TW202101663A - Substrate transferring apparatus, semiconductor process machine and substrate transferring method - Google Patents

Abstract

The disclosure provides a substrate transferring apparatus, a semiconductor process machine, and a substrate transferring method. The substrate transferring apparatus includes a transferring device and a positioning device. The transferring device is configured to transfer the substrate to the positioning device for positioning. The positioning device is configured to calculate a position of the substrate to be measured. If the to-be-measured position is same with a first predetermined position, then the positioning device provides predetermined transferring coordinates to the transferring device. If the to-be-measured position is different from the first predetermined position, then the positioning device provides modified transferring coordinates to the transferring device. The modified transferring coordinates include the predetermined transferring coordinates and a modified value in connection with the coordinates. The first predetermined position is a coordinate of a center of a predetermined circle. The measured position is a measured value of a coordinate of a center of the substrate.

Description

Substrate transfer equipment, semiconductor processing machine and substrate transfer method

The present disclosure relates to a substrate transfer equipment, and particularly relates to a substrate transfer equipment with positioning function.

In order to speed up the process, semiconductor process machines use robotic arms to transfer wafers. For example, a robotic arm is used to take out the wafer from the cassette in the loading area, and then send it to the carrier or turntable in the process chamber. If the position of the wafer placed on the turntable is not aligned, it may cause instability when the turntable rotates and affect the process yield.

Please refer to FIG. 1, the cassette 2 where the wafer 1 is placed is not tightly matched with the wafer 1. The position where the wafer 1 is placed in the cassette 2 may be slightly different. As a result, the center of the wafer 1 cannot be aligned with the rotation axis of the turntable when the subsequent robot arm picks up the wafer 1 and places it on the stage or turntable.

The conventional technology uses mechanical positioning or laser optical positioning, which requires complicated steps and wastes a lot of process time. There is another method of image positioning, but it is not suitable for transparent or opaque wafer materials. It is also impossible to accurately locate the wafer with warpage.

Some image positioning technologies place the image capturing unit in the process cavity. However, because other equipment is usually required in the process chamber to process the substrate in the process chamber, it is not easy to configure the optical axis of the imaging unit to overlap the symmetry axis of the substrate. The image captured by the image capturing unit will be distorted, which increases the difficulty and time of positioning. In addition, reactive gases or substances are often applied to the process chamber, which easily contaminates the lens of the imaging unit, so that the semiconductor machine must be shut down for maintenance.

In order to solve the above-mentioned problems of the conventional technology, the purpose of the present disclosure is to provide a substrate transfer equipment, a semiconductor process tool and a substrate transfer method, which can effectively solve the problem of complicated positioning methods in the prior art that cannot locate warped wafers. problem.

In order to achieve the above objective, the present disclosure provides a substrate transfer device, which is suitable for transferring the substrate from a lower cargo area to a carrier. The substrate transfer equipment includes a transfer device and a positioning device. The transfer device is used to support the substrate and transfer the substrate to the carrier. The positioning device is arranged between the loading area and the loading platform for positioning a position to be measured of the substrate. The transfer device is used for transferring the substrate to the positioning device for positioning before transferring the substrate to the carrier. The positioning device is used for calculating the position to be measured of the substrate. If the position to be measured is the same as a first preset position, the positioning device provides a preset transfer coordinate to the transfer device, so that the substrate can be transferred by the transfer device to a second preset position. If the position to be measured is different from the first preset position, the positioning device provides a modified transfer coordinate to the transfer device, so that the substrate can be transferred by the transfer device to the second preset position on the carrier . The modified transmission coordinates include the preset transmission coordinates and a standard correction value. The first preset position is a preset center coordinate, the position to be measured is a center coordinate detection value of the substrate, and the coordinate correction value is the difference between the center coordinate detection value and the preset center coordinate.

In one of the embodiments of the present disclosure, the positioning device includes an image capturing unit and a backlight unit disposed relative to the image capturing unit. An optical axis of the backlight unit overlaps an optical axis of the image capturing unit. The transfer device is used for transferring the substrate between the backlight unit and the image capturing unit, so that the substrate is located in an image capturing range of the image capturing unit.

In one of the embodiments of the present disclosure, the first predetermined position is located in the image capturing range between the backlight unit and the image capturing unit.

In one of the embodiments of the present disclosure, when the conveying device reaches a predetermined device position, the positioning device detects whether the substrate is located at the first predetermined position, and the predetermined device position is located between the backlight unit and the Between the acquisition units.

In one of the embodiments of the present disclosure, the position to be measured is an average value of a plurality of detection values of the center coordinates of the substrate.

In one of the embodiments of the present disclosure, the positioning device includes an arithmetic unit for calculating the detection value of the center coordinate of the substrate. The detection value of the circle center coordinate is calculated by the computing device using one of a graph comparison method, a circular arc calculation method, or a circle matching caliper method.

In one of the embodiments of the present disclosure, the positioning device is used to operate the image capturing unit to obtain a complete image of the substrate.

The present disclosure also provides a semiconductor processing machine, including a reaction chamber, a cargo area, and a substrate transfer equipment. The reaction chamber is used for semiconductor manufacturing process. A carrier is set in the reaction chamber. The loading area is used for placing at least one substrate. The substrate transfer equipment includes a transfer device and a positioning device. The conveying device is used for supporting the substrate and conveying the substrate from the unloading area to the carrier. The positioning device is arranged between the loading area and the loading platform for positioning a position to be measured of the substrate. The transfer device is used for transferring the substrate to the positioning device for positioning before transferring the substrate to the carrier. The positioning device is used for calculating the position to be measured of the substrate. If the position to be measured is the same as a first preset position, the positioning device provides a preset transfer coordinate to the transfer device, so that the substrate can be transferred by the transfer device to a second preset position. If the position to be measured is different from the first preset position, the positioning device provides a modified transfer coordinate to the transfer device, so that the substrate can be transferred by the transfer device to the second preset position on the carrier . The modified transmission coordinates include the preset transmission coordinates and a standard correction value. The first preset position is a preset center coordinate, the position to be measured is a center coordinate detection value of the substrate, and the coordinate correction value is the difference between the center coordinate detection value and the preset center coordinate.

In the semiconductor process tool of one embodiment of the present disclosure, the positioning device includes an image capturing unit and a backlight unit disposed relative to the image capturing unit. An optical axis of the backlight unit overlaps an optical axis of the image capturing unit. The transfer device is used for transferring the substrate between the backlight unit and the image capturing unit, so that the substrate is located in an image capturing range of the image capturing unit.

The present disclosure also provides a substrate transfer method, which is suitable for transferring the substrate from a lower cargo area to a carrier, wherein the substrate transfer method includes: providing a transfer device; providing a positioning device, which is arranged in the loading area and the loading platform. Between the stages; the transfer device supports the substrate and transfers the substrate to the positioning device; the positioning device detects a position to be measured of the substrate; the positioning device determines whether the position to be measured and a first preset position Same, if the position to be measured is the same as the first preset position, the positioning device provides a preset transfer coordinate to the transfer device; the transfer device transfers the substrate to a first on the carrier according to the preset transfer coordinate Two preset positions; if the position to be measured is different from the first preset position, the positioning device provides a corrected transfer coordinate to the transfer device; and the transfer device transfers the substrate to the carrier according to the corrected transfer coordinate The second preset position. The modified transmission coordinates include the preset transmission coordinates and a mark correction value, the first preset position is a preset circle center coordinate, the position to be measured is a center coordinate detection value of the substrate, and the coordinate correction value is The difference between the detected value of the circle center coordinate and the preset circle center coordinate.

Compared with the prior art, the substrate transfer equipment, the semiconductor process machine and the substrate transfer method of the present disclosure detect and obtain the center coordinate detection value of the substrate by the image capturing unit and the backlight unit of the positioning device, and correct the transfer coordinates of the transfer device. The wafer positioning can be provided quickly and accurately without being affected by wafer warping, effectively avoiding the problems in the prior art.

In order to make the above and other objectives, features, and advantages of the present disclosure more comprehensible, preferred embodiments of the present disclosure will be described in detail below in conjunction with the accompanying drawings. Furthermore, the directional terms mentioned in the present disclosure, such as up, down, top, bottom, front, back, left, right, inside, outside, side layer, surrounding, center, horizontal, horizontal, vertical, vertical, axial , Radial, uppermost or lowermost layers, etc., are only the direction of reference to the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present disclosure, rather than to limit the present disclosure.

In the figure, units with similar structures are indicated by the same reference numerals.

2 and 3, the present disclosure provides a substrate transfer device 100, which is suitable for transferring the substrate 10 from the lower cargo area 200 to a carrier 30. The substrate transfer equipment 100 includes a transfer device 110 and a positioning device 120. The transfer device 110 is used to support the substrate 10 and transfer the substrate 10 to the carrier 30. The positioning device 120 is disposed between the loading area 200 and the carrier 30 for positioning a position M_P of the substrate 10 to be measured. The transfer device 110 is used to transfer the substrate 10 to the positioning device 120 for positioning before transferring the substrate 10 to the stage 30. The positioning device 120 is used to calculate the position to be measured M_P of the substrate 10. If the position to be measured M_P is the same as a first preset position P_P1, the positioning device 120 provides a preset transfer coordinate P_C to the transfer device 110 so that the substrate 10 can be transferred to the carrier by the transfer device 110 30, one of the second preset positions P_P2. If the position to be measured M_P is different from the first preset position P_P1, the positioning device 120 provides a modified transfer coordinate A_C to the transfer device 110, so that the substrate 10 can be transferred to the stage 30 by the transfer device 110 The second preset position P_P2 above. The modified transmission coordinate A_C includes the preset transmission coordinate P_C and a standard correction value. The first preset position P_P1 is a preset center coordinate P_CC, the to-be-measured position M_P is a center coordinate detection value M_CC of the substrate 10, and the coordinate correction value is the center coordinate detection value M_CC and the preset center coordinate Difference of P_CC.

Specifically, the substrate transfer equipment 100 should first be calibrated, so that if the position to be measured M_P is the same as the first preset position P_P1, the transfer device 110 can send the substrate 10 to the substrate at the preset transfer coordinate P_C. The second preset position P_P2 of the carrier 30. FIG. 3 shows an example in which the position to be measured M_P is different from the first preset position P_P1. In FIGS. 2 and 3, the black dots at the first preset position P_P1 or the second preset position P_P2 are for illustrative purposes only, and it does not mean that the aligned black dots or marks must be drawn in the substrate transfer device 100.

Specifically, FIG. 3 shows a transparent substrate 10, so the conveying device 110 below can be seen through the substrate. The conveying device 110 is, for example, a robotic arm, and the present invention is not limited to this. Fig. 6 shows a substrate 10' that is opaque or less transparent.

Specifically, because the substrate 10 is mostly circular and has symmetry, the center of the circle is used as the positioning reference, which can quickly and accurately achieve the positioning of the substrate. It is also applicable to substrates with warpage or notches in alignment.

Referring to FIG. 4, in one of the embodiments of the present disclosure, the positioning device 120 includes an image capturing unit 121 and a backlight unit 122 disposed opposite to the image capturing unit 121. An optical axis O_A of the backlight unit 122 overlaps an optical axis O_A' of the image capturing unit 121. The transfer device 110 is used to transfer the substrate 10 between the backlight unit 122 and the image capturing unit 121 so that the substrate 10 is located in an image capturing range C_F of the image capturing unit 121.

Specifically, an optical axis O_A of the backlight unit 122 overlaps with an optical axis O_A' of the image capturing unit 121, and the optical axis O_A is perpendicular to the supporting plane of the transmission device 110, so that the image captured by the image capturing unit 121 is not distorted , Reduce the difficulty of identification and calculation, shorten the process time.

In one of the embodiments of the present disclosure, the first preset position P_P1 is located in the image capturing range C_F between the backlight unit 122 and the image capturing unit 121.

5, in one of the embodiments of the present disclosure, when the transfer device 110 reaches a preset device position P_DP, the positioning device 120 detects whether the substrate 10 is located at the first preset position P_P1, and the preset It is assumed that the device position P_DP is located between the backlight unit 122 and the image capturing unit 121.

Specifically, the transmission device 110 should be calibrated first, so that the transmission device 110 can accurately reach the preset device position P_DP. When the transfer device 110 reaches a preset device position P_DP, the positioning device 120 is triggered to detect the position of the substrate 10.

In one of the embodiments of the present disclosure, the position to be measured M_P is an average value of a plurality of detection values M_CC of the circle center coordinates of the substrate 10.

Specifically, although only a small arc can be provided to calculate the center position, for a substrate with warpage, only a small arc is used to calculate the center of the circle will have a larger error, so this disclosure takes a larger range For circular images, multiple center coordinates are calculated and averaged to obtain better alignment results.

2, in one of the embodiments of the present disclosure, the positioning device 120 includes an arithmetic unit 130 for calculating the center coordinate detection value M_CC of the substrate 10. The detected value of the circle center coordinate is calculated by the computing device using one of a pattern matching method, a curve fitting method, or a circle fit caliper method.

Specifically, the pattern comparison method requires a complete substrate image, and is suitable for opaque or low-transparency substrates. The pattern comparison method cuts the substrate image into small areas, and calculates the center of gravity of the pattern formed by all the small areas, which is the center of the substrate. The arc calculation method is suitable for transparent or opaque substrates. The arc calculation method appropriately divides the circumference of the substrate into several small segments, and calculates the vertical line of each arc. The arc segments can partially overlap. The intersection of the two vertical lines is the center of the circle. The present disclosure calculates multiple center positions and averages them, and sets the upper and lower limits so as to eliminate the center of the circle whose coordinate value is excessively deviated before calculating the average center position. The round fitting caliper method is suitable for transparent, opaque or warped substrates. The circle fitting caliper method uses a software caliper to fit on the image circle of the substrate to construct a best fitting circle (Virtual Circle) to obtain the circle center coordinates. In this disclosure, a software caliper is adapted to multiple arc segments to obtain multiple center coordinates and then averaged to reduce errors.

In one of the embodiments of the present disclosure, the positioning device is used to operate the image capturing unit to obtain a complete image of the substrate.

2 and 3, the present disclosure also provides a semiconductor processing tool 1000 including a reaction chamber 300, a cargo area 200, and a substrate transfer equipment 100. The reaction chamber 300 is used for semiconductor manufacturing process. A carrier 30 is provided in the reaction chamber 300. The loading area 200 is used to place at least one substrate 10. The substrate transfer equipment 100 includes a transfer device 110 and a positioning device 120. The transfer device 110 is used to support the substrate 10 and transfer the substrate 10 from the loading area 200 to the carrier 30. The positioning device 120 is disposed between the loading area 200 and the carrier 30 for positioning a position M_P of the substrate 10 to be measured. The transfer device 110 is used to transfer the substrate 10 to the positioning device 120 for positioning before transferring the substrate 10 to the stage 30. The positioning device 120 is used to calculate the position to be measured M_P of the substrate 10. If the position to be measured M_P is the same as a first preset position P_P1, the positioning device 120 provides a preset transfer coordinate P_C to the transfer device 110 so that the substrate 10 can be transferred to the carrier by the transfer device 110 30, one of the second preset positions P_P2. If the position to be measured M_P is different from the first preset position P_P1, the positioning device 120 provides a modified transfer coordinate A_C to the transfer device 110, so that the substrate 10 can be transferred to the stage 30 by the transfer device 110 The second preset position P_P2 above. The modified transmission coordinate A_C includes the preset transmission coordinate P_C and a standard correction value. The first preset position P_P1 is a preset center coordinate P_CC, the to-be-measured position M_P is a center coordinate detection value M_CC of the substrate 10, and the coordinate correction value is the center coordinate detection value M_CC and the preset center coordinate Difference of P_CC.

Specifically, the substrate transfer equipment 100 should first be calibrated, so that if the position to be measured M_P is the same as the first preset position P_P1, the transfer device 110 can send the substrate 10 to the substrate at the preset transfer coordinate P_C. The second preset position P_P2 of the carrier 30. FIG. 3 shows an example in which the position to be measured M_P is different from the first preset position P_P1. In FIGS. 2 and 3, the black dots at the first preset position P_P1 or the second preset position P_P2 are for illustrative purposes only, and it does not mean that the aligned black dots or marks must be drawn in the substrate transfer device 100.

Specifically, FIG. 3 shows a transparent substrate 10, so the conveying device 110 below can be seen through the substrate. The conveying device 110 is, for example, a robotic arm, and the present invention is not limited thereto. Fig. 6 shows a substrate 10' that is opaque or less transparent.

Specifically, because the substrate 10 is mostly circular and has symmetry, the center of the circle is used as the positioning reference, which can quickly and accurately achieve the positioning of the substrate. It is also applicable to substrates with warpage or notches in alignment.

Specifically, the number and configuration of the unloading area 200 and the reaction chamber 300 of the semiconductor processing tool 1000 shown in FIG. 2 are for illustrative purposes only, and the present disclosure is not limited thereto.

Specifically, the carrier 30 is, for example, a spin chuck. The substrate 10 is, for example, a wafer (Wafer). The unloading area 200 may be provided with a wafer cassette to carry multiple wafers.

Referring to FIG. 4, in the semiconductor processing tool 1000 of one embodiment of the present disclosure, the positioning device 120 includes an image capturing unit 121 and a backlight unit 122 disposed opposite to the image capturing unit 121. An optical axis O_A of the backlight unit 122 overlaps an optical axis O_A' of the image capturing unit 121. The transfer device 110 is used to transfer the substrate 10 between the backlight unit 122 and the image capturing unit 121 so that the substrate 10 is located in an image capturing range C_F of the image capturing unit 121.

Specifically, an optical axis O_A of the backlight unit 122 overlaps with an optical axis O_A' of the image capturing unit 121, and the optical axis O_A is perpendicular to the supporting plane of the transmission device 110, so that the image captured by the image capturing unit 121 is not distorted , Reduce the difficulty of identification and calculation, shorten the process time. Specifically, an optical axis O_A' of the image capturing unit 121 approximately overlaps the symmetry axis of the substrate 10 to obtain an image with a lower degree of distortion.

7, the present disclosure also provides a substrate transfer method, which is suitable for transferring the substrate 10 from the lower cargo area 200 to a carrier 30. The substrate transfer method includes: Step S10: Provide a transfer device 110; Step S20 : Provide a positioning device 120, which is arranged between the loading area 200 and the carrier 30; Step S30: The transfer device 110 supports the substrate 10 and transfers the substrate 10 to the positioning device 120; Step S40: the The positioning device 120 detects a position M_P of the substrate 10; Step S50: The positioning device 120 determines whether the position M_P is the same as a first preset position P_P1, if the position M_P is the same as a first preset position If the position P_P1 is the same, perform step S60: the positioning device 120 provides a preset transfer coordinate P_C to the transfer device 110; step S70: the transfer device 110 transfers the substrate 10 to the carrier 30 according to the preset transfer coordinate P_C A second preset position P_P2; if the position to be measured M_P is different from the first preset position P_P1, perform step S80: the positioning device 120 provides a modified transmission coordinate A_C to the transmission device 110; and step S90: the The transfer device 110 transfers the substrate 10 to the second preset position P_P2 on the stage 30 according to the corrected transfer coordinate A_C. The corrected transmission coordinate A_C includes the preset transmission coordinate P_C and a mark correction value, the first preset position P_P1 is a preset circle center coordinate P_CC, and the to-be-measured position M_P is a center coordinate detection value M_CC of the substrate 10 , And the coordinate correction value is the difference between the center coordinate detection value M_CC and the preset center coordinate P_CC.

Compared with the prior art, the substrate transfer equipment, the semiconductor process machine and the substrate transfer method of the present disclosure detect and obtain the center coordinate detection value of the substrate by the image capturing unit and the backlight unit of the positioning device, and correct the transfer coordinates of the transfer device. The wafer positioning can be provided quickly and accurately without being affected by wafer warping, effectively avoiding the problems in the prior art.

Although the present disclosure has been shown and described with respect to one or more implementation manners, those skilled in the art will think of equivalent variations and modifications based on the reading and understanding of the specification and the drawings. The present disclosure includes all such modifications and variations, and is only limited by the scope of the appended invention applications. Particularly with regard to the various functions performed by the above-mentioned elements, the terms used to describe such elements are intended to correspond to any element (unless otherwise indicated) that performs the specified function of the element (for example, it is functionally equivalent), Even if the structure is not equivalent to the disclosed structure that performs the functions in the exemplary implementation of the present specification shown herein. In addition, although a specific feature of this specification has been disclosed with respect to only one of several implementations, this feature can be combined with one or more of other implementations that may be desirable and advantageous for a given or specific application. Other feature combinations. Moreover, as far as the terms "including", "having", "containing" or their variations are used in specific embodiments or claims, such terms are intended to be included in a similar manner to the term "comprising".

The above are only the preferred embodiments of the present disclosure. It should be pointed out that for those of ordinary skill in the art, without departing from the principles of the present disclosure, several improvements and modifications can be made, and these improvements and modifications should also be regarded as the present disclosure. protected range.

1: Wafer 10, 10’: Substrate 100: substrate transfer equipment 110: transfer device 120: positioning device 121: imaging unit 122: Backlight unit 130: Operation unit 1000: Semiconductor process machine 2: Cassette 200: unloading area 300: reaction chamber 30: Stage M_P: Position to be measured P_P1: First preset position P_P2: Second preset position P_C: Default transmission coordinates A_C: Correct transmission coordinates P_CC: preset circle center coordinate M_CC: circle center coordinate detection value O_A, O_A’: optical axis C_F: imaging range P_DP: preset device position S10~S90: steps

Figure 1 shows a schematic diagram of the structure of a cassette for placing wafers in the prior art;

FIG. 2 shows a schematic diagram of the structure of a semiconductor processing tool according to an embodiment of the present disclosure;

FIG. 3 shows a schematic diagram of a first preset position and a second preset position in an embodiment of the present disclosure;

4 shows a schematic diagram of the structure of an image capturing unit and a backlight unit in an embodiment of the present disclosure;

FIG. 5 shows a schematic diagram of a preset device position according to an embodiment of the present disclosure;

Fig. 6 shows a schematic diagram of an image obtained by an image capturing unit according to an embodiment of the present disclosure;

FIG. 7 shows a schematic flowchart of a substrate transfer method according to an embodiment of the present disclosure.

10: substrate

100: substrate transfer equipment

110: Conveyor

120: positioning device

121: Acquisition unit

122: Backlight unit

130: arithmetic unit

1000: Semiconductor process machine

200: unloading area

300: reaction chamber

30: Stage

P_P2: second preset position

P_C: Default transfer coordinates

A_C: Correct the transmission coordinates

Claims (10)

A substrate transfer device is suitable for transferring the substrate from a lower cargo area to a carrier, wherein the substrate transfer device includes: A transferring device for supporting the substrate and transferring the substrate to the carrier; and A positioning device is arranged between the loading area and the carrier for positioning a position to be measured of the substrate, wherein The transfer device is used for transferring the substrate to the positioning device for positioning before transferring the substrate to the stage; The positioning device is used to calculate the position to be measured of the substrate; If the position to be measured is the same as a first preset position, the positioning device provides a preset transfer coordinate to the transfer device, so that the substrate can be transferred by the transfer device to a second preset Location; and If the position to be measured is different from the first preset position, the positioning device provides a modified transfer coordinate to the transfer device, so that the substrate can be transferred by the transfer device to the second preset position on the carrier , Wherein the modified transmission coordinates include the preset transmission coordinates and a mark correction value, the first preset position is a preset circle center coordinate, the position to be measured is a center coordinate detection value of the substrate, and the coordinate correction value Is the difference between the detected value of the circle center coordinate and the preset circle center coordinate. The substrate transfer equipment as described in the first item of the scope of patent application, wherein The positioning device includes an image capturing unit and a backlight unit disposed relative to the image capturing unit; An optical axis of the backlight unit overlaps an optical axis of the image capturing unit; and The transfer device is used for transferring the substrate between the backlight unit and the image capturing unit, so that the substrate is located in an image capturing range of the image capturing unit. The substrate transfer device as described in item 2 of the scope of patent application, wherein the first preset position is located in the image capturing range between the backlight unit and the image capturing unit. For the substrate transfer equipment described in item 2 of the scope of patent application, the positioning device detects whether the substrate is located at the first preset position when the transfer device reaches a preset device position, and the preset device position Located between the backlight unit and the image capturing unit. The substrate conveying device described in item 1 of the scope of patent application, wherein the position to be measured is an average value of a plurality of detection values of the circle center coordinates of the substrate. As for the substrate transfer equipment described in claim 1, wherein the positioning device includes an arithmetic unit for calculating the detected value of the center coordinate of the substrate, wherein the detected value of the center coordinate is compared by the arithmetic device with a pattern It is calculated by one of the pairing method, one-circle calculation method or one-circle matching caliper method. The substrate transfer equipment described in item 1 of the scope of patent application, wherein the positioning device is used to operate the image capturing unit to obtain a complete image of the substrate. A semiconductor processing machine includes: A reaction chamber for semiconductor manufacturing process, wherein a carrier is set in the reaction chamber; The lower cargo area is used to place at least one substrate; and A substrate transfer equipment, including: A transfer device for supporting the substrate and transferring the substrate from the unloading area to the carrier; and A positioning device is arranged between the loading area and the carrier for positioning a position to be measured of the substrate, wherein The transfer device is used for transferring the substrate to the positioning device for positioning before transferring the substrate to the stage; The positioning device is used to calculate the position to be measured of the substrate; If the position to be measured is the same as a first preset position, the positioning device provides a preset transfer coordinate to the transfer device, so that the substrate can be transferred by the transfer device to a second preset Location; and If the position to be measured is different from the first preset position, the positioning device provides a modified transfer coordinate to the transfer device so that the substrate can be transferred by the transfer device to the second preset on the carrier Position, wherein the corrected transmission coordinates include the preset transmission coordinates and a mark correction value, the first preset position is a preset circle center coordinate, the measured position is a center coordinate detection value of the substrate, and the coordinate correction The value is the difference between the detected value of the center coordinate and the preset center coordinate. The semiconductor process tool as described in item 8 of the scope of patent application, in which The positioning device includes an image capturing unit and a backlight unit disposed relative to the image capturing unit; An optical axis of the backlight unit overlaps an optical axis of the image capturing unit; and The transfer device is used for transferring the substrate between the backlight unit and the image capturing unit, so that the substrate is located in an image capturing range of the image capturing unit. A substrate transfer method is suitable for transferring the substrate from a lower cargo area to a carrier, wherein the substrate transfer method includes: Provide a transmission device; Provide a positioning device arranged between the cargo unloading area and the carrier; The transfer device supports the substrate and transfers the substrate to the positioning device; The positioning device detects a position to be measured of the substrate; The positioning device determines whether the position to be measured is the same as a first preset position, and if the position to be measured is the same as the first preset position, the positioning device provides a preset transmission coordinate to the transmission device; The transfer device transfers the substrate to a second preset position on the carrier according to the preset transfer coordinates; If the position to be measured is different from the first preset position, the positioning device provides a modified transmission coordinate to the transmission device; and The transfer device transfers the substrate to the second preset position on the carrier according to the corrected transfer coordinates, wherein the corrected transfer coordinates include the preset transfer coordinates and a mark correction value, and the first preset position is a preset Assuming the center coordinate, the position to be measured is a center coordinate detection value of the substrate, and the coordinate correction value is the difference between the center coordinate detection value and the preset center coordinate.

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