TW202114267A - Lighting module and display device - Google Patents

Abstract

A lighting module includes a circuit board, a light emitting diode, a light guide plate and a glue. The light emitting diode is disposed over the circuit board, and the light emitting diode includes a light emitting side surface and a non-light emitting side surface. The light guide plate is substantially parallel to the circuit board, and a portion of the light guide plate is disposed over the circuit board and is adjacent to the light emitting side surface of the light emitting diode. The glue covers and is in contact with the non-light emitting side surface of the light emitting diode and the portion of the light guide plate.

Description

Illumination module and display device

The invention relates to a lighting module and a display device including the lighting module.

Most of the existing lighting modules do not have a waterproof structure, and are easily affected by water vapor, resulting in short circuits or rusting of circuits. Therefore, how to make the lighting module have good water resistance is an urgent issue in this technical field.

The object of the present invention is to provide a lighting module with good waterproofness and low manufacturing cost. By covering and contacting the non-luminous side of the light-emitting diode and a part of the light-emitting side of the light guide plate adjacent to the light-emitting diode with a filling and curing ability glue material, moisture cannot enter the surroundings of the light-emitting diode Therefore, the lighting module of the present invention has good water resistance. In addition, since only the glue material can make the lighting module have good waterproofness, the manufacturing cost of the lighting module of the present invention is lower than that of lighting modules using multiple waterproof materials.

The invention provides a lighting module, which includes a circuit board, a light-emitting diode, a light guide plate and a glue material. The light-emitting diode is located above the circuit board, and the light-emitting diode includes a light-emitting side surface and a non-light-emitting side surface. The light guide plate is approximately parallel to the circuit board, and a part of the light guide plate is located on the circuit board and is adjacent to the light-emitting side surface of the light-emitting diode. The glue covers and contacts the non-luminous side of the light-emitting diode and the part of the light guide plate.

According to some embodiments of the present invention, the adhesive material covers and contacts the upper surface of the part of the light guide plate.

According to some embodiments of the present invention, the adhesive material further covers and contacts a part of the light-emitting side surface of the light-emitting diode.

According to some embodiments of the present invention, the part of the light guide plate contacts the circuit board.

According to some embodiments of the present invention, the light-emitting diode further includes a non-light-emitting top surface, and the adhesive material does not cover the non-light-emitting top surface of the light-emitting diode.

According to some embodiments of the present invention, the height of the adhesive material covering the non-luminous side of the light-emitting diode is less than or equal to the height of the light-emitting diode.

According to some embodiments of the present invention, the adhesive material is further disposed between the part of the light guide plate and the circuit board.

According to some embodiments of the present invention, the light-emitting diode further includes a non-luminous top surface, and the adhesive material further covers and contacts the non-luminous top surface of the light-emitting diode.

According to some embodiments of the present invention, the adhesive material includes a side surface located on the part of the light guide plate, and the inner angle between the side surface and the upper surface of the part of the light guide plate is less than 90 degrees.

According to some embodiments of the present invention, the glue material is formed by dispensing, gluing, injection molding or hot pressing.

According to some embodiments of the present invention, the adhesive material includes a light-curing resin, a heat-curing resin, a moisture-curing resin or a combination thereof.

According to some embodiments of the present invention, the adhesive material includes silicon resin, epoxy resin, phenolic resin (Novolac), rubber (rubber), polymethylmethacrylate (PMMA), and phenol resin (Phenolic resin). Resin, Polyester, Polyurethane (PU), Polyethylene (PE), Polypropylene (PP), Polystyrene (PS), Acrylonitrile butadiene Acrylonitrile-Butadiene-Styrene (Acrylonitrile-Butadiene-Styrene, ABS), polycarbonate (PC), polyethylene terephthalate (PET), or a combination thereof.

The present invention also provides a display device, including the above-mentioned lighting module and a display panel arranged on a surface of the light guide plate.

The following provides a variety of different embodiments or examples of the present invention to realize the different technical features of the provided subject. The components and designs of the following specific examples are used to simplify the present invention. Of course, these are only examples and are not used to limit the present invention. For example, the specification discloses that the first feature structure is formed above the second feature structure, which includes the embodiment in which the first feature structure and the second feature structure are formed in direct contact, and it is also included in the first feature structure and the second feature structure. There are other embodiments with other characteristic structures between the structures, that is, the first characteristic structure and the second characteristic structure are not in direct contact. In addition, the present invention may use repeated reference symbols and/or words in each example. These repeated symbols or words are for the purpose of simplification and clarity, and are not used to limit the relationship between the various embodiments and/or the structures.

In addition, spatial relative terms, such as "down", "upper", etc., are used to conveniently describe the relative relationship between an element or feature and other elements or features in the drawing. These spatial relative terms are intended to include the different orientations of the device during use or operation in addition to the orientation shown in the diagram. The device can be positioned separately (for example, rotated by 90 degrees or other orientations), and the spatial relative description used herein can also be explained accordingly.

In this specification, "substantially parallel" is defined as the range between two elements being completely parallel to a deviation of ±5°.

The object of the present invention is to provide a lighting module with good waterproofness and low manufacturing cost. By covering and contacting the non-luminous side of the light-emitting diode and a part of the light-emitting side of the light guide plate adjacent to the light-emitting diode with a filling and curing ability glue material, moisture cannot enter the surroundings of the light-emitting diode Therefore, the lighting module of the present invention has good water resistance. In addition, since only the glue material can make the lighting module have good waterproofness, the manufacturing cost of the lighting module of the present invention is lower than that of the lighting module including multiple waterproof materials.

The lighting module of the present invention can be applied to a backlight module or a front light module of a display panel. The light guide plate of the lighting module can be located on the back of the display panel or on the display surface. Several embodiments of the lighting module will be described in detail below.

FIG. 1 is a schematic cross-sectional view of a lighting module according to an embodiment of the invention. As shown in FIG. 1, the lighting module 100 includes a circuit board 110, a light emitting diode 120, a light guide plate 130 and a glue 140.

In some embodiments, the circuit board 110 is a flexible printed circuit board (FPC), a rigid printed circuit board (PCB), or a combination thereof. In some embodiments, the circuit board 110 includes one or more insulating layers, one or more metal layers, and one or more circuit layers.

The light emitting diode 120 is located above the circuit board 110. The light-emitting diode 120 has a light-emitting side surface 120a and a non-light-emitting side surface 120b. In some embodiments, the light-emitting diode 120 has a light-emitting side surface 120a and a plurality of non-light-emitting side surfaces. The first figure shows the non-light-emitting side surface 120b opposite to the light-emitting side surface 120a.

In some embodiments, the lighting module 100 includes a plurality of light-emitting diodes (Figure 1 only shows a cross-section of one of the light-emitting diodes 120), and the circuit board 110 and the light-emitting diodes The pole body constitutes the light bar.

The light guide plate 130 is substantially parallel to the circuit board 110. A portion 130 a of the light guide plate 130 is adjacent to the light emitting side surface 120 a of the light emitting diode 120. The portion 130a of the light guide plate 130 may also be referred to as the front edge portion. In some embodiments, as shown in FIG. 1, the portion 130 a of the light guide plate 130 contacts the circuit board 110.

In some embodiments, the light emitting diode 120 has at least one contact (not shown), and the contact can also be referred to as a soldering point. In some embodiments, the contact point of the light-emitting diode 120 is between the bottom surface of the light-emitting diode 120 and the circuit board 110. The contacts contain metallic materials and are easily damaged by moisture. Therefore, in the present invention, the adhesive material 140 with good filling ability and curing ability is used to cover and contact the non-luminous side 120b of the light-emitting diode 120 and the part 130a of the light guide plate 130 adjacent to the light-emitting side 120a of the light-emitting diode 120. The moisture cannot enter the surroundings of the light-emitting diode 120, so that the contacts can be effectively prevented from being damaged by moisture.

In some embodiments, the glue 140 can be formed by dispensing, coating, injection molding, or thermocompression molding.

In some embodiments, the glue dispensing method is to use syringe injection or inkjet to make the fluid glue adhere to the substrate 110, the light guide plate 130, and/or the light emitting diode 120, and then solidify to form胶料140。 Plastic 140.

In some embodiments, the glue application method is to make the fluid glue material adhere to the substrate 110, the light guide plate 130, and/or the light emitting diode 120 by screen printing, and then solidify to form the glue material 140.

In some embodiments, the injection molding method is to inject fluidized glue onto the substrate 110, the light guide plate 130, and/or the light emitting diode 120 in a low-pressure injection manner, and form the glue 140 after cooling.

The hot press molding method can also be referred to as compression molding. In some embodiments, the hot pressing method is to first obtain a sheet-shaped glue material, place it on the substrate 110, the light guide plate 130, and/or the light-emitting diode 120 after hot pressing and melting, and form the glue material 140 after cooling.

In some embodiments, the glue 140 is a transparent glue. In some embodiments, the adhesive material 140 includes a light curing resin (for example, an ultraviolet light curing resin, an infrared light curing resin, or a visible light curing resin), a heat curing resin, a moisture curing resin, or a combination thereof.

In some embodiments, the adhesive material 140 includes silicon resin, epoxy resin, phenolic resin (Novolac), rubber (rubber), polymethylmethacrylate (PMMA), and phenol resin (Phenolic resin). Resin, Polyester, Polyurethane (PU), Polyethylene (PE), Polypropylene (PP), Polystyrene (PS), Acrylonitrile butadiene Acrylonitrile-Butadiene-Styrene (ABS), Polycarbonate (PC), Polyethylene terephthalate (PET), but not limited to these.

In some embodiments, as shown in FIG. 1, the height H1 of the light emitting diode 120 is greater than or equal to the height H2 of the light guide plate 130. In some embodiments, the height H1 of the light emitting diode 120 and the height H2 of the light guide plate 130 are between 5:1 and 1:1. In some embodiments, the height H1 of the light emitting diode 120 is between 0.2 mm and 0.5 mm, and the height H2 of the light guide plate 130 is between 0.1 mm and 0.4 mm.

In some embodiments, as shown in FIG. 1, the adhesive material 140 covers and contacts the upper surface of the portion 130 a of the light guide plate 130 adjacent to the light-emitting side 120 a of the light-emitting diode 120. In some embodiments, the glue 140 further covers and contacts a part of the light-emitting side surface 120 a of the light-emitting diode 120.

In some embodiments, as shown in FIG. 1, the height H3 of the adhesive material 140 covering the non-luminous side surface 120b of the light-emitting diode 120 is less than or equal to the height H1 of the light-emitting diode 120. In some embodiments, the height H3 of the glue 140 covering the non-luminous side 120b of the light-emitting diode 120 is between 0.3 mm and 0.5 mm. In some embodiments, as shown in FIG. 1, the light-emitting diode 120 further includes a non-light-emitting top surface 120 c, and the adhesive material 140 does not cover the non-light-emitting top surface 120 c of the light-emitting diode 120.

FIG. 2 is a schematic cross-sectional view of a lighting module according to another embodiment of the invention. The difference between the embodiment in FIG. 2 and the embodiment in FIG. 1 is that the glue 140 is further disposed between the portion 130a (that is, the front edge portion) of the light guide plate 130 and the circuit board 110, and the glue 140 further covers and Contact with the non-emitting top surface 120c of the light-emitting diode 120. In some embodiments, the lighting module 100 further includes a double-sided adhesive tape 150, the double-sided adhesive tape 150 is disposed between the portion 130 a of the light guide plate 130 and the circuit board 110, and the double-sided adhesive tape 150 is adjacent to the adhesive 140.

FIG. 3 is a schematic cross-sectional view of a lighting module according to another embodiment of the invention. The difference between the embodiment in FIG. 3 and the embodiment in FIG. 1 is that the adhesive 140 has a side surface 140a located on the portion 130a (ie, the front edge portion) of the light guide plate 130, and the side surface 140a and the portion 130a of the light guide plate 130 The inner included angle α between the upper surfaces is less than 90 degrees. In some embodiments, a part of the light emitted by the light-emitting diode 120 does not enter the light guide plate 130, but enters the glue 140. This part of the light can be reflected by the inclined side surface 140a and enter the light guide plate 130, so that The lighting module of the present invention has good optical performance.

FIG. 4 is a schematic cross-sectional view of a lighting module according to another embodiment of the invention. The difference between the embodiment in FIG. 4 and the embodiment in FIG. 2 is that the adhesive 140 has a side surface 140a located on the portion 130a (ie the front edge portion) of the light guide plate 130, and the side surface 140a is connected to the portion 130a of the light guide plate 130. The inner included angle α between the upper surfaces is less than 90 degrees. In some embodiments, a part of the light emitted by the light-emitting diode 120 does not enter the light guide plate 130, but enters the glue 140. This part of the light can be reflected by the inclined side surface 140a and enter the light guide plate 130, so that The lighting module of the present invention has good optical performance.

The invention also provides a display device. FIG. 5 is a schematic cross-sectional view of a display device according to an embodiment of the invention. As shown in FIG. 5, the display device includes a lighting module 100 and a display panel 200 disposed on a surface 1301 of the light guide plate 130. In some embodiments, the display device further includes a protective layer 300.

The lighting module 100 may be the lighting module shown in FIGS. 1 to 4, for example. The lighting module 100 shown in FIG. 5 is based on the lighting module 100 shown in FIG. 1 as an example.

The display panel 200 is disposed on the surface 1301 of the light guide plate 130. In some embodiments, the display panel 200 is a liquid crystal display panel (Liquid crystal display panel), an organic light-emitting display panel (Organic light-emitting display panel), an electrowetting display panel (Electrowetting display panel), a reflective display panel (Reflective display panel) panel) or electrophoretic display panel (Electrophoretic display panel).

In some embodiments, the display panel 200 is disposed on the surface 1301 of the light guide plate 130 through the adhesive layer 402. In some embodiments, the adhesive layer 402 is an optically clear adhesive (OCA).

The protective layer 300 is disposed on the other surface 1302 of the light guide plate 130. The surface 1302 and the surface 1301 are opposite to each other. In some embodiments, the protective layer 300 is an anti-glare film (AG film) or a cover lens. In some embodiments, the protective layer 300 is disposed on the surface 1302 of the light guide plate 130 through the adhesive layer 404. In some embodiments, the glue layer 404 is an optical glue.

As shown in FIG. 5, since the front edge portion of the light-emitting diode 120 and the light guide plate 130 is covered by the glue 140 in the lighting module 100, the light-emitting diode 120 can be effectively prevented from being damaged by moisture.

The above briefly mentioned the features of various embodiments, so those familiar with the art can better understand the various aspects of the present invention. Those familiar with the art should realize that in order to achieve the same purpose and/or achieve the same advantages of the embodiments presented here, they can easily use the present invention as a basis for designing or modifying other manufacturing processes and structures. Those familiar with the art should also understand that these equal structures do not depart from the spirit and scope of the present invention, and that people can make various changes, substitutions, and substitutions here without departing from the spirit and scope of the present invention.

100: lighting module 110: circuit board 120: LED 120a: illuminated side 120b: non-luminous side 120c: non-luminous top surface 130: light guide plate 130a: part of the light guide plate 1301, 1302: surface 140: plastic 140a: side 150: Double-sided tape 200: display panel 300: protective layer 402, 404: Adhesive layer H1, H2, H3: height α: internal angle

In order to make the above and other objectives, features, advantages and embodiments of the present invention more obvious and understandable, please read the following detailed description and match the corresponding drawings: FIG. 1 is a schematic cross-sectional view of a lighting module according to an embodiment of the invention. FIG. 2 is a schematic cross-sectional view of a lighting module according to another embodiment of the invention. FIG. 3 is a schematic cross-sectional view of a lighting module according to another embodiment of the invention. FIG. 4 is a schematic cross-sectional view of a lighting module according to another embodiment of the invention. FIG. 5 is a schematic cross-sectional view of a display device according to an embodiment of the invention.

Domestic deposit information (please note in the order of deposit institution, date and number) no Foreign hosting information (please note in the order of hosting country, institution, date and number) no

100: lighting module

110: circuit board

120: LED

120a: illuminated side

120b: non-luminous side

120c: non-luminous top surface

130: light guide plate

130a: part of the light guide plate

140: plastic

H1, H2, H3: height

Claims (13)

A lighting module includes: A circuit board; A light-emitting diode located above the circuit board, the light-emitting diode including a light-emitting side surface and a non-light-emitting side surface; A light guide plate approximately parallel to the circuit board, wherein a part of the light guide plate is located on the circuit board and is adjacent to the light-emitting side surface of the light-emitting diode; and A glue material covers and contacts the non-luminous side surface of the light-emitting diode and the part of the light guide plate. The lighting module according to claim 1, wherein the adhesive material covers and contacts an upper surface of the part of the light guide plate. The lighting module according to claim 1, wherein the glue material further covers and contacts a part of the light-emitting side surface of the light-emitting diode. The lighting module according to claim 1, wherein the part of the light guide plate contacts the circuit board. The lighting module according to claim 1, wherein the light-emitting diode further includes a non-luminous top surface, and the adhesive material does not cover the non-luminous top surface of the light-emitting diode. The lighting module according to claim 1, wherein a height of the adhesive material covering the non-luminous side of the light-emitting diode is less than or equal to a height of the light-emitting diode. The lighting module according to claim 1, wherein the adhesive material is further disposed between the part of the light guide plate and the circuit board. The lighting module according to claim 1, wherein the light-emitting diode further includes a non-luminous top surface, and the adhesive material further covers and contacts the non-luminous top surface of the light-emitting diode. The lighting module according to claim 1, wherein the adhesive material includes a side surface on the part of the light guide plate, and an inner angle between the side surface and an upper surface of the part of the light guide plate is less than 90 degrees. The lighting module according to claim 1, wherein the glue is formed by dispensing, gluing, injection molding or hot pressing. The lighting module according to claim 1, wherein the adhesive material comprises a light-curing resin, a heat-curing resin, a moisture-curing resin or a combination thereof. The lighting module according to claim 1, wherein the adhesive material includes silicon resin, epoxy resin, phenolic resin (Novolac), rubber (rubber), polymethylmethacrylate (PMMA) ), Phenolic Resin, Polyester, Polyurethane (PU), Polyethylene (PE), Polypropylene (PP), Polystyrene (PS) , Acrylonitrile-Butadiene-Styrene (Acrylonitrile-Butadiene-Styrene, ABS), Polycarbonate (PC), Polyethylene terephthalate (PET) or a combination thereof. A display device includes: The lighting module described in claim 1; and A display panel is arranged on a surface of the light guide plate.

Images