TW202041477A - Glass substrate conveying device, laminated glass manufacturing device, and laminated glass manufacturing method to provide a conveying device for glass substrate for suppressing breakage of the glass substrate when the glass substrate is separated from the roll - Google Patents
Glass substrate conveying device, laminated glass manufacturing device, and laminated glass manufacturing method to provide a conveying device for glass substrate for suppressing breakage of the glass substrate when the glass substrate is separated from the roll Download PDFInfo
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- TW202041477A TW202041477A TW109109002A TW109109002A TW202041477A TW 202041477 A TW202041477 A TW 202041477A TW 109109002 A TW109109002 A TW 109109002A TW 109109002 A TW109109002 A TW 109109002A TW 202041477 A TW202041477 A TW 202041477A
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- glass substrate
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- 239000000758 substrate Substances 0.000 title claims abstract description 157
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- 238000004519 manufacturing process Methods 0.000 title claims description 28
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- 230000008030 elimination Effects 0.000 claims abstract description 61
- 238000003379 elimination reaction Methods 0.000 claims abstract description 61
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- 238000004804 winding Methods 0.000 abstract description 37
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- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
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- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- GVFOJDIFWSDNOY-UHFFFAOYSA-N antimony tin Chemical compound [Sn].[Sb] GVFOJDIFWSDNOY-UHFFFAOYSA-N 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
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- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
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- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
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- 229910052749 magnesium Inorganic materials 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
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- 238000012986 modification Methods 0.000 description 1
- 229910052758 niobium Inorganic materials 0.000 description 1
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- WCNLCIJMFAJCPX-UHFFFAOYSA-N pethidine hydrochloride Chemical compound Cl.C=1C=CC=CC=1C1(C(=O)OCC)CCN(C)CC1 WCNLCIJMFAJCPX-UHFFFAOYSA-N 0.000 description 1
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- 229910052726 zirconium Inorganic materials 0.000 description 1
Images
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
- C03B35/14—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
- C03B35/16—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by roller conveyors
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/001—General methods for coating; Devices therefor
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
- C03B35/14—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
- C03B35/16—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by roller conveyors
- C03B35/167—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by roller conveyors specially adapted for removing defect sheets, ribbons or parts thereof
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B35/00—Transporting of glass products during their manufacture, e.g. hot glass lenses, prisms
- C03B35/14—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands
- C03B35/16—Transporting hot glass sheets or ribbons, e.g. by heat-resistant conveyor belts or bands by roller conveyors
- C03B35/18—Construction of the conveyor rollers ; Materials, coatings or coverings thereof
- C03B35/183—Construction of the conveyor rollers ; Materials, coatings or coverings thereof specially adapted for thermal adjustment of the rollers, e.g. insulating, heating, cooling thereof
- C03B35/184—Cooling
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
- C03C17/36—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal
- C03C17/3602—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer
- C03C17/3655—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions at least one coating being a metal the metal being present as a layer the multilayer coating containing at least one conducting layer
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C23/00—Other surface treatment of glass not in the form of fibres or filaments
- C03C23/0005—Other surface treatment of glass not in the form of fibres or filaments by irradiation
- C03C23/004—Other surface treatment of glass not in the form of fibres or filaments by irradiation by electrons, protons or alpha-particles
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/15—Deposition methods from the vapour phase
- C03C2218/151—Deposition methods from the vapour phase by vacuum evaporation
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/15—Deposition methods from the vapour phase
- C03C2218/154—Deposition methods from the vapour phase by sputtering
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Physical Vapour Deposition (AREA)
- Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
- Surface Treatment Of Glass (AREA)
Abstract
Description
本發明係關於一種玻璃基材之搬送裝置、積層玻璃之製造裝置、及積層玻璃之製造方法。The present invention relates to a conveying device for glass substrates, a manufacturing device for laminated glass, and a manufacturing method for laminated glass.
近年來,作為液晶顯示器、有機EL(Electroluminescence,電致發光)顯示器等圖像顯示裝置所具備之光學膜之撓性基材,就耐熱性等觀點而言,正逐步使用薄玻璃基材。具體而言,於薄玻璃基材形成銦錫氧化物(ITO)等透明導電層而成之透明導電性玻璃用作觸控面板膜。In recent years, as flexible substrates for optical films included in image display devices such as liquid crystal displays and organic EL (Electroluminescence) displays, thin glass substrates are gradually being used from the viewpoint of heat resistance and the like. Specifically, transparent conductive glass formed by forming a transparent conductive layer such as indium tin oxide (ITO) on a thin glass substrate is used as a touch panel film.
為了量產此種光學膜,採用輥對輥方式。即,利用驅動輥或導輥等輥搬送長條且撓性之薄玻璃基材,利用濺鍍法等成膜透明導電層等功能層,最後,將積層有功能層之積層玻璃捲繞成卷狀(參照專利文獻1)。 [先前技術文獻] [專利文獻]In order to mass produce this optical film, a roll-to-roll method is adopted. That is, a long and flexible thin glass substrate is transported by rollers such as a driving roller or a guide roller, and a functional layer such as a transparent conductive layer is formed by a sputtering method. Finally, the laminated glass with the functional layer is wound into a roll State (refer to Patent Document 1). [Prior Technical Literature] [Patent Literature]
[專利文獻1]日本專利特開2014-109073號公報[Patent Document 1] Japanese Patent Laid-Open No. 2014-109073
[發明所欲解決之問題][The problem to be solved by the invention]
然,於專利文獻1中,於功能層之成膜時存在以400℃以上之高溫進行加熱之情形,因此搬送中之薄玻璃基材於未積層保護材等之狀態下搬送及成膜。即,薄玻璃基材單獨被搬送及成膜。However, in
因此,薄玻璃基材與輥直接接觸。薄玻璃基材與先前之塑膠基材相比,表面較平滑,因此容易產生與輥密接之黏連現象。其結果,於薄玻璃基材與輥分離時,產生薄玻璃基材破損之擔憂。Therefore, the thin glass substrate is in direct contact with the roller. Compared with the previous plastic substrates, the thin glass substrate has a smoother surface, so it is prone to adhesion to the roller. As a result, when the thin glass substrate is separated from the roller, the thin glass substrate may be damaged.
本發明提供一種抑制玻璃基材之破損之玻璃基材之搬送裝置、積層玻璃之製造裝置、及積層玻璃之製造方法。 [解決問題之技術手段]The present invention provides a glass substrate conveying device, a laminated glass manufacturing device, and a laminated glass manufacturing method that suppress damage to the glass substrate. [Technical means to solve the problem]
本發明[1]包含一種玻璃基材之搬送裝置,其係搬送具有可撓性之玻璃基材之搬送裝置,且具備:第1輥,其將具備上述玻璃基材及保護材之搬送基材捲出;第2輥,其自上述玻璃基材捲取上述保護材;第3輥,其配置於上述第1輥之搬送方向下游側,捲取上述玻璃基材;及去靜電部,其配置於上述第1輥與上述第3輥之間。The present invention [1] includes a conveying device for a glass substrate, which is a conveying device for conveying a flexible glass substrate, and is provided with: a first roller for conveying the substrate with the glass substrate and protective material Winding out; a second roller, which winds the protective material from the glass substrate; a third roller, which is arranged on the downstream side of the conveying direction of the first roller, and winds up the glass substrate; and a static elimination part, which is arranged Between the first roller and the third roller.
根據該玻璃基材之搬送裝置,於第1輥及第3輥之間具備去靜電部,因此,可去除玻璃基材所帶之電。因此,於玻璃基材與導輥等輥接觸時,可抑制由帶電所導致之玻璃基材與輥之密接(黏連)。因此,於玻璃基材與輥分離時,可減輕玻璃基材之負荷,可抑制玻璃基材之破損。According to the conveying device for the glass substrate, the static elimination part is provided between the first roller and the third roller, so that the electricity charged by the glass substrate can be removed. Therefore, when the glass substrate is in contact with a roller such as a guide roller, it is possible to suppress the adhesion (adhesion) between the glass substrate and the roller caused by electrification. Therefore, when the glass substrate is separated from the roller, the load on the glass substrate can be reduced, and the damage of the glass substrate can be suppressed.
本發明[2]包含如[1]中記載之玻璃基材之搬送裝置,其進而具備驅動輥,且上述去靜電部配置於上述驅動輥之搬送方向下游側。The present invention [2] includes the glass substrate conveying device as described in [1], which further includes a driving roller, and the static elimination unit is arranged on the downstream side of the conveying direction of the driving roller.
根據該玻璃基材之搬送裝置,其具備驅動輥,因此,可確實且連續地搬送玻璃基材。又,去靜電部配置於驅動輥之下游側,因此,可對因與驅動輥之接觸而產生之玻璃基材之帶電進行去靜電,其結果,可抑制因驅動輥所致之玻璃基材之破損。According to this glass substrate conveying device, which is provided with a drive roller, the glass substrate can be conveyed reliably and continuously. In addition, the destaticizing part is arranged on the downstream side of the driving roller. Therefore, the electrification of the glass substrate caused by the contact with the driving roller can be destaticized. As a result, the glass substrate caused by the driving roller can be suppressed. damaged.
本發明[3]包含一種積層玻璃之製造裝置,其具備:如[1]或[2]中記載之搬送裝置;及成膜裝置,其配置於上述第1輥與上述第3輥之間,在真空下於上述玻璃基材設置功能層。The present invention [3] includes a manufacturing apparatus for laminated glass, which includes: a conveying device as described in [1] or [2]; and a film forming device arranged between the first roller and the third roller, A functional layer is provided on the glass substrate under vacuum.
根據該積層玻璃基材之搬送裝置,其具備上述搬送裝置及成膜裝置,因此,可抑制玻璃基材之破損地,於玻璃基材設置功能層。因此,可確實地製造積層玻璃。According to the conveying device for the laminated glass substrate, the conveying device and the film forming device are provided, and therefore, the glass substrate can be prevented from being damaged and the functional layer can be provided on the glass substrate. Therefore, laminated glass can be manufactured reliably.
本發明[4]包含如[3]中記載之積層玻璃之製造裝置,其中上述去靜電部具有第1去靜電部及第2去靜電部,上述第1去靜電部設置於上述成膜裝置之搬送方向上游側,上述第2去靜電部設置於上述成膜裝置之搬送方向下游側。The present invention [4] includes the manufacturing apparatus for laminated glass as described in [3], wherein the static elimination part has a first static elimination part and a second static elimination part, and the first static elimination part is provided in the film forming apparatus. On the upstream side in the conveying direction, the second static elimination unit is provided on the downstream side in the conveying direction of the film forming apparatus.
根據該積層玻璃之搬送裝置,於成膜裝置之上游側及下游側具備去靜電部(第1去靜電部或第2去靜電部),因此,可抑制成膜前後之玻璃基材之帶電。因此,可更確實地抑制玻璃基材之破損。According to the conveying device of the laminated glass, the static elimination part (the first static elimination part or the second static elimination part) is provided on the upstream side and the downstream side of the film forming device. Therefore, it is possible to suppress the electrification of the glass substrate before and after the film formation. Therefore, the damage of the glass substrate can be suppressed more reliably.
本發明[5]包含一種積層玻璃之製造方法,其依序具備:準備步驟,其係準備具備具有可撓性之玻璃基材及保護材之搬送基材;剝離步驟,其係自上述玻璃基材剝離上述保護材;及成膜步驟,其係在真空下於上述玻璃基材設置功能層;且於上述成膜步驟之前及/或後具備將上述玻璃基材去靜電之去靜電步驟。The present invention [5] includes a manufacturing method of laminated glass, which sequentially includes: a preparation step, which prepares a conveying substrate with a flexible glass substrate and a protective material; and a peeling step, which is derived from the above glass substrate The protective material is peeled off from the protective material; and the film forming step is to provide a functional layer on the glass substrate under vacuum; and before and/or after the film forming step, an antistatic step for removing static electricity from the glass substrate is provided.
根據該積層玻璃之製造方法,可將玻璃基材去靜電,因此可去除玻璃基材所帶之電。因此,可抑制玻璃基材與輥接觸時之黏連,可減輕其等分離時之負荷。因此,可抑制玻璃基材之破損地,於玻璃基材設置功能層。結果,可確實地製造積層玻璃。According to the manufacturing method of the laminated glass, the glass substrate can be destaticized, and therefore the electricity charged by the glass substrate can be removed. Therefore, the adhesion between the glass substrate and the roll can be suppressed, and the load during separation can be reduced. Therefore, it is possible to provide a functional layer on the glass substrate while preventing damage to the glass substrate. As a result, laminated glass can be manufactured reliably.
本發明[6]包含如[5]中記載之積層玻璃之製造方法,其中上述去靜電步驟至少於上述成膜步驟之前實施。The present invention [6] includes the method for manufacturing laminated glass as described in [5], wherein the above-mentioned destaticizing step is carried out at least before the above-mentioned film forming step.
根據該積層玻璃之製造方法,於成膜前將玻璃基材去靜電,因此可抑制成膜前之玻璃基材之破損。According to the manufacturing method of the laminated glass, the glass substrate is destaticized before the film formation, so that the damage of the glass substrate before the film formation can be suppressed.
本發明[7]包含如[5]或[6]中記載之積層玻璃之製造方法,其中上述去靜電步驟於上述成膜步驟之前及之後實施。The present invention [7] includes the manufacturing method of laminated glass as described in [5] or [6], wherein the above-mentioned destaticizing step is performed before and after the above-mentioned film forming step.
根據該積層玻璃之製造方法,於成膜步驟之前後兩者實施去靜電步驟,因此,可抑制成膜前後之玻璃基材之帶電。因此,可更確實地抑制玻璃基材之破損。 [發明之效果]According to the manufacturing method of the laminated glass, the static elimination step is performed before and after the film formation step, and therefore, the electrification of the glass substrate before and after the film formation can be suppressed. Therefore, the damage of the glass substrate can be suppressed more reliably. [Effects of Invention]
根據本發明之玻璃基材之搬送裝置,可抑制玻璃基材之破損地搬送玻璃基材。又,根據本發明之積層玻璃之製造裝置及使用其之製造方法,可抑制玻璃基材之破損地製造積層玻璃。According to the glass substrate conveying device of the present invention, the glass substrate can be conveyed while suppressing damage to the glass substrate. Furthermore, according to the manufacturing apparatus of the laminated glass of the present invention and the manufacturing method using the same, the laminated glass can be manufactured while suppressing the damage of the glass substrate.
1.搬送成膜裝置
參照圖1,對作為本發明之製造裝置之一實施形態之搬送成膜裝置10進行說明。1. Transport the
圖1所示之搬送成膜裝置10搬送玻璃基材1,並且於其厚度方向一面設置透明導電層(功能層之一例)2,而製造透明導電性玻璃(積層玻璃之一例)3。具體而言,搬送成膜裝置10自卷狀搬送基材4將第1保護材5(保護材之一例)剝離,而搬送玻璃基材1單獨體,其次,於玻璃基材1設置透明導電層2而製造透明導電性玻璃3,其次,於透明導電性玻璃3積層第2保護材6並捲繞成卷狀。The transport film-forming
搬送成膜裝置10具備搬送裝置11、濺鍍裝置(成膜裝置之一例)12及冷卻裝置13。搬送裝置11具備捲出部14、去靜電部15及捲取部16。去靜電部15具備第1去靜電部17及第2去靜電部18。具體而言,搬送成膜裝置10自搬送方向上游側(以下,省略為「上游側」)朝向搬送方向下游側(以下,省略為「下游側」)依序具備捲出部14、第1去靜電部17、濺鍍裝置12、冷卻裝置13、第2去靜電部18及捲取部16。以下,對其等進行詳述。The transport
捲出部14配置於搬送裝置11中之最上游側,將長條之搬送基材4捲出。The
捲出部14具備捲出輥(第1輥之一例)21、第1驅動輥(驅動輥之一例)22、保護材捲取輥(第2輥之一例)23及捲出殼體24。The
於捲出輥21,設置卷狀搬送基材4。即,於捲出輥21之周面,捲繞有於搬送方向上為長條之搬送基材4。捲出輥21係具有朝搬送方向旋轉之旋轉軸且於寬度方向上延伸之圓柱構件。再者,於本說明書中,下述各種輥(捲出輥21、第1~2驅動輥(22、40)、保護材捲取輥23、第1~5導輥(26、28、31、38、43)、第1~2冷卻輥(34、35)、捲取輥41、保護材捲出輥42、夾輥44)均為具有朝搬送方向旋轉之旋轉軸且於寬度方向上延伸之圓柱構件。The
又,捲出輥21以利用外部動力等驅動,且能夠於圖1所示之箭頭方向上旋轉之方式構成。即,捲出輥21、驅動輥之構成均於第1驅動輥22中詳述。In addition, the unwinding
第1驅動輥22對設置於捲出輥21之搬送基材4之玻璃基材1賦予用以向下游側捲出之動力。即,將玻璃基材1自捲出輥21捲出,而搬送至第1去靜電部17。The
第1驅動輥22以利用外部動力等驅動,且能夠朝圖1所示之箭頭方向旋轉之方式構成。具體而言,於第1驅動輥22之旋轉軸之端部,設置有齒輪(未圖示),於齒輪,連接有用以使第1驅動輥22朝箭頭方向旋轉之馬達(未圖示)。第1驅動輥22利用馬達之驅動力旋轉。The
保護材捲取輥23自搬送基材4剝離第1保護材5,並且捲取第1保護材5。保護材捲取輥23配置於捲出輥21之附近。保護材捲取輥23為驅動輥,以利用外部動力等驅動,且能夠朝圖1所示之箭頭方向旋轉之方式構成。The protective
捲出殼體24於其內部收容捲出輥21、第1驅動輥22及保護材捲取輥23。The unwinding
捲出殼體24以能夠將其內部調節為真空狀態之方式構成。具體而言,於捲出殼體24,連接有將其內部之空氣排出至外部之真空泵(未圖示)。再者,於本說明書中,真空狀態例如係指氣壓為0.1 Pa以下、較佳為1×10-3
Pa以下之狀態。The roll-out
第1去靜電部17以與捲出部14相鄰之方式配置於捲出部14之下游側。第1去靜電部17對玻璃基材1進行去靜電。The first static elimination part 17 is arranged on the downstream side of the unwinding
第1去靜電部17具備第1去靜電機25、第1導輥26、及第1去靜電罩殼27。The first static elimination unit 17 includes a first
第1去靜電機25使玻璃基材1所帶之電減少。第1去靜電機25配置於第1驅動輥22之下游側且第1導輥26之上游側。The first
作為第1去靜電機25,例如可列舉電暈放電式去靜電機、電離輻射線式去靜電機等。As the first
電暈放電式去靜電機藉由電暈放電使空氣離子化,使離子化之空氣與玻璃基材1接觸,藉此進行去靜電。作為電暈放電式去靜電機,例如可為電壓施加式及自放電式之任一者。The corona discharge type static elimination machine ionizes the air by corona discharge, and makes the ionized air contact the
電離輻射線式去靜電機例如藉由使軟X射線、α粒子、紫外線等電離輻射線與玻璃基材1接觸而進行去靜電。The ionizing radiation type destaticizer performs destaticizing by, for example, contacting ionizing radiation such as soft X-rays, alpha particles, and ultraviolet rays with the
第1導輥26將自第1驅動輥22通過第1去靜電機25搬送之玻璃基材1導引至濺鍍裝置12之第2導輥28。第1導輥26配置於第1去靜電機25之下游側且第2導輥28之上游側。The
第1去靜電罩殼27於其內部收容第1去靜電機25及第1導輥26。第1去靜電罩殼27以能夠將其內部調節為真空狀態之方式構成。The first
濺鍍裝置12以與第1去靜電部17相鄰之方式配置於第1去靜電部17之下游側。濺鍍裝置12於成膜區域33(成膜室)對玻璃基材1實施濺鍍,形成透明導電層2。The sputtering
濺鍍裝置12具備第2導輥28、濺鍍靶29、加熱機30、第3導輥31、及濺鍍罩殼32。The sputtering
第2導輥28將自第1導輥26搬送之玻璃基材1導引至成膜區域33。第2導輥28配置於第1導輥26之下游側且濺鍍靶29之上游側。The
濺鍍靶29為透明導電層2之原材料。濺鍍靶29與玻璃基材1空開間隔地對向配置於第2導輥28之下游側且第3導輥31之上游側。The
作為濺鍍靶29之材料,例如可列舉包含選自由In、Sn、Zn、Ga、Sb、Nb、Ti、Si、Zr、Mg、Al、Au、Ag、Cu、Pd、W所組成之群中之至少1種金屬之金屬氧化物。As the material of the
具體而言,例如可列舉銦錫複合氧化物(ITO)等含銦之氧化物,例如可列舉銻錫複合氧化物(ATO)等含銻之氧化物等,較佳可列舉含銦之氧化物,更佳可列舉ITO。Specifically, for example, indium-containing oxides such as indium tin composite oxide (ITO) can be cited, for example, antimony-containing oxides such as antimony tin composite oxide (ATO) can be cited, and indium-containing oxides are preferably cited. ITO is more preferable.
加熱機30對玻璃基材1或其後獲得之透明導電性玻璃3進行加熱。其於第2導輥28之下游側且第3導輥31之上游側,與玻璃基材1空開間隔地配置。又,加熱機30以玻璃基材1為基準,對向配置於濺鍍靶29之相反側。The
成膜區域33劃分為第2導輥28與第3導輥31之間之搬送方向中途,於成膜區域33配置有濺鍍靶29及加熱機30。The
第3導輥31將成膜之玻璃基材1(即,透明導電性玻璃3)導引至冷卻裝置13之第1冷卻輥34。第3導輥31配置於濺鍍靶29之下游側且第1冷卻輥34(下述)之上游側。The
濺鍍罩殼32收容第2導輥28、濺鍍靶29、加熱機30及第3導輥31。濺鍍罩殼32以能夠將其內部調節為真空狀態之方式構成。The sputtering cover 32 houses the
再者,濺鍍裝置12未圖示,但具備用以實施濺鍍之其他元件(陽極、陰極、Ar氣體導入機構等)。In addition, the sputtering
作為濺鍍裝置12,具體而言,例如可列舉雙極型濺鍍裝置、電子迴旋共振型濺鍍裝置、磁控型濺鍍裝置、離子束型濺鍍裝置等。Specific examples of the sputtering
冷卻裝置13以與濺鍍裝置12相鄰之方式配置於濺鍍裝置12之下游側。冷卻裝置13使於濺鍍裝置12中加熱之透明導電性玻璃3冷卻。The
冷卻裝置13具備第1冷卻輥34、第2冷卻輥35及冷卻殼體36。The
第1冷卻輥34於冷卻裝置13中配置於上游側,第2冷卻輥35配置於第1冷卻輥34之下游側。又,第1冷卻輥34及第2冷卻輥35分別亦為驅動輥。The
第1冷卻輥34及第2冷卻輥35之表面溫度以能夠維持於例如280℃以下,較佳為150℃以下,又,例如為40℃以上,較佳為100℃以上之方式構成。The surface temperature of the
冷卻殼體36於其內部收容第1冷卻輥34及第2冷卻輥35。冷卻殼體36以能夠將其內部調節為真空狀態之方式構成。The cooling
第2去靜電部18以與冷卻裝置13相鄰之方式配置於冷卻裝置13之下游側。第2去靜電部18對透明導電性玻璃3進行去靜電。The second static elimination unit 18 is arranged on the downstream side of the
第2去靜電部18具備第2去靜電機37、第4導輥38、及第2去靜電罩殼39。The second static elimination unit 18 includes a second
第2去靜電機37使玻璃基材1所帶之電減少。第2去靜電機37配置於第2冷卻輥35之下游側且第3導輥31之上游側。作為第2去靜電機37之具體例,可列舉與第1去靜電機25相同者。The second
第4導輥38將自第2冷卻輥35通過第2去靜電機37搬送之透明導電性玻璃3導引至捲取部16之第2驅動輥40。第4導輥38配置於第2去靜電機37之下游側且第2驅動輥40之上游側。The
第2去靜電罩殼39於其內部收容第2去靜電機37及第4導輥38。第2去靜電罩殼39以能夠將其內部調節為真空狀態之方式構成。The second
捲取部16於搬送裝置11中配置於最下游側,且以與第2去靜電機37相鄰之方式配置於第2去靜電機37之下游側。捲取部16將透明導電性玻璃3與第2保護材6一起進行捲取。The winding
捲取部16具備第2驅動輥40、捲取輥(第3輥之一例)41、保護材捲出輥42、第5導輥43、夾輥44、及捲取罩殼45。The winding
第2驅動輥40對自第2去靜電部18搬送之透明導電性玻璃3賦予用以向下游側捲出之動力。即,第2驅動輥40將透明導電性玻璃3導引至捲取輥41。The
捲取輥41對自第5導輥43與夾輥44之間搬送之透明導電性玻璃3及第2保護材6之積層體7進行捲取。捲取輥41亦為驅動輥。The winding
於保護材捲出輥42設置有卷狀第2保護材6。即,於保護材捲出輥42之周面,捲繞有於搬送方向上為長條之第2保護材6。保護材捲出輥42為驅動輥,將第2保護材6捲出至第5導輥43。The second protective material 6 in a rolled form is provided on the protective
第5導輥43將自保護材捲出輥42捲出之第2保護材6導引至夾輥44。第5導輥43配置於保護材捲出輥42與夾輥44之搬送方向中途。The
夾輥44與第2驅動輥40一起使第2保護材6積層於透明導電性玻璃3。夾輥44與第2驅動輥40空開少許間隔而對向配置。The
捲取罩殼45於其內部收容第2驅動輥40、捲取輥41、保護材捲出輥42、第5導輥43及夾輥44。捲取罩殼45以能夠將其內部調節為真空狀態之方式構成。The winding
2.透明導電性玻璃之製造方法
參照圖1及圖2,對使用搬送成膜裝置10製造透明導電性玻璃3之方法進行說明。透明導電性玻璃3之製造方法依序具備:準備步驟,其係準備搬送基材4;剝離步驟,其係自玻璃基材1剝離第1保護材5;第1去靜電步驟,其係對玻璃基材1進行去靜電;成膜步驟,其係在真空下於玻璃基材1設置透明導電層2;冷卻步驟,其係將透明導電性玻璃3冷卻;第2去靜電步驟,其係對透明導電性玻璃3進行去靜電;及捲取步驟,其係將透明導電性玻璃3捲取至捲取輥41。以下,對各步驟進行詳述。2. Manufacturing method of transparent
首先,於捲出輥21準備搬送基材4(準備步驟)。具體而言,準備搬送基材4,設置於捲出輥21。First, the
搬送基材4於厚度方向上具備玻璃基材1及第1保護材5(參照圖2A)。即,搬送基材4為附保護材之玻璃基材。搬送基材4於搬送方向上為長條,而捲繞成卷狀。此種卷狀搬送基材4可使用公知或市售者。The conveying
玻璃基材1具有膜形狀(包含薄片形狀),由透明玻璃形成。作為玻璃,例如可列舉無鹼玻璃、鈉玻璃、硼矽酸玻璃、鋁矽酸玻璃等。The
玻璃基材1具有可撓性,其厚度例如為250 μm以下,較佳為100 μm以下,且例如為10 μm以上,較佳為40 μm以上。The
第1保護材5於捲出卷狀玻璃基材1時,防止由玻璃基材1彼此之接觸所導致之破損。第1保護材5具有膜形狀,配置於玻璃基材1之厚度方向一面。The first
作為第1保護材5,例如可列舉附黏著劑之膜、間隔紙等。As the first
附黏著劑之膜於厚度方向上具備高分子膜及黏著劑層。The adhesive film has a polymer film and an adhesive layer in the thickness direction.
作為高分子膜,例如可列舉聚酯系膜(聚對苯二甲酸乙二酯膜、聚對苯二甲酸丁二酯膜、聚萘二甲酸乙二酯膜等)、聚碳酸酯系膜、烯烴系膜(聚乙烯膜、聚丙烯膜、環烯烴膜等)、丙烯酸系膜、聚醚碸系膜、聚芳酯系膜、三聚氰胺系膜、聚醯胺系膜、聚醯亞胺系膜、纖維素系膜、聚苯乙烯系膜。Examples of polymer films include polyester films (polyethylene terephthalate films, polybutylene terephthalate films, polyethylene naphthalate films, etc.), polycarbonate films, Olefin-based film (polyethylene film, polypropylene film, cycloolefin film, etc.), acrylic film, polyether-based film, polyarylate-based film, melamine-based film, polyamide-based film, polyimide-based film , Cellulose film, polystyrene film.
黏著劑層為感壓接著劑層,例如可列舉丙烯酸系黏著劑層、橡膠系黏著劑層、聚矽氧系黏著劑層、聚酯系黏著劑層、聚胺基甲酸酯系黏著劑層、聚醯胺系黏著劑層、環氧系黏著劑層、乙烯基烷基醚系黏著劑層、氟系黏著劑層等。The adhesive layer is a pressure sensitive adhesive layer, for example, acrylic adhesive layer, rubber adhesive layer, silicone adhesive layer, polyester adhesive layer, polyurethane adhesive layer , Polyamide-based adhesive layer, epoxy-based adhesive layer, vinyl alkyl ether-based adhesive layer, fluorine-based adhesive layer, etc.
作為間隔紙,例如可列舉道林紙、日本紙、牛皮紙、玻璃紙、合成紙、面漆紙等。As the spacer paper, for example, Dolin paper, Japanese paper, kraft paper, cellophane, synthetic paper, top coat paper, etc. can be cited.
第1保護材5之厚度例如為10 μm以上,較佳為30 μm以上,又,例如為1000 μm以下,較佳為500 μm以下。The thickness of the first
其次,使搬送成膜裝置10作動。具體而言,將各種殼體(捲出殼體24、第1去靜電罩殼27、第2去靜電罩殼39、捲取罩殼45)全部調整為真空,並且使各種驅動輥(捲出輥21、第1~2驅動輥(22、40)、保護材捲取輥23、第1~5導輥(26、28、31、38、43)、第1~2冷卻輥(34、35)、捲取輥41、保護材捲出輥42、夾輥44))全部旋轉驅動。又,亦使去靜電部15(第1去靜電機25及第2去靜電機37)、冷卻裝置13、濺鍍裝置12等作動。藉此,搬送基材4被搬送至下游側,並且依序實施剝離步驟、第1去靜電步驟、成膜步驟、冷卻步驟、第2去靜電步驟、及捲取步驟。Next, the transport
具體而言,於捲出部14,搬送基材4自捲出輥21捲出。此時,自搬送基材4之玻璃基材1剝離第1保護材5。第1保護材5被捲取至保護材捲取輥23,玻璃基材1單獨朝第1驅動輥22搬送(參照圖2B)。Specifically, in the unwinding
其後,玻璃基材1係其厚度方向一面與第1驅動輥22直接接觸,自捲出部14搬送至第1去靜電部17。此時,由於第1驅動輥22之驅動力及摩擦力,而於玻璃基材1之厚度方向一面產生帶電。After that, the
於第1去靜電部17中,玻璃基材1藉由第1去靜電機25之作動而去靜電。即,玻璃基材1攜帶之電量減少。此時,第1去靜電部17自玻璃基材1之厚度方向一側進行去靜電,以便將玻璃基材1之厚度方向一面去靜電。In the first destaticizing part 17, the
其後,經去靜電之玻璃基材1被導引至第1導輥26,而搬送至濺鍍裝置12。After that, the
於濺鍍裝置12中,玻璃基材1經第2導輥28導引而搬送至成膜區域33。於成膜區域33中,對玻璃基材1實施濺鍍。In the
濺鍍係藉由供給氣體並且自電源施加電壓,而使氣體離子加速,照射至濺鍍靶29,自濺鍍靶29表面濺出靶材料,使該靶材料積層於玻璃基材1之表面。In sputtering, gas is supplied and a voltage is applied from a power supply to accelerate gas ions and irradiate the
作為濺鍍,具體而言,可列舉雙極濺鍍法、電子迴旋共振濺鍍法、磁控濺鍍法、離子束濺鍍法等。Specific examples of sputtering include bipolar sputtering, electron cyclotron resonance sputtering, magnetron sputtering, ion beam sputtering, and the like.
作為濺鍍所使用之氣體(即,要導入至成膜區域33之氣體),例如可列舉氬氣(Ar)等惰性氣體。較佳為可併用氧氣等反應性氣體。As the gas used for sputtering (that is, the gas to be introduced into the film formation region 33), for example, an inert gas such as argon (Ar) can be cited. Preferably, a reactive gas such as oxygen can be used in combination.
濺鍍時之氣壓(即,成膜區域33之氣壓)為真空,較佳為未達1.0 Pa,更佳為0.5 Pa以下。The air pressure during sputtering (that is, the air pressure of the film formation region 33) is a vacuum, preferably less than 1.0 Pa, more preferably 0.5 Pa or less.
藉此,於成膜區域33中,於玻璃基材1之厚度方向一面成膜透明導電層2,而獲得透明導電性玻璃3(參照圖2C)。Thereby, in the
又,與濺鍍同時,透明導電性玻璃3利用加熱機30進行加熱。In addition, simultaneously with sputtering, the transparent
作為加熱溫度,例如為300℃以上,較佳為400℃以上,又,例如為800℃以下,較佳為600℃以下。藉此,例如於透明導電層2為ITO層之情形時,可與成膜同時使ITO層於高溫下結晶化,可提高導電性。The heating temperature is, for example, 300°C or higher, preferably 400°C or higher, and for example, 800°C or lower, and preferably 600°C or lower. Thereby, for example, when the transparent
其後,透明導電性玻璃3被導引至第3導輥31,而被搬送至冷卻裝置13。After that, the transparent
於冷卻裝置13中,透明導電性玻璃3依序與第1冷卻輥34及第2冷卻輥35接觸,而得以冷卻。In the
各冷卻輥(34、35)之表面溫度例如為280℃以下,較佳為150℃以下,又,例如為40℃以上。The surface temperature of each cooling roll (34, 35) is, for example, 280°C or lower, preferably 150°C or lower, and, for example, 40°C or higher.
此時,就透明導電性玻璃3與冷卻輥34、35之接觸面積擴大(進而提高冷卻效率)之觀點而言,以於第1冷卻輥34與第2冷卻輥35之間,橫穿其等之對向方向之方式搬送透明導電性玻璃3。即,以第1冷卻輥34之徑向一側端部與第2冷卻輥35之徑向另一端部相接觸之方式搬送透明導電性玻璃3。At this time, from the viewpoint of the expansion of the contact area between the transparent
此時,透明導電性玻璃3之玻璃基材1之厚度方向另一面與第2冷卻輥35直接接觸,自冷卻裝置13搬送至第2去靜電部18。此時,由於第2冷卻輥35之驅動力及摩擦力,而於透明導電性玻璃3之厚度方向另一面(玻璃基材1側之表面)產生帶電。At this time, the other surface of the
其後,經冷卻之透明導電性玻璃3被搬送至第2去靜電部18。After that, the cooled transparent
於第2去靜電部18中,透明導電性玻璃3藉由第2去靜電機37之作動而去靜電。即,透明導電性玻璃3之玻璃基材1攜帶之電量減少。此時,第2去靜電部18自透明導電性玻璃3之厚度方向另一側去靜電,以便將透明導電性玻璃3之厚度方向另一面(玻璃基材1側之表面)去靜電。In the second antistatic part 18, the transparent
其後,經去靜電之透明導電性玻璃3被導引至第4導輥38,而搬送至捲取部16。After that, the transparent
於捲取部16中,第2保護材6自保護材捲出輥42捲出,被導引至第5導輥43,而搬送至夾輥44。In the winding
另一方面,透明導電性玻璃3與第2保護材6一起通過第2驅動輥40與夾輥44之間,而於透明導電性玻璃3之厚度方向一面積層第2保護材6。On the other hand, the transparent
其後,透明導電性玻璃3與第2保護材6一起被捲取至捲取輥41。具體而言,具備透明導電性玻璃3及配置於其厚度方向另一面(與透明導電層2為相反側之表面)之第2保護材6之積層體7(參照圖2D)被捲繞成卷狀。After that, the transparent
3.透明導電性玻璃之用途
透明導電性玻璃3例如用於圖像顯示裝置等光學裝置。於圖像顯示裝置(具體而言,具有LCD(Liquid Crystal Display,液晶顯示裝置)模組、有機EL模組等圖像顯示元件之圖像顯示裝置)具備透明導電性玻璃3之情形時,透明導電性玻璃3例如用作觸控面板用基材、抗反射基材等,較佳為用作觸控面板用基材。作為觸控面板之形式,可列舉光學方式、超音波方式、靜電電容方式、電阻膜方式等各種方式,尤其適宜用於靜電電容方式之觸控面板。3. The use of transparent conductive glass
The transparent
而且,該搬送成膜裝置10中之搬送裝置11具備捲出輥21、保護材捲取輥23、捲取輥41及去靜電部15。In addition, the conveying
因此,可去除玻璃基材1表面所帶之電。因此,於玻璃基材1與第1導輥26等其他輥接觸時,可抑制由帶電所導致之玻璃基材1與其他輥之黏連。因此,於玻璃基材1與其他輥分離時,可減輕玻璃基材1之負荷,可抑制玻璃基材1之破損。Therefore, the electricity charged on the surface of the
又,搬送裝置11進而具備第1驅動輥22,因此,可確實且連續地搬送玻璃基材1。又,第1去靜電機25配置於第1驅動輥22之下游側,因此可對因與第1驅動輥22之接觸而產生之玻璃基材1之帶電進行去靜電,其結果,可抑制由第1驅動輥22所引起之玻璃基材1之破損。In addition, the conveying
尤其是,若第1驅動輥22與玻璃基材1之平滑之表面直接接觸,則因由第1驅動輥22之旋轉所導致之摩擦,而容易於玻璃基材1之表面產生靜電。因此,藉由緊隨第1驅動輥22後配置第1去靜電部17,可立即且確實地減少玻璃基材1之帶電。另一方面,於透明導電性玻璃3中,就透明導電層2與第1冷卻輥34(驅動輥)之接觸而言,透明導電層2不如玻璃表面平滑,難以產生靜電,因此並不特別需要緊隨與透明導電層2接觸之第1冷卻輥34(驅動輥)後配置去靜電部。另一方面,若緊隨與玻璃基材1接觸之第2冷卻輥35(驅動輥)後配置第2去靜電部18,則可有效地抑制由玻璃基材1之帶電所導致之破損。In particular, if the
又,搬送成膜裝置10具備搬送裝置11及濺鍍裝置12。In addition, the transport
因此,可抑制玻璃基材1之破損地,於玻璃基材1設置透明導電層2。因此,可確實地製造透明導電性玻璃3。Therefore, the transparent
又,去靜電部15具有第1去靜電部17及第2去靜電部18,第1去靜電部17設置於濺鍍裝置12之上游側,第2去靜電部18設置於濺鍍裝置12之下游側。In addition, the static elimination part 15 has a first static elimination part 17 and a second static elimination part 18, the first static elimination part 17 is provided on the upstream side of the sputtering
因此,於透明導電層2之成膜前後,可抑制玻璃基材1或透明導電性玻璃3之帶電。因此,可更確實地抑制玻璃基材1或透明導電性玻璃3之破損,可確實地製造透明導電性玻璃3。Therefore, before and after the film formation of the transparent
透明導電性玻璃3之製造方法依序具備:準備步驟,其係準備具備玻璃基材1及第1保護材5之搬送基材4;剝離步驟,其係自玻璃基材1剝離第1保護材5;及成膜步驟,其係在真空下於玻璃基材1設置透明導電層2;且於成膜步驟之前後,具備對玻璃基材1進行去靜電之去靜電步驟。The manufacturing method of the transparent
因此,可抑制玻璃基材1與輥之接觸時之黏連,減輕其等分離時之負荷。因此,可抑制玻璃基材1之破損地,於玻璃基材1設置透明導電層2。結果,可確實地製造透明導電性玻璃3。Therefore, it is possible to suppress adhesion between the
尤其關於去靜電步驟,其於成膜步驟之前及之後實施。因此,於透明導電層2之成膜前後,可抑制玻璃基材1或透明導電性玻璃3之帶電。因此,可更確實地抑制玻璃基材1或透明導電性玻璃3之破損,可確實地製造透明導電性玻璃3。Especially with regard to the destaticizing step, it is performed before and after the film forming step. Therefore, before and after the film formation of the transparent
4.變化例 以下,對圖1所示之一實施形態之變化例進行說明。再者,關於該等變化例,亦發揮與上述一實施形態同樣之作用效果。4. Variations Hereinafter, a modification example of the embodiment shown in FIG. 1 will be described. In addition, these modified examples also exhibit the same effects as the above-mentioned embodiment.
(1)於圖1所示之實施形態中,2個去靜電部15配置於濺鍍裝置12之前後。即,去靜電步驟於成膜步驟之前後實施。例如,雖未圖示,去靜電部15可僅具備第1去靜電部17,又,亦可僅具備第2去靜電部18。即,去靜電步驟可僅作為濺鍍成膜之前步驟實施,又,亦可僅作為後續步驟實施。(1) In the embodiment shown in FIG. 1, two static elimination parts 15 are arranged before and after the
較佳可列舉圖1所示之實施形態。於該實施形態中,可隨時對因與配置於濺鍍裝置12之前後之驅動輥之接觸而產生之電進行去靜電,而確實地抑制由帶電所導致之玻璃基材1之破損。Preferably, the embodiment shown in FIG. 1 can be cited. In this embodiment, the electricity generated by contact with the driving rollers arranged before and after the
(2)於圖1及圖2所示之實施形態中,作為積層玻璃,例示了透明導電性玻璃3,即,作為功能層,例示了透明導電層2,例如,雖未圖示,但作為功能層,例如亦可設為硬塗層、光學調整層、金屬層(例如銅層等非透明導電層)等。又,作為功能層,可為1層,亦可為2層以上。(2) In the embodiment shown in FIGS. 1 and 2, the transparent
(3)於圖1所示之實施形態中,作為成膜裝置,例示了濺鍍裝置12,例如,雖未圖示,但可列舉真空蒸鍍裝置、化學蒸鍍裝置等真空成膜裝置等。(3) In the embodiment shown in FIG. 1, the
再者,上述發明提供本發明之例示之實施形態,但此僅為例示,不能限定性地進行解釋。對該技術領域之業者而言顯而易見之本發明之變化例包含於下述申請專利範圍。 [產業上之可利用性]Furthermore, the above-mentioned invention provides an exemplary embodiment of the present invention, but this is only an example and cannot be interpreted in a limited manner. Variations of the present invention that are obvious to those skilled in the art are included in the scope of the following patent applications. [Industrial availability]
玻璃基材之搬送裝置及積層玻璃之製造裝置用於積層玻璃之製造。The conveying device of glass substrate and the manufacturing device of laminated glass are used for the manufacture of laminated glass.
1:玻璃基材 2:透明導電層 3:透明導電性玻璃 4:搬送基材 5:第1保護材 6:第2保護材 7:積層體 10:搬送成膜裝置 11:搬送裝置 12:濺鍍裝置 13:冷卻裝置 14:捲出部 15:去靜電部 16:捲取部 17:第1去靜電部 18:第2去靜電部 21:捲出輥 22:第1驅動輥 23:保護材捲取輥 24:捲出殼體 25:第1去靜電機 26:第1導輥 27:第1去靜電罩殼 28:第2導輥 29:濺鍍靶 30:加熱機 31:第3導輥 33:成膜區域 34:第1冷卻輥 35:第2冷卻輥 36:冷卻殼體 37:第2去靜電機 38:第4導輥 39:第2去靜電罩殼 40:第2驅動輥 41:捲取輥 42:保護材捲出輥 43:第5導輥 44:夾輥 45:捲取罩殼1: Glass substrate 2: Transparent conductive layer 3: Transparent conductive glass 4: Transport substrate 5: The first protective material 6: The second protective material 7: Laminated body 10: Transporting the film forming device 11: Conveying device 12: Sputtering device 13: Cooling device 14: Roll out 15: Go to the static department 16: Coiling section 17: The first antistatic part 18: The second antistatic part 21: Roll out roller 22: 1st drive roller 23: Protective material take-up roller 24: Roll out the shell 25: The first anti-static machine 26: The first guide roller 27: The first anti-static cover 28: The second guide roller 29: Sputtering target 30: heating machine 31: The third guide roller 33: Film forming area 34: 1st cooling roll 35: 2nd cooling roll 36: Cooling shell 37: The second antistatic machine 38: 4th guide roller 39: The second anti-static cover 40: 2nd drive roller 41: take-up roller 42: Protective material roll out roller 43: 5th guide roller 44: nip roller 45: take-up cover
圖1表示本發明之搬送成膜裝置之一實施形態。 圖2A-D表示用圖1之搬送成膜裝置搬送之搬送物之剖視圖,圖2A表示捲繞至捲出輥之階段之搬送物(即,搬送基材),圖2B表示自捲出輥搬送至第1驅動輥之階段之搬送物(即,玻璃基材單獨體),圖2C表示自成膜區域搬送至冷卻裝置之階段之搬送物(即,透明導電性玻璃),圖2D表示自第5導輥捲繞至捲取輥之階段之搬送物(即,透明導電性玻璃與第2保護材之積層體)。Fig. 1 shows an embodiment of the transport film forming apparatus of the present invention. Figures 2A-D show a cross-sectional view of the transported object transported by the transport film forming device of Figure 1, Figure 2A shows the transported object at the stage of winding to the unwinding roll (ie, transporting the substrate), and Figure 2B shows the transporting from the unwinding roll Fig. 2C shows the conveyed material (that is, transparent conductive glass) from the film forming area to the cooling device, and Fig. 2D shows the conveyed material (ie, transparent conductive glass) at the stage of the first drive roller. 5 The conveyed material (ie, the laminated body of the transparent conductive glass and the second protective material) at the stage where the guide roller is wound to the take-up roller.
1:玻璃基材 1: Glass substrate
3:透明導電性玻璃 3: Transparent conductive glass
4:搬送基材 4: Transport substrate
5:第1保護材 5: The first protective material
6:第2保護材 6: The second protective material
7:積層體 7: Laminated body
10:搬送成膜裝置 10: Transporting the film forming device
11:搬送裝置 11: Conveying device
12:濺鍍裝置 12: Sputtering device
13:冷卻裝置 13: Cooling device
14:捲出部 14: Roll out
15:去靜電部 15: Go to the static department
16:捲取部 16: Coiling section
17:第1去靜電部 17: The first antistatic part
18:第2去靜電部 18: The second antistatic part
21:捲出輥 21: Roll out roller
22:第1驅動輥 22: 1st drive roller
23:保護材捲取輥 23: Protective material take-up roller
24:捲出殼體 24: Roll out the shell
25:第1去靜電機 25: The first anti-static machine
26:第1導輥 26: The first guide roller
27:第1去靜電罩殼 27: The first anti-static cover
28:第2導輥 28: The second guide roller
29:濺鍍靶 29: Sputtering target
30:加熱機 30: heating machine
31:第3導輥 31: The third guide roller
32:濺鍍罩殼 32: Sputtering cover
33:成膜區域 33: Film forming area
34:第1冷卻輥 34: 1st cooling roll
35:第2冷卻輥 35: 2nd cooling roll
36:冷卻殼體 36: Cooling shell
37:第2去靜電機 37: The second antistatic machine
38:第4導輥 38: 4th guide roller
39:第2去靜電罩殼 39: The second anti-static cover
40:第2驅動輥 40: 2nd drive roller
41:捲取輥 41: take-up roller
42:保護材捲出輥 42: Protective material roll out roller
43:第5導輥 43: 5th guide roller
44:夾輥 44: nip roller
45:捲取罩殼 45: winding cover
Claims (7)
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JP2019064118A JP7324028B2 (en) | 2019-03-28 | 2019-03-28 | Glass substrate conveying device, laminated glass manufacturing device, and laminated glass manufacturing method |
JP2019-064118 | 2019-03-28 |
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TW202041477A true TW202041477A (en) | 2020-11-16 |
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JP (1) | JP7324028B2 (en) |
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CN114574813A (en) * | 2020-11-30 | 2022-06-03 | 佳能特机株式会社 | Conveying device, film forming method, method for manufacturing electronic device, and film forming device |
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JPH1111980A (en) * | 1997-06-27 | 1999-01-19 | Asahi Glass Co Ltd | Transparent conductive glass substrate and its production |
JP4613048B2 (en) | 2004-10-29 | 2011-01-12 | 大日本印刷株式会社 | Pressure gradient ion plating film deposition system |
US9926627B2 (en) | 2011-12-21 | 2018-03-27 | Applied Materials, Inc. | System and methods for processing a substrate |
JP6016723B2 (en) * | 2012-08-07 | 2016-10-26 | 株式会社神戸製鋼所 | Glass film transport device |
KR20140071058A (en) | 2012-12-03 | 2014-06-11 | 코닝정밀소재 주식회사 | Roll-to-roll sputtering apparatus |
KR20150095670A (en) * | 2012-12-13 | 2015-08-21 | 아사히 가라스 가부시키가이샤 | Electronic device manufacturing method, and glass laminate manufacturing method |
JP6615520B2 (en) * | 2015-07-15 | 2019-12-04 | 日東電工株式会社 | Optical laminate |
JP6640516B2 (en) | 2015-09-30 | 2020-02-05 | AvanStrate株式会社 | Method for manufacturing glass substrate for display, apparatus for manufacturing glass substrate for display |
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CN114574813A (en) * | 2020-11-30 | 2022-06-03 | 佳能特机株式会社 | Conveying device, film forming method, method for manufacturing electronic device, and film forming device |
CN114574813B (en) * | 2020-11-30 | 2023-07-25 | 佳能特机株式会社 | Conveying device, film forming method, method for manufacturing electronic device, and film forming device |
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CN111747642B (en) | 2023-09-15 |
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