的側視示意圖。4 is a schematic side view of the backlight module according to the first embodiment of the present invention.

圖5為圖4的IV部分的放大示意圖。Fig. 5 is an enlarged schematic diagram of part IV of Fig. 4.

圖6為圖5的另外一實施例的示意圖。Fig. 6 is a schematic diagram of another embodiment of Fig. 5.

圖7為圖5的另外再一實施例的示意圖。FIG. 7 is a schematic diagram of another embodiment of FIG. 5.

圖8為本發明第一實施例的背光模組包括有底面反光結構的部分示意圖。FIG. 8 is a partial schematic diagram of a backlight module including a bottom reflective structure according to the first embodiment of the present invention.

圖9為本發明第一實施例的背光模組包括有底面反光結構與頂面反光結構的部分示意圖。9 is a partial schematic diagram of the backlight module according to the first embodiment of the present invention including a bottom surface reflective structure and a top surface reflective structure.

圖10為本發明第二實施例的背光模組的承載基板的側視示意圖。FIG. 10 is a schematic side view of the supporting substrate of the backlight module according to the second embodiment of the present invention.

圖11為本發明第二實施例的背光模組的側視示意圖。FIG. 11 is a schematic side view of a backlight module according to a second embodiment of the present invention.

圖12為本發明第三實施例的底面反光結構包括有不透光層與底面粗化結構的側視示意圖。12 is a schematic side view of a bottom reflective structure including an opaque layer and a roughened bottom structure according to the third embodiment of the present invention.

圖13為本發明第三實施例的背光模組的承載基板的側視示意圖。FIG. 13 is a schematic side view of a supporting substrate of a backlight module according to a third embodiment of the present invention.

圖14為本發明第三實施例的背光模組的側視示意圖。FIG. 14 is a schematic side view of a backlight module according to a third embodiment of the present invention.

圖15為本發明第四實施例的顯像顯示器的示意圖。Fig. 15 is a schematic diagram of a display device according to a fourth embodiment of the present invention.

Z:影像顯示器Z: Video display

D:顯示模組D: Display module

B:背光模組B: Backlight module

L:背光光源L: Backlight light source

Claims (10)

一種影像顯示器,其包括一顯示模組以及一背光模組,所述背光模組設置於所述顯示模組的下方,以提供背光光源給所述顯示模組,其特徵在於,所述背光模組包括: 一承載基板,所述承載基板包括一透光本體、設置在所述透光本體的一頂面上的一導電線路層以及設置在所述透光本體的一底面上的一底面反光結構;以及 一發光單元,所述發光單元包括設置在所述透光本體的所述頂面上的多個發光元件,每一所述發光元件電性連接於該導電線路層; 其中,每一所述發光元件所產生的一初始光源穿過所述透光本體的所述頂面而投射到所述底面反光結構,所述初始光源透過所述底面反光結構的反射而形成一反射光源,且所述反射光源再次穿過所述透光本體的所述頂面而形成投射到所述透光本體的外部的一投射光源。An image display, comprising a display module and a backlight module, the backlight module is arranged below the display module to provide a backlight light source to the display module, characterized in that the backlight module The group includes: A carrier substrate, the carrier substrate comprising a light-transmitting body, a conductive circuit layer arranged on a top surface of the light-transmitting body, and a bottom surface reflective structure arranged on a bottom surface of the light-transmitting body; and A light-emitting unit, the light-emitting unit includes a plurality of light-emitting elements arranged on the top surface of the light-transmitting body, each of the light-emitting elements is electrically connected to the conductive circuit layer; Wherein, an initial light source generated by each of the light-emitting elements passes through the top surface of the light-transmitting body and is projected onto the bottom reflective structure, and the initial light source is reflected by the bottom reflective structure to form a A reflective light source, and the reflective light source passes through the top surface of the light-transmitting body again to form a projection light source projected to the outside of the light-transmitting body. 如申請專利範圍第1項所述的影像顯示器,其中,所述底面反光結構為直接形成在所述透光本體的所述底面上的一底面粗化結構或者一具有平整反光面的反光結構,且所述底面粗化結構包括依續相連的多個底端反光面;其中,所述承載基板還進一步包括一不透光層,所述不透光層設置在所述透光本體的所述底面上,以覆蓋所述底面粗化結構;其中,所述承載基板包括設置在所述透光本體的所述頂面上的一頂面反光結構,所述頂面反光結構包括分別圍繞多個所述發光元件的多個頂面粗化結構,且所述頂面粗化結構包括依續相連的多個頂端反光面;其中,每一所述發光元件所產生的所述初始光源投射到相對應的所述頂面粗化結構,且所述初始光源透過相對應的所述頂面粗化結構的反射而形成投射到所述透光本體的外部的另一投射光源。The image display according to the first item of the scope of patent application, wherein the bottom surface reflective structure is a bottom surface roughened structure directly formed on the bottom surface of the light-transmitting body or a reflective structure with a flat reflective surface, And the bottom surface roughening structure includes a plurality of bottom end light-reflecting surfaces that are successively connected; wherein, the carrier substrate further includes an opaque layer, and the opaque layer is disposed on the light-transmitting body. The bottom surface is to cover the bottom surface roughened structure; wherein, the carrier substrate includes a top surface reflective structure disposed on the top surface of the light-transmitting body, and the top surface reflective structure includes a plurality of The light-emitting element has a plurality of roughened top surface structures, and the roughened top surface structure includes a plurality of top reflective surfaces that are successively connected; wherein, the initial light source generated by each of the light-emitting elements is projected onto the phase Corresponding to the top surface roughened structure, and the initial light source transmits through the reflection of the corresponding top surface roughened structure to form another projection light source projected to the outside of the light-transmitting body. 如申請專利範圍第1項所述的影像顯示器,其中,所述底面反光結構包括一不透光層以及設置在所述不透光層的一表面上的一底面粗化結構或者一具有平整反光面的反光結構,所述底面粗化結構連接於在所述不透光層的所述表面與所述透光本體的所述底面之間,且所述底面粗化結構包括依續相連的多個底端反光面;其中,所述承載基板包括設置在所述透光本體的所述頂面上的一頂面反光結構,所述頂面反光結構包括分別圍繞多個所述發光元件的多個頂面粗化結構,且所述頂面粗化結構包括依續相連的多個頂端反光面;其中,每一所述發光元件所產生的所述初始光源投射到相對應的所述頂面粗化結構,且所述初始光源透過相對應的所述頂面粗化結構的反射而形成投射到所述透光本體的外部的另一投射光源。The image display according to the first item of the scope of patent application, wherein the bottom reflective structure includes an opaque layer and a roughened bottom structure or a flat reflective structure provided on a surface of the opaque layer The bottom surface roughened structure is connected between the surface of the opaque layer and the bottom surface of the light-transmitting body, and the bottom surface roughened structure includes successively connected multiple A bottom reflective surface; wherein the carrier substrate includes a top surface reflective structure disposed on the top surface of the light-transmitting body, and the top surface reflective structure includes a plurality of A roughened top surface structure, and the roughened top surface structure includes a plurality of top reflective surfaces connected in succession; wherein, the initial light source generated by each of the light-emitting elements is projected onto the corresponding top surface A roughened structure, and the initial light source transmits the reflection of the corresponding roughened top surface structure to form another projection light source projected to the outside of the light-transmitting body. 如申請專利範圍第1項所述的影像顯示器,其中,每一所述發光元件透過導電體或者導電線以電性連接於所述導電線路層,每一所述發光元件包括用於產生所述初始光源的一發光層以及用於反射所述初始光源的一反光層;其中,所述承載基板包括設置在所述透光本體的所述頂面上的一頂面反光結構,所述頂面反光結構包括分別圍繞多個所述發光元件的多個頂面粗化結構,且所述頂面粗化結構包括依續相連的多個頂端反光面;其中,每一所述發光元件所產生的所述初始光源投射到相對應的所述頂面粗化結構,且所述初始光源透過相對應的所述頂面粗化結構的反射而形成投射到所述透光本體的外部的另一投射光源;其中,所述底面反光結構的內部混入多個螢光粉顆粒,以形成一具有反光功能的底面螢光層,且所述頂面反光結構的內部混入多個螢光粉顆粒,以形成一具有反光功能的頂面螢光層。The image display according to the first item of the patent application, wherein each of the light-emitting elements is electrically connected to the conductive circuit layer through a conductive body or a conductive wire, and each of the light-emitting elements includes a method for generating the A light-emitting layer of the original light source and a light-reflecting layer for reflecting the original light source; wherein the carrier substrate includes a top surface reflective structure arranged on the top surface of the light-transmitting body, and the top surface The light-reflecting structure includes a plurality of top surface roughening structures respectively surrounding a plurality of the light-emitting elements, and the top surface roughening structure includes a plurality of top light-reflecting surfaces connected successively; wherein, each light-emitting element generates The initial light source is projected to the corresponding roughened top surface structure, and the initial light source is reflected by the corresponding roughened top surface structure to form another projection projected to the outside of the light-transmitting body A light source; wherein a plurality of fluorescent powder particles are mixed into the bottom reflective structure to form a bottom fluorescent layer with a reflective function, and a plurality of fluorescent powder particles are mixed into the top reflective structure to form A top fluorescent layer with reflective function. 一種影像顯示器,其包括一顯示模組以及一背光模組,所述背光模組設置於所述顯示模組的下方,以提供背光光源給所述顯示模組,其特徵在於,所述背光模組包括: 一承載基板,所述承載基板包括一透光本體、設置在所述透光本體的一頂面上的一導電線路層以及設置在所述透光本體的一底面上的一底面反光結構;以及 一發光單元,所述發光單元包括多個發光元件,每一所述發光元件電性連接於該導電線路層; 其中,每一所述發光元件所產生的一初始光源透過所述底面反光結構的反射而形成投射到所述透光本體的外部的一投射光源。An image display, comprising a display module and a backlight module, the backlight module is arranged below the display module to provide a backlight light source to the display module, characterized in that the backlight module The group includes: A carrier substrate, the carrier substrate comprising a light-transmitting body, a conductive circuit layer arranged on a top surface of the light-transmitting body, and a bottom surface reflective structure arranged on a bottom surface of the light-transmitting body; and A light-emitting unit, the light-emitting unit includes a plurality of light-emitting elements, each of the light-emitting elements is electrically connected to the conductive circuit layer; Wherein, an initial light source generated by each of the light-emitting elements is reflected by the bottom reflective structure to form a projection light source projected to the outside of the light-transmitting body. 如申請專利範圍第5項所述的影像顯示器,其中,所述底面反光結構為直接形成在所述透光本體的所述底面上的一底面粗化結構或者一具有平整反光面的反光結構,且所述底面粗化結構包括依續相連的多個底端反光面;其中,所述承載基板還進一步包括一不透光層,所述不透光層設置在所述透光本體的所述底面上,以覆蓋所述底面粗化結構;其中,所述承載基板包括設置在所述透光本體的所述頂面上的一頂面反光結構,所述頂面反光結構包括分別圍繞多個所述發光元件的多個頂面粗化結構,且所述頂面粗化結構包括依續相連的多個頂端反光面;其中,每一所述發光元件所產生的所述初始光源透過相對應的所述頂面粗化結構的反射而形成投射到所述透光本體的外部的另一投射光源。According to the image display according to item 5 of the scope of patent application, wherein the bottom surface reflective structure is a bottom surface roughened structure directly formed on the bottom surface of the light-transmitting body or a reflective structure with a flat reflective surface, Moreover, the bottom surface roughening structure includes a plurality of bottom end light-reflecting surfaces that are successively connected; wherein, the carrier substrate further includes an opaque layer, and the opaque layer is disposed on the light-transmitting body. On the bottom surface to cover the bottom surface roughened structure; wherein, the carrier substrate includes a top surface reflective structure provided on the top surface of the light-transmitting body, and the top surface reflective structure includes a plurality of The light-emitting element has a plurality of roughened top surface structures, and the roughened top surface structure includes a plurality of top light-reflecting surfaces connected successively; wherein, the initial light source generated by each light-emitting element transmits through a corresponding The reflection of the roughened structure on the top surface forms another projection light source projected to the outside of the light-transmitting body. 如申請專利範圍第5項所述的影像顯示器,其中,所述底面反光結構包括一不透光層以及設置在所述不透光層的一表面上的一底面粗化結構或者一具有平整反光面的反光結構,所述底面粗化結構連接於在所述不透光層的所述表面與所述透光本體的所述底面之間,且所述底面粗化結構包括依續相連的多個底端反光面;其中,所述承載基板包括設置在所述透光本體的所述頂面上的一頂面反光結構,所述頂面反光結構包括分別圍繞多個所述發光元件的多個頂面粗化結構,且所述頂面粗化結構包括依續相連的多個頂端反光面;其中,每一所述發光元件所產生的所述初始光源透過相對應的所述頂面粗化結構的反射而形成投射到所述透光本體的外部的另一投射光源。The image display device according to item 5 of the scope of patent application, wherein the bottom reflective structure includes an opaque layer and a roughened bottom structure or a flat reflective layer disposed on a surface of the opaque layer The bottom surface roughened structure is connected between the surface of the opaque layer and the bottom surface of the light-transmitting body, and the bottom surface roughened structure includes successively connected multiple A bottom reflective surface; wherein the carrier substrate includes a top surface reflective structure disposed on the top surface of the light-transmitting body, and the top surface reflective structure includes a plurality of A roughened top surface structure, and the roughened top surface structure includes a plurality of top reflective surfaces that are successively connected; wherein the initial light source generated by each light-emitting element transmits through the corresponding rough top surface The reflection of the chemical structure forms another projection light source projected to the outside of the light-transmitting body. 如申請專利範圍第5項所述的影像顯示器,其中,每一所述發光元件透過導電體或者導電線以電性連接於所述導電線路層,每一所述發光元件包括用於產生所述初始光源的一發光層以及用於反射所述初始光源的一反光層;其中,所述承載基板包括設置在所述透光本體的所述頂面上的一頂面反光結構,所述頂面反光結構包括分別圍繞多個所述發光元件的多個頂面粗化結構,且所述頂面粗化結構包括依續相連的多個頂端反光面;其中,每一所述發光元件所產生的所述初始光源透過相對應的所述頂面粗化結構的反射而形成投射到所述透光本體的外部的另一投射光源;其中,所述底面反光結構的內部混入多個螢光粉顆粒,以形成一具有反光功能的底面螢光層,且所述頂面反光結構的內部混入多個螢光粉顆粒,以形成一具有反光功能的頂面螢光層。The image display according to the fifth item of the scope of patent application, wherein each of the light-emitting elements is electrically connected to the conductive circuit layer through a conductive body or a conductive wire, and each of the light-emitting elements includes a method for generating the A light-emitting layer of the original light source and a light-reflecting layer for reflecting the original light source; wherein the carrier substrate includes a top surface reflective structure disposed on the top surface of the light-transmitting body, and the top surface The light-reflecting structure includes a plurality of top surface roughening structures respectively surrounding a plurality of the light-emitting elements, and the top-surface roughening structure includes a plurality of top light-reflecting surfaces connected successively; wherein, each light-emitting element generates The initial light source transmits the reflection of the corresponding roughened top surface to form another projection light source projected to the outside of the light-transmitting body; wherein a plurality of phosphor particles are mixed into the bottom surface reflective structure , To form a bottom surface fluorescent layer with reflective function, and a plurality of phosphor particles are mixed into the top surface reflective structure to form a top surface fluorescent layer with reflective function. 一種影像顯示器,其包括一顯示模組以及一背光模組,所述背光模組設置於所述顯示模組的下方,以提供背光光源給所述顯示模組,其特徵在於,所述背光模組包括: 一承載基板,所述承載基板包括一透光本體以及設置在所述透光本體的一底面上的一底面反光結構;以及 一發光單元,所述發光單元包括設置在所述透光本體上的多個發光元件; 其中,每一所述發光元件所產生的一初始光源透過所述底面反光結構的反射而形成投射到所述透光本體的外部的一投射光源。An image display, comprising a display module and a backlight module, the backlight module is arranged below the display module to provide a backlight light source to the display module, characterized in that the backlight module The group includes: A carrier substrate, the carrier substrate comprising a light-transmitting body and a bottom surface reflective structure provided on a bottom surface of the light-transmitting body; and A light-emitting unit, the light-emitting unit comprising a plurality of light-emitting elements arranged on the light-transmitting body; Wherein, an initial light source generated by each of the light-emitting elements is reflected by the bottom reflective structure to form a projection light source projected to the outside of the light-transmitting body. 如申請專利範圍第9項所述的影像顯示器,其中,每一所述發光元件包括用於產生所述初始光源的一發光層以及用於反射所述初始光源的一反光層;其中,所述承載基板包括設置在所述透光本體的一頂面上的一頂面反光結構,所述頂面反光結構包括分別圍繞多個所述發光元件的多個頂面粗化結構,且所述頂面粗化結構包括依續相連的多個頂端反光面;其中,每一所述發光元件所產生的所述初始光源透過相對應的所述頂面粗化結構的反射而形成投射到所述透光本體的外部的另一投射光源;其中,所述底面反光結構的內部混入多個螢光粉顆粒,以形成一具有反光功能的底面螢光層,且所述頂面反光結構的內部混入多個螢光粉顆粒,以形成一具有反光功能的頂面螢光層。The image display according to claim 9, wherein each of the light-emitting elements includes a light-emitting layer for generating the initial light source and a reflective layer for reflecting the initial light source; wherein, the The carrier substrate includes a top surface reflective structure provided on a top surface of the light-transmitting body, the top surface reflective structure includes a plurality of top surface roughened structures respectively surrounding a plurality of the light emitting elements, and the top surface The roughened surface structure includes a plurality of top reflective surfaces that are successively connected; wherein the initial light source generated by each of the light-emitting elements passes through the reflection of the corresponding roughened top surface to form a projection onto the transparent surface. Another projection light source outside the light body; wherein a plurality of phosphor particles are mixed into the bottom surface reflective structure to form a bottom surface fluorescent layer with a reflective function, and the top surface reflective structure is mixed into more Phosphor particles to form a top surface phosphor layer with reflective function.
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CN110398857A (en) * 2019-07-15 2019-11-01 青岛海信电器股份有限公司 Micro-led lamp plate, its production method, backlight module and display device

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