CN112524585B - Waterproof light-emitting module - Google Patents

Waterproof light-emitting module Download PDF

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Publication number
CN112524585B
CN112524585B CN201910874714.8A CN201910874714A CN112524585B CN 112524585 B CN112524585 B CN 112524585B CN 201910874714 A CN201910874714 A CN 201910874714A CN 112524585 B CN112524585 B CN 112524585B
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China
Prior art keywords
waterproof layer
light emitting
waterproof
light
top surface
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CN201910874714.8A
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CN112524585A (en
Inventor
许财维
严智清
任欣豪
游钦祺
陈执群
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E Ink Holdings Inc
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E Ink Holdings Inc
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Priority to CN201910874714.8A priority Critical patent/CN112524585B/en
Priority to TW109132030A priority patent/TWI751708B/en
Publication of CN112524585A publication Critical patent/CN112524585A/en
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00—Gas-tight or water-tight arrangements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V2200/00—Use of light guides, e.g. fibre optic devices, in lighting devices or systems
    • F21V2200/20—Use of light guides, e.g. fibre optic devices, in lighting devices or systems of light guides of a generally planar shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Planar Illumination Modules (AREA)

Abstract

The invention discloses a waterproof light-emitting module which comprises a circuit board, a light-emitting diode, a light guide plate, a first waterproof layer, a second waterproof layer and a third waterproof layer. The light emitting diode is positioned on the circuit board and provided with a light emitting surface, a first non-light emitting surface and a second non-light emitting surface. The light emitting surface is opposite to the first non-light emitting surface. The second non-light emitting surface is positioned between the light emitting surfaces and the first non-light emitting surface. The center of the light guide plate is substantially opposite to the center of the Ji Yufa light diode in a direction perpendicular to the light emitting surface. The light emitting diode is positioned between the first waterproof layer and the light guide plate. The second waterproof layer covers the second non-luminous surface. The third waterproof layer is positioned between the second waterproof layer and the light guide plate. The light emitting surface of the light emitting diode is transmitted to the light guide plate, and has little or no light loss.

Description

Waterproof light-emitting module
Technical Field
The invention relates to a waterproof light-emitting module.
Background
Most of the existing light-emitting modules have no waterproof structure and are easily affected by water vapor, so that a circuit is short-circuited or corroded. Therefore, how to improve the light emitting module and the display device using the same to make the light emitting module have good waterproof performance is a subject to be improved in the art.
The light emitting module generally includes a light guide plate for receiving light from a light source disposed on the circuit board and redistributing the light more uniformly. In some cases, the light guide plate is assembled to the circuit board with an adhesive material. However, in order to align the center of the light source with the center of the light guide plate for optimal light utilization, the interval between the light guide plate and the circuit board needs to be controlled so that the adhesive material may have insufficient thickness, resulting in failure to secure the light guide plate and the circuit board.
Disclosure of Invention
The invention aims to provide a waterproof light-emitting module with little or no light loss.
According to an embodiment of the invention, a waterproof light-emitting module comprises a circuit board, a light-emitting diode, a first waterproof layer, a second waterproof layer and a third waterproof layer. The light emitting diode is positioned above the circuit board and is provided with a light emitting surface, a first non-light emitting surface and a second non-light emitting surface, wherein the light emitting surface is opposite to the first non-light emitting surface, and the second non-light emitting surface is positioned between the light emitting surface and the first non-light emitting surface. The light guide plate is adjacent to the light emitting surface of the light emitting diode, and the center of the light guide plate is substantially opposite to the center of the Ji Yufa light emitting diode along the direction perpendicular to the light emitting surface. The light emitting diode is positioned between the first waterproof layer and the light guide plate. The second waterproof layer covers the second non-luminous surface of the light-emitting diode. The third waterproof layer is positioned between the second waterproof layer and the light guide plate.
According to an embodiment of the invention, the first waterproof layer is adhered to the second waterproof layer and the circuit board.
According to an embodiment of the invention, the first waterproof layer contacts the second waterproof layer and the circuit board.
According to an embodiment of the invention, the second waterproof layer is covered above the first waterproof layer and the third waterproof layer.
According to an embodiment of the invention, the light emitting diode is located between the first waterproof layer and the third waterproof layer.
According to an embodiment of the invention, the first waterproof layer is located between the circuit board and the second waterproof layer.
According to an embodiment of the present invention, the first waterproof layer has a top surface and a bottom surface opposite to the top surface, and at least one of the top surface and the bottom surface has adhesiveness.
According to an embodiment of the present invention, the second waterproof layer has a top surface and a bottom surface opposite to the top surface, and at least one of the top surface and the bottom surface has adhesiveness.
According to an embodiment of the present invention, the second waterproof layer has a top surface and a bottom surface opposite to the top surface, and at least one of the top surface and the bottom surface has non-tackiness.
According to an embodiment of the present invention, the third waterproof layer has a top surface and a bottom surface opposite to the top surface, and at least one of the top surface and the bottom surface has adhesiveness.
According to an embodiment of the present invention, the thickness of the third waterproof layer is approximately in the range of 0.1 mm to 0.3 mm.
According to an embodiment of the invention, the waterproof light emitting module further includes a fourth waterproof layer. The fourth waterproof layer is positioned below the circuit board and the light guide plate, and the top surface of the fourth waterproof layer is adhered to the circuit board and the light guide plate.
According to an embodiment of the invention, the waterproof light emitting module further includes a fifth waterproof layer, a sixth waterproof layer, and a seventh waterproof layer. The fifth waterproof layer is positioned below the circuit board and the light guide plate. The sixth waterproof layer is positioned between the circuit board and the fifth waterproof layer. The seventh waterproof layer is positioned between the light guide plate and the fifth waterproof layer.
According to an embodiment of the present invention, the fifth waterproof layer has a top surface and a bottom surface opposite to the top surface, and at least one of the top surface and the bottom surface has adhesiveness.
According to an embodiment of the present invention, the fifth waterproof layer has a top surface and a bottom surface opposite to the top surface, and at least one of the top surface and the bottom surface has non-tackiness.
According to an embodiment of the present invention, the sixth waterproof layer has a top surface and a bottom surface opposite to the top surface, and at least one of the top surface and the bottom surface has adhesiveness.
According to an embodiment of the present invention, the seventh waterproof layer has a top surface and a bottom surface opposite to the top surface, and at least one of the top surface and the bottom surface has adhesiveness.
Embodiments of the present invention provide a waterproof light emitting module having a first waterproof layer, a second waterproof layer, and a third waterproof layer, wherein the center (e.g., geometric center) of a light guide plate is substantially opposite to the center of a Ji Yufa light emitting diode along a direction perpendicular to the light emitting surface, so that light is transmitted from the light emitting surface of the light emitting diode to the light guide plate with little or no light loss. Accordingly, desired optical characteristics of the waterproof light emitting module may be maintained. Further, the third waterproof layer is thick enough to provide tight adhesion between the light guide plate and the second waterproof layer. Therefore, the light emitting diode and the circuit board can be firmly fixed on the light guide plate. In other words, the light emitting diode and the circuit board can be prevented from falling off the light guide plate. The waterproof light-emitting module further comprises fifth, sixth and seventh waterproof layers for preventing moisture in the environment from entering the light-emitting diode.
Drawings
The foregoing and other objects, features, advantages and embodiments of the invention will be apparent from the following description taken in conjunction with the accompanying drawings in which:
fig. 1 is a schematic top view of a waterproof led device according to various embodiments of the present invention.
FIG. 2 is a schematic cross-sectional view of a waterproof LED device according to various embodiments of the present invention along the section line 2-2' of FIG. 1.
Fig. 3 is a schematic cross-sectional view of a waterproof led device according to various embodiments of the present invention.
Fig. 4 is a schematic cross-sectional view of a waterproof led device according to various embodiments of the present invention.
Fig. 5 to 14 are schematic cross-sectional views of waterproof light emitting modules according to various embodiments of the invention.
Fig. 15 is a schematic cross-sectional view of a waterproof display device according to various embodiments of the invention.
Fig. 16 is a schematic cross-sectional view of a waterproof light emitting module according to an embodiment of the present invention.
Fig. 17 is a schematic cross-sectional view of a waterproof light emitting module according to an embodiment of the present invention.
Fig. 18 is a schematic cross-sectional view of a waterproof light emitting module according to an embodiment of the present invention.
The main reference numerals illustrate:
2-2' -section line, 110, 210-circuit board, 120, 220-light emitting diode, 122-contact, 120e, 220 e-light emitting surface, 2201-first non-light emitting surface, 2202-second non-light emitting surface, 130, 230-waterproof layer, 132-first waterproof layer, 134-second waterproof layer, 136-third waterproof layer, 138-fourth waterproof layer, 200-waterproof light emitting module, 200a, 200b, 200C-waterproof light emitting module, 232-adhesive, 232D-double-sided tape, 232 s-single-sided tape, 234-substrate, 234 a-concave portion, 240-light guide plate, 240 a-concave portion, 300-display panel, 310-circuit board, 320-light emitting diode, 320 e-light emitting surface, 340-light guide plate, 400-protective layer, 502, 504-glue layer, 600-first waterproof layer, 602-second waterproof layer, 604-third waterproof layer, 606-fourth waterproof layer, 608-fifth waterproof layer, 610-sixth waterproof layer, 612-seventh waterproof layer, 2401-first surface, 2402-second surface, 3201-first non-luminous surface, 3202-second non-luminous surface, 3203-third non-luminous surface, 6001-top surface, 6002-bottom surface, 6021-top surface, 6022-bottom surface, 6041-top surface, 6042-bottom surface, 6061-top surface, 6081-top surface, 6082-bottom surface, 6101-top surface, 6102-bottom surface, 6121-top surface, 6122-bottom surface, C1-center, C2-center, D1-direction, T1-thickness, T2-thickness, t3-thickness, T4-thickness, T5-thickness, T1-thickness, T2-thickness.
Detailed Description
The following provides a number of different embodiments or examples of the invention to achieve the different technical features of the provided subject matter. The elements and designs of the following specific examples are presented to simplify the present invention. These are, of course, merely examples and are not intended to limit the invention from that described above. For example, embodiments in which a first feature is formed above a second feature are disclosed in the specification as including embodiments in which the first feature is formed in direct contact with the second feature, as well as embodiments in which other features are provided between the first feature and the second feature, i.e., the first feature is not in direct contact with the second feature. Furthermore, repeated reference characters and/or words may be used in various examples of the invention. These repeated symbols or words are for simplicity and clarity and are not intended to limit the relationship between the various embodiments and/or structures described.
In addition, spatially relative terms, such as "lower," "upper," and the like, may be used for convenience in describing the relative relationship of one element or feature to another element or feature in the drawings. These spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise positioned (e.g., rotated 90 degrees or other orientations) and the spatially relative descriptors used herein interpreted accordingly.
The invention provides a waterproof light-emitting diode device. The waterproof layer is arranged to cover the contact points of the light-emitting diode, so that the contact points can be effectively prevented from being damaged by water and gas. Various embodiments of the waterproof light emitting diode device will be described in detail below.
Fig. 1 is a schematic top view of a waterproof led device according to various embodiments of the present invention. The waterproof led device includes a circuit board 110, leds 120, and a waterproof layer 130. The waterproof LED device can also be called a waterproof light bar. It should be noted that although fig. 1 shows the waterproof layer 130 covering the contacts of the single led 120, it will be understood by those skilled in the art that the contacts of a plurality of leds can be covered at the same time by extending the structure of the waterproof layer.
In some embodiments, the circuit board 110 is a flexible printed circuit board (flexible printed circuit, FPC), a rigid printed circuit board (printed circuit board, PCB), or a combination thereof.
The light emitting diode 120 is located above the circuit board 110. The light emitting diode 120 may be top-emitting or side-emitting. In some embodiments, the light emitting diode is side-emitting, having a light emitting face 120e, as shown in FIG. 1. The light emitting diode 120 has at least one contact 122. The contact 122 may also be referred to as a solder joint. In some embodiments, the contact 122 of the light emitting diode 120 is interposed between the bottom surface of the light emitting diode 120 and the circuit board 110.
The contact 122 contains metal material and is vulnerable to moisture. Therefore, the present invention provides the waterproof layer 130 to cover the contact 122 of the led 120, so as to prevent the contact 122 from being damaged by moisture. In some embodiments, the waterproof layer 130 comprises an adhesive material, a single-sided tape, a double-sided tape, a plastic substrate, or a combination thereof. In some embodiments, the plastic substrate comprises Polyimide (PI), polyethylene terephthalate (Polyethylene Terephthalate, PET), polytetrafluoroethylene (Teflon), liquid crystal polymer (Liquid Crystal Polymer, LCP), polyethylene (PE), polypropylene (PP), polystyrene (PS), polyvinylchloride (Polyvinyl Chloride, PVC), nylon (Nylon or Polyamides), polymethyl methacrylate (PMMA), ABS plastic (Acrylonitrile-Butadiene-Styrene), phenolic resin (Phenolic Resins), epoxy resin (Epoxy), polyester (Silicone), polyurethane (PU), polyamide-imide (PAI), or combinations thereof, but is not limited thereto.
FIG. 2 is a schematic cross-sectional view of a waterproof LED device according to various embodiments of the present invention along the section line 2-2' of FIG. 1. As shown in fig. 2, the waterproof layer 130 surrounds and connects the contacts 122 of the light emitting diode 120 to prevent the contacts 122 from being damaged by moisture. In some embodiments, the waterproof layer 130 includes an adhesive material covering the entire contact 122, but the adhesive material does not cover the entire led 120. In some embodiments, the waterproof layer 130 is not connected to the light emitting surface 120e of the led 120, so that the light emitting characteristics of the led 120 are not affected.
Fig. 3 is a schematic cross-sectional view of a waterproof led device according to various embodiments of the present invention. As shown in fig. 3, the waterproof layer 130 surrounds but does not connect the contacts of the trigger diode 120. The waterproof layer 130 includes a first waterproof layer 132, a second waterproof layer 134 and a third waterproof layer 136, which form a closed space. In detail, the first waterproof layer 132 adheres to the circuit board 110 and surrounds the contacts 122. The second waterproof layer 134 is located above the first waterproof layer 132. For the above viewing angle (not shown), the second waterproof layer 134 surrounds the partial led 120. The third waterproof layer 136 adheres to the second waterproof layer 134 and the top surface of the light emitting diode 120.
In some embodiments, the first waterproof layer 132 is a double sided tape, an adhesive tape, or a combination thereof. In some embodiments, the second waterproof layer 134 is a plastic substrate. In some embodiments, the upper and lower surfaces of the plastic substrate are non-tacky. In other embodiments, the plastic substrate may be replaced with other waterproof substrates, such as metal substrates or alloy substrates. In some embodiments, the third waterproof layer 136 is a single sided tape.
Fig. 4 is a schematic cross-sectional view of a waterproof led device according to various embodiments of the present invention. As shown in fig. 4, the waterproof layer 130 surrounds the entire light emitting diode 120. The waterproof layer 130 includes a first waterproof layer 132, a second waterproof layer 134, a third waterproof layer 136 and a fourth waterproof layer 138, which form a closed space. In detail, the first waterproof layer 132 adheres to the circuit board 110 and surrounds the entire light emitting diode 120. The second waterproof layer 134 and the fourth waterproof layer 138 are located above the first waterproof layer 132. For the above viewing angle (not shown), the second waterproof layer 134 and the fourth waterproof layer 138 form a ring shape surrounding the entire led 120. The third waterproof layer 136 adheres to the top surfaces of the second waterproof layer 134, the fourth waterproof layer 138, and the light emitting diode 120. In other embodiments (not shown), the third waterproof layer is adhered to the second waterproof layer and the fourth waterproof layer, but not adhered to the top surface of the light emitting diode.
In some embodiments, the first waterproof layer 132 is a double-sided tape, an adhesive material, or a combination thereof, and the adhesive material may be a waterproof adhesive. In some embodiments, the second waterproof layer 134 is a plastic substrate. The second waterproof layer 134 may be transparent or opaque. In some embodiments, the fourth waterproof layer 138 is a transparent plastic substrate. In some embodiments, the fourth waterproof layer 138 is made of polymethyl methacrylate. The fourth waterproof layer 138 may or may not contact the light emitting surface 120e. In some embodiments, the third waterproof layer 136 is a single sided tape. In other embodiments (not shown), the second waterproof layer, the third waterproof layer and the fourth waterproof layer are made of the same material, and form an integrally formed waterproof shell. The waterproof housing may or may not contact the top surface of the trigger diode.
As shown in fig. 1 to 4, the waterproof layer 130 covers the contact 122 or the entire led 120, so that ambient moisture cannot contact the contact 122, and the contact 122 is prevented from being damaged by moisture.
The invention further provides a waterproof light-emitting module. The light emitting module can be applied to a backlight module or a front light module. In detail, the light emitting module includes a light guide plate. The light guide plate may be located on the back surface of the display panel or on the display surface. Various embodiments of the waterproof lighting module will be described in detail below.
Fig. 5 to 14 are schematic cross-sectional views of waterproof light emitting modules according to various embodiments of the invention. The waterproof light-emitting module comprises a circuit board 210, a light-emitting diode 220, a light guide plate 240 and a waterproof layer 230. The waterproof layer 230 is selected from the group consisting of an adhesive material, a single-sided tape, a double-sided tape, a base material, a concave portion of a light guide plate, a portion of a circuit board, and a combination thereof. The substrate may be a plastic substrate, a metal substrate, an alloy substrate, other suitable waterproof substrate, or a combination thereof. In some embodiments (not shown), the waterproof light emitting module includes a plurality of leds, and the circuit board and the leds form a light bar. For clarity, fig. 5-14 only show a single led 220.
Referring to fig. 5, the waterproof light emitting module includes a circuit board 210, a light emitting diode 220, a light guide plate 240 and a waterproof layer 230.
The light emitting diode 220 is located above the circuit board 210. In some embodiments, the light emitting diode 220 is side-emitting. The light emitting diode 220 has a light emitting surface 220e, a first non-light emitting surface 2201, and a second non-light emitting surface 2202. The light emitting surface 220e and the first non-light emitting surface 2201 are opposed to each other, and the second non-light emitting surface 2202 is connected between the light emitting surface 220e and the first non-light emitting surface 2201. As shown in fig. 5, the second non-light emitting surface 2202 may also be referred to as a top surface.
The light guide plate 240 abuts the light emitting surface 220e of the light emitting diode 220. In some embodiments, the light guide plate 240 is fixed on the circuit board 210. In some embodiments, the light guide plate 240 is fixed to the circuit board 210 by a double-sided adhesive tape 232 d.
It is noted that the waterproof layer 230 of fig. 5 includes an adhesive 232 and a substrate 234. The adhesive 232 contacts the circuit board 210 and covers the first non-light emitting surface 2201 of the light emitting diode 220. The substrate 234 contacts the adhesive 232 and encapsulates the second non-light emitting surface 2202 of the light emitting diode 220. In some embodiments, the waterproof layer 230 further includes a double-sided tape 232d, and the substrate 234 is fixed on the light guide plate 240 by the double-sided tape 232 d. In other embodiments, the adhesive 232 may be replaced with a double-sided tape.
Next, please refer to fig. 6. As shown in fig. 6, the waterproof layer 230 includes a single-sided tape 232s, a double-sided tape 232d, and a base 234. The substrate 234 is secured to the circuit board 210 by double-sided tape 232 d. The substrate 234 covers the first non-light emitting surface 2201 of the light emitting diode 220, and the single-sided tape 232s contacts the substrate 234 and covers the second non-light emitting surface 2202 of the light emitting diode 220. In some embodiments, the single-sided tape 232s also covers a surface (not labeled) of the light guide plate 240.
As for fig. 7, it is similar to fig. 6. The difference between the two is that the waterproof layer 230 of fig. 7 further includes another double-sided tape 232d, which is located between the single-sided tape 232s and the light guide plate 240. In other embodiments, the other double-sided tape 232d may be replaced with a single-sided tape or an adhesive.
As for fig. 8, it is similar to fig. 6. The difference is that the substrate 234 of fig. 8 also covers the light emitting surface 220e of the light emitting diode 220. In other words, the substrate 234 is interposed between the light emitting surface 220e of the light emitting diode 220 and the light guide plate 240.
Next, referring to fig. 9, the waterproof layer 230 includes a double-sided tape 232d and a substrate 234. The substrate is secured to the circuit board 210 by double-sided tape 232 d. The substrate 234 has a recessed portion 234a. The concave portion 234a covers the light emitting surface 220e of the light emitting diode 220 in addition to the first non-light emitting surface 2201 and the second non-light emitting surface 2202 of the light emitting diode 220. In some embodiments, the recessed portion 234a is coupled to the light emitting surface 220e of the light emitting diode 220. In some embodiments, the waterproof layer 230 further includes a single-sided tape 232s contacting the substrate 234 and covering a surface (not shown) of the light guide plate 240. In some embodiments, another double-sided tape 232d is positioned between the single-sided tape 232s and the light guide plate 240. In other embodiments (not shown), the other double-sided tape 232d may be replaced with a single-sided tape or an adhesive material.
As for fig. 10, it is similar to fig. 9. The difference is that the top surface (not shown) of the substrate 234 of fig. 10 is sloped. In detail, the top surface of the substrate 234 extends obliquely upward from a side close to the light guide plate 240 to a side far from the light guide plate 240. In some embodiments, the single-sided tape 232s directly contacts a surface (not labeled) of the light guide plate 240.
Next, referring to fig. 11, the waterproof layer 230 includes a double-sided tape 232d and a concave portion 240a of the light guide plate 240. The light guide plate 240 is fixed to the circuit board 210 by a double-sided tape 232 d. The concave portion 240a of the light guide plate 240 covers the light emitting surface 220e of the light emitting diode 220 in addition to the first and second non-light emitting surfaces 2201 and 2202 of the light emitting diode 220. In some embodiments, the waterproof layer 230 further includes a single-sided tape 232s covering a surface (not labeled) of the light guide plate 240.
As for fig. 12, it is similar to fig. 11. The difference is that the top surface (not shown) of the light guide plate 240 of fig. 12 is inclined. In detail, the top surface of the light guide plate 240 extends obliquely upward from the side close to the light emitting surface 220e to the side opposite to the light emitting surface 220e.
Referring to fig. 13, the waterproof layer 230 includes a double-sided tape 232d and a portion 210a of the circuit board 210. As shown in fig. 13, the circuit board 210 is concavely folded into a U shape, and the portion 210a of the circuit board 210 is L-shaped. The L-shaped portion 210a covers the first non-light emitting surface 2201 and the second non-light emitting surface 2202 of the light emitting diode 220. The end of the portion 210a is fixed to the light guide plate 240 by a double-sided tape 232 d. In other embodiments, the extending portion 210a of the circuit board may be concavely folded into any shape, so long as the first non-light emitting surface 2201 and the second non-light emitting surface 2202 of the light emitting diode 220 can be covered.
Referring to fig. 14, the led 220 is located above the circuit board 210, and the led 220 emits light. The light emitting diode 220 has a light emitting surface 220e, a first non-light emitting surface 2201, and a second non-light emitting surface 2202. The first non-light emitting surface 2201 and the second non-light emitting surface 2202 are opposed to each other, and the light emitting surface 220e is connected between the first non-light emitting surface 2201 and the second non-light emitting surface 2202. The light emitting surface 220e may also be referred to as a top surface. The light guide plate 240 abuts the light emitting surface 220e of the light emitting diode 220.
As shown in fig. 14, the waterproof layer 230 includes a double-sided tape 232d and a substrate 234. The substrate 234 is concavely folded into a U-shape. The substrate 234 covers the bottom surface (not shown) of the circuit board 210 in addition to the first non-light emitting surface 2201 and the second non-light emitting surface 2202 of the light guide plate 240. The two ends of the base material 234 are fixed to both sides (not shown) of the light guide plate 240 by double-sided adhesive tapes 232 d. In other embodiments, the substrate 234 may be concavely folded into any shape as long as it can cover the first non-light emitting surface 2201, the second non-light emitting surface 2202, and the circuit board 210 of the light emitting diode 220.
As shown in fig. 5 to 14, the light emitting diode 220 is completely covered by the waterproof layer 230, so that the light emitting diode 220 is prevented from being damaged by moisture.
The invention further provides a waterproof display device. Fig. 15 is a schematic cross-sectional view of a waterproof display device according to various embodiments of the invention. As shown in fig. 15, the waterproof display device includes a waterproof light emitting module 200, a display panel 300, and a protective layer 400.
The waterproof light emitting module 200 may be, for example, the waterproof light emitting module shown in fig. 5 to 14. The waterproof light emitting module 200 shown in fig. 15 is taken as an example of the waterproof light emitting module shown in fig. 6.
The display panel 300 is fixed on the first surface 2401 of the light-guiding plate 240. In some embodiments, the display panel 300 is a liquid crystal display panel (Liquid crystal display panel), an electro-wetting display panel (Electrowetting display panel), a reflective display panel (Reflective display panel), or an electrophoretic display panel (Electrophoretic display panel). In some embodiments, the display panel 300 is fixed on the first surface 2401 of the light guide plate 240 through the adhesive layer 502. In some embodiments, the glue layer 502 is an optical glue (optically clear adhesive; OCA).
The protective layer 400 is fixed on the second surface 2402 of the light-guiding plate 240. The second surface 2402 and the first surface 2401 are opposite to each other. In some embodiments, protective layer 400 is an anti-glare film (AG film) or a protective panel (cover lens). In some embodiments, the protective layer 400 is fixed to the second surface 2402 of the light-guiding plate 240 by an adhesive layer 504. In some embodiments, the glue layer 504 is an optical glue.
As shown in fig. 15, since the waterproof layer 230 is disposed in the waterproof light emitting module 200 to cover the light emitting diode 220, moisture can be prevented from damaging the light emitting diode 220.
Fig. 16 is a schematic cross-sectional view of a waterproof light emitting module 200a according to an embodiment of the invention. As shown in fig. 16, the waterproof light emitting module 200a includes a circuit board 310, a light emitting diode 320, a light guide plate 340, a first waterproof layer 600, a second waterproof layer 602, and a third waterproof layer 604. The light emitting diode 320 is located above the circuit board 310, and the light emitting diode 320 has a light emitting surface 320e, a first non-light emitting surface 3201 and a second non-light emitting surface 3202. The light emitting surface 320e is opposite to the first non-light emitting surface 3201, and the second non-light emitting surface 3202 is located between the light emitting surface 320e and the first non-light emitting surface 3201. The light guide plate 340 is adjacent to the light emitting surface 320e of the light emitting diode 320, and the light emitting diode 320 is located between the first waterproof layer 600 and the light guide plate 340. The second waterproof layer 602 covers the second non-light emitting surface 3202 of the light emitting diode 320, and the third waterproof layer 604 is located between the second waterproof layer 602 and the light guide plate 340. The combination of the first, second and third waterproof layers 600, 602, 604 can fix the light emitting diode 320 and the circuit board 310 to the light guide plate 340. The center C1 (e.g., geometric center) of the light guide plate 340 substantially opposes the center C2 of the Ji Yufa led 320 substantially along the direction D1 perpendicular to the light emitting surface 320e, such that light can be transmitted from the light emitting surface 320e of the led 320 to the light guide plate 340 with little or no light loss. Accordingly, desired optical characteristics of the waterproof light emitting module 200a may be maintained.
The first waterproof layer 600 is adhered to the second waterproof layer 602 and the circuit board 310. For example, in some embodiments, the first waterproof layer 600 contacts the second waterproof layer 602 and the circuit board 310. Therefore, the first waterproof layer 600 can prevent moisture in the environment from entering the light emitting diode 320. Further, the first waterproof layer 600 can also prevent dust from entering the first non-light emitting surface 3201 of the light emitting diode 320.
In some embodiments, the thickness T1 of the first waterproof layer 600 is approximately in the range of 0.5 mm to 0.8 mm, and the first waterproof layer 600 is thick enough to allow the second waterproof layer 602 to be positioned at a high enough position relative to the light guide plate 340 to provide enough space (e.g., a vertical distance between the light guide plate 340 and the second waterproof layer 602) to dispose the third waterproof layer 604. In some embodiments, the thickness t1 of the light emitting diode 320 is approximately in the range of 0.3 mm to 0.5 mm. In some embodiments, the thickness t2 of the light guide plate 340 is approximately in the range of 0.15 mm to 0.35 mm. In some embodiments, the thickness T3 of the third waterproof layer 604 is approximately in the range of 0.1 millimeters to 0.3 millimeters. The third waterproof layer 604 is thick enough to provide tight adhesion between the light guide plate 340 and the second waterproof layer 602. Therefore, the light emitting diode 320 and the circuit board 310 can be firmly fixed to the light guide plate 340. In other words, the light emitting diode 320 and the circuit board 310 are prevented from falling off the light guide plate 340.
The second waterproof layer 602 is covered on the first waterproof layer 600 and the third waterproof layer 604. The first waterproof layer 600 is located between the circuit board 310 and the second waterproof layer 602, so as to adhere the second waterproof layer 602 to the circuit board 310. Therefore, the second waterproof layer 602 can prevent moisture in the environment from entering the light emitting diode 320. Further, the second waterproof layer 602 can also prevent dust from entering the second non-light emitting surface 3202 of the light emitting diode 320. In some embodiments, the thickness T2 of the second waterproof layer 602 is approximately in the range of 0.02 millimeters to 0.15 millimeters.
The first waterproof layer 600 has a top surface 6001 and a bottom surface 6002 opposite to the top surface 6001, and at least one of the top surface 6001 and the bottom surface 6002 has adhesiveness. In some embodiments, the bottom surface 6002 of the first waterproof layer 600 has adhesiveness such that the first waterproof layer 600 may adhere to the circuit board 310. For example, the first waterproof layer 600 may be a single-sided tape. In other embodiments, the top surface 6001 of the first waterproof layer 600 also has adhesiveness, such that the first waterproof layer 600 can adhere to the second waterproof layer 602. For example, the first waterproof layer 600 may be a double-sided tape or an adhesive.
The second waterproof layer 602 has a top surface 6021 and a bottom surface 6022 opposite to the top surface 6021, and at least one of the top surface 6021 and the bottom surface 6022 has adhesion. In some embodiments, the bottom surface 6022 of the second waterproof layer 602 has adhesiveness such that the second waterproof layer 602 may adhere to the first waterproof layer 600. For example, the first waterproof layer 600 may be a single-sided tape. Further, at least one of the bottom surface 6022 of the second waterproof layer 602 and the top surface 6001 of the first waterproof layer 600 has adhesion, so that the first waterproof layer 600 and the second waterproof layer 602 can adhere to each other. At least one of the top surface 6021 and the bottom surface 6022 of the second waterproof layer 602 has non-tackiness. In some embodiments, both the top surface 6021 and the bottom surface 6022 of the second waterproof layer 602 have non-tackiness. For example, the second waterproof layer 602 is a waterproof substrate, such as plastic, metal, ceramic, or a combination thereof, to provide sufficient structural strength to the waterproof lighting module 200a.
The light emitting diode 320 is located between the first waterproof layer 600 and the third waterproof layer 604, so that the third waterproof layer 604 can prevent moisture in the environment from entering the light emitting diode 320. Further, the third waterproof layer 604 can also prevent dust from entering the light emitting surface 320e of the led 320.
The third waterproof layer 604 has a top surface 6041 and a bottom surface 6042 opposite to the top surface 6041, and at least one of the top surface 6041 and the bottom surface 6042 has adhesion. In some embodiments, the bottom surface 6042 of the third waterproof layer 604 has an adhesive property such that the third waterproof layer 604 may adhere to the circuit board 310. For example, the third waterproof layer 604 may be a single-sided tape. In other embodiments, the top surface 6041 of the third waterproof layer 604 also has adhesiveness, such that the third waterproof layer 604 can adhere to the second waterproof layer 602. For example, the third waterproof layer 604 may be a double-sided tape or an adhesive.
Fig. 17 is a schematic cross-sectional view of a waterproof light emitting module 200b according to an embodiment of the present invention. The main differences of the waterproof light emitting module 200a and the waterproof light emitting module 200b of fig. 16 are: the waterproof lighting module 200b further includes a fourth waterproof layer 606 under the circuit board 310 and the light guide plate 340. As shown in fig. 17, the light emitting diode 320 further includes a third non-light emitting surface 3203 opposite to the second non-light emitting surface 3202. The top surface 6061 of the fourth waterproof layer 606 is adhered to the circuit board 310 and the light guide plate 340. For example, the fourth waterproof layer 606 may be a single-sided tape. Therefore, the fourth waterproof layer 606 may prevent moisture in the environment from entering the light emitting diode 320. Further, the fourth waterproof layer 606 can also prevent dust from entering the third non-light emitting surface 3203 of the light emitting diode 320.
Fig. 18 is a schematic cross-sectional view of a waterproof light emitting module 200c according to an embodiment of the invention. The main differences of the waterproof light emitting module 200a and the waterproof light emitting module 200c of fig. 16 are: the waterproof lighting module 200c further includes a fifth waterproof layer 608, a sixth waterproof layer 610, and a seventh waterproof layer 612. The fifth waterproof layer 608 is located below the circuit board 310 and the light guide plate 340. The sixth waterproof layer 610 is located between the circuit board 310 and the fifth waterproof layer 608. The seventh waterproof layer 612 is located between the light guide plate 340 and the fifth waterproof layer 608. The fifth, sixth and seventh water- resistant layers 608, 610, 612 prevent ambient moisture from entering the light emitting diode 320. Further, the fifth, sixth and seventh waterproof layers 608, 610, 612 also prevent dust from entering the third non-light emitting surface 3203 of the light emitting diode 320. In some embodiments, the thickness T4 of the sixth waterproof layer 610 is approximately in the range of 0.1 mm to 0.3 mm. Accordingly, the sixth waterproof layer 610 is thick enough to provide tight adhesion between the circuit board 310 and the fifth waterproof layer 608. In some embodiments, thickness T5 of seventh water barrier layer 612 is approximately in the range of 0.1 millimeters to 0.3 millimeters. Accordingly, the seventh waterproof layer 612 is thick enough to provide tight adhesion between the light guide plate 340 and the fifth waterproof layer 608.
The fifth waterproof layer 608 has a top surface 6081 and a bottom surface 6082 opposite the top surface 6081. At least one of the top surface 6081 and the bottom surface 6082 has adhesion. In some embodiments, the top surface 6081 of the fifth waterproof layer 608 has an adhesive property such that the fifth waterproof layer 608 can adhere to the sixth waterproof layer 610 and the seventh waterproof layer 612. For example, the fifth waterproof layer 608 may be a single-sided tape. The sixth waterproof layer 610 has a top surface 6101 and a bottom surface 6102 opposite the top surface 6101. Further, at least one of the bottom surface 6102 of the sixth waterproof layer 610 and the top surface 6101 of the fifth waterproof layer 608 has adhesiveness, so that the fifth waterproof layer 608 and the sixth waterproof layer 610 can adhere to each other. The seventh waterproof layer 612 has a top surface 6121 and a bottom surface 6122 opposite to the top surface 6121, and at least one of the bottom surface 6122 of the seventh waterproof layer 612 and the top surface 6081 of the fifth waterproof layer 608 has adhesiveness, so that the fifth waterproof layer 608 and the seventh waterproof layer 612 can adhere to each other. At least one of the top surface 6081 and the bottom surface 6082 of the fifth waterproof layer 608 has non-tackiness. In some embodiments, the top surface 6081 and the bottom surface 6082 of the fifth waterproof layer 608 are non-adhesive. For example, the fifth waterproof layer 608 is a waterproof substrate, such as plastic, metal, ceramic, or a combination thereof, to provide sufficient structural strength to the waterproof lighting module 200b.
At least one of the top surface 6101 and the bottom surface 6102 of the sixth waterproof layer 610 has adhesiveness. In some embodiments, the top surface 6101 of the sixth waterproof layer 610 has adhesiveness, so that the sixth waterproof layer 610 may be adhered to the circuit board 310. For example, the sixth waterproof layer 610 may be a single-sided tape. In other embodiments, the bottom surface 6102 of the sixth waterproof layer 610 also has adhesiveness, so that the sixth waterproof layer 610 can be adhered to the fifth waterproof layer 608. For example, the sixth waterproof layer 610 may be a double-sided tape or an adhesive.
At least one of the top surface 6121 and the bottom surface 6122 of the seventh water-repellent layer 612 has adhesiveness. In some embodiments, the top surface 6121 of the seventh waterproof layer 612 has adhesiveness such that the seventh waterproof layer 612 may adhere to the light guide plate 340. For example, seventh waterproof layer 612 may be a single sided tape. In other embodiments, the bottom surface 6122 of the seventh waterproof layer 612 also has adhesion, such that the seventh waterproof layer 612 can adhere to the fifth waterproof layer 608. For example, seventh water-resistant layer 612 may be a double-sided tape or an adhesive.
Embodiments of the present invention provide a waterproof light emitting module having a first waterproof layer, a second waterproof layer, and a third waterproof layer, wherein the center (e.g., geometric center) of a light guide plate is substantially opposite to the center of a Ji Yufa light emitting diode along a direction perpendicular to the light emitting surface, so that light is transmitted from the light emitting surface of the light emitting diode to the light guide plate with little or no light loss. Accordingly, desired optical characteristics of the waterproof light emitting module may be maintained. Further, the third waterproof layer is thick enough to provide tight adhesion between the light guide plate and the second waterproof layer. Therefore, the light emitting diode and the circuit board can be firmly fixed on the light guide plate. In other words, the light emitting diode and the circuit board can be prevented from falling off the light guide plate. The waterproof light-emitting module further comprises fifth, sixth and seventh waterproof layers for preventing moisture in the environment from entering the light-emitting diode.
The features of the various embodiments are briefly mentioned above so that those skilled in the art may better understand the aspects of the present invention. Those skilled in the art should appreciate that they may readily use the present invention as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments presented herein. It will also be understood by those skilled in the art that various changes, substitutions, and alterations can be made herein without departing from the spirit and scope of the invention.

Claims (15)

1. A waterproof lighting module, comprising:
a circuit board;
the light-emitting diode is positioned above the circuit board and is provided with a light-emitting surface, a first non-light-emitting surface and a second non-light-emitting surface, wherein the light-emitting surface is opposite to the first non-light-emitting surface, and the second non-light-emitting surface is positioned between the light-emitting surface and the first non-light-emitting surface;
a light guide plate adjacent to the light emitting face of the light emitting diode, wherein a center of the light guide plate is substantially aligned with a center of the light emitting diode along a direction perpendicular to the light emitting face;
the light emitting diode is positioned between the first waterproof layer and the light guide plate;
a second waterproof layer covering the second non-light emitting surface of the light emitting diode;
the third waterproof layer is positioned between the second waterproof layer and the light guide plate;
the fifth waterproof layer is positioned below the circuit board and the light guide plate, wherein the fifth waterproof layer is a single-sided adhesive tape;
the sixth waterproof layer is positioned between the circuit board and the fifth waterproof layer, wherein the thickness of the sixth waterproof layer is consistent; and
and the seventh waterproof layer is positioned between the light guide plate and the fifth waterproof layer, wherein the sixth waterproof layer and the seventh waterproof layer are separated along the direction vertical to the light emitting surface.
2. The waterproof lighting module of claim 1, wherein the first waterproof layer is adhered to the second waterproof layer and the circuit board.
3. The waterproof lighting module of claim 1, wherein the first waterproof layer contacts the second waterproof layer and the circuit board.
4. The waterproof lighting module of claim 1, wherein the second waterproof layer is over the first waterproof layer and the third waterproof layer.
5. The waterproof lighting module of claim 1, wherein the light emitting diode is located between the first waterproof layer and the third waterproof layer.
6. The waterproof lighting module of claim 1, wherein the first waterproof layer is located between the circuit board and the second waterproof layer.
7. The waterproof lighting module of claim 1, wherein the first waterproof layer has a top surface and a bottom surface opposite to the top surface, and at least one of the top surface and the bottom surface has adhesiveness.
8. The waterproof lighting module of claim 1, wherein the second waterproof layer has a top surface and a bottom surface opposite to the top surface, and at least one of the top surface and the bottom surface has adhesiveness.
9. The waterproof lighting module of claim 1, wherein the second waterproof layer has a top surface and a bottom surface opposite to the top surface, and at least one of the top surface and the bottom surface has non-tackiness.
10. The waterproof lighting module of claim 1, wherein the third waterproof layer has a top surface and a bottom surface opposite to the top surface, and at least one of the top surface and the bottom surface has adhesiveness.
11. The waterproof lighting module of claim 1, wherein the thickness of the third waterproof layer is in the range of 0.1 mm to 0.3 mm.
12. The waterproof lighting module of claim 1, further comprising:
and the fourth waterproof layer is positioned below the circuit board and the light guide plate, and the top surface of the fourth waterproof layer is adhered to the circuit board and the light guide plate.
13. The waterproof lighting module of claim 1, wherein the fifth waterproof layer has a top surface and a bottom surface opposite to the top surface, and at least one of the top surface and the bottom surface has non-tackiness.
14. The waterproof lighting module of claim 1, wherein the sixth waterproof layer has a top surface and a bottom surface opposite to the top surface, and at least one of the top surface and the bottom surface has adhesiveness.
15. The waterproof lighting module of claim 1, wherein the seventh waterproof layer has a top surface and a bottom surface opposite the top surface, and at least one of the top surface and the bottom surface has an adhesive property.
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