TW202121384A - Display module - Google Patents

Abstract

A display module is provided. The display module includes a wiring substrate, a carrier, a plurality of light-emitting elements and a driving chip. The wiring substrate has an opening. The light-emitting elements are disposed on the carrier. The driving chip is electrically connected to the light-emitting elements. When the wiring substrate is coupled face-to-face to the carrier, the driving chip is arranged in the opening.

Description

Display module

The present invention relates to a display module, and more particularly to a display module that uses a driving chip to drive a light-emitting element.

With the advancement of technology, consumers are increasingly demanding displays. For household displays, and even some large commercial displays, it is hoped that the resolution can be improved. For some large-scale signage displays, most of them are made by splicing multiple display modules. Under the condition that the display is expected to have a good resolution, how to arrange the components and how to design the layout of the control circuit is very important. Based on this, the industry expects to devote itself to proposing a new display module without increasing the size of the device.

The present invention relates to a display module, which can improve the aforementioned problems.

According to one aspect of the present invention, a display module is provided. The display module includes a circuit substrate, a carrier board, a number of light-emitting elements, and a driving chip. The circuit substrate has an opening. Several light-emitting elements are arranged on the carrier board. The driving chip is electrically connected to these light-emitting elements. When the circuit substrate and the carrier are coupled face to face, the driving chip is disposed in the opening.

In order to have a better understanding of the above and other aspects of the present invention, the following specific examples are given in conjunction with the accompanying drawings to describe in detail as follows:

Several embodiments of the present invention will be disclosed in the following drawings. For clear description, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit the present invention. That is to say, in some embodiments of the present invention, these practical details are unnecessary. In addition, in order to simplify the drawings, some conventionally used structures and elements are shown in the drawings in a simple and schematic manner. Also, in the drawings, the thickness of layers, films, panels, regions, etc., are exaggerated for clarity. The drawing of these drawings is to clearly express the connection relationship between the elements in these embodiments, rather than to show the actual size of the elements or their proportional relationship.

Hereinafter, an exemplary embodiment will be described with reference to a cross-sectional view as a schematic diagram of an idealized embodiment. Therefore, it is possible to foresee graphical changes as a result of, for example, manufacturing technology and/or tolerances. The embodiments described herein should not be limited to the specific shape of the area as shown, but include deviations caused by manufacturing, for example. For example, the flat areas shown in the drawings may generally have rough and/or non-linear characteristics. Therefore, the area shown in the figure is schematic in nature, and its shape is not intended to imply its precise shape, nor is it intended to limit the present invention.

FIG. 1 is a schematic diagram of the display device 10 according to an embodiment of the present invention shown in the above view. FIG. 2 is a schematic cross-sectional view of the display module 100 taken along the line 2-2' in FIG. 1. FIG.

Please refer to Figure 1. In order to clearly show the features of the display device 10, drawing of some components is omitted. However, it should be understood that this is not intended as a limitation of the present invention.

In Figure 1, the display device 10 shown can be used for a large-scale signage display, which can be formed by aligning a plurality of display modules 100 with the alignment line ML to realize a large-size display. Among them, these display modules 100 share a circuit substrate 110. In addition, the figure shows that a circuit substrate 110 can control 3×3 display modules 100 for splicing, but this is only an example, and the number and arrangement are not intended to limit the present invention. For example, in another embodiment, the circuit substrate 110 can control a total of 12×6 display modules 100 for splicing.

Please refer to FIG. 2, which further illustrates the details of the display module 100. The display module 100 includes a circuit substrate 110, a carrier 120, a plurality of light-emitting elements 130 and a driving chip 140. The carrier 120 may be disposed on the circuit substrate 110 through a bonding layer 160, the bonding layer 160 is, for example, UV glue.

The light emitting element 130 is disposed on the carrier board 120. In some embodiments, the light-emitting element 130 may be a light-emitting diode, such as an organic light-emitting diode, a miniature light-emitting diode, a sub-millimeter light-emitting diode, or a quantum dot light-emitting diode. In an embodiment, the carrier 120 can carry at least 5 orders of magnitude or more of the light-emitting elements 130. Therefore, the light-emitting elements 130 may be miniature light-emitting diodes to enable the display device to have a higher resolution. However, the present invention does not This is limited.

The driving chip 140 is electrically connected to the light-emitting elements 130 for controlling and driving the light-emitting elements 130. Among them, a single driver chip 140 can control the light-emitting elements 130 on the carrier 120 of the same display module 100.

Please refer to Figures 1 and 2, the circuit substrate 110 may have openings 111, the openings 111 can penetrate through the first surface 110S1 and the second surface 110S2 of the circuit substrate 110, and the number and position of the openings correspond to the configuration of the display module 100 . When the circuit substrate 110 is coupled to the carrier 120 of one of the display modules 100 face-to-face (which may include a physical connection and/or an electrical connection), the driving chip 140 is disposed in the corresponding opening 111. Therefore, the opening 111 can provide an extra space for accommodating the driver chip 140 to fully utilize the existing space of the display module 100 as a whole.

Please refer to Figure 2, for example, the carrier 120 may include opposite first side 120S1 and second side 120S2, the light emitting element 130 is disposed on the first side 120S1 of the carrier 120, and the driving chip 140 is disposed on the first side 120S1 of the carrier 120. The second side 120S2. The first surface 110S1 of the circuit substrate 110 can be used as a carrying surface, and the carrying surface can face the second side 120S2 of the carrier board 120 and be coupled to the carrier board 120 face to face. At this time, the carrier board 120 is supported by the carrier surface, and the driving chip 140 is received in the opening 111 of the circuit substrate 110.

The carrier 120 may include a substrate 121 and a wiring structure 122. The wiring structure 122 is disposed on the substrate 121 and may include a first wiring layer 122a. The driving chip 140 can be electrically connected to the light emitting element 130 via the first wiring layer 122a. For example, the first wiring layer 122a can be distributed on any surface (such as upper, lower or side surfaces) of the substrate 121, or on the sidewall surface of the through hole passing through the substrate 121, so as to be disposed on the other side of the carrier 120 The driver chip 140 can be electrically connected to the light-emitting element 130 via the first wiring layer 122a.

FIG. 2 does not show the distribution of the first wiring layer 122a in detail, but it can be seen from the figure that part of the first wiring layer 122a is exposed from the second side 120S2 of the carrier 120 to be electrically connected to the driver chip 140. Here, the driver chip 140 can be coupled to the first wiring layer 122a through a conductive film layer 152. In one embodiment, the conductive film layer 152 may be an anisotropic conductive film (ACF) to be electrically connected to the corresponding first wiring layer 122a in the vertical direction, so as to transmit the control signal to the corresponding The light-emitting element 130.

In an embodiment, the circuit substrate 110 may be a printed circuit board, including but not limited to a single-sided, double-sided, or multilayer printed circuit board. In other embodiments, the circuit substrate 110 may also be made of glass.

Please refer to FIG. 1 and FIG. 2, the driving chip 140 is a passive chip. Therefore, the display device 10 may include a control chip 150, which is an active chip, so as to output control signals to the driving chip 140. The circuit substrate 110 may include a circuit structure 112, and the control chip 150 can establish a connection with each display module 100 through the circuit structure 112, and communicate with the driver chip 140 via the wiring structure 122 on the carrier 120, so that the driver chip 140 can control And drive the light-emitting element 130.

In detail, the wiring structure 122 of the carrier 120 may further include a second wiring layer 122b. The second wiring layer 122b is distributed on the second side 120S2 of the carrier board 120, and is electrically connected to the driving chip 140. Here, the driver chip 140 can be coupled to the second wiring layer 122b via the conductive film layer 152.

The second wiring layer 122b may include a first contact P1, which is exposed from the second side 120S2 of the carrier board 120; correspondingly, the circuit structure 112 may include a second contact P2, and the second contact P2 is from the circuit The first surface 110S1 (ie, the carrying surface) of the substrate 110 is exposed. The second contact P2 and the first contact P1 are correspondingly arranged and electrically connected to each other, and the first contact P1 and the second contact P2 can be formed in the form of golden fingers.

The second contact P2 can be coupled to the first contact P1 through a conductive film 151. In an embodiment, the conductive film 151 may be an anisotropic conductive film, so that the second contact P2 can be electrically connected to the corresponding first contact P1 in the vertical direction, so as to transfer the control output from the control chip 150 Signal. Therefore, the control chip 150 can be electrically connected to the driver chip 140 via the circuit structure 112 and the second wiring layer 122b.

If the light-emitting element 130 is a miniature light-emitting diode (micro LED or mini LED), since the size of the miniature light-emitting diode is very small, and the LED unit pitch may be less than 0.01mm, a carrier 120 can even carry at least 5 Therefore, the number of the first wiring layer 122a distributed on the substrate 121 is also very considerable, and the size is also very small. In this case, the substrate 121 can be made of glass. In this way, the first wiring layer 122a can be fabricated on the substrate 121 with a fine process (such as mass transfer) level to provide the driver chip 140 to control and drive these lights. Multiple paths of element 130.

On the other hand, compared to the first wiring layer 122a, the number of lines required by the second wiring layer 122b is far less than that of the first wiring layer 122a. For example, the number of the first contact point P1 and the second contact point P2 only needs to be within about 2 orders of magnitude, so that the command of the control chip 150 can be transmitted to the driving chip 140. In another embodiment, the line density per unit area of the first wiring layer 122a may be at least two orders of magnitude greater than that of the second wiring layer 122b. For example, the line density per unit area of the first wiring layer 122a is 4 orders of magnitude more than the line density per unit area of the second wiring layer 122b.

Of course, in other embodiments, the light-emitting element 130 may also be other types of light-emitting diodes, such as sub-millimeter light-emitting diodes. In this case, the carrier 120 may be a printed circuit board.

In summary, according to the above embodiments, each display module shares a circuit substrate, and each display module includes its own driving chip. By arranging the driving chip in the opening of the circuit substrate, the existing space of the entire display module can be fully utilized. Furthermore, in some embodiments, it is only necessary to fabricate the circuit at the carrier end with a finer process level to enable the display device to have a high resolution.

Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Those with ordinary knowledge in the technical field to which the present invention belongs can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention shall be subject to those defined by the attached patent application scope.

10: Display device 100: display module 110: circuit board 110S1: The first side of the circuit board 110S2: The second side of the circuit board 111: Hole 112: Line structure 120: carrier board 120S1: The first side of the carrier board 120S2: The second side of the carrier board 121: Base 122: Wiring structure 122a: first wiring layer 122b: second wiring layer 130: light-emitting element 140: driver chip 150: control chip 151: conductive film 152: conductive film layer 160: Bonding layer P1: The first contact P2: second contact ML: Counterpoint

FIG. 1 is a schematic diagram of the display device manufactured according to an embodiment of the present invention in the above view. Figure 2 is a schematic cross-sectional view of the display module taken along line 2-2' in Figure 1.

100: display module

110: circuit board

110S1: The first side of the circuit board

110S2: The second side of the circuit board

111: Hole

112: Line structure

120: carrier board

120S1: The first side of the carrier board

120S2: The second side of the carrier board

121: Base

122: Wiring structure

122a: first wiring layer

122b: second wiring layer

130: light-emitting element

140: driver chip

150: control chip

151: conductive film

152: conductive film layer

160: Bonding layer

P1: The first contact

P2: second contact

Claims (10)

A display module includes: A circuit substrate with an opening; A carrier board A plurality of light-emitting elements are arranged on the carrier board; and A driving chip is electrically connected to the light-emitting elements. When the circuit substrate and the carrier are coupled face-to-face, the driving chip is disposed in the opening. As for the display module described in claim 1, wherein the carrier includes a first side and a second side opposite to each other, the light-emitting elements are arranged on the first side, and the driving chip is arranged on the first side. Two sides. According to the display module described in item 2 of the scope of patent application, the circuit substrate includes a bearing surface, the bearing surface faces the second side of the carrier board, and the carrier board is supported by the bearing surface. For the display module described in item 3 of the scope of patent application, the carrier board includes: A base; and A wiring structure is disposed on the substrate, the wiring structure includes a first wiring layer, and a part of the first wiring layer is exposed from the second side of the carrier, wherein the drive chip passes through the first wiring layer It is electrically connected with the light-emitting elements. The display module as described in item 4 of the scope of patent application, in which: The wiring structure further includes a second wiring layer electrically connected to the driver chip, and the second wiring layer includes a first contact; and The circuit substrate includes a circuit structure, the circuit structure includes a second contact, the second contact and the first contact are correspondingly arranged and electrically connected to each other; Wherein, a control chip is electrically connected to the driving chip through the circuit structure and the second wiring layer. In the display module described in item 4 of the scope of patent application, the material of the substrate is glass, and the carrier can carry at least 5 orders of magnitude or more light-emitting elements. In the display module described in item 5 of the scope of patent application, the first contact is exposed from the second side of the carrier board, and the second contact is exposed from the carrying surface of the circuit substrate. In the display module described in item 5 of the scope of patent application, the circuit substrate is a printed circuit board. For the display module described in item 5 of the scope of patent application, the circuit density per unit area of the first wiring layer is at least 2 orders of magnitude more than that of the second wiring layer. The display module described in item 5 of the scope of patent application includes: A conductive film is arranged between the first contact and the second contact.

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