TW202124098A - Processing unit and substrate processing device - Google Patents

Abstract

The present invention suppresses an increase in the footprint of a substrate processing device and improves the processing efficiency of a processing unit of the substrate processing device. A dressing unit used for the substrate processing device includes: a dresser shaft (51) disposed so as to oppose a polishing pad (352) for polishing a substrate; a plurality of dressers (50-1, 50-2) for holding a plurality of dressing members (50-1a, 50-2a) which are arranged concentrically via arms (410) about the axis of the dresser shaft (51); an air cylinder for driving the plurality of dressers (50-1, 50-2) in a direction approaching or going away from the polishing pad (352); and a folding mechanism (450) configured to be capable of adjusting the angle of the arms (410) such that the plurality of dressers (50-1, 50-2) approach each other.

Description

Processing unit and substrate processing device

This application is related to a processing unit and a substrate processing device. This application claims priority based on Japanese Patent Application No. 2019-222928 filed on December 10, 2019. The entire disclosure including the specification, application scope, drawings and abstract of Japanese Patent Application No. 2019-222928 is incorporated into this application as a whole for reference.

When manufacturing semiconductor elements, a chemical mechanical polishing (CMP) device is used in order to flatten the surface of the substrate. Most of the substrates used in the manufacture of semiconductor devices are in the shape of a circular plate. In addition, not limited to semiconductor components, when flattening the surface of square substrates such as CCL substrates (Copper Clad Laminate substrates), PCB (Printed Circuit Board) substrates, mask substrates, display panels, etc. The requirements for flatness have also increased. In addition, the demand for flattening the surface of package substrates equipped with electronic components such as PCB substrates has also increased.

Substrate processing devices such as chemical mechanical polishing devices contain various processing units, one of which includes a dresser for dressing (shaping) the surface of the polishing pad used for polishing the substrate. The dresser includes: a holder for installing dressing components such as electrodeposited diamond particles; a rotating shaft to hold the holder; a motor to rotate the rotating shaft; and a lifting mechanism to move the holder up and down. The dresser is constructed by contacting the dressing member with the polishing pad by a lifting mechanism, and dressing the surface of the polishing pad by rotating a rotating shaft. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] JP 2008-110471 A

(The problem to be solved by the invention)

With the increase in the size of substrates in recent years, the polishing pad has also been increasing in size. When a dresser of the past size is used to dress the polishing pad, there is a concern about insufficient dressing. In addition, in order to prevent insufficient trimming, it is also considered to increase the trimming time, but this is not appropriate from the viewpoint of processing efficiency.

Regarding this point, although it is possible to effectively and adequately perform trimming by increasing the diameter of the trimmer, it is not appropriate because increasing the diameter of the trimmer may cause the footprint of the substrate processing apparatus to become larger.

This kind of problem occurs not only in the dresser, but also in the processing unit including the cleaning tool for cleaning the surface of the substrate arranged face up; or the processing unit for polishing the substrate with the polishing pad face down.

Therefore, one of the objectives of the present application is to suppress the increase in the footprint of the substrate processing apparatus and to improve the processing efficiency of the processing unit of the substrate processing apparatus. (Means to solve the problem)

One embodiment discloses a processing unit used in a substrate processing device, and includes: a rotating shaft, which is arranged opposite to a substrate or a polishing pad used for polishing the substrate; and a plurality of holders, which are held on the aforementioned rotating shaft A plurality of treatment tools or a plurality of treatment objects are arranged concentrically around the axis through the arms; a driving part which drives the plurality of holders in the direction of approaching or away from the substrate or the polishing pad; and folding The mechanism is constructed by adjusting the angle of the arm in a manner that the plurality of holders are approached respectively.

Hereinafter, an embodiment of a substrate processing apparatus including a trimming unit as an example of the processing unit of the present invention will be described with reference to the drawings. In the drawings, the same or similar reference signs are added to the same or similar elements, and repeated descriptions about the same or similar elements will be omitted in the description of each embodiment. In addition, as long as the features shown in each embodiment are not contradictory to each other, they can also be applied to other embodiments.

FIG. 1 is a plan view showing the overall structure of a substrate processing apparatus 1000 according to an embodiment. The substrate processing apparatus 1000 shown in FIG. 1 has a loading unit 100, a conveying unit 200, a polishing unit 300, a drying unit 500, and an unloading unit 600. In the illustrated embodiment, the transport unit 200 has two transport units 200A and 200B, and the polishing unit 300 has two polishing units 300A and 300B. In one embodiment, each of these units can be formed independently. By forming these units independently, the substrate processing apparatus 1000 of different configurations can be easily formed by arbitrarily combining the number of units. In addition, the substrate processing apparatus 1000 includes a control device 900, and each element of the substrate processing apparatus 1000 is controlled by the control device 900. In one embodiment, the control device 900 may be constituted by a general computer equipped with an input/output device, a computing device, a memory device, and the like. ＜Loading unit＞

The loading unit 100 is a unit for introducing the substrate WF before processing such as polishing and cleaning into the substrate processing apparatus 1000. In one embodiment, the loading unit 100 is constructed according to the mechanical device interface specification (IPC-SMEMA-9851) of SMEMA (Surface Mount Equipment Manufacturers Association).

In the illustrated embodiment, the transport mechanism of the loading unit 100 has a plurality of transport rollers 202 and a plurality of roller shafts 204 to which the transport rollers 202 are attached. In the embodiment shown in FIG. 1, three conveying rolls 202 are attached to each roll shaft 204. As shown in FIG. The board|substrate WF is arrange|positioned on the conveyance roll 202, and the board|substrate WF is conveyed by the rotation of the conveyance roll 202. The mounting position of the conveying roller 202 on the roller shaft 204 is not limited, as long as it is a position where the substrate WF can be stably conveyed. However, since the transport roller 202 is in contact with the substrate WF, it should be arranged in a region where there is no problem even if the transport roller 202 is in contact with the substrate WF to be processed. In one embodiment, the conveying roller 202 of the loading unit 100 may be made of a conductive polymer. In one embodiment, the conveying roll 202 is electrically grounded via a roll shaft 204 and the like. For this reason, in order to prevent the substrate WF from being charged and damaging the electronic components on the substrate WF, etc. In addition, in one embodiment, in order to prevent the substrate WF from being charged, an ionizer (not shown) may be provided in the loading unit 100. ＜Transfer unit＞

The substrate processing apparatus 1000 shown in FIG. 1 includes two transport units 200A and 200B. The two conveying units 200A and 200B may have the same configuration, and therefore, they will be described together as the conveying unit 200 below.

The transport unit 200 shown in the figure includes a plurality of transport rollers 202 for transporting the substrate WF. By rotating the conveying roller 202, the substrate WF on the conveying roller 202 can be conveyed in a designated direction. The conveying roller 202 of the conveying unit 200 may be formed of a conductive polymer, or may be formed of a non-conductive polymer. The transport roller 202 is driven by a motor (not shown). The substrate WF is transported to the substrate delivery position by the transport roller 202.

In one embodiment, the transport unit 200 has a cleaning nozzle 284. The cleaning nozzle 284 is connected to a supply source of cleaning liquid (not shown). The cleaning nozzle 284 is configured to supply a cleaning liquid to the substrate WF transported by the transport roller 202. ＜Grinding unit＞

FIG. 2 is a perspective view schematically showing the structure of a polishing unit 300 according to an embodiment. The substrate processing apparatus 1000 shown in FIG. 1 includes two polishing units 300A and 300B. The two polishing units 300A and 300B may have the same configuration. Therefore, they will be described together as the polishing unit 300 below.

As shown in FIG. 2, the polishing unit 300 includes: a polishing table 350; The polishing table 350 is connected to a polishing table rotation motor (not shown) disposed under the table shaft 351 via a table shaft 351, and is rotatable around the table shaft 351. A polishing pad 352 is attached to the upper surface of the polishing table 350, and the surface 352a of the polishing pad 352 constitutes the polishing surface of the polishing substrate. In one embodiment, the polishing pad 352 can also be attached via a layer that can be easily peeled from the polishing table 350. Such layers are, for example, a silicon layer, a fluorine-based resin layer, etc., and those described in, for example, Japanese Patent Application Laid-Open No. 2014-176950 etc. can also be used.

A polishing liquid supply nozzle 354 is provided above the polishing table 350, and the polishing liquid can be supplied on the polishing pad 352 on the polishing table 350 through the polishing liquid supply nozzle 354. In addition, as shown in FIG. 2, the polishing table 350 and the table shaft 351 are provided with a passage 353 for supplying polishing liquid. The passage 353 communicates with the opening 355 on the surface of the polishing table 350. At a position corresponding to the opening 355 of the polishing table 350, the polishing pad 352 is formed with a through hole 357, and the polishing liquid passing through the passage 353 is supplied to the surface of the polishing pad 352 from the opening 355 of the polishing table 350 and the through hole 357 of the polishing pad 352 . In addition, the opening 355 of the polishing table 350 and the through hole 357 of the polishing pad 352 may be one or more. In addition, the positions of the opening 355 of the polishing table 350 and the through hole 357 of the polishing pad 352 are not limited. In one embodiment, they are arranged near the center of the polishing table 350.

In one embodiment, the polishing unit 300 includes an atomizer 358 (refer to FIG. 1) for spraying a liquid or a mixed fluid of liquid and gas toward the polishing pad 352 (refer to FIG. 1), but it is not shown in FIG. The liquid sprayed from the atomizer 358 is, for example, pure water, and the gas is, for example, nitrogen.

The upper circular turntable 302 is connected to the upper circular turntable shaft 18, and the upper circular turntable shaft 18 can move the rocking arm 360 up and down through the up-and-down movement mechanism 319. By moving the upper circular turntable shaft 18 up and down, the entire upper circular turntable 302 can move the rocking arm 360 up and down for positioning. The upper ring turntable shaft 18 can be rotated by an upper ring turntable rotating motor (not shown). The upper ring turntable 302 rotates around the upper ring turntable shaft 18 by the rotation of the upper ring turntable shaft 18. In addition, a rotary joint 323 is installed at the upper end of the upper ring-shaped turntable shaft 18.

In addition, various polishing pads are available on the market, such as Suba800 (“SUBA” is a registered trademark) manufactured by NITTAHAAS Co., Ltd., IC-1000, IC-1000/SUBA400 (two-layer cloth), and manufactured by FUJIMI Inc. Surfin xxx-5, Surfin 000, etc. ("surfin" is a registered trademark). SUBA800, Surfin xxx-5, Surfin 000 are non-woven fabrics with urethane resin fixed fiber, and IC-1000 is rigid foamed polyurethane (single layer). Polyurethane foam is porous (porous), and its surface has many fine recesses or pores.

The upper ring turntable 302 can hold a square substrate underneath it. The swing arm 360 is configured to be rotatable with a support shaft 362 as a center. The upper ring turntable 302 can be moved between the substrate transfer position of the transport unit 200 and the upper side of the polishing table 350 by the rotation of the swing arm 360. By lowering the upper circular turntable shaft 18 and lowering the upper circular turntable 302, the substrate can be pressed against the surface (grinding surface) 352a of the polishing pad 352. At this time, the upper ring turntable 302 and the polishing table 350 are respectively rotated, and the polishing liquid is supplied to the polishing pad 352 from the polishing liquid supply nozzle 354 provided above the polishing table 350 and/or the opening 355 provided in the polishing table 350. Therefore, the substrate WF can be pressed against the polishing surface 352a of the polishing pad 352 to polish the surface of the substrate. During the polishing of the substrate WF, the upper ring turntable 302 may pass through the center of the polishing pad 352 (a method of covering the through hole 357 of the polishing pad 352) to fix the rocking arm 360 or make it rock.

The up-and-down movement mechanism 319 for moving the upper circular turntable shaft 18 and the upper circular turntable 302 up and down includes: a bridge 28 that rotatably supports the upper circular turntable shaft 18 via a bearing 321; a ball screw 32 installed on the bridge 28; The supporting table 29 supported by the pillar 130; and the AC servo motor 38 arranged on the supporting table 29. The support table 29 supporting the servo motor 38 is fixed to the swing arm 360 via the support 130.

The ball screw 32 includes: a screw shaft 32a connected to the servo motor 38; and a nut 32b to which the screw shaft 32a is screwed. The upper circular turntable shaft 18 and the bridge 28 are integrated to move up and down. Therefore, when the servo motor 38 is driven, the bridge 28 moves up and down via the ball screw 32, whereby the upper ring-shaped turntable shaft 18 and the upper ring-shaped turntable 302 move up and down. The polishing unit 300 includes a distance measuring sensor 70 as a position detection unit that detects the distance from the bridge 28 to the lower surface, that is, the position of the bridge 28. By detecting the position of the bridge 28 by the distance measuring sensor 70, the position of the upper ring disk 302 can be detected. The distance measuring sensor 70, the ball screw 32 and the servo motor 38 constitute a vertical movement mechanism 319 together. In addition, the ranging sensor 70 can also be a laser sensor, an ultrasonic sensor, an overcurrent sensor, or a linear displacement sensor. In addition, each device in the grinding unit such as the distance measuring sensor 70 and the servo motor 38 is configured to be controlled by the control device 900.

The polishing unit 300 of one embodiment includes a dressing unit 356 that dresses the polishing surface 352 a of the polishing pad 352. After the trimming unit 356 is briefly described using FIG. 2, it will be described in detail using FIGS. 3 to 10. As shown in FIG. 2, the dressing unit 356 is provided with: a dresser (dressing member holder) 50 slidingly in contact with the polishing surface 352a; a dresser shaft 51 connecting the dresser 50; and air for driving the dresser shaft 51 up and down The cylinder 53; and the swing arm 55 that rotatably supports the dresser shaft 51. FIG. 2 illustrates one dresser 50 for the sake of simplification of the description. However, the present embodiment includes a plurality of dressers as described later. A dressing member 50a is held under the dresser 50, and needle-shaped diamond particles are electrodeposited under the dressing member 50a. The air cylinder 53 is arranged on a support table 57 supported by pillars 56, and these pillars 56 are fixed to the swing arm 55.

The swing arm 55 is driven by a motor (not shown), and is configured to rotate around a support shaft 58. The dresser shaft 51 and the polishing pad 352 are arranged opposite to each other. FIG. 2 is driven by a motor (not shown) to rotate. The dresser 50 rotates around the dresser shaft 51 by rotating the dresser shaft 51. The air cylinder 53 moves the dresser 50 up and down via the dresser shaft 51, and presses the dresser 50 against the polishing surface 352a of the polishing pad 352 with a specified pressing force.

The dressing of the polishing surface 352a of the polishing pad 352 is performed as follows. The dresser 50 is pressed against the polishing surface 352a by the air cylinder 53, and at the same time, pure water is supplied to the polishing surface 352a from a pure water supply nozzle (not shown). In this state, the dresser 50 rotates around the dresser shaft 51, and the lower surface (diamond particles) of the dressing member 50a is brought into sliding contact with the polishing surface 352a. In this way, the polishing pad 352 is removed by the dresser 50 to dress the polishing surface 352a.

The polishing apparatus of this embodiment uses the dresser 50 to measure the amount of wear of the polishing pad 352. That is, the dressing unit 356 includes a displacement sensor 60 that measures the displacement of the dresser 50. The displacement sensor 60 constitutes a wear amount detecting mechanism for detecting the wear amount of the polishing pad 352, and is installed on the upper surface of the swing arm 55. A target plate 61 is fixed on the dresser shaft 51, and the target plate 61 can move up and down as the dresser 50 moves up and down. The displacement sensor 60 is configured to penetrate the target board 61 and measure the displacement of the dresser 50 by measuring the displacement of the target board 61. In addition, the displacement sensor 60 uses all types of sensors such as linear displacement sensors, laser sensors, ultrasonic sensors, or eddy current sensors.

In this embodiment, the wear amount of the polishing pad 352 is measured as follows. First, the air cylinder 53 is driven, and the dresser 50 is brought into contact with the polishing surface 352a of the polishing pad 352 whose initial shaping has been completed. In this state, the displacement sensor 60 detects the initial position (initial height value) of the dresser 50 and memorizes the initial position (initial height value) in the control device 900. Then, after the polishing process of one or more substrates is completed, the dresser 50 is brought into contact with the polishing surface 352a again, and the position of the dresser 50 is measured in this state. Because the position of the dresser 50 changes to the bottom according to the amount of wear of the polishing pad 352, the control device 900 can obtain the amount of wear of the polishing pad 352 by calculating the difference between the initial position and the position of the dresser 50 after polishing. . In this way, the amount of wear of the polishing pad 352 is obtained based on the position of the dresser 50. ＜Drying unit＞

The drying unit 500 is a device for drying the substrate WF. In the substrate processing apparatus 1000 shown in FIG. 1, after the drying unit 500 is polished by the polishing unit 300, the substrate WF cleaned by the cleaning section of the transport unit 200 is dried. As shown in FIG. 1, the drying unit 500 is arranged downstream of the conveying unit 200.

The drying unit 500 has a nozzle 530 for spraying gas toward the substrate WF conveyed on the conveying roll 202. The gas can be compressed air or nitrogen, for example. The drying unit 500 blows off the water droplets on the conveyed substrate WF, so that the substrate WF can be dried. <Uninstall unit>

The unloading unit 600 is a unit for unloading the substrate WF after processing such as polishing and cleaning, out of the substrate processing apparatus 1000. In the substrate processing apparatus 1000 shown in FIG. 1, the unloading unit 600 contains the substrates dried by the drying unit 500. As shown in FIG. 1, the unloading unit 600 is arranged downstream of the drying unit 500.

In one embodiment, the unloading unit 600 is constructed according to the mechanical device interface specification (IPC-SMEMA-9851) of SMEMA (Surface Mount Equipment Manufacturers Association). ＜Finishing unit＞

Next, the trimming unit 356, which is an example of the processing unit used in the substrate processing apparatus, will be described in detail. FIG. 3 is a longitudinal cross-sectional view schematically showing the configuration of a dressing unit 356 according to an embodiment. As shown in FIG. 3, the aforementioned dresser shaft 51 is held by the swing arm 55 via the ball spline 72. The dresser shaft 51 is connected to the motor 86 and the reducer 88 via the dresser-side gear 82 and the motor-side gear 84, and is configured to be rotated by the drive motor 86. It is also possible to provide pulleys and belts instead of the dresser-side gear 82 and the motor-side gear 84. In addition, the dresser shaft 51 is held by the housing 76 via a bearing 74, and a rotary joint 78 is provided on the housing 76. It is also possible to replace the rotary joint 78 with a slip ring. The above-mentioned air cylinder 53 is connected to a target plate 61 via a load sensor 54 and is configured to move the dresser shaft 51 up and down via the target plate 61. The air cylinder 53 is an example of a driving part that drives a plurality of dressers described later in the direction of approaching or leaving the polishing pad 352. In addition, a fluid machine other than the air cylinder 53 may also be used for the driving part. In addition, electric motors such as motors can also be used instead of fluid machines. At this time, the lifting mechanism of the dresser shaft 51 can also adopt the same structure as the vertical movement mechanism 319 combining the ball screw 32 and the servo motor 38 that lift the upper ring-shaped turntable shaft 18 and the upper ring-shaped turntable 302.

A dresser 50 and a folding mechanism 450 are provided at the lower end of the dresser shaft 51. The trimmer 50 and the folding mechanism 450 are omitted in FIG. 3 and will be described in detail below. Fig. 4 is a plan view schematically showing the configuration of a dresser and a folding mechanism of an embodiment. Fig. 5 is a longitudinal cross-sectional view schematically showing the configuration of the dresser and the folding mechanism of an embodiment, and shows the state of opening the dresser. Fig. 6 is a longitudinal sectional view schematically showing the configuration of the dresser and folding mechanism of an embodiment, and shows the state of the folding dresser. Fig. 7 is a plan view schematically showing a condition of dressing using a dressing unit of an embodiment.

As shown in FIGS. 4 to 6, the dressing unit 356 includes an arm 410 extending radially around the axis of the dresser shaft 51. In addition, the dressing unit 356 includes dressers (dressing member holders) 50-1 that hold the dressing members 50-1a, 50-2a, and 50-3a arranged concentrically to the axis of the dresser shaft 51 via the arm 410, 50-2, 50-3. This embodiment shows an example in which the trimming unit 356 includes three trimmers 50-1, 50-2, and 50-3, but the number of trimmers may be any number of two or more.

The trimming unit 356 includes a folding mechanism 450 configured by adjusting the angle of the arm 410 in such a way that the trimmers 50-1, 50-2, and 50-3 are approached, respectively. The folding mechanism 450 includes: a worm gear 430 installed on the arm 410; a worm 420 meshed with the worm gear 430; and a rotary actuator 440 for rotating the worm 420.

Specifically, a housing 442 is connected to the lower end of the dresser shaft 51, and a rotary actuator 440 is arranged in the housing 442. In the rotary actuator 440, the gas for rotationally driving the worm 420 is supplied via the rotary joint 78. When the rotary actuator 440 is electric. The electric signal for rotating and driving the worm 420 is supplied via the slip ring. The worm 420 extends downward from the rotary actuator 440 and is held by the housing 442 via the bearing 422. A helical gear is formed in the worm 420, whereby the worm 420 and the worm wheel 430 can mesh with each other. In addition, instead of the worm 420 and the worm wheel 430, a rack gear and a quarter-circle pinion may be provided. At this time, the rotary actuator 440 may be a direct-acting actuator (air cylinder or a direct-acting electric actuator).

The arm 410 includes: a first arm 410a extending downward from the housing 442; and a second arm 410b extending radially around the axis of the dresser shaft 51 via a rotary joint 414 for the first arm 410a. The angle of the second arm 410b can be changed by rotating the joint 414. The worm wheel 430 is connected to the second arm 410b. Dressers 50-1, 50-2, and 50-3 are respectively installed at the front end of the second arm 410b via a spherical joint 416. By providing the spherical joint 416, the dressing surfaces of the dressing members 50-1a, 50-2a, and 50-3a can be parallel to the polishing pad 352.

The first arm 410a is provided with a flange 418 extending in the radial direction from the first arm 410a, and a stop bolt 412 (stop) is installed in the flange 418 to penetrate the flange 418. The stop bolt 412 is brought into contact with the arm 410 (second arm 410b) by the part protruding from the flange 418, so as to control the arm 410 (second arm 410b) in each of the trimmers 50-1, 50-2, 50- 3 of the movement away from the direction. In addition, the rotary actuator 440 may also be a servo motor. When using a servo motor with a brake, the stop bolt 412 can be omitted.

When the worm 420 is rotated in a specified direction (for example, clockwise) by the rotary actuator 440, the worm wheel 430 meshed with the worm 420 rotates, and the second arm 410b changes its angle in such a way that it opens outward. When the second arm 410b is in contact with the stop bolt 412, as shown in FIG. 5, the dressers 50-1, 50-2, and 50-3 are opened. The state in which the dressers 50-1, 50-2, and 50-3 are opened refers to the state in which the dressing surfaces of the dressing members 50-1a, 50-2a, and 50-3a are substantially parallel to the polishing pad 352. When the dressers 50-1, 50-2, 50-3 are opened, the dressers 50-1, 50-2, 50-3 are lowered by using the air cylinder 53, and the dressing members 50-1a, 50 -2a, 50-3a is pressed against the polishing pad 352. In this state, as shown in FIG. 7, the polishing table 350 (polishing pad 352) is rotated and the dressers 50-1, 50-2, and 50-3 are rotated by the motor 86, and the dressing liquid (pure water ) The polishing pad 352 can be trimmed (shaped) by supplying it to the polishing surface 352a. In the dressing, by shaking the swing arm 55 with the support shaft 58 as the center, the polishing pad 352 can be completely dressed.

In addition, at the end of the dressing, as shown in FIG. 6, the air cylinder 53 raises the dressers 50-1, 50-2, and 50-3. In this state, when the worm 420 is rotated in the opposite direction (for example, counterclockwise) to the designated direction by the rotary actuator 440, the worm wheel 430 rotates in the opposite direction, and accordingly, the second arm 410b is angled inwardly closed Variety. As a result, as shown in Fig. 6, the trimmers 50-1, 50-2, and 50-3 are folded. The so-called folded state of the trimmers 50-1, 50-2, and 50-3 is a circle formed by closing the second arm 410b to the inside and connecting the outermost periphery of the trimmers 50-1, 50-2, 50-3 The diameter β of is smaller than the diameter α of the circle formed by connecting the outermost periphery of the dressers 50-1, 50-2, and 50-3 when the dressers 50-1, 50-2, and 50-3 are opened.

In this embodiment, as shown in FIGS. 5 and 7, by forming a state where the dressers 50-1, 50-2, and 50-3 are opened, it is possible to use a substantially large-diameter dresser 50 for dressing. As a result, even if the size of the polishing pad 352 increases as the size of the substrate WF increases, the dressing can be performed in a short time, so that the processing efficiency of the processing unit (the dressing unit 356) of the substrate processing apparatus 1000 can be improved.

Furthermore, in the case of this embodiment, when trimming is not performed, as shown in FIG. 6, by folding the trimmers 50-1, 50-2, and 50-3 in a folded state, the substrate processing apparatus 1000 can be space-saving. . That is, when the dressing is not performed, the dressing unit 356 is arranged to be retracted to the outside of the polishing table 350 as shown in FIG. 1. In this state, if the dressing unit 356 has a dresser with a large diameter, in order to provide a specified gap between the dresser and the side wall of the polishing unit 300, the side wall of the polishing unit 300 needs to be enlarged to the outside, resulting in the substrate processing apparatus The footprints have increased. In addition, when the present embodiment is adopted, as shown in FIG. 6, the dressers 50-1, 50-2, and 50-3 are arranged in a folded state on the outside of the polishing table 350, and there is no need to install the side wall of the polishing unit 300. Enlarging to the outside, as a result, the footprint of the substrate processing apparatus 1000 can be suppressed from increasing. Furthermore, when the present embodiment is adopted, it is possible to suppress increase in the cost of the dressing unit 356 and the substrate processing apparatus 1000. That is, when a large-diameter dresser is used as the polishing pad 352 is enlarged, the cost of the dressing unit 356 and the substrate processing apparatus 1000 increases because of the high price of the large-diameter dresser. In addition, when the present embodiment is adopted, since the small-diameter dresser used in the past can be used as it is, the cost increase of the dressing unit 356 and the substrate processing apparatus 1000 can be suppressed compared with the case of using a large-diameter dresser.

Next, a modified example of the folding mechanism 450 will be explained. Fig. 8 is a plan view schematically showing the configuration of a dresser and a folding mechanism of an embodiment. Fig. 9 is a longitudinal sectional view schematically showing the configuration of the dresser and the folding mechanism of an embodiment, and shows the state of the dresser being opened. Fig. 10 is a longitudinal sectional view schematically showing the configuration of the dresser and folding mechanism of an embodiment, and shows the state of the folding dresser.

As shown in FIGS. 8 to 10, the dressing unit 356 includes an arm 490 extending radially around the axis of the dresser shaft 51. In addition, the dressing unit 356 includes dressers (dressing member holders) 50-1 that hold the dressing members 50-1a, 50-2a, and 50-3a arranged concentrically to the axis of the dresser shaft 51 via the arm 490, 50-2, 50-3.

The trimming unit 356 includes a folding mechanism 450 configured by adjusting the angle of the arm 490 in such a way that the trimmers 50-1, 50-2, and 50-3 are respectively approached. The folding mechanism 450 includes: a first rotary joint 462 provided at one end of the arm 490 without the trimmers 50-1, 50-2, 50-3; and a second rotary joint provided at the center of the arm 490 464. In addition, the folding mechanism 450 includes: a connecting rod 466 connected to the second rotary joint 464; and a third rotary joint 468 provided at the end of the connecting rod 466. In addition, the folding mechanism 450 includes: a linear shaft 470 to which the third rotary joint 468 is installed; and a linear actuator 480 for reciprocating the linear shaft 470.

Specifically, a housing 482 is connected to the lower end of the dresser shaft 51, and a linear actuator 480 is arranged in the housing 482. The linear actuator 480 supplies gas for reciprocating the linear shaft 470 via the rotary joint 78. When the linear actuator 480 is electrically driven, an electric signal for reciprocating the linear shaft 470 is supplied via a slip ring. The linear shaft 470 extends from the linear actuator 480 to the bottom. A flange 484 extending in the radial direction from the linear shaft 470 is provided at the lower part of the housing 482, and a stopper bolt (stop) 492 is installed in the flange 484 so as to penetrate the flange 484. The stopper bolt 492 is in contact with the arm 490 by a portion protruding through the flange 484 to control the movement of the arm 490 in the separation direction of the dressers 50-1, 50-2, and 50-3.

The first rotary joint 462 is installed at the center under the flange 484. The arm 490 extends from the first rotary joint 462 in a radial direction around the axis of the linear shaft 470. The angle of the arm 490 can be changed by the first rotating joint 462. The front end of the arm 490 is equipped with dressers 50-1, 50-2, and 50-3 via a spherical joint 494, respectively. By setting the spherical joint 494, the dressing surfaces of the dressing members 50-1a, 50-2a, and 50-3a can be parallel to the polishing pad 352. The second revolute joint 464 is provided between the end of the arm 490 where the first revolute joint 462 is mounted and the end where the dressers 50-1, 50-2, and 50-3 are mounted (the central portion). The third rotary joint 468 is installed at the lower end of the linear shaft 470. The connecting rod 466 is arranged to connect the second rotary joint 464 and the third rotary joint 468.

When the linear shaft 470 is driven upward by the linear actuator 480, the position of the third rotary joint 468 installed at the lower end of the linear shaft 470 rises, whereby the arm 490 is opened to the outside via the link 466 The angle changes. When the arm 490 is in contact with the stopper bolt 492, as shown in FIG. 9, the dressers 50-1, 50-2, and 50-3 are opened. The state in which the dressers 50-1, 50-2, and 50-3 are opened refers to the state in which the dressing surfaces of the dressing members 50-1a, 50-2a, and 50-3a are substantially parallel to the polishing pad 352. When the dressers 50-1, 50-2, 50-3 are opened, the air cylinder 53 is used to lower the dressers 50-1, 50-2, 50-3, and the dressing members 50-1a, 50- 2a, 50-3a is pressed against the polishing pad 352. In this state, the polishing table 350 (polishing pad 352) is rotated in the same manner as in the above-mentioned embodiment (FIG. 7 and related description), and the dresser 50-1, 50-2, 50 -3 rotation, can dress (reshape) the polishing pad 352.

In addition, at the end of the dressing, as shown in FIG. 10, the air cylinder 53 raises the dressers 50-1, 50-2, and 50-3. In this state, when the linear shaft 470 is driven downward by the linear actuator 480, the position of the third rotary joint 468 is lowered, whereby the angle of the arm 490 is closed inward via the link 466. . As a result, as shown in Fig. 10, the trimmers 50-1, 50-2, and 50-3 are folded. The so-called folded state of the trimmers 50-1, 50-2, and 50-3 is the diameter of the circle formed by closing the arm 490 to the inside and connecting the outermost periphery of the trimmers 50-1, 50-2, and 50-3 β is smaller than the diameter α of the circle formed by connecting the outermost periphery of the dressers 50-1, 50-2, and 50-3 when the dressers 50-1, 50-2, and 50-3 are opened. In addition, at the end of the stroke of the linear actuator 480, as shown in Figure 10, the dressers 50-1, 50-2, and 50-3 can be prevented from being folded to prevent the dressers 50-1, 50-2, 50-3 contact.

In this embodiment, as shown in FIGS. 9 and 10, by opening the dressers 50-1, 50-2, and 50-3, the dresser 50 with a substantially large diameter can be used for dressing. As a result, even if the size of the polishing pad 352 increases as the size of the substrate WF increases, the dressing can be performed in a short time, and the processing efficiency of the processing unit (the dressing unit 356) of the substrate processing apparatus 1000 can be improved.

Furthermore, in the case of this embodiment, when trimming is not performed, as shown in FIG. 10, by folding the trimmers 50-1, 50-2, and 50-3 in a folded state, the substrate processing apparatus 1000 can be space-saving. . That is, when the dressing is not performed, the dressing unit 356 is arranged to be retracted to the outside of the polishing table 350 as shown in FIG. 1. In this state, if the dressing unit 356 has a dresser with a large diameter, in order to provide a specified gap between the dresser and the side wall of the polishing unit 300, the side wall of the polishing unit 300 needs to be enlarged to the outside, resulting in the substrate processing apparatus The footprints have increased. In addition, when the present embodiment is adopted, as shown in FIG. 10, the dressers 50-1, 50-2, and 50-3 are arranged in a folded state on the outside of the polishing table 350, and there is no need to install the side wall of the polishing unit 300. Enlarging to the outside, as a result, the footprint of the substrate processing apparatus 1000 can be suppressed from increasing.

An example of the plurality of treatment tools arranged concentrically around the axis of the rotating shaft through the arms described above is the trimming members 50-1a, 50-2a, and 50-3a, but it is not limited to this. The plurality of processing tools can also be cleaning tools arranged opposite to the substrate WF for cleaning the substrate WF. Fig. 11 is a perspective view schematically showing the structure of a substrate processing apparatus having a cleaning tool and a folding mechanism according to an embodiment. Fig. 12 is a plan view schematically showing the structure of a substrate processing apparatus having a cleaning tool and a folding mechanism according to an embodiment.

As shown in FIG. 11, the cleaning unit used in the substrate processing apparatus includes a table 10 for mounting, holding and rotating the substrate WF transported by the transport unit, and a cleaning tool holder 27 for cleaning tools (dish sponge) 21 . The workbench 10 includes a plurality of arms 12 (four in the figure) mounted with a chuck 11 for holding the substrate WF in a horizontal posture, and the arms 12 are integrally mounted on the base 13. The base 13 is connected to the rotation shaft 14, and the substrate WF can be rotated in the arrow A direction by the rotation of the rotation shaft 14.

In addition, the washing tool mounting mechanism 20 has a swing arm 23, and a rotating shaft 22 is provided at the front end of the swing arm 23. At the lower end of the rotating shaft 22, a folding mechanism 450 and an arm 490 similar to those in FIGS. 9 and 10 are provided. At the front end of the arm 490, instead of the dressers 50-1, 50-2, and 50-3 in FIGS. 9 and 10, a washing tool holder 27 is provided, and a washing tool (dish-shaped sponge) 21 is installed in the washing tool holder 27. The rotating shaft 22 rotates in the direction of arrow B by a rotating mechanism not shown, so that the cleaning tool 21 rotates in the same direction. In addition, a rocking shaft 24 is provided at the end of the rocking arm 23, so that the rocking arm 23 can be rocked in the arrow C direction. In addition, the swing shaft 24 also causes the swing arm 23 to rise and fall as indicated by the arrow D.

In the substrate processing apparatus of the above-mentioned structure, the cleaning tool 21 is brought into contact with the substrate WF held by the chuck 11 by lowering the swing shaft 24, and pure water or the like is sprayed from the nozzle 25 on the substrate WF rotating in the direction of arrow A The cleaning liquid simultaneously rotates the cleaning tool 21 in the direction of arrow B and swings the shaking arm 23 in the direction of arrow C to clean the upper surface of the substrate WF. At the end of the cleaning, the swing arm 23 is rotated, and the cleaning tool holder 27 is retracted to the outside of the substrate WF.

As shown in FIG. 11, by forming a state in which the cleaning tool holder 27 is opened, the cleaning tool holder 27 having a substantially large diameter can be used to clean the substrate WF. As a result, even if the substrate WF is enlarged, it can be cleaned in a short time, so the processing efficiency of the processing unit (cleaning unit) of the substrate processing apparatus can be improved.

Furthermore, in the case of this embodiment, when the cleaning is not performed, by folding the cleaning tool holder 27 into a folded state as shown in FIG. 12, it is possible to save the space of the substrate processing apparatus. That is, as shown in FIG. 12, when cleaning is not performed, the cleaning unit is arranged to retract to the outside of the substrate WF. In this state, if the cleaning unit has a cleaning tool holder 27 with a large diameter, in order to accommodate the cleaning tool holder 27 in the substrate processing apparatus, the side wall WL of the substrate processing apparatus needs to be enlarged to the outside, resulting in the footprint of the substrate processing apparatus Increase. In addition, when using this embodiment, as shown in FIG. 12, by folding the cleaning tool holder 27 and arranging it on the outer side of the substrate WF, there is no need to expand the side wall WL of the substrate processing apparatus to the outside. As a result, Suppress the increase of the footprint of the substrate processing equipment.

The above is an example of a dresser and a cleaning tool to illustrate a plurality of processing tools, but it is not limited to these, it can also be applied to a polishing unit that grinds a plurality of substrates arranged concentrically around the axis of a rotating shaft through an arm. invention. That is, in a substrate processing apparatus that grinds a substrate with the polishing pad facing down, a substrate holder can be provided instead of the dresser 50 or the cleaning tool holder 27. By mounting the substrate WF on the substrate holder, the polishing can be effectively performed. The substrate WF can suppress the increase of the footprint of the substrate processing device.

In the above, some embodiments of the present invention have been described. However, the above-mentioned embodiments of the present invention are intended to facilitate the understanding of the present inventors, and are not intended to limit the present inventors. The present invention can be changed and improved without departing from its gist, and of course the present invention includes its equivalents. In addition, as long as at least a part of the above-mentioned problems can be solved or at least a part of the effect can be achieved, the various elements described in the scope of the patent application and the specification can be combined or omitted arbitrarily.

An embodiment of the present application discloses a processing unit used in a substrate processing device, and includes: a rotating shaft, which is arranged opposite to the substrate or the polishing pad used for polishing the substrate; and a plurality of holders, which hold A plurality of treatment tools or a plurality of treatment objects are arranged concentrically around the axis of the rotating shaft through an arm; a driving part that moves the plurality of holders closer to or away from the substrate or the polishing pad Directional drive; and a folding mechanism, which is constituted by adjusting the angle of the arm in a manner in which the plurality of holders are approached respectively.

Furthermore, one embodiment of the present application discloses a processing unit, wherein the aforementioned folding mechanism includes: a worm gear, which is mounted on the aforementioned arm; a worm gear, which is meshed with the aforementioned worm wheel; and a rotary actuator, which is used to rotate Drive the aforementioned worm.

Furthermore, an embodiment of the present application discloses a processing unit, wherein the aforementioned folding mechanism includes: a first revolute joint, which is set at the end of the arm; a second revolute joint, which is located at the center of the arm A connecting rod, which is connected to the aforementioned second rotary joint; a third rotary joint, which is arranged at the end of the aforementioned connecting rod; a linear shaft, which is installed with the aforementioned third rotary joint; and a linear actuator, It makes the aforementioned linear shaft move back and forth.

Furthermore, an embodiment of the present application discloses a processing unit, which further includes a stopper, which controls the movement of the arm in the direction away from the plurality of holders by contacting the arm.

Furthermore, an embodiment of the present application discloses a processing unit, wherein the plurality of processing tools are dressing members arranged opposite to the polishing pad in order to dress the polishing pad, or arranged opposite to the substrate in order to clean the substrate One of the cleaning tools, and the plurality of processing objects are substrates arranged opposite to the polishing pad.

Furthermore, an embodiment of the present application discloses a substrate processing apparatus, which includes: a conveying unit for conveying a substrate; a worktable for holding a substrate or a polishing pad for polishing a substrate; and any of the above processes The unit is arranged opposite to the aforementioned substrate or the aforementioned polishing pad.

10: Workbench 11: Chuck 12: arm 13: Abutment 14: Rotation axis 18: Upper ring turntable shaft 21: Cleaning tool (dish-shaped sponge) 22: Rotation axis 23: Shake the arm 24: Shake the axis 25: Nozzle 27: Washing tool holder 28: Bridge 29: support table 32: Ball screw 32a: Screw shaft 32b: Nut 38: Servo motor 50,50-1,50-2,50-3: dresser (retainer for dressing member) 50a, 50-1a, 50-2a, 50-3a: trim parts 51: Dresser shaft 53: Air cylinder (drive part) 54: Load sensor 55: Shake the arm 56: Pillar 57: support table 58: Pivot 60: displacement sensor 61: target board 70: Ranging sensor 72: ball spline 74: Bearing 76: shell 78: Rotary joint 82: Dresser side gear 84: Motor side gear 86: Motor 88: reducer 100: loading unit 130: Pillar 200, 200A, 200B: transfer unit 202: Conveying rolls 204: Roll Axle 284: Cleaning nozzle 300, 300A, 300B: Grinding unit 302: upper ring turntable 319: Up and down movement mechanism 321: Bearing 323: Rotary joint 350: Grinding table 351: table shaft 352: Grinding Pad 352a: Grinding surface 353: Path 354: Grinding liquid supply nozzle 355: opening 356: Trimming Unit 357: Through Hole 358: Atomizer 360: Shake the arm 362: Pivot 319: Up and down movement mechanism 410: arm 410a: First arm 410b: second arm 412: Stop Bolt 414: Rotary Joint 416: Spherical joint 418: Flange 420: Worm 422: Bearing 430: Worm Gear 440: Rotary Actuator 442: Shell 450: Folding mechanism 462: First Rotary Joint 464: Second Rotary Joint 466: connecting rod 468: Third Rotary Joint 470: Linear shaft 480: Direct Actuator 482: Shell 484: Flange 490: arm 492: Stopper bolt (stopper) 494: Spherical joint 500: Drying unit 530: Nozzle 600: unload unit 900: control device 1000: Substrate processing device A, B, C, D: arrow WF: substrate WL: sidewall

FIG. 1 is a plan view showing the overall structure of a substrate processing apparatus according to an embodiment. Fig. 2 is a perspective view schematically showing the structure of a polishing unit according to an embodiment. Fig. 3 is a longitudinal sectional view schematically showing the configuration of a dressing unit of an embodiment. Fig. 4 is a plan view schematically showing the configuration of a dresser and a folding mechanism of an embodiment. Fig. 5 is a longitudinal cross-sectional view schematically showing the configuration of the dresser and the folding mechanism of an embodiment, and shows the state of opening the dresser. Fig. 6 is a longitudinal sectional view schematically showing the configuration of the dresser and folding mechanism of an embodiment, and shows the state of the folding dresser. Fig. 7 is a plan view schematically showing a condition of dressing using a dressing unit of an embodiment. Fig. 8 is a plan view schematically showing the configuration of a dresser and a folding mechanism of an embodiment. Fig. 9 is a longitudinal sectional view schematically showing the configuration of the dresser and the folding mechanism of an embodiment, and shows the state of the dresser being opened. Fig. 10 is a longitudinal sectional view schematically showing the configuration of the dresser and folding mechanism of an embodiment, and shows the state of the folding dresser. Fig. 11 is a perspective view schematically showing the construction of a cleaning tool and a folding mechanism of an embodiment. Fig. 12 is a plan view schematically showing the construction of a cleaning tool and a folding mechanism of an embodiment.

50-1, 50-2: Dresser

50-1a, 50-2a: finishing components

51: Dresser shaft

55: Shake the arm

350: Grinding table

352: Grinding Pad

410: arm

410a: First arm

410b: second arm

412: Stop Bolt

414: Rotary Joint

416: Spherical joint

418: Flange

420: Worm

422: Bearing

430: Worm Gear

440: Rotary Actuator

442: Shell

450: Folding mechanism

Claims (6)

A processing unit is used in a substrate processing device and includes: A rotating shaft, which is arranged opposite to a substrate or a polishing pad used for a polishing substrate; A plurality of holders, which hold a plurality of treatment tools or a plurality of treatment objects arranged concentrically via an arm around the axis of the aforementioned rotating shaft; A driving part, which drives the plurality of holders in a direction toward or away from the substrate or the polishing pad; and A folding mechanism is constructed by adjusting the angle of the arm in a manner that the plurality of holders are approached respectively. The processing unit of claim 1, wherein the folding mechanism includes: a worm gear that is mounted on the arm; a worm gear that meshes with the worm gear; and a rotary actuator that is used to rotationally drive the worm gear. Such as the processing unit of claim 1, wherein the aforementioned folding mechanism includes: a first revolute joint attached to an end of the aforementioned arm; a second revolving joint attached to a central portion of the aforementioned arm; and a connecting rod , Which is connected to the aforementioned second rotary joint; a third rotary joint, which is arranged at one end of the aforementioned link; a linear shaft, which is installed with the aforementioned third rotary joint; and a linear actuator, which is Make the aforementioned linear shaft move back and forth. For example, the processing unit of claim 2 or 3, which further includes a stopper, which controls the movement of the arm in the direction away from the plurality of holders by contacting the arm. The processing unit according to any one of claims 1 to 3, wherein the plurality of processing tools are dressing members arranged opposite to the polishing pad in order to dress the polishing pad, or arranged opposite to the substrate in order to clean the substrate One of the cleaning tools, In addition, the plurality of processing objects are substrates arranged opposite to the polishing pad. A substrate processing device includes: A transport unit, which is used to transport a substrate; A worktable that holds a substrate or a polishing pad used for polishing a substrate; and The processing unit of any one of claims 1 to 5, which is arranged opposite to the aforementioned substrate or the aforementioned polishing pad.

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