TW202117334A - Inspection probe, method for manufacturing inspection probe, and inspection device - Google Patents

Abstract

The present invention provides an inspection probe, a method for manufacturing the inspection probe, and an inspection device that can suppress the time required for inspection of optical elements. An inspection probe 20 includes a needle 21 with a cantilevered structure which has a fixed end 212 and a free end 211 electrically connected to the fixed end 212, and an optical waveguide 22 which is formed on the needle 21 such that a light receiving surface 221 faces the same direction as the free end 211. During inspection of an inspection object 3, the free end 211 of the inspection probe 20 is electrically connected to an electrical signal terminal of the inspection object 3, and the light receiving surface 221 of the inspection probe 20 is optically connected to an optical signal terminal of the inspection object 3.

Description

Inspection probe, inspection probe manufacturing method and inspection device

The present invention relates to an inspection probe used in the inspection of the characteristics of an inspection object, a manufacturing method of the inspection probe, and an inspection device.

Using silicon photonics technology, semiconductor elements (hereinafter referred to as "optical elements") for power supply signals and optical signal transmission are formed on silicon substrates and the like. In order to check the characteristics of optical components with wafer status, electrical probes for power supply signal transmission and optical probes for optical signal transmission are used to connect measuring devices such as optical components and testers. For example, a probe made of a conductive material is used as an electrical probe, and an optical fiber is used as an optical probe.

(Prior technical literature)

(Patent Document)

Patent Document 1: Japanese Patent Application Publication No. 2018-81948

However, by separately aligning the electrical probe and the optical probe with the optical element, the time required for inspection will increase. In view of the above-mentioned problems, the object of the present invention is to provide an inspection probe, a method of manufacturing an inspection probe, and an inspection device that can reduce the time required for inspection of optical elements.

According to one aspect of the present invention, there is provided an inspection probe, which is provided with: a cantilevered needle part having a fixed end and a free end electrically connected to the fixed end; The free end is formed in the needle part in the same direction.

According to another aspect of the present invention, there is provided a manufacturing method of an inspection probe, the manufacturing method includes the following steps: forming a first coating layer on the surface of the needle portion of the cantilever structure by a first photolithography step; The second photoetching step forms a core with a higher refractive index than the first coating layer on a part of the upper surface of the first coating layer; and the third photoetching step covers the core in the first A second coating layer having the same refractive index as the first coating layer is formed on the upper surface of the coating layer. The optical waveguide formed by covering the core with a coating is formed in the needle such that the end face of one of the optical waveguides faces the same direction as the free end, wherein the coating is composed of a first coating and a second coating Constituted.

According to yet another aspect of the present invention, there is provided an inspection device, which is provided with: an inspection probe, a needle having a cantilever structure and a light guide wave path, the needle of the cantilever structure having a fixed end fixed to a substrate and a fixed The end is electrically connected to the free end, and the optical waveguide is formed on the needle in such a way that the direction of one end face is the same as the direction of the free end; and the optical signal transmission path is optically connected to the other end of the optical waveguide connection. The relative positional relationship between the free end of the needle and the end face of the other side of the optical waveguide corresponds to the relative positional relationship between the electrical signal terminal and the optical signal terminal of the object to be inspected.

According to the present invention, it is possible to provide an inspection probe, a method for manufacturing an inspection probe, and an inspection device that can suppress the time required for inspection of optical elements.

1: Inspection device

2: pedestal

3: Inspection object

10: substrate

11: Support substrate

12: Printed substrate

20: Check the probe

21: Needle

21A: The first needle material

21B: Second needle material

22: Optical waveguide

30: Optical signal transmission path

40: Reinforcement bar

50: O/E conversion connector

61, 62, 63, 64, 65: mask material

70: Plating electrode film

80: Resist film

110: Connection terminal

111: Internal wiring

120: Tester Island

121: Board wiring

200: base material

201: first coating layer

202: core layer

203: second coating layer

210: Hollow

211: free end

212: fixed end

221: light-receiving surface

222: Connection surface

301: Electrical signal terminal

302: Optical signal terminal

L: Optical signal

FIG. 1 is a schematic diagram showing the structure of the inspection device of the first embodiment of the present invention.

Fig. 2 is a plan view showing an example of the structure of the inspection object.

FIG. 3 is a schematic diagram showing the structure of the inspection probe of the first embodiment of the present invention.

4 is a schematic diagram showing the shape of the light-receiving surface of the inspection probe of the first embodiment of the present invention.

5 is a schematic diagram showing other shapes of the light-receiving surface of the inspection probe of the first embodiment of the present invention.

6 is a schematic diagram showing the shape of the corner portion of the optical waveguide of the inspection probe of the first embodiment of the present invention.

7 is a schematic diagram showing other shapes of the corners of the optical waveguide of the inspection probe of the first embodiment of the present invention.

8 is a schematic diagram showing still another shape of the corner portion of the optical waveguide of the inspection probe of the first embodiment of the present invention.

Fig. 9 is a sequence diagram (Part 1) for explaining the manufacturing method of the inspection probe of the first embodiment of the present invention.

FIG. 10 is a sequence diagram (No. 2) for explaining the manufacturing method of the inspection probe of the first embodiment of the present invention.

FIG. 11 is a sequence diagram (No. 3) for explaining the manufacturing method of the inspection probe of the first embodiment of the present invention.

Fig. 12 is a sequence diagram (No. 4) for explaining the manufacturing method of the inspection probe of the first embodiment of the present invention.

FIG. 13 is a sequence diagram (part 5) for explaining the manufacturing method of the inspection probe of the first embodiment of the present invention.

FIG. 14 is a sequence diagram (No. 6) for explaining the manufacturing method of the inspection probe of the first embodiment of the present invention.

FIG. 15 is a sequence diagram (part 7) for explaining the manufacturing method of the inspection probe of the first embodiment of the present invention.

FIG. 16 is a process diagram (No. 8) for explaining the manufacturing method of the inspection probe of the first embodiment of the present invention.

FIG. 17 is a sequence diagram (9) for explaining the manufacturing method of the inspection probe of the first embodiment of the present invention.

FIG. 18 is a schematic diagram for explaining another manufacturing method of the inspection probe of the first embodiment of the present invention.

19 is a cross-sectional view showing the structure of the inspection probe of the second embodiment of the present invention.

Fig. 20 is a side view of the structure of the inspection probe of the second embodiment of the present invention.

Fig. 21 is a sequence diagram (Part 1) for explaining the manufacturing method of the inspection probe of the second embodiment of the present invention.

Fig. 22 is a sequence diagram (No. 2) for explaining the manufacturing method of the inspection probe of the second embodiment of the present invention.

FIG. 23 is a sequence diagram (No. 3) for explaining the manufacturing method of the inspection probe of the second embodiment of the present invention.

FIG. 24 is a sequence diagram (No. 4) for explaining the manufacturing method of the inspection probe of the second embodiment of the present invention.

FIG. 25 is a process diagram (No. 5) for explaining the manufacturing method of the inspection probe of the second embodiment of the present invention.

Fig. 26 is a sequence diagram (No. 6) for explaining the manufacturing method of the inspection probe of the second embodiment of the present invention.

FIG. 27 is a sequence diagram (part 7) for explaining the manufacturing method of the inspection probe of the second embodiment of the present invention.

FIG. 28 is a process diagram (No. 8) for explaining the manufacturing method of the inspection probe of the second embodiment of the present invention.

Fig. 29 is a process diagram (9) for explaining the manufacturing method of the inspection probe of the second embodiment of the present invention.

FIG. 30 is a sequence diagram (No. 1) for explaining the manufacturing method of the inspection probe of Modification 2 of the second embodiment of the present invention.

FIG. 31 is a sequence diagram (No. 2) for explaining the manufacturing method of the inspection probe of the modification 2 of the second embodiment of the present invention.

FIG. 32 is a sequence diagram (No. 3) for explaining the manufacturing method of the inspection probe of Modification 2 of the second embodiment of the present invention.

FIG. 33 is a sequence diagram (No. 4) for explaining the manufacturing method of the inspection probe of the modification 2 of the second embodiment of the present invention.

FIG. 34 is a sequence diagram (No. 5) for explaining the manufacturing method of the inspection probe of Modification 2 of the second embodiment of the present invention.

FIG. 35 is a sequence diagram (No. 6) for explaining the manufacturing method of the inspection probe of the modification 2 of the second embodiment of the present invention.

Next, the implementation mode of the present invention will be described with reference to the drawings. In the following drawings, the same or similar parts are marked with the same or similar symbols. However, the drawing is used for illustration, and it should be noted that the ratio of the thickness of each part is different from reality. Moreover, among the drawings, of course, it also includes parts with different size relationships or ratios. The embodiments shown below are examples of devices or methods for embodying the technical ideas of the present invention. The embodiments of the present invention do not specify the materials, shapes, structures, and configurations of the components as follows .

(First implementation type)

The inspection device 1 of the first embodiment shown in FIG. 1 is used for the characteristic inspection of the inspection object 3. The inspection device 1 includes a substrate 10, an inspection probe 20 fixed to the substrate 10, and an optical signal transmission path 30 connected to the inspection probe 20. The substrate 10 has a structure in which a supporting substrate 11 and a printed circuit board 12 are laminated.

The inspection object 3 is an optical element having an electrical signal terminal for power supply signal transmission and an optical signal terminal for optical signal transmission. The inspection object 3 is not particularly limited, but is, for example, a semiconductor device such as a silicon photonics device and a vertical resonator surface emitting laser (VCSEL). For example, the inspection target 3 illustrated in FIG. 2 is an example of a VCSEL in which the electrical signal terminal 301 is a signal input terminal and the optical signal terminal 302 is a light-emitting part. The inspection target 3 is arranged on the pedestal 2 with the surface on which the electrical signal terminal 301 and the optical signal terminal 302 are formed facing the inspection probe 20.

The inspection probe 20 is provided with a cantilevered needle 21 having a fixed end 212 and a free end 211 electrically connected to the fixed end 212; and an optical waveguide 22 formed on the surface of the needle 21. Here, the surface of the needle 21 facing the inspection target 3 is referred to as the lower surface, the surface facing the lower surface is referred to as the upper surface, and the surface facing the upper surface from the lower surface is referred to as the side surface. For example, as shown in FIG. 3, an optical waveguide 22 is arranged on the side surface of the needle 21. However, the optical waveguide 22 may also be arranged on the lower surface or the upper surface of the needle 21.

As shown in FIGS. 1 and 3, the free end 211 of the needle 21 of the inspection probe 20 faces the inspection target 3. In addition, one end surface of the optical waveguide 22 (hereinafter referred to as the “light receiving surface 221”) faces the same direction as the free end 211, and the light receiving surface 221 faces the inspection target 3. In addition, the other end surface of the optical waveguide 22 (hereinafter referred to as “connection surface 222”) is optically connected to the optical signal transmission path 30. In addition, "optical connection" refers to the concept that includes direct contact connection and light transmission in a separate area.

During the inspection of the inspection object 3, as shown in FIG. 3, the free end 211 of the needle 21 is connected to the electrical signal terminal 301 of the inspection object 3, and the light-receiving surface 221 of the optical waveguide 22 is connected to the light of the inspection object 3. The signal terminal 302 is optically connected. Therefore, the optical signal L output from the inspection target 3 is incident on the light receiving surface 221 and transmitted through the optical waveguide 22, and incident on one end of the optical signal transmission path 30 from the connection surface 222. Viewed from above the surface of the inspection object 3 facing the inspection probe 20 (hereinafter referred to as "top view"), the relative positional relationship between the free end 211 and the light-receiving surface 221 is related to the electrical signal terminal 301 of the inspection object 3 Corresponds to the relative position of the optical signal terminal 302 is OFF.

For example, with respect to the inspection target 3 shown in FIG. 2, the free end 211 overlaps with the electrical signal terminal 301 in a plan view, and the light receiving surface 221 overlaps with the optical signal terminal 302. In this way, in the state where the free end 211 is in contact with the electrical signal terminal 301, the optical waveguide 22 is connected with the light receiving surface 221 and the optical signal terminal The sub 302 is arranged on the needle 21 in such a way that it faces each other. At this time, the light receiving surface 221 and the light signal terminal 302 are opposed to each other, so that the light signal L is incident on the light receiving surface 221 with an effective intensity for inspection.

The fixed end 212 of the needle portion 21 of the inspection probe 20 is electrically connected to the connection terminal 110 arranged on the surface of the support substrate 11 and is fixed to the support substrate 11. The connection terminal 110 is connected to the internal wiring 111 arranged inside the support substrate 11. As the support substrate 11, a multilayer wiring substrate such as MLO (Multi-Layer Organic) or MLC (Multi-Layer Ceramic) can be used.

The internal wiring 111 of the support substrate 11 is electrically connected to the substrate wiring 121 formed on the printed circuit board 12. The board wiring 121 is connected to the tester island 120 arranged on the printed circuit board 12. That is, the needle 21 is electrically connected to the tester island 120. The tester island 120 is connected to a tester (not shown).

The printed circuit board 12 is fixed to a reinforcing bar 40 having a higher rigidity than the printed circuit board 12. The reinforcing strip 40 ensures the mechanical strength of the printed circuit board 12 and is also used as a support for fixing the inspection probe 20.

As described above, the needle 21 of the inspection probe 20 is electrically connected to the tester, and electrical signals are transmitted between the tester and the inspection object 3 through the needle 21. A conductive material is used for the needle part 21, for example, a metal system such as nickel (Ni) alloy is used for the needle part 21.

The optical signal transmission path 30 optically connected to the connecting surface 222 of the optical waveguide 22 and one end is connected to the O/E conversion connector 50 at the other end. The O/E conversion connector 50 converts the optical signal L transmitted to the optical signal transmission path 30 into an electrical signal, and transmits the electrical signal to the tester. The optical signal transmission path 30 preferably uses, for example, optical fibers. As described above, between the tester and the inspection target 3, the optical signal L is transmitted through the optical waveguide 22.

The end of the optical signal transmission path 30 connected to the optical waveguide 22 is exposed on the lower surface of the support substrate 11 and penetrates the support substrate 11. The optical signal transmission path 30 is connected to the O/E conversion connector 50 arranged on the printed circuit board 12 through the printed circuit board 12 and the opening provided in the reinforcing bar 40. In addition, the lens of the connecting surface 222 of the optical waveguide 22 can also be processed into a convex spherical surface, so as to improve the condensability of the optical signal L output from the connecting surface 222.

Furthermore, the shape of the light receiving surface 221 of the optical waveguide 22 may be processed so as to easily receive the light signal L output from the inspection target 3. For example, as shown in FIG. 4, the light-receiving surface 221 may be made into a convex spherical surface by lens processing. Alternatively, as shown in FIG. 5, the tip angle may be approximately 90 degrees to make the light receiving surface 221 sharp.

In addition, the corners of the optical waveguide 22 can be formed in any shape in order to suppress the transmission loss of the optical signal L. As described later, since the optical waveguide 22 is formed by the photoetching technique, the optical waveguide 22 can be easily formed into a desired shape.

For example, as shown in FIG. 6, the corners of the optical waveguide 22 may be R-chamfered (arc chamfered). In this way, the light signal L is scattered at the corners and is difficult to reflect. Alternatively, as shown in FIG. 7, the straight portions of the optical waveguide 22 may be separated from each other, and an air layer may be provided at the corners. In addition, as shown in FIG. 8, the corner portion may be C-chamfered. By processing the corners into the shape shown in FIG. 7 or FIG. 8 with high accuracy, the transmission loss caused by the reflection of the light signal L can be suppressed.

Hereinafter, the inspection method using the inspection device 1 will be described. In the inspection of the inspection target 3, the inspection target 3 and the inspection probe 20 are aligned. This alignment is performed, for example, by moving the pedestal 2 on which the inspection target 3 is mounted on the mounting surface in a direction parallel to the mounting surface, or rotating the pedestal 2 with the surface normal direction of the mounting surface as the central axis.

Then, in a state where the position of the free end 211 of the hand portion 21 and the electrical signal terminal 301 of the inspection target 3 coincide in a plan view, the distance between the inspection target 3 and the inspection probe 20 is changed. For example, the pedestal 2 is moved toward the inspection device 1 and the free end 211 of the needle 21 is electrically connected to the electrical signal terminal 301 of the inspection target 3. At this time, the relative positional relationship between the free end 211 of the needle 21 and the light-receiving surface 221 of the optical waveguide 22 corresponds to the relative positional relationship between the electrical signal terminal 301 and the optical signal terminal 302 of the inspection object 3, so the light-receiving surface 221 It will face the optical signal terminal 302.

Furthermore, electrical signals or optical signals are transmitted between the inspection object 3 and the tester through the inspection probe 20 to inspect the characteristics of the inspection object 3. For example, through the needle 21 of the inspection probe 20, the electrical signal transmitted from the tester is input to the electrical signal terminal 301 of the inspection object 3. Furthermore, the light signal L output from the inspection target 3 is received by the light receiving surface 221 of the optical waveguide 22. The optical signal L is transmitted to the optical waveguide 22 and the optical signal transmission path 30, and is converted into an electrical signal by the O/E conversion connector 50. The electrical signal after photoelectric conversion of the optical signal L is transmitted to the tester, and the characteristics of the inspection object 3 are inspected. In addition, according to the specifications of the tester, the optical signal L can be converted into an electrical signal and then input to the tester as described above, or the optical signal L can be directly input to the tester.

As described above, the needle 21 of the inspection probe 20 functions as an electrical probe, and the optical waveguide 22 functions as an optical probe. In addition, the needle 21 is provided with a cavity 210 penetrating from one side surface to the other side surface. By providing the hollow 210 in the needle part 21, the needle part 21 can be made stretchable. Therefore, when the needle 21 is brought into contact with the inspection target 3, overdrive can be applied, and the needle 21 can be brought into contact with the inspection target 3 with a predetermined needle pressure. Thereby, the electrical connection between the needle 21 and the inspection target 3 can be reliably performed.

In addition, as illustrated in FIG. 3, in a state where the free end 211 is in contact with the surface of the inspection target 3, the light receiving surface 221 is separated from the inspection target 3. In this way, it can be suppressed because the optical waveguide 22 The contact causes damage to the inspection object 3. However, the inspection target 3 may be inspected in a state where the light-receiving surface 221 is in contact with the inspection target 3.

In order to use the inspection device 1 to accurately inspect the inspection object 3, when the free end 211 of the inspection probe 20 is connected to the electrical signal terminal 301 of the inspection object 3, the light-receiving surface 221 must be aligned with the inspection object with high position accuracy. The optical signal terminals 302 of the object 3 face each other. Therefore, the relative positional relationship between the free end 211 and the light-receiving surface 221 must have high accuracy.

As will be described later, the optical waveguide 22 of the inspection probe 20 is formed on the needle 21 by using a photoetching technique. Therefore, the accuracy of the relative positional relationship between the free end 211 and the light receiving surface 221 can be improved, and the optical waveguide 22 can be arranged on the needle 21. Therefore, by aligning the needle 21 with respect to the electrical signal terminal 301 of the inspection target 3, the optical signal terminal 302 of the inspection target 3 is also aligned with the optical waveguide 22 at the same time. Therefore, the inspection probe 20 can be aligned with the inspection target 3 in a short time.

As described above, according to the inspection device 1 provided with the inspection probe 20, the time required for inspection of the inspection target 3 can be suppressed. In addition, the needle 21 and the electrical signal terminal 301 of the inspection target 3 and the optical waveguide 22 and the optical signal terminal 302 of the inspection target 3 are simultaneously connected with a predetermined positional accuracy. Therefore, electrical inspection and optical inspection can be performed on the inspection target 3 at the same time.

In FIG. 1, a case where one inspection probe 20 is used for one inspection target 3 is exemplarily shown. On the other hand, it is also possible to use a plurality of inspection probes 20 for the inspection of one inspection target 3 corresponding to the structure of the signal terminal of the inspection target. In addition, by increasing the number of inspection probes 20 arranged in the inspection device 1, it is also possible to inspect a plurality of inspection objects 3 at the same time.

Hereinafter, a method of manufacturing the inspection probe 20 will be described with reference to the drawings. First, the needle 21 having a cantilever structure with a fixed end 212 and a free end 211 is prepared. For example, the needle 21 integrally formed from the fixed end 212 to the free end 211 is prepared. Furthermore, as shown in Figure 9, fix one side to the base The other side surface of the needle 21 on the surface of the material 200 forms the first coating layer 201. In the first coating layer 201, for example, an epoxy-based photosensitive material is used. Here, the material of the first coating layer 201 is a photocurable resin.

Next, as shown in FIG. 10, a predetermined region of the first coating layer 201 is irradiated with ultraviolet rays (hereinafter referred to as "UV exposure") by using the mask material 61. In addition, as shown in FIG. 11, by the development process, only the UV-exposed area of the first coating layer 201 remains on the surface of the needle 21. Through the above first photoetching step, a part of the optical waveguide 22 is formed.

Then, as shown in FIG. 12, a core layer 202 is formed on the upper surface of the first coating layer 201. In the core layer 202, similar to the first coating layer 201, for example, an epoxy-based photosensitive material is used. However, in the material of the core layer 202, a material having a higher refractive index than the material of the first coating layer 201 is used. Here, the material of the core layer 202 is a photocurable resin.

Next, as shown in FIG. 13, a predetermined area of the core layer 202 is UV exposed using the mask material 62. Specifically, the outer edge of the UV-exposed region of the core layer 202 is made closer to the inside than the outer edge of the first covering layer 201 in such a way that the core layer 202 remains on a part of the upper surface of the first covering layer 201. Furthermore, as shown in FIG. 14, only the UV-exposed area of the core layer 202 remains on the upper surface of the first coating layer 201 by the development process. Through the above second photoetching step, the core of the optical waveguide 22 is formed.

Next, as shown in FIG. 15, the core layer 202 and the first coating layer 201 are covered to form a second coating layer 203 having the same refractive index as the first coating layer 201. For example, the second coating layer 203 uses the same material as the first coating layer 201. Then, as shown in FIG. 16, a predetermined area of the second coating layer 203 is UV exposed using the mask material 63. And, as shown in FIG. 17, through the development process, the core layer 202 The surrounding area remains and the second coating layer 203 is removed. Through the above third photoetching step, the core layer 202 is covered on the upper surface of the first coating layer 201 to form the second coating layer 203.

In the above, the photoetching technique is used to complete the optical waveguide 22 formed by covering the core with a covering portion composed of the first covering layer 201 and the second covering layer 203. Then, the base material 200 is peeled from the needle 21.

In addition, in the above, the case where the optical waveguide 22 is formed on the side surface of the needle 21 is described, but the optical waveguide 22 may be formed on the lower surface or the upper surface of the needle 21 by the same photoetching technique. When the optical waveguide 22 is formed on the lower surface or the upper surface of the needle 21, as shown in FIG. 18, the optical waveguide 22 is formed adjacent to the needle 21 whose side is fixed on the surface of the substrate 200, and the optical waveguide 22 is formed on the surface of the substrate 200. . Then, the base 200 is peeled from the needle 21 and the optical waveguide 22.

The film thickness or material of the first coating layer 201, the core layer 202, and the second coating layer 203 can be arbitrarily selected according to the specifications required by the optical waveguide 22 and the like. For example, to suppress the transmission loss of the optical signal L, the structure or material of the optical waveguide 22 is selected.

Furthermore, the material of the optical waveguide 22 can be a sheet type in which a sheet-like material is applied, or a resist type in which a liquid-like material is coated, or the like. The sheet type can be thermally compressed with a laminated or air compressor, so it can be easily processed. Furthermore, in the sheet type, the film thickness can be managed uniformly with high accuracy.

In addition, the material of the needle 21 is selected to be not easily affected by the manufacturing process of the optical waveguide 22. For example, Ni alloy is preferably used for the material of the needle 21. When a sheet-type material is used in the optical waveguide 22, the Ni alloy system will not be affected by the heat when the sheet-type material is laminated.

According to the method of manufacturing the inspection probe 20 described above, the optical waveguide 22 is formed on the needle 21 by photolithography. Therefore, the relative position of the free end 211 of the needle 21 and the light receiving surface 221 of the optical waveguide 22 can be adjusted with high accuracy. Based on inspection probes manufactured by photoetching technology The needle 20 can also be aligned with the optical signal terminal 302 of the inspection target 3 by aligning the needle portion 21 with the electrical signal terminal 301 of the inspection target 3. Therefore, the alignment of the inspection probe 20 and the inspection target 3 can be easily performed. Therefore, the time required for the inspection of the inspection object 3 can be suppressed.

(Second implementation type)

In the inspection probe 20 of the second embodiment, as shown in Figs. 19 and 20, the optical waveguide 22 is embedded in the surface of the needle 21. 19 is a cross-sectional view taken along the XIX-XIX direction of FIG. 20, and an optical waveguide 22 is embedded on the side of the needle 21. The inspection device of the second embodiment is different from the first embodiment in which the optical waveguide 22 of the inspection probe 20 is embedded in the needle 21 at the point where the optical waveguide 22 is formed on the surface of the needle 21. Regarding the other structure, it is the same as that of the first embodiment shown in FIG. 1.

Hereinafter, the manufacturing method of the inspection probe 20 of the second embodiment will be described with reference to the drawings. First, after the first coating layer 201 is formed on the surface of the substrate 200, the first coating layer 201 is formed as shown in FIG. 21 by the same first photoetching step as the method described with reference to FIGS. 10 to 11.

Next, after the core layer 202 is formed to cover the first covering layer 201, the second photoetching step is the same as the method described with reference to FIGS. 13 to 14, as shown in FIG. 22, so that the core layer 202 remains A part of the upper surface of the first coating layer 201.

Then, after the second coating layer 203 is formed to cover the core layer 202, the third photoetching step is the same as the method described with reference to FIGS. 16 to 17, so that the periphery of the core layer 202 is left as shown in FIG. 23 The second coating layer 203 is removed. In this way, an optical waveguide 22 is formed on the surface of the substrate 200.

Then, as shown in FIG. 24, the surfaces of the substrate 200 and the optical waveguide 22 are covered to form a plated electrode film 70 used in the electroplating step described later. The plated electrode film 70 is, for example, a copper (Cu) film with a film thickness of about 1 μm. And, as shown in FIG. 25, a photocurable surface is formed on the upper surface of the plated electrode film 70 The resist film 80. Then, as shown in FIG. 26, the mask material 64 is used to expose a part of the resist film 80 to UV except for the area where the plated electrode film 70 is exposed.

Next, as shown in FIG. 27, the area of the resist film 80 that has not been exposed to UV is removed by a development process. Furthermore, by the electroplating step using the plated electrode film 70 as an electrode, the needle 21 is formed as shown in FIG. 28. The material of the needle 21 is, for example, Ni alloy. Then, as shown in FIG. 29, the resist film 80 or the plated electrode film 70 remaining on the outer side of the needle portion 21 is removed by etching. Through the above steps, the inspection probe 20 with the optical waveguide 22 embedded in the surface of the needle 21 is completed.

When the substrate 200 is an organic material or the like, a step of forming the plated electrode film 70 is necessary as described above. The plated electrode film 70 is preferably a Cu film which is easy to be etched and removed, or the like. In addition to the Cu film, a nickel film, a palladium (Pd) film, a chromium (Cr) film, etc. can be used for the plated electrode film 70 depending on the use or price. In addition, the needle 21 may be formed by an electroless plating method or the like.

The material of the needle 21 is selected from a material that is not easily affected by the manufacturing process of the inspection probe 20. For example, the Ni alloy system is not affected by the chemical used for etching and removing the copper film used as the plated electrode film 70.

In addition, in the above description, although the case where the optical waveguide 22 is buried on the side surface of the needle 21 is described, the optical waveguide 22 may be buried on the upper surface or the lower surface of the needle 21. Other systems are substantially the same as the first embodiment, and repeated descriptions are omitted.

<Modifications>

In the above description, although the configuration in which the optical waveguide 22 embedded in the needle 21 is exposed on the surface of the needle 21 has been described, a configuration in which the entire optical waveguide 22 is buried in the inside of the needle 21 may also be adopted. Hereinafter, an example of a method of manufacturing the inspection probe 20 in which the entire optical waveguide 22 is buried in the needle 21 will be described.

First, as shown in FIG. 30, the first coating layer 201 is formed on the upper surface of the first needle material 21A fixed to the base 200. Then, in the same manner as the method described with reference to FIGS. 10 to 17, the core layer 202 and the second coating layer 203 are formed, and as shown in FIG. 31, the optical waveguide 22 is formed on the upper surface of the first needle 21A.

Next, as shown in FIG. 32, the surfaces of the substrate 200, the first needle material 21A, and the optical waveguide 22 are covered to form a plated electrode film 70. In addition, after forming a photocurable resist film 80 on the upper surface of the plated electrode film 70, as shown in FIG. 33, a masking material 65 is used to prevent the plated electrode film 70 from being exposed to the resist film. Part of 80 is UV exposed. Then, the area of the resist film 80 that has not been exposed to UV is removed by a development process.

Then, through the electroplating step using the plated electrode film 70 as the electrode, as shown in FIG. 34, the second needle material 21B is formed. In addition, the resist film 80 or the plated electrode film 70 remaining on the outer side of the first needle material 21A and the second needle material 21B is removed by etching. Through the above steps, as shown in FIG. 35, the inspection probe 20 of the optical waveguide 22 is embedded in the needle part 21 composed of the first needle material 21A and the second needle material 21B.

(Other implementation types)

Although the present invention has been described in terms of implementation styles as described above, it should not be understood that the statements and drawings that form part of this disclosure limit the present inventors. From this disclosure, the relevant industry will understand various alternative implementation types, embodiments, and application technologies.

For example, in the above description, although the case where the optical waveguide 22 is formed by UV exposure and development processing is described, it is also possible to form the light guide by etching with a patterned etching mask using a photoetching technique. Wave 22.

In this way, the present invention naturally includes various embodiments and the like that are not described herein.

1: Inspection device

2: pedestal

3: Inspection object

10: substrate

11: Support substrate

12: Printed substrate

20: Check the probe

21: Needle

22: Optical waveguide

30: Optical signal transmission path

40: Reinforcement bar

50: O/E conversion connector

110: Connection terminal

111: Internal wiring

120: Tester Island

121: Board wiring

210: Hollow

211: free end

212: fixed end

221: light-receiving surface

222: Connection surface

Claims (9)

An inspection probe used for inspection of inspection objects. The inspection probe has: The needle part of the cantilever structure has a fixed end and a free end electrically connected to the aforementioned fixed end; and The optical waveguide is formed in the needle part so that one end face faces the same direction as the free end. The inspection probe according to claim 1, wherein the optical waveguide is made of photocurable resin. The inspection probe according to claim 1 or 2, wherein the optical waveguide is arranged on the surface of the needle. The inspection probe according to claim 1 or 2, wherein the optical waveguide is embedded in the needle. A manufacturing method of an inspection probe, the inspection probe is used for inspection of an inspection object, and the manufacturing method has the following steps: Prepare a cantilevered needle with a fixed end and a free end electrically connected to the aforementioned fixed end; Forming a first coating layer on the surface of the needle portion by a first photoetching step; Forming a core with a higher refractive index than the first coating layer on a part of the upper surface of the first coating layer by a second photoetching step; Forming a second coating layer with the same refractive index as the first coating layer on the upper surface of the first coating layer in a manner of covering the core by a third photoetching step; The optical waveguide formed by covering the core with a coating is formed on the needle such that the end face of one of the optical waveguides faces the same direction as the free end, wherein the coating is formed by the first coating And the aforementioned second coating layer. The method of manufacturing an inspection probe according to claim 5, wherein the first coating layer, the core portion, and the second coating layer are made of photocurable resin. An inspection device used for inspection of inspection objects with electrical signal terminals for power supply signal transmission and optical signal terminals for optical signal transmission. The inspection device has: Substrate The inspection probe has a needle with a cantilever structure and an optical waveguide. The needle of the cantilever structure has a fixed end fixed to the substrate and a free end electrically connected to the fixed end. The optical waveguide The direction of the end surface is set in the aforementioned needle part in the same manner as the direction of the aforementioned free end; and The optical signal transmission path is optically connected to the other end surface of the aforementioned optical waveguide; The relative positional relationship between the free end and the one end surface corresponds to the relative positional relationship between the electrical signal terminal and the optical signal terminal. The inspection device according to claim 7, wherein the optical waveguide is made of photocurable resin. The inspection device according to claim 7 or 8, wherein the optical waveguide is arranged on the surface of the needle.

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