TWM589280U - Quality control and inspection device using two-dimensional image recognition technology to perform quality control and inspection of connection terminals of electronic components to be tested - Google Patents

Abstract

This creation is a quality control device that uses two-dimensional image recognition technology to perform quality control on the connection terminals of the electronic components to be tested. The quality control device includes a detection platform, a light source device, an image capture device and one An inspection computer, in which the inspection platform enables the connection terminal of an electronic component to be tested to face upwards near the free end, and the light source device can project light onto the connection terminal to generate corresponding light and shadow, and the image capture device can Capture the overall image of the connection terminal near the free end, and then the inspection computer will filter the overall image to filter out irrelevant light and shadow, and construct the two-dimensional manufacturing specifications of the electronic components to be tested, so as to match the original The ideal specifications of the connection terminals designed by computer simulation are compared and analyzed one by one, with a view to greatly improving the accuracy and yield of connection terminal manufacturing.

Description

Quality control device for performing quality control on connection terminals of electronic components to be tested using two-dimensional image recognition technology

This creation is about the quality inspection device of electronic components, especially a kind of electronic components (including: microprocessors, electronic modules, electromechanical modules, connector plugs and connector sockets) using two-dimensional image recognition technology. . Etc.) The connection terminals on the implementation of the ideal specifications of the inspection method, with the hope that the quality control inspection device created can not only greatly improve the manufacturing accuracy and yield of the connection terminal, but also enable each electronic component to accurately transmit high Frequency serial data, and can ensure the integrity of the data signal in the transmission of high frequency serial data.

According to press, printed circuit board assembly industry used to be the star industry of Taiwan in the twentieth century. Especially in the era of booming development of the electronics industry, the more or more electronic components on the printed circuit board, the larger the volume. The volume and weight of the product will also increase significantly, so that each electronic product must eventually face the problem of excessive volume or weight. However, with the rapid innovation and advancement of technology in different places, the passive component design is integrated into the active component and product. Body circuit, and based on which various surface mount devices (SMD) are made, it seems that it has become a common technical method in the industry at present, with the hope that all surface mount devices can be installed one by one through surface mount technology The printed circuit board (Printed Circuit Board, hereinafter referred to as PCB), has created a new era for the thin and short Taiwanese printed circuit board industry.

In this new era, all kinds of high-tech process technology are constantly being innovated And developed, various passive components, active components and integrated circuits can also be made into smaller and lighter surface adhesive components, so that various electronic products can smoothly get rid of the design limitations of the previous oversize , So that all kinds of electronic products can easily meet the market trend of "light, thin, short, small". In view of this irreversible market trend, more and more consortia have invested huge amounts of money and excellent talents to this high-end circuit In the field of development and production of boards and electronic components, although the manufacturing and assembly processes of each of the high-end circuit boards and electronic components have been fully automated, once the assembly of the high-end circuit boards and electronic components is completed, There are still many inspection tasks that need to be carried out by the inspection personnel, through the visual inspection method, with the free testimony of each inspection personnel, to perform the various inspections required on the various connection terminals installed on them one by one. This inspection method not only wastes time, And often due to the difference of subjective testimony of each tester or errors caused by visual fatigue, the test results are very different and very inconsistent, so that accurate and consistent quality control cannot be achieved. Accordingly, many companies have invested huge amounts of money and manpower to conduct research and development on the various detections of the high-end circuit boards and electronic components, so as to accurately and consistently detect the high-end circuit boards and electronic components. The production quality of the various connection terminals on the above, so that each of the high-end circuit boards and electronic components can always meet the requirements of the industry, providing the expected function, function and service life.

Check, although the various conventional inspection jigs currently developed and used in the industry can indeed effectively improve the above-mentioned quality control problems, because each inspection jig is based on the probes provided on it, through For each of the corresponding connection terminals (ie, input terminal and output terminal) on the high-level circuit board and electronic components, for each connection terminal and the electrical characteristics between them, the test items such as short circuit, open circuit and zero reset are executed one by one. In addition, based on the absolute necessity of each test item, it also prompted the industry to adopt each test fixture to replace the visual inspection of the test personnel, and therefore Greatly improved the inspection quality, production quantity and rich economic benefits derived from the high-end circuit boards and electronic components. However, when such a conventional inspection jig performs the foregoing inspection items on each of the high-level circuit boards and electronic components, the probes provided thereon are used to abut and press the high-level circuit boards and electronic components. The two corresponding connection terminals on the component, therefore, the probes often cannot be accurately controlled due to the force applied when they abut and touch, resulting in the corresponding connection terminals being too large for the probes to abut and touch the pressure In addition to the slide-out detection jig, it is difficult for these probes to accurately complete the aforementioned detection items. This is also an important issue that manufacturers are currently facing and are eager to solve.

In addition, in order for each of the high-end circuit boards and electronic components to meet the "Press-fit technology" required by the industry, there is still a lot to be solved in the design, manufacturing and testing of the related electronic products. bottleneck. Press, the so-called "Press-fit technology" is expected to be able to press-assemble the connection terminals on the surface-adhered components or electronic components into the corresponding terminal holes H on a PCB using the principle of press-fit. According to the structure of the press-fit pins (ie, connection terminals) used on the surface-mounted components or electronic components, it can be roughly divided into two different types of press-assembly; among them, please refer to Figure 1 One type is a solid press-fit pin P ₁ , which has a strong press-in area P ₁₁ ; see FIG. 2, the second type is a flexible press-fit pin P ₂ , which has an elastic press-in area P ₂₁ . In the Press-fit technical white paper, only the flexible press-fit pin P ₂ having the elastic press-in area P ₂₁ is described, and it is collectively referred to as the press-fit pin.

In addition, TE Connectivity (TE)'s press-fit technology was first introduced into the telecommunications industry in the 1970s; later, in 1988, TE Connectivity's first press-fit pin was introduced into the vehicle industry; today, TE Connectivity has Two unique press-fit solutions are provided for vehicle applications; one is shown in Figure 3, which is called the ACTION PIN connection terminal P ₃ (or independent pin, press-fit pin); As shown in Figure 4, the system is called Multispring connection terminal P ₄ (or independent pin, press-fit pin); generally speaking, the press-fit technology can be applied to multiple series; among them, please refer to the figure 3 , The most basic method of using the independent pin P ₃ series of press-fit technology. This method is usually to insert each independent pin P ₃ into the corresponding terminal hole on the PCB at a high frequency and individually through automatic equipment; P ₃ has the pin shoulder geometry P _30, which was independent of each pin P ₃ is press-fitted to the PCB to provide the necessary support; independently respect to the adjacent pin P ₃ P Room independent pin spacing of 5mm _3, Using TE Connectivity's P350 insertion machine can reach a rate of inserting up to 5 individual pins P ₃ per second, and the insertion process can be controlled by measuring the indentation force and/or depth to obtain the best connection quality control. Complex See Figure 4, another series is the most common system used with a press-fit pin P the pin head ₄₀ of P _4, P of the pin head ₄₀ of the press-fit pin Nailing P ₄ is firmly positioned to have a Insulated plastic plug (or socket) assembly between the housing C and the PCB; usually, these press-fit pins P ₄ are kept parallel to the PCB (0°), at a certain predetermined angle or perpendicular (90°), and according to the needs The number of press-fit pins P ₄ is such that the press-fit pins P ₄ can be processed by manual, semi-automatic or fully automatic connection terminal manufacturing machines; then, by pressing the pin head P _{40 of} each press-fit pin P ₄ , That is, each press-fit pin P ₄ can be press-fitted to the corresponding terminal hole H on the PCB. Of course, there are some applications that can complete the installation process on the PCB by directly pressing the insulating plastic plug (or socket) housing C.

Generally speaking, TE Connectivity's press-fit solutions are actually implemented with compatible and flexible press-fit pins P ₃ and P ₄ (or connecting terminals). Therefore, each of the press-fit pins P ₃ and P ₄ is Although it may be deformed during insertion into the corresponding terminal holes H on the PCB, it is obviously more effective in reducing the stress on the corresponding terminal holes H on the PCB than the solid press-fit pins, and it is also effective Maintain the normal force during permanent contact insertion (Normal force), so that it can provide an effective and reliable electrical and mechanical connection during the entire service life. In addition, after the press-fit pins P ₃ and P ₄ are inserted into the corresponding terminal holes H on the PCB, the positive force between the press-fit pins P ₃ and P ₄ and the corresponding terminal holes H Cold solder interconnections will be automatically generated; in particular, if tin plating is used for at least one of the two contacts (eg, terminal holes), the cold soldering process will result in direct metal connection between the contacts, As a result, only extremely low contact resistance values (usually less than 0.1mOhm/submilliohm range) will be generated between them. According to this, not only can it increase the stability of the mechanical contact, but also obviously increase its electrical stability. Check, the press-fit technology of TE Connectivity has been widely used in many applications in the field of vehicles, not only for vehicle manufacturers to provide many functions with convenience, auxiliary and safety in the design, manufacture and use of vehicles, It still proves that the vehicle industry highly recognizes and trusts the TE Connectivity press-fit technology itself. In addition, as more electronic devices are continuously developed and increasingly popularized, the number of electrical connections in vehicles is also increasing. However, in order to meet the market trend of making vehicles smaller, safer, cheaper, and easier to handle, many innovative designs and applications of vehicles mainly focus on electrical control units (hereinafter referred to as ECUs) ) Perform related control, and each ECU also needs to be as compact as possible. According to this, each ECU is independently equipped with a PCB, and electrical components with the same trend of miniaturization are carried on it. Based on the aforementioned market trends of electronicization and miniaturization, many electronic or electrical components must have more electrical interconnection capabilities in the same or even smaller packaging space. This demand has also prompted relevant companies to devote themselves to the camp Develop miniaturized interconnect components (or connectors). In order to cater to this market trend, some related companies have used TE Connectivity press-fit technology to launch a miniature connector C ₁ (miniaturized connector) called NanoMQS series for 0.4x0.5mm connection terminals. Please refer to Figure 5. As shown. In order to reduce the space occupied by the NanoMQS series miniature connector C ₁ on the PCB, please refer to Figure 6, the distance between the two adjacent connection terminals has been greatly reduced from the traditional connector C ₀ 2.54mm to 1.8 in one fell swoop At the same time, the size of the terminal hole on the PCB has also been greatly reduced from the traditional 1.0mm to 0.6mm. Therefore, according to its configuration and specifications, it should be easy to see that compared with the traditional connector C ₀ using 0.63x0.63mm connection terminals, the NanoMQS series miniature connector C ₁ can obviously save up to 60% of the occupation on the PCB space.

In addition, another trend in the market is to use the connection terminals of NanoMQS in combination with the press-fit technology. Some related companies have developed a brand-new press-fit pin called NanoMultispring, and promoted the inclusion of press-fit The electrical interconnection characteristics including contacts meet more and more reliable product standards, which can be applied to more stringent environmental conditions and meet more and higher functional characteristics. In addition, as each electronic device is equipped with more electronic components, naturally more electrical interconnections are formed between the electronic components, so that the requirements of the industry for each electronic component are gradually increasing, In this way, it can effectively ensure that each electronic component can always provide high-quality and reliable performance during its service life. Although, in today's vehicle applications, the most common PCB thickness is still 1.6mm, but with the evolution of the aforementioned market trends, in future applications, we are likely to see thinner PCB (such as: thickness (1.2mm, 1.0mm or 0.8mm PCB). According to this, in order to meet the aforementioned market trends, the press-fit technology solutions must naturally face more and more stringent requirements in their design, manufacturing and testing, so that they can be applied to various PCB interconnection systems and can Provide each of the interconnected systems with many advantages in line with market trends.

In addition to the aforementioned press-fit pins P ₃ and P ₄ (or the connecting terminals P ₃ and P ₄ ) used in the aforementioned press-fit technology solution, generally speaking, the press-fit pin P ₅ most commonly used in the vehicle industry, Please refer to FIG. 7, the structure is formed by forming two electroplating layers on a base material P ₅₀ (base material) (ie, bottom plating P ₅₁ and top plating P ₅₂ ) With the introduction of lead free soldering technology in the industry, the average soldering temperature needs to be much higher than in the past. In order to adapt to this higher operating temperature, it is necessary to use special and expensive electronic components High temperature resistant plastics (such as: LCP, PPS, PPA and PCT...), as the insulating material on it, however, by using the press-fit technology and abandoning the welding process, not only can this shortcoming be completely avoided, but also lead-free The application does not need to use expensive high temperature resistant plastics. In addition, the effective use of space has always been an important consideration in vehicle design, and the application of press-fit technology has just provided an excellent solution for it, although this solution is difficult to achieve through traditional welding processes. Miniaturized solution. However, it provides an advantageous solution for large connectors and reflow soldering processes, enabling the industry to use surface mount technology (SMT) to apply many electronic components to the soldering process steps of existing PCBs during the manufacture of various electronic components In order to effectively avoid the problem that large solder joints often interfere with the SMT reflow soldering process. As for the temperature of the plug and the terminals of adjacent parts that are too low, resulting in defects in the welding process, it can also be solved by adding a head through the press-fit technology after the welding process; In addition, in the application of the aforementioned press-fit technology, There is also a very common application of integrated housing (module) or module (module). Please refer to Figure 8. This application uses coils, capacitors, and actuators. ) And sensors (sensors)... and other electronic components or motor components (not shown in the figure) are integrated in the same housing or module M, so that they can be press-fit mounted on the same PCB, so that These electronic components or motor components can share the functions and functions provided by the same PCB; where each integrated housing or module M is generally made of ABS/ESC materials, in order to make the assembly process of the press-fit technology more It is easy and reliable, and makes many applications of mechatronics a fact that can be realized rather than out of reach.

In recent years, with the increasing progress and complexity of the motor and electronics industries, the high-speed transmission of big data seems to have become an irreversible inevitable trend in the future electronics industry. The backplane technology is used as an example. Basically, the development of the backplane structure has pushed the data transmission bandwidth of the telecommunication system from a transmission speed of several Mb per second to a transmission speed of several Terabits per second (ie, 10 ¹² bits=1000000000000bits=1000gigabits), however, in the pursuit of During the high-speed transmission of the ultimate data stream flow, not only the physical layer structure in the backplane is very critical, but also the density of the connection terminals, the terminal holes and the wiring direction in the connector are also the reasons for the connector designers to control the excess reactance in the entire channel Challenges that must be faced, although, through the use of advanced microvia technology and surface adhesion technology, connector and backplane designers have been able to use mature digital analog design programs to break through many obstacles in telecommunications systems and design ideals Backplanes, connectors and their corresponding electronic components; however, because current telecommunication platforms rely on high-speed serial data transmission, and connector and backplane designers also routinely limit the performance limits of telecommunication systems It is transferred to the copper used for the connection terminals in the connector. In order to break the boundaries of Terabit, in recent years, an advanced backplane technology has been adopted in network switches and routers. This advanced backplane technology has benefited from it. The complex design techniques in the physical layer components have been computerized or digitized, so that the design, modeling, simulation, measurement and verification of most of the components in the design process can be computerized. Or the digital simulation design program is completed one by one, and can make full use of both the time domain analysis capability and the frequency domain analysis capability of the analog design program, so that designers can reflect, crosstalk, impedance mismatch and loss... etc. Complex phenomena are displayed intuitively.

As mentioned above, although designers of advanced backplanes, connectors or related components have been able to use computer or digital simulation design programs to design the ideal specifications of the connection terminals on various backplanes, connectors or related components , And make each backplane, connector or related components have the expected ideal electrical characteristics, however, contrary to expectations, through advanced automatic Production technology and equipment, after manufacturing each of the advanced backplanes, connectors or related components, each of the advanced backplanes, connectors or related components is often subject to various mechanical errors or processes on the automated production equipment Deficiency causes that the manufacturing specifications of the connection terminals on each of the advanced backplanes, connectors or related components do not meet the ideal specifications of the original design, so that each of the advanced backplanes, connectors or related components cannot be transmitted at high frequencies Under the environment, give play to the ideal electrical characteristics expected by the industry. In view of this, how to accurately detect the physical structure of various connectors installed on each of the advanced backplanes, connectors or related components to ensure the pin positions of each connection terminal in each connector , Spacing and configuration... The manufacturing specifications are fully in line with the ideal specifications designed, and various electronic components can be accurately mounted on the PCB of the telecommunications equipment through the corresponding connection terminals, so that each telecommunications equipment Not only can it accurately transmit high-frequency serial data, but it can also achieve the integrity of the data signal in the transmission of high-frequency serial data, which has become an important issue that the major telecommunications equipment and component design and manufacturers urgently want to solve It is also an important subject for the creative in-depth discussion in the follow-up.

In view of this, in order to improve the conventional knowledge of many defects that occur when connecting terminals on various electronic components, the creator has finally developed and designed a kind of two-dimensional image recognition technology to be tested after long-term research and experiment A quality control device that performs quality control on the connection terminals of electronic components.

An object of this creation is to provide a quality inspection device that uses two-dimensional image recognition technology to perform quality inspection on the connection terminals of electronic components to be tested. The quality inspection device includes at least an inspection platform (or tray) and a light source Device, an image capturing device and a testing computer; wherein, the top side of the testing platform can locate at least one electronic component to be tested, and make each of the to be tested The position of the connection terminal on the electronic component adjacent to the free end (or plug-in end) faces upwards of the detection platform, so that the detection device can perform quality control inspection on the connection terminal on each electronic component to be tested; the light source device It is installed above the top side of the detection platform, and the projection light generated by it can be projected at a predetermined angle along the insertion and removal direction of the connection terminal to the position of each connection terminal near the free end, so that each of the electronic to be tested The component and each part of the connection terminal adjacent to the free end can produce a whole light and shadow; the image capture device is also installed above the top side of the detection platform, and can accurately capture each of the electronic components to be tested The overall image of the component and each of the connection terminals adjacent to the free end portion; the detection computer is electrically connected to the light source device and the image capture device respectively to control the light source device and the image capture device, respectively for each The electronic component to be tested and each of the connection terminals thereon project light and capture images near the free end, and can filter the overall image after receiving the overall image from the image capture device to filter Eliminate the light and shadow in the overall image that are irrelevant to the two-dimensional manufacturing specifications of the electronic component under test, and construct the two-dimensional manufacturing specifications of the electronic component under test according to the original computer simulation design. Test the ideal specifications of the electronic components and the connection terminals on the pins, thickness, quantity, spacing and configuration...etc., and perform quality control comparison and analysis one by one, with a view to greatly improve the accuracy and yield of connection terminal manufacturing , So that each electronic component can not only accurately transmit high-frequency serial data, but also ensure the integrity of the data signal in the transmission of high-frequency serial data.

In order for your reviewing committee to have a better understanding and understanding of the purpose, shape, features of the structure and its function of this creation, the following examples are used in conjunction with the drawings. The detailed description is as follows:

[Knowledge]

P ₁ ‧‧‧ Solid Pressed Pin

P ₁₁ ‧‧‧Sturdy press-in area

P ₂ ‧‧‧ flexible press-fit pin

P ₂₁ ‧‧‧Elastic press-in zone

P ₃ , P ₄ ‧‧‧ACTION PIN connection terminal

P ₃₀ ‧‧‧ shoulder geometry

P ₄₀ ‧‧‧ pin head

P ₅ ‧‧‧ Press-fit pin

P ₅₀ ‧‧‧Basic materials

P ₅₁ ‧‧‧Bottom plating

P ₅₂ ‧‧‧Top plating layer

C ₁ ‧‧‧mini connector

C ₀ ‧‧‧traditional connector

H‧‧‧terminal hole

C‧‧‧insulated plastic plug (or socket) shell

M‧‧‧Housing or module

PCB‧‧‧Printed circuit board

[This creation]

1‧‧‧ Quality control testing device

2‧‧‧Electronic components

30‧‧‧ Testing platform

300‧‧‧Part positioning slot

31‧‧‧Horizontal displacement mechanism

320‧‧‧Light source device

330‧‧‧Image capture device

34‧‧‧Vertical displacement mechanism

38‧‧‧ Testing computer

380‧‧‧Two-dimensional image recognition and detection program

C ₉ ‧‧‧ connector

M ₁₀ ‧‧‧Integrated housing or module

P ₉ , P ₁₀ , P ₁₁ ‧‧‧ connection terminal

CPU‧‧‧Electronic components

100~107‧‧‧step

Figure 1 is a schematic diagram of the structure of a solid press-fit pin used in conventional press-fit technology; Figure 2 is a schematic diagram of the structure of a flexible press-fit pin used in conventional press-fit technology; Figure 3 is TE Connectivity The schematic diagram of the structure of the independent pin P ₃ series provided for vehicle applications; Figure ₄ is the schematic diagram of the structure of the Multispring pin P ₄ series provided by TE Connectivity for vehicle applications; Figure 5 is one of the models launched using the TE Connectivity press-fit technology and a connection terminal 0.4x0.5mm NanoMQS called mini _{series. 1} and its corresponding connector C of the conventional connector C appearance ₀ schematic; Fig. 6 based NanoMQS series _{micro. 1} and its corresponding connector C of the conventional connector C ₀ top-side structure diagram; Figure 7 is a schematic diagram of the appearance of the most commonly used press-fit pin P ₅ in the vehicle industry; Figure 8 is a schematic diagram of the appearance of integrated housing or module applications common in the application of press-fit technology; Figure 9 is a schematic diagram of the appearance of the Dimm socket; Figure 10 is a schematic diagram of the bottom structure of the socket used by the press-fit technology; Figure 11 is another socket used by the press-fit technology Figure 12 is a schematic diagram of the top structure; Figure 12 is a schematic diagram of the hardware architecture of the detection device of the present creation; and Figure 13 is a schematic flowchart of the detection method of the creation.

As mentioned above, based on the current high-speed serial data transmission of telecommunication platforms, in order to break the boundaries of Terabit, although designers of various connectors, backplanes, integrated housings or modules and their related electronic components suffer from Thanks to the computerization or digitalization of the complex design technology in the physical layer components, the design, modeling, simulation, measurement and verification of most components in the design process can be computerized or The digital simulation design program is completed one by one, and can fully utilize the simulation design program with both time domain analysis and frequency domain analysis capabilities, allowing designers to combine reflection, crosstalk, impedance mismatch and loss... The phenomenon is visually displayed, and the desired specifications of the connection terminals on the various types of connectors, backplanes, integrated housings or modules and their related components are designed after modification and adjustment, and each connector , Backplane, integrated housing or module and their related components therefore have the expected ideal electrical characteristics, but often contrary to expectations, the industry through advanced automated production technology and equipment to manufacture each connector, backplane After the integrated housing or module and its related components, each connector, backplane, integrated housing or module and its related components are often caused by various mechanical errors or missing manufacturing processes on the automated production equipment The manufacturing specifications of the connection terminals on each connector, backplane, integrated housing or module and their related components do not meet the ideal specifications of the original design, so that each connector, backplane, integrated housing or module and The related components cannot perform the ideal electrical characteristics expected by the industry in the high-frequency transmission environment. In view of this, the creators have personally participated in various connectors, backplanes, integrated housings or modules and their Practical experience in the development, design, manufacture and promotion of related components, deeply experience the type of connector C ₉ (see Figure 9), integrated housing or module M ₁₀ (see page Figure 10) and its related electronic components CPU (please refer to Figure 11 below, hereinafter referred to as "electronic components"), the quality of the signal transmission quality depends on the connection terminals used to transmit signals P ₉ , P ₁₀ , and P _{11 are of} good quality. If the manufacturing specifications of each of the electronic components C ₉ , M ₁₀ , and the connection terminals P ₉ , P ₁₀ , and P ₁₁ on the CPU meet the ideal specifications of the original design, each should Electronic components C ₉ , M ₁₀ , and CPU can easily play the ideal electrical characteristics expected by the industry in a high-frequency transmission environment, thereby ensuring that each electronic component C ₉ , M ₁₀ , and CPU always have excellent high-frequency data Transmission quality; accordingly, the creator is thinking about how to accurately determine the physical structure of each connection terminal P ₉ , P ₁₀ , P ₁₁ installed on each of the electronic components C ₉ , M ₁₀ , and CPU Test to ensure the pin position, spacing and structure of each connection terminal P ₉ , P ₁₀ and P ₁₁ on each of the electronic components C ₉ , M ₁₀ and CPU The manufacturing specifications such as shape... are fully in line with the ideal specifications of the original design, so that the electronic components C ₉ , M ₁₀ and CPU can be accurately installed through the corresponding connection terminals P ₉ , P ₁₀ and P ₁₁ On the PCB of various electronic and telecommunication equipment, and not only can the electronic and telecommunication equipment accurately transmit high-frequency serial data, but also can realize the integrity of the data signal in the transmission of high-frequency serial data.

In view of the fact that the ideal specifications of each connection terminal P ₉ , P ₁₀ , and P ₁₁ on the electronic component C ₉ , M ₁₀ , and CPU are determined when the design is completed, and each electronic component C ₉ , M ₁₀ , CPU is through each of the connection terminals P ₉ , P ₁₀ , P ₁₁ along the direction of insertion and removal and the corresponding connection terminals are in conflict with each other to form an electrical connection, and according to the precise transmission of high-frequency serial data, generally In other words, the positions where the corresponding connection terminals conflict with each other are located at the position of each of the connection terminals P ₉ , P ₁₀ , and P ₁₁ adjacent to the free end (or plug-in end), and in order to effectively improve the conductivity between the corresponding connection terminals For the performance and signal transmission quality, the industry will plate a layer of gold or silver on each part of the connection terminals P ₉ , P ₁₀ and P ₁₁ adjacent to the free end (or plug end)... Each part of the connection terminals P ₉ , P ₁₀ and P ₁₁ adjacent to the free end (or plug-in end) has better reflective and conductive characteristics.

Based on the foregoing characteristics of each of the electronic components C ₉ , M ₁₀ , and each connection terminal P ₉ , P ₁₀ , and P _{11 on} the CPU, the creator thinks that if the electronic component to be tested C ₉ , M ₁₀ , each part of the connection terminal P ₉ , P ₁₀ and P ₁₁ on the CPU adjacent to the free end (or plug-in end), first capture its two-dimensional image along its insertion and removal direction; then, use the two-dimensional image Identification technology to accurately outline the two-dimensional image of the adjacent free ends (or plug-in ends) of each of the connection terminals P ₉ , P ₁₀ and P ₁₁ on the electronic components C ₉ , M ₁₀ and CPU under test Identification, that is, it can be manufactured by confirming the pin position, spacing and plug-in configuration of each connection terminal P ₉ , P ₁₀ and P ₁₁ on the electronic component C ₉ , M ₁₀ and CPU under test. After the specification, according to the comparison with the ideal specification of the original design, if it is judged that the manufacturing specifications fully meet the ideal specifications of the original design, it means that each of the electronic components to be tested C ₉ , M ₁₀ , CPU is A good product that passed the quality control test; otherwise, it means that each of the electronic components to be tested C ₉ , M ₁₀ , and CPU is a defective product that cannot pass the quality control test. In this way, it can not only enable the industry to complete the detection and judgment of the ideal specifications of the electronic components C ₉ , M ₁₀ , and CPU in batches in the fastest and accurate inspection process, so as to ensure that each electronic component C ₉ , M ₁₀ , the pin position, spacing and configuration of each connection terminal P ₉ , P ₁₀ , P ₁₁ on the CPU are completely in line with the ideal specifications of the original design, so that each electronic component C _9. M ₁₀ and CPU can be accurately mounted on the PCB of various electronic and telecommunication equipment through the corresponding connection terminals P ₉ , P ₁₀ and P ₁₁ , and the electronic and telecommunication equipment can not only be accurately transmitted High-frequency serial data can still realize the integrity of data signals in the transmission of high-frequency serial data; not only that, the industry can still accurately detect each of the electronic components C ₉ , M ₁₀ , and CPU After the specific defects in the manufacturing specifications such as the foot position, spacing and plug-in terminal configuration of the support terminals P ₉ , P ₁₀ , P ₁₁ , etc., we can quickly investigate and find the corresponding mechanical errors on their automated production equipment Or the manufacturing process is missing, so that after obtaining the solutions of the defects, the product quality and production yield of the electronic components C ₉ , M ₁₀ , and CPU can be greatly improved.

Based on the aforementioned creative concept, the creators, with many years of practical experience in the design and manufacture of automated testing equipment, after long-term hard observation and research, found that only need to use two-dimensional image recognition technology, which can be batch targeted The physical structure and location of ten or hundreds of electronic components C ₉ , M ₁₀ , and the connection terminals P ₉ , P ₁₀ , and P _{11 on} the CPU, while performing two-dimensional image capture and identification, which can be mass and precise Complete the relevant inspection work on the ideal specifications of each connection terminal P ₉ , P ₁₀ , and P ₁₁ on each electronic component C ₉ , M ₁₀ , and CPU. The first problem that must be solved is to check the electronic component. Each of the connection terminals P ₉ , P ₁₀ , and P ₁₁ on the components C ₉ , M ₁₀ , and CPU is adjacent to the free end (or plug-in end). Before performing the relevant inspection work, you must make each electronic component C ₉ , M ₁₀ , the part of each connection terminal P ₉ , P ₁₀ , P ₁₁ on the CPU adjacent to the free end (or plug-in end) can be completely exposed in an open and perspective space without dead angle. In this way, when the two-dimensional image recognition technology is used to perform relevant inspection work on each of the connection terminals P ₉ , P ₁₀ , and P ₁₁ on the electronic components C ₉ , M ₁₀ , and CPU, the two-dimensional image recognition technology can be enabled. The light source used passes through the open and non-dead-view perspective space, and is projected onto each of the electronic components C ₉ , M ₁₀ , and each connection terminal P ₉ , P ₁₀ , P ₁₁ on the CPU near the free end (or plug-in At the same time, at the same time, the image sensing device used by the two-dimensional image recognition technology can smoothly pass through the open and dead-end perspective space and capture each electronic component C ₉ , M ₁₀ , and CPU A clear image of the connection terminal P ₉ , P ₁₀ , P ₁₁ near the free end (or plug-in end), so that the two-dimensional image recognition technology can use its built-in automated optical inspection technology for each Reconstruction of two-dimensional images (ie, their manufacturing specifications) of the connection terminals P ₉ , P ₁₀ , and P ₁₁ adjacent to the free end (or plug-in end) respectively, and corresponding to a perfect and flawless two-dimensional reference respectively Image (that is, the ideal specification of the original design), compare and analyze the characteristics of the specifications (such as: foot position, spacing and configuration... etc.) to quickly and accurately follow each connection terminal P ₉ , The insertion and removal directions of P ₁₀ and P _{11 are} completed for the manufacturing specifications of the electronic components C ₉ , M ₁₀ and each connection terminal P ₉ , P ₁₀ and P _{11 on} the CPU. Various tests.

Based on this design concept, please refer to the illustration in Figure 12, the creator is thinking about designing a quality inspection device 1, which uses a special structure design inspection platform 30 (as shown in Figure 12 Trays), a plurality of component positioning grooves 300 are formed concavely on the top side of the detection platform 30, and the component positioning grooves 300 are spaced apart from each other and maintain a predetermined distance from each other. The configuration, size, and depth of the positioning slot 300 match the configuration, size, and height of each electronic component 2 so that when each electronic component 2 is carried on the top side of the detection platform 30, each The electronic components 2 can be accommodated one by one into the positioning grooves 300 of each component, please refer to FIG. 12, and each connecting terminal P ₉ , P ₁₀ , P ₁₁ on each electronic component 2 is adjacent The free ends (or plug-in ends) are exposed on the top side of the detection platform 30, and face upwards from the top side of the detection platform 30. In this way, the top side of the inspection platform 30 can locate and carry a plurality of electronic components 2 in batches, and when the electronic components 2 are moved to a corresponding detection position, each of the electronic components 2 Each of the connection terminals P ₉ , P ₁₀ , and P ₁₁ adjacent to the free end (or plug-in end) faces upwards on the top side of the detection platform 30, so that the connection terminals P ₉ , P ₁₀ , and P _{11 are} adjacent The free end (or plug-in end) can correspond to an open detection space without dead angle. In this way, the present invention can use a light source device 320 and an image capturing device 330 provided above the top side of the detection platform 30, so that the light source device 320 can pass through the corresponding detection space one by one for each connection terminal P ₉ , P ₁₀ and P ₁₁ project light near the free end (or plug-in end), and the image capture device 330 can capture the connection terminals P ₉ , P ₁₀ , and P ₁₁ near the free end (or plug-in end) one by one ) After reflecting one of the two-dimensional images to be inspected, each of the two-dimensional images to be inspected is sent to an inspection computer 38. The inspection computer 38 has a two-dimensional image recognition and inspection program 380 built in Detect and identify the two-dimensional images, and reconstruct the two-dimensional images of the connection terminals P ₉ , P ₁₀ , and P ₁₁ adjacent to the free end (or plug-in end) respectively, and construct each connection terminal accordingly P ₉ , P ₁₀ and P _{11 are} adjacent to the contour points and lines of the free end (or plug-in end), so as to obtain the manufacture of the connection terminals P ₉ , P ₁₀ and P ₁₁ adjacent to the free end (or plug-in end) Specifications (such as: foot position, spacing and configuration... etc.), and according to the ideal specifications corresponding to one of the original designs, perform feature comparison and analysis to quickly and accurately determine the connection terminal P ₉ , P ₁₀ , P ₁₁ plugging and unplugging direction to complete the detection of each connection terminal P ₉ , P ₁₀ , P ₁₁ on each electronic component 2.

Please refer to FIG. 12 again. In the quality control testing device 1 of the present creation, it also includes a horizontal displacement mechanism 31 and a vertical displacement mechanism 34; wherein, the horizontal displacement mechanism 31 and the vertical displacement mechanism 34 are respectively The detection computer 38 is electrically connected, and is used to carry the light source device 320 and the image capture device 330, respectively, to receive the control of the detection computer 38, and to perform horizontal operation on the light source device 320 and the image capture device 330. And/or vertical displacement, so that the light source device 320 and the image capture device 330 can each pair of each connection terminal P ₉ , P ₁₀ , P ₁₁ on the electronic component 2 adjacent to the free end (or plug The terminal) to project light and enable the inspection computer 38 to read the electronic component 2 captured by the image capture device 330 and each of the connection terminals P ₉ , P ₁₀ , and P _{11 on it} The overall image of the free end (or plug-in end); finally, the inspection computer 38 will use its built-in two-dimensional image recognition and inspection program 380 for each electronic component 2 and each connection terminal P _9. Reconstruction of the overall image of P ₁₀ and P ₁₁ near the free end (or plug end) of the two-dimensional point and line contour (ie, manufacturing specifications), and according to the ideal specifications corresponding to one of the original designs. The comparison and analysis of specifications and features can quickly and accurately complete the electronic component 2 and each connection terminal P _{9 from the} direction of insertion and removal of each connection terminal P ₉ , P ₁₀ , and P ₁₁ . , P ₁₀ and P ₁₁ not only ensure batch testing, but also achieve the purpose of performing various tests on a large number of electronic components 2 and each connection terminal P ₉ , P ₁₀ and P ₁₁ on it, It can still ensure that the electronic components 2 that have been tested can have ideal working performance and expected service life.

According to the above, the detection computer 38 can be based on the image capturing device 330 to capture and transmit the electronic component 2 and each of its connecting terminals P ₉ , P ₁₀ , P ₁₁ near the free end (Or the plug-in end) clear overall image, using its built-in two-dimensional image recognition and detection program 380, to accurately reconstruct the two-dimensional image of the overall image to quickly and accurately obtain each electronic zero The manufacturing specifications of the component 2 and each connecting terminal P ₉ , P ₁₀ and P ₁₁ are based on accurate analysis, judgment and detection of the electronic component 2 and each connecting terminal P ₉ and P _10, P ₁₁ of the manufacturing precision in order to effectively enhance _9, P _10, P ₁₁ quality control of quality and efficiency for each of the electronic components on each of its two terminals connected to a P.

The above is only one of the preferred embodiments of this creation. However, the actual implementation of this creation is not limited to this, and any mechanism or device used on it can be treated according to actual needs. Simplify or complicate, however, no matter how modified or changed, as long as the quality inspection device 1 is assisted by the inspection platform 30, through the aforementioned component elements of this creation, using two-dimensional image recognition and comparison technology, while Performing batch image inspections on multiple electronic components C ₉ , M ₁₀ , CPU and each of the connecting terminals P ₉ , P ₁₀ , P ₁₁ along the plug-in direction is the protection of the author here. The quality control testing device 1 should be specified first.

Please refer to FIG. 12 again, this creation is a device and method for performing quality control testing of connection terminals of electronic components to be tested using two-dimensional image recognition technology. The quality control testing method is through the aforementioned quality control testing device 1 To be realized, the quality control testing device 1 includes a testing platform 30 (ie, the aforementioned tray), a light source device 320, an image capturing device 330, and a testing computer 38, wherein the top side of the testing platform 30 can be positioned At least one electronic component to be tested C ₉ , M ₁₀ , and CPU, and the portion of each electronic component to be tested 2 connected to the terminals P ₉ , P ₁₀ , and P ₁₁ adjacent to the free end (or plug-in end) faces the detection Above the platform 30, so that the quality control testing device 1 can perform quality control testing on each of the electronic components to be tested 2 and the connection terminals P ₉ , P ₁₀ , and P ₁₁ thereon; the light source device 320 is installed on the testing above the top side of the platform 30, and it produces a projection light energy _9, P _10, P ₁₁ of the plug direction form a predetermined angle to each of the projected connection terminals P _9, P ₁₀ along each of the connecting terminals P, P _{11 is} adjacent to the free end (or plug-in end), so that each of the connection terminals P ₉ , P ₁₀ , and P ₁₁ adjacent to the free end (or plug-in end) can produce a corresponding reflected light and shadow; the image The capture device 330 is also installed above the top side of the detection platform 30, so that the image capture device 330 can accurately capture each of the electronic components to be tested 2 and the connection terminals P ₉ , P ₁₀ , The overall image of P ₁₁ adjacent to the free end; the detection computer 38 is electrically connected to the light source device 320 and the image capture device 330, respectively, to control the light source device 320 and the image capture device 330 respectively The electronic component 2 and its connecting terminals P ₉ , P ₁₀ , and P _{11 are} adjacent to the free end of the light source device and capture images, and can receive the overall image from the image capture device 330, please refer to Figure 13 As shown, and in accordance with the following steps, perform quality control inspections on each of the electronic component 2 to be tested and its connecting terminals P ₉ , P ₁₀ , and P ₁₁ :

(100) First, the light source device 320 can generate projected light, and the projected light can be projected to each of the connection terminals at a predetermined angle along the insertion and removal directions of the connection terminals P ₉ , P ₁₀ , and P ₁₁ P ₉ , P ₁₀ and P _{11 are} adjacent to the free end (or plug-in end);

(101) Let the image capturing device 330 capture the projected light at the position near the free end (or plug-in end) of each of the electronic component to be tested 2 and the connecting terminals P ₉ , P ₁₀ , and P _{11 on} it Produce an overall image;

(102) Read the whole image from the image capturing device 330;

(103) Perform color filtering on the overall image to filter out the proximity of the overall image and the construction of the electronic component under test 2 and the connection terminals P ₉ , P ₁₀ , and P ₁₁ Light and shadow of the two-dimensional manufacturing specifications at the end (or plug-in end);

(104) Reconstruct the two-dimensional manufacturing specifications of each of the electronic component to be tested 2 and the connection terminals P ₉ , P ₁₀ , and P ₁₁ adjacent to the free end (or plug end); wherein, the overall image is recognized Each of the manufacturing specifications (such as the specifications, such as the pin positions, spacing, and configuration of the connection terminals P ₉ , P ₁₀ , and P _{11 on} it) corresponds to the top side of the detection platform 30 or each At least one specific reference position on the electronic component to be tested 2 is used as a reference point for operation comparison;

(105) Based on each reference point, calculate the position, pitch (i.e., pin position) of the free end (or plug end) of each of the connection terminals P ₉ , P ₁₀ , and P ₁₁ and each of the connection terminals P ₉ , P _10. The arc or offset (ie, configuration) of P ₁₁ adjacent to the free end (or plug end);

(106) Once the free ends (or plug-in ends) of each of the connection terminals P ₉ , P ₁₀ , and P _{11 are} calculated, the spacing and the connection terminals P ₉ , P ₁₀ , and P _{11 are} adjacent to the free end (or plug-in connection) After the manufacturing specifications, such as the arc or offset of the part), the pin positions, thickness, number, spacing and configuration of the connection terminals P ₉ , P ₁₀ , and P ₁₁ can be simulated with the original computer. .. wait for the ideal specifications and compare them one by one to determine whether they are consistent? If yes, go to step (107); otherwise, go to step (108);

(107) The test computer 38 displays "the plurality of connecting terminals on the electronic component to be tested meets the ideal design specifications and passes the quality control test!", and the processing flow ends.

(108) The test computer 38 displays "The plural connection terminals on the electronic component to be tested do not meet the ideal design specifications and cannot pass the quality control test!" And the quality control tester should request this defect state to investigate the cause And seek solutions, and note that as a reference basis for future improvement of the process and adjustment of machine errors, with a view to greatly improve the accuracy and yield of the manufacturing of connection terminals P ₉ , P ₁₀ , P ₁₁ , so that each The electronic component 2 can not only accurately transmit high-frequency serial data, but also ensure the integrity of data signals in the transmission of high-frequency serial data.

According to the above, it is only one of the best embodiments of this creation, but this creation The structural features are not limited to this. Anyone who is familiar with this skill can easily think of changes or modifications in this creative field, which can be covered in the patent scope of the following case.

1‧‧‧ Quality control testing device

2‧‧‧Electronic components

30‧‧‧ Testing platform

300‧‧‧Part positioning slot

31‧‧‧Horizontal displacement mechanism

320‧‧‧Light source device

330‧‧‧Image capture device

34‧‧‧Vertical displacement mechanism

38‧‧‧ Testing computer

380‧‧‧Two-dimensional image recognition and detection program

Claims (3)

A quality control testing device that uses two-dimensional image recognition technology to perform quality control on the connecting terminals of electronic components to be tested includes at least: a testing platform whose top side can position at least one electronic component to be tested The position of the connection terminal on the test electronic component adjacent to the free end is directed upward of the detection platform, so that the quality control testing device can perform quality control on each of the electronic component to be tested and the connection terminal on it; a light source device is It is installed above the top side of the detection platform, and the projection light generated by it can be projected at a predetermined angle along the insertion and removal direction of each connection terminal to the location of each connection terminal near the free end, so that each The electronic components and the parts of the connection terminals adjacent to the free end can produce a whole light and shadow; an image capture device is also installed above the top side of the detection platform, and can accurately capture each of the to-be-tested The electronic component and the overall image of each connection terminal adjacent to the free end portion thereof; and a detection computer, which are electrically connected to the light source device and the image capture device respectively to control the light source device and the image capture device , Respectively project light and capture images on each of the electronic components to be tested and each of the connection terminals adjacent to the free end, and after receiving the overall image from the image capture device, it can be performed on the overall image Filtering to filter out the light and shadow in the overall image that are not related to the two-dimensional manufacturing specifications of the electronic component under test, and accordingly construct the two-dimensional manufacturing specifications of each electronic component under test, and simulate with the original computer Designed the ideal specifications of the position, thickness, quantity, spacing and configuration of each electronic component to be tested and each of the connection terminals on it, performing quality control comparison and analysis one by one, with a view to greatly improving the accuracy of connection terminal manufacturing Degree and yield, so that each electronic component can not only accurately transmit high-frequency serial data, but also ensure the integrity of the data signal in the transmission of high-frequency serial data. The quality control testing device according to claim 1, further comprising a horizontal displacement mechanism and a vertical displacement mechanism; wherein, the horizontal displacement mechanism and the vertical displacement mechanism are respectively electrically connected to the testing computer, and are respectively used for Carrying the light source device and the image capturing device to accept the control of the detection computer, and performing horizontal and/or vertical displacements on the light source device and the image capturing device, thereby enabling the light source device and the image capturing The device can project light on each of the electronic component and each connection terminal near the free end one by one, and the detection computer can read each electronic component and its upper part captured by the image capturing device The overall image of each connection terminal adjacent to the free end. The quality control inspection device as described in claim 2 further includes a two-dimensional image recognition and inspection program, which is built in the inspection computer and can accurately carry out two-dimensional image of the whole Reconstruction of images to quickly and accurately obtain the manufacturing specifications of each electronic component and each connection terminal on it, so as to accurately analyze, judge and detect each electronic component and each connection terminal on it The manufacturing precision can effectively improve the quality and efficiency of the quality control of each electronic component and each connection terminal on it.

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