TWM585428U - Substrate transferring apparatus and semiconductor process machine - Google Patents

Abstract

The disclosure provides a substrate transferring apparatus, and a semiconductor process machine. The substrate transferring apparatus includes a transferring device and a positioning device. The transferring device is configured to transfer the substrate to the positioning device for positioning. The positioning device is configured to calculate a position of the substrate to be measured. If the to-be-measured position is same with a first predetermined position, then the positioning device provides predetermined transferring coordinates to the transferring device. If the to-be-measured position is different from the first predetermined position, then the positioning device provides modified transferring coordinates to the transferring device. The modified transferring coordinates include the predetermined transferring coordinates and a modified value in connection with the coordinates. The first predetermined position is a coordinate of a center of a predetermined circle. The measured position is a measured value of a coordinate of a center of the substrate.

Description

Substrate transfer equipment and semiconductor process equipment

The present disclosure relates to a substrate transfer device, and more particularly, to a substrate transfer device having a positioning function.

In order to speed up the process, semiconductor manufacturing equipment uses robotic arms to transfer wafers. For example, a robotic arm removes a wafer from a cassette in the unloading area, and sends it to a carrier or a turntable in the process chamber. If the wafer is placed on the turntable without being aligned, it may cause instability and affect the process yield when the turntable is rotated.

Referring to FIG. 1, the cassette 2 on which the wafer 1 is placed is not closely fitted to the wafer 1. The position where the wafer 1 is placed in the cassette 2 may be slightly different, so that when the subsequent robot arm holds the wafer 1 and places it on a stage or a turntable, the center of the wafer 1 cannot be aligned with the rotation axis of the turntable.

Conventional techniques use mechanical positioning or laser optical positioning. The steps are complicated and waste a lot of process time. There is another method of image positioning, but it is not applicable to transparent wafer materials or opaque wafer materials. It is also impossible to accurately position wafers with warpage.

Some image positioning technologies place the image capturing unit in the process cavity. However, because other equipment is usually required in the processing cavity to process the substrate in the processing cavity, it is not easy to configure the optical axis of the imaging unit to overlap the symmetry axis of the substrate. The image acquired by the imaging unit will be distorted as a result, increasing the difficulty and time of positioning. In addition, a reactive gas or substance is often applied in the process cavity, which easily contaminates the lens of the imaging unit, so that the semiconductor machine must be shut down for maintenance.

In order to solve the problems of the above-mentioned conventional technologies, an object of the present disclosure is to provide a substrate transfer device and a semiconductor process machine, which can effectively solve the problem that the positioning methods in the prior art are complicated and the warped wafer cannot be positioned.

To achieve the above object, the present disclosure provides a substrate transfer device, which is suitable for transferring the substrate from a lower cargo area to a carrier. The substrate transfer apparatus includes a transfer device and a positioning device. The transfer device is used to support the substrate and transfer the substrate to the stage. The positioning device is disposed between the unloading area and the carrier, and is used for positioning a position to be measured of the substrate. The transfer device is used to transfer the substrate to the positioning device for positioning before transferring the substrate to the stage. The positioning device is used to calculate the measured position of the substrate. If the position to be measured is the same as a first preset position, the positioning device provides a preset transfer coordinate to the transfer device, so that the substrate can be transferred by the transfer device to a second preset on the stage. position. If the position to be measured is different from the first preset position, the positioning device provides a correction transfer coordinate to the transfer device, so that the substrate can be transferred by the transfer device to the second preset position on the stage. . The modified transmission coordinate includes the preset transmission coordinate and a coordinate correction value. The first preset position is a preset circle center coordinate, the measured position is a circle center coordinate detection value of the substrate, and the coordinate correction value is a difference between the circle center detection value and the preset circle center coordinate.

In one embodiment of the present disclosure, the positioning device includes an image capturing unit and a backlight unit disposed opposite the image capturing unit. An optical axis of the backlight unit and an optical axis of the image capturing unit overlap. The transferring device is used for transferring the substrate between the backlight unit and the image capturing unit, so that the substrate is located in an image capturing range of the image capturing unit.

In one embodiment of the present disclosure, the first preset position is located in the image capturing range between the backlight unit and the image capturing unit.

In one embodiment of the present disclosure, the positioning device detects whether the substrate is located at the first preset position when the transmission device reaches a preset device position, and the preset device position is located between the backlight unit and the backlight unit. Between image capturing units.

In one embodiment of the present disclosure, the position to be measured is an average value of a plurality of detection values of the center coordinates of the substrate.

In one embodiment of the present disclosure, the positioning device includes an operation unit for calculating a detection value of the center coordinate of the substrate. The circle center coordinate detection value is calculated by the computing device using one of a graphic comparison method, a circular arc calculation method, or a circular adapter caliper method.

In one embodiment of the present disclosure, the positioning device is used to operate the image capturing unit to obtain a complete image of the substrate.

The present disclosure also provides a semiconductor process machine including a reaction chamber, a lower cargo area, and a substrate transfer device. The reaction chamber is used for performing a semiconductor process. A stage is set in the reaction chamber. The loading area is used to place at least one substrate. The substrate transfer apparatus includes a transfer device and a positioning device. The transfer device is used for supporting the substrate and transferring the substrate from the unloading area to the carrier. The positioning device is disposed between the unloading area and the carrier, and is used for positioning a position to be measured of the substrate. The transfer device is used to transfer the substrate to the positioning device for positioning before transferring the substrate to the stage. The positioning device is used to calculate the measured position of the substrate. If the position to be measured is the same as a first preset position, the positioning device provides a preset transfer coordinate to the transfer device, so that the substrate can be transferred by the transfer device to a second preset on the stage. position. If the position to be measured is different from the first preset position, the positioning device provides a correction transfer coordinate to the transfer device, so that the substrate can be transferred by the transfer device to the second preset position on the stage. . The modified transmission coordinate includes the preset transmission coordinate and a coordinate correction value. The first preset position is a preset circle center coordinate, the measured position is a circle center coordinate detection value of the substrate, and the coordinate correction value is a difference between the circle center detection value and the preset circle center coordinate.

In the semiconductor manufacturing machine according to one of the embodiments of the present disclosure, the positioning device includes an image capturing unit and a backlight unit disposed opposite the image capturing unit. An optical axis of the backlight unit and an optical axis of the image capturing unit overlap. The transferring device is used for transferring the substrate between the backlight unit and the image capturing unit, so that the substrate is located in an image capturing range of the image capturing unit.

Compared with the prior art, the substrate transfer equipment, semiconductor processing machine, and substrate transfer method of the present disclosure detect and obtain the center-coordinate detection value of the substrate by the imaging unit and the backlight unit of the positioning device, and correct the transfer coordinates of the transfer device. It can quickly and accurately provide wafer positioning without being affected by wafer warping, and effectively avoid problems in the prior art.

In order to make the above and other objects, features, and advantages of the present disclosure more comprehensible, the following describes the preferred embodiments of the present disclosure and the accompanying drawings in detail, as follows. Furthermore, the directional terms mentioned in this disclosure are, for example, top, bottom, top, bottom, front, back, left, right, inside, outside, side layer, surrounding, center, horizontal, horizontal, vertical, vertical, axial , Radial, uppermost or lowermost, etc., are only directions referring to additional drawings. Therefore, the terminology used is to explain and understand the disclosure, but not to limit the disclosure.

In the figures, similarly structured units are denoted by the same reference numerals.

2 and 3, the present disclosure provides a substrate transfer apparatus 100 adapted to transfer the substrate 10 from the lower cargo area 200 to a carrier 30. The substrate transfer apparatus 100 includes a transfer device 110 and a positioning device 120. The transferring device 110 is used for supporting the substrate 10 and transferring the substrate 10 to the stage 30. The positioning device 120 is disposed between the unloading area 200 and the stage 30 to position a position M_P of the substrate 10 to be measured. The transfer device 110 is used to transfer the substrate 10 to the positioning device 120 for positioning before transferring the substrate 10 to the stage 30. The positioning device 120 is used to calculate the measured position M_P of the substrate 10. If the measured position M_P is the same as a first preset position P_P1, the positioning device 120 provides a preset transfer coordinate P_C to the transfer device 110 so that the substrate 10 can be transferred by the transfer device 110 to the stage One of 30 second preset positions P_P2. If the measured position M_P is different from the first preset position P_P1, the positioning device 120 provides a corrected transfer coordinate A_C to the transfer device 110 so that the substrate 10 can be transferred by the transfer device 110 to the stage 30 The second preset position P_P2. The modified transmission coordinate A_C includes the preset transmission coordinate P_C and a coordinate correction value. The first preset position P_P1 is a preset circle center coordinate P_CC, the measured position M_P is a circle center detected value M_CC of the substrate 10, and the coordinate correction value is the circle center detected value M_CC and the preset circle center coordinate. The difference of P_CC.

Specifically, the substrate transfer device 100 should first perform calibration so that if the measured position M_P is the same as the first preset position P_P1, the transfer device 110 can send the substrate 10 to the preset transfer coordinate P_C. The second preset position P_P2 of the carrier 30. FIG. 3 shows an example where the measured position M_P is different from the first preset position P_P1. In FIG. 2 and FIG. 3, the black dots at the first preset position P_P1 or the second preset position P_P2 are for illustrative purposes only, and do not indicate that a black dot or mark for registration must be drawn in the substrate transfer device 100.

Specifically, FIG. 3 shows a transparent substrate 10, so the transmission device 110 below can be seen through the substrate. The transmission device 110 is, for example, a robot arm, and the present invention is not limited thereto. Fig. 6 shows an opaque or less transparent substrate 10 '.

Specifically, since the substrate 10 is mostly circular and has symmetry, the center of the circle is used as a reference for positioning, and the positioning of the substrate can be achieved quickly and accurately. It can also be applied to a substrate with warpage or a substrate with alignment notches.

Referring to FIG. 4, in one embodiment of the present disclosure, the positioning device 120 includes an image capturing unit 121 and a backlight unit 122 disposed opposite the image capturing unit 121. An optical axis O_A of the backlight unit 122 and an optical axis O_A 'of the image capturing unit 121 overlap. The transferring device 110 is used to transfer the substrate 10 between the backlight unit 122 and the image capturing unit 121 so that the substrate 10 is located in an image capturing range C_F of the image capturing unit 121.

Specifically, an optical axis O_A of the backlight unit 122 overlaps an optical axis O_A 'of the image capturing unit 121, and the optical axis O_A is perpendicular to the supporting plane of the transmission device 110, so that the image acquired by the image capturing unit 121 will not be distorted. , Reduce the difficulty of identification and calculation, shorten the process time.

In one embodiment of the present disclosure, the first preset position P_P1 is located in the image capturing range C_F between the backlight unit 122 and the image capturing unit 121.

Referring to FIG. 5, in one embodiment of the present disclosure, when the transfer device 110 reaches a preset device position P_DP, the positioning device 120 detects whether the substrate 10 is located at the first preset position P_P1, and the preset It is assumed that the device position P_DP is located between the backlight unit 122 and the image capturing unit 121.

Specifically, the transmitting device 110 should be calibrated first, so that the transmitting device 110 can accurately reach the preset device position P_DP. When the transfer device 110 reaches a preset device position P_DP, the positioning device 120 is triggered to detect the position of the substrate 10.

In one embodiment of the present disclosure, the measured position M_P is an average value of a plurality of circle center coordinate detection values M_CC of the substrate 10.

Specifically, although only a small segment of the arc can be provided to calculate the position of the center of the circle, for a substrate with warpage, there will be a large error in calculating the center of the circle with only a small segment of the arc. For circle images, multiple circle center coordinates are calculated and averaged to obtain better alignment results.

Referring to FIG. 2, in one embodiment of the present disclosure, the positioning device 120 includes an operation unit 130 for calculating the circle center coordinate detection value M_CC of the substrate 10. The circle center coordinate detection value is calculated by the computing device using one of a pattern match method, a curve fit method, or a circle fit caliper method.

Specifically, the pattern comparison method requires a complete substrate image, and is suitable for opaque or low-transparency substrates. The pattern comparison method cuts the substrate image into small areas, and calculates the position of the center of gravity of the pattern formed by all the small areas, which is the position of the center of the circle of the substrate. The arc calculation method is suitable for transparent or opaque substrates. The arc calculation method appropriately divides the circumference of the substrate into several small segments, and calculates the mid-perpendicular line of each segment of the arc. The arc segments can partially overlap. The center of the circle is where the two vertical lines meet. The present disclosure calculates a plurality of circle center positions and averages them, and sets upper and lower limits so as to eliminate the circle centers whose coordinates are excessively deviated before calculating the average circle center positions. The circular adapter caliper method is suitable for transparent, opaque or warped substrates. The circle adapting caliper method uses a software caliper to adapt on the circumference of the substrate image and construct a best fit circle (Virtual Circle) to obtain the center coordinates of the circle. In the present disclosure, a software caliper is used to adapt multiple arc segments to obtain multiple circle center coordinates, and then an average value is taken to reduce the error.

In one embodiment of the present disclosure, the positioning device is used to operate the image capturing unit to obtain a complete image of the substrate.

Referring to FIGS. 2 and 3, the present disclosure further provides a semiconductor processing machine 1000 including a reaction chamber 300, a lower cargo area 200, and a substrate transfer device 100. The reaction chamber 300 is used for performing a semiconductor process. A stage 30 is disposed in the reaction chamber 300. The unloading area 200 is used to place at least one substrate 10. The substrate transfer apparatus 100 includes a transfer device 110 and a positioning device 120. The transfer device 110 is used for supporting the substrate 10 and transferring the substrate 10 from the unloading area 200 to the carrier 30. The positioning device 120 is disposed between the unloading area 200 and the stage 30 to position a position M_P of the substrate 10 to be measured. The transfer device 110 is used to transfer the substrate 10 to the positioning device 120 for positioning before transferring the substrate 10 to the stage 30. The positioning device 120 is used to calculate the measured position M_P of the substrate 10. If the measured position M_P is the same as a first preset position P_P1, the positioning device 120 provides a preset transfer coordinate P_C to the transfer device 110 so that the substrate 10 can be transferred by the transfer device 110 to the stage One of 30 second preset positions P_P2. If the measured position M_P is different from the first preset position P_P1, the positioning device 120 provides a corrected transfer coordinate A_C to the transfer device 110 so that the substrate 10 can be transferred by the transfer device 110 to the stage 30 The second preset position P_P2. The modified transmission coordinate A_C includes the preset transmission coordinate P_C and a coordinate correction value. The first preset position P_P1 is a preset circle center coordinate P_CC, the measured position M_P is a circle center detected value M_CC of the substrate 10, and the coordinate correction value is the circle center detected value M_CC and the preset circle center coordinate. The difference of P_CC.

Specifically, the substrate transfer device 100 should first perform calibration so that if the measured position M_P is the same as the first preset position P_P1, the transfer device 110 can send the substrate 10 to the preset transfer coordinate P_C. The second preset position P_P2 of the carrier 30. FIG. 3 shows an example where the measured position M_P is different from the first preset position P_P1. In FIG. 2 and FIG. 3, the black dots at the first preset position P_P1 or the second preset position P_P2 are for illustrative purposes only, and do not indicate that a black dot or mark for registration must be drawn in the substrate transfer device 100.

Specifically, FIG. 3 shows a transparent substrate 10, so the transmission device 110 below can be seen through the substrate. The transmission device 110 is, for example, a robot arm, and the present invention is not limited thereto. Fig. 6 shows an opaque or less transparent substrate 10 '.

Specifically, since the substrate 10 is mostly circular and has symmetry, the center of the circle is used as a reference for positioning, and the positioning of the substrate can be achieved quickly and accurately. It can also be applied to a substrate with warpage or a substrate with alignment notches.

Specifically, the number and configuration of the unloading area 200, the reaction chamber 300, and the like of the semiconductor processing machine 1000 shown in FIG. 2 are for illustrative purposes only, and the present disclosure is not limited thereto.

Specifically, the carrier 30 is, for example, a spin chuck. The substrate 10 is, for example, a wafer. A wafer cassette (Wafer Cassette) can be set in the unloading area 200 to carry a plurality of wafers.

Referring to FIG. 4, in a semiconductor processing machine 1000 according to one embodiment of the present disclosure, the positioning device 120 includes an image capturing unit 121 and a backlight unit 122 disposed opposite the image capturing unit 121. An optical axis O_A of the backlight unit 122 and an optical axis O_A 'of the image capturing unit 121 overlap. The transferring device 110 is used to transfer the substrate 10 between the backlight unit 122 and the image capturing unit 121 so that the substrate 10 is located in an image capturing range C_F of the image capturing unit 121.

Specifically, an optical axis O_A of the backlight unit 122 overlaps an optical axis O_A 'of the image capturing unit 121, and the optical axis O_A is perpendicular to the supporting plane of the transmission device 110, so that the image acquired by the image capturing unit 121 will not be distorted. , Reduce the difficulty of identification and calculation, shorten the process time. Specifically, an optical axis O_A 'of the image capturing unit 121 substantially overlaps the axis of symmetry of the substrate 10 to obtain an image with a low degree of distortion.

Referring to FIG. 7, the present disclosure also provides a substrate transfer method adapted to transfer the substrate 10 from the lower cargo area 200 to a carrier 30. The substrate transfer method includes: Step S10: providing a transfer device 110; Step S20 : Providing a positioning device 120 disposed between the loading area 200 and the carrier 30; step S30: the transfer device 110 supports the substrate 10 and transfers the substrate 10 to the positioning device 120; step S40: the The positioning device 120 detects a measured position M_P of the substrate 10; step S50: The positioning device 120 determines whether the measured position M_P is the same as a first preset position P_P1. If the measured position M_P is a first preset If the position P_P1 is the same, step S60 is performed: the positioning device 120 provides a preset transfer coordinate P_C to the transfer device 110; step S70: the transfer device 110 transfers the substrate 10 to the carrier 30 according to the preset transfer coordinate P_C. A second preset position P_P2; if the measured position M_P is different from the first preset position P_P1, step S80 is performed: the positioning device 120 provides a corrected transmission coordinate A_C to the transmission device 110; and step S90: the Teleporter 110 transfers the substrate 30 of the second one of P_P2 10 to a predetermined position by the stage transfer the correction coordinate A_C. The modified transmission coordinate A_C includes the preset transmission coordinate P_C and a coordinate correction value. The first preset position P_P1 is a preset circle center coordinate P_CC, and the measured position M_P is a circle center coordinate detection value M_CC of the substrate 10. , And the coordinate correction value is a difference between the circle center coordinate detection value M_CC and the preset circle center coordinate P_CC.

Compared with the prior art, the substrate transfer equipment, semiconductor processing machine, and substrate transfer method of the present disclosure detect and obtain the center-coordinate detection value of the substrate by the imaging unit and the backlight unit of the positioning device, and correct the transfer coordinates of the transfer device. It can quickly and accurately provide wafer positioning without being affected by wafer warping, and effectively avoid problems in the prior art.

Although the present disclosure has been shown and described with respect to one or more implementations, equivalent variations and modifications will occur to those skilled in the art upon the reading and understanding of this specification and the drawings. This disclosure includes all such modifications and variations and is limited only by the scope of the appended patent applications. In particular with regard to the various functions performed by the aforementioned elements, the terminology used to describe such elements is intended to correspond to any element (unless otherwise indicated) that performs the specified function of the element (eg, it is functionally equivalent), Even if it is not structurally equivalent to the disclosed structure that performs the functions in the exemplary implementation of the present specification shown herein. Furthermore, although a particular feature of this specification has been disclosed with respect to only one of several implementations, this feature may be compared to one or more of other implementations as may be desirable and advantageous for a given or specific application. Other feature combinations. Moreover, to the extent that the terms "including," "having," "containing," or variations thereof are used in the detailed description or claims, such terms are intended to be included in a manner similar to the term "comprising."

The above are only the preferred embodiments of the present disclosure. It should be noted that, for those of ordinary skill in the art, without departing from the principles of the present disclosure, several improvements and retouches can be made. protected range.

1‧‧‧ wafer

10, 10'‧‧‧ substrate
100‧‧‧ substrate transfer equipment

110‧‧‧ transmission device
120‧‧‧ Positioning device

121‧‧‧Image acquisition unit
122‧‧‧ backlight unit

130‧‧‧ Computing Unit
1000‧‧‧ semiconductor process equipment

2‧‧‧ Cassette
200‧‧‧Unloading area

300‧‧‧ reaction chamber
30‧‧‧ carrier

M_P‧‧‧Measured position
P_P1‧‧‧First preset position

P_P2‧‧‧Second preset position
P_C‧‧‧Default transmission coordinates

A_C‧‧‧Correct transmission coordinates
P_CC‧‧‧ preset circle center coordinates

M_CC‧‧‧Circle center coordinate detection value
O_A, O_A'‧‧‧ Optical axis

C_F‧‧‧ Acquisition range
P_DP‧‧‧Default device location

S10 ~ S90‧‧‧step         

FIG. 1 is a schematic structural diagram of a cassette for placing a wafer in a conventional technology; FIG.

FIG. 2 is a schematic structural diagram of a semiconductor process machine according to an embodiment of the present disclosure; FIG.

3 is a schematic diagram showing a first preset position and a second preset position according to an embodiment of the present disclosure;

4 is a schematic structural diagram of an image capturing unit and a backlight unit according to an embodiment of the disclosure;

FIG. 5 is a schematic diagram of a preset device position according to an embodiment of the disclosure; FIG.

6 is a schematic diagram of an image obtained by an image capturing unit according to an embodiment of the present disclosure;

FIG. 7 is a schematic flowchart of a substrate transfer method according to an embodiment of the disclosure.

Claims (9)

A substrate transfer device is adapted to transfer the substrate from a lower cargo area to a carrier. The substrate transfer device includes:
A transfer device for supporting the substrate and transferring the substrate to the carrier; and a positioning device disposed between the unloading area and the carrier for positioning a position to be tested of the substrate, wherein The transfer device is used to transfer the substrate to the positioning device for positioning before transferring the substrate to the stage;
The positioning device is used to calculate the measured position of the substrate;
If the position to be measured is the same as a first preset position, the positioning device provides a preset transfer coordinate to the transfer device, so that the substrate can be transferred by the transfer device to a second preset on the stage. Position; and if the position to be measured is different from the first preset position, the positioning device provides a correction transfer coordinate to the transfer device so that the substrate can be transferred by the transfer device to the second on the stage A preset position, wherein the modified transmission coordinate includes the preset transmission coordinate and a coordinate correction value, the first preset position is a preset circle center coordinate, the measured position is a circle center coordinate detection value of the substrate, and the The coordinate correction value is the difference between the circle center detection value and the preset circle center coordinate. The substrate transfer device according to item 1 of the patent application scope, wherein the positioning device includes an image capturing unit and a backlight unit disposed opposite the image capturing unit;
An optical axis of the backlight unit overlaps an optical axis of the image capturing unit; and the transfer device is used to transfer the substrate between the backlight unit and the image capturing unit so that the substrate is located in the image capturing unit. One in the image range. The substrate transfer device according to item 2 of the scope of patent application, wherein the first preset position is located in the image capturing range between the backlight unit and the image capturing unit. The substrate transfer device according to item 2 of the scope of patent application, wherein when the transfer device reaches a preset device position, the positioning device detects whether the substrate is located at the first preset position, and the preset device position It is located between the backlight unit and the image capturing unit. The substrate transfer device according to item 1 of the scope of patent application, wherein the position to be measured is an average value of a plurality of detection values of the center coordinates of the substrate. The substrate transfer device according to item 1 of the scope of the patent application, wherein the positioning device includes an arithmetic unit for calculating the circle center coordinate detection value of the substrate, and the circle center coordinate detection value is calculated by the computing device in a graphic ratio. Calculated by one of the pair method, a circular arc calculation method, or a circular adaptation caliper method. The substrate transfer device according to item 1 of the patent application scope, wherein the positioning device is used to operate the image capturing unit to obtain a complete image of the substrate. A semiconductor process machine includes:
A reaction chamber for semiconductor processing, wherein a stage is set in the reaction chamber;
A cargo area for placing at least one substrate; and a substrate transfer device, including:
A transfer device for supporting the substrate and transferring the substrate from the unloading area to the carrier; and a positioning device provided between the unloading area and the carrier for positioning the substrate A position to be measured, wherein the transfer device is used to transfer the substrate to the positioning device for positioning before transferring the substrate to the stage;
The positioning device is used to calculate the measured position of the substrate;
If the position to be measured is the same as a first preset position, the positioning device provides a preset transfer coordinate to the transfer device, so that the substrate can be transferred by the transfer device to a second preset on the stage. Position; and if the position to be measured is different from the first preset position, the positioning device provides a correction transfer coordinate to the transfer device so that the substrate can be transferred by the transfer device to the first position on the carrier. Two preset positions, wherein the modified transmission coordinate includes the preset transmission coordinate and a coordinate correction value, the first preset position is a preset circle center coordinate, the position to be measured is a circle center coordinate detection value of the substrate, and The coordinate correction value is a difference between the circle center coordinate detection value and the preset circle center coordinate. The semiconductor process machine according to item 8 of the scope of patent application, wherein the positioning device includes an image capturing unit and a backlight unit disposed opposite the image capturing unit;
An optical axis of the backlight unit overlaps an optical axis of the image capturing unit; and the transfer device is used to transfer the substrate between the backlight unit and the image capturing unit so that the substrate is located in the image capturing unit. One in the image range.