TW202042405A - Dielectric ceramic material composition for capacitor applications for effectively improving insulation characteristics, capacitance temperature characteristics and stability to an electric field of DC bias - Google Patents
Dielectric ceramic material composition for capacitor applications for effectively improving insulation characteristics, capacitance temperature characteristics and stability to an electric field of DC bias Download PDFInfo
- Publication number
- TW202042405A TW202042405A TW109117894A TW109117894A TW202042405A TW 202042405 A TW202042405 A TW 202042405A TW 109117894 A TW109117894 A TW 109117894A TW 109117894 A TW109117894 A TW 109117894A TW 202042405 A TW202042405 A TW 202042405A
- Authority
- TW
- Taiwan
- Prior art keywords
- mol
- batio
- core
- dielectric ceramic
- component
- Prior art date
Links
Images
Landscapes
- Compositions Of Oxide Ceramics (AREA)
- Ceramic Capacitors (AREA)
Abstract
Description
本發明係提供一種符合EIA-X8R規範之介電陶瓷材料並可應用於卑金屬電極製程,尤指利用控制Sc2O3的添加量對BaTiO3進行改質,使BaTiO3產生核-殼結構以提高BaTiO3的介電特性對於應用溫度及直流偏壓電場的穩定性,並可降低Sc2O3的使用量以降低成本,亦極具產業利用性。 The present invention provides a dielectric ceramic material meet EIA-X8R specification can be applied to a base metal of an electrode manufacturing process, especially the control Sc 2 O 3 is added in an amount of BaTiO 3 by reforming the produced BaTiO 3 core - shell structure In order to improve the dielectric properties of BaTiO 3 to the application temperature and the stability of the DC bias voltage field, and to reduce the amount of Sc 2 O 3 used to reduce costs, it is also very industrially applicable.
隨著現今科技的進步與快速發展,使得電容器朝著微型化、高電容量、高穩定性及可靠度等趨勢邁進,並由傳統電容器轉變為晶片型式的積層陶瓷電容器(MLCCs)。此型態電容器不但縮小了電容器體積且提高電容量,也降低了生產成本,使得積層陶瓷電容器成為目前電子零件中使用量最多且應用最為廣泛的電子元件。而美國電子工業協會(EIA)依據不同使用的範圍及電氣特性,廣義將電容器歸納為溫度補償型電容及中高介電值型電容二大類。其中,X7R(-55℃至125℃,△C/C≦±15%)規範的積層陶瓷電容器具有多元的電氣特性且可滿足大多數的消費性電子產品應用溫度範圍,因此被廣泛應用在各類型的電子產品當中;近年來在汽車電子產品的應用發展迅速且對於安全性的要求更趨嚴格,故X7R積層陶瓷電容器不足以應付如此嚴苛的運作環境。基於安全方面的考量,更 具溫度穩定性的X8R(-55℃至150℃,△C/C≦±15%)高階積層陶瓷電容器受到高度的關注。 With the advancement and rapid development of science and technology, capacitors are moving towards miniaturization, high capacitance, high stability and reliability, etc., and are transformed from traditional capacitors to chip-type multilayer ceramic capacitors (MLCCs). This type of capacitor not only reduces the volume of the capacitor and increases the capacitance, but also reduces the production cost, making the multilayer ceramic capacitor the most widely used and most widely used electronic component among electronic components. The Electronic Industries Association of America (EIA) broadly summarizes capacitors into two categories: temperature-compensated capacitors and medium-to-high dielectric value capacitors based on different ranges of use and electrical characteristics. Among them, X7R (-55°C to 125°C, △C/C≦±15%) standard multilayer ceramic capacitors have multiple electrical characteristics and can meet the application temperature range of most consumer electronic products, so they are widely used in various Among the types of electronic products: In recent years, the application of automotive electronic products has developed rapidly and the requirements for safety have become more stringent, so X7R multilayer ceramic capacitors are not enough to cope with such a harsh operating environment. Based on safety considerations, X8R (-55°C to 150°C, △C/C≦±15%) high-end multilayer ceramic capacitors with temperature stability have received high attention.
再者,隨著電容器領域中的技術成熟,電容器結構上可以改變設計的部位趨於有限,因此大都是針對其介電陶瓷材料的組成配比與介電特性作適配性的調整,以期望能達到符合X8R規範兼具高介電常數的特性。一般積層陶瓷電容器製程以內電極來劃分,可分為貴金屬製程與卑金屬製程,其中貴金屬製程常以銀/鈀合金作內電極。此類稀有金屬昂貴使其衍生之產品成本極高,故基於成本考量現今大都採用較廉價的卑金屬製程。而卑金屬電極製程的內電極材料為很容易氧化的銅(Cu)或鎳(Ni)金屬,故需要在還原氣氛下進行燒結。然而,還原氣氛燒結將導致介電陶瓷材料脫氧,使得積層陶瓷電容器的絕緣特性劣化。因此,穩定的介電陶瓷材料配方並不容易達成。 Furthermore, as the technology in the field of capacitors matures, the areas that can be changed in the capacitor structure tend to be limited. Therefore, most of them are adjusted for the composition ratio and dielectric characteristics of the dielectric ceramic materials to meet the expectations. It can meet the X8R specification and have the characteristics of high dielectric constant. Generally, the manufacturing process of multilayer ceramic capacitors is divided into internal electrodes, which can be divided into precious metal manufacturing processes and base metal manufacturing processes. Among them, the precious metal manufacturing process often uses silver/palladium alloy as internal electrodes. Such rare metals are expensive and their derived products have extremely high costs. Therefore, based on cost considerations, nowadays, cheaper base metal processes are mostly used. The internal electrode material of the base metal electrode manufacturing process is copper (Cu) or nickel (Ni) metals that are easily oxidized, so sintering in a reducing atmosphere is required. However, sintering in a reducing atmosphere will cause the dielectric ceramic material to deoxidize, which will degrade the insulating properties of the multilayer ceramic capacitor. Therefore, a stable dielectric ceramic material formulation is not easy to achieve.
另外,在X8R規範的積層陶瓷電容器開發上,係以具有較高介電常數的鈦酸鋇陶瓷基材為主要方向,藉由各種修飾劑、晶粒成長抑制劑、燒結促進劑等的添加對鈦酸鋇進行改質,以提升介電陶瓷材料之介電特性穩定性和燒結性,相關先前技術已揭示出一種介電陶瓷混合物之製備方法,請參見中華民國發明公開號第TW201044427A號,係利用BaTiO3為主成份,並摻雜不同配比之Sc2O3、MgCO3、BaSiO3、MnCO3、La2O3、Co3O4及NiO等添加物進行均勻混合,以製備形成符合X8R規範並具有較佳的緻密性之介電陶瓷,惟該介電陶瓷為了達到符合X8R規範之介電特性的穩定性,需要添加相當比例(即大於1.00mol%,但小於4.00mol%)之昂貴Sc2O3成份而造成生產成本極高,使其產業利用性差,若要降低Sc2 O3的含量又達到穩定的介電特性,則須額外添加不易取得的氧合物(如La2O3、Co3O4或NiO等),因此提高了材料配方組成的複雜性、物料控管與生產成本,以及製造變異性上的風險。此外,另有先前技術為追求符合X8R規範添加入不同主成分或複雜副成份改質以後,使居禮溫度附近或高溫端區間(25℃至150℃)的TCC曲線能夠達成逐漸趨於平坦的目的。但往往卻不幸地造成低溫端的TCC曲線(例如室溫或-55℃至25℃區間)異常陡峭或波動過大,嚴重喪失室溫以下TCC曲線優異平緩的特性,這種改質作法顧此失彼,也是製造變異性難以控制所引發的問題,則有待從事於此行業者研究改善來加以有效解決。 In addition, in the development of the X8R standard multilayer ceramic capacitors, the main direction is the barium titanate ceramic substrate with higher dielectric constant, and the addition of various modifiers, grain growth inhibitors, sintering accelerators, etc. Barium titanate is modified to improve the stability of dielectric properties and sinterability of dielectric ceramic materials. The related prior art has disclosed a method for preparing dielectric ceramic mixtures. Please refer to the Republic of China Invention Publication No. TW201044427A. Using BaTiO 3 as the main component, and doping with different proportions of Sc 2 O 3 , MgCO 3 , BaSiO 3 , MnCO 3 , La 2 O 3 , Co 3 O 4 and NiO and other additives for uniform mixing to prepare a X8R standard dielectric ceramics with better compactness, but in order to achieve the stability of the dielectric characteristics of the dielectric ceramics in accordance with the X8R standard, a considerable proportion (that is, more than 1.00 mol%, but less than 4.00 mol%) Expensive Sc 2 O 3 components result in extremely high production costs, which makes its industrial applicability poor. To reduce the content of Sc 2 O 3 and achieve stable dielectric properties, additional oxygen compounds that are not easily available (such as La 2 O 3 , Co 3 O 4 or NiO, etc.), thereby increasing the complexity of the material formulation composition, material control and production costs, and the risk of manufacturing variability. In addition, there is another prior art in order to meet the X8R specification by adding different main components or complex sub-components to modify, so that the TCC curve near the Curie temperature or the high temperature end range (25°C to 150°C) can achieve a gradually flattening purpose. Unfortunately, the TCC curve at the low temperature end (such as room temperature or -55℃ to 25℃) is abnormally steep or fluctuates too much, and the excellent and gentle characteristics of the TCC curve below room temperature are severely lost. This modification method takes care of the other, and is also manufacturing The problems caused by the difficulty of controlling variability need to be solved effectively by those engaged in this industry to study and improve.
故,發明人有鑑於上述製備之介電陶瓷利用添加Sc2O3對BaTiO3進行改質,需要添加相當比例之昂貴Sc2O3,導致生產成本過高而不具商業競爭力。若是降低Sc2O3成份的含量,則須額外添加如La2O3、Co3O4及NiO等化合物,因此提高了材料配方的組成複雜性、成本及製造變異性的風險等問題與缺失。乃搜集相關資料經由多方的評估及考量,並利用從事於此行業之多年研發經驗不斷的試作,始有此種可應用於卑金屬電極製程的介電陶瓷材料組成的發明專利誕生。 Therefore, the inventor considers that the above-prepared dielectric ceramics are modified by adding Sc 2 O 3 to modify BaTiO 3 , and it is necessary to add a considerable proportion of expensive Sc 2 O 3 , which leads to high production costs and not commercial competitiveness. If the content of Sc 2 O 3 is reduced, additional compounds such as La 2 O 3 , Co 3 O 4 and NiO must be added, thus increasing the composition complexity, cost, and manufacturing variability of the material formulation. . After collecting relevant information, after many evaluations and considerations, and using years of research and development experience in this industry, the invention patent of the dielectric ceramic material composition that can be applied to the base metal electrode process was born.
本發明之主要目的乃在於實施例所製備之積層陶瓷電容器為利用控制Sc2O3的添加量來對BaTiO3進行改質,並在燒結反應的過程中,該Sc2O3成份的添加可使BaTiO3產生核-殼結構,具有抑制BaTiO3晶粒成長之功效及有效提升其絕緣特性及介電溫度穩定性。而Sc2O3相對於BaTiO3每100莫耳時添加的含量比率係介於0.30~1.00莫耳,並另可適當添 加0~2.00莫耳的MgO,對於-55℃至25℃區間的TCC曲線具有加強穩定化的效果,由於材料配比組成的添加物成份簡單且含量佔比稀少,即可降低Sc2O3的使用量、成本及製造變異性的風險等,進而得到應用於卑金屬電極製程並符合EIA-X8R規範之介電陶瓷材料。 The main purpose of the present invention is that the multilayer ceramic capacitor prepared in the examples is to modify the BaTiO 3 by controlling the addition amount of Sc 2 O 3 , and during the sintering reaction, the addition of the Sc 2 O 3 component can be The BaTiO 3 produces a core-shell structure, which has the effect of inhibiting the growth of BaTiO 3 grains and effectively improves its insulation properties and dielectric temperature stability. The ratio of Sc 2 O 3 to BaTiO 3 added per 100 mol is 0.30~1.00 mol, and 0~2.00 mol of MgO can be added appropriately. For TCC in the range of -55℃ to 25℃ The curve has the effect of strengthening stabilization. Because the additive composition of the material ratio is simple and the content is sparse, it can reduce the amount of Sc 2 O 3 used, the cost and the risk of manufacturing variability, and then it can be applied to base metals Electrode manufacturing process and dielectric ceramic materials that meet EIA-X8R specifications.
本發明之次要目的乃在於上述積層陶瓷電容器使用之介電陶瓷材料最佳為BaTiO3共摻雜0.45mol% Sc2O3和1.00mol% MgO,並於-55℃至150℃區間的介電常數變化率穩定維持在±10%範圍內,符合EIA-X8R規範並可應用於卑金屬電極製程,其介電常數為1744,介電損耗為0.58%,-55℃的TCC為-3.9%和150℃的TCC為-8.5%,室溫電阻係數達到2.8×1012Ω-cm和高溫150℃電阻係數達到1.7×1011Ω-cm,則可有效改善積層陶瓷電容器介電溫度特性的穩定性,且兼具良好的絕緣特性。
The secondary objective of the present invention is that the dielectric ceramic material used in the above-mentioned multilayer ceramic capacitor is optimally BaTiO 3 co-doped with 0.45 mol% Sc 2 O 3 and 1.00 mol% MgO, and the dielectric ceramic material is between -55 ℃ and 150 ℃. The rate of change of the electrical constant is maintained within the range of ±10%, which complies with the EIA-X8R specification and can be applied to the base metal electrode process. The dielectric constant is 1744, the dielectric loss is 0.58%, and the TCC at -55°C is -3.9%. And 150℃ TCC is -8.5%, room temperature resistivity reaches 2.8×10 12 Ω-cm and
[第1圖]係本發明使用介電陶瓷材料所製作成實施例的積層陶瓷電容器之製備流程圖。 [Figure 1] is a flow chart of the production of multilayer ceramic capacitors of the embodiment of the present invention using dielectric ceramic materials.
[第2圖]係本發明實施例使用之介電陶瓷材料配比參數與介電特性的數據表(一)。 [Figure 2] is a data table (1) of the ratio parameters and dielectric properties of the dielectric ceramic materials used in the embodiment of the present invention.
[第3圖]係本發明實施例之介電溫度特性量測圖(一)。 [Figure 3] is the dielectric temperature characteristic measurement diagram (1) of the embodiment of the present invention.
〔第4圖]係本發明實施例使用之介電陶瓷材料配比參數與介電特性的數據表(二)。 [Figure 4] is a data table (2) of the ratio parameters and dielectric properties of the dielectric ceramic materials used in the embodiment of the present invention.
[第5圖]係本發明實施例之介電溫度特性量測圖(二)。 [Figure 5] is the dielectric temperature characteristic measurement diagram (2) of the embodiment of the present invention.
為達成上述目的及功效,本發明所採用之技術手段及其構造,茲繪圖就本發明之較佳實施例詳加說明其構造與功能如下,俾利完全瞭解。 In order to achieve the above-mentioned purpose and effect, the technical means and structure adopted by the present invention are illustrated in detail below to explain the structure and function of the preferred embodiment of the present invention in order to fully understand.
請參閱第1圖所示,係為本發明使用介電陶瓷材料所製作成實施例的積層陶瓷電容器之製備流程圖,由圖中可清楚看出,本發明實施例的積層陶瓷電容器製備的方法,係依據下列步驟流程實施,但實際應用時製備的方法並不以此為限,只要本領域中具有通常知識者所周知的任何一種製備積層陶瓷電容器的方法皆可使用,並包含其他型態之相關陶瓷電容器的應用產品。本發明實施例之積層陶瓷電容器製備的方法包括以下步驟: Please refer to Figure 1, which is a manufacturing flow chart of the multilayer ceramic capacitor of the embodiment of the invention using dielectric ceramic materials. It can be clearly seen from the figure that the method of manufacturing the multilayer ceramic capacitor of the embodiment of the invention It is implemented according to the following steps, but the method of preparation in actual application is not limited to this, as long as any method of preparing multilayer ceramic capacitors known to those with ordinary knowledge in the field can be used, and includes other types Application products of related ceramic capacitors. The method of manufacturing a multilayer ceramic capacitor of the embodiment of the present invention includes the following steps:
(101)將主成份與副成份粉末依組成配比混合調製出陶瓷漿料。 (101) Mix the main component and the secondary component powder according to the composition ratio to prepare a ceramic slurry.
(102)製備陶瓷薄帶。 (102) Preparation of ceramic thin tape.
(103)網印電極圖案。 (103) Screen printing electrode pattern.
(104)製備積層陶瓷生胚。 (104) Preparation of laminated ceramic green embryo.
(105)氧化熱處理燒除有機質。 (105) Oxidative heat treatment burns out organic matter.
(106)還原氣氛燒結。 (106) Sintering in a reducing atmosphere.
(107)再氧化熱處理。 (107) Re-oxidation heat treatment.
(108)製備外部電極。 (108) Prepare external electrodes.
(109)電性量測。 (109) Electrical measurement.
可由上述之實施步驟得知,其步驟為首先將高純度(>99%)的鈦酸鋇(BaTiO3)粉末在空氣中以5℃/min的加熱速率加熱至115 0℃持續4小時,作為初始BaTiO3粉末。然後將主成份包含BaTiO3粉末、0.05mol%的碳酸錳(MnCO3)、1.37mol%的矽酸鋇(BaSiO3)與至少一種副成份包含0.30~1.00mol%的氧化鈧(Sc2O3)及0~2.00mol%的氧化鎂(MgO)依組成的配方比例混合後,再加入甲苯、無水酒精、黏結劑、分散劑及塑化劑,使用氧化鋯球進行研磨均勻混合調製出陶瓷漿料,便可將陶瓷漿料進行刮刀成型製備成陶瓷薄帶,並使用網版印刷的方式將金屬包含鎳(Ni)、銅(Cu)、銀(Ag)或鈀(Pd)的電極圖案印製到陶瓷薄帶上,再將陶瓷薄帶以交錯的方式進行堆疊、熱壓成型出緊湊的積層陶瓷生胚,即可根據設計的積層陶瓷電容器尺寸進行切割。 It can be known from the above implementation steps that the step is to first heat high purity (>99%) barium titanate (BaTiO 3 ) powder in the air at a heating rate of 5°C/min to 115 0°C for 4 hours, as Initial BaTiO 3 powder. Then the main component contains BaTiO 3 powder, 0.05 mol% of manganese carbonate (MnCO 3 ), 1.37 mol% of barium silicate (BaSiO 3 ), and at least one secondary component containing 0.30 to 1.00 mol% of scandium oxide (Sc 2 O 3) ) And 0~2.00mol% of magnesium oxide (MgO) are mixed according to the composition ratio, then toluene, absolute alcohol, binder, dispersant and plasticizer are added, and zirconia balls are used to grind and mix uniformly to prepare ceramic slurry The ceramic paste can be scraped into a thin ceramic ribbon, and the electrode pattern of the metal containing nickel (Ni), copper (Cu), silver (Ag) or palladium (Pd) can be printed by screen printing. It is made on the ceramic thin ribbon, and then the ceramic thin ribbon is stacked in a staggered manner and hot-pressed to form a compact laminated ceramic green embryo, which can be cut according to the designed laminated ceramic capacitor size.
而在燒結之前,係先將積層陶瓷生胚在純氮氣(N2)氣氛下以350℃~550℃進行氧化熱處理4小時(加熱和冷卻速率保持在2℃/min),藉此燒除積層陶瓷生胚中先前加入的有機質,然後將積層陶瓷生胚在97%純氮氣、3%氫氣(H2)與35℃飽和水蒸汽所組成的還原氣氛下以1200℃~1300℃進行燒結2小時(加熱和冷卻速率保持在5℃/min),再將所有燒除樣品置於純氮氣與35℃飽和水蒸汽所組成的低氧分壓氣氛下以950℃進行氧化熱處理2小時,並緩緩降至室溫後得到積層陶瓷熟胚。 Before sintering, the laminated ceramic green embryos are oxidized and heat treated at 350°C~550°C for 4 hours (heating and cooling rates are maintained at 2°C/min) in a pure nitrogen (N 2 ) atmosphere to burn out the laminate The organic matter previously added to the ceramic green embryo is then sintered for 2 hours at 1200℃~1300℃ in a reducing atmosphere composed of 97% pure nitrogen, 3% hydrogen (H 2 ) and 35℃ saturated steam. (The heating and cooling rate is maintained at 5°C/min), and then all burned samples are placed in a low oxygen partial pressure atmosphere composed of pure nitrogen and 35°C saturated steam at 950°C for 2 hours, and slowly After cooling down to room temperature, a laminated ceramic cooked embryo is obtained.
續將外部電極包含Cu電極塗料以浸漬的方式塗覆在積層陶瓷熟胚二端,並與內部Ni電極接觸,然後將外部電極在純氮氣氣氛下以900℃進行燒結並與內部Ni電極結合,最後將Ni和Sn(錫)電鍍在半成品的積層陶瓷電容器的二端Cu電極上,便可完成以下說明書中各實施例所有樣品的製備,而樣品的製備完成後,則使用掃描式電子顯微鏡(SEM)、穿透式電子顯微鏡(TEM)及X光繞射儀(XRD)觀察積層陶瓷電 容器的微觀結構,並使用電感電容電阻(TLC)量測儀進行積層陶瓷電容器介電特性的測量。 Continue to coat the outer electrode containing Cu electrode paint on the two ends of the laminated ceramic cooked green blank by dipping, and contact the inner Ni electrode, then the outer electrode is sintered at 900°C in a pure nitrogen atmosphere and combined with the inner Ni electrode. Finally, Ni and Sn (tin) are electroplated on the two-terminal Cu electrodes of the semi-finished multilayer ceramic capacitor to complete the preparation of all the samples in each embodiment in the following specification. After the preparation of the samples is completed, use a scanning electron microscope ( SEM), transmission electron microscope (TEM) and X-ray diffractometer (XRD) to observe the multilayer ceramic The microstructure of the container, and the dielectric characteristics of multilayer ceramic capacitors are measured using an inductance capacitance resistance (TLC) measuring instrument.
請參閱第2~3圖所示,係分別為本發明實施例使用之介電陶瓷材料配比參數與介電特性的數據表(一)及實施例之介電溫度特性量測圖(一),由圖中可清楚看出,本發明上述積層陶瓷電容器使用之介電陶瓷材料主要由BaTiO3、0.05mol% MnCO3、1.37mol% BaSiO3作為主成份,但於實際應用時,亦可適當添加其他與BaTiO3混合的化合物,並由主成份添加不同含量的Sc2O3(0.30~0.60mol%)及MgO(0~2.00mol%)作為副成份對BaTiO3進行改質。 Please refer to Figures 2 to 3, which are the data sheet (1) and the dielectric temperature characteristic measurement diagram of the embodiment (1) of the dielectric ceramic material ratio parameters and dielectric characteristics used in the embodiment of the present invention. It can be clearly seen from the figure that the dielectric ceramic materials used in the above-mentioned multilayer ceramic capacitors of the present invention are mainly composed of BaTiO 3 , 0.05 mol% MnCO 3 , and 1.37 mol% BaSiO 3 as the main components, but in practical applications, it can also be appropriate Add other compounds mixed with BaTiO 3 , and add different content of Sc 2 O 3 (0.30~0.60mol%) and MgO (0~2.00mol%) as secondary components to modify BaTiO 3 from the main component.
當使用SEM觀察各實施例之積層陶瓷電容器的橫截面微觀結構時,可發現添加量為0.30mol% Sc2O3的積層陶瓷電容器相較於添加量為0.60mol% Sc2O3的積層陶瓷電容器有更少的孔隙及更高的燒結密度。而隨著Sc2O3添加量的增加,雖然可使BaTiO3的晶粒尺寸細化且粒度更均勻,但在燒結反應的過程中反而會傾向於抑制BaTiO3的晶界遷移速率,故過量的添加Sc2O3將會導致BaTiO3的緻密度降低及燒結緻密溫度提高,由於BaTiO3晶粒尺寸縮小的關係,隨著Sc2O3添加量的增加使得BaTiO3的介電常數及介電損耗亦會隨著降低,而其絕緣特性會因晶粒比表面積增加的關係,而有顯著的提升效果。進一步的觀察Sc2O3添加量0.30mol%至0.60mol%之間的TCC曲線變化,可發現隨著Sc2O3添加量的增加,對於BaTiO3的TCC曲線穩定性有著顯著的助益。 When the cross section was observed using an SEM microstructure of the laminated ceramic capacitor of the embodiment when the respective embodiments, may be added in an amount found to 0.30mol% Sc 2 O 3 of the multilayer ceramic capacitor as compared to the addition amount 0.60mol% Sc 2 O 3 ceramic laminate of Capacitors have fewer porosity and higher sintered density. With the increase of Sc 2 O 3 addition, although the grain size of BaTiO 3 can be refined and the grain size can be more uniform, it tends to suppress the grain boundary migration rate of BaTiO 3 during the sintering reaction process, so excessive The addition of Sc 2 O 3 will cause the density of BaTiO 3 to decrease and the sintering densification temperature to increase. Due to the shrinking of BaTiO 3 grain size, with the increase of Sc 2 O 3 addition, the dielectric constant and dielectric constant of BaTiO 3 The electrical loss will also decrease, and its insulating properties will have a significant improvement effect due to the increase in the specific surface area of the crystal grains. Further observe the TCC curve between 0.30mol% to 0.60mol% of the added amount of Sc 2 O 3, may be found with increasing amount of added 2 O 3 Sc, TCC curves for the stability of the BaTiO 3 has a significant benefit.
為了理解積層陶瓷電容器的微觀結構中不同Sc2O3添加量對於BaTiO3晶體結構與介電特性的影響,使用TEM觀察可發現Sc2O3添 加量提高至0.45mol%以上時,將使BaTiO3的晶粒產生化學組成不均勻的核-殼結構(Core-Shell Structure)。藉由使用能量分散X光譜儀(EDS)分析晶粒上的組成時可發現晶粒外殼具有較高含量的鈧(Sc)元素(>1.0at%),而晶粒核心則具有較低含量的鈧(Sc)元素(<0.5at%),此一現象是由於Sc元素擴散速率較低所產生的濃度梯度差異,該較高含量的Sc元素導致在BaTiO3的晶粒處產生具有濃度梯度的核-殼結構,且晶粒外殼正方性較低為近似立方晶結構的順電態,而晶粒核心則正方性較高具有自發性極化的鐵電正方晶結構。另外,Mg元素擴散速率較快,所以晶粒外殼及晶粒核心並未發現Mg元素的含量存在太大差異。然而,當Sc2O3添加量達到0.30mol%時,並未發現晶粒存在化學組成不均勻的核-殼結構。 In order to understand the influence of different Sc 2 O 3 additions on the crystal structure and dielectric properties of BaTiO 3 in the microstructure of multilayer ceramic capacitors, TEM observation shows that when the addition of Sc 2 O 3 increases to 0.45 mol% or more, BaTiO The crystal grains of 3 produce a core-shell structure with uneven chemical composition. By using energy dispersive X spectrometer (EDS) to analyze the composition of the grains, it can be found that the outer shell of the grain has a higher content of scandium (Sc) element (>1.0at%), while the core of the grain has a lower content of scandium. (Sc) element (<0.5at%), this phenomenon is due to the concentration gradient difference caused by the low diffusion rate of Sc element. The higher content of Sc element leads to the generation of nuclei with concentration gradient at the crystal grains of BaTiO 3 -Shell structure, and the crystal grain shell has a low squareness, which is a paraelectric state similar to a cubic crystal structure, while the crystal grain core has a high squareness and a spontaneously polarized ferroelectric square crystal structure. In addition, the diffusion rate of Mg element is relatively fast, so there is not much difference in the content of Mg element in the grain shell and the grain core. However, when the amount of Sc 2 O 3 added reached 0.30 mol%, no core-shell structure with uneven chemical composition was found in the crystal grains.
如第2~3圖所示,係分別列出了積層陶瓷電容器添加不同含量的Sc2O3及MgO在還原氣氛下燒結得到的介電特性,以及繪製出了電容溫度係數(TCC)與溫度的關係曲線,其顯示了當BaTiO3添加Sc2O3的含量從0.30mol%提高時,可使-55℃至150℃區間的TCC曲線變得更平坦,尤其是添加量分別為0.45mol%和0.60mol% Sc2O3的積層陶瓷電容器。而MgO添加量為1.00mol%時,對於-55℃至25℃區間的TCC曲線則具有加強穩定化的效果,因此Sc2O3的添加對於BaTiO3的介電溫度特性具有良好的穩定效果,尤其是25℃至150℃區間的TCC曲線的影響更明顯。 As shown in Figures 2 to 3, the dielectric properties of multilayer ceramic capacitors with different contents of Sc 2 O 3 and MgO sintered in a reducing atmosphere are listed, and the temperature coefficient of capacitance (TCC) and temperature are plotted. The relationship curve shows that when BaTiO 3 is added with Sc 2 O 3 from 0.30mol%, the TCC curve in the range of -55℃ to 150℃ can become flatter, especially when the addition amount is 0.45mol%. And 0.60mol% Sc 2 O 3 multilayer ceramic capacitors. When the addition amount of MgO is 1.00 mol%, the TCC curve from -55°C to 25°C has an enhanced stabilization effect. Therefore, the addition of Sc 2 O 3 has a good stabilizing effect on the dielectric temperature characteristics of BaTiO 3 . In particular, the influence of the TCC curve from 25°C to 150°C is more obvious.
再者,當Sc2O3添加量分別為0.45mol%和0.60mol%時,其介電常數分別為1744、1675,介電損耗(tanδ)分別為0.58%、0.59%,量測溫度-55℃的TCC分別為-3.9%、-2.1%和150℃的TCC分別為-8.5%、-11.6%,室溫25℃的電阻係數分別達到2.8×1012Ω-cm、3.3×1012Ω-cm和
高溫150℃的電阻係數分別達到1.7×1011Ω-cm、4.3×1011Ω-cm,所有相關組成配比的TCC曲線皆可符合EIA-X8R所定義之應用規範,且具有良好的絕緣特性。
Furthermore, when the addition amount of Sc 2 O 3 is 0.45 mol% and 0.60 mol%, the dielectric constant is 1744 and 1675, the dielectric loss (tanδ) is 0.58%, 0.59%, and the measurement temperature is -55 The TCC at ℃ is -3.9%, -2.1%, and the TCC at 150℃ is -8.5%, -11.6%, and the resistivity at room temperature 25℃ is 2.8×10 12 Ω-cm, 3.3×10 12 Ω- The resistivity of cm and
在本實施例中,上述積層陶瓷電容器使用之介電陶瓷材料共摻雜0.45mol% Sc2O3和1.00mol% MgO具有最佳之介電特性,並於量測溫度-55℃至150℃區間的介電常數(K值)變化率穩定維持在±10%範圍內,符合EIA-X8R規範,其介電常數為1744,介電損耗(tanδ)為0.58%,量測溫度-55℃的TCC為-3.9%和150℃的TCC為-8.5%,室溫25℃的電阻係數達到2.8×1012Ω-cm和高溫150℃的電阻係數達到1.7×1011Ω-cm。然而,本發明實施例所製備之積層陶瓷電容器為利用控制Sc2O3的添加量對BaTiO3基材進行改質,使BaTiO3晶粒產生核-殼結構,並在燒結反應的過程中Sc2O3添加具有抑制BaTiO3晶粒成長之功效,且可有效提升其絕緣特性,由於Sc2O3添加量甚少並不大於1.00mol%,其材料成份的組成簡單且含量的佔比稀少,即可簡化生產製程及降低Sc2O3的使用量以低成本得到應用於卑金屬電極製程並符合EIA-X8R規範之介電陶瓷材料組成。 In this embodiment, the dielectric ceramic materials used in the above multilayer ceramic capacitors are doped with 0.45mol% Sc 2 O 3 and 1.00mol% MgO to have the best dielectric properties, and the measurement temperature is -55℃ to 150℃ The rate of change of the dielectric constant (K value) of the interval is maintained within ±10%, which conforms to the EIA-X8R specification. The dielectric constant is 1744, the dielectric loss (tanδ) is 0.58%, and the measurement temperature is -55℃. The TCC is -3.9% and the TCC at 150°C is -8.5%, the resistivity at 25°C at room temperature reaches 2.8×10 12 Ω-cm and the resistivity at 150°C at high temperature reaches 1.7×10 11 Ω-cm. However, the multilayer ceramic capacitor prepared in the embodiment of the present invention uses the control of the addition amount of Sc 2 O 3 to modify the BaTiO 3 substrate, so that the BaTiO 3 grains have a core-shell structure, and Sc 2 O 3 is in the process of the sintering reaction. The addition of 2 O 3 has the effect of inhibiting the growth of BaTiO 3 grains, and can effectively improve its insulation properties. Because the amount of Sc 2 O 3 added is very small and not more than 1.00 mol%, the composition of the material components is simple and the content is rare , Which can simplify the production process and reduce the amount of Sc 2 O 3 used to obtain a dielectric ceramic material composition that is applied to the base metal electrode process and meets the EIA-X8R specification at a low cost.
請同時參閱第4~5圖所示,係分別為本發明實施例使用之介電陶瓷材料配比參數與介電特性的數據表(二)及實施例之介電溫度特性量測圖(二),由圖中可清楚看出,當Sc2O3的添加量介於0.60mol%至1.00mol%之間時,即使是添加有0mol% MgO的積層陶瓷電容器,所有相關組成配比的TCC曲線皆可符合EIA-X8R所定義之應用規範。由於添加0.45mol%以上的Sc2O3可使BaTiO3的晶粒產生核-殼結構,並在量測溫度-55℃至150℃的範圍內可有效地抑制TCC曲線的峰值。而MgO的添加則 是對於-55℃至25℃區間的TCC曲線具有加強穩定化的效果,當MgO的添加量介於0.50mol%至2.00mol%之間時皆有相同趨勢的影響,其中積層陶瓷電容器之介電損耗(tanδ)從含量為0mol% MgO的0.76%急遽下降到含量為2.00mol% MgO的0.56%。很明顯,Sc2O3添加的含量對於積層陶瓷電容器的介電常數、TCC曲線等介電溫度特性的穩定性為關鍵性的要素,且MgO的存在有利於提高BaTiO3的緻密度和降低介電損耗,以及提高低溫(-55℃)的TCC值(從-2.1%提高至-0.2%)。特別是當Sc2O3達到0.60mol%以上時,不同含量的MgO對於TCC曲線的影響將變得相當不明顯,這也顯示了Sc2O3的添加除了提高了BaTiO3的介電特特性對於溫度的穩定性,亦提高了BaTiO3對於化學成分組成的穩定性,由此可見本發明內容極具有產業利用性之重要價值。 Please refer to Figures 4 to 5 at the same time, which are the data table (2) of the dielectric ceramic material ratio parameters and dielectric characteristics used in the embodiment of the present invention and the measurement diagram of the dielectric temperature characteristics of the embodiment (2) ), it can be clearly seen from the figure that when the addition amount of Sc 2 O 3 is between 0.60mol% and 1.00mol%, even if it is a multilayer ceramic capacitor with 0mol% MgO added, all relevant composition ratios of TCC The curves can all meet the application specifications defined by EIA-X8R. Adding more than 0.45 mol% of Sc 2 O 3 can produce a core-shell structure in the BaTiO 3 grains, and can effectively suppress the peak of the TCC curve within the measurement temperature range of -55°C to 150°C. The addition of MgO has the effect of strengthening the stabilization of the TCC curve in the range of -55℃ to 25℃. When the addition amount of MgO is between 0.50mol% and 2.00mol%, it has the same trend of influence. The dielectric loss (tanδ) of ceramic capacitors dropped sharply from 0.76% of 0mol% MgO to 0.56% of 2.00mol% MgO. Obviously, the added content of Sc 2 O 3 is a key element for the stability of the dielectric constant, TCC curve and other dielectric temperature characteristics of multilayer ceramic capacitors, and the presence of MgO is beneficial to increase the density of BaTiO 3 and reduce the dielectric Electricity loss, and increase the low temperature (-55℃) TCC value (from -2.1% to -0.2%). Especially when Sc 2 O 3 reaches 0.60 mol% or more, the influence of different content of MgO on the TCC curve will become quite insignificant. This also shows that the addition of Sc 2 O 3 improves the dielectric properties of BaTiO 3 The stability of temperature also improves the stability of BaTiO 3 to chemical composition. It can be seen that the content of the present invention is extremely valuable for industrial applicability.
換句話說,發明人有鑑於先前技術礙於製備介電陶瓷時因為添加Sc2O3對BaTiO3進行改質存在諸多困難,尤其另得添加如La2O3、Co3O4或NiO等化合物造成製造變異性問題等,遂積極研究以微量Sc2O3(0.3~1.00mol%)及MgO元素(0~2.0mol%),並透過對晶格內微觀擴散行為的巧妙控制,使生產製程得以簡化並最終滿足X8R規範要求。當Sc2O3介於0.45~1.00mol%時,可使BaTiO3晶粒形成具濃度梯度的核-殼結構並具有穩定的介電特性。以Sc2O3為0.60mol%為例,無論MgO添加量多寡,整體TCC曲線於-55℃~150℃溫度區間有幾乎有重疊趨勢,倘再進一步檢視TCC曲線之低溫端(-55℃至25℃)或高溫端(25℃至150℃)則係相當優異的平滑曲線。相反地,當Sc2O3不足0.45mol%時,因為晶粒沒有形成具濃度梯度的核-殼結構,故得巧妙控制微量Sc2O3及MgO之間組 成比例,始能順利滿足X8R規範,以Sc2O3為0.30mol%為例,因為MgO的添加對於-55℃至25℃區間的TCC曲線具有穩定化效果,此結果順利使介電陶瓷符合X8R規範,其介電常數甚至較其他具濃度梯度的核-殼結構者優異。另外,本發明不限於前述所揭露之各圖式或數據表的試驗數值,尤其本領域之人可以「外插法(extrapolate)」將本發明所得數據間關係,改透過統計邏輯或趨勢推衍進一步計算出沒有被記載於本發明的具體試驗數值內,但其效果仍不背離本發明技術方案或範疇者,例如:改透過外插法發現微量Sc2O3向下控制到0.05mol%或許也會有相同效果。因此,縱使本發明未提出具體試驗數值,亦未曾對該些試驗數值進行深入闡述,但掌握Sc2O3或MgO微妙控制關係並輔以外插法等常見科學方法,所推衍得到結果仍然係屬於本發明技術方案或範疇。 In other words, the inventors considered that the prior art hindered the preparation of dielectric ceramics because of the difficulties in modifying BaTiO 3 by adding Sc 2 O 3 , especially adding La 2 O 3 , Co 3 O 4 or NiO. Compounds cause manufacturing variability problems, etc., so we actively researched the use of small amounts of Sc 2 O 3 (0.3~1.00mol%) and MgO elements (0~2.0mol%), and through clever control of the microscopic diffusion behavior in the crystal lattice, the production The process is simplified and finally meets the X8R specification requirements. When Sc 2 O 3 is between 0.45 and 1.00 mol%, BaTiO 3 grains can form a core-shell structure with a concentration gradient and have stable dielectric properties. Taking Sc 2 O 3 as 0.60 mol% as an example, no matter how much MgO is added, the overall TCC curve has an almost overlapping trend in the temperature range of -55℃~150℃. If you further examine the low temperature end of the TCC curve (-55℃ to 25°C) or the high temperature end (25°C to 150°C) is an excellent smooth curve. Conversely, when the Sc 2 O 3 is less than 0.45 mol%, because the crystal grains do not form a core-shell structure with a concentration gradient, the composition ratio between the trace Sc 2 O 3 and MgO must be skillfully controlled to successfully meet the X8R specification Taking Sc 2 O 3 as 0.30mol% as an example, because the addition of MgO has a stabilizing effect on the TCC curve between -55℃ and 25℃, this result smoothly makes the dielectric ceramic conform to the X8R specification, and its dielectric constant is even higher. Other core-shell structures with a concentration gradient are excellent. In addition, the present invention is not limited to the experimental values of the various graphs or data tables disclosed above. In particular, those in the field can "extrapolate" the relationship between the data obtained in the present invention by using statistical logic or trend derivation. It is further calculated that those that are not recorded in the specific experimental values of the present invention, but whose effects still do not deviate from the technical solution or scope of the present invention, for example: the extrapolation method is used to find that the trace amount of Sc 2 O 3 is controlled down to 0.05 mol%. Will have the same effect. Therefore, even though the present invention does not propose specific test values, nor has it elaborated on these test values in depth, but mastering the subtle control relationship of Sc 2 O 3 or MgO and supplementing common scientific methods such as extrapolation, the results derived are still consistent. It belongs to the technical scheme or category of the present invention.
本發明所提供之介電陶瓷材料與先前技術使用之介電陶瓷材料相比較時,具有下列各項優點: Compared with the dielectric ceramic materials used in the prior art, the dielectric ceramic material provided by the present invention has the following advantages:
(一)本發明實施例所製備之積層陶瓷電容器使用之介電陶瓷材料係由BaTiO3作為主成份,並添加不同含量的Sc2O3(0.30~1.00mol%)作為副成份對BaTiO3進行改質,在通過燒結反應的過程中,Sc2O3除了可使BaTiO3晶粒尺寸細化且粒度更均勻,並隨著Sc2O3添加具有抑制BaTiO3晶粒成長之功效及有效提升其絕緣特性,當Sc2O3達到0.45mol%以上時,可形成具濃度梯度的核-殼結構並大幅提高BaTiO3在-55℃至150℃的TCC曲線穩定性,以及所有相關組成配比的TCC曲線,皆可符合EIA-X8R之應用規範。 (1) The dielectric ceramic material used in the multilayer ceramic capacitor prepared in the embodiment of the present invention is made of BaTiO 3 as the main component, and different content of Sc 2 O 3 (0.30~1.00 mol%) is added as a secondary component to BaTiO 3 Modification, in the process of sintering reaction, Sc 2 O 3 can not only make the BaTiO 3 grain size finer and more uniform, and with the addition of Sc 2 O 3, it can inhibit the growth of BaTiO 3 grains and effectively improve it. Its insulating properties. When Sc 2 O 3 reaches 0.45 mol% or more, it can form a core-shell structure with a concentration gradient and greatly improve the stability of the TCC curve of BaTiO 3 at -55°C to 150°C, as well as all relevant composition ratios. All of the TCC curves can meet the application specifications of EIA-X8R.
(二)本發明上述積層陶瓷電容器所使用之介電陶瓷材料 除了可由BaTiO3添加不同含量的Sc2O3對BaTiO3進行改質,亦可適當添加MgO(0~2.00mol%),對於-55℃至25℃區間的TCC曲線具有加強穩定化效果,此種介電陶瓷材料配比組成的成份簡單且含量的佔比稀少,不但可降低Sc2O3的使用量,亦不須額外添加如La2O3、Co3O4及NiO等化合物,因此可有效降低材料配方的組成複雜性、成本及製造變異性的風險,進而得到應用於卑金屬電極製程並符合EIA-X8R規範之介電陶瓷材料。 (B) of the present invention, the above-described dielectric ceramic material used in the laminated ceramic capacitor may be formed in addition to BaTiO 3 was added different amounts of Sc 2 O 3 for a modified pair of BaTiO 3, may also be appropriately added MgO (0 ~ 2.00mol%), for - The TCC curve in the range of 55°C to 25°C has an enhanced stabilization effect. The composition of this dielectric ceramic material is simple and the content is rare. It can not only reduce the amount of Sc 2 O 3 used, but also does not require additional addition Compounds such as La 2 O 3 , Co 3 O 4 and NiO can effectively reduce the compositional complexity, cost and manufacturing variability of the material formulation, and then be applied to the base metal electrode process and meet the EIA-X8R specification. Electric ceramic materials.
(三)本發明使用之介電陶瓷材料最佳為BaTiO3共摻雜0.45mol% Sc2O3和1.00mol% MgO,其介電常數為1744,介電損耗為0.58%,-55℃的TCC為-3.9%和150℃的TCC為-8.5%,室溫電阻係數達到2.8×1012Ω-cm和高溫150℃電阻係數達到1.7×1011Ω-cm,則可有效改善積層陶瓷電容器介電溫度特性的穩定性。
(3) The best dielectric ceramic material used in the present invention is BaTiO 3 co-doped with 0.45 mol% Sc 2 O 3 and 1.00 mol% MgO, with a dielectric constant of 1744, a dielectric loss of 0.58%, and a temperature of -55℃ TCC is -3.9% and 150℃ TCC is -8.5%, room temperature resistivity reaches 2.8×10 12 Ω-cm and
上述詳細說明為針對本發明一種較佳之可行實施例說明而已,惟該實施例並非用以限定本發明之申請專利範圍,凡其他未脫離本發明所揭示之技藝精神下所完成之均等變化與修飾變更,均應包含於本發明所涵蓋之專利範圍中。 The above detailed description is for a preferred and feasible embodiment of the present invention. However, the embodiment is not intended to limit the scope of the patent application of the present invention. All other equal changes and modifications made without departing from the spirit of the technique disclosed in the present invention All changes shall be included in the scope of patent covered by the present invention.
綜上所述,本發明上述之電容器應用的介電陶瓷材料組成使用時為確實能達到其功效及目的,故本發明誠為一實用性優異之發明,實符合發明專利之申請要件,爰依法提出申請,盼 審委早日賜准本案,以保障發明人之辛苦發明,倘若 鈞局有任何的稽疑,請不吝來函指示,發明人定當竭力配合,實感德便。 In summary, the composition of the dielectric ceramic material used in the capacitor application of the present invention can indeed achieve its efficacy and purpose when used. Therefore, the present invention is truly an invention with excellent practicability, and it actually meets the requirements of an invention patent application. The application is filed, and I hope that the review committee will grant this case as soon as possible to protect the inventor’s hard work. If there is any doubt, please send me instructions. The inventor will do his best to cooperate and feel good.
Claims (9)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109117894A TWI748483B (en) | 2019-04-25 | 2019-04-25 | The composition of dielectric ceramic materials used in capacitors |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW109117894A TWI748483B (en) | 2019-04-25 | 2019-04-25 | The composition of dielectric ceramic materials used in capacitors |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202042405A true TW202042405A (en) | 2020-11-16 |
TWI748483B TWI748483B (en) | 2021-12-01 |
Family
ID=74201566
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109117894A TWI748483B (en) | 2019-04-25 | 2019-04-25 | The composition of dielectric ceramic materials used in capacitors |
Country Status (1)
Country | Link |
---|---|
TW (1) | TWI748483B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114763304A (en) * | 2021-01-14 | 2022-07-19 | 东莞华科电子有限公司 | Ceramic composition, ceramic sintered body, capacitor and method for producing capacitor |
US12100554B2 (en) | 2022-06-23 | 2024-09-24 | Walsin Technology Corporation | Ceramic composition, ceramic sintered body, capacitor and method for manufacturing the same |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3039417B2 (en) * | 1997-02-07 | 2000-05-08 | 株式会社村田製作所 | Multilayer ceramic capacitors |
JP4428187B2 (en) * | 2004-10-12 | 2010-03-10 | Tdk株式会社 | Dielectric ceramic composition and electronic component |
TW200839814A (en) * | 2007-03-14 | 2008-10-01 | Tdk Corp | Dielectric ceramic composition and electronic device |
WO2009041160A1 (en) * | 2007-09-26 | 2009-04-02 | Murata Manufacturing Co., Ltd. | Dielectric ceramic and laminated ceramic capacitor |
JP4999987B2 (en) * | 2008-03-24 | 2012-08-15 | 京セラ株式会社 | Multilayer ceramic capacitor |
-
2019
- 2019-04-25 TW TW109117894A patent/TWI748483B/en active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114763304A (en) * | 2021-01-14 | 2022-07-19 | 东莞华科电子有限公司 | Ceramic composition, ceramic sintered body, capacitor and method for producing capacitor |
US12100554B2 (en) | 2022-06-23 | 2024-09-24 | Walsin Technology Corporation | Ceramic composition, ceramic sintered body, capacitor and method for manufacturing the same |
Also Published As
Publication number | Publication date |
---|---|
TWI748483B (en) | 2021-12-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6223784B2 (en) | Dielectric ceramic composition and multilayer ceramic capacitor using the same | |
KR100632001B1 (en) | Glass compositions for low temperature sintering, glass frit, dielectric compositions and multilayer ceramic condenser using the same | |
CN105693236B (en) | Low temperature sintered dielectric composition and multilayer ceramic capacitor formed therefrom | |
JP5461774B2 (en) | Electronic component and manufacturing method thereof | |
WO2007026614A1 (en) | Dielectric ceramic, process for producing the same, and laminated ceramic capacitor | |
JP2008239407A (en) | Dielectric porcelain and multilayer ceramic capacitor | |
JP5077362B2 (en) | Dielectric ceramic and multilayer ceramic capacitor | |
JP5446880B2 (en) | Dielectric porcelain composition and electronic component | |
JPWO2018074290A1 (en) | Dielectric ceramic composition and ceramic electronic component | |
TWI748483B (en) | The composition of dielectric ceramic materials used in capacitors | |
CN115206679A (en) | Dielectric ceramic composition and application thereof | |
JP2004155649A (en) | Dielectric ceramic, method of producing the same, and multilayer ceramic capacitor | |
WO2009119614A1 (en) | Multilayer ceramic capacitor | |
JP2007169090A (en) | Dielectric ceramic composition and laminated ceramic capacitor using the same | |
JP4863007B2 (en) | Dielectric porcelain composition and electronic component | |
JP2006135138A (en) | Laminated ceramic capacitor | |
JP5151039B2 (en) | Dielectric ceramic, manufacturing method thereof, and multilayer ceramic capacitor | |
JP2014198660A (en) | Dielectric ceramic composition and multi-layer ceramic capacitor comprising the same | |
JP2009096671A (en) | Dielectric ceramic and multi-layer ceramic capacitor | |
JP2005170692A (en) | Dielectric ceramic composition, laminated ceramic capacitor using the same, and its manufacturing method | |
TWI749319B (en) | The composition of dielectric ceramic materials used in capacitors | |
CN102136310A (en) | Conductive paste and method for producing electronic components | |
KR100703080B1 (en) | Method for Manufacturing Dielectric Powder for Low Temperature Sintering and Method for Manufacturing Multilayer Ceramic Condenser Using the Same | |
JP2008230928A (en) | Dielectric ceramic composition and electronic component | |
JP2011207696A (en) | Dielectric ceramic composition and electronic component |