TW202108524A - Glass substrate conveying device, and laminated glass manufacturing device and manufacturing method capable of suppressing breakage of a glass substrate - Google Patents
Glass substrate conveying device, and laminated glass manufacturing device and manufacturing method capable of suppressing breakage of a glass substrate Download PDFInfo
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- TW202108524A TW202108524A TW109124778A TW109124778A TW202108524A TW 202108524 A TW202108524 A TW 202108524A TW 109124778 A TW109124778 A TW 109124778A TW 109124778 A TW109124778 A TW 109124778A TW 202108524 A TW202108524 A TW 202108524A
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- roller
- glass substrate
- glass
- guide roller
- transparent conductive
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- 238000005096 rolling process Methods 0.000 claims description 3
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- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
- C03C17/002—General methods for coating; Devices therefor for flat glass, e.g. float glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H20/00—Advancing webs
- B65H20/02—Advancing webs by friction roller
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
- B32B37/1018—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure using only vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H23/00—Registering, tensioning, smoothing or guiding webs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H27/00—Special constructions, e.g. surface features, of feed or guide rollers for webs
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H37/00—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations
- B65H37/04—Article or web delivery apparatus incorporating devices for performing specified auxiliary operations for securing together articles or webs, e.g. by adhesive, stitching or stapling
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
- C03B35/14—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
- C03B35/16—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by roller conveyors
- C03B35/162—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by roller conveyors combined with means for thermal adjustment of the rollers, e.g. cooling
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
- C03B35/14—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
- C03B35/16—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by roller conveyors
- C03B35/18—Construction of the conveyor rollers ; Materials, coatings or coverings thereof
- C03B35/183—Construction of the conveyor rollers ; Materials, coatings or coverings thereof specially adapted for thermal adjustment of the rollers, e.g. insulating, heating, cooling thereof
- C03B35/184—Cooling
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/22—Surface treatment of glass, not in the form of fibres or filaments, by coating with other inorganic material
- C03C17/23—Oxides
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/541—Heating or cooling of the substrates
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
- C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
- B65H2701/00—Handled material; Storage means
- B65H2701/10—Handled articles or webs
- B65H2701/17—Nature of material
- B65H2701/172—Composite material
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/15—Deposition methods from the vapour phase
- C03C2218/154—Deposition methods from the vapour phase by sputtering
Abstract
Description
本發明係關於一種玻璃基材之搬送裝置、積層玻璃之製造裝置及製造方法,詳細而言係關於一種玻璃基材之搬送裝置、具備該搬送裝置之積層玻璃之製造裝置、及使用該製造裝置之積層玻璃之製造方法。The present invention relates to a conveying device for a glass substrate, a manufacturing device and a manufacturing method for laminated glass, and more specifically, to a conveying device for a glass substrate, a manufacturing device for laminated glass provided with the conveying device, and using the manufacturing device The manufacturing method of laminated glass.
近年來,使用耐熱性優異之薄玻璃基材作為配備於液晶顯示器、有機EL(Electroluminescence,電致發光)顯示器等圖像顯示裝置之光學膜的撓性基材。具體而言,將於薄玻璃基材上形成有銦錫氧化物(ITO)等透明導電層之透明導電性玻璃用作觸控面板膜。In recent years, thin glass substrates with excellent heat resistance have been used as flexible substrates for optical films equipped in image display devices such as liquid crystal displays and organic EL (Electroluminescence) displays. Specifically, transparent conductive glass in which a transparent conductive layer such as indium tin oxide (ITO) is formed on a thin glass substrate is used as a touch panel film.
為了量產此種光學膜而採用輥對輥方式。即,捲繞於捲出輥上,將呈長條且撓性之薄玻璃基材捲出,且使用導輥進行搬送,以濺鍍法等成膜透明導電層等功能層,並利用捲取輥捲取具備薄玻璃基材及功能層之積層玻璃(例如,參照下述專利文獻1)。In order to mass-produce this optical film, a roll-to-roll method is adopted. That is, it is wound on the unwinding roll, the long and flexible thin glass substrate is unrolled, and the guide roll is used for conveying, and the transparent conductive layer and other functional layers are formed by sputtering method, etc., and the winding is used Roll-up laminated glass provided with a thin glass substrate and functional layers (for example, refer to
又,亦揭示有玻璃搬送用輥之表面粗糙度Ra為0.5 μm以下(例如,參照下述專利文獻2)。
[先前技術文獻]
[專利文獻]In addition, it has also been disclosed that the surface roughness Ra of the glass transport roller is 0.5 μm or less (for example, refer to
[專利文獻1]日本專利特開2014-109073號公報 [專利文獻2]日本專利特開2009-84100號公報[Patent Document 1] Japanese Patent Laid-Open No. 2014-109073 [Patent Document 2] Japanese Patent Laid-Open No. 2009-84100
[發明所欲解決之問題][The problem to be solved by the invention]
然而,專利文獻1所記載之薄玻璃基材相較於先前之塑膠基材而言,表面平坦(平滑)。因此,易產生與導輥密接之現象(黏連)。尤其是將專利文獻2所記載之玻璃搬送用輥用作導輥之情形時,該玻璃搬送用輥之表面粗糙度Ra較小,為0.5 μm,故更易產生黏連。However, the thin glass substrate described in
若薄玻璃基材黏連於導輥,則需較大之力使薄玻璃基材自導輥離開。如此一來,存在較塑膠基材更脆弱之薄玻璃基材易破損之不良情況。因此,若薄玻璃基材破損,則無法以輥對輥方式搬送薄玻璃基材。If the thin glass substrate adheres to the guide roller, greater force is required to make the thin glass substrate separate from the guide roller. As a result, there is a disadvantage that the thin glass substrate, which is more fragile than the plastic substrate, is easily damaged. Therefore, if the thin glass substrate is damaged, the thin glass substrate cannot be transported in a roll-to-roll system.
再者,本說明書中,「破損」係指薄玻璃基材遍及其厚度方向整體被撕裂,與下述「擦傷」有所區別。Furthermore, in this specification, "damage" means that the thin glass substrate is torn in its entire thickness direction, which is different from the following "scratch".
本發明提供一種可抑制玻璃基材之破損之玻璃基材之搬送裝置、積層玻璃之製造裝置及製造方法。 [解決問題之技術手段]The present invention provides a glass substrate conveying device, a laminated glass manufacturing device, and a manufacturing method that can suppress damage to the glass substrate. [Technical means to solve the problem]
本發明(1)包含一種玻璃基材之搬送裝置,其具備:捲出輥,其以捲出具有可撓性之玻璃基材之方式構成;捲取輥,其以捲取上述玻璃基材之方式構成;及導輥,其配置於上述玻璃基材之搬送方向上之上述捲出輥及上述捲取輥之間;且上述導輥之表面具有1.0 μm以上之最大高度粗糙度Rz。The present invention (1) includes a glass substrate conveying device, which is provided with: a take-up roller configured to take up a flexible glass substrate; a take-up roller to take up the glass substrate And a guide roller, which is arranged between the unwinding roller and the winding roller in the conveying direction of the glass substrate; and the surface of the guide roller has a maximum height roughness Rz of 1.0 μm or more.
該玻璃基材之搬送裝置中,由於導輥具有1.0 μm以上之較大之最大高度粗糙度Rz,故可抑制玻璃基材密接於導輥表面之黏連。因此,可抑制玻璃基材自導輥離開時之破損。因此,可於捲出輥及捲取輥之間確實地搬送玻璃基材。In the glass substrate conveying device, since the guide roller has a large maximum height roughness Rz of 1.0 μm or more, the adhesion of the glass substrate to the surface of the guide roller can be suppressed. Therefore, it is possible to suppress breakage of the glass substrate when it is separated from the guide roller. Therefore, the glass base material can be reliably conveyed between the unwinding roll and the winding roll.
本發明(2)包含如(1)之玻璃基材之搬送裝置,其中上述導輥之表面具有50 μm以下之最大高度粗糙度Rz。The present invention (2) includes the glass substrate conveying device according to (1), wherein the surface of the guide roller has a maximum height roughness Rz of 50 μm or less.
然而,若導輥表面之最大高度粗糙度Rz超過50 μm,則於玻璃基材與導輥表面接觸時,玻璃基材之表面會被擦傷。However, if the maximum height roughness Rz of the surface of the guide roller exceeds 50 μm, the surface of the glass substrate will be scratched when the glass substrate is in contact with the surface of the guide roller.
再者,本說明書中,所謂「擦傷」係於玻璃基材之表面形成凹部等而使玻璃基材之表面受損傷,與玻璃基材遍及厚度方向整體被撕裂之「破損」有所區別。Furthermore, in this specification, the so-called "scratch" refers to the formation of recesses on the surface of the glass substrate to damage the surface of the glass substrate, which is different from the "breakage" in which the glass substrate is torn in the entire thickness direction.
然而,該玻璃基材之搬送裝置中,由於導輥具有50 μm以下之最大高度粗糙度Rz,故可抑制玻璃基材之表面擦傷。However, in the glass substrate conveying device, since the guide roller has a maximum height roughness Rz of 50 μm or less, the surface scratches of the glass substrate can be suppressed.
本發明(3)包含如(1)或(2)之玻璃基材之搬送裝置,其進而具備驅動輥,該驅動輥配置於上述搬送方向上之上述捲出輥及上述捲取輥之間,且構成為被賦予用以搬送上述玻璃基材之動力,上述驅動輥之表面具有0.8 μm以下之最大高度粗糙度Rz。The present invention (3) includes the glass substrate conveying device according to (1) or (2), further comprising a driving roller arranged between the unwinding roller and the winding roller in the conveying direction, And it is configured to be given power for conveying the glass substrate, and the surface of the driving roller has a maximum height roughness Rz of 0.8 μm or less.
該玻璃基材之搬送裝置由於具備驅動輥,故可更進一步確實地搬送玻璃基材。Since this glass base material conveying device is equipped with a drive roller, it can convey a glass base material more reliably.
而且,由於驅動輥之表面具有0.8 μm以下之最大高度粗糙度Rz,故可抑制驅動輥之表面相對於玻璃基材滑動,可控制施加至玻璃基材之張力,可將驅動輥之旋轉確實地轉換為玻璃基材之搬送,從而更進一步確實地搬送玻璃基材。Moreover, since the surface of the drive roller has a maximum height roughness Rz of 0.8 μm or less, the surface of the drive roller can be prevented from sliding relative to the glass substrate, the tension applied to the glass substrate can be controlled, and the rotation of the drive roller can be reliably Switch to the transportation of the glass substrate, so that the glass substrate can be transported more reliably.
本發明(4)包含一種積層玻璃之製造裝置,其具備:如(1)至(3)中任一項之搬送裝置;及成膜裝置,其配置於上述搬送方向上之上述捲出輥及上述捲取輥之間,且構成為將功能層於真空下設置於上述玻璃基材。The present invention (4) includes a manufacturing device for laminated glass, which is provided with: the conveying device according to any one of (1) to (3); and a film forming device, which is arranged in the above-mentioned unwinding roller and the above-mentioned conveying direction Between the above-mentioned winding rollers, it is configured to provide a functional layer on the above-mentioned glass substrate under vacuum.
該積層玻璃基材之搬送裝置由於具備上述搬送裝置及成膜裝置,故可抑制玻璃基材之破損,並且將功能層設置於玻璃基材。因此,可確實地製造積層玻璃。Since the conveying device of the laminated glass substrate is provided with the aforementioned conveying device and the film forming device, it is possible to suppress the breakage of the glass substrate and to provide a functional layer on the glass substrate. Therefore, laminated glass can be manufactured reliably.
本發明(5)包含一種積層玻璃之製造方法,其係使用如(4)之積層玻璃之製造裝置來製造積層玻璃的方法,且具備以下步驟:將上述玻璃基材自上述捲出輥捲出;藉由上述導輥導引上述玻璃基材;藉由上述成膜裝置將上述功能層於真空下設置於上述玻璃基材;及藉由上述捲取輥捲取具備上述玻璃基材及上述功能層之積層玻璃。The present invention (5) includes a method for manufacturing laminated glass, which is a method for manufacturing laminated glass using the manufacturing device for laminated glass as in (4), and includes the following steps: rolling out the glass substrate from the unwinding roll The glass substrate is guided by the guide roller; the functional layer is set on the glass substrate by the film forming device under vacuum; and the glass substrate and the function are wound by the winding roller Layers of laminated glass.
該積層玻璃之製造方法由於使用上述積層玻璃之搬送裝置,故可抑制玻璃基材黏連於導輥。因此,可抑制玻璃基材自導輥離開時之破損,並且進而將功能層設置於玻璃基材,從而可確實地製造積層玻璃。 [發明之效果]Since the manufacturing method of this laminated glass uses the conveying device of the above-mentioned laminated glass, it can suppress that a glass base material adheres to a guide roller. Therefore, it is possible to suppress breakage of the glass base material when it is separated from the guide roll, and furthermore, to provide a functional layer on the glass base material, so that laminated glass can be reliably manufactured. [Effects of Invention]
本發明之玻璃基材之搬送裝置可抑制玻璃基材之破損。The glass substrate conveying device of the present invention can suppress the damage of the glass substrate.
根據本發明之積層玻璃之製造裝置及製造方法,可抑制玻璃基材之破損,並且將功能層設置於玻璃基材。According to the manufacturing apparatus and manufacturing method of laminated glass of the present invention, the damage of the glass substrate can be suppressed, and the functional layer can be provided on the glass substrate.
1.搬送成膜裝置 參照圖1,說明本發明之製造裝置之一實施方式之搬送成膜裝置。1. Transport the film forming device Referring to Fig. 1, a transport film forming apparatus which is an embodiment of the manufacturing apparatus of the present invention will be described.
圖1所示之搬送成膜裝置10一面搬送玻璃基材1一面於其厚度方向一面51上設置透明導電層(功能層之一例)2(參照圖2C),從而製造透明導電性玻璃(積層玻璃之一例)3。具體而言,搬送成膜裝置10自卷狀之搬送基材4(下述)剝離第1保護材5而單獨搬送玻璃基材1,繼之,於玻璃基材1上設置透明導電層2而製造透明導電性玻璃3,繼之,於透明導電性玻璃3上積層第2保護材6並捲繞成卷狀。The transport
搬送成膜裝置10具備搬送裝置11、濺鍍裝置(成膜裝置之一例)12、及冷卻裝置13。進而,搬送裝置11具備捲出部14、去靜電部15、及捲取部16。再者,去靜電部15具備第1去靜電部17及第2去靜電部18。搬送成膜裝置10自搬送方向上游側(以下,省略為「上游側」)朝搬送方向下游側(以下,省略為「下游側」)依序具備捲出部14、第1去靜電部17、濺鍍裝置12、冷卻裝置13、第2去靜電部18、及捲取部16。以下,對其等進行詳細敍述。The transport
捲出部14於搬送裝置11中配置於最上游側。捲出部14捲出長條之搬送基材4。捲出部14具備捲出輥21、第1驅動輥(驅動輥之一例)22、保護材捲取輥23、及捲出外殼24。The
於捲出輥21上,置有卷狀之搬送基材4。即,於捲出輥21之表面(周面),捲繞有搬送方向上為長條之搬送基材4。捲出輥21為圓柱構件,其具有沿搬送方向旋轉之旋轉軸,且於寬度方向上延伸。再者,本實施方式中,下述各種輥(捲出輥21、第1~第2驅動輥(22、40)、保護材捲取輥23、第1~第4導輥(26、28、31、38)、保護材導輥43、第1~第2冷卻輥(34、35)、捲取輥41、保護材捲出輥42、夾輥44)均為圓柱構件,即,具有沿搬送方向旋轉之旋轉軸,且於寬度方向(與搬送方向及厚度方向正交之方向)上延伸。On the
捲出輥21構成為,由外部動力等驅動而沿圖1所示之箭頭方向旋轉。The
第1驅動輥22配置於捲出輥21之下游側。第1驅動輥22構成為自外部被賦予用以搬送玻璃基材1之動力。藉此,第1驅動輥22基於上述外部動力而沿圖1所示之箭頭方向旋轉。具體而言,於第1驅動輥22之旋轉軸之端部,設置有齒輪(未圖示),於齒輪上,連接有用以使第1驅動輥22沿箭頭方向旋轉之馬達(未圖示)。第1驅動輥22藉由馬達之驅動力而旋轉。The
藉此,第1驅動輥22將置於捲出輥21上之搬送基材4之玻璃基材1搬送至第1去靜電部17。Thereby, the
又,該第1驅動輥22不同於與夾輥44鄰接配置之第2驅動輥40(下述),構成為於與玻璃基材1之厚度方向一面(接觸面)51(參照圖2B)接觸之狀態下,玻璃基材1之厚度方向另一面(非接觸面)52(參照圖2B)不與其他搬送構件(夾輥44等)接觸。In addition, the
作為第1驅動輥22之材料,並未特別限定,可列舉例如金屬、樹脂、陶瓷等,較佳可列舉金屬。The material of the
第1驅動輥22之表面例如平坦,具體而言,例如具有1 μm以下、較佳為0.8 μm以下、更佳為0.5 μm以下、進而較佳為0.3 μm以下之最大高度粗糙度Rz。又,第1驅動輥22之表面例如較佳為具有0.001 μm以上之最大高度粗糙度Rz。再者,第1驅動輥22之表面之最大高度粗糙度Rz係基於JIS B 0601(2009)而測定。下述其他輥之表面之最大高度粗糙度Rz亦基於與上述相同之方法而測定。The surface of the
若第1驅動輥22之表面之最大高度粗糙度Rz為上述上限以下,則可抑制第1驅動輥22之表面相對於玻璃基材1滑動,可控制施加至玻璃基材1之張力,且可將第1驅動輥22之材料之旋轉確實地轉換為玻璃基材1之搬送,從而可更進一步確實地搬送玻璃基材1。If the maximum height roughness Rz of the surface of the
若第1驅動輥22之表面之最大高度粗糙度Rz為上述下限以上,則可確實地搬送玻璃基材1。If the maximum height roughness Rz of the surface of the
為了將第1驅動輥22之表面設定為上述最大高度粗糙度Rz,例如對驅動輥22之表面進行平坦化處理。作為平坦化處理,並未特別限定,例如可列舉電鍍、無電解鍍覆、研磨等。或者,亦可預先準備具有上述最大高度粗糙度Rz之表面之第1驅動輥22。In order to set the surface of the
保護材捲取輥23配置於捲出輥21之附近。保護材捲取輥23使第1保護材5自搬送基材4剝離(離開),並且捲取第1保護材5。保護材捲取輥23構成為,由外部動力等驅動而沿圖1所示之箭頭方向旋轉。The protective
捲出外殼24於其內部收容捲出輥21、第1驅動輥22及保護材捲取輥23。捲出外殼24係以將其內部調節成真空狀態之方式構成。具體而言,於捲出外殼24上,連接有將其內部之空氣排出至外部之真空泵(未圖示)。再者,本說明書中,所謂真空狀態係指例如氣壓為0.1 Pa以下、較佳為1×10-3
Pa以下之狀態。The unwinding housing 24 accommodates the unwinding
第1去靜電部17以與捲出部14鄰接之方式配置於捲出部14之下游側。第1去靜電部17對玻璃基材1去除靜電。第1去靜電部17具備第1去靜電機25、第1導輥(導輥之一例)26、及第1去靜電外殼27。The first
第1去靜電機25使玻璃基材1所帶之電減少。第1去靜電機25配置於第1驅動輥22之下游側且第1導輥26之上游側。作為第1去靜電機25,可列舉例如電暈放電式去靜電機、游離輻射式去靜電機等。The first
第1導輥26將自第1驅動輥22通過第1去靜電機25搬送之玻璃基材1引導(guide)至濺鍍裝置12之第2導輥28。第1導輥26配置於第1去靜電機25之下游側且第2導輥28之上游側。The
作為第1導輥26之材料,並未特別限定,可列舉例如金屬、樹脂、陶瓷等,較佳可列舉金屬。The material of the
第1導輥26之表面具有1.0 μm以上之最大高度粗糙度Rz。The surface of the
於第1導輥26之表面具有未達1.0 μm之最大高度粗糙度Rz之情形時,玻璃基材1會黏連於第1導輥26之表面。因此,為了使玻璃基材1自第1導輥26離開,需要較大之張力。若對玻璃基材1施加較大之張力,則玻璃基材1會破損。When the surface of the
第1導輥26之表面具有較佳為2 μm以上、更佳為5 μm以上、進而較佳為10 μm以上之最大高度粗糙度Rz,又,具有例如較佳為100 μm以下、更佳為50 μm以下、進而較佳為30 μm以下之最大高度粗糙度Rz。The surface of the
若第1導輥26之表面為上述下限以上,則可有效地抑制玻璃基材1黏連於第1導輥26之表面。因此,無需對搬送中之玻璃基材1施加較大張力,因此,第1導輥26可確實地引導玻璃基材1。If the surface of the
另一方面,若第1導輥26之表面為上述上限以下,則可抑制玻璃基材1之表面(厚度方向一面及另一面)擦傷。On the other hand, if the surface of the
為了設定第1導輥26之表面之最大高度粗糙度Rz,例如,準備表面平坦之第1導輥26,其後,對第1導輥26之表面進行粗化處理(粗面化)。作為粗化處理,並未特別限定。作為粗化處理之具體例,可列舉例如熔射(例如,日本專利特開2017-0665189號公報等中所記載之熔射皮膜之形成)、無電解鍍覆(例如,日本專利特開2016-103138號公報等中所記載之熔射皮膜之形成)、噴砂、蝕刻等。或者,亦可準備預先具有上述最大高度粗糙度Rz之表面之第1導輥26。In order to set the maximum height roughness Rz of the surface of the
第1去靜電外殼27於其內部收容第1去靜電機25及第1導輥26。第1去靜電外殼27係以將其內部調節成真空狀態之方式構成。The first
濺鍍裝置12以與第1去靜電部17鄰接之方式配置於第1去靜電部17之下游側。濺鍍裝置12於成膜區域33對玻璃基材1實施濺鍍,而形成透明導電層2(參照圖2C)。The sputtering
濺鍍裝置12具備第2導輥(導輥之一例)28、濺鍍靶29、加熱機30、第3導輥(導輥之一例)31、及濺鍍外殼32。The sputtering
第2導輥28將自第1導輥26搬送之玻璃基材1引導(guide)至成膜區域33。第2導輥28配置於第1導輥26之下游側且濺鍍靶29之上游側。第2導輥28之構成與第1導輥26之構成相同。The
濺鍍靶29為透明導電層2之原材料。濺鍍靶29於第2導輥28之下游側且第3導輥31之上游側與玻璃基材1隔開間隔地對向配置。濺鍍靶29面向玻璃基材1之厚度方向一面51。The
作為濺鍍靶29之材料,可列舉例如包含選自由In、Sn、Zn、Ga、Sb、Nb、Ti、Si、Zr、Mg、Al、Au、Ag、Cu、Pd、W所組成之群中之至少1種金屬之金屬氧化物。具體而言,可列舉例如銦錫複合氧化物(ITO)等含銦氧化物、例如銻錫複合氧化物(ATO)等含銻氧化物等,較佳可列舉含銦氧化物,更佳可列舉ITO。Examples of materials for the
加熱機30對玻璃基材1及自其獲得之透明導電性玻璃3進行加熱。於第2導輥28之下游側且第3導輥31之上游側,與玻璃基材1隔開間隔地配置。又,以玻璃基材1為基準,加熱機30對向配置於與濺鍍靶29相反側。加熱機30面向玻璃基材1之厚度方向另一面52。The
成膜區域33被劃分在第2導輥28與第3導輥31之搬送方向中途。於成膜區域33,配置有濺鍍靶29及加熱機30。The
第3導輥31將成膜後之玻璃基材1(具體而言為於厚度方向上具備玻璃基材1及透明導電層2之透明導電性玻璃3)(參照圖2C)引導(guide)至冷卻裝置13之第1冷卻輥34。第3導輥31配置於濺鍍靶29之下游側且第1冷卻輥34(下述)之上游側。第3導輥31之構成與第1導輥26之構成相同。The
濺鍍外殼32收容第2導輥28、濺鍍靶29、加熱機30及第3導輥31。濺鍍外殼32構成包含成膜區域33之成膜室。濺鍍外殼32係以將其內部調節成真空狀態之方式構成。再者,雖未圖示,但濺鍍裝置12具備用以實施濺鍍之其他元件(陽極、陰極、Ar氣體導入器件等)。作為濺鍍裝置12,具體而言,可列舉例如二極型濺鍍裝置、電子回旋共振型濺鍍裝置、磁控型濺鍍裝置、離子束型濺鍍裝置等。The sputtering
冷卻裝置13以與濺鍍裝置12鄰接之方式配置於濺鍍裝置12之下游側。冷卻裝置13將經濺鍍裝置12加熱後之透明導電性玻璃3冷卻。冷卻裝置13具備第1冷卻輥34、第2冷卻輥35、及冷卻外殼36。The
第1冷卻輥34於冷卻裝置13中配置於上游側。第2冷卻輥35配置於第1冷卻輥34之下游側。第1冷卻輥34及第2冷卻輥35分別構成為,由外部動力等驅動而沿圖1所示之箭頭方向旋轉。The
構成為,第1冷卻輥34及第2冷卻輥35之表面溫度例如為280℃以下,較佳為150℃以下,又,例如維持於40℃以上,較佳為100℃以上。The surface temperature of the
冷卻外殼36於其內部收容第1冷卻輥34及第2冷卻輥35。冷卻外殼36係以將其內部調節成真空狀態之方式構成。The cooling
第2去靜電部18以與冷卻裝置13鄰接之方式配置於冷卻裝置13之下游側。第2去靜電部18對透明導電性玻璃3去除靜電。第2去靜電部18具備第2去靜電機37、第4導輥(導輥之一例)38、及第2去靜電外殼39。The second
第2去靜電機37使玻璃基材1所帶之電減少。第2去靜電機37配置於第2冷卻輥35之下游側且第4導輥38之上游側。第2去靜電機37之構成與第1去靜電機25之構成相同。The second
第4導輥38將自第2冷卻輥35通過第2去靜電機37搬送之透明導電性玻璃3引導(guide)至捲取部16之第2驅動輥40。第4導輥38配置於第2去靜電機37之下游側且第2驅動輥40之上游側。第4導輥38之構成與第1導輥26之構成相同。The
第2去靜電外殼39於其內部收容第2去靜電機37及第4導輥38。第2去靜電外殼39係以將其內部調節成真空狀態之方式構成。The second
捲取部16於搬送裝置11中配置於最下游側,且以與第2去靜電機37鄰接之方式配置於第2去靜電機37之下游側。捲取部16將透明導電性玻璃3與第2保護材6(參照圖2D)一起捲取。捲取部16具備第2驅動輥40、捲取輥41、保護材捲出輥42、保護材導輥43、夾輥44、及捲取外殼45。The winding
第2驅動輥40配置於第4導輥38之下游側且捲取輥41之上游側。第2驅動輥40構成為自外部被賦予用以搬送包含玻璃基材1之透明導電性玻璃3之動力。藉此,第2驅動輥40基於上述外部動力而沿圖1所示之箭頭方向旋轉。藉此,第2驅動輥40將透明導電性玻璃3搬送至捲取輥41。The
但是,第2驅動輥40構成為,於與透明導電性玻璃3之厚度方向一面53接觸之狀態下,第2保護材6之厚度方向另一面54與夾輥44接觸。亦即,第2驅動輥40及夾輥44構成夾持機構。However, the
第2驅動輥40之表面之最大高度粗糙度Rz並未特別限定。第2驅動輥40之表面之最大高度粗糙度Rz例如大於第1驅動輥22之表面之最大高度粗糙度Rz,具體而言,超過0.8 μm。The maximum height roughness Rz of the surface of the
捲取輥41捲取自第2驅動輥40與夾輥44之間搬送之透明導電性玻璃3及第2保護材6之積層體7(下述)。捲取輥41構成為,由外部動力等驅動而沿圖1所示之箭頭方向旋轉。The winding
保護材捲出輥42配置於捲取輥41之附近。於保護材捲出輥42上,置有捲狀之第2保護材6。即,於保護材捲出輥42之表面,捲繞有搬送方向上為長條之第2保護材6。保護材捲出輥42構成為,由外部動力等驅動而沿圖1所示之箭頭方向旋轉。保護材捲出輥42將第2保護材6捲出至保護材導輥43。The protective
保護材導輥43將自保護材捲出輥42捲出之第2保護材6引導至夾輥44。保護材導輥43配置於保護材捲出輥42與夾輥44之搬送方向中途。The protection
夾輥44與第2驅動輥40一起使第2保護材6積層於透明導電性玻璃3。夾輥44與第2驅動輥40對向配置。夾輥44構成為,其表面能夠與第2驅動輥40之表面將透明導電性玻璃3及第2保護材6夾住並且進行層壓。夾輥44之材料可列舉例如橡膠等彈性體。The
捲取外殼45於其內部收容第2驅動輥40、捲取輥41、保護材捲出輥42、保護材導輥43及夾輥44。捲取外殼45係以將其內部調節成真空狀態之方式構成。The winding
2.透明導電性玻璃之製造方法
參照圖1及圖2A~圖2D,對使用搬送成膜裝置10製造透明導電性玻璃3之方法進行說明。透明導電性玻璃3之製造方法具備:準備步驟,其係準備搬送基材4;剝離步驟,其係自玻璃基材1將第1保護材5剝離;搬送步驟,其係藉由第1~第2驅動輥(22、40)搬送玻璃基材1;引導步驟,其係藉由第1~第4導輥(26、28、31、38)引導玻璃基材1;成膜步驟,其係將透明導電層2於真空下設置於玻璃基材1;冷卻步驟,其係冷卻透明導電性玻璃3;及捲取步驟,其係將透明導電性玻璃3捲取至捲取輥41上。以下,詳細敍述各步驟。2. Manufacturing method of transparent
首先,於捲出輥21上準備搬送基材4(準備步驟)。具體而言,準備搬送基材4,且置於捲出輥21上。First, the
搬送基材4係帶保護材之玻璃基材,具體而言,朝厚度方向另一側依序具備玻璃基材1與第1保護材5(參照圖2A)。搬送基材4於搬送方向上為長條,且捲繞成卷狀。此種卷狀之搬送基材4可使用公知或市售者。The conveying
玻璃基材1具有膜狀(包含片狀),由透明之玻璃形成。作為玻璃,可列舉例如無鹼玻璃、鈉玻璃、硼矽酸玻璃、鋁矽玻璃等。The
玻璃基材1具有可撓性。The
另一方面,玻璃基材1之機械強度通常較低(脆弱),下述測定之彎曲試驗中之斷裂時之兩端部間距離L例如為15 mm以下、或20 mm以下。On the other hand, the mechanical strength of the
如圖4所示,具體而言,將玻璃基材1切斷加工成長度120 mm,且將其長度方向兩端部卡於隔開間隔對向配置之2個治具81各者之卡住部82。繼而,使2個治具81相互緩慢靠近,獲得玻璃基材1斷裂時2個卡住部82間之長度L作為斷裂時之兩端部間距離L。As shown in Fig. 4, specifically, the
玻璃基材1之厚度方向另一面52平坦。具體而言,玻璃基材1之厚度方向另一面52具有例如1 μm以下、進而0.1 μm以下、進而0.01 μm以下之最大高度粗糙度Rz,又,具有例如0.0001 μm以上之最大高度粗糙度Rz。與上述另一面52同樣,玻璃基材1之厚度方向一面51平坦,且具有上述最大高度粗糙度Rz。The
玻璃基材1之厚度例如為250 μm以下,較佳為200 μm以下,更佳為150 μm以下,進而較佳為100 μm以下,又,例如為10 μm以上,較佳為40 μm以上。The thickness of the
此種玻璃基材1可使用市售品,例如可使用G-leaf系列(日本電氣硝子公司製造)等。Commercially available products can be used for such a
第1保護材5防止於捲出卷狀之玻璃基材1時因玻璃基材1彼此接觸而導致破損。第1保護材5具有膜狀,配置於玻璃基材1之厚度方向另一面52。The first
作為第1保護材5,可列舉例如帶黏著劑之膜、間隔紙等。As the first
帶黏著劑之膜於厚度方向上具備高分子膜與黏著劑層。The film with adhesive has a polymer film and an adhesive layer in the thickness direction.
作為高分子膜,可列舉例如聚酯系膜(聚對苯二甲酸乙二酯膜、聚對苯二甲酸丁二酯膜、聚萘二甲酸乙二酯膜等)、聚碳酸酯系膜、烯烴系膜(聚乙烯膜、聚丙烯膜、環烯烴膜等)、丙烯酸系膜、聚醚碸系膜、聚芳酯系膜、三聚氰胺系膜、聚醯胺系膜、聚醯亞胺系膜、纖維素系膜、及聚苯乙烯系膜。Examples of polymer films include polyester films (polyethylene terephthalate film, polybutylene terephthalate film, polyethylene naphthalate film, etc.), polycarbonate film, Olefin-based film (polyethylene film, polypropylene film, cycloolefin film, etc.), acrylic film, polyether-based film, polyarylate-based film, melamine-based film, polyamide-based film, polyimide-based film , Cellulose-based films, and polystyrene-based films.
黏著劑層為感壓接著劑層,可列舉例如丙烯酸系黏著劑層、橡膠系黏著劑層、矽酮系黏著劑層、聚酯系黏著劑層、聚胺基甲酸酯系黏著劑層、聚醯胺系黏著劑層、環氧系黏著劑層、乙烯基烷基醚系黏著劑層、氟系黏著劑層等。The adhesive layer is a pressure-sensitive adhesive layer, such as acrylic adhesive layer, rubber adhesive layer, silicone adhesive layer, polyester adhesive layer, polyurethane adhesive layer, Polyamide-based adhesive layer, epoxy-based adhesive layer, vinyl alkyl ether-based adhesive layer, fluorine-based adhesive layer, etc.
作為間隔紙,可列舉例如道林紙、日本紙、牛皮紙、玻璃紙、合成紙、面漆紙等。As the spacer paper, for example, Dowling paper, Japanese paper, kraft paper, cellophane, synthetic paper, top coat paper, etc. can be mentioned.
第1保護材5之厚度例如為10 μm以上,較佳為30 μm以上,又,例如為1000 μm以下,較佳為500 μm以下。The thickness of the first
繼之,使搬送成膜裝置10作動。具體而言,使所有外殼(捲出外殼24、第1去靜電外殼27、濺鍍外殼32、冷卻外殼36、第2去靜電外殼39、捲取外殼45)為真空,並且使所有驅動輥(捲出輥21、第1~第2驅動輥(22、40)、保護材捲取輥23、第1~第2冷卻輥(34、35)、捲取輥41、保護材捲出輥42)旋轉驅動。又,亦使去靜電部15(第1去靜電機25及第2去靜電機37)、冷卻裝置13、濺鍍裝置12等作動。藉此,將搬送基材4搬送至下游側(搬送步驟),並且依序實施剝離步驟、成膜步驟、冷卻步驟、及捲取步驟。又,藉由所有導輥(第1導輥26、第2導輥28、第3導輥31、第4導輥38)、保護材捲取輥23、保護材捲出輥42、保護材導輥43、及夾輥44之旋轉而實施引導步驟。Subsequently, the transport
具體而言,於捲出部14中,搬送基材4被自捲出輥21捲出。此時,第1保護材5自玻璃基材1剝離(剝離步驟)。第1保護材5捲取至保護材捲取輥23上。另一方面,玻璃基材1單獨由第1驅動輥22搬送至第1去靜電部17(參照圖2B)(搬送步驟)。於玻璃基材1之厚度方向一面51與第1驅動輥22接觸之狀態下,玻璃基材1之厚度方向另一面52(非接觸面52)不與其他構件接觸。玻璃基材1即便與第1驅動輥22接觸而帶電,亦可藉由第1去靜電部17之第1去靜電機25作動而去除靜電。Specifically, in the unwinding
繼而,玻璃基材1由第1導輥26引導至濺鍍裝置12(引導步驟)。Then, the
繼而,於濺鍍裝置12中,玻璃基材1由第2導輥28引導至成膜區域33(引導步驟)。於成膜區域33,對玻璃基材1實施濺鍍。作為濺鍍,具體而言,可列舉二極濺鍍法、電子回旋共振濺鍍法、磁控濺鍍法、離子束濺鍍法等。濺鍍時之氣壓(即,成膜區域33之氣壓)為真空,較佳為未達1.0 Pa,更佳為0.5 Pa以下。Then, in the
藉此,於成膜區域33中,在玻璃基材1之厚度方向一面51成膜透明導電層2,而製造出朝厚度方向一側依序具備玻璃基材1及透明導電層2之透明導電性玻璃3(參照圖2C)(成膜步驟)。Thereby, in the film-forming
又,與濺鍍同時,透明導電性玻璃3由加熱機30加熱。In addition, at the same time as sputtering, the transparent
由加熱機30加熱之透明導電性玻璃3之表面溫度例如為200℃以上,較佳為300℃以上,更佳為400℃以上,又,例如為800℃以下,較佳為600℃以下。藉此,例如於透明導電層2之材料為ITO之情形時,可與透明導電層2之成膜同時地使透明導電層2於高溫下結晶化,從而可提高透明導電層2之導電性。The surface temperature of the transparent
其後,透明導電性玻璃3由第3導輥31引導至冷卻裝置13(引導步驟)。After that, the transparent
於冷卻裝置13中,透明導電性玻璃3依序接觸第1冷卻輥34及第2冷卻輥35而被冷卻(冷卻步驟)。In the
各冷卻輥(34、35)之表面溫度例如為280℃以下,較佳為150℃以下,又,例如為40℃以上。The surface temperature of each cooling roll (34, 35) is, for example, 280°C or lower, preferably 150°C or lower, and, for example, 40°C or higher.
此時,就擴大透明導電性玻璃3與冷卻輥34、35之接觸面積(進而提高冷卻效率)之觀點而言,以將連結第1冷卻輥34之旋轉軸與第2冷卻輥35之旋轉軸之線段橫切之方式搬送透明導電性玻璃3。At this time, from the viewpoint of enlarging the contact area between the transparent
此時,透明導電性玻璃3之玻璃基材1中,其厚度方向另一面52直接接觸第2冷卻輥35。另一方面,透明導電性玻璃3之透明導電層2中,其厚度方向一面53直接接觸第1冷卻輥34。其後,透明導電性玻璃3自冷卻裝置13被搬送至第2去靜電部18。At this time, in the
此時,透明導電性玻璃3之厚度方向另一面52(玻璃基材1之厚度方向另一面52)中,即便因與第2冷卻輥35之摩擦而產生帶電,亦可藉由第2去靜電部18之第2去靜電機37作動而去除靜電。再者,於透明導電性玻璃3之厚度方向一面53(透明導電層2之厚度方向一面53),由於透明導電層2為導電性,故即便與第1冷卻輥34摩擦,通常亦不會帶電。At this time, on the
其後,透明導電性玻璃3由第4導輥38引導至捲取部16(引導步驟)。After that, the transparent
於捲取部16中,第2保護材6被自保護材捲出輥42捲出,由保護材導輥43引導,而搬送至夾輥44。In the winding
另一方面,透明導電性玻璃3與第2保護材6一起通過第2驅動輥40與夾輥44之間,將第2保護材6層壓至透明導電性玻璃3之厚度方向另一面52。On the other hand, the transparent
於積層體7之透明導電性玻璃3之厚度方向一面53接觸第2驅動輥40之狀態下,積層體7中之第2保護材6之厚度方向另一面54(接觸面54)接觸夾輥44(被加壓)。In the state where one
其後,透明導電性玻璃3與第2保護材6一起被捲取至捲取輥41上(捲取步驟)。具體而言,將具備透明導電性玻璃3、及配置於其厚度方向另一面52(與透明導電層2相反側之表面52)之第2保護材6的積層體7(參照圖2D)捲繞成卷狀。積層體7朝厚度方向一側依序具備第2保護材6、玻璃基材1及透明導電層2。After that, the transparent
3.透明導電性玻璃之用途
透明導電性玻璃3例如用於圖像顯示裝置等光學裝置。將透明導電性玻璃3配備於圖像顯示裝置(具體而言為具有LCD(liquid crystal display,液晶顯示器)模組、有機EL模組等圖像顯示元件之圖像顯示裝置)之情形時,透明導電性玻璃3例如用作觸控面板用基材、抗反射基材等,較佳為用作觸控面板用基材。作為觸控面板之形式,可列舉光學方式、超音波方式、靜電電容方式、電阻膜方式等各種方式,尤其適宜用於靜電電容方式之觸控面板。3. Purpose of transparent conductive glass
The transparent
4.一實施方式之作用效果
而且,該搬送裝置11中,第1~第4導輥(26、28、31、38)之各者具有1.0 μm以上之較大之最大高度粗糙度Rz。因此,可抑制玻璃基材1密接於第1~第4導輥(26、28、31、38)各者之表面之黏連。因此,可抑制玻璃基材1自第1~第4導輥(26、28、31、38)之各者離開時之破損。因此,可將玻璃基材1於捲出輥21及捲取輥41之間確實地搬送。4. The effect of an implementation method
In addition, in the conveying
另一方面,若第1~第4導輥(26、28、31、38)各者之表面之最大高度粗糙度Rz超過50 μm,則於玻璃基材1接觸第1~第4導輥(26、28、31、38)各者之表面時,玻璃基材1之表面(厚度方向一面51及另一面52)會被擦傷。On the other hand, if the maximum height roughness Rz of the surface of each of the first to fourth guide rollers (26, 28, 31, 38) exceeds 50 μm, the first to fourth guide rollers ( 26, 28, 31, 38) the surface of the glass substrate 1 (the one
然而,於該搬送裝置11中,第1~第4導輥(26、28、31、38)之各者具有50 μm以下之最大高度粗糙度Rz之情形時,可抑制玻璃基材1之表面擦傷。However, when each of the first to fourth guide rollers (26, 28, 31, 38) has a maximum height roughness Rz of 50 μm or less in the conveying
搬送裝置11進而具備第1~第2驅動輥(22、40)之各者,故可更進一步確實地搬送玻璃基材1。The conveying
而且,於第1~第2驅動輥(22、40)各者之表面具有0.8 μm以下之最大高度粗糙度Rz之情形時,可抑制第1~第2驅動輥(22、40)各者之表面相對於玻璃基材1滑動,且可將第1~第2驅動輥(22、40)各者之旋轉確實地轉換為玻璃基材1之搬送,從而更進一步確實地搬送玻璃基材1。Moreover, when the surface of each of the first to second drive rollers (22, 40) has a maximum height roughness Rz of 0.8 μm or less, it is possible to suppress the difference between the first to second drive rollers (22, 40) The surface slides with respect to the
又,該搬送成膜裝置10由於具備搬送裝置11及濺鍍裝置12,故可抑制玻璃基材1破損,並且可將透明導電層2設置於玻璃基材1。因此,可確實地製造透明導電性玻璃3。In addition, since the transport
又,透明導電性玻璃3之製造方法由於使用上述搬送成膜裝置10,故可抑制玻璃基材1黏連於第1~第4導輥(26、28、31、38)。因此,可抑制玻璃基材1自第1~第4導輥(26、28、31、38)離開時之破損,並且進而可將透明導電層2設置於玻璃基材1而確實地製造積層體7。Moreover, since the manufacturing method of the transparent
4.變化例 以下各變化例中,對與上述一實施方式相同之構件及步驟標註相同之參照符號,並省略其詳細說明。又,除特別記載以外,各變化例可發揮與一實施方式相同之作用效果。進而,可將一實施方式及其變化例適當組合。4. Variations In the following modification examples, the same reference numerals are given to the same components and steps as those of the above-mentioned one embodiment, and detailed descriptions thereof are omitted. In addition, each modified example can exhibit the same effects as those of the first embodiment, except for special descriptions. Furthermore, an embodiment and its modification examples can be appropriately combined.
作為本發明之導輥之一例,例示了第1導輥26、第2導輥28、第3導輥31及第4導輥38這4個,但其數量可為單數亦可為複數(除4以外)。As an example of the guide roller of the present invention, the
又,只要上述4個導輥中之任意至少1個表面具有上述最大高度粗糙度Rz(1.0 μm以上)即可。較佳為,4個導輥中之任一表面均具有上述最大高度粗糙度Rz。In addition, it is only necessary that at least one surface of any of the four guide rollers has the maximum height roughness Rz (1.0 μm or more). Preferably, any surface of the four guide rollers has the above-mentioned maximum height roughness Rz.
又,搬送裝置11具備配置於捲出輥21及捲取輥41之間之第1~第2驅動輥(22、40),但例如雖未圖示,亦可不具備第1~第2驅動輥(22、40)而具備第1~第4導輥(26、28、31、38)。In addition, the conveying
進而,如圖3所示,作為本發明之搬送裝置之一例,亦可例示如下搬送裝置8:不具備濺鍍裝置12、第1驅動輥22及第2驅動輥40(參照圖1)而具備捲出輥21、捲取輥41、及配置於其等之間之第1導輥26。Furthermore, as shown in FIG. 3, as an example of the conveying device of the present invention, the following conveying device 8 can also be exemplified: without the sputtering
又,圖1及圖2所示之實施方式中,例示出透明導電層2作為功能層,但作為功能層,例如雖未圖示,亦可設為例如硬塗層、光學調整層、金屬層(例如,銅層等非透明導電層)等。又,作為功能層,可為1層,亦可為2層以上。In addition, in the embodiment shown in FIGS. 1 and 2, the transparent
圖1所示之實施方式中,例示出濺鍍裝置12作為成膜裝置,但例如雖未圖示,亦可列舉真空蒸鍍裝置、化學蒸鍍裝置等真空成膜裝置等。
[實施例]In the embodiment shown in FIG. 1, the sputtering
以下示出實施例及比較例,更具體地說明本發明。再者,本發明並不限定於任何實施例及比較例。又,以下記載中使用之調配比例(比例)、物性值、參數等具體數值可取代為上述「實施方式」中記載之與其等對應之調配比例(比例)、物性值、參數等相關記載之上限(定義為「以下」、「未達」之數值)或下限(定義為「以上」、「超過」之數值)。Examples and comparative examples are shown below to explain the present invention more specifically. In addition, the present invention is not limited to any Examples and Comparative Examples. In addition, the specific values of the blending ratio (ratio), physical property values, and parameters used in the following descriptions can be replaced with the corresponding blending ratios (ratio), physical property values, parameters, etc., as described in the above-mentioned "embodiment". (Defined as "below", "not reached" value) or lower limit (defined as "above", "over" value).
實施例1
準備一實施方式中所說明之搬送成膜裝置10。基於JIS B 0601(2009)測定第1~第4導輥(26、28、31、38)各者之最大高度粗糙度Rz,結果均為1.0 μm。Example 1
The transport
基於JIS B 0601(2009)測定第1~第2驅動輥(22、40)各者之最大高度粗糙度Rz,結果均為0.2 μm。The maximum height roughness Rz of each of the first to second drive rollers (22, 40) was measured based on JIS B 0601 (2009), and the results were all 0.2 μm.
繼而,將具備厚度50 μm、厚度方向另一面52之最大高度粗糙度Rz為0.001 μm之G-leaf(日本電氣硝子公司製造)、及配置於其厚度方向另一面52之第1保護材5的搬送基材4作為玻璃基材1置於捲出輥21(準備步驟)。Next, a G-leaf (manufactured by Nippon Electric Glass Co., Ltd.) with a thickness of 50 μm and a maximum height roughness Rz of 0.001 μm on the
繼而,依序實施剝離步驟、成膜步驟、冷卻步驟、及捲取步驟。又,藉由第1~第2驅動輥(22、40)實施搬送步驟,藉由第1~第4導輥(26、28、31、38)實施引導步驟。Then, the peeling step, the film forming step, the cooling step, and the winding step are sequentially implemented. In addition, the conveying step is performed by the first to second driving rollers (22, 40), and the guiding step is performed by the first to fourth guide rollers (26, 28, 31, 38).
成膜步驟中,將材料為ITO、厚度為130 nm之透明導電層2形成於玻璃基材1之厚度方向一面51。In the film forming step, a transparent
實施例2~實施例4 按照表1變更第1~第4導輥(26、28、31、38)之表面之最大高度粗糙度Rz,除此之外,以與實施例1相同之方式進行處理。Example 2 ~ Example 4 According to Table 1, the maximum height roughness Rz of the surface of the first to fourth guide rollers (26, 28, 31, 38) was changed, except that the treatment was performed in the same manner as in Example 1.
比較例1~比較例2 按照表1變更第1~第4導輥(26、28、31、38)之表面之最大高度粗糙度Rz,除此之外,以與實施例1相同之方式進行處理,並嘗試搬送玻璃基材1。Comparative example 1 to comparative example 2 According to Table 1, change the maximum height roughness Rz of the surface of the first to fourth guide rollers (26, 28, 31, 38), except that the treatment is performed in the same manner as in Example 1, and try to transport the glass substrate材1.
然而,因第1導輥26上黏連玻璃基材1而導致玻璃基材破損,故其後無法搬送玻璃基材1,結果無法形成透明導電層2,進而亦無法獲得積層體7,進而,亦無法藉由捲取輥41捲取積層體7。However, since the
[評估]
<玻璃基材之破損>
按照以下基準評估實施例1~比較例2各者之玻璃基材1之破損。
○:玻璃基材1未破損。
×:因與導輥黏連而導致玻璃基材破損。[Assessment]
<Damage of glass substrate>
The damage of the
<玻璃基材之厚度方向另一面之擦傷>
利用相機觀察實施例1~比較例2各者之玻璃基材1之厚度方向另一面52,按照以下基準進行評估。
○:於玻璃基材1之厚度方向另一面52未觀察到擦傷。
×:於玻璃基材1之厚度方向另一面52觀察到擦傷。<Scratches on the other side of the glass substrate in the thickness direction>
The
[表1]
再者,上述發明係作為本發明之例示之實施方式而提供,但其僅為例示,不可限定性地解釋。由該技術領域之業者明確之本發明之變化例包含於下述申請專利範圍中。In addition, the above-mentioned invention is provided as an exemplary embodiment of this invention, but it is only an illustration, and cannot be interpreted restrictively. Variations of the present invention that have been clarified by those in this technical field are included in the scope of the following patent applications.
1:玻璃基材 2:透明導電層 3:透明導電性玻璃 4:搬送基材 5:第1保護材 6:第2保護材 7:積層體 8:搬送裝置 10:搬送成膜裝置 11:搬送裝置 12:濺鍍裝置 13:冷卻裝置 14:捲出部 15:去靜電部 16:捲取部 17:第1去靜電部 18:第2去靜電部 21:捲出輥 22:第1驅動輥 23:保護材捲取輥 24:捲出外殼 25:第1去靜電機 26:第1導輥 27:第1去靜電外殼 28:第2導輥 29:濺鍍靶 30:加熱機 31:第3導輥 32:濺鍍外殼 33:成膜區域 34:第1冷卻輥 35:第2冷卻輥 36:冷卻外殼 37:第2去靜電機 38:第4導輥 39:第2去靜電外殼 40:第2驅動輥 41:捲取輥 42:保護材捲出輥 43:保護材導輥 44:夾輥 45:捲取外殼 51:玻璃基材之厚度方向一面 52:玻璃基材之厚度方向另一面 53:透明導電性玻璃之厚度方向一面 54:第2保護材之厚度方向另一面 81:治具 82:卡住部1: Glass substrate 2: Transparent conductive layer 3: Transparent conductive glass 4: Transport substrate 5: The first protective material 6: The second protective material 7: Laminated body 8: Conveying device 10: Transporting the film forming device 11: Conveying device 12: Sputtering device 13: Cooling device 14: Roll out part 15: Go to the static department 16: Coiling section 17: The first anti-static part 18: The second anti-static part 21: Roll out roller 22: 1st drive roller 23: Protective material take-up roller 24: Roll out the shell 25: The first anti-static machine 26: The first guide roller 27: No. 1 anti-static shell 28: The second guide roller 29: Sputtering target 30: heating machine 31: The third guide roller 32: Sputtering shell 33: Film-forming area 34: 1st cooling roll 35: 2nd cooling roll 36: Cooling shell 37: The second anti-static machine 38: 4th guide roller 39: The second to the static shell 40: 2nd drive roller 41: take-up roller 42: Protective material roll-out roller 43: Protective material guide roller 44: nip roller 45: Coiling shell 51: One side of the thickness direction of the glass substrate 52: The other side of the thickness direction of the glass substrate 53: One side in the thickness direction of transparent conductive glass 54: The other side of the thickness direction of the second protective material 81: Fixture 82: stuck part
圖1表示本發明之製造裝置之一實施方式之搬送成膜裝置。 圖2A~圖2D係由圖1之搬送成膜裝置搬送之搬送物之剖視圖,圖2A表示自捲出輥捲出之第1保護材及玻璃基材,圖2B表示搬送至第1驅動輥之玻璃基材,圖2C表示搬送至冷卻裝置之玻璃基材及透明導電層,圖2D表示被捲取輥捲取之第2保護材、透明導電層及玻璃基材。 圖3表示本發明之搬送裝置之變化例。 圖4表示玻璃基材之彎曲試驗中使用之2個治具。Fig. 1 shows a transport film forming apparatus as an embodiment of the manufacturing apparatus of the present invention. 2A to 2D are cross-sectional views of the conveyed objects conveyed by the conveying film forming device of Fig. 1, Fig. 2A shows the first protective material and glass substrate rolled out from the unwinding roller, and Fig. 2B shows the conveyed material to the first driving roller The glass substrate, FIG. 2C shows the glass substrate and the transparent conductive layer conveyed to the cooling device, and FIG. 2D shows the second protective material, the transparent conductive layer and the glass substrate wound by the winding roller. Fig. 3 shows a modified example of the conveying device of the present invention. Figure 4 shows two jigs used in the bending test of the glass substrate.
1:玻璃基材 1: Glass substrate
3:透明導電性玻璃 3: Transparent conductive glass
4:搬送基材 4: Transport substrate
5:第1保護材 5: The first protective material
6:第2保護材 6: The second protective material
7:積層體 7: Laminated body
10:搬送成膜裝置 10: Transporting the film forming device
11:搬送裝置 11: Conveying device
12:濺鍍裝置 12: Sputtering device
13:冷卻裝置 13: Cooling device
14:捲出部 14: Roll out part
15:去靜電部 15: Go to the static department
16:捲取部 16: Coiling section
17:第1去靜電部 17: The first anti-static part
18:第2去靜電部 18: The second anti-static part
21:捲出輥 21: Roll out roller
22:第1驅動輥 22: 1st drive roller
23:保護材捲取輥 23: Protective material take-up roller
24:捲出外殼 24: Roll out the shell
25:第1去靜電機 25: The first anti-static machine
26:第1導輥 26: The first guide roller
27:第1去靜電外殼 27: No. 1 anti-static shell
28:第2導輥 28: The second guide roller
29:濺鍍靶 29: Sputtering target
30:加熱機 30: heating machine
31:第3導輥 31: The third guide roller
32:濺鍍外殼 32: Sputtering shell
33:成膜區域 33: Film-forming area
34:第1冷卻輥 34: 1st cooling roll
35:第2冷卻輥 35: 2nd cooling roll
36:冷卻外殼 36: Cooling shell
37:第2去靜電機 37: The second anti-static machine
38:第4導輥 38: 4th guide roller
39:第2去靜電外殼 39: The second to the static shell
40:第2驅動輥 40: 2nd drive roller
41:捲取輥 41: take-up roller
42:保護材捲出輥 42: Protective material roll-out roller
43:保護材導輥 43: Protective material guide roller
44:夾輥 44: nip roller
45:捲取外殼 45: Coiling shell
Claims (5)
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