TW202104305A - Surface treatment film, method for producing same, and article - Google Patents

Surface treatment film, method for producing same, and article Download PDF

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TW202104305A
TW202104305A TW108143220A TW108143220A TW202104305A TW 202104305 A TW202104305 A TW 202104305A TW 108143220 A TW108143220 A TW 108143220A TW 108143220 A TW108143220 A TW 108143220A TW 202104305 A TW202104305 A TW 202104305A
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polymer layer
polymer
group
surface treatment
substrate
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TWI813817B (en
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田儀陽一
嶋中之
榊原圭太
辻敬亘
後藤淳
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日商大日精化工業股份有限公司
國立大學法人 京都大學
新加坡南洋理工大學
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • B32B27/30Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F291/00Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00
    • C08F291/04Macromolecular compounds obtained by polymerising monomers on to macromolecular compounds according to more than one of the groups C08F251/00 - C08F289/00 on to halogen-containing macromolecules
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18Manufacture of films or sheets

Abstract

The present invention provides a surface treatment film which is capable of imparting the surfaces of various base materials with durabilities such as wear resistance, friction resistance, chemical resistance, heat resistance and solvent resistance, and which exhibits excellent adhesion to the surfaces of the base materials. A surface treatment film which is provided on the surface of a base material. This surface treatment film has a multilayer structure that comprises a polymer layer (i) that is arranged on the surface side of the base material and a polymer layer (ii) that is formed on the polymer layer (i); the polymer layer (i) contains a first polymer which contains a constituent unit that is derived from a monomer represented by general formula (1) (wherein R1 represents a hydrogen atom or a methyl group; X represents O or NH; R2 represents an arbitrary organic group; each of R3 and R4 represents a hydrogen atom, an alkyl group, an aryl group or an acyl group; and Y represents a chlorine atom or the like); and the polymer layer (ii) contains a second polymer which contains a constituent unit that is derived from a monomer such as an aromatic vinyl monomer, and which is elongated using a functional group of a monomer represented by general formula (1) as the polymerization starting point.

Description

表面處理膜、其製造方法及物品 Surface treatment film, its manufacturing method and article

本發明係關於一種設置於基材之表面上之表面處理膜及其製造方法、以及設置有該表面處理膜之物品。 The present invention relates to a surface treatment film provided on the surface of a substrate, a manufacturing method thereof, and an article provided with the surface treatment film.

作為基材之改質方法,已知有藉由使其末端具有能夠與基材吸附或反應之基之聚合物作用於基材,而於基材表面形成物理性地或化學性地鍵結之聚合物層之方法。又,亦已知有藉由以賦予於基材表面之聚合性基為起點使單體聚合,而形成自基材表面接枝之聚合物層之方法。 As a method for modifying the substrate, it is known that a polymer having a group capable of adsorbing or reacting with the substrate acts on the substrate to form a physical or chemical bond on the surface of the substrate. Polymer layer method. In addition, there is also known a method of forming a polymer layer grafted from the surface of the substrate by polymerizing monomers starting from the polymerizable group provided on the surface of the substrate.

近年來,研究有利用1990年代發展之活性自由基聚合技術於基板上高密度接枝、所謂「濃厚聚合物刷」。於該濃厚聚合物刷中,高分子鏈依1~4nm之間隔高密度接枝於基板上。藉由此種濃厚聚合物刷對基材表面進行改質,可賦予低摩擦性、抑制蛋白質吸附、尺寸排除特性、親水性、撥水性等特徵(例如,專利文獻1及2、非專利文獻1~3)。 In recent years, research has been conducted on the so-called "dense polymer brush" by using the living radical polymerization technology developed in the 1990s to graft high-density onto the substrate. In the dense polymer brush, polymer chains are grafted onto the substrate at a high density at an interval of 1 to 4 nm. By modifying the surface of the substrate with such a thick polymer brush, it is possible to impart features such as low friction, inhibition of protein adsorption, size exclusion properties, hydrophilicity, and water repellency (for example, Patent Documents 1 and 2, Non-Patent Document 1 ~3).

[先前技術文獻] [Prior Technical Literature]

[專利文獻] [Patent Literature]

[專利文獻1]日本專利特開2008-133434號公報 [Patent Document 1] Japanese Patent Laid-Open No. 2008-133434

[專利文獻2]日本專利特開2010-261001號公報 [Patent Document 2] Japanese Patent Laid-Open No. 2010-261001

[非專利文獻] [Non-Patent Literature]

[非專利文獻1]Adv. Polym. Sci., 2006, 197, 1 - 45 [Non-Patent Document 1] Adv. Polym. Sci., 2006, 197, 1-45

[非專利文獻2]J. Am. Chem. Soc., 2005, 127, 15843 - 15847 [Non-Patent Document 2] J. Am. Chem. Soc., 2005, 127, 15843-15847

[非專利文獻3]Polym. Chem., 2012, 3, 148 - 153 [Non-Patent Document 3] Polym. Chem., 2012, 3, 148-153

濃厚聚合物刷(以下亦簡稱為「刷」)係於潤滑、摩擦、磨耗之磨潤學領域表現出低摩擦性。然而,存在因摩擦時使用之潤滑油或溶劑導致刷之聚合物層易自基材表面脫離之情況。濃厚聚合物刷係藉由在形成了屬於單分子膜層之聚合起始基層之後進行聚合而形成。然而,認為由於單分子膜層之鍵結力或密接性較弱,故聚合物層易因摩擦或溶劑而脫離。 The thick polymer brush (hereinafter also referred to as "brush") shows low friction in the field of lubrication, friction, and abrasion. However, there are cases where the polymer layer of the brush is easily detached from the surface of the substrate due to the lubricant or solvent used during friction. The thick polymer brush is formed by polymerization after forming the polymerization starting base layer belonging to the monomolecular film layer. However, it is believed that because the bonding force or adhesion of the monomolecular film layer is weak, the polymer layer is easily detached due to friction or solvents.

又,於形成刷之基材之表面存在凹凸而刷之聚合物層無法完全被覆凹凸之情形時,有未表現出低摩擦性之情況。為了遮蓋基材表面之粗度,亦可對基材表面進行研磨使其變得平滑之後形成刷,但由於增加了研磨基材表面之步驟,故於成本等方面不利。再者,可藉由形成膜厚較厚之刷以遮蓋基材表面之粗度。然而,形成膜厚較厚之刷時需要於高壓條件下(例如100~1,000MPa)下進行活性自由基聚合而接枝於基材表面等特殊之條件或裝置。因此,形成膜厚較厚之刷未必容易,且於成本方面亦容易變得不利。 In addition, when there are irregularities on the surface of the substrate forming the brush and the polymer layer of the brush cannot completely cover the irregularities, there are cases where low friction properties are not exhibited. In order to cover the roughness of the surface of the substrate, the surface of the substrate can be polished to make it smooth and then a brush is formed. However, since the step of polishing the surface of the substrate is added, it is disadvantageous in terms of cost. Furthermore, a thicker brush can be formed to cover the roughness of the substrate surface. However, to form a brush with a thick film thickness, special conditions or devices such as living radical polymerization under high pressure conditions (for example, 100~1,000MPa) and grafting onto the substrate surface are required. Therefore, it is not necessarily easy to form a brush with a thicker film, and it is also liable to become disadvantageous in terms of cost.

本發明係鑒於此種習知技術所存在之問題點而成者,其課題在於提供一種能夠對各種基材之表面賦予耐磨耗性、耐摩擦性、耐藥品性、耐熱性及耐溶劑性等耐久性,且與基材表面之 密接性優異之表面處理膜。又,本發明之課題在於提供一種上述表面處理膜之製造方法、及具備上述表面處理膜之物品。 The present invention was made in view of the problems of this conventional technology, and its subject is to provide a method that can impart abrasion resistance, abrasion resistance, chemical resistance, heat resistance, and solvent resistance to the surface of various substrates. Such as durability, and with the surface of the substrate Surface treatment film with excellent adhesion. Furthermore, the subject of the present invention is to provide a method of manufacturing the above-mentioned surface treatment film, and an article provided with the above-mentioned surface treatment film.

即,根據本發明,可提供一種以下所示之表面處理膜。 That is, according to the present invention, a surface treatment film shown below can be provided.

[1]一種表面處理膜,其係設置於基材之表面上者,其具有包含配置於上述基材之表面側之聚合物層(i)、及形成於上述聚合物層(i)上之聚合物層(ii)之積層構造;上述聚合物層(i)含有第1聚合物,該第1聚合物包含來自下述通式(1)所表示之單體之構成單位;上述聚合物層(ii)含有第2聚合物,該第2聚合物包含來自從由芳香族乙烯基系單體、(甲基)丙烯酸酯系單體及(甲基)丙烯醯胺系單體所構成之群組選擇之一種以上單體之構成單位,且以下述通式(1)所表示之單體之官能基為聚合起始點進行延長。 [1] A surface treatment film, which is provided on the surface of a substrate, and has a polymer layer (i) arranged on the surface side of the substrate, and a polymer layer (i) formed on the polymer layer (i) The laminated structure of the polymer layer (ii); the polymer layer (i) contains a first polymer, and the first polymer contains a constituent unit derived from a monomer represented by the following general formula (1); the polymer layer (ii) Contains a second polymer, which is derived from the group consisting of aromatic vinyl-based monomers, (meth)acrylate-based monomers, and (meth)acrylamide-based monomers The constitutional unit of more than one monomer selected from the group, and the functional group of the monomer represented by the following general formula (1) is used as the polymerization initiation point for extension.

Figure 108143220-A0101-12-0003-2
Figure 108143220-A0101-12-0003-2

(上述通式(1)中,R1表示氫原子或甲基,X表示O或NH,R2表示任意之有機基,R3及R4分別獨立地表示氫原子、烷基、芳基或醯基,並且R3及R4所鍵結之碳原子為三級碳原子或四級碳原子,Y表示氯原子、溴原子或碘原子) (In the above general formula (1), R 1 represents a hydrogen atom or a methyl group, X represents O or NH, R 2 represents an arbitrary organic group, and R 3 and R 4 each independently represent a hydrogen atom, an alkyl group, an aryl group or The carbon atom to which R 3 and R 4 are bonded is a tertiary carbon atom or a quaternary carbon atom, and Y represents a chlorine atom, a bromine atom, or an iodine atom)

[2]如上述[1]所記載之表面處理膜,其中上述第1聚合物含有30質量%以上之來自上述通式(1)所表示之單體之構成單位。 [2] The surface treatment film described in the above [1], wherein the first polymer contains 30% by mass or more of the constituent unit derived from the monomer represented by the general formula (1).

[3]如上述[1]或[2]所記載之表面處理膜,其中上述第1聚合物進而包含來自具有從由烷氧基矽基、(甲基)丙烯醯氧基、環氧基、異氰酸基、嵌段異氰酸基、羥基、羧基及磷酸基所構成之群組選擇之反應性官能基之自由基聚合性單體之構成單位。 [3] The surface treatment film as described in the above [1] or [2], wherein the first polymer further contains a polymer derived from an alkoxysilyl group, a (meth)acryloyloxy group, an epoxy group, Isocyanate group, blocked isocyanate group, hydroxyl group, carboxyl group and phosphoric acid group constituted by the group of reactive functional groups selected as the constituent unit of radical polymerizable monomers.

[4]如上述[3]所記載之表面處理膜,其中上述第1聚合物具有交聯構造。 [4] The surface treatment film described in [3] above, wherein the first polymer has a crosslinked structure.

[5]如上述[1]至[4]中任一項所記載之表面處理膜,其中上述聚合物層(ii)係含有溶劑而膨潤。 [5] The surface treatment film described in any one of [1] to [4] above, wherein the polymer layer (ii) contains a solvent and swells.

又,根據本發明,可提供一種以下所示之表面處理膜之製造方法。 Furthermore, according to the present invention, it is possible to provide a method for manufacturing the surface treatment film shown below.

[6]一種表面處理膜之製造方法,其係如上述[1]至[5]中任一項所記載之表面處理膜之製造方法,其具有如下步驟:於上述基材之表面上配置上述聚合物層(i);及於常壓~1,000MPa之壓力條件下,於上述聚合物層(i)之存在下,使從由芳香族乙烯基系單體、(甲基)丙烯酸酯系單體及(甲基)丙烯醯胺系單體所構成之群組選擇之一種以上單體進行表面起始自由基聚合或表面起始活性自由基聚合,而於上述聚合物層(i)上形成上述聚合物層(ii)。 [6] A method for manufacturing a surface treatment film, which is the method for manufacturing a surface treatment film as described in any one of [1] to [5] above, which has the following steps: disposing the above-mentioned substrate on the surface of the above-mentioned substrate Polymer layer (i); and under normal pressure to 1,000 MPa, in the presence of the above polymer layer (i), from aromatic vinyl monomers, (meth)acrylate monomers One or more monomers selected from the group consisting of a monomer and a (meth)acrylamide-based monomer undergo surface-initiated radical polymerization or surface-initiated living radical polymerization to form on the above-mentioned polymer layer (i) The above-mentioned polymer layer (ii).

[7]如上述[6]所記載之表面處理膜之製造方法,其係進而於從由鹵化四級銨鹽、鹵化四級鏻鹽及鹵化鹼金屬鹽所構成之群組選擇之至少一種鹽之共存下,進行表面起始自由基聚合或表面起始活性自由基聚合,而於上述聚合物層(i)上形成上述聚合物層(ii)。 [7] The method for producing a surface treatment film as described in [6] above, which is further based on at least one salt selected from the group consisting of halogenated quaternary ammonium salts, halogenated quaternary phosphonium salts, and halogenated alkali metal salts Under the coexistence of the above, surface-initiated radical polymerization or surface-initiated living radical polymerization is performed, and the above-mentioned polymer layer (ii) is formed on the above-mentioned polymer layer (i).

進而,根據本發明,提供一種以下所示之物品。 Furthermore, according to the present invention, there is provided an article shown below.

[8]一種物品,其具備基材、及設置於上述基材之表面上之上述[1]至[5]中任一項所記載之表面處理膜。 [8] An article comprising a substrate and the surface treatment film described in any one of [1] to [5] above provided on the surface of the substrate.

[9]如上述[8]所記載之物品,其中,上述聚合物層(i)之膜厚係較上述基材之表面之表面粗度之最大高度Rz厚。 [9] The article according to [8] above, wherein the film thickness of the polymer layer (i) is thicker than the maximum height Rz of the surface roughness of the substrate.

根據本發明,可提供一種能夠對各種基材之表面賦予耐磨耗性、耐摩擦性、耐藥品性、耐熱性及耐溶劑性等耐久性,且與基材表面之密接性優異之表面處理膜。又,根據本發明,可提供一種上述表面處理膜之製造方法、及具備上述表面處理膜之物品。 According to the present invention, it is possible to provide a surface treatment that can impart durability such as abrasion resistance, abrasion resistance, chemical resistance, heat resistance, and solvent resistance to the surface of various substrates, and has excellent adhesion to the surface of the substrate. membrane. Furthermore, according to the present invention, it is possible to provide a method of manufacturing the above-mentioned surface treatment film, and an article provided with the above-mentioned surface treatment film.

<表面處理膜及其製造方法> <Surface treatment film and its manufacturing method>

以下針對本發明之實施形態進行說明,但本發明並不限定於以下之實施形態。本發明之表面處理膜係設置於基材之表面上之膜,具有包含配置於基材之表面側之聚合物層(i)、及形成於該聚合物層(i)上之聚合物層(ii)之積層構造。聚合物層(i)含有第1聚合物,該第1聚合物包含來自下述通式(1)所表示之單體之構成單位。並且,聚合物層(ii)含有第2聚合物,該第2聚合物包含來自從由芳香族乙烯基系單體、(甲基)丙烯酸酯系單體及(甲基)丙烯醯胺系單體所構成之群組選擇之一種以上單體之構成單位,且以下述通式(1)所表示之單體之官能基為聚合起始點進行延長。以下針對本發明之表面處理膜之詳情進行說明。 Hereinafter, the embodiments of the present invention will be described, but the present invention is not limited to the following embodiments. The surface treatment film of the present invention is a film disposed on the surface of a substrate, and has a polymer layer (i) disposed on the surface side of the substrate, and a polymer layer (i) formed on the polymer layer (i). ii) The multi-layer structure. The polymer layer (i) contains a first polymer, and the first polymer contains a structural unit derived from a monomer represented by the following general formula (1). In addition, the polymer layer (ii) contains a second polymer that is derived from aromatic vinyl monomers, (meth)acrylate monomers, and (meth)acrylamide monomers. The constitutional unit of more than one monomer selected by the group constituted by the body, and the functional group of the monomer represented by the following general formula (1) is used as the polymerization initiation point for extension. The details of the surface treatment film of the present invention will be described below.

(聚合物層(i)) (Polymer layer (i))

表面處理膜具有包含聚合物層(i)及聚合物層(ii)之積層構造。聚合物層(i)係配置於基材之表面側之層,其為含有第1聚合物之層,較佳為實質上由第1聚合物形成之層,該第1聚合物包含來自下述通式(1)所表示之單體之構成單位。 The surface treatment film has a laminated structure including a polymer layer (i) and a polymer layer (ii). The polymer layer (i) is a layer disposed on the surface side of the substrate, and it is a layer containing a first polymer, preferably a layer substantially formed of a first polymer, and the first polymer includes The constituent unit of the monomer represented by the general formula (1).

Figure 108143220-A0101-12-0006-3
Figure 108143220-A0101-12-0006-3

(上述通式(1)中,R1表示氫原子或甲基,X表示O或NH,R2表示任意之有機基,R3及R4分別獨立地表示氫原子、烷基、芳基或醯基,並且R3及R4所鍵結之碳原子為三級碳原子或四級碳原子,Y表示氯原子、溴原子或碘原子) (In the above general formula (1), R 1 represents a hydrogen atom or a methyl group, X represents O or NH, R 2 represents an arbitrary organic group, and R 3 and R 4 each independently represent a hydrogen atom, an alkyl group, an aryl group or The carbon atom to which R 3 and R 4 are bonded is a tertiary carbon atom or a quaternary carbon atom, and Y represents a chlorine atom, a bromine atom, or an iodine atom)

例如,可於基材表面塗佈含有包含來自通式(1)所表示之單體之構成單位之第1聚合物的成分(塗佈液)並進行乾燥,使其硬化,藉此於基材之表面形成聚合物層(i)。並且,若於該聚合物層(i)之存在下,利用既定方法使從由芳香族乙烯基系單體、(甲基)丙烯酸酯系單體及(甲基)丙烯醯胺系單體所構成之群組選擇之一種以上單體聚合,則第2聚合物以聚合物層(i)中包含之第1聚合物中之下述通式(2)所表示之官能基為聚合起始點進行延長。藉此,可於聚合物層(i)上形成含有第2聚合物、較佳為實質上由第2聚合物形成之聚合物層(ii),而獲得表面處理膜。 For example, a component (coating liquid) containing a first polymer containing a structural unit derived from the monomer represented by the general formula (1) can be coated on the surface of the substrate and dried to harden it, thereby coating the substrate The polymer layer (i) is formed on the surface. In addition, in the presence of the polymer layer (i), it is made from aromatic vinyl monomers, (meth)acrylate monomers, and (meth)acrylamide monomers by a predetermined method. Polymerization of one or more monomers selected by the constituent group, the second polymer uses the functional group represented by the following general formula (2) in the first polymer contained in the polymer layer (i) as the polymerization starting point Make an extension. Thereby, the polymer layer (ii) containing the second polymer, preferably substantially formed of the second polymer, can be formed on the polymer layer (i) to obtain a surface treatment film.

Figure 108143220-A0101-12-0007-4
Figure 108143220-A0101-12-0007-4

(上述通式(2)中,R3及R4分別獨立地表示氫原子、烷基、芳基或醯基,並且R3及R4所鍵結之碳原子為三級碳原子或四級碳原子,Y表示氯原子、溴原子或碘原子) (In the above general formula (2), R 3 and R 4 each independently represent a hydrogen atom, an alkyl group, an aryl group or an acyl group, and the carbon atom to which R 3 and R 4 are bonded is a tertiary carbon atom or a quaternary carbon atom Carbon atom, Y represents chlorine atom, bromine atom or iodine atom)

通式(2)中,Y所表示之氯原子等鹵素原子係藉由光、熱及自由基等之作用而脫離成為鹵素自由基,生成三級或四級碳自由基。生成之三級或四級碳自由基係攻擊具有能夠進行自由基聚合之基之上述單體而進行反應,第2聚合物延長。 In the general formula (2), halogen atoms such as chlorine atoms represented by Y are separated into halogen radicals by the action of light, heat, free radicals, etc., and tertiary or quaternary carbon radicals are generated. The generated tertiary or quaternary carbon radicals attack the above-mentioned monomers having groups capable of radical polymerization to react, and the second polymer is elongated.

作為通式(1)所表示之單體之具體例,可列舉使(甲基)丙烯酸(二)羥基烷基酯、N-羥烷基(甲基)丙烯醯胺、甲基丙烯酸縮水甘油酯等具有環氧基之(甲基)丙烯酸酯等與2-氯丙酸、2-氯丁酸、2-氯異丁酸、2-氯戊酸、2-溴丙酸、2-溴丁酸、2-溴異丁酸、2-溴戊酸、α-溴苯基乙酸、α-溴-4-氯乙酸等鹵素取代羧酸化合物、該等之酸酐或醯鹵化物進行反應而獲得之化合物。進而,可列舉使該等化合物中之氯原子或溴原子與碘原子進行鹵素交換而獲得之化合物。作為通式(1)所表示之化合物中可相對容易獲取之市售品,可列舉甲基丙烯酸2-(2-溴異丁醯氧基)乙酯。又,亦可使用將該甲基丙烯酸2-(2-溴異丁醯氧基)乙酯之溴原子取代為碘原子而成之甲基丙烯酸2-(2-碘異丁醯氧基)乙酯。 Specific examples of the monomer represented by the general formula (1) include (di)hydroxyalkyl (meth)acrylate, N-hydroxyalkyl (meth)acrylamide, and glycidyl methacrylate Etc. (meth)acrylates with epoxy groups, etc. and 2-chloropropionic acid, 2-chlorobutyric acid, 2-chloroisobutyric acid, 2-chloropentanoic acid, 2-bromopropionic acid, 2-bromobutyric acid , 2-bromoisobutyric acid, 2-bromopentanoic acid, α-bromophenylacetic acid, α-bromo-4-chloroacetic acid and other halogen-substituted carboxylic acid compounds, and compounds obtained by reacting such anhydrides or halides . Furthermore, compounds obtained by halogen-exchanging chlorine atoms or bromine atoms and iodine atoms in these compounds can be cited. Among the compounds represented by the general formula (1), commercially available products that are relatively easily available include 2-(2-bromoisobutyroxy)ethyl methacrylate. In addition, 2-(2-iodoisobutanoyloxy)ethyl methacrylate obtained by substituting bromine atoms of 2-(2-bromoisobutyroxy)ethyl methacrylate with iodine atoms can also be used. ester.

若使通式(1)所表示之單體進行聚合,則可獲得第1聚合物。又,使上述(甲基)丙烯酸(二)羥基烷基酯、N-羥烷基(甲基)丙烯醯胺、甲基丙烯酸縮水甘油酯等具有環氧基之(甲基)丙烯酸酯等聚合而獲得聚合物,使該聚合物與上述鹵素取代羧酸化合物等反 應,亦可獲得第1聚合物。 If the monomer represented by the general formula (1) is polymerized, the first polymer can be obtained. In addition, the above-mentioned (di)hydroxyalkyl (meth)acrylate, N-hydroxyalkyl (meth)acrylamide, glycidyl methacrylate, and other epoxy-containing (meth)acrylates are polymerized To obtain a polymer, the polymer is reacted with the above halogen-substituted carboxylic acid compound, etc. Should, the first polymer can also be obtained.

第1聚合物亦可包含除來自通式(1)所表示之單體之構成單位以外之構成單位(其他構成單位)。藉由包含其他構成單位,可改變第1聚合物之熱特性、機械特性,或形成立體網狀構造,可提昇與基材之密接性、柔軟性、耐藥品性等耐久性。第1聚合物較佳為含有0.1~100質量%之來自通式(1)所表示之單體之構成單位,進而較佳為含有30質量%以上,尤佳為含有50質量%以上。若第1聚合物中之來自通式(1)所表示之單體之構成單位之量過少,則以通式(1)所表示之單體之官能基為聚合起始點進行延長之第2聚合物之量變少,聚合物層(ii)之效果易變得不足。 The first polymer may include structural units (other structural units) other than the structural unit derived from the monomer represented by the general formula (1). By including other constituent units, the thermal properties and mechanical properties of the first polymer can be changed, or a three-dimensional network structure can be formed, which can improve durability such as adhesion to the substrate, flexibility, and chemical resistance. The first polymer preferably contains 0.1 to 100% by mass of structural units derived from the monomer represented by the general formula (1), more preferably 30% by mass or more, and particularly preferably 50% by mass or more. If the amount of the constituent unit derived from the monomer represented by the general formula (1) in the first polymer is too small, the functional group of the monomer represented by the general formula (1) is used as the polymerization initiation point for the second extension When the amount of polymer decreases, the effect of the polymer layer (ii) tends to become insufficient.

其他構成單位可藉由使除通式(1)所表示之單體以外之單體(其他單體)與通式(1)所表示之單體進行共聚合而形成。作為其他單體,可適當選擇使用習知公知之自由基聚合性單體。其中,藉由使用具有反應性官能基之自由基聚合性單體,可提昇聚合物層(i)對基材之密接性、或提昇聚合物層(i)之機械強度,故較佳。進而,藉由反應性官能基具有自反應性、或使用具有與上述反應性官能基反應之基之化合物(交聯劑),可使聚合物層(i)成為具有立體網狀構造之硬化體,故較佳。作為反應性官能基,可列舉:烷氧基矽基、(甲基)丙烯醯氧基、環氧基、異氰酸基、嵌段異氰酸基、羥基、羧基及磷酸基等。 Other structural units can be formed by copolymerizing a monomer (other monomer) other than the monomer represented by the general formula (1) and the monomer represented by the general formula (1). As other monomers, conventionally known radical polymerizable monomers can be appropriately selected and used. Among them, by using a radically polymerizable monomer having a reactive functional group, the adhesion of the polymer layer (i) to the substrate can be improved, or the mechanical strength of the polymer layer (i) can be improved, which is preferred. Furthermore, the polymer layer (i) can be made into a hardened body having a three-dimensional network structure by using the reactive functional group having self-reactivity or using a compound (crosslinking agent) having a group reactive with the above-mentioned reactive functional group , So better. Examples of reactive functional groups include alkoxysilyl groups, (meth)acryloxy groups, epoxy groups, isocyanate groups, blocked isocyanate groups, hydroxyl groups, carboxyl groups, and phosphoric acid groups.

於反應性官能基為烷氧基矽基之情形時,烷氧基矽基與基材表面之羥基進行脫水縮合反應、或烷氧基矽基彼此進行自交聯反應而形成立體網狀構造。作為與烷氧基矽基反應之交聯劑,可列舉四乙氧基矽烷等矽烷偶合劑。 When the reactive functional group is an alkoxysilyl group, the alkoxysilyl group and the hydroxyl group on the surface of the substrate undergo a dehydration condensation reaction, or the alkoxysilyl group undergoes a self-crosslinking reaction with each other to form a three-dimensional network structure. Examples of the crosslinking agent that reacts with the alkoxysilyl group include silane coupling agents such as tetraethoxysilane.

於反應性官能基為(甲基)丙烯醯氧基之情形時,可添加光自由基產生劑等,並照射紫外線或電子束使其硬化。又,若添加熱自由基產生劑等,則可進行熱交聯。進而,可使用丙烯酸苯氧基乙酯等單官能單體、季戊四醇四丙烯酸酯等丙烯酸系低聚物作為交聯劑。 When the reactive functional group is a (meth)acryloyloxy group, a photo-radical generator or the like can be added, and it can be cured by irradiating it with ultraviolet rays or electron beams. In addition, if a thermal radical generator or the like is added, thermal crosslinking can be performed. Furthermore, monofunctional monomers, such as phenoxyethyl acrylate, and acrylic oligomers, such as pentaerythritol tetraacrylate, can be used as a crosslinking agent.

於反應性官能基為環氧基之情形時,可藉由添加光陽離子產生劑、或聚胺系化合物、酸酐等硬化劑而形成環氧硬化體。於反應性官能基為異氰酸基或嵌段異氰酸基之情形時,若添加具有2個以上羥基或胺基之化合物形成胺基甲酸酯鍵,則可形成具有強韌性之聚合物層(i)。於反應性官能基為羥基之情形時,可使用聚羧酸化合物或聚異氰酸酯化合物作為交聯劑。 When the reactive functional group is an epoxy group, an epoxy cured body can be formed by adding a photocation generator, or a curing agent such as a polyamine compound or an acid anhydride. When the reactive functional group is an isocyanate group or a blocked isocyanate group, if a compound with more than two hydroxyl groups or amino groups is added to form a urethane bond, a polymer with strong toughness can be formed Layer (i). When the reactive functional group is a hydroxyl group, a polycarboxylic acid compound or a polyisocyanate compound can be used as a crosslinking agent.

於反應性官能基為羧基之情形時,若使用三聚氰胺交聯劑、碳二醯亞胺交聯劑、

Figure 108143220-A0101-12-0009-14
唑啉交聯劑、聚異氰酸酯交聯劑、聚環氧化合物等交聯劑,則可形成立體網狀構造。又,於反應性官能基為磷酸基之情形時,若基材為金屬,則藉由與金屬之表面之反應而生成磷酸-金屬鍵,故可提昇基材與聚合物層(i)之密接性。 When the reactive functional group is a carboxyl group, if a melamine crosslinking agent, carbodiimide crosslinking agent,
Figure 108143220-A0101-12-0009-14
Crosslinking agents such as oxazoline crosslinking agents, polyisocyanate crosslinking agents, and polyepoxy compounds can form a three-dimensional network structure. In addition, when the reactive functional group is a phosphoric acid group, if the substrate is a metal, a phosphoric acid-metal bond is formed by the reaction with the surface of the metal, so the adhesion between the substrate and the polymer layer (i) can be improved Sex.

作為第1聚合物之聚合物構造,可列舉:直鏈狀、分支型、接枝型、嵌段型、多嵌段型、瓶刷構造、星形構造、多分支型構造、樹枝狀聚合物型、粒子型、交聯構造型等。第1聚合物之數量平均分子量較佳為1,000以上。第1聚合物例如可藉由自由基聚合、活性自由基聚合、陰離子聚合、活性陰離子聚合、陽離子聚合、活性陽離子聚合等各種聚合方法而形成。其中,由反應條件溫和等而言,較佳為自由基聚合或活性自由基聚合。進而,可藉由塊狀聚合、懸浮聚合、乳化聚合、分散聚合、沈澱聚合、溶液聚合等 習知公知之聚合方法而製造。 Examples of the polymer structure of the first polymer include: linear, branched, grafted, block, multi-block, bottle brush structure, star structure, multi-branched structure, dendritic polymer Type, particle type, cross-linked structure type, etc. The number average molecular weight of the first polymer is preferably 1,000 or more. The first polymer can be formed by various polymerization methods such as radical polymerization, living radical polymerization, anionic polymerization, living anionic polymerization, cationic polymerization, and living cationic polymerization. Among them, in terms of mild reaction conditions, etc., radical polymerization or living radical polymerization is preferred. Furthermore, bulk polymerization, suspension polymerization, emulsion polymerization, dispersion polymerization, precipitation polymerization, solution polymerization, etc. can be used It is manufactured by the well-known polymerization method.

聚合物層(i)實質上由第1聚合物形成,或藉由利用交聯劑等使第1聚合物硬化而形成。聚合物層(i)例如可藉由將含有第1聚合物之塗佈液塗佈於基材之表面上形成塗層之後進行乾燥,進而使其硬化而形成。塗佈液中通常含有水或有機溶劑等液體介質、交聯劑、其他添加劑等作為除第1聚合物以外之成分。又,可進而含有具有通式(2)所表示之成為聚合起始點之官能基、及能夠與第1聚合物中之反應性官能基反應之基的化合物。此種化合物之中,作為與烷氧基矽基反應之化合物,可列舉:2-溴-2-甲基丙酸3-(三甲氧基矽基)丙酯、2-溴-2-甲基丙酸5-(三甲氧基矽基)戊酯。作為與(甲基)丙烯醯氧基反應之化合物,可列舉(甲基)丙烯酸2-(2-溴異丁醯氧基)乙酯等。作為與環氧基反應之化合物,可列舉具有通式(2)所表示之官能基及胺基或羧基之化合物。作為與異氰酸基或嵌段異氰酸基反應之化合物,可列舉具有通式(2)所表示之官能基及羥基或胺基之化合物。作為與羥基反應之化合物,可列舉具有通式(2)所表示之官能基及羧基之化合物、或其酸酐及醯鹵化物等。作為與羧基反應之化合物,可列舉具有通式(2)所表示之官能基及胺基等官能基之化合物。 The polymer layer (i) is substantially formed of the first polymer, or formed by curing the first polymer with a crosslinking agent or the like. The polymer layer (i) can be formed, for example, by applying a coating liquid containing the first polymer on the surface of the substrate to form a coating layer, followed by drying, and then curing it. The coating liquid usually contains a liquid medium such as water or an organic solvent, a crosslinking agent, other additives, and the like as components other than the first polymer. In addition, it may further contain a compound having a functional group that becomes a polymerization starting point represented by the general formula (2) and a group capable of reacting with the reactive functional group in the first polymer. Among such compounds, as compounds that react with alkoxysilyl groups, 3-(trimethoxysilyl)propyl 2-bromo-2-methylpropionate, 2-bromo-2-methyl 5-(Trimethoxysilyl)pentyl propionate. As a compound which reacts with a (meth)acryloxy group, 2-(2-bromoisobutoxy)ethyl (meth)acrylate etc. are mentioned. As a compound which reacts with an epoxy group, the compound which has a functional group represented by general formula (2) and an amino group or a carboxyl group is mentioned. Examples of the compound that reacts with an isocyanate group or a blocked isocyanate group include a compound having a functional group represented by the general formula (2) and a hydroxyl group or an amino group. As a compound which reacts with a hydroxyl group, the compound which has a functional group and a carboxyl group represented by general formula (2), or its acid anhydride and halides, etc. are mentioned. As a compound which reacts with a carboxyl group, the compound which has functional groups, such as a functional group represented by General formula (2), and an amino group, is mentioned.

作為將塗佈液塗佈於基材之表面之方法,可列舉:網版印刷法、浸漬塗佈法、噴墨法、旋轉塗佈法、刮刀塗佈法、棒式塗佈法、狹縫式塗佈法、邊緣流延法、噴塗法、輥塗法、淋幕式塗佈法、凹版印刷法、柔版印刷法、凹版膠版印刷法等。其中,較佳為能夠依需求塗佈(印劃)成任意形狀之噴墨法。 As a method of applying the coating liquid on the surface of the substrate, there can be mentioned: screen printing method, dip coating method, inkjet method, spin coating method, knife coating method, bar coating method, slit Type coating method, edge casting method, spraying method, roller coating method, curtain coating method, gravure printing method, flexographic printing method, gravure offset printing method, etc. Among them, an inkjet method capable of coating (imprinting) into any shape as required is preferred.

(聚合物層(ii)) (Polymer layer (ii))

於配置於基材表面上之聚合物層(i)之存在下,使特定之單體進行表面起始自由基聚合或表面起始活性自由基聚合。藉此,可使第2聚合物以通式(1)所表示之單體之官能基為聚合起始點而進行延長,於聚合物層(i)上形成聚合物層(ii)。 In the presence of the polymer layer (i) disposed on the surface of the substrate, a specific monomer is subjected to surface-initiated radical polymerization or surface-initiated living radical polymerization. Thereby, the second polymer can be extended with the functional group of the monomer represented by the general formula (1) as the polymerization starting point, and the polymer layer (ii) can be formed on the polymer layer (i).

作為特定之單體,使用由芳香族乙烯基系單體、(甲基)丙烯酸酯系單體及(甲基)丙烯醯胺系單體所構成之群組選擇之一種以上單體。其中,由聚合率高、聚合條件溫和等而言,較佳為(甲基)丙烯酸酯系單體。 As the specific monomer, one or more monomers selected from the group consisting of aromatic vinyl monomers, (meth)acrylate monomers, and (meth)acrylamide monomers are used. Among them, (meth)acrylate-based monomers are preferred in terms of high polymerization rate and mild polymerization conditions.

作為芳香族乙烯基系單體,可列舉:苯乙烯、乙烯基甲苯、乙烯基羥基苯、氯甲基苯乙烯、乙烯基萘、乙烯基聯苯、乙烯基乙基苯、乙烯基二甲基苯、α-甲基苯乙烯等。 Examples of aromatic vinyl monomers include styrene, vinyl toluene, vinyl hydroxybenzene, chloromethyl styrene, vinyl naphthalene, vinyl biphenyl, vinyl ethyl benzene, vinyl dimethyl Benzene, α-methylstyrene, etc.

作為(甲基)丙烯酸酯系單體,可列舉:(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸丁酯、2-甲基丙烷(甲基)丙烯酸酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸戊酯、(甲基)丙烯酸己酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸壬酯、(甲基)丙烯酸癸酯、(甲基)丙烯酸異癸酯、(甲基)丙烯酸月桂酯、(甲基)丙烯酸十四烷基酯、(甲基)丙烯酸十八烷基酯、(甲基)丙烯酸山萮酯、(甲基)丙烯酸異硬脂酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸第三丁基環己基甲酯、(甲基)丙烯酸異

Figure 108143220-A0101-12-0011-13
酯、(甲基)丙烯酸三甲基環己酯、(甲基)丙烯酸環癸酯、(甲基)丙烯酸環癸基甲酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸第三丁基苯并三唑苯基乙酯、(甲基)丙烯酸苯酯、(甲基)丙烯酸萘酯、(甲基)丙烯酸烯丙酯等脂肪族、脂環族、芳香族(甲基) 丙烯酸烷基酯等。 Examples of (meth)acrylate monomers include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, (meth) )Butyl acrylate, 2-methylpropane (meth)acrylate, tertiary butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, octyl (meth)acrylate , 2-ethylhexyl (meth)acrylate, nonyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, lauryl (meth)acrylate, (meth) Myristyl acrylate, stearyl (meth)acrylate, behenyl (meth)acrylate, isostearyl (meth)acrylate, cyclohexyl (meth)acrylate, (meth) Tertiary butyl cyclohexyl methyl acrylate, (meth) acrylate iso
Figure 108143220-A0101-12-0011-13
Ester, trimethylcyclohexyl (meth)acrylate, cyclodecyl (meth)acrylate, cyclodecylmethyl (meth)acrylate, benzyl (meth)acrylate, tertiary butyl (meth)acrylate Aliphatic, cycloaliphatic, aromatic (meth)acrylic acid such as phenyl ethyl benzotriazole, phenyl (meth)acrylate, naphthyl (meth)acrylate, allyl (meth)acrylate, etc. Base ester and so on.

再者,作為(甲基)丙烯酸酯系單體,亦可使用包含羥基、二醇基、酸基(羧基、磺酸基、磷酸基等)、氧原子、胺基、氮原子等之(甲基)丙烯酸酯系化合物。 Furthermore, as (meth)acrylate monomers, (meth)acrylic acid ester-based monomers containing hydroxyl groups, glycol groups, acid groups (carboxyl groups, sulfonic acid groups, phosphoric acid groups, etc.), oxygen atoms, amine groups, nitrogen atoms, etc. may also be used. Base) Acrylate-based compounds.

又,作為(甲基)丙烯醯胺系單體,可列舉:(甲基)丙烯醯胺、N,N-二甲基(甲基)丙烯醯胺、N,N-二乙基(甲基)丙烯醯胺、N-羥乙基(甲基)丙烯醯胺、(甲基)丙烯醯

Figure 108143220-A0101-12-0012-12
啉等。 In addition, examples of (meth)acrylamide-based monomers include (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N,N-diethyl(methyl) ) Acrylamide, N-hydroxyethyl (meth) acrylamide, (meth) acrylamide
Figure 108143220-A0101-12-0012-12
Morpho etc.

可藉由使用有機溶劑、添加劑及觸媒等,於常壓~1,000MPa之壓力條件下,較佳為於100MPa以上之壓力條件下進行表面起始自由基聚合或表面起始活性自由基聚合,而形成第2聚合物。就由具有鹵素原子之聚合起始基引發聚合而言,較佳為藉由習知公知之使用金屬錯合物之原子轉移自由基聚合進行單體聚合。作為金屬錯合物,可列舉:氯化銅、溴化銅與二壬基聯吡啶、三-二甲胺基乙基胺、五甲基二伸乙基三胺等聚胺之錯合物、或二氯參(三苯基膦)釕等。原子轉移自由基聚合可為塊體聚合,亦可為使用有機溶劑等之溶液聚合。作為有機溶劑,可使用烴系溶劑、酯系溶劑、二醇系溶劑、醚系溶劑、醯胺系溶劑、醇系溶劑、亞碸系溶劑、脲系溶劑、離子液體等。 By using organic solvents, additives and catalysts, surface-initiated radical polymerization or surface-initiated living radical polymerization can be carried out under pressure conditions of normal pressure to 1,000 MPa, preferably above 100 MPa, Thus, the second polymer is formed. As far as polymerization is initiated by a polymerization initiation group having a halogen atom, it is preferable to perform monomer polymerization by conventionally known atom transfer radical polymerization using metal complexes. Examples of metal complexes include: copper chloride, copper bromide and polyamine complexes such as dinonylbipyridine, tris-dimethylaminoethylamine, and pentamethyldiethylenetriamine, Or dichloro ginseng (triphenylphosphine) ruthenium and so on. Atom transfer radical polymerization may be bulk polymerization or solution polymerization using organic solvents or the like. As the organic solvent, hydrocarbon-based solvents, ester-based solvents, glycol-based solvents, ether-based solvents, amide-based solvents, alcohol-based solvents, sulfite-based solvents, urea-based solvents, ionic liquids, and the like can be used.

原子轉移自由基聚合中由於使用重金屬,則需要考慮著色或環境負荷,並且亦需要自反應系統去除。因此,較佳為於不使用重金屬之通用之有機化合物之存在下進行聚合。具體而言,較佳為於從鹵化四級銨鹽、鹵化四級鏻鹽及鹵化鹼金屬鹽所構成之群組選擇之至少一種鹽之共存下,進行表面起始自由基聚合或表面起始活性自由基聚合。藉此,可利用市售之廉價之有機材料或無機鹽 進行聚合。又,由於不必去除金屬,故可減輕環境負荷,且亦可簡化步驟。 Due to the use of heavy metals in atom transfer radical polymerization, coloring or environmental load needs to be considered, and it also needs to be removed from the reaction system. Therefore, it is preferable to polymerize in the presence of general-purpose organic compounds that do not use heavy metals. Specifically, it is preferable to perform surface initiation radical polymerization or surface initiation in the coexistence of at least one salt selected from the group consisting of halogenated quaternary ammonium salt, halogenated quaternary phosphonium salt, and halogenated alkali metal salt. Living free radical polymerization. In this way, commercially available cheap organic materials or inorganic salts can be used Perform polymerization. In addition, since it is not necessary to remove the metal, the environmental load can be reduced and the steps can also be simplified.

通式(1)中之Y(鹵素)脫離為自由基,並且於Y脫離之同時生成碳自由基,單體插入至該碳自由基而進行聚合。此時,藉由使上述特定之鹽共存,而發生鹵素自由基之奪取或鹵素交換,由所生成之碳自由基進行單體聚合,而形成第2聚合物。 Y (halogen) in the general formula (1) is detached into a radical, and a carbon radical is generated at the same time as Y is detached, and the monomer is inserted into the carbon radical to be polymerized. At this time, by allowing the above-mentioned specific salt to coexist, extraction of halogen radicals or halogen exchange occurs, and the generated carbon radicals undergo monomer polymerization to form a second polymer.

作為鹵化四級銨鹽,可列舉:氯化苄基三甲基銨、溴化四丁基銨、碘化四丁基銨、碘化四辛基銨、氯化壬基吡啶鎓、氯化膽鹼等。作為鹵化四級鏻鹽,可列舉:氯化四苯基鏻、溴化甲基三丁基鏻、碘化四丁基鏻等。作為鹵化鹼金屬鹽,可列舉:溴化鋰、碘化鉀等。 Examples of quaternary ammonium halide salts include benzyltrimethylammonium chloride, tetrabutylammonium bromide, tetrabutylammonium iodide, tetraoctylammonium iodide, nonylpyridinium chloride, and choline chloride Alkali etc. Examples of halogenated quaternary phosphonium salts include tetraphenylphosphonium chloride, methyltributylphosphonium bromide, and tetrabutylphosphonium iodide. Examples of halogenated alkali metal salts include lithium bromide, potassium iodide, and the like.

作為鹽,較佳為使用碘化物鹽。藉由使用碘化物鹽,進行活性自由基聚合,可獲得分子量分佈更窄之第2聚合物。又,較佳為使用碘化四級銨鹽、碘化四級鏻鹽及碘化鹼金屬鹽等可溶解於聚合溶液之鹽,進而較佳為使用碘化四級銨鹽。作為碘化四級銨鹽,可列舉:碘化苄基四丁基銨、碘化四丁基銨、碘化四辛基銨、碘化十二烷基三甲基銨、碘化十八烷基三甲基銨、碘化三-十八烷基甲基銨等。 As the salt, an iodide salt is preferably used. By using an iodide salt to perform living radical polymerization, a second polymer with a narrower molecular weight distribution can be obtained. In addition, it is preferable to use a salt that is soluble in the polymerization solution, such as a quaternary ammonium iodide salt, a quaternary phosphonium iodide salt, and an alkali metal iodide salt, and it is more preferable to use a quaternary ammonium iodide salt. Examples of the quaternary ammonium iodide salt include: benzyltetrabutylammonium iodide, tetrabutylammonium iodide, tetraoctylammonium iodide, dodecyltrimethylammonium iodide, and octadecane iodide. Trimethylammonium, trioctadecylmethylammonium iodide, etc.

由提高活性度、並獲得更濃厚且高分子量之第2聚合物之觀點而言,鹽相對於聚合起始基之量較佳為設為等莫耳以上,更佳為設為10倍莫耳以上,亦可設為100倍莫耳以上。 From the viewpoint of improving the activity and obtaining a denser and higher molecular weight second polymer, the amount of the salt relative to the polymerization starting group is preferably equal to or greater than equal mol, more preferably 10 times mol The above can also be set to 100 times or more moles.

於使用該四級鹽或鹵化物鹽之方法中,其聚合條件並無特別限制。於習知公知之條件下進行。較佳為溫度為60℃以上,較佳為使用有機溶劑作為溶劑。作為溶劑,可使用習知公知之溶 劑,並無特別限制。該溶劑可使用上述習知公知之有機溶劑,但較佳為使用使鹽溶解之溶劑,較佳為醇系、二醇系、醯胺系、脲系、亞碸系、離子液體等高極性之有機溶劑。 In the method of using the quaternary salt or halide salt, the polymerization conditions are not particularly limited. Under the conditions of familiarity and public knowledge. Preferably, the temperature is 60°C or higher, and it is preferable to use an organic solvent as the solvent. As the solvent, conventionally known solvents can be used The agent is not particularly limited. The solvent can use the above-mentioned conventional and well-known organic solvents, but it is preferable to use a solvent that dissolves the salt, preferably an alcohol-based, glycol-based, amide-based, urea-based, sulfite-based, ionic liquid, and other high-polarity solvents. Organic solvents.

於常壓~1,000MPa之壓力條件下,較佳為100~1,000MPa、更佳為200~800MPa、特佳為300~600MPa之壓力條件下進行聚合。具體而言,一面經由水等介質對裝有單體及基材之聚合容器整體均勻地賦予壓力,一面進行聚合。藉由在賦予壓力之狀態下進行自由基聚合,可對停止反應加以抑制,形成更高分子量之第2聚合物。 The polymerization is carried out under pressure conditions of normal pressure to 1,000 MPa, preferably 100 to 1,000 MPa, more preferably 200 to 800 MPa, and particularly preferably 300 to 600 MPa. Specifically, the polymerization is carried out while uniformly applying pressure to the entire polymerization vessel containing the monomer and the substrate via a medium such as water. By performing radical polymerization under pressure, the stop reaction can be suppressed, and a second polymer with a higher molecular weight can be formed.

可耐超過1,000MPa之壓力之容器或裝置不易準備,且不實用。隨著形成之第2聚合物之分子量變大,聚合物層(ii)之膜厚亦變厚。藉由增大聚合物層(ii)之膜厚,可使基材表面改質成表現出先前未有之特性。聚合物層(ii)之膜厚例如可設為數nm至數μm,較佳設為10nm以上,更佳設為100nm以上。 Containers or devices that can withstand pressures exceeding 1,000 MPa are difficult to prepare and impractical. As the molecular weight of the second polymer formed becomes larger, the film thickness of the polymer layer (ii) also becomes thicker. By increasing the film thickness of the polymer layer (ii), the surface of the substrate can be modified to exhibit unprecedented characteristics. The film thickness of the polymer layer (ii) can be, for example, several nm to several μm, preferably 10 nm or more, and more preferably 100 nm or more.

作為聚合容器,較佳為使用可密封且可耐高壓之容器。又,由於需要向容器之內部傳輸壓力,故較佳為使用具有塑膠製之軟質部分或伸縮部分等於壓力下變形之部分的容器。具體而言,可使用聚乙烯製瓶、PET瓶、高溫殺菌包、起泡容器等各種容器。又,較佳為於聚合時之溫度下不易變形之包含具有耐熱性之素材之容器。進而,較佳為不易被聚合用溶劑等侵蝕之包含具有耐藥品性或耐溶劑性等特性之素材之容器。作為構成聚合容器之素材,可舉例如:聚烯烴系樹脂、氟系樹脂、聚酯系樹脂、聚醯胺系樹脂、工程塑膠等。又,於聚合時較佳為儘可能地不讓氣體進入聚合容器內。例如,較佳為裝入占聚合容器之容量之90%以上之聚合溶液。 As the polymerization container, it is preferable to use a container that can be sealed and can withstand high pressure. In addition, since it is necessary to transmit pressure to the inside of the container, it is better to use a container with a plastic soft part or a flexible part equal to the part that deforms under pressure. Specifically, various containers such as polyethylene bottles, PET bottles, high-temperature sterilization bags, and foaming containers can be used. In addition, it is preferably a container containing a heat-resistant material that is not easily deformed at the temperature during polymerization. Furthermore, it is preferable that it is a container containing the material which has characteristics, such as chemical resistance and solvent resistance, which is not easily corroded by a polymerization solvent etc.. Examples of materials constituting the polymerization container include polyolefin resins, fluorine resins, polyester resins, polyamide resins, and engineering plastics. In addition, it is preferable to prevent gas from entering the polymerization vessel as much as possible during polymerization. For example, it is preferable to fill a polymerization solution that occupies more than 90% of the capacity of the polymerization vessel.

以上將基材、單體、觸媒等聚合溶液裝入至聚合容器內,並施加常壓、或常壓以上1000MPa以下之外壓,較佳為加溫而進行聚合,藉此可自基材之聚合物層(i)生成聚合物,從而對基材之表面進行改質。可根據使用之單體之種類等將基材之表面改質為任意之性質。例如,藉由使用氟系單體,可形成易撥水或油之表面張力較低之聚合物層(ii)。藉由使用具有聚乙二醇基或羧基等之單體,可形成使接觸之水蒸氣立刻變成水滴而不易起霧之親水性之聚合物層(ii)。進而,亦可製造不易附著蛋白質等之生物相容性基材。又,亦可利用潤滑油等使所形成之聚合物層(ii)膨潤而製成潤滑膜,製成極低摩擦性之聚合物層。 In the above, the polymerization solution such as the substrate, monomer, catalyst, etc. is charged into the polymerization vessel, and the normal pressure is applied, or an external pressure above the normal pressure and below 1000 MPa. It is preferably heated and polymerized, whereby the substrate can be polymerized. The polymer layer (i) generates polymer to modify the surface of the substrate. The surface of the substrate can be modified to any properties according to the types of monomers used. For example, by using a fluorine-based monomer, it is possible to form a polymer layer (ii) with a low surface tension that is easy to repel water or oil. By using monomers with polyethylene glycol groups or carboxyl groups, it is possible to form a hydrophilic polymer layer (ii) that makes the water vapor in contact immediately turn into water droplets and is not prone to fogging. Furthermore, it is also possible to manufacture a biocompatible substrate to which proteins and the like are not easily adhered. In addition, the formed polymer layer (ii) can be swelled with lubricating oil or the like to form a lubricating film to form a polymer layer with extremely low friction.

驗證構成所形成之聚合物層(ii)之第2聚合物之分子量稱不上容易。因此,較佳為於具有與聚合起始基相同之起始基之起始基單體之共存下進行表面起始自由基聚合或表面起始活性自由基聚合。藉此,形成不包含於聚合物層(ii)中之游離聚合物。進而,依照慣例測定所形成之游離聚合物之分子量,藉此可推測出構成聚合物層(ii)之第2聚合物之分子量。所形成之游離聚合物藉由凝膠滲透層析法(GPC)測定之聚苯乙烯換算之數量平均分子量(Mn)通常為1,000~10,000,000,較佳為100,000以上。 It is not easy to verify the molecular weight of the second polymer constituting the formed polymer layer (ii). Therefore, it is preferable to perform surface-initiated radical polymerization or surface-initiated living radical polymerization in the coexistence of an initiator monomer having the same initiator as the polymerization initiator. Thereby, a free polymer not contained in the polymer layer (ii) is formed. Furthermore, the molecular weight of the free polymer formed is measured in accordance with the conventional practice, whereby the molecular weight of the second polymer constituting the polymer layer (ii) can be estimated. The number average molecular weight (Mn) of the formed free polymer measured by gel permeation chromatography (GPC) in terms of polystyrene is usually 1,000-10,000,000, preferably 100,000 or more.

作為起始基單體,係使用具有與聚合起始基相同之基之化合物。具體而言,可使用下述式(3)~(5)所表示之化合物作為起始基單體。 As the starting group monomer, a compound having the same group as the polymerization starting group is used. Specifically, the compounds represented by the following formulas (3) to (5) can be used as the starting group monomer.

Figure 108143220-A0101-12-0016-5
Figure 108143220-A0101-12-0016-5

聚合物層(ii)較佳為含有水、有機溶劑或該等之混合溶劑等溶劑而膨潤。藉由利用溶劑使其膨潤,可增大聚合物層(ii)之膜厚。進而,膨潤之聚合物層(ii)表示出對壓縮之較強阻抗力或低摩擦性等特異之性質,故較佳。例如可藉由將於表面形成有表面處理膜之基材浸漬於溶劑中而使聚合物層(ii)膨潤。 The polymer layer (ii) is preferably swollen by containing a solvent such as water, an organic solvent, or a mixed solvent of these. By swelling with a solvent, the film thickness of the polymer layer (ii) can be increased. Furthermore, the swollen polymer layer (ii) exhibits specific properties such as strong resistance to compression or low friction, so it is preferred. For example, the polymer layer (ii) can be swelled by immersing the substrate on which the surface treatment film is formed in the solvent.

<物品> <Item>

本發明之物品具備基材、及設置於該基材之表面上之上述表面處理膜。基材之種類並無特別限制,可使用天然物、人工物、無機構件、有機構件之任一者。其中,較佳為使用可耐聚合溶液之基材。作為基材之具體例,可列舉:金屬、金屬氧化物、金屬氮化物、金屬碳化物、陶瓷、木材、矽化合物、熱塑性樹脂、熱硬化性樹脂、纖維素、玻璃等之機械零件、薄膜、纖維、片材等。 The article of the present invention includes a substrate and the above-mentioned surface treatment film provided on the surface of the substrate. The type of the substrate is not particularly limited, and any of natural materials, artificial materials, inorganic components, and organic components can be used. Among them, it is preferable to use a substrate that can withstand polymerization solutions. Specific examples of substrates include: metal, metal oxide, metal nitride, metal carbide, ceramics, wood, silicon compounds, thermoplastic resins, thermosetting resins, cellulose, glass and other mechanical parts, films, Fiber, sheet, etc.

亦可對基材實施表面處理。作為表面處理,可列舉:矽烷偶合處理、塗矽處理、矽鋁處理等無機處理、電漿處理、紫外線照射處理、臭氧氧化處理、放射線處理、X射線處理、電子束處理、雷射處理等洗淨、活化、及表面處理官能基賦予處理等。 Surface treatment can also be applied to the substrate. Surface treatments include inorganic treatments such as silane coupling treatment, silicon coating treatment, silicon aluminum treatment, plasma treatment, ultraviolet irradiation treatment, ozone oxidation treatment, radiation treatment, X-ray treatment, electron beam treatment, laser treatment, etc. Net, activation, and surface treatment, functional group imparting treatment, etc.

聚合物層(i)之膜厚較佳為較基材表面之表面粗度之最大高度Rz厚。一般之基材表面上通常有奈米單位至微米單位之凹凸。若聚合物層(i)過薄,則有無法完全被覆凹凸而凸部露出之情況。又,即使勉強被覆凸部,聚合物層(i)之表面形狀亦反映出基材 之凹凸,並且形成於其上之聚合物層(ii)之表面亦容易變得凹凸。因此,藉由使聚合物層(i)之膜厚較基材表面之表面粗度之最大高度Rz厚,可均勻地被覆基材之整個表面,使其平滑。又,可於聚合物層(i)之整個表面形成更平滑之聚合物層(ii)。聚合物層(i)之膜厚例如可藉由使用原子力顯微鏡或橢圓偏光計等精密機器之測定方法、或藉由使用電子顯微鏡觀察之測定方法、使用膜厚測定機之測定方法等而測定。 The film thickness of the polymer layer (i) is preferably thicker than the maximum height Rz of the surface roughness of the substrate surface. Generally, the surface of the substrate usually has irregularities ranging from nanometers to micrometers. If the polymer layer (i) is too thin, the unevenness may not be completely covered and the protrusions may be exposed. Moreover, even if the convex portions are barely covered, the surface shape of the polymer layer (i) reflects the base material The surface of the polymer layer (ii) formed thereon is also easy to become uneven. Therefore, by making the film thickness of the polymer layer (i) thicker than the maximum height Rz of the surface roughness of the substrate surface, the entire surface of the substrate can be uniformly covered and made smooth. In addition, a smoother polymer layer (ii) can be formed on the entire surface of the polymer layer (i). The film thickness of the polymer layer (i) can be measured by, for example, a measurement method using precision equipment such as an atomic force microscope or an ellipsometer, a measurement method using an electron microscope observation, a measurement method using a film thickness measuring machine, or the like.

藉由在基材之表面上設置具有包含與基材密接並賦予機械強度之聚合物層(i)、及表現出特異性質之聚合物層(ii)之積層構造的表面處理膜,可製成被賦予作為零件之性能、或性能提昇之本發明之物品。本發明之物品適宜用作例如醫療用構件、電子材料、顯示器材料、半導體材料、機械零件、滑動構件、電池材料等各種領域中使用之物品。 By providing a surface treatment film with a laminated structure including a polymer layer (i) that is in close contact with the substrate and imparts mechanical strength and a polymer layer (ii) that exhibits specific properties on the surface of the substrate, it can be made The article of the present invention that is given the performance of the part or the performance improvement. The article of the present invention is suitably used as articles used in various fields such as medical components, electronic materials, display materials, semiconductor materials, mechanical parts, sliding members, and battery materials.

[實施例] [Example]

以下,基於實施例具體地說明本發明,但本發明並不限定於該等實施例。再者,若無特別說明,則實施例、比較例中之「份」及「%」為質量基準。 Hereinafter, the present invention will be specifically explained based on examples, but the present invention is not limited to these examples. In addition, unless otherwise specified, the "parts" and "%" in the examples and comparative examples are quality standards.

<起始基聚合物(第1聚合物)之合成> <Synthesis of starting base polymer (first polymer)>

(合成例1:起始基聚合物1) (Synthesis Example 1: Starting Base Polymer 1)

向安裝有攪拌裝置、攪拌葉、溫度計、冷卻管、氮氣導入裝置及滴加裝置之反應容器中,放入150份丙二醇單甲醚乙酸酯(PGMAc)。一面吹入氮氣一面攪拌,歷時30分鐘加溫至80℃。於另一容器中放入75份甲基丙烯酸2-(2-溴異丁醯氧基)乙酯 (BBEM)、25份3-甲基丙烯醯氧基丙基甲基二乙氧基矽烷(MPES)、及1.5份2,2'-偶氮雙(2,4-二甲基戊腈)(V-65)並攪拌,製備均勻之單體混合液。於反應容器中添加所製備之單體混合液之1/3後,歷時1小時滴加剩餘之單體混合液。滴加後,立刻添加0.5份V-65。1小時後,進而添加0.5份V-65,於80℃下進行7小時聚合,獲得含有起始基聚合物1之帶些許黃色之低黏度液體。所獲得之液體之固形份為40.1%,聚合率約為100%。使用GPC裝置(展開溶劑:四氫呋喃(THF))測定之起始基聚合物1之聚苯乙烯換算之數量平均分子量(Mn)為12,000,分子量分佈(Mw/Mn、分散度PDI)為3.56。 Put 150 parts of propylene glycol monomethyl ether acetate (PGMAc) into a reaction vessel equipped with a stirring device, a stirring blade, a thermometer, a cooling tube, a nitrogen introduction device, and a dripping device. While blowing in nitrogen while stirring, it took 30 minutes to heat up to 80°C. Put 75 parts of 2-(2-bromoisobutoxy)ethyl methacrylate in another container (BBEM), 25 parts of 3-methacryloxypropylmethyl diethoxysilane (MPES), and 1.5 parts of 2,2'-azobis(2,4-dimethylvaleronitrile) ( V-65) and stir to prepare a uniform monomer mixture. After adding 1/3 of the prepared monomer mixture into the reaction vessel, add the remaining monomer mixture dropwise over 1 hour. After dropping, add 0.5 part of V-65 immediately. After 1 hour, further add 0.5 part of V-65, and polymerize at 80°C for 7 hours to obtain a slightly yellowish low-viscosity liquid containing the starting base polymer 1. The solid content of the obtained liquid was 40.1%, and the polymerization rate was about 100%. The polystyrene conversion number average molecular weight (Mn) of the starting base polymer 1 measured with a GPC device (developing solvent: tetrahydrofuran (THF)) was 12,000, and the molecular weight distribution (Mw/Mn, PDI) was 3.56.

(合成例2:起始基聚合物2) (Synthesis Example 2: Starting Base Polymer 2)

向與合成例1中使用之反應容器相同之反應容器中放入100份PGMAc,一面吹入氮氣一面攪拌,歷時30分鐘加溫至65℃。於另一容器中放入50份BBEM、15份甲基丙烯酸甲酯(MMA)、15份甲基丙烯酸丁酯(BMA)、10份甲基丙烯酸2-乙基己酯(2EHMA)、10份甲基丙烯酸2-[O-(1'-甲基亞丙基胺基)羧基胺基]乙酯(嵌段異氰酸酯單體,商品名「Karenz MOI-BM」,昭和電工公司製造)、及1份V-65並攪拌,製備均勻之單體混合液。於反應容器中添加所製備之單體混合液之1/2後,歷時2小時滴加剩餘之單體混合液。進行3小時聚合之後,進而添加0.5份V-65並進行5小時聚合,獲得含有起始基聚合物2之帶些許黃色之黏稠溶液。所獲得之液體之固形份為50.3%,聚合率約為100%。起始基聚合物2之Mn為18,600,PDI為2.06。 Put 100 parts of PGMAc into the same reaction vessel as the reaction vessel used in Synthesis Example 1, and stir while blowing in nitrogen gas, and heat to 65°C over 30 minutes. Put 50 parts of BBEM, 15 parts of methyl methacrylate (MMA), 15 parts of butyl methacrylate (BMA), 10 parts of 2-ethylhexyl methacrylate (2EHMA), and 10 parts in another container 2-[O-(1'-Methylpropyleneamino)carboxyamino]ethyl methacrylate (blocked isocyanate monomer, trade name "Karenz MOI-BM", manufactured by Showa Denko), and 1 Part V-65 and stir to prepare a uniform monomer mixture. After adding 1/2 of the prepared monomer mixture to the reaction vessel, drop the remaining monomer mixture over 2 hours. After 3 hours of polymerization, 0.5 part of V-65 was added and polymerization was performed for 5 hours to obtain a slightly yellow viscous solution containing the starting base polymer 2. The solid content of the obtained liquid was 50.3%, and the polymerization rate was about 100%. The Mn of the starting base polymer 2 is 18,600, and the PDI is 2.06.

(合成例3~5:起始基聚合物3~5) (Synthesis examples 3~5: starting base polymer 3~5)

使用表1之中段所示之種類及量(單位:份)之單體,除此以外,以與上述合成例1相同之方式,獲得分別含有起始基聚合物3~5之溶液。將所獲得之起始基聚合物各自之物性值等示於表1之下段。 Using the monomers of the type and amount (unit: parts) shown in the middle section of Table 1, except for this, in the same manner as in Synthesis Example 1 above, solutions containing 3 to 5 starting base polymers were obtained. The physical properties of the obtained starting base polymers are shown in the lower section of Table 1.

[表1]

Figure 108143220-A0101-12-0019-7
[Table 1]
Figure 108143220-A0101-12-0019-7

<聚合物層(i)形成用之塗佈液之製造> <Manufacturing of coating liquid for forming polymer layer (i)>

(製造例1:COT-1) (Manufacturing Example 1: COT-1)

將100份含有起始基聚合物1之液體、及60.4份PGMAc混合,獲得塗佈液(COT-1)。 100 parts of the liquid containing the starting base polymer 1 and 60.4 parts of PGMAc were mixed to obtain a coating liquid (COT-1).

(製造例2:COT-2) (Manufacturing Example 2: COT-2)

將100份含有起始基聚合物2之液體、2份聚乙烯亞胺(商品名「Epomin SP-003」,日本觸媒公司製造)、及107.2份PGMAc混合,獲得塗佈液(COT-2)。 100 parts of the liquid containing the starting base polymer 2, 2 parts of polyethyleneimine (trade name "Epomin SP-003", manufactured by Nippon Shokubai Co., Ltd.), and 107.2 parts of PGMAc were mixed to obtain a coating liquid (COT-2 ).

(製造例3~5:COT-3~5) (Manufacturing example 3~5: COT-3~5)

使用表2之中段所表示之種類及量(單位:份)之成分,除此以外,以與上述製造例1相同之方式,獲得塗佈液(COT-3~5)。將所獲得之塗佈液各自外觀及固形份(%)示於表2之下段。 Except for using the components of the type and amount (unit: parts) shown in the middle section of Table 2, the coating liquid (COT-3 to 5) was obtained in the same manner as in the above-mentioned Production Example 1. The appearance and solid content (%) of the obtained coating liquids are shown in the lower part of Table 2.

[表2]

Figure 108143220-A0101-12-0020-8
[Table 2]
Figure 108143220-A0101-12-0020-8

<聚合物層(i)賦予基材之製造> <Manufacturing of polymer layer (i) imparting base material>

(製造例6:SUB-1) (Manufacturing Example 6: SUB-1)

準備經洗淨且藉由UV臭氧進行表面活化處理之矽晶圓作為基材。於準備之基材之表面塗佈COT-1,使用旋轉塗佈機於2,000rpm、30秒之條件下進行塗佈。放入至80℃之烘箱內乾燥5分鐘之 後,放入至120℃之烘箱內加熱12小時進行硬化,而形成聚合物層(i),獲得屬於聚合物層(i)賦予基材之SUB-1。藉由分光橢圓偏光法測定之聚合物層(i)之膜厚為1,286nm。將獲得之SUB-1浸漬於THF中進行5分鐘超音波洗淨之後,再次測定聚合物層(i)之膜厚。其結果確認,聚合物層(i)之膜厚係較洗淨前幾乎無變化,形成充分硬化之聚合物層(i)。 Prepare a silicon wafer that has been cleaned and surface-activated by UV ozone as the substrate. Coat COT-1 on the surface of the prepared substrate, and use a spin coater to coat at 2,000 rpm for 30 seconds. Put it in an oven at 80℃ and dry for 5 minutes Afterwards, it is placed in an oven at 120° C. and heated for 12 hours for curing to form the polymer layer (i), and obtain the SUB-1 that belongs to the polymer layer (i) and gives the substrate. The thickness of the polymer layer (i) measured by spectroscopic ellipsometry was 1,286 nm. After immersing the obtained SUB-1 in THF for 5 minutes to perform ultrasonic cleaning, the film thickness of the polymer layer (i) was measured again. As a result, it was confirmed that the film thickness of the polymer layer (i) hardly changed from before washing, and a sufficiently hardened polymer layer (i) was formed.

(製造例7:SUB-2) (Manufacturing Example 7: SUB-2)

準備經洗淨且藉由UV臭氧進行表面活化處理之玻璃板(Rz=15nm)作為基材。於準備之基材之表面塗佈COT-2,使用旋轉塗佈機於2,000rpm、30秒之條件下進行塗佈。放入至80℃之烘箱內乾燥5分鐘之後,放入至140℃之烘箱內加熱1小時進行硬化,而形成聚合物層(i),獲得屬於聚合物層(i)賦予基材之SUB-2。藉由分光橢圓偏光法測定之聚合物層(i)之膜厚為1,331nm。將獲得之SUB-2浸漬於THF中進行5分鐘超音波洗淨之後,再次測定聚合物層(i)之膜厚。其結果確認,聚合物層(i)之膜厚係較洗淨前幾乎無變化,形成充分硬化之聚合物層(i)。 Prepare a cleaned and surface activated glass plate (Rz=15nm) with UV ozone as the substrate. Coat COT-2 on the surface of the prepared substrate, and use a spin coater to coat at 2,000 rpm for 30 seconds. After drying for 5 minutes in an oven at 80°C, it is placed in an oven at 140°C and heated for 1 hour to harden to form the polymer layer (i), and obtain the SUB- which belongs to the polymer layer (i) to give the substrate. 2. The thickness of the polymer layer (i) measured by spectroscopic ellipsometry was 1,331 nm. After immersing the obtained SUB-2 in THF for 5 minutes and ultrasonic cleaning, the film thickness of the polymer layer (i) was measured again. As a result, it was confirmed that the film thickness of the polymer layer (i) hardly changed from before washing, and a sufficiently hardened polymer layer (i) was formed.

(製造例8~10:SUB-3~5) (Manufacturing example 8~10: SUB-3~5)

設為表3之下段所示之條件,除此以外,以與上述製造例6及7相同之方式,獲得屬於聚合物層(i)賦予基材之SUB-3~5。 Except for the conditions shown in the lower stage of Table 3, in the same manner as in the above-mentioned Production Examples 6 and 7, SUB-3 to 5 belonging to the polymer layer (i) providing the base material were obtained.

[表3]

Figure 108143220-A0101-12-0022-9
[table 3]
Figure 108143220-A0101-12-0022-9

(比較製造例1:SUB-C-1) (Comparative Manufacturing Example 1: SUB-C-1)

將混合有0.2份2-溴-2-甲基丙酸3-(三甲氧基矽基丙基)酯(BPM)、2份濃氨水、及45份乙醇之溶液放入至聚苯乙烯製培養皿。準備經充分洗淨之玻璃板(Rz=15nm)作為基材。將準備之基材放入培養皿內使其浸漬於溶液中,於室溫下靜置12小時之後,利用乙醇充分地洗淨。藉此,獲得於玻璃板之表面上形成有具有聚合起始點之單分子膜之SUB-C-1。 Put a mixture of 0.2 parts of 2-bromo-2-methylpropionic acid 3-(trimethoxysilylpropyl) ester (BPM), 2 parts of concentrated ammonia, and 45 parts of ethanol into the polystyrene culture Dish. Prepare a sufficiently cleaned glass plate (Rz=15nm) as the substrate. Put the prepared substrate in a petri dish, immerse it in the solution, and let it stand at room temperature for 12 hours, and then wash it thoroughly with ethanol. Thereby, SUB-C-1 with a monomolecular film with a polymerization starting point formed on the surface of the glass plate is obtained.

(比較製造例2:SUB-C-2) (Comparative Manufacturing Example 2: SUB-C-2)

使用SUS板(Rz=0.8μm)代替玻璃板作為基材,除此以外,以與上述比較製造例1相同之方式,獲得於SUS板之表面上形成有具有聚合起始點之單分子膜之SUB-C-2。 A SUS plate (Rz=0.8μm) was used instead of the glass plate as the base material. Except for this, in the same manner as in Comparative Production Example 1 above, a monomolecular film with a polymerization initiation point formed on the surface of the SUS plate was obtained. SUB-C-2.

<表面處理膜賦予基材之製造> <Manufacturing of Surface Treatment Film for Substrate>

(實施例1:SUB-6) (Example 1: SUB-6)

於氬氣環境下,將0.00054份2-溴異丁酸乙酯(EBiB)、55.5份3-甲氧基-N,N-二甲基丙醯胺(商品名「KJCMPA-100」,KJ化學公司製造)(KJCMPA)、55.1份MMA、及0.41份碘化四丁基銨(TBAI)放入至燒瓶中攪拌,製備聚合溶液。於PTFE製螺旋口容器中放入屬於聚合物層(i)賦予基材之SUB-1,並向容器內注滿所製備之聚合溶液後加栓,並於蓋子部分纏繞石蠟薄膜。將該容器放入至鋁層壓袋內,一面抽出氣體一面進行熱密封。將容器連同鋁層壓袋一起放入至裝有作為加壓介質之水之高壓裝置(商品名「PV-400」,Sincorporation公司製造)內,加溫至75℃,並加壓至400MPa進行4小時聚合。於高壓裝置內中生成含有聚合物之高黏性溶液,取一部分作為試樣進行測定之聚合物之Mn為2,378,000,PDI為1.42。利用THF充分地洗淨自容器取出之基材。藉由分光橢圓偏光法測定於矽晶圓之表面上形成之膜之膜厚,結果為1,962nm。根據較聚合物層(i)之膜厚而變厚,確認形成了於聚合物層(i)上積層有聚合物層(ii)之表面處理膜。將獲得之基材(表面處理膜賦予基材)設為SUB-6。 In an argon atmosphere, 0.00054 parts of ethyl 2-bromoisobutyrate (EBiB) and 55.5 parts of 3-methoxy-N,N-dimethylpropanamide (trade name "KJCMPA-100", KJ Chemical (KJCMPA), 55.1 parts of MMA, and 0.41 part of tetrabutylammonium iodide (TBAI) were put into the flask and stirred to prepare a polymerization solution. Put the SUB-1 that belongs to the polymer layer (i) as the base material in a screw-top container made of PTFE, fill the container with the prepared polymer solution, then add a stopper, and wrap a paraffin film on the lid. The container was put into an aluminum laminate bag, and heat-sealed while evacuating the gas. Put the container together with the aluminum laminate bag into a high-pressure device (trade name "PV-400", manufactured by Sincorporation) containing water as a pressurizing medium, and heat to 75°C and pressurize to 400MPa for 4 Hour polymerization. A high-viscosity solution containing polymer is generated in the high-pressure device, and a part of the polymer is taken as a sample for measurement. The Mn of the polymer is 2,378,000 and the PDI is 1.42. Use THF to thoroughly clean the substrate taken out of the container. The film thickness of the film formed on the surface of the silicon wafer was measured by spectroscopic ellipsometry, and the result was 1,962nm. It was confirmed that it became thicker than the film thickness of the polymer layer (i), and it was confirmed that the surface treatment film which laminated|stacked the polymer layer (ii) on the polymer layer (i) was formed. The obtained substrate (surface-treated film-imparting substrate) was set to SUB-6.

(實施例2:SUB-7) (Example 2: SUB-7)

於氬氣環境下,將0.00098份EBiB、0.080份溴化銅(II)(CuBr2)、0.46份溴化銅(I)(CuBr)、3.2份4,4'-二壬基-2,2'-聯吡啶(dNbpy)、100.1份MMA、及103.9份大茴香醚放入至燒瓶中攪拌,製備聚合溶液。於PTFE製螺旋口容器中放入屬於聚合物層(i)賦予基材之SUB-2,並向容器內注滿所製備之聚合溶液後加栓,並於蓋子部分纏繞石蠟薄膜。將該容器放入至鋁層壓袋內,一面抽出氣體一面進行熱密封。 將容器連同鋁層壓袋一起放入至裝有作為加壓介質之水之高壓裝置(PV-400)內,加溫至60℃,並加壓至400MPa進行4小時聚合。於高壓裝置內生成含有聚合物之高黏性溶液,取一部分作為試樣進行測定之聚合物之Mn為2,463,000,PDI為1.09。利用THF充分地洗淨自容器取出之基材。藉由分光橢圓偏光法測定於玻璃板之表面上形成之膜之膜厚,結果為2,028nm。根據較聚合物層(i)之膜厚而變厚,確認形成了於聚合物層(i)上積層有聚合物層(ii)之表面處理膜。將獲得之基材(表面處理膜賦予基材)設為SUB-7。 In an argon atmosphere, 0.00098 parts of EBiB, 0.080 parts of copper(II) bromide (CuBr 2 ), 0.46 parts of copper(I)(CuBr), 3.2 parts of 4,4'-dinonyl-2,2 '-Bipyridine (dNbpy), 100.1 parts of MMA, and 103.9 parts of anisole were put into a flask and stirred to prepare a polymerization solution. Put the SUB-2 which belongs to the polymer layer (i) as the base material into the screw-top container made of PTFE, fill the container with the prepared polymer solution, then add a stopper, and wrap a paraffin film on the lid. The container was put into an aluminum laminate bag, and heat-sealed while evacuating the gas. Put the container together with the aluminum laminate bag into a high-pressure device (PV-400) containing water as a pressurizing medium, heat it to 60°C, and pressurize it to 400MPa for 4 hours of polymerization. A high-viscosity solution containing polymer is generated in a high-pressure device, and a part of the polymer is taken as a sample for measurement. The Mn of the polymer is 2,463,000 and the PDI is 1.09. Use THF to thoroughly clean the substrate taken out of the container. The film thickness of the film formed on the surface of the glass plate was measured by spectroscopic ellipsometry, and the result was 2,028 nm. It was confirmed that it became thicker than the film thickness of the polymer layer (i), and it was confirmed that the surface treatment film which laminated|stacked the polymer layer (ii) on the polymer layer (i) was formed. The obtained substrate (surface-treated film-imparting substrate) was set to SUB-7.

(實施例3~5、比較例1、2:SUB-8~10、SUB-C-3、4) (Examples 3~5, Comparative Examples 1, 2: SUB-8~10, SUB-C-3, 4)

使用表4所示種類之聚合物層(i)賦予基材及單體,除此以外,以與上述實施例1或2相同之方式,獲得屬於表面處理膜賦予基材之SUB-8~10、SUB-C-3、4。將獲得之表面處理膜賦予基材之詳情示於表4。 The polymer layer (i) of the type shown in Table 4 was used to impart the substrate and the monomer, except for this, in the same manner as in Example 1 or 2 above, SUB-8 to 10 belonging to the surface treatment film imparted substrate were obtained. , SUB-C-3, 4. Table 4 shows the details of applying the obtained surface treatment film to the substrate.

[表4]

Figure 108143220-A0101-12-0024-10
[Table 4]
Figure 108143220-A0101-12-0024-10

<評價> <evaluation>

(評價(1):SUB-7) (Evaluation (1): SUB-7)

將實施例2所獲得之SUB-7於甲苯中浸漬一晚而使表面處理膜膨潤。使用摩擦試驗機(商品名「Heidon摩擦試驗機型號14」,新東科學公司製造),於荷重1,000g、振幅寬30mm、滑動速度200mm/min之條件下進行1,000次往返之球壓頭往返滑動試驗。資料解析之結果,摩擦係數為0.0020,1,000次往返後摩擦係數亦無變化。藉由雷射顯微鏡觀察滑動試驗後之表面,結果未發現磨耗。綜上確認SUB-7為低摩擦,且具有高耐久性。 The SUB-7 obtained in Example 2 was immersed in toluene overnight to swell the surface treatment film. Using a friction tester (trade name "Heidon Friction Tester Model 14", manufactured by Shinto Scientific Co., Ltd.), 1,000 reciprocating ball indenter reciprocating sliding under the conditions of a load of 1,000g, an amplitude of 30mm, and a sliding speed of 200mm/min test. As a result of data analysis, the friction coefficient is 0.0020, and there is no change in the friction coefficient after 1,000 round trips. The surface after the sliding test was observed with a laser microscope, and no wear was found. In summary, it is confirmed that SUB-7 has low friction and high durability.

(評價(2):SUB-10) (Evaluation (2): SUB-10)

代替甲苯而浸漬於己二酸二異十三烷基酯中,除此以外,以與上述評價(1)相同之方式,針對實施例5所獲得之SUB-10進行滑動試驗。其結果,摩擦係數為0.0018,1,000次往返後摩擦係數亦無變化。藉由雷射顯微鏡觀察滑動試驗後之表面,結果未發現磨耗。綜上確認SUB-10為低摩擦,且具有高耐久性。 Except that it was immersed in diisotridecyl adipate instead of toluene, a sliding test was performed on the SUB-10 obtained in Example 5 in the same manner as in the above-mentioned evaluation (1). As a result, the coefficient of friction was 0.0018, and there was no change in the coefficient of friction even after 1,000 round trips. The surface after the sliding test was observed with a laser microscope, and no wear was found. In summary, it is confirmed that SUB-10 has low friction and high durability.

(評價(3):SUB-C-3) (Evaluation (3): SUB-C-3)

以與上述評價(1)相同之方式,針對比較例1所獲得之SUB-C-3進行滑動試驗。其結果,初期之摩擦係數為0.002,但約500次往返後摩擦係數慢慢上升,1,000次往返後之摩擦係數成為0.05。藉由雷射顯微鏡觀察滑動試驗後之表面,結果觀察到磨耗痕。SUB-C-3係於玻璃板(Rz=15nm)上未形成聚合物層(i)而直接形成聚合物層 (ii)者。認為由於不存在聚合物層(i),而因玻璃板之表面粗度導致磨耗進展,摩擦係數上升。 In the same manner as in the above evaluation (1), a sliding test was performed on the SUB-C-3 obtained in Comparative Example 1. As a result, the initial friction coefficient was 0.002, but the friction coefficient gradually increased after about 500 reciprocations, and the friction coefficient after 1,000 reciprocations became 0.05. The surface after the sliding test was observed with a laser microscope, and as a result, abrasion marks were observed. SUB-C-3 is directly formed on the glass plate (Rz=15nm) without forming the polymer layer (i) (ii) Person. It is considered that since the polymer layer (i) is not present, the abrasion progresses due to the surface roughness of the glass plate, and the friction coefficient increases.

(評價(4):SUB-C-4) (Evaluation (4): SUB-C-4)

以與上述評價(1)相同之方式,針對比較例2所獲得之SUB-C-4進行滑動試驗。其結果,初期之摩擦係數為0.09,摩擦係數慢慢上升,約100次往返後之摩擦係數成為0.2。藉由雷射顯微鏡觀察滑動試驗後之表面,結果觀察到清晰之磨耗痕。SUB-C-4係於SUS板(Rz=0.8μm)上未形成聚合物層(i)而直接形成聚合物層(ii)者。認為由於SUS板之表面粗糙,故利用聚合物層(ii)產生之潤滑性缺乏,耐久性明顯降低。 In the same manner as in the above evaluation (1), the SUB-C-4 obtained in Comparative Example 2 was subjected to a sliding test. As a result, the initial friction coefficient was 0.09, the friction coefficient gradually increased, and the friction coefficient became 0.2 after about 100 round trips. The surface after the sliding test was observed with a laser microscope, and as a result, clear abrasion marks were observed. SUB-C-4 is directly formed on the SUS board (Rz=0.8μm) without forming the polymer layer (i) but directly forming the polymer layer (ii). It is believed that due to the rough surface of the SUS board, the lubricity generated by the polymer layer (ii) is lacking, and the durability is significantly reduced.

(產業上之可利用性) (Industrial availability)

本發明之表面處理膜可對基材之表面賦予低摩擦性、防附著性、親水性、疏水性或撥水性等性質。進而,與基材之密接性高,可提高基材之耐久性。因此,若使用本發明之表面處理膜,則可提供醫療用構件、電子材料、顯示器材料、半導體材料、機械零件、滑動構件、電池材料等各種領域中使用之零件等各種物品。 The surface treatment film of the present invention can impart properties such as low friction, anti-adhesion, hydrophilicity, hydrophobicity or water repellency to the surface of the substrate. Furthermore, the adhesion to the substrate is high, and the durability of the substrate can be improved. Therefore, if the surface treatment film of the present invention is used, various articles such as parts used in various fields such as medical parts, electronic materials, display materials, semiconductor materials, mechanical parts, sliding parts, and battery materials can be provided.

Claims (9)

一種表面處理膜,其係設置於基材之表面上者, A surface treatment film, which is arranged on the surface of the substrate, 其具有包含配置於上述基材之表面側之聚合物層(i)、及形成於上述聚合物層(i)上之聚合物層(ii)的積層構造, It has a laminated structure including a polymer layer (i) arranged on the surface side of the above-mentioned substrate, and a polymer layer (ii) formed on the above-mentioned polymer layer (i), 上述聚合物層(i)含有第1聚合物,該第1聚合物包含來自下述通式(1)所表示之單體的構成單位, The polymer layer (i) contains a first polymer, and the first polymer contains a structural unit derived from a monomer represented by the following general formula (1), 上述聚合物層(ii)含有第2聚合物,該第2聚合物包含來自從由芳香族乙烯基系單體、(甲基)丙烯酸酯系單體及(甲基)丙烯醯胺系單體所構成之群組選擇之一種以上單體的構成單位,且以下述通式(1)所表示之單體之官能基為聚合起始點進行延長; The polymer layer (ii) contains a second polymer, and the second polymer contains a monomer derived from an aromatic vinyl monomer, a (meth)acrylate monomer, and a (meth)acrylamide monomer The constituent unit of one or more monomers selected by the constituted group, and the functional group of the monomer represented by the following general formula (1) is used as the polymerization starting point for extension;
Figure 108143220-A0101-13-0001-11
Figure 108143220-A0101-13-0001-11
(上述通式(1)中,R1表示氫原子或甲基,X表示O或NH,R2表示任意之有機基,R3及R4分別獨立地表示氫原子、烷基、芳基或醯基,並且R3及R4所鍵結之碳原子為三級碳原子或四級碳原子,Y表示氯原子、溴原子或碘原子)。 (In the above general formula (1), R 1 represents a hydrogen atom or a methyl group, X represents O or NH, R 2 represents an arbitrary organic group, and R 3 and R 4 each independently represent a hydrogen atom, an alkyl group, an aryl group or The carbon atom to which R 3 and R 4 are bonded is a tertiary carbon atom or a quaternary carbon atom, and Y represents a chlorine atom, a bromine atom, or an iodine atom).
如請求項1之表面處理膜,其中,上述第1聚合物係含有30質量%以上之來自上述通式(1)所表示之單體的構成單位。 The surface treatment film of claim 1, wherein the first polymer contains 30% by mass or more of the constituent unit derived from the monomer represented by the general formula (1). 如請求項1之表面處理膜,其中,上述第1聚合物係進而包含來自具有從由烷氧基矽基、(甲基)丙烯醯氧基、環氧基、異氰酸基、嵌段異氰酸基、羥基、羧基及磷酸基所構成之群組 選擇之反應性官能基之自由基聚合性單體的構成單位。 The surface treatment film of claim 1, wherein the above-mentioned first polymer system further comprises a polymer having a alkoxysilyl group, a (meth)acryloyloxy group, an epoxy group, an isocyanate group, and a blocked isocyanate group. The group consisting of cyanate, hydroxyl, carboxyl and phosphoric acid groups The constituent unit of the radical polymerizable monomer of the selected reactive functional group. 如請求項3之表面處理膜,其中,上述第1聚合物係具有交聯構造。 The surface treatment film of claim 3, wherein the first polymer has a cross-linked structure. 如請求項1至4中任一項之表面處理膜,其中,上述聚合物層(ii)係含有溶劑而膨潤。 The surface treatment film according to any one of claims 1 to 4, wherein the polymer layer (ii) contains a solvent and swells. 一種表面處理膜之製造方法,其係請求項1至5中任一項之表面處理膜之製造方法,其具有如下步驟: A method for manufacturing a surface treatment film, which is the method for manufacturing a surface treatment film according to any one of claims 1 to 5, and has the following steps: 於上述基材之表面上配置上述聚合物層(i);及 Disposing the aforementioned polymer layer (i) on the surface of the aforementioned substrate; and 於常壓~1,000MPa之壓力條件下,於上述聚合物層(i)之存在下,使從由芳香族乙烯基系單體、(甲基)丙烯酸酯系單體及(甲基)丙烯醯胺系單體所構成之群組選擇之一種以上單體進行表面起始自由基聚合或表面起始活性自由基聚合,而於上述聚合物層(i)上形成上述聚合物層(ii)。 Under normal pressure~1,000MPa pressure conditions, in the presence of the above polymer layer (i), from aromatic vinyl monomers, (meth)acrylate monomers and (meth)acrylic acid monomers One or more monomers selected from the group consisting of amine-based monomers undergo surface-initiated radical polymerization or surface-initiated living radical polymerization to form the above-mentioned polymer layer (ii) on the above-mentioned polymer layer (i). 如請求項6之表面處理膜之製造方法,其進而於從由鹵化四級銨鹽、鹵化四級鏻鹽及鹵化鹼金屬鹽所構成之群組選擇之至少一種鹽之共存下,進行表面起始自由基聚合或表面起始活性自由基聚合,而於上述聚合物層(i)上形成上述聚合物層(ii)。 Such as the method of manufacturing a surface treatment film of claim 6, which further performs surface treatment under the coexistence of at least one salt selected from the group consisting of halogenated quaternary ammonium salt, halogenated quaternary phosphonium salt, and halogenated alkali metal salt. Initiation of radical polymerization or surface initiation of living radical polymerization, and the above-mentioned polymer layer (ii) is formed on the above-mentioned polymer layer (i). 一種物品,其具備: An item that has: 基材,及 Substrate, and 設置於上述基材之表面上之請求項1至5中任一項之表面處理膜。 The surface treatment film of any one of claims 1 to 5 provided on the surface of the above-mentioned substrate. 如請求項8之物品,其中,上述聚合物層(i)之膜厚係較上述基材之表面之表面粗度之最大高度Rz厚。 The article according to claim 8, wherein the film thickness of the polymer layer (i) is thicker than the maximum height Rz of the surface roughness of the substrate.
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