TW202046438A - Alignment system and method for operating the same - Google Patents

Abstract

An alignment system includes an adjustable stage, a processing module, a first and a second image capture device, and a pick-up device. The adjustable stage is configured to accommodate and adjust a substrate. The processing module is configured to provide at least a first virtual mask and a second virtual mask. The first image capture device is configured to capture an image of a first region of the substrate. The second image capture device is configured to capture an image of a second region of the substrate. The pick-up device is configured to pick up and place a first device to the first region and to adjust the first device such that the first device overlaps the first virtual mask, and to pick up and place the second device in the second region and to adjust the second device such that the second device overlaps the second virtual mask.

Description

Alignment system and method of operation

The present disclosure relates to an alignment system and an operation method thereof, and particularly relates to an alignment system and an operation method thereof that use the superimposition of a virtual image and a physical image to achieve high-precision alignment.

With the trend of miniaturization of electronic devices, semiconductor dies used in these end products or composing these end products are also moving towards higher density and narrower pitch. Therefore, in the die bonding (also known as die bonding) process of assembling the semiconductor device to the substrate, the alignment of the die and the substrate is an important step.

In addition, different products may need to assemble dies with different functions and/or different sizes, which makes the die bonding process more complicated, and requires more stringent die bonding accuracy.

The present disclosure discloses an alignment system used in die bonding process and its operation method. By providing different virtual images and superimposition of the placement positions of different components, the steps of placing die of different functions and sizes are completed. And meet the requirements of high precision.

Some embodiments of the present disclosure provide an alignment system including an adjustment table, an arithmetic module, a first image capturing device and a second image capturing device, and a picking device. The adjustment table is configured to place a substrate and adjust the substrate. The operation module is configured to provide at least a first virtual mask and a second virtual image, and the first virtual image is different from the second virtual image. The first image capturing device and the second image capturing device are configured to capture images of at least a first area and a second area on the substrate, and provide an image of the first area and an image of the second area To the computing module. The picking device is configured to pick up at least a first component and a second component. The adjustment stage adjusts the substrate to overlap the image of the first area and the first virtual image, and overlap the image of the second area and the second virtual image. The picking device places the first element into the first area and superimposes the first element and the first dummy pattern, and places the second element into the second area and superimposes the second element and the The second virtual image. The first element is different from the second element.

Another embodiment of the present disclosure provides an operating method of the alignment system. The method includes the following steps: providing a first virtual image and a second virtual image, and the first virtual image is different from the second virtual image. A first image capturing device and a second image capturing device are used to capture images of a first area and a second area of the substrate, the first area and the second area are separate and different in size. A first alignment step is performed to overlap the image of the first area and the first virtual image, and to overlap the image of the second area and the second virtual image.

The technical features of the present disclosure have been briefly described above, so that the detailed description of the present disclosure below can be better understood. Other technical features that constitute the subject of the patent application scope of this disclosure will be described below. Those with ordinary knowledge in the technical field to which the present disclosure belongs should understand that the concepts and specific embodiments disclosed below can be used as a basis to modify or design other structures or processes to achieve the same purpose as the present disclosure. Those with ordinary knowledge in the technical field to which this disclosure belongs should also understand that such equivalent constructions cannot deviate from the spirit and scope of this disclosure proposed in the appended patent scope.

The direction discussed in this disclosure is an alignment system and its operation method. In order to thoroughly understand this disclosure, detailed steps and components will be presented in the following description. Obviously, the implementation of this disclosure is not limited to the specific details familiar to those skilled in the relevant field. On the other hand, well-known components or steps are not described in details to avoid unnecessary limitation of this disclosure. The preferred embodiments of the present disclosure will be described in detail as follows. However, in addition to these detailed descriptions, the present disclosure can also be widely implemented in other embodiments, and the scope of the present disclosure is not limited, and the subsequent patent scope shall prevail. .

Please refer to FIG. 1 and FIG. 2, which illustrate an alignment system provided according to different embodiments of the present disclosure. According to an embodiment of the disclosure, the alignment systems 100 and 102 may include an adjustment stage 110, an arithmetic module 120, a plurality of imaging devices 130a and 130b, a display device 140, and a pickup device 150.

As shown in FIGS. 1 and 2, the adjustment stage 110 is configured to place a target object, such as a substrate, but the disclosure is not limited thereto. In some embodiments of the present disclosure, the computing module 120 is configured to provide at least a first virtual image and a second virtual image, and the first virtual image and the second virtual image are different. In some embodiments of the present disclosure, the computing module 120 can generate the first virtual image and the second virtual image through a computer-aided design (CAD) software. The first virtual image and the second virtual image may include different circuit design layout plans, but the disclosure is not limited to this.

In some embodiments of the present disclosure, the image capturing device may include at least one first image capturing device 130a and a second image capturing device 130b, but the number of image capturing devices is not limited thereto. In addition, the first image capturing device 130a and the second image capturing device 130b are configured to capture at least an image of a first area and an image of a second area on the substrate, and provide an image of the first area and a second area The image to the computing module 120. The first image capturing device 130a and the second image capturing device 130b may be a camera, a video camera or other image capturing devices, respectively. In some embodiments, the first image capturing device 130a and the second image capturing device 130b respectively include an image capturing element 132, an optical scale device 134, a magnification controller 136, and an optical lens 138. The image capturing element 132 may include a charge-coupled device (CCD), a complementary metal oxide semiconductor (CMOS) photosensitive element, but the disclosure is not limited thereto. The optical scale device 134 is configured to provide an image capturing position of the image capturing element 132, and can provide the image capturing position to the computing module 120. The magnification controller 136 is configured to control the imaging magnification of one of the imaging elements 132. The optical lens 138 may be a lens group or a reflective imaging lens group, but the disclosure is not limited to this. In some embodiments of the present disclosure, the imaging magnification of the first imaging device 130a has a first range, the imaging magnification of the second imaging device 130b has a second range, and the first range and the second range The scope is different. In some embodiments of the present disclosure, the first imaging device 130a has a first field of view (FOV), the second imaging device 130b has a second field of view, and the first field of view and the The second field of view is different. In some embodiments of the present disclosure, the alignment system 100 may further include a rail 131, and the first image capturing device 130a and the second image capturing device 130b can move horizontally relative to the substrate along the rail 131 to adjust their image capturing. position. Therefore, the first image capturing device 130a and the second image capturing device 130b can move to the target area to capture images in a one-dimensional direction or a two-dimensional direction. In addition, the first image capturing device 130a and the second image capturing device 130b can also be configured to move up and down relative to the substrate to adjust the image capturing heights thereof. Therefore, the first image capturing device 130a and the second image capturing device 130b can also be used to capture 3D images.

Please continue to refer to Figure 1 and Figure 2. The display device 140 is configured to display the first virtual image, the second virtual image, the image of the first area of the substrate, and the image of the second area of the substrate. The picking device 150 is configured to pick up at least one first element and one second element, and the first element and the second element may be different.

Please refer to FIG. 1, in some embodiments of the present disclosure, the first image capturing device 130 a and the second image capturing device 130 b of the alignment system 100 may be disposed above the adjustment table 110. Please refer to FIG. 2, in other embodiments of the present disclosure, the first image capturing device 130 a and the second image capturing device 130 b of the alignment system 102 may be disposed under the adjustment table 110. In these embodiments, the adjustment stage 110 may include a light-transmitting material, and the substrate may be a light-transmitting substrate. Therefore, even if the first image capturing device 130a and the second image capturing device 130b can be disposed under the adjustment table 110, images of different areas on the substrate can still be captured.

In other embodiments, the first image capturing device 130a and the second image capturing device 130b may be disposed above and below the adjustment table 110, respectively. In addition, in other embodiments of the present disclosure, the first image capturing device 130a and the second image capturing device 130b can capture images of different areas on the substrate obliquely at an angle. That is, the first image capturing device 130a and the substrate may have a first angle, the second image capturing device 130b and the substrate may have a second angle, and the first angle and the second angle may be the same or different.

According to the embodiment of the disclosure, the adjustment stage 110 of the alignment system 100 and 102 adjusts the substrate to overlap the image of the first area and the first virtual image, and overlap the image of the second area and the second virtual image . For example, the alignment systems 100 and 102 can use the arithmetic module 120 to control the position and position of the adjustment stage 110 according to the first virtual image and the image of the first region, and the second virtual image and the image of the second region. The pitch angle is to overlap the image of the first area and the first virtual image, and to overlap the image of the second area and the second virtual image. The pick-up device 150 of the alignment system 100 and 102 places the first component in the first area and overlaps the first component and the first virtual image, and places the second component in the second area and overlaps the second component With the second virtual image. For example, the alignment systems 100 and 102 can be based on the first virtual image and the image of the first element in the first area, and the second virtual image and the second element in the second area through the computing module 120 The image control pickup device 150 is used to superimpose the first element and the first virtual image, and superimpose the second element and the second virtual image.

Please refer to FIG. 3, which is a schematic flowchart of an embodiment of the alignment system operation method provided by the disclosure. As shown in FIG. 3, the alignment system operation method 20 provided by the present disclosure may include step 202, step 204, step 206, step 208, step 210, and step 212.

4, according to step 202 of the alignment system operating method 20 provided by the present disclosure, a first virtual image V1 and a second virtual image V2 are provided. As described above, the first virtual image V1 and A second virtual image V2 can be generated by a computer-aided design software. It should also be noted that the first virtual image V1 and the second virtual image V2 can be displayed on the display device 140. The first virtual image V1 is different from the second virtual image V2. As shown in FIG. 4, the first virtual image V1 may include a pattern of the position of an optical fiber element, and the second virtual image V2 may It includes a pattern of the position of the laser light emitting element, but the disclosure is not limited to this. It is also worth noting that different components may have different sizes. For example, the size of an optical fiber component may be larger than that of a laser light emitting component. In some embodiments, the size of the optical fiber element may be 1.70*2.00*1.25 (mm ³ ), and the size of the laser light-emitting element may be 0.25*0.8*0.095 (mm ³ ). However, in the first virtual image V1 and the second virtual image V2, different elements can be displayed to have almost the same size. However, in other embodiments of the present disclosure, in the first virtual image V1 and the second virtual image V2, different elements may still contain different sizes, but the first virtual image V1 and the second virtual image V2 The size of the element pattern is such that the operator can clearly observe it from the display device 140. In addition, the first virtual image V1 may include a pair of marks A1, and the second virtual image V2 may include a pair of marks A2.

Please refer to Figure 5. Next, according to step 204, a substrate SUB is placed on the adjustment table 110. In some embodiments of the present disclosure, the substrate SUB may be a circuit substrate, and the circuit substrate may be a rigid board, a flexible board, or a rigid-flex board, and the material may be semiconductor, metal, polymer, ceramic, glass, Sapphire, and printed circuit board materials familiar to the industry, etc. In some other embodiments of the present disclosure, the substrate SUB may also be a transparent substrate such as a glass substrate or a plastic substrate, and is not limited thereto. According to step 206, the first image capturing device 130a and the second image capturing device 130b are used to capture the image of the first area R1 and the second area R2 of a substrate SUB, respectively. And as shown in FIG. 5, the first region R1 and the second region R2 are separated from each other and have different sizes. In some disclosed embodiments, the first region R1 and the second region R2 can be used to place different elements. For example, the aforementioned optical fiber can be placed in the first zone R1, and the aforementioned laser light emitting element can be placed in the first zone. Two area R2.

It is worth noting that because the sizes of different components are not the same, the size of the placement area may also be different. If a single imaging device is used, it will face the limit of the magnification adjustment of the single imaging device and the limit of the field of view. For example, in some comparative embodiments, a single imaging device is used. The imaging magnification of a single imaging device has a range within which a clear image of the original layout plan in the first region R1 can be provided, but within this range, a clear image of the original layout plan in the second region R2 may not be provided. Or, in the field of view of a single imaging device, the entire second region R2 can be observed, but only a part of the first region R1 can be observed. As a result, the placement accuracy of different components may be different, resulting in a decrease in the accuracy of the location of die adhesion. Even if a single imaging device based on a large imaging magnification range and field of view can be used, the single imaging device may be too expensive and the manufacturing cost may increase. In addition, since the first region R1 and the second region R2 may be far apart, it may also cause a single image capturing device to perform multiple image capturing and alignment between different regions and increase the time cost.

Therefore, the present disclosure provides a first image capturing device 130a and a second image capturing device 130b having different image capturing ranges and different field of view ranges. The first image capturing device 130a can be used to capture larger components and larger areas. The image of the first region R1 and the second image capturing device 130b can be used to capture the image of the second region R2 with a smaller area where smaller components are placed, but the disclosure is not limited to this. Therefore, even if the substrate SUB has areas with huge differences in area and/or far away, the alignment system 100 or 102 can still provide a complete field of view and clear images. In addition, as mentioned above, the clear image of the first region R1 and the clear image of the second region R2 can be displayed on the display device 140. In some embodiments, even though the actual areas of the first region R and the second region R2 are different, in the display device 140, the image of the first region R and the image of the second region R2 can be adjusted separately, so that the operator It can be clearly observed from the display device 140.

The first area R1 and the second area R2 may have different layout plans or alignment marks, respectively. In some embodiments of the present disclosure, a substrate alignment step can be performed according to step 208. In step 208, the arithmetic module 120 can be used to control the position and elevation angle of the adjustment table 110 to the image of the first region R1. For example, the layout plan in the first region R1 overlaps the first virtual image V1, or The alignment mark in a region R1 overlaps with the alignment mark A1 of the first virtual image V1. The arithmetic module 120 simultaneously controls the position and the pitch angle of the adjustment stage 110 to make the image of the second region R2, for example, the layout plan in the second region R2 overlaps the second virtual image V2, or the alignment in the second region R2 The alignment mark overlaps with the alignment mark A2 of the second virtual image V2.

Please refer to Figure 6. Next, according to step 210, a first component D1 is picked up and placed in the first area R1 by the picking device 150, and a second component D2 is picked up and placed in the second area R2, and the first component D1 and the second component D2 is different. In some embodiments, the dimensions of the first element D1 and the second element D2 are different. In other embodiments, the functions of the first element D1 and the second element D2 are different. For example, the first element D1 may be an optical fiber element with a larger size, and the second element D2 may be a laser light emitting element with a smaller size. As mentioned above, the size of the first element D1 and the second element D2 may be very different, but since the present disclosure provides imaging devices 130a and 130b with different imaging magnifications and different field of view, even the size Different elements with great differences can still be clearly presented in the display device 140. As shown in FIG. 6, the first imaging device 130a can clearly show the relative relationship between the first element D1 and the first virtual image V1 in the first region R1, and the second imaging device 130b can clearly show the second region The relative relationship between the second element D2 and the second virtual image V2 in R2.

Refer to Figure 7. Next, step 212 is performed to perform a component alignment step to superimpose the first component D1 and the first virtual image V1, and superimpose the second component D2 and the second virtual image V2. In some embodiments of the present disclosure, the pickup device 150 can be controlled to adjust the position of the first element D1 until the first element D1 overlaps with the first virtual image V1, and at the same time adjust the position of the second element D2 to overlap with the first element D1. The two virtual images V2 are superimposed, as shown in Figure 7. In some embodiments of the present disclosure, the arithmetic module 120 can be used to control the pick-up device 150 to perform the above-mentioned component alignment steps to adjust the positions of the first component D1 and the second component D2 respectively. In other embodiments of the present disclosure, it is also possible to manually operate the picking device 150 to perform the above-mentioned component alignment steps to adjust the positions of the first component D1 and the second component D2 respectively.

Refer to Figure 8. According to some embodiments of the disclosure, it may further include a step of bonding the first device D1 to the substrate SUB and the second device D2 to the substrate SUB, and complete a die bonding process. As shown in Fig. 8, in fact, the first element D1 and its area R1 may be much larger than the second element D2 and its area R2. This difference may exceed the limit of a single imaging device, and the positions may be far apart . Therefore, the present disclosure provides multiple arrays of imaging devices 130a and 130b, which utilize different magnification ranges and field of view sizes to meet the requirements of improving alignment accuracy in components and regions of different sizes, without increasing the complexity of the manufacturing process. Under the premise of high degree, the flexibility of the process is improved.

The foregoing summarizes the features of some embodiments, so those skilled in the art can better understand various aspects of the disclosure. Those skilled in the art should understand that the present disclosure can be easily used as a basis for designing or modifying other processes and structures to achieve the same purpose and/or same advantages as the embodiments described in this application. Those familiar with this technique should also understand that this equalization structure does not deviate from the spirit and scope of the content disclosed in this disclosure, and those familiar with this technique can make various changes, substitutions and substitutions without departing from the spirit and scope of this disclosure.

100: alignment system 102: Alignment system 110: adjustment table 120: Computing module 130a: The first imaging device 130b: Second imaging device 131: Orbit 132: Acquisition components 134: Optical ruler device 136: rate controller 138: Optical lens 140: display device 150: Pickup device 20: Alignment system operation method 202: Step 204: Step 206: Step 208: Step 210: Step 212: Step V1: The first virtual image V2: Second virtual image A1: Counterpoint A2: Counterpoint SUB: Substrate R1: First zone R2: second area D1: The first component D2: The second element

To help readers achieve the best understanding, it is recommended to refer to the attached illustrations and detailed text descriptions when reading this disclosure. Please note that in order to comply with industry standard practices, the drawings in this patent specification are not necessarily drawn at the correct scale. In some drawings, the size may be deliberately enlarged or reduced to help readers clearly understand the discussion content. FIG. 1 is a schematic diagram illustrating an alignment system provided according to an embodiment of the present disclosure. FIG. 2 is a schematic diagram illustrating an alignment system provided according to another embodiment of the present disclosure. FIG. 3 is a flowchart illustrating an embodiment of the operation method of the alignment system provided by the present disclosure. 4 to 8 are schematic diagrams of different steps in an embodiment of the operation method of the alignment system provided by the disclosure.

100: alignment system

110: adjustment table

120: Computing module

130a: The first imaging device

130b: Second imaging device

131: Orbit

132: Acquisition components

134: Optical ruler device

136: rate controller

138: Optical lens

140: display device

150: Pickup device

Claims (20)

An alignment system including: An adjustment table configured to place a substrate and adjust the substrate; An arithmetic module configured to provide at least a first virtual mask and a second virtual image, and the first virtual image is different from the second virtual image; A first image capturing device and a second image capturing device are configured to capture images of at least a first area and a second area on the substrate, and provide images of the first area and the second area Images to the computing module; and A picking device configured to pick up at least a first component and a second component, The adjustment stage adjusts the substrate to superimpose the image of the first region and the first virtual image, and superimpose the image of the second region and the second virtual image, and the pickup device is placed on the first virtual image. An element is placed in the first area and superimposed on the first element and the first virtual image, and the second element is placed in the second area and superimposed on the second element and the first virtual image, And the first element is different from the second element. The alignment system according to claim 1, wherein the first image capturing device and the second image capturing device respectively include: An imaging element; An optical ruler device configured to provide an image capturing position of the image capturing element; and A magnification controller is configured to control an imaging magnification of one of the imaging elements. The alignment system according to claim 2, wherein the imaging magnification of the first imaging device has a first range, the imaging magnification of the second imaging device has a second range, and the first The range is different from this second range. The alignment system according to claim 2, wherein the first image capturing device has a first field of view (FOV), the second image capturing device has a second field of view, and the first field of view The range is different from the second field of view. The alignment system according to claim 1, further comprising a display device configured to display the first virtual image, the second virtual image, the image of the first region of the substrate, and the first region of the substrate Images of two regions, the first element and the second element. The alignment system according to claim 1, further comprising a track, wherein the first imaging device and the second imaging device move horizontally relative to the substrate along the track to adjust an imaging position. The alignment system according to claim 1, wherein the first image capturing device and the second image capturing device are configured to move up and down relative to the substrate to adjust an image capturing height. The alignment system according to claim 1, wherein the first image capturing device is arranged above or below the adjustment table. The alignment system according to claim 1, wherein the second image capturing device is arranged above or below the adjustment table. The alignment system according to claim 1, wherein the arithmetic module controls the adjustment stage according to the first virtual image and the image of the first area, and the second virtual image and the image of the second area The position and the pitch angle are to overlap the image of the first area with the first virtual image, and to overlap the image of the second area with the second virtual image. The alignment system according to claim 1, wherein the arithmetic module controls the pickup device according to the first virtual image and the image of the first area, and the second virtual image and the image of the second area , To superimpose the first element and the first virtual image, and superimpose the second element and the second virtual image. A method of operating the alignment system, including: Providing a first virtual image and a second virtual image, and the first virtual image and the second virtual image are different; Place a substrate on an adjustment table; Using a first image capturing device and a second image capturing device to capture images of a first region and a second region of the substrate, the first region and the second region are separated from each other and have different sizes; Using a picking device to pick up a first element and place it in the first area, and pick up a second element and place it in the second area, and the first element is different from the second element; and A component alignment step is performed to superimpose the first component and the first virtual image, and superimpose the second component and the second virtual image. The operation method according to claim 12, further comprising a substrate alignment step, which controls the position and elevation angle of the adjustment stage to the image of the first area to be overlapped with the first virtual image, and the second area The image is superimposed with the second virtual image. The operation method according to claim 13, wherein the first virtual image and the second virtual image respectively include a pair of digits. The operation method according to claim 12, wherein the component positioning step further includes controlling the pickup device to adjust the positions of the first component and the second component until the first component and the first virtual image overlap, And the second element is overlapped with the second virtual image. The operating method according to claim 12, wherein the first element and the second element include different elements. The operation method according to claim 12, wherein the first element and the second element include different sizes. The operation method according to claim 12, wherein the first virtual image and the second virtual image are generated by a computer-aided design software. The operation method according to claim 12, further comprising displaying the first virtual image, the second virtual image, the image of the first area of the substrate, and the second area of the substrate on a display device The image, the first element and the second element. The operation method according to claim 12 further includes a step of bonding the first element to the substrate and the second element to the substrate.

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