TW202123270A - Multilayer ceramic capacitor and manufacturing method thereof - Google Patents
Multilayer ceramic capacitor and manufacturing method thereof Download PDFInfo
- Publication number
- TW202123270A TW202123270A TW108144164A TW108144164A TW202123270A TW 202123270 A TW202123270 A TW 202123270A TW 108144164 A TW108144164 A TW 108144164A TW 108144164 A TW108144164 A TW 108144164A TW 202123270 A TW202123270 A TW 202123270A
- Authority
- TW
- Taiwan
- Prior art keywords
- electrode
- powder
- nickel
- external electrode
- external
- Prior art date
Links
Images
Abstract
Description
本發明是有關於一種積層陶瓷電容器及其製造方法,尤指積層陶瓷電容器之內部電極與二側之第一外部電極皆含有粒徑為介於0.2~0.4μm之鎳粉及鈦酸鋇粉,以可使內部電極與第一外部電極電性接觸性良好,並提升相互結合強度,進而降低剝離之情況。 The present invention relates to a multilayer ceramic capacitor and its manufacturing method. In particular, the internal electrodes of the multilayer ceramic capacitor and the first external electrodes on both sides both contain nickel powder and barium titanate powder with a particle size of 0.2~0.4μm. In this way, the internal electrode and the first external electrode have good electrical contact, and the mutual bonding strength is improved, thereby reducing the peeling.
按,現今電子產品及其周邊相關之電子設備均需使用到主動元件與被動元件,其中,主動元件(如IC或CPU)可單獨執行運算處理功能,而被動元件則是相對於主動元件在進行電流或電壓改變時,使其電阻或阻抗不會隨之改變的元件,一般為以電容(Capacitor)、電阻(Resistor)與電感(Inductor)合稱作三大被動元件,然而,就以功能而言,電容器是以靜電模式儲存電荷,可在預定的時間內將電能釋放,甚至作為濾波或旁波協調使用;而電阻為可調整電路中之電壓及電流使用;電感係以過濾電流內雜訊、防止電磁波干擾為主要功能。 According to, today's electronic products and related electronic equipment need to use active components and passive components. Among them, active components (such as IC or CPU) can perform arithmetic processing functions independently, while passive components perform relative to active components. When the current or voltage changes, the resistance or impedance of the components will not change accordingly. Generally, capacitors, resistors and inductors are collectively called the three passive components. However, they are based on functions. In other words, capacitors store charges in electrostatic mode, which can release electrical energy within a predetermined period of time, and can even be used as a filter or side wave coordinated use; while resistors can be used to adjust the voltage and current in the circuit; inductance is used to filter noise in the current , The main function is to prevent electromagnetic interference.
目前各項資訊、通訊、消費電子或其他尖端電子產品都係藉由三者彼此相互搭配應用而達成電子迴路控制的目的,且因為電子產品的種類無遠弗界,遂使被動元件中有關電容器的要求被提升,例如:電容 器尺寸越來越小或電容器介電穩定性要求越來越高,然而,電容器依材質可分為鋁質電解電容器、陶瓷電容器、塑膠薄膜電容器、鉭質電容器以及雲母電容器等,其中,陶瓷電容器因為具有介電係數高、絕緣度好、耐熱佳、體積小、適合量產且穩定性及可靠度良好等特性,並因陶瓷電容器耐高壓和高熱、運作溫度範圍廣的優點,再加上晶片化之陶瓷電容器可透過表面黏著技術(SMT)直接焊接,生產製造之速度與數量亦較電解電容器、組質電容器等其它電容器來得優越許多。 At present, various information, communications, consumer electronics or other cutting-edge electronic products are used in conjunction with each other to achieve the purpose of electronic circuit control, and because the types of electronic products have no boundaries, the capacitors in the passive components Requirements have been raised, for example: capacitors The size of capacitors is getting smaller or the requirements for dielectric stability of capacitors are getting higher and higher. However, capacitors can be divided into aluminum electrolytic capacitors, ceramic capacitors, plastic film capacitors, tantalum capacitors and mica capacitors according to their materials. Among them, ceramic capacitors Because it has the characteristics of high dielectric coefficient, good insulation, good heat resistance, small size, suitable for mass production, and good stability and reliability, and because of the advantages of ceramic capacitors with high voltage and high heat resistance and wide operating temperature range, plus the chip The ceramic capacitors can be directly welded through surface mount technology (SMT), and the speed and quantity of manufacturing are also much better than other capacitors such as electrolytic capacitors and assembled capacitors.
又,陶瓷電容器種類繁多,例如:圓板狀陶瓷電容器、錠狀陶瓷電容器及積層陶瓷電容器(Multi-Layer CeramicCapacitor,MLCC)等都是市場上普遍常見的典型陶瓷電容器,其中積層陶瓷電容器主要係由高介電性質之鈦酸鋇所組成,而其電容值含量通常與產品表面積大小、陶瓷薄膜堆疊層數成正比,且內部為由一層內部電極層、一層陶瓷誘電體層以及一層內部電極層呈交錯間隔堆疊形成並聯在一起的電容,也就是每一陶瓷誘電體層都被上、下二平行之內部電極層夾住形成一平板電容後,再結合外部電極層作電性導通,如此,積層陶瓷電容器即可作為儲存電量的容器。 In addition, there are many types of ceramic capacitors. For example, disc ceramic capacitors, ingot ceramic capacitors and multilayer ceramic capacitors (Multi-Layer Ceramic Capacitor, MLCC) are typical ceramic capacitors commonly used in the market. Among them, multilayer ceramic capacitors are mainly composed of It is composed of barium titanate with high dielectric properties, and its capacitance content is usually proportional to the surface area of the product and the number of ceramic film stacks. The interior is composed of an internal electrode layer, a ceramic dielectric layer, and an internal electrode layer. Stacked at intervals to form capacitors connected in parallel, that is, each ceramic dielectric layer is sandwiched by the upper and lower internal electrode layers to form a flat capacitor, and then combined with the external electrode layers for electrical conduction. In this way, multilayer ceramic capacitors It can be used as a container for storing electricity.
再者,積層陶瓷電容器因為陶瓷誘電體層及內部電極層呈交錯間隔的堆疊數量較多,所以係電子產品中目前最受歡迎且應用最廣泛的陶瓷電容器,特別常見於可攜式的高階電子及通訊產品,例如:PC、手機或車用電子元件等。 Furthermore, multilayer ceramic capacitors are the most popular and most widely used ceramic capacitors in electronic products because of the large number of stacks of ceramic dielectric layers and internal electrode layers in staggered intervals. They are especially common in portable high-end electronics and Communication products, such as PCs, mobile phones or automotive electronic components, etc.
習知技藝如日本特開平5-3131之專利案,其揭露一種積層陶瓷電容器,該積層陶瓷電容器具備內部電極與陶瓷誘電體交互疊 層的積層體以及外部電極層,其中該積層陶瓷電容器的內部電極係由鎳組成,且位於陶瓷誘電體二側之外部電極層則包括第一外部電極、位於二第一外部電極外部利用玻璃結合銀(或銀合金)所成型之第二外部電極、以及成型於二第二外部電極外部由電鍍金屬皮膜所成型之第三外部電極。 Conventional techniques such as the patent of Japanese Patent Application Laid-Open No. 5-3131, which discloses a multilayer ceramic capacitor with internal electrodes and ceramic dielectrics alternately stacked The internal electrode of the multilayer ceramic capacitor is composed of nickel, and the external electrode layer on the two sides of the ceramic dielectric includes the first external electrode, and the two first external electrodes are located outside the two first external electrodes and are bonded by glass The second external electrode formed by silver (or silver alloy), and the third external electrode formed by electroplating metal film formed on the outside of the two second external electrodes.
其中該陶瓷誘電體與鎳材質的第一外部電極在相鄰結合位置周圍,因燒結溫度高容易形成氧化鎳的擴散層,使結合強度提升,然而,當製作第二外部電極時,由於玻璃材質的粉末具有燒結溫度甚高及燒結時間冗長的特性,遂容易使玻璃成份以熱擴散方式侵入第一外部電極與陶瓷誘電體內部,最終造成積層陶瓷電容器或誘電體的結構強度降低。 Among them, the ceramic dielectric body and the first external electrode made of nickel are around the adjacent bonding position. Due to the high sintering temperature, it is easy to form a diffusion layer of nickel oxide, which improves the bonding strength. However, when the second external electrode is made, the glass material The powder has the characteristics of very high sintering temperature and lengthy sintering time, so it is easy for the glass component to invade the first external electrode and the ceramic dielectric body by thermal diffusion, and ultimately cause the structural strength of the multilayer ceramic capacitor or dielectric body to decrease.
此外,第二外部電極因為同時包括玻璃粉末及銀(或銀合金)材料,故容易發生玻璃粉末分佈不均勻現象,當玻璃粉末往周圍聚積或大量密集分佈時,則於第二外部電極外部再電鍍第三外部電極時,即容易造成電鍍液(如:鎳電鍍液)經由第二、第一外部電極的擴散路徑侵入至陶瓷誘電體內部,遂造成積層陶瓷電容器的緻密度嚴重不佳、品質變差、質地脆弱及易生裂縫,如果應用於電子產品上時,則無法發揮積層陶瓷電容器預期的正常功能,故存在諸多缺失有待改善。 In addition, because the second external electrode includes glass powder and silver (or silver alloy) materials at the same time, uneven distribution of the glass powder is prone to occur. When the glass powder accumulates around or is densely distributed, it will be placed outside the second external electrode. When the third external electrode is electroplated, it is easy to cause the electroplating solution (such as nickel electroplating solution) to penetrate into the ceramic dielectric body through the diffusion path of the second and first external electrodes, resulting in a serious poor density and quality of the multilayer ceramic capacitor. Due to deterioration, fragile texture, and easy cracking, if applied to electronic products, the multilayer ceramic capacitor cannot perform the expected normal function, so there are many shortcomings that need to be improved.
又,習知技藝積層陶瓷電容器普遍係以多次的加熱或燒結製程去製作外部電極的層狀結構,但頻繁的燒結或過高溫度的加熱都會對電容器造成破壞,特別是內部電極與第一外部電極,為了生產高電容量的積層陶瓷電容器並增加內部電極的堆疊數量,許多內部電極都漸漸趨向薄型化,致使每一層內部電極與第一外部電極彼此能夠接觸的面積縮小許多,此時若已經成型的第一外部電極受到後續製程的溫度影響並發生熱膨脹 現象,則第一外部電極與內部電極原先接觸的位置將發生剝離之情況,甚至破壞或斷裂,繼而影響電容器的電氣特性。 In addition, conventional multilayer ceramic capacitors generally use multiple heating or sintering processes to fabricate the layered structure of the external electrodes. However, frequent sintering or excessively high temperature heating will damage the capacitors, especially the internal electrodes and the first For external electrodes, in order to produce high-capacity multilayer ceramic capacitors and increase the number of internal electrodes stacked, many internal electrodes are gradually becoming thinner, so that the contact area between each layer of internal electrodes and the first external electrode is much reduced. The formed first external electrode is affected by the temperature of the subsequent process and undergoes thermal expansion Phenomenon, the position where the first external electrode and the internal electrode were in contact with each other will peel off, or even break or break, which will affect the electrical characteristics of the capacitor.
此外,習知技藝的積層陶瓷電容器製作外部電極或第一外部電極時可能會選擇含銅金屬或銅金屬等,但外部電極與內部電極因為材料種類不同,致使彼此熱膨脹係數不相同,一旦受熱發生體積變化,則第一外部電極與內部電極原先接觸的位置也容易發生破壞。 In addition, the conventional multilayer ceramic capacitor may choose copper-containing metal or copper metal when making the external electrode or the first external electrode. However, the external electrode and the internal electrode have different thermal expansion coefficients due to the different materials. If the volume changes, the original contact position of the first external electrode and the internal electrode is also prone to damage.
呈上所述,習知技藝存在上述諸多積層陶瓷電容器問題,特別係玻璃不均勻地存在會使外部電極於成型過程發生電鍍液入侵陶瓷誘電體並導致信賴性裂化,因此,如何解決積層陶瓷電容器受到玻璃粉末材料或其它雜質元素擴散侵入,此為本領域相關廠商所亟欲研究改善之方向所在者。 As mentioned above, the conventional technology has many of the above-mentioned problems of multilayer ceramic capacitors. In particular, the uneven presence of glass will cause the plating solution to invade the ceramic dielectric body during the molding process of the external electrodes and cause reliability cracking. Therefore, how to solve the problem of multilayer ceramic capacitors Diffusion invaded by glass powder materials or other impurity elements, this is where the relevant manufacturers in the field urgently want to study and improve the direction.
故,發明人有鑑於上述缺失,乃搜集相關資料,經由多方評估及考量,並以從事於此行業累積之多年經驗,經由不斷試作及修改,始設計出此種積層陶瓷電容器及其製造方法的發明專利者。 Therefore, in view of the above-mentioned deficiencies, the inventor collected relevant information, evaluated and considered from many parties, and based on years of experience in this industry, through continuous trials and modifications, he began to design this type of multilayer ceramic capacitor and its manufacturing method. Invention patentee.
本發明之主要目的乃在於該陶瓷電容器之基部為包括陶瓷誘電體及成型於陶瓷誘電體內呈交錯間隔排列之複數內部電極,並於複數內部電極一側邊分別設有露出陶瓷誘電體外之內電極端部,且該內部電極含有粒徑為介於0.2μm~0.4μm之鎳粉及鈦酸鋇粉,再於基部二側邊燒結有外部電極層之二第一外部電極,且該二第一外部電極為與複數內部電極之內電極端部呈電性接觸,而該第一外部電極含有粒徑為介於0.2μm~0.4μm之鎳粉及鈦酸鋇粉,再於二第一外部電極外部成型 有由金屬粉末及樹脂製成之第二外部電極,其因內部電極與第一外部電極皆含有粒徑為介於0.2μm~0.4μm之鎳粉及鈦酸鋇粉,所以可使內部電極與第一外部電極電性接觸性良好,且可提升相互結合強度,進而降低第一外部電極剝離於內部電極的情況發生,藉此防止電鍍液侵入,以達到提升產品良率、增加市場競爭力之目的。 The main purpose of the present invention is that the base of the ceramic capacitor includes a ceramic dielectric body and a plurality of internal electrodes formed in the ceramic dielectric body and arranged in staggered intervals, and each side of the plurality of internal electrodes is provided with the internal electrodes exposing the ceramic dielectric body. The extreme part, and the internal electrode contains nickel powder and barium titanate powder with a particle size of 0.2μm~0.4μm, and two first external electrodes of external electrode layers are sintered on both sides of the base, and the two first The external electrode is in electrical contact with the inner electrode ends of the plurality of internal electrodes, and the first external electrode contains nickel powder and barium titanate powder with a particle size of 0.2μm~0.4μm, and is connected to the two first external electrodes. External molding There is a second external electrode made of metal powder and resin. Both the internal electrode and the first external electrode contain nickel powder and barium titanate powder with a particle size of 0.2μm~0.4μm, so the internal electrode can be The first external electrode has good electrical contact and can increase the mutual bonding strength, thereby reducing the occurrence of peeling of the first external electrode from the internal electrode, thereby preventing the intrusion of electroplating solution, so as to achieve the improvement of product yield and increase market competitiveness. purpose.
本發明之次要目的乃在於該第二鎳電極膏中鎳粉對鈦酸鋇粉體積百分率較佳為與第一鎳電極膏中鎳粉對鈦酸鋇粉體積百分率相同,以使積層陶瓷電容器受熱發生膨賬時,體積變化會趨於相同或近似,進而避免熱膨脹所產生的破壞,且第一鎳電極膏可作為第二鎳電極膏使用,藉此達到減少材料製造時間、浪費及庫存之目的。 The secondary objective of the present invention is that the volume percentage of nickel powder to barium titanate powder in the second nickel electrode paste is preferably the same as the volume percentage of nickel powder to barium titanate powder in the first nickel electrode paste, so that the multilayer ceramic capacitor When swelling occurs due to heat, the volume change will tend to be the same or similar, thereby avoiding damage caused by thermal expansion, and the first nickel electrode paste can be used as the second nickel electrode paste, thereby reducing material manufacturing time, waste and inventory purpose.
本發明之另一目的乃在於該基部與外部電極層之第一外部電極為透過共同燒結方式製成,即可有效減少後續加熱次數或溫度對於電容器本身或複數內部電極之內電極端部所產生的結構破壞,以使第一外部電極質地不至發生脆弱或產生裂縫等情況,進而提升緻密度,藉此達到提升二第一外部電極與複數內部電極電性接觸性之目的。 Another object of the present invention is that the base and the first external electrode of the external electrode layer are made by a co-sintering method, which can effectively reduce the number of subsequent heating or temperature caused by the capacitor itself or the internal electrode end of the plurality of internal electrodes. The structure is destroyed, so that the texture of the first external electrode will not be fragile or cracked, thereby increasing the density, thereby achieving the purpose of improving the electrical contact between the two first external electrodes and the plurality of internal electrodes.
本發明之再一目的乃在於該金屬電極膏中之金屬粉末可為銀粉、銀與鎳混合粉末、銅粉、表面覆蓋銀之銅粉或其它具導電性之粉末,而該樹脂為包含環氧樹脂及熱硬化性樹脂,且因第二外部電極為在溫度區間250℃左右進行固化成型,故可確保在成型第二外部電極時,不會發生金屬粉末擴散或入侵至二第一外部電極、陶瓷誘電體或內部電極等位置,便可達到不致影響第一外部電極、陶瓷誘電體或內部電極等結構強度或電性傳導等性能之目的。 Another object of the present invention is that the metal powder in the metal electrode paste can be silver powder, silver and nickel mixed powder, copper powder, copper powder covered with silver or other conductive powder, and the resin contains epoxy Resin and thermosetting resin, and because the second external electrode is cured and molded in a temperature range of about 250°C, it can be ensured that when the second external electrode is molded, the metal powder will not diffuse or invade the two first external electrodes, The position of the ceramic dielectric body or the internal electrode can achieve the purpose of not affecting the structural strength or electrical conductivity of the first external electrode, the ceramic dielectric body or the internal electrode.
1‧‧‧基部 1‧‧‧Base
11‧‧‧陶瓷誘電體 11‧‧‧Ceramic dielectric
12‧‧‧內部電極 12‧‧‧Internal electrode
121‧‧‧內電極端部 121‧‧‧Inner electrode end
2‧‧‧外部電極層 2‧‧‧External electrode layer
21‧‧‧第一外部電極 21‧‧‧First external electrode
22‧‧‧第二外部電極 22‧‧‧Second external electrode
23‧‧‧第三外部電極 23‧‧‧Third external electrode
第一圖 係為本發明之側視剖面圖。 The first figure is a cross-sectional side view of the present invention.
第二圖 係為本發明之流程圖。 The second figure is a flowchart of the present invention.
第三圖 係為本發明之靜電容量及絕緣電阻裂化率之測試結果圖(一)。 The third figure is the test result figure (1) of the electrostatic capacity and insulation resistance cracking rate of the present invention.
第四圖 係為本發明之靜電容量及絕緣電阻裂化率之測試結果圖(二)。 The fourth figure is the test result figure (2) of the electrostatic capacity and insulation resistance cracking rate of the present invention.
為達成上述目的及功效,本發明所採用之技術手段及其構造,茲繪圖就本發明之較佳實施例詳加說明其特徵與功能如下,俾利完全瞭解。 In order to achieve the above-mentioned purpose and effect, the technical means and structure adopted by the present invention are illustrated below in detail to illustrate the features and functions of the preferred embodiments of the present invention, so as to fully understand.
請參閱第一圖,係為本發明之側視剖面圖,由圖中可清楚看出,該積層陶瓷電容器係包括基部1及成型於基部1二側邊之外部電極層2,其中:
Please refer to the first figure, which is a side sectional view of the present invention. It can be clearly seen from the figure that the multilayer ceramic capacitor includes a base 1 and an
該基部1為包括陶瓷誘電體11及成型於陶瓷誘電體11內呈交錯間隔排列之複數內部電極12,其中該複數內部電極12一側邊分別設有露出陶瓷誘電體11外之內電極端部121,而該複數內部電極12之內電極端部121為分別以間隔交錯方式露出於陶瓷誘電體11相對二側邊,且該內部電極12含有粒徑為介於0.2μm~0.4μm之鎳粉及鈦酸鋇粉。
The base 1 includes a ceramic
該外部電極層2為包括成型於基部1的陶瓷誘電體11二側邊之第一外部電極21、成型於二側第一外部電極21外部之第二外部電極22及成型於二第二外部電極22外部之第三外部電極23,其中該
二第一外部電極21為與複數內部電極12之內電極端部121呈電性接觸,且該第一外部電極21含有粒徑為介於0.2μm~0.4μm之鎳粉及鈦酸鋇粉,而該第二外部電極22為由金屬粉末及樹脂等成分所固化成型。
The
上述基部1之陶瓷誘電體11的成份為包括有鈦酸鋇粉、氧化錳粉、氧化釔粉、氧化矽粉及樹脂等。
The composition of the ceramic
再者,上述基部1之內部電極12及外部電極層2之第一外部電極21所含之鈦酸鋇粉的粒徑為介於0.05μm~0.1μm,且該內部電極12中之鈦酸鋇粉對鎳粉的體積百分率可為25vol%,而該第一外部電極21中之鈦酸鋇粉對鎳粉的體積百分率為介於15vol%~50vol%。
Furthermore, the particle size of the barium titanate powder contained in the
且上述外部電極層2之第二外部電極22為由金屬粉末及樹脂等成分組成,且該金屬粉末可為銀粉、銀與鎳混合粉末、銅粉、表面覆蓋銀之銅粉或其它具導電性之粉末,而該樹脂為包含環氧樹脂及熱硬化性樹脂(如:脲甲醛或酚醛樹脂等)。
And the second
然而,上述外部電極層2之第三外部電極23為鎳及錫等為主成分進行電鍍加工之電鍍層。
However, the third
再請參閱第二圖所示,係為本發明之流程圖,由圖中可清楚看出,本發明積層陶瓷電容器之製造方法係包括下列之步驟: Please refer to the second figure again, which is the flow chart of the present invention. From the figure, it can be clearly seen that the manufacturing method of the multilayer ceramic capacitor of the present invention includes the following steps:
(A)係可先將陶瓷漿料利用薄帶成型機加工成型為陶瓷薄帶。 (A) The ceramic slurry can be processed into a ceramic thin strip by a thin strip forming machine.
(B)並將第一鎳電極膏加工成型於陶瓷薄帶上,以使陶 瓷薄帶上成形出鎳電極膏層,且待其乾燥,而該第一鎳電極膏為包含有鎳粉及鈦酸鋇粉,且該鎳粉含有粒徑為介於0.2μm~0.4μm。 (B) The first nickel electrode paste is processed and formed on the ceramic thin tape to make the ceramic A nickel electrode paste layer is formed on the ceramic thin belt, and is allowed to dry. The first nickel electrode paste contains nickel powder and barium titanate powder, and the nickel powder has a particle size ranging from 0.2 μm to 0.4 μm.
(C)再將複數陶瓷薄帶以交錯方式堆疊,以使複數鎳電極膏層呈交錯型式間隔堆疊設置,並予以進行加壓之積層結合,再予以進行切割,即成型出積層陶瓷電容器之生胚,且該複數鎳電極膏層一側邊為分別以間隔交錯方式露出於生胚相對二側邊。 (C) Then stack a plurality of ceramic thin strips in a staggered manner, so that the plurality of nickel electrode paste layers are stacked in a staggered pattern, and are laminated and combined under pressure, and then cut, that is, the production of a multilayer ceramic capacitor is formed Embryos, and one side of the plurality of nickel electrode paste layers are respectively exposed on two opposite sides of the green embryo in a staggered manner.
(D)便可將生胚相對二側邊浸於第二鎳電極膏中,再進行塗佈預定厚度後待其乾燥,而該第二鎳電極膏為包含有鎳粉及鈦酸鋇粉,且該鎳粉含有粒徑為介於0.2μm~0.4μm。 (D) The two opposite sides of the green embryo can be immersed in the second nickel electrode paste, and then coated with a predetermined thickness and then dried. The second nickel electrode paste contains nickel powder and barium titanate powder, And the nickel powder has a particle size ranging from 0.2 μm to 0.4 μm.
(E)然後將生胚及二端面之第二鎳電極膏利用共同燒結方式進行燒結作業,以使生胚燒結成形為積層陶瓷電容器之基部1,且該複數陶瓷薄帶燒結成形為基部1之複數陶瓷誘電體11,而該複數鎳電極膏層燒結成形為基部1之複數內部電極12,另該第二鎳電極膏則燒結成形為外部電極層2之第一外部電極21,且複數內部電極12露出於基部1相對二側邊之內電極端部121為與第一外部電極21形成電性接觸。
(E) Then the green blank and the second nickel electrode paste on the two end faces are sintered by a common sintering method, so that the green blank is sintered and formed into the base 1 of the multilayer ceramic capacitor, and the plurality of ceramic ribbons are sintered and formed into the base 1 A plurality of ceramic
(F)再將金屬電極膏成形於二第一外部電極21相對外側處,並將第一外部電極21固化成型為第二外部電極22。
(F) Then, the metal electrode paste is formed on the opposite outer sides of the two first
(G)又於二第二外部電極22外部進行電鍍加工,以成型出第三外部電極23,便可完成積層陶瓷電容器之製造。
(G) Electroplating is performed on the outside of the two second
上述步驟(A)之前為可先執行步驟(A01): Step (A01) can be performed first before the above step (A):
(A01)取預定重量之主成分〔以鈦酸鋇為主,再添加其它成分(如:氧化錳粉、氧化釔粉或氧化矽粉等)〕、溶劑(即乙醇與 甲苯組成)及塑化劑等,並透過球磨機進行加工混合,以製成陶瓷漿料。 (A01) Take a predetermined weight of the main component (based on barium titanate, and then add other components (such as: manganese oxide powder, yttrium oxide powder or silica powder, etc.)), solvent (ie ethanol and Toluene) and plasticizer, etc., and processed and mixed through a ball mill to make ceramic slurry.
且上述步驟(A)中之陶瓷漿料為可透過薄帶成型機之刮刀來於塑膠膜(如:PET膜)上製作寬度約為150mm、厚度約為10μm之陶瓷薄帶,而較佳製作寬度約為150mm,且厚度約為6μm之陶瓷薄帶,再使用此陶瓷薄帶製作3225尺寸的10μF的電容器。 In addition, the ceramic slurry in the above step (A) can be used to produce a ceramic ribbon with a width of about 150mm and a thickness of about 10μm on a plastic film (such as PET film) through the scraper of the ribbon forming machine. A ceramic ribbon with a width of about 150mm and a thickness of about 6μm is used to make a 3225 size 10μF capacitor.
再者,上述步驟(B)中之第一鎳電極膏為可透過網版印刷加工方式來於陶瓷薄帶上成形出鎳電極膏層,且該第一鎳電極膏包括鎳粉、鈦酸鋇粉、黏合劑及溶劑等成分,而該鈦酸鋇粉的粒徑為介於0.05μm~0.1μm,且鎳粉對鈦酸鋇粉體積百分率約為25vol%。 Furthermore, the first nickel electrode paste in the above step (B) is a nickel electrode paste layer that can be formed on a ceramic thin belt through a screen printing process, and the first nickel electrode paste includes nickel powder and barium titanate. Powder, binder, solvent and other ingredients, and the barium titanate powder has a particle size ranging from 0.05 μm to 0.1 μm, and the volume percentage of nickel powder to barium titanate powder is about 25 vol%.
而上述步驟(C)中之陶瓷薄帶為可被切割成約為150mm*150mm的尺寸。 The ceramic thin strip in the above step (C) can be cut into a size of about 150mm*150mm.
然而,上述步驟(D)執行前為可進一步執行步驟(D01): However, the step (D01) can be further executed before the above step (D) is executed:
(D01)將生胚與食物粉裝填於容器中,並使容器迴轉研磨生胚的各角落部位。 (D01) Fill the container with the raw embryo and food powder, and rotate the container to grind the corners of the raw embryo.
又上述步驟(D)中之第二鎳電極膏為包括鎳粉、鈦酸鋇粉、黏合劑及溶劑等成分,而該鈦酸鋇粉的粒徑為介於0.05μm~0.1μm,且鎳粉對鈦酸鋇粉體積百分率為介於15vol%~50vol%,而該第二鎳電極膏中鎳粉對鈦酸鋇粉體積百分率較佳為與第一鎳電極膏中鎳粉對鈦酸鋇粉體積百分率相同,以使積層陶瓷電容器受熱發生膨賬時,體積變化會趨於相同或近似,進而避免熱膨脹所產生的破壞,且可使第一鎳電極膏作為第二鎳電極膏使用,藉此減少材料製造時間、浪費及 庫存。 In the above step (D), the second nickel electrode paste includes nickel powder, barium titanate powder, binder and solvent, etc. The particle size of the barium titanate powder is between 0.05μm and 0.1μm, and the nickel The volume percentage of barium titanate powder to barium titanate powder is 15vol%~50vol%, and the volume percentage of nickel powder to barium titanate powder in the second nickel electrode paste is preferably the same as that in the first nickel electrode paste. The powder volume percentage is the same, so that when the multilayer ceramic capacitor is heated and swelled, the volume change will tend to be the same or similar, so as to avoid damage caused by thermal expansion, and the first nickel electrode paste can be used as the second nickel electrode paste. This reduces material manufacturing time, waste and in stock.
另外,上述步驟(D)中第二鎳電極膏之厚度為介於5μm~50μm,以可保持積層陶瓷電容器較安定的電氣特性,當第二鎳電極膏之厚度超過50μm時,其外部電極層2之二第一外部電極21燒結成型後,可能會造成第一外部電極21發生剝離之現象,而當第二鎳電極膏之厚度未滿5μm時,即會產生二第一外部電極21與複數內部電極12的內電極端部121間電性接續不充分之情況,以造成燒結後的成品無法得到安定的電氣特性等缺失。
In addition, the thickness of the second nickel electrode paste in the above step (D) is between 5μm~50μm to maintain the stable electrical characteristics of the multilayer ceramic capacitor. When the thickness of the second nickel electrode paste exceeds 50μm, the external electrode layer 2bis. After the first
且上述步驟(E)中之生胚相對二側邊分別成形有第二鎳電極膏後,為可將生胚及二端面之第二鎳電極膏置於氮氣環境中,並以約400℃的溫度進行脫脂處理,再控制氫氣/水蒸氣的含量,以使生胚及二第二鎳電極膏於比鎳的平衡氧分壓低一位數以上的低還原氣氛之燒結條件下進行約1300℃共同燒結作業;然而,當基部1二側在約1300℃左右溫度燒結成型外部電極層2之第一外部電極21時,該第一外部電極21質地不至發生脆弱或產生裂縫等情況,且燒結後第一外部電極21的緻密度極佳,以可使二第一外部電極21與複數內部電極12之內電極端部121呈充分接續之電性導通,進而提升電性導通之穩定性,且利用共同燒結方式能夠有效減少後續加熱次數或溫度對於電容器本身或複數內部電極12之內電極端部121所產生的結構破壞;另外,脫脂條件可依使用的黏結劑與塑化劑的種類作適宜的條件決定,至於最高燒結溫度,為可依據陶瓷材料的種類可得到充分緻密性的溫度來進行決定,然而,對於氣氛,若以鎳會氧化的氣氛作燒結作業的話,該外部電極層2之二第一外
部電極21會酸化,因此,無法得到充分的導通,必須要留意。
And after the second nickel electrode paste is formed on the opposite sides of the green embryo in the above step (E), the green embryo and the second nickel electrode paste on the two end faces can be placed in a nitrogen environment and heated to a temperature of about 400°C. The temperature is degreasing treatment, and the hydrogen/water vapor content is controlled so that the green embryo and the second nickel electrode paste are sintered at about 1300°C under a low reducing atmosphere that is one digit lower than the equilibrium oxygen partial pressure of nickel. Sintering operation; however, when the first
而上述步驟(F)中之金屬電極膏為可直接塗佈至二第一外部電極21相對二側處,亦或者將二第一外部電極21浸漬於金屬電極膏中,即可使金屬電極膏成形於二第一外部電極21相對外側處,且二側金屬電極膏為可利用加熱或置於250℃左右溫度環境中,使金屬電極膏固化成型為第二外部電極22。
The metal electrode paste in the above step (F) can be directly applied to the two opposite sides of the two first
且上述步驟(F)中之金屬電極膏為包括金屬粉末及樹脂等成分,並可在大氣環境中利用約為100℃~150℃/30分鐘進行乾燥處理,再於大氣環境中以220℃~270℃使金屬電極膏固化成形,藉此使固化成型為第二外部電極22,且該金屬電極膏固化成型的溫度較佳為介於240℃~270℃,以可使基部1與外部電極層2之二第一外部電極21有充分的固著、接著強度及良好電性導通狀態;另外,該金屬電極膏中之金屬粉末可為銀粉、銀與鎳混合粉末、銅粉、表面覆蓋銀之銅粉或其它具導電性之粉末,而該樹脂為包含環氧樹脂及熱硬化性樹脂(如:脲甲醛或酚醛樹脂等),且因第二外部電極22為在溫度區間250℃左右進行固化成型,故可確保在成型第二外部電極22時,不會發生金屬粉末擴散或入侵至二第一外部電極21、陶瓷誘電體11或內部電極12等位置,便不致影響第一外部電極21、陶瓷誘電體11或內部電極12等結構強度或電性傳導等性能。
And the metal electrode paste in the above step (F) includes metal powder and resin and other components, and can be dried at about 100℃~150℃/30 minutes in an atmospheric environment, and then heated at 220℃~ The metal electrode paste is solidified and formed at 270°C, thereby solidifying and forming the second
上述步驟(G)中之二第二外部電極22為可透過鎳與錫電鍍成形有第三外部電極23,以使基部1二側邊分別成型有外部電極層2之第一外部電極21、第二外部電極22及第三外部電極23,以製作
出積層陶瓷電容器,且可提升積層陶瓷電容器之結構強度增加及信賴性;另外,其因第二外部電極22中之樹脂材料具有阻隔金屬元素擴散的特殊性,所以當基部1二側的第二外部電極22外部進行電鍍加工成型第三外部電極23時,該第三外部電極23之電鍍液將不會侵入第二外部電極22、第一外部電極21、陶瓷誘電體11或內部電極12等位置處,以可保持積層陶瓷電容器的既有結構強度,進而具有良好的電容器性能。
The second
又,為了證實本發明所製作積層陶瓷電容器所具有之電容強度及信賴度,本發明基部1之內部電極12及外部電極層2之第一外部電極21中之鎳粉及鈦酸鋇粉為選擇三種不同粒徑搭配,且該第一外部電極21中之鎳粉及鈦酸鋇粉分別依據不同體積百分率比例進行試驗,比較燒成後不同第一外部電極厚度對靜電容量及絕緣電阻裂化率的結果,全部試驗結果如第三、四圖所示。
In addition, in order to verify the capacitance strength and reliability of the multilayer ceramic capacitor produced by the present invention, the nickel powder and barium titanate powder in the
第一種搭配:該內部電極12中之鎳粉粒徑為0.4μm及鈦酸鋇粉粒徑為0.1μm,且鈦酸鋇粉對鎳粉的體積百分率比例為25vol%,而該第一外部電極21中之鎳粉粒徑為0.4μm及鈦酸鋇粉粒徑為0.1μm。
The first combination: the particle size of the nickel powder in the
第二種搭配:該內部電極12中之鎳粉粒徑為0.2μm及鈦酸鋇粉粒徑為0.05μm,且鈦酸鋇粉對鎳粉的體積百分率比例為25vol%,而該第一外部電極21中之鎳粉粒徑為0.4μm及鈦酸鋇粉粒徑為0.1μm。
The second combination: the particle size of the nickel powder in the
第三種搭配:該內部電極12中之鎳粉粒徑為0.2μm及鈦酸鋇粉粒徑為0.05μm,且鈦酸鋇粉對鎳粉的體積百分率比例為
25vol%,而該第一外部電極21中之鎳粉粒徑為0.2μm及鈦酸鋇粉粒徑為0.05μm。
The third combination: the particle size of the nickel powder in the
由上述三種搭配可清楚看出該內部電極12使用含有粒徑0.2~0.4μm的鎳粉與粒徑0.05~0.1μm的鈦酸鋇粉及第一外部電極21使用含有粒徑0.2~0.4μm的鎳粉與粒徑0.05~0.1μm的鈦酸鋇粉時,其第一外部電極21燒結後平均厚度在5~50μm的範圍內沒有發生剝離之情況,且靜電容量皆可達到10μF以上,並且第一外部電極21中鈦酸鋇粉對鎳粉的體積比為15vol%~50vol%的組成範圍可被使用,以及信賴性1000小時試驗結果顯示所有80件試驗品內沒有任何一件試驗品現缺陷或絕緣阻抗裂化。
It can be clearly seen from the above three combinations that the
本發明為具有下列之優點: The present invention has the following advantages:
(一)該內部電極與第一外部電極皆含有粒徑為介於0.2μm~0.4μm之鎳粉及鈦酸鋇粉,所以可使內部電極與第一外部電極電性接觸性良好,且可提升相互結合強度,進而降低第一外部電極剝離於內部電極的情況發生,藉此防止電鍍液侵入,以達到提升產品良率、增加市場競爭力之效用。 (1) The internal electrode and the first external electrode both contain nickel powder and barium titanate powder with a particle size of 0.2μm~0.4μm, so the internal electrode and the first external electrode have good electrical contact and can be The mutual bonding strength is improved, thereby reducing the occurrence of peeling of the first external electrode from the internal electrode, thereby preventing the intrusion of electroplating solution, so as to achieve the effect of improving product yield and increasing market competitiveness.
(二)該第二鎳電極膏中鎳粉對鈦酸鋇粉體積百分率較佳為與第一鎳電極膏中鎳粉對鈦酸鋇粉體積百分率相同,以使積層陶瓷電容器受熱發生膨賬時,體積變化會趨於相同或近似,進而避免熱膨脹所產生的結構破壞,且第一鎳電極膏可作為第二鎳電極膏使用,藉此達到減少材料製造時間、浪費及庫存之效果。 (2) The volume percentage of nickel powder to barium titanate powder in the second nickel electrode paste is preferably the same as the volume percentage of nickel powder to barium titanate powder in the first nickel electrode paste, so that the multilayer ceramic capacitor will swell when heated , The volume changes tend to be the same or similar, thereby avoiding structural damage caused by thermal expansion, and the first nickel electrode paste can be used as the second nickel electrode paste, thereby achieving the effect of reducing material manufacturing time, waste and inventory.
(三)該基部1與外部電極層2之第一外部電極21為透
過共同燒結方式製成,即可有效減少後續加熱次數或溫度對於電容器本身或複數內部電極12之內電極端部121所產生的結構破壞,以使第一外部電極21質地不至發生脆弱或產生裂縫等情況,進而提升緻密度,藉此達到提升二第一外部電極21與複數內部電極12電性接觸性之效用。
(3) The base 1 and the first
(四)該金屬電極膏中之金屬粉末可為銀粉、銀與鎳混合粉末、銅粉、表面覆蓋銀之銅粉或其它具導電性之粉末,而該樹脂為包含環氧樹脂及熱硬化性樹脂,且因第二外部電極22為在溫度區間250℃左右進行固化成型,故可確保在成型第二外部電極22時,不會發生金屬粉末擴散或入侵至二第一外部電極21、陶瓷誘電體11或內部電極12等位置,便不致影響第一外部電極21、陶瓷誘電體11或內部電極12等結構強度或電性傳導等性能。
(4) The metal powder in the metal electrode paste can be silver powder, silver and nickel mixed powder, copper powder, copper powder covered with silver or other conductive powder, and the resin contains epoxy resin and thermosetting Resin, and because the second
上所述僅為本發明之較佳實施例而已,非因此即侷限本發明之專利範圍,故舉凡運用本發明說明書及圖式內容所為之簡易修飾及等效結構變化,均應同理包含於本發明之專利範圍內,合予陳明。 The above are only the preferred embodiments of the present invention, which does not limit the patent scope of the present invention. Therefore, all simple modifications and equivalent structural changes made by using the description and drawings of the present invention should be included in the same reasoning. Within the scope of the patent of the present invention, it should be Chen Ming.
綜上所述,本發明之積層陶瓷電容器及其製造方法於實際應用、實施時,為確實能達到其功效及目的,故本發明誠為一實用性優異之研發,為符合發明專利之申請要件,爰依法提出申請,盼 審委早日賜准本案,以保障發明人之辛苦研發、創設,倘若 鈞局審委有任何稽疑,請不吝來函指示,發明人定當竭力配合,實感德便。 In summary, the multilayer ceramic capacitor and its manufacturing method of the present invention can indeed achieve its effects and purposes during actual application and implementation. Therefore, the present invention is a research and development with excellent practicality and meets the requirements of an invention patent application. , Yan filed an application in accordance with the law, and I hope that the review committee will grant this case as soon as possible to ensure the inventor’s hard research and development and creation. If the review committee of the Bureau has any doubts, please feel free to write instructions, and the inventor will do his best to cooperate and feel good.
Claims (10)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108144164A TWI709987B (en) | 2019-12-03 | 2019-12-03 | Multilayer ceramic capacitor and its manufacturing method |
US16/751,656 US10777359B2 (en) | 2017-01-25 | 2020-01-24 | Multilayer ceramic capacitor |
CN202010244935.XA CN112908697B (en) | 2019-12-03 | 2020-03-31 | Multilayer ceramic capacitor and method for manufacturing same |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108144164A TWI709987B (en) | 2019-12-03 | 2019-12-03 | Multilayer ceramic capacitor and its manufacturing method |
Publications (2)
Publication Number | Publication Date |
---|---|
TWI709987B TWI709987B (en) | 2020-11-11 |
TW202123270A true TW202123270A (en) | 2021-06-16 |
Family
ID=74202379
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108144164A TWI709987B (en) | 2017-01-25 | 2019-12-03 | Multilayer ceramic capacitor and its manufacturing method |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI709987B (en) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWM586447U (en) * | 2019-05-13 | 2019-11-11 | 禾伸堂企業股份有限公司 | Heat-dissipation structure of laminated ceramic capacitor |
-
2019
- 2019-12-03 TW TW108144164A patent/TWI709987B/en active
Also Published As
Publication number | Publication date |
---|---|
TWI709987B (en) | 2020-11-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI665691B (en) | Multilayer ceramic capacitor and its manufacturing method | |
US11017950B2 (en) | Method for producing a ceramic electronic component | |
JP4276084B2 (en) | Multilayer electronic components | |
US8310805B2 (en) | Multilayer ceramic electronic component including plating material of external terminal electrode disposed in voids of inner conductor and method for manufacturing the same | |
US9275804B2 (en) | Ceramic electronic component and method for producing the same | |
KR101496814B1 (en) | Multilayered ceramic capacitor, the method of the same and board for mounting the same | |
KR101535838B1 (en) | Ceramic electronic component | |
US11011307B2 (en) | Electronic component | |
KR20110067509A (en) | Paste compound for termination electrode and multilayer ceramic capacitor comprising the same and manufactuaring method thereof | |
KR20150106742A (en) | Multilayered electronic component and manufacturing method thereof | |
US10361032B2 (en) | Ceramic capacitor including first, second, and third external electrodes wrapping around side and principal surfaces | |
US10361031B2 (en) | Ceramic capacitor including first, second, and third external electrodes wrapping around side and principal surfaces | |
TWI709987B (en) | Multilayer ceramic capacitor and its manufacturing method | |
TWI703596B (en) | Multilayer ceramic capacitor and its manufacturing method | |
JP2004096010A (en) | Laminated ceramic electronic component fabricating process | |
CN104008881B (en) | Multi-layer ceramics device | |
KR20130090335A (en) | Ceramic electronic component and manufacturing method therefor | |
JPH03296205A (en) | Ceramic capacitor | |
US10777359B2 (en) | Multilayer ceramic capacitor | |
CN112908697B (en) | Multilayer ceramic capacitor and method for manufacturing same | |
KR102198539B1 (en) | Conductive paste composition for inner electrode and method for manufacturing multi-layered ceramic electronic component | |
JPH0897006A (en) | Chip ceramic electronic part and manufacture thereof | |
TWI441341B (en) | Multilayer ceramic devices for computer products and sintering method thereof | |
KR100490500B1 (en) | Chip parts with good plating property and fabricating method therefor | |
TWI437711B (en) | Multilayer ceramic devices for consumer electronics and sintering method thereof |