WO2021098494A1 - Light guide structure - Google Patents

Light guide structure Download PDF

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Publication number
WO2021098494A1
WO2021098494A1 PCT/CN2020/125754 CN2020125754W WO2021098494A1 WO 2021098494 A1 WO2021098494 A1 WO 2021098494A1 CN 2020125754 W CN2020125754 W CN 2020125754W WO 2021098494 A1 WO2021098494 A1 WO 2021098494A1
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WO
WIPO (PCT)
Prior art keywords
light guide
circuit board
light
flexible circuit
guide plate
Prior art date
Application number
PCT/CN2020/125754
Other languages
French (fr)
Chinese (zh)
Inventor
严建斌
周艺端
林德斌
林顺龙
Original Assignee
宸美（厦门）光电有限公司
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Publication date
Application filed by 宸美（厦门）光电有限公司 filed Critical 宸美（厦门）光电有限公司
Publication of WO2021098494A1 publication Critical patent/WO2021098494A1/en

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    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133606—Direct backlight including a specially adapted diffusing, scattering or light controlling members
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/255—Splicing of light guides, e.g. by fusion or bonding
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133603—Direct backlight with LEDs
    • G—PHYSICS
    • G02—OPTICS
    • G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
    • G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/1333—Constructional arrangements; Manufacturing methods
    • G02F1/1335—Structural association of cells with optical devices, e.g. polarisers or reflectors
    • G02F1/1336—Illuminating devices
    • G02F1/133602—Direct backlight
    • G02F1/133605—Direct backlight including specially adapted reflectors
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements

Definitions

  • the invention relates to a light guide structure.
  • the display panel has become a medium for transmitting information between the device and the user.
  • some display panels do not emit light by themselves, and usually require an external light source to clearly display the picture. Therefore, the light-emitting component is generally arranged on one side of the light guide plate. The light emitted by the light-emitting component is guided by the light guide plate to be evenly dispersed on the display surface of the display device.
  • the current waterproof treatment uses waterproof glue to seal the gaps to prevent external moisture from entering the light-emitting components.
  • the glue dispensing angle and processing difficulty it is difficult to observe the glue dispensing status, which reduces the process yield and the effect of waterproof treatment is not ideal. Therefore, a novel display panel is needed to solve the above-mentioned problems.
  • the purpose of the present invention is to provide a light guide structure including a flexible circuit board, a light guide plate, a gasket, a light emitting diode, a waterproof glue and a light reflecting layer.
  • the flexible circuit board includes a first side, a second side opposite to the first side, a third side, and a fourth side opposite to the third side.
  • the light guide plate is arranged on the flexible circuit board and extends beyond the first side of the flexible circuit board.
  • the gasket is arranged on the flexible circuit board on the same side as the light guide plate and extends along the second side.
  • the light emitting diode is arranged on the flexible circuit board and located between the light guide plate and the spacer.
  • the waterproof glue is arranged on the third side and the fourth side of the flexible circuit board, and the waterproof glue extends from the light guide plate to the gasket.
  • the light reflecting layer is arranged on the light guide plate, the light emitting diode and the gasket.
  • the light reflecting layer includes at least two openings, and each opening exposes the waterproof glue.
  • the light emitted by the light emitting diode is configured to directly illuminate the light guide plate.
  • the thickness of the spacer is the same as the thickness of the light emitting diode.
  • the flexible circuit board, the light guide plate, the gasket, the reflective layer and the waterproof glue constitute a closed space.
  • the light guide structure further includes an adhesive layer, and the flexible circuit board is bonded to the light guide plate through the adhesive layer.
  • a light guide structure which includes a flexible circuit board, a light guide plate, a light emitting diode, and a waterproof glue.
  • the light guide plate is arranged on the flexible circuit board and extends beyond the flexible circuit board.
  • the light emitting diode is arranged on the flexible circuit board on the same side as the light guide plate.
  • the waterproof glue completely covers the LED.
  • the waterproof glue is configured to convert the first color temperature of the light emitted by the light emitting diode into a second color temperature, and the second color temperature is different from the first color temperature.
  • the second color temperature is 5700K.
  • the light guide structure further includes an adhesive layer, and the flexible circuit board is bonded to the substrate through the adhesive layer.
  • the waterproof glue directly contacts the light guide plate.
  • FIG. 1 illustrates a top view of a light guide structure 100 according to some embodiments of the present invention.
  • FIG. 2 illustrates a schematic cross-sectional view of the light guide structure 100 along the line AA' according to some embodiments of the present invention.
  • FIG. 3 is a schematic cross-sectional view of the light guide structure 100 along the line BB' according to some embodiments of the present invention.
  • FIG. 4 illustrates a top view of a light guide structure 200 according to some embodiments of the present invention.
  • FIG. 5 illustrates a schematic cross-sectional view of the light guide structure 200 along the line CC' according to some embodiments of the present invention.
  • the following disclosure provides many different embodiments, or examples, to implement different features of the provided target.
  • the specific examples of components and arrangements described below are for simplifying the present disclosure. These are of course only examples, and their purpose is not to constitute a limitation.
  • the size of the device is not limited by the disclosed range or value, but may depend on the manufacturing process conditions and/or required characteristics of the device.
  • FIG. 1 illustrates a top view of a light guide structure 100 according to some embodiments of the present invention.
  • FIG. 2 illustrates a schematic cross-sectional view of the light guide structure 100 along the line AA' according to some embodiments of the present invention.
  • FIG. 3 is a schematic cross-sectional view of the light guide structure 100 along the line BB' according to some embodiments of the present invention.
  • the light guide structure 100 includes a flexible circuit board 110, a light guide plate 120, a light emitting diode 130, a spacer 140, a light reflecting layer 150 and a waterproof glue 160.
  • the light reflecting layer 150 is represented by a thicker dashed line.
  • the flexible circuit board 110 since part of the flexible circuit board 110 is located under the light guide plate 120, its position is indicated by a dotted line.
  • the flexible circuit board 110 includes a first side 111, a second side 112, a third side 113 and a fourth side 114.
  • the first side 111 is opposite to the second side 112
  • the third side 113 is opposite to the fourth side 114.
  • the third side 113 and the fourth side 114 are perpendicular to the first side 111 and the second side 112, respectively.
  • the light guide plate 120 is disposed on the flexible circuit board 110 and extends beyond the first side 111 of the flexible circuit board 110.
  • the material of the light guide plate 120 may be poly(methylmethacrylate) (PMMA), cycloolefin polymer (COP) or polycarbonate (PC).
  • the light guide structure 100 further includes an adhesive layer 170 disposed between the light guide plate 120 and the flexible circuit board 110.
  • the light guide plate 120 is bonded to the flexible circuit board 110 through the adhesive layer 170.
  • the adhesive layer 170 may be optically clear adhesive (OCA).
  • the spacer 140 is disposed on the second side 112 of the flexible circuit board 110. In some embodiments, the spacer 140 is aligned with the second side 112 of the flexible circuit board 110. In some embodiments, the material of the gasket 140 may be foam. The gasket 140 is used to isolate moisture and prevent external moisture from penetrating from the second side 112 of the flexible circuit board 110. In some embodiments, the gasket 140 has a back adhesive layer (not shown), and the back adhesive layer is disposed between the gasket 140 and the flexible circuit board 110. The gasket 140 is attached to the flexible circuit board 110 through the adhesive layer.
  • the light emitting diode 130 is disposed on the flexible circuit board 110, and the light emitting diode 130 is disposed between the light guide plate 120 and the spacer 140. It is worth noting that, in some embodiments, the light-emitting diode 130 does not contact the light guide plate 120 or the spacer 140. In some embodiments, the distance d1 between the light emitting diode 130 and the spacer 140 is about 50 ⁇ m to about 500 ⁇ m, for example, 100 ⁇ m, 200 ⁇ m, 300 ⁇ m, or 400 ⁇ m. In some embodiments, as shown in FIG. 1, the light guide structure 100 includes a plurality of light emitting diodes 130.
  • the waterproof glue 160 is disposed on the third side 113 and the fourth side 114 of the flexible circuit board 110, and the waterproof glue 160 extends from the light guide plate 120 to the spacer 140. Therefore, the waterproof glue 160 is used to prevent external moisture from penetrating into the light guide structure 100 from the third side 113 or the fourth side 114 of the flexible circuit board 110 to damage the light emitting diode 130.
  • the light-reflecting layer 150 is disposed on the light guide plate 120, the light emitting diode 130 and the spacer 140. It is worth noting that the reflective layer 150 includes at least two openings 155, and each opening 155 exposes the waterproof glue 160. In other words, the opening 155 of the reflective layer 150 is disposed above the waterproof glue 160. In some embodiments, the reflective layer 150 is a white tape. Therefore, after the light guide plate 120, the light emitting diode 130 and the spacer 140 are arranged on the flexible circuit board 110, the light reflecting layer 150 can be attached to the light guide plate 120, the light emitting diode 130 and the spacer 140.
  • the light reflecting layer 150 can block the light emitted by the light emitting diode 130 in the vertical direction, so as to prevent the light from leaking from the edge of the light guide plate 120.
  • the light-reflecting layer 150 may also have a function of reflecting light, and guide the light emitted by the light-emitting diode 130 to the light guide plate 120 to increase the use efficiency of the light emitted by the light-emitting diode 130.
  • the flexible circuit board 110, the light guide plate 120, the spacer 140, the reflective layer 150 and the waterproof glue 160 constitute a closed space 180.
  • the waterproof glue 160 is only arranged on the third side 113 and the fourth side 114 of the flexible circuit board 110, and will not flow between the light guide plate 120 and the LED 130 or the LED 130 and the gasket 140 between.
  • the thickness of the light emitting diode 130 is the same as the thickness of the spacer 140.
  • the thickness of the light emitting diode 130, the thickness of the spacer 140, and the thickness of the light guide plate 120 are substantially the same. Therefore, the reflective layer 150 can be completely attached to the light emitting diode 130 and the gasket 140, so that the reflective layer 150 has a better sealing performance.
  • the waterproof glue 160 needs to be injected from the third side 113 and the fourth side 114 of the flexible circuit board 110 to prevent moisture from flowing from the third side 113 and the fourth side 114.
  • the fourth side 114 penetrates.
  • the reflective layer 150 of the present invention includes at least two openings 155.
  • the glue can be dispensed directly through the openings 155. Therefore, there is no need to reverse the direction of the light guide structure 100 during the manufacturing process, and the glue can be directly dispensed from the top of the light reflective layer 150, which greatly reduces the difficulty of the manufacturing process.
  • the viscosity of the injected waterproof glue 160 is about 25 Pa ⁇ s-35 Pa ⁇ s, such as 28 Pa ⁇ s, 30 Pa ⁇ s, or 32 Pa ⁇ s. If the viscosity of the waterproof glue 160 is too small, the waterproof glue 160 will easily flow to the light-emitting surface of the LED 130 or between the LED 130 and the gasket 140. If the viscosity of the waterproof glue 160 is too large, it is not easy to seal the third side 113 and the fourth side 114 of the flexible circuit board 110, and therefore it is not easy to form a closed space 180.
  • the waterproof glue 160 is a room temperature curing type waterproof glue, and the waterproof glue 160 can be cured by standing for a period of time after dispensing.
  • the present invention also provides another light guide structure.
  • FIG. 4 illustrates a top view of a light guide structure 200 according to some embodiments of the present invention.
  • the light guide structure 200 includes a flexible circuit board 110, a light guide plate 120, a light emitting diode 130 and a waterproof glue 260. Since the waterproof glue 260 covers the light-emitting diode 130, in Figure 4, the position of the light-emitting diode 130 is indicated by a dotted line.
  • FIG. 5 illustrates a schematic cross-sectional view of the light guide structure 200 along the line CC' according to some embodiments of the present invention.
  • the light guide plate 120 is disposed on the flexible circuit board 110 and extends beyond the flexible circuit board 110.
  • the material of the light guide plate 120 may be poly(methylmethacrylate) (PMMA), cycloolefin polymer (COP) or polycarbonate (PC).
  • the light guide structure 200 further includes an adhesive layer 170 disposed between the light guide plate 120 and the flexible circuit board 110.
  • the light guide plate 120 is bonded to the flexible circuit board 110 through the adhesive layer 170.
  • the adhesive layer 170 may be optically clear adhesive (OCA).
  • the light emitting diode 130 is disposed on the flexible circuit board 110 on the same side as the light guide plate 120.
  • the light guide structure 200 includes a plurality of light emitting diodes 130.
  • the light-emitting diode 130 does not contact the light guide plate 120.
  • the waterproof glue 260 completely covers the light emitting diode 130. It should be noted that the waterproof glue 260 of the light guide structure 200 may be the same as or different from the waterproof glue 160 of the light guide structure 100. In some embodiments, the waterproof glue 260 is configured to convert the first color temperature of the light emitted by the light emitting diode 130 into a second color temperature, where the second color temperature is different from the first color temperature. In other words, the waterproof glue 260 can change the color of the light emitted by the light emitting diode 130 to a desired color. Therefore, the waterproof glue 260 can be selected from materials that match the color of the light emitted by the light-emitting diode 130. In some embodiments, the aforementioned second color temperature is 5700K. Similar to the waterproof glue 160, the waterproof glue 260 is used to prevent external moisture from damaging the LED 130.
  • the waterproof glue 260 completely covers the light-emitting diode 130 and does not require the configuration of gaskets. Therefore, the process steps can be reduced, and the effect of preventing water vapor from damaging the light-emitting diode 130 can be achieved.
  • the waterproof glue 260 matching the color of the light emitted by the light emitting diode 130 is selected, the selection of the light emitting diode 130 is more flexible. For example, blue light emitting diodes can be used with matching waterproof glue, so that the light emitted is the expected white light (5700K).
  • the present invention exemplarily provides different light guide structures, and suitable embodiments can be selected according to requirements.
  • a light guide structure with waterproof function can be fabricated using an easier manufacturing process.
  • the yield rate of the process is also improved, and the unit per hour per person is also improved.

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Abstract

A light guide structure (100), comprising a flexible circuit board (110), a light guide plate (120), a gasket (140), a light-emitting diode (130), waterproof glue (160) and a reflective layer (150). The flexible circuit board (110) includes a first side edge (111), a second side edge (112) opposite the first side edge (111), a third side edge (113) and a fourth side edge (114) opposite the third side edge (113); the light guide plate (120) is configured on the flexible circuit board (110) and extends beyond the first side edge (111) of the flexible circuit board (120), and the gasket (140) is configured, on the same side as the light guide plate (120), on the flexible circuit board (110) and extends along the second side edge (112); the light-emitting diode (130) is configured on the flexible circuit board (110) and is positioned between the light guide plate (120) and the gasket (140); the waterproof glue (160) is configured on the third side edge (113) and the fourth side edge (114) of the flexible circuit board (110), and the waterproof glue (160) extends to the gasket (140) from the light guide plate (120); and the reflective layer (150) is arranged on the light guide plate (120), the light-emitting diode (130) and the gasket (140), the reflective layer (150) includes at least two openings (155), and the waterproof glue (160) is exposed out of each opening (155), such that glue can be dispensed directly through the openings (155).

Description

导光结构Light guide structure 技术领域Technical field
本发明涉及导光结构。The invention relates to a light guide structure.
背景技术Background technique
随着科技发展，显示面板已成为装置与用户之间传递讯息的媒介。然而，一些显示面板本身不会发光，通常需要外加光源才能清楚的显示画面。因此，一般会配置发光组件于导光板的一侧。发光组件放射出的光线透过导光板的引导而平均分散于显示设备的显示面上。With the development of technology, the display panel has become a medium for transmitting information between the device and the user. However, some display panels do not emit light by themselves, and usually require an external light source to clearly display the picture. Therefore, the light-emitting component is generally arranged on one side of the light guide plate. The light emitted by the light-emitting component is guided by the light guide plate to be evenly dispersed on the display surface of the display device.
然而，发光组件碰到水气容易损坏，因此需要对于发光组件做防水处理。目前的防水处理是使用防水胶封住缝隙，防止外界水气进入发光组件。但是，由于点胶角度以及加工难度的关系，难以观察点胶状况，使得制程良率降低，防水处理的效果也不甚理想。因此，需要一种新颖的显示面板，以解决上述问题。However, the light-emitting components are easily damaged when exposed to moisture, and therefore, the light-emitting components need to be waterproofed. The current waterproof treatment uses waterproof glue to seal the gaps to prevent external moisture from entering the light-emitting components. However, due to the glue dispensing angle and processing difficulty, it is difficult to observe the glue dispensing status, which reduces the process yield and the effect of waterproof treatment is not ideal. Therefore, a novel display panel is needed to solve the above-mentioned problems.
发明内容Summary of the invention
为了解决上述金属导体可视的问题，克服现有技术的不足，本发明的目的在于提供一种导光结构，包含软性电路板、导光板、垫片、发光二极管、防水胶及反光层。软性电路板包含第一侧边、相对于第一侧边的第二侧边、第三侧边以及相对于第三侧边的第四侧边。导光板配置于软性电路板上，并延伸超出软性电路板的第一侧边。垫片配置于与导光板同侧的软性电路板上，且沿第二侧边延伸。发光二极管配置于软性电路板上且位于导光板与垫片之间。防水胶配置于软性电路板的第三侧边及第四侧边，防水胶自导光板延伸至垫片。反光层配置于导光板、发光二极管以及垫片上，反光层包含至少两个开口，各开口暴露出防水胶。In order to solve the above-mentioned visible problem of metal conductors and overcome the shortcomings of the prior art, the purpose of the present invention is to provide a light guide structure including a flexible circuit board, a light guide plate, a gasket, a light emitting diode, a waterproof glue and a light reflecting layer. The flexible circuit board includes a first side, a second side opposite to the first side, a third side, and a fourth side opposite to the third side. The light guide plate is arranged on the flexible circuit board and extends beyond the first side of the flexible circuit board. The gasket is arranged on the flexible circuit board on the same side as the light guide plate and extends along the second side. The light emitting diode is arranged on the flexible circuit board and located between the light guide plate and the spacer. The waterproof glue is arranged on the third side and the fourth side of the flexible circuit board, and the waterproof glue extends from the light guide plate to the gasket. The light reflecting layer is arranged on the light guide plate, the light emitting diode and the gasket. The light reflecting layer includes at least two openings, and each opening exposes the waterproof glue.
根据本发明一或多个实施方式，发光二极管发出的光线配置以直接照射于导光板。According to one or more embodiments of the present invention, the light emitted by the light emitting diode is configured to directly illuminate the light guide plate.
根据本发明一或多个实施方式，垫片的厚度与发光二极管的厚度相同。According to one or more embodiments of the present invention, the thickness of the spacer is the same as the thickness of the light emitting diode.
根据本发明一或多个实施方式，软性电路板、导光板、垫片、反光层及防水胶构成一封闭空间。According to one or more embodiments of the present invention, the flexible circuit board, the light guide plate, the gasket, the reflective layer and the waterproof glue constitute a closed space.
根据本发明一或多个实施方式，导光结构更包含黏着层，软性电路板藉由黏着层与导光板贴合。According to one or more embodiments of the present invention, the light guide structure further includes an adhesive layer, and the flexible circuit board is bonded to the light guide plate through the adhesive layer.
根据本揭露的另一态样，系提供一种导光结构，包含软性电路板、导光板、发光二极管及防水胶。导光板配置于软性电路板上，并延伸超出软性电路板。发光二极管配置于与导光板同侧的软性电路板上。防水胶完整包覆发光二极管。According to another aspect of the present disclosure, a light guide structure is provided, which includes a flexible circuit board, a light guide plate, a light emitting diode, and a waterproof glue. The light guide plate is arranged on the flexible circuit board and extends beyond the flexible circuit board. The light emitting diode is arranged on the flexible circuit board on the same side as the light guide plate. The waterproof glue completely covers the LED.
根据本发明一或多个实施方式，防水胶配置以将发光二极管发出的光线的第一色温转换为第二色温，第二色温不同于第一色温。According to one or more embodiments of the present invention, the waterproof glue is configured to convert the first color temperature of the light emitted by the light emitting diode into a second color temperature, and the second color temperature is different from the first color temperature.
根据本发明一或多个实施方式，第二色温为5700K。According to one or more embodiments of the present invention, the second color temperature is 5700K.
根据本发明一或多个实施方式，导光结构更包含黏合层，软性电路板藉由黏合层与基板贴合。According to one or more embodiments of the present invention, the light guide structure further includes an adhesive layer, and the flexible circuit board is bonded to the substrate through the adhesive layer.
根据本发明一或多个实施方式，防水胶与导光板直接接触。According to one or more embodiments of the present invention, the waterproof glue directly contacts the light guide plate.
附图说明Description of the drawings
图1绘示根据本发明一些实施例的导光结构100的上视图。FIG. 1 illustrates a top view of a light guide structure 100 according to some embodiments of the present invention.
图2绘示根据本发明一些实施例的导光结构100沿着AA’线的剖面示意图。FIG. 2 illustrates a schematic cross-sectional view of the light guide structure 100 along the line AA' according to some embodiments of the present invention.
图3绘示根据本发明一些实施例的导光结构100沿着BB’线的剖面示意图。FIG. 3 is a schematic cross-sectional view of the light guide structure 100 along the line BB' according to some embodiments of the present invention.
图4绘示根据本发明一些实施例的导光结构200的上视图。FIG. 4 illustrates a top view of a light guide structure 200 according to some embodiments of the present invention.
图5绘示根据本发明一些实施例的导光结构200沿着CC’线的剖面示意图。FIG. 5 illustrates a schematic cross-sectional view of the light guide structure 200 along the line CC' according to some embodiments of the present invention.
具体实施方式Detailed ways
以下揭露提供许多不同实施例，或示例，以建置所提供之目标物的不同特征。以下叙述的成份和排列方式的特定示例是为了简化本公开。这些当然仅是做为示例，其目的不在构成限制。举例而言，组件的尺寸不被揭露的范 围或数值所限制，但可以取决于组件的制程条件与/或所需的特性。The following disclosure provides many different embodiments, or examples, to implement different features of the provided target. The specific examples of components and arrangements described below are for simplifying the present disclosure. These are of course only examples, and their purpose is not to constitute a limitation. For example, the size of the device is not limited by the disclosed range or value, but may depend on the manufacturing process conditions and/or required characteristics of the device.
除非内容中有其他清楚的指称，本文所使用的单数词包含多个的指称对象。透过参考“一实施例”这样特定的指称，在至少其中之一的本揭露的实施例中，表示一种特定的特征、结构或特色，因此在各处的“在一实施例”，这样的词组透过特别的指称出现时，并不需要参考相同的实施方式，更进一步，在一或多实施方式中，这些特别的特征、结构、或特色可以依合适的情况相互组合。Unless there are other clear references in the content, the singular words used in this article include multiple referents. By referring to the specific designation "an embodiment", in at least one of the embodiments of the present disclosure, a specific feature, structure, or characteristic is indicated. Therefore, "an embodiment" is used everywhere, so When the phrase appears through a special designation, there is no need to refer to the same embodiment. Furthermore, in one or more embodiments, these special features, structures, or characteristics can be combined with each other as appropriate.
图1绘示根据本发明一些实施例的导光结构100的上视图。图2绘示根据本发明一些实施例的导光结构100沿着AA’线的剖面示意图。图3绘示根据本发明一些实施例的导光结构100沿着BB’线的剖面示意图。请先参考图1，导光结构100包含软性电路板110、导光板120、发光二极管130、垫片140、反光层150以及防水胶160。需了解的是，为了更清楚说明，反光层150用较粗的虚线表示。此外，由于部分的软性电路板110位于导光板120之下，因此使用虚线表示其位置。FIG. 1 illustrates a top view of a light guide structure 100 according to some embodiments of the present invention. FIG. 2 illustrates a schematic cross-sectional view of the light guide structure 100 along the line AA' according to some embodiments of the present invention. FIG. 3 is a schematic cross-sectional view of the light guide structure 100 along the line BB' according to some embodiments of the present invention. Please refer to FIG. 1 first, the light guide structure 100 includes a flexible circuit board 110, a light guide plate 120, a light emitting diode 130, a spacer 140, a light reflecting layer 150 and a waterproof glue 160. It should be understood that, in order to make the description clearer, the light reflecting layer 150 is represented by a thicker dashed line. In addition, since part of the flexible circuit board 110 is located under the light guide plate 120, its position is indicated by a dotted line.
软性电路板110包含第一侧边111、第二侧边112、第三侧边113及第四侧边114。第一侧边111与第二侧边112相对，而第三侧边113与第四侧边114相对。在一些实施例中，第三侧边113及第四侧边114分别垂直于第一侧边111及第二侧边112。The flexible circuit board 110 includes a first side 111, a second side 112, a third side 113 and a fourth side 114. The first side 111 is opposite to the second side 112, and the third side 113 is opposite to the fourth side 114. In some embodiments, the third side 113 and the fourth side 114 are perpendicular to the first side 111 and the second side 112, respectively.
请参考图2，导光板120配置于软性电路板110上，并延伸超出软性电路板110的第一侧边111。在一些实施例中，导光板120的材料可以为聚甲基丙烯酸甲酯(poly(methyl methacrylate),PMMA)、环烯烃聚合物(cyclo olefin polymer,COP)或聚碳酸酯(polycarbonate,PC)。Please refer to FIG. 2, the light guide plate 120 is disposed on the flexible circuit board 110 and extends beyond the first side 111 of the flexible circuit board 110. In some embodiments, the material of the light guide plate 120 may be poly(methylmethacrylate) (PMMA), cycloolefin polymer (COP) or polycarbonate (PC).
在一些实施例中，导光结构100更包含黏着层170，配置于导光板120与软性电路板110之间。导光板120藉由黏着层170与软性电路板110贴合。在某些实施例中，黏着层170可以为光学胶(optically clear adhesive,OCA)。In some embodiments, the light guide structure 100 further includes an adhesive layer 170 disposed between the light guide plate 120 and the flexible circuit board 110. The light guide plate 120 is bonded to the flexible circuit board 110 through the adhesive layer 170. In some embodiments, the adhesive layer 170 may be optically clear adhesive (OCA).
垫片140配置于软性电路板110的第二侧边112。在一些实施例中，垫片140与软性电路板110的第二侧边112切齐。在某些实施例中，垫片140的材料可以为泡绵。垫片140用来将水气隔离，避免外界的水气自软性电路板110的第二侧边112渗入。在一些实施例中，垫片140具有背胶层(未绘示)， 背胶层配置于垫片140与软性电路板110之间。垫片140藉由背胶层与软性电路板110贴合。The spacer 140 is disposed on the second side 112 of the flexible circuit board 110. In some embodiments, the spacer 140 is aligned with the second side 112 of the flexible circuit board 110. In some embodiments, the material of the gasket 140 may be foam. The gasket 140 is used to isolate moisture and prevent external moisture from penetrating from the second side 112 of the flexible circuit board 110. In some embodiments, the gasket 140 has a back adhesive layer (not shown), and the back adhesive layer is disposed between the gasket 140 and the flexible circuit board 110. The gasket 140 is attached to the flexible circuit board 110 through the adhesive layer.
请参考图3，发光二极管130配置于软性电路板110上，且发光二极管130配置于导光板120与垫片140之间。值得注意的是，在一些实施例中，发光二极管130并未接触导光板120或垫片140。在一些实施例中，发光二极管130与垫片140之间的距离d1为约50μm至约500μm，例如100μm、200μm、300μm或400μm。在一些实施例中，如图1所示，导光结构100包含多个发光二极管130。Please refer to FIG. 3, the light emitting diode 130 is disposed on the flexible circuit board 110, and the light emitting diode 130 is disposed between the light guide plate 120 and the spacer 140. It is worth noting that, in some embodiments, the light-emitting diode 130 does not contact the light guide plate 120 or the spacer 140. In some embodiments, the distance d1 between the light emitting diode 130 and the spacer 140 is about 50 μm to about 500 μm, for example, 100 μm, 200 μm, 300 μm, or 400 μm. In some embodiments, as shown in FIG. 1, the light guide structure 100 includes a plurality of light emitting diodes 130.
请同时参考图1及图2，防水胶160配置于软性电路板110的第三侧边113及第四侧边114，且防水胶160自导光板120延伸至垫片140。因此，防水胶160用以防止外界的水气自软性电路板110的第三侧边113或第四侧边114渗入导光结构100而破坏发光二极管130。Please refer to FIGS. 1 and 2 at the same time. The waterproof glue 160 is disposed on the third side 113 and the fourth side 114 of the flexible circuit board 110, and the waterproof glue 160 extends from the light guide plate 120 to the spacer 140. Therefore, the waterproof glue 160 is used to prevent external moisture from penetrating into the light guide structure 100 from the third side 113 or the fourth side 114 of the flexible circuit board 110 to damage the light emitting diode 130.
请同时参考图1、图2及图3，反光层150配置于导光板120、发光二极管130以及垫片140上。值得注意的是，反光层150包含至少两个开口155，各开口155暴露出防水胶160。换句话说，反光层150的开口155配置于防水胶160上方。在某些实施例中，反光层150为白色胶带。因此，可以将导光板120、发光二极管130以及垫片140配置于软性电路板110上之后，再将反光层150贴附于导光板120、发光二极管130以及垫片140上。在一些实施例中，反光层150可以阻挡发光二极管130在垂直方向上发出的光线，避免光线从导光板120的边缘处漏出。此外，反光层150亦可以具有反射光线的功能，将发光二极管130发出的光线导向导光板120，以增加发光二极管130发出的光线的使用效率。在一些实施例中，软性电路板110、导光板120、垫片140、反光层150及防水胶160构成一封闭空间180。值得注意的是，防水胶160仅配置于软性电路板110的第三侧边113及第四侧边114，并不会流至导光板120与发光二极管130之间或发光二极管130与垫片140之间。此外，在某些实施例中，发光二极管130的厚度与垫片140的厚度相同。在一些实施例中，发光二极管130的厚度、垫片140的厚度以及导光板120的厚度基本上皆相同。因此，反光层150可以完整的贴附于发光二极管130及垫片140上，使得反光层150的密封性更好。Please refer to FIG. 1, FIG. 2 and FIG. 3 at the same time. The light-reflecting layer 150 is disposed on the light guide plate 120, the light emitting diode 130 and the spacer 140. It is worth noting that the reflective layer 150 includes at least two openings 155, and each opening 155 exposes the waterproof glue 160. In other words, the opening 155 of the reflective layer 150 is disposed above the waterproof glue 160. In some embodiments, the reflective layer 150 is a white tape. Therefore, after the light guide plate 120, the light emitting diode 130 and the spacer 140 are arranged on the flexible circuit board 110, the light reflecting layer 150 can be attached to the light guide plate 120, the light emitting diode 130 and the spacer 140. In some embodiments, the light reflecting layer 150 can block the light emitted by the light emitting diode 130 in the vertical direction, so as to prevent the light from leaking from the edge of the light guide plate 120. In addition, the light-reflecting layer 150 may also have a function of reflecting light, and guide the light emitted by the light-emitting diode 130 to the light guide plate 120 to increase the use efficiency of the light emitted by the light-emitting diode 130. In some embodiments, the flexible circuit board 110, the light guide plate 120, the spacer 140, the reflective layer 150 and the waterproof glue 160 constitute a closed space 180. It is worth noting that the waterproof glue 160 is only arranged on the third side 113 and the fourth side 114 of the flexible circuit board 110, and will not flow between the light guide plate 120 and the LED 130 or the LED 130 and the gasket 140 between. In addition, in some embodiments, the thickness of the light emitting diode 130 is the same as the thickness of the spacer 140. In some embodiments, the thickness of the light emitting diode 130, the thickness of the spacer 140, and the thickness of the light guide plate 120 are substantially the same. Therefore, the reflective layer 150 can be completely attached to the light emitting diode 130 and the gasket 140, so that the reflective layer 150 has a better sealing performance.
需了解的是，若反光层150不包含开口155，则需要自软性电路板110的第三侧边113及第四侧边114注入防水胶160，才能避免水气自第三侧边113及第四侧边114渗入。如此一来，除了需要翻转导光结构100的方向以注入防水胶160之外，亦不易观察点胶情况，使得防水胶160容易流至发光二极管130的出光面，影响发光二极管130的发光效率。It should be understood that if the reflective layer 150 does not include the opening 155, the waterproof glue 160 needs to be injected from the third side 113 and the fourth side 114 of the flexible circuit board 110 to prevent moisture from flowing from the third side 113 and the fourth side 114. The fourth side 114 penetrates. As a result, in addition to the need to reverse the direction of the light guide structure 100 to inject the waterproof glue 160, it is also difficult to observe the dispensing situation, so that the waterproof glue 160 easily flows to the light emitting surface of the LED 130, which affects the luminous efficiency of the LED 130.
本发明的反光层150包含至少两个开口155，在注入防水胶160时，可以直接透过开口155点胶。因此，在制程中不需要翻转导光结构100的方向，即可直接自反光层150上方点胶，大幅减少制程难度。此外，透过本发明的技术方案，亦可以较容易地检查点胶情形，避免防水胶160流至发光二极管130的出光面。故在一些实施例中，发光二极管130发出的光线直接照射于导光板120。The reflective layer 150 of the present invention includes at least two openings 155. When the waterproof glue 160 is injected, the glue can be dispensed directly through the openings 155. Therefore, there is no need to reverse the direction of the light guide structure 100 during the manufacturing process, and the glue can be directly dispensed from the top of the light reflective layer 150, which greatly reduces the difficulty of the manufacturing process. In addition, through the technical solution of the present invention, it is also possible to easily check the glue dispensing situation and prevent the waterproof glue 160 from flowing to the light emitting surface of the light emitting diode 130. Therefore, in some embodiments, the light emitted by the light emitting diode 130 directly irradiates the light guide plate 120.
在一些实施例中，注入的防水胶160的黏度为约25Pa·s-35Pa·s，例如28Pa·s、30Pa·s或32Pa·s。若防水胶160的黏度过小，则防水胶160容易流至发光二极管130的出光面或发光二极管130与垫片140之间。若防水胶160的黏度过大，则不易密封软性电路板110的第三侧边113及第四侧边114，因此不易形成封闭空间180。在一些实施例中，防水胶160为常温固化型的防水胶，在点胶后静置一段时间即可使防水胶160固化。In some embodiments, the viscosity of the injected waterproof glue 160 is about 25 Pa·s-35 Pa·s, such as 28 Pa·s, 30 Pa·s, or 32 Pa·s. If the viscosity of the waterproof glue 160 is too small, the waterproof glue 160 will easily flow to the light-emitting surface of the LED 130 or between the LED 130 and the gasket 140. If the viscosity of the waterproof glue 160 is too large, it is not easy to seal the third side 113 and the fourth side 114 of the flexible circuit board 110, and therefore it is not easy to form a closed space 180. In some embodiments, the waterproof glue 160 is a room temperature curing type waterproof glue, and the waterproof glue 160 can be cured by standing for a period of time after dispensing.
本发明亦提供另一种导光结构。请参考图4，其绘示根据本发明一些实施例的导光结构200的上视图。在本发明的图式中，相似的组件或者特征可以具有相同的组件符号。导光结构200包含软性电路板110、导光板120、发光二极管130以及防水胶260。由于防水胶260覆盖发光二极管130，因此在第4图中，发光二极管130的位置以虚线表示。The present invention also provides another light guide structure. Please refer to FIG. 4, which illustrates a top view of a light guide structure 200 according to some embodiments of the present invention. In the drawings of the present invention, similar components or features may have the same component symbols. The light guide structure 200 includes a flexible circuit board 110, a light guide plate 120, a light emitting diode 130 and a waterproof glue 260. Since the waterproof glue 260 covers the light-emitting diode 130, in Figure 4, the position of the light-emitting diode 130 is indicated by a dotted line.
图5绘示根据本发明一些实施例的导光结构200沿着线CC’的剖面示意图。请参考第5图，导光板120配置于软性电路板110上，并延伸超出软性电路板110。在一些实施例中，导光板120的材料可以为聚甲基丙烯酸甲酯(poly(methyl methacrylate),PMMA)、环烯烃聚合物(cyclo olefin polymer,COP)或聚碳酸酯(polycarbonate,PC)。FIG. 5 illustrates a schematic cross-sectional view of the light guide structure 200 along the line CC' according to some embodiments of the present invention. Please refer to FIG. 5, the light guide plate 120 is disposed on the flexible circuit board 110 and extends beyond the flexible circuit board 110. In some embodiments, the material of the light guide plate 120 may be poly(methylmethacrylate) (PMMA), cycloolefin polymer (COP) or polycarbonate (PC).
在一些实施例中，导光结构200更包含黏着层170，配置于导光板120与软性电路板110之间。导光板120藉由黏着层170与软性电路板110贴合。 在某些实施例中，黏着层170可以为光学胶(optically clear adhesive,OCA)。In some embodiments, the light guide structure 200 further includes an adhesive layer 170 disposed between the light guide plate 120 and the flexible circuit board 110. The light guide plate 120 is bonded to the flexible circuit board 110 through the adhesive layer 170. In some embodiments, the adhesive layer 170 may be optically clear adhesive (OCA).
发光二极管130配置于与导光板120同侧的软性电路板110上。在一些实施例中，导光结构200包含多个发光二极管130。在某些实施例中，发光二极管130并未接触导光板120。The light emitting diode 130 is disposed on the flexible circuit board 110 on the same side as the light guide plate 120. In some embodiments, the light guide structure 200 includes a plurality of light emitting diodes 130. In some embodiments, the light-emitting diode 130 does not contact the light guide plate 120.
防水胶260完整包覆发光二极管130。值得注意的是，导光结构200的防水胶260可以与导光结构100的防水胶160相同或不同。在一些实施例中，防水胶260配置以将发光二极管130发出的光线的第一色温转换为第二色温，其中第二色温不同于第一色温。换句话说，防水胶260可以将发光二极管130发出的光线的颜色改变为预期的颜色。因此，防水胶260可以选用与发光二极管130发出的光线的颜色匹配的材料。在某些实施例中，上述的第二色温为5700K。与防水胶160相似，防水胶260用以防止外界的水气破坏发光二极管130。The waterproof glue 260 completely covers the light emitting diode 130. It should be noted that the waterproof glue 260 of the light guide structure 200 may be the same as or different from the waterproof glue 160 of the light guide structure 100. In some embodiments, the waterproof glue 260 is configured to convert the first color temperature of the light emitted by the light emitting diode 130 into a second color temperature, where the second color temperature is different from the first color temperature. In other words, the waterproof glue 260 can change the color of the light emitted by the light emitting diode 130 to a desired color. Therefore, the waterproof glue 260 can be selected from materials that match the color of the light emitted by the light-emitting diode 130. In some embodiments, the aforementioned second color temperature is 5700K. Similar to the waterproof glue 160, the waterproof glue 260 is used to prevent external moisture from damaging the LED 130.
防水胶260完整包覆发光二极管130，不需要垫片的配置，因此可以减少制程步骤，即可达到防止水气损坏发光二极管130的功效。此外，由于选用与发光二极管130发出的光线的颜色匹配的防水胶260，因此发光二极管130的选择较为灵活。举例来说，可以选用蓝光发光二极管搭配匹配的防水胶，使得发出的光线为预期的白光(5700K)。The waterproof glue 260 completely covers the light-emitting diode 130 and does not require the configuration of gaskets. Therefore, the process steps can be reduced, and the effect of preventing water vapor from damaging the light-emitting diode 130 can be achieved. In addition, since the waterproof glue 260 matching the color of the light emitted by the light emitting diode 130 is selected, the selection of the light emitting diode 130 is more flexible. For example, blue light emitting diodes can be used with matching waterproof glue, so that the light emitted is the expected white light (5700K).
本发明例示性提供不同的导光结构，可以根据需求选择适合的实施例。透过本发明的技术方案，可以使用较容易的制程制作具有防水功能的导光结构。此外，由于制程较容易，因此亦提升了制程的良率，更提升单位人时产能(units per hour per person)。The present invention exemplarily provides different light guide structures, and suitable embodiments can be selected according to requirements. Through the technical solution of the present invention, a light guide structure with waterproof function can be fabricated using an easier manufacturing process. In addition, because the process is easier, the yield rate of the process is also improved, and the unit per hour per person is also improved.
虽然本发明已以实施方式揭露如上，然其并非用以限定本发明，任何熟悉本领域的技术人员，在不脱离本发明的精神与范围内，当可作各种更动与润饰，因此本发明之保护范围当视后附的申请专利范围所界定者为准。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the invention shall be subject to the scope of the attached patent application.
以上所述仅为本发明的较佳实施例而已，并不用以限制本发明，凡在本发明的精神和原则之内，所做的任何修改、等同替换、改进等，均应包含在本发明保护的范围之内。The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the present invention. Within the scope of protection.

Claims (10)

  1. 一种导光结构，其特征在于，包含：A light guide structure, characterized in that it comprises:
    一软性电路板，包含一第一侧边、相对于该第一侧边的一第二侧边、一第三侧边以及相对于该第三侧边的一第四侧边；A flexible circuit board includes a first side, a second side opposite to the first side, a third side, and a fourth side opposite to the third side;
    一导光板，配置于该软性电路板上，并延伸超出该软性电路板的该第一侧边；A light guide plate disposed on the flexible circuit board and extending beyond the first side of the flexible circuit board;
    一垫片，沿着该第二侧边配置于与该导光板同侧的该软性电路板上；A gasket arranged on the flexible circuit board on the same side as the light guide plate along the second side edge;
    一发光二极管，配置于该软性电路板上，且位于该导光板与该垫片之间；A light emitting diode arranged on the flexible circuit board and located between the light guide plate and the spacer;
    一防水胶，配置于该软性电路板的该第三侧边及该第四侧边，该防水胶自该导光板延伸至该垫片；以及A waterproof glue disposed on the third side and the fourth side of the flexible circuit board, the waterproof glue extends from the light guide plate to the gasket; and
    一反光层，配置于该导光板、该发光二极管以及该垫片上，该反光层包含至少两个开口，各该开口暴露出该防水胶。A light-reflecting layer is disposed on the light guide plate, the light-emitting diode and the gasket. The light-reflecting layer includes at least two openings, and each of the openings exposes the waterproof glue.
  2. 如权利要求1所述的导光结构，其特征在于，该发光二极管发出的光线配置以直接照射于该导光板。8. The light guide structure of claim 1, wherein the light emitted by the light emitting diode is configured to directly illuminate the light guide plate.
  3. 如权利要求1所述的导光结构，其特征在于，该垫片的厚度与该发光二极管的厚度相同。8. The light guide structure of claim 1, wherein the thickness of the spacer is the same as the thickness of the light emitting diode.
  4. 如权利要求1所述的导光结构，其特征在于，该软性电路板、该导光板、该垫片、该反光层及该防水胶构成一封闭空间。8. The light guide structure of claim 1, wherein the flexible circuit board, the light guide plate, the gasket, the reflective layer, and the waterproof glue form a closed space.
  5. 如权利要求1所述的导光结构，其特征在于，更包含一黏着层，该软性电路板藉由该黏着层与该导光板贴合。8. The light guide structure of claim 1, further comprising an adhesive layer, and the flexible circuit board is attached to the light guide plate through the adhesive layer.
  6. 一种导光结构，其特征在于，包含：A light guide structure, characterized in that it comprises:
    一软性电路板；A flexible circuit board;
    一导光板，配置于该软性电路板上，并延伸超出该软性电路板；A light guide plate arranged on the flexible circuit board and extending beyond the flexible circuit board;
    一发光二极管，配置于与该导光板同侧的该软性电路板上；以及A light emitting diode arranged on the flexible circuit board on the same side as the light guide plate; and
    一防水胶，完整包覆该发光二极管。A waterproof glue completely covers the light-emitting diode.
  7. 如权利要求6所述的导光结构，其特征在于，该防水胶配置以将该发光二极管发出的光线的一第一色温转换为一第二色温，该第二色温不同于该第一色温。7. The light guide structure of claim 6, wherein the waterproof glue is configured to convert a first color temperature of the light emitted by the light emitting diode into a second color temperature, and the second color temperature is different from the first color temperature.
  8. 如权利要求7所述的导光结构，其特征在于，该第二色温为5700K。8. The light guide structure of claim 7, wherein the second color temperature is 5700K.
  9. 如权利要求6所述的导光结构，其特征在于，更包含一黏合层，该软性电路板藉由该黏合层与该基板贴合。7. The light guide structure of claim 6, further comprising an adhesive layer, and the flexible circuit board is attached to the substrate through the adhesive layer.
  10. 如权利要求6所述的导光结构，其特征在于，该防水胶与该导光板直接接触。7. The light guide structure of claim 6, wherein the waterproof glue is in direct contact with the light guide plate.
PCT/CN2020/125754 2019-11-19 2020-11-02 Light guide structure WO2021098494A1 (en)

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Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001067917A (en) * 1999-08-25 2001-03-16 Matsushita Electronics Industry Corp Surface light emitting device
JP2008108750A (en) * 2002-10-01 2008-05-08 Matsushita Electric Ind Co Ltd Linear light source device
US20110164202A1 (en) * 2010-01-07 2011-07-07 Hitachi Displays, Ltd. Liquid crystal display device
CN202444006U (en) * 2012-03-09 2012-09-19 纮华电子科技（上海）有限公司 Packaging structure of bar light-emitting diode module
CN103672575A (en) * 2012-09-12 2014-03-26 友达光电股份有限公司 Backlight module
CN107620880A (en) * 2017-10-31 2018-01-23 武汉天马微电子有限公司 Backlight module and display device
CN110361807A (en) * 2019-07-05 2019-10-22 Oppo（重庆）智能科技有限公司 The preparation method of electronic equipment, backlight module and backlight module
CN110444109A (en) * 2019-07-26 2019-11-12 Oppo（重庆）智能科技有限公司 A kind of display screen component and display equipment
CN211123557U (en) * 2019-11-19 2020-07-28 宸美（厦门）光电有限公司 Light guide structure

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4911983B2 (en) * 2006-02-08 2012-04-04 株式会社 日立ディスプレイズ Display device
TW201500815A (en) * 2013-06-17 2015-01-01 Primax Electronics Ltd Backlight module
TWI631297B (en) * 2017-08-15 2018-08-01 元太科技工業股份有限公司 Waterproof light emitting module and display device

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001067917A (en) * 1999-08-25 2001-03-16 Matsushita Electronics Industry Corp Surface light emitting device
JP2008108750A (en) * 2002-10-01 2008-05-08 Matsushita Electric Ind Co Ltd Linear light source device
US20110164202A1 (en) * 2010-01-07 2011-07-07 Hitachi Displays, Ltd. Liquid crystal display device
CN202444006U (en) * 2012-03-09 2012-09-19 纮华电子科技（上海）有限公司 Packaging structure of bar light-emitting diode module
CN103672575A (en) * 2012-09-12 2014-03-26 友达光电股份有限公司 Backlight module
CN107620880A (en) * 2017-10-31 2018-01-23 武汉天马微电子有限公司 Backlight module and display device
CN110361807A (en) * 2019-07-05 2019-10-22 Oppo（重庆）智能科技有限公司 The preparation method of electronic equipment, backlight module and backlight module
CN110444109A (en) * 2019-07-26 2019-11-12 Oppo（重庆）智能科技有限公司 A kind of display screen component and display equipment
CN211123557U (en) * 2019-11-19 2020-07-28 宸美（厦门）光电有限公司 Light guide structure

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