TWM589280U - Quality control and inspection device using two-dimensional image recognition technology to perform quality control and inspection of connection terminals of electronic components to be tested - Google Patents
Quality control and inspection device using two-dimensional image recognition technology to perform quality control and inspection of connection terminals of electronic components to be tested Download PDFInfo
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Abstract
本創作係一種利用二維影像辨識技術對待測電子零組件的連接端子執行品管檢測的品管檢測裝置,該品管檢測裝置包括一檢測平台、一光源裝置、一影像擷取裝置與之一一檢測電腦,其中,該檢測平台能使一待測電子零組件的連接端子鄰近自由端部分朝上,且光源裝置能投射光線至該連接端子,以產生對應光影,該影像擷取裝置則能擷取該連接端子鄰近自由端部位的整體影像,之後,該檢測電腦會對整體影像進行濾波處理,以濾除掉無關光影,並建構待測電子零組件的二維製造規格,以能與原先電腦模擬設計之連接端子的理想規格,逐一進行比對及分析,以期能大幅提高連接端子製造的精準度及良率。 This creation is a quality control device that uses two-dimensional image recognition technology to perform quality control on the connection terminals of the electronic components to be tested. The quality control device includes a detection platform, a light source device, an image capture device and one An inspection computer, in which the inspection platform enables the connection terminal of an electronic component to be tested to face upwards near the free end, and the light source device can project light onto the connection terminal to generate corresponding light and shadow, and the image capture device can Capture the overall image of the connection terminal near the free end, and then the inspection computer will filter the overall image to filter out irrelevant light and shadow, and construct the two-dimensional manufacturing specifications of the electronic components to be tested, so as to match the original The ideal specifications of the connection terminals designed by computer simulation are compared and analyzed one by one, with a view to greatly improving the accuracy and yield of connection terminal manufacturing.
Description
本創作係關於電子零組件之品管檢測裝置,尤指一種利用二維影像辨識技術對電子零組件(包括:微處理器、電子模組、機電模組、連接器插頭及連接器插座...等)上之連接端子執行理想規格的檢測方法,以期本創作之品管檢測裝置不僅能大幅提高連接端子的製造精準度及良率,更能因此而令各該電子零組件精準地傳輸高頻串列數據,且能在高頻串列數據的傳輸上確保數據訊號的完整性。 This creation is about the quality inspection device of electronic components, especially a kind of electronic components (including: microprocessors, electronic modules, electromechanical modules, connector plugs and connector sockets) using two-dimensional image recognition technology. . Etc.) The connection terminals on the implementation of the ideal specifications of the inspection method, with the hope that the quality control inspection device created can not only greatly improve the manufacturing accuracy and yield of the connection terminal, but also enable each electronic component to accurately transmit high Frequency serial data, and can ensure the integrity of the data signal in the transmission of high frequency serial data.
按,印刷電路板組裝業曾是台灣二十世紀的明星產業,特別是在電子產業蓬渤發展的年代裏,印刷電路板上電子零組件的數量愈多或體積愈大,其所形成之電子產品的體積及重量亦會隨之大幅增加,從而使得各該電子產品最終必需面對體積或重量過大的問題,然而,隨著科技日新月異地創新及進步,將被動元件設計整合至主動元件及積體電路,並據以製成各式表面黏著元件(Surface Mount Device,以下簡稱SMD),似乎已成為目前業界慣用的技術手段,以期所有表面黏著元件均能透過表面黏著技術逐一地被安裝至一印刷電路板(Printed Circuit Board,以下簡稱PCB)上,而為輕薄短小的台灣印刷電路板產業開創一全新的紀元。 According to press, printed circuit board assembly industry used to be the star industry of Taiwan in the twentieth century. Especially in the era of booming development of the electronics industry, the more or more electronic components on the printed circuit board, the larger the volume. The volume and weight of the product will also increase significantly, so that each electronic product must eventually face the problem of excessive volume or weight. However, with the rapid innovation and advancement of technology in different places, the passive component design is integrated into the active component and product. Body circuit, and based on which various surface mount devices (SMD) are made, it seems that it has become a common technical method in the industry at present, with the hope that all surface mount devices can be installed one by one through surface mount technology The printed circuit board (Printed Circuit Board, hereinafter referred to as PCB), has created a new era for the thin and short Taiwanese printed circuit board industry.
在此一全新紀元裏,有賴各式高科技工藝技術不斷地被創新 及開發出來,各式被動元件、主動元件及積體電路亦得以分別被製作成體積更小且重量更輕的各式表面黏著元件,從而令各種電子產品能一舉順利擺脫昔日體積過大的設計侷限,使得各種電子產品均能輕易符合「輕、薄、短、小」的市場趨勢,有鑑於此一不可逆轉的市場趨勢,已有愈來愈多財團紛紛投入巨額資金及優秀人才至此一高階電路板及電子零組件的開發及生產領域中,雖然各該高階電路板及電子零組件之製造及組裝過程均已十分地自動化了,但是,俟各該高階電路板及電子零組件組裝完成後,仍然有許多檢測工作需要透過檢測人員,以目測方式,搭配各該檢測人員的自由心證,對其上所安裝的各式連接端子逐一執行所需的各種檢測,這樣的檢測作法不僅浪費時間,且經常會因各該檢測人員主觀心證的不同或視覺疲勞所產生的誤差,而導致檢測結果南轅北轍、極不一致,從而無法實現精準且一致的品質控管。據此,許多業者乃投入巨資及龐大人力,針對各該高階電路板及電子零組件的各種檢測進行研究及開發,期能據以精準且一致地檢測出各該高階電路板及電子零組件上各式連接端子的生產品質,以令各該高階電路板及電子零組件始終能符合業界要求,提供預期的功能、作用及使用壽命。 In this new era, all kinds of high-tech process technology are constantly being innovated And developed, various passive components, active components and integrated circuits can also be made into smaller and lighter surface adhesive components, so that various electronic products can smoothly get rid of the design limitations of the previous oversize , So that all kinds of electronic products can easily meet the market trend of "light, thin, short, small". In view of this irreversible market trend, more and more consortia have invested huge amounts of money and excellent talents to this high-end circuit In the field of development and production of boards and electronic components, although the manufacturing and assembly processes of each of the high-end circuit boards and electronic components have been fully automated, once the assembly of the high-end circuit boards and electronic components is completed, There are still many inspection tasks that need to be carried out by the inspection personnel, through the visual inspection method, with the free testimony of each inspection personnel, to perform the various inspections required on the various connection terminals installed on them one by one. This inspection method not only wastes time, And often due to the difference of subjective testimony of each tester or errors caused by visual fatigue, the test results are very different and very inconsistent, so that accurate and consistent quality control cannot be achieved. Accordingly, many companies have invested huge amounts of money and manpower to conduct research and development on the various detections of the high-end circuit boards and electronic components, so as to accurately and consistently detect the high-end circuit boards and electronic components. The production quality of the various connection terminals on the above, so that each of the high-end circuit boards and electronic components can always meet the requirements of the industry, providing the expected function, function and service life.
查,目前業界所開發及使用的各式習知檢測治具,雖確實能有效改善前述品質控管上的問題,但是,由於各該檢測治具均係藉其上所設之探針,透過各該高階電路板及電子零組件上兩對應之連接端子(即,輸入端及輸出端),針對各該連接端子及其間之電氣特性,逐一執行短路、開路及歸零等狀態之檢測項目,另,基於各該檢測項目有其絕對的必要性,亦促使業者紛紛採用各該檢測治具來取代檢測人員之目視檢測,亦因此而 大幅地提升了各該高階電路板及電子零組件之檢測品質、生產數量及其所衍生的豐厚經濟效益。惟,當此種習知檢測治具在對各該高階電路板及電子零組件執行前述檢測項目時,由於係使用其上所設之探針抵靠及觸壓各該高階電路板及電子零組件上兩對應之連接端子,因此,該等探針常會因其抵靠及觸壓時所施加的力道無法獲得精準地控制,導致對應之連接端子受該等探針抵靠及觸壓力道過大而滑彈出檢測治具外,而使該等探針難以精準地完成前述檢測項目,此亦為各製造廠商當前經常面對且亟欲解決之一重要議題。 Check, although the various conventional inspection jigs currently developed and used in the industry can indeed effectively improve the above-mentioned quality control problems, because each inspection jig is based on the probes provided on it, through For each of the corresponding connection terminals (ie, input terminal and output terminal) on the high-level circuit board and electronic components, for each connection terminal and the electrical characteristics between them, the test items such as short circuit, open circuit and zero reset are executed one by one. In addition, based on the absolute necessity of each test item, it also prompted the industry to adopt each test fixture to replace the visual inspection of the test personnel, and therefore Greatly improved the inspection quality, production quantity and rich economic benefits derived from the high-end circuit boards and electronic components. However, when such a conventional inspection jig performs the foregoing inspection items on each of the high-level circuit boards and electronic components, the probes provided thereon are used to abut and press the high-level circuit boards and electronic components. The two corresponding connection terminals on the component, therefore, the probes often cannot be accurately controlled due to the force applied when they abut and touch, resulting in the corresponding connection terminals being too large for the probes to abut and touch the pressure In addition to the slide-out detection jig, it is difficult for these probes to accurately complete the aforementioned detection items. This is also an important issue that manufacturers are currently facing and are eager to solve.
另,為了令各該高階電路板及電子零組件能滿足業界所要求之「Press-fit技術」,在各該相關電子產品之設計、製造及檢測上,尚必需面對有待一一解決的諸多瓶頸。按,所謂「Press-fit技術」係期望能以按壓-配接的原理,將各該表面黏著元件或電子零組件上的連接端子按壓-組裝至一PCB上對應的端子孔H中,其作法依各該表面黏著元件或電子零組件上所使用之壓配銷(即,連接端子)結構的不同可概分成兩種不同的按壓-組裝類型;其中,請參閱第1圖所示,第一種類型係實心壓配銷P1,其具有一堅固的壓入區P11;請參閱第2圖所示,第二種類型係柔性壓配銷P2,其具有一彈性壓入區P21。在Press-fit技術白皮書中僅描述了具有彈性壓入區P21的柔性壓配銷P2,且將其統稱為壓配銷。 In addition, in order for each of the high-end circuit boards and electronic components to meet the "Press-fit technology" required by the industry, there is still a lot to be solved in the design, manufacturing and testing of the related electronic products. bottleneck. Press, the so-called "Press-fit technology" is expected to be able to press-assemble the connection terminals on the surface-adhered components or electronic components into the corresponding terminal holes H on a PCB using the principle of press-fit. According to the structure of the press-fit pins (ie, connection terminals) used on the surface-mounted components or electronic components, it can be roughly divided into two different types of press-assembly; among them, please refer to Figure 1 One type is a solid press-fit pin P 1 , which has a strong press-in area P 11 ; see FIG. 2, the second type is a flexible press-fit pin P 2 , which has an elastic press-in area P 21 . In the Press-fit technical white paper, only the flexible press-fit pin P 2 having the elastic press-in area P 21 is described, and it is collectively referred to as the press-fit pin.
此外,TE Connectivity(TE)的壓合技術在20世紀的70年代首次被引入電信行業;後來,在1988年,TE Connectivity的第一個壓配銷被引入至車輛行業;今天,TE Connectivity已為車輛應用提供了兩種獨特之壓配解決方案;其一請參閱第3圖所示,係被稱之為ACTION PIN連接端子P3(或 稱獨立銷、壓配銷);其二請參閱第4圖所示,係被稱之為Multispring連接端子P4(或稱獨立銷、壓配銷);一般言,壓配技術係可被應用至多個系列;其中,復請參閱第3圖所示,使用獨立銷P3的系列係壓配技術的最基本工法,該工法通常係通過自動設備將各獨立銷P3分別以高頻率且單獨地插入至PCB上對應之端子孔中;各該獨立銷P3所具有之肩部幾何形狀P30,則為各該獨立銷P3被壓配至PCB提供必要的支撐;對於相鄰獨立銷P3間具有5mm間距之獨立銷P3而言,使用TE Connectivity的P350插入機可每秒達到插入最多5個獨立銷P3的速率,而通過量測壓入力及/或深度來控制插入過程,亦能獲得最佳的連接質量控制。復請參閱第4圖所示,另一種最常見的系列則係使用具銷頭P40之壓配銷P4,該銷頭P40乃令該壓配銷P4得被穩固地定位至一絕緣塑料插頭(或插座)殼體C與PCB間的組件;通常,這些壓配銷P4係與PCB保持平行(0°)、某一預定角度或保持垂直(90°),且根據所需之壓配銷P4數量,令該等壓配銷P4得透過手工、半自動或全自動連接端子製造機予以加工完成;嗣,通過按壓各該壓配銷P4之銷頭P40肩部,即能將各該壓配銷P4按壓裝配至PCB上對應之端子孔H。當然,亦有一些應用可透過直接按壓該絕緣塑料插頭(或插座)殼體C來完成安裝至PCB上的程序。 In addition, TE Connectivity (TE)'s press-fit technology was first introduced into the telecommunications industry in the 1970s; later, in 1988, TE Connectivity's first press-fit pin was introduced into the vehicle industry; today, TE Connectivity has Two unique press-fit solutions are provided for vehicle applications; one is shown in Figure 3, which is called the ACTION PIN connection terminal P 3 (or independent pin, press-fit pin); As shown in Figure 4, the system is called Multispring connection terminal P 4 (or independent pin, press-fit pin); generally speaking, the press-fit technology can be applied to multiple series; among them, please refer to the figure 3 , The most basic method of using the independent pin P 3 series of press-fit technology. This method is usually to insert each independent pin P 3 into the corresponding terminal hole on the PCB at a high frequency and individually through automatic equipment; P 3 has the pin shoulder geometry P 30, which was independent of each pin P 3 is press-fitted to the PCB to provide the necessary support; independently respect to the adjacent pin P 3 P Room independent pin spacing of 5mm 3, Using TE Connectivity's P350 insertion machine can reach a rate of inserting up to 5 individual pins P 3 per second, and the insertion process can be controlled by measuring the indentation force and/or depth to obtain the best connection quality control. Complex See Figure 4, another series is the most common system used with a press-fit pin P the pin head 40 of P 4, P of the pin head 40 of the press-fit pin Nailing P 4 is firmly positioned to have a Insulated plastic plug (or socket) assembly between the housing C and the PCB; usually, these press-fit pins P 4 are kept parallel to the PCB (0°), at a certain predetermined angle or perpendicular (90°), and according to the needs The number of press-fit pins P 4 is such that the press-fit pins P 4 can be processed by manual, semi-automatic or fully automatic connection terminal manufacturing machines; then, by pressing the pin head P 40 of each press-fit pin P 4 , That is, each press-fit pin P 4 can be press-fitted to the corresponding terminal hole H on the PCB. Of course, there are some applications that can complete the installation process on the PCB by directly pressing the insulating plastic plug (or socket) housing C.
一般言,TE Connectivity的壓配解決方案實際上係以兼容且具有彈性的壓配銷P3、P4(或連接端子),予以實現,因此,在各該壓配銷P3、P4被插入至PCB上對應之各該端子孔H的過程中雖可能會發生變形,但其與實心壓配銷相比,顯然較能有效降低PCB上各該對應端子孔H上的應力,且能有效保持永久接觸插入時的正向作用力(Normal force),從而令其能在整個使用壽命期間內提供有效且可靠的電氣及機械連接。另,在各該壓配銷 P3、P4被插入至PCB上對應之各該端子孔H後,各該壓配銷P3、P4與各該對應端子孔H間的正向作用力將自動地產生冷焊互連;特別是,如果鍍錫用於兩個接觸件中的至少一個(如:端子孔),則由於冷焊接過程將令該等接觸件間產生金屬上的直接連接,而導致僅會在其間產生極低的接觸電阻值(通常低於0.1mOhm/亞毫歐範圍),據此,不僅能增加其在機械接觸上的穩定性,亦顯然能增加其在電氣上的穩定性。查,TE Connectivity的壓配技術目前已廣泛地被應用至車輛領域的諸多應用中,不僅為車輛業者在車輛的設計、製造及使用上提供了諸多具備便利性、輔助性及安全性的功能,尚證明了車輛業者對TE Connectivity壓配技術本身的高度認可及信任。此外,隨著更多電子設備不斷地被開發出來且日益地普及化,亦促使車輛中的電連接數量不斷地增加。然而,為了滿足使車輛變得更小、更安全、更便宜及更易於操控的市場趨勢,在車輛的諸多創新設計及應用上,主要均偏重在以電氣控制單元(electrical control unit,以下簡稱ECU)執行相關的控制,且各該ECU亦需要盡可能地緊湊(compact),據此,每個ECU內均獨立地配設有一PCB,且其上分別承載著具有相同小型化趨勢的電氣元件。基於前述電子化及小型化的市場趨勢,許多電子或電氣元件在相同或甚至更小的封裝空間上必需具備更多電氣上的互連能力,此一需求亦促使相關業者莫不汲汲營營地致力於開發小型化的互連零組件(或連接器)。為了迎合此一市場趨勢,已有相關業者利用TE Connectivity壓配技術推出了一款用於0.4x0.5mm連接端子且名為NanoMQS系列的微型連接器C1(miniaturized connector),請參閱第5圖所示。為了減少NanoMQS系列微型連接器C1在PCB上所佔用的空間,請參閱第6圖所示,其上二相鄰連接端子間的距離已從傳 統連接器C0的2.54mm一舉大幅縮減至1.8mm,同時,PCB上端子孔的尺寸亦從傳統的1.0mm大幅縮小至0.6mm。因此,根據其配置及規格,應可輕易看出,其與使用0.63x0.63mm連接端子的傳統連接器C0相較,NanoMQS系列微型連接器C1顯然能在PCB上節省高達60%的佔用空間。 Generally speaking, TE Connectivity's press-fit solutions are actually implemented with compatible and flexible press-fit pins P 3 and P 4 (or connecting terminals). Therefore, each of the press-fit pins P 3 and P 4 is Although it may be deformed during insertion into the corresponding terminal holes H on the PCB, it is obviously more effective in reducing the stress on the corresponding terminal holes H on the PCB than the solid press-fit pins, and it is also effective Maintain the normal force during permanent contact insertion (Normal force), so that it can provide an effective and reliable electrical and mechanical connection during the entire service life. In addition, after the press-fit pins P 3 and P 4 are inserted into the corresponding terminal holes H on the PCB, the positive force between the press-fit pins P 3 and P 4 and the corresponding terminal holes H Cold solder interconnections will be automatically generated; in particular, if tin plating is used for at least one of the two contacts (eg, terminal holes), the cold soldering process will result in direct metal connection between the contacts, As a result, only extremely low contact resistance values (usually less than 0.1mOhm/submilliohm range) will be generated between them. According to this, not only can it increase the stability of the mechanical contact, but also obviously increase its electrical stability. Check, the press-fit technology of TE Connectivity has been widely used in many applications in the field of vehicles, not only for vehicle manufacturers to provide many functions with convenience, auxiliary and safety in the design, manufacture and use of vehicles, It still proves that the vehicle industry highly recognizes and trusts the TE Connectivity press-fit technology itself. In addition, as more electronic devices are continuously developed and increasingly popularized, the number of electrical connections in vehicles is also increasing. However, in order to meet the market trend of making vehicles smaller, safer, cheaper, and easier to handle, many innovative designs and applications of vehicles mainly focus on electrical control units (hereinafter referred to as ECUs) ) Perform related control, and each ECU also needs to be as compact as possible. According to this, each ECU is independently equipped with a PCB, and electrical components with the same trend of miniaturization are carried on it. Based on the aforementioned market trends of electronicization and miniaturization, many electronic or electrical components must have more electrical interconnection capabilities in the same or even smaller packaging space. This demand has also prompted relevant companies to devote themselves to the camp Develop miniaturized interconnect components (or connectors). In order to cater to this market trend, some related companies have used TE Connectivity press-fit technology to launch a miniature connector C 1 (miniaturized connector) called NanoMQS series for 0.4x0.5mm connection terminals. Please refer to Figure 5. As shown. In order to reduce the space occupied by the NanoMQS series miniature connector C 1 on the PCB, please refer to Figure 6, the distance between the two adjacent connection terminals has been greatly reduced from the traditional connector C 0 2.54mm to 1.8 in one fell swoop At the same time, the size of the terminal hole on the PCB has also been greatly reduced from the traditional 1.0mm to 0.6mm. Therefore, according to its configuration and specifications, it should be easy to see that compared with the traditional connector C 0 using 0.63x0.63mm connection terminals, the NanoMQS series miniature connector C 1 can obviously save up to 60% of the occupation on the PCB space.
又,市場上的另一趨勢,係欲將NanoMQS的連接端子與壓配技術結合使用,亦有相關業者已就此開發出了一種全新且名為NanoMultispring的壓配銷,且促使其上包括壓配觸點在內的電氣互連特性能符合更多且更可靠的產品標準,從而能適用於更嚴苛的環境條件及滿足更多且更高的功能性特性需求。此外,隨著每一電子裝置中配設有更多的電子零組件,該等電子零組件間自然形成了更多的電氣互連,從而令業者對每一電子零組件的要求亦逐漸增加,如此,始能有效確保每一電子零組件在其使用壽命期間始終能提供高品質且可靠的性能。雖然,在現今的車輛應用中,最常見的PCB厚度仍是1.6mm,但是,隨著前述市場趨勢的演變,在未來的應用中我們極有可能會看到厚度更薄的PCB(如:厚度為1.2mm、1.0mm或0.8mm的PCB)。據此,壓配技術解決方案為了滿足前述市場趨勢,在其設計、製造及檢測上自然必需面對更多且更嚴苛的要求,以令其得以適用於各式PCB互連系統,且能為各該互連系統提供許多符合市場趨勢的優點。 In addition, another trend in the market is to use the connection terminals of NanoMQS in combination with the press-fit technology. Some related companies have developed a brand-new press-fit pin called NanoMultispring, and promoted the inclusion of press-fit The electrical interconnection characteristics including contacts meet more and more reliable product standards, which can be applied to more stringent environmental conditions and meet more and higher functional characteristics. In addition, as each electronic device is equipped with more electronic components, naturally more electrical interconnections are formed between the electronic components, so that the requirements of the industry for each electronic component are gradually increasing, In this way, it can effectively ensure that each electronic component can always provide high-quality and reliable performance during its service life. Although, in today's vehicle applications, the most common PCB thickness is still 1.6mm, but with the evolution of the aforementioned market trends, in future applications, we are likely to see thinner PCB (such as: thickness (1.2mm, 1.0mm or 0.8mm PCB). According to this, in order to meet the aforementioned market trends, the press-fit technology solutions must naturally face more and more stringent requirements in their design, manufacturing and testing, so that they can be applied to various PCB interconnection systems and can Provide each of the interconnected systems with many advantages in line with market trends.
除了在前述壓配技術解決方案中所使用到之前述壓配銷P3、P4(或連接端子P3、P4),一般言,在車輛行業中最常使用的壓配銷P5,請參閱第7圖所示,其結構係在一基礎材料P50(base material)上形成兩個電鍍層(即,底部電鍍層(under plating)P51及頂部電鍍層(top plating)P52),而隨著 業界導入無鉛焊接技術(lead free soldering)後,平均焊接溫度亦需較以往提高許多,為了適應此種較高的作業溫度,各該電子零組件上即必需使用較特殊且昂貴的耐高溫塑料(如:LCP,PPS,PPA和PCT...等),作為其上之絕緣材料,然而,透過使用壓配技術且捨棄焊接工藝,不僅可完全避免此一缺點,尚可令無鉛應用亦無需使用昂貴的耐高溫塑料。此外,由於空間的有效利用一直是車輛設計上之一重要的考量環節,而壓配技術的應用恰為其提供了一極佳的解決方案,雖然該解決方案係很難透過傳統焊接工藝實現的小型化解決方案。卻為大型連接器及回流焊接工藝提供了有利的解決方案,使得業界在製造各式電子零組件的過程中,得以利用表面安裝技術(SMT)將許多電子零組件應用至現有PCB的焊接工藝步驟中,以有效避開大型焊接頭經常會干擾SMT回流焊工藝的問題。至於插頭及相鄰部件的端子因溫度太低,而導致焊接過程有缺陷的問題,亦可在焊接過程後通過壓配技術來添加頭部予以解決;此外,在前述壓配技術的應用中,還有一種非常常見之集成殼體(integrated housing)或模組(module)M的應用,請參閱第8圖所示,該項應用係將線圈(Coils)、電容器(capacitors),激發器(actuators)及感測器(sensors)...等電子元件或電機元件(圖中未室)集成在同一殼體或模組M中,而令其得以被壓配安裝至同一個PCB上,以令該等電子元件或電機元件得以共享同一個PCB所提供之功能及作用;其中,各該集成殼體或模組M一般係使用ABS/ESC材料製成,以期令壓配技術應用的組裝過程更加容易及可靠,且令機電一體化的諸多應用成為能被具體實現而非遙不可及的事實。 In addition to the aforementioned press-fit pins P 3 and P 4 (or the connecting terminals P 3 and P 4 ) used in the aforementioned press-fit technology solution, generally speaking, the press-fit pin P 5 most commonly used in the vehicle industry, Please refer to FIG. 7, the structure is formed by forming two electroplating layers on a base material P 50 (base material) (ie, bottom plating P 51 and top plating P 52 ) With the introduction of lead free soldering technology in the industry, the average soldering temperature needs to be much higher than in the past. In order to adapt to this higher operating temperature, it is necessary to use special and expensive electronic components High temperature resistant plastics (such as: LCP, PPS, PPA and PCT...), as the insulating material on it, however, by using the press-fit technology and abandoning the welding process, not only can this shortcoming be completely avoided, but also lead-free The application does not need to use expensive high temperature resistant plastics. In addition, the effective use of space has always been an important consideration in vehicle design, and the application of press-fit technology has just provided an excellent solution for it, although this solution is difficult to achieve through traditional welding processes. Miniaturized solution. However, it provides an advantageous solution for large connectors and reflow soldering processes, enabling the industry to use surface mount technology (SMT) to apply many electronic components to the soldering process steps of existing PCBs during the manufacture of various electronic components In order to effectively avoid the problem that large solder joints often interfere with the SMT reflow soldering process. As for the temperature of the plug and the terminals of adjacent parts that are too low, resulting in defects in the welding process, it can also be solved by adding a head through the press-fit technology after the welding process; In addition, in the application of the aforementioned press-fit technology, There is also a very common application of integrated housing (module) or module (module). Please refer to Figure 8. This application uses coils, capacitors, and actuators. ) And sensors (sensors)... and other electronic components or motor components (not shown in the figure) are integrated in the same housing or module M, so that they can be press-fit mounted on the same PCB, so that These electronic components or motor components can share the functions and functions provided by the same PCB; where each integrated housing or module M is generally made of ABS/ESC materials, in order to make the assembly process of the press-fit technology more It is easy and reliable, and makes many applications of mechatronics a fact that can be realized rather than out of reach.
近年來,隨著電機、電子產業的日趨進步及複雜化,大數據 的高速傳輸似已成未來電子產業中不可逆轉的必然趨勢,茲以背板技術為例,背板技術是現今電信系統的基礎,背板結構的發展已將電信系統的數據傳輸頻寬由每秒幾Mb的傳輸速度推向了每秒幾Terabit(即,1012bits=1000000000000bits=1000gigabits)的傳輸速度,然而,在追求終極數據串流量的高速傳輸過程中,不僅背板內實體層結構非常關鍵,其上連接器內連接端子密度、端子孔及佈線走向亦是連接器設計師們在控制整個通道內超額電抗時所必需面臨的挑戰,雖然,透過採用先進微孔(microvia)技術及表面黏著技術,連接器及背板設計師們已能利用成熟的數位模擬設計程式,突破電信系統中的諸多障礙,設計出理想的背板、連接器及其對應之電子零組件;惟,由於目前電信平台均係依賴高速串列數據傳輸,而連接器及背板設計師們亦習慣性地經常會將電信系統之性能極限轉稼至連接器內連接端子所使用之銅材上,而為了打破Terabit的界限,近年來在網路交換機及路由器中均會採用了一種先進的背板技術,該先進背板技術因受惠於實體層元件中複雜的設計技術已被電腦化或數位化,而令其設計過程中對大部份元件的設計、建模、模擬、測量及驗證等...程序,均能在電腦化或數位化的模擬設計程式上逐一完成,且能充分利用既具備時域分析能力也具備頻域分析能力的模擬設計程式,令設計人員能將反射、串擾、阻抗失配及損耗...等複雜的現象直觀地顯示出來。 In recent years, with the increasing progress and complexity of the motor and electronics industries, the high-speed transmission of big data seems to have become an irreversible inevitable trend in the future electronics industry. The backplane technology is used as an example. Basically, the development of the backplane structure has pushed the data transmission bandwidth of the telecommunication system from a transmission speed of several Mb per second to a transmission speed of several Terabits per second (ie, 10 12 bits=1000000000000bits=1000gigabits), however, in the pursuit of During the high-speed transmission of the ultimate data stream flow, not only the physical layer structure in the backplane is very critical, but also the density of the connection terminals, the terminal holes and the wiring direction in the connector are also the reasons for the connector designers to control the excess reactance in the entire channel Challenges that must be faced, although, through the use of advanced microvia technology and surface adhesion technology, connector and backplane designers have been able to use mature digital analog design programs to break through many obstacles in telecommunications systems and design ideals Backplanes, connectors and their corresponding electronic components; however, because current telecommunication platforms rely on high-speed serial data transmission, and connector and backplane designers also routinely limit the performance limits of telecommunication systems It is transferred to the copper used for the connection terminals in the connector. In order to break the boundaries of Terabit, in recent years, an advanced backplane technology has been adopted in network switches and routers. This advanced backplane technology has benefited from it. The complex design techniques in the physical layer components have been computerized or digitized, so that the design, modeling, simulation, measurement and verification of most of the components in the design process can be computerized. Or the digital simulation design program is completed one by one, and can make full use of both the time domain analysis capability and the frequency domain analysis capability of the analog design program, so that designers can reflect, crosstalk, impedance mismatch and loss... etc. Complex phenomena are displayed intuitively.
誠如前述,雖然先進背板、連接器或其相關零組件的設計人員們已能利用電腦或數位模擬設計程式,設計出各式背板、連接器或其相關零組件上連接端子之理想規格,並令各該背板、連接器或其相關零組件因此而具備預期的理想電氣特性,然而,事與願違的是,俟透過先進自動 化生產技術及設備,製造出各該先進背板、連接器或其相關零組件後,各該先進背板、連接器或其相關零組件卻常會因自動化生產設備上的各項機械誤差或製程缺失,導致各該先進背板、連接器或其相關零組件上連接端子的製造規格不符合原設計之理想規格,從而令各該先進背板、連接器或其相關零組件無法在高頻傳輸環境下,發揮業者預期的理想電氣特性。有鑑於此,如何針對各該先進背板、連接器或其相關零組件上所安裝之各式連接器的實體結構進行精準的檢測,以確保各該連接器內每一支連接端子的腳位、間距及構形...等製造規格均完全符合所設計之理想規格,且使各式電子零組件得以透過對應之連接端子被精準地安裝至電信設備之PCB上,從而令各該電信設備不僅能精準地傳輸高頻串列數據,尚能在高頻串列數據的傳輸上具體實現數據訊號的完整性,即成為目前各大電信設備及元件設計及製造業者亟欲解決之一重要議題,亦為本創作欲在後續進行深入探討之一重要課題。 As mentioned above, although designers of advanced backplanes, connectors or related components have been able to use computer or digital simulation design programs to design the ideal specifications of the connection terminals on various backplanes, connectors or related components , And make each backplane, connector or related components have the expected ideal electrical characteristics, however, contrary to expectations, through advanced automatic Production technology and equipment, after manufacturing each of the advanced backplanes, connectors or related components, each of the advanced backplanes, connectors or related components is often subject to various mechanical errors or processes on the automated production equipment Deficiency causes that the manufacturing specifications of the connection terminals on each of the advanced backplanes, connectors or related components do not meet the ideal specifications of the original design, so that each of the advanced backplanes, connectors or related components cannot be transmitted at high frequencies Under the environment, give play to the ideal electrical characteristics expected by the industry. In view of this, how to accurately detect the physical structure of various connectors installed on each of the advanced backplanes, connectors or related components to ensure the pin positions of each connection terminal in each connector , Spacing and configuration... The manufacturing specifications are fully in line with the ideal specifications designed, and various electronic components can be accurately mounted on the PCB of the telecommunications equipment through the corresponding connection terminals, so that each telecommunications equipment Not only can it accurately transmit high-frequency serial data, but it can also achieve the integrity of the data signal in the transmission of high-frequency serial data, which has become an important issue that the major telecommunications equipment and component design and manufacturers urgently want to solve It is also an important subject for the creative in-depth discussion in the follow-up.
有鑑於此,為改進習知檢測各式電子零組件上連接端子時,所發生的諸多缺失,創作人經過長久努力研究與實驗,終於開發設計出本創作之一種利用二維影像辨識技術對待測電子零組件的連接端子執行品管檢測的品管檢測裝置。 In view of this, in order to improve the conventional knowledge of many defects that occur when connecting terminals on various electronic components, the creator has finally developed and designed a kind of two-dimensional image recognition technology to be tested after long-term research and experiment A quality control device that performs quality control on the connection terminals of electronic components.
本創作之一目的,係提供一種利用二維影像辨識技術對待測電子零組件的連接端子執行品管檢測的品管檢測裝置,該品管檢測裝置至少包括一檢測平台(或托盤)、一光源裝置、一影像擷取裝置及一檢測電腦;其中,該檢測平台之頂側面至少能定位一待測電子零組件,且令各該待測 電子零組件上之連接端子鄰近自由端(或插接端)的部位朝向該檢測平台之上方,使得該檢測裝置能對各該待測電子零組件上之連接端子執行品管檢測;該光源裝置係安裝在該檢測平台頂側上方,且其所產生之投射光線能沿著連接端子之插拔方向呈一預定角度地投射至各該連接端子鄰近自由端之部位,以令各該待測電子零組件及其上各該連接端子鄰近自由端之部位能產生一整體光影;該影像擷取裝置亦係安裝在該檢測平台之頂側上方,且能精準地擷取到各該待測電子零組件及其上各該連接端子鄰近自由端部位之整體影像;該檢測電腦係分別與該光源裝置及該影像擷取裝置相電氣連接,以控制該光源裝置及該影像擷取裝置,分別對各該待測電子零組件及其上各該連接端子鄰近自由端部位投射光線及擷取影像,且能在接收到該影像擷取裝置傳來之整體影像後針對該整體影像進行濾波處理,以濾除掉該整體影像中與建構該待測電子零組件之二維製造規格無關的光影,並據以建構各該待測電子零組件的二維製造規格,且與原先電腦模擬設計之各該待測電子零組件及其上各該連接端子之腳位、厚度、數量、間距及構形…等理想規格,逐一進行品管比對及分析,以期能大幅提高連接端子製造的精準度及良率,從而令各該電子零組件不僅能精準地傳輸高頻串列數據,尚能在高頻串列數據的傳輸上確保數據訊號的完整性。 An object of this creation is to provide a quality inspection device that uses two-dimensional image recognition technology to perform quality inspection on the connection terminals of electronic components to be tested. The quality inspection device includes at least an inspection platform (or tray) and a light source Device, an image capturing device and a testing computer; wherein, the top side of the testing platform can locate at least one electronic component to be tested, and make each of the to be tested The position of the connection terminal on the electronic component adjacent to the free end (or plug-in end) faces upwards of the detection platform, so that the detection device can perform quality control inspection on the connection terminal on each electronic component to be tested; the light source device It is installed above the top side of the detection platform, and the projection light generated by it can be projected at a predetermined angle along the insertion and removal direction of the connection terminal to the position of each connection terminal near the free end, so that each of the electronic to be tested The component and each part of the connection terminal adjacent to the free end can produce a whole light and shadow; the image capture device is also installed above the top side of the detection platform, and can accurately capture each of the electronic components to be tested The overall image of the component and each of the connection terminals adjacent to the free end portion; the detection computer is electrically connected to the light source device and the image capture device respectively to control the light source device and the image capture device, respectively for each The electronic component to be tested and each of the connection terminals thereon project light and capture images near the free end, and can filter the overall image after receiving the overall image from the image capture device to filter Eliminate the light and shadow in the overall image that are irrelevant to the two-dimensional manufacturing specifications of the electronic component under test, and construct the two-dimensional manufacturing specifications of the electronic component under test according to the original computer simulation design. Test the ideal specifications of the electronic components and the connection terminals on the pins, thickness, quantity, spacing and configuration...etc., and perform quality control comparison and analysis one by one, with a view to greatly improve the accuracy and yield of connection terminal manufacturing , So that each electronic component can not only accurately transmit high-frequency serial data, but also ensure the integrity of the data signal in the transmission of high-frequency serial data.
為便 貴審查委員能對本創作之目的、形狀、構造裝置特徵及其功效,做更進一步之認識與瞭解,茲舉實施例配合圖式,詳細說明如下: In order for your reviewing committee to have a better understanding and understanding of the purpose, shape, features of the structure and its function of this creation, the following examples are used in conjunction with the drawings. The detailed description is as follows:
[習知] [Knowledge]
P1‧‧‧實心壓配銷 P 1 ‧‧‧ Solid Pressed Pin
P11‧‧‧堅固的壓入區 P 11 ‧‧‧Sturdy press-in area
P2‧‧‧柔性壓配銷 P 2 ‧‧‧ flexible press-fit pin
P21‧‧‧彈性壓入區 P 21 ‧‧‧Elastic press-in zone
P3、P4‧‧‧ACTION PIN連接端子 P 3 , P 4 ‧‧‧ACTION PIN connection terminal
P30‧‧‧肩部幾何形狀 P 30 ‧‧‧ shoulder geometry
P40‧‧‧銷頭 P 40 ‧‧‧ pin head
P5‧‧‧壓配銷 P 5 ‧‧‧ Press-fit pin
P50‧‧‧基礎材料 P 50 ‧‧‧Basic materials
P51‧‧‧底部電鍍層 P 51 ‧‧‧Bottom plating
P52‧‧‧頂部電鍍層 P 52 ‧‧‧Top plating layer
C1‧‧‧微型連接器 C 1 ‧‧‧mini connector
C0‧‧‧傳統連接器 C 0 ‧‧‧traditional connector
H‧‧‧端子孔 H‧‧‧terminal hole
C‧‧‧絕緣塑料插頭(或插座)殼體 C‧‧‧insulated plastic plug (or socket) shell
M‧‧‧殼體或模組 M‧‧‧Housing or module
PCB‧‧‧印刷電路板 PCB‧‧‧Printed circuit board
[本創作] [This creation]
1‧‧‧品管檢測裝置 1‧‧‧ Quality control testing device
2‧‧‧電子零組件 2‧‧‧Electronic components
30‧‧‧檢測平台 30‧‧‧ Testing platform
300‧‧‧零組件定位槽 300‧‧‧Part positioning slot
31‧‧‧水平位移機構 31‧‧‧Horizontal displacement mechanism
320‧‧‧光源裝置 320‧‧‧Light source device
330‧‧‧影像擷取裝置 330‧‧‧Image capture device
34‧‧‧垂直位移機構 34‧‧‧Vertical displacement mechanism
38‧‧‧檢測電腦 38‧‧‧ Testing computer
380‧‧‧二維影像辨識及檢測程式 380‧‧‧Two-dimensional image recognition and detection program
C9‧‧‧連接器 C 9 ‧‧‧ connector
M10‧‧‧集成殼體或模組 M 10 ‧‧‧Integrated housing or module
P9、P10、P11‧‧‧連接端子 P 9 , P 10 , P 11 ‧‧‧ connection terminal
CPU‧‧‧電子元件 CPU‧‧‧Electronic components
100~107‧‧‧步驟 100~107‧‧‧step
第1圖係習知按壓-配接技術所使用之實心壓配銷的結構示意圖;第2圖係習知按壓-配接技術所使用之柔性壓配銷的結構示意圖;第3圖係TE Connectivity為車輛應用所提供之獨立銷P3系列的結構示意圖;第4圖係TE Connectivity為車輛應用所提供之Multispring銷P4系列的結構示意圖;第5圖係利用TE Connectivity壓配技術推出之一款用於0.4x0.5mm連接端子且名為NanoMQS系列的微型連接器C1及其對應之傳統連接器C0的外觀示意圖;第6圖係NanoMQS系列微型連接器C1及其對應之傳統連接器C0的頂側結構圖;第7圖係車輛行業中最常使用之壓配銷P5的外觀示意圖;第8圖係壓配技術應用中常見之集成殼體或模組應用的外觀示意圖;第9圖係Dimm插接座的外觀示意圖;第10圖係按壓-配接技術所使用之插接座的底側結構示意圖;第11圖係按壓-配接技術所使用之另一插接座的頂側結構示意圖;第12圖係本創作之檢測裝置的硬體架構示意圖;及第13圖係本創作之檢測方法的流程示意圖。 Figure 1 is a schematic diagram of the structure of a solid press-fit pin used in conventional press-fit technology; Figure 2 is a schematic diagram of the structure of a flexible press-fit pin used in conventional press-fit technology; Figure 3 is TE Connectivity The schematic diagram of the structure of the independent pin P 3 series provided for vehicle applications; Figure 4 is the schematic diagram of the structure of the Multispring pin P 4 series provided by TE Connectivity for vehicle applications; Figure 5 is one of the models launched using the TE Connectivity press-fit technology and a connection terminal 0.4x0.5mm NanoMQS called mini series. 1 and its corresponding connector C of the conventional connector C appearance 0 schematic; Fig. 6 based NanoMQS series micro. 1 and its corresponding connector C of the conventional connector C 0 top-side structure diagram; Figure 7 is a schematic diagram of the appearance of the most commonly used press-fit pin P 5 in the vehicle industry; Figure 8 is a schematic diagram of the appearance of integrated housing or module applications common in the application of press-fit technology; Figure 9 is a schematic diagram of the appearance of the Dimm socket; Figure 10 is a schematic diagram of the bottom structure of the socket used by the press-fit technology; Figure 11 is another socket used by the press-fit technology Figure 12 is a schematic diagram of the top structure; Figure 12 is a schematic diagram of the hardware architecture of the detection device of the present creation; and Figure 13 is a schematic flowchart of the detection method of the creation.
誠如前述,基於目前電信平台均係採用高速串列數據傳輸,為了打破Terabit的界限,雖然各式連接器、背板、集成殼體或模組及其相關電子零組件之設計師們因受惠於實體層元件中複雜設計技術的電腦化或數 位化,令其在設計過程中對大部份元件的設計、建模、模擬、測量及驗證等...程序,均能在電腦化或數位化的模擬設計程式上逐一完成,且能充分利用既具備時域分析能力也具備頻域分析能力的模擬設計程式,令設計人員能將反射、串擾、阻抗失配及損耗...等複雜的現象直觀地顯示出來,並據以修改調整後設計出所需之各式連接器、背板、集成殼體或模組及其相關零組件上連接端子之理想規格,且令各該連接器、背板、集成殼體或模組及其相關零組件因此而具備預期的理想電氣特性,但是,經常事與願違的是,俟業者透過先進自動化生產技術及設備,製造出各該連接器、背板、集成殼體或模組及其相關零組件後,各該連接器、背板、集成殼體或模組及其相關零組件卻常會因自動化生產設備上的各項機械誤差或製程缺失,導致各該連接器、背板、集成殼體或模組及其相關零組件上連接端子的製造規格不符合原設計之理想規格,從而令各該連接器、背板、集成殼體或模組及其相關零組件無法在高頻傳輸環境下,發揮業者預期的理想電氣特性,有鑑於此,創作人基於二十多年來親身參與各式連接器、背板、集成殼體或模組及其相關零組件之開發、設計、製造及推廣之實務經驗,深刻體驗到無論係那一種類型的連接器C9(請參閱第9圖所示)、集成殼體或模組M10(請參閱第10圖所示)及其相關電子元件CPU(請參閱第11圖所示,以下均簡稱為「電子零組件」),其訊號傳輸品質之良窳均取決於其上用以傳輸訊號之連接端子P9、P10、P11製作品質之良窳,若各該電子零組件C9、M10、CPU上連接端子P9、P10、P11的製造規格符合原設計之理想規格,各該電子零組件C9、M10、CPU即能在高頻傳輸環境下,輕易地發揮業者預期的理想電氣特性,從而確保各該電子零組件C9、M10、CPU始終具備優異的高頻數 據傳輸品質;據此,創作人乃思及究應如何針對各該電子零組件C9、M10、CPU上所安裝之每一支連接端子P9、P10、P11的實體結構進行精準的檢測,以能確保各該電子零組件C9、M10、CPU上每一支連接端子P9、P10、P11的腳位、間距及構形...等製造規格均完全符合原設計之理想規格,從而使各該電子零組件C9、M10、CPU得以透過對應之各該連接端子P9、P10、P11被精準地安裝至各式電子及電信設備之PCB上,且令各該電子及電信設備不僅能精準地傳輸高頻串列數據,尚能在高頻串列數據的傳輸上具體實現數據訊號的完整性。 As mentioned above, based on the current high-speed serial data transmission of telecommunication platforms, in order to break the boundaries of Terabit, although designers of various connectors, backplanes, integrated housings or modules and their related electronic components suffer from Thanks to the computerization or digitalization of the complex design technology in the physical layer components, the design, modeling, simulation, measurement and verification of most components in the design process can be computerized or The digital simulation design program is completed one by one, and can fully utilize the simulation design program with both time domain analysis and frequency domain analysis capabilities, allowing designers to combine reflection, crosstalk, impedance mismatch and loss... The phenomenon is visually displayed, and the desired specifications of the connection terminals on the various types of connectors, backplanes, integrated housings or modules and their related components are designed after modification and adjustment, and each connector , Backplane, integrated housing or module and their related components therefore have the expected ideal electrical characteristics, but often contrary to expectations, the industry through advanced automated production technology and equipment to manufacture each connector, backplane After the integrated housing or module and its related components, each connector, backplane, integrated housing or module and its related components are often caused by various mechanical errors or missing manufacturing processes on the automated production equipment The manufacturing specifications of the connection terminals on each connector, backplane, integrated housing or module and their related components do not meet the ideal specifications of the original design, so that each connector, backplane, integrated housing or module and The related components cannot perform the ideal electrical characteristics expected by the industry in the high-frequency transmission environment. In view of this, the creators have personally participated in various connectors, backplanes, integrated housings or modules and their Practical experience in the development, design, manufacture and promotion of related components, deeply experience the type of connector C 9 (see Figure 9), integrated housing or module M 10 (see page Figure 10) and its related electronic components CPU (please refer to Figure 11 below, hereinafter referred to as "electronic components"), the quality of the signal transmission quality depends on the connection terminals used to transmit signals P 9 , P 10 , and P 11 are of good quality. If the manufacturing specifications of each of the electronic components C 9 , M 10 , and the connection terminals P 9 , P 10 , and P 11 on the CPU meet the ideal specifications of the original design, each should Electronic components C 9 , M 10 , and CPU can easily play the ideal electrical characteristics expected by the industry in a high-frequency transmission environment, thereby ensuring that each electronic component C 9 , M 10 , and CPU always have excellent high-frequency data Transmission quality; accordingly, the creator is thinking about how to accurately determine the physical structure of each connection terminal P 9 , P 10 , P 11 installed on each of the electronic components C 9 , M 10 , and CPU Test to ensure the pin position, spacing and structure of each connection terminal P 9 , P 10 and P 11 on each of the electronic components C 9 , M 10 and CPU The manufacturing specifications such as shape... are fully in line with the ideal specifications of the original design, so that the electronic components C 9 , M 10 and CPU can be accurately installed through the corresponding connection terminals P 9 , P 10 and P 11 On the PCB of various electronic and telecommunication equipment, and not only can the electronic and telecommunication equipment accurately transmit high-frequency serial data, but also can realize the integrity of the data signal in the transmission of high-frequency serial data.
有鑑於各該電子零組件C9、M10、CPU上每一支連接端子P9、P10、P11之理想規格在設計完成時即已確定,且各該電子零組件C9、M10、CPU均係透過各該連接端子P9、P10、P11沿著其插拔方向而分別與對應之連接端子相互抵觸,形成電氣連接,而據以精準地傳輸高頻串列數據,一般言,對應連接端子間相互抵觸之部位均係位在上每一支連接端子P9、P10、P11鄰近自由端(或插接端)之部位,且為了有效提升對應連接端子間之導電性及訊號傳輸品質,業者均會在每一支連接端子P9、P10、P11鄰近自由端(或插接端)之部位鍍上一層金或銀...等材料,也因此而令每一支連接端子P9、P10、P11鄰近自由端(或插接端)之部位具備更佳的反光及導電特性。 In view of the fact that the ideal specifications of each connection terminal P 9 , P 10 , and P 11 on the electronic component C 9 , M 10 , and CPU are determined when the design is completed, and each electronic component C 9 , M 10 , CPU is through each of the connection terminals P 9 , P 10 , P 11 along the direction of insertion and removal and the corresponding connection terminals are in conflict with each other to form an electrical connection, and according to the precise transmission of high-frequency serial data, generally In other words, the positions where the corresponding connection terminals conflict with each other are located at the position of each of the connection terminals P 9 , P 10 , and P 11 adjacent to the free end (or plug-in end), and in order to effectively improve the conductivity between the corresponding connection terminals For the performance and signal transmission quality, the industry will plate a layer of gold or silver on each part of the connection terminals P 9 , P 10 and P 11 adjacent to the free end (or plug end)... Each part of the connection terminals P 9 , P 10 and P 11 adjacent to the free end (or plug-in end) has better reflective and conductive characteristics.
基於各該電子零組件C9、M10、CPU上每一支連接端子P9、P10、P11之前述特性,創作人乃思及,若能對各該待測電子零組件C9、M10、CPU上每一支連接端子P9、P10、P11鄰近自由端(或插接端)之部位,先沿其插拔方向,擷取其二維影像;嗣,利用二維影像辨識技術,對各該待測電子零組件C9、M10、CPU上每一支連接端子P9、P10、P11鄰近自由端(或插接端) 部位之二維影像進行精準的輪廓辨識,即能在確認各該待測電子零組件C9、M10、CPU上每一支連接端子P9、P10、P11之腳位、間距及插接端構形...等製造規格後,據以與原設計之理想規格進行比較判斷,若判斷出該等製造規格完全符合原設計之該等理想規格,即表示各該待測電子零組件C9、M10、CPU係屬通過品管檢測之良品;反之,即表示各該待測電子零組件C9、M10、CPU係屬無法通過檢品管測之遐疵品。如此,不僅能令業者在最快速且精準的檢測過程中,以批次方式,對該等電子零組件C9、M10、CPU完成理想規格之檢測判斷,以確保各該電子零組件C9、M10、CPU上每一支連接端子P9、P10、P11的腳位、間距及構形...等製造規格均完全符合原設計之理想規格,從而使各該電子零組件C9、M10、CPU得以透過對應之各該連接端子P9、P10、P11被精準地安裝至各式電子及電信設備之PCB上,且令各該電子及電信設備不僅能精準地傳輸高頻串列數據,尚能在高頻串列數據的傳輸上具體實現數據訊號的完整性;不僅如此,業者尚能在精準檢測出各該電子零組件C9、M10、CPU上每一支連接端子P9、P10、P11在腳位、間距及插接端構形...等製造規格上之具體遐疵後,據以迅速探究及尋找其自動化生產設備上對應之機械誤差或製程缺失,從而在獲得各該遐疵之解決方案後,能大幅提升各該電子零組件C9、M10、CPU之產品品質及生產良率。 Based on the foregoing characteristics of each of the electronic components C 9 , M 10 , and each connection terminal P 9 , P 10 , and P 11 on the CPU, the creator thinks that if the electronic component to be tested C 9 , M 10 , each part of the connection terminal P 9 , P 10 and P 11 on the CPU adjacent to the free end (or plug-in end), first capture its two-dimensional image along its insertion and removal direction; then, use the two-dimensional image Identification technology to accurately outline the two-dimensional image of the adjacent free ends (or plug-in ends) of each of the connection terminals P 9 , P 10 and P 11 on the electronic components C 9 , M 10 and CPU under test Identification, that is, it can be manufactured by confirming the pin position, spacing and plug-in configuration of each connection terminal P 9 , P 10 and P 11 on the electronic component C 9 , M 10 and CPU under test. After the specification, according to the comparison with the ideal specification of the original design, if it is judged that the manufacturing specifications fully meet the ideal specifications of the original design, it means that each of the electronic components to be tested C 9 , M 10 , CPU is A good product that passed the quality control test; otherwise, it means that each of the electronic components to be tested C 9 , M 10 , and CPU is a defective product that cannot pass the quality control test. In this way, it can not only enable the industry to complete the detection and judgment of the ideal specifications of the electronic components C 9 , M 10 , and CPU in batches in the fastest and accurate inspection process, so as to ensure that each electronic component C 9 , M 10 , the pin position, spacing and configuration of each connection terminal P 9 , P 10 , P 11 on the CPU are completely in line with the ideal specifications of the original design, so that each electronic component C 9. M 10 and CPU can be accurately mounted on the PCB of various electronic and telecommunication equipment through the corresponding connection terminals P 9 , P 10 and P 11 , and the electronic and telecommunication equipment can not only be accurately transmitted High-frequency serial data can still realize the integrity of data signals in the transmission of high-frequency serial data; not only that, the industry can still accurately detect each of the electronic components C 9 , M 10 , and CPU After the specific defects in the manufacturing specifications such as the foot position, spacing and plug-in terminal configuration of the support terminals P 9 , P 10 , P 11 , etc., we can quickly investigate and find the corresponding mechanical errors on their automated production equipment Or the manufacturing process is missing, so that after obtaining the solutions of the defects, the product quality and production yield of the electronic components C 9 , M 10 , and CPU can be greatly improved.
基於前述創作理念,創作人憑藉著多年來從事自動化檢測機具設計及製造的豐富實務經驗,經過長久地努力地觀察與研究後,發現僅須利用二維影像辨識技術,即能批次地針對幾十個或上百個電子零組件C9、M10、CPU上連接端子P9、P10、P11之實體結構及位置,同時執行二維影像的擷取及辨識,而能大量且精準地完成對各該電子零組件C9、M10、CPU 上每一支連接端子P9、P10、P11理想規格之相關檢測工作,其首先必需要解決的問題,就是在對各該電子零組件C9、M10、CPU上之每一支連接端子P9、P10、P11鄰近自由端(或插接端)之部位,執行相關檢測工作前,必需使各該電子零組件C9、M10、CPU上每一支連接端子P9、P10、P11鄰近自由端(或插接端)之部位能完全曝露在一開放且無死角的透視空間中。如此,在利用二維影像辨識技術對各該電子零組件C9、M10、CPU上每一支連接端子P9、P10、P11執行相關檢測工作時,始能令二維影像辨識技術所使用之光源順利通過該開放且無死角的透視空間,投射至各該電子零組件C9、M10、CPU上每一支連接端子P9、P10、P11鄰近自由端(或插接端)之部位上,同時,令二維影像辨識技術所使用之影像感測裝置能順利通過該開放且無死角的透視空間,擷取到每一電子零組件C9、M10、CPU上每一支連接端子P9、P10、P11鄰近自由端(或插接端)之部位的清晰影像,從而始能令二維影像辨識技術利用其內建之自動化光學檢測技術,對每一支連接端子P9、P10、P11鄰近自由端(或插接端)之部位分別進行二維影像(即,其製造規格)的重建,並據以分別與一對應且完美無瑕的二維參考影像(即,原設計之理想規格),進行規格特徵(如:腳位、間距及構形...等)之比對及分析,以快速且精準地沿著每一支連接端子P9、P10、P11之插拔方向完成對電子零組件C9、M10、CPU上每一支連接端子P9、P10、P11之腳位、間距及構形...等製造規格的各項檢測。 Based on the aforementioned creative concept, the creators, with many years of practical experience in the design and manufacture of automated testing equipment, after long-term hard observation and research, found that only need to use two-dimensional image recognition technology, which can be batch targeted The physical structure and location of ten or hundreds of electronic components C 9 , M 10 , and the connection terminals P 9 , P 10 , and P 11 on the CPU, while performing two-dimensional image capture and identification, which can be mass and precise Complete the relevant inspection work on the ideal specifications of each connection terminal P 9 , P 10 , and P 11 on each electronic component C 9 , M 10 , and CPU. The first problem that must be solved is to check the electronic component. Each of the connection terminals P 9 , P 10 , and P 11 on the components C 9 , M 10 , and CPU is adjacent to the free end (or plug-in end). Before performing the relevant inspection work, you must make each electronic component C 9 , M 10 , the part of each connection terminal P 9 , P 10 , P 11 on the CPU adjacent to the free end (or plug-in end) can be completely exposed in an open and perspective space without dead angle. In this way, when the two-dimensional image recognition technology is used to perform relevant inspection work on each of the connection terminals P 9 , P 10 , and P 11 on the electronic components C 9 , M 10 , and CPU, the two-dimensional image recognition technology can be enabled. The light source used passes through the open and non-dead-view perspective space, and is projected onto each of the electronic components C 9 , M 10 , and each connection terminal P 9 , P 10 , P 11 on the CPU near the free end (or plug-in At the same time, at the same time, the image sensing device used by the two-dimensional image recognition technology can smoothly pass through the open and dead-end perspective space and capture each electronic component C 9 , M 10 , and CPU A clear image of the connection terminal P 9 , P 10 , P 11 near the free end (or plug-in end), so that the two-dimensional image recognition technology can use its built-in automated optical inspection technology for each Reconstruction of two-dimensional images (ie, their manufacturing specifications) of the connection terminals P 9 , P 10 , and P 11 adjacent to the free end (or plug-in end) respectively, and corresponding to a perfect and flawless two-dimensional reference respectively Image (that is, the ideal specification of the original design), compare and analyze the characteristics of the specifications (such as: foot position, spacing and configuration... etc.) to quickly and accurately follow each connection terminal P 9 , The insertion and removal directions of P 10 and P 11 are completed for the manufacturing specifications of the electronic components C 9 , M 10 and each connection terminal P 9 , P 10 and P 11 on the CPU. Various tests.
基於此一設計理念,請參閱第12圖所示,創作人乃思及設計一品管檢測裝置1,該品管檢測裝置1係利用一具特殊結構設計之檢測平台30(如第12圖所繪製的托盤態樣),該檢測平台30之頂側面係向下凹設形成有
複數個零組件定位槽300,該等零組件定位槽300係彼此間隔且相互保持一預定的間距,各該零組件定位槽300之構形、大小及深浅係與各該電子零組件2之構形、大小及高低相匹配,以在每一個電子零組件2被承載在該檢測平台30之頂側面時,各該電子零組件2能被逐一地容納至各該零組件定位槽300內,復請參閱第12圖所示,且各該電子零組件2上每一支連接端子P9、P10、P11鄰近自由端(或插接端)之部位均外露在該檢測平台30之頂側面,而朝向該檢測平台30之頂側面上方。如此,該檢測平台30之頂側即能批次性地定位及承載複數個電子零組件2,且令該等電子零組件2在被位移至對應之一檢測位置時,各該電子零組件2上每一支連接端子P9、P10、P11鄰近自由端(或插接端)之部位均朝向該檢測平台30頂側之上方,使得各該連接端子P9、P10、P11鄰近自由端(或插接端)之部位均能分別對應至一開放且無死角的檢測空間。如此,本創作即能利用設在該檢測平台30頂側上方之一光源裝置320及一影像擷取裝置330,令該光源裝置320能逐一通過對應的檢測空間,對各該連接端子P9、P10、P11鄰近自由端(或插接端)之部位投射光線,該影像擷取裝置330能在逐一擷取各該連接端子P9、P10、P11鄰近自由端(或插接端)部位所反射之一待檢測二維影像後,將各該待檢測二維影像傳送至一檢測電腦38,該檢測電腦38內建有一二維影像辨識及檢測程式380,能對每一待檢測二維影像進行辨識,且對其上各該連接端子P9、P10、P11鄰近自由端(或插接端)之部位分別進行二維影像的重建,並據以建構各該連接端子P9、P10、P11鄰近自由端(或插接端)部位之輪廓點及線,從而獲得各該連接端子P9、P10、P11鄰近自由端(或插接端)部位之製造規格(如:腳位、間距及構形...等),並據以分別與原設計之一對應的理想規格,進行特徵比對及分
析,以快速且精準地由各該連接端子P9、P10、P11之插拔方向完成對各該電子零組件2上每一支連接端子P9、P10、P11的各項檢測。
Based on this design concept, please refer to the illustration in Figure 12, the creator is thinking about designing a quality inspection device 1, which uses a special structure design inspection platform 30 (as shown in Figure 12 Trays), a plurality of
復請參閱第12圖所示,在本創作前述品管檢測裝置1中,尚包括一水平位移機構31及一垂直位移機構34;其中,該水平位移機構31及該垂直位移機構34係分別與該檢測電腦38相電氣連接,且係分別用以承載該光源裝置320及該影像擷取裝置330,以接受該檢測電腦38之控制,對該光源裝置320及該影像擷取裝置330執行水平向及/或垂直向的位移,從而令該光源裝置320及該影像擷取裝置330能逐一對各該電子零組件2上每一支連接端子P9、P10、P11鄰近自由端(或插接端)之部位投射光線,且令該檢測電腦38能讀取該影像擷取裝置330所擷取之各該電子零組件2及其上每一支連接端子P9、P10、P11鄰近自由端(或插接端)部位之整體影像;最後,該檢測電腦38會利用其內建之二維影像辨識及檢測程式380,針對各該電子零組件2及其上每一支連接端子P9、P10、P11鄰近自由端(或插接端)部位之整體影像進行二維點、線輪廓(即,製造規格)的重建,並據以與原設計之一對應的理想規格,進行規格特徵之比對及分析,即能快速且精準地由每一支連接端子P9、P10、P11之插拔方向完成對各該電子零組件2及其上每一支連接端子P9、P10、P11的各項檢測,不僅確保能以批次方式,同時實現對大量電子零組件2及其上每一支連接端子P9、P10、P11執行各項檢測之目的,尚能確保完成檢測的該等電子零組件2都能具備理想的工作效能及預期的使用壽命。
Please refer to FIG. 12 again. In the quality control testing device 1 of the present creation, it also includes a
據上所述,該檢測電腦38即能根據該影像擷取裝置330所擷取及傳來之各該電子零組件2及其上每一支連接端子P9、P10、P11鄰近自由端(或插接端)部位之清晰的整體影像,利用其內建之二維影像辨識及檢測程式
380,對該整體影像精準地進行二維影像的重建,以快速且精準地獲得各該電子零組件2及其上每一支連接端子P9、P10、P11的製造規格,俾據以精準地分析判斷及檢測出各該電子零組件2及其上每一支連接端子P9、P10、P11之製造精準度,以有效提升對各該電子零組件2及其上每一支連接端子P9、P10、P11之品管質量及效率。
According to the above, the
以上所述,僅係本創作之一較佳實施例,惟,本創作在實際施作時,並不侷限於此,且其上所採用的任何機構或裝置,均能視實際的需要,予以簡單化或複雜化,但是,無論如何修飾及改變,只要該品管檢測裝置1係在該檢測平台30的輔助下,透過本創作之前述組成元件,利用二維影像辨識及比對技術,同時對複數個電子零組件C9、M10、CPU及其上每一支連接端子P9、P10、P11沿插拔方向執行批次的影像檢測,均係本創作在此欲主張保護之該品管檢測裝置1,合先指明。
The above is only one of the preferred embodiments of this creation. However, the actual implementation of this creation is not limited to this, and any mechanism or device used on it can be treated according to actual needs. Simplify or complicate, however, no matter how modified or changed, as long as the quality inspection device 1 is assisted by the
復請參閱第12圖所示,本創作係一種利用二維影像辨識技術對待測電子零組件的連接端子執行品管檢測的裝置及其方法,該品管檢測方法係透過前述品管檢測裝置1予以實現,該品管檢測裝置1包括一檢測平台30(即,前述托盤)、一光源裝置320、一影像擷取裝置330及一檢測電腦38,其中,該檢測平台30之頂側面上能定位至少一待測電子零組件C9、M10、CPU,且各該待測電子零組件2上連接端子P9、P10、P11鄰近自由端(或插接端)的部位係朝向該檢測平台30之上方,以令該品管檢測裝置1能對各該待測電子零組件2及其上連接端子P9、P10、P11執行品管檢測;該光源裝置320係安裝在該檢測平台30之頂側上方,且其所產生的投射光線能沿著各該連接端子P9、P10、P11之插拔方向呈一預定角度地投射至各該連接端子P9、P10、 P11鄰近自由端(或插接端)之部位,以令各該連接端子P9、P10、P11鄰近自由端(或插接端)之部位能分別產生一對應之反射光影;該影像擷取裝置330亦係安裝在該檢測平台30之頂側上方,使得該影像擷取裝置330能精準地擷取到各該待測電子零組件2及其上各連接端子P9、P10、P11鄰近自由端部位之整體影像;該檢測電腦38係分別與該光源裝置320及該影像擷取裝置330相電氣連接,以控制該光源裝置320及該影像擷取裝置330分別對各該待測電子零組件2及其上各連接端子P9、P10、P11鄰近自由端部位光源裝置及擷取影像,且能接收該影像擷取裝置330傳來之整體影像,請參閱第13圖所示,並依下列步驟,對各該待測電子零組件2及其上各連接端子P9、P10、P11執行品管檢測: Please refer to FIG. 12 again, this creation is a device and method for performing quality control testing of connection terminals of electronic components to be tested using two-dimensional image recognition technology. The quality control testing method is through the aforementioned quality control testing device 1 To be realized, the quality control testing device 1 includes a testing platform 30 (ie, the aforementioned tray), a light source device 320, an image capturing device 330, and a testing computer 38, wherein the top side of the testing platform 30 can be positioned At least one electronic component to be tested C 9 , M 10 , and CPU, and the portion of each electronic component to be tested 2 connected to the terminals P 9 , P 10 , and P 11 adjacent to the free end (or plug-in end) faces the detection Above the platform 30, so that the quality control testing device 1 can perform quality control testing on each of the electronic components to be tested 2 and the connection terminals P 9 , P 10 , and P 11 thereon; the light source device 320 is installed on the testing above the top side of the platform 30, and it produces a projection light energy 9, P 10, P 11 of the plug direction form a predetermined angle to each of the projected connection terminals P 9, P 10 along each of the connecting terminals P, P 11 is adjacent to the free end (or plug-in end), so that each of the connection terminals P 9 , P 10 , and P 11 adjacent to the free end (or plug-in end) can produce a corresponding reflected light and shadow; the image The capture device 330 is also installed above the top side of the detection platform 30, so that the image capture device 330 can accurately capture each of the electronic components to be tested 2 and the connection terminals P 9 , P 10 , The overall image of P 11 adjacent to the free end; the detection computer 38 is electrically connected to the light source device 320 and the image capture device 330, respectively, to control the light source device 320 and the image capture device 330 respectively The electronic component 2 and its connecting terminals P 9 , P 10 , and P 11 are adjacent to the free end of the light source device and capture images, and can receive the overall image from the image capture device 330, please refer to Figure 13 As shown, and in accordance with the following steps, perform quality control inspections on each of the electronic component 2 to be tested and its connecting terminals P 9 , P 10 , and P 11 :
(100)首先,令該光源裝置320能產生投射光線,且令該投射光線能沿著各該連接端子P9、P10、P11之插拔方向呈一預定角度地投射至各該連接端子P9、P10、P11鄰近自由端(或插接端)之部位;
(100) First, the
(101)令該影像擷取裝置330擷取該投射光線在各該待測電子零組件2及其上各該連接端子P9、P10、P11鄰近自由端(或插接端)部位所產生之一整體影像;
(101) Let the
(102)讀取該影像擷取裝置330傳來之該整體影像;
(102) Read the whole image from the
(103)針對該整體影像進行濾波處理(color filtering),以濾除掉該整體影像中與建構各該待測電子零組件2及其上各該連接端子P9、P10、P11鄰近自由端(或插接端)部位之二維製造規格無關的光影;
(103) Perform color filtering on the overall image to filter out the proximity of the overall image and the construction of the electronic component under
(104)重建各該待測電子零組件2及其上各該連接端子P9、P10、P11鄰近自由端(或插接端)部位之二維製造規格;其中,在辨識該整體影像中各
該製造規格(如:其上各該連接端子P9、P10、P11之腳位、間距及構形等規格特徵)時,係以對應於該檢測平台30之頂側面上或各該待測電子零組件2上之至少一特定參考位置,作為運算比對時之參考點;
(104) Reconstruct the two-dimensional manufacturing specifications of each of the electronic component to be tested 2 and the connection terminals P 9 , P 10 , and P 11 adjacent to the free end (or plug end); wherein, the overall image is recognized Each of the manufacturing specifications (such as the specifications, such as the pin positions, spacing, and configuration of the connection terminals P 9 , P 10 , and P 11 on it) corresponds to the top side of the
(105)根據各該參考點,計算出各該連接端子P9、P10、P11之自由端(或插接端)位置、間距(即,腳位)及各該連接端子P9、P10、P11鄰近自由端(或插接端)部位之弧度或偏移量(即,構形); (105) Based on each reference point, calculate the position, pitch (i.e., pin position) of the free end (or plug end) of each of the connection terminals P 9 , P 10 , and P 11 and each of the connection terminals P 9 , P 10. The arc or offset (ie, configuration) of P 11 adjacent to the free end (or plug end);
(106)俟計算出各該連接端子P9、P10、P11之自由端(或插接端)位置、間距及各該連接端子P9、P10、P11鄰近自由端(或插接端)部位之弧度或偏移量...等製造規格後,即能與原先電腦模擬設計之各該連接端子P9、P10、P11的腳位、厚度、數量、間距及構形...等理想規格,逐一進行比對,以判斷二者是否一致?若是,即執行步驟(107);否則,執行步驟(108); (106) Once the free ends (or plug-in ends) of each of the connection terminals P 9 , P 10 , and P 11 are calculated, the spacing and the connection terminals P 9 , P 10 , and P 11 are adjacent to the free end (or plug-in connection) After the manufacturing specifications, such as the arc or offset of the part), the pin positions, thickness, number, spacing and configuration of the connection terminals P 9 , P 10 , and P 11 can be simulated with the original computer. .. wait for the ideal specifications and compare them one by one to determine whether they are consistent? If yes, go to step (107); otherwise, go to step (108);
(107)在該檢測電腦38上顯示「該待測電子零組件上複數支連接端子符合理想的設計規格,通過品管檢測!」,且結束處理流程。
(107) The
(108)在該檢測電腦38上顯示「該待測電子零組件上複數支連接端子不符合理想的設計規格,無法通過品管檢測!」且要求品管檢測人員應對此一瑕疵狀態,探究原因及尋求解決方案,並予註記,俾作為日後據以改善製程及調整機台誤差的參考依據,以期能大幅提高連接端子P9、P10、P11製造的精準度及良率,從而令各該電子零組件2不僅能精準地傳輸高頻串列數據,尚能在高頻串列數據的傳輸上確保數據訊號的完整性。
(108) The
按,以上所述,僅為本創作最佳之一具體實施例,惟本創作 之構造特徵並不侷限於此,任何熟悉該項技藝者在本創作領域內,可輕易思及之變化或修飾,皆可涵蓋在以下本案之專利範圍。 According to the above, it is only one of the best embodiments of this creation, but this creation The structural features are not limited to this. Anyone who is familiar with this skill can easily think of changes or modifications in this creative field, which can be covered in the patent scope of the following case.
1‧‧‧品管檢測裝置 1‧‧‧ Quality control testing device
2‧‧‧電子零組件 2‧‧‧Electronic components
30‧‧‧檢測平台 30‧‧‧ Testing platform
300‧‧‧零組件定位槽 300‧‧‧Part positioning slot
31‧‧‧水平位移機構 31‧‧‧Horizontal displacement mechanism
320‧‧‧光源裝置 320‧‧‧Light source device
330‧‧‧影像擷取裝置 330‧‧‧Image capture device
34‧‧‧垂直位移機構 34‧‧‧Vertical displacement mechanism
38‧‧‧檢測電腦 38‧‧‧ Testing computer
380‧‧‧二維影像辨識及檢測程式 380‧‧‧Two-dimensional image recognition and detection program
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108210800U TWM589280U (en) | 2019-08-15 | 2019-08-15 | Quality control and inspection device using two-dimensional image recognition technology to perform quality control and inspection of connection terminals of electronic components to be tested |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW108210800U TWM589280U (en) | 2019-08-15 | 2019-08-15 | Quality control and inspection device using two-dimensional image recognition technology to perform quality control and inspection of connection terminals of electronic components to be tested |
Publications (1)
Publication Number | Publication Date |
---|---|
TWM589280U true TWM589280U (en) | 2020-01-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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TW108210800U TWM589280U (en) | 2019-08-15 | 2019-08-15 | Quality control and inspection device using two-dimensional image recognition technology to perform quality control and inspection of connection terminals of electronic components to be tested |
Country Status (1)
Country | Link |
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TW (1) | TWM589280U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI790877B (en) * | 2021-12-28 | 2023-01-21 | 國巨股份有限公司 | Device and method for passive component inspection |
-
2019
- 2019-08-15 TW TW108210800U patent/TWM589280U/en unknown
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI790877B (en) * | 2021-12-28 | 2023-01-21 | 國巨股份有限公司 | Device and method for passive component inspection |
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