TW202043534A - Vaporizer and method for manufacturing the same capable of heating raw material mist under precise temperature management - Google Patents

Abstract

The present invention provides a vaporizer capable of heating raw material mist under precise temperature management to thereby obtain a gas raw material which is adjusted to a required temperature with very little temperature deviation and producing almost no precipitates. The present invention relates to a vaporizer for obtaining a gas raw material for film formation. The vaporizer heats and vaporizes the raw material mist to obtain the gas raw material for film formation, and includes a metal main part which is internally provided with first flow paths through which the raw material mist flows and second flow paths through which a heat medium for heating the raw material mist flows. The equivalent area circle diameter of the cross section of the first flow path is 5 mm or less, and the equivalent area circle diameter of the cross section of the second flow path is 2 mm or less. In the main part, there are no gaps aside from the second flow paths between one of the first flow paths and another of the first flow paths adjacent thereto.

Description

Vaporizer and manufacturing method thereof

The invention relates to a gasifier and a manufacturing method thereof.

As a method of forming a film on the surface of an object using a gas raw material, for example, a CVD (Chemical Vapor Deposition) method can be cited. For example, in the manufacturing process of semiconductor devices, several thin films are usually formed on a wafer by a CVD method. There are also cases where a part of the film is removed by blowing an etching gas onto the film formed on the wafer by the CVD method, thereby performing patterning.

As a method for obtaining a gas raw material used as a thin film material or an etching material in a CVD method or the like, several methods have been previously proposed.

For example, Patent Document 1 describes a method for vaporizing liquid raw materials, which is characterized in that it is a method of vaporizing liquid raw materials stored in a liquid tank by bubbling, and has the following steps: using a carrier with a specific flow rate The gas vaporizes the liquid raw material in the liquid tank by bubbling to produce a high-concentration raw material gas; mix the high-concentration raw material gas with the dilution gas to dilute the high-concentration raw material gas to a specific concentration The raw material gas; and the flow control is performed so that the raw material gas of a specific concentration becomes a specific flow rate, and the raw material gas of the specific concentration controlled by the flow rate is introduced into a processing chamber for specific processing of the object to be processed. In addition, it is stated that according to this method, even at low flow rates, it is possible to control a specific concentration of raw material gas with high accuracy while supplying it stably. In addition, it can be performed by a CVD device used in a planarization process. Stable low-concentration doping can improve the reliability of the insulating film.

For example, Patent Document 2 describes a vaporizer for CVD, which is characterized by having an orifice tube, which has a gas for dispersing two or more raw material solutions in the form of particles or mist in a carrier gas Passage; a plurality of raw material solution passages, which separately supply the above-mentioned two or more kinds of raw material solutions when communicating with the gas passage of the orifice tube; a carrier gas passage that separates the above-mentioned carrier gas and the above-mentioned two or more kinds The raw material solutions are separately supplied to the orifice tube; and a vaporization tube that vaporizes the two or more raw material solutions dispersed by the orifice tube; and ejects the gas from the orifice tube The portion is inserted into the vaporization tube, and the ejection portion is formed in a convex shape whose outer diameter decreases toward the front side. In addition, it is stated that according to this type of vaporizer for CVD, it is possible to provide a solution capable of dispersing various raw material solutions in the form of particles or mist in the carrier gas, preventing clogging, and controlling the raw materials for CVD with high precision for a long time. Vaporizer for CVD of solution flow.

For example, Patent Document 3 describes a vaporizer characterized by including: a vaporization chamber, which is heated by a heater; a primary filter, which is arranged at the lower end of the vaporization chamber and is heated by a heater; and liquid The raw material supply part, which drops the liquid raw material whose flow rate is adjusted from above the gasification chamber toward the primary filter; a carrier gas introduction path, which guides the carrier gas to the lower surface of the primary filter; and a raw material outlet path, It is used to discharge the mixed gas of the carrier gas and the gasified liquid raw material from the upper part of the gasification chamber. In addition, it is described that according to this type of vaporizer, since the liquid raw material can be vaporized and atomized by a primary filter, and then the mist is vaporized in the vaporization chamber, it is compared with the previous vaporizer that only applies heat , Exert a higher gasification efficiency. Due to the higher gasification efficiency, the liquid raw material can be gasified even at a lower temperature. Even the liquid raw material with high thermal decomposition property can prevent the inside of the gasifier. Deposition of thermal decomposition products and polymers and blockage of flow paths, and can vaporize a large amount of liquid raw materials.

For example, in Patent Document 4, a vaporizer is described, which is characterized by having: an external block having a circular heater embedded with a heater for heating a liquid raw material or a mixed gas of a liquid raw material and a carrier gas A hole for forming a gasification chamber; a cylindrical inner block embedded with a heater for heating the liquid raw material or the mixed gas of the liquid raw material and the carrier gas, and the diameter is slightly smaller than the gasification chamber Hole; and formed in the outer block: an introduction hole, which introduces the liquid raw material or the mixed gas of the liquid raw material and the carrier gas to the gasification formed by the gasification chamber forming hole and the internal block Flow path; and outlet holes, which discharge the vaporized liquid raw material gas or the mixed gas of the vaporized liquid raw material gas and the above-mentioned carrier gas from the vaporization flow path. In addition, it is described that according to this type of vaporizer, the temperature boundary layer effect of the narrow slit-shaped vaporization flow path formed by the gasification chamber forming hole and the internal block is used, and the arc is used. The centrifugal force effect can efficiently heat the mixed gas from the wall, and then through the synergistic effect of adiabatic expansion and rapid heating of the heat-insulated expansion area by a heater, the complete gasification of the liquid raw material can be realized . [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 9-181061 [Patent Document 2] Japanese Patent No. 3,896,594 [Patent Document 3] Japanese Patent Laid-Open No. 2007-1002007 [Patent Document 4] Japanese Patent Laid-Open No. 2013-23700

[The problem to be solved by the invention]

However, in the prior methods as exemplified in Patent Documents 1 to 4, it is difficult to perform detailed temperature management, so it is difficult to obtain a gas raw material adjusted to a desired temperature, and there is a tendency to obtain a gas raw material with a temperature different from the desired temperature. In addition, the temperature deviation of the gas raw material is also large. Furthermore, there are cases where precipitates such as solid raw materials are generated in the gasifier.

The purpose of the present invention is to solve the above-mentioned problems. That is, the object of the present invention is to provide a gasifier that can obtain a gas raw material adjusted to a desired temperature with a very small temperature deviation, and further produces almost no precipitates or hardly deposits even if they do. It is considered that the gasifier can be miniaturized when a gas raw material adjusted to a required temperature with very little temperature deviation can be obtained. Moreover, the object of the present invention is to provide a method of manufacturing such a vaporizer. [Technical means to solve the problem]

In order to solve the above-mentioned problems, the present inventors conducted intensive research and completed the present invention. The present invention is the following (1) to (7). (1) A vaporizer for obtaining gas raw materials for film formation, which is obtained by heating and vaporizing raw material mist to obtain gas raw materials for film formation, and Inside the main part containing the metal material, there are a first flow path through which the raw material mist circulates and a second flow path through which a heat medium for heating the raw material mist circulates, The equivalent circle equivalent diameter of the cross section of the first flow path is 5 mm or less, and the equivalent circle equivalent diameter of the cross section of the second flow path is 2 mm or less, In the inside of the main part, there is no gap other than the second flow path between the first flow path and the other first flow paths existing beside it. (2) A vaporizer for obtaining gas raw materials for film formation as described in (1) above, wherein In the cross section of the main part in a direction perpendicular to the direction in which the raw material mist flows, When the direction in which the heat medium flows while meandering is the left and right direction, the holes of the first flow path are arranged in rows in the left and right direction, and the rows of holes are arranged to form layers in the up and down direction, The second flow path exists between the layers of rows of holes that are adjacent in the vertical direction, and the second flow path is not connected to the first flow path. The second flow path avoids being clamped in the vertical direction. The holes of the first flow path in the layer of rows of holes meander in the up and down direction. (3) The vaporizer for obtaining a gas raw material for film formation as described in (1) or (2) above, when the first flow path is divided into a plurality of locations in the longitudinal direction, can be targeted at Each of the other parts is configured to adjust the temperature of the raw material mist existing in the first flow path. (4) The vaporizer for obtaining a gas raw material for film formation as described in any one of (1) to (3) above, wherein the surface of the main part formed with a hole for the raw material mist to flow into is set as an inlet On the side surface, when the surface in the main part on which the hole for discharging the gas raw material is formed is the exit side, the equal-area circle of the first flow path existing in the inside from the entrance side to the exit side The equivalent diameter gradually changes. (5) A vaporizer for obtaining a gas raw material for film formation according to any one of (1) to (4) above, wherein when the first flow path is arranged in a vertical direction, the second flow The road is formed in the horizontal direction, and it goes straight. (6) A vaporizer for obtaining a gas raw material for film formation according to any one of (1) to (5) above, which is configured to be connected to the first flow path and the second flow on the outer surface of the main part There is a gap between at least part of the road, so that the internal heat is difficult to release to the outside. (7) A method of manufacturing a vaporizer, which includes the steps of preparing a plurality of metal plates, forming a groove that becomes a part of the second flow path on the main surface, and then forming a groove from one main surface to the other. A through hole that penetrates through the main surface and becomes a part of the above-mentioned first flow path; and Making the main surfaces of the above-mentioned metal plates close to each other and joined by diffusion bonding; Thus, the gasifier according to any one of (1) to (6) above is obtained. [Effects of Invention]

According to the present invention, it is possible to provide a gasifier, which can heat the raw material mist under careful temperature management, so that the gas raw material can be adjusted to the required temperature and the temperature deviation is very small, and almost no production Precipitate. In addition, a manufacturing method of such a vaporizer can be provided.

The present invention will be explained. The present invention is a vaporizer for obtaining gas raw materials for film formation, which is obtained by heating and vaporizing the raw material mist to obtain the gas raw materials for film formation, and the main part containing the metal material has the supply The first flow path through which the raw material mist flows and the second flow path through which the heat medium for heating the above raw material mist flows. The equal area circle equivalent diameter of the cross section of the first flow path is 5 mm or less, the second flow path The equivalent diameter of the equal-area circle of the cross-section is 2 mm or less. Inside the main part, there is no flow path except the second flow path between the first flow path and the other first flow paths that exist beside it. Beyond the gap. Hereinafter, this type of vaporizer is also referred to as "the vaporizer of the present invention".

In addition, the present invention is a method for manufacturing a vaporizer, which includes the steps of preparing a plurality of metal plates, forming a groove that becomes a part of the second flow path on the main surface, and forming a groove from one of the main surfaces. The through hole, which is a part of the first flow path through which the other main surface penetrates, and the main surfaces of the metal plate material are brought into close contact with each other and joined by diffusion bonding, thereby obtaining the vaporizer of the present invention. Hereinafter, the manufacturing method of such a vaporizer is also referred to as "the manufacturing method of the present invention".

<The vaporizer of the present invention> The vaporizer of the present invention will be described. The vaporizer of the present invention is a vaporizer that obtains a gas raw material for film formation by heating the raw material mist to vaporize it.

The raw material mist used as the object to be heated by the vaporizer of the present invention includes an atomized liquid raw material, and is preferably a mixture of the atomized liquid raw material and a carrier gas. Here, the types of carrier gas and liquid materials are not particularly limited. For example, they may be the carrier gas and liquid previously used as part of the manufacturing process of semiconductor devices, when a film is formed by CVD or when a part of the film is etched. raw material.

For example, as the carrier gas, inert gases such as nitrogen and argon, or hydrogen can be cited.

For example, as a liquid raw material, a solution containing cyanide, fluoride, indium, gallium, aluminum, tantalum, etc. can be mentioned. Solutions of indium, gallium, aluminum, tantalum, etc. can be used for film formation. On the other hand, solutions of cyanide, fluoride, etc. can be used to remove part of the patterning of the formed thin film. When an etching gas such as cyanide or fluoride is used as a liquid raw material, the following main part preferably contains a metal material (titanium, stainless steel, etc.) with excellent corrosion resistance.

The raw material mist includes those obtained by atomizing such liquid raw materials. The method of atomizing the liquid raw material is not particularly limited, and for example, it may be a previously known method. Specifically, for example, the following method can be cited: a carrier gas and a liquid raw material are introduced into a sprayer to obtain a mist in which a mist-like liquid raw material is dispersed in the carrier gas.

The raw material mist may also include other than the carrier gas and atomized liquid raw materials. For example, the raw material mist may also include liquid raw materials that have not become mist due to insufficient atomization.

The vaporizer of the present invention has, for example, the structure shown in FIG. 1. Fig. 1 is a schematic perspective view showing a preferred aspect of the vaporizer of the present invention. In FIG. 1, the gasifier 10 of the present invention has a main part 12, and the main part 12 has a first flow path 1 for circulating the raw material mist and a second flow path for heating the raw material mist to flow inside the main part 12 2. It further has: a supply part 14 for supplying the raw material mist to the main part 12; and a discharge part 16 which collects the gaseous raw materials discharged from the main part 12 and discharges them outside the system.

[Supply part] FIG. 2 is a schematic perspective view of the supply part 14 shown in FIG. 1, and FIG. 3 is a cross-sectional view taken along the line AA' in FIG. As shown in FIGS. 2 and 3, the supply part 14 is equipped with the introduction hole 141 which introduces the raw material mist. In addition, the raw material mist introduced from the introduction hole 141 into the inside of the supply unit 14 is discharged from the supply unit 14 and then supplied to the main unit 12. The supply part 14 shown in FIGS. 2 and 3 is configured to supply the raw material mist introduced from the introduction hole 141 to the inlets 1Pin of the plurality of first flow paths 1 formed on the surface of the main part 12 as evenly as possible. Specifically, as shown in FIG. 3, the cross-sectional diameter (r ₁₄ ) of the flow path 143 of the raw material mist gradually widens inside the supply part 14. The supply part 14 preferably contains a metal material like the main part 12. Furthermore, the vaporizer of the present invention preferably includes a supply unit.

[Main part] 4 is a schematic perspective view of the main part 12 shown in FIG. 1, and FIG. 5 is a cross-sectional view taken along line BB' in FIG. As shown in Figs. 4 and 5, the main part 12 has a first flow path 1 through which the raw material mist flows and a second flow path 2 through which a heat medium for heating the raw material mist flows.

In the aspect shown in FIG. 4 and FIG. 5, when the first flow path 1 is arranged in a vertical direction, the second flow path 2 is formed in the horizontal direction, and it runs straight. This aspect is preferable as the main part of the gasifier of the present invention.

The main part may be configured to be separable into several, or a spacer may be clamped between one main part and another main part, for example. Fig. 6 is a schematic perspective view showing a state where the three main parts 12a, 12b, 12c sandwich the spacers 9a, 9b, and Fig. 7 is a schematic perspective view showing a state in which they are separated. The spacers 9a and 9b may have a plate shape, for example, and a through hole 91 that leads from one main surface to the other main surface is formed. The raw material mist discharged from the main body 12a is all collected in the through hole 91 formed in the spacer 9a, thereby making the temperature and composition of the raw material mist more uniform. As shown in FIGS. 6 and 7, if the main part is configured to be separable into several parts, it becomes easy to clean the inside of the first flow path and the like as necessary. Furthermore, the case where 3 main parts and 2 spacers are provided is illustrated in FIG. 6, FIG. The number of main parts and spacers is not particularly limited. Of course, the spacer may not be provided as shown in FIG. 4.

The spacer preferably includes the same material as the main part. However, it may contain a metal or organic substance different from the main part.

Here, the heat medium flowing in the second flow path 2 is not particularly limited as long as it is a fluid that can heat the raw material mist flowing in the first flow path. For example, heating steam, oil, etc. can be cited. The temperature of the heating medium is also not particularly limited. For example, 200-300°C oil can be used as the heating medium.

As shown in FIGS. 4 to 7, the raw material mist supplied from the supply part 14 enters the first flow path 1 from the inlets 1Pin of a plurality of first flow paths 1 formed on the surface of the main part 12. In addition, the raw material mist receives heat from the heating medium in the second flow path 2 while moving in the first flow path 1 toward the outlet 1Pout, and when it is discharged from the outlet 1Pout, it becomes a gas in principle.

In the gasifier of the present invention, the main part contains a metal material. For example, metal materials such as corrosion-resistant alloys (titanium, nickel-chromium alloys, Hirst alloys (nickel-based alloys), or stainless steels (such as SUS316L) can also be included. That is, there is no such thing as a combination of metal materials and plastic materials. Here, the main part may include two or more types of metal materials, but preferably includes one type of metal material. Such a main part containing a metal material and having a fine flow path inside can be manufactured by a method including a step of closely contacting the main surfaces of metal plates and bonding them by diffusion bonding.

Also, in principle, there are no voids other than the first flow path or the second flow path inside the main part. Therefore, inside the main part, there is no gap other than the second flow path between one first flow path and the other first flow paths existing beside it. This will be explained using FIGS. 8 to 12. Fig. 8, Fig. 10, Fig. 11, and Fig. 12 all show a situation where the first flow path and the second flow path intersect perpendicularly. Fig. 9 shows a state in which the linear second flow path in Fig. 8 is replaced with a snake.

Fig. 8 shows a cross section perpendicular to the first flow path (a cross section horizontal to the second flow path) in the main part of the vaporizer of the present invention. It can also be regarded as a partial enlarged view of FIG. 5. In the aspect shown in FIG. 8, the holes of the first flow path are represented as Pa, Pb, Pc, Pd, Pe, Pf, Pg, Ph, Pi, Pj, Pk, Pl. In addition, in FIG. 8, the second flow paths are represented as 2a, 2b, 2c, and 2d. In addition, the shaded part in FIG. 8 means that there is a metal material. That is, in FIG. 8, the voids are only the first flow path and the second flow path.

In FIG. 8, for example, the holes of the other first flow paths existing beside the hole Pf of the first flow path are the holes Pa, Pb, Pc, Pe, Pg, Pi, Pj, and Pk. It can be seen from FIG. 8 that any one of the holes Pe and Pg and the hole Pf are filled with metal material, and there is no gap. Furthermore, there is a second flow path between any one of the holes Pa, Pb, Pc, Pi, Pj, and Pk and the hole Pf, but there is no void other than that.

The arrow shown in Figure 8 conceptually represents the movement of heat. If it is the aspect shown in FIG. 8, the heat transfer from the heating medium in the second flow path (2a, 2b, 2c, 2d) to the raw material mist in the first flow path is performed efficiently.

Fig. 9 shows a cross section perpendicular to the first flow path of the main part of the vaporizer of the present invention. It shows that the second flow path in FIG. 8 is not a straight line but is replaced by a snake. In the aspect shown in FIG. 9, the holes of the first flow path are represented as Pa, Pb, Pc, Pd, Pe, Pf, Pg, Ph, Pi, Pj, Pk. In addition, in FIG. 9, the second flow paths are shown as 2a, 2b, 2c, and 2d. In addition, the shaded part in FIG. 9 means that a metal material is present. That is, in FIG. 9, the voids are only the first flow path and the second flow path.

In FIG. 9, for example, the holes of the other first flow paths existing beside the hole Pf of the first flow path are the holes Pb, Pc, Pe, Pg, Pi, and Pj. In this case, it is also the same as the situation shown in FIG. 8, which is any one of the following: any one of the holes Pb, Pc, Pe, Pg, Pi, Pj and the hole Pf are filled with a metal material Full, or only the second flow path (2b, 2c) exists.

The arrow shown in Fig. 9 conceptually represents the movement of heat. If it is the aspect shown in Fig. 9, the heat transfer from the heating medium in the second flow path (2a, 2b, 2c, 2d) to the raw material mist in the first flow path is performed efficiently.

Figure 10 is not consistent with the main part of the gasifier of the present invention. Fig. 10 is a combination of a tubular first flow path and a second flow path in a lattice shape and fixed at their contact points. In the aspect shown in FIG. 10, the holes of the first flow path are represented as Pa, Pb, Pc, Pd, Pe, Pf, Pg, Ph, Pi, Pj, Pk, Pl. In addition, in FIG. 10, the second flow paths are shown as 2a, 2b, 2c, and 2d.

In FIG. 10, for example, the holes of the other first flow paths existing beside the hole Pf of the first flow path are the holes Pa, Pb, Pc, Pe, Pg, Pi, Pj, and Pk. It can be seen from FIG. 10 that there is a gap γ between the hole Pf and the hole Pe. In addition, there is also a gap δ between the hole Pf and the hole Pg.

The arrow shown in Fig. 10 conceptually represents the movement of heat. 10, the heat transfer from the heating medium in the second flow path (2a, 2b, 2c, 2d) to the raw material mist in the first flow path is only between the second flow path and the first flow path. 1 Perform at the contact point of the flow path. Therefore, the heat transfer efficiency is poor.

Figure 11 does not correspond to the main part of the gasifier of the present invention. Fig. 11 combines the tubular first flow path and the second flow path in a grid like the case of the above-mentioned Fig. 10, and they are fixed at their joints, and the first flow paths are also connected to each other. Fixed at a point. In the aspect shown in FIG. 11, the holes of the first flow path are represented as Pa, Pb, Pc, Pd, Pe, Pf, Pg, Ph, Pi, Pj, Pk, Pl. In addition, in FIG. 11, the second flow paths are shown as 2a, 2b, 2c, and 2d.

In FIG. 11, for example, the holes of the other first flow paths existing beside the hole Pf of the first flow path are holes Pa, Pb, Pc, Pe, Pg, Pi, Pj, and Pk. It can be seen from FIG. 11 that there are voids α and γ between the hole Pf and the hole Pa. In addition, there are gaps γ and ε between the hole Pf and the hole Pe.

The arrow shown in Fig. 11 conceptually represents the movement of heat. If it is the state shown in Figure 11, the heat transfer from the heat medium in the second flow path (2a, 2b, 2c, 2d) to the raw material mist in the first flow path is only between the second flow path and the first flow path. 1 Perform at the contact point of the flow path. Therefore, the heat transfer efficiency is poor.

Figure 12 does not match the main part of the vaporizer of the present invention. The difference between the aspect shown in FIG. 12 and the aspect shown in FIG. 11 is the cross-sectional shape of the first flow path. That is, the cross section of the first flow path in the aspect shown in FIG. 11 is circular, but the cross section of the first flow path in the aspect shown in FIG. 12 is rectangular. Otherwise, similar to the configuration shown in FIG. 11, the tubular first flow path and the second flow path are combined in a lattice shape and fixed at their joints, and the first flow paths are also equal to each other. The contact point is fixed. In the case of such a structure, there is a tendency for the voids to be reduced compared with the aspect shown in FIG. 11. However, even if the tubes are brought into close contact with each other, as shown in FIG. 12, a certain gap is formed between them. In FIG. 12, there are voids α, β, γ, δ, ε, and ζ, for example.

In the aspect shown in FIG. 12, the holes of the first flow path are represented as Pa, Pb, Pc, Pd, Pe, Pf, Pg, Ph, Pi, Pj, Pk, Pl. In addition, in FIG. 12, the second flow paths are shown as 2a, 2b, 2c, and 2d.

In FIG. 12, for example, the holes of the other first flow paths existing beside the hole Pf of the first flow path are the holes Pa, Pb, Pc, Pe, Pg, Pi, Pj, and Pk. It can be seen from FIG. 11 that there are voids α and γ between the hole Pf and the hole Pa. In addition, there are gaps γ and ε between the hole Pf and the hole Pe.

The arrow shown in FIG. 12 conceptually represents the movement of heat. If it is the state shown in Figure 12, the heat transfer from the heating medium in the second flow path (2a, 2b, 2c, 2d) to the raw material mist in the first flow path is only between the second flow path and the first flow path. 1 Perform at the contact point of the flow path. Therefore, the heat transfer efficiency is poor.

As illustrated in FIGS. 8 to 12, in the vaporizer of the present invention, there is no second flow path between the first flow path and the other first flow paths existing beside it in the main part. The gap outside the flow path allows efficient heat transfer from the heat medium in the second flow path to the raw material mist in the first flow path.

The equal-area circle equivalent diameter (diameter) of the cross-section of the first flow path existing inside the main part of the vaporizer of the present invention is 5 mm or less, preferably 2 mm or less. Moreover, it is preferably 1 mm or more. Here, the equivalent diameter of a circle of equal area in the present invention means the diameter of a true circle corresponding to the area of the cross-sectional pattern of the first flow path. In addition, the equivalent diameter of the equal-area circle of the second flow path is also the same. If the size of the cross section of the first flow path is in the above range, it is preferable in terms of the balance between pressure loss and heat transfer performance, and the resistance to clogging of precipitates. In addition, the cross-sectional shape of the first flow path is not particularly limited. Can be round, oval, rectangular, etc.

The equal-area circle equivalent diameter (diameter) of the cross-section of the second flow path existing inside the main part of the vaporizer of the present invention is 2 mm or less, preferably 1 mm or less. Moreover, it is preferably 0.5 mm or more. If the size of the cross section of the second flow path is within the above range, it is preferable in terms of the balance between pressure loss and heat transfer performance. In addition, the cross-sectional shape of the second flow path is not particularly limited. Can be round, oval, rectangular, etc.

The vaporizer of the present invention preferably has the following aspect: in the cross section of the main part in the direction perpendicular to the direction in which the raw material mist flows, the direction in which the heating medium flows while meandering is set to the left and right direction In this case, the holes of the first flow path are arranged in rows in the left and right direction, and the rows of holes are arranged to form layers in the vertical direction, and the second flow exists between the layers of adjacent rows of holes in the vertical direction. The second flow path is not connected to the first flow path, and the second flow path is in the vertical direction to avoid the holes of the first flow path in the layer of rows of holes sandwiched from the vertical direction Snaking.

As the vaporizer of the present invention corresponding to this preferred aspect, aspect 1, aspect 2, and aspect 3 are shown below.

Regarding aspect 1, description will be given using FIGS. 13 to 15. FIG. 13 is a schematic perspective view showing a preferred aspect (aspect 1) of the main part of the vaporizer of the present invention, and FIG. 14 is a cross-sectional view taken along line CC' in FIG. 13. In the main part 20 of the aspect 1 shown in FIG. 13, as shown in FIG. 13, a second flow path 22 is formed on a plane that runs straight with the first flow path 21, and the second flow path 22 is formed to avoid the first flow path. The way of the flow path snakes. Furthermore, in Figures 13 and 14, "21p" represents the hole at the entrance or exit of the first channel or the hole of the first channel appearing in the cross section, and "22p" represents the hole at the entrance or exit of the second channel. hole.

The main portion 20, which is a preferred aspect (aspect 1) explained using FIGS. 13 to 15, can obtain a cross-section A that satisfies the following [Requirement 1] to [Requirement 3].

[Required Condition 1] The main part 20 as illustrated in Figure 13 and Figure 14 is vertical by the main part 20 relative to the direction in which the raw material mist flows (in the case where the first flow path extends linearly in the vertical direction) Cut in the direction to obtain a section A as illustrated in FIG. 14. Furthermore, the cross-section A may not be a cross-section in a direction perpendicular to all the first flow paths in the main portion 20. Depending on the configuration of the first flow path, there may be cases where it is impossible to obtain a cross section at right angles to all the first flow paths. In this case, set a section in a direction perpendicular to a part of the first flow path in the main part 20 (relative to as many first flow paths in the main part 20 as possible) as the cross section in the main part 20 A.

For example, in the case of the main portion 20 shown in FIG. 13, since the first flow path 21 is formed linearly, the cross section in the direction perpendicular to the flow path, that is, the cross section along the line C-C' in FIG. A, if it is shown, it looks like Figure 14.

In addition, the first flow path and the second flow path in FIG. 13 and FIG. 14 are flow paths having extremely simple structures for easy understanding. For example, the second flow path may be connected to another second flow path at the end in the left-right direction.

[Requirement 2] The requirement 2 will be described using FIG. 15. FIG. 15 shows the same section A as in FIG. 14. In addition, in FIG. 14, the hole of the first flow path is indicated as "21p", but in FIG. 15 it is indicated as "P _mk " (m and k are set to integers of 1 or more). In the main part 20, as illustrated in FIG. 15, when the direction in which the heating medium flows while meandering in the section A is set to the left and right direction, the holes (P _mk ) of the first flow path are arranged in a row in the left and right direction. , And row-shaped holes are arranged in a way that forms layers in the up and down direction. In Fig. 15, the holes (P _mk ) are arranged in rows in the left and right direction, and there are three layers of holes in the row of holes in the vertical direction. Also, set the layers of the rows of holes from below to the first, second, and third layers, set the holes in the first layer to "P _1k ", and set the holes in the second layer to " P _2k ", set the hole of the third layer to "P _3k ". That is, let m be the number of the layer. In addition, the holes in each layer are set to "P _m1 ", "P _m2 ", "P _m3 "... "P _mk "from left to right. That is, k is the number (serial number) of the holes in the same layer. Here, it is _assumed that the hole of "P _1k "on the first layer is directly above the hole of "P _3k " on the third layer. For example, directly above the hole "P ₁₃ "on the first layer, there is a hole "P ₃₃ " on the third layer. In addition, it is assumed that there is a hole in the second layer "P _2k " at the upper left of the hole in the first layer "P _1k ". For example, at the upper left of the hole "P ₁₃ "in the first layer, there is a hole "P ₂₃ " in the second layer.

In this case, the layers of rows of holes adjacent in the vertical direction become the first layer and the second layer, and the second and third layers. However, in the adjacent first and second layers, the 1 The holes of the flow path are not arranged at the same position in the left-right direction. That is, there is no center of the hole of the second layer directly above the center of the hole of the first layer. The hole in the second layer exists between the two holes in the first layer. Similarly, in the adjacent second layer and third layer, the holes of the second flow path are not arranged at the same position in the left-right direction. That is, there is no center of the hole of the third layer directly above the center of the hole of the second layer. The hole in the third layer exists between the two holes in the second layer.

[Required Condition 3] In the main portion 20, as shown in FIGS. 14 and 15, there is a second flow path 22 between the layers of adjacent rows of holes in the vertical direction. In addition, the first flow path 21 and the second flow path 22 are not connected. In addition, the second flow path 22 snakes in the vertical direction so as to avoid the holes (21p, P _mk ) of the first flow path in the layer of row-shaped holes sandwiched from the vertical direction. For example, in Figure 15, in the first layer containing the holes (P ₁₁ , P ₁₂ , P ₁₃ , P ₁₄ ) of the first flow path, and the holes (P ₂₁ , P ₂₂ , P ₂₃ , There is a second flow path 22 between the second layer of P ₂₄ , P ₂₅ ), and the second flow path avoids the holes (P ₁₁ , P ₁₂ , P ₁₃ , P ₁₄ ) of the first layer and the second layer The way of holes (P ₂₁ , P ₂₂ , P ₂₃ , P ₂₄ , P ₂₅ ) snakes in the up and down direction. Here, as shown in FIG. 15, the belt-shaped part that becomes the boundary between the first layer and the second layer snakes up and down, and the second flow path snakes along the shape of the belt-shaped part.

Regarding aspect 2, FIG. 16 is used for description. FIG. 16 is the same cross-section as FIG. 14 showing the cross-section of aspect 1. The vaporizer of the present invention has the following aspect: in the cross section A of the main part 20 in the direction perpendicular to the direction of the flow of the raw material mist, when the direction of the heat medium meandering and flowing is the left and right direction , The holes 21p of the first flow path are arranged in rows in the left-right direction, and the row-shaped holes are arranged to form a layer in the vertical direction. In addition, when compared with the layer of adjacent row-shaped holes in the vertical direction, the first flow path The holes 21p are not arranged at the same position in the left and right directions. The second flow path 22 is not connected to the first flow path 21. The second flow path 22 avoids the rows of holes sandwiched from the vertical direction. The hole 21p of the first flow path snakes in the vertical direction.

Regarding aspect 3, description will be given using FIG. 17. FIG. 17 is the same cross-section as FIG. 14 showing the cross-section of aspect 1. The vaporizer of the present invention has the following aspect: in the cross section A of the main part 20 in the direction perpendicular to the direction of the flow of the raw material mist, when the direction of the heat medium meandering and flowing is the left and right direction , The holes 21p of the first flow path are arranged in rows in the left and right direction, and the rows of holes are arranged to form layers in the vertical direction. The second flow path 22 and the first flow path 21 are not connected, and the second flow path 22 is Avoiding the hole 21p of the first flow path in the layer of rows of holes sandwiched from the up and down direction snakes in the up and down direction.

When the vaporizer of the present invention divides the first flow path into a plurality of parts in the longitudinal direction, it is preferable that the above-mentioned existing inside the first flow path can be adjusted for each of these parts. The method of forming the temperature of the raw material mist. The reason is that if the gas raw material for film formation is manufactured in this way, the amount of precipitates generated becomes smaller.

Secondly, this better aspect will be explained. For example, in FIG. 4, the surface of the main portion 12 on which the hole 1Pin for the inflow of the raw material mist is formed is the entrance side 125. In addition, the surface of the main portion 12 on which the hole 1Pout for discharging the gas raw material is formed is the exit side surface 127. In this case, if the second flow path in the main part 12 near the entrance side 125 is formed separately, the heat medium flow path and the second flow in the main part 12 near the exit side 127 The path through which the heat medium flows into the main part 12 can make the temperature of the heat medium flowing into the second flow path in the main part 12 near the inlet side 125 and the latter to the outlet side 127 of the main part 12 The temperature of the heating medium flowing in the second flow path in the part is different. In this case, the temperature of the raw material mist existing in the first flow path 1 in the part near the entrance side 125 in the main part 12 of the former can be adjusted for each part, and the proximity of the main part 12 in the latter The temperature of the raw material mist existing in the first flow path 1 in the part exiting the side surface 127. Also, for example, if the second flow path in the main part 12 near the entrance side 125 is formed separately, the heat medium flow path and the second flow path in the main part 12 near the exit side 127 are formed. The path for the inflow of the heat medium, and the heat medium with a relatively high temperature is circulated to the second flow path of the main part 12 near the entrance side 125 of the former, and the path for the heat medium to flow into the heat medium with a relatively low temperature The medium flows to the second flow path in the main part 12 near the exit side surface 127 to flow into the heat medium. Then, it can flow from the entrance side surface 125 to the exit side surface 127, so that the second flow path existing inside The temperature of the above-mentioned heat medium inside gradually decreases. In this case, the temperature of the raw material mist flowing into the first flow path from the hole 1Pin gradually decreases as it moves toward the hole 1Pout.

Also, for example, in the detachable configuration of the main part shown in Figs. 6 and 7, if the main part 12a, the main part 12b, and the main part 12c flow in the second flow path respectively, The method of adjusting the temperature of the heating medium can adjust the temperature of the raw material mist existing in each of the main portion 12a, main portion 12b, and main portion 12c. For example, if the temperature of the heating medium in the second flow path is gradually reduced from the inlet side 125 to the outlet side 127, the mist of the raw material flowing into the first flow path from the hole 1Pin will be directed toward the hole 1Pout During the movement, the temperature gradually decreases.

In the gasifier of the present invention, the surface of the main part formed with the holes for the inflow of the raw material mist is set as the inlet side, and the surface of the main part formed with the holes for discharging the gas raw material is set as the outlet side In this case, it is preferable that the equal-area circle-equivalent diameter of the first flow path existing in the entrance side face toward the exit side face gradually changes.

About this preferable aspect, it demonstrates using FIG. 18-21. Fig. 18 shows a cross-sectional view taken along the line D-D' in Fig. 4, and Figs. 19-21 show cross-sectional views when the first flow path shown in Fig. 18 is replaced with another aspect (preferred aspect).

In the main portion 12 shown in FIG. 18, from the inlet side 125 where the hole 1Pin for the inflow of the raw material mist is formed toward the outlet side 127 where the hole 1Pout for the discharge of the gas raw material is formed, the first flow path 1 exists in the inside thereof The diameter has not changed. The first flow path 1 is formed linearly.

On the other hand, in the main portion 12 shown in FIG. 19, from the inlet side 125 formed with the hole 1Pin for the inflow of the raw material mist toward the outlet side 127 formed with the hole 1Pout for discharging the gas raw material, the above-mentioned inside is present The equivalent diameter of the equal-area circle of the first flow path gradually decreases. If it is in this state, it is preferable in terms of allowing the temperature of the gas raw material to rise slowly.

In addition, in the main portion 12 shown in FIG. 20, from the inlet side 125 formed with the hole 1Pin for the inflow of the raw material mist toward the outlet side 127 formed with the hole 1Pout for discharging the gas raw material, the above-mentioned first The equivalent diameter of the equal area circle of the flow path changes gradually. In this aspect, it is preferable in that the gas raw material can be evenly distributed on the first flow path.

In addition, in the main portion 12 shown in FIG. 21, from the inlet side 125 formed with the hole 1Pin for the inflow of the raw material mist toward the outlet side 127 formed with the hole 1Pout for discharging the gas raw material, the above-mentioned first The equivalent diameter of the equal-area circle of the flow path changes in a way that gradually becomes smaller and then becomes larger. If it is in this aspect, it is preferable in terms of utilizing the chaos of the gaseous material to promote heat transfer and homogenization of the fluid.

[Discharge part] FIG. 22 is a schematic perspective view of the discharge part 16, and FIG. 23 is a cross-sectional view taken along the line E-E' in FIG. The discharge part 16 illustrated in FIG. 22 collects the gas raw material discharged from the main part 12 as described above, and discharges it to the outside of the system. In the situation illustrated in FIGS. 22 and 23, the gas raw materials discharged from the main body 12 are collected in the recess 162. In addition, the gaseous material is discharged to the outside of the system through the path 164 connected thereto. The discharge part 16 preferably contains a metal material like the main part 12. Furthermore, the vaporizer of the present invention preferably includes a discharge part.

The vaporizer of the present invention is preferably configured to have a gap between the outer surface of the main part and at least a part of the first flow path and the second flow path, so that the internal heat is difficult to release to the outside. By setting the void into a vacuum, the internal heat is difficult to release to the outside. Furthermore, the vaporizer of the present invention may be further configured to have a gap between the outer surface of a part other than the main part and at least a part of the first flow path and the second flow path, so that the internal heat It is difficult to release to the outside world. This preferred aspect will be described using FIGS. 24-27.

Fig. 24 is the following aspect: the main part 12 in the aspect shown in Fig. 1 is replaced with the main part (12a, 9a, 12b, 9b, 12c) shown in Fig. 6, with a second flow path 72 The introduction hole 61 for introducing the heat medium and the discharge hole 63 for discharging the heat medium from the second flow path 72 further have a gap 67 between the outer surface 65 and at least a part of the first flow path 71 and the second flow path 72. 25 is a cross-sectional view taken along line F-F' in FIG. 24, FIG. 26 is a cross-sectional view taken along line G-G' in FIG. 24, and FIG. 27 is a cross-sectional view taken along line H-H' in FIG. 24.

In the preferred embodiment of the vaporizer of the present invention shown in FIGS. 24 to 27, a gap 67 is formed between the outer surface 65 and at least a part of the first flow path 71 and the second flow path 72. In the case of the preferred aspect shown in FIGS. 24 to 27, the void 67 is formed with a certain thickness along the outer surface in principle. However, the part where the heat medium introduction hole 61 and the heat medium discharge hole 63, the introduction hole for introducing the raw material mist and the discharge hole for discharging the gas material are formed, may not be formed as shown in FIGS. 24-27. Gap 67.

The thickness of the void is not particularly limited, but is preferably about 0.5 to 2.0 mm.

The void can be formed by the same method as the first flow path, for example. The method of forming the first flow path will be described below.

The vaporizer of the present invention has such a gap, so that the internal heat is difficult to release to the outside, which is preferable. Furthermore, it is also possible to make the inside of such a space a vacuum. If the vaporizer of the present invention is manufactured by the following manufacturing method of the present invention, the inside of the void can be easily vacuumed. It is also possible to fill the void with a thermal insulation material, but when the void is set to a vacuum, the thermal insulation is more excellent.

<The manufacturing method of the present invention> The manufacturing method of the present invention will be described. The vaporizer of the present invention as described above is preferably manufactured by the manufacturing method of the present invention shown below.

Description will be given using FIGS. 28 to 30. In the manufacturing method of the present invention, first, as shown in FIG. 28(a), a plurality of metal plates 30 are prepared. Then, as shown in FIG. 28(b), a groove 34 that becomes a part of the second flow path is formed on the main surface 32 thereof.

The method of forming such trenches 34 is not particularly limited. It can be formed by chemical methods such as etching, or can be formed by physical methods such as laser processing or cutting.

Next, as shown in FIG. 28(c), a through hole 40 penetrating from one main surface 32 to the other main surface 38 is formed. For example, a drill may be used to form the through hole 40. In addition, the through hole 40 may be formed by a chemical method such as etching, or a physical method such as laser processing or cutting. The through hole 40 becomes a part of the first flow path.

Next, the main surfaces 32 of the metal plate material 42 on which the groove 34 and the through hole 40 are formed are brought into close contact with each other (FIG. 29(a), (b)). Then, if the main surfaces 32 of the metal plates 42 are joined to each other by diffusion bonding, the main part having the first flow path 52 and the second flow path 54 inside as shown in FIG. 29(c) can be obtained One part 50. Then, if a plurality of parts 50 of the main part as shown in FIG. 29(c) are made and their main surfaces are joined to each other by diffusion bonding, the main part can be obtained.

In addition, in FIG. 29, the case where the two metallic plates 42 formed on the main surface 32 with the groove 34 as a part of the second flow path are in close contact and joined together is described, but it may be as shown in the figure. As shown in 30(a), the metal plate 42 on which the groove 34 and the through hole 40 are formed, and the metal plate 42' on which the through hole 40 is formed without the groove 34 are in close contact and joined. Then, if the main surfaces 32 of the metal plates 42, 42' are joined to each other by diffusion bonding, it is possible to obtain the first flow path 52 and the second flow path 54 inside as shown in FIG. 30(c) A part of the main part 50. Then, if a plurality of parts 50 of the main part as shown in FIG. 30(c) are made and their main surfaces are joined to each other by diffusion bonding, the main part can be obtained.

1: The first flow path 1Pin: the inlet of the first flow path 1Pout: the outlet of the first flow path 2: the second flow path 2a: the second flow path 2b: the second flow path 2c: the second flow path 2d: the second Flow path 9a: spacer 9b: spacer 10: vaporizer of the present invention 12: main part 12a: main part 12b: main part 12c: main part 14: supply part 16: discharge part 20: main part 21: first Flow path 21p: First flow path hole 22: Second flow path 22p: Second flow path hole 30: Metal plate 32: Main surface 34: Groove 36: Metal plate 38: Main surface 40: Through hole 42: Metal sheet 42': Metal sheet 50: Main part (part of) 52: First flow path 54: Second flow path 61: Introductory hole 63: Discharge hole 65: Outer surface 67: Gap 71: First Flow path 72: Second flow path 91: Through hole 125: Inlet side of the main part 127: Outgoing side of the main part 141: Introductory hole 143: Flow path 161: Discharge hole 162: Recess 164: Path A: Section Pa, Pb, Pc, Pd, Pe, Pf, Pg, Ph, Pi, Pj, Pk, Pl: the holes of the first flow path P ₁₁ , P ₁₂ , P ₁₃ ... P _mk : the holes α, β of the first flow path , Γ, δ, ε, ζ: void

Fig. 1 is a schematic perspective view showing one aspect of the vaporizer of the present invention. Fig. 2 is a schematic perspective view showing one aspect of a supply unit that the vaporizer of the present invention can have. FIG. 3 is a cross-sectional view taken along line AA' of the aspect shown in FIG. 2. FIG. Fig. 4 is a schematic perspective view showing one aspect of the main part that the vaporizer of the present invention can have. FIG. 5 is a cross-sectional view taken along line BB' of the aspect shown in FIG. 4. FIG. Fig. 6 is a schematic perspective view showing another aspect of the main part that the vaporizer of the present invention can have. Fig. 7 is a schematic perspective view showing the separated state of the main part shown in Fig. 6; Fig. 8 is a schematic view showing one aspect of a cross section of the main part of the vaporizer of the present invention. Fig. 9 is a schematic diagram showing another aspect of the cross section of the main part of the vaporizer of the present invention. Fig. 10 is a schematic view showing a cross-sectional aspect of the main part which is not equivalent to the vaporizer of the present invention. Fig. 11 is a schematic diagram showing another aspect of the cross-section of the main part which is not equivalent to the vaporizer of the present invention. Fig. 12 is a schematic view showing another aspect of the cross section of the main part which is not equivalent to the vaporizer of the present invention. Fig. 13 is a schematic perspective view showing another aspect of the main part that the vaporizer of the present invention can have. Fig. 14 is a cross-sectional view taken along line CC' of the aspect shown in Fig. 13. Fig. 15 is a cross-sectional view taken along line CC' of the aspect shown in Fig. 13. Fig. 16 is a schematic view showing a cross-section of another aspect of the main part that the vaporizer of the present invention can have. Fig. 17 is a schematic view showing a cross-section of another aspect of the main part that can be provided in the vaporizer of the present invention. Fig. 18 is a cross-sectional view taken along the line D-D' of the aspect shown in Fig. 4. Fig. 19 is a schematic cross-sectional view showing the aspect shown in Fig. 18 replaced with another aspect of the first flow path. FIG. 20 is a schematic cross-sectional view showing another aspect in which the first flow path of the aspect shown in FIG. 18 is replaced with another aspect. FIG. 21 is a schematic cross-sectional view showing another aspect in which the first flow path of the aspect shown in FIG. 18 is replaced with another aspect. Fig. 22 is a schematic perspective view showing one aspect of a discharge portion that can be provided in the vaporizer of the present invention. FIG. 23 is a cross-sectional view taken along line E-E' of the aspect shown in FIG. 22. FIG. Fig. 24 is a schematic perspective view showing a preferred aspect of the vaporizer of the present invention. Fig. 25 is a cross-sectional view taken along line FF' of the aspect shown in Fig. 24. Fig. 26 is a cross-sectional view taken along the line G-G' of the aspect shown in Fig. 24; Fig. 27 is a cross-sectional view taken along line H-H' of the aspect shown in Fig. 24. Fig. 28 (a)-(c) are schematic perspective views for explaining the manufacturing method of the present invention. Figures 29 (a) to (c) are schematic perspective views for explaining the subsequent steps of the manufacturing method of the present invention. 30(a)-(c) are schematic perspective views for explaining another manufacturing method of the present invention.

1: The first flow path

1Pin: the entrance of the first flow path

2: Second flow path

10: The vaporizer of the present invention

12: Main part

14: Supply Department

16: discharge part

127: The side of the main part

141: Lead-in hole

161: discharge hole

Claims (7)

A vaporizer for obtaining gas raw materials for film formation, which is obtained by heating and vaporizing raw material mist to obtain gas raw materials for film formation, and Inside the main part containing the metal material, there are a first flow path through which the above-mentioned raw material mist flows and a second flow path through which a heat medium for heating the above-mentioned raw material mist flows, The equivalent circle equivalent diameter of the cross section of the first flow path is 5 mm or less, and the equivalent circle equivalent diameter of the cross section of the second flow path is 2 mm or less, In the inside of the main part, there is no gap other than the second flow path between the first flow path and the other first flow paths existing beside it. Such as the gasifier for obtaining gas raw materials for film formation in claim 1, where In the cross section of the main part in a direction perpendicular to the direction in which the raw material mist flows, When the direction in which the heating medium flows while meandering is left and right, the holes of the first flow path are arranged in a row in the left and right direction, and the rows of holes are arranged to form a layer in the vertical direction, The second flow path exists between the layers of rows of holes that are adjacent in the vertical direction, and the second flow path is not connected to the first flow path. The holes of the first flow path in the layer of rows of holes meander in the up and down direction. For example, the vaporizer for obtaining the gas raw material for film formation in claim 1 or 2, when the first flow path is divided into a plurality of parts in the longitudinal direction, it can be adjusted for each of these parts The composition is based on the temperature of the raw material mist existing in the first flow path. For example, the vaporizer for obtaining gas raw materials for film formation of claim 1 or 2, wherein the main part is formed with holes for the raw material mist to flow into as the inlet side, and the main part is formed with When the surface of the hole for discharging the gas raw material is set as the exit side, the equivalent diameter of the equal-area circle of the first flow path existing in the entrance side toward the exit side gradually changes. Such as the vaporizer for obtaining a gas raw material for film formation of claim 1 or 2, wherein when the first flow path is arranged in a vertical direction, the second flow path is formed in a horizontal direction, and the same goes straight . The vaporizer for obtaining a gas raw material for film formation of claim 1 or 2 is configured to have a gap between the outer surface of the main part and at least a part of the first flow path and the second flow path, and It is difficult to release the internal heat to the outside. A manufacturing method of a gasifier, which includes the following steps: Prepare a plurality of metal plates, form grooves that become a part of the second flow path on the main surface, and form a through hole that penetrates from one main surface to the other main surface and becomes a part of the first flow path; and Making the main surfaces of the above-mentioned metal plates close to each other and joined by diffusion bonding; Thus, the vaporizer as claimed in item 1 or 2 is obtained.

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