TWI441341B - Multilayer ceramic devices for computer products and sintering method thereof - Google Patents

Description

Multilayer ceramic component for computer product and sintering method thereof

This case relates to a laminated ceramic component for a computer product and a sintering method thereof. In particular, the present invention relates to a laminated ceramic component for a computer product formed by sintering a green body by using a rapid heating rate and suppressing sintering shrinkage.

In the market trend of combining information and wireless communication, as well as the versatility and high performance of modern computer products, the electronic components in various computer products tend to be lighter, thinner or have better performance in the original size. . In terms of passive components, the application range of laminated ceramic components is quite extensive. However, in order to achieve thinness and shortness while maintaining good electrical properties, in addition to improving the properties of the raw materials, it is also possible to start with the process direction, improve the internal structure, and thin the internal electrode layer and the ceramic layer. Better electronic component characteristics.

Nowadays, the laminated ceramic component 1 is as shown in the first figure (a), and the manufacturing method thereof is to print the conductor electrode layer 121 on the ceramic layer 122 by a screen printing technique, and then use a multi-layer stacking method, after the sintering process. form. Finally, an electrode terminal 13 is provided at both ends thereof so as to be electrically connected to the external circuit. However, the ceramic layer 122 and the conductor electrode layer 121 themselves have different material properties, which will cause the conductor electrode layer 121 itself to be filled with defects due to the difference in temperature at which shrinkage starts and shrinkage, etc., without continuous electrode. Sex.

In order to solve the problem of electrode continuity, there are mainly two ways. First, the difference in time between the start of shrinkage between the ceramic layer 122 and the conductor electrode layer 121 can be brought about by the rapid temperature rise, and the different materials can be simultaneously contracted as much as possible to reduce the discontinuity of the electrode. In addition, before the ceramic element is laminated, as shown in the first figure (b), the surface of the parallel conductor electrode layer 121 and the ceramic layer 122 may be applied to the conductor electrode layer 121 and the ceramic layer 122. Outside of the formed element layer 12, a manner of suppressing the layer 11 is provided, wherein the suppression layer 11 has a higher initial shrinkage temperature than the ceramic layer 122. In the sintering process, a sintering temperature which does not cause the suppression layer 11 to be sintered is selected, so that the shrinkage-free suppression layer 11 suppresses the shrinkage of the ceramic layer 122, so that the difference in the shrinkage amount between the ceramic layer 122 and the conductor electrode layer 121 can be reduced. .

However, there are still many problems in the above two methods. In terms of rapid temperature rise, since the shrinkage rate of the ceramic layer 122 is usually much larger than that of the conductor electrode layer 121, in order to reduce the difference in shrinkage between the two, a ceramic powder is added to the conductor electrode layer 121 to improve the conductor. The shrinkage rate of the electrode layer 121. However, this will result in an increase in the thickness of the conductor electrode layer 121. Under the requirements of light and short components, the number of layers of the conductor electrode layer 121 is limited by the increase in thickness, so that the laminated ceramic component cannot have high electrical properties. In view of suppressing the sintering shrinkage by the suppression layer 11, since the suppression layer 11 is provided on the upper and lower surfaces of the laminated ceramic element, the ceramic layer 122 closer to the suppression layer 11 and the ceramic layer 122 farther from the suppression layer 11 are suppressed. The obvious difference in strength leads to the unevenness of the internal stress of the laminated ceramic component, which makes the internal grain size difference greatly, which will make the electrical properties of the ceramic layer 122 severely uneven, so even the same batch of fabricated ceramic components Due to the difference in grain size, the electrical properties are also significantly different, and the yield of the product is significantly reduced.

In view of the shortcomings in the prior art, the applicant of this case, after careful experimentation and research, and a perseverance spirit, finally conceived the case "the laminated ceramic component for computer products and its sintering method" to inhibit the sintering shrinkage by combining the inhibitory layer. And a method of rapidly heating and sintering characteristics, selecting a material having a shrinkage ratio smaller than that of the ceramic layer as a suppression layer, and heating the temperature to a temperature at which both the ceramic layer and the suppression layer are sintered by rapid temperature rise. Since both the ceramic layer and the suppression layer are sintered, the effect of suppression is small compared to the sintering of only the ceramic layer. However, due to the rapid temperature rise, not only the insufficient suppression ability but also the shrinkage time of the ceramic layer and the suppression layer can be compensated for. The sharp drop in the amount of energy can reduce the problem of excessive electrical stress caused by excessive internal stress.

In order to improve the yield of the laminated ceramic component for a computer product, the present invention transmits a suppressing layer having a shrinkage ratio smaller than that of the ceramic layer on the green body of the unsintered laminated ceramic component, and heats it up to a rapid heating rate. A sintering temperature is performed to perform a sintering process.

The object of the present invention is to improve the size of the ceramic grain in the laminated ceramic component by controlling the size of the ceramic grain in the laminated ceramic component under the basic concept of improving the yield of the laminated ceramic component for the computer product. The difference in electrical values between ceramic elements is minimized to narrow the electrical distribution.

In order to achieve the above object, the present invention provides a method of fabricating a computer product, the method comprising the steps of: forming a suppression layer on a green body; and combining the green body and the suppression layer with a temperature higher than 10 ° C per minute. The rate of temperature rise is raised to a sintering temperature to form a laminated ceramic component.

According to the above concept, the computer product includes a desktop computer, a notebook computer, a Macintosh computer, a tablet computer, a barebones computer, a palmtop computer or a small notebook.

According to the above concept, the heating rate is higher than 50 ° C per minute.

According to the above concept, the green body and the suppression layer respectively have a first shrinkage amount and a second shrinkage amount at the sintering temperature, and the first shrinkage amount is greater than the second shrinkage amount, so that the green body and the suppression The layer inhibits shrinkage of the green body at the sintering temperature.

According to the above concept, the green body is formed by alternately stacking a plurality of ceramic green bodies and a plurality of electrode green bodies.

According to the above concept, the suppression layer is formed on a first surface and a second surface of the green body, and the first surface and the second surface are opposite.

According to the above concept, the first surface and the second surface are parallel to the ceramic green bodies and the electrode green bodies.

According to the above concept, the ceramic green bodies are sintered to produce a plurality of crystal grains, and the crystal grains have a particle size distribution, and the particle size distribution substantially approaches a single distribution.

According to the above concept, the green body has a side surface perpendicular to the ceramic green bodies, and the temperature is raised to the sintering temperature by the temperature increase rate, so that the side surface remains perpendicular to the ceramic green bodies after being sintered.

According to the above concept, the method further comprises the step of placing the electronic component in the computer product.

In order to achieve the above object, the present invention further provides a computer product comprising: a laminated ceramic component formed by sintering a green body, and the laminated ceramic component further comprises: a plurality of ceramic layers having a plurality of crystal grains, and the crystal grains A particle size distribution substantially approaches a single distribution; and a plurality of electrode layers alternately stacked with the ceramic layers to form an element.

According to the above concept, the laminated ceramic component further includes: a suppression layer formed on the component in parallel with the ceramic layers. Wherein a first initial sintering temperature of the ceramic layers is lower than a second initial sintering temperature of the suppression layer, and the green body is heated to a sintering temperature at a temperature increase rate higher than 10 ° C for sintering

According to the above concept, the ceramic layers and the suppression layer respectively have a first shrinkage amount and a second shrinkage amount at the sintering temperature, and the first shrinkage amount is greater than the second shrinkage amount, so that the ceramic layers and The suppression layer inhibits shrinkage of the ceramic layers at the sintering temperature.

The "layered ceramic component for computer products and its sintering method" proposed in the present application will be fully understood by the following examples, so that those skilled in the art can complete it. However, the implementation of the present invention may not be implemented by the following For example, those skilled in the art can devise other embodiments in light of the spirit of the embodiments disclosed herein, and such embodiments are within the scope of the invention.

Please refer to the second figure for a schematic diagram showing the shrinkage at various temperatures between the various materials of the present invention. As is apparent from the figure, the electrode layer 221 starts to shrink at a lower temperature, and the ceramic layer 222 is second, and the temperature at which the suppression layer 21 starts to shrink is relatively highest. Further, since the electrode layer 221 is mostly a metal powder, it has a low shrinkage ratio with respect to the ceramic powder of the ceramic layer 222 and the suppression layer 21.

Further, the shrinkage rate of the suppression layer 21 is smaller than the shrinkage ratio of the ceramic layer 222 at different temperatures. Therefore, when the ceramic layer 222 starts to be sintered for shrinkage, the suppression layer 21 has a relatively low shrinkage ratio, suppresses shrinkage of the ceramic layer 222, and further suppresses shrinkage of the ceramic layer 222 and grain growth thereof. Since the shrinkage rate of the ceramic layer 222 is suppressed by the suppression layer 21, the difference in shrinkage ratio between the electrode layer 221 and the ceramic layer 222 is remarkably lowered, and the electrode layer 221 itself can have a high electrode continuity.

In the second figure, there are two straight lines representing different heating rates. The heating rate of 200 ° C per hour (about 3.3 ° C per minute) is expressed by the normal heating line 24, and the heating rate of 3000 ° C per hour (about 50 per minute) °C) is represented by a rapid temperature rise line 25. By the effect of rapid temperature rise, the shrinkage time of the ceramic layer 222 and the suppression layer 21 can be reduced from about 18 minutes to about 2 minutes. Therefore, if the ceramic layer 222 has a separate shrinkage time of up to about 18 minutes with respect to the suppression layer 21 under the condition of the normal temperature rise line 24, the ceramic layer 222 may have severe internal stress under long-term individual shrinkage. The problem of unevenness. Please refer to the third figure (a), which is a schematic view of the appearance of the laminated ceramic component with the suppression layer after sintering at a normal heating rate. The element layer 32 composed of the ceramic layer and the electrode layer, and the outer layer 323 which is in contact with the suppression layer 31, under the condition of the normal temperature rising line 24, is greatly reduced in shrinkage due to the effect of the stress in the suppression layer 31. . However, in the portion of the inner layer 324 at the center of the element layer 32, since it is far from the suppression layer 31, it is relatively less affected by the stress in the suppression layer 31, so that the effect of reducing the shrinkage rate is remarkably inferior. Therefore, due to the significant difference in shrinkage ratio between the inner layer 324 and the outer layer 323, and the individual shrinkage of the element layer 32 compared to the suppression layer 31 for a long time, the first side surface 325 of the element layer 32 is concave. It fully demonstrates the phenomenon of uneven shrinkage and internal stress between the inner and outer layers.

Please refer to the second figure and the third figure (b) in combination, wherein the third figure (b) is a schematic view of the appearance of the laminated ceramic component after sintering at a rapid heating rate. If the temperature increase rate is increased to the rapid temperature rise line 25, since the difference in time between the start of shrinkage of the ceramic layer 222 and the suppression layer 21 is greatly shortened from 18 minutes to 2 minutes, the time for the ceramic layer 222 to individually shrink is greatly shortened, so the inner layer 324 and the outer layer are shortened. The difference in shrinkage between the 323 is greatly reduced, so that the second side surface 326 of the element layer 32 remains in a state perpendicular to the surface of the suppression layer, exhibiting a relatively uniform shrinkage phenomenon.

General laminated ceramic components are mainly used in capacitors, inductors, and resistors. In this case, the capacitor will be taken as an example to illustrate the technical content of the case, but its application range is not limited to the use of capacitors. The capacitance of a typical capacitor is related to the dielectric constant of the material, the thickness of the dielectric layer, and the area of the electrode. Through the suppression of sintering shrinkage and rapid temperature rise in the present case, the electrode layer can have a high degree of electrode continuity, that is, the electrode layer will almost remain the same as the electrode area when unsintered, so that the electrode area is almost constant, The resulting yield impact is relatively low. In addition, due to the high continuity of the electrode, that is, the ceramic layer itself does not intrude into the electrode layer, and the connection between the electrode and the electrode is interrupted, the thickness of the ceramic layer is not abnormally thickened by the contraction of the electrode, and thus the thickness of the dielectric layer It will not cause a significant impact on yield. Therefore, the control of the dielectric constant will be an urgent problem to be overcome after the continuity of the electrode is maintained.

Please refer to the fourth figure, which is a graph showing the relationship between the grain size and dielectric constant of BaTiO _{3 which} is commonly used in multilayer ceramic capacitors. From the fourth figure, it can be found that when the grain size is above 10 μm, the dielectric constant remains constant and does not change due to grain size. When the grain size is less than 10 μm, the dielectric constant starts to vary with the change in grain size. However, nowadays, in order to reduce the number of crystal grains in the ceramic layer, the grain size can be reduced in addition to reducing the number of crystal grains in the ceramic layer, so how to control the range of grain size distribution under the condition of reducing the grain size to avoid The dielectric constant distribution of the component is too large, resulting in a decrease in the yield of the product.

In the present invention, since the suppressing layer suppresses the shrinkage effect, in addition to suppressing the shrinkage of the ceramic layer during the sintering shrinkage, the powder of the suppressing layer provides internal stress due to the action of the green compact by the thermocompression bonding. The grain boundary diffusion phenomenon of the ceramic layer powder on the surface of the suppression layer is suppressed, so that the ceramic layer powder is less likely to grow crystal grains. However, as seen from the third diagram (a), it is apparent from the appearance of the element layer 32 that the influence of the internal stress between the inner layer 324 and the outer layer 323 is extremely large, and the concave first side surface 325 is produced. From this, it can be seen that the suppression layer 31 also has a significant difference in the effect of suppressing grain growth between the inner layer 324 and the outer layer 323. Since the grains on the same layer are subjected to similar internal stress effects, the grain growth is suppressed by the same effect, so that the grain size distribution of the grains inside the same layer substantially approaches a single distribution (monodisperse), that is, It has a narrow crystal grain distribution, however, at a normal heating rate, the inner layer 324 and the outer layer 323 are different in that the grain growth is suppressed, so that the inner layer 324 has a larger crystal grain than the outer layer 323, so that the element layer The overall grain size distribution of 32 grains is relatively wide.

As seen from the third figure (b), it is apparent from the appearance of the element layer 32 that the internal stress difference between the inner layer 324 and the outer layer 323 is extremely small, so that the internal stress having the effect of suppressing grain growth is similar between the two. Therefore, the difference in grain size between the inner layer 324 and the outer layer 323 is extremely small, so that the particle size distribution of the entire crystal grain of the element layer 32 is still substantially maintained in a nearly monolithic state, while maintaining the monolithic element layer 32 with narrow crystal grains. distributed. As a result, the difference in dielectric constant between the device and the device is minimized, the electrical distribution of the multilayer ceramic capacitor is narrowed, and the yield can be greatly improved.

Please refer to the fifth figure, which is a schematic view of a green body 5 for making a laminated ceramic component according to the present invention. The green body 5 has a plurality of ceramic green bodies 522, a plurality of electrode green bodies 521, and a suppression layer green body 51. The plurality of ceramic green bodies 522 and the plurality of electrode green bodies 521 are alternately stacked to form an element green body 52, and the element green body 52 has an upper surface 527 and a lower surface 528, wherein the upper surface 527 and the lower surface 528 are combined with the ceramic green body 522 and the electrode green body 521 are parallel. The suppression layer green body 51 is formed on the upper surface 527 and the lower surface 528 so as to be parallel to the plane of the ceramic green body 522.

The ceramic green body 522, the suppression layer green body 51, and the electrode layer green body 521 are sintered to have a first shrinkage amount, a second shrinkage amount, and a third shrinkage amount, respectively. In the present invention, since the ceramic green body 522, the suppression layer green body 51, and the electrode layer 521 are all contracted by sintering, the second shrinkage amount of the suppression layer green body 51 needs to be smaller than that of the ceramic green body 522. The amount of shrinkage allows the suppression layer green body 51 to achieve the effect of suppressing the shrinkage of the ceramic green body 522. Further, the initial sintering temperature of the ceramic green body 522 is also lower than the initial sintering temperature of the green layer 51 of the suppression layer.

Please refer to the sixth drawing, which is a flow chart of the fabrication of the laminated ceramic component of the present invention, the steps comprising: (S61) alternately stacking a plurality of ceramic green bodies and a plurality of electrode green bodies to form a component green body; (S62) in the component raw A suppression layer green body is formed on the blank; (S63) is heated to a sintering temperature at a temperature increase rate of more than 10 ° C per minute; (S64) a sintering process is performed at the sintering temperature to complete a laminated ceramic component.

Referring to the fifth and sixth figures, in step S61, the plurality of ceramic green bodies 522 have a first shrinkage ratio, and further, the plurality of ceramic green bodies 522 and the plurality of electrode green bodies 521 are stacked to form the component green body 52. The ceramic green body 522 can be used as the outermost layer to be stacked with the subsequent suppression layer green body 51 which is also a ceramic material.

In step S62, the suppression layer green body 51 formed on the element green body 52 has a second shrinkage ratio, and the second shrinkage ratio must be smaller than the first shrinkage ratio. Therefore, when the subsequent step is performed at the sintering temperature, the ceramic green body 522 and the suppression layer green body 51 respectively have a first shrinkage amount and a second shrinkage amount smaller than the first shrinkage amount. Since the second shrinkage amount of the green layer 51 of the suppression layer is small, the shrinkage of the ceramic green body 522 can be suppressed to achieve the effect of suppressing shrinkage and suppressing grain growth. Further, the first initial sintering temperature of the ceramic green body 522 may also be lower than the second initial sintering temperature of the suppression layer green body 51.

In step S63, the green body 5 formed by the element green body 52 and the suppression layer green body 51 is heated to a sintering temperature at a temperature increase rate higher than 10 ° C per minute, preferably, the temperature increase rate may be The minutes are above 25 ° C, even above 50 ° C per minute. The sintering temperature is at least higher than the first initial sintering temperature of the ceramic green body. Preferably, the sintering temperature is such that the ceramic green body 522 in the component green body 52 can be sintered, and even the sintering temperature can be made. Each of the layers in the blank 5 is sintered.

In step S64, the green body 5 is subjected to a sintering process at the sintering temperature to obtain the laminated ceramic component of the present invention.

Please refer to the seventh figure, which is a schematic view of the laminated ceramic component 7 of the present invention. The laminated ceramic component 7 has a plurality of ceramic layers 722, a plurality of electrode layers 721, and a suppression layer 71. The plurality of ceramic layers 722 are alternately stacked with the plurality of electrode layers 721 to form an element layer 72. The suppression layer 71 is formed over the element layer 72 in a manner parallel to the surface of the ceramic layer 722, and the element layer 72 further has a side surface 726. Further, since the suppression layer 71 serves to suppress shrinkage of the plurality of ceramic layers 722 during sintering, it does not belong to the element layer 72 of the laminated ceramic element 7, and therefore, after the sintering of the laminated ceramic element 7, the suppression layer 71 can be removed.

In the foregoing embodiment, prior to the formation of the laminated ceramic component 7, it is formed by sintering a green body 5 by the process of the present invention. Therefore, the first start sintering temperature of the ceramic layer 722 may be lower than the second start sintering temperature of the suppression layer 71. In addition, the ceramic layer 722 and the suppression layer 71 have a first shrinkage amount and a second shrinkage amount, respectively, at a sintering temperature in the sintering process. Since the effect of suppressing shrinkage in the present case is achieved, the second contraction amount is required to be lower than the first contraction amount, so that the suppression layer 71 suppresses shrinkage of the ceramic layer 722. At the sintering temperature, at least the ceramic layer 722 must be sintered. Preferably, the sintering temperature causes the ceramic layer 722 and the suppression layer 71 to complete sintering.

In the foregoing embodiment, since the effect of suppressing the shrinkage of the ceramic layer 722 by the suppressing layer 71, coupled with the effect caused by the rapid heating rate, the ceramic layer 722 does not have an uneven internal stress. Therefore, the side surface 726 of the element layer 72 can be perpendicular to the plane of the ceramic layer 722 and the electrode layer 721 after being rapidly heated to the sintering temperature, without a concave phenomenon.

In the foregoing embodiment, the ceramic layer 722 is formed of a ceramic powder during the unsintered green body, and a plurality of ceramic grains are formed after sintering. Among these ceramic crystal grains, the crystal grain growth is also suppressed by the internal stress in the ceramic layer 722 due to the effect of suppressing the shrinkage of the layer 71. Since the internal stress of the grains on the same plane is equivalent, the grain growth of the same plane is suppressed by the same effect, so that the grain size distribution of the grains in the same plane is substantially closer to a single distribution. . In addition, since the side surface 726 of the element layer 72 is not concave, the central portion of the element layer 72 and the outer layer portion are not significantly different from the internal stress, so the particle size distribution of the central portion and the outer portion should be To be substantially similar. Therefore, the particle size distribution of the ceramic layer 722 of the laminated ceramic component 7 of the present invention substantially approaches a single distribution. Therefore, in the present invention, the electrical distribution between the different laminated ceramic elements is narrowed due to the narrow grain size distribution, and the electrical distribution is narrowed, and the yield can be improved.

When the laminated ceramic component of the present invention is used as a capacitor, the electrode layer, the ceramic layer and the suppression layer material may be nickel, BaTiO ₃ (abbreviated as BT) and (Ba,Ca)(Ti,Zr)O _{3 , respectively.} (referred to as BCTZ). However, the present invention is not limited to the foregoing materials, and as long as it satisfies the spirit of the scope of the patent application, the modifications and modifications are not intended to be protected by the scope of the patent application.

The laminated ceramic component for a computer product and the method for sintering the same according to the present invention can be applied to a passive component such as a capacitor, an inductor or a resistor. Since the passive component has a wide application range, the laminated ceramic component for the computer product of the present invention and the sintering manufacturing method thereof can be applied to a desktop computer, a notebook computer, a Macintosh computer, a tablet computer, a barebone computer, Palm-sized computers, small notebooks, and other computer products

Please refer to the eighth drawing, which is a schematic diagram of a computer product 8 having a laminated ceramic component of the present invention. The computer product 8 has at least one circuit board 81, and the circuit board 81 has at least one laminated ceramic element 82. The laminated ceramic component 82 can be a passive component such as a capacitor, an inductor or a resistor. Further, the positions of the laminated ceramic elements 82 and the circuit board 81 on the drawing are merely for illustration, and are not limited to the positions set on the drawing. That is, the laminated ceramic component 82 and the circuit board 81 can be placed anywhere on the computer product 8.

The embodiments described above are merely illustrative for convenience of description and are not intended to limit the invention. Therefore, those skilled in the art can make modifications and changes to the above embodiments without departing from the spirit and scope of the invention.

1, 7, 82‧‧‧ laminated ceramic components

121‧‧‧Conductor electrode layer

11, 21, 31, 71‧‧‧ suppression layer

12, 32, 72‧‧‧ component layer

122, 222, 722‧‧‧ ceramic layers

13‧‧‧ electrode end

221, 721‧‧‧ electrode layer

24‧‧‧Normal heating line

25‧‧‧Rapid heating line

323‧‧‧ outer layer

324‧‧‧ inner layer

325‧‧‧ first side surface

326‧‧‧ second side surface

5‧‧‧Green

51‧‧‧Suppression layer green body

52‧‧‧Component blank

521‧‧‧electrode blank

522‧‧‧Ceramic green body

527‧‧‧ upper surface

528‧‧‧ lower surface

S61-S64‧‧‧Steps

726‧‧‧ side surface

8‧‧‧Computer products

81‧‧‧Circuit board

The first figure (a) is a schematic view of the structure of a common laminated ceramic component;

The first figure (b) is a schematic structural view of a laminated ceramic element having a suppression layer that does not shrink;

The second figure is a graph of the shrinkage of different materials in a laminated ceramic component at different temperatures;

The third figure (a) is a schematic view showing the appearance of the laminated ceramic component having the suppression layer after sintering at a normal heating rate;

The third figure (b) is a schematic view showing the appearance of the laminated ceramic component having the suppression layer after sintering at a rapid heating rate;

The fourth figure is a graph showing the relationship between the grain size and the dielectric constant of BaTiO _{3 which} is commonly used in a multilayer ceramic capacitor; the fifth figure is a schematic view of the green body of the laminated ceramic component of the present invention; and the sixth figure is the fabrication of the laminated ceramic component of the present invention. 7 is a schematic view of a laminated ceramic component of the present invention; and FIG. 8 is a schematic view of a computer product having a laminated ceramic component of the present invention.

7. . . Laminated ceramic component

71. . . Suppression layer

72. . . Component layer

721. . . Electrode layer

722. . . Ceramic layer

726. . . Side surface

Claims (10)

A computer product comprising: a laminated ceramic component formed by sintering a green body, and the laminated ceramic component further comprises: a plurality of ceramic layers having a plurality of crystal grains, and a particle size distribution of the crystal grains substantially approaches a single distribution; a plurality of electrode layers alternately stacked with the ceramic layers to form an element; and a suppression layer formed on the laminated ceramic element in parallel with the ceramic layers. The computer products mentioned in the second application of the patent scope include a desktop computer, a notebook computer, a Macintosh computer, a tablet computer, a barebones computer, a palmtop computer or a small notebook. The computer product of claim 1, wherein a first initial sintering temperature of the ceramic layers is lower than a second initial sintering temperature of the suppression layer, and the green body is at a temperature higher than 10 ° C. The rate of temperature rise is raised to a sintering temperature for sintering. The computer product of claim 3, wherein the ceramic layer and the suppression layer respectively have a first shrinkage amount and a second shrinkage amount at the sintering temperature, and the first shrinkage amount is greater than the second The amount of shrinkage is such that the ceramic layer and the suppression layer inhibit the shrinkage of the ceramic layers at the sintering temperature. The computer product of claim 3, wherein the heating rate is higher than 50 ° C per minute. The computer product according to claim 3, wherein the green body has a side surface perpendicular to the ceramic layers, and the sintering temperature is raised by the heating rate, so that the side surface is maintained after being sintered. Wait for the ceramic layer to be vertical. A method for fabricating a computer product, the method comprising: forming a suppression layer on a green body; and heating the green body and the suppression layer together to a sintering temperature at a temperature increase rate higher than 10 ° C per minute to form A laminated ceramic component. The method of claim 7, wherein the green body and the suppression layer respectively have a first shrinkage amount and a second shrinkage amount at the sintering temperature, and the first shrinkage amount is greater than the second shrinkage amount The green layer and the suppression layer inhibit the shrinkage of the green body at the sintering temperature. The method of claim 7, wherein the green body is formed by alternately stacking a plurality of ceramic green bodies and a plurality of electrode green bodies, and the suppression layer is formed on a first surface of the green body and a second a surface, and the first surface and the second surface are parallel to the ceramic green bodies and the electrode green bodies. The method of claim 7, wherein the step further comprises: disposing the electronic component in the computer product.