TW202112196A - Soldered product manufacturing apparatus and method for manufacturing soldered product - Google Patents

Abstract

The soldered product manufacturing apparatus 1 includes a stage 13 on which a substrate W having solder pieces arranged thereon is to be placed, a cover 16 for covering at least the upper portion of the substrate W placed on the stage 13 with a predetermined distance, a chamber 11 accommodating the stage 13 and cover 16, a heating unit 15 for heating the substrate W on the stage 13, and a reducing gas supply device 19 for supplying a reducing gas F. The method for manufacturing a soldered product uses the soldered product manufacturing apparatus 1, and is, providing a substrate W on a stage 13, covering the substrate W placed on the stage 13 with a cover 16, heating the substrate W, and supplying a reducing gas F into the chamber 11.

Description

Welded product manufacturing device and welding product manufacturing method

The present invention relates to a welding product manufacturing device and a welding product manufacturing method, and more particularly to a welding product manufacturing device and a welding product manufacturing method that prevents unnecessary substances from adhering to a substrate and increases the reduction rate of oxides.

The substrate on which the solder bumps are formed is a reflow step for mounting electronic components on the substrate. Place the solder paste and flux mixture on the substrate and heat it to melt and form solder bumps. Finally, the entire substrate is cleaned, flux residues are removed, and then dried to produce a substrate with solder bumps. (For example, refer to Japanese Patent No. 6274341).

When forming solder bumps, if a solder paste mixed with flux is used, the cleaning to remove the flux residue is more labor-intensive. When using formic acid instead of flux to form solder bumps, if the oxide film is reduced and removed, post-cleaning is not required, and the steps can be simplified. But by using A When the solder bumps are formed by the reflow of acid, the components of the solder and/or the substrate and/or formic acid may vaporize when the solder and the substrate are heated, and the vaporized components (substances) will diffuse and accumulate in the chamber Such deposits may scatter and adhere to the substrate. In addition, when formic acid is used to reduce and remove the oxide film formed on the solder, processing time is required until the formic acid reacts with the oxide, but the shorter the processing time is, the better.

In view of the above-mentioned problems, the present disclosure provides a welding product manufacturing device and a welding product manufacturing method that suppresses the adhesion of unnecessary substances to the substrate and increases the reduction rate of oxides.

In order to achieve the above-mentioned object, the soldering product manufacturing apparatus of the first aspect of the present disclosure is, for example, as shown in FIG. At least the upper part of the substrate W placed on the stage 13; the chamber 11 contains the stage 13 and the cover 16; the heating part 15 heats the substrate W placed on the stage 13; and the reducing gas supply device 19, The reducing gas F for reducing oxides is supplied into the chamber 11. Here, the solder disposed on the substrate is typically the raw material solder that completes the solder bump or the raw material of the solder bump.

With the above-mentioned structure, the cover is provided, so that the vaporized substances generated on the substrate can be prevented from condensing and adhering to the substrate, and the heating of the substrate can be prevented from dissipating to the periphery, thereby preventing the oxide from reacting with the reducing gas. , Which can increase the speed of restoration.

In addition, the soldering product manufacturing apparatus of the second aspect of the present disclosure is shown, for example, with reference to FIG. 1. In the soldering product manufacturing apparatus 1 of the first aspect of the present disclosure, the specific distance is that the solder and the solder disposed on the substrate W The shortest distance of the cover 16 is specified.

With the above structure, it is possible to prevent the solder from contacting the cover and prevent adverse effects on the solder.

In addition, the welded product manufacturing apparatus of the third aspect of the present disclosure is in the welded product manufacturing apparatus of the second aspect of the present disclosure, and the shortest distance is configured to be 0.1 mm to 20 mm.

With the above structure, the reduction rate of the oxides generated in the substrate and the solder and the reducing gas can be increased, the processing time can be shortened, and the productivity can be improved.

In addition, the welding product manufacturing apparatus of the fourth aspect of the present disclosure is, for example, as shown in FIG. 1. In the welding product manufacturing apparatus 1 of the first aspect of the present disclosure, the specific distance is between the substrate and the upper portion of the substrate The shortest distance of the aforementioned cover is stipulated.

With the above configuration, it is possible to suppress an increase in the size of the chamber.

In addition, the welding product manufacturing apparatus of the fifth aspect of the present disclosure is shown, for example, with reference to FIG. 1. In the welding product manufacturing apparatus 1 of any one of the first to fourth aspects of the present disclosure, the heating unit 15 is It is configured to heat the substrate W by heating the stage 13 on which the substrate W is placed; the lid 16 is configured to be in contact with the stage 13 so as to generate heat transfer from the stage 13.

With the above-mentioned structure, the lid body contacts the heated stage, so the lid body temperature is raised above the condensation temperature of the substance, which can inhibit the substance from condensing in the lid body.

In addition, the welding product manufacturing apparatus of the sixth aspect of the present disclosure is shown, for example, with reference to FIG. 1. In the welding product manufacturing apparatus 1 of the fifth aspect of the present disclosure, the cover 16 is placed on the stage to surround 13 is constructed in the manner of the space around the substrate W.

With the above configuration, the heat dissipation in the space surrounded by the cover can be suppressed, and the reduction rate when the oxide reacts with the reducing gas can be increased.

In addition, the welding product manufacturing apparatus of the seventh aspect of the present disclosure is, for example, as shown in FIG. 4. In the welding product manufacturing apparatus of any one of the first to sixth aspects of the present disclosure, the cover 16B has a mesh Portion 16h, the mesh portion 16h allows vaporized substances generated from substances on the substrate to pass, but liquefied or solidified substances cannot pass.

With the above structure, the vaporized substance is released to the outside of the cover through the mesh part, but the liquefied or solidified substance does not invade the inside of the cover, and the adhesion of the condensed substance to the substrate can be suppressed.

In addition, the manufacturing method of the welded product of the eighth aspect of the present disclosure is shown, for example, with reference to FIGS. 1 and 2, which uses the welded product manufacturing apparatus 1 of any one of the first to seventh aspects of the present disclosure. The method of manufacturing soldered products has the following steps: the placing step (S1) is to place the substrate W on which the solder is placed on the stage 13; the covering step (S2) is to cover the body at a distance from the solder 16 covers at least the upper part of the substrate W placed on the stage 13; the heating step (S3) is to heat the substrate W after the covering step (S2); and the reducing gas supply step (S4) is to supply the reduction in the chamber 11 Gas F.

With the above configuration, a welded product can be manufactured. In the welded product, the substance generated from the substance on the substrate does not adhere to the substrate, and the reduction speed and productivity during manufacturing can be improved.

In addition, the manufacturing method of the welded product of the ninth aspect of the present disclosure is shown, for example, with reference to FIGS. 1 and 2. In the manufacturing method of the welded product of the eighth aspect of the present disclosure, the covering step (S2) is The distance from the solder to the shortest part of the lid 16 is configured to be 0.1 mm to 20 mm.

With the above structure, the substrate can be prevented from dissipating heat to the periphery, and the reduction rate when the oxide reacts with the reducing gas can be increased.

According to the present invention, the vaporized substance generated by the substance on the substrate can be prevented from being condensed and attached to the substrate, and the reduction rate when the oxide reacts with the reducing gas can be increased.

1: Welding product manufacturing equipment

1A: Welding product manufacturing equipment

11: Chamber

11f: Formic acid inlet

13: Stage

13A: Stage

13e: high margin

13t: Mounting surface

15: Heating section

16: Lid

16A: Lid

16B: Lid

16h: Net department

16s: side panel

16t: roof

19: Reducing gas supply device

19p: Piping

19v: control valve

50: control device

F: reducing gas

P: Products

S: Solder bump

W: substrate

Fig. 1 is a schematic configuration diagram of an embodiment of a welded product manufacturing apparatus.

Figure 2 is a flowchart illustrating the manufacturing sequence of welded products.

Fig. 3 is a schematic configuration diagram of a welded product manufacturing apparatus according to a modification of the embodiment.

4 is a vertical cross-sectional view showing a schematic configuration of a modification of the cover body, and the cover system constitutes an embodiment of a welded product manufacturing device.

This application is based on Japanese Patent Application No. 2019-138130 filed in Japan on July 26, 2019 and Japanese Patent Application No. 2020-097848 filed in Japan on June 4, 2020, and these contents are used in this application. Application.

In addition, the present invention can be fully understood by the following detailed description. The further application scope of the present invention can also be self-evident from the following detailed description. However, the detailed description and specific examples are preferred embodiments of the present invention, and the purpose of the description is to illustrate. Those with ordinary knowledge in the technical field can make various changes and changes within the spirit and scope of the present invention from the detailed description. The applicant wants to claim that the purpose of the recorded implementation types is not to be disclosed to the public, and there may be parts in the disclosed changes and substitutions that are not included in the scope of the patent application, but these are all aspects of the invention under the theory of equality. unit Minute. The following describes each implementation type with reference to the drawings. In addition, components that are the same or equivalent to each other in each figure are denoted by the same or similar symbols, and repeated descriptions are omitted.

First, referring to FIG. 1, an embodiment of a welded product manufacturing apparatus 1 will be described. FIG. 1 is a schematic configuration diagram of the welded product manufacturing apparatus 1. As shown in FIG. The soldering product manufacturing apparatus 1 is configured to be usable as a solder bump forming apparatus and as a co-soldering apparatus. The solder bump forming device forms the raw material solder arranged on the substrate W into a finished solder bump S (hereinafter referred to as "solder bump S") whose surface becomes a hemispherical shape. The finished solder bump is suitable for electronic parts Reflow step when mounting on the substrate W. In this specification, the raw material solder refers to the non-hemispherical solder before the solder bump S is completed, and it is typically one with a proper amount of solder paste dispensed. The solder used as the raw material solder is typically a compound of lead, zinc, tin, or the like. In this embodiment, the solder bump forming device can form the solder bump S on the substrate W without using flux. On the other hand, the soldering device arranges the finished solder bumps S arranged on the substrate W on the electronic components, and melts the solder bumps S in the reflow step, so that the electronic components are soldered on the substrate W. The substrate W with solder bumps S manufactured in the solder bump forming device (the substrate W on which the solder bumps S is formed), and the substrate W with electronic parts mounted on the solder bumping device (the solder bumps on the substrate W) S-joined electronic components (joined substrates) are respectively a form of soldered products. The soldering product manufacturing apparatus 1 can be regarded as a general term for the solder bump forming apparatus and the soldering apparatus. The following description uses the soldered product manufacturing apparatus 1 as a solder bump forming apparatus. The welding product manufacturing apparatus 1 includes a chamber 11, a stage 13 on which a substrate W is placed, a heater 15 for heating the substrate W, a cover 16 for covering the substrate W, and a formic acid supply that supplies formic acid gas F in the chamber 11 Department 19.

The cavity 11 is formed with a space for forming the raw material solder arranged on the substrate W into the solder bump S. The chamber 11 is configured to withstand the pressure difference between the inside and the outside 的结构。 The structure. From the viewpoint of ease of manufacture, the cavity 11 is typically formed in a rectangular parallelepiped shape, and from the viewpoint of pressure resistance, the outer peripheral wall may be formed as a curved surface. In the chamber 11, a formic acid introduction port 11f into which the formic acid gas F is introduced is formed. In this embodiment, the formic acid introduction port 11f is formed in the upper part of the chamber 11. In addition, a shutter (not shown in the figure) is provided in the chamber 11, and the shutter opens and closes an opening (not shown in the figure). The opening allows the substrate W with solder to pass in and out.

In this embodiment, the carrier 13 is formed in a plate shape and is arranged in the cavity 11. In the stage 13, the mounting surface 13t on which the substrate W is mounted is formed as a flat surface from the viewpoint of mounting stability. Typically, the inner surface of the placing surface 13t is also formed as a flat surface. Typically, the stage 13 is installed in the chamber 11 such that the mounting surface 13t becomes horizontal. However, the stage 13 can be tilted with respect to the horizontal in the mountable range of the mounted substrate W (within the range where the mounted substrate W does not fall) (the mounting surface 13t has a horizontal component and a vertical direction in the extending direction ingredient). The stage 13 is formed of a material that can transmit the heat generated by the heater 15 to the substrate W, and is typically formed of graphite, but may be formed of a metal with high thermal conductivity. Here, the heat transmitted from the heater 15 to the substrate W through the stage 13 can increase the temperature to a temperature at which the raw material solder arranged on the substrate W is melted. The stage 13 is typically configured to be raised higher than the arrangement. The melting point of the raw material solder on the substrate W. The mounting surface 13t of the stage 13 is formed to be larger than the substrate W in area.

In this embodiment, the heater 15 is arranged in the chamber 11 at a position close to the stage 13 below the stage 13. In this embodiment, the heater 15 is composed of a plurality of infrared lamps (hereinafter referred to as "IR lamps") arranged along the inner surface of the stage 13 at appropriate intervals. The heater 15 heats the substrate W placed on the stage 13 through the stage 13 and corresponds to a heating section. In addition, a comb-tooth-shaped cooling portion can be provided in the gap between the plurality of IR lamps constituting the heater 15, and the comb-tooth-shaped cooling portion is in contact with the inner surface of the carrier 13, thereby cooling the carrier 13 (more specifically, the substrate W), the cooling The part is configured to be able to move back and forth with respect to the stage 13 (when cooling) and separated (when not cooling).

In order to prevent unnecessary substances from adhering to the substrate W and the like, the cover 16 is covered with the substrate W when the substrate W on which the raw material solder is placed is placed on the stage 13. In addition, the cover 16 appropriately covers the substrate W, so that the reduction rate of the oxide by the formic acid gas F can be increased. In this embodiment, the cover 16 can cover the entire substrate W as a whole, so that the size in a plan view is formed to include the substrate W. In other words, the cover 16 can cover a plurality of raw material solders disposed on the substrate W. In this embodiment, the cover 16 has a top plate 16t formed in a rectangular plate shape, and a side plate 16s extending from the four sides of the top plate 16t at right angles to the top plate 16t. The four side plates 16s respectively extend with the same length in the same direction with respect to the top plate 16t. The length of the side plate 16s is made as short as possible within the range where the top plate 16t does not contact the substrate W and the raw material solder when the side plate 16s is in contact with the stage 13. At this time, the shortest distance between the raw material solder in the substrate W with the raw material solder and the top plate 16t (typically, the distance at which the distance between the solder and the lid 16 becomes the shortest part of the range where the desired function is exhibited) corresponds to the specific distance. As mentioned above, in this embodiment, the cover 16 is configured to cooperate with the stage 13 and completely cover the substrate W, thereby enhancing the protection of the substrate W. Even if the substrate W is completely covered with the cover 16 and the stage 13, when the formic acid gas F is supplied in the chamber 11, due to the characteristics of the formic acid gas F, the formic acid gas F can penetrate into the cover 16 from the boundary between the cover 16 and the stage 13 . However, when the substrate W can be protected from unnecessary substances by covering only the upper part of the substrate W, the side plate 16s can be removed by the cover 16 so that the formic acid gas F can easily reach the substrate W. On the other hand, from the viewpoint of increasing the reduction rate of oxides by the formic acid gas F, in order to suppress the decrease in the temperature around the substrate W, it is preferable to surround the space around the substrate W with a cover 16 having a side plate 16s. The shortest distance between the raw material solder in the substrate W and the top plate 16t The distance is preferably 0.1 mm to 20 mm, and from the viewpoint of increasing the reduction rate of oxides by formic acid gas F, it is more preferably 2.0 mm or less, and more preferably 1.5 mm or less. On the other hand, it is to suppress the difficulty of device manufacturing From the viewpoint of sex, it is more preferably 0.5 mm or more, and still more preferably 1.0 mm. The shortest distance between the raw material solder in the substrate W and the top plate 16t may vary depending on the plurality of raw material solders arranged on the substrate W, and it is preferable that the respective shortest distances be in the range of 0.1 mm to 20 mm. The cover 16 is preferably formed of a material with high thermal conductivity, and is typically formed of a metal.

The formic acid supply unit 19 has a formic acid source (not shown in the figure), a pipe 19p for introducing formic acid gas F into the chamber 11 from the formic acid source, and a control valve 19v arranged in the pipe 19p. The formic acid source (not shown in the figure) has a vaporization section for vaporized formic acid, and is configured in such a way that vaporized formic acid F can be supplied into the chamber 11. The pipe 19p is connected to the formic acid inlet 11f. The formic acid supply unit 19 is configured to supply vaporized formic acid F into the chamber when the control valve 19v is opened, and stop the supply of formic acid gas F into the chamber 11 when the control valve 19v is closed. The formic acid gas F is supplied to the substrate W or the solder at the reduction temperature, thereby reducing the oxide of the substrate W or the solder, which is equivalent to a reducing gas. In addition, the formic acid supply unit 19 supplies formic acid gas F as a reducing gas, and corresponds to a reducing gas supply device. In the soldering product manufacturing apparatus 1, by supplying formic acid gas F to the substrate W or the solder due to the reduction temperature, the oxide of the substrate W or the solder can be reduced without using a flux.

The welded product manufacturing device 1 is further provided with a control device 50 that can control the operation of the welded product manufacturing device 1. The control device 50 is connected to the heater 15 in a wired or wireless manner, and is configured to heat the stage 13 by changing the ON-OFF and output of the heater 15. In addition, the control device 50 is connected to the formic acid supply unit 19 in a wired or wireless manner, And it is configured such that the formic acid gas F can be supplied to the chamber 11 by the opening and closing operation of the control valve 19v.

Next, a method of manufacturing a soldered product using the soldered product manufacturing device 1 (here, a method of manufacturing a solder bump forming substrate) will be described with reference to FIG. 2. Fig. 2 is a flowchart showing the manufacturing procedure of a solder bump forming substrate (solder product). Hereinafter, when referring to the structure of the soldering product manufacturing apparatus 1 in the description of the manufacturing method of the solder bump forming substrate, refer to FIG. 1 as appropriate. The following description of the method of manufacturing a substrate using solder bumps of the soldering product manufacturing device 1 is also an explanation of the function of the soldering product manufacturing device 1.

When manufacturing the solder bump formation substrate, first, the substrate W on which the raw material solder is placed is put into the chamber 11 and placed on the placement surface 13t of the stage 13 (S1: placement step). After the substrate W with the raw material solder is placed on the stage 13 in the chamber 11, the cover 16 is placed on the carrier 13 so as to cover the substrate W with the raw material solder (S2: covering step). At this time, the lid body 16 is arranged on the stage 13 so that the raw material solder and the substrate W do not contact the lid body 16. In addition, the shortest distances between the respective raw material solders arranged on the substrate W and the lid 16 become specific distances. Here, the specific distance is 0.1 mm to 20 mm. After the cover 16 is arranged, the control device 50 turns on the heater 15 to heat the stage 13 and the substrate W with the raw material solder to the reduction temperature (S3). The reduction temperature is lower than the melting point of the raw material solder disposed on the substrate W, and is suitable for reducing the raw material solder and the oxide film of the substrate W with formic acid F. If the stage 13 is heated by the heater 15, the heat will also be transmitted to the lid body 16 in contact with the stage 13, and the lid body 16 will also be heated. Then, the internal space enclosed by the lid 16 and the stage 13 becomes high temperature.

Next, after the control device 50 raises the temperature of the stage 13 to the reduction temperature, it opens the control valve 19v and supplies formic acid gas F into the chamber 11 (S4: reducing gas supply step). borrow The formic acid gas F is supplied in the chamber 11 to perform a reduction process. This reduction process is to reduce the oxide film formed on the raw material solder or the surface of the substrate W by the formic acid F. At this time, the shortest distance between each raw material solder disposed on the substrate W and the lid 16 becomes a specific distance, so the speed of reducing the oxide film by the formic acid gas F can be increased. The reason for the increase in the reduction rate is presumably as follows: since the shortest distance between the raw material solder and the lid 16 becomes a certain distance, the space around the substrate W becomes smaller and heat dissipation is suppressed; and/or the number of collisions between formic acid molecules and the oxide film increases. Use formic acid F to remove the oxide film, so that no flux is used, and the step of cleaning the flux can be omitted afterwards. In addition, when the formic acid gas F is supplied into the chamber 11 before the temperature of the stage 13 is raised to the reduction temperature to remove the oxide film, the reducing gas supply step (S4) can be performed before the step (S3) of heating to the reduction temperature. Or in parallel with the step (S3) of heating to the reduction temperature.

After the reduction process of formic acid F is completed, the control device 50 raises the output of the heater 15 to a melting temperature exceeding the melting point of the raw material solder, and heats the stage 13 and the raw material soldering substrate W (S5). Thereby, the raw material solder on the substrate W melts into a hemispherical shape. After the raw material solder forms a hemispherical shape, the control device 50 stops the heating of the heater 15 and discharges the formic acid gas F from the chamber 11 to cool the substrate W with the hemispherical solder (S6). In addition, after the step (S3) of heating to the reduction temperature, the heating is continued to the melting temperature before the heater 15 stops heating, which corresponds to the heating step. Then, after the heater 15 stops heating, the hemispherical solder on the substrate W is solidified by cooling, and the finished solder bump S is formed. After that, the substrate W on which the solder bumps S is formed (a form of soldered product, hereinafter referred to as "product P") is taken out from the chamber 11 (S7). Thus, a substrate W with solder bumps S is obtained, and for the sake of safety, it is determined whether the solder bumps S are properly formed (S8). When the solder bump S is not formed, return to the placing step (S1) and form the solder bump S again, and then perform the above-mentioned process. On the other hand, when the solder bump S is formed, the solder bump formation substrate (product P) is finished 之 Manufacturing. Thereby, the solder bump formation substrate (product P) is manufactured in a series of steps, and the solder bump formation substrate (product P) is sent to the subsequent step. Next, when a solder bump formation substrate (product P) is to be separately manufactured, the above-mentioned process is repeated.

In the above process, when the raw material solder and the substrate W are heated to the reduction temperature (S3), the formic acid gas F (S4) is supplied, and the melting temperature is optionally heated (S5), the composition of the raw material solder and/or the substrate W Some produce vaporized substances and/or substances that combine with formic acid (hereinafter referred to as "vaporized substances"). The vaporized substance will diffuse in the chamber 11. Then, the raw material solder is melted into a hemispherical shape, the heating of the heater 15 is stopped, and the temperature in the cavity 11 is lowered, and the vaporized substance will liquefy or solidify (hereinafter referred to as "condensation"). Condensed vaporized substances (referred to as unnecessary substances in the foregoing description, and hereinafter referred to as "condensed substances") will adhere and accumulate on the inner wall of the chamber 11 and the like. During the manufacturing process of the solder bump forming substrate, for example, when the formic acid gas F is supplied in the chamber 11, the condensed substances accumulated on the inner wall of the chamber 11 so far are scattered. In this embodiment, when the solder bump S is formed from the raw material solder, the substrate W on which the raw material solder is disposed is covered with the cover 16, so even if the condensed material is scattered in the cavity 11, it can prevent the condensed material from adhering to Substrate W and so on. In addition, before the product P is taken out of the chamber 11, the temperature in the chamber 11 will decrease and condensate will be generated. Although the inside of the heating stage 13 and the cover 16 is lowered to the solder solidification temperature, it is still in a high temperature state, which can be suppressed The vaporized substance condenses.

The solder bump formation substrate (product P) manufactured by the above-mentioned manufacturing method of the solder bump formation substrate can be used as an object for soldering electronic parts. By soldering electronic components on the solder bump formation substrate (product P), the electronic component mounting substrate (bonded substrate) of one form of soldered product can be manufactured. Next, as described above, the soldered product manufacturing device 1 can be used as a soldering device, so that the electronic component mounting board can be manufactured. Even when the welding product manufacturing device 1 is used as a welding device, The configuration is the same as when used as the above-mentioned solder bump forming apparatus, so most of the description of the above-mentioned solder bump forming apparatus can be shared. When the soldered product manufacturing apparatus 1 is used as a soldering apparatus, the difference is as follows from the description of the solder bump forming apparatus described above. In the soldering device, the cavity 11 forms a space, and the space is processed for melting the solder bumps S arranged on the substrate W and soldering electronic components to the substrate W. The heat transferred from the heater 15 to the substrate W through the stage 13 can raise the temperature to a temperature at which the solder bumps S arranged on the substrate W can be melted. In the cover 16, the shortest distance between the solder bump S on which the electronic components are arranged and the cover 16 becomes the aforementioned specific distance. In addition, the manufacturing method of the electronic component mounting board (welded product) can basically be applied to the flow shown in Fig. 2, but the following are the differences. In the placing step (S1), electronic components are placed (supplied) on the substrate W on which the solder bumps S are placed, and placed on the stage 13 in the chamber 11. In the step (S7), the soldered product taken out from the chamber 11 is one where the solder on the substrate W adheres to the electronic component (electronic component mounting substrate). In step (S8), it is determined whether the electronic component is properly soldered to the substrate W. If it is not soldered, it returns to the mounting step (S1), and when soldering, the manufacture of the electronic component mounting substrate (welded product) is completed. In the manufacturing method of the electronic component mounting substrate (welded product) using the soldering device, the substrate W is covered with the cover 16 and the oxide film reduction treatment (S3-S4) is performed, thereby increasing the reduction speed.

As described above, the welded product manufacturing apparatus 1 according to the present embodiment is provided with the cover 16, so even when the condensed substance is scattered in the chamber 11, it can prevent the condensed substance from adhering to the substrate W or the like. In addition, the cover 16 contacts the carrier 13 and generates heat transfer from the carrier 13 to the cover 16. Therefore, the space surrounded by the carrier 13 and the cover 16 can be kept at a high temperature, and vaporized substances can be prevented from being deposited on the cover. Condensation on the periphery of 16 can prevent condensed substances from accumulating on the cover 16. In addition, the shortest distance between the solder on the substrate W and the cover 16 covering the substrate W is set to a specific distance, thereby increasing the reduction speed during the reduction treatment of the oxide film using formic acid gas F. Also, according to this embodiment The method of manufacturing a substrate formed by solder bumps in a state of the art can produce products P in which condensed substances do not adhere to the substrate W, etc., and can be omitted and then cleaned. In addition, according to the method of manufacturing a welded product of this embodiment, the reduction speed during the reduction treatment of the oxide film using formic acid gas F can be increased.

Next, a welding product manufacturing apparatus 1A according to a modification of the embodiment will be described with reference to FIG. 3. Fig. 3 is a schematic configuration diagram of a welded product manufacturing apparatus 1A. In the welded product manufacturing apparatus 1A, the stage 13 (refer to FIG. 1) and the cover are mainly replaced by a stage 13A formed at a portion lower than the mounting surface 13t, and a cover 16A formed of a plate-shaped member The body 16 (refer to FIG. 1) is different from the welded product manufacturing apparatus 1 (refer to FIG. 1) in this point. The mounting table 13A is surrounded by a high edge 13e whose outer periphery of the mounting surface 13t is higher than the mounting surface 13t. The height of the peripheral edge 13e around the mounting surface 13t is preferably such that when the substrate W with solder (raw material solder or solder bump S) is placed on the mounting surface 13t, the highest part of the substrate W with solder does not reach Within the range of the top end of the peripheral edge 13e, it should be as low as possible. The cover 16A is configured to include only the top plate 16t (see FIG. 1) and not the side plate 16s (see FIG. 1) in the cover 16 (see FIG. 1). The structure of the welded product manufacturing apparatus 1A other than the above is the same as that of the welded product manufacturing apparatus 1 (refer to FIG. 1). In the welded product manufacturing apparatus 1A configured as described above, the lid 16A has a simpler structure, so that the lid 16A can be opened and closed more easily.

In the above description, although the heater 15 is arranged in the chamber 11, it can be arranged outside the chamber 11 (for example, the lower part of the bottom surface of the chamber 11), and the part of the chamber 11 between the heater 15 and the stage 13 is It is transparent, and the stage 13 is heated by the radiant heat from the heater 15.

In the above description, the substrate W and the oxide film of the solder are reduced by formic acid, but a carboxylic acid gas other than formic acid can be used as a reducing gas to perform the reduction process of the substrate W and the oxide film of the solder.

In the above description, when the cover 16 has a top plate 16t and a side plate 16s, the formic acid gas F supplied into the chamber 11 or the vaporized substance generated by the heating of the substrate W can pass through the cover 16 and the carrier 13 The boundary enters and exits between the inside and the outside of the cover 16, but the cover 16B of the modified example shown in FIG. 4 may be provided with a net 16h through which vaporized substances are discharged from the inside of the cover 16B to the outside. The net portion 16h is constructed in a way that vaporized substances can pass but condensed substances cannot pass. Here, the inability of the condensed substance to pass does not strictly mean that the condensed substance cannot pass, but the inability to pass without affecting the quality of the product P to an extent, that is, it does not need to pass substantially. The net portion 16h is typically provided on the top plate 16t, but can be provided on the side plate 16s instead of the top plate 16t, or on the top plate 16t and the side plates 16s. The formic acid gas F can also pass through the mesh for 16 hours. Therefore, when the cover 16B is used, it is possible to effectively prevent the condensed substance from contacting the substrate W and the like, and at the same time, the formic acid gas F can be easily supplied around the substrate W. In addition, the configuration of the net portion 16h included in the lid 16B can also be applied to the lid 16A as shown in FIG. 3.

In the above description, as an example, FIGS. 1 to 4 are mainly used to describe the welding product manufacturing apparatus and the welding product manufacturing method of this embodiment, but the structure, structure, number, arrangement, shape, material, etc. of each part are not limited to the above Specific examples, those with ordinary knowledge in the technical field, which can be appropriately and selectively adopted within the spirit of the present invention, are also included in the scope of the present invention.

All documents cited in this specification, including publications, patent applications, and patents, can be referred to as shown in the respective documents and incorporated into this case by reference, and all their contents are incorporated into this case by reference to the same extent as above.

Regarding the description of the present invention (especially with regard to the following claims), the use of nouns and the same descriptive words should be interpreted as both singular and plural in this specification, unless otherwise specified or there is no obvious contradiction in context. The sentence "has", "has", "contains" and "contains" If it is not specifically stated, it should be interpreted as open-ended writing (that is, "including but not limited to"). In this specification, the description of the numerical range is in this specification. Unless otherwise specified, its meaning is only a brief description method to illustrate each value within the range, and each value is separately enumerated and incorporated in this specification. . All methods described in this specification can be carried out in various appropriate orders without special restrictions in this specification or without obvious contradiction in context. Various examples or exemplified statements (such as "etc.") used in this specification are only used to clearly illustrate the present invention without special instructions, and are not used to limit the scope of the present invention. Any statement in the specification should not be interpreted as a requirement not recorded in the claim, or what is indispensable for implementing the present invention.

This specification includes the best mode known to the inventors for implementing the present invention, and describes the preferred mode of implementation of the present invention. Those who have ordinary knowledge in the technical field should be able to understand the modifications of the preferred implementation patterns by reading the above descriptions. The inventors of the present invention can expect that those skilled in the related art can appropriately apply this modification, and can implement the present invention in methods other than those specifically described in this specification. Therefore, according to the patent law, the present invention includes amendments and equivalents of the content described in the claims attached to this specification. In addition, in this specification, all combinations of the above-mentioned requirements in all modifications are included in the present invention without special restrictions or no obvious contradiction in context.

Claims (9)

A welding product manufacturing device, which is equipped with: The carrier is a base board equipped with solder; The cover body covers at least the upper part of the aforementioned substrate placed on the aforementioned stage at a certain distance; The chamber contains the aforementioned carrier and the aforementioned cover; The heating part heats the aforementioned substrate placed on the aforementioned stage; and The reducing gas supply device supplies the reducing gas for reducing oxides into the aforementioned chamber. The soldered product manufacturing apparatus according to claim 1, wherein the specific distance is specified by the shortest distance between the solder disposed on the substrate and the cover. The welded product manufacturing device according to claim 2, wherein the shortest distance is configured to be 0.1 mm to 20 mm. The welding product manufacturing apparatus according to claim 1, wherein the specific distance is specified by the shortest distance between the substrate and the cover on the upper portion of the substrate. The welded product manufacturing apparatus according to any one of claims 1 to 4, wherein the heating section is configured to heat the substrate by heating the stage on which the substrate is placed; The cover system is configured to be in contact with the stage so as to generate heat transfer from the stage. The welded product manufacturing apparatus according to claim 5, wherein the cover system is configured to surround a space around the substrate placed on the stage. The welded product manufacturing apparatus according to any one of claims 1 to 6, wherein the cover has a net portion that allows vaporized substances generated by substances on the substrate to pass through, but liquefies or solidifies The aforementioned substances cannot pass. A method for manufacturing welded products is a method for manufacturing welded products using the welded product manufacturing device as described in any one of claims 1 to 7, and has the following steps: The placing step is to place the aforementioned substrate with the aforementioned solder on the aforementioned carrier; The covering step is to cover at least the upper part of the substrate placed on the stage with the cover at a distance from the solder; The heating step is to heat the substrate after the covering step; and The reducing gas supply step is to supply the reducing gas in the chamber. The method of manufacturing a welded product according to claim 8, wherein in the covering step, the distance between the solder and the shortest part of the cover is configured to be 0.1 mm to 20 mm.

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