TW202044678A - Power interposer with bypass capacitors - Google Patents

Abstract

In one embodiment, an electrical power interposer has a first mounting interface that can mount to a first electrical component, and a second mounting interface that is opposite the first mounting interface and can mount to a second electrical component. The interposer has a plurality of electrical contacts that extend from the first mounting interface to the second mounting interface. Each electrical contact has a first mounting end at the first mounting interface and a second mounting end at the second mounting interface. The interposer has a plurality of capacitors that interconnect pairs of the electrical contacts to one another. The capacitors can limit inductance along a path that extends through the interposer along a direction from the first mounting interface to the second mounting interface.

Description

Power interposer with bypass capacitor

This application is related to power interposers with bypass capacitors.

This application claims the priority of U.S. Provisional Patent Application No. 62/840,731 filed on April 30, 2019, the entire disclosure of which is incorporated herein by reference.

Electrical connector systems generally include one or more circuits and components on interconnected circuit boards. Examples of circuit boards in the electrical connector system may include daughter boards, main boards, backplanes, midplanes, or the like. The electrical assembly may further include an electrical connector that provides an interface between the electrical components and provides a conductive path for the electrical communication data signal and/or power source to place the electrical components in electrical communication with each other.

In one example, the power interposer includes a first mounting interface, a second mounting interface, a plurality of electrical contacts, and a plurality of capacitors. The first mounting interface is configured to be mounted to the first electrical component. The second mounting interface is opposite to the first mounting interface and is configured to be mounted to the second electrical component. A plurality of electrical contacts extend from the first mounting interface to the second mounting interface. Each electrical contact has a first mounting end at the first mounting interface and a second mounting end at the second mounting interface. Each capacitor is electrically coupled to a pair of electrical contacts.

In electronic circuits, interposers are generally used to route the electrical connection of a first electrical component (such as a first printed circuit board (PCB)) to the electrical connection of a second electrical component (such as a second PCB). In many cases, the interposer is used to route electrical connections with a first pitch to electrical connections with a second pitch different from the first pitch, or to reroute one or more of the electrical connections relative to other Different locations of one or more of the electrical connections.

The interposer may additionally or alternatively be used to place the first electrical component in electrical communication with the second electrical component so that the interposer creates a gap between the first electrical component and the second electrical component. This can be advantageous when one or more other electrical components are placed between the first electrical component and the second electrical component. However, the inductance along the path extending from the first electrical component through the interposer to the second electrical component is related to the distance between the first electrical component and the second electrical component, and therefore to the length of the wiring in the interposer. Longer wiring in the interposer can experience greater inductance than comparable shorter wiring. To offset or limit the inductance, the interposer may include a plurality of capacitors attached to the wiring, as discussed below. An interposer having a wiring with a plurality of capacitors attached thereon may have a lower inductance than a comparable interposer without capacitors (for example, wiring with the same length).

Referring to FIG. 1, generally speaking, the system 100 includes a first electrical component 104 and a second electrical component 106. The first electrical component 104 can be, for example, a main printed circuit board (PCB), and the second electrical component 106 can be, for example, a secondary PCB, a packaged integrated circuit (IC) with IC dies mounted on the secondary PCB, or a Bare IC die mounted to PCB. The first electrical component 104 provides power to the second electrical component 106. The first electrical component 104 may be directly connected to the second electrical component 106 in order to provide power to the second electrical component 106. However, as shown in FIG. 1, the system 100 includes at least one other electrical component located between the first electrical component 104 and the second electrical component 106. Specifically, the system 100 includes a power interposer 102 that (1) spaces a first electrical component 104 and a second electrical component 106 and (2) electrically couples the first electrical component 104 to the second electrical component 106 in order to provide power from the first electrical component 104 to the second electrical component 106. It should be understood that the system of the present invention may include the power interposer 102 and at least one such as the first electrical component 104 and the second electrical component 106 (such as both). As will be described in further detail below, the power interposer 102 may include a plurality of capacitors connected to the electrical contacts of the power interposer 102 in order to limit or offset the conductive path extending from the first electrical component 104 to the second electrical component 106的 inductance.

Referring now more detail with reference to a particular system 100, having a first electrical component 104 opposite to each other _along the first direction of the first surface and a second surface 104a D 104b. The first surface 104a can be regarded as an internal surface, and the second surface 104b can be regarded as an external surface. The first surface 104a and second surface 104b may each extend substantially D ₃ (to the page in FIG. 1) along the second direction and the third ₂ D. The first, second, and third directions may be substantially perpendicular to each other. The first or inner surface 104a of the first component 104 may include a plurality of electrical contacts 104c configured to be electrically coupled to the power interposer 102. In one example, the electrical contacts 104c can be configured in multiple columns and multiple rows; however, it should be understood that other configurations are encompassed. Electrical contacts 104c of the column D ₃ may be spaced from each other in the third direction. Each row of electrical contacts 104c may extend in a second direction D _2. 104c plurality of rows of electrical contacts ₂ may be spaced from each other along a second direction D. Each row of electrical contacts 104c may extend in a third direction D _3. Each electrical contact 104c can be a conductive contact pad, a plated through hole, or any other suitable electrical contact configured to mount an electrical component to a PCB.

Similarly, a second electrical component having a first direction 106 opposite to each other in _a first surface and a second surface 106a D 106b. The first surface 106a can be regarded as an internal surface, and the second surface 106b can be regarded as an external surface. The first surface 106a and second surface 106b may each extend substantially along the second direction and the third ₂ D D _3. The first or inner surface 104a of the first component 104 may face the first or inner surface 106a of the second component 106. The first or inner surface 106a of the second component 106 may include a plurality of electrical contacts 106c. In one example, the electrical contacts 106c may be configured in a plurality of columns R and a plurality of rows C, however, it should be understood that other configurations are encompassed. R ₁ may be a column spaced from each other in the third direction D. Each column may extend along a second direction D _{2. 2} C plurality of rows may be spaced from each other along a second direction D. Each row may extend in a third direction D _3. Each electrical contact 106c can be a conductive contact pad, a plated through hole, or any other suitable electrical contact configured to mount an electrical component to a PCB.

The system 100 may include a plurality of electrical components supported by the second electrical component 106. For example, the system 100 may include an integrated circuit (IC) 108 mounted on the second electrical component 106. The IC 108 may be mounted on the second surface 106b of the second electrical component 106 so that the IC 108 and the second electrical component 106 are in electrical communication. . The second electrical component 106 with IC 108 and optionally one or more additional electrical components (such as one or more of 110, 112, 114, 116, 118, 120, 122, and 124) can be called a chip package Or die package. In an alternative example, the system 100 may not contain a secondary PCB, and the IC 108 may be the second electrical component 106 mounted directly to the interposer 102. The internal surface of the IC 108 may include a plurality of electrical contacts, and in such an alternative example, the plurality of electrical contacts of the IC 108 may be the electrical contacts 106c of the second electrical component 106.

The system 100 may optionally include at least one of a plurality of electrical connectors (for example, 118, 120, 122, 124) installed on the second electrical component 106 as appropriate. Each electrical connector can be installed on one of the first surface 106 a and the second surface 106 b of the second electrical component 106 so as to be in electrical communication with the second electrical component 106. The second electrical component 106 can place each of the electrical connectors to communicate with the IC 108. Therefore, the second electrical component 106 may include an electrical communication path extending from each of the at least one electrical connector to the IC 108. Each electrical connector can be configured to mate with a corresponding electrical connector (not shown in the figure) in order to place the corresponding electrical connector in electrical communication with the second electrical component 106 and therefore with the IC 108.

In one example, the at least one electrical connector may include a first internal electrical connector 118 mounted to the first surface 106a of the second electrical component 106, so that the first internal electrical connector 118 is free from the second direction D ₂ The first side of the power interposer 102 is offset outward. Additionally or alternatively, the at least one electrical connector may include a second internal electrical connector 120 mounted to the first surface 106a of the second electrical component 106, so that the second internal electrical connector 120 is free from the second direction D ₂ The second side of the power interposer 102 is offset outward, and the second side is opposite to the first side of the power interposer 102. Therefore, the first internal electrical connector 118 and the second internal electrical connector 120 can be mounted to the second electrical component 106 on the opposite side of the power interposer 102. In other words, the first internal electrical connector 118 and the second internal electrical connector 120 may be spaced outwardly from the power interposer 102 in the opposite direction with respect to the second direction D ₂ .

Additionally or alternatively, the at least one electrical connector may include a first external electrical connector 122 mounted to the second surface 106b of the second electrical component 106, so that the first external electrical connector 122 is free from the second direction D ₂ The first side of IC 108 is offset outward. Additionally or alternatively, the at least one electrical connector may include a second external electrical connector 124 mounted to the second surface 106b of the second electrical component 106, so that the second external electrical connector 124 is free from the second direction D ₂ The second side of IC 108 is offset outward, and the second side is opposite to the first side of IC 108. Therefore, the first external electrical connector 122 and the second external electrical connector 124 can be mounted to the second electrical component 106 on the opposite side of the IC 108. In other words, the first external electrical connector 122 and the second external electrical connector 124 may be spaced outward from the IC 108 in the opposite direction with respect to the second direction D ₂ .

In some embodiments, the first external electrical connector 122 with respect to the first direction D ₁ with a first internal electrical connector 118 in a straight line. Additionally or alternatively, a second external electrical connector 124 with respect to the first direction D ₁ and the second internal electrical connector 120 in a straight line. However, it should be understood that alternative configurations of electrical connectors 118, 120, 122, and 124 are covered.

The system 100 may optionally include at least one of a plurality of capacitors (for example, 110, 112, 114, 116) mounted on the second electrical component 106 as appropriate. Each capacitor can be mounted to one of the first surface 106 a and the second surface 106 b of the second electrical component 106 so as to be in electrical communication with the second electrical component 106. Each capacitor may be configured to limit or offset at least one of resistance and inductance along a conductive path extending from one of the electrical connectors (eg, 118, 120, 122, and 124) to the IC chip 108.

In an example, the at least one capacitor may include a first internal capacitor 110 mounted to the first surface 106a of the second electrical component 106, so that the first internal capacitor 110 is from the first of the power interposer 102 relative to the second direction D ₂ One side is offset outward. The first internal capacitor 110 may be located in a signal path extending from the first internal electrical connector 118 to the IC 108, such as the signal path between the first internal electrical connector 118 and the IC 108. Additionally or alternatively, at least one capacitor may include a first electrical component mounted to the second surface 106 of the interior 106a of the second capacitor 112, so that the second internal capacitor 112 with respect to the second direction D ₂ from the power supply 102 of the inserter The two sides are offset outward, and the second side is opposite to the first side of the power interposer 102. The second internal capacitor 112 may be located in the signal path extending from the second internal electrical connector 1120 to the IC 108, such as the signal path between the second internal electrical connector 120 and the IC 108. Therefore, the first internal capacitor 110 and the second internal capacitor 112 can be mounted to the second electrical component 106 on the opposite side of the power interposer 102. In other words, the first internal capacitor 110 and the second internal capacitor 112 may be spaced outwardly from the power interposer 102 in the opposite direction with respect to the second direction D ₂ .

Additionally or alternatively, the at least one capacitor may include a first external capacitor 114 mounted to the second surface 106b of the second electrical component 106 such that the first external capacitor 114 is from the first side of the IC 108 with respect to the second direction D ₂ Offset outward. The first external capacitor 114 may be located in a signal path extending from the first external electrical connector 122 to the IC 108, such as the signal path between the first external electrical connector 122 and the IC 108. Additionally or alternatively, the at least one capacitor may include a second external capacitor 116 mounted to the second surface 106b of the second electrical component 106 so that the second external capacitor 116 is from the second side of the IC 108 with respect to the second direction D ₂ Offset outward, the second side is opposite to the first side of IC 108. The second external capacitor 116 may be located in the signal path extending from the second external electrical connector 124 to the IC 108, such as the signal path between the second external electrical connector 124 and the IC 108. Therefore, the first external capacitor 114 and the second external capacitor 116 can be mounted to the second electrical component 106 on the opposite side of the IC 108. In other words, the first external capacitor 114 and the second external capacitor 116 may be spaced outward from the IC 108 in the opposite direction with respect to the second direction D ₂ .

In some embodiments, the first external capacitor 114 is mounted to the second surface 106b with respect to the first direction D ₁ and mounted to a first surface 110 of the inner capacitor 106a in line. Additionally or alternatively, mounted to the second surface 106b of the second capacitor 116 may be external with respect to the first direction D ₁ is mounted to the first surface 112 of the second internal capacitor 106a in line. However, it should be understood that alternative configurations of capacitors 110, 112, 114, and 116 are covered.

As can be seen in FIG. 1, the system 100 may optionally include at least one internal electrical component (for example, 110, 112, 118, and 120) between the first electrical component 104 and the second electrical component 106. At least one internal electrical component in a first direction D ₁ has an outer dimension. The interposer 102 can space the first electrical component 104 and the second electrical component 106 from each other by at least an outer dimension so that at least one internal electrical component does not mechanically interfere with the first electrical component 104. Therefore, the system 100 defines a gap 107 between the first electrical component 104 and the second electrical component 106, the gap 107 being configured to provide a gap for at least one internal electrical component. 107 spaced along a first direction D ₁ extending from the first surface 104a of the first electrical component 104 to the second electrical component 106 of the first surface 106a. At least one (at most all) of the first internal electrical connector 118, the second internal electrical connector 120, the first internal capacitor 110, and the second internal capacitor 112 can be placed on the first electrical component 104 and the second electrical component 106 between the interval 107.

The interval 107 may have a size H ₁ along the first direction D ₁ from the first surface 104 a to the first surface 106 a, and the size H _{1 is} greater than or equal to the maximum size of the internal electrical component disposed in the interval 107. For example, the size H ₁ may be greater than or equal to the maximum size of at least one of the internal electrical connectors 118 and 120 along the first direction D ₁ . Therefore, the second electrical component 106 can be mounted to the first electrical component 104 so that the internal electrical components mounted on the first surface 106 a of the second electrical component 106 do not mechanically interfere with the first electrical component 104.

1 and 2, the system 100 includes a power interposer 102 between the first electrical component 104 and the second electrical component 106 to create a gap with a defined interval 107 between the first electrical component 104 and the second electrical component 106. Power Interposer 102 has a first mounting interface 130 and the second mounting interface 132 in a first direction D ₁ offsets to each other. The power interposer 102 has a dimension H ₂ along the first direction D ₁ from the first mounting interface 130 to the second mounting interface 132, and the dimension H ₂ at least partially defines the dimension H _{1 of the} interval 107. The power interposer 102 may be a straight interposer, in which the first mounting interface 130 and the second mounting interface 132 are mounted in the same direction (ie, the first direction D ₁ ). However, in an alternative embodiment, the inserter 102 may be an angled inserter (such as a right-angled inserter) in which the first interface 130 and the second interface 132 are installed in directions that are angularly offset from each other.

The power interposer 102 includes a plurality of electrical contacts 134 (shown in Figures 4, 5 to 9 and 12). The electrical contact 134 may be supported by a dielectric or non-conductive housing 136. Each electrical contact 134 along a first direction D ₁ of the first mounting end offset from each other and the second mounting end 134a 134b. Each electrical contact 134 has a contact body 134c (shown in FIGS. 4, 5 to 9 and 12) extending from the first mounting end 134a to the second mounting end 134b. Contact body 134c may be substantially elongated along a first direction D _1. Each electrical contact 134 may have a size H ₂ from its first mounting end 134a to its second mounting end 134b _. When mounted to the first electrical component 104 and the second electrical component 106, each electrical contact 134 is formed from one of the electrical contacts 104c of the first electrical component 104 to the electrical contact 106c of the second electrical component 106 One of the conductive paths.

The first mounting end 134 a at least partially defines the first mounting interface 130 and is configured to be mounted to the second electrical component 106. For example, each first mounting end 134a is configured to be mounted to the electrical contact 106c of the second electrical component 104. The first mounting end 134a can be configured in a plurality of columns R and a plurality of rows C; however, it should be understood that other configurations are covered. Column D ₃ R may be spaced from each other in the third direction. Each column may extend along a second direction D _{2. 2} C plurality of rows may be spaced from each other along a second direction D. Each row may extend in a third direction D _3. The plurality of first mounting ends 134a can define a grid or other suitable patterns. The grid may have a uniform pitch on each column R and each row C. In other words, the distance between the first mounting ends 134a can be constant on each column R and each row C. Alternatively, the pitch can vary from one column to the next, from one row to the next, in column R, and/or in row C.

Each first mounting end 134a may be configured to be configured to receive a mounting tail of a solder ball. In some embodiments, each first mounting end 134a may include solder balls such that the first mounting ends 134a together define a ball grid array (as shown). However, in alternative embodiments, each first mounting part may be configured as a press-fit mounting tail, surface mounting tail, compression mounting part, or any other suitable mounting part or suitable for mounting the power interposer 102 to a PCB The combination of installation parts.

The second mounting end 134 b at least partially defines the second mounting interface 132 and is configured to be mounted to the first electrical component 104. For example, each second mounting end 134b is configured to be mounted to the electrical contact 104c of the first electrical component 104. The second mounting end 134b may be configured in a plurality of columns R and a plurality of rows C; however, it should be understood that other configurations are covered. Column D ₃ R may be spaced from each other in the third direction. Each column may extend along a second direction D _{2. 2} C plurality of rows may be spaced from each other along a second direction D. Each row may extend in a third direction D _3. The plurality of second mounting ends 134b can define a grid or other suitable patterns. The grid may have a uniform pitch on each column R and each row C. In other words, the distance between the second mounting ends 134b can be constant on each column R and each row C. Alternatively, the pitch can vary from one column to the next, from one row to the next, in column R, and/or in row C. The configuration and spacing of the second mounting end 134b can match the configuration and spacing of the first mounting end 134a. Alternatively, at least one of the configuration and spacing of the second mounting end 134b may be different from the configuration and spacing of the first mounting end 134a.

Each second mounting end 134b can be configured as any suitable mounting part. Figure 3 shows an example of a mount, but covers other compression mounts. It should be understood that in alternative embodiments, each second mounting part may alternatively be configured as a solder ball, a mounting tail, pins, pads, a press-fit mounting tail, a surface mounting tail, or a solder ball configured to receive the solder ball. Any other suitable mounting parts or a combination of mounting parts suitable for mounting the power interposer 102 on the PCB.

3, 4, 6, 8 and 9, in one example, each contact body 134c may be a linear beam or pin extending from the first mounting end 134a to the second mounting end 134b. For example, each contact body 134c may have a pair of opposed wide sides and a pair of edges extending from one of the wide sides to the other of the wide sides. The wide side may have a width greater than the thickness of the edge. One of the electrical contacts 134 of electrical contacts 134 R, D ₂ can be edge to edge aligned in a second direction. The distance between adjacent electrical contacts 134 in a row R of electrical contacts 134 may be less than the width of adjacent electrical contacts 134 along row R. However, it should be understood that the electrical contacts 134 can have other suitable shapes and can be oriented relative to each other in different ways than discussed above. For example, each contact body 134c may define a pin with a circular cross section. Additionally or alternatively, each contact body 134 may be non-linear, such as in an embodiment where one or more of the electrical connections are rerouted to a different location relative to one or more of the other electrical connections .

3 and 4, in one example, the power interposer 102 may include a plurality of frames 135, which may be referred to as lead frames. Each frame 135 has a main body formed of dielectric or non-conductive material. Each body supports a plurality of electrical contacts 134 in a row R. The frame 135 may be supported by the housing 136 and may be offset from each other in the third direction D ₃ .

The inductance along the path extending from the first electrical component 104 to the second electrical component 106 through the power interposer is determined at least in part by the dimension H _{2 of the} electrical contact 134 (and therefore the dimension H _{1 of the} gap 107 ). A conventional interposer with a larger size H ₂ (ie, w/o capacitor) can produce a larger inductance than a comparable interposer with a smaller size H ₂ . However, choosing the electrical contact 134 with a smaller size H ₂ may cause one or more of the internal electrical components (such as 110, 112, 118 and 120) to provide mechanical interference with the first electrical component 104.

To offset or limit the inductance along the path from the first electrical component 104 to the second electrical component 106, the power interposer 102 includes a plurality of capacitors 138, each of which is electrically connected to a pair of electrical contacts 134. Each capacitor 138 may extend over the gap between a pair of electrical contacts 134 to interconnect the pair of electrical contacts 134. Therefore, each capacitor 138 can be parallel to the pair of electrical contacts 134. The plurality of capacitors 138 may include a plurality of sets of capacitors 138. Each set of capacitors 138 can electrically connect the electrical contacts 134 of a different pair of multiple electrical contacts 134 to each other. In other words, the electrical contacts 134 in each pair of the plurality of electrical contacts 134 can be interconnected with each other by different sets of capacitors 138. The capacitors 138 in each set may be spaced apart from each other along a direction extending from the first mounting interface 130 to the second mounting interface 132 (such as along the first direction D ₁ ).

The intermediate electrical contact 134 located between the two electrical contacts 134 can be interconnected with each of the two electrical contacts 134 by a different one of the set of capacitors 138. In some embodiments, each intermediate electrical contact 134 may be interconnected with two electrical contacts 134 on opposite sides of the intermediate electrical contact 134. For example, each intermediate electrical contact 134 can be interconnected by the first of the set of capacitors 138 with the first electrical contact 134 on the first side of the intermediate electrical contact 134, and by the capacitor 138 The second of the set is interconnected with the second electrical contact 134 on the second side of the intermediate electrical contact 134.

In at least some embodiments, the electrical contacts 134 in each pair can be adjacent to each other. For example, adjacent ones of the electrical contacts 134 may be adjacent to each other without any other electrical contacts 134 in between. The electrical contacts 134 of each pair can be aligned with each other along at least one of the following: (1) the second direction D ₂ , (2) the third direction D ₃ and (3) from the second direction D ₂ and the third direction The direction D _{3 is} the direction D _{A of the} angular offset. For example, a pair of electrical contacts 134 can be aligned in a row R along the second direction D ₂ , as shown in FIG. 3. Therefore, the electrical contacts 134 can be interconnected with the electrical contacts 134 in the same row R. As another example, a pair of electrical contacts 134 may be aligned in a row C along the third direction D ₃ . Therefore, the electrical contacts 134 can be interconnected with the electrical contacts 134 in the same row C. As yet another example, a pair of electrical contacts 134 may be aligned in a direction D _A that is angularly offset from the second direction D ₂ and the third direction D ₃ . For example, the electrical contacts 134 in a given column R and a given row C may be interconnected with electrical contacts 134 in an adjacent column R and an adjacent row C, as shown in FIG. 11.

Preferably, at least some of the capacitors 138 are located closer to the first mounting interface 130 mounted to the second electrical component 106 than the second mounting interface 132 mounted to the first electrical component 104. Configuring the capacitor 138 in this manner can prevent the electrical contact 134 from having a longer stretch adjacent to the second electrical component 106 without the capacitor 138.

With continued reference to FIG. 4, each capacitor 138 may have a first conductor 138a and a second conductor 138b separated from each other by a dielectric 138c. Each capacitor 138 may have a width along a selected direction extending from the first conductor 138a to the second conductor 138b. ₁ each capacitor 138 may have a height along a first direction D. In some embodiments, such as when the capacitor 138 in the second direction D ₂ interconnecting electrical contacts 134, the width along a second direction D _2. However, it should be understood that, in another embodiment D _A direction, the width along the third direction, such as from ₂ D ₃ and the third or second direction angularly offset D D ₃ in an alternative embodiment.

In one example, the plurality of capacitors 138 may include smaller-sized capacitors 138, and the larger-sized capacitors 138 are larger than the smaller-sized capacitors 138. Each larger-sized capacitor 138 may have at least one of a height greater than the height of the smaller-sized capacitor 138 and a width greater than the width of the smaller-sized capacitor 138 (such as both). Each set of capacitors 138 may include a smaller size capacitor 138 and a larger size capacitor 138. A set of smaller size of the capacitor 138 and the capacitor 138 may be of larger dimension D ₁ are alternately arranged in the first direction. Additionally or alternatively, the smaller-sized capacitor 138 and the larger-sized capacitor 138 may extend along a selected direction from the first conductor 138a of one of the capacitors 138 to the second conductor 138b of the capacitor 138 (for example, along the second direction D ₂ , the third direction D ₃ or the direction D _{A that is} angularly offset from the second direction D ₂ and the third direction D ₃ ) are alternately arranged. Additionally or alternatively, the smaller-sized capacitors 138 and the larger-sized capacitors 138 may be alternately arranged along a vertical direction perpendicular to the selection direction. Alternating capacitors 138 of different sizes allows the capacitors 138 to be more densely packed. As a result, the total capacitance of all capacitors 138 can be greater than a comparable interposer that does not alternate capacitors 138 of different sizes. However, it should be understood that alternative embodiments may be implemented without using capacitors of different sizes.

The electrical contacts 134 may all be allocated to the same power domain or may be allocated to different power domains. For example, capacitors 138 of different sizes and values can be installed to electrical contacts 134 allocated to different power domains. The plurality of electrical contacts 134 includes a plurality of power contacts configured to provide power from the first mounting end 134a to the second mounting end 134b. In some embodiments, each capacitor 138 may be coupled to a pair of power contacts. In an alternative embodiment, the plurality of electrical contacts 134 may include a plurality of power contacts and a plurality of ground contacts, and each capacitor 138 may be coupled to a pair of contacts including a power contact and a ground contact.

The plurality of capacitors 138 may be implemented as positive geometry capacitors as shown in FIG. 5, reverse geometry capacitors as shown in FIG. 6, or as a classification of positive geometry capacitors and reverse geometry capacitors. Positive geometry of a capacitor having a first conductor 138a may be extending to a width direction of the selection of a second conductor 138b, the width is less than the height along the first direction D ₁ of the capacitor, as shown in FIG. 5 from direction shown. Inverse geometry capacitor may have a height along the conductor 138a extends from the first selected direction to a width of the second conductor 138b, the width is greater than the capacitor in the first direction D _1, shown in FIG. 6. The equivalent series inductance of a capacitor can depend on the length of its current loop. A reverse geometry conductor can have a shorter current loop than a positive geometry capacitor. Therefore, the parasitic inductance of the reverse geometry conductor can be lower than that of the positive geometry capacitor, and for the reverse geometry capacitor, the speed of energy transfer to the load can be greater than that of the positive geometry capacitor. Therefore, reverse geometry capacitors may be better than positive geometry capacitors, but the embodiments of the present invention are not limited to using reverse geometry capacitors.

Turning to Figure 7, any suitable mounting technique can be used to mount the capacitor 138 to the electrical contact 134, including but not limited to: welding, soldering, conductive gluing, compression mounting (for example, using perfusion), mechanical fastening, and any of them combination. Figure 7 shows an example of mechanical fastening technology. As shown in FIG. 7, the power interposer 102 may include a conductive tape 140 that secures the capacitor 138 to the electrical contact 134. Each conductive tape 140 may be the first direction D so as to define a plurality of recesses 141 offset from one another by _a curved or shaped. Each recess 141 may be sized to accommodate the capacitor 138 therein. For each recess 141, each conductive tape 140 may have an inner portion 140a that is welded, glued with a conductive adhesive, or otherwise attached to the electrical contact 134. Inner portion 140 of conductive strips D ₁ 140a may offset from each other in the first direction. Each inner portion 140a may be disposed between the capacitor 138 and the electrical contact 134.

For each of the recesses 141, 140 each may have a conductive strip along a first direction D of the first engagement portion 140b and a second engagement portion 140c to define therebetween a recess portion 141 is spaced apart from one another of _1. The first joining portion 140b and the second joining portion 140c of each recess 141 are configured to join opposite ends of the capacitor 138 disposed in the recess 141, such as the upper and lower ends of the capacitor 138. Each of the first bonding portion 140b and the second bonding portion 140c may be formed by bending the conductive tape 140 into an s shape, but other shapes are covered. The first engagement portion 140b and the second engagement portion 140c of each recess 141 can be elastically biased toward each other so as to grasp the opposite ends of the capacitor 138 therebetween.

Turning to Figures 8 to 10, in another embodiment, the power interposer 102 has a plurality of electrical contacts 134, the plurality of electrical contacts 134 have the contact body 134c and the first mounting end 134a and the first as described above Two mounting end 134b. In addition, the electrical contact 134 includes a plurality of tabs 142 to which the capacitors 138(1) and 138(2) are attached. The plurality of protrusions 142 may include a plurality of sets of protrusions 142. Each set of the tabs 142 can extend from the contact body 134a of one of the electrical contacts 134 toward a set of the tabs 142 of the adjacent electrical contacts 134. Each set of tabs 142 may be spaced from each other along _a first direction D. Each tab 142 of the electrical contact 134 may protrude toward the adjacent tab 142 of the adjacent electrical contact 134 so as to define a gap 137 between the tab 142 and the adjacent tab 142.

The intermediate electrical contact 134 between the two electrical contacts 134 may include a first and a second set of tabs 142 extending in opposite directions to each other. The first and second set of tabs 142 may be offset from each other such that the first set of tabs 142 at a position between the second set of tabs in the first direction D ₁ extending from the contact portion 142 of the body with respect to 134c. Similarly, a second set of tabs 142 may extend from the contact body with respect to 134c at a position between the tabs ₁₄₂₁ of the first set of a first direction D. Therefore, the first and second set of tabs 142 with respect to the first direction D ₁ are alternately offset from one another. A first set of capacitor thus, attached to the intermediate electrical contact tabs 142 134 138 (1) or 138 (2) relative to the first direction D ₁ is attached to the intermediate electrical contact with the tabs 134 of the contact 142 The second set of capacitors 138(1) or 138(2) are staggered.

The power interposer 102 has a plurality of capacitors 138(1) and 138(2). Each capacitor 138(1) and 138(2) can be attached to the tab 142 of the electrical contact 134 and the adjacent tab 142 of the adjacent electrical contact 134 so as to span between the tab 142 and the adjacent tab 142的 gap 137. The plurality of capacitors 138(1) and 138(2) may include a plurality of sets of capacitors. Each set of capacitors in the capacitor 138 (1) and 138 (2) may be spaced from one another _a spacer 144 to define therebetween a first direction D. The capacitors 138(1) and 138(2) in a set of capacitors may be aligned with the interval 144 between the capacitors 138(1) and 138(2) in the adjacent set of capacitors along the selection direction. Capacitors 138(1) and 138(2) in the middle set of capacitors located between the first and second adjacent sets of capacitors can be adjacent to the first neighbors of capacitors 138(1) and 138(2) along the selection direction The interval 144 between the capacitors 138(1) and 138(2) in the set is in a straight line, and is aligned with the capacitors 138(1) and the capacitors 138(1) and 138(1) in the second adjacent set of the capacitors 138(1) and 138(2) along the selection direction The interval 144 between 138(2) is straight. The selection direction may extend from one of the conductors 138a and 138b of the capacitor 138 to the other of the conductors 138a and 138b of the capacitor 138. In Figures 8 and 9, the selection direction is the second direction D ₂ . However, in an alternative embodiment, the selection direction may be the third direction D ₃ or the angular direction D _{A that is} angularly offset from the second direction D ₂ and the third direction D ₃ .

Capacitor 138 (1) and 138 (2) also from the third direction D ₃ is shifted one column to another column. For example, the first row A of the electrical contacts 134 may have capacitors 138 (in a vertical direction perpendicular to the selected direction and the spacing 144 between the capacitors 138(2) of the second row B of the electrical contacts 134). 1). Similarly, the capacitors 138(2) of the second row B of the electrical contacts 134 may be aligned with the spacing 144 between the capacitors 138(1) of the first row A of the electrical contacts 134 in the vertical direction. In Figures 8 and 9, the vertical direction is the third direction D ₃ . However, in an alternative embodiment, the vertical direction may be the second direction D ₂ or an angular direction D _{A that is} angularly offset from the second direction D ₂ and the third direction D ₃ .

In some examples, the type or size of capacitors can also vary from one column to another. For example, the first row A of electrical contacts 134 may have capacitors 138(1) of a first size, and the second row B of electrical contacts 134 may have capacitors 138(1) of a second size different from the first size. 2). Figure 10 shows example dimensions of capacitor 138(1) and capacitor 138(2). It should be appreciated that in alternative embodiments, the dimensions of capacitors 138(1) and 138(2) may be different from the dimensions shown in FIG. 10. It should also be appreciated that in alternative embodiments, the size of capacitor 138(1) may be the same as the size of capacitor 138(2). Still further, it should be understood that the capacitors can vary in size from one column to the next, from one row to the next row, within one column, within one row, or any combination thereof.

Turning now to FIGS. 11 and 12, in another embodiment, the power interposer 102 has a plurality of electrical contacts 134 having a first mounting end 134a and a second mounting end 134b as described above . In addition, each electrical contact 134 may have a contact body 134c that is curved or curved between the first mounting end 134a and the second mounting end 134b. For example, each contact body 134c may have a substantially sinusoidal arc or curved shape, but other shapes are covered. Each electrical contact 134 may be a substantial mirror image of the adjacent electrical contact 134, but the embodiment of the present invention is not limited thereto.

Each electrical contact 134 may define a set of at least a first direction D ₁ along the recessed portion 134d of the offset of each other. At least some of the electrical contacts 134, such as intermediate electrical contacts each disposed between two adjacent electrical contacts 134, may include a first set of recesses 134d and a second set of recesses 134d that are open in opposite directions. First and second recesses 134d of set ₁ may be alternately offset from each other along a first direction D. Each recess 134d may be in line with the recess 134d of the adjacent electrical contact 134 and open to the recess 134d. Therefore, adjacent electrical contacts 134 may have opposite recesses 134d that are open toward each other. The capacitor 134 can be accommodated in each pair of opposite recesses 134 d of adjacent electrical contacts 134.

The plurality of capacitors 138 may include a plurality of sets of capacitors 138. The capacitors 138 in each set may be spaced apart from each other along the first direction D ₁ so as to define an interval 144 therebetween. Each intermediate electrical contact 134 can support the first set of capacitors 138 interconnecting the intermediate electrical contact 134 to the first adjacent electrical contact 134 in the first set of its recess 134d, and in the first set of its recess 134d The second set supports a second set of capacitors 138 interconnecting the intermediate electrical contact 134 to the second adjacent electrical contact 134 opposite the first adjacent electrical contact 134. Each capacitor 138 can be electrically coupled to an adjacent electrical contact 134. For example, the power interposer 102 may include connecting blades or wires 146 that electrically connect each capacitor 138 to a pair of adjacent electrical contacts 134. For each capacitor 138, the power interposer 102 may include a first conductor 138a (shown in FIG. 11) coupling the first conductor 138a of the capacitor 138 to a first blade or wire 146 of the first electrical contact 134, and a first conductor 146 of the capacitor 138 The two conductors 138 b (shown in FIG. 11) are coupled to the second blade or wire 146 of the second electrical contact 134 adjacent to the first electrical contact 134. In an alternative example, the package may not contain blades or wires 146, and each capacitor 138 may directly contact adjacent electrical contacts 134. In one such example, each contact 134 can be configured such that its recess 134d can be expanded to accommodate the capacitor 138 and contracted to capture the capacitor 138 in the recess 134d. When contracted around the capacitor 138, the contact 134 may contact the capacitor 138 to be in electrical communication with the capacitor 138.

The capacitors 138 in each set of capacitors may be spaced apart from each other along the first direction D ₁ so as to define an interval 144 therebetween. The capacitors 138 in a set of capacitors may be aligned with the interval 144 between the capacitors 138 in the adjacent set of capacitors along the selection direction. The capacitor 138 in the intermediate set of capacitors located between the first and second adjacent sets of capacitors may be aligned with the interval 144 between the capacitors 138 in the first adjacent set of capacitors 138 along the selection direction, and along the selection direction The direction is in line with the spacing 144 between capacitors 138 in the second adjacent set of capacitors 138. The selection direction may extend from one of the conductors 138a and 138b of the capacitor 138 to the other of the conductors 138a and 138b of the capacitor 138. In FIG. 11, the selection direction is an angular direction D _{A that is} angularly offset from the second direction D ₂ and the third direction D ₃ . However, in an alternative embodiment, the selection direction may be the second direction D ₂ or the third direction D ₃ .

In some embodiments, the power interposer may include a plurality of trays 148. Each tray 148 may be formed of a non-conductive material such as plastic. Each tray 148 may be configured to support a plurality of capacitors 138 aligned with each other in a vertical direction perpendicular to the first direction D ₁ (such as in the angled direction DA, the second direction D ₂ or the third direction D ₃ ).

As shown in FIG. 11, the plurality of electrical contacts 134 includes a plurality of power contacts PWR configured to provide power from the first mounting end 134a to the second mounting end 134b. The plurality of electrical contacts 134 may also include a plurality of ground contacts GND. Each capacitor 138 can be coupled to a pair of contacts including a power contact PWR and a ground contact GND. In FIG. 11, the power interposer includes a row of power contacts PWR between two rows of ground contacts GND. However, alternative configurations of power contacts and ground contacts are covered.

In one embodiment, a method of assembling an electrical system including a first electrical component 104 and a second electrical component 106 may include placing the first electrical component 104 through the power interposer 102 and the second electrical component 106 The step of electrical communication so that the power interposer 102 is configured to provide power from the first electrical component 104 to the second electrical component 106 via the plurality of electrical contacts 134 of the power interposer 102. The power interposer 102 includes a plurality of capacitors 138, and each capacitor 138 is electrically coupled to a pair of electrical contacts 134 to limit the inductance through the power interposer 102 when power is provided through the power interposer 102. The placing step may include the step of installing the power interposer 102 on the first electrical component 104. Additionally or alternatively, the placing step may include the step of installing the power interposer 102 to the second electrical connector 106. The placing step may include placing the first electrical component 104 in electrical communication with the second electrical component 106 such that one or more internal electrical components are placed between the first electrical component 104 and the second electrical component 106. The method may further include the step of transferring power from the first electrical component 104 to the second electrical component 106 via the power interposer 102 such that the capacitor 138 limits the inductance through the power interposer 102.

Although the example interposer is discussed above with respect to the use of the example interposer in preventing mechanical interference between the internal electrical components mounted to the first surface 106a of the second electrical component 106 and the first electrical component 104, it should be understood that the present invention The inserter can have other uses. For example, in some conventionally larger ICs with contact arrays (such as ball grid arrays, pin grid arrays, or land grid arrays), the rectangles that omit the contacts of the grid (usually from the center of the array) Area to allow space for capacitors. However, omitting contacts in this way reduces the maximum current carrying capacity of such ICs. As an alternative, each such larger IC can be made without omitting part of the grid and can be directly mounted to the interposer of the present invention. The interposer may include capacitors as discussed above, and may have an array of contacts that matches the array of larger ICs so that each contact of the IC is electrically coupled to the contacts of the interposer. The interposer can then be mounted to another electrical component. In such alternatives, the interposer can be implemented to have a relatively short height (eg, about 2 to 3 mm) to keep the distance between the IC and other electrical components relatively small.

13 and 14, it can be seen that the use of the interposer of the present invention can reduce the cumulative impedance of the chip package. Figure 13 graphically illustrates the impedance characteristics of a high-power switch chip, CPU or GPU chip package with a 7mm power interposer without capacitors therein. Figure 14 graphically illustrates the impedance characteristics of a comparable high-power switch chip, CPU or GPU chip package with a 7mm power interposer according to an embodiment of the invention with a plurality of capacitors as discussed above. In FIGS. 13 and 14, Zc1, Zc2, Zc3, and Zc4 illustrate the impedance of the first, second, third, and fourth capacitor banks, respectively. In addition, Zcum describes the cumulative parallel impedance of Zc1, Zc2, Zc3, and Zc4. As can be seen, the peak cumulative parallel impedance Zcum of the package with the conventional interposer in FIG. 13 is 8.4 mOhm, and the peak cumulative parallel impedance Zcum of the package with the interposer including the capacitor in FIG. 14 is 1.3 mOhm.

It should be noted that the illustrations and descriptions of the examples and embodiments shown in the drawings are for illustrative purposes only and should not be considered as limiting the present invention. Those skilled in the art will understand that the present invention encompasses various embodiments. In addition, it should be understood that the concepts described above with respect to the above examples and embodiments can be used alone or in combination with any of the other above examples and embodiments. It should be further understood that the various alternative examples and embodiments described above with respect to one illustrated embodiment can be applied to all examples and embodiments as described herein, unless otherwise indicated.

Unless expressly stated otherwise, each value and range should be interpreted as an approximation, as if the word "approximately", "approximately" or "substantially" before the value or range. Unless stated otherwise, the terms "approximately", "approximately" and "substantially" can be understood as describing a range within 15% of the specified value.

Unless otherwise specifically stated or understood in other ways in the context as used, conditional language used in this article, such as "may", "may", "can", "may", "for example" and the like In addition to others, it is generally intended to convey that certain embodiments include certain features, elements, and/or steps, while other embodiments do not include certain features, elements, and/or steps. Therefore, such conditional language is not generally intended to imply that the features, elements, and/or steps are required by one or more embodiments in any way, or that one or more embodiments must include information for use with or without author input Or, if prompted, determine whether these features, elements, and/or steps are included in any particular embodiment or logic to be executed in any particular embodiment. The terms "including", "including", "having" and the like are synonymous and used in an inclusive manner in an open manner, and do not exclude additional elements, features, actions, operations, etc. In addition, the term "or" is used in its inclusive meaning (and not in its exclusive meaning), so that when used, for example, to connect a list of elements, the term "or" means one or some of the elements in the list. Or all.

Although certain embodiments have been described, these embodiments are presented only by way of examples and are not intended to limit the scope of the invention disclosed herein. Therefore, the foregoing description does not intend to imply that any specific features, characteristics, steps, modules or blocks are necessary or indispensable. In fact, the novel methods and systems described in this article can be implemented in a variety of other forms; in addition, without departing from the spirit of the invention disclosed in this article, various omissions can be made in the form of the methods and systems described in this article, Replacement and change. The scope of the attached patent application and its equivalents are intended to cover such forms or modifications that fall within the scope and spirit of certain inventions disclosed herein.

Although the preferred embodiments of the present invention have been shown and described, it will be readily apparent to those familiar with the art that modifications that do not exceed the scope of the appended patent application can be made. The embodiments described in conjunction with the illustrated embodiments have been presented with the help of the description, and the present invention is therefore not intended to be limited to the disclosed embodiments. In addition, the structure and features of each of the embodiments described above can be applied to other embodiments described herein. Therefore, those familiar with the art will recognize that the present invention intends to cover all modifications and alternative configurations included in the spirit and scope of the present invention, as set forth in the scope of the appended patent application.

100: system 102: power interposer 104: first electrical component 104a: first surface 104b: second surface 104c: electrical contact 106: second electrical component 106a: first surface 106b: second surface 106c: electrical contact 107: Interval 108: Integrated circuit 110: First internal capacitor 112: Second internal capacitor 114: First external capacitor 116: Second external capacitor 118: First internal electrical connector 120: Second internal electrical connector 122: First external electrical connector 124: Second external electrical connector 130: First mounting interface 132: Second mounting interface 134: Electrical contact 134a: First mounting end 134b: Second mounting end 134c: Contact body 134d: Recess 135: Frame 136: Case 137: Gap 138: Capacitor 138 (1): Capacitor 138 (2): Capacitor 138a: First Conductor 138b: Second Conductor 138c: Dielectric 140: Conductive Tape 140a: Inner Part 140b : First joint part 140c: second joint part 141: recess 142: convex piece 144: space 146: blade or wire 148: tray A: first column B: second row C: row D ₁ : first direction D ₂ : Second direction D ₃ : third direction D _A : direction GND: ground contact H ₁ : size H ₂ : size PWR: power contact R: column Zc1: impedance of the first capacitor bank Zc2: of the second capacitor bank Impedance Zc3: Impedance of the third capacitor bank Zc4: Impedance of the fourth capacitor bank Zcum: Cumulative parallel impedance

When read in conjunction with the accompanying drawings, you will better understand the foregoing content of the present invention and the following embodiments of the present invention. For the purpose of illustrating exemplary embodiments of the present invention, reference to the drawings is made. However, it should be understood that this application is not limited to the precise configuration and instrumentation shown. In these figures:

[Figure 1] A simplified front view showing a system with a power interposer that interconnects a first printed circuit board (PCB) with a chip package (the chip package has a second PCB), where the product The integrated circuit (IC), the capacitor and the electrical connector are mounted on the second PCB; [FIG. 2] A perspective view showing a power interposer according to an embodiment; [FIG. 3] A perspective view showing the power interposer of FIG. 2 according to an embodiment, wherein the power interposer has a plurality of frames and the housing is shown transparently for illustration purposes; [FIG. 4] A perspective view showing one of the frames of the power interposer of FIG. 3 according to an embodiment; [FIG. 5] A front elevational view showing a portion of a plurality of electrical contacts of the power interposer of FIG. 2 according to an embodiment, in which the capacitor has a positive geometry; [FIG. 6] A front elevational view showing a part of a plurality of electrical contacts of the power interposer of FIG. 2 according to an embodiment, in which the capacitor has an inverse geometry; [FIG. 7] A side elevation view showing the electrical contacts of the interposer of FIG. 2 according to an embodiment, in which the capacitor is attached using a conductive tape; [Fig. 8] A front elevation view showing the first and second rows of electrical contacts of the power interposer of Fig. 2 according to an embodiment, in which the bypass capacitor is attached to the tabs of the electrical contacts; [FIG. 9] Shows a top view of the power interposer of FIG. 2 according to an embodiment, wherein the power interposer implements the column of FIG. 8; [FIG. 10] shows the size of the first and second capacitors that can be implemented in the power interposer of FIG. 9 according to an embodiment; [FIG. 11] Shows a top view of the power interposer of FIG. 2 according to one embodiment, where the housing is hidden for illustrative purposes and each capacitor has the first electrical contact adjacent to the adjacent column and row The electrical contacts are interconnected. [FIG. 12] Shows a side elevation view of the power interposer of FIG. 2 according to one embodiment, where the housing is hidden for illustration purposes and the electrical contacts are arc-shaped to support the capacitor; [Figure 13] Graphically illustrate the impedance characteristics of a high-power switch chip, CPU or GPU chip package with a 7mm power interposer without capacitors; and [Figure 14] Graphically illustrates the impedance characteristics of a high-power switch chip, CPU or GPU chip package with a 7mm power interposer according to an embodiment with a plurality of capacitors.

100: System

102: power interposer

104: The first electrical component

104a: first surface

104b: second surface

104c: electrical contact

106: second electrical component

106a: first surface

106b: second surface

106c: electrical contact

107: Interval

108: Integrated Circuit

110: The first internal capacitor

112: second internal capacitor

114: The first external capacitor

116: second external capacitor

118: The first internal electrical connector

120: second internal electrical connector

122: The first external electrical connector

124: second external electrical connector

D ₁ : first direction

D ₂ : second direction

H ₁ : size

Claims (49)

A power interposer, which includes: A first mounting interface configured to be mounted to a first electrical component, and a second mounting interface opposite to the first mounting interface and configured to be mounted to a second electrical component; A plurality of electrical contacts extending from the first mounting interface to the second mounting interface, each electrical contact having a first mounting end located at the first mounting interface and a first mounting end located at the second mounting interface The second mounting end; and A plurality of capacitors are each electrically coupled to a pair of electrical contacts. Such as the power interposer of claim 1, wherein the plurality of capacitors includes a plurality of sets of the capacitors, and each of the sets interconnects different pairs of electrical contacts in the plurality of electrical contacts with each other . Such as the power interposer of claim 2, wherein the plurality of electrical contacts include intermediate electrical contacts, and each intermediate electrical contact is located between two electrical contacts and is different by one of the sets of capacitors Which is interconnected with the two electrical contacts. Such as the power interposer of claim 3, in which each intermediate electrical contact: 1) by a first one of the sets of the capacitors and a first on a first side of the intermediate electrical contact The electrical contacts are interconnected, and 2) the second one of the sets of the capacitors is interconnected with a second electrical contact on a second side of the intermediate electrical contact. Such as the power interposer of claim 2, wherein the capacitors in each set are spaced apart from each other along a first direction extending from the first mounting interface to the second mounting interface. For example, the power interposer of claim 5, wherein each set of the capacitors includes a smaller size capacitor and a larger size capacitor, and the smaller size capacitors and the larger size capacitors in a set are along the The first direction is alternately arranged. For example, the power interposer of claim 5, wherein each set of the capacitors includes a smaller size capacitor and a larger size capacitor, and the smaller size capacitors and the larger size capacitors of different sets are along the At least one of them is alternately arranged: 1) a second direction perpendicular to the first direction; 2) a third direction perpendicular to the first direction and the second direction; and 3) from the second direction and The third direction is a direction that is angularly offset. Such as the power interposer of claim 5, wherein the power interposer includes a conductive tape that fixes the capacitors to the electrical contacts. Such as the power interposer of claim 8, wherein each conductive strip is shaped to define a plurality of recesses offset from each other along the first direction, and each recess supports a capacitor of the plurality of capacitors therein. For example, the power interposer of claim 9, wherein each conductive strip has first and second engaging portions spaced apart from each other along the first direction for each recess so as to define one of the recesses therebetween, and each The first joining portion and the second joining portion of the recess are joined to opposite ends of one of the capacitors. Such as the power interposer of claim 5, wherein the electrical contacts include a plurality of tabs to which the capacitors are attached. For example, the power interposer of claim 11, wherein the plurality of protrusions includes a plurality of sets of the protrusions, and each set of the protrusions faces from a contact body of one of the electrical contacts A collection of the tabs of an adjacent electrical contact extends. Such as the power interposer of claim 11, wherein the tabs in each set are spaced apart from each other along the first direction. For example, the power interposer of claim 11, wherein each tab of an electrical contact protrudes toward an adjacent tab of an adjacent electrical contact so as to define a gap between the tab and the adjacent tab, And a capacitor spans the gap. Such as the power interposer of claim 11, wherein the plurality of electrical contacts includes an intermediate electrical contact located between two electrical contacts, and each intermediate electrical contact includes a lug extending in a direction opposite to each other The first and second set. Such as the power interposer of claim 15, wherein the first set and the second set of tabs of an intermediate electrical contact are staggered so that the tabs of the first set are between the tabs of the second set A position between the middle electrical contacts extends from a contact body of the intermediate electrical contact. Such as the power interposer of claim 15, wherein a first set of capacitors is attached to the first set of tabs of an intermediate electrical contact, and a second set of capacitors is attached to the second set of tabs of the intermediate power supply And the capacitors in the first set are offset from the capacitors in the second set with respect to the first direction. For example, the power interposer of claim 5, wherein the capacitors in each set of the capacitors are spaced apart from each other along the first direction so as to define an interval therebetween, and the capacitors in the set of the capacitors are perpendicular to the first One of the directions is in line with the spacing between the capacitors in an adjacent set of the capacitors. For example, the power interposer of claim 2, wherein the first mounting interface and the second mounting interface are offset from each other along a first direction, the electrical contacts are arranged in a plurality of rows extending along a second direction, and the The electrical contacts are arranged in a plurality of rows extending along a third direction, wherein the first direction, the second direction, and the third direction are perpendicular to each other. Such as the power interposer of claim 19, wherein each pair of interconnected electrical contacts are offset from each other along the second direction. Such as the power interposer of claim 19, wherein each pair of interconnected electrical contacts are offset from each other along the third direction. Such as the power interposer of claim 19, wherein each pair of the plurality of electrical contacts interconnected with each other is offset from each other along an angular direction that is angularly offset from the second direction and the third direction. Such as the power interposer of claim 1, wherein the plurality of capacitors are implemented as inverse geometry capacitors. Such as the power interposer of claim 1, wherein the contacts in each pair are adjacent to each other. For example, the power interposer of claim 1, wherein each electrical contact has a contact body, and the contact body is linear when it extends from its first mounting end to its second mounting end. For example, the power interposer of claim 1, wherein each electrical contact has a contact body, and the contact body is curved or curved when it extends from its first mounting end to its second mounting end. The power interposer according to claim 26, wherein each contact body has a substantially sinusoidal arc or curved shape. Such as the power interposer of claim 27, wherein each electrical contact is a substantial mirror image of an adjacent electrical contact. Such as the power interposer of claim 27, wherein each electrical contact defines at least one set of recesses offset from each other in a first direction extending from the first mounting interface to the second mounting interface, and the plurality of capacitors Each of the capacitors is contained in a different one of the recesses. Such as the power interposer of claim 29, wherein each intermediate electrical contact disposed between two adjacent electrical contacts includes a first set of recesses that are open in opposite directions and a second set of recesses. Such as the power interposer of claim 30, wherein the recesses in the first set and the second set are alternately offset from each other along the first direction. Such as the power interposer of claim 29, wherein each capacitor is accommodated in a pair of opposite recesses of adjacent electrical contacts. A system that includes: At least one electrical component; and The power interposer of any one of claim 1 to 32, wherein at least one of the first mounting interface and the second mounting interface is mounted to the at least one electrical component. The system of claim 33, wherein the at least one electrical component includes an electrical component configured to provide power to the power interposer. The system of any one of claims 33 and 34, wherein the at least one electrical component includes an electrical component configured to receive power from the power interposer. The system of any one of claims 33 to 35, comprising an integrated circuit mounted to the at least one electrical component, wherein the integrated circuit is configured to receive power from the power interposer. Such as the system of any one of claims 33 to 36, wherein the at least one electrical component includes a printed circuit board (PCB). Such as the system of claim 33, where: The at least one electrical component includes a first electrical component and a second electrical component; The first mounting interface is mounted to the first electrical component; and The second mounting interface is mounted to the second electrical component. The system of claim 38, wherein the power interposer is configured to provide power from the first electrical component to the second electrical component. Such as the system of claim 38, wherein each of the first electrical component and the second electrical component is a printed circuit board. Such as the system of any one of claims 38 and 39, which includes an integrated circuit mounted on the second electrical component. Such as the system of any one of claims 38 to 41, which includes at least one internal electrical component mounted on the second electrical component between the first electrical component and the second electrical component. The system of claim 42, wherein the interposer separates the first electrical component and the second electrical component so that the at least one internal electrical component does not mechanically interfere with the first electrical component. Such as the system of claim 42, wherein the at least one internal electrical component includes at least one electrical connector. For example, the system of claim 42, wherein the at least one internal electrical component has an external dimension along a first direction from the first mounting interface to the second mounting interface, and the power interposer connects the first electrical component to the The second electrical components are spaced apart from each other by at least the outer dimension. Such as the system of claim 38, wherein the second electrical component is an integrated circuit die directly mounted to the interposer. A method of assembling an electrical system including a first electrical component and a second electrical component, the method comprising: The first electrical component is placed in electrical communication with the second electrical component via a power interposer, so that the power interposer is configured to transfer power from the first electrical component via a plurality of electrical contacts of the power interposer Provided to the second electrical component, wherein the power interposer includes a plurality of capacitors, each capacitor is electrically coupled to a pair of electrical contacts so as to limit the inductance through the power interposer when power is supplied through the power interposer. The method of claim 47, wherein the placing step includes a step of installing the power interposer on the first electrical component. The method according to any one of claim 47 and 48, wherein the placing step includes a step of installing the power interposer to the second electrical connector.

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