TW202040195A - Photoelectric composite transmission module - Google Patents

Abstract

This photoelectric composite transmission module 1 comprises: a photoelectric composite substrate 2 with an optical waveguide 6 and an electric circuit board 7 provided in order in the thickness direction; a printed wiring board 3 bonded to the electric circuit board 7 so as to be electrically connected to the electric circuit board 7; an optical element 4 which is optically connected to the optical waveguide 6 and is mounted to the photoelectric composite substrate 2 so as to be electrically connected to the electrical circuit board 7; and a bonding member 27 which covers the electrical connection portion 29 of the printed wiring board 3 and the electrical circuit board 7, and which bonds the printed wiring board 3 and the electrical circuit board 7. The bonding member 27 is a cured product of a material which can be cured by being heated at a temperature of 100 DEG C for two hours.

Description

Photoelectric composite transmission module

The invention relates to a photoelectric composite transmission module.

Previously, an optoelectronic composite transmission module was proposed, which is provided with: an optoelectronic hybrid substrate, which includes an optical waveguide and a circuit substrate, and is equipped with optical elements such as VCSEL (Vertical Cavity Surface Emitting Laser); and A printed wiring board is electrically connected to a circuit board (for example, refer to Patent Document 1).

In the photoelectric composite transmission module of Patent Document 1, as a method of joining the photoelectric hybrid substrate and the printed wiring board, bumps are provided between the terminals of the photoelectric hybrid transmission module, and then a non-conductive resin is poured into the photoelectric hybrid substrate and the printed wiring board. After that, it is heated with a heating furnace at 150°C. [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2008-310066

[The problem to be solved by the invention]

However, in the method described in Patent Document 1, the optical element may be damaged during heating.

The present invention provides a photoelectric composite transmission module that can inhibit damage to optical elements. [Technical means to solve the problem]

The present invention (1) includes an optoelectronic composite transmission module, which includes: an optoelectronic hybrid substrate having an optical waveguide and a circuit substrate sequentially in the thickness direction; and a printed wiring board that is electrically connected to the circuit substrate. The above-mentioned circuit board; an optical element mounted on the above-mentioned opto-electric hybrid board in a manner that is optically connected to the above-mentioned optical waveguide and electrically connected to the above-mentioned circuit board; , The above-mentioned printed wiring board and the above-mentioned circuit board are joined; and the above-mentioned joining member is a cured product of a material that can be cured by heating at 100°C for 2 hours.

In the photoelectric composite transmission module, since the material can be cured by heating at 100°C for 2 hours, the electrical connection part of the printed wiring board and the circuit board is covered, and then heated under low-temperature conditions that can prevent damage to the optical element. As a bonding member of the cured product, the printed wiring board and the circuit board can be bonded by this.

Therefore, the photoelectric composite transmission module can suppress the damage of the optical element.

The present invention (2) includes the photoelectric composite transmission module according to (1), wherein the cured product is a cured product formed by heating the aforementioned material, or a cured product formed by heating the aforementioned material and irradiating active energy rays.

Since the cured product is a cured product formed by heating a material, or a cured product formed by heating a material and irradiating active energy rays, it can be formed as a joint of the cured product by low-temperature heating that can suppress damage to the optical element member.

The present invention (3) includes the photoelectric composite transmission module as (1) or (2), wherein the above-mentioned joining member has a linear expansion coefficient of 70 ppm or less.

In the photoelectric composite transmission module, since the bonding member has a linear expansion coefficient of 70 ppm or less, the warpage of the photoelectric hybrid substrate can be suppressed. Therefore, the bonding member has excellent bonding properties to the printed wiring board and the circuit board.

The present invention (4) includes the photoelectric composite transmission module according to any one of (1) to (3), wherein the material of the optical waveguide is epoxy resin.

In the photoelectric composite transmission module, since the material of the optical waveguide is epoxy resin, it has excellent heat resistance and light transmission.

The present invention (5) includes the photoelectric composite transmission module according to any one of (1) to (4), wherein the circuit board includes a first terminal, the printed wiring board includes a second terminal, and the connection portion includes the A conductive member that contacts the first terminal and the second terminal.

In the photoelectric composite transmission module, since the connection part includes the conductive member contacting the first terminal and the second terminal, the electrical connection reliability of the printed wiring board and the circuit board is excellent. [Effects of Invention]

The photoelectric composite transmission module of the present invention can inhibit the damage of the optical element.

An embodiment of the photoelectric composite transmission module of the present invention will be described with reference to FIGS. 1 to 2.

The photoelectric composite transmission module 1 has a substantially plate (or sheet) shape extending in the length direction. The photoelectric composite transmission module 1 includes a photoelectric hybrid substrate 2, a printed wiring board 3, an optical element 4, and a bonding part 5.

The photoelectric hybrid substrate 2 has a substantially plate shape extending in the longitudinal direction. The photoelectric hybrid substrate 2 includes an optical waveguide 6 and a circuit board 7 in this order toward the upper side (an example of one side in the thickness direction).

The optical waveguide 6 is located at the lower part of the photoelectric hybrid substrate 2. The optical waveguide 6 has a substantially sheet shape extending in the longitudinal direction. The optical waveguide 6 is provided with a bottom cladding layer 8, a core layer 9 and an upper cladding layer 10 in this order toward the lower side (an example of the other side in the thickness direction). The peripheral surface of the core layer 9 in a front cross-sectional view is covered by the bottom cladding layer 8 and the upper cladding layer 10. Furthermore, a mirror 11 is formed at one end of the core layer 9 in the longitudinal direction. Examples of the material of the optical waveguide 6 include transparent materials such as epoxy resin, acrylic resin, and silicone resin. Preferably, from the viewpoint of heat resistance and optical signal transmission properties, epoxy resin is used.

The circuit board 7 is arranged on the upper side of the optical waveguide 6. The circuit board 7 has a substantially plate shape extending in the longitudinal direction. The circuit board 7 includes a metal support layer 12, a base insulating layer 13, and a first conductor layer 14 in this order toward the upper side. The metal supporting layer 12 is formed in a region corresponding to the first conductor layer 14. The insulating base layer 13 has the same planar shape as the circuit board 7.

The first conductor layer 14 includes a first terminal 15, a third terminal 17 and a first wiring 16.

A plurality of first terminals 15 are arranged at one end of the photoelectric hybrid substrate 2 in the longitudinal direction. Specifically, the plurality of first terminals 15 are arranged at one end in the longitudinal direction in the bonding area 18 overlapping the printed wiring board 3 when projected in the vertical direction. The plurality of first terminals 15 are arranged in a substantially U-shape in a plan view so as to surround the plurality of third terminals 17 described below. The joining area 18 has a substantially U-shape opening toward the other side in the longitudinal direction at one end in the longitudinal direction in a plan view. The plurality of first terminals 15 are arranged neatly in line with each other in the bonding area 18 at intervals.

A plurality of third terminals 17 are arranged at the center of one end of the circuit board 7 in the longitudinal direction in a plan view. The plurality of third terminals 17 and the first terminal 15 are spaced apart from each other. The plurality of third terminals 17 are arranged neatly at intervals in the longitudinal direction and the width direction.

The first wiring 16 electrically connects each of the plurality of first terminals 15 and each of the plurality of third terminals 17.

Furthermore, although not shown, the circuit board 7 may be provided with an insulating cover layer covering the first wiring 16 on the upper surface of the insulating base layer.

The printed wiring board 3 and the circuit board 7 are electrically connected and joined. The printed wiring board 3 has a substantially flat plate shape extending in the longitudinal direction and wider than the opto-electric hybrid substrate 2. The center in the width direction of the other end in the longitudinal direction of the printed wiring board 3 is cut into a substantially rectangular shape in plan view. Thereby, the printed wiring board 3 includes two extended portions 19 extending toward the other side in the longitudinal direction, and a connecting portion 20 connecting the base ends of the two extended portions 19. The two extended portions 19 and the connecting portion 20 When projecting in the vertical direction, the junction area 18 of the photoelectric hybrid substrate 2 is included. The two extension portions 19 are arranged on both sides of the third terminal 17 in the width direction. The printed wiring board 3 includes a support board 21 and a conductor circuit 22.

The support plate 21 has a substantially plate shape that extends in the longitudinal direction and cuts the center of the other end in the longitudinal direction. Examples of the material of the support plate 21 include hard materials such as glass fiber reinforced epoxy resin.

The conductor circuit 22 includes a second terminal 23, a fourth terminal 24, and a conductor wire 25.

A plurality of second terminals 23 are arranged below the support plate 21. Each of the plurality of second terminals 23 and the upper side of each of the plurality of first terminals 15 of the opto-electric hybrid substrate 2 are arranged to face each other with an interval therebetween. Each of the plurality of second terminals 23 coincides with each of the plurality of first terminals 15 when projected in the vertical direction. The plurality of second terminals 23 are arranged in a substantially U-shape with a space between the two extended portions 19 and the connecting portion 20 of the support plate 21.

The fourth terminal 24 is arranged on one end surface of the support plate 21 in the longitudinal direction.

The conductor wire 25 electrically connects the second terminal 23 and the fourth terminal 24. Furthermore, the conductor wire 25 includes a through hole 26 through which the support plate 21 penetrates in the vertical direction. The lower edge of the through hole 26 is in contact with the upper edge of the second terminal 23.

Examples of the material of the conductor circuit 22 include conductor materials such as copper.

The optical element 4 is mounted on the central portion of the upper surface of one end portion in the longitudinal direction of the optical-electric hybrid substrate 2. In detail, the optical element 4 is surrounded by the bonding area 18 having a substantially U-shape in a plan view. The optical element 4 is provided with light entrances and exits and electrodes not shown. The entrance and exit are optically connected with the reflecting mirror 11. The electrode is electrically connected to the third terminal 17. Thereby, the optical element 4 is optically connected to the optical waveguide 6 and electrically connected to the circuit board 7.

The bonding part 5 includes a conductive member 27 and a bonding member 28.

The conductive member 27 is arranged between the first terminal 15 and the second terminal 23 and is in contact with the same. The conductive member 27 connects the first terminal 15 and the second terminal 23 in the vertical direction. The conductive members 27 are provided in plural corresponding to the plural first terminals 15 and the plural second terminals 23. In addition, the conductive member 27 is in contact with, for example, the upper surface of the first terminal 15 and the lower surface of the third terminal 17, but does not contact the peripheral side surfaces thereof.

The conductive member 27, the first terminal 15 and the third terminal 17 have an electrical conduction relationship, and therefore constitute a connection portion 29 that electrically connects the printed wiring board 3 and the circuit board 7. The connection part 29 includes a conductive member 27, a first terminal 15 and a third terminal 17.

The connecting portion 29 is provided in plural corresponding to the plural first terminals 15, the plural third terminals 17, and the plural conductive members 27.

Examples of the material of the conductive member 27 include metals such as gold and alloys (solder, etc.).

The bonding member 28 covers a plurality of connection portions 29 and bonds the printed wiring board 3 and the circuit board 7.

Specifically, the bonding member 28 is disposed on the entire bonding area 18 and filled between the opto-electric hybrid substrate 2 and the printed wiring board 3 corresponding to the bonding area 18. The joining member 28 covers the side surfaces of a plurality of connecting parts 29. One joint member 28 is provided in the joint area 18 with respect to the plurality of connection parts 29. The outer shape of the joining member 28 in plan view is the same as the outer shape of the joining region 18 in plan view.

The joining member 28 is a cured product of a curable composition. In other words, the material (raw material) of the joining member 28 is a curable composition, and the cured product after hardening is the joining member 28.

The curable composition can be cured by heating at 100°C for 2 hours.

Specifically, the curable composition contains a curable resin.

Examples of curable resins include thermosetting resins that can be cured by heating, such as thermo-photocurable resins that can be cured by heating and irradiating light (active energy rays), such as moisture-curable resins. . These can be used individually or in combination of 2 or more types. Furthermore, the type of the above-mentioned curable resin is not strictly distinguished.

Examples of curable resins include epoxy resins, silicone resins, polyurethane resins, polyimide resins, urea resins, melamine resins, and unsaturated polyester resins. These can be used individually or in combination of 2 or more types. In addition, when the curable resin contains an epoxy resin, the curable composition is an epoxy resin composition.

Examples of epoxy resins include bisphenol A epoxy resins, bisphenol F epoxy resins, bisphenol S epoxy resins, brominated bisphenol A epoxy resins, and hydrogenated bisphenol A epoxy resins. , Bisphenol AF type epoxy resin, biphenyl type epoxy resin, naphthalene type epoxy resin, sulphur type epoxy resin, phenol novolak type epoxy resin, o-cresol novolak type epoxy resin, trihydroxybenzene Difunctional epoxy resin or multifunctional epoxy resin such as methane type epoxy resin and tetraphenol ethane type epoxy resin. Examples of epoxy resins include hydantoin type epoxy resins, triglycidyl isocyanurate type epoxy resins, and glycidylamine type epoxy resins. These can be used individually or in combination of 2 or more types.

Examples of silicone resins include pure silicone resins such as methyl silicone resin, phenyl silicone resin, and methyl phenyl silicone resin, such as alkyd modified silicone resin and polyester. Modified silicone resin, polyurethane modified silicone resin, epoxy modified silicone resin, acrylic modified silicone resin and other modified silicone resins. These can be used individually or in combination of 2 or more types.

Furthermore, when the curable composition is an epoxy resin composition, the curable composition may further contain a curing agent such as an imidazole compound and an amine compound. Furthermore, the curable composition may contain, for example, a curing accelerator such as a urea compound, a tertiary amine compound, a phosphorus compound, a tertiary ammonium salt compound, and an organic metal salt compound.

In addition, when the curable resin is a thermo-photocurable resin, the curable composition may contain a photoinitiator, for example.

Furthermore, the curable composition may contain a reactive monomer.

Furthermore, in addition to the above, the curable composition may contain a filler.

The filler is not particularly limited. Examples thereof include inorganic fillers such as aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, quartz glass, talc, silicon oxide, aluminum nitride, silicon nitride, and boron nitride, such as acrylic acid. Organic fillers such as resin particles and silicone resin particles.

Furthermore, the curable composition can further contain additives such as a coupling agent and a lubricant in an appropriate ratio.

The ratio of each component in the curable composition is appropriately set according to the application and purpose. The ratio of the curable resin in the curable composition is, for example, 50% by mass or more and 90% by mass or less. The ratio of the curing agent in the curable composition is, for example, 1% by mass or more, and for example, 40% by mass or less. The ratio of the curing accelerator in the curable composition is, for example, 0.5% by mass or more, and for example, 10% by mass or less. The ratio of the reactive monomer in the curable composition is, for example, 1% by mass or more and 10% by mass or less. The proportion of the filler in the curable composition is, for example, 1% by mass or more and 40% by mass or less.

Furthermore, as described above, the curable composition can be cured by heating at 100°C for 2 hours. The so-called hardening does not mean semi-hardening as B-staged, but refers to complete hardening as C-staged.

On the contrary, if the curable composition is cured by heating at 100°C for 2 hours as described above, but is cured by heating conditions that are more severe than the above heating conditions (for example, heating at 150°C for 2 hours) When the curable composition is cured under severe heating conditions, the optical element 4 will be damaged.

In addition, the curable composition is a resin as follows: Even if it is the above-mentioned thermo-photo-curable resin that can be cured by heating and light irradiation, it does not need to be irradiated with light, and it is simply heated at 100°C for 2 hours as described above. Can harden.

Preferably, the curable composition can be cured by heating at 80°C for 2 hours.

Furthermore, it is preferable that the curable composition can be cured by heating at 100°C for 1 hour.

The thermal expansion coefficient of the joining member 28 is, for example, 150 ppm or less, preferably 100 ppm or less, more preferably 70 ppm or less, and still more preferably 50 ppm or less. In addition, the thermal expansion coefficient of the joining member 28 is, for example, 0 ppm or more.

If the thermal expansion coefficient of the bonding member 28 is lower than the above upper limit, the warpage of the photoelectric hybrid substrate 2 can be suppressed. Therefore, the bonding member 28 has excellent bonding properties to the printed wiring board 3 and the circuit board 7.

Next, the manufacturing method of the photoelectric composite transmission module 1 will be described.

First, each of the photoelectric hybrid board 2, the printed wiring board 3, and the optical element 4 is prepared.

A curable composition (raw material of the joining member 28) is prepared. Specifically, the above-mentioned components are mixed in the above-mentioned ratio.

Then, the optical element 4 is mounted on the photoelectric hybrid substrate 2. The electrode of the optical element (not shown) is electrically connected to the third terminal 17 of the photoelectric hybrid substrate 2. In addition, the light entrance and exit of the optical element (not shown) are optically connected to the reflecting mirror 11.

Then, the conductive member 27 is arranged on the upper surface of the first terminal 15.

Then, the printed wiring board 3 is arranged on the optoelectronic hybrid substrate 2 (the optoelectronic hybrid substrate 2 on which the optical element 4 is mounted) such that the second terminal 23 is in contact with the upper end of the conductive member 27.

Then, the curable composition (raw material of the bonding member 28) is filled (injected) into the bonding of the optoelectronic hybrid substrate 2 and the printed wiring board 3 in such a way that it contacts the side surfaces of the first terminal 15, the second terminal 23, and the conductive member 27 Area 18.

After that, when the curable composition contains a thermosetting resin, the curable composition is heated. The heating conditions are, for example, low temperature conditions that do not damage the optical element 4, for example, 130°C or lower, preferably 110°C or lower, more preferably 100°C or lower, still more preferably 80°C or lower, and, for example, 50°C or higher. The heating time is, for example, less than 2 hours, preferably 1 hour or less, more preferably 45 minutes or less, still more preferably 30 minutes or less, particularly preferably 15 minutes or less.

Specifically, if the heating time is 130°C or less, the heating conditions are set to 15 minutes or less. If the heating time is 110°C or less, the heating conditions are set to 30 minutes or less. If the heating time is 100°C or less, the heating conditions are set to 45 minutes or less. If the heating time is 80°C or less, the heating conditions are set to 1 hour or less.

Moreover, when the curable composition contains a thermo-photocurable resin and a photoinitiator, the curable composition is irradiated with light and heated.

For example, a curable composition containing a thermo-photocurable resin and a photoinitiator is first irradiated with light, and then the curable composition is heated.

Examples of light include ultraviolet rays.

The energy of light is not particularly limited. For example, it is 10 J/m ² or more, preferably 100 J/m ² or more, and, for example, 10,000 J/m ² or less, preferably 1,000 J/m ² or less.

Furthermore, in this case, it is allowed to partially include a portion where the curable composition is not irradiated with light in the bonding region 18.

Then, the curable composition is heated. The heating conditions may be the same as the heating conditions when the curable composition contains a thermosetting resin, and are preferably more gentle. For example, it is 110°C or lower, preferably 100°C or lower, more preferably 80°C or lower, still more preferably 70°C or lower, and, for example, 40°C or higher. The heating time is, for example, less than 1 hour, preferably 30 minutes or less, more preferably 15 minutes or less, still more preferably 10 minutes or less, and particularly preferably 5 minutes or less.

Specifically, if the heating time is 110°C or less, the heating conditions are set to 5 minutes or less. If the heating time is 100°C or less, the heating conditions are set to 10 minutes or less. If the heating time is 80°C or less, the heating conditions are set to 15 minutes or less. If the heating time is 70°C or less, the heating conditions are set to 30 minutes or less.

The part not irradiated with light by this heating is hardened by the following heating.

By the above heating, the conductive member 27 is reflowed, and the first terminal 15 and the second terminal 23 are electrically connected via the conductive member 27. The connecting portion 29 is formed by the first terminal 15, the second terminal 23, and the reflowed conductive member 27.

The hardened body produced by curing the curable composition by the above-mentioned heating, or heating and light irradiation, and the joining member 28 as the hardened body joins the photoelectric hybrid substrate 2 in the joining area 18 to the printed wiring board 3 (adhesive) . At the same time, the joining member 28 reinforces a plurality of connecting parts 29.

Furthermore, when the curable composition contains a moisture curable resin, the conductive member 27 is preliminarily reflowed by heating to form the connecting portion 29, and then the curable composition is injected around the connecting portion 29. Then, place it under normal temperature and humidity (or high humidity) conditions. The leaving time is, for example, 10 hours or more, and for example, 100 hours or less.

Moreover, in this photoelectric composite transmission module, the curable composition as a material can be cured by heating at 100°C for 2 hours, so that the electrical connection portion 29 of the printed wiring board 3 and the circuit board 7 is covered, and thereafter, the The optical element 4 is heated under low temperature conditions to prevent damage to the optical element 4, and the bonding member 28 as a cured product can be formed.

Therefore, the photoelectric composite transmission module 1 can suppress the damage of the optical element 4.

In addition, in the photoelectric composite transmission module 1, the bonding member 28 is a cured product formed by heating a material, or a cured product formed by heating a material and irradiating light, so that damage to the optical element 4 can be suppressed The low temperature heating forms the joining member 28.

Furthermore, it may be considered that the joining member 28 is a structure of a hardened product formed only by light irradiation. In this configuration, the curable composition contains a photocurable resin, and in the manufacturing step, the curable composition is irradiated with light. In the above-mentioned steps, depending on the arrangement and/or shape of the bonding region 18, light cannot be irradiated to the entire curable composition, so an uncured portion remains. Therefore, this configuration is not suitable.

In addition, in the photoelectric composite transmission module 1, if the bonding member 28 has a linear expansion coefficient of 70 ppm or less, the warpage of the photoelectric hybrid substrate 2 can be suppressed. Therefore, the bonding properties of the printed wiring board 3 and the circuit board 7 by the bonding member 28 are excellent.

In the photoelectric composite transmission module 1, if the material of the optical waveguide 6 is an epoxy resin composition, the heat resistance and the transmission of optical signals are excellent.

In the photoelectric composite transmission module 1, the connection portion 29 includes the conductive member 27 that contacts the first terminal 15 and the second terminal 23, so the electrical connection reliability of the printed wiring board 3 and the circuit board 7 is excellent.

＜Change example＞ In the following modification examples, the same reference numerals are given to the same members and steps as those in the above-mentioned embodiment, and detailed descriptions thereof are omitted. In addition, each modified example can exert the same effect as the first embodiment, except for special description. Furthermore, an embodiment and its modification examples can be combined as appropriate.

In the manufacturing method of one embodiment, the conductive member 27 is first arranged on the first terminal 15. However, for example, the conductive member 27 may be first arranged on the second terminal 23, and then the lower end of the conductive member 27 is connected to the first terminal 15 The upper surface touches.

In one embodiment, the top view shape of the bonding area 18 is substantially U-shaped, but it is not limited to this. For example, it may be a rectangular shape that is longer in the width direction or a rectangular shape that is longer in the length direction.

When curing the thermo-photocurable resin, the order of light irradiation and heating is not limited to the above. For example, it may be heated first and then light irradiated. [Example]

Examples and comparative examples are presented below to explain the present invention more specifically. In addition, the present invention is not limited to any Examples and Comparative Examples. In addition, specific numerical values such as the mixing ratio (ratio), physical property values, and parameters used in the following description can replace the upper limit of the corresponding mixing ratio (ratio), physical property values, parameters, etc., described in the above-mentioned "embodiment" (Defined as "below", "not reached" value) or lower limit (defined as "above", "over" value).

First, the raw materials of the joining member 28 used are described below. Curable composition A: SUF1575 (manufactured by Namics) Curable composition B: thermo-light curing epoxy resin Curable composition C: TB2274S (manufactured by Threebond) Curable composition D: 87776SL1 (manufactured by Kyoritsu Chemical Industry Co., Ltd.) Curable composition E: TB2280C (manufactured by ThreeBond) Examples 1 to 4, Comparative Example 1 An embodiment of the photoelectric composite transmission module 1 is manufactured.

Furthermore, the raw materials described in Table 1 were cured by the method described in Table 1 to form the joining member 28 as a cured product.

In addition, the optical waveguides are all formed of epoxy resin.

Comparative example 2 Try to manufacture the photoelectric composite transmission module 1 of an embodiment. The raw materials described in Table 1 were heated by the method described in Table 1 (100°C, 2 hours), but the raw materials were not hardened, so that the joining member 28 as a hardened product was not formed. That is, the photoelectric composite transmission module 1 has not been manufactured.

＜Evaluation＞ Evaluate the following items.

(1) Damage to optical components The optical element 4 in the photoelectric composite transmission module 1 of Examples 1 to 4 and Comparative Example 1 was observed, and the evaluation was performed on the following basis. ○: No damage to the optical element 4 was observed. ×: Damage to the optical element 4 is observed.

(2) Hardening test A and B Under the heating conditions of Hardening Test A described in Table 1, the materials of Examples 1 to 4 were hardened.

Under the heating conditions of Hardening Test B described in Table 1, the raw material of Comparative Example 1 was hardened.

Under the heating conditions of Hardening Test A described in Table 1, an attempt was made to harden the raw material of Comparative Example 2, but it did not harden.

(3) Warpage The optoelectronic hybrid substrate 2 near the junction area 18 of the optoelectronic composite transmission module 1 of Examples 1 to 4 and Comparative Example 1 was observed, and the warpage was evaluated as follows. ○: No warpage is observed. △: Slight warpage is observed.

(4) Thermal expansion coefficient of joint components The thermal expansion coefficients of the joining member 28 in the photoelectric composite transmission module 1 of Examples 1 to 4 and Comparative Example 1 were obtained.

[Table 1] Example 1 Example 2 Example 3 Example 4 Comparative example 1 Comparative example 2 Joining member Hardening composition A B C D E E Hardening conditions when joining 90℃, only heating for 90 minutes Ultraviolet radiation ※1＋90℃, heating for 60 minutes 90℃, only heating for 60 minutes Ultraviolet radiation ※1＋90℃, heating for 60 minutes 130℃, only heating for 90 minutes 90℃, only heating for 90 minutes Evaluation Damage to optical components 〇 〇 〇 〇 × - Hardening test A (100°C, heating for 2 hours) <low temperature heating> hardening hardening hardening hardening - Not hardened Hardening test B (150℃, 2 hours) <High temperature heating> - - - - hardening - Warpage 〇 〇 ∆ ∆ 〇 - Coefficient of linear expansion of joining components (ppm) 50 50 100 100 50 - ※1: Line amount [1000]J/m ²

In addition, the above-mentioned invention is provided as an exemplary embodiment of the present invention, but this is only an illustration and is not interpreted in a restrictive manner. Variations of the present invention cleared by the industry in this technical field are included in the scope of the following patent applications. [Industrial availability]

The photoelectric composite transmission module is used for the composite transmission of light and electricity.

1: Photoelectric composite transmission module 2: Optical hybrid substrate 3: Printed wiring board 4: optical components 5: Joint 6: Optical waveguide 7: Circuit board 8: bottom coating 9: core layer 10: Upper cladding layer 11: Mirror 12: Metal support layer 13: Base insulating layer 14: The first conductor layer 15: Terminal 1 16: first wiring 17: Terminal 3 18: Joint area 19: Extension 20: Connection 21: Support board 22: Conductor circuit 23: 2nd terminal 24: 4th terminal 25: Conductor wire 26: Through hole 27: Conductive member 28: Joint member 29: Connection part

Fig. 1 is a top view of an embodiment of the photoelectric composite transmission module of the present invention. Fig. 2 is a side cross-sectional view of the photoelectric composite transmission module shown in Fig. 1 along line X-X.

1: Photoelectric composite transmission module

2: Optical hybrid substrate

3: Printed wiring board

4: optical components

5: Joint

6: Optical waveguide

7: Circuit board

8: bottom coating

9: core layer

10: Upper cladding layer

11: Mirror

12: Metal support layer

13: Base insulating layer

14: The first conductor layer

15: Terminal 1

16: first wiring

17: Terminal 3

18: Joint area

20: Connection

21: Support board

22: Conductor circuit

23: 2nd terminal

25: Conductor wire

26: Through hole

27: Conductive member

28: Joint member

29: Connection part

Claims (5)

An optoelectronic composite transmission module, characterized in that it has: A photoelectric hybrid substrate, which is provided with an optical waveguide and a circuit substrate in the thickness direction; A printed wiring board, which is joined to the circuit substrate in a manner of being electrically connected to the circuit substrate; An optical element mounted on the opto-electronic hybrid substrate in a manner that is optically connected to the optical waveguide and electrically connected to the circuit substrate; and A joining member that covers the electrical connection portion of the printed wiring board and the circuit board, and joins the printed wiring board and the circuit board; and The aforementioned joining member is a cured product of a material that can be cured by heating at 100°C for 2 hours. The optoelectronic composite transmission module according to claim 1, wherein the cured product is a cured product formed by heating the aforementioned material, or a cured product formed by heating the aforementioned material and irradiating active energy rays. The photoelectric composite transmission module of claim 1 or 2, wherein the above-mentioned joining member has a linear expansion coefficient of 70 ppm or less. Such as the photoelectric composite transmission module of claim 1 or 2, wherein the material of the optical waveguide is epoxy resin. Such as the photoelectric composite transmission module of claim 1 or 2, wherein the circuit board has a first terminal, The printed wiring board is provided with a second terminal, The connection portion includes a conductive member that is in contact with the first terminal and the second terminal.

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