TWI812781B - Manufacturing method of surface modified substrate - Google Patents
Manufacturing method of surface modified substrate Download PDFInfo
- Publication number
- TWI812781B TWI812781B TW108133252A TW108133252A TWI812781B TW I812781 B TWI812781 B TW I812781B TW 108133252 A TW108133252 A TW 108133252A TW 108133252 A TW108133252 A TW 108133252A TW I812781 B TWI812781 B TW I812781B
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- Prior art keywords
- meth
- polymer
- group
- polymerization
- molecular weight
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 45
- 239000000758 substrate Substances 0.000 title claims description 67
- 229920000642 polymer Polymers 0.000 claims abstract description 127
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 76
- 239000000178 monomer Substances 0.000 claims abstract description 43
- 239000000463 material Substances 0.000 claims abstract description 34
- 229920000058 polyacrylate Polymers 0.000 claims abstract description 27
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 21
- 150000003839 salts Chemical class 0.000 claims abstract description 19
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 14
- 230000000379 polymerizing effect Effects 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 33
- 239000002904 solvent Substances 0.000 claims description 24
- 239000003795 chemical substances by application Substances 0.000 claims description 17
- 239000003960 organic solvent Substances 0.000 claims description 15
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims description 11
- 125000002252 acyl group Chemical group 0.000 claims description 10
- 125000003118 aryl group Chemical group 0.000 claims description 10
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 9
- 238000005227 gel permeation chromatography Methods 0.000 claims description 9
- 230000004048 modification Effects 0.000 claims description 8
- 238000012986 modification Methods 0.000 claims description 8
- DPKBAXPHAYBPRL-UHFFFAOYSA-M tetrabutylazanium;iodide Chemical compound [I-].CCCC[N+](CCCC)(CCCC)CCCC DPKBAXPHAYBPRL-UHFFFAOYSA-M 0.000 claims description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims description 7
- KGPZZJZTFHCXNK-UHFFFAOYSA-M tetraoctylazanium;iodide Chemical compound [I-].CCCCCCCC[N+](CCCCCCCC)(CCCCCCCC)CCCCCCCC KGPZZJZTFHCXNK-UHFFFAOYSA-M 0.000 claims description 7
- 239000004793 Polystyrene Substances 0.000 claims description 6
- 125000003368 amide group Chemical group 0.000 claims description 6
- 238000009826 distribution Methods 0.000 claims description 6
- 125000004185 ester group Chemical group 0.000 claims description 6
- 229920002223 polystyrene Polymers 0.000 claims description 6
- 238000009835 boiling Methods 0.000 claims description 5
- 125000004093 cyano group Chemical group *C#N 0.000 claims description 5
- 238000004381 surface treatment Methods 0.000 claims description 5
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 claims description 4
- 150000001408 amides Chemical class 0.000 claims description 4
- 239000004202 carbamide Substances 0.000 claims description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims description 4
- 239000002608 ionic liquid Substances 0.000 claims description 3
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 claims description 2
- KXHPPCXNWTUNSB-UHFFFAOYSA-M benzyl(trimethyl)azanium;chloride Chemical group [Cl-].C[N+](C)(C)CC1=CC=CC=C1 KXHPPCXNWTUNSB-UHFFFAOYSA-M 0.000 claims description 2
- YIFWXQBNRQNUON-UHFFFAOYSA-M dodecyl(trimethyl)azanium;iodide Chemical compound [I-].CCCCCCCCCCCC[N+](C)(C)C YIFWXQBNRQNUON-UHFFFAOYSA-M 0.000 claims description 2
- HIACZXUUKNSHAN-UHFFFAOYSA-M trimethyl(octadecyl)azanium;iodide Chemical compound [I-].CCCCCCCCCCCCCCCCCC[N+](C)(C)C HIACZXUUKNSHAN-UHFFFAOYSA-M 0.000 claims description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 claims 1
- LYHDELLYKJQCCE-UHFFFAOYSA-M methyl(trioctadecyl)azanium;iodide Chemical compound [I-].CCCCCCCCCCCCCCCCCC[N+](C)(CCCCCCCCCCCCCCCCCC)CCCCCCCCCCCCCCCCCC LYHDELLYKJQCCE-UHFFFAOYSA-M 0.000 claims 1
- 229910052723 transition metal Inorganic materials 0.000 claims 1
- 150000003624 transition metals Chemical class 0.000 claims 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 abstract description 8
- 150000001875 compounds Chemical class 0.000 abstract description 7
- 229910052760 oxygen Inorganic materials 0.000 abstract description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 abstract description 2
- 229910052801 chlorine Inorganic materials 0.000 abstract 1
- 125000001309 chloro group Chemical group Cl* 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 31
- -1 quaternary ammonium halide salts Chemical class 0.000 description 31
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 29
- 239000002585 base Substances 0.000 description 19
- 239000007858 starting material Substances 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 11
- 239000010703 silicon Substances 0.000 description 11
- LBVMWHCOFMFPEG-UHFFFAOYSA-N 3-methoxy-n,n-dimethylpropanamide Chemical compound COCCC(=O)N(C)C LBVMWHCOFMFPEG-UHFFFAOYSA-N 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 229910052799 carbon Inorganic materials 0.000 description 8
- 125000004432 carbon atom Chemical group C* 0.000 description 8
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 7
- 229910052736 halogen Inorganic materials 0.000 description 7
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 150000002367 halogens Chemical group 0.000 description 6
- 239000004033 plastic Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 150000003254 radicals Chemical class 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 5
- 238000010560 atom transfer radical polymerization reaction Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229940107816 ammonium iodide Drugs 0.000 description 4
- 150000001723 carbon free-radicals Chemical class 0.000 description 4
- 229920006158 high molecular weight polymer Polymers 0.000 description 4
- XMBWDFGMSWQBCA-UHFFFAOYSA-M iodide Chemical compound [I-] XMBWDFGMSWQBCA-UHFFFAOYSA-M 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 4
- 125000001453 quaternary ammonium group Chemical group 0.000 description 4
- 238000010526 radical polymerization reaction Methods 0.000 description 4
- 238000005070 sampling Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000005456 alcohol based solvent Substances 0.000 description 3
- 229910001508 alkali metal halide Inorganic materials 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- AOJOEFVRHOZDFN-UHFFFAOYSA-N benzyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1=CC=CC=C1 AOJOEFVRHOZDFN-UHFFFAOYSA-N 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- 239000011247 coating layer Substances 0.000 description 3
- 150000004696 coordination complex Chemical class 0.000 description 3
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000004210 ether based solvent Substances 0.000 description 3
- IOLQWGVDEFWYNP-UHFFFAOYSA-N ethyl 2-bromo-2-methylpropanoate Chemical compound CCOC(=O)C(C)(C)Br IOLQWGVDEFWYNP-UHFFFAOYSA-N 0.000 description 3
- 239000002808 molecular sieve Substances 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 3
- 229910010271 silicon carbide Inorganic materials 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- URGAHOPLAPQHLN-UHFFFAOYSA-N sodium aluminosilicate Chemical compound [Na+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O URGAHOPLAPQHLN-UHFFFAOYSA-N 0.000 description 3
- 238000003786 synthesis reaction Methods 0.000 description 3
- JRMUNVKIHCOMHV-UHFFFAOYSA-M tetrabutylammonium bromide Chemical compound [Br-].CCCC[N+](CCCC)(CCCC)CCCC JRMUNVKIHCOMHV-UHFFFAOYSA-M 0.000 description 3
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonium chloride Substances [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- ORILYTVJVMAKLC-UHFFFAOYSA-N adamantane Chemical compound C1C(C2)CC3CC1CC2C3 ORILYTVJVMAKLC-UHFFFAOYSA-N 0.000 description 2
- 229910001516 alkali metal iodide Chemical class 0.000 description 2
- 125000005370 alkoxysilyl group Chemical group 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 235000011114 ammonium hydroxide Nutrition 0.000 description 2
- 229920005601 base polymer Polymers 0.000 description 2
- 210000000941 bile Anatomy 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000000306 component Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- 239000012769 display material Substances 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N dodecane Chemical compound CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910001385 heavy metal Inorganic materials 0.000 description 2
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 2
- 230000005764 inhibitory process Effects 0.000 description 2
- 150000004694 iodide salts Chemical class 0.000 description 2
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- LSMAIBOZUPTNBR-UHFFFAOYSA-N phosphanium;iodide Chemical class [PH4+].[I-] LSMAIBOZUPTNBR-UHFFFAOYSA-N 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 102000004169 proteins and genes Human genes 0.000 description 2
- 108090000623 proteins and genes Proteins 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 1
- JEKYMVBQWWZVHO-UHFFFAOYSA-N 1-chloro-2,2-dimethylpropane Chemical compound CC(C)(C)CCl JEKYMVBQWWZVHO-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- JOLQKTGDSGKSKJ-UHFFFAOYSA-N 1-ethoxypropan-2-ol Chemical compound CCOCC(C)O JOLQKTGDSGKSKJ-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- WCSFWJIABFJVKW-UHFFFAOYSA-M 1-nonylpyridin-1-ium;chloride Chemical compound [Cl-].CCCCCCCCC[N+]1=CC=CC=C1 WCSFWJIABFJVKW-UHFFFAOYSA-M 0.000 description 1
- ZMNFBUFSXBSEIP-UHFFFAOYSA-N 2-(2-bromo-2-methylpropoxy)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCC(C)(C)Br ZMNFBUFSXBSEIP-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 1
- DBESYUOJKJZGLV-UHFFFAOYSA-N 2-iodo-2-methylpropanenitrile Chemical compound CC(C)(I)C#N DBESYUOJKJZGLV-UHFFFAOYSA-N 0.000 description 1
- KANCEDLWHJRDBS-UHFFFAOYSA-N 3-(2-bromo-2-methylpropoxy)propyl-trimethoxysilane Chemical compound BrC(COCCC[Si](OC)(OC)OC)(C)C KANCEDLWHJRDBS-UHFFFAOYSA-N 0.000 description 1
- SCSCNTOYWUFFCE-UHFFFAOYSA-N 3-butoxy-n,n-dimethylpropan-1-amine Chemical compound CCCCOCCCN(C)C SCSCNTOYWUFFCE-UHFFFAOYSA-N 0.000 description 1
- LDMRLRNXHLPZJN-UHFFFAOYSA-N 3-propoxypropan-1-ol Chemical compound CCCOCCCO LDMRLRNXHLPZJN-UHFFFAOYSA-N 0.000 description 1
- DQFMPTUTAAIXAN-UHFFFAOYSA-N 4,4-dimethyl-1h-imidazol-5-one Chemical compound CC1(C)NC=NC1=O DQFMPTUTAAIXAN-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- ZCYVEMRRCGMTRW-UHFFFAOYSA-N 7553-56-2 Chemical compound [I] ZCYVEMRRCGMTRW-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- MCMNRKCIXSYSNV-UHFFFAOYSA-N ZrO2 Inorganic materials O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 1
- MZVQCMJNVPIDEA-UHFFFAOYSA-N [CH2]CN(CC)CC Chemical group [CH2]CN(CC)CC MZVQCMJNVPIDEA-UHFFFAOYSA-N 0.000 description 1
- RMKZLFMHXZAGTM-UHFFFAOYSA-N [dimethoxy(propyl)silyl]oxymethyl prop-2-enoate Chemical compound CCC[Si](OC)(OC)OCOC(=O)C=C RMKZLFMHXZAGTM-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 125000005250 alkyl acrylate group Chemical group 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- MBQXUMAOBLRIOQ-UHFFFAOYSA-N bis(trifluoromethylsulfonyl)azanide ethyl-(3-methoxypropyl)-dimethylazanium Chemical compound CC[N+](C)(C)CCCOC.FC(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)F MBQXUMAOBLRIOQ-UHFFFAOYSA-N 0.000 description 1
- WUFQNPMBKMKEHN-UHFFFAOYSA-N bis(trifluoromethylsulfonyl)azanide;diethyl-(2-methoxyethyl)-methylazanium Chemical compound CC[N+](C)(CC)CCOC.FC(F)(F)S(=O)(=O)[N-]S(=O)(=O)C(F)(F)F WUFQNPMBKMKEHN-UHFFFAOYSA-N 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 150000003842 bromide salts Chemical class 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- KBLWLMPSVYBVDK-UHFFFAOYSA-N cyclohexyl prop-2-enoate Chemical compound C=CC(=O)OC1CCCCC1 KBLWLMPSVYBVDK-UHFFFAOYSA-N 0.000 description 1
- BXHHZLMBMOBPEH-UHFFFAOYSA-N diethyl-(2-methoxyethyl)-methylazanium Chemical compound CC[N+](C)(CC)CCOC BXHHZLMBMOBPEH-UHFFFAOYSA-N 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- 239000004205 dimethyl polysiloxane Substances 0.000 description 1
- 229910001873 dinitrogen Inorganic materials 0.000 description 1
- 238000003618 dip coating Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- ZJXZSIYSNXKHEA-UHFFFAOYSA-N ethyl dihydrogen phosphate Chemical compound CCOP(O)(O)=O ZJXZSIYSNXKHEA-UHFFFAOYSA-N 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000003779 heat-resistant material Substances 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000012770 industrial material Substances 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 229910052740 iodine Inorganic materials 0.000 description 1
- 239000011630 iodine Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 239000006247 magnetic powder Substances 0.000 description 1
- 239000012567 medical material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- FSAJWMJJORKPKS-UHFFFAOYSA-N octadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCOC(=O)C=C FSAJWMJJORKPKS-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000009931 pascalization Methods 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 125000002467 phosphate group Chemical group [H]OP(=O)(O[H])O[*] 0.000 description 1
- 150000004714 phosphonium salts Chemical group 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- ROSDSFDQCJNGOL-UHFFFAOYSA-N protonated dimethyl amine Natural products CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- HNJBEVLQSNELDL-UHFFFAOYSA-N pyrrolidin-2-one Chemical compound O=C1CCCN1 HNJBEVLQSNELDL-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000007870 radical polymerization initiator Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000006479 redox reaction Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 1
- RNVYQYLELCKWAN-UHFFFAOYSA-N solketal Chemical compound CC1(C)OCC(CO)O1 RNVYQYLELCKWAN-UHFFFAOYSA-N 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 230000001954 sterilising effect Effects 0.000 description 1
- 238000004659 sterilization and disinfection Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- CCIYPTIBRAUPLQ-UHFFFAOYSA-M tetrabutylphosphanium;iodide Chemical compound [I-].CCCC[P+](CCCC)(CCCC)CCCC CCIYPTIBRAUPLQ-UHFFFAOYSA-M 0.000 description 1
- WAGFXJQAIZNSEQ-UHFFFAOYSA-M tetraphenylphosphonium chloride Chemical compound [Cl-].C1=CC=CC=C1[P+](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 WAGFXJQAIZNSEQ-UHFFFAOYSA-M 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XMRGUUXVQWPMAO-UHFFFAOYSA-M tributyl(5-phenylpentyl)azanium iodide Chemical compound [I-].C(C1=CC=CC=C1)CCCC[N+](CCCC)(CCCC)CCCC XMRGUUXVQWPMAO-UHFFFAOYSA-M 0.000 description 1
- SDSMZSUWTYFEBO-UHFFFAOYSA-M tributyl(methyl)phosphanium;bromide Chemical compound [Br-].CCCC[P+](C)(CCCC)CCCC SDSMZSUWTYFEBO-UHFFFAOYSA-M 0.000 description 1
- 125000001889 triflyl group Chemical group FC(F)(F)S(*)(=O)=O 0.000 description 1
- PZJJKWKADRNWSW-UHFFFAOYSA-N trimethoxysilicon Chemical group CO[Si](OC)OC PZJJKWKADRNWSW-UHFFFAOYSA-N 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F292/00—Macromolecular compounds obtained by polymerising monomers on to inorganic materials
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F4/00—Polymerisation catalysts
Landscapes
- Chemical & Material Sciences (AREA)
- Medicinal Chemistry (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Inorganic Chemistry (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Laminated Bodies (AREA)
- Polymerisation Methods In General (AREA)
- Graft Or Block Polymers (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
本發明所提供的聚合物之製造方法,係使用可輕易取得的材料,且聚合條件不需要嚴格管理,依較溫和之條件亦能獲得習知屬困難的高分子量(甲基)丙烯酸系聚合物。本發明的聚合物之製造方法,係包括有:在100~1,000MPa的壓力條件下、60℃以上的溫度條件下,且在具一般式(1)或(2)所示起始基的起始化合物、與鹵化四級銨鹽等鹽的共存下,使(甲基)丙烯酸系單體進行聚合,形成數量平均分子量為100,000~10,000,000之(甲基)丙烯酸系聚合物的步驟。 The polymer manufacturing method provided by the present invention uses easily available materials, and the polymerization conditions do not need to be strictly controlled. High molecular weight (meth)acrylic polymers that are conventionally difficult can also be obtained under relatively mild conditions. . The manufacturing method of the polymer of the present invention includes: under a pressure condition of 100 to 1,000 MPa, a temperature condition above 60°C, and starting with a starting group represented by the general formula (1) or (2). A step of polymerizing (meth)acrylic acid-based monomers in the coexistence of original compounds and salts such as halogenated quaternary ammonium salts to form a (meth)acrylic-based polymer with a number average molecular weight of 100,000 to 10,000,000.
Description
本發明係關於高分子量聚合物((甲基)丙烯酸系聚合物)之製造方法、及表面改質基材之製造方法。 The present invention relates to a method for producing a high molecular weight polymer ((meth)acrylic polymer) and a method for producing a surface modification base material.
近年,有研究利用1990年代發展的活性自由基聚合技術高密度地接枝於基板上之所謂「濃厚聚合物刷」(Concentrated Polymer Brush)。該濃厚聚合物刷係由高分子鏈依1~4nm間隔的高密度接枝於基板上。利用此種濃厚聚合物刷改質基材表面,便可賦予低摩擦性、抑制蛋白質吸附、分子篩特性、親水性、撥水性等等特徵(例如專利文獻1及2、非專利文獻1~3)。 In recent years, there has been research on the so-called "Concentrated Polymer Brush" that uses the living radical polymerization technology developed in the 1990s to graft high-density onto the substrate. The thick polymer brush is composed of polymer chains grafted onto the substrate at a high density with intervals of 1 to 4 nm. By using this thick polymer brush to modify the surface of the substrate, you can impart features such as low friction, protein adsorption inhibition, molecular sieve properties, hydrophilicity, water repellency, etc. (e.g. Patent Documents 1 and 2, Non-Patent Documents 1 to 3) .
[專利文獻1]日本專利特開2008-133434號公報 [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-133434
[專利文獻2]日本專利特開2010-261001號公報 [Patent Document 2] Japanese Patent Application Publication No. 2010-261001
[非專利文獻1]Adv. Polym. Sci., 2006, 197, 1-45 [Non-patent document 1] Adv. Polym. Sci., 2006, 197, 1-45
[非專利文獻2]J. Am. Chem. Soc., 2005, 127, 15843-15847 [Non-patent document 2] J. Am. Chem. Soc., 2005, 127, 15843-15847
[非專利文獻3]Polym. Chem., 2012, 3, 148-153 [Non-patent document 3]Polym. Chem., 2012, 3, 148-153
習知濃厚聚合物刷幾乎係利用原子轉移自由基聚合法製造。原子轉移自由基聚合法係屬於活性自由基聚合法之一種,將鹵等起始基導入於基板上,再利用以銅或釕等之金屬錯合物為觸媒的氧化還原反應之聚合法。但是,原子轉移自由基聚合法在除去所使用銅等重金屬時較費工夫。又,因重金屬的使用,亦會有對環境造成負擔的顧慮。又,原子轉移自由基聚合法係需要單體或材料的精製,且需要嚴格管理氧濃度等聚合條件等,屬於略繁雜的方法。 Conventional thick polymer brushes are almost always produced by atom transfer radical polymerization. The atom transfer radical polymerization method is a type of living radical polymerization method. It introduces initiating groups such as halogen onto the substrate, and then utilizes a redox reaction using a metal complex such as copper or ruthenium as a catalyst. However, the atom transfer radical polymerization method is time-consuming to remove heavy metals such as copper used. In addition, due to the use of heavy metals, there are also concerns about the burden on the environment. In addition, the atom transfer radical polymerization method requires purification of monomers or materials, and strict management of polymerization conditions such as oxygen concentration, etc., making it a somewhat complicated method.
本發明係有鑑於此種習知技術的問題而完成,其課題在於提供:使用可輕易取得的材料,且聚合條件不需要嚴格管理,依較溫和之條件亦能獲得習知屬困難的高分子量(甲基)丙烯酸系聚合物之聚合物之製造方法。又,本發明之課題在於提供:使用可輕易取得的材料,且聚合條件不需要嚴格管理,依較溫和之條件亦能形成由習知屬困難的高分子量(甲基)丙烯酸系聚合物所構成具充分厚度之聚合物層的表面改質基材之製造方法。 The present invention was completed in view of the problems of this conventional technology, and its object is to provide a method that can obtain a high molecular weight that is conventionally difficult by using easily available materials, and the polymerization conditions do not need to be strictly controlled, and can be obtained under relatively mild conditions. A method for producing a (meth)acrylic polymer. Furthermore, an object of the present invention is to provide a polymer that can be formed from a high molecular weight (meth)acrylic polymer that is conventionally difficult using easily available materials and without strict control of polymerization conditions under relatively mild conditions. Method for manufacturing a surface-modified substrate with a sufficiently thick polymer layer.
即,根據本發明可提供以下所示聚合物之製造方法。 That is, according to the present invention, a method for producing the polymer shown below can be provided.
[1]一種聚合物之製造方法,係包括有:在100~1,000MPa的壓 力條件下、60℃以上的溫度條件下、以及起始化合物與鹽的共存下,使(甲基)丙烯酸系單體進行聚合,形成利用凝膠滲透色層分析儀所測定聚苯乙烯換算的數量平均分子量為100,000~10,000,000之(甲基)丙烯酸系聚合物的步驟;其中,上述起始化合物係具有下述一般式(1)或(2)所示起始基;且,上述鹽係從鹵化四級銨鹽、鹵化四級鏻鹽、及鹵化鹼金屬鹽所構成群組中選擇之至少一種。 [1] A method for manufacturing a polymer, which includes: applying a pressure of 100 to 1,000 MPa The (meth)acrylic acid-based monomer is polymerized under strong conditions, a temperature of 60°C or above, and the coexistence of the starting compound and a salt to form a polystyrene equivalent measured by a gel permeation chromatography analyzer. A step of producing a (meth)acrylic polymer with a number average molecular weight of 100,000 to 10,000,000; wherein, the above starting compound has a starting group represented by the following general formula (1) or (2); and, the above salt is derived from At least one selected from the group consisting of quaternary ammonium halide salts, quaternary phosphonium halide salts, and alkali metal halide salts.
(上述一般式(1)中,X係表示氯原子、溴原子、或碘原子;R1係表示氫原子、烷基、芳基、氰基、醯基、羧基、酯基、或醯胺基;R2係表示烷基、芳基、氰基、醯基、羧基、酯基、或醯胺基;「*」係表示鍵結位置) (In the above-mentioned general formula ( 1 ), ; R 2 represents an alkyl group, aryl group, cyano group, acyl group, carboxyl group, ester group, or amide group; "*" represents a bonding position)
(上述一般式(2)中,X係表示氯原子、溴原子、或碘原子;Y係表示O或NH;R3係表示氫原子、烷基、芳基、或醯基;R4係表示烷基、芳基、或醯基;「*」係表示鍵結位置) (In the above-mentioned general formula (2) , Alkyl, aryl, or acyl group; "*" indicates the bonding position)
[2]如上述[1]所記載的聚合物之製造方法,其係在從醇系溶劑、二醇系溶劑、醯胺系溶劑、醚系溶劑、亞碸系溶劑、脲系溶劑、及離子液體所構成群組中選擇之至少一種有機溶劑中,於上述有機溶劑的沸點以下之溫度條件下,使上述(甲基)丙烯酸系單體進行聚 合。 [2] The method for producing a polymer according to the above [1], wherein the polymer is produced from an alcohol-based solvent, a glycol-based solvent, an amide-based solvent, an ether-based solvent, a trine-based solvent, a urea-based solvent, and an ion-based solvent. In at least one organic solvent selected from the group consisting of liquids, the above-mentioned (meth)acrylic monomer is polymerized under temperature conditions below the boiling point of the above-mentioned organic solvent. combine.
[3]如上述[1]或[2]所記載的聚合物之製造方法,其中,上述鹽係從碘化四級銨鹽、碘化四級鏻鹽、及碘化鹼金屬鹽所構成群組中選擇之至少一種。 [3] The method for producing a polymer according to the above [1] or [2], wherein the salt is a group consisting of a quaternary ammonium iodide salt, a quaternary phosphonium iodide salt, and an alkali metal iodide salt. Choose at least one from the group.
[4]如上述[1]~[3]中任一項所記載的聚合物之製造方法,其中,所獲得上述(甲基)丙烯酸系聚合物的分子量分佈(重量平均分子量/數量平均分子量)係1.8以下。 [4] The method for producing a polymer according to any one of the above [1] to [3], wherein the obtained (meth)acrylic polymer has a molecular weight distribution (weight average molecular weight/number average molecular weight) It is below 1.8.
再者,根據本發明可提供以下所示表面改質基材之製造方法。 Furthermore, according to the present invention, a method for manufacturing a surface-modified substrate shown below can be provided.
[5]一種表面改質基材之製造方法,係包括有:利用具有下述一般式(1)或(2)所示起始基、與烷氧矽烷基的處理劑,對基材施行表面處理,而獲得處理基材的步驟;以及在100~1,000MPa的壓力條件下、60℃以上的溫度條件下、以及上述處理基材與鹽的共存下,使(甲基)丙烯酸系單體進行聚合,形成利用凝膠滲透色層分析儀所測定聚苯乙烯換算的數量平均分子量為100,000~10,000,000之(甲基)丙烯酸系聚合物,而在上述處理基材的表面上,配置含有上述(甲基)丙烯酸系聚合物、且厚度100nm以上之聚合物層的步驟。 [5] A method for manufacturing a surface-modified substrate, which includes: using a treatment agent having a starting group represented by the following general formula (1) or (2) and an alkoxysilane group to perform surface treatment on the substrate. The step of treating to obtain a treated base material; and causing the (meth)acrylic monomer to process Polymerize to form a (meth)acrylic polymer with a number average molecular weight of 100,000 to 10,000,000 in terms of polystyrene as measured by a gel permeation chromatography analyzer, and on the surface of the above-mentioned treated substrate, a layer containing the above (meth)acrylic polymer is disposed. base) acrylic polymer and a polymer layer with a thickness of 100 nm or more.
(上述一般式(1)中,X係表示氯原子、溴原子、或碘原子;R1係表示氫原子、烷基、芳基、氰基、醯基、羧基、酯基、或醯胺基;R2係表示烷基、芳基、氰基、醯基、羧基、酯基、或醯胺基;「*」係表示鍵結位置) (In the above-mentioned general formula ( 1 ), ; R 2 represents an alkyl group, aryl group, cyano group, acyl group, carboxyl group, ester group, or amide group; "*" represents a bonding position)
(上述一般式(2)中,X係表示氯原子、溴原子、或碘原子;Y係表示O或NH;R3係表示氫原子、烷基、芳基、或醯基;R4係表示烷基、芳基、或醯基;「*」係表示鍵結位置)(對照先前技術之功效) (In the above-mentioned general formula (2) , Alkyl, aryl, or acyl group; "*" indicates the bonding position) (compare the efficacy of the previous technology)
根據本發明,可提供:使用可輕易取得的材料,且聚合條件不需要嚴格管理,依較溫和之條件亦能獲得習知屬困難的高分子量(甲基)丙烯酸系聚合物之聚合物之製造方法。又,根據本發明,可提供:使用可輕易取得的材料,且聚合條件不需要嚴格管理,依較溫和之條件亦能形成由習知屬困難的高分子量(甲基)丙烯酸系聚合物所構成具充分厚度之聚合物層的表面改質基材之製造方法。即,藉由利用本發明聚合物之製造方法,便可製造對其表面賦予各種性質之零件或構件等的基材。 According to the present invention, it is possible to provide a polymer that can obtain a high molecular weight (meth)acrylic polymer, which is conventionally difficult, using easily available materials, and the polymerization conditions do not need to be strictly controlled, and can be produced under relatively mild conditions. method. Furthermore, according to the present invention, it is possible to provide that high molecular weight (meth)acrylic polymers, which are conventionally difficult, can be formed using easily available materials, and the polymerization conditions do not need to be strictly controlled, and can be formed under relatively mild conditions. Method for manufacturing a surface-modified substrate with a sufficiently thick polymer layer. That is, by utilizing the production method of the polymer of the present invention, it is possible to produce base materials such as parts or members whose surfaces are provided with various properties.
<聚合物之製造方法> <Production method of polymer>
以下,針對本發明的實施形態進行說明,惟,本發明並不侷限於以下實施形態。本發明的聚合物之製造方法,係包括有:在100~1,000MPa的壓力條件下、60℃以上的溫度條件下、以及起始 化合物與鹽的共存下,使(甲基)丙烯酸系單體進行聚合,形成利用凝膠滲透色層分析儀所測定聚苯乙烯換算的數量平均分子量為100,000~10,000,000之(甲基)丙烯酸系聚合物的步驟(聚合步驟)。 Hereinafter, embodiments of the present invention will be described, but the present invention is not limited to the following embodiments. The manufacturing method of the polymer of the present invention includes: under pressure conditions of 100~1,000MPa, under temperature conditions above 60°C, and starting In the coexistence of the compound and the salt, the (meth)acrylic monomer is polymerized to form a (meth)acrylic polymer with a polystyrene-converted number average molecular weight of 100,000 to 10,000,000 as measured by a gel permeation chromatography analyzer. material step (polymerization step).
(聚合步驟) (polymerization step)
聚合步驟係在100~1,000MPa、較佳係在200~800MPa、更佳係在300~600MPa的壓力條件下進行聚合。具體而言,對已裝入(甲基)丙烯酸系單體的聚合容器全體,一邊經由水等介質均勻地賦予壓力,一邊進行聚合。藉由在賦予壓力的狀態下進行自由基聚合,而抑制反應停止,便可形成更高分子量的(甲基)丙烯酸系聚合物。若壓力未滿100MPa,便無法獲得目標之高分子量聚合物。另一方面,準備能承受超過1,000MPa壓力的容器或裝置之事屬困難,不符實用性。 The polymerization step is carried out under pressure conditions of 100~1,000MPa, preferably 200~800MPa, and more preferably 300~600MPa. Specifically, polymerization is performed while uniformly applying pressure to the entire polymerization container in which the (meth)acrylic acid-based monomer has been placed via a medium such as water. By performing radical polymerization under pressure and suppressing reaction cessation, a (meth)acrylic polymer with a higher molecular weight can be formed. If the pressure is less than 100MPa, the target high molecular weight polymer cannot be obtained. On the other hand, it is difficult and impractical to prepare containers or devices that can withstand pressures exceeding 1,000MPa.
聚合容器較佳係使用能密閉、且能承受高壓的容器。又,壓力必需傳遞至容器內部,因而較佳係使用具有塑膠製軟質部分或伸縮部分等之會因壓力產生變形部分的容器。具體而言,可使用:聚乙烯製瓶、寶特瓶、殺菌袋、泡殼容器等各種容器。又,較佳係由不易因聚合時的溫度產生變形、具有耐熱性的素材構成之容器。又,較佳係聚合用溶劑等不易侵入、具有耐藥性或耐溶劑性等特性的素材所構成之容器。構成聚合容器的素材,係可舉例如:聚烯烴系樹脂、氟系樹脂、聚酯系樹脂、聚醯胺系樹脂、工程塑膠等。又,聚合時,較佳係以氣體不會進入聚合容器內的方式進行。例如較佳係將聚合溶液裝填至聚合容器之容量的90%以上。 The polymerization container is preferably a container that can be sealed and can withstand high pressure. In addition, pressure must be transmitted to the inside of the container, so it is preferable to use a container that has a plastic soft part or a stretchable part that can deform due to pressure. Specifically, various containers such as polyethylene bottles, plastic bottles, sterilization bags, and bubble containers can be used. Furthermore, it is preferable that the container is made of a heat-resistant material that is not easily deformed by the temperature during polymerization. Furthermore, it is preferable that the container is made of a material that is difficult to penetrate, such as polymerization solvents, and has properties such as chemical resistance or solvent resistance. Examples of materials constituting the polymerization container include polyolefin-based resins, fluorine-based resins, polyester-based resins, polyamide-based resins, and engineering plastics. In addition, during polymerization, it is preferable to conduct the polymerization in such a manner that gas does not enter the polymerization container. For example, it is preferable that the polymerization solution is filled to 90% or more of the capacity of the polymerization container.
聚合步驟時,在60℃以上、較佳係在70℃以上的溫度條件下進行聚合。另外,較佳係在200℃以下、更佳係在120℃以下的溫度條件下進行聚合。 In the polymerization step, polymerization is performed at a temperature of 60°C or higher, preferably 70°C or higher. In addition, polymerization is preferably performed at a temperature of 200°C or lower, more preferably 120°C or lower.
聚合步驟時,特定起始基中的鹵會以自由基的形式脫離,且會從脫離的地方(碳自由基)進行聚合。所以,為在鹵的自由基脫離時能與鹽進行反應,便必需設為既定的溫度條件。 During the polymerization step, the halogen in the specific starting group will be released in the form of a free radical, and polymerization will proceed from the place where it was released (carbon radical). Therefore, in order to react with the salt when the radicals of the halogen are detached, it is necessary to set the predetermined temperature conditions.
(起始化合物) (starting compound)
起始化合物係具有下述一般式(1)或(2)所示起始基的化合物。從起始化合物的起始基開始進行聚合。具體而言,一般式(1)或(2)中的X係以自由基的形式脫離,同時生成碳自由基並插入單體進行聚合。藉此,形成以起始基為末端的聚合物。 The starting compound is a compound having a starting group represented by the following general formula (1) or (2). The polymerization proceeds from the starting group of the starting compound. Specifically, X in the general formula (1) or (2) is detached in the form of a radical, and at the same time, a carbon radical is generated and inserted into the monomer for polymerization. Thereby, a polymer terminated with the starting group is formed.
(上述一般式(1)中,X係表示氯原子、溴原子、或碘原子;R1係表示氫原子、烷基、芳基、氰基、醯基、羧基、酯基、或醯胺基;R2係表示烷基、芳基、氰基、醯基、羧基、酯基、或醯胺基;「*」係表示鍵結位置) (In the above-mentioned general formula ( 1 ), ; R 2 represents an alkyl group, aryl group, cyano group, acyl group, carboxyl group, ester group, or amide group; "*" represents a bonding position)
一般式(1)中,X所鍵結的碳原子係三級碳原子或四級碳原子。較佳係R1與R2之至少1者為烷基以外的基。即,若R1與R2之至少1者為烷基以外的供電子性基,則X較容易脫離。尤其,若X 係鍵結於四級碳原子上,便會生成自由基,故更佳。 In the general formula (1), the carbon atom to which X is bonded is a tertiary carbon atom or a quaternary carbon atom. Preferably, at least one of R 1 and R 2 is a group other than an alkyl group. That is, if at least one of R 1 and R 2 is an electron-donating group other than an alkyl group, X will be released more easily. In particular, if X is bonded to a quaternary carbon atom, it will generate free radicals, so it is more preferable.
(上述一般式(2)中,X係表示氯原子、溴原子、或碘原子;Y係表示O或NH;R3係表示氫原子、烷基、芳基、或醯基;R4係表示烷基、芳基、或醯基;「*」係表示鍵結位置) (In the above-mentioned general formula (2) , Alkyl, aryl, or acyl group; "*" indicates the bonding position)
一般式(2)中,X所鍵結的碳原子係三級碳原子或四級碳原子。因為酯基或醯胺基係屬於供電子性基,因而亦可R3與R4均為烷基。又,若X係鍵結於四級碳原子上,便會生成自由基,故更佳。 In the general formula (2), the carbon atom to which X is bonded is a tertiary carbon atom or a quaternary carbon atom. Since the ester group or amide group is an electron-donating group, R 3 and R 4 may both be alkyl groups. In addition, if X is bonded to a quaternary carbon atom, free radicals will be generated, so it is more preferable.
起始化合物亦可使用市售的化合物,亦可使用合成的化合物。起始化合物係例如藉由使碘,與諸如偶氮雙異丁腈或偶氮異丁酸二甲酯之類的偶氮系自由基聚合起始劑進行反應便可獲得。 As the starting compound, a commercially available compound or a synthetic compound may be used. The starting compound can be obtained, for example, by reacting iodine with an azo radical polymerization initiator such as azobisisobutyronitrile or dimethyl azoisobutyrate.
(鹽) (salt)
鹽係從鹵化四級銨鹽、鹵化四級鏻鹽、及鹵化鹼金屬鹽所構成群組中選擇之至少一種。起始基中的X(鹵)會以自由基的形式脫離,同時在隨X脫離所生成的碳自由基中插入單體並進行聚合。此時,藉由使特定的鹽共存,便進行鹵自由基脫離、或產生鹵交換,從所生成的碳自由基進行單體的聚合,而形成聚合物。 The salt is at least one selected from the group consisting of quaternary ammonium halide salts, quaternary phosphonium halide salts, and alkali metal halide salts. The X (halogen) in the starting group will be released in the form of a free radical, and at the same time, the monomer will be inserted into the carbon radical generated with the release of X and polymerization will proceed. At this time, by allowing a specific salt to coexist, halogen radicals are detached or halogen exchange occurs, and monomers are polymerized from the generated carbon radicals to form a polymer.
鹵化四級銨鹽係可舉例如:氯化苄基三甲銨、溴化四丁銨、碘 化四丁銨、碘化四辛銨、氯化壬基吡啶鎓、氯化膽等。鹵化四級鏻鹽係可舉例如:氯化四苯鏻、溴化甲基三丁鏻、碘化四丁鏻等。鹵化鹼金屬鹽係可舉例如:溴化鋰、碘化鉀等。 Examples of halogenated quaternary ammonium salts include benzyltrimethylammonium chloride, tetrabutylammonium bromide, tetrabutylammonium iodide, tetraoctyl ammonium iodide, nonylpyridinium chloride, and bile chloride. wait. Examples of halogenated quaternary phosphonium salts include tetraphenylphosphonium chloride, methyltributylphosphonium bromide, and tetrabutylphosphonium iodide. Examples of alkali metal halide salts include lithium bromide, potassium iodide, and the like.
鹽較佳係使用碘化物鹽。藉由使用碘化物鹽,便會進行活性自由基聚合,能獲得分子量分佈更窄的聚合物。又,較佳係使用碘化四級銨鹽、碘化四級鏻鹽、及碘化鹼金屬鹽等能溶解於聚合溶液中的鹽,更佳係使用碘化四級銨鹽。碘化四級銨鹽係可舉例如:碘化苄基四丁銨、碘化四丁銨、碘化四辛銨、碘化十二烷基三甲銨、碘化十八烷基三甲銨、碘化三(十八烷基)甲銨等。 As the salt, iodide salt is preferably used. By using iodide salts, living radical polymerization occurs, and polymers with a narrower molecular weight distribution can be obtained. Moreover, it is preferable to use a salt which can be dissolved in a polymerization solution, such as a quaternary ammonium iodide salt, a quaternary phosphonium iodide salt, and an alkali metal iodide salt, and it is more preferable to use a quaternary ammonium iodide salt. Examples of quaternary ammonium iodide salts include: benzyl tetrabutylammonium iodide, tetrabutylammonium iodide, tetraoctyl ammonium iodide, dodecyltrimethylammonium iodide, stearyltrimethylammonium iodide, iodine Tri(octadecyl)methane, etc.
從提高活性度,且獲得更濃厚高分子量之聚合物的觀點,鹽相對於起始基的量較佳係設為等莫耳以上、更佳係設為10倍莫耳以上,亦可設為100倍莫耳以上。 From the viewpoint of improving the activity and obtaining a thicker and high molecular weight polymer, the amount of the salt relative to the starting group is preferably equal to or more moles, more preferably 10 times or more moles, and may also be set to More than 100 times mole.
((甲基)丙烯酸系單體) ((meth)acrylic monomer)
(甲基)丙烯酸系單體係可使用習知公知的(甲基)丙烯酸系單體。本說明書中,「(甲基)丙烯酸系單體」係除(甲基)丙烯酸酯之外,尚包括(甲基)丙烯酸在內。 As the (meth)acrylic monomer system, conventionally known (meth)acrylic monomers can be used. In this specification, "(meth)acrylic monomer" includes (meth)acrylic acid in addition to (meth)acrylate.
(甲基)丙烯酸系單體係可舉例如:(甲基)丙烯酸;(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸異丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸己酯、(甲基)丙烯酸-2-乙基己酯、(甲基)丙烯酸辛酯、(甲基)丙烯酸十二烷基酯、(甲基) 丙烯酸十八烷基酯、(甲基)丙烯酸環己酯、(甲基)丙烯酸三甲基環己酯、(甲基)丙烯酸環癸酯、(甲基)丙烯酸三環癸酯、(甲基)丙烯酸異酯、(甲基)丙烯酸金剛烷酯等(甲基)丙烯酸烷基酯系、(甲基)丙烯酸環烷基酯系單體; Examples of the (meth)acrylic monosystem include: (meth)acrylic acid; methyl (meth)acrylate, ethyl (meth)acrylate, isopropyl (meth)acrylate, n-(meth)acrylate Butyl ester, tert-butyl (meth)acrylate, hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, octyl (meth)acrylate, dodecane (meth)acrylate ester, (meth)octadecyl acrylate, (meth)cyclohexyl acrylate, (meth)trimethylcyclohexyl acrylate, (meth)acrylic acid cyclodecyl ester, (meth)acrylic acid trimethylester Cyclodecyl ester, iso(meth)acrylate Ester, adamantane (meth)acrylate and other (meth)alkyl acrylate series, (meth)acrylic acid cycloalkyl ester series monomers;
(甲基)丙烯酸-2-羥乙酯、(甲基)丙烯酸-2-羥丙酯、(甲基)丙烯酸-4-羥丁酯、(甲基)丙烯酸-2,3-二羥丙酯等(甲基)丙烯酸羥烷基酯系單體; 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 2,3-dihydroxypropyl (meth)acrylate and other (meth)hydroxyalkyl acrylate monomers;
(甲基)丙烯酸甲氧基乙氧基乙酯、聚乙二醇(甲基)丙烯酸酯、聚乙二醇單甲醚(甲基)丙烯酸酯、聚丙二醇單甲醚(甲基)丙烯酸酯、(甲基)丙烯酸環氧丙酯、(甲基)丙烯酸-3-乙基氧雜環丁酯、2,2-二甲基-1,3-二氧雜環戊烷-4-甲醇(甲基)丙烯酸酯、(甲基)丙烯酸葡糖氧乙酯等(甲基)丙烯酸氧烷基酯系單體; Methoxyethoxyethyl (meth)acrylate, polyethylene glycol (meth)acrylate, polyethylene glycol monomethyl ether (meth)acrylate, polypropylene glycol monomethyl ether (meth)acrylate , Glycidyl (meth)acrylate, 3-ethyloxetanyl (meth)acrylate, 2,2-dimethyl-1,3-dioxolane-4-methanol ( (meth)acrylate oxyalkyl ester monomers such as meth)acrylate and glucosoxyethyl (meth)acrylate;
(甲基)丙烯酸-N,N'-二甲胺基乙酯、(甲基)丙烯酸二乙胺基乙酯、(甲基)丙烯酸第三丁胺基乙酯、(甲基)丙烯酸氯化苄基二甲銨乙酯、(甲基)丙烯酸氯化三甲基乙酯、(甲基)丙烯酸二甲銨乙酯之雙三氟甲醯胺鹽、2-(甲基)丙烯醯氧乙基磷酸膽等(甲基)丙烯酸胺基烷酯系、(甲基)丙烯酸銨基烷酯系單體; -N,N'-dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, tert-butylaminoethyl (meth)acrylate, (meth)acrylic acid chloride Benzyldimethylammonium ethyl ester, (meth)acrylic acid trimethylethyl chloride, (meth)acrylic acid dimethylammonium ethyl bistrifluoromethane salt, 2-(meth)acryloxyethyl bile phosphate (Meth)acrylic acid aminoalkyl ester and (meth)acrylic acid ammonium alkyl ester monomers;
(甲基)丙烯酸-2,2,2-三氟乙酯、(甲基)丙烯酸-2-全氟丁基乙酯、(甲基)丙烯酸-2-全氟辛基乙酯等含氟原子之(甲基)丙烯酸酯系單體;聚二甲基矽氧烷之末端(甲基)丙烯酸酯等矽聚合物系巨單 體;(甲基)丙烯酸磷酸乙酯、(甲基)丙烯醯氧丙基三甲氧基矽烷、(甲基)丙烯醯氧乙基異氰酸酯等高反應性單體等等。 (Meth)acrylic acid-2,2,2-trifluoroethyl, (meth)acrylic acid-2-perfluorobutylethyl, (meth)acrylic acid-2-perfluorooctylethyl, etc. contain fluorine atoms The (meth)acrylate monomer; the terminal (meth)acrylate of polydimethylsiloxane and other silicon polymers are monomers Monomers; (meth)acrylic acid ethyl phosphate, (meth)acryloxypropyltrimethoxysilane, (meth)acryloxyethyl isocyanate and other highly reactive monomers, etc.
本發明的聚合物之製造方法,係具羧基或高反應性基的(甲基)丙烯酸系單體,可在羧基或高反應性基未受保護的狀態下直接使用。習知的原子轉移自由基聚合法,係將聚胺的金屬錯合物使用為觸媒。但是,若使具羧基的單體等酸成分等共存,則屬於觸媒的金屬錯合物會遭破壞,因而不會進行聚合反應。相對於此,本發明的聚合物之製造方法,係在羧基或磷酸基等官能基未受保護的狀態下進行聚合反應。 The method for producing the polymer of the present invention uses a (meth)acrylic monomer having a carboxyl group or a highly reactive group, and can be used directly without protecting the carboxyl group or the highly reactive group. The conventional atom transfer radical polymerization method uses a metal complex of polyamine as a catalyst. However, if an acid component such as a monomer having a carboxyl group is allowed to coexist, the metal complex that is the catalyst is destroyed and the polymerization reaction does not proceed. On the other hand, in the method of producing the polymer of the present invention, the polymerization reaction is carried out in a state where functional groups such as carboxyl groups and phosphate groups are not protected.
藉由設定起始基、與(甲基)丙烯酸系單體的量比,便可某程度控制所獲得聚合物的分子量。例如,相對於起始化合物1莫耳,假設使用分子量100之單體5,000莫耳進行聚合時,便形成「1×100×5,000=500,000」的理論分子量之聚合物。即,由[起始化合物1莫耳×單體分子量×起始化合物相對於單體的莫耳比]之式子,便可計算出所獲得單體的分子量。 By setting the starting group and the amount ratio of the (meth)acrylic monomer, the molecular weight of the obtained polymer can be controlled to a certain extent. For example, if 5,000 moles of a monomer with a molecular weight of 100 are used for polymerization relative to 1 mole of the starting compound, a polymer with a theoretical molecular weight of "1×100×5,000=500,000" will be formed. That is, the molecular weight of the obtained monomer can be calculated from the formula [1 mol of starting compound × molecular weight of monomer × molar ratio of starting compound to monomer].
(有機溶劑) (organic solvent)
聚合步驟時,較佳係在有機溶劑中進行(甲基)丙烯酸系單體的聚合。尤其,藉由在能溶解所形成聚合物的有機溶劑中進行聚合,便可使聚合物不會固化,俾能輕易處置。另外,從工業性及生產性的安全性觀點,較佳係在有機溶劑之沸點以下的溫度條件下進行(甲基)丙烯酸系單體的聚合。 In the polymerization step, the (meth)acrylic monomer is preferably polymerized in an organic solvent. In particular, by conducting polymerization in an organic solvent that can dissolve the polymer formed, the polymer can be prevented from solidifying and can be easily disposed of. In addition, from the viewpoint of industrial and productivity safety, it is preferable to polymerize the (meth)acrylic monomer under temperature conditions below the boiling point of the organic solvent.
有機溶劑係可使用習知公知的聚合用溶劑。尤其,較佳係使用從醇系溶劑、二醇系溶劑、醯胺系溶劑、醚系溶劑、亞碸系溶劑、脲系溶劑、及離子液體所構成群組中選擇之至少一種有機溶劑。因為該等有機溶劑的極性較高,因而可溶解前述鹽。又,藉由使用高極性的該等有機溶劑,便可更加速鹵交換的速度,故較佳。 As the organic solvent, conventionally known solvents for polymerization can be used. In particular, it is preferable to use at least one organic solvent selected from the group consisting of alcohol-based solvents, glycol-based solvents, amide-based solvents, ether-based solvents, trine-based solvents, urea-based solvents, and ionic liquids. Because these organic solvents are highly polar, they can dissolve the aforementioned salts. In addition, by using such organic solvents with high polarity, the speed of halogen exchange can be further accelerated, so it is preferable.
醇系溶劑係可舉例如:異丙醇、丁醇、己醇等。二醇系溶劑係可舉例如:乙二醇、丙二醇、聚(n=2以上)乙二醇單甲醚、聚(n=2以上)乙二醇單丁醚、聚(n=2以上)丙二醇單甲醚、丙二醇單乙醚、丙二醇單丙醚、丙二醇單甲醚醋酸酯等。醯胺系溶劑係可舉例如:二甲基甲醯胺、二甲基乙醯胺、2-吡咯啶酮、N-甲基吡咯啶酮、3-甲氧基-N,N-二甲基丙醯胺、3-丁氧基-N,N-二甲基丙醯胺等。 Examples of alcohol-based solvents include isopropyl alcohol, butanol, hexanol, and the like. Examples of glycol solvents include ethylene glycol, propylene glycol, poly(n=2 or more) ethylene glycol monomethyl ether, poly(n=2 or more) ethylene glycol monobutyl ether, poly(n=2 or more) Propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monomethyl ether acetate, etc. Examples of amide solvents include dimethylformamide, dimethylacetamide, 2-pyrrolidone, N-methylpyrrolidone, and 3-methoxy-N,N-dimethyl Propamide, 3-butoxy-N,N-dimethylpropamide, etc.
醚系溶劑係可舉例如:二乙二醇二甲醚、二乙二醇二乙醚等。亞碸系溶劑係可舉例如:環丁碸、二甲亞碸等。脲系溶劑係可舉例如:四甲脲、二甲基咪唑啉酮等。離子液體係可舉例如:乙基(3-甲氧基丙基)二甲銨雙(三氟甲磺醯基)醯亞胺、1-丁基-3-甲基咪唑鎓四氟硼酸鹽、N,N-二乙基-N-甲基-N-2-甲氧基乙銨雙(三氟甲磺醯基)醯亞胺等。該等有機溶劑中,較佳係使用不易揮發的有機溶劑,因為在聚合時較不易膨脹,較佳係使用沸點為150℃以上的有機溶劑。 Examples of ether solvents include diethylene glycol dimethyl ether, diethylene glycol diethyl ether, and the like. Examples of the teresine-based solvent system include cyclotenine, dimethyl teresine, and the like. Examples of urea solvents include tetramethylurea, dimethylimidazolinone, and the like. Examples of ionic liquid systems include: ethyl(3-methoxypropyl)dimethylammonium bis(trifluoromethanesulfonyl)imide, 1-butyl-3-methylimidazolium tetrafluoroborate, N,N-diethyl-N-methyl-N-2-methoxyethylammonium bis(trifluoromethanesulfonyl)imide, etc. Among these organic solvents, it is preferable to use non-volatile organic solvents because they are less likely to expand during polymerization, and it is preferable to use organic solvents with a boiling point of 150° C. or above.
((甲基)丙烯酸系聚合物) ((meth)acrylic polymer)
利用本發明聚合物之製造方法所製造的(甲基)丙烯酸系聚合 物,利用凝膠滲透色層分析儀(GPC)所測定的聚苯乙烯換算之數量平均分子量(Mn),係100,000~10,000,000、較佳係300,000~8,000,000、更佳係500,000~5,000,000。即,根據本發明聚合物之製造方法,可簡便地製造通常溶液聚合等較難製造的高分子量(甲基)丙烯酸系聚合物。可認為此係藉由在高壓條件下進行聚合,便可抑制反應停止,同時促進成長反應的緣故所致。另外,關於Mn未滿100,000的(甲基)丙烯酸系聚合物,係可利用其他的聚合方法(溶液聚合法、塊狀聚合法、乳化聚合法等)進行製造。另一方面,Mn超過10,000,000的(甲基)丙烯酸系聚合物之製造,實質上係屬困難。 (Meth)acrylic polymer produced by the production method of the polymer of the present invention The number average molecular weight (Mn) converted to polystyrene measured by gel permeation chromatography (GPC) is 100,000 to 10,000,000, preferably 300,000 to 8,000,000, and more preferably 500,000 to 5,000,000. That is, according to the manufacturing method of the polymer of this invention, a high molecular weight (meth)acrylic polymer which is difficult to manufacture normally, such as solution polymerization, can be easily manufactured. This is considered to be because polymerization under high-pressure conditions suppresses reaction cessation and promotes the growth reaction. In addition, (meth)acrylic polymers with Mn less than 100,000 can be produced by other polymerization methods (solution polymerization, block polymerization, emulsion polymerization, etc.). On the other hand, it is essentially difficult to produce a (meth)acrylic polymer having an Mn exceeding 10,000,000.
再者,利用本發明聚合物之製造方法所製造的(甲基)丙烯酸系聚合物之分子量分佈(重量平均分子量(Mw)/數量平均分子量(Mn)=PDI)較佳係1.8以下、更佳係1.4以下。 Furthermore, the molecular weight distribution (weight average molecular weight (Mw)/number average molecular weight (Mn) = PDI) of the (meth)acrylic polymer produced by the method for producing the polymer of the present invention is preferably 1.8 or less, more preferably Department 1.4 or less.
因為利用本發明聚合物之製造方法所製造的(甲基)丙烯酸系聚合物,係屬於高分子量,因而可有效使用為例如:用於形成耐久性優異之塗佈層的塗佈劑、以及各種成形物的成形原料。 Since the (meth)acrylic polymer produced by the method of producing the polymer of the present invention has a high molecular weight, it can be effectively used as a coating agent for forming a coating layer with excellent durability, and various Molding raw material for molded objects.
<表面改質基材之製造方法> <Manufacturing method of surface modification substrate>
本發明的表面改質基材之製造方法,係包括有:利用具有下述一般式(1)或(2)所示起始基、與烷氧矽烷基的處理劑,對基材施行表面處理而獲得處理基材的步驟(前處理步驟);以及在100~1,000MPa的壓力條件下、60℃以上的溫度條件下、及處理基 材與鹽的共存下,使(甲基)丙烯酸系單體進行聚合,形成利用凝膠滲透色層分析儀所測定聚苯乙烯換算的數量平均分子量為100,000~10,000,000之(甲基)丙烯酸系聚合物,而在處理基材的表面配置含有(甲基)丙烯酸系聚合物、且厚度100nm以上之聚合物層的步驟(聚合步驟)。即,本發明的表面改質基材之製造方法,係利用前述聚合物之製造方法對基材表面施行改質,在基材表面上形成既定厚度的聚合物層,而獲得表面改質基材的方法。 The manufacturing method of the surface modified substrate of the present invention includes: surface treatment of the substrate using a treatment agent having a starting group represented by the following general formula (1) or (2) and an alkoxysilane group The steps to obtain the treated substrate (pre-treatment step); and under pressure conditions of 100~1,000MPa, temperature conditions above 60°C, and treatment of the substrate In the coexistence of materials and salts, (meth)acrylic monomers are polymerized to form a (meth)acrylic polymer with a number average molecular weight of 100,000 to 10,000,000 in terms of polystyrene as measured by a gel permeation chromatography analyzer. A step (polymerization step) of arranging a polymer layer containing a (meth)acrylic polymer and having a thickness of 100 nm or more on the surface of the treated substrate. That is, the manufacturing method of the surface-modified substrate of the present invention utilizes the aforementioned manufacturing method of the polymer to modify the surface of the substrate to form a polymer layer of a predetermined thickness on the surface of the substrate to obtain the surface-modified substrate. Methods.
(上述一般式(1)中,X係表示氯原子、溴原子、或碘原子;R1係表示氫原子、烷基、芳基、氰基、醯基、羧基、酯基、或醯胺基;R2係表示烷基、芳基、氰基、醯基、羧基、酯基、或醯胺基;「*」係表示鍵結位置) (In the above-mentioned general formula ( 1 ), ; R 2 represents an alkyl group, aryl group, cyano group, acyl group, carboxyl group, ester group, or amide group; "*" represents a bonding position)
(上述一般式(2)中,X係表示氯原子、溴原子、或碘原子;Y係表示O或NH;R3係表示氫原子、烷基、芳基、或醯基;R4係表示烷基、芳基、或醯基;「*」係表示鍵結位置) (In the above-mentioned general formula (2) , Alkyl, aryl, or acyl group; "*" indicates the bonding position)
(基材) (Substrate)
基材係可舉例如:矽基板;玻璃基板;金屬、陶瓷、氧化鋁、碳化矽、氮化硼、ITO膜、塑膠板、塑膠薄膜等板狀及薄膜狀基材; 玻璃纖維、碳纖維等纖維狀基材等等。又,亦可使用顏料、二氧化矽、磁性粉等填料狀基材。 Examples of the substrate system include: silicon substrate; glass substrate; metal, ceramic, alumina, silicon carbide, boron nitride, ITO film, plastic plate, plastic film and other plate-shaped and film-shaped substrates; Fibrous substrates such as glass fiber and carbon fiber, etc. In addition, filler-like base materials such as pigments, silica, and magnetic powder can also be used.
(處理劑) (treatment agent)
前處理步驟時,利用具有一般式(1)或(2)所示起始基、與烷氧矽烷基的處理劑,對基材施行表面處理。藉此,可獲得既定起始基鍵結於基材表面上的處理基材。烷氧矽烷基係可舉例如:甲氧基二甲矽烷基、乙氧二甲矽烷基、二甲氧基甲矽烷基、二乙氧基甲矽烷基、三甲氧基矽烷基、三乙氧基矽烷基、氯甲氧基甲矽烷基等。而,具有既定起始基與烷氧矽烷基的處理劑之具體例係可舉例如下述式(3)~(7)所示化合物: In the pretreatment step, the base material is surface treated using a treatment agent having a starting group represented by general formula (1) or (2) and an alkoxysilane group. Thereby, a treated substrate in which a predetermined starting group is bonded to the surface of the substrate can be obtained. Examples of alkoxysilyl groups include methoxydimethylsilyl, ethoxydimethylsilyl, dimethoxysilyl, diethoxysilyl, trimethoxysilyl, and triethoxy Silyl group, chloromethoxysilyl group, etc. Specific examples of treatment agents having a predetermined starting group and alkoxysilane group include compounds represented by the following formulas (3) to (7):
再者,亦可將由含有:下述式(8)所示單體,與(甲基)丙烯醯氧丙基三甲基矽烷或(甲基)丙烯醯氧丙基三乙氧基矽烷等具烷氧矽烷基單體的單體成分,進行聚合而獲得的聚合物(聚合物型處理劑),使用為處理劑。又,使用為處理劑的此種聚合物,係可為具有聚酯、聚胺酯、聚醯胺等構造的聚合物,亦可為具有無規構造、嵌段構造、接枝構造、星形構造、粒子等構造的聚合物。 Furthermore, it may also be composed of a monomer represented by the following formula (8) and (meth)acryloxypropyltrimethylsilane or (meth)acryloxypropyltriethoxysilane. A polymer (polymer-type treatment agent) obtained by polymerizing a monomer component of an alkoxysilyl monomer is used as a treatment agent. In addition, the polymer used as the treatment agent may be a polymer having a structure such as polyester, polyurethane, or polyamide, or may be a polymer having a random structure, a block structure, a graft structure, a star structure, or a star structure. Polymers with structures such as particles.
在利用處理劑施行表面處理前,亦可對基材施行事先處理。事先處理係可舉例如:矽烷偶合處理、二氧化矽處理、氧化鋁處理、二氧化矽氧化鋁處理、二氧化鋯處理、UV照射、電漿照射、電子束照射、放射線照射、臭氧氧化等表面洗淨、活化、以及賦予官能基等處理。 Before surface treatment with a treatment agent, the base material can also be pre-treated. Examples of the pretreatment system include: silane coupling treatment, silica treatment, alumina treatment, silica alumina treatment, zirconium dioxide treatment, UV irradiation, plasma irradiation, electron beam irradiation, radiation irradiation, ozone oxidation, etc. Cleaning, activation, and addition of functional groups.
處理劑係具有烷氧矽烷基的化合物。所以,利用乾式處理方法或濕式處理方法等習知公知的矽烷偶合處理方法,便可利用處理劑對基材施行表面處理。乾式處理方法係將處理劑直接或溶解於低沸點溶媒等之中施行噴霧等,而賦予基材表面之後,再施行乾燥的方法。濕式處理方法係將基材浸漬於處理劑的溶液中之後,再施行乾燥的方法。又,前述聚合物型處理劑的情況,亦可利用浸塗、塗佈機、旋塗等手法形成膜厚較厚的層,再將基材施行平坦化。 The treatment agent is a compound having an alkoxysilane group. Therefore, the surface treatment of the substrate can be performed using a treatment agent using a conventionally known silane coupling treatment method such as a dry treatment method or a wet treatment method. The dry treatment method is a method in which the treatment agent is sprayed directly or dissolved in a low-boiling solvent or the like, and applied to the surface of the substrate, and then dried. The wet treatment method is a method in which the base material is immersed in a solution of a treatment agent and then dried. In addition, in the case of the aforementioned polymer-type treatment agent, a thicker layer can also be formed using techniques such as dip coating, coater, spin coating, etc., and then the base material can be planarized.
(聚合步驟) (polymerization step)
聚合步驟時,與前述聚合物之製造方法的聚合步驟同樣地,使(甲基)丙烯酸系單體進行聚合。即,在100~1,000MPa的壓力條件下、60℃以上的溫度條件下、以及處理基材與鹽的共存下,使(甲基)丙烯酸系單體進行聚合。藉此,形成(甲基)丙烯酸系聚合物,便 可獲得在處理基材表面上配置有聚合物層的表面改質基材。 In the polymerization step, the (meth)acrylic monomer is polymerized in the same manner as in the polymerization step of the above-mentioned polymer production method. That is, the (meth)acrylic monomer is polymerized under pressure conditions of 100 to 1,000 MPa, temperature conditions of 60° C. or higher, and the coexistence of the treatment base material and salt. Thereby, a (meth)acrylic polymer is formed, and A surface-modified substrate having a polymer layer disposed on the surface of the treated substrate can be obtained.
聚合時的壓力條件及溫度條件,亦包括較佳條件等在內,係與前述聚合物之製造方法的壓力條件及溫度條件相同。又,關於所使用單體、及聚合時共存的鹽,亦包括較佳者在內,係與前述聚合物之製造方法所使用單體及鹽相同。 The pressure conditions and temperature conditions during polymerization, including preferred conditions, are the same as the pressure conditions and temperature conditions of the aforementioned polymer production method. In addition, the monomers used and the salts coexisting during polymerization are the same as those used in the above-described method of producing the polymer, including preferred ones.
如前述,因為在既定的壓力及溫度條件下進行聚合,因而會形成高分子量的(甲基)丙烯酸系聚合物。所以,可形成厚度100nm以上、較佳係200nm以上、更佳係500nm以上的聚合物層。又,聚合物層係不同於一般的聚合物塗佈層,而是利用由鍵結於基材表面的起始基進行接枝之聚合物形成。所以,構成利用本發明製造方法所製造之表面改質基材的聚合物層,可期待發揮不同於一般聚合物塗佈層的特性。又,因為利用由基材表面朝垂直方向濃密伸長的聚合物形成聚合物層,因而可期待更明顯地發揮例如:低摩擦性、抑制蛋白質吸附、分子篩特性、親水性、撥水性等等特性。 As mentioned above, since polymerization proceeds under predetermined pressure and temperature conditions, a high molecular weight (meth)acrylic polymer is formed. Therefore, a polymer layer having a thickness of 100 nm or more, preferably 200 nm or more, and more preferably 500 nm or more can be formed. In addition, the polymer layer is different from the general polymer coating layer, but is formed by using a polymer grafted from a starting group bonded to the surface of the substrate. Therefore, the polymer layer constituting the surface-modified base material produced by the production method of the present invention is expected to exhibit characteristics different from those of general polymer coating layers. In addition, since the polymer layer is formed of a polymer densely elongated in the vertical direction from the surface of the base material, it is expected to exhibit properties such as low friction, protein adsorption inhibition, molecular sieve properties, hydrophilicity, water repellency, etc. more significantly.
因為起始基的反應性呈均勻,因而使用具起始基的既定起始化合物所製造之前述聚合物的分子量,與構成使用具起始基的既定處理劑所形成聚合物層的聚合物分子量,可認為實質上相同。所以,藉由利用GPC等測定依本發明表面改質基材之製造方法的聚合步驟所生成聚合物的分子量,便可確認構成在基材表面上所形成聚合物層的聚合物分子量。 Because the reactivity of the starting group is uniform, the molecular weight of the aforementioned polymer produced using a given starting compound having a starting group is the same as the molecular weight of the polymer constituting the polymer layer formed using a given treatment agent having a starting group. , can be considered to be essentially the same. Therefore, by measuring the molecular weight of the polymer produced in the polymerization step of the method for producing a surface-modified substrate of the present invention using GPC or the like, the molecular weight of the polymer constituting the polymer layer formed on the surface of the substrate can be confirmed.
從聚合物層的厚度L、聚合物鏈的數量平均分子量Mn、及聚合物鏈的密度d,便可計算出每單位面積的聚合物鏈支數(聚合物形成密度、單位:支/nm2)。構成利用本發明製造方法所製造之表面改質基材的聚合物層中,聚合物形成密度較佳係0.05支/nm2以上、更佳係0.1~0.7支/nm2。聚合物形成密度越高,則越能有效地發揮例如:高彈性、超低摩擦、及分子篩效果等特性。 From the thickness L of the polymer layer, the number average molecular weight Mn of the polymer chain, and the density d of the polymer chain, the number of polymer chain branches per unit area (polymer formation density, unit: branch/nm 2 ). In the polymer layer constituting the surface-modified base material manufactured by the manufacturing method of the present invention, the polymer formation density is preferably 0.05 branches/nm 2 or more, and more preferably 0.1 to 0.7 branches/nm 2 . The higher the density of the polymer, the more effectively it can exhibit properties such as high elasticity, ultra-low friction, and molecular sieve effect.
聚合物形成密度σ係下述式(X)所示。另外,下述式(X)中,NA係表示亞佛加厥常數。 The polymer formation density σ is represented by the following formula (X). In addition, in the following formula (X), N A represents Avogadro's constant.
σ=dLNAMn‧‧‧(X) σ=dLN A Mn‧‧‧(X)
聚合物層的厚度L係使用例如:橢圓偏光儀、電子顯微鏡、或原子力顯微鏡等便可測定。聚合物鏈的密度d係除參照習知公知文獻所記載的密度之外,尚亦可例如根據JIS K 7112:1999的方法進行測定。 The thickness L of the polymer layer can be measured using, for example, an ellipsometer, an electron microscope, or an atomic force microscope. The density d of the polymer chain can be measured in accordance with the method of JIS K 7112:1999, in addition to referring to the density described in conventionally known literature.
根據本發明的製造方法,可簡便地製造經明顯改質基材表面特性的表面改質基材。所以,本發明的製造方法係可有效使用為製造例如:醫療用構件、電子材料、顯示器材料、半導體材料、機械零件、滑動構件、電池材料等各種領域所使用各種基材的方法。 According to the manufacturing method of the present invention, a surface-modified substrate with significantly modified surface properties of the substrate can be easily manufactured. Therefore, the manufacturing method of the present invention can be effectively used to manufacture various base materials used in various fields such as medical components, electronic materials, display materials, semiconductor materials, mechanical parts, sliding members, and battery materials.
以下,針對本發明,根據實施例進行具體說明,惟,本發明並不侷限於該等實施例。另外,實施例、比較例中的「份」與「%」, 在無特別聲明的前提下係質量基準。 Hereinafter, the present invention will be specifically described based on examples. However, the present invention is not limited to these examples. In addition, "part" and "%" in the examples and comparative examples, It is the quality standard unless otherwise stated.
<聚合物之製造> <Manufacturing of Polymers>
(實施例1) (Example 1)
在玻璃製採樣瓶中,裝入:2-氰基-2-碘丙烷(CP-I)0.002份、碘化四丁銨(TBAI)0.7388份、甲基丙烯酸甲酯(MMA)20.0份、及3-甲氧基-N,N-二甲基丙醯胺(MDPA)20.0份。攪拌內容物,使TBAI溶解呈均勻化。吹入氮氣後,將內容物移入樹脂製採樣瓶中並鎖蓋。將蓋部分捲繞著薄膜並密封的採樣瓶放入鋁箔袋中,脫除空氣再密封。 In a glass sampling bottle, put: 0.002 parts of 2-cyano-2-iodopropane (CP-I), 0.7388 parts of tetrabutylammonium iodide (TBAI), 20.0 parts of methyl methacrylate (MMA), and 20.0 parts of 3-methoxy-N,N-dimethylpropionamide (MDPA). Stir the contents until TBAI is dissolved and homogenized. After blowing in nitrogen, transfer the contents into a resin sampling bottle and lock the cap. Put the sampling bottle with the cover partially wrapped with film and sealed into an aluminum foil bag, remove the air and then seal it.
在已裝入水作為加壓介質的高壓裝置(商品名「PV-400系列」、Shin Corporation公司製)內放入鋁箔袋,加熱至80℃,且加壓至400MPa,進行4小時聚合。採取採樣瓶中的高黏性聚合物溶液之一部分,利用以THF為展開溶媒的GPC所測定聚合物的聚苯乙烯換算之數量平均分子量(Mn)係785,000,PDI(Mw/Mn)係1.56。從利用氣相色層分析儀(GC)所測定之MMA殘量計算出的聚合率係64.3%。 An aluminum foil bag was placed in a high-pressure device (trade name "PV-400 series", manufactured by Shin Corporation) containing water as a pressurized medium, heated to 80° C., and pressurized to 400 MPa to perform polymerization for 4 hours. A portion of the highly viscous polymer solution in the sampling bottle was taken, and the number average molecular weight (Mn) of the polymer measured in terms of polystyrene was 785,000, and the PDI (Mw/Mn) was 1.56 using GPC using THF as the developing solvent. The polymerization rate calculated from the residual amount of MMA measured with a gas chromatograph (GC) was 64.3%.
(比較例1) (Comparative example 1)
除未加壓之外,其餘均與前述實施例1同樣地施行聚合,獲得具若干黏性的聚合物溶液。所獲得聚合物的Mn係39,000,PDI係1.12。又,聚合率係15.0%。 Except that no pressure was applied, polymerization was carried out in the same manner as in Example 1 to obtain a polymer solution with some viscosity. The obtained polymer had an Mn value of 39,000 and a PDI value of 1.12. In addition, the polymerization rate is 15.0%.
(實施例2) (Example 2)
除取代CP-I,改為使用溴異丁酸乙酯(EBIB)0.002份,且取代TBAI,改為使用溴化四丁銨(TBAB)0.645份之外,其餘均與前述實施例1同樣地進行聚合,獲得聚合物溶液。所獲得聚合物的Mn係1,230,000,PDI係3.25。又,聚合率係71.2%。藉由取代碘化物鹽,改為使用溴化物鹽,可依高產率獲得分子量分佈廣闊、更高分子量的聚合物。 Except that CP-I was replaced with 0.002 parts of ethyl bromoisobutyrate (EBIB), and 0.645 parts of tetrabutylammonium bromide (TBAB) was used instead of TBAI, the rest were the same as in Example 1. Polymerization is carried out to obtain a polymer solution. The Mn system of the obtained polymer was 1,230,000, and the PDI system was 3.25. In addition, the polymerization rate was 71.2%. By replacing iodide salts with bromide salts, polymers with a broad molecular weight distribution and higher molecular weights can be obtained in high yields.
(實施例3) (Example 3)
除使用EBIB:0.001份、碘化四辛銨(TOAI)0.593份、MMA:20份、及MDPA:10份之外,其餘均與前述實施例1同樣地進行聚合,獲得幾乎沒有流動性的聚合物溶液。所獲得聚合物的Mn係2,420,000,PDI係1.78。又,聚合率係65.0%。藉由將溴化物使用為起始化合物,且使用碘化物鹽,便可獲得分子量分佈某程度狹窄、更高分子量的聚合物。 Except for using EBIB: 0.001 parts, tetraoctylammonium iodide (TOAI): 0.593 parts, MMA: 20 parts, and MDPA: 10 parts, polymerization was carried out in the same manner as in Example 1, and polymerization with almost no fluidity was obtained. material solution. The obtained polymer had an Mn value of 2,420,000 and a PDI value of 1.78. In addition, the polymerization rate was 65.0%. By using bromide as the starting compound and using an iodide salt, a polymer with a somewhat narrow molecular weight distribution and higher molecular weight can be obtained.
(實施例4) (Example 4)
除取代MMA,改為使用甲基丙烯酸苄酯(BzMA)35.2份,且取代TOAI,改為使用TBAI:0.369份,並將聚合時間設為6小時之外,其餘均與前述實施例3同樣地進行聚合,獲得聚合物溶液。所獲得聚合物的Mn係3,530,000,PDI係1.49。又,聚合率係71.1%。 Except that instead of MMA, 35.2 parts of benzyl methacrylate (BzMA) was used, and in place of TOAI, 0.369 parts of TBAI was used, and the polymerization time was set to 6 hours. The rest were the same as in Example 3. Polymerization is carried out to obtain a polymer solution. The obtained polymer had an Mn value of 3,530,000 and a PDI value of 1.49. In addition, the polymerization rate was 71.1%.
(實施例5) (Example 5)
除取代BzMA,改為使用甲基丙烯酸月桂酯(LMA)25.4份,且 取代MDPA,改為使用3-丁氧基-N,N-二甲基丙醯胺(BDPA)25.4份之外,其餘均與前述實施例4同樣地進行聚合,獲得聚合物溶液。所獲得聚合物的Mn係450,000,PDI係1.23。又,聚合率係51.2%。 In addition to replacing BzMA, 25.4 parts of lauryl methacrylate (LMA) was used, and Polymerization was carried out in the same manner as in Example 4 except that 25.4 parts of 3-butoxy-N,N-dimethylpropylamine (BDPA) was used instead of MDPA to obtain a polymer solution. The Mn system of the obtained polymer was 450,000, and the PDI system was 1.23. In addition, the polymerization rate was 51.2%.
(實施例6) (Example 6)
除取代MMA,改為使用丙烯酸丁酯(BA)25.6份,且取代MDPA,改為使用BDPA:25.6份,並將聚合溫度設為130℃之外,其餘均與前述實施例3同樣地進行聚合,獲得較具黏性的聚合物溶液。所獲得聚合物的Mn係1,030,000,PDI係1.89。又,聚合率係30.0%。 Polymerization was carried out in the same manner as in Example 3 except that 25.6 parts of butyl acrylate (BA) was used instead of MMA, 25.6 parts of BDPA was used instead of MDPA, and the polymerization temperature was set to 130°C. , to obtain a more viscous polymer solution. The obtained polymer had an Mn value of 1,030,000 and a PDI value of 1.89. In addition, the polymerization rate was 30.0%.
(實施例7) (Example 7)
除使用東洋高壓公司製高壓加壓處理裝置(商品名「全能萃取機」),加壓至100MPa之外,其餘均與前述實施例3同樣地進行聚合,獲得高黏性的聚合物溶液。所獲得聚合物的Mn係278,000,PDI係1.92。又,聚合率係45.5%。 Polymerization was carried out in the same manner as in Example 3 except that a high-pressure processing device (trade name "All-round Extractor") manufactured by Toyo High Pressure Co., Ltd. was used and the pressure was increased to 100 MPa to obtain a highly viscous polymer solution. The obtained polymer had an Mn value of 278,000 and a PDI value of 1.92. In addition, the polymerization rate was 45.5%.
(實施例8) (Example 8)
除取代MDPA,改為使用N,N-二乙基-N-甲基-N-2-甲氧基乙銨雙(三氟甲磺醯基),且將聚合時間設為2小時之外,其餘均與前述實施例3同樣地進行聚合,獲得聚合物溶液。所獲得聚合物的Mn係2,600,000,PDI係1.58。又,聚合率係35.0%。 In addition to replacing MDPA, N,N-diethyl-N-methyl-N-2-methoxyethylammonium bis(trifluoromethanesulfonyl) is used instead, and the polymerization time is set to 2 hours. In other cases, polymerization was carried out in the same manner as in Example 3 to obtain a polymer solution. The obtained polymer had an Mn value of 2,600,000 and a PDI value of 1.58. In addition, the polymerization rate was 35.0%.
(實施例9) (Example 9)
除取代MDPA,改為使用醋酸丁酯之外,其餘均與前述實施例2同樣地進行聚合,獲得聚合物溶液。所獲得聚合物的Mn係120,000,PDI係1.23。又,聚合率係7.5%。 Except that butyl acetate was used instead of MDPA, polymerization was carried out in the same manner as in Example 2 to obtain a polymer solution. The obtained polymer had an Mn value of 120,000 and a PDI value of 1.23. In addition, the polymerization rate was 7.5%.
<表面改質基材之製造(1)> <Manufacturing of Surface Modification Base Material (1)>
(實施例10) (Example 10)
將1cm×1cm大小的矽基板利用異丙醇施行超音波洗淨後,使用碎屑清洗劑(BioForce Nanosciences公司製),施行UV臭氧照射,而在矽基板表面上形成羥基並活化。將經活化的矽基板,在已裝入:乙醇100份、28%氨水溶液10份、及2-溴-2-甲基丙醯氧丙基三甲氧基矽烷(BPM)1份的容器中浸漬12小時。將取出的矽基板,使用乾燥機依80℃施行10分鐘乾燥。 A 1 cm × 1 cm silicon substrate was ultrasonically cleaned with isopropyl alcohol, then a chip cleaner (manufactured by BioForce Nanosciences) was used, and UV ozone irradiation was performed to form and activate hydroxyl groups on the surface of the silicon substrate. Dip the activated silicon substrate into a container filled with: 100 parts of ethanol, 10 parts of 28% ammonia solution, and 1 part of 2-bromo-2-methylpropyloxypropyltrimethoxysilane (BPM) 12 hours. Use a dryer to dry the removed silicon substrate at 80°C for 10 minutes.
在已裝入:MMA:20份、TOAI:0.593份、EBAI:0.001份、及MDPA:20份,且具有蓋子的塑膠容器中,放入上述矽基板。將已封蓋的塑膠容器放入高壓裝置中,加熱至80℃,且加壓至400MPa,進行6小時聚合,獲得矽基板表面上形成有聚合物層的表面改質基材。在塑膠容器內所生成之高黏性的聚合物溶液中,聚合物的Mn係720,000,PDI係1.86。所生成聚合物係由自由的起始基所形成之聚合物。而,因為在矽基板表面存在有自由的起始基,因而在矽基板表面上所形成的聚合物層,亦由同樣的聚合物構成。使用橢偏儀(商品名「EC-400」、J.A.Woollam公司製)所測定的聚合物層膜厚係380nm。 Put the above-mentioned silicon substrate into a plastic container that has been filled with: MMA: 20 parts, TOAI: 0.593 parts, EBAI: 0.001 parts, and MDPA: 20 parts, and has a lid. The capped plastic container is placed in a high-pressure device, heated to 80°C, and pressurized to 400 MPa, and polymerized for 6 hours to obtain a surface-modified substrate with a polymer layer formed on the surface of the silicon substrate. In the highly viscous polymer solution generated in the plastic container, the Mn of the polymer is 720,000 and the PDI is 1.86. The resulting polymer is a polymer formed from free starting groups. However, since there are free starting groups on the surface of the silicon substrate, the polymer layer formed on the surface of the silicon substrate is also composed of the same polymer. The film thickness of the polymer layer measured using an ellipsometer (trade name "EC-400", manufactured by J.A. Woollam Co., Ltd.) was 380 nm.
(實施例11) (Example 11)
除取代BPM,改為使用2-碘-2-甲基丙醯氧己基三乙氧基矽烷(HIE)1份之外,其餘均與前述實施例10同樣地,獲得矽基板表面上形成有聚合物層的表面改質基材。所生成聚合物的Mn係860,000,PDI係1.33。又,所形成聚合物層的膜厚係490nm。 Except for replacing BPM and using 1 part of 2-iodo-2-methylpropyloxyhexyltriethoxysilane (HIE), the rest were the same as in the aforementioned Example 10, and polymerization was obtained on the surface of the silicon substrate. The surface modification substrate of the physical layer. The resulting polymer had an Mn value of 860,000 and a PDI value of 1.33. In addition, the film thickness of the formed polymer layer was 490 nm.
(實施例12) (Example 12)
除使用神戸製鐵所公司製高壓處理裝置(商品名「Dr.CHEF」),加熱至80℃,且加壓至600MPa,進行4小時聚合之外,其餘均與前述實施例11同樣地,獲得矽基板表面上形成有聚合物層的表面改質基材。所生成聚合物的Mn係1,300,000,PDI係1.66。又,所形成聚合物層的膜厚係680nm。 Except using a high-pressure treatment device (trade name "Dr.CHEF") manufactured by Kobe Steel Co., Ltd., heating to 80° C. and pressurizing to 600 MPa to perform polymerization for 4 hours, the same procedure as in Example 11 was performed. A surface modification substrate with a polymer layer formed on the surface of a silicon substrate. The resulting polymer has an Mn value of 1,300,000 and a PDI value of 1.66. In addition, the film thickness of the formed polymer layer was 680 nm.
<起始化合物之合成> <Synthesis of starting compounds>
(合成例1) (Synthesis example 1)
在安裝有:攪拌機、回流冷凝器、溫度計、及氮導入管的反應裝置中,裝入丙二醇單甲醚醋酸酯(PGMAc)100份,加熱至80℃,吹入氮氣。在另一容器中,裝入:甲基丙烯酸-2-(2-溴異丁醯氧基)乙酯(BBEM)50份、甲基丙烯醯氧丙基三乙氧基矽烷(MOPS)50份、及偶氮雙異丁腈(AIBN)1.5份,均勻攪拌,調製得均勻的單體混合液。在反應裝置中添加半量的單體混合液後,再將剩餘的歷時2小時滴下,接著,進行8小時聚合,獲得聚合物液。採取聚合物液之一部分,所測定的固形份係49.2%,確認到幾乎所有單體均已聚合。聚合物液中的聚合物的Mn係18,900,PDI係3.11。在所獲得聚合 物液中添加PGMAc而稀釋,獲得固形份15%的起始基聚合物1溶液。起始基聚合物1溶液中的起始基聚合物1,係具有既定起始基與烷氧矽烷基的聚合物型處理劑。 In a reaction device equipped with a mixer, a reflux condenser, a thermometer, and a nitrogen introduction pipe, 100 parts of propylene glycol monomethyl ether acetate (PGMAc) was placed, heated to 80°C, and nitrogen gas was blown into the reaction device. In another container, put: 50 parts of 2-(2-bromoisobutyloxy)ethyl methacrylate (BBEM) and 50 parts of methacryloxypropyltriethoxysilane (MOPS) , and 1.5 parts of azobisisobutyronitrile (AIBN), stir evenly to prepare a uniform monomer mixture. After adding half the amount of the monomer mixture to the reaction device, the remaining amount was dropped over 2 hours, and then polymerization was performed for 8 hours to obtain a polymer liquid. A portion of the polymer liquid was taken and the measured solid content was 49.2%. It was confirmed that almost all the monomers had been polymerized. The Mn system of the polymer in the polymer liquid is 18,900, and the PDI system is 3.11. The aggregation obtained PGMAc was added to the material solution to dilute it to obtain a starting base polymer 1 solution with a solid content of 15%. The starting group polymer 1 in the starting group polymer 1 solution is a polymer-type treatment agent having a predetermined starting group and an alkoxysilane group.
<表面改質基材之製造(2)> <Manufacturing of Surface Modification Base Material (2)>
(實施例13) (Example 13)
準備3cm×3cm大小的玻璃基板,與前述實施例10同樣地活化。將合成例1所調製的起始基聚合物1溶液,依2,000轉施行30秒鐘旋塗於玻璃基板上之後,先依90℃施行90秒鐘、再依180℃施行30分鐘烘烤而使硬化,形成塗膜。利用橢偏儀所測定的塗膜膜厚係1.80μm。然後,除使用已形成塗膜的上述玻璃基板之外,其餘均與前述實施例10同樣地,獲得玻璃基板表面上形成有聚合物層的表面改質基材。所生成聚合物的Mn係790,000,PDI係1.72。又,含有由起始基聚合物1溶液所形成塗膜的聚合物層膜厚係2.15μm。即,在塗膜上所形成聚合物層的膜厚係350nm。 A glass substrate with a size of 3 cm×3 cm was prepared and activated in the same manner as in Example 10 above. The starting base polymer 1 solution prepared in Synthesis Example 1 was spin-coated on the glass substrate at 2,000 rpm for 30 seconds, first at 90°C for 90 seconds, and then baked at 180°C for 30 minutes. Hardens to form a coating. The coating film thickness measured by an ellipsometer was 1.80 μm. Then, in the same manner as in Example 10 except that the above-mentioned glass substrate on which a coating film has been formed is used, a surface-modified base material in which a polymer layer is formed on the surface of the glass substrate is obtained. The resulting polymer had an Mn value of 790,000 and a PDI value of 1.72. In addition, the film thickness of the polymer layer containing the coating film formed from the starting polymer 1 solution was 2.15 μm. That is, the film thickness of the polymer layer formed on the coating film is 350 nm.
(實施例14) (Example 14)
準備碳化矽製基材(直徑2cm、厚度1.0mm的圓盤狀),與前述實施例10同樣地活化。將基材在含有:乙醇100份、28%氨水溶液1份、及四乙氧基矽烷10份的溶液中浸漬24小時。將取出的基材利用乙醇洗淨後,依150℃施行10分鐘乾燥。除使用依此準備的基材,且將聚合時間設為8小時之外,其餘均與前述實施例10同樣地,獲得碳化矽製基材表面上形成有聚合物層的表面改質基材。所生成聚合物的Mn係1,480,000,PDI係1.88。又,所形成聚合物層 的膜厚係710nm。 A silicon carbide substrate (disk-shaped with a diameter of 2 cm and a thickness of 1.0 mm) was prepared and activated in the same manner as in Example 10 above. The substrate was immersed in a solution containing: 100 parts of ethanol, 1 part of 28% ammonia solution, and 10 parts of tetraethoxysilane for 24 hours. After washing the taken-out substrate with ethanol, it was dried at 150°C for 10 minutes. The surface-modified substrate in which the polymer layer was formed on the surface of the silicon carbide substrate was obtained in the same manner as in Example 10 except that the substrate prepared in this way was used and the polymerization time was set to 8 hours. The resulting polymer has an Mn value of 1,480,000 and a PDI value of 1.88. In addition, the polymer layer formed The film thickness is 710nm.
(實施例15) (Example 15)
將1.5cm×1.5cm大小的SUS402製金屬板,在由合成例1所調製之起始基聚合物1溶液經稀釋為3%的溶液中浸塗後,先依90℃施行30秒鐘、再依180℃施行20分鐘烘烤而使硬化,形成塗膜。所形成塗膜的膜厚係2.6μm。然後,除使用已形成塗膜的上述金屬板,且取代MMA,改為使用LMA,並取代MDPA,改為使用BDPA之外,其餘均與前述實施例10同樣地,獲得金屬板表面上形成有聚合物層的表面改質基材。所生成聚合物的Mn係1,340,000,PDI係1.55。又,所形成聚合物層的膜厚係686nm。 A metal plate made of SUS402 with a size of 1.5 cm Bake at 180°C for 20 minutes to harden and form a coating film. The film thickness of the formed coating film was 2.6 μm. Then, except that the above-mentioned metal plate on which the coating film has been formed is used, LMA is used instead of MMA, and BDPA is used instead of MDPA, the rest is the same as in the above-mentioned Example 10, and a metal plate formed on the surface of the metal plate is obtained. Surface modification substrate for polymer layer. The resulting polymer has an Mn value of 1,340,000 and a PDI value of 1.55. In addition, the film thickness of the formed polymer layer was 686 nm.
本發明聚合物之製造方法,係可有效使用為例如:塗料、油墨、塗佈劑等塗膜、以及薄膜、建材、汽車用構件、電池構件、醫療用材料、顯示器材料、電子機器零件等所使用高分子量聚合物的製造方法。又,本發明表面改質基材之製造方法,係可有效使用為製造各種產業材料所使用經賦予新性能之基材的方法。 The method for producing the polymer of the present invention can be effectively used for coating films such as paints, inks, and coating agents, as well as films, building materials, automotive components, battery components, medical materials, display materials, electronic equipment parts, and the like. Manufacturing methods using high molecular weight polymers. Furthermore, the method for producing a surface-modified base material of the present invention is a method that can effectively use a base material imparted with new properties for use in the production of various industrial materials.
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JP6924434B2 (en) * | 2017-03-02 | 2021-08-25 | 国立大学法人京都大学 | Graft Polymer Initiator |
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