TW202117258A - Non-oriented vapor chamber - Google Patents
Non-oriented vapor chamber Download PDFInfo
- Publication number
- TW202117258A TW202117258A TW109136738A TW109136738A TW202117258A TW 202117258 A TW202117258 A TW 202117258A TW 109136738 A TW109136738 A TW 109136738A TW 109136738 A TW109136738 A TW 109136738A TW 202117258 A TW202117258 A TW 202117258A
- Authority
- TW
- Taiwan
- Prior art keywords
- plate
- channel
- lower plate
- upper plate
- directional
- Prior art date
Links
Images
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0283—Means for filling or sealing heat pipes
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
- F28F21/085—Heat exchange elements made from metals or metal alloys from copper or copper alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2275/00—Fastening; Joining
- F28F2275/06—Fastening; Joining by welding
- F28F2275/067—Fastening; Joining by welding by laser welding
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
本發明涉及一種用於將熱從熱源釋放的非定向型均熱板。 The invention relates to a non-directional soaking plate for releasing heat from a heat source.
均熱板(Vapor Chamber)是利用液體與氣體之間的相位變化(Phase Transition)時的潛熱,從物件中去除熱量的裝置。均熱板具有與一般狀態下的熱傳遞體系(傳導、對流、輻射)不同的方式,可以從物件中迅速除熱和排出的優勢。 The Vapor Chamber is a device that uses the latent heat of the phase transition between liquid and gas to remove heat from the object. The soaking plate has a different method from the general heat transfer system (conduction, convection, radiation), and has the advantage of quickly removing heat and discharging from the object.
目前習知的均熱板大部分都是設計成單一方向來運行的。具體而言,熱源位於腔室的下部,基於所述熱源而汽化的氣體上升後在所述腔室的上部設置的凝結部(condensation section)凝結成液體。凝結的液體基於重力再次滴落至下部的熱源一側。 Most of the currently known soaking plates are designed to operate in a single direction. Specifically, the heat source is located in the lower part of the chamber, and the gas vaporized by the heat source rises and condenses into a liquid in a condensation section provided in the upper part of the chamber. The condensed liquid drops again to the lower side of the heat source due to gravity.
與此不同的是,為了使均熱板不受方向性限制而運行,也可採用纖維材質的毛細結構(wick)。但是纖維材質的毛細結構需要通過熱處理(電離化、高溫加熱)來進行製造,存在產品的厚度過厚和製造昂貴等缺點。 The difference is that, in order to make the soaking plate operate without being restricted by the directionality, a wick structure of fiber material can also be used. However, the capillary structure of the fiber material needs to be manufactured through heat treatment (ionization, high temperature heating), and there are disadvantages such as excessive thickness of the product and expensive manufacturing.
並且,與均熱板相似的導熱管(heat pipe)大部分是由圓筒形銅管構成的,並廣泛應用於電子器械的冷卻裝置之中。近來,由於對超薄化趨勢和薄版型的需求不斷增加,因此對圓筒形銅導熱管或均熱板進行衝壓壓扁而製作產品及使用。但是這些厚度達到了2.0mm的水準,並且相比於厚度,對超薄化需求也已經達到了技術性侷限之處,在製造時很難將產品的厚度控制在1mm以下。並且,在上板和下板相互熔接的過程中,因製造時間增加和過熱引起的塑性變形還會導致軟氮化問題等現象出現。 In addition, most of the heat pipes similar to the soaking plate are composed of cylindrical copper pipes, and are widely used in cooling devices of electronic devices. Recently, due to the ever-increasing demand for ultra-thinness and thin version, cylindrical copper heat pipes or soaking plates are stamped and flattened to make products and use them. However, these thicknesses have reached the level of 2.0mm, and compared with the thickness, the demand for ultra-thinness has reached the technical limitation, and it is difficult to control the thickness of the product below 1mm during manufacturing. Moreover, in the process of welding the upper plate and the lower plate to each other, the plastic deformation caused by the increase in manufacturing time and overheating can also cause the phenomenon of soft nitriding and other phenomena.
本發明目的在於,提供一種非定向型均熱板,通過薄化製程將厚度縮小至最小,以達到放熱最大化的效果。 The object of the present invention is to provide a non-directional soaking plate whose thickness is reduced to a minimum through a thinning process to achieve the effect of maximizing heat dissipation.
本發明的另一目的在於,提供一種通過薄化製程製作,能夠防止在使用中結構強度變低的非定向型均熱板。 Another object of the present invention is to provide a non-directional soaking plate that can be manufactured through a thinning process to prevent the structural strength from becoming low during use.
為了成功解決上述問題,本發明旨在提供一種非定向型均熱板,包括:一上板,具備一第一結構面;一下板,具備與所述第一結構面相對的一第二結構面;一大通道,通過蝕刻製程形成在所述第一結構面和所述第二結構面中的至少一個上,並形成有能夠使汽相的運行流體基於熱能從一蒸發部向一凝結部流動的通路;以及一微通道,通過蝕刻製程形成在所述第一結構面和所述第二結構面中的至少一個上,所述微通道具有比所述大通道更小寬度的溝槽,並配置於兩個相鄰所述大通道之間的位置,所述微通道還形成有能夠使液相的運行流體基於毛細管力從所述凝結部向所述蒸發部移動的通路;其中,所述大通道包括一外側放熱通道,所述外側放熱通道佔據著所述上板或者所述下板上之一最外側通道中的至少一部分。 In order to successfully solve the above problems, the present invention aims to provide a non-directional soaking plate, including: an upper plate having a first structure surface; a lower plate having a second structure surface opposite to the first structure surface ; A large channel is formed on at least one of the first structure surface and the second structure surface by an etching process, and is formed to enable the vapor phase operating fluid to flow from an evaporation portion to a condensation portion based on thermal energy And a microchannel formed on at least one of the first structure surface and the second structure surface by an etching process, the microchannel having a groove with a smaller width than the large channel, and Disposed at a position between two adjacent large channels, the microchannel is also formed with a passage capable of moving the operating fluid in the liquid phase from the condensation part to the evaporation part based on capillary force; wherein, the The large channel includes an outer heat releasing channel, and the outer heat releasing channel occupies at least a part of the outermost channel of one of the upper plate or the lower plate.
其中,所述上板及所述下板分別由具備四個邊的四角形形成;所述外側放熱通道佔據著所述上板或者所述下板的四個邊的所述最外側通道的全部,並且形成將所述微通道包圍起來的結構。 Wherein, the upper plate and the lower plate are respectively formed of a quadrangular shape with four sides; the outer heat radiation channel occupies all of the outermost channels of the four sides of the upper plate or the lower plate, And a structure surrounding the microchannel is formed.
其中,所述上板及所述下板中的至少一個還包括有形成在所述大通道內突出的一間隔維持凸起,以維持所述上板和所述下板相互分隔的狀態。 Wherein, at least one of the upper plate and the lower plate further includes an interval maintaining protrusion formed in the large channel to protrude, so as to maintain the state that the upper plate and the lower plate are separated from each other.
其中,所述間隔維持凸起具備有複數個,並且沿一個方向配置形成鋸齒形。 Wherein, there are a plurality of the interval maintaining protrusions, and they are arranged in a zigzag shape along one direction.
其中,所述上板和所述下板可具備不同的厚度。 Wherein, the upper plate and the lower plate may have different thicknesses.
其中,所述大通道和所述微通道在所述上板和所述下板中的一個上交替並排地排列配置;所述上板和所述下板中的另一個上包括一劃痕區域,所述劃痕區域具有相比所述微通道更小寬度的劃痕溝槽。 Wherein, the large channel and the micro channel are arranged alternately side by side on one of the upper plate and the lower plate; the other of the upper plate and the lower plate includes a scratch area , The scratch area has a scratch groove with a smaller width than that of the microchannel.
其中,所述劃痕區域與所述大通道和微通道所形成的區域相對應。 Wherein, the scratch area corresponds to the area formed by the large channel and the micro channel.
其中,所述劃痕溝槽是對所述上板和下板中的另一個進行金屬電刷接觸與旋轉的操作而製造形成。 Wherein, the scratch groove is formed by performing metal brush contact and rotation operations on the other of the upper plate and the lower plate.
其中,所述上板和所述下板分別還包括形成於其外面上的一熔接槽,所述上板和所述下板是通過對所述熔接槽進行雷射照射,使所述上板和所述下板相互熔接接合。 Wherein, the upper plate and the lower plate respectively further include a welding groove formed on the outer surface of the upper plate and the lower plate, and the upper plate and the lower plate are irradiated by laser to the welding groove to make the upper plate And the lower plate are welded and joined to each other.
如上所述,本發明中的非定向型均熱板通過對上板的第一結構面和下板的第二結構面中的至少一個進行蝕刻製程而形成大通道和微通道,從而使非定向型均熱板從整體上降低厚度。 As mentioned above, the non-directional heat spreading plate in the present invention forms large channels and micro channels by etching at least one of the first structure surface of the upper plate and the second structure surface of the lower plate, thereby making the non-directional The thickness of the type soaking plate is reduced as a whole.
再進一步地說,大通道佔據著上板或者下板的最外側通道中的至少一部分,使汽相的運行流體不斷流動,因此可以使其具有的熱量高效地向外部釋放出去。 Furthermore, the large channel occupies at least a part of the outermost channel of the upper plate or the lower plate, so that the operating fluid in the vapor phase flows continuously, so that the heat it has can be efficiently released to the outside.
並且,上板和下板通過熔接而相互熔合,因此在製造過程中,可以防止由於熱的影響導致上板和下板整體的強度下降的問題。 In addition, the upper plate and the lower plate are fused to each other by welding, so during the manufacturing process, it is possible to prevent the problem of the overall strength of the upper plate and the lower plate from decreasing due to the influence of heat.
並且,在大通道上形成的間隔維持凸起,可以抑制在使用過程中上板和下板產生的擠壓。 In addition, the interval maintaining protrusions formed on the large channel can suppress the compression of the upper plate and the lower plate during use.
100,100’,200,300:非定向型均熱板 100,100’,200,300: Non-directional soaking plate
110,210,310:上板 110,210,310: upper board
111,311:第一結構面 111, 311: the first structural plane
112:第一露出面 112: The first appearance
113,133:注入口形成部 113, 133: Injection port forming part
114,134:熔接槽 114,134: Welding slot
115,135,215,235:間隔維持凸起 115, 135, 215, 235: Interval maintenance bump
130,230,330:下板 130,230,330: lower board
131,331:第二結構面 131, 331: the second structural surface
132:第二露出面 132: The Second Exposure
150,250,350:大通道 150, 250, 350: large aisle
155:外側放熱通道 155: Outer heat release channel
170,270,370:微通道 170,270,370: microchannel
390:劃痕區域 390: scratched area
EZ:蒸發部 EZ: Evaporation Department
CZ:凝結部 CZ: Condensation part
圖1是顯示本發明中一實施例的非定向型均熱板的概略性分解立體圖; Figure 1 is a schematic exploded perspective view showing a non-directional soaking plate according to an embodiment of the present invention;
圖2是顯示圖1所示之非定向型均熱板的組裝狀態下的具體截面圖; FIG. 2 is a detailed cross-sectional view showing the assembled state of the non-directional soaking plate shown in FIG. 1;
圖3是基於圖2所示之非定向型均熱板的一變化實施例,顯示出製作完成的非定向型均熱板的分解圖; Fig. 3 is a modified embodiment of the non-directional heat equalizing plate shown in Fig. 2, showing an exploded view of the finished non-directional heat equalizing plate;
圖4是顯示本發明另一實施例的非定向型均熱板的具體截面圖; 4 is a specific cross-sectional view showing a non-directional soaking plate according to another embodiment of the present invention;
圖5是顯示圖4所示之非定向型均熱板的分解截面圖;以及 Figure 5 is an exploded cross-sectional view showing the non-directional soaking plate shown in Figure 4; and
圖6是顯示本發明中其他另一實施例的非定向型均熱板的具體截面圖。 Fig. 6 is a detailed cross-sectional view showing another embodiment of the non-directional soaking plate in the present invention.
以下將基於本發明較佳實施例的非定向型均熱板,參照附圖進行詳細說明。在本說明書中,即使是相互不同的實施例,針對相同或相似的結構也會賦予相同或相似的元件符號,對這部分的說明也會用最初的說明來代替。 Hereinafter, the non-directional heat spreading plate based on the preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. In this specification, even in mutually different embodiments, the same or similar reference numerals will be assigned to the same or similar structures, and the description of this part will be replaced by the original description.
圖1是顯示本發明中一實施例的非定向型均熱板100的概略性分解立體圖。
FIG. 1 is a schematic exploded perspective view showing a non-directional
通過附圖可以看出,非定向型均熱板100整體上由上板110和下板130結合構成。
It can be seen from the drawings that the
上板110和下板130分別由矩形形態的平板而構成。其結構可以由金屬材質構成,例如可以由銅合金來製作而成。上板110和下板130作為相互疊加結合的結構,可以具有相同的大小和形態。
The
在上板110與下板130之間的相對的面分別是由第一結構面111和第二結構面131構成。在這相對面上可通過蝕刻(etching)製程來製造大通道150(參照圖2)等結構。在上板110和下板130上,向外部露出的面分別由第一露出面112和第二露出面132構成。並且,在上板110和下板130的一角落處形成有突出的注入口形成部113、133。所述注入口形成部113、133在運行流體注入至大通道150後被切斷開。
The opposite surfaces between the
對於上述非定向型均熱板100的具體結構將參照附圖2進行具體地說明。圖2是顯示圖1之非定向型均熱板100在組裝狀態下的具體截面圖。
The specific structure of the above-mentioned
參照圖2,為了使上板110和下板130結合,沿著第一露出面112和第二露出面132的邊緣處,形成了熔接槽114、134。熔接槽114、134可以通過對上板110和下板130的蝕刻製程來製造。所述熔接槽114、134可通過照射雷射來熔接上板110和下板130,從而完成熔接。通過上述熔接接合,可將熔接點和周圍的熱變形最小化,提高熔接性的同時,還可以扼制由於熱變形而引起的上板110和下板130的塑性變形(軟氮化)。這不僅可以維持薄型非定向型均熱板100的原有剛性,還可以使其維持和原來相比較高的彈性。
2, in order to combine the
通過對第一結構面111和第二結構面131的蝕刻製程,可以形成大通道150和微通道170。大通道150和微通道170以相互並排的狀態交替配置。在本實施例中,大通道150具有四個,而微通道170具有三個。微通道170配置在鄰近的一對大通道150之間的位置。
Through the etching process of the
大通道150是通過對第一結構面111和第二結構面131進行蝕刻製程而形成的結構。對第一結構面111和第二結構面131進行蝕刻時的高度可以是相同的。這部分結構形成一個通路,使汽相的運行流體基於熱能從蒸發部EZ(參照圖3)流動至凝結部CZ(參照圖3)。
The
大通道150內部形成有間隔維持凸起115、135。間隔維持凸起115、135是在蝕刻製程中,由未被蝕刻的部分形成。間隔維持凸起115、135分別形成於上板110或者下板130上,可以具有相同的高度。間隔維持凸起115、135
可以防止受到外力而導致上板110和下板130的相互壓縮,使大通道150維持其穩定的形狀。在這裡所指的外力是相對於大通道150內部的真空,從非定向型均熱板100的外部向內部作用的外力。在本附圖中,間隔維持凸起115、135只是概念性地示出,具體的形態參照圖3的內容便可以理解。
大通道150中的最外側通道可以稱為是外側放熱通道155。在位於非定向型均熱板100的最外側的外側放熱通道155的作用下,汽相的運行流體將熱能高效地釋放至外部。外側放熱通道155可以佔據最外側通道的全部,或者是佔據其中一部分。
The outermost channel in the
微通道170也是通過對第一結構面111和第二結構面131的蝕刻製程而形成的結構。微通道170也是類似於上述情形,對第一結構面111和第二結構面131進行蝕刻時的高度可以是相同的。這部分結構是用於形成一個通路,使液相的運行流體受毛細管力的作用,從凝結部CZ返回至蒸發部EZ。為了使毛細管力的作用能夠正常持續下去,微通道170具有比大通道150更細小寬度的溝槽。基於上述毛細管力,液相的運行流體不受重力影響而移動至溝槽之內。在本實施例中,一個微通道170之中形成有2至5個溝槽。
The
現在參照圖3,舉例對實際製造的非定向型均熱板100’增加部分的結構進行說明。圖3是基於圖2所示之非定向型均熱板100的一變化實施例,顯示出製作完成的非定向型均熱板100’的分解圖。
Now referring to Fig. 3, the structure of the additional part of the non-directional heat equalizing plate 100' that is actually manufactured will be described by way of example. Fig. 3 is a modified embodiment of the non-directional
參照圖3,上板110和下板130分別設置為具有四個邊的四角形形狀,外側放熱通道155相對於上板110和下板130的四個邊可以佔據最外側通道的全部。基於上述結構,微通道170由於外側放熱通道155在被圍住的區域內像小島一樣存在。因此,汽相運行的流體所含有的熱能就能更高效地從位於各個邊上的外側放熱通道155釋放至外部。
3, the
間隔維持凸起115、135可以在大通道150內設置有複數個。間隔維持凸起115、135可以大體上以圓柱形形態、四角柱狀形態、半球形等形狀出現。如上所述的間隔維持凸起115、135可以沿一個反向以「之」字形態或者格子形態來配置。因此,汽相的運行流體不會受制於大通道150延長的方向,沿著與上述方向交叉的方向上也可以進行擴散。並且,間隔維持凸起115、135並不是連續凸起延長地形成牆,而是圓柱形等固定形態,因此相比於形成牆的方式,可以確保擁有更大的空間。
A plurality of
現在參照圖4和圖5,針對另一形態的非定向型均熱板200進行說明。圖4是顯示本發明另一實施例的非定向型均熱板200的具體截面圖;圖5是顯示圖4所示之非定向型均熱板200的分解截面圖。
Referring now to FIG. 4 and FIG. 5, another form of
參照圖4與圖5,非定向型均熱板200與上述提及的非定向型均熱板100的基本結構大體上是相同的,但上板210和下板230的結構是相互不對稱的,在這點上存在差異。
4 and 5, the basic structure of the non-directional
首先,上板210相比於下板230具有更厚的厚度。例如,上板210的厚度如果是0.25mm,則下板230的厚度可以是0.1mm。因此,非定向型均熱板200的整體厚度可以薄至0.4mm左右的厚度。進一步來說,上板210或者下板230的寬度可以製作成15~200mm,而長度在40~200mm。一般的銅均熱板為了確保沿重力方向上不受運行特性影響,通過燒結(sintering)製程或者使用毛細結構(wick),但受制於製程無法完成1.0mm以下厚度的製造,目前只是達到2.5mm的水準的產品完成了真正量產並正在市場上銷售。在本實施例中的非定向型均熱板200,其均熱板不足1.0mm,甚至0.4mm厚度及在這個厚度以下的產品都可以確保其運行特性良好。
First, the
由於上板210和下板230的厚度存在差異,因此在其上面為了製造大通道250為微通道270而進行的蝕刻的高度也會有所不同。例如,在上板210如果蝕刻0.17mm的話,在下板230上的蝕刻高度可以是0.05mm。並且,大通道250的寬度如果是4~5mm時,在微通道270上的溝槽寬度可以是0.01~0.1mm。進一步地說,在大通道250上的間隔維持凸起215、235的寬度可以維持在0.3mm~0.5mm之間的水準。
Due to the difference in the thickness of the
最後,參照圖6對其他另一形態的非定向型均熱板300進行詳細說明。圖6是顯示本發明中其他另一實施例的非定向型均熱板300的具體截面圖。
Finally, referring to FIG. 6, another
參照圖6,非定向型均熱板300與上述提及的非定向型均熱板200的基本結構大體上是相同的,但大通道350以及微通道370在下板330的形成上是存在差異的。
6, the basic structure of the non-directional
具體而言,相比於上板310,下板330可以具有更厚的厚度。在這樣的下板330上形成有大通道350和微通道370。為此,只在第二結構面331上完成蝕刻製造相應的大通道350和微通道370可行的。因此,大通道350和微通道370在下板330上可以交替並排配置。
Specifically, compared to the
與下板330不同的是,在上板310上可以形成有刮痕區域390。所述刮痕區域390上形成有比微通道370的溝槽更細小的劃痕溝槽。所述劃痕溝槽與上板310的第一結構面311上的金屬電刷接觸後,在旋轉的機械作用力下形成。在電刷的作用下形成的溝槽是可以毫無方向性的隨機形成的自然形態。劃痕區域390與大通道350和微通道370形成的區域相對應,整體上都形成在第一結構面311上。
Unlike the
基於上述結構,在厚度比較薄的上板310上形成的劃痕區域390的作用下,不僅不增加整體的厚度,還能提高整體的性能。並且,由於劃痕區域390是形成在整體區域上,從大通道350凝結的運行流體通過劃痕區域390迅速向發熱部,或者通過微通道370向發熱部移動。在這樣的情形下,運行流體的蒸發和凝結的循環過程可以更好地進行下去,提高放熱的效率。
Based on the above structure, the
如上所述的非定向型均熱板,並不侷限於上述實施例的結構和運行方式。在上述各個實施例中,對其全部或者一部分進行有選擇性地組合和變化也是可以完成相應功能的。 The above-mentioned non-directional soaking plate is not limited to the structure and operation mode of the above-mentioned embodiment. In each of the above embodiments, all or part of them can be selectively combined and changed to complete the corresponding functions.
100:非定向型均熱板 100: Non-directional soaking plate
110:上板 110: upper board
111:第一結構面 111: The first structural plane
112:第一露出面 112: The first appearance
114,134:熔接槽 114,134: Welding slot
115,135:間隔維持凸起 115, 135: Interval maintenance bump
130:下板 130: lower board
131:第二結構面 131: The second structural surface
132:第二露出面 132: The Second Exposure
150:大通道 150: large channel
155:外側放熱通道 155: Outer heat release channel
170:微通道 170: Micro channel
Claims (9)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR20180140817 | 2018-11-15 | ||
KR10-2019-0136479 | 2019-10-30 | ||
KR1020190136479A KR20200056916A (en) | 2018-11-15 | 2019-10-30 | Non-oriented vapor chamber |
Publications (1)
Publication Number | Publication Date |
---|---|
TW202117258A true TW202117258A (en) | 2021-05-01 |
Family
ID=70914685
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109136738A TW202117258A (en) | 2018-11-15 | 2020-10-22 | Non-oriented vapor chamber |
Country Status (2)
Country | Link |
---|---|
KR (1) | KR20200056916A (en) |
TW (1) | TW202117258A (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112629298A (en) * | 2020-12-02 | 2021-04-09 | 东莞领杰金属精密制造科技有限公司 | Method for preparing vapor chamber and vapor chamber |
KR102620257B1 (en) * | 2021-07-20 | 2024-01-03 | 주식회사 씨지아이 | Vapor chamber and working fluid used therefor |
KR20230128804A (en) | 2022-02-28 | 2023-09-05 | 주식회사 에스씨 | Microchannel Heat Pipe using laser etching |
-
2019
- 2019-10-30 KR KR1020190136479A patent/KR20200056916A/en not_active Application Discontinuation
-
2020
- 2020-10-22 TW TW109136738A patent/TW202117258A/en unknown
Also Published As
Publication number | Publication date |
---|---|
KR20200056916A (en) | 2020-05-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW202117258A (en) | Non-oriented vapor chamber | |
US11384993B2 (en) | Heat pipe | |
TWI768335B (en) | Vapor chamber and manufacturing method of the same | |
TWI398616B (en) | Micro - temperature plate structure improvement | |
JP6741142B2 (en) | Vapor chamber | |
JP6564879B2 (en) | Vapor chamber | |
JP2024016179A (en) | Vapor chamber, electronic apparatus and metal sheet for vapor chamber | |
JP6597892B2 (en) | Loop heat pipe, manufacturing method thereof, and electronic device | |
US10247488B2 (en) | Heat dissipation device | |
KR20200056917A (en) | Non-oriented vapor chamber having wick | |
CA2614471A1 (en) | Heat pipe and method for manufacturing same | |
WO2018221369A1 (en) | Plane-type heat pipe | |
US20170080533A1 (en) | Heat dissipation device manufacturing method | |
JP2009024933A (en) | Thermal diffusion device and manufacturing method for it | |
JP7097308B2 (en) | Wick structure and heat pipe containing the wick structure | |
TW201947180A (en) | Loop vapor chamber conducive to separation of liquid and gas | |
TWI702372B (en) | Vapor chamber and manufacturing method for the same | |
TWM595784U (en) | Vapor chamber device | |
JP7211021B2 (en) | Vapor chamber, sheet for vapor chamber, and method for manufacturing vapor chamber | |
TWI409425B (en) | Heat pipe | |
TWI808404B (en) | Heat exchanger fin and manufacturing method of the same | |
KR101474256B1 (en) | Microchannel-based Heat Pipe and Manufacturing Method Thereof | |
CN112484544A (en) | Non-directional soaking plate | |
WO2019056506A1 (en) | Thin type heat uniformizing plate formed by stamping process | |
TWI773145B (en) | Vapor chamber |