TW202119670A - Heat dissipating flexible substrate and its production method and oled with heat dissipating flexible substrate and organic solar cell with heat dissipating flexible substrate - Google Patents

Abstract

The present invention discloses heat dissipating flexible substrates and their production methods together with OLEDs and Organic Photovoltaics (OPVs) comprising such heat dissipating flexible substrates. One heat dissipating flexible substrate includes a first plate, a nano-heat-conducting layer formed by spin coating on a surface of the first plate, and a second plate. Another heat dissipating flexible substrate is a polymer plate doped with plural metal nanoparticles. The production methods being processed relate individually to both mentioned heat dissipating flexible substrates. The OLED or the OPV with the heat dissipating flexible substrate includes a heat dissipating flexible substrate; multi-layers for organic light-emitting or photoelectric conversion; and a passivation layer. With the implementation of the present invention, the heat dissipating flexible substrate helps to significantly increase the lifetime of the OLED or the OPV, reducing considerable cost for the establishment and application thereof.

Description

High heat dissipation flexible substrate and manufacturing method thereof, and organic light emitting diode and organic solar cell with high heat dissipation flexible substrate

The present invention relates to a flexible substrate with high heat dissipation and an organic light-emitting diode or organic solar cell with a flexible substrate with high heat dissipation, in particular to a high heat dissipation with a nano thermal conductive layer or doped and dispersed nano metal particles Flexible substrates, and organic light-emitting diodes or organic solar cells with high heat dissipation flexible substrates.

The development of flexible substrates has greatly increased the availability of organic light-emitting diodes (Organic Light-Emitting Diode, OLED) lighting or organic solar cells (Organic Photovoltaics, OPV), no matter in human daily life, industrial production, commercial additional , Or national defense and military have a wide range of applications.

However, due to the continuous operation of OLED devices or OPV devices, considerable heat energy is generated. If the heat dissipation cannot be improved effectively, not only the temperature rise cannot be controlled in the application, but the device life cannot reach the best condition and cannot effectively reduce the use. The cost greatly reduces the willingness to use and the scope of application.

The conventional heat dissipation technology of substrates, organic light-emitting diodes or solar cells may have an eye on this, but most of them are improved structures of the encapsulation layer. Although the heat dissipation capacity may be improved, the overall device cannot be fully improved due to the focus on the encapsulation. The heat dissipation has limited help to increase the service life of the component.

Or use a metal substrate with high heat dissipation capacity to improve the heat dissipation capacity of the substrate, but because the metal substrate is a rigid substrate, it cannot have flexibility. Or, if there are additional heat-conducting elements, due to the design or use of the additional heat-conducting elements, they must be arranged on the substrate in an additional process flow, which leads to an increase in manufacturing costs.

In view of this, if a novel and advanced flexible heat dissipation substrate can be proposed, no additional processing or heat dissipation mechanism is required, that is, the maximum heat dissipation effect can be obtained, which can effectively reduce the temperature of the components and save the manufacturing and use costs; Applied to flexible structures and increasing the service life of organic light-emitting diodes or organic solar cells, it will be an invention design with significant contributions to the development of lighting, display devices, solar devices and other fields, and provide more Choice of sample application.

The invention relates to a flexible substrate with high heat dissipation, a manufacturing method thereof, and an organic light emitting diode and an organic solar cell with a flexible substrate with high heat dissipation. Among them, a high heat dissipation flexible substrate includes a first substrate; a nano thermal conductive layer spin-coated on a surface of the first substrate; and a second substrate bonded to the first substrate. Another type of high heat dissipation flexible substrate is formed by a flexible organic base plate doped and dispersed with a plurality of nano metal particles. The manufacturing methods correspond to the two high heat dissipation flexible substrates respectively. Organic light emitting diodes or organic solar cells with high heat dissipation flexible substrates respectively include high heat dissipation flexible substrates; diode elements or photoelectric conversion elements; and packaging bodies. Through the implementation of the present invention, organic light-emitting diodes or organic solar can be added The service life of the energy battery greatly reduces the use cost of the overall organic light-emitting diode or organic solar battery application.

The present invention provides a high heat dissipation flexible substrate, which includes: a first substrate, which is formed of a flexible organic plate; a nano thermal conductive layer, which is coated on a surface of the first substrate. Rice metal coating; and a second substrate, which is a flexible organic plate corresponding to the first substrate and attached to the first substrate, and the attachment method is such that the nano thermal conductive layer is interposed between the first substrate And the second substrate.

The present invention also provides a flexible substrate with high heat dissipation, which is formed by a flexible organic base plate doped and dispersed with a plurality of nano metal particles.

The present invention also provides a method for manufacturing a flexible substrate with high heat dissipation, which includes the following steps: providing a first substrate (step S10), which provides a first substrate formed by a flexible organic plate; forming a nano thermal conductive layer (Step S20), which is to coat a layer of nano metal solution on one surface of the first substrate to form a nano thermally conductive layer; cover the second substrate (step S30), which is applied to the first substrate coated with a nano thermally conductive layer The surface is covered with a second substrate formed by a flexible organic plate; and a highly heat-dissipating flexible substrate is formed (step S40), which seals the first substrate, the nano thermal conductive layer and the second substrate to form a highly heat-dissipating flexible substrate式substrate.

The present invention also provides a method for manufacturing a flexible substrate with high heat dissipation, which includes the following steps: providing a flexible organic-based plate (step S210); heating the flexible organic-based plate to a molten state (step S220); Rice metal particles (step S230), which is a flexible organic-based plate doped with a plurality of nano metal particles dispersed in a molten state; and a high heat dissipation flexible substrate is formed (step S240), which is solidified, mixed and dispersed with the The flexible organic substrate in the molten state of some nano metal particles forms a highly heat-dissipating flexible substrate.

The present invention further provides an organic light emitting diode with a high heat dissipation flexible substrate, which includes: a high heat dissipation flexible substrate, which includes: a first substrate formed by a flexible organic plate; A nano thermal conductive layer, which is a nano metal coating coated on a surface of the first substrate; and a second substrate, which corresponds to the first substrate and is attached to a flexible type of the first substrate The organic plate is bonded in such a way that the nano thermal conductive layer is interposed between the first substrate and the second substrate; a diode element is fixed on the high heat dissipation flexible substrate, and includes: a first electrode; A second electrode; and a plurality of organic material layers, sandwiched and fixed between the first electrode and the second electrode, and electrically connected to the first electrode and the second electrode, respectively; and a package body, the package covering the diode element and the high Flexible substrate for heat dissipation.

The present invention further provides an organic light emitting diode with a high heat dissipation flexible substrate, which includes: a high heat dissipation flexible substrate, which is doped with a plurality of nanometer metal particles dispersed and a flexible organic substrate Formed; a diode element, fixed on a high heat dissipation flexible substrate, and including: a first electrode; a second electrode; and a plurality of organic material layers, sandwiched and fixed on the first electrode and the second electrode It is in conductive connection with the first electrode and the second electrode respectively; and a package body which packages and covers the diode element and the flexible substrate with high heat dissipation.

The present invention also provides an organic solar cell with a flexible substrate with high heat dissipation, which includes: a flexible substrate with high heat dissipation, including: a first substrate formed by a flexible organic plate; A thermal conductive layer, which is a nano metal coating coated on a surface of the first substrate; and a second substrate, which corresponds to the first substrate and is attached to a flexible organic plate of the first substrate , The bonding method is such that the nano thermal conductive layer is between the first substrate and the second substrate; a photoelectric conversion element is fixed on the high heat dissipation flexible substrate and includes: a first electrode; a second electrical And a plurality of organic material layers, sandwiched and fixed between the first electrode and the second electrode and electrically connected to the first electrode and the second electrode, respectively; and a package body that covers the photoelectric conversion element and has high heat dissipation and flexibility式substrate.

The present invention also provides an organic solar cell with a high heat dissipation flexible substrate, which includes: a high heat dissipation flexible substrate formed by a flexible organic substrate doped with a plurality of nanometer metal particles dispersed; A photoelectric conversion element is fixed on a high heat dissipation flexible substrate, and includes: a first electrode; a second electrode; and a plurality of organic material layers, sandwiched and fixed between the first electrode and the second electrode, and respectively Conductively connect with the first electrode and the second electrode; and a package body for packaging and covering the photoelectric conversion element and the flexible substrate with high heat dissipation.

Through the implementation of the present invention, at least the following improved effects can be achieved: increase the service life of the organic light-emitting diode or organic solar cell, and greatly reduce the overall installation or use cost of the organic light-emitting diode or organic solar cell application.

In order for anyone who is familiar with the relevant art to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the scope of patent application and the drawings, anyone who is familiar with the relevant art can easily understand the purpose and advantages of the present invention. Therefore, the detailed features and advantages of the present invention will be described in detail in the embodiments.

100‧‧‧High heat dissipation flexible substrate

10‧‧‧First substrate

11‧‧‧surface

20‧‧‧Nano Thermal Conductive Layer

30‧‧‧Second substrate

200‧‧‧High heat dissipation flexible substrate

10’‧‧‧Flexible organic substrate

20’‧‧‧Nano Metal Particles

40‧‧‧Electric hole injection material layer

50‧‧‧hole transmission material layer

60‧‧‧Organic luminescent material layer

70‧‧‧Electronic transmission material layer

80‧‧‧Electron injection material layer

90‧‧‧Organic photoelectric conversion material layer

S100‧‧‧High heat dissipation flexible substrate manufacturing method

S10‧‧‧Provide the first substrate

S20‧‧‧Forming a nano thermal conductive layer

S30‧‧‧cover the second substrate

S40‧‧‧Form a flexible substrate with high heat dissipation

S200‧‧‧High heat dissipation flexible substrate manufacturing method

S210‧‧‧Provide flexible organic substrate sheet

S220‧‧‧Heating the flexible organic substrate to a molten state

S230‧‧‧Plant Nano Metal Particles

S240‧‧‧Form a flexible substrate with high heat dissipation

300‧‧‧Organic Light Emitting Diode

310‧‧‧High heat dissipation flexible substrate

320‧‧‧Diode element

321‧‧‧First electrode

322‧‧‧Second electrode

323‧‧‧Organic material layer

330‧‧‧Package

400‧‧‧Organic Light Emitting Diode

410‧‧‧High heat dissipation flexible substrate

420‧‧‧Diode element

421‧‧‧First electrode

422‧‧‧Second electrode

423‧‧‧Organic material layer

430‧‧‧Package body

500‧‧‧Organic Solar Cell

510‧‧‧High heat dissipation flexible substrate

520‧‧‧Photoelectric conversion element

521‧‧‧First electrode

522‧‧‧Second electrode

523‧‧‧Organic material layer

530‧‧‧Package body

600‧‧‧Organic Solar Cell

610‧‧‧High heat dissipation flexible substrate

620‧‧‧Photoelectric conversion element

621‧‧‧First electrode

622‧‧‧Second electrode

623‧‧‧Organic material layer

630‧‧‧Package

FIG. 1 is a three-dimensional exploded view of a flexible substrate with high heat dissipation according to an embodiment of the present invention.

FIG. 2 is a three-dimensional schematic diagram of a flexible substrate with high heat dissipation according to an embodiment of the present invention.

FIG. 3 is a three-dimensional schematic diagram of another flexible substrate with high heat dissipation according to an embodiment of the present invention.

FIG. 4A is a flowchart of a manufacturing method of a high heat dissipation flexible substrate according to an embodiment of the present invention.

FIG. 4B is a flowchart of another method for manufacturing a flexible substrate with high heat dissipation according to an embodiment of the present invention.

FIG. 5A is a three-dimensional exploded schematic diagram of an organic light emitting diode with a flexible substrate with high heat dissipation according to an embodiment of the present invention.

FIG. 5B is a three-dimensional schematic diagram of an organic light-emitting diode with a flexible substrate with high heat dissipation according to an embodiment of the present invention.

FIG. 6A is an exploded perspective view of another organic light-emitting diode with a flexible substrate with high heat dissipation according to an embodiment of the present invention.

FIG. 6B is a three-dimensional schematic diagram of another organic light emitting diode with a flexible substrate with high heat dissipation according to an embodiment of the present invention.

FIG. 7A is a three-dimensional schematic diagram of an organic material layer in the embodiment of FIG. 5A.

FIG. 7B is a three-dimensional schematic diagram of an organic material layer in the embodiment of FIG. 6A.

FIG. 8A is a three-dimensional exploded schematic diagram of an organic solar cell with a high heat dissipation flexible substrate according to an embodiment of the present invention.

FIG. 8B is a three-dimensional schematic diagram of an organic solar cell with a high heat dissipation flexible substrate according to an embodiment of the present invention.

FIG. 9A is a three-dimensional exploded schematic diagram of another organic solar cell with a high heat dissipation flexible substrate according to an embodiment of the present invention.

FIG. 9B is a three-dimensional schematic diagram of another organic solar cell with a high heat dissipation flexible substrate according to an embodiment of the present invention.

FIG. 10A is a three-dimensional schematic diagram of an organic material layer in the embodiment of FIG. 8A.

FIG. 10B is a three-dimensional schematic diagram of an organic material layer in the embodiment of FIG. 9A.

Please refer to FIG. 1 and FIG. 2, which is a high heat dissipation flexible substrate 100 of an embodiment, which includes: a first substrate 10; a nano thermal conductive layer 20; and a second substrate 30.

As shown in Figures 1 and 2, the first substrate 10 of the highly heat-dissipating flexible substrate 100 can be, for example, polyimide (PI), polyethylene terephthalate (PET), Polyethylene phthalate (PEN) or polycarbonate (PC), etc., are formed by heat-resistant and light-transmitting flexible organic plates.

Also as shown in Figures 1 and 2, the nano thermal conductive layer 20 of the highly heat-dissipating flexible substrate 100 is spin-coated with a nano metal solution on one surface 11 of the first substrate 10 Formed.

The thickness of the thermally conductive nano layer 20 can be determined by controlling the speed of spin coating of the nano metal solution and the execution time of spin coating according to application requirements. The nano-metal solution used for spin coating can be selected as a nano-silver solution.

Please refer to Figures 1 and 2, the second substrate 30 of the high heat dissipation flexible substrate 100 is another flexible substrate corresponding to the first substrate 10 and attached to the first substrate 10. Organic board, its bonding method is to make the nano thermal conductive layer 20 Between the first substrate 10 and the second substrate 30. In addition, the second substrate 30 can be bonded to the first substrate 10 by means of adhesive bonding or vacuum sealing.

As for the material of the second substrate 30, it can also be polyimide (PI), polyethylene terephthalate (PET), polyethylene phthalate (PEN) or polycarbonate (PC).

Please refer to FIG. 3, which is another high-heat-dissipation flexible substrate 200 of the embodiment. The high-heat-dissipation flexible substrate 200 can be doped and dispersed by a heat-resistant and light-transmitting flexible organic substrate 10' A plurality of nano metal particles 20' are formed.

The material forming the flexible organic substrate 10' can also be polyimide (PI), polyethylene terephthalate (PET), polyethylene phthalate (PEN) or polycarbonate ( PC). The nano metal particles 20' can be selected as nano silver particles.

As shown in Figures 1 to 3, the high heat dissipation flexible substrate 100 or the high heat dissipation flexible substrate 200 has a light transmittance of at least 85%, a resistivity> 1Ω/cm ² , and due to the The implementation of the thermal conductive layer 20 or the doped and dispersed nano metal particles 20 ′ greatly improves the heat dissipation capability of the high heat dissipation flexible substrate 100 or the high heat dissipation flexible substrate 200.

Next, please refer to FIG. 4A, which is an embodiment of a method S100 for manufacturing a flexible substrate with high heat dissipation, which includes the following steps: providing a first substrate (step S10); forming a nano thermal conductive layer (step S20); Cover the second substrate (step S30); and form a high heat dissipation flexible substrate (step S40).

As shown in FIG. 1 and FIG. 4A, the step of providing a first substrate (step S10) is to provide a first substrate 10 formed of a flexible organic plate, and the flexible organic plate of the first substrate 10 is formed The material is as mentioned above, so I won’t repeat it here.

As shown in Figures 1 and 4A, the step of forming a nano thermally conductive layer (step S20) is to apply a layer of nano metal solution on one surface 11 of the first substrate 10 to form a nano thermally conductive layer 20, wherein The nanometal solution used can be a nanosilver solution with good thermal conductivity.

As shown in Figures 1 and 4A, the step of covering the second substrate (step S30) is to cover the surface 11 of the first substrate 10 coated with the nano thermal conductive layer 20 with a flexible organic plate The second substrate 30 formed. The material of the flexible organic plate forming the second substrate 30 is also the same as described above.

Similarly, as shown in Figures 1 and 4A, the step of forming a highly heat-dissipating flexible substrate (step S40) is to seal the first substrate 10 with glue or sealant, or by vacuuming etc. , The nano thermal conductive layer 20 and the second substrate 30 form a heat-resistant and light-transmitting flexible substrate 100 with high heat dissipation.

Next, as shown in FIG. 4B, another method for manufacturing a high heat dissipation flexible substrate S200 of the embodiment includes the following steps: providing a sheet of flexible organic substrate (step S210); heating the flexible organic substrate The plate of the substrate is in a molten state (step S220); nano-metal particles are planted (step S230); and a flexible substrate with high heat dissipation is formed (step S240).

As shown in Figures 3 and 4B, the step of providing a flexible organic substrate (step S210) is to select a heat-resistant and light-transmitting flexible plate. The material of the plate can also be polyimide ( PI), polyethylene terephthalate (PET), polyethylene phthalate (PEN) or polycarbonate (PC).

As shown in Figures 3 and 4B, the step of heating the plate of the flexible organic substrate to a molten state (step S220) is to heat the plate of the flexible organic substrate 10' to a molten state, so that the plate can easily interact with other materials. Material mixing.

The step of planting nano metal particles (step S230) as shown in FIGS. 3 and 4B is to dope and spread a plurality of metal nano particles 20' on the sheet of the flexible organic substrate 10' in the molten state. . Among them, the doping method of the nano metal particles 20' can be uniformly dispersed, and the weight percentage can also be adjusted and controlled so that the flexible organic substrate 10' plate doped with the nano metal particles 20' can be better. heat radiation. In addition, the nano-metal particles 20' can be selected as nano-silver particles with very good thermal conductivity.

Also as shown in Figures 3 and 4B, the step of forming a highly heat-dissipating flexible substrate (step S240) is to solidify and dope the flexible organic substrate in the molten state with the nano metal particles 20' dispersed in it. 10' plate, and form a flexible substrate 200 with high heat dissipation.

Please refer to FIG. 5A and FIG. 5B, which is an organic light emitting diode 300 with a high heat dissipation flexible substrate according to an embodiment, which includes: a high heat dissipation flexible substrate 310; a diode Component 320; and package 330.

As shown in FIG. 5A, the high heat dissipation flexible substrate 310 includes: a first substrate 10 formed of a flexible organic plate; a nano metal coating coated on a surface 11 of the first substrate 10 is formed after drying The nano thermal conductive layer 20; and the second substrate 30 formed by the flexible organic plate corresponding to the first substrate 10 and attached to the first substrate 10.

The bonding method of the second substrate 30 and the first substrate 10 is such that the nano thermal conductive layer 20 is interposed between the first substrate 10 and the second substrate 30. In addition, the second substrate 30 can be bonded to the first substrate 10 by means of adhesive bonding or vacuum sealing.

As shown in Figure 5A and Figure 5B, the organic light emitting diode 300 The diode element 320 is fixed on a surface of the high heat dissipation flexible substrate 310 and includes: a first electrode 321; a second electrode 322; and sandwiched and fixed to the first electrode 321 and the second electrode 322 A plurality of organic material layers 323 in between and electrically connected to the first electrode 321 and the second electrode 322 respectively.

Also as shown in Figures 5A and 5B, the package body 330 can be made of packaging, gluing, or multilayer film material, or a flexible plate with packaging, gluing, or multilayer film material. , The package covers and protects the diode element 320 of the organic light emitting diode 300 and the high heat dissipation flexible substrate 310.

Please refer to FIG. 6A and FIG. 6B, which is an organic light emitting diode 400 with a high heat dissipation flexible substrate according to an embodiment, which includes: a high heat dissipation flexible substrate 410; Body device 420; and a package body 430.

As shown in FIGS. 6A and 6B, the high heat dissipation flexible substrate 410 is formed by a flexible organic substrate 10' doped and dispersed with a plurality of nano metal particles 20'. The flexible organic substrate 10' The material will not be repeated.

As shown in FIGS. 6A and 6B, the diode element 420 is fixed on a surface of the high heat dissipation flexible substrate 410 and includes: a first electrode 421; a second electrode 422; and clips A plurality of organic material layers 423 fixed between the first electrode 421 and the second electrode 422 and electrically connected to the first electrode 421 and the second electrode 422 are provided.

Also as shown in Fig. 6A and Fig. 6B, the package body 430 can be made of encapsulation, gluing or multilayer film material, or a flexible plate with encapsulation, gluing or multilayer film material. , The package covers and protects the diode element 420 of the organic light emitting diode 400 and the high heat dissipation flexible substrate 410.

As shown in FIGS. 5A to 6B, the light transmittance of the organic light emitting diode 300 or the organic light emitting diode 400 of the high heat dissipation flexible substrate 310 or the high heat dissipation flexible substrate 410 can reach at least 85%, the resistivity is >1Ω/cm ² , and due to the implementation of the nano thermal conductive layer 20 or the doped and dispersed nano metal particles 20', the heat dissipation capacity of the organic light emitting diode 300 or the organic light emitting diode 400 is obtained A substantial improvement.

In the practical application of the embodiment, the organic light-emitting diode of 10000nits light intensity unit is observed and measured, and the calculated lifetime of its LT50 (when the luminous brightness drops to 50%) can be prolonged by about 1.6 times, that is, organic light-emitting diodes The life span of the diode is increased by approximately 60%.

Furthermore, as shown in FIG. 5A to FIG. 6B, FIG. 7A and FIG. 7B, the organic material layer 323 or the organic material layer 423 of the organic light-emitting diode 300 or the organic light-emitting diode 400 may be respectively There are a hole injection material layer 40, a hole transport material layer 50, an organic light emitting material layer 60, an electron transport material layer 70, and an electron injection material layer 80 in sequence.

Next, please refer to FIG. 8A and FIG. 8B, which is an organic solar cell 500 with a high heat dissipation flexible substrate according to an embodiment, which includes: a high heat dissipation flexible substrate 510; and a photoelectric conversion element 520; and a package body 530.

As shown in FIGS. 8A and 8B, the high heat dissipation flexible substrate 510 of the organic solar cell 500 further includes: a first substrate 10 formed by a flexible organic plate; coated on a surface of the first substrate 10 The nano thermal conductive layer 20 formed by drying the nano metal coating of 11; and the second substrate 30 formed by a flexible organic plate corresponding to the first substrate 10 and attached to the first substrate 10.

The method of bonding the first substrate 10 and the second substrate 30 is to The nano thermal conductive layer 20 is interposed between the first substrate 10 and the second substrate 30. In addition, the second substrate 30 can be bonded to the first substrate 10 by means of adhesive bonding or vacuum sealing.

As shown in FIGS. 8A and 8B, the photoelectric conversion element 520 of the organic solar cell 500 is fixed on the high heat dissipation flexible substrate 510, and includes: a first electrode 521; a second electrode 522; A plurality of organic material layers 523 fixed between the first electrode 521 and the second electrode 522 and electrically connected to the first electrode 521 and the second electrode 522 respectively.

Also as shown in FIGS. 8A and 8B, the package body 530 is packaged to cover and protect the photoelectric conversion element 520 and the flexible substrate 510 with high heat dissipation.

As shown in FIGS. 9A and 9B, it is another organic solar cell 600 with a high heat dissipation flexible substrate of the embodiment, which includes: a high heat dissipation flexible substrate 610; a photoelectric conversion element 620; and A package body 630.

As shown in FIGS. 9A and 9B, the high heat dissipation flexible substrate 610 is formed by a flexible organic substrate 10' doped and dispersed with a plurality of nano metal particles 20'.

As shown in FIGS. 9A and 9B, the photoelectric conversion element 620 is fixed on a surface of the high heat dissipation flexible substrate 610, and includes: a first electrode 621; a second electrode 622; A plurality of organic material layers 623 fixed between the first electrode 621 and the second electrode 622 and electrically connected to the first electrode 621 and the second electrode 622 respectively.

As shown in FIGS. 9A and 9B, the package body 630 of the organic solar cell 600 is packaged to cover and protect the photoelectric conversion element 620 and the high heat dissipation flexible substrate 610.

The light transmittance of the high heat dissipation flexible substrate 510 or the high heat dissipation flexible substrate 610 of the organic solar cell 500 or the organic solar cell 600 of the embodiment shown in FIGS. 8A to 9B can reach at least 85%. The rate is >1Ω/cm ² , and due to the implementation of the nano thermal conductive layer 20 or the doped and dispersed nano metal particles 20 ′, the heat dissipation capacity of the organic solar cell 500 or the organic solar cell 600 has been greatly improved.

Furthermore, as shown in FIGS. 8A to 9B, 10A, and 10B, the organic material layers 523 or the organic material layers 623 of the organic solar cell 500 or the organic solar cell 600 may be one in order, respectively. The hole transport material layer 50, an organic photoelectric conversion material layer 90, and an electron transport material layer 70.

In summary, as shown in the various embodiments, the flexible heat dissipation substrate 100, the flexible heat dissipation substrate 200, the organic light-emitting diode 300, the organic light-emitting diode 400, the organic solar cell 500, or the organic solar cell 600 respectively have The nano thermal conductive layer 20 or the doped and dispersed nano metal particles 20' can not only achieve 85% light transmittance, but also greatly improve the heat dissipation capacity, which further increases the service life of the device by up to 60%, effectively reducing The industry contributes greatly to the setup and use cost of the application.

What's more, because of its flexibility, the application range is very wide.

However, the above-mentioned embodiments are used to illustrate the characteristics of the present invention, and their purpose is to enable those who are familiar with the technology to understand the content of the present invention and implement them accordingly, rather than limiting the scope of the present invention. The equivalent modification or modification completed by the spirit of the disclosure should still be included in the scope of patent application described below.

100‧‧‧High heat dissipation flexible substrate

10‧‧‧First substrate

11‧‧‧surface

20‧‧‧Nano Thermal Conductive Layer

30‧‧‧Second substrate

Claims (13)

A flexible substrate with high heat dissipation, which includes: A first substrate, which is formed by a flexible organic plate; A nano thermal conductive layer, which is a nano metal coating coated on a surface of the first substrate; and A second substrate corresponding to the first substrate and attached to a flexible organic plate of the first substrate. The attachment method is such that the nano thermal conductive layer is interposed between the first substrate and the second substrate. Between two substrates. The high heat dissipation flexible substrate described in the first item of the scope of patent application, wherein the nano thermal conductive layer is formed by applying a nano metal solution to the surface of the first substrate by spin coating. A flexible substrate with high heat dissipation is formed by a flexible organic base plate doped and dispersed with a plurality of nano metal particles. The highly heat-dissipating flexible substrate described in item 1 or item 3 of the scope of patent application is a heat-resistant and light-transmitting flexible substrate. For the high heat dissipation flexible substrate described in item 1 or item 3 of the scope of patent application, its light transmittance is at least 85%. A method for manufacturing a flexible substrate with high heat dissipation includes the following steps: Providing a first substrate (step S10), which provides a first substrate formed by a flexible organic plate; Forming a nano thermal conductive layer (step S20), which is to coat a layer of nano metal solution on a surface of the first substrate to form the nano thermal conductive layer; Covering a second substrate (step S30), which covers a second substrate formed of a flexible organic plate on the surface of the first substrate coated with the nano thermal conductive layer; as well as A high heat dissipation flexible substrate is formed (step S40). The first substrate, the nano thermal conductive layer and the second substrate are sealed by means of glue sealing or vacuuming to form a high heat dissipation flexible substrate. A method for manufacturing a flexible substrate with high heat dissipation includes the following steps: Provide a flexible organic substrate sheet (step S210); Heating the plate of the flexible organic substrate to a molten state (step S220), which heats the plate of the organic substrate to a molten state; Planting nano metal particles (step S230), which is to dope and disperse a plurality of nano metal particles in a molten state of the flexible organic substrate sheet; and A highly heat-dissipating flexible substrate is formed (step S240), which is to solidify and dope the sheet of the flexible organic substrate in the molten state dispersed with the nano metal particles to form a highly heat-dissipating flexible substrate. An organic light emitting diode with a flexible substrate with high heat dissipation, including: A high heat dissipation flexible substrate, which includes: A first substrate, which is formed by a flexible organic plate; A nano thermal conductive layer, which is a nano metal coating coated on a surface of the first substrate; and A second substrate corresponding to the first substrate and attached to a flexible organic plate of the first substrate. The attachment method is such that the nano thermal conductive layer is interposed between the first substrate and the second substrate. Between two substrates; A diode element is fixed on the high heat dissipation flexible substrate and includes: A first electrode; A second electrode; and A plurality of organic material layers are sandwiched and fixed between the first electrode and the second electrode and electrically connected to the first electrode and the second electrode, respectively; and a package body that packages and covers the diode element and the Flexible substrate with high heat dissipation. An organic light emitting diode with a flexible substrate with high heat dissipation, including: A high heat dissipation flexible substrate, which is formed by a flexible organic substrate doped with a plurality of nano metal particles dispersed; A diode element is fixed on the high heat dissipation flexible substrate and includes: A first electrode; A second electrode; and A plurality of organic material layers are sandwiched and fixed between the first electrode and the second electrode and electrically connected to the first electrode and the second electrode, respectively; and a package body that packages and covers the diode element and the Flexible substrate with high heat dissipation. For the organic light-emitting diode described in item 8 or 9 of the scope of patent application, the organic material layers are sequentially a hole injection material layer, a hole transport material layer, an organic light emitting material layer, and An electron transport material layer and an electron injection material layer. An organic solar cell with a flexible substrate with high heat dissipation, including: A high heat dissipation flexible substrate, which includes: A first substrate, which is formed by a flexible organic plate; A nano thermal conductive layer, which is a nano metal coating coated on a surface of the first substrate; and A second substrate corresponding to the first substrate and attached to a flexible organic plate of the first substrate. The attachment method is such that the nano thermal conductive layer is interposed between the first substrate and the second substrate. Between two substrates; A photoelectric conversion element is fixed on the high heat dissipation flexible substrate and includes: A first electrode; A second electrode; and A plurality of organic material layers are sandwiched and fixed between the first electrode and the second electrode, and are electrically connected to the first electrode and the second electrode, respectively; and a package body that encapsulates and covers the photoelectric conversion element and the height Flexible substrate for heat dissipation. An organic solar cell with a flexible substrate with high heat dissipation, including: A highly heat-dissipating flexible substrate, which is formed by a flexible organic substrate doped with a plurality of nano metal particles dispersed therein; A photoelectric conversion element is fixed on the high heat dissipation flexible substrate and includes: A first electrode; A second electrode; and A plurality of organic material layers are sandwiched and fixed between the first electrode and the second electrode, and are electrically connected to the first electrode and the second electrode, respectively; and a package body that encapsulates and covers the photoelectric conversion element and the height Flexible substrate for heat dissipation. For the organic solar cell described in item 11 or item 12 of the scope of patent application, the organic material layers are sequentially a hole transport material layer, an organic photoelectric conversion material layer, and an electron transport material layer.

Images