TW202109021A - Quality control inspection device using two-dimensional image recognition technology to perform quality control inspection on connection terminals of electronic components to be tested and method thereof for greatly improving accuracy and yield of connection terminals - Google Patents

Abstract

The present invention provides a quality control inspection device using two-dimensional image recognition technology to perform quality control inspection on connection terminals of electronic components to be tested and a method thereof. The quality control inspection device first projects light to a portion of the connection terminals f an electronic component to be tested that is adjacent to a free end so as to generate a corresponding shadow, and then capture an overall image. After that, the quality control inspection device subjects the overall image to filtering to filter out irrelevant shadow and identify a specific reference position, and uses the reference position as a reference point when constructing a two-dimensional manufacturing specification of the electronic component to be tested. Furthermore, according to each reference point, the quality control inspection device calculates a position of the free end of the connection terminals and an arc or an offset of each connection terminal adjacent to the free end, which are sequentially analyzed and compared with the ideal specification of the connection terminals of the original computer simulation design, so as to greatly improve the accuracy and yield of the connection terminals.

Description

Quality control inspection device and method for performing quality control inspection on connection terminals of electronic components to be tested by using two-dimensional image recognition technology

The present invention relates to a quality control inspection method for electronic components, especially a method for electronic components (including microprocessors, electronic modules, electromechanical modules, connector plugs and connector sockets.. .Etc.) The connecting terminal implements the inspection method of the ideal specification, in order to hope that the quality control inspection method of the present invention can not only greatly improve the manufacturing accuracy and yield of the connecting terminal, but also enable the electronic components to accurately transmit high Frequency serial data, and can ensure the integrity of the data signal in the transmission of high-frequency serial data.

By the way, the printed circuit board assembly industry was once a star industry in Taiwan in the 20th century. Especially in the era of the development of the electronic industry, the greater the number or the larger the volume of electronic components on the printed circuit board, the electronic The volume and weight of products will also increase significantly, so that each electronic product must eventually face the problem of excessive volume or weight. However, with the rapid innovation and progress of technology, the design of passive components is integrated into active components and products. Various surface mount devices (SMD for short) have been made into bulk circuits based on this. It seems that it has become a common technical method in the industry. It is hoped that all surface mount devices can be mounted one by one through surface mount technology. Printed Circuit Board (PCB) is used to create a new era for the thin, thin and short printed circuit board industry in Taiwan.

In this new era, all kinds of high-tech technology are constantly being innovated And developed, various passive components, active components and integrated circuits can also be made into various smaller and lighter surface mount components, so that various electronic products can smoothly get rid of the design limitations of the past too large in one fell swoop , So that various electronic products can easily conform to the market trend of "light, thin, short and small". In view of this irreversible market trend, more and more consortia have invested huge amounts of money and talents to this high-end circuit In the field of development and production of boards and electronic components, although the manufacturing and assembling processes of the high-end circuit boards and electronic components have been fully automated, however, once the high-end circuit boards and electronic components are assembled, There are still many inspections that need to go through the inspection personnel, visually, with the free evaluation of the inspectors, and perform all the required inspections one by one on the various connection terminals installed on them. This inspection method is not only a waste of time, but also a waste of time. And often due to the different subjective testimony of the inspectors or errors caused by visual fatigue, the inspection results are very different and extremely inconsistent, so that accurate and consistent quality control cannot be achieved. According to this, many companies have invested huge sums of money and manpower to conduct research and development on the various inspections of high-end circuit boards and electronic components, hoping to accurately and consistently detect each of these high-end circuit boards and electronic components. The production quality of the above-mentioned various connection terminals ensures that the high-end circuit boards and electronic components can always meet the requirements of the industry and provide the expected functions, functions and service life.

According to the investigation, although the various conventional testing tools developed and used in the industry can effectively improve the aforementioned quality control problems, because each of the testing tools is based on the probe set on it, through Each of the high-level circuit boards and electronic components has two corresponding connection terminals (i.e., input and output). According to the electrical characteristics of each of the connection terminals and the electrical characteristics between them, the detection items of short circuit, open circuit and reset to zero are carried out one by one, In addition, based on the absolute necessity of each test item, the industry has also encouraged the use of various test fixtures to replace the visual inspection by the inspectors. It has greatly improved the inspection quality, production quantity and the rich economic benefits derived from each of the high-end circuit boards and electronic components. However, when this conventional inspection fixture performs the aforementioned inspection items on each of the high-end circuit boards and electronic components, it uses the probes provided on it to abut and press each of the high-end circuit boards and electronic components. There are two corresponding connecting terminals on the component. Therefore, the force exerted by the probes when they are pressed and pressed cannot be accurately controlled, which results in the corresponding connecting terminals being exposed to excessive abutment and pressing force of the probes. The sliding ejection of the inspection jig makes it difficult for the probes to accurately complete the aforementioned inspection items. This is also an important issue that manufacturers often face and urgently want to solve.

In addition, in order for the high-end circuit boards and electronic components to meet the "Press-fit technology" required by the industry, the design, manufacturing and testing of related electronic products still have to face many problems that need to be resolved one by one. bottleneck. Press, the so-called "Press-fit technology" is expected to be able to press-assemble the connection terminals on the surface-mounted components or electronic components into the corresponding terminal holes H on a PCB based on the principle of press-matching. Depending on the structure of the press-fitting pins (ie, connecting terminals) used on the surface mount components or electronic components, it can be roughly divided into two different press-assembly types; among them, please refer to Figure 1. One type is a solid press-fitting pin P ₁ , which has a solid press-in area P ₁₁ ; please refer to Figure 2, the second type is a flexible press-fitting pin P ₂ , which has an elastic press-in area P ₂₁ . In the Press-fit technical white paper, only the flexible press-fitting pin P _{2 with the elastic press-in area P 21} is described, and they are collectively referred to as press-fitting pins.

In addition, TE Connectivity's (TE) compression technology was first introduced into the telecommunications industry in the 1970s; later, in 1988, TE Connectivity's first compression fitting was introduced to the vehicle industry; today, TE Connectivity has Vehicle applications provide two unique press-fitting solutions; one, please refer to figure 3, which is called ACTION PIN connection terminal P ₃ (or independent pin, press-fit pin); the second, please refer to page As shown in figure 4, the system is called Multispring connection terminal P ₄ (or independent pin, press-fit pin); in general, press-fit technology can be applied to multiple series; among them, please refer to figure 3 , The series using the independent pin P ₃ is the most basic method of press-fitting technology. The method usually uses an automatic device to insert each independent pin P ₃ separately into the corresponding terminal hole on the PCB at a high frequency; each independent P ₃ has the pin shoulder geometry P _30, which was independent of each pin P ₃ is press-fitted to the PCB to provide the necessary support; independently respect to the adjacent pin P ₃ P Room independent pin spacing of 5mm _3, Using TE Connectivity's P350 insertion machine can reach the rate of inserting up to 5 independent pins P ₃ per second, and by measuring the pressing force and/or depth to control the insertion process, the best connection quality control can also be obtained. Complex See Figure 4, another series is the most common system used with a press-fit pin P the pin head ₄₀ of P _4, P of the pin head ₄₀ of the press-fit pin Nailing P ₄ is firmly positioned to have a The component between the insulated plastic plug (or socket) shell C and the PCB; usually, these press-fit pins P ₄ are kept parallel to the PCB (0°), a predetermined angle or vertical (90°), and according to requirements The number of press-fitting pins P ₄ , so that the press-fitting pins P ₄ can be processed by manual, semi-automatic or fully automatic connection terminal making machine; then, by pressing the shoulders of the pins P _{40 of each press-fitting pin P 4} , That is, each press-fitting pin P ₄ can be press-fitted to the corresponding terminal hole H on the PCB. Of course, there are also some applications that can complete the installation procedure on the PCB by directly pressing the insulating plastic plug (or socket) shell C.

Generally speaking, TE Connectivity’s press-fitting solution is actually _{realized with compatible and elastic press-fitting pins P 3} and P ₄ (or connecting terminals). Therefore, the press-fitting pins P ₃ and P ₄ are Although it may be deformed when inserted into the corresponding terminal hole H on the PCB, it is obviously more effective in reducing the stress on the corresponding terminal hole H on the PCB than the solid press-fitting pin, and it can effectively reduce the stress on the corresponding terminal hole H on the PCB. It maintains permanent contact with the normal force during insertion, so that it can provide effective and reliable electrical and mechanical connections throughout its service life. In addition, after the press-fitting pins P ₃ , P ₄ are inserted into the corresponding terminal holes H on the PCB, _{the positive force between the press-fitting pins P 3} , P ₄ and the corresponding terminal holes H Cold-welded interconnections will be automatically generated; in particular, if tinning is used for at least one of the two contacts (such as terminal holes), the cold-welding process will cause a direct metal connection between these contacts. As a result, only extremely low contact resistance values (usually lower than 0.1mOhm/sub-milliohm range) are generated between them. According to this, it can not only increase the stability of its mechanical contact, but also obviously increase its electrical resistance. stability. According to the investigation, TE Connectivity’s press-fitting technology has been widely used in many applications in the vehicle field. It not only provides vehicle operators with many convenient, auxiliary and safe functions in the design, manufacture and use of vehicles. It has proved that the vehicle industry has a high degree of recognition and trust in TE Connectivity's press-fitting technology itself. In addition, as more electronic devices continue to be developed and become more popular, the number of electrical connections in the vehicle is also increasing. However, in order to meet the market trend of making vehicles smaller, safer, cheaper and easier to handle, many innovative designs and applications of vehicles mainly focus on the use of electrical control unit (ECU) ) Perform related control, and each ECU needs to be as compact as possible. According to this, each ECU is independently equipped with a PCB, and each ECU carries electrical components with the same miniaturization trend. Based on the aforementioned electronic and miniaturization market trends, many electronic or electrical components must have more electrical interconnection capabilities in the same or even smaller packaging space. This demand has also prompted relevant industry players to devote themselves to Develop miniaturized interconnect components (or connectors). In order to cater to this market trend, related companies have used TE Connectivity press-fitting technology to introduce a miniature connector C1 (miniaturized connector) called NanoMQS series for 0.4x0.5mm connection terminals. Please refer to Figure 5 Show. In order to reduce the space occupied by the NanoMQS series miniature connector C ₁ on the PCB, please refer to Figure 6. The distance between the upper two adjacent connecting terminals has been greatly reduced from 2.54mm of the _{traditional connector C 0 to 1.8 in one fell swoop} At the same time, the size of the terminal hole on the PCB has been greatly reduced from the traditional 1.0mm to 0.6mm. Therefore, according to its configuration and specifications, it should be easy to see that, compared with the traditional connector C ₀ that uses 0.63x0.63mm connection terminals, the NanoMQS series miniature connector C ₁ can obviously save up to 60% of the footprint on the PCB. space.

In addition, another trend in the market is to combine the connection terminals of NanoMQS with press-fitting technology. Related companies have also developed a brand new press-fitting pin called NanoMultispring, which has prompted it to include press-fitting technology. The electrical interconnection characteristics including the contacts meet more and more reliable product standards, which can be applied to more severe environmental conditions and meet the requirements of more and higher functional characteristics. In addition, as each electronic device is equipped with more electronic components, more electrical interconnections are naturally formed between these electronic components, which will gradually increase the industry’s requirements for each electronic component. In this way, it can effectively ensure that each electronic component can always provide high-quality and reliable performance during its service life. Although, in today's vehicle applications, the most common PCB thickness is still 1.6mm, but with the evolution of the aforementioned market trends, we are very likely to see thinner PCBs in future applications (such as: thickness 1.2mm, 1.0mm or 0.8mm PCB). Accordingly, in order to meet the aforementioned market trends, press-fit technology solutions must naturally face more and more stringent requirements in their design, manufacturing and testing, so that they can be applied to various PCB interconnection systems and can Provide many advantages in line with market trends for each interconnection system.

In addition to the aforementioned press-fitting pins P ₃ , P ₄ (or connecting terminals P ₃ , P ₄ ) used in the aforementioned press-fitting technology solutions, generally speaking, the most commonly used press-fitting pins P ₅ in the vehicle industry, Please refer to Figure 7, the structure is formed on a base material P ₅₀ (base material) with two plating layers (ie, the bottom plating layer (under plating) P ₅₁ and the top plating layer (top plating) P ₅₂ ) With the introduction of lead free soldering in the industry, the average soldering temperature needs to be much higher than before. In order to adapt to this higher operating temperature, it is necessary to use more special and expensive electronic components. High temperature resistant plastics (such as: LCP, PPS, PPA and PCT... etc.) are used as the insulating materials on top of them. However, through the use of press-fitting technology and the abandonment of soldering processes, not only this shortcoming can be completely avoided, but also lead-free The application also does not require the use of expensive high-temperature resistant plastics. In addition, because the effective use of space has always been an important consideration in vehicle design, the application of press-fitting technology provides an excellent solution for it, although this solution is difficult to achieve through traditional welding processes. Miniaturized solutions. However, it provides a favorable solution for large connectors and reflow soldering processes, enabling the industry to use surface mount technology (SMT) to apply many electronic components to existing PCB soldering process steps in the process of manufacturing various electronic components. In order to effectively avoid the problem that large solder joints often interfere with the SMT reflow soldering process. As for the problem that the terminals of the plug and adjacent components are too low in temperature, which leads to defects in the welding process, it can also be solved by adding heads after the welding process through press-fitting technology; in addition, in the application of the aforementioned press-fitting technology, There is also a very common application of integrated housing or module M. Please refer to Figure 8. This application combines coils, capacitors, and actuators. ) And sensors (sensors)... and other electronic components or motor components (not shown in the figure) are integrated in the same housing or module M, so that they can be press-fitted and mounted on the same PCB to make These electronic components or motor components can share the functions and functions provided by the same PCB; among them, each integrated housing or module M is generally made of ABS/ESC material, in order to make the assembly process of press-fitting technology application more convenient. It is easy and reliable, and makes many applications of mechatronics a reality that can be realized instead of being out of reach.

In recent years, with the increasing progress and complexity of the electrical and electronic industries, big data The high-speed transmission seems to have become an irreversible inevitable trend in the future electronics industry. Take backplane technology as an example. Backplane technology is the foundation of today’s telecommunications systems. The development of backplane structures has reduced the data transmission bandwidth of telecommunications systems. The transmission speed of a few Mb per second has been pushed to a transmission speed of a few Terabits per second (ie, 1012bits=1000000000000bits=1000gigabits). However, in the pursuit of high-speed transmission of ultimate data stream traffic, not only the physical layer structure in the backplane is very important, but also The density of connection terminals, terminal holes, and wiring direction in the upper connector are also challenges that connector designers must face when controlling the excess reactance in the entire channel. Although, through the use of advanced microvia technology and surface mount technology , Connector and backplane designers have been able to use mature digital analog design programs to break through many obstacles in the telecommunications system and design ideal backplanes, connectors and their corresponding electronic components; however, due to the current telecommunications platform All rely on high-speed serial data transmission, and connector and backplane designers habitually often transfer the performance limit of the telecommunication system to the copper used in the connection terminals in the connector, and in order to break the Terabit’s In recent years, an advanced backplane technology has been adopted in network switches and routers. This advanced backplane technology has been computerized or digitized due to the benefits of complex design technology in physical layer components. In the design process, the design, modeling, simulation, measurement and verification of most of the components...The procedures can be completed one by one in the computerized or digital simulation design program, and can make full use of the existing time domain analysis Ability The analog design program with frequency domain analysis capabilities enables designers to visually display complex phenomena such as reflection, crosstalk, impedance mismatch and loss.

As mentioned above, although designers of advanced backplanes, connectors or related components have been able to use computers or digital analog design programs to design ideal specifications for the connection terminals on various backplanes, connectors or related components , And make each backplane, connector or its related components have the expected ideal electrical characteristics. After manufacturing the advanced backplanes, connectors, or related components, the advanced backplanes, connectors, or related components are often caused by various mechanical errors or manufacturing processes on the automated production equipment. Missing, resulting in the manufacturing specifications of the connecting terminals on the advanced backplanes, connectors or related components that do not meet the ideal specifications of the original design, so that the advanced backplanes, connectors or related components cannot transmit at high frequencies Under the environment, the ideal electrical characteristics expected by the industry are brought into play. In view of this, how to accurately detect the physical structure of the various connectors installed on each of the advanced backplanes, connectors or related components to ensure that the pins of each connection terminal in each connector , Spacing, configuration... and other manufacturing specifications are fully in line with the ideal specifications designed, and all kinds of electronic components can be accurately installed on the PCB of the telecommunications equipment through the corresponding connection terminals, so that each telecommunications equipment Not only can it accurately transmit high-frequency serial data, but it can also achieve the integrity of data signals in the transmission of high-frequency serial data. This has become an important issue that major telecommunications equipment and component designers and manufacturers urgently want to solve. It is also one of the important topics of the present invention to be discussed in depth later.

In view of this, in order to improve the many deficiencies that occur when conventionally detecting the connection terminals on various electronic components, the inventor has finally developed and designed a two-dimensional image recognition technology of the present invention to be tested after a long period of hard research and experiments. A quality control inspection device and a method for performing quality control inspections on the connecting terminals of electronic components.

One object of the present invention is to provide a quality control inspection device that uses two-dimensional image recognition technology to perform quality control inspections on the connection terminals of electronic components to be tested. The quality control inspection device at least includes a detection platform (or tray) and a light source Device, an image capture device, and a testing computer; wherein the top side of the testing platform can locate at least one electronic component to be tested, and each The part of the connecting terminal on the electronic component that is adjacent to the free end (or the plug-in end) faces the upper side of the testing platform, so that the testing device can perform quality control testing on the connecting terminals on each electronic component to be tested; the light source device It is installed above the top side of the detection platform, and the projected light generated by it can be projected to the part adjacent to the free end of each connection terminal at a predetermined angle along the plugging and unplugging direction of the connection terminal, so that each of the electronic devices to be tested The components and the parts on the connecting terminals adjacent to the free ends can produce an overall light and shadow; the image capturing device is also installed on the top side of the detection platform, and can accurately capture each of the electronic zeros to be tested The overall image of the component and each connecting terminal adjacent to the free end; the detection computer is electrically connected with the light source device and the image capture device to control the light source device and the image capture device, respectively The electronic component to be tested and each of the connecting terminals on the adjacent free ends project light and capture images, and can perform filtering processing on the entire image after receiving the entire image from the image capture device to filter Remove the light and shadow in the overall image that have nothing to do with the construction of the two-dimensional manufacturing specifications of the electronic component to be tested, and construct the two-dimensional manufacturing specifications of each electronic component to be tested according to the original computer simulation design. Measure the ideal specifications of the electronic components and the pins, thickness, quantity, spacing and configuration of the connecting terminals, etc., and conduct quality control comparison and analysis one by one, in order to greatly improve the accuracy of the manufacturing of the connecting terminals and Yield rate, so that the electronic components can not only accurately transmit high-frequency serial data, but also ensure the integrity of the data signal in the transmission of high-frequency serial data.

Another object of the present invention is to provide a method for performing quality control inspection on the connection terminals of electronic components under test by using two-dimensional image recognition technology. The method is applied to a quality control inspection device that includes at least one inspection Platform (or tray), a light source device, an image capture device and a testing computer; wherein the top side of the testing platform can position at least one electronic component to be tested, and connect each electronic component to be tested The terminal is adjacent to the free end (or plug-in end) The position of is facing above the inspection platform, so that the inspection device can perform quality control inspection on the connection terminals of the electronic components to be tested; the light source device is installed above the top side of the inspection platform, and the projection generated by it The light can be projected at a predetermined angle along the plugging and unplugging direction of the connecting terminal to the part of each connecting terminal adjacent to the free end, so that the part of each connecting terminal adjacent to the free end can generate a corresponding light and shadow; the image capturing device It is also installed above the top side of the detection platform, and can accurately capture the overall image of each electronic component to be tested and its connecting terminal adjacent to the free end; the detection computer is separately connected to the light source device and the The image capture device is electrically connected to control the light source device and the image capture device to project light and capture images on each of the electronic components to be tested and their connecting terminals adjacent to the free ends, and can receive the After the overall image from the image capture device, perform the quality control inspection on the connection terminals of each electronic component under test according to the following steps: First, filter the overall image captured by the image capture device to Filter out the light and shadow in the overall image that have nothing to do with the construction of the two-dimensional manufacturing specifications of the electronic component to be tested; identify the overall image corresponding to at least one specific on the top side of the inspection platform or on the electronic component to be tested The reference position, and each reference position is used as the reference point when constructing the two-dimensional manufacturing specifications of the electronic component under test; according to each reference point, the free end (or plug-in end) position of each connection terminal is calculated (Ie, the pin position) and the arc or offset of each connecting terminal adjacent to the free end (or plug-in end); until the position of the free end (or plug-in end) of each connecting terminal and each connecting terminal are calculated After the arc or offset of the adjacent free end (or plug-in end), it can be compared with the original computer simulation design of each terminal's pin position, thickness, number, spacing and configuration...and other ideal specifications, one by one Perform comparison and analysis to determine whether the two are consistent? If yes, it will display "The manufacturing specifications of the connection terminals on the electronic component under test meet the ideal specifications of the original design, and can pass the quality control inspection!"; otherwise, it will display "The manufacturing specifications of the connection terminals on the electronic component under test. Do not It meets the ideal specifications of the original design, but cannot pass the quality control inspection! And the inspector should explore the cause and seek a solution for this defect state, and make a note! This is to serve as a reference for improving the manufacturing process and adjusting machine errors in the future," in order to greatly improve the accuracy and yield of the connection terminal manufacturing, so that the electronic components can not only accurately transmit high-frequency serial data, but also It can ensure the integrity of the data signal in the transmission of high-frequency serial data.

In order to facilitate your reviewer to have a further understanding and understanding of the purpose, shape, features and effects of the structure of the present invention, a detailed description is given as follows:

[Learning]

P ₁ ‧‧‧Solid press fitting

P ₁₁ ‧‧‧Sturdy press-in area

P ₂ ‧‧‧Flexible press fitting pin

P ₂₁ ‧‧‧Elastic press-in area

P ₃ 、P ₄ ‧‧‧ACTION PIN connection terminal

P ₃₀ ‧‧‧Shoulder geometry

P ₄₀ ‧‧‧pin

P ₅ ‧‧‧Press fit pin

P ₅₀ ‧‧‧Basic material

P ₅₁ ‧‧‧Bottom plating layer

P ₅₂ ‧‧‧Top plating layer

C ₁ ‧‧‧Miniature connector

C ₀ ‧‧‧Traditional connector

H‧‧‧Terminal hole

C‧‧‧Insulating plastic plug (or socket) shell

M‧‧‧Shell or module

PCB‧‧‧Printed Circuit Board

〔this invention〕

1‧‧‧Quality Control Testing Device

2‧‧‧Electronic components

30‧‧‧Testing platform

300‧‧‧Parts positioning slot

31‧‧‧Horizontal displacement mechanism

320‧‧‧Light source device

330‧‧‧Image capture device

34‧‧‧Vertical displacement mechanism

38‧‧‧Testing computer

380‧‧‧Two-dimensional image recognition and detection program

C ₉ ‧‧‧Connector

M ₁₀ ‧‧‧Integrated shell or module

P ₉ , P ₁₀ , P ₁₁ ‧‧‧Connecting terminal

CPU‧‧‧Electronic components

100~107‧‧‧step

Figure 1 is a schematic diagram of the structure of a solid press-fitting pin used in the conventional press-fitting technology; Figure 2 is a schematic diagram of the structure of a flexible press-fitting pin used in the conventional press-fitting technology; Figure 3 is TE Connectivity The structure diagram of the independent pin P _{3 series provided for vehicle applications; Figure 4 is} the structure diagram of the Multispring pin P 4 series provided by TE Connectivity for vehicle applications; Figure 5 is a model released by TE Connectivity press-fitting technology _{The appearance diagram of the micro connector C 1} and its corresponding traditional connector C ₀ , which is used for 0.4x0.5mm connection terminals and named NanoMQS series; Figure 6 is the NanoMQS series micro connector C ₁ and its corresponding traditional connector The top side structure diagram of C ₀ ; Figure 7 is a schematic diagram of the appearance of the most commonly used press fitting pin P ₅ in the vehicle industry; Figure 8 is a schematic diagram of the appearance of an integrated housing or module application commonly used in press-fitting technology applications; Figure 9 is a schematic diagram of the appearance of the Dimm socket; Figure 10 is a schematic diagram of the bottom side structure of the socket used by the push-fit technology; Figure 11 is another socket used by the push-mate technology Figure 12 is a schematic diagram of the hardware architecture of the detection device of the present invention; and Figure 13 is a schematic flow diagram of the detection method of the present invention.

As mentioned above, based on the current telecommunications platforms adopting high-speed serial data transmission, in order to break the Terabit boundary, although the designers of various connectors, backplanes, integrated housings or modules and related electronic components suffer from Thanks to the computerization or digitization of the complex design technology in the physical layer components, the design, modeling, simulation, measurement and verification of most components in the design process can be computerized or The digital simulation design program is completed one by one, and it can make full use of the simulation design program with both time domain analysis ability and frequency domain analysis ability, so that the designer can make the reflection, crosstalk, impedance mismatch and loss... The phenomenon is displayed intuitively, and after modification and adjustment, the desired specifications of the connecting terminals on the various connectors, backplanes, integrated shells or modules and related components are designed, and the connectors are , Backplanes, integrated housings or modules and their related components have the expected ideal electrical characteristics. However, often contrary to expectations, the industry uses advanced automated production technology and equipment to manufacture the connectors and backplanes. , After the integrated shell or module and its related components, each connector, backplane, integrated shell or module and its related components are often caused by various mechanical errors or missing processes on the automated production equipment. The manufacturing specifications of each connector, backplane, integrated housing or module and its related components do not meet the ideal specifications of the original design, so that each connector, backplane, integrated housing or module and Its related components cannot play the ideal electrical characteristics expected by the industry under the high frequency transmission environment. In view of this, the inventor has personally participated in various connectors, backplanes, integrated housings or modules and their Practical experience in the development, design, manufacturing and promotion of related components. I have a deep experience of whichever type of connector C ₉ (see Figure 9), integrated housing or module M ₁₀ (see page Figure 10) and its related electronic components CPU (refer to Figure 11, hereinafter referred to as "electronic components"). The quality of its signal transmission depends on the connection terminals used to transmit the signal. The _{production quality of P 9} , P ₁₀ and P _{11 is} good. If the manufacturing specifications of the electronic components C ₉ , M ₁₀ , and the connection terminals P ₉ , P ₁₀ , P ₁₁ on the CPU meet the ideal specifications of the original design, each Electronic components C ₉ , M ₁₀ , and CPU can easily play the ideal electrical characteristics expected by the industry under high-frequency transmission environment, so as to ensure that each electronic component C ₉ , M ₁₀ , and CPU always have excellent high-frequency data Transmission quality; accordingly, the inventor is thinking about how to accurately determine the physical structure of each connecting terminal P ₉ , P ₁₀ , P _{11 installed on each of the electronic components C 9} , M _{10, and CPU} Inspection to ensure the pin position, spacing and structure of each connecting terminal P ₉ , P ₁₀ , P ₁₁ on each of the electronic components C ₉ , M _{10, and CPU} The manufacturing specifications such as shape... are fully in line with the ideal specifications of the original design, so that the electronic components C ₉ , M ₁₀ , and CPU can be accurately installed through the corresponding connection terminals P ₉ , P ₁₀ , P ₁₁ On the PCB of various electronic and telecommunications equipment, and so that each of the electronic and telecommunications equipment can not only accurately transmit high-frequency serial data, but also realize the integrity of the data signal in the transmission of high-frequency serial data.

In view of the fact that the ideal specifications of each of the electronic components C ₉ , M ₁₀ , and each connection terminal P ₉ , P ₁₀ , P _{11 on} the CPU have been determined when the design is completed, and each of the electronic components C ₉ , M ₁₀ , CPU through each of the connection terminals P ₉ , P ₁₀ , P ₁₁ along the plugging direction and respectively conflict with the corresponding connection terminals to form an electrical connection, and according to the precise transmission of high-frequency serial data, generally In other words, the conflicting parts between the corresponding connecting terminals are all located at the positions of each connecting terminal P ₉ , P ₁₀ , P ₁₁ adjacent to the free end (or plug-in end), and in order to effectively improve the conduction between the corresponding connecting terminals The industry will coat each connecting terminal P ₉ , P ₁₀ , P ₁₁ adjacent to the free end (or plug-in end) with a layer of gold or silver... and other materials. The parts of each connecting terminal P ₉ , P ₁₀ , P ₁₁ adjacent to the free end (or plug-in end) have better reflective and conductive properties.

Based on the aforementioned characteristics of each of the electronic components C ₉ , M ₁₀ , and each of the connection terminals P ₉ , P ₁₀ , P _{11 on} the CPU, the inventor thinks that if the electronic components C ₉ , C 9, M ₁₀ , the position of each connection terminal P ₉ , P ₁₀ , P ₁₁ on the CPU adjacent to the free end (or plug-in end) is first taken along its plugging and unplugging direction to capture its two-dimensional image; then, using the two-dimensional image _{Identification technology to accurately contour the two-dimensional image of each of the electronic components C 9} , M ₁₀ , and each connection terminal P ₉ , P ₁₀ , P ₁₁ adjacent to the free end (or plug-in end) on each of the electronic components to be tested Identification, that is, it can be manufactured by confirming the pin position, spacing, and connector configuration of each connecting terminal P ₉ , P ₁₀ , P _{11 on each of the electronic components C 9} , M _{10, and CPU to be tested.} After specifications, compare and judge with the ideal specifications of the original design. If it is determined that the manufacturing specifications completely meet the ideal specifications of the original design, it means that the electronic components C ₉ , M ₁₀ , and CPU under test belong to Good products that pass the quality control inspection; on the contrary, it means that the electronic components C ₉ , M ₁₀ , and CPU to be tested are defective products that cannot pass the quality control inspection. In this way, it not only enables the industry to complete the inspection and judgment of the ideal specifications of the _{electronic components C 9} , M _{10 , and CPU in the fastest and accurate inspection process, so as to ensure that the electronic components C 9} , M ₁₀ , the pin position, spacing and configuration of each connecting terminal P ₉ , P ₁₀ , P ₁₁ on the CPU, etc., are fully in line with the ideal specifications of the original design, so that each electronic component C _9. M ₁₀ , CPU can be accurately installed on the PCB of various electronic and telecommunications equipment through the corresponding connection terminals P ₉ , P ₁₀ , and P _{11, and the electronic and telecommunications equipment can not only accurately transmit} High-frequency serial data can still achieve the integrity of the data signal in the transmission of high-frequency serial data; not only that, the industry can still accurately detect each of the electronic components C ₉ , M ₁₀ , and CPU After the specific flaws in the manufacturing specifications of the supporting connection terminals P ₉ , P ₁₀ , P ₁₁ in the pin position, spacing, and plug-in terminal configuration, etc., we can quickly explore and find the corresponding mechanical errors on the automated production equipment. Or the manufacturing process is lacking, so that after obtaining the solutions for the defects, the product quality and production yield _{of the electronic components C 9} , M _{10, and CPU can be greatly improved.}

Based on the foregoing invention concept, the inventor has been engaged in the design and manufacture of automated inspection equipment for many years. After long-term observation and research, the inventor found that only two-dimensional image recognition technology can be used to target several batches. Ten or hundreds of electronic components C ₉ , M ₁₀ , the physical structure and position of the connection terminals P ₉ , P ₁₀ , P _{11 on} the CPU, and perform two-dimensional image capture and identification at the same time, which can be large and accurate To complete the relevant inspection work for the ideal specifications of each of the electronic components C ₉ , M ₁₀ , and each connection terminal P ₉ , P ₁₀ , P ₁₁ on the CPU, the first problem that must be solved is to check the electronic components. Components C ₉ , M ₁₀ , and each connection terminal P ₉ , P ₁₀ , P ₁₁ on the CPU adjacent to the free end (or plug-in end). Before performing related inspections, it is necessary to make each electronic component C ₉ , M ₁₀ , and each connecting terminal P ₉ , P ₁₀ , P ₁₁ on the CPU adjacent to the free end (or plug-in end) can be completely exposed in an open perspective space without dead angles. In this way, when the two-dimensional image recognition technology is used to _{perform related inspections on each of the electronic components C 9} , M ₁₀ , and each connection terminal P ₉ , P ₁₀ , P ₁₁ on the CPU, the two-dimensional image recognition technology can only be used The light source used smoothly passes through the open and non-dead perspective space, and is projected to each of the electronic components C ₉ , M ₁₀ , and each connecting terminal P ₉ , P ₁₀ , P ₁₁ on the CPU adjacent to the free end (or plug At the same time, the image sensing device used by the two-dimensional image recognition technology can smoothly pass through the open perspective space without dead angles, and capture each electronic component C ₉ , M10 and CPU. The clear images of the parts adjacent to the free end (or the plug-in end) of the connecting terminals P ₉ , P ₁₀ , and P ₁₁ can be used to enable the two-dimensional image recognition technology to use its built-in automatic optical detection technology to connect each The positions of the terminals P ₉ , P ₁₀ , and P ₁₁ adjacent to the free end (or the plug-in end) are respectively reconstructed with two-dimensional images (that is, their manufacturing specifications), and are respectively corresponding to one-to-one and flawless two-dimensional reference images (That is, the ideal specification of the original design), compare and analyze the specification features (such as: pin position, spacing and configuration... etc.) to quickly and accurately follow each connection terminal P ₉ , P _10. The plugging and unplugging direction of P ₁₁ is completed. The electronic components C ₉ , M ₁₀ , and the pin positions, spacing and configuration of each connecting terminal P ₉ , P ₁₀ , P _{11 on the CPU and other manufacturing specifications are completed.} Item detection.

Based on this design concept, please refer to Figure 12. The inventor thought and designed a quality control inspection device 1. The quality control inspection device 1 uses a special structural design of the inspection platform 30 (as drawn in the 12 The top side surface of the detection platform 30 is concavely formed with a plurality of component positioning grooves 300. The component positioning grooves 300 are spaced apart and kept at a predetermined distance from each other. The configuration, size, and depth of the positioning slot 300 match the configuration, size, and height of each electronic component 2 so that when each electronic component 2 is carried on the top side of the detection platform 30, each The electronic components 2 can be accommodated in each of the component positioning grooves 300 one by one, please refer to Figure 12 again, and each of the connecting terminals P ₉ , P ₁₀ , P ₁₁ on each of the electronic components 2 are adjacent to each other The free end (or the plug-in end) is exposed on the top side of the detection platform 30 and faces above the top side of the detection platform 30. In this way, the top side of the detection platform 30 can locate and carry a plurality of electronic components 2 in batches, and when the electronic components 2 are displaced to a corresponding detection position, each of the electronic components 2 The position of each connecting terminal P ₉ , P ₁₀ , P ₁₁ adjacent to the free end (or plug-in end) is facing above the top side of the detection platform 30, so that the connecting terminals P ₉ , P ₁₀ , P _{11 are} adjacent to each other The parts of the free end (or the plug-in end) can respectively correspond to an open detection space with no dead ends. In this way, the present invention can utilize a light source device 320 and an image capture device 330 disposed on the top side of the detection platform 30, so that the light source device 320 can pass through the corresponding detection space one by one, and connect each of the connection terminals P ₉ , P 9, P ₁₀ , P _{11 are} adjacent to the free end (or plug-in end) to project light, the image capturing device 330 can capture each of the connection terminals P ₉ , P ₁₀ , P ₁₁ adjacent to the free end (or plug-in end) one by one After one of the two-dimensional images to be inspected reflected by the part, each of the two-dimensional images to be inspected is sent to a inspection computer 38. The inspection computer 38 has a built-in two-dimensional image recognition and inspection program 380, which can respond to each Detect the two-dimensional image for identification, and _{reconstruct the two-dimensional image on each of the connecting terminals P 9} , P ₁₀ , P ₁₁ adjacent to the free end (or plug-in end), and construct each of the connecting terminals accordingly P ₉ , P ₁₀ , P ₁₁ adjacent to the free end (or plug-in end) of the contour points and lines, so as to obtain the connection terminal P ₉ , P ₁₀ , P ₁₁ adjacent to the free end (or plug-in end) of the manufacturing Specifications (such as: pin position, spacing and configuration... etc.), and based on the ideal specifications corresponding to one of the original designs, perform feature comparison and analysis, so as to quickly and accurately connect each terminal P ₉ , P ₁₀ , P ₁₁ plugging and unplugging directions to complete the detection _{of each connection terminal P 9} , P ₁₀ , P _{11 on each electronic component 2.}

Please refer to Figure 12 again. In the aforementioned quality control inspection device 1 of the present invention, it further includes a horizontal displacement mechanism 31 and a vertical displacement mechanism 34; wherein, the horizontal displacement mechanism 31 and the vertical displacement mechanism 34 are respectively connected to the horizontal displacement mechanism 31 and the vertical displacement mechanism 34. The detection computer 38 is electrically connected, and is used to carry the light source device 320 and the image capture device 330, respectively, to receive the control of the detection computer 38, and perform horizontal orientation on the light source device 320 and the image capture device 330. And/or vertical displacement, so that the light source device 320 and the image capturing device 330 can pair each of the connecting terminals P ₉ , P ₁₀ , and P ₁₁ on each of the electronic components 2 adjacent to the free end (or inserting Light is projected on the part of the terminal), and the inspection computer 38 can read each of the electronic components 2 captured by the image capturing device 330 and each of the connecting terminals P ₉ , P ₁₀ , and P ₁₁ adjacent to each other The overall image of the free end (or plug-in end); finally, the inspection computer 38 will use its built-in two-dimensional image identification and inspection program 380 to target each electronic component 2 and each connection terminal P _9. The overall image of P ₁₀ and P ₁₁ adjacent to the free end (or plug-in end) is reconstructed with two-dimensional points and line contours (ie, manufacturing specifications), and based on the ideal specifications corresponding to one of the original designs. The comparison and analysis of specifications and features can quickly and accurately complete the adjustment of each electronic component 2 and each connecting terminal P _{9 on each of the connecting terminals P 9} , P ₁₀ , and P _11. , P ₁₀ , P ₁₁ test, not only to ensure that the batch method, but also to achieve the purpose of performing various tests _{on a large number of electronic components 2 and each of the connecting terminals P 9} , P ₁₀ , P _11, It is still possible to ensure that the electronic components 2 that have been tested have ideal working performance and expected service life.

According to the above description, the detection computer 38 can be based on each of the electronic components 2 and each of the connecting terminals P ₉ , P ₁₀ , and P ₁₁ adjacent to the free ends captured and transmitted by the image capturing device 330 (Or plug-in end) of the clear overall image, using its built-in two-dimensional image recognition and detection program 380 to accurately reconstruct the two-dimensional image of the overall image, in order to quickly and accurately obtain each electronic zero The manufacturing specifications of the component 2 and each connecting terminal P ₉ , P ₁₀ , P ₁₁ on it, so as to accurately analyze, judge and detect each electronic component 2 and each connecting terminal P ₉ , P on it. _10. The manufacturing accuracy of P ₁₁ can effectively improve the quality and efficiency of the quality control of each electronic component 2 and each connecting terminal P ₉ , P ₁₀ , P _{11 on it.}

The above is only a preferred embodiment of the present invention. However, the present invention is not limited to this when it is actually implemented, and any mechanism or device adopted on it can be implemented according to actual needs. Simplified or complicated, but no matter how modified or changed, as long as the quality control inspection device 1 is assisted by the inspection platform 30, through the aforementioned components of the present invention, two-dimensional image recognition and comparison technology is used, and at the same time Perform batch image inspection of a plurality of electronic components C ₉ , M ₁₀ , CPU and each of the connecting terminals P ₉ , P ₁₀ , P ₁₁ along the plugging and unplugging directions, all of which the present invention intends to protect The quality control inspection device 1 shall be specified first.

Please refer to Figure 12 again. The present invention is a device and method for performing quality control inspection on the connection terminals of electronic components under test using two-dimensional image recognition technology. The quality control inspection method is implemented by the aforementioned quality control inspection device 1 To achieve this, the quality control inspection device 1 includes a inspection platform 30 (ie, the aforementioned tray), a light source device 320, an image capture device 330, and a testing computer 38, wherein the top side of the inspection platform 30 can be positioned At least one electronic component to be tested C ₉ , M ₁₀ , CPU, and each of the electronic component 2 to be tested is connected to the terminals P ₉ , P ₁₀ , P ₁₁ adjacent to the free end (or plug-in end) toward the detection Above the platform 30, so that the quality control inspection device 1 can perform quality control inspections on each of the electronic components 2 to be tested and the connecting terminals P ₉ , P ₁₀ , and P ₁₁ ; the light source device 320 is installed in the inspection Above the top side of the platform 30, and the projected light generated by it can _{be projected to each of the connecting terminals P 9} , P ₁₀ , P 9, P 10, at a predetermined angle along the plugging and unplugging direction of _{each of the connecting terminals P 9} , P ₁₀ , P ₁₁ The part of P ₁₁ adjacent to the free end (or plug-in end), so that the parts of each of the connection terminals P ₉ , P ₁₀ , P ₁₁ adjacent to the free end (or plug-in end) can respectively generate a corresponding reflected light and shadow; the image The capturing device 330 is also installed above the top side of the inspection platform 30, so that the image capturing device 330 can accurately capture each of the electronic components 2 to be tested and the connecting terminals P ₉ , P ₁₀ , P ₁₁ is an overall image near the free end; the detection computer 38 is electrically connected to the light source device 320 and the image capture device 330 to control the light source device 320 and the image capture device 330 to control each of the waiting devices. The electronic component 2 and its connecting terminals P ₉ , P ₁₀ , P _{11 are} adjacent to the free end of the light source device and the captured image, and can receive the overall image from the image capturing device 330, please refer to Figure 13 As shown, and according to the following steps, perform quality control inspection on each electronic component 2 to be tested and each connection terminal P ₉ , P ₁₀ , P _{11 on it:}

(100) First, the light source device 320 can generate projection light, and the projection light can be projected to each connection terminal at a predetermined angle along the plugging and unplugging direction of _{each connection terminal P 9} , P ₁₀ , P ₁₁ P ₉ , P ₁₀ , P _{11 are} adjacent to the free end (or plug-in end);

(101) Make the image capturing device 330 capture the projection light on each of the electronic component 2 to be tested and each of the connecting terminals P ₉ , P ₁₀ , and P ₁₁ adjacent to the free end (or plug-in end). Produce an overall image;

(102) Read the overall image from the image capture device 330;

(103) Perform color filtering on the overall image to filter out and construct the electronic components 2 under test and the connection terminals P ₉ , P ₁₀ , and P ₁₁ adjacent to each other in the overall image. Light and shadow irrelevant to the two-dimensional manufacturing specifications at the end (or plug-in end);

(104) Rebuild the two-dimensional manufacturing specifications of each electronic component 2 under test and the connecting terminals P ₉ , P ₁₀ , and P ₁₁ adjacent to the free end (or plug-in end); wherein, the overall image is recognized When each of the manufacturing specifications (such as: _{the pin position, spacing and configuration of each of the connecting terminals P 9} , P ₁₀ , P ₁₁ ) is corresponding to the top side of the detection platform 30 or each At least one specific reference position on the electronic component 2 to be tested is used as a reference point for calculation comparison;

(105) According to each reference point, calculate the free end (or plug-in end) position and spacing (ie, pin position) of each _{connecting terminal P 9} , P ₁₀ , P _{11 and each connecting terminal P 9} , P _10, P ₁₁ adjacent the free ends (or end plug) or offset portion of the arc (i.e., configuration);

(106) once calculated for each of the connection terminals P _9, P _10, the free ends (or end plug) of the position P _11, and each pitch of the connection _9, P _10, P ₁₁ adjacent the free end of the terminal P (or plug the rear end) portion of the curvature, or offset, ... other manufacturing specifications, i.e., each of the connecting terminals P _9, P _10, P ₁₁ of the pin, thickness, number, spacing and configuration of the original design and that it can simulate the computer. .. Wait for the ideal specifications and compare them one by one to determine whether the two are consistent? If yes, go to step (107); otherwise, go to step (108);

(107) The test computer 38 displays ``The multiple connection terminals on the electronic component to be tested conform to Ideal design specifications, through quality control testing! "And end the processing flow.

(108) The test computer 38 displays "The multiple connecting terminals on the electronic component under test do not meet the ideal design specifications and cannot pass the quality control inspection!" and the quality control inspectors are required to investigate the defect status and investigate the cause And seek a solution, and annotate it as a reference for improving the manufacturing process and adjusting the machine error in the future, in order to greatly improve the _{manufacturing accuracy and yield of the connecting terminals P 9} , P ₁₀ , P ₁₁ , so as to make each The electronic component 2 can not only accurately transmit high-frequency serial data, but also ensure the integrity of data signals in the transmission of high-frequency serial data.

According to, the above is only one of the best specific embodiments of the present invention, but the structural features of the present invention are not limited to this. Anyone familiar with the art in the field of the present invention can easily think of changes or modifications , Can be covered in the following patent scope of this case.

1‧‧‧Quality Control Testing Device

2‧‧‧Electronic components

30‧‧‧Testing platform

300‧‧‧Parts positioning slot

31‧‧‧Horizontal displacement mechanism

320‧‧‧Light source device

330‧‧‧Image capture device

34‧‧‧Vertical displacement mechanism

38‧‧‧Testing computer

380‧‧‧Two-dimensional image recognition and detection program

Claims (5)

A quality control inspection device that uses two-dimensional image recognition technology to perform quality control inspections on the connecting terminals of electronic components to be tested, at least comprising: a testing platform, the top side of which can position at least one electronic component to be tested, and each of the electronic components to be tested can be positioned The part of the connecting terminal on the electronic component to be tested near the free end faces the upper side of the testing platform, so that the quality control testing device can perform quality control testing on each electronic component to be tested and the connecting terminals on it; a light source device, It is installed above the top side of the detection platform, and the projected light generated by it can be projected to the part adjacent to the free end of each connection terminal at a predetermined angle along the plugging and unplugging direction of each connection terminal, so that each test The electronic components and the parts on the connecting terminals adjacent to the free ends can produce an overall light and shadow; an image capture device is also installed on the top side of the inspection platform, and can accurately capture each of the to-be-tested The overall image of the electronic components and the adjacent free ends of each of the connecting terminals; and a detection computer which is electrically connected to the light source device and the image capture device to control the light source device and the image capture device , Projecting light and capturing images on each of the electronic components to be tested and the adjacent free ends of each of the connecting terminals, and after receiving the overall image from the image capturing device, the overall image Filtering process to filter out the light and shadow in the overall image that has nothing to do with the construction of the two-dimensional manufacturing specifications of the electronic component to be tested, and to construct the two-dimensional manufacturing specifications of each electronic component to be tested based on the original computer simulation Design the ideal specifications of the pin position, thickness, quantity, spacing and configuration of each electronic component to be tested and each of the connecting terminals on it. Quality control comparison and analysis are carried out one by one, in order to greatly improve the accuracy of connecting terminal manufacturing. Therefore, the electronic components can not only accurately transmit high-frequency serial data, but also ensure the integrity of the data signal in the transmission of high-frequency serial data. The quality control inspection device according to claim 1, further comprising a horizontal displacement mechanism and a vertical displacement mechanism; wherein, the horizontal displacement mechanism and the vertical displacement mechanism are respectively electrically connected to the inspection computer, and are respectively used for Carry the light source device and the image capture device to receive the control of the detection computer, and perform horizontal and/or vertical displacement of the light source device and the image capture device, so that the light source device and the image capture device The device can project light on each of the electronic components and the parts adjacent to the free ends of each connecting terminal one by one, and enable the testing computer to read the electronic components and their upper parts captured by the image capturing device. The overall image of each connecting terminal adjacent to the free end. The quality control inspection device described in claim 2 further includes a two-dimensional image recognition and inspection program. The two-dimensional image recognition and inspection program is built in the inspection computer to accurately perform the two-dimensional image on the overall image. Image reconstruction to quickly and accurately obtain the manufacturing specifications of each electronic component and each connection terminal on it, so as to accurately analyze, judge and detect each electronic component and each connection terminal on it. The precision of manufacturing can effectively improve the quality and efficiency of the quality control of each electronic component and each connection terminal on it. A method for performing quality control inspection on the connection terminals of electronic components under test by using two-dimensional image recognition technology. The method is applied to a quality control inspection device. The quality control inspection device includes at least one inspection platform, a light source device, and an image capture device. A fetching device and a testing computer, wherein at least one electronic component to be tested can be positioned on the top side of the testing platform, and the portion of each electronic component to be tested adjacent to the free end of the connecting terminal faces the upper side of the testing platform, The detection device can perform quality control inspection on the connection terminals of the electronic components to be tested; the light source device is installed above the top side of the detection platform, and the projected light generated by it can follow the connection terminals The plugging direction is projected at a predetermined angle to the part of each connecting terminal adjacent to the free end, so that the part of each connecting terminal adjacent to the free end can respectively generate a corresponding light and shadow; the image capturing device is also installed on the detection platform Above the top side, and can accurately capture each of the The overall image of the electronic component to be tested and its connecting terminal adjacent to the free end; the testing computer is electrically connected with the light source device and the image capture device to control the pair of the light source device and the image capture device respectively Each of the electronic components under test and their connecting terminals are adjacent to the free end of the light source device and the captured image, and after receiving the overall image from the image capture device, follow the steps below to perform the following steps on each of the electronic components to be tested The components and their connecting terminals perform quality control inspection: first, the light source device can generate projection light, and the projection light can be projected to each connection terminal at a predetermined angle along the plugging and unplugging direction of each connection terminal The position adjacent to the free end; the image capturing device is made to capture an overall image generated by the projected light on each of the electronic components to be tested and the connecting terminals adjacent to the free end; reading the image capturing device The incoming overall image; filtering the overall image to filter out the light and shadow in the overall image that has nothing to do with the construction of the two-dimensional manufacturing specifications of the electronic component to be tested; reconstruct the two-dimensional of the electronic component to be tested Manufacturing specifications; wherein, when identifying the manufacturing specifications in the overall image, at least one specific reference position corresponding to the top side of the inspection platform or the electronic component to be tested is used as a reference point for the calculation and comparison; According to each reference point, calculate the free end position of each connecting terminal and the arc or offset of each connecting terminal adjacent to the free end; then calculate the free end position of each connecting terminal and the adjacent free end of each connecting terminal After the offset of the end part or the manufacturing specifications of the offset, it can be compared with the ideal specifications of the original computer simulation design of the pin position, thickness, number, spacing and configuration of the connection terminal one by one to judge Whether the two are consistent, if it is judged that the two are consistent, it will display "The multiple connection terminals on the electronic component under test meet the ideal design specifications and pass the quality control inspection!"; otherwise, if it is judged If the two are inconsistent, it means "The multiple connecting terminals on the electronic component under test do not meet the ideal design specifications and cannot pass the quality control inspection!", and the quality control inspectors are required to investigate the cause of this defect and seek a solution It is also noted that it will be used as a reference for improving the manufacturing process and adjusting the machine error in the future, in order to greatly improve the accuracy and yield of the connection terminal manufacturing, so that each electronic component can not only accurately transmit high frequency Serial data can still ensure the integrity of the data signal in the transmission of high-frequency serial data. The quality control inspection method according to claim 4, wherein the quality control inspection device further includes a horizontal displacement mechanism and a vertical displacement mechanism, and the horizontal displacement mechanism and the vertical displacement mechanism are electrically connected to the inspection computer, respectively, And it is used to carry the light source device and the image capture device respectively, and can be controlled by the detection computer to perform horizontal and/or vertical displacement of the light source device and the image capture device, so as to make the light source The projection light generated by the device can be projected at a predetermined angle along the plugging and unplugging direction of each connecting terminal on each electronic component to be tested to the position of each connecting terminal adjacent to the free end, so that each electronic component to be tested The components and the parts on the connecting terminals adjacent to the free ends can generate the overall light and shadow, and the image capturing device can capture the whole of the electronic components and each connecting terminal adjacent to the free ends one by one Image, so that the inspection computer can accurately perform the reconstruction and quality control inspection of the manufacturing specifications of the electronic components to be tested and the adjacent free ends of the connecting terminals.

Images