TW202112555A - Thermoplastic resin material with primer, and resin-resin conjugate - Google Patents

Thermoplastic resin material with primer, and resin-resin conjugate Download PDF

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TW202112555A
TW202112555A TW109126435A TW109126435A TW202112555A TW 202112555 A TW202112555 A TW 202112555A TW 109126435 A TW109126435 A TW 109126435A TW 109126435 A TW109126435 A TW 109126435A TW 202112555 A TW202112555 A TW 202112555A
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thermoplastic resin
primer
resin material
aforementioned
layer
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TW109126435A
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大谷和男
沼尾臣二
高橋信行
新林良太
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日商昭和電工股份有限公司
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/04Dielectric heating, e.g. high-frequency welding, i.e. radio frequency welding of plastic materials having dielectric properties, e.g. PVC
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/06Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using friction, e.g. spin welding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/08Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using ultrasonic vibrations
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/14Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
    • B29C65/16Laser beams
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/18Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated tools
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/02Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
    • B29C65/34Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement"
    • B29C65/36Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using heated elements which remain in the joint, e.g. "verlorenes Schweisselement" heated by induction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C65/00Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
    • B29C65/70Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by moulding
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/32Layered products comprising a layer of synthetic resin comprising polyolefins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/38Layered products comprising a layer of synthetic resin comprising epoxy resins
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/40Layered products comprising a layer of synthetic resin comprising polyurethanes
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/15Heterocyclic compounds having oxygen in the ring
    • C08K5/151Heterocyclic compounds having oxygen in the ring having one oxygen atom in the ring
    • C08K5/1515Three-membered rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/29Compounds containing one or more carbon-to-nitrogen double bonds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/26Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12Polyphenylene oxides
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D175/00Coating compositions based on polyureas or polyurethanes; Coating compositions based on derivatives of such polymers
    • C09D175/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Physics & Mathematics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Toxicology (AREA)
  • Laminated Bodies (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Paints Or Removers (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

A thermoplastic resin material with a primer, which comprises a thermoplastic resin material and one or more primer layers laminated on the thermoplastic resin material, wherein at least one of the primer layers is a polymer composition layer comprising a specific polymer composition.

Description

附底漆之熱塑性樹脂材及樹脂-樹脂接合體Thermoplastic resin material with primer and resin-resin joint

本發明係關於在強固熔接同種或異種之熱塑性樹脂材之用途上所適宜之附底漆之熱塑性樹脂材及其之製造方法、使用前述附底漆之熱塑性樹脂材之樹脂-樹脂接合體及其製造方法。The present invention relates to a primer-attached thermoplastic resin material suitable for the purpose of strongly fusing thermoplastic resin materials of the same or different species and a method for producing the same, a resin-resin joint body using the aforementioned primer-attached thermoplastic resin material, and the same Production method.

近年來基於製品之輕量化及低成本化等之觀點,從而頻繁地進行將汽車零件、醫療機器、家電製品等、各種領域之零件予以樹脂化而作成樹脂成形品。又,基於樹脂成形品之高生產性化等之觀點,諸多係採用預先將樹脂成形品分割成複數進行成形,並將該等之分割成形品互相接合之手段。In recent years, based on the viewpoints of weight reduction and cost reduction of products, it has been frequently carried out to resinize parts in various fields such as automobile parts, medical equipment, and home appliances into resin molded products. In addition, based on the viewpoints of increasing the productivity of resin molded products, many methods employ a method of dividing the resin molded product into plural pieces in advance for molding, and joining the divided molded products to each other.

作為將由此種樹脂所構成之分割成形品互相接合之手段,係使用如機械性接合、接著劑接合、熔接。其中,熔接尤其係高信賴性且生產性有用之接合法。熔接係根據加熱樹脂構件之方法而有各種方法,具體而言,如有超音波熔接或振動熔接、熱熔接、熱風熔接、感應熔接、射出熔接等。As a means for joining divided molded products made of such resins to each other, mechanical joining, adhesive joining, and welding are used. Among them, welding is particularly a highly reliable and productive joining method. There are various methods of welding depending on the method of heating the resin member. Specifically, there are ultrasonic welding, vibration welding, thermal welding, hot air welding, induction welding, injection welding, and the like.

熔接一般係使用於接合同種熱塑性樹脂材之接合法,但接合強度則會根據熔接法或樹脂種類而有無法充分展現的情況。由於熔接時之母材損傷之影響,諸多情況例如只有原本母材強度之5~8成程度。因此,進行熔接法之改良。Welding is generally used for joining different types of thermoplastic resin materials, but the bonding strength may not be fully exhibited depending on the welding method or the type of resin. Due to the damage of the base material during welding, in many cases, for example, it is only about 50 to 80% of the original base material strength. Therefore, the welding method is improved.

關於同種之熱塑性樹脂材之接合,例如,專利文獻1已揭示藉由預先對聚丙烯進行電暈放電處理,而接合聚丙烯彼此之技術。Regarding the joining of the same kind of thermoplastic resin material, for example, Patent Document 1 discloses a technique of joining polypropylenes by corona discharge treatment in advance.

又,熔接也能可使用在接合溶解度參數(以下SP值)相近之異種之熱塑性樹脂材。 關於異種之熱塑性樹脂材之接合,例如,專利文獻2、3已揭示、在使熱塑性樹脂組成物成形而成之成形體,及,與前述成形體之熱塑性樹脂為異種之熱塑性樹脂之間隔著具有官能基之熱塑性片材與強化纖維束進行超音波熔接之技術。又,專利文獻4已揭示藉由在被熔接構件之間插入中間層並將該中間層固定在超音波共振器號角(ultrasonic resonator horn)上並使其振動來將兩被熔接構件進行超音波熔接之技術。 [先前技術文獻] [專利文獻]In addition, it is also possible to use dissimilar thermoplastic resin materials with similar solubility parameters (SP value below) for welding. Regarding the joining of dissimilar thermoplastic resin materials, for example, Patent Documents 2 and 3 disclose that there is a gap between a molded body formed by molding a thermoplastic resin composition and a thermoplastic resin of a dissimilar type from the thermoplastic resin of the molded body. The technology of ultrasonic welding of functional group thermoplastic sheet and reinforced fiber bundle. In addition, Patent Document 4 has disclosed that two welded members are ultrasonically welded by inserting an intermediate layer between the welded members and fixing the intermediate layer on an ultrasonic resonator horn (ultrasonic resonator horn) and making it vibrate. Of technology. [Prior Technical Literature] [Patent Literature]

[專利文獻1]日本特開平8-126823號公報 [專利文獻2]日本特開2017-202667號公報 [專利文獻3]日本特開2017-206014號公報 [專利文獻4]日本特開2008-284862號公報[Patent Document 1] Japanese Patent Application Laid-Open No. 8-126823 [Patent Document 2] JP 2017-202667 A [Patent Document 3] JP 2017-206014 A [Patent Document 4] JP 2008-284862 A

[發明所欲解決之課題][The problem to be solved by the invention]

前述同種之熱塑性樹脂材之接合中,即使以專利文獻1之方法仍也無法確保充分之接合強度。In the above-mentioned joining of the same kind of thermoplastic resin material, even if the method of Patent Document 1 is used, sufficient joining strength cannot be ensured.

又,熔接之強度係藉由接合界面之分子擴散所成之分子糾纏與結晶化來展現。因此,以往在異種熱塑性樹脂材之接合中,熔接仍有無法取得充足接合強度的問題。In addition, the strength of welding is demonstrated by molecular entanglement and crystallization caused by molecular diffusion at the bonding interface. Therefore, in the past, in the joining of dissimilar thermoplastic resin materials, there is still a problem that sufficient joining strength cannot be obtained by welding.

本發明係有鑑於該技術背景所完成者,其課題在於提供一種在強固地熔接同種之熱塑性樹脂材或異種之熱塑性樹脂材之用途所適宜之附底漆之熱塑性樹脂材及其之關聯技術。前述關聯技術係意指前述附底漆之熱塑性樹脂材之製造方法、使用前述附底漆之熱塑性樹脂材之樹脂-樹脂接合體及其之製造方法。 [用以解決課題之手段]The present invention has been accomplished in view of the technical background, and its subject is to provide a primer-attached thermoplastic resin material and related technologies that are suitable for the purpose of strongly fusing the same kind of thermoplastic resin material or a different kind of thermoplastic resin material. The aforementioned related technology refers to the aforementioned method of manufacturing a primer-attached thermoplastic resin material, a resin-resin assembly using the aforementioned primer-attached thermoplastic resin material, and its manufacturing method. [Means to solve the problem]

本發明為了達成前述目的,提供以下之手段。 尚且,本說明書中,接合係意指將物與物予以連接,且接著及熔接則為其之下位概念。接著係意指隔著膠帶或接著劑之各種有機材(熱硬化性樹脂或熱塑性樹脂等),將2個被連接材(所欲接著者)作成接合狀態。熔接係意指藉由熱來熔融被連接材之熱塑性樹脂等之表面,並藉由接觸加壓與冷卻來利用由分子擴散所成之糾纏與結晶化而作成接合狀態。In order to achieve the aforementioned object, the present invention provides the following means. Furthermore, in this specification, joining means connecting objects to objects, and subsequent and welding are its subordinate concepts. Next means that various organic materials (thermosetting resins, thermoplastic resins, etc.) are interposed by tapes or adhesives, and two connected materials (who want to be connected) are brought into a joined state. Welding refers to the use of heat to melt the surface of the thermoplastic resin or the like of the connected material, and to use the entanglement and crystallization caused by molecular diffusion to form a joined state by contact pressure and cooling.

(附底漆之熱塑性樹脂材) [1] 一種附底漆之熱塑性樹脂材,其係具有熱塑性樹脂材,與層合於前述熱塑性樹脂材之1層或複數層之底漆層,且前述底漆層之至少1層為包含下述(A)或(B)之聚合物組成物之聚合物組成物層; (A)聚合物組成物,其係包含:含有下述(1)~(7)之至少一種之聚合型組成物之聚合物,與無水馬來酸改質聚丙烯或改質聚苯醚; (B)聚合物組成物,其係包含:含有下述(1)~(7)之至少一種之聚合型組成物之聚合物、無水馬來酸改質聚丙烯或改質聚苯醚,及,與構成前述熱塑性樹脂材之熱塑性樹脂為異種之熱塑性樹脂; (1)2官能異氰酸酯化合物與二醇之組合、 (2)2官能異氰酸酯化合物與2官能胺基化合物之組合、 (3)2官能異氰酸酯化合物與2官能硫醇化合物之組合、 (4)2官能環氧化合物與二醇之組合、 (5)2官能環氧化合物與2官能羧基化合物之組合、 (6)2官能環氧化合物與2官能硫醇化合物之組合、 (7)單官能自由基聚合性單體。 [2] 如[1]之附底漆之熱塑性樹脂材,其中前述聚合物組成物層係與前述熱塑性樹脂材直接接觸之層。 [3] 如[1]或[2]之附底漆之熱塑性樹脂材,其中前述聚合物組成物包含含有前述(4)之聚合型組成物之聚合物,且,前述(4)之二醇為2官能酚化合物。 [4] 如[1]或[3]之附底漆之熱塑性樹脂材,其中前述底漆層係在前述聚合物組成物層與前述熱塑性樹脂材之間具有熱硬化性樹脂層,該熱硬化性樹脂層係由包含熱硬化性樹脂之組成物所形成而成。 [5] 如[4]之附底漆之熱塑性樹脂材,其中前述熱硬化性樹脂為選自由胺基甲酸酯樹脂、環氧樹脂、乙烯基酯樹脂及不飽和聚酯樹脂所成群之至少1種。 [6] 如[1]~[5]中任一項之附底漆之熱塑性樹脂材,其中構成前述熱塑性樹脂材之熱塑性樹脂為選自由聚丙烯、改質聚苯醚、及聚對酞酸丁二酯所成群之至少1種。(Thermoplastic resin material with primer) [1] "A thermoplastic resin material with primer, which has a thermoplastic resin material, and one or more primer layers laminated on the thermoplastic resin material, and at least one of the primer layers includes The polymer composition layer of the polymer composition of (A) or (B); (A) A polymer composition, which includes: a polymer containing at least one of the following (1) to (7) polymeric composition, and anhydrous maleic acid modified polypropylene or modified polyphenylene ether; (B) A polymer composition, which includes: a polymer containing at least one of the following (1) to (7) polymeric composition, anhydrous maleic acid modified polypropylene or modified polyphenylene ether, and , And the thermoplastic resin constituting the aforementioned thermoplastic resin material is a different kind of thermoplastic resin; (1) Combination of 2-functional isocyanate compound and diol, (2) The combination of a 2-functional isocyanate compound and a 2-functional amino compound, (3) Combination of 2-functional isocyanate compound and 2-functional thiol compound, (4) Combination of 2-functional epoxy compound and diol, (5) Combination of 2-functional epoxy compound and 2-functional carboxyl compound, (6) Combination of 2-functional epoxy compound and 2-functional thiol compound, (7) Monofunctional radical polymerizable monomer. [2] "The thermoplastic resin material with a primer as in [1], wherein the polymer composition layer is a layer in direct contact with the thermoplastic resin material. [3] "The thermoplastic resin material with primer as in [1] or [2], wherein the polymer composition includes a polymer containing the polymer composition of (4), and the diol of (4) It is a bifunctional phenol compound. [4] "The thermoplastic resin material with primer as in [1] or [3], wherein the primer layer has a thermosetting resin layer between the polymer composition layer and the thermoplastic resin material, and the thermosetting The resin layer is formed of a composition containing a thermosetting resin. [5] "The thermoplastic resin material with primer as in [4], wherein the thermosetting resin is selected from the group consisting of urethane resin, epoxy resin, vinyl ester resin and unsaturated polyester resin At least one. [6] "The thermoplastic resin material with primer as described in any one of [1] to [5], wherein the thermoplastic resin constituting the aforementioned thermoplastic resin material is selected from polypropylene, modified polyphenylene ether, and polyterephthalic acid At least one of the groups of butanediesters.

(附底漆之熱塑性樹脂材之製造方法) [7] 一種如[1]之附底漆之熱塑性樹脂材之製造方法,其係將前述聚合物組成物塗佈於前述熱塑性樹脂材上。(Method of manufacturing thermoplastic resin material with primer) [7] "A method for producing a primer-attached thermoplastic resin material as in [1], which comprises coating the aforementioned polymer composition on the aforementioned thermoplastic resin material.

(樹脂-樹脂接合體) [8] 一種樹脂-樹脂接合體,其係使如[1]~[6]中任一項之附底漆之熱塑性樹脂材之底漆層,與其他熱塑性樹脂材熔接而成。 [9] 如[8]之樹脂-樹脂接合體,其中前述其他之熱塑性樹脂材係如[1]~[6]中任一項之附底漆之熱塑性樹脂材,並且係使各自之底漆層熔接而成。 [10] 如[8]或[9]之樹脂-樹脂接合體,其中在構成前述其他熱塑性樹脂材之熱塑性樹脂且係構成該熱塑性樹脂之單體中佔最大含量之單體,與,構成如[1]~[6]中任一項之附底漆之熱塑性樹脂材之熱塑性樹脂且係構成該熱塑性樹脂之單體中佔最大含量之單體為相同,且該單體之含量皆為70質量%以上。(Resin-resin junction) [8]   A resin-resin joint, which is formed by welding a primer layer of a thermoplastic resin material with a primer as described in any one of [1] to [6] with other thermoplastic resin materials. [9]   The resin-resin joint as in [8], wherein the aforementioned other thermoplastic resin material is a thermoplastic resin material with a primer as in any one of [1] to [6], and the respective primers are used Layers are welded together. [10]   The resin-resin junction as in [8] or [9], wherein the thermoplastic resin constituting the aforementioned other thermoplastic resin material is the monomer with the largest content among the monomers constituting the thermoplastic resin, and is constituted as [1]~[6] The thermoplastic resin of the thermoplastic resin material with primer and the monomer that constitutes the thermoplastic resin with the largest content is the same, and the content of the monomer is all 70 Above mass%.

(樹脂-樹脂接合體之製造方法) [11] 一種如[8]~[10]中任一項之樹脂-樹脂接合體之製造方法,其係對前述附底漆之熱塑性樹脂材之底漆層,以選自由超音波熔接法、振動熔接法、電磁感應法、高頻法、雷射法、及熱壓法所成群之至少1種方法來熔接其他熱塑性樹脂材。 [12] 一種如[8]~[10]中任一項之樹脂-樹脂接合體之製造方法,其係對前述附底漆之熱塑性樹脂材之底漆層,以射出成形法來射出熔接其他熱塑性樹脂材。 [發明效果](Manufacturing method of resin-resin joint body) [11]   A method for manufacturing a resin-resin joint as described in any one of [8] to [10], which is based on the primer layer of the aforementioned thermoplastic resin material with primer, selected from the ultrasonic welding method, At least one method of vibration welding method, electromagnetic induction method, high frequency method, laser method, and hot pressing method is used to weld other thermoplastic resin materials. [12]   A method for manufacturing a resin-resin joint as described in any one of [8] to [10], which is to inject and weld the primer layer of the aforementioned thermoplastic resin material with primer by injection molding. Thermoplastic resin material. [Effects of the invention]

根據本發明,可提供在強固地熔接同種之熱塑性樹脂材或異種之熱塑性樹脂材之用途上所適宜之附底漆之熱塑性樹脂材及其之關聯技術。According to the present invention, it is possible to provide a primer-attached thermoplastic resin material and related technologies that are suitable for the purpose of strongly welding the same kind of thermoplastic resin material or different kinds of thermoplastic resin material.

詳述關於本發明之附底漆之熱塑性樹脂材及其之關聯技術。 尚且,本說明書中,「(甲基)丙烯醯基」係意指丙烯醯基及/或甲基丙烯醯基,又,「(甲基)丙烯酸酯」係意指丙烯酸酯及/或甲基丙烯酸酯。The thermoplastic resin material with primer of the present invention and its related technology are described in detail. Furthermore, in this specification, "(meth)acryloyl" means acrylic and/or methacryloyl, and "(meth)acrylate" means acrylate and/or methyl Acrylate.

[附底漆之熱塑性樹脂材] 如圖1所示,本實施形態之附底漆之熱塑性樹脂材1為具有熱塑性樹脂材2,與,層合於前述熱塑性樹脂材上之1層或複數層之底漆層3的層合體。圖1中,前述底漆層3之至少1層為聚合物組成物層31,其係包含特定聚合型組成物之聚合物組成物的。 本發明中,聚合型組成物係意指藉由使特定之2官能之化合物之組合在觸媒存在下進行加成聚合反應,或,特定之單官能單體之自由基聚合反應,而形成熱可塑構造,即,線性聚合物構造之組成物。與在進行聚合時會構成由交聯構造所成之3次元網路的熱硬化性樹脂相異,聚合型組成物不會構成由交聯構造所成之3次元網路,而仍具有熱塑性。 本發明中,聚合物組成物係意指將具有熱可塑構造之聚合物(線性聚合物)作為主成分(合計90質量%以上)之組成物。前述聚合物包括:由包含前述特定之2官能之化合物之組合及/或特定之單官能單體之聚合型組成物所得之聚合物,或對前述聚合物加成無水馬來酸改質聚丙烯而成者、無水馬來酸改質聚丙烯、改質聚苯醚等。 前述聚合物組成物層31為包含聚合物組成物之層,該聚合物組成物包含前述聚合型組成物之聚合物,或對前述聚合物加成無水馬來酸改質聚丙烯而成者、無水馬來酸改質聚丙烯、改質聚苯醚等。[Thermoplastic resin material with primer] As shown in FIG. 1, the thermoplastic resin material 1 with a primer of this embodiment is a laminated body which has a thermoplastic resin material 2 and the primer layer 3 of 1 layer or multiple layers laminated|stacked on the said thermoplastic resin material. In FIG. 1, at least one layer of the aforementioned primer layer 3 is a polymer composition layer 31, which contains a polymer composition of a specific polymer composition. In the present invention, the polymeric composition means that a combination of specific bifunctional compounds undergoes addition polymerization reaction in the presence of a catalyst, or radical polymerization of specific monofunctional monomers to form heat Plastic structure, that is, the composition of linear polymer structure. Unlike thermosetting resins that form a three-dimensional network formed by a cross-linked structure during polymerization, the polymerized composition does not form a three-dimensional network formed by a cross-linked structure, but still has thermoplasticity. In the present invention, the polymer composition means a composition containing a polymer (linear polymer) having a thermoplastic structure as a main component (90% by mass or more in total). The aforementioned polymer includes: a polymer obtained from a polymerized composition containing a combination of the aforementioned specific bifunctional compound and/or a specific monofunctional monomer, or the aforementioned polymer is modified by adding anhydrous maleic acid to the polypropylene Made from, anhydrous maleic acid modified polypropylene, modified polyphenylene ether, etc. The aforementioned polymer composition layer 31 is a layer comprising a polymer composition, the polymer composition comprising the polymer of the aforementioned polymeric composition, or one made by adding anhydrous maleic acid to the aforementioned polymer to modify polypropylene, Anhydrous maleic acid modified polypropylene, modified polyphenylene ether, etc.

本發明中,如後述般,前述底漆層係指在將熱塑性樹脂材2,與另一方之接合對象物即其他熱塑性樹脂材5予以接合一體化而取得樹脂-樹脂接合體之際,存在於熱塑性樹脂材2與其他熱塑性樹脂材5之間,而使熱塑性樹脂材2對其他熱塑性樹脂材5之接合強度提升之層者。In the present invention, as will be described later, the primer layer refers to the presence of the thermoplastic resin material 2 and the other thermoplastic resin material 5, which is the other joining object, when the thermoplastic resin material 2 is joined and integrated to obtain a resin-resin joined body. Between the thermoplastic resin material 2 and the other thermoplastic resin material 5, the layer that improves the bonding strength of the thermoplastic resin material 2 to the other thermoplastic resin material 5.

本發明在前述其他熱塑性樹脂材5係為包含與構成前述熱塑性樹脂材2之熱塑性樹脂為同種熱塑性樹脂之熱塑性樹脂材時,則係適宜於將熱塑性樹脂材2與其他熱塑性樹脂材5予以強固熔接之用途上。又,在前述其他熱塑性樹脂材5係為包含與構成前述熱塑性樹脂材2之熱塑性樹脂為異種熱塑性樹脂之熱塑性樹脂材時,一般而言,熱塑性樹脂材2與其他熱塑性樹脂材5之SP值會遠離之情況為多,但仍係特別適宜於將此種異種之熱塑性樹脂材予以強固熔接之用途上。 在此,本說明書中,「同種熱塑性樹脂」係意構成熱塑性樹脂之單體中,佔最大含量之單體為相同,該單體之含量皆為70質量%以上之熱塑性樹脂。又,「異種熱塑性樹脂」係意指「同種熱塑性樹脂」以外之熱塑性樹脂,具體而言,意指不存在共通之單體之熱塑性樹脂、構成熱塑性樹脂之單體中佔最大含量之單體為相異之熱塑性樹脂,或,佔最大含量之單體為相同且至少一者之佔最大含量之單體含量為未滿70質量%之熱塑性樹脂。In the present invention, when the aforementioned other thermoplastic resin material 5 is a thermoplastic resin material containing the same type of thermoplastic resin as the thermoplastic resin constituting the aforementioned thermoplastic resin material 2, it is suitable for strongly fusing the thermoplastic resin material 2 and the other thermoplastic resin material 5 The purpose. In addition, when the other thermoplastic resin material 5 is a thermoplastic resin material that contains a different kind of thermoplastic resin from the thermoplastic resin constituting the thermoplastic resin material 2, in general, the SP value of the thermoplastic resin material 2 and the other thermoplastic resin material 5 will be There are many cases where it is far away, but it is still particularly suitable for the application of strong welding of such dissimilar thermoplastic resin materials. Here, in this specification, "the same type of thermoplastic resin" means that among the monomers constituting the thermoplastic resin, the monomers with the largest content are the same, and the content of the monomers is all thermoplastic resins with a content of 70% by mass or more. In addition, "different thermoplastic resin" means a thermoplastic resin other than "the same kind of thermoplastic resin". Specifically, it means a thermoplastic resin that does not have a common monomer, and the monomer with the largest content among the monomers constituting the thermoplastic resin is Different thermoplastic resins, or thermoplastic resins with the same monomer with the largest content and at least one of the monomers with the largest content of less than 70% by mass.

<熱塑性樹脂材2> 熱塑性樹脂材2之形態並無特別限定,可為塊狀亦可為薄膜狀。 構成熱塑性樹脂材2之熱塑性樹脂並非係受到特別限定者。 作為熱塑性樹脂,可舉出例如,聚丙烯(PP,SP值:8.0(J/cm3 )1 / 2 )、聚醯胺6(PA6,SP值:12.7-13.6(J/cm3 )1 / 2 )、聚醯胺66(PA66,SP值:13.6(J/cm3 )1 / 2 )、改質聚苯醚(m-PPE)、聚苯硫醚(PPS,SP值:19.8(J/cm3 )1 / 2 )、聚醚醯亞胺(PEI)、聚碳酸酯(PC,SP值:9.7(J/cm3 )1 / 2 )、聚對酞酸丁二酯(PBT,SP值:20.5(J/cm3 )1 / 2 )等。其中,從取得本發明效果之觀點,以選自由聚丙烯、改質聚苯醚、及聚對酞酸丁二酯所成群之至少1種為佳。<Thermoplastic resin material 2> The form of the thermoplastic resin material 2 is not particularly limited, and it may be a block shape or a film shape. The thermoplastic resin constituting the thermoplastic resin material 2 is not particularly limited. The thermoplastic resin includes, for example, polypropylene (PP, SP value: 8.0 (J / cm 3) 1/2), polyamide 6 (PA6, SP value: 12.7-13.6 (J / cm 3) 1 / 2), polyamide 66 (PA66, SP value: 13.6 (J / cm 3) 1/2), modified polyphenylene ether (m-PPE), polyphenylene sulfide (PPS, SP value: 19.8 (J / cm 3) 1/2), polyetherimide (PEI), polycarbonate (PC, SP value: 9.7 (J / cm 3) 1/2), polyethylene terephthalate, polybutylene terephthalate (PBT, SP value : 20.5 (J / cm 3) 1/2) and the like. Among them, from the viewpoint of obtaining the effects of the present invention, at least one selected from the group consisting of polypropylene, modified polyphenylene ether, and polybutylene terephthalate is preferred.

在此,溶解度參數(SP值)係指、根據由希德布郎所導入之正規溶液理論來定義之提供材料間之相互作用程度之預測數值的值(δ)。 已提出有各種SP值之算出方法,例如,由Fedors (Polym. Eng. Sci. 1974年, 14卷, p147)所提出之手法,可使用下述式(1)來求出。 δ=(ΣEcoh /ΣV)1 / 2 ・・・(1) 在此,δ表示溶解度參數(J0.5 /cm1.5 ),Ecoh 表示凝聚能密度(J/mol)、V表示莫耳分子容積(cm3 /mol),Σ係指對於構成單體之全部原子團,將賦予至各個原子團之該等數值取總和之意義。各個原子團之Ecoh 或V之數值係例舉在例如“聚合物物性,第3完整改版(Properties of Polymers, Third completely revised edition)”之Table7.3等。Here, the solubility parameter (SP value) refers to a value (δ) that provides a predicted value of the degree of interaction between materials defined according to the regular solution theory introduced by Sidbron. Various methods for calculating the SP value have been proposed. For example, the method proposed by Fedors (Polym. Eng. Sci. 1974, Volume 14, p147) can be calculated using the following formula (1). δ=(ΣE coh /ΣV) 1 / 2・・・(1) Here, δ represents the solubility parameter (J 0.5 /cm 1.5 ), E coh represents the cohesive energy density (J/mol), and V represents the molar molecular volume (cm 3 /mol), Σ refers to the sum of all the atomic groups that constitute the monomer. The value of E coh or V of each atomic group is exemplified in Table 7.3 of "Properties of Polymers, Third completely revised edition", etc.

<底漆層3> 底漆層係層合在熱塑性樹脂材2之上而成。Primer layer 3> The primer layer is laminated on the thermoplastic resin material 2.

[聚合物組成物層31] 如先前所述,底漆層之至少1層為包含特定聚合物組成物之聚合物組成物層31。 聚合物組成物層31係可將前述特定聚合物組成物或包含該特定聚合物組成物之溶液塗佈於前述熱塑性樹脂材2之上而得。在前述熱塑性樹脂材2之上塗佈前述包含特定聚合物組成物之溶液之情況,在塗佈後使溶劑揮發即可。[Polymer composition layer 31] As described above, at least one layer of the primer layer is the polymer composition layer 31 containing a specific polymer composition. The polymer composition layer 31 can be obtained by coating the aforementioned specific polymer composition or a solution containing the specific polymer composition on the aforementioned thermoplastic resin material 2. In the case of applying the solution containing the specific polymer composition on the thermoplastic resin material 2, the solvent may be volatilized after the application.

前述聚合物組成物層31係以包含前述聚合型組成物之聚合物90質量%以上為佳,以包含95質量%以上為較佳。The aforementioned polymer composition layer 31 preferably contains 90% by mass or more of the polymer of the aforementioned polymeric composition, and more preferably 95% by mass or more.

前述特定聚合物組成物為下述(A)或(B)之聚合物組成物。 (A)聚合物組成物,其係包含:含有下述(1)~(7)之至少一種之聚合型組成物之聚合物,與無水馬來酸改質聚丙烯或改質聚苯醚; (B)聚合物組成物,其係包含:含有下述(1)~(7)之至少一種之聚合型組成物之聚合物、無水馬來酸改質聚丙烯或改質聚苯醚,及,與構成前述熱塑性樹脂材2之熱塑性樹脂為異種之熱塑性樹脂; (1)2官能異氰酸酯化合物與二醇之組合 (2)2官能異氰酸酯化合物與2官能胺基化合物之組合 (3)2官能異氰酸酯化合物與2官能硫醇化合物之組合 (4)2官能環氧化合物與二醇之組合 (5)2官能環氧化合物與2官能羧基化合物之組合 (6)2官能環氧化合物與2官能硫醇化合物之組合 (7)單官能自由基聚合性單體The aforementioned specific polymer composition is the polymer composition of (A) or (B) below. (A) A polymer composition, which includes: a polymer containing at least one of the following (1) to (7) polymeric composition, and anhydrous maleic acid modified polypropylene or modified polyphenylene ether; (B) A polymer composition, which includes: a polymer containing at least one of the following (1) to (7) polymeric composition, anhydrous maleic acid modified polypropylene or modified polyphenylene ether, and , And the thermoplastic resin constituting the aforementioned thermoplastic resin material 2 is a different kind of thermoplastic resin; (1) Combination of 2-functional isocyanate compound and diol (2) Combination of 2-functional isocyanate compound and 2-functional amino compound (3) Combination of 2-functional isocyanate compound and 2-functional thiol compound (4) Combination of 2-functional epoxy compound and diol (5) Combination of 2-functional epoxy compound and 2-functional carboxyl compound (6) Combination of 2-functional epoxy compound and 2-functional thiol compound (7) Monofunctional radical polymerizable monomer

前述(A)及(B)之聚合物組成物係以包含含有前述(4)之聚合型組成物之聚合物為佳,前述(4)係以2官能環氧樹脂與2官能酚化合物之組合為較佳。The polymer composition of the aforementioned (A) and (B) is preferably a polymer containing the polymer composition of the aforementioned (4), and the aforementioned (4) is a combination of a bifunctional epoxy resin and a bifunctional phenol compound For better.

(1)中之2官能異氰酸酯化合物與二醇之摻合量比係以設定成異氰酸酯基對羥基之莫耳當量比成為0.7~1.5為佳,較佳作成0.8~1.4,更佳作成0.9~1.3。 (2)中之2官能異氰酸酯化合物與2官能胺基化合物之摻合量比係以設定成異氰酸酯基對胺基之莫耳當量比成為0.7~1.5為佳,較佳作成0.8~1.4,更佳作成0.9~1.3。 (3)中之2官能異氰酸酯化合物與2官能硫醇化合物之摻合量比係以設定成異氰酸酯基對巰基之莫耳當量比成為0.7~1.5為佳,較佳作成0.8~1.4,更佳作成0.9~1.3。 (4)中之2官能環氧化合物與二醇之摻合量比係以設定成環氧基對羥基之莫耳當量比成為0.7~1.5為佳,較佳作0.8~1.4,更佳作成0.9~1.3。 (5)中之2官能環氧化合物與2官能羧基化合物之摻合量比係以設定成環氧基對羧基之莫耳當量比成為0.7~1.5為佳,較佳作成0.8~1.4,更佳作成0.9~1.3。 (6)中之2官能環氧化合物與2官能硫醇化合物之摻合量比係以設定成環氧基對巰基之莫耳當量比成為0.7~1.5為佳,較佳作成0.8~1.4,更佳作成0.9~1.3。(1) The blending ratio of the bifunctional isocyanate compound and the diol is set to a molar equivalent ratio of the isocyanate group to the hydroxyl group of 0.7 to 1.5, preferably 0.8 to 1.4, and more preferably 0.9 to 1.3 . (2) The blending ratio of the bifunctional isocyanate compound and the bifunctional amine group compound in (2) is set so that the molar equivalent ratio of the isocyanate group to the amine group is preferably 0.7 to 1.5, preferably 0.8 to 1.4, more preferably Make 0.9~1.3. (3) The blending ratio of the bifunctional isocyanate compound and the bifunctional thiol compound is set so that the molar equivalent ratio of the isocyanate group to the mercapto group becomes 0.7 to 1.5, preferably 0.8 to 1.4, and more preferably 0.9~1.3. (4) The blending ratio of the bifunctional epoxy compound and the diol is set so that the molar equivalent ratio of the epoxy group to the hydroxyl group is preferably 0.7~1.5, preferably 0.8~1.4, and more preferably 0.9~ 1.3. (5) The blending ratio of the bifunctional epoxy compound and the bifunctional carboxyl compound is set so that the molar equivalent ratio of the epoxy group to the carboxyl group is preferably 0.7 to 1.5, preferably 0.8 to 1.4, more preferably Make 0.9~1.3. (6) The blending ratio of the bifunctional epoxy compound and the bifunctional thiol compound is set so that the molar equivalent ratio of the epoxy group to the mercapto group is preferably 0.7 to 1.5, preferably 0.8 to 1.4, and more Good works are 0.9~1.3.

(2官能異氰酸酯化合物) 前述2官能異氰酸酯化合物為具有2個異氰酸基之化合物,可舉出例如,六亞甲基二異氰酸酯、四亞甲基二異氰酸酯、二聚物酸二異氰酸酯、2,4-或2,6-伸甲苯基二異氰酸酯(TDI)或其混合物、p-伸苯基二異氰酸酯、伸茬基二異氰酸酯、二苯基甲烷二異氰酸酯(MDI)等之二異氰酸酯化合物。其中從底漆強度之觀點,以TDI或MDI等為佳。(2-functional isocyanate compound) The aforementioned bifunctional isocyanate compound is a compound having two isocyanate groups, for example, hexamethylene diisocyanate, tetramethylene diisocyanate, dimer acid diisocyanate, 2,4- or 2,6 -Diisocyanate compounds such as tolylene diisocyanate (TDI) or mixtures thereof, p-phenylene diisocyanate, stubyl diisocyanate, diphenylmethane diisocyanate (MDI) and the like. Among them, from the standpoint of primer strength, TDI or MDI is preferred.

(二醇) 前述二醇為具有2個羥基之化合物,可舉出例如,乙二醇、丙二醇、二乙二醇、1,6己二醇等之脂肪族二醇、雙酚A、雙酚F、雙酚S等之雙酚類。其中從底漆強靭性之觀點,以丙二醇、二乙二醇等為佳。(Diol) The aforementioned diols are compounds with two hydroxyl groups, for example, aliphatic diols such as ethylene glycol, propylene glycol, diethylene glycol, 1,6 hexanediol, bisphenol A, bisphenol F, and bisphenol S and other bisphenols. Among them, propylene glycol, diethylene glycol, etc. are preferred from the standpoint of primer strength and toughness.

(2官能胺基化合物) 前述2官能胺基化合物為具有2個胺基之化合物,可舉出例如,2官能之脂肪族二胺、芳香族二胺。作為脂肪族二胺,可舉出如,乙二胺、1,2-丙二胺、1,3-丙二胺、1,4-二胺基丁烷、1,6-六亞甲基二胺、2,5-二甲基-2,5-己二胺、2,2,4-三甲基六亞甲基二胺、異佛爾酮二胺、雙(4-胺基-3-甲基環己基)甲烷、1,3-二胺基環己烷、N-胺基乙基哌嗪等,作為芳香族二胺,可舉出如二胺基二苯基甲烷、二胺基二苯基丙烷等。其中從底漆強靭性之觀點,以1,3-丙二胺、1,4-二胺基丁烷、1,6-六亞甲基二胺等為佳。(2-functional amino compound) The aforementioned bifunctional amine compound is a compound having two amine groups, and examples thereof include bifunctional aliphatic diamines and aromatic diamines. As aliphatic diamines, for example, ethylenediamine, 1,2-propanediamine, 1,3-propanediamine, 1,4-diaminobutane, 1,6-hexamethylenediamine Amine, 2,5-dimethyl-2,5-hexanediamine, 2,2,4-trimethylhexamethylenediamine, isophoronediamine, bis(4-amino-3- Methylcyclohexyl) methane, 1,3-diaminocyclohexane, N-aminoethylpiperazine, etc., as aromatic diamines, for example, diaminodiphenylmethane, diaminodiamine Phenylpropane and so on. Among them, from the standpoint of primer strength and toughness, 1,3-propanediamine, 1,4-diaminobutane, 1,6-hexamethylenediamine, etc. are preferred.

(2官能硫醇化合物) 前述2官能硫醇化合物為分子內具有2個巰基之化合物,可舉出例如,2官能2級硫醇化合物之1,4-雙(3-巰基丁醯氧基)丁烷(例如,昭和電工股份有限公司製「Karenz MT(註冊商標) BD1」)。(2-functional thiol compound) The aforementioned bifunctional thiol compound is a compound having two mercapto groups in the molecule, and for example, 1,4-bis(3-mercaptobutanoyloxy)butane (for example, Showa Denko A company limited by shares "Karenz MT (registered trademark) BD1").

(2官能環氧化合物) 前述2官能環氧化合物為1分子中具有2個環氧基之化合物。可舉出例如,雙酚A型環氧樹脂、雙酚F型環氧樹脂、雙酚S型環氧樹脂、聯酚型環氧樹脂、萘型2官能環氧樹脂等之芳香族環氧樹脂或1,6-己二醇二環氧丙基醚等脂肪族環氧化合物。 該等之中,可單獨使用1種,亦可併用2種以上。 具體地可舉出如三菱化學股份有限公司製「jER(註冊商標)828」、同「jER(註冊商標)834」、同「jER(註冊商標)1001」、同「jER(註冊商標)1004」、同「jER(註冊商標)YX-4000」等。其他,只要2官能者,也可使用特殊構造之環氧化合物。該等之中,可單獨使用1種,亦可併用2種以上。(2-functional epoxy compound) The aforementioned bifunctional epoxy compound is a compound having two epoxy groups in one molecule. For example, aromatic epoxy resins such as bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type epoxy resin, biphenol type epoxy resin, naphthalene type bifunctional epoxy resin, etc. Or aliphatic epoxy compounds such as 1,6-hexanediol diglycidyl ether. Among these, one type may be used alone, or two or more types may be used in combination. Specific examples include "jER (registered trademark) 828" manufactured by Mitsubishi Chemical Corporation, the same as "jER (registered trademark) 834", the same as "jER (registered trademark) 1001", and the same as "jER (registered trademark) 1004" , Same as "jER (registered trademark) YX-4000" etc. In addition, as long as it is bifunctional, epoxy compounds with a special structure can also be used. Among these, one type may be used alone, or two or more types may be used in combination.

(2官能羧基化合物) 作為前述2官能羧基化合物,只要係具有2個羧基之化合物即可,可舉出例如,草酸、丙二酸、琥珀酸、戊二酸、己二酸、馬來酸、富馬酸、異酞酸、對酞酸等。其中從底漆之強度或強靭性之觀點,以異酞酸、對酞酸、己二酸等為佳。(2-functional carboxyl compound) As the aforementioned bifunctional carboxyl compound, as long as it is a compound having 2 carboxyl groups, for example, oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, maleic acid, fumaric acid, isophthalic acid Acid, terephthalic acid, etc. Among them, from the standpoint of the strength or toughness of the primer, isophthalic acid, terephthalic acid, adipic acid, etc. are preferred.

(單官能自由基聚合性單體) 前述單官能自由基聚合性單體為具有1個乙烯性不飽和鍵之單體。例如,苯乙烯單體;苯乙烯之α-,o-,m-,p-烷基、硝基、氰基、醯胺、酯衍生物;氯苯乙烯、乙烯基甲苯、二乙烯基苯等之苯乙烯系單體;(甲基)丙烯酸乙酯、(甲基)丙烯酸甲酯、(甲基)丙烯酸-n-丙基、(甲基)丙烯酸-i-丙基、(甲基)丙烯酸己基、(甲基)丙烯酸2-乙基己基酯、(甲基)丙烯酸月桂基酯、(甲基)丙烯酸十二基酯、(甲基)丙烯酸環戊基酯、(甲基)丙烯酸環己基酯、(甲基)丙烯酸四氫呋喃基酯、乙醯乙醯氧基乙基(甲基)丙烯酸酯、二環戊烯氧基乙基(甲基)丙烯酸酯及苯氧基乙基(甲基)丙烯酸酯、環氧丙基(甲基)丙烯酸酯等之(甲基)丙烯酸酯類。前述化合物之中,可使用1種,亦可使用2種以上。其中從底漆之強度或強靭性之觀點,以苯乙烯、(甲基)丙烯酸甲酯、(甲基)丙烯酸2-乙基己基酯、苯氧基乙基(甲基)丙烯酸酯之中之一種,或2種以上之組合為佳。 在取得單官能自由基聚合性單體之自由基聚合物之際,為了使自由基聚合反應充分地進行而取得所欲之聚合物,含有自由基聚合性單體之組成物亦可包含溶劑,或因應必要之著色劑等之添加劑。此時,前述組成物之溶劑以外之含有成分中,以前述單官能自由基聚合性單體係主成分為佳。前述主成分係意指前述單官能自由基聚合性單體之含有率為50~100質量%。前述含有率係以60質量%以上為佳,較佳為80質量%以上。 作為自由基聚合反應用之聚合起始劑,可適宜使用例如,公知之有機過氧化物或光起始劑等。也可使用對有機過氧化物組合鈷金屬鹽或胺類而成之常溫自由基聚合起始劑。作為有機過氧化物,可舉出如被分類在過氧化酮、過氧化縮酮、氫過氧化物、二烯丙基過氧化物、二醯基過氧化物、過氧化酯、過氧化二碳酸酯者。作為光起始劑,以在從紫外線至可見光線下能開始聚合開始者為理想。 自由基聚合反應雖也係根據反應化合物等之種類而不同,但以在常溫~200℃下加熱5~90分鐘來進行為佳。又在光硬化之情況,照射紫外線或可見光來進行聚合反應。 尚且,本說明書中,常溫係指5~35℃,以15~25℃為佳。(Monofunctional radical polymerizable monomer) The aforementioned monofunctional radical polymerizable monomer is a monomer having one ethylenically unsaturated bond. For example, styrene monomer; styrene α-, o-, m-, p-alkyl, nitro, cyano, amide, ester derivatives; chlorostyrene, vinyl toluene, divinylbenzene, etc. The styrenic monomers; ethyl (meth)acrylate, methyl (meth)acrylate, (meth)acrylic acid-n-propyl, (meth)acrylic acid-i-propyl, (meth)acrylic acid Hexyl, 2-ethylhexyl (meth)acrylate, lauryl (meth)acrylate, lauryl (meth)acrylate, cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate Ester, tetrahydrofuryl (meth)acrylate, acetoxyethyl (meth)acrylate, dicyclopentenoxyethyl (meth)acrylate and phenoxyethyl (meth) (Meth)acrylates such as acrylate and glycidyl (meth)acrylate. Among the aforementioned compounds, one type may be used, or two or more types may be used. Among them, from the standpoint of primer strength or toughness, among styrene, methyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and phenoxyethyl (meth)acrylate One type or a combination of two or more types is preferred. When obtaining a radical polymer of a monofunctional radical polymerizable monomer, the composition containing the radical polymerizable monomer may also include a solvent in order to allow the radical polymerization reaction to proceed sufficiently to obtain the desired polymer. Or additives such as coloring agents if necessary. In this case, among the components other than the solvent of the aforementioned composition, the aforementioned monofunctional radical polymerizable single-system main component is preferred. The aforementioned main component means that the content of the aforementioned monofunctional radical polymerizable monomer is 50-100% by mass. The aforementioned content rate is preferably 60% by mass or more, and more preferably 80% by mass or more. As the polymerization initiator for radical polymerization reaction, for example, well-known organic peroxides or photoinitiators can be suitably used. It is also possible to use a room temperature free radical polymerization initiator formed by combining organic peroxides with cobalt metal salts or amines. Examples of organic peroxides include ketone peroxides, ketal peroxides, hydroperoxides, diallyl peroxides, diacyl peroxides, peroxyesters, and peroxydicarbonic acids. Esters. As a photoinitiator, it is ideal to start polymerization under ultraviolet to visible light. Although the radical polymerization reaction also differs depending on the type of reaction compound, etc., it is better to heat it at room temperature to 200°C for 5 to 90 minutes. In the case of light curing, ultraviolet or visible light is irradiated to carry out the polymerization reaction. Moreover, in this manual, normal temperature refers to 5~35℃, preferably 15~25℃.

藉由在前述熱塑性樹脂材2上層合聚合物組成物層31作為底漆層3,而能強固地熔接前述熱塑性樹脂材2,與同種之熱塑性樹脂材或異種之熱塑性樹脂材。尤其,前述聚合物組成物層31係以與前述熱塑性樹脂材2直接接觸之層為佳。 尚且,作為前述聚合物組成物,以選擇包含與構成前述熱塑性樹脂材2之熱塑性樹脂為同種或類似之熱塑性樹脂的組成物為佳。例如,前述熱塑性樹脂材2為聚丙烯之情況,藉由使用包含無水馬來酸改質聚丙烯之聚合物組成物,而變得能更強固熔接。又,前述熱塑性樹脂材2為改質聚苯醚之情況,藉由使用包含改質聚苯醚之聚合物組成物,而變得更強固熔接。By laminating the polymer composition layer 31 on the thermoplastic resin material 2 as the primer layer 3, the thermoplastic resin material 2 can be strongly welded to the same kind of thermoplastic resin material or a different kind of thermoplastic resin material. In particular, the polymer composition layer 31 is preferably a layer directly in contact with the thermoplastic resin material 2. Furthermore, as the aforementioned polymer composition, it is preferable to select a composition containing the same or similar thermoplastic resin as the thermoplastic resin constituting the aforementioned thermoplastic resin material 2. For example, in the case where the aforementioned thermoplastic resin material 2 is polypropylene, by using a polymer composition containing anhydrous maleic acid-modified polypropylene, it can be more strongly welded. In addition, when the aforementioned thermoplastic resin material 2 is modified polyphenylene ether, by using a polymer composition containing modified polyphenylene ether, a stronger fusion bond is achieved.

也能以包含前述聚合物組成物層31之複數層來構成前述底漆層3。前述底漆層3在包含複數層之情況,必須之聚合物組成物層31係以層合在與前述熱塑性樹脂材2為反對側之最表面上為佳。The primer layer 3 may also be constituted by a plurality of layers including the polymer composition layer 31. When the primer layer 3 includes a plurality of layers, the necessary polymer composition layer 31 is preferably laminated on the outermost surface on the side opposite to the thermoplastic resin material 2.

(聚合物組成物層A) 聚合物組成物層31之實施形態之一種之聚合物組成物層A係包含前述(A)聚合物組成物。 構成聚合物組成物層A之聚合物係可藉由在無水馬來酸改質聚丙烯或改質聚苯醚之溶液中,使前述(1)~(6)之至少一種在觸媒存在下進行加成聚合反應而得。作為加成聚合反應用之觸媒,適宜使用例如,三乙基胺、2,4,6-參(二甲基胺基甲基)酚等之3級胺-三苯基膦等之磷系化合物等。前述加成聚合反應雖也係根據組成物之組成而不同,但以在常溫~200℃下加熱5~120分鐘來進行為佳。 具體而言,聚合物組成物層A係可在將含有前述(1)~(6)之至少一種之聚合型組成物與無水馬來酸改質聚丙烯或改質聚苯醚之混合物塗佈在前述熱塑性樹脂材2之前,預先進行加成聚合反應,將包含該反應物之混合物塗佈於前述熱塑性樹脂材2之上來形成。(Polymer composition layer A) The polymer composition layer A, which is one of the embodiments of the polymer composition layer 31, contains the aforementioned (A) polymer composition. The polymer constituting the polymer composition layer A can be made by making at least one of the aforementioned (1) to (6) in a solution of anhydrous maleic acid modified polypropylene or modified polyphenylene ether in the presence of a catalyst It is obtained by addition polymerization reaction. As the catalyst for the addition polymerization reaction, for example, triethylamine, 2,4,6-ginseng (dimethylaminomethyl)phenol and other tertiary amine-triphenylphosphine and other phosphorus-based catalysts are suitably used. Compound etc. Although the aforementioned addition polymerization reaction also differs according to the composition of the composition, it is preferably carried out by heating at room temperature to 200°C for 5 to 120 minutes. Specifically, the polymer composition layer A can be coated with a mixture of a polymeric composition containing at least one of the aforementioned (1) to (6) and anhydrous maleic acid-modified polypropylene or modified polyphenylene ether Before the thermoplastic resin material 2, an addition polymerization reaction is performed in advance, and a mixture containing the reactant is applied on the thermoplastic resin material 2 to form it.

構成聚合物組成物層A之聚合物係可使含有前述(7)之單官能自由基聚合性單體之組成物在無水馬來酸改質聚丙烯或改質聚苯醚之溶液中進行自由基聚合反應而得。前述加成聚合反應係也係根據組成物之組成而不同,但以在常溫~200℃下加熱5~90分鐘來進行為佳。又在光硬化之情況,照射紫外線或可見光來進行聚合反應。 具體而言,聚合物組成物層A可將包含使含有前述(7)之單官能自由基聚合性單體之聚合型組成物與無水馬來酸改質聚丙烯或改質聚苯醚進行混合並加熱而得之自由基聚合反應物的混合物塗佈在前述熱塑性樹脂材2之上來形成。The polymer constituting the polymer composition layer A can free the composition containing the monofunctional radical polymerizable monomer of the aforementioned (7) in a solution of anhydrous maleic acid modified polypropylene or modified polyphenylene ether Based on polymerization reaction. The aforementioned addition polymerization reaction system also differs according to the composition of the composition, but it is preferably carried out by heating at room temperature to 200°C for 5 to 90 minutes. In the case of light curing, ultraviolet or visible light is irradiated to carry out the polymerization reaction. Specifically, the polymer composition layer A may include a polymerized composition containing the monofunctional radical polymerizable monomer of (7) above and anhydrous maleic acid-modified polypropylene or modified polyphenylene ether. The mixture of the radical polymerization reactants obtained by heating is applied on the aforementioned thermoplastic resin material 2 to be formed.

(無水馬來酸改質聚丙烯) 無水馬來酸改質聚丙烯為以無水馬來酸來接枝改質之聚丙烯。如有化藥AKZO公司製Kayabrid 002PP、002PP-NW、003PP、003PP-NW、三菱化學公司製Modic系列等。 又亦可併用BYK公司製SCONA TPPP2112GA、TPPP8112GA、TPPP9212GA作為以無水馬來酸來機能化之聚丙烯添加劑。(Anhydrous maleic acid modified polypropylene) Anhydrous maleic acid modified polypropylene is a polypropylene modified by grafting anhydrous maleic acid. For example, there are Kayabrid 002PP, 002PP-NW, 003PP, 003PP-NW manufactured by AKZO, Modic series manufactured by Mitsubishi Chemical Corporation, etc. SCONA TPPP2112GA, TPPP8112GA, and TPPP9212GA manufactured by BYK can also be used together as polypropylene additives functionalized with anhydrous maleic acid.

(改質聚苯醚) 作為前述改質聚苯醚,可使用公知者。 改質聚苯醚為對聚苯醚摻合聚苯乙烯、聚醯胺、聚苯硫醚、聚丙烯等而成者,如有SABIC公司製NORYL系列(PPS/PS):731、7310、731F、7310F,旭化成化學公司製Zylon系列(PPE/PS、PP/PPE、PA/PPE、PPS/PPE、PPA/PPE)、三菱工程塑料公司製Iupiace系列、Lemalloy系列(PPE/PS、PPE/PA)。(Modified polyphenylene ether) As the aforementioned modified polyphenylene ether, a known one can be used. Modified polyphenylene ether is made of polyphenylene ether blended with polystyrene, polyamide, polyphenylene sulfide, polypropylene, etc., such as NORYL series (PPS/PS) manufactured by SABIC: 731, 7310, 731F , 7310F, Zylon series manufactured by Asahi Kasei Chemical Company (PPE/PS, PP/PPE, PA/PPE, PPS/PPE, PPA/PPE), Iupiace series manufactured by Mitsubishi Engineering Plastics, Lemalloy series (PPE/PS, PPE/PA) .

在取得前述聚合物組成物層A時所使用之前述(1)~(7)之合計量,在將無水馬來酸改質聚丙烯或改質聚苯醚設為100質量份,以5~100質量份為佳,以10~60質量份為較佳,以20~40質量份為更佳。The total amount of the aforementioned (1) to (7) used when obtaining the aforementioned polymer composition layer A is set to 100 parts by mass of anhydrous maleic acid-modified polypropylene or modified polyphenylene ether, and 5~ 100 parts by mass is preferable, 10-60 parts by mass is more preferable, and 20-40 parts by mass is more preferable.

(聚合物組成物層B) 聚合物組成物層31之實施形態之一種之聚合物組成物層B係包含前述(B)聚合物組成物。 聚合物組成物層B係可在無水馬來酸改質聚丙烯或改質聚苯醚之溶液中,使前述(1)~(6)之至少一種在觸媒存在下進行加成聚合反應後,將其混合於與構成熱塑性樹脂材2之熱塑性樹脂為異種之熱塑性樹脂中而得。或,也可在包含與構成熱塑性樹脂材2之熱塑性樹脂為異種之熱塑性樹脂之溶液中,使前述(1)~(6)之至少一種在觸媒存在下進行加成聚合反應後,再與無水馬來酸改質聚丙烯或改質聚苯醚進行混合而得。或,可使無水馬來酸改質聚丙烯或改質聚苯醚、與構成熱塑性樹脂材2之熱塑性樹脂為異種之熱塑性樹脂,及前述(1)~(6)之至少一種在觸媒存在下進行加成聚合反應而得。作為加成聚合反應用之觸媒,適宜使用例如,三乙基胺、2,4,6-參(二甲基胺基甲基)酚等之3級胺、三苯基膦等之磷系化合物等。前述加成聚合反應雖也係根據組成物之組成而不同,但以在常溫~200℃下加熱5~120分鐘來進行為佳。 具體而言,例如,聚合物組成物層B係可將包含反應物的混合物塗佈於前述熱塑性樹脂材2之上來形成,該反應物係使無水馬來酸改質聚丙烯或改質聚苯醚、與構成熱塑性樹脂材2之熱塑性樹脂為異種之熱塑性樹脂,及,含有前述(1)~(6)之至少一種之聚合型組成物之混合物進行加熱而得者。(Polymer composition layer B) The polymer composition layer B, which is one of the embodiments of the polymer composition layer 31, contains the aforementioned (B) polymer composition. The polymer composition layer B can be in a solution of anhydrous maleic acid modified polypropylene or modified polyphenylene ether, after at least one of the aforementioned (1) to (6) is subjected to addition polymerization reaction in the presence of a catalyst , It is obtained by mixing it with a thermoplastic resin that is different from the thermoplastic resin constituting the thermoplastic resin material 2. Or, in a solution containing a thermoplastic resin different from the thermoplastic resin constituting the thermoplastic resin material 2, at least one of the aforementioned (1) to (6) may be subjected to addition polymerization reaction in the presence of a catalyst, and then with It is obtained by mixing anhydrous maleic acid modified polypropylene or modified polyphenylene ether. Or, anhydrous maleic acid-modified polypropylene or modified polyphenylene ether, and the thermoplastic resin constituting the thermoplastic resin material 2 can be a different kind of thermoplastic resin, and at least one of the aforementioned (1) to (6) is present in the catalyst The following addition polymerization reaction is obtained. As a catalyst for addition polymerization, for example, tertiary amines such as triethylamine, 2,4,6-ginseng (dimethylaminomethyl)phenol, and phosphorus-based amines such as triphenylphosphine are suitably used. Compound etc. Although the aforementioned addition polymerization reaction also differs according to the composition of the composition, it is preferably carried out by heating at room temperature to 200°C for 5 to 120 minutes. Specifically, for example, the polymer composition layer B can be formed by coating the aforementioned thermoplastic resin material 2 with a mixture containing a reactant that modifies polypropylene or modified polystyrene with anhydrous maleic acid. The ether and the thermoplastic resin constituting the thermoplastic resin material 2 are different kinds of thermoplastic resins, and are obtained by heating a mixture of a polymerized composition containing at least one of the aforementioned (1) to (6).

聚合物組成物層B係也可使含有前述(7)之單官能自由基聚合性單體之組成物,在包含無水馬來酸改質聚丙烯或改質聚苯醚,及,與構成熱塑性樹脂材2之熱塑性樹脂為異種之熱塑性樹脂之溶液中進行自由基聚合反應而得。前述加成聚合反應係也係根據組成物之組成而不同,但以在常溫~200℃下加熱5~90分鐘來進行為佳。又在光硬化之情況,照射紫外線或可見光來進行聚合反應。 具體而言,例如,聚合物組成物層B係可將包含反應物的混合物塗佈於前述熱塑性樹脂材2之上來形成,該反應物為對含有前述(7)之單官能自由基聚合性單體之聚合型組成物之聚合物混合無水馬來酸改質聚丙烯或改質聚苯醚,及,與構成熱塑性樹脂材2之熱塑性樹脂為異種之熱塑性樹脂並加熱而得者。The polymer composition layer B can also be made of a composition containing the monofunctional radical polymerizable monomer of (7) above, including anhydrous maleic acid modified polypropylene or modified polyphenylene ether, and, with a thermoplastic composition The thermoplastic resin of the resin material 2 is obtained by radical polymerization in a solution of a different kind of thermoplastic resin. The aforementioned addition polymerization reaction system also differs according to the composition of the composition, but it is preferably carried out by heating at room temperature to 200°C for 5 to 90 minutes. In the case of light curing, ultraviolet or visible light is irradiated to carry out the polymerization reaction. Specifically, for example, the polymer composition layer B can be formed by coating a mixture containing a reactant on the thermoplastic resin material 2, which reacts with the monofunctional radical polymerizable monomer containing the aforementioned (7) It is obtained by mixing anhydrous maleic acid-modified polypropylene or modified polyphenylene ether with the polymer of the polymeric composition of the body, and the thermoplastic resin constituting the thermoplastic resin material 2 is a different kind of thermoplastic resin and heated.

尚且,取得形成前述聚合物組成物層之聚合物組成物時所產生之反應方式則有多種方式如無水馬來酸改質聚丙烯或改質聚苯醚與2官能環氧樹脂之反應、無水馬來酸改質聚丙烯或改質聚苯醚與2官能酚化合物之反應等,且,也無法包括性地表現基於該組合之具體態樣。因此,藉由構造或特性來直接特定前述聚合物組成物可謂係不可能或不實際。Moreover, there are many ways of reaction when obtaining the polymer composition forming the aforementioned polymer composition layer, such as the reaction of anhydrous maleic acid modified polypropylene or modified polyphenylene ether with bifunctional epoxy resin, anhydrous The reaction of maleic acid-modified polypropylene or modified polyphenylene ether with a bifunctional phenol compound, etc., cannot include the specific state based on the combination. Therefore, it may be impossible or impractical to directly specify the aforementioned polymer composition by its structure or characteristics.

[熱硬化性樹脂層32] 以包含前述聚合物組成物層31之複數層來構成底漆層3之情況,如圖2所示般,底漆層3係也可在聚合物組成物層31與熱塑性樹脂材2之間包含由包含熱硬化性樹脂之組成物所形成而成之熱硬化性樹脂層32。 尚且,前述包含熱硬化性樹脂之組成物為了使前述熱硬化性樹脂之硬化反應充分進行而形成所欲之熱硬化性樹脂層,亦可包含溶劑,或因應必要之著色劑等之添加劑。於此情況,在前述組成物之溶劑以外之含有成分中,以前述熱硬化性樹脂為主成分為佳。前述主成分係意指前述熱硬化性樹脂之含有率為40~100質量%。前述含有率係以60質量%以上為佳,較佳為70質量%以上,更佳為80質量%以上。[Thermosetting resin layer 32] In the case where the primer layer 3 is constituted by a plurality of layers including the aforementioned polymer composition layer 31, as shown in FIG. 2, the primer layer 3 may also be included between the polymer composition layer 31 and the thermoplastic resin material 2. The thermosetting resin layer 32 is formed of a composition containing a thermosetting resin. Furthermore, the composition containing the thermosetting resin may contain a solvent or additives such as a coloring agent if necessary in order to fully advance the curing reaction of the thermosetting resin to form a desired thermosetting resin layer. In this case, among the components other than the solvent of the aforementioned composition, the aforementioned thermosetting resin is preferably used as the main component. The aforementioned main component means that the content of the aforementioned thermosetting resin is 40-100% by mass. The aforementioned content rate is preferably 60% by mass or more, preferably 70% by mass or more, and more preferably 80% by mass or more.

作為前述熱硬化性樹脂,可舉出例如,胺基甲酸酯樹脂、環氧樹脂、乙烯基酯樹脂、不飽和聚酯樹脂。 熱硬化性樹脂層32係能以該等樹脂之中之單獨1種來形成,亦可混合2種以上來形成。又或,也能以複數層來構成熱硬化性樹脂層32,並使用包含相異種類之熱硬化性樹脂之組成物來形成各層。Examples of the thermosetting resin include urethane resins, epoxy resins, vinyl ester resins, and unsaturated polyester resins. The thermosetting resin layer 32 can be formed by one type of these resins alone, or can be formed by mixing two or more types. Alternatively, the thermosetting resin layer 32 may be composed of a plurality of layers, and each layer may be formed using a composition containing different kinds of thermosetting resins.

藉由前述包含熱硬化性樹脂之單體之組成物來形成熱硬化性樹脂層32之塗覆方法並非係受到特別限定者,可舉出例如,噴塗法、浸漬法等。The coating method of forming the thermosetting resin layer 32 from the composition containing the monomer of the thermosetting resin is not particularly limited, and examples thereof include spraying methods and dipping methods.

尚且,本實施態樣所稱之熱硬化性樹脂係廣泛地意指交聯硬化之樹脂,而不受限於加熱硬化型,也係作為包括常溫硬化型或光硬化型者。前述光硬化型係藉由可見光或紫外線之照射而能達成短時間內之硬化者。亦可將前述光硬化型與加熱硬化型及/或常溫硬化型併用。作為前述光硬化型,可舉出例如,昭和電工股份有限公司製「Ripoxy(註冊商標)LC-760」、同「Ripoxy(註冊商標)LC-720」等之乙烯基酯樹脂。In addition, the thermosetting resin referred to in this embodiment broadly refers to a cross-linked and hardened resin, and is not limited to a heat-curing type, but also includes a room-temperature-curing type or a light-curing type. The aforementioned photo-curing type is one that can achieve curing in a short time by irradiation of visible light or ultraviolet light. It is also possible to use the aforementioned light-curing type, heat-curing type and/or room-temperature curing type in combination. Examples of the photocurable type include vinyl ester resins such as "Ripoxy (registered trademark) LC-760" manufactured by Showa Denko Co., Ltd., and the same "Ripoxy (registered trademark) LC-720".

(胺基甲酸酯樹脂) 前述胺基甲酸酯樹脂通常係藉由異氰酸酯化合物之異氰酸基與多元醇化合物之羥基之反應而得之樹脂,以該當於在ASTM D16中,定義成「包含不揮發媒液成分10wt%以上之聚異氰酸酯之塗料」者之胺基甲酸酯樹脂為佳。前述胺基甲酸酯樹脂可為單液型,亦可為二液型。(Urethane resin) The aforementioned urethane resin is usually a resin obtained by the reaction between the isocyanate group of the isocyanate compound and the hydroxyl group of the polyol compound. It should be defined in ASTM D16 as "containing 10wt% of non-volatile vehicle components. The urethane resin of the above-mentioned polyisocyanate coating is preferred. The aforementioned urethane resin may be a single-component type or a two-component type.

作為單液型胺基甲酸酯樹脂,可舉出例如,油改質型(藉由不飽和脂肪酸基之氧化聚合而進行硬化者)、濕氣硬化型(藉由異氰酸基與空氣中之水之反應而進行硬化者)、封端型(封端劑藉由加熱進行解離而再生之異氰酸基與羥基進行反應而硬化者)、漆(Lacquer)型(藉由溶劑進行揮發乾燥而進行硬化者)等。該等之中,從操作容易性等之觀點,適宜使用濕氣硬化型單液胺基甲酸酯樹脂。具體地可舉出如昭和電工股份有限公司製「UM-50P」等。Examples of one-component urethane resins include oil-modified type (cured by oxidative polymerization of unsaturated fatty acid groups), moisture curing type (by isocyanate groups and air It is hardened by the reaction of water), blocked type (blocking agent dissociates by heating and regenerated isocyanate group reacts with hydroxyl to harden), lacquer type (vaporizes and drys by solvent) And those who undergo hardening) and so on. Among these, from the viewpoint of ease of handling, etc., a moisture-curable single-liquid urethane resin is suitably used. Specifically, "UM-50P" manufactured by Showa Denko Co., Ltd. can be cited.

作為二液型胺基甲酸酯樹脂,可舉出例如,觸媒硬化型(異氰酸基與空氣中之水等在觸媒存在下反應而進行硬化者)、多元醇硬化型(藉由異氰酸基與多元醇化合物之羥基之反應而進行硬化者)等。The two-component urethane resin includes, for example, a catalyst hardening type (the isocyanate group reacts with water in the air to cure in the presence of a catalyst), and a polyol hardening type (by The reaction between the isocyanate group and the hydroxyl group of the polyol compound for curing), etc.

作為前述多元醇硬化型中之多元醇化合物,可舉出例如,聚酯多元醇、聚醚多元醇、酚樹脂等。 又,作為前述多元醇硬化型中之具有異氰酸基之異氰酸酯化合物,可舉出例如,六亞甲基二異氰酸酯(HDI)、四亞甲基二異氰酸酯、二聚物酸二異氰酸酯等之脂肪族異氰酸酯;2,4-或2,6-伸甲苯基二異氰酸酯(TDI)或其混合物、p-伸苯基二異氰酸酯、伸茬基二異氰酸酯、二苯基甲烷二異氰酸酯(MDI)或其多核體混合物之聚合型MDI等之芳香族異氰酸酯;異佛爾酮二異氰酸酯(IPDI)等之脂環族異氰酸酯等。 前述多元醇硬化型之二液型胺基甲酸酯樹脂中之前述多元醇化合物與前述異氰酸酯化合物之配合比在以羥基/異氰酸基之莫耳當量比計,以0.7~1.5之範圍為佳。Examples of the polyol compound in the polyol curing type include polyester polyol, polyether polyol, phenol resin, and the like. In addition, as the isocyanate compound having an isocyanate group in the aforementioned polyol curing type, for example, fatty acids such as hexamethylene diisocyanate (HDI), tetramethylene diisocyanate, and dimer acid diisocyanate can be mentioned. Group isocyanate; 2,4- or 2,6-tolylylene diisocyanate (TDI) or mixtures thereof, p-phenylene diisocyanate, stubyl diisocyanate, diphenylmethane diisocyanate (MDI) or its polynuclear Aromatic isocyanates such as polymeric MDI; isophorone diisocyanate (IPDI) and other alicyclic isocyanates. The mixing ratio of the polyol compound and the isocyanate compound in the polyol-curable two-component urethane resin is based on the molar equivalent ratio of the hydroxyl group/isocyanate group, which is in the range of 0.7 to 1.5 good.

作為前述二液型胺基甲酸酯樹脂中所使用之胺基甲酸酯化觸媒,可舉出例如,三乙二胺、四甲基胍、N,N,N’,N’-四甲基己-1,6-二胺、二甲基醚胺、N,N,N’,N’’,N’’-五甲基二伸丙基-三胺、N-甲基嗎啉、雙(2-二甲基胺基乙基)醚、二甲基胺基乙氧基乙醇-三乙基胺等之胺系觸媒;二丁基錫二乙酸酯、二丁基錫二月桂酸酯、二丁基錫硫代羧酸鹽、二丁基錫二馬來酸鹽等之有機錫系觸媒等。 前述多元醇硬化型中,一般而言,相對於前述多元醇化合物100質量份,以摻合前述胺基甲酸酯化觸媒0.01~10質量份為佳。As the urethane catalyst used in the aforementioned two-component urethane resin, for example, triethylenediamine, tetramethylguanidine, N,N,N',N'-tetra Methylhexyl-1,6-diamine, dimethyl ether amine, N,N,N',N'',N''-pentamethyldipropylene-triamine, N-methylmorpholine, Amine catalysts such as bis(2-dimethylaminoethyl) ether, dimethylaminoethoxyethanol-triethylamine, etc.; dibutyltin diacetate, dibutyltin dilaurate, two Organotin catalysts such as butyl tin thiocarboxylate and dibutyl tin dimaleate. In the above-mentioned polyol curing type, generally, 0.01-10 parts by mass of the urethane catalyst is preferably blended with respect to 100 parts by mass of the above-mentioned polyol compound.

(環氧樹脂) 前述環氧樹脂為1分子中具有至少2個環氧基之樹脂。 作為前述環氧樹脂之硬化前之預聚物,可舉出例如,醚系雙酚型環氧樹脂、酚醛型環氧樹脂、聚酚型環氧樹脂、脂肪族型環氧樹脂、酯系之芳香族環氧樹脂、環狀脂肪族環氧樹脂、醚・酯系環氧樹脂等,該等之中係以適宜使用雙酚A型環氧樹脂。該等之中,可單獨使用1種,亦可併用2種以上。 作為雙酚A型環氧樹脂,具體地可舉出如三菱化學股份有限公司製「jER(註冊商標)828」、同「jER(註冊商標)1001」等。 作為酚醛型環氧樹脂,具體地可舉出如陶氏化學公司製「D.E.N.(註冊商標)438(註冊商標)」等。(Epoxy resin) The aforementioned epoxy resin is a resin having at least two epoxy groups in one molecule. As the prepolymer before curing of the aforementioned epoxy resin, for example, ether type bisphenol type epoxy resin, novolac type epoxy resin, polyphenol type epoxy resin, aliphatic type epoxy resin, and ester type epoxy resin can be mentioned. Aromatic epoxy resins, cycloaliphatic epoxy resins, ether and ester epoxy resins, etc., among them, bisphenol A epoxy resins are suitably used. Among these, one type may be used alone, or two or more types may be used in combination. Specific examples of the bisphenol A epoxy resin include "jER (registered trademark) 828" manufactured by Mitsubishi Chemical Corporation, "jER (registered trademark) 1001" and the like. Specific examples of the novolac epoxy resin include "D.E.N. (registered trademark) 438 (registered trademark)" manufactured by The Dow Chemical Company.

作為前述環氧樹脂所使用之硬化劑,可舉出例如,脂肪族胺、芳香族胺、酸酐、酚樹脂、硫醇類、咪唑類、陽離子觸媒等之公知之硬化劑。前述硬化劑藉由與長鏈脂肪族胺或/及硫醇類之併用,而可取得伸長率大,且耐衝撃性優異之效果。 作為前述硫醇類之具體例,可舉出如,與作為後述之形成含官能基層用之硫醇化合物所例示者為相同之化合物。該等之中,從伸長率及耐衝撃性之觀點,以季戊四醇肆(3-巰基丁酸酯)(例如,昭和電工股份有限公司製「Karenz MT(註冊商標)PE1」)為佳。Examples of the curing agent used for the epoxy resin include known curing agents such as aliphatic amines, aromatic amines, acid anhydrides, phenol resins, mercaptans, imidazoles, and cationic catalysts. The aforementioned hardener can be used in combination with long-chain aliphatic amines or/and mercaptans to achieve high elongation and excellent impact resistance. Specific examples of the aforementioned thiols include, for example, the same compounds as those exemplified as the thiol compound for forming a functional group-containing layer described later. Among them, from the viewpoint of elongation and impact resistance, pentaerythritol 4 (3-mercaptobutyrate) (for example, "Karenz MT (registered trademark) PE1" manufactured by Showa Denko Co., Ltd.) is preferred.

(乙烯基酯樹脂) 前述乙烯基酯樹脂係使乙烯基酯化合物溶解於聚合性單體(例如,苯乙烯等)者。雖然也係稱為環氧基(甲基)丙烯酸酯樹脂,但前述乙烯基酯樹脂中也係作為包括胺基甲酸酯(甲基)丙烯酸酯樹脂者。 作為前述乙烯基酯樹脂,也可使用例如,「聚酯樹脂手冊」(日刊工業新聞社、1988年發行)、「塗料用語辭典」(色材協會、1993年發行)等記載者,又,具體地可舉出如昭和電工股份有限公司製「Ripoxy(註冊商標)R-802」、同「Ripoxy(註冊商標)R-804」、同「Ripoxy(註冊商標)R-806」等。(Vinyl ester resin) The aforementioned vinyl ester resin is one in which a vinyl ester compound is dissolved in a polymerizable monomer (for example, styrene, etc.). Although it is also referred to as epoxy (meth)acrylate resin, among the aforementioned vinyl ester resins, a urethane (meth)acrylate resin is also included. As the aforementioned vinyl ester resin, for example, those described in "Polyester Resin Handbook" (Nikkan Kogyo Shimbun, published in 1988), "Dictionary of Paint Terms" (Colored Materials Association, published in 1993), etc., can also be used. Examples of locations include "Ripoxy (registered trademark) R-802" manufactured by Showa Denko Co., Ltd., "Ripoxy (registered trademark) R-804", and "Ripoxy (registered trademark) R-806".

作為前述胺基甲酸酯(甲基)丙烯酸酯樹脂,可舉出例如,使異氰酸酯化合物與多元醇化合物反應後,再使含羥基之(甲基)丙烯醯基單體(及,因應必要之含羥基之烯丙基醚單體)反應而得之含自由基聚合性不飽和基之寡聚物。具體地可舉出如昭和電工股份有限公司製「Ripoxy(註冊商標)R-6545」等。As the aforementioned urethane (meth)acrylate resin, for example, after reacting an isocyanate compound with a polyol compound, a hydroxyl-containing (meth)acrylic monomer (and, as necessary) (Hydroxy-containing allyl ether monomers) are oligomers containing radically polymerizable unsaturated groups obtained by reaction. Specifically, "Ripoxy (registered trademark) R-6545" manufactured by Showa Denko Co., Ltd. can be cited.

前述乙烯基酯樹脂係能以由在有機過氧化物等之觸媒存在下之加熱所成自由基聚合來使其硬化。 作為前述有機過氧化物,並非係受到特別限定者,可舉出例如,過氧化酮類、過氧化縮酮類、氫過氧化物類、二烯丙基過氧化物類、二醯基過氧化物類、過氧化酯類、過氧化二碳酸酯類等。藉由將該等與鈷金屬鹽等組合,從而也變得能在常溫下硬化。 作為前述鈷金屬鹽,並非係受到特別限定者,可舉出例如,環烷酸鈷、辛酸鈷、氫氧化鈷等。該等之中,以環烷酸鈷或/及辛酸鈷為佳。The aforementioned vinyl ester resin can be cured by radical polymerization formed by heating in the presence of a catalyst such as an organic peroxide. The aforementioned organic peroxides are not particularly limited, and examples include ketone peroxides, peroxide ketals, hydroperoxides, diallyl peroxides, and diacyl peroxides. Materials, peroxyesters, peroxydicarbonates, etc. By combining these with cobalt metal salt, etc., it becomes possible to harden at room temperature. The aforementioned cobalt metal salt is not particularly limited, and examples thereof include cobalt naphthenate, cobalt octoate, and cobalt hydroxide. Among them, cobalt naphthenate or/and cobalt octoate are preferred.

(不飽和聚酯樹脂) 前述不飽和聚酯樹脂係使由多元醇化合物與不飽和多元酸(及,因應必要之飽和多元酸)之酯化反應而成之縮合生成物(不飽和聚酯)溶解於聚合性單體(例如,苯乙烯等)者。 作為前述不飽和聚酯樹脂,也可使用如「聚酯樹脂手冊」(日刊工業新聞社、1988年發行)、「塗料用語辭典」(色材協會、1993年發行)等記載者,又,具體地可舉出如昭和電工股份有限公司製「Rigolac(註冊商標)」等。(Unsaturated polyester resin) The aforementioned unsaturated polyester resin is a condensation product (unsaturated polyester) formed by the esterification reaction of a polyol compound and an unsaturated polybasic acid (and, if necessary, a saturated polybasic acid) in a polymerizable monomer ( For example, styrene, etc.). As the aforementioned unsaturated polyester resin, those described in "Polyester Resin Handbook" (Nikkan Kogyo Shimbun, published in 1988) and "Dictionary of Paint Terms" (Colored Materials Association, published in 1993) can also be used. Examples of places include "Rigolac (registered trademark)" manufactured by Showa Denko Co., Ltd.

前述不飽和聚酯樹脂係能以由與關於前述乙烯基酯樹脂同樣之觸媒存在下之加熱所成自由基聚合來使其硬化。The aforementioned unsaturated polyester resin can be cured by radical polymerization by heating in the presence of the same catalyst as the aforementioned vinyl ester resin.

[底漆層3之作用] 底漆層3係形成在熱塑性樹脂材2之表面。 藉由底漆層3,而能賦予與接合對象之其他熱塑性樹脂材之優異接合性。也能取得即使經過數個月間之長時間,仍能維持前述接合性之附底漆之熱塑性樹脂材。 又,藉由底漆層3,熱塑性樹脂材2之表面受到保護,而能抑制污垢之附著或氧化等之變質。[The role of primer layer 3] The primer layer 3 is formed on the surface of the thermoplastic resin material 2. The primer layer 3 can provide excellent bonding properties with other thermoplastic resin materials to be bonded. It is also possible to obtain a primer-attached thermoplastic resin material that can maintain the aforementioned bonding properties even after a long period of several months. Moreover, the surface of the thermoplastic resin material 2 is protected by the primer layer 3, and deterioration such as adhesion of dirt or oxidation can be suppressed.

[樹脂-樹脂接合體4] 如圖3所示,本發明之樹脂-樹脂接合體4係使附底漆之熱塑性樹脂材1之底漆層3,與其他熱塑性樹脂材5熔接而成。構成其他熱塑性樹脂材5之熱塑性樹脂係可為與構成前述附底漆之熱塑性樹脂材1之熱塑性樹脂為同種,亦可為異種。[Resin-resin joint 4] As shown in FIG. 3, the resin-resin joint body 4 of the present invention is formed by welding the primer layer 3 of the primer-attached thermoplastic resin material 1 and the other thermoplastic resin material 5. The thermoplastic resin system constituting the other thermoplastic resin material 5 may be the same kind as the thermoplastic resin constituting the aforementioned primer-attached thermoplastic resin material 1, or may be a different kind.

構成附底漆之熱塑性樹脂材1之熱塑性樹脂與構成其他熱塑性樹脂材5之熱塑性樹脂即使為同種,在一者或兩者之熱塑性樹脂含有填料或纖維,或該熱塑性樹脂係為與其他熱塑性樹脂之摻合物時,附底漆之熱塑性樹脂材1與其他熱塑性樹脂材5之接合強度仍會有變得不充分的情況。但,根據本發明,仍能強固地熔接附底漆之熱塑性樹脂材1與其他熱塑性樹脂材5。Even if the thermoplastic resin constituting the primer-attached thermoplastic resin material 1 and the thermoplastic resin constituting the other thermoplastic resin material 5 are of the same kind, one or both of the thermoplastic resins contain fillers or fibers, or the thermoplastic resin is of the same type as other thermoplastic resins. In the case of a blend of the primer, the bonding strength of the primer-attached thermoplastic resin material 1 and other thermoplastic resin materials 5 may still become insufficient. However, according to the present invention, the primer-attached thermoplastic resin material 1 and other thermoplastic resin materials 5 can still be welded firmly.

構成附底漆之熱塑性樹脂材1之熱塑性樹脂,與,構成其他熱塑性樹脂材5之熱塑性樹脂為同種之情況,在構成熱塑性樹脂之單體中,佔最大含量之(相同之)單體之比例皆為70質量%以上,以70~100質量%為佳,較佳為80~100質量%,更佳為85~100質量%。When the thermoplastic resin constituting the primer-attached thermoplastic resin material 1 and the thermoplastic resin constituting the other thermoplastic resin materials 5 are of the same kind, the ratio of the monomer constituting the thermoplastic resin with the largest content (same) All are 70% by mass or more, preferably 70-100% by mass, preferably 80-100% by mass, and more preferably 85-100% by mass.

構成附底漆之熱塑性樹脂材1之熱塑性樹脂及/或構成其他熱塑性樹脂材5之熱塑性樹脂在含有選自由填料及纖維所成群之至少1種之情況,其含量係以5~50質量%為佳,較佳為5~40質量%,更佳為5~30質量%。前述含量在前述範圍內時,可提高附底漆之熱塑性樹脂材1與其他熱塑性樹脂材5之接合強度。When the thermoplastic resin constituting the thermoplastic resin material 1 with primer and/or the thermoplastic resin constituting the other thermoplastic resin material 5 contains at least one selected from the group of fillers and fibers, the content is 5-50% by mass More preferably, it is preferably 5-40% by mass, more preferably 5-30% by mass. When the aforementioned content is within the aforementioned range, the bonding strength between the primer-coated thermoplastic resin material 1 and the other thermoplastic resin material 5 can be improved.

又,構成附底漆之熱塑性樹脂材1之熱塑性樹脂及/或構成其他熱塑性樹脂材5之熱塑性樹脂為主要之熱塑性樹脂與附隨之熱塑性樹脂之摻合物的情況,附隨之熱塑性樹脂之含有率係以5~40質量%為佳,較佳為5~30質量%,更佳為5~20質量%。前述含有率在前述範圍內時,可提高附底漆之熱塑性樹脂材1與其他熱塑性樹脂材5之接合強度。 尚且,前述含有率係可藉由下述式來求出。 含有率(質量%)=[B/(A+B)]×100 (式中,A為構成附底漆之熱塑性樹脂材之熱塑性樹脂及/或構成其他熱塑性樹脂材之熱塑性樹脂當中主要之熱塑性樹脂之質量(g),B為構成附底漆之熱塑性樹脂材之熱塑性樹脂及/或構成其他熱塑性樹脂材5之熱塑性樹脂當中附隨之熱塑性樹脂之質量(g)。)In addition, when the thermoplastic resin constituting the primer-attached thermoplastic resin material 1 and/or the thermoplastic resin constituting the other thermoplastic resin material 5 is a blend of the main thermoplastic resin and the attached thermoplastic resin, the attached thermoplastic resin The content rate is preferably 5-40% by mass, preferably 5-30% by mass, and more preferably 5-20% by mass. When the aforementioned content is within the aforementioned range, the bonding strength between the primer-attached thermoplastic resin material 1 and the other thermoplastic resin material 5 can be improved. In addition, the aforementioned content rate can be calculated by the following formula. Content rate (mass%)=[B/(A+B)]×100 (In the formula, A is the mass (g) of the thermoplastic resin that constitutes the thermoplastic resin material with primer and/or the thermoplastic resin that constitutes other thermoplastic resin materials, and B is the mass (g) of the thermoplastic resin that constitutes the thermoplastic resin material with primer The thermoplastic resin and/or the thermoplastic resin constituting the other thermoplastic resin material 5 is accompanied by the mass (g) of the thermoplastic resin.)

本發明在即使前述構成其他熱塑性樹脂材5之熱塑性樹脂,與,前述構成附底漆之熱塑性樹脂材1之熱塑性樹脂為異種之情況,仍能強固地熔接其他熱塑性樹脂材5與附底漆之熱塑性樹脂材1。並且,前述構成其他熱塑性樹脂材5之熱塑性樹脂之SP值,與前述構成附底漆之熱塑性樹脂材1之熱塑性樹脂之SP值即使遠離之情況,仍能強固地熔接其他熱塑性樹脂材5與附底漆之熱塑性樹脂材1。In the present invention, even if the aforementioned thermoplastic resin constituting the other thermoplastic resin material 5 and the aforementioned thermoplastic resin constituting the primer-attached thermoplastic resin material 1 are different, the other thermoplastic resin material 5 and the primer-attached thermoplastic resin can still be firmly welded. Thermoplastic resin material 1. In addition, even if the SP value of the thermoplastic resin constituting the other thermoplastic resin material 5 and the SP value of the thermoplastic resin constituting the primer-attached thermoplastic resin material 1 are far apart, the other thermoplastic resin material 5 can be strongly welded to the attached resin. Thermoplastic resin material of primer 1.

前述底漆層之厚度(乾燥後之厚度)雖也係根據附底漆之熱塑性樹脂材1及其他熱塑性樹脂材5之材質或接合部分之接觸面積而不同,從取得優異接合強度之觀點,以1μm~500μm為佳,較佳為3μm~100μm,更佳為5μm~70μm。又,聚合物組成物層之厚度(乾燥後之厚度)係以1~60μm為佳。 尚且,前述底漆層為複數層之情況,底漆層之厚度(乾燥後之厚度)係作為各層合計之厚度。Although the thickness of the aforementioned primer layer (thickness after drying) is also different depending on the material of the primer-attached thermoplastic resin material 1 and other thermoplastic resin materials 5 or the contact area of the joint part, from the viewpoint of obtaining excellent joint strength, It is preferably 1 μm to 500 μm, preferably 3 μm to 100 μm, and more preferably 5 μm to 70 μm. In addition, the thickness of the polymer composition layer (thickness after drying) is preferably 1-60 μm. Furthermore, when the aforementioned primer layer is a plurality of layers, the thickness of the primer layer (thickness after drying) is taken as the total thickness of each layer.

作為製造樹脂-樹脂接合體4之方法,可舉出如,對附底漆之熱塑性樹脂材1之底漆層3以選自由超音波熔接法、振動熔接法、電磁感應法、高頻法、雷射法、及熱壓法所成群之至少1種方法來熔接其他熱塑性樹脂材之方法,或,在附底漆之熱塑性樹脂材1之底漆層3之上,藉由射出成形來使其他熱塑性樹脂材成形之方法。 作為前述其他熱塑性樹脂材5,也可使用與本發明之附底漆之熱塑性樹脂材1相同構成之附底漆之熱塑性樹脂材,來熔接各自之底漆層。於此情況,兩者之熱塑性樹脂可為同種亦可為相異。As a method of manufacturing the resin-resin joint body 4, for example, the primer layer 3 of the primer-attached thermoplastic resin material 1 is selected from the group consisting of ultrasonic welding method, vibration welding method, electromagnetic induction method, high frequency method, At least one of the laser method and hot pressing method is a method of welding other thermoplastic resin materials, or, on the primer layer 3 of the thermoplastic resin material 1 with primer, injection molding is used to make Other methods of forming thermoplastic resin materials. As the aforementioned other thermoplastic resin material 5, a primer-attached thermoplastic resin material having the same configuration as the primer-attached thermoplastic resin material 1 of the present invention can also be used to weld the respective primer layers. In this case, the two thermoplastic resins may be the same or different.

構成附底漆之熱塑性樹脂材1之熱塑性樹脂與構成其他熱塑性樹脂材5之熱塑性樹脂可為同種,也可為異種,從強固熔接之觀點,以同種為佳。 [實施例]The thermoplastic resin constituting the primer-attached thermoplastic resin material 1 and the thermoplastic resin constituting the other thermoplastic resin materials 5 may be of the same kind or different kinds. From the viewpoint of strong welding, the same kind is preferable. [Example]

其次,說明關於本發明之具體實施例,但本發明並非係受到該等實施例所特別限定者。Next, specific embodiments of the present invention will be described, but the present invention is not specifically limited by these embodiments.

<試驗片用熱塑性樹脂材> 在以下所示之表1之條件下,使用射出成形機(住友重機械工業股份有限公司製SE100V),而取得拉伸試驗用之試驗片用熱塑性樹脂材(寬10mm、長度45mm、厚度3mm):放有滑石之PP樹脂、m-PPE樹脂、PC樹脂、放有玻璃纖維之PBT樹脂。<Thermoplastic resin material for test piece> Under the conditions shown in Table 1 below, an injection molding machine (SE100V manufactured by Sumitomo Heavy Industries Co., Ltd.) was used to obtain a thermoplastic resin material (width 10mm, length 45mm, thickness 3mm) for the test piece for tensile testing : PP resin with talc, m-PPE resin, PC resin, PBT resin with glass fiber.

Figure 02_image001
Figure 02_image001

<試驗片:實施例1~3、比較例1、2> (底漆層形成用之組成物-1之製作) 在燒瓶中放入無水馬來酸改質聚丙烯(三菱化學股份有限公司製Modic(註冊商標)ER321P):5g、二甲苯:95g,進行攪拌並同時升溫至125℃使其溶解。其次,將2官能環氧樹脂(三菱化學股份有限公司製jER(註冊商標)1001)(雙酚A型環氧樹脂 分子量約900):1.01g、雙酚A:0.24g、2,4,6-參(二甲基胺基甲基)酚:0.006g投入燒瓶中,在125℃下攪拌30分鐘來進行前述2官能環氧樹脂與雙酚A之加成聚合反應,而取得包含無水馬來酸改質聚丙烯,及前述2官能環氧樹脂與雙酚A之聚合物(熱塑性環氧樹脂)的組成物-1(以下,亦單稱為組成物-1)。<Test piece: Examples 1 to 3, Comparative Examples 1 and 2> (Production of composition-1 for forming primer layer) Anhydrous maleic acid-modified polypropylene (Modic (registered trademark) ER321P manufactured by Mitsubishi Chemical Corporation): 5 g and xylene: 95 g were put in the flask, and the mixture was heated to 125° C. to be dissolved while stirring. Next, bifunctional epoxy resin (jER (registered trademark) 1001 manufactured by Mitsubishi Chemical Co., Ltd.) (bisphenol A epoxy resin molecular weight approximately 900): 1.01 g, bisphenol A: 0.24 g, 2, 4, 6 -Ginseng (dimethylaminomethyl) phenol: 0.006g was put into the flask, stirred at 125°C for 30 minutes to carry out the addition polymerization reaction of the aforementioned bifunctional epoxy resin and bisphenol A, and obtained containing anhydrous maleic acid Acid-modified polypropylene, and composition-1 of the polymer (thermoplastic epoxy resin) of the aforementioned bifunctional epoxy resin and bisphenol A (hereinafter, also simply referred to as composition-1).

(底漆層形成用之組成物-2之製作) 在燒瓶中放入改質聚苯醚(SABIC公司製NOLYL731):3.77g、二甲苯:95g,進行攪拌並同時升溫至125℃使其溶解。其次,將2官能環氧樹脂(三菱化學股份有限公司製jER(註冊商標)1001):1.0g、雙酚A:0.22g、2,4,6-參(二甲基胺基甲基)酚:0.005g投入燒瓶中,在125℃下攪拌30分鐘來進行前述2官能環氧樹脂與雙酚A之加成聚合反應。取得包含相對於前述改質聚苯醚100質量份為32質量份之前述2官能環氧樹脂與雙酚A之聚合物(熱塑性環氧樹脂)的組成物-2(以下,亦單稱為組成物-2)。(Production of composition-2 for forming primer layer) The modified polyphenylene ether (NOLYL731 manufactured by SABIC Corporation): 3.77 g and xylene: 95 g were put in the flask, and the temperature was raised to 125° C. to be dissolved while stirring. Next, a bifunctional epoxy resin (jER (registered trademark) 1001 manufactured by Mitsubishi Chemical Co., Ltd.): 1.0 g, bisphenol A: 0.22 g, 2,4,6-ginseng (dimethylaminomethyl)phenol : 0.005g was put into the flask, and stirred at 125°C for 30 minutes to perform the addition polymerization reaction of the aforementioned bifunctional epoxy resin and bisphenol A. Obtained composition-2 (hereinafter, also referred to simply as composition) containing 32 parts by mass of the bifunctional epoxy resin and the polymer (thermoplastic epoxy resin) of bisphenol A with respect to 100 parts by mass of the modified polyphenylene ether物-2).

(底漆層之形成) 其次,在前述試驗片用熱塑性樹脂材之PP(滑石30質量%)、PBT(玻璃纖維30質量%)之單面表面上,以乾燥後之厚度成為80μm之方式使用噴霧法來塗佈組成物-1。藉由在空氣中在常溫(23℃)下放置30分鐘而使溶劑(二甲苯)揮發後,在150℃之爐中加熱30分鐘,放置冷卻至常溫(23℃),而取得將組成物-1作為底漆層之試驗片PP-1、PBT-1。(Formation of primer layer) Next, the composition was applied by spraying on the single-sided surface of PP (30% by mass of talc) and PBT (30% by mass of glass fiber) of the aforementioned thermoplastic resin material for the test piece, so that the thickness after drying became 80μm. -1. After leaving the solvent (xylene) in the air at room temperature (23°C) for 30 minutes to volatilize the solvent (xylene), heating in a furnace at 150°C for 30 minutes, leaving it to cool to room temperature (23°C), and obtaining the composition- 1 Test pieces PP-1 and PBT-1 as primer layer.

又,在前述試驗片用熱塑性樹脂材之m-PPE之單面表面上,以乾燥後之厚度成為80μm之方式,使用噴霧法來塗佈組成物-2。藉由在空氣中在常溫(23℃)放置30分鐘而使溶劑(二甲苯)揮發後,在150℃之爐中加熱30分鐘,放置冷卻至常溫(23℃),而取得將組成物-2作為底漆層之試驗片m-PPE-1。 以下,將試驗片中已形成底漆層之面稱為底漆面,將未形成底漆層之面稱為無底漆面。又,下述表2中,將具有底漆層之面標示為(有),將不具有底漆層之面標示為(無)。In addition, on the single-sided surface of the m-PPE of the thermoplastic resin material for the test piece, the composition-2 was applied by spraying so that the thickness after drying became 80 μm. After leaving the solvent (xylene) in the air at room temperature (23°C) for 30 minutes to volatilize the solvent (xylene), heating in a furnace at 150°C for 30 minutes, leaving to cool to room temperature (23°C) to obtain the composition-2 The test piece m-PPE-1 as the primer layer. Hereinafter, the surface of the test piece on which the primer layer has been formed is referred to as the primer surface, and the surface on which the primer layer is not formed is referred to as the non-primer surface. In addition, in the following Table 2, the surface with the primer layer is indicated as (present), and the surface without the primer layer is indicated as (none).

<實施例1> (熔接) 在使PP-1之底漆面與m-PPE-1之底漆面以接合部重疊且成為長度5mm、寬10mm之方式來疊合之狀態下,使用精電舍電子工業股份有限公司製超音波熔接機SONOPET-JII430T-M(28.5KHz)進行超音波熔接,而取得試驗片1(樹脂-樹脂接合體)。在此接合部係意指疊合試驗片用熱塑性樹脂材的場所。<Example 1> (Fusion) In a state where the primer surface of PP-1 and the primer surface of m-PPE-1 are overlapped so that the length is 5mm, and the width is 10mm, the super is used by Seidesha Electronics Co., Ltd. The sonic welding machine SONOPET-JII430T-M (28.5KHz) performs ultrasonic welding to obtain test piece 1 (resin-resin joint). The junction here means a place where the thermoplastic resin material for the test piece is laminated.

(拉伸剪切強度) 對於試驗片1,在常溫(23℃)下放置1天後,根據ISO19095 1-4,使用拉伸試驗機(股份有限公司島津製作所製 萬能試驗機Autograph「AG-IS」;荷重元10kN、拉伸速度10mm/min、溫度23℃、50%RH),進行拉伸剪切強度試驗,並測量接合強度。將測量結果展示於下述表2。(Tensile shear strength) For test piece 1, after leaving it at room temperature (23°C) for 1 day, according to ISO19095 1-4, a tensile testing machine (Autograph "AG-IS", a universal testing machine manufactured by Shimadzu Corporation, Ltd.; Extension speed 10mm/min, temperature 23℃, 50%RH), carry out tensile shear strength test, and measure joint strength. The measurement results are shown in Table 2 below.

<實施例2> (熔接) 在使PP-1之底漆面與PBT-1之底漆面以接合部重疊且成為長度5mm、寬10mm之方式來疊合之狀態下,使用精電舍電子工業股份有限公司製超音波熔接機SONOPET-JII430T-M(28.5KHz)進行超音波熔接,而取得試驗片2(樹脂-樹脂接合體)。<Example 2> (Fusion) In a state where the primer surface of PP-1 and the primer surface of PBT-1 are overlapped with the joints so that the length is 5mm and the width is 10mm, ultrasonic welding is used by Seidensha Electronics Co., Ltd. The machine SONOPET-JII430T-M (28.5KHz) was used for ultrasonic welding to obtain test piece 2 (resin-resin joint).

(拉伸剪切強度) 對於試驗片2,使用與實施例1相同之手法來進行拉伸剪切強度試驗。將測量結果展示於下述表2。(Tensile shear strength) For the test piece 2, the same method as in Example 1 was used to perform a tensile shear strength test. The measurement results are shown in Table 2 below.

<實施例3> (熔接) 在使m-PPE-1之底漆面與前述試驗片用熱塑性樹脂材之PC之單面(無底漆面)以接合部重疊且成為長度5mm、寬10mm之方式來疊合之狀態下,使用精電舍電子工業股份有限公司製超音波熔接機SONOPET-JII430T-M(28.5KHz)進行超音波熔接,而取得試驗片3(樹脂-樹脂接合體)。<Example 3> (Fusion) In the state where the primer surface of m-PPE-1 and the single side (non-primed surface) of the PC of the thermoplastic resin material for the test piece overlapped so that the length was 5mm and the width was 10mm, Ultrasonic welding was performed using the ultrasonic welding machine SONOPET-JII430T-M (28.5KHz) manufactured by Seidesha Electronics Co., Ltd. to obtain test piece 3 (resin-resin joint).

(拉伸剪切強度) 對於試驗片3,使用與實施例1相同之手法來進行拉伸剪切強度試驗。將測量結果展示於下述表2。(Tensile shear strength) For the test piece 3, the same method as in Example 1 was used to perform a tensile shear strength test. The measurement results are shown in Table 2 below.

<比較例1> 嘗試在使PP-1之無底漆面與PBT-1之無底漆面以接合部重疊且成為長度5mm、寬10mm之方式來疊合之狀態下,使用精電舍電子工業股份有限公司製超音波熔接機SONOPET-JII430T-M(28.5KHz)進行超音波熔接,但無法熔接。<Comparative example 1> Attempt to superimpose the primerless surface of PP-1 and the primerless surface of PBT-1 in a state where the joints overlap and become 5mm in length and 10mm in width. Use Seidesha Electronics Co., Ltd. The ultrasonic welding machine SONOPET-JII430T-M (28.5KHz) performs ultrasonic welding, but it cannot be welded.

<比較例2> 嘗試在使m-PPE-1之無底漆面與前述試驗片用熱塑性樹脂材之PC之單面(無底漆面)以接合部重疊且成為長度5mm、寬10mm之方式疊合之狀態下,使用精電舍電子工業股份有限公司製超音波熔接機SONOPET-JII430T-M (28.5KHz)進行超音波熔接,但無法熔接。<Comparative example 2> Try to superimpose the non-primed surface of m-PPE-1 and the single side (non-primed surface) of the PC of the aforementioned thermoplastic resin material for the test piece in a state where the joint is overlapped and becomes a length of 5mm and a width of 10mm. , Use the ultrasonic welding machine SONOPET-JII430T-M (28.5KHz) made by Seidensha Electronics Co., Ltd. for ultrasonic welding, but it cannot be welded.

Figure 02_image003
Figure 02_image003

<實施例4:試驗片4-1、4-2> 將附底漆之熱塑性樹脂材m-PPE-1、PP-1插入於模具中,在與表1相同條件下,在底漆面上射出成形PBT,而取得前述底漆面與PBT(寬10mm、長度45mm、厚度3mm)之接合部重疊且成為長度5mm、寬10mm之試驗片(2種)。<Example 4: Test pieces 4-1, 4-2> Insert the primer-attached thermoplastic resin materials m-PPE-1 and PP-1 into the mold. Under the same conditions as in Table 1, the PBT is injection molded on the primer surface to obtain the primer surface and PBT (width 10mm). , 45mm in length and 3mm in thickness) overlap and become a test piece (2 types) with a length of 5mm and a width of 10mm.

(拉伸剪切強度) 對於各試驗片,使用與實施例1相同之手法來進行拉伸剪切強度試驗。將測量結果展示於下述表3。(Tensile shear strength) For each test piece, the same method as in Example 1 was used to perform a tensile shear strength test. The measurement results are shown in Table 3 below.

Figure 02_image005
[產業上之可利用性]
Figure 02_image005
[Industrial availability]

本發明之附底漆之熱塑性樹脂材係可與其他熱塑性樹脂材接合一體化而使用作為例如,門側板(door side panel)、罩蓋頂(bonnet roof)、尾板(tailgate)、轉向吊架(Steering hanger)、A柱、B柱、C柱、D柱、碰撞盒(crash box)、電源控制單元(PCU)殼、電動壓縮機構件(內壁部、吸入口部、排氣控制閥(ECV)挿入部、機架軸套(mount boss)部等)、鋰離子電池(LIB)隔件、電池盒、LED頭燈等之汽車用零件,或智慧型電話、筆記型個人電腦、平板個人電腦、智慧手錶、大型液晶電視(LCD-TV)、屋外LED照明之構造物等,並非係特別係受限至於該等例示之用途者。The primer-coated thermoplastic resin material of the present invention can be integrated with other thermoplastic resin materials and used as, for example, door side panels, bonnet roofs, tailgates, and steering hangers. (Steering hanger), A-pillar, B-pillar, C-pillar, D-pillar, crash box, power control unit (PCU) shell, electric compressor components (inner wall, suction port, exhaust control valve ( ECV) inserts, mount bosses, etc.), lithium-ion battery (LIB) spacers, battery boxes, LED headlights and other automotive parts, or smart phones, notebook personal computers, tablet personal Computers, smart watches, large liquid crystal televisions (LCD-TV), outdoor LED lighting structures, etc., are not specifically restricted to the exemplified uses.

1:附底漆之熱塑性樹脂材 2:熱塑性樹脂材 3:底漆層 31:聚合物組成物層 32:熱硬化性樹脂層 4:樹脂-樹脂接合體 5:其他熱塑性樹脂材1: Thermoplastic resin material with primer 2: Thermoplastic resin material 3: Primer layer 31: Polymer composition layer 32: Thermosetting resin layer 4: Resin-resin junction 5: Other thermoplastic resin materials

[圖1]展示本發明之一實施形態中之附底漆之熱塑性樹脂材之構成的說明圖。 [圖2]展示本發明之其他實施形態中之附底漆之熱塑性樹脂材之構成的說明圖。 [圖3]展示本發明之一實施形態中之樹脂-樹脂接合體之構成的說明圖。[Fig. 1] An explanatory diagram showing the structure of a thermoplastic resin material with primer in one embodiment of the present invention. [Fig. 2] An explanatory diagram showing the structure of a primer-attached thermoplastic resin material in another embodiment of the present invention. [Fig. 3] An explanatory diagram showing the structure of a resin-resin assembly in one embodiment of the present invention.

1:附底漆之熱塑性樹脂材 1: Thermoplastic resin material with primer

2:熱塑性樹脂材 2: Thermoplastic resin material

3:底漆層 3: Primer layer

31:聚合物組成物層 31: Polymer composition layer

Claims (12)

一種附底漆之熱塑性樹脂材,其係具有熱塑性樹脂材,與層合於前述熱塑性樹脂材之1層或複數層之底漆層, 且前述底漆層之至少1層為包含下述(A)或(B)之聚合物組成物之聚合物組成物層; (A)聚合物組成物,其係包含:含有下述(1)~(7)之至少一種之聚合型組成物之聚合物,與無水馬來酸改質聚丙烯或改質聚苯醚; (B)聚合物組成物,其係包含:含有下述(1)~(7)之至少一種之聚合型組成物之聚合物、無水馬來酸改質聚丙烯或改質聚苯醚,及,與構成前述熱塑性樹脂材之熱塑性樹脂為異種之熱塑性樹脂; (1)2官能異氰酸酯化合物與二醇之組合、 (2)2官能異氰酸酯化合物與2官能胺基化合物之組合、 (3)2官能異氰酸酯化合物與2官能硫醇化合物之組合、 (4)2官能環氧化合物與二醇之組合、 (5)2官能環氧化合物與2官能羧基化合物之組合、 (6)2官能環氧化合物與2官能硫醇化合物之組合、 (7)單官能自由基聚合性單體。A thermoplastic resin material with primer, which has a thermoplastic resin material and one or more primer layers laminated on the aforementioned thermoplastic resin material, And at least one layer of the aforementioned primer layer is a polymer composition layer containing the polymer composition of (A) or (B) below; (A) A polymer composition, which includes: a polymer containing at least one of the following (1) to (7) polymeric composition, and anhydrous maleic acid modified polypropylene or modified polyphenylene ether; (B) A polymer composition, which includes: a polymer containing at least one of the following (1) to (7) polymeric composition, anhydrous maleic acid modified polypropylene or modified polyphenylene ether, and , And the thermoplastic resin constituting the aforementioned thermoplastic resin material is a different kind of thermoplastic resin; (1) Combination of 2-functional isocyanate compound and diol, (2) The combination of a 2-functional isocyanate compound and a 2-functional amino compound, (3) Combination of 2-functional isocyanate compound and 2-functional thiol compound, (4) Combination of 2-functional epoxy compound and diol, (5) Combination of 2-functional epoxy compound and 2-functional carboxyl compound, (6) Combination of 2-functional epoxy compound and 2-functional thiol compound, (7) Monofunctional radical polymerizable monomer. 如請求項1之附底漆之熱塑性樹脂材,其中前述聚合物組成物層係與前述熱塑性樹脂材直接接觸之層。The primer-attached thermoplastic resin material of claim 1, wherein the polymer composition layer is a layer directly in contact with the thermoplastic resin material. 如請求項1或2之附底漆之熱塑性樹脂材,其中前述聚合物組成物包含含有前述(4)之聚合型組成物之聚合物,且,前述(4)之二醇為2官能酚化合物。The thermoplastic resin material with primer of claim 1 or 2, wherein the polymer composition includes a polymer containing the polymer composition of (4), and the diol of (4) is a bifunctional phenol compound . 如請求項1或3之附底漆之熱塑性樹脂材,其中前述底漆層係在前述聚合物組成物層與前述熱塑性樹脂材之間具有熱硬化性樹脂層,該熱硬化性樹脂層係由包含熱硬化性樹脂之組成物所形成而成。The thermoplastic resin material with primer according to claim 1 or 3, wherein the primer layer has a thermosetting resin layer between the polymer composition layer and the thermoplastic resin material, and the thermosetting resin layer is composed of It is formed from a composition containing thermosetting resin. 如請求項4之附底漆之熱塑性樹脂材,其中前述熱硬化性樹脂為選自由胺基甲酸酯樹脂、環氧樹脂、乙烯基酯樹脂及不飽和聚酯樹脂所成群之至少1種。The thermoplastic resin material with primer of claim 4, wherein the thermosetting resin is at least one selected from the group consisting of urethane resin, epoxy resin, vinyl ester resin and unsaturated polyester resin . 如請求項1~5中任一項之附底漆之熱塑性樹脂材,其中構成前述熱塑性樹脂材之熱塑性樹脂為選自由聚丙烯、改質聚苯醚、及聚對酞酸丁二酯所成群之至少1種。The thermoplastic resin material with primer according to any one of claims 1 to 5, wherein the thermoplastic resin constituting the aforementioned thermoplastic resin material is selected from polypropylene, modified polyphenylene ether, and polybutylene terephthalate At least one of the group. 一種如請求項1之附底漆之熱塑性樹脂材之製造方法,其係將前述聚合物組成物塗佈於前述熱塑性樹脂材上。A method for producing a primer-attached thermoplastic resin material according to claim 1, wherein the polymer composition is coated on the thermoplastic resin material. 一種樹脂-樹脂接合體,其係使如請求項1~6中任一項之附底漆之熱塑性樹脂材之底漆層,與其他熱塑性樹脂材熔接而成。A resin-resin joint, which is formed by welding a primer layer of a thermoplastic resin material with a primer according to any one of claims 1 to 6 and other thermoplastic resin materials. 如請求項8之樹脂-樹脂接合體,其中前述其他之熱塑性樹脂材係如請求項1~6中任一項之附底漆之熱塑性樹脂材,並且係使各自之底漆層熔接而成。Such as the resin-resin joint of claim 8, wherein the aforementioned other thermoplastic resin material is the thermoplastic resin material with primer in any one of claims 1 to 6, and is formed by welding the respective primer layers. 如請求項8或9之樹脂-樹脂接合體,其中構成前述其他熱塑性樹脂材之熱塑性樹脂且係構成該熱塑性樹脂之單體中佔最大含量之單體,與,構成如請求項1~6中任一項之附底漆之熱塑性樹脂材之熱塑性樹脂且係構成該熱塑性樹脂之單體中佔最大含量之單體為相同,且該單體之含量皆為70質量%以上。Such as the resin-resin joint body of claim 8 or 9, in which the thermoplastic resin constituting the aforementioned other thermoplastic resin material is the monomer with the largest content among the monomers constituting the thermoplastic resin, and the composition is as in claims 1 to 6 Any one of the thermoplastic resins of the primer-attached thermoplastic resin material has the same monomer with the largest content among the monomers constituting the thermoplastic resin, and the content of the monomers is all 70% by mass or more. 一種如請求項8~10中任一項之樹脂-樹脂接合體之製造方法,其係對前述附底漆之熱塑性樹脂材之底漆層,以選自由超音波熔接法、振動熔接法、電磁感應法、高頻法、雷射法、及熱壓法所成群之至少1種方法來熔接其他熱塑性樹脂材。A method for manufacturing a resin-resin joint body according to any one of claims 8 to 10, which is based on the primer layer of the aforementioned thermoplastic resin material with primer selected from ultrasonic welding method, vibration welding method, and electromagnetic welding method. At least one method of induction method, high frequency method, laser method, and hot pressing method is used to weld other thermoplastic resin materials. 一種如請求項8~10中任一項之樹脂-樹脂接合體之製造方法,其係對前述附底漆之熱塑性樹脂材之底漆層,以射出成形法來射出熔接其他熱塑性樹脂材。A method for manufacturing a resin-resin joint according to any one of claims 8 to 10, which is to inject and weld other thermoplastic resin materials to the primer layer of the aforementioned primer-attached thermoplastic resin material by injection molding.
TW109126435A 2019-08-06 2020-08-05 Thermoplastic resin material with primer, and resin-resin conjugate TW202112555A (en)

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