TW202040247A - 非等向性導電水分障壁膜及具有此膜的電光總成 - Google Patents
非等向性導電水分障壁膜及具有此膜的電光總成 Download PDFInfo
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Abstract
一種電光總成,包含:構造成在施加電場時會切換光學狀態的電光材料之層;以及具有一種以上的抗水分聚合物、和導電材料的非等向性導電層,該抗水分聚合物具有小於5g/(m2*d)的WVTR。
Description
本申請案主張在2018年12月17日提出申請的美國臨時專利申請案No. 62/780,401的優先權。本文所揭露的全部參照文獻、專利和專利申請案係以參照的方式將其全部內容包含於此。
本發明係關於一種非等向性導電膜,其可被包含電光總成中。更具體而言,在一個態樣中,本發明係關於一種非等向性導電膜,其改良了水分障壁性質且可被包含電光裝置或顯示器中。
作為應用於材料或者顯示器的術語“電光”,在本文中使用的是其在成像領域中的常規含義,係指具有第一和第二顯示狀態的材料,該第一和第二顯示狀態係至少一個光學性質不同,藉由向該材料施加電場使該材料從其第一顯示狀態轉變成其第二顯示狀態。雖然該光學性質通常是人眼可感覺到的顏色,但也可以是其他光學性質,諸如光學透射、反射、發光或在欲用於機器讀取的顯示的情況下,是在可見光範圍之外的電磁波長的反射變化的意義上的偽色(pseudo-color)。
多年來,係將非等向性導電黏合劑(adhesives)用於微電子器件的總成中。如US 4,729,809所例示,通常的方法係以比導電性的展透閾值(percolation threshold of conductivity)稍低的方式,給熱固化性環氧樹脂裝填導電粒子。然後利用相應的電性接點將此配方(formulation)施加在半導體晶片與電路板之間。在熱和壓力下,該等導電粒子被侷限在該晶片的該等接點與電路板之間而不會因橫向的導電性造成短路地完成連接。
除了該次展透閾值的方法(sub-percolation threshold approach)外,已經使用利用電場或磁場來將該等導電性粒子定向(orient)的各種方法,來形成非等向性導電膜和黏合劑。它們包含使用導電纖維(US 4,170,677)、諸如氧化鐵的磁性粒子(US 7,843,626)、和在電場中被定向的碳黑(US 9,437,347)。
提供非等向性導電膜的另一種方法係揭露於美國專利申請案No. 2017/0052421,其在利用正和負電暈源來分別書寫或抹除黑色和白色電泳膜的的直接書寫系統中包含該導電膜。此法製造以非接觸的方式且在該顯示裝置上不需要任何驅動電子器件(electronics)便能運作的顯示器。為了防止對該等微囊造成機械性損傷而在含有微囊的該電泳材料上方設置厚的非等向性導電層作為保護層。需要非等向性導電性來使來自該等電暈的該等離子穿越該保護層至該電泳材料層。此導電性係藉由將導電性、磁性粒子添加至UV固化性樹脂配方來達成。該等粒子的裝填係依以下方式選擇:曝露於強磁場以使該等粒子對齊與該保護層的平面垂直的方位(orientation),從而在Z方向上形成導電性且在X或Y方向上沒有任何明顯的橫向導電性。一旦完成對齊,便利用UV輻射將該基質樹脂固化以將該保護層硬化,同時鎖住該粒子方位。
美國專利申請案No. 2017/0052421所揭露的該非等向性導電層的主要缺點之一係在高環境濕度下的不良成像品質。因此,要求具有改良的水分障壁性質的非等向性導電膜以維護該顯示器的該成像品質。
根據一個態樣,一種電光總成,包括:構造成在施加電場時會切換光學狀態的電光材料之層;以及包括一種以上的抗水分聚合物、和導電材料的非等向性導電層,該抗水分聚合物具有小於5g/(m2
*d)的WVTR。
本發明的各種實施例的這些和其他態樣將藉由以下的說明而易於理解。
一般而言,本發明的各種實施例提供一種非等向性導電層和形成其的方法,其具有固有的水蒸氣障壁(moisture vapor barrier)性質。其藉由將抗水分聚合物包含在於製造該層的期間內被固化或冷卻的該非等向性導電層的連續相中來達成。這消除了另外的障壁形成步驟的需求且可以提供具有改良的機構完整性的障壁。此外,本發明的某些實施例可以排除專門的輻射固化設備的需求並消除了處理可輻射固化的單體的危險。
較佳的總成的示意圖係圖示於圖1和2中,且下面提供用於製造根據本發明的各種實施例的總成的製程(process)。該總成包括基板、導電層、電光層和非等向性導電層。然後,可以將該總成包含在電光裝置中,諸如顯示器。電光顯示器一般包括電光材料之層和至少兩個配置在該電光材料的相反側上的其他層,這兩層中的一個係電極層。在大多數這樣的顯示器中,兩層皆為電極層,且將該等電極層中的一個或兩個圖案化以界定該顯示器的像素。例如,可將其中一個電極層圖案化為長列電極而將另一個圖案化為與該列電極正交延伸的長行電極,該等像素係由該列電極和行電極的相交所界定。或者更常見的是,其中一個電極層具有單一的連續電極形式而將另一個電極層圖案化為像素電極矩陣,每一個像素電極界定該顯示器的一個像素。在另一種意在與和顯示器分開的觸針(stylus)、印字頭或類似的可移動電極一起使用的電光顯示器中(諸如前述美國專利申請案No. 2017/0052421所揭露的該裝置),多層中只有鄰接該電光層的那一層包括電極,在該電光層的相反側上的層通常是意在防止該可移動電極損害該電光層的保護層。
現在,雖然僅藉由圖示,但參照貫穿該總成的示意剖面圖的圖1和2,說明根據本發明的一個實施例的該總成的實施例。圖1所示的該總成(一般標示為100)包括基板110、電極層120、電光層130、和非等向性導電層180。
在一些實施例中,若要將該總成100包含在有意將該基板110作為該顯示器的觀看側的顯示器中,則該基板110和電極層120可以是透光的。在其他實施例中,若有意將該非等向性導電層180用作顯示器的觀看表面,則其可以是透光的。在另外的實施例中,若要將該總成100包含在雙面顯示器中,則基板110、電極層120、和非等向性導電層180這三層都可以是透光的。此處使用術語“透光”,在整個說明書和申請專利範圍中係指由其所指定的層讓足夠的光線通過以使觀察者看穿該層而觀察到該電光介質的顯示狀態的變化,其一般是透過該導電層和鄰接的基板觀看;在該電光介質係在非可見光波長顯示反射的變化的情況下,當然應將該術語“透光”解釋為意指相關的非可見光波長的透射。
在能夠手動地將該基板纏繞在直徑10吋(254mm)的鼓輪(say)上而沒有永久變形的意義上,該基板110較佳為柔性的。該基板通常是聚合膜且一般具有約1至約25密爾(mil)(25至634μm)範圍的厚度,較佳為約2至約10密爾(51至254μm)。可以形成該最終顯示器的觀看表面的該基板110的下表面(在圖1中)可以具有一個以上的附加層(未圖示),例如用於吸附紫外輻射的保護層、用於防止氧或水分進入該最終顯示器的障壁層、和用於改良該顯示器的光學性質的抗反射塗層。若該基板110不需要是透光的,便可以使用本領域的具有通常知識者所知的任何相容的柔性材料。
塗布在該基110的上表面的是導電性電極層120,其可以用作該最終顯示裝置中的共同電極。如前所述,該電極層120可以以金屬或金屬氧化物的薄透光層的形式提供,例如諸如鋁或ITO,或者可以是導電聚合物。塗布有鋁或ITO的聚(對苯二甲酸乙二酯)(PET)膜可由市面上取得,例如,來自E.I. du Pont de Nemours & Company, Wilmington DE的“鋁化Mylar”(“Mylar”為註冊商標),且在本發明的各種實施例中這種市售材料可有效地用作該基板110和電極層120。
然後,可以將電光材料之層130施加在該電極層120的相對於該基板110的相反表面上。可以將各種類型的電光材料包含在本發明的各種實施例中,諸如固態電光材料。
一些電光材料,就該等材料具有固態的外表面的意義而言是固態的,雖然該等材料可能(且往往確實)具有填充有液體或氣體的內部空間。以下,為了方便起見,可能將這種使用固態的電光材料的顯示器稱為“固態的電光顯示器”。因此,術語“固態的電光顯示器”包含旋轉雙色構件(member)顯示器、封裝電泳顯示器、微胞電泳顯示器和封裝液晶顯示器。
術語“雙穩態”和“雙穩定性(bistability)”,在本文中使用的是其在領域中的常規含義,係指包括具有第一和第二顯示狀態的顯示元件的顯示器,該第一和第二顯示狀態係至少一個光學性質不同,而且在任何給定的元件藉由有限期間的定址脈衝(addressing pulse)而受到驅動以取得其第一或第二顯示狀態後,在該定址脈衝結束後,那個狀態會保留一段改變該顯示元件的狀態所需的該定址脈衝的最小期間的至少數倍(例如至少四倍)時間。美國專利No.7,170,670中指出一些具有灰階功能的基於粒子的電泳顯示器不僅在其極端的黑態和白態下是穩定的,在其中間的灰態(gray state)下也是穩定的,而且一些其他類型的電光顯示器也有同樣的情形。雖然為了方便起見,本文可能使用術語“雙穩態”來涵蓋雙穩態和多穩態這兩種顯示器,但此種顯示器適合稱為“多穩態”而非雙穩態。
含有旋轉雙色構件(rotating bichromal member)型材料的顯示器係記載在例如美國專利No.5,808,783、5,777,782、5,760,761、6,054,071、6,055,091、6,097,531、6,128,124、6,137,467和6,147,791中(雖然這種顯示器經常被稱為“旋轉雙色球”顯示器,但是由於在上述一些專利中旋轉構件並非球狀,所以術語“旋轉雙色構件”因更加準確而較佳)。這種顯示器使用大量具有帶有不同光學特徵的兩個以上部分的小體(small bodies)(通常是球狀或圓柱狀)、及內部偶極子(internal dipole)。這些體(bodies)係懸浮在基質(matrix)中的充滿液體的液泡(vacuoles)內,該液泡係充滿液體以便該等體能自由旋轉。該顯示器的外觀係藉由以下方式改變:向其施加電場,從而將該等體旋轉到各種位置而改變透過觀看表面所看到的該等體的部分。這種電光介質通常是雙穩態。
另一種電光顯示器可以使用電致變色介質,例如奈米變色薄膜(nanochromic film)形式的電致變色介質,其包括至少部分由半導電金屬氧化物形成的電極、及複數個附著在該電極的能夠可逆變色的染料分子;可參見例如O’Regan, B.等人,Nature 1991, 353, 737;和Wood, D., Information Display, 18(3), 24(2002年3月)。亦可參見Bach, U.等人,Adv. Mater., 2002, 14(11), 845。例如在美國專利No. 6,301,038、6,870,657、和6,950,220中也揭示了這種奈米變色薄膜。這種介質通常也是雙穩態。
另一種電光顯示器係由Philips開發的並在Hayes, R.A.等人的“基於電潤濕的視訊速度電子紙(Video-Speed Electronic Paper Based on Electrowetting)”,Nature, 425, 383-385(2003)中記載的電潤濕顯示器。美國專利No.7,420,549中指出這樣的電潤濕顯示器能夠被製成雙穩態。
可以被包含在本發明的各種實施例中的較佳類型的電光顯示器,係基於粒子的電泳顯示器,其中,複數個帶電粒子在電場的影響下移動通過流體。當與液晶顯示器相比時,電泳顯示器能夠具有以下屬性:良好的亮度和對比度、廣視角、狀態雙穩定性、和低功耗。
電泳介質需要有流體存在。在大多數的電泳介質的先前技術中,此流體為液體,但電泳介質能夠使用氣相流體製造;參見例如Kitamura, T.等人,“類電子紙顯示器的電性調色劑運動(Electrical toner movement for electronic paper-like display)”,IDW Japan, 2001, Paper HCS1-1,和Yamaguchi, Y.等人,“使用以摩擦帶電方式帶電的絕緣性粒子的調色劑顯示器(Toner display using insulative particles charged triboelectrically)”,IDW Japan, 2001, Paper AMD4-4)。亦可參見美國專利No. 7,321,459和7,236,291。
大量轉讓給麻省理工學院(MIT)、E Ink公司、E Ink加州股份有限公司和相關公司或是在其名下的專利和申請案記載用於封裝的電泳介質和微胞電泳介質和其他電光介質的各種技術。封裝的電泳介質包括大量的小囊,每一個小囊本身包括內部相和圍繞該內部相的囊壁,該內部相在流體介質中含有可電泳移動的粒子。通常,該等囊本身係保持在聚合黏結劑(binder)中以形成位於兩電極之間的黏附層(coherent layer)。在微胞電泳顯示器中,該等帶電粒子和該流體未被封裝在微囊內,取而代之的是保留在形成在載體介質(通常是聚合膜)內的複數個凹部(cavities)內。記載在這些專利和申請案中的該等技術包含:
(a)電泳粒子、流體和流體添加劑;參見例如美國專利No.7,002,728、7,679,814;
(b)囊、黏結劑和封裝製程;參見例如美國專利No.6,922,276和7,411,719;
(c)微胞結構、壁材料、和形成微胞的方法;參見例如美國專利No.7,072,095和9,279,906;
(d)用於填充和密封微胞的方法;參見例如美國專利No.7,144,942和7,715,088;
(e)含有電光材料的膜和子總成;參見例如美國專利No.6,982,178和7,839,564;
(f)用於顯示器中的背板、黏合劑層和其他輔助層以及方法;參見例如美國專利No.7,116,318和7,535,624;
(g)顏色形成和顏色調節;參見例如美國專利No.7,075,502和7,839,564;
(h)用於驅動顯示器的方法;參見例如美國專利No.7,012,600和7,453,445;
(i)顯示器的應用;參見例如美國專利No.7,312,784和8,009,348;以及
(j)非電泳顯示器,如在美國專利No.6,241,921和美國專利申請案公開No.2015/0277160中所記載;和顯示器以外的封裝和微胞技術的應用;參見例如美國專利申請案公開No.2015/0005720和2016/0012710。
許多前述專利和申請案認識到在封裝的電泳介質中圍繞該等離散的微囊的該等壁能由連續相取代,由此產生所謂的聚合物分散型電泳顯示器,其中該電泳介質包括複數個離散的電泳流體液滴和連續相的聚合材料,而且即使沒有與每個單獨的液滴相結合的離散的囊膜,也可以將在這樣的聚合物分散型電泳顯示器內的離散的電泳流體液滴視為囊或微囊;參見例如前述美國專利No.6,866,760。因此,基於本申請案的目的,將這樣的聚合物分散型電泳介質視為封裝的電泳介質的子類。
封裝的電泳顯示器通常不會遇到傳統電泳裝置的聚集和沉降失效模式,並且提供另外的優點,諸如能夠將該顯示器印刷或塗布在很多種柔性和剛性基板上。(使用該詞彙“印刷”係意在包含印刷和塗布的全部形式,包含但不限於:諸如補釘模塗布(patch die coating)的預先計量式塗布、狹縫或擠出塗布、滑動或層疊塗布、簾式淋塗;諸如輥上刮刀式塗布(knife over roll coating)、正向和逆向輥塗布的輥塗布;凹版式塗布;浸漬塗布;噴灑塗布;彎月面塗布;旋轉塗布;刷塗;氣刀塗布;絲網印刷製程;靜電印刷製程;熱印刷製程;噴墨印刷製程;電泳沉積(參見美國專利No.7,339,715);及其他類似技術。)。因此,所產生的顯示器可以是柔性的。另外,因為能夠(使用多種方法)印刷該顯示器介質,因此能夠便宜地製造該顯示器本身。
可以將各種類型的電光介質用於本發明的總成中。再次參照圖1的較佳實施例,該電光層130係封裝的電泳介質且包括微囊/液滴140,其每一者包括在烴基流體165中的帶負電白色粒子150和帶正電黑色粒子160。該等微囊/液滴140係保持在聚合黏結劑170內。可以將該電光層130沉積在該導電電極層120上,其通常是藉由狹縫塗布來進行,這兩層係電性接觸。在圖2的另一個實施例中,取而代之的是,電光層230可以包括包含複數個密封的微胞的聚合片240,且每個該等密封的微胞係填充有該白色粒子150和黑色粒子160的分散物(dispersion)。
一旦施加橫跨電光層130/230的電場,則白色粒子150移動至該正電極而黑色粒子160移動至該負電極,從而電光層130依據導電層120是否相對於該非等向性導電層180的區域為帶正電或帶負電,而對透過基板110及/或非等向性導電層180觀看該顯示器的觀察者顯現白色或黑色。
在根據本發明的實施例的第一製程中,可以藉由先用含有導電材料、一種以上的抗水分聚合物、和複數個可固化單體及/或寡聚物的流體塗布該電光材料之層130/230的頂部,來將該非等向性導電層180設置在該電光介質層130/230上。在塗布該電光材料之層130/230的頂部表面後,可以將電場及/或磁場施加至該流體,以使該導電材料對齊一般是與該電光材料之層的平面垂直的方向。在最後的步驟中,在施加該電場或磁場的期間內將該複數種單體及/或寡聚物進行聚合,使得一旦停止施加該電場或磁場,該導電材料仍能維持其經對齊的位置。
可以使用本領域的具有通常知識者所知的任何方法來將該等一個以上的單體進行聚合,但較佳為可UV固化者。可以用於本發明的各種實施例的單體的範例包含但不限於:胺基甲酸酯、丙烯酸酯、甲基丙烯酸酯、矽酮、環氧物、碳酸酯、醯胺、亞胺、內酯、脂肪族烴、烯烴、芳香族、及其組合。例如,可以使用任何上述單體的寡聚物。較佳為在該塗布步驟前,將該等單體及/或寡聚物與該導電材料和一種以上的抗水分聚合物充分混合,從而該等單體及/或寡聚物在聚合時形成連續的基質。在一些實施例中,以該流體的重量計,該抗水分聚合物可以依以下的比例存在:不多於約99、90、80、70、60、和50wt.%(依給定的順序越後面的越佳)且不少於45、35、25、20、15、和10wt.% (依給定的順序越後面的越佳)。
較佳為該一種以上的抗水分聚合物具有小於或等於5g/(m2
*d)的水蒸氣穿透率(WVTR),更佳為小於或等於1g/(m2
*d)的WVTR。可以包含在該第一製程的該流體中的抗水分聚合物的範例包含但不限於:聚異丁烯、苯乙烯-異丁烯-苯乙烯嵌段共聚物、聚(乙烯-共-降莰烯)(poly(ethylene-co-norbornene))、聚乙烯、聚丙烯、聚萘二甲酸乙二酯、聚偏二氯乙烯、聚氯三氟乙烯、及其組成。
可以包含在該非等向性導電層中的導電材料包含但不限於:導電粒子,例如碳粒子、鎳粒子、鐵粒子、銀粒子、銅粒子、經鍍覆的聚合物球、經鍍覆的玻璃球、銦錫氧化物粒子、或奈米相銦錫氧化物粒子。或者是,能夠使用導電聚合物,諸如聚乙炔、聚苯胺、聚吡咯、聚(3,4-伸乙二氧基噻吩)(PEDOT)、或聚噻吩。較佳為該非等向性導電層所選用的份量和材料能形成具有如下導電性的層:z軸方向(即與該非等向性導電層的平面垂直的方向)上的導電性比與該層的平面平行的方向(即x-y方向)上的導電性大至少約兩個級數(orders)。例如,在本發明的一個實施例中,該非等向性導電層的x-y方向上的導電性可以小於或等於約10-10
S/cm且z方向上的導電性可以大於或等於10-8
S/cm。
在根據本發明的實施例的第二較佳製程中,可以藉由用含有導電材料和一種以上的抗水分聚合物的熱塑性流體,在其溶點以上塗布該電光材料之層130/230的頂部,來將該非等向性導電層180設置在該電光介質層130/230上。在塗布該電光材料之層130/230的頂部表面後,可以將電場及/或磁場施加至該熱塑性流體,以使該導電材料對齊與該電光材料之層130/230的平面垂直的方向。在最後的步驟中,在施加該電場或磁場的期間內將該熱塑性流體冷卻,從而一旦移除該電場或磁場,該導電材料仍能維持其經對齊的位置。
因為該第二製程不必需要任何可能有危險的可固化單體的存在,因此其是更佳的,且可以更容易藉由溫度來控制該熱塑性流體的黏度以有助於該流體的塗布和該導電粒子的對齊。
在本發明的另一個實施例中,總成可以以兩個步驟提供,該第一步驟包括:設置前板積層體(front plane laminate)(FPL)且該第二步驟包括:將非等向性導電層施加於該FPL。
例如,參照圖3,FPL300可以包括許多與圖1和2所示的總成相同的層。該FPL300可以包含具有電極層120的基板110,在該電極層120上施加有電光介質層130。然而,該FPL300可以是在下述方面上不同:在此第一步驟中,該電光介質130較佳為塗布有液體形式的積層黏合劑380,權宜上係藉由狹縫塗布來塗布在剝離片390上,將該黏合劑乾燥(或者固化)以形成固態層,且然後將該黏合劑和剝離片積層至該電光層130,權宜上這可以使用熱輥積層來達成。或者是,但較不理想,可以將該積層黏合劑施加在該電光層130上,且在被該剝離片390覆蓋之前當場加以乾燥或者固化。在另一個範例中,可以將薄黏合劑層包含在該電光介質130與該電極層120之間,且可以不需要介於其間的黏合劑層地直接將該剝離片390施加於該電光介質130。該積層黏合劑較佳為非等向性黏合劑且可以例如根據美國專利No.7,843,626所揭露的程序來製備。
權宜上,該剝離片390係7密爾(177μm)膜;依據所使用的該電光介質的本質,可能理想的是,用剝離劑(例如,矽酮)塗布此膜。在用於形成該總成的第二步驟中,可以在將非等向性導電層施加於該FPL300前,將該剝離片390從該積層黏合劑380剝掉或者移除(如圖3所示)。
在本發明的另一個實施例中,該電光介質可以設置有雙剝離膜,諸如美國專利No.7,561,324中所記載的“雙剝離片”。在一種形式中,可以將固態電光介質層包夾在兩個黏合劑層(較佳為非等向性黏合劑)之間,該等黏合劑層中的一個或兩個被剝離片覆蓋。在另一種形式中,可以將固態電光介質層包夾在兩個剝離片之間。可以將該雙剝離膜的兩種形式用於大致與已述的用於由前板積層體組裝電光顯示器的製程類似的製程中。一般而言,在第一積層步驟中,一個剝離片係在將該電光介質積層於前電極層以形成前次總成之前移除,然後在第二步驟中,該第二剝離片(若存在的話)可以在施加非等向性導電層之前予以移除。
如前所述,該非等向性導電層可以用作顯示器用的保護層,且因此可以被包含於非接觸式顯示器中,該非接觸式顯示器不需要與該非等向性導電層接觸的任何驅動電極,而提供了改良的抗水分性質。或者是,可以將另一個任選的較佳的非等向性黏合劑層和任選的剝離片施加於該非等向性導電層的露出的表面,從而,稍後可以將該剝離片(若存在的話)移除,並在能夠有效地使該非等向性黏合劑層黏接於驅動電子器件的條件下,該最上面的非等向性黏合劑層與該等驅動電子器件(諸如背板)接觸。
對本領域的具有通常知識者而言,顯然能夠在不脫離本發明的範圍下,對上述的本發明的特定實施例做出許多變化和修改。由此,前述記載的整體內容應解釋為說明性質而非限制性質。
所有的前述美國專利和已公開的申請案的全部內容係以參照的方式包含在本文中。
100:總成
110:基板
120:電極層
130:電光材料之層
140:微囊/液滴
150:帶負電白色粒子
160:帶正電黑色粒子
165:烴基流體
170:聚合黏結劑
180:非等向性導電層
230:電光材料之層
300:前板積層體
380:積層黏合劑
390:剝離片
繪製的圖式係僅藉由範例而非藉由限定條件,描繪根據本構思的實施態樣。在該等圖式中,相似的參照符號代表相同或類似的元件。
圖1係根據本發明的一個實施例的示意剖面側視圖。
圖2係根據本發明的另一個實施例的示意剖面側視圖。
圖3係根據本發明的另一個實施例的示意剖面側視圖。
無。
Claims (20)
- 一種電光總成,包括:構造成在施加電場時會切換光學狀態的電光材料之層;以及包括一種以上的抗水分聚合物、和導電材料的非等向性導電層,該抗水分聚合物具有小於5g/(m2 *d)的WVTR。
- 如請求項1的電光總成,其中該抗水分聚合物具有小於1g/(m2 *d)的WVTR。
- 如請求項1的電光總成,其中與該非等向性導電層的平面垂直的方向上的導電性係至少10-8 S/cm,且與該非等向性導電層的平面平行的方向上的導電性係小於或等於約10-10 S/cm。
- 如請求項1的電光總成,其中該非等向性導電層進一步包括一種以上的源自胺基甲酸酯、丙烯酸酯、甲基丙烯酸酯、矽酮、環氧物(epoxies)、碳酸酯、醯胺、亞胺、內酯、脂肪族烴、烯烴、芳香族、及其組合的聚合物。
- 如請求項1的電光總成,其中該抗水分聚合物係選自由聚異丁烯、苯乙烯-異丁烯-苯乙烯嵌段共聚物、聚(乙烯-共-降莰烯)(poly(ethylene-co-norbornene))、聚乙烯、聚丙烯、聚萘二甲酸乙二酯(polyethylene naphthalate)、聚偏二氯乙烯、聚氯三氟乙烯、及其組成所構成的群組。
- 如請求項1的電光總成,其中該抗水分聚合物包括10至99wt%的該非等向性導電層。
- 如請求項1的電光總成,其中該電光材料包括封裝的電泳材料。
- 如請求項7的電光總成,其中該電光材料包括複數個囊,該等囊含有在流體中的複數個帶電粒子,該等帶電粒子能夠在對該電光材料施加該電場時移動通過該流體。
- 如請求項7的電光總成,其中該電光材料包括複數個密封的微胞,該等密封的微胞含有在流體中的複數個帶電粒子,該等帶電粒子能夠在對該電光材料施加該電場時移動通過該流體。
- 如請求項7的電光總成,其中該電光材料包括在連續相內的複數個液滴,該等液滴含有在流體中的複數個帶電粒子,該等帶電粒子能夠在對該電光材料施加該電場時移動通過該流體。
- 一種形成電光總成的方法,包括: 提供基板,該基板包括被施加於該基板的表面的電極層; 在該電極層的相對於該基板的相反側上,將電光材料之層施加於該電極層,該電光材料係構造成在施加電場時會切換光學狀態; 用流體塗布該電光材料之層,使得該電光材料之層係在該電極層與該流體之間,該流體含有:導電材料、複數種單體和寡聚物中的至少一者、和一種以上的具有小於5g/(m2 *d)的WVTR的抗水分聚合物; 將電場或磁場施加至該流體,以使該導電材料對齊與該電光材料之層垂直的方向;及 在施加該電場或磁場的期間內將該複數種單體或寡聚物進行固化(cure)。
- 如請求項11的方法,其中該抗水分聚合物具有小於1g/(m2 *d)的WVTR。
- 如請求項11的方法,其中該複數種單體係選自由胺基甲酸酯、丙烯酸酯、甲基丙烯酸酯、矽酮、環氧物、碳酸酯、醯胺、亞胺、內酯、脂肪族烴、烯烴、芳香族、及其組合所構成的群組。
- 如請求項11的方法,其中該抗水分聚合物係選自由聚異丁烯、苯乙烯-異丁烯-苯乙烯嵌段共聚物、聚(乙烯-共-降莰烯)、聚乙烯、聚丙烯、聚萘二甲酸乙二酯、聚偏二氯乙烯、聚氯三氟乙烯、及其組成所構成的群組。
- 如請求項11的方法,其中該抗水分聚合物包括10至99wt%的該流體。
- 如請求項11的方法,其中該電光材料包括封裝的電泳材料。
- 一種形成電光總成的方法,包括: 提供基板,該基板包括被施加於該基板的表面的電極層; 在該電極層的相對於該基板的相反側上,將電光材料之層施加於該電極層,該電光材料係構造成在施加電場時會切換光學狀態; 用熱塑性流體塗布該電光材料之層,使得該電光材料之層係在該電極層與該熱塑性流體之間,該熱塑性流體含有:導電材料、和一種以上的具有小於5g/(m2 *d)的WVTR的抗水分聚合物; 將電場或磁場施加至該熱塑性流體,以使該導電材料對齊與該電光材料之層垂直的方向;及 在施加該電場或磁場的期間內將該熱塑性流體冷卻而形成固態熱塑性物(solid thermoplastic)。
- 如請求項17的方法,其中該抗水分聚合物具有小於1g/(m2 *d)的WVTR。
- 如請求項17的方法,其中該抗水分聚合物係選自由聚異丁烯、苯乙烯-異丁烯-苯乙烯嵌段共聚物、聚(乙烯-共-降莰烯)、聚乙烯、聚丙烯、聚萘二甲酸乙二酯、聚偏二氯乙烯、聚氯三氟乙烯、及其組成所構成的群組。
- 如請求項17的方法,其中該電光材料包括封裝的電泳材料層。
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Family Cites Families (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4170677A (en) | 1977-11-16 | 1979-10-09 | The United States Of America As Represented By The Secretary Of The Army | Anisotropic resistance bonding technique |
US4857409A (en) | 1985-02-08 | 1989-08-15 | Exxon Chemical Patents Inc. | Clear barrier composites containing polyisobutylene/polyolefin alloy components |
US4729809A (en) | 1985-03-14 | 1988-03-08 | Amp Incorporated | Anisotropically conductive adhesive composition |
US5153039A (en) | 1990-03-20 | 1992-10-06 | Paxon Polymer Company, L.P. | High density polyethylene article with oxygen barrier properties |
US6137467A (en) | 1995-01-03 | 2000-10-24 | Xerox Corporation | Optically sensitive electric paper |
US6866760B2 (en) | 1998-08-27 | 2005-03-15 | E Ink Corporation | Electrophoretic medium and process for the production thereof |
US7411719B2 (en) | 1995-07-20 | 2008-08-12 | E Ink Corporation | Electrophoretic medium and process for the production thereof |
US5760761A (en) | 1995-12-15 | 1998-06-02 | Xerox Corporation | Highlight color twisting ball display |
US5808783A (en) | 1996-06-27 | 1998-09-15 | Xerox Corporation | High reflectance gyricon display |
US6055091A (en) | 1996-06-27 | 2000-04-25 | Xerox Corporation | Twisting-cylinder display |
US5777782A (en) | 1996-12-24 | 1998-07-07 | Xerox Corporation | Auxiliary optics for a twisting ball display |
DE69830566T2 (de) | 1997-02-06 | 2006-05-11 | University College Dublin | Elektrochromes system |
US7002728B2 (en) | 1997-08-28 | 2006-02-21 | E Ink Corporation | Electrophoretic particles, and processes for the production thereof |
US6054071A (en) | 1998-01-28 | 2000-04-25 | Xerox Corporation | Poled electrets for gyricon-based electric-paper displays |
US7075502B1 (en) | 1998-04-10 | 2006-07-11 | E Ink Corporation | Full color reflective display with multichromatic sub-pixels |
US6241921B1 (en) | 1998-05-15 | 2001-06-05 | Massachusetts Institute Of Technology | Heterogeneous display elements and methods for their fabrication |
US6128124A (en) | 1998-10-16 | 2000-10-03 | Xerox Corporation | Additive color electric paper without registration or alignment of individual elements |
US6097531A (en) | 1998-11-25 | 2000-08-01 | Xerox Corporation | Method of making uniformly magnetized elements for a gyricon display |
US6147791A (en) | 1998-11-25 | 2000-11-14 | Xerox Corporation | Gyricon displays utilizing rotating elements and magnetic latching |
US7012600B2 (en) | 1999-04-30 | 2006-03-14 | E Ink Corporation | Methods for driving bistable electro-optic displays, and apparatus for use therein |
US8009348B2 (en) | 1999-05-03 | 2011-08-30 | E Ink Corporation | Machine-readable displays |
US6870657B1 (en) | 1999-10-11 | 2005-03-22 | University College Dublin | Electrochromic device |
US7715088B2 (en) | 2000-03-03 | 2010-05-11 | Sipix Imaging, Inc. | Electrophoretic display |
US6242058B1 (en) | 2000-05-12 | 2001-06-05 | Dow Corning Corporation | Method for forming coatings from radiation curable compositions containing alkenyl ether functional polyisobutylenes |
FR2815374B1 (fr) | 2000-10-18 | 2003-06-06 | Saint Gobain | Vitrage feuillete et ses moyens d'etancheification peripherique |
AU2002250304A1 (en) | 2001-03-13 | 2002-09-24 | E Ink Corporation | Apparatus for displaying drawings |
JP4568477B2 (ja) | 2001-04-02 | 2010-10-27 | イー インク コーポレイション | 画像安定性を改良した電気泳動媒体 |
US7679814B2 (en) | 2001-04-02 | 2010-03-16 | E Ink Corporation | Materials for use in electrophoretic displays |
US20020188053A1 (en) | 2001-06-04 | 2002-12-12 | Sipix Imaging, Inc. | Composition and process for the sealing of microcups in roll-to-roll display manufacturing |
US7535624B2 (en) | 2001-07-09 | 2009-05-19 | E Ink Corporation | Electro-optic display and materials for use therein |
US6982178B2 (en) | 2002-06-10 | 2006-01-03 | E Ink Corporation | Components and methods for use in electro-optic displays |
JP4202266B2 (ja) | 2002-03-06 | 2008-12-24 | 株式会社ブリヂストン | 画像表示装置および方法 |
US6950220B2 (en) | 2002-03-18 | 2005-09-27 | E Ink Corporation | Electro-optic displays, and methods for driving same |
EP1488277A4 (en) | 2002-03-27 | 2006-08-16 | Avery Dennison Corp | ELECTRO-OPTICAL SWITCHABLE LAMINATES |
KR100867286B1 (ko) | 2002-04-24 | 2008-11-06 | 이 잉크 코포레이션 | 전자 표시장치 |
AU2003265922A1 (en) | 2002-09-03 | 2004-03-29 | E Ink Corporation | Electro-optic displays |
US7839564B2 (en) | 2002-09-03 | 2010-11-23 | E Ink Corporation | Components and methods for use in electro-optic displays |
US7012364B2 (en) * | 2002-10-01 | 2006-03-14 | Dai Nippon Printing Co., Ltd. | Organic electroluminescent display |
TWI229230B (en) | 2002-10-31 | 2005-03-11 | Sipix Imaging Inc | An improved electrophoretic display and novel process for its manufacture |
US6922276B2 (en) | 2002-12-23 | 2005-07-26 | E Ink Corporation | Flexible electro-optic displays |
US7339715B2 (en) | 2003-03-25 | 2008-03-04 | E Ink Corporation | Processes for the production of electrophoretic displays |
JP4579823B2 (ja) | 2003-04-02 | 2010-11-10 | 株式会社ブリヂストン | 画像表示媒体に用いる粒子、それを用いた画像表示用パネル及び画像表示装置 |
CN101930118B (zh) | 2003-10-08 | 2013-05-29 | 伊英克公司 | 电润湿显示器 |
JP4675060B2 (ja) * | 2004-05-14 | 2011-04-20 | 三菱鉛筆株式会社 | 電気泳動表示媒体 |
US7453445B2 (en) | 2004-08-13 | 2008-11-18 | E Ink Corproation | Methods for driving electro-optic displays |
US20060153997A1 (en) * | 2005-01-07 | 2006-07-13 | Eastman Kodak Company | Method of varying wavelengths of liquid crystals |
WO2007002452A2 (en) * | 2005-06-23 | 2007-01-04 | E Ink Corporation | Edge seals and processes for electro-optic displays |
US7855711B2 (en) * | 2005-09-14 | 2010-12-21 | Palo Alto Research Center Incorporated | Conductive islands for printable electronic paper |
US20150005720A1 (en) | 2006-07-18 | 2015-01-01 | E Ink California, Llc | Electrophoretic display |
NO333507B1 (no) | 2009-06-22 | 2013-06-24 | Condalign As | Fremgangsmate for a lage et anisotropisk, ledende lag og en derav frembrakt gjenstand |
JP2013105144A (ja) * | 2011-11-16 | 2013-05-30 | Sony Corp | 表示装置および電子機器 |
US9279906B2 (en) | 2012-08-31 | 2016-03-08 | E Ink California, Llc | Microstructure film |
KR102161178B1 (ko) * | 2013-05-29 | 2020-09-29 | 타츠타 전선 주식회사 | 전자파 실드 필름의 제조 방법 |
WO2015148398A1 (en) | 2014-03-25 | 2015-10-01 | E Ink California, Llc | Magnetophoretic display assembly and driving scheme |
WO2015163907A1 (en) * | 2014-04-25 | 2015-10-29 | Hewlett-Packard Development Company, L.P. | Aligned particle layer |
TWI613498B (zh) | 2014-06-27 | 2018-02-01 | 電子墨水加利福尼亞有限責任公司 | 用於電泳顯示器的各向異性傳導介電層 |
TWI559915B (en) | 2014-07-10 | 2016-12-01 | Sipix Technology Inc | Smart medication device |
EP3356445B1 (en) * | 2015-09-30 | 2021-01-06 | E Ink Corporation | Polyurethane adhesive layers for electro-optic assemblies |
JP6857982B2 (ja) * | 2016-08-10 | 2021-04-14 | イー インク コーポレイション | アクティブマトリクス回路基板、表示装置、表示装置の駆動方法および電子機器 |
EP3616001B1 (en) | 2017-06-13 | 2023-01-11 | Hewlett-Packard Development Company, L.P. | Vapor barrier for e-paper |
WO2023009792A1 (en) * | 2021-07-30 | 2023-02-02 | Berry Global, Inc. | Moisture barrier system |
-
2019
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- 2019-12-17 US US16/716,618 patent/US11520211B2/en active Active
- 2019-12-17 EP EP19900399.7A patent/EP3899640A4/en not_active Withdrawn
- 2019-12-17 TW TW108146157A patent/TWI736068B/zh active
- 2019-12-17 CN CN201980081835.5A patent/CN113196134A/zh active Pending
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2022
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US20230046003A1 (en) | 2023-02-16 |
EP3899640A4 (en) | 2022-09-07 |
US11782322B2 (en) | 2023-10-10 |
CN113196134A (zh) | 2021-07-30 |
EP3899640A1 (en) | 2021-10-27 |
TWI736068B (zh) | 2021-08-11 |
US20200192176A1 (en) | 2020-06-18 |
WO2020131799A1 (en) | 2020-06-25 |
JP2022514540A (ja) | 2022-02-14 |
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