TW202035635A - Adhesive composition and adhesive tape - Google Patents

Adhesive composition and adhesive tape Download PDF

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TW202035635A
TW202035635A TW109107119A TW109107119A TW202035635A TW 202035635 A TW202035635 A TW 202035635A TW 109107119 A TW109107119 A TW 109107119A TW 109107119 A TW109107119 A TW 109107119A TW 202035635 A TW202035635 A TW 202035635A
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adhesive
polysiloxane
weight
functional group
graft copolymer
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TW109107119A
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Chinese (zh)
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下地頭所彰
緒方雄大
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日商積水化學工業股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J151/00Adhesives based on graft polymers in which the grafted component is obtained by reactions only involving carbon-to-carbon unsaturated bonds; Adhesives based on derivatives of such polymers
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00Adhesives based on unspecified macromolecular compounds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation

Abstract

The present invention makes it possible to provide an adhesive composition capable of suppressing adhesion enhancement even when subjected to a high-temperature heat treatment step while having high adhesive strength at the time of application, and an adhesive tape having an adhesive layer composed of the adhesive composition. The present invention is an adhesive composition that contains an adhesive component and a silicone-based graft copolymer having a functional group capable of crosslinking with the adhesive component.

Description

黏著劑組成物及黏著帶Adhesive composition and adhesive tape

本發明係關於一種黏著劑組成物、及具有由該黏著劑組成物所構成之黏著劑層之黏著帶。The present invention relates to an adhesive composition and an adhesive tape having an adhesive layer composed of the adhesive composition.

近年來,黏著帶被用於各種產業領域。於建築領域中,於保護片之暫時固定、內飾材料之貼合等時使用雙面黏著帶;於汽車領域中,於片材、感測器等內飾零件之固定、側飾條、側窗遮陽板等外飾零件之固定等時使用雙面黏著帶;於電氣電子領域中,於組裝模組、模組向殼體之貼合等時使用雙面黏著帶。具體而言,例如於搭載有影像顯示裝置或輸入裝置之可攜式電子機器(例如行動電話、行動資訊終端等)中,為了組裝而使用雙面黏著帶。更具體而言,例如,為了將用以保護可攜式電子機器之表面之蓋板黏接於觸控面板模組或顯示面板模組,或將觸控面板模組與顯示面板模組黏接,而使用雙面黏著帶。此種雙面黏著帶例如以沖裁成邊框狀等形狀並配置於顯示畫面之周邊之方式來使用(例如專利文獻1、2)。又,於將車輛零件(例如車載用面板)固定於車輛本體之用途中亦使用雙面黏著帶。 [先前技術文獻] [專利文獻]In recent years, adhesive tapes have been used in various industrial fields. In the construction field, double-sided adhesive tape is used for the temporary fixing of protective sheets and the lamination of interior materials; in the automotive field, it is used for fixing, side moldings, and side trims of interior parts such as sheets and sensors. Double-sided adhesive tape is used when fixing exterior parts such as window visors; in the electrical and electronic fields, double-sided adhesive tape is used when assembling modules and attaching modules to shells. Specifically, for example, in portable electronic devices (such as mobile phones, mobile information terminals, etc.) equipped with image display devices or input devices, double-sided adhesive tapes are used for assembly. More specifically, for example, in order to bond the cover for protecting the surface of the portable electronic machine to the touch panel module or the display panel module, or to bond the touch panel module and the display panel module , And use double-sided adhesive tape. Such a double-sided adhesive tape is used, for example, by punching it into a frame shape or the like and arranging it on the periphery of the display screen (for example, Patent Literature 1 and 2). In addition, double-sided adhesive tapes are also used for fixing vehicle parts (such as automotive panels) to the vehicle body. [Prior Technical Literature] [Patent Literature]

專利文獻1:日本特開2009-242541號公報 專利文獻2:日本特開2009-258274號公報Patent Document 1: Japanese Patent Application Publication No. 2009-242541 Patent Document 2: Japanese Patent Application Publication No. 2009-258274

[發明所欲解決之課題][The problem to be solved by the invention]

根據黏著帶之用途,於將黏著帶貼附於被黏著體之狀態下進行高溫熱處理步驟,其後需要剝離黏著帶。例如於半導體晶片等電子零件之製造步驟中,於將半導體晶圓經由雙面黏著帶黏接於支持板來補強之狀態下,進行各種高溫熱處理步驟,於其後自支持板剝離半導體晶圓。此處,若因高溫熱處理步驟而黏著帶發生接著亢進,則有時變得難以自支持板剝離半導體晶圓,或於剝離時糊劑殘留於半導體晶圓之表面。針對此,將聚矽氧化合物作為剝離助劑摻合於黏著劑層中。藉由摻合聚矽氧化合物,可利用自黏著劑層滲出之聚矽氧化合物來抑制接著亢進。According to the purpose of the adhesive tape, a high-temperature heat treatment step is carried out while the adhesive tape is attached to the adherend, and then the adhesive tape needs to be peeled off. For example, in the manufacturing steps of electronic parts such as semiconductor chips, various high-temperature heat treatment steps are performed in a state where the semiconductor wafer is bonded to a support plate via a double-sided adhesive tape for reinforcement, and then the semiconductor wafer is peeled from the support plate. Here, if the adhesion of the adhesive tape increases due to the high-temperature heat treatment step, it may become difficult to peel the semiconductor wafer from the support plate, or the paste may remain on the surface of the semiconductor wafer during the peeling. In response to this, polysiloxane compound is blended into the adhesive layer as a peeling aid. By blending the silicone compound, the silicone compound exuded from the adhesive layer can be used to suppress the subsequent increase.

然而,以往之聚矽氧化合物根據被黏著體之種類,存在難以充分抑制接著亢進之情形。以往之聚矽氧化合物由於為低極性,故而有與高極性物質之親和性較低之性質,於被黏著體為半導體晶圓之類之極性較高者之情形時,滲出至黏著帶表面之聚矽氧化合物無法留在表面,而自與被黏著體之界面擴散。因此,有時存在於黏著帶與被黏著體之界面之聚矽氧化合物減少而無法充分抑制接著亢進。However, depending on the type of the adherend, the conventional silicone compound has a situation where it is difficult to sufficiently suppress the adhesion enhancement. Conventional polysiloxane compounds have low affinity with highly polar substances due to their low polarity. When the adherend is a semiconductor wafer with high polarity, it will ooze out to the surface of the adhesive tape. The polysiloxane cannot stay on the surface, but diffuses from the interface with the adherend. Therefore, sometimes the polysiloxane present at the interface between the adhesive tape and the adherend decreases, and the subsequent increase cannot be sufficiently suppressed.

又,黏著帶一方面需要抑制接著亢進,另一方面還需要於貼附時具有較高之黏著力(以下將貼附時之黏著力稱為初始黏著力)。然而,以往之聚矽氧化合物亦存在若不大量地使用則無法抑制接著亢進,若大量地使用聚矽氧化合物則初始黏著力降低之問題。In addition, the adhesive tape needs to suppress the subsequent hyperplasia on the one hand, and on the other hand, it also needs to have a high adhesive force during attachment (hereinafter, the adhesive force during attachment is referred to as the initial adhesive force). However, the conventional polysiloxane also has a problem that the adhesion cannot be suppressed if it is not used in a large amount, and the initial adhesion is lowered if the polysiloxane is used in a large amount.

本發明之目的在於鑒於上述現狀,提供一種儘管於貼附時具有較高之黏著力,但即便供於高溫熱處理步驟亦可抑制接著亢進之黏著劑組成物、及具有由該黏著劑組成物所構成之黏著劑層之黏著帶。 [解決課題之技術手段]The object of the present invention is to provide an adhesive composition that can suppress the subsequent increase even if it is used in a high-temperature heat treatment step, even if it is used in the high-temperature heat treatment step, and has a composition made of the adhesive composition. The adhesive tape that constitutes the adhesive layer. [Technical means to solve the problem]

本發明係一種黏著劑組成物,其含有黏著劑成分及聚矽氧系接枝共聚物,該聚矽氧系接枝共聚物具有能夠與上述黏著劑成分交聯之官能基。 以下對本發明進行詳細說明。The present invention is an adhesive composition, which contains an adhesive component and a silicone-based graft copolymer. The silicone-based graft copolymer has a functional group capable of crosslinking with the adhesive component. The present invention will be described in detail below.

本發明之一實施態樣之黏著劑組成物含有黏著劑成分。 上述黏著劑成分並無特別限制,可為硬化型黏著劑成分,亦可為非硬化型黏著劑成分,但較佳為硬化型黏著劑成分。其中,本發明之一實施態樣之黏著劑組成物較佳為以作為硬化型黏著劑成分之聚合性聚合物作為主成分且含有聚合起始劑之硬化型黏著劑組成物。 若黏著劑成分為硬化型黏著劑成分,則硬化前由黏著劑組成物所構成之黏著劑層能夠良好地密接於被黏著體,因此於貼附時可表現出較高之黏著力。進而,藉由使黏著劑成分硬化,可使黏著劑層之彈性模數提高,因此藉由於熱處理步驟之前或熱處理步驟時使黏著劑成分硬化,可抑制於高溫下之接著亢進。又,藉由黏著劑層之彈性模數提高,亦可抑制糊劑殘留於被黏著體。The adhesive composition of one embodiment of the present invention contains an adhesive component. The above-mentioned adhesive component is not particularly limited, and may be a hardening adhesive component or a non-hardening adhesive component, but it is preferably a hardening adhesive component. Among them, the adhesive composition of one embodiment of the present invention is preferably a curable adhesive composition mainly composed of a polymerizable polymer as a curable adhesive component and containing a polymerization initiator. If the adhesive component is a hardening type adhesive component, the adhesive layer composed of the adhesive composition can be well adhered to the adherend before hardening, so it can exhibit a high adhesive force during sticking. Furthermore, by hardening the adhesive component, the elastic modulus of the adhesive layer can be improved. Therefore, by hardening the adhesive component before the heat treatment step or during the heat treatment step, the adhesion increase at high temperature can be suppressed. In addition, by improving the elastic modulus of the adhesive layer, it is also possible to prevent the paste from remaining on the adherend.

作為上述硬化型黏著劑組成物,可列舉含有上述聚合性聚合物及光聚合起始劑之光硬化型黏著劑組成物、或含有上述聚合性聚合物及熱聚合起始劑之熱硬化型黏著劑組成物。其中,就可藉由熱處理步驟之熱而硬化,且無需光硬化設備或光硬化步驟之方面而言,較佳為熱硬化型黏著劑組成物。於硬化型黏著劑組成物為熱硬化型黏著劑組成物之情形時,僅憑經過加熱步驟便無需另外設置硬化步驟,因此亦可減少步驟數。又,上述硬化型黏著劑組成物並無特別限定,但就耐熱性、耐候性優異,且能夠應用於範圍廣泛之被黏著體之方面而言,較佳為丙烯酸系黏著劑組成物。 上述黏著劑成分之結構並無特別限定,可為無規共聚物,亦可為嵌段共聚物、接枝共聚物。Examples of the curable adhesive composition include a photocurable adhesive composition containing the polymerizable polymer and a photopolymerization initiator, or a thermosetting adhesive composition containing the polymerizable polymer and a thermal polymerization initiator.剂组合物。 Agent composition. Among them, in terms of being hardenable by the heat of the heat treatment step and requiring no light hardening equipment or light hardening step, a thermosetting adhesive composition is preferred. When the hardening type adhesive composition is a heat hardening type adhesive composition, it is not necessary to provide an additional hardening step only by passing through the heating step, so the number of steps can also be reduced. In addition, the above-mentioned curable adhesive composition is not particularly limited, but it is preferably an acrylic adhesive composition in terms of excellent heat resistance and weather resistance and being applicable to a wide range of adherends. The structure of the above-mentioned adhesive component is not particularly limited, and it may be a random copolymer, a block copolymer or a graft copolymer.

於上述黏著劑成分為硬化型黏著劑成分之情形時,用以發揮硬化性之交聯性官能基並無特別限定,但較佳為自由基聚合性不飽和鍵。即,上述黏著劑成分較佳為於分子內具有自由基聚合性不飽和鍵。 上述黏著劑成分於在分子內具有自由基聚合性不飽和鍵之情形時,即,硬化型黏著劑成分之交聯性官能基為自由基聚合性不飽和鍵之情形時,相較於使用其他交聯性官能基,交聯點之極性降低,而可提高交聯密度。藉此,由黏著劑組成物所構成之黏著劑層之彈性模數更為提高,而可更為抑制接著亢進。又,藉由使彈性模數提高,亦可抑制糊劑殘留。 再者,上述自由基聚合性不飽和鍵係不僅可於上述黏著劑成分內構建交聯結構,亦能夠與下述聚矽氧系接枝共聚物交聯之官能基,且為亦有助於上述黏著劑成分與聚矽氧系接枝共聚物之交聯者。於上述黏著劑成分具有除上述自由基聚合性不飽和鍵以外之能夠與聚矽氧系接枝共聚物交聯之官能基之情形時,此類官能基並無特別限定,例如可列舉羧基、羥基、醯胺基、異氰酸基(isocyanate group)、環氧基等。該等能夠與聚矽氧系接枝共聚物交聯之官能基可單獨使用,亦可併用2種以上。When the aforementioned adhesive component is a curable adhesive component, the crosslinkable functional group for exhibiting curability is not particularly limited, but it is preferably a radically polymerizable unsaturated bond. That is, it is preferable that the said adhesive component has a radically polymerizable unsaturated bond in a molecule|numerator. When the above-mentioned adhesive component has a radically polymerizable unsaturated bond in the molecule, that is, when the crosslinkable functional group of the curable adhesive component is a radically polymerizable unsaturated bond, it is compared with other Cross-linkable functional groups reduce the polarity of the cross-linking point and increase the cross-link density. Thereby, the elastic modulus of the adhesive layer composed of the adhesive composition is further improved, and the subsequent hyperactivity can be more suppressed. In addition, by increasing the modulus of elasticity, it is also possible to suppress paste residue. Furthermore, the radically polymerizable unsaturated bond system can not only construct a cross-linked structure in the adhesive component, but also a functional group that can be cross-linked with the following polysiloxane-based graft copolymer, and also contributes to Crosslinking of the above-mentioned adhesive components and polysiloxane graft copolymers. When the adhesive component has a functional group capable of crosslinking with the polysiloxane-based graft copolymer other than the aforementioned radically polymerizable unsaturated bond, such functional group is not particularly limited, and examples include carboxyl, Hydroxy, amide, isocyanate group, epoxy group, etc. These functional groups that can be crosslinked with the polysiloxane-based graft copolymer may be used alone or in combination of two or more kinds.

上述自由基聚合性不飽和鍵例如於合成上述聚合性聚合物時,可藉由使用「具有自由基聚合性不飽和鍵之單體」而導入。又,上述自由基聚合性不飽和鍵亦可藉由利用以下方法獲得上述聚合性聚合物而導入。 即,上述聚合性聚合物例如可藉由如下方式獲得:預先合成於分子內具有官能基之(甲基)丙烯酸系聚合物(以下稱為含官能基之(甲基)丙烯酸系聚合物),使其與在分子內具有與上述官能基反應之官能基及自由基聚合性不飽和鍵之化合物(以下稱為含官能基之不飽和化合物)進行反應。The radically polymerizable unsaturated bond can be introduced by using "a monomer having a radically polymerizable unsaturated bond", for example, when synthesizing the polymerizable polymer. In addition, the radically polymerizable unsaturated bond may also be introduced by obtaining the polymerizable polymer by the following method. That is, the aforementioned polymerizable polymer can be obtained, for example, by pre-synthesizing a (meth)acrylic polymer having a functional group in the molecule (hereinafter referred to as a functional group-containing (meth)acrylic polymer), It is reacted with a compound having a functional group that reacts with the above-mentioned functional group and a radically polymerizable unsaturated bond in the molecule (hereinafter referred to as a functional group-containing unsaturated compound).

上述含官能基之(甲基)丙烯酸系聚合物係藉由如下方式獲得者:藉由自由基聚合等常規方法使烷基之碳數通常處於2~18之範圍內之丙烯酸烷基酯及/或甲基丙烯酸烷基酯、含官能基之單體、及視需要之進而能夠與其等共聚之其他改質用單體進行共聚。其係與作為在常溫下具有黏著性之聚合物的一般(甲基)丙烯酸系聚合物之情形相同。上述含官能基之(甲基)丙烯酸系聚合物之重量平均分子量通常為20萬~200萬左右。The above-mentioned functional group-containing (meth)acrylic polymer is obtained by a conventional method such as free radical polymerization to make alkyl acrylate and/or the carbon number of the alkyl group in the range of 2-18 Or methacrylate, functional group-containing monomers, and other monomers for modification that can be copolymerized with them as needed. This is the same as the case of general (meth)acrylic polymers, which are polymers with adhesiveness at room temperature. The weight average molecular weight of the functional group-containing (meth)acrylic polymer is usually about 200,000 to 2 million.

上述含官能基之單體例如可列舉:丙烯酸、甲基丙烯酸等含羧基之單體;(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸2-羥基丙酯、(甲基)丙烯酸4-羥基丁酯等含羥基之單體等。又,作為上述含官能基之單體,例如亦可列舉:丙烯酸環氧丙基酯、甲基丙烯酸環氧丙基酯等含環氧基之單體;丙烯酸異氰酸基乙酯、甲基丙烯酸異氰酸基乙酯等含異氰酸基之單體;丙烯酸胺基乙酯、甲基丙烯酸胺基乙酯等含胺基之單體等。再者,該等含官能基之單體之官能基之中,與上述含官能基之不飽和化合物之反應中未使用的未反應官能基成為「作為能夠與聚矽氧系接枝共聚物交聯之官能基,而有助於上述黏著劑成分與聚矽氧系接枝共聚物的交聯」者。 上述能夠共聚之其他改質用單體例如可列舉:乙酸乙烯酯、丙烯腈、苯乙烯、順丁烯二酸酐等用於一般(甲基)丙烯酸系聚合物之各種單體。Examples of the above-mentioned functional group-containing monomers include carboxyl group-containing monomers such as acrylic acid and methacrylic acid; 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, and (meth)acrylic acid. Hydroxyl-containing monomers such as 4-hydroxybutyl ester. In addition, as the above-mentioned functional group-containing monomers, for example, epoxy group-containing monomers such as glycidyl acrylate and glycidyl methacrylate; isocyanatoethyl acrylate, methyl Monomers containing isocyanate groups such as isocyanatoethyl acrylate; monomers containing amino groups such as aminoethyl acrylate and aminoethyl methacrylate. Furthermore, among the functional groups of the functional group-containing monomers, the unreacted functional groups that are not used in the reaction with the above-mentioned functional group-containing unsaturated compounds become "as a function of being able to cross with the polysiloxane-based graft copolymer Linking functional groups, which contribute to the crosslinking of the above-mentioned adhesive components and the polysiloxane-based graft copolymer." The above-mentioned other monomers for modification that can be copolymerized include, for example, various monomers used in general (meth)acrylic polymers such as vinyl acetate, acrylonitrile, styrene, and maleic anhydride.

作為上述自由基聚合之聚合方法,可使用以往公知之方法,例如可列舉溶液聚合(沸點聚合或定溫聚合)、乳化聚合、懸浮聚合、塊狀聚合等。 上述自由基聚合中所使用之聚合起始劑並無特別限制,例如可列舉有機過氧化物、偶氮化合物等。作為上述有機過氧化物,例如可列舉:1,1-雙(過氧化第三己基)-3,3,5-三甲基環己烷(1,1-bis(tert-hexly peroxy)-3,3,5-trimethylcyclohexane)、過氧化三甲基乙酸第三己酯(tert-hexyl peroxy pivalate)、過氧化三甲基乙酸第三丁酯(tert-butyl peroxy pivalate)、2,5-二甲基-2,5-雙(過氧化2-乙基己醯基)己烷(2,5-dimethyl-2,5-bis(2-ethylhexanoyl peroxy)hexane)、過氧化-2-乙基己酸第三己酯(tert-hexyl peroxy-2-ethylhexanoate)、過氧化-2-乙基己酸第三丁酯(tert-butyl peroxy-2-ethylhexanoate)、過氧化異丁酸第三丁酯(tert-butyl peroxy isobutyrate)、過氧化-3,5,5-三甲基己酸第三丁酯(tert-butyl peroxy-3,5,5-trimethylhexanoate)、過氧化月桂酸第三丁酯(tert-butyl peroxy laurate)等。作為上述偶氮化合物,例如可列舉偶氮雙異丁腈、偶氮雙環己烷甲腈(azobis cyclohexanecarbonitrile)等。該等聚合起始劑可單獨使用,亦可併用2種以上。As the polymerization method of the above-mentioned radical polymerization, a conventionally known method can be used, and examples thereof include solution polymerization (boiling point polymerization or constant temperature polymerization), emulsion polymerization, suspension polymerization, and bulk polymerization. The polymerization initiator used in the above radical polymerization is not particularly limited, and examples thereof include organic peroxides and azo compounds. Examples of the above-mentioned organic peroxides include: 1,1-bis(tert-hexly peroxy)-3,3,5-trimethylcyclohexane (1,1-bis(tert-hexly peroxy)-3 ,3,5-trimethylcyclohexane, tert-hexyl peroxy pivalate, tert-butyl peroxy pivalate, 2,5-dimethyl 2,5-bis(2-ethylhexanoyl peroxy)hexane (2,5-dimethyl-2,5-bis(2-ethylhexanoyl peroxy)hexane), peroxy-2-ethylhexanoic acid Tert-hexyl peroxy-2-ethylhexanoate, tert-butyl peroxy-2-ethylhexanoate, tert-butyl peroxy-2-ethylhexanoate, tert-hexyl peroxy-2-ethylhexanoate -butyl peroxy isobutyrate), tert-butyl peroxy-3,5,5-trimethylhexanoate, tert-butyl peroxy-3,5,5-trimethylhexanoate, tert- butyl peroxy laurate) and so on. As said azo compound, azobisisobutyronitrile, azobis cyclohexane carbonitrile, etc. are mentioned, for example. These polymerization initiators may be used alone or in combination of two or more kinds.

上述含官能基之(甲基)丙烯酸系聚合物亦可藉由活性自由基聚合獲得。活性自由基聚合係聚合反應不會受停止反應或鏈轉移反應等副反應阻礙而分子鏈增長之聚合。根據活性自由基聚合,與例如自由基聚合等相比,可獲得具有更均一之分子量及組成之聚合物,並抑制低分子量成分等之生成,因此所獲得之黏著劑組成物於高溫下之接著亢進得到抑制,另一方面,使黏著劑組成物不易剝落以至於不會發生無意剝離之程度。The functional group-containing (meth)acrylic polymer can also be obtained by living radical polymerization. Living radical polymerization is a polymerization in which the molecular chain grows without being hindered by side reactions such as stop reaction or chain transfer reaction. According to living free radical polymerization, compared with, for example, free radical polymerization, a polymer with a more uniform molecular weight and composition can be obtained, and the generation of low molecular weight components can be suppressed. Therefore, the adhesive composition obtained is adhered at high temperature Hyperplasia is suppressed, and on the other hand, the adhesive composition is not easily peeled off to such an extent that unintentional peeling does not occur.

活性自由基聚合只要為一般所使用者則並無特別限定,可列舉TERP法、RAFT法、NMP法等。於TERP法中使用有機碲化合物,於RAFT法中使用RAFT劑,於NMP法中使用氮氧自由基(nitroxide)化合物,且視需要組合有機過氧化物、偶氮化合物等上述聚合起始劑來使用。此外,亦可使用ATRP法。Living radical polymerization is not particularly limited as long as it is generally used, and examples include the TERP method, the RAFT method, and the NMP method. Organic tellurium compounds are used in the TERP method, RAFT agents are used in the RAFT method, nitroxide compounds are used in the NMP method, and the above-mentioned polymerization initiators such as organic peroxides and azo compounds are combined as necessary. use. In addition, the ATRP method can also be used.

於上述自由基聚合中,可使用分散穩定劑。作為上述分散穩定劑,例如可列舉:聚乙烯吡咯啶酮、聚乙烯醇、甲基纖維素、乙基纖維素、聚(甲基)丙烯酸、聚(甲基)丙烯酸酯、聚乙二醇等。In the above radical polymerization, a dispersion stabilizer can be used. Examples of the dispersion stabilizer include: polyvinylpyrrolidone, polyvinyl alcohol, methylcellulose, ethylcellulose, poly(meth)acrylic acid, poly(meth)acrylate, polyethylene glycol, etc. .

於在上述自由基聚合中使用聚合溶劑之情形時,該聚合溶劑並無特別限制。作為上述聚合溶劑,例如可使用:己烷、環己烷、辛烷、甲苯、二甲苯等非極性溶劑;或水、甲醇、乙醇、丙醇、丁醇、丙酮、甲基乙基酮、甲基異丁基酮、四氫呋喃、二

Figure 109107119-A0304-12-0059-1
烷、N,N-二甲基甲醯胺等高極性溶劑。該等聚合溶劑可單獨使用,亦可併用2種以上。聚合溫度就聚合速度之觀點而言,較佳為0~110℃。In the case of using a polymerization solvent in the above radical polymerization, the polymerization solvent is not particularly limited. As the aforementioned polymerization solvent, for example, non-polar solvents such as hexane, cyclohexane, octane, toluene, and xylene; or water, methanol, ethanol, propanol, butanol, acetone, methyl ethyl ketone, methyl ethyl ketone, etc. can be used. Isobutyl ketone, tetrahydrofuran, two
Figure 109107119-A0304-12-0059-1
Highly polar solvents such as alkane and N,N-dimethylformamide. These polymerization solvents may be used alone or in combination of two or more kinds. The polymerization temperature is preferably 0 to 110°C from the viewpoint of the polymerization rate.

作為與上述含官能基之(甲基)丙烯酸系聚合物反應之含官能基之不飽和化合物,視上述含官能基之(甲基)丙烯酸系聚合物之官能基,可使用與上述含官能基之單體相同者。例如於上述含官能基之(甲基)丙烯酸系聚合物之官能基為羧基之情形時,可使用含環氧基之單體或含異氰酸基之單體。又,於該官能基為羥基之情形時,可使用含異氰酸基之單體。又,於該官能基為環氧基之情形時,可使用含羧基之單體或丙烯醯胺等含醯胺基之單體。進而,於該官能基為胺基之情形時,可使用含環氧基之單體。As the functional group-containing unsaturated compound that reacts with the above-mentioned functional group-containing (meth)acrylic polymer, depending on the functional group of the above-mentioned functional group-containing (meth)acrylic polymer, the above-mentioned functional group-containing The monomers are the same. For example, when the functional group of the functional group-containing (meth)acrylic polymer is a carboxyl group, an epoxy group-containing monomer or an isocyanate group-containing monomer can be used. In addition, when the functional group is a hydroxyl group, an isocyanate group-containing monomer can be used. Moreover, when the functional group is an epoxy group, a carboxyl group-containing monomer or an amide group-containing monomer such as acrylamide can be used. Furthermore, when the functional group is an amino group, an epoxy group-containing monomer can be used.

本發明之一實施態樣之黏著劑組成物亦可含有多官能低聚物或單體。 上述多官能低聚物或單體較佳為分子量為1萬以下者,更佳為其分子量為5000以下且分子內之自由基聚合性不飽和鍵之數為2~20個而可高效率地完成藉由加熱或光之照射的黏著劑層之三維網狀化者。此類更佳之多官能低聚物或單體例如可列舉:三羥甲基丙烷三丙烯酸酯、四羥甲基甲烷四丙烯酸酯、新戊四醇三丙烯酸酯、新戊四醇四丙烯酸酯、二新戊四醇單羥基五丙烯酸酯、二新戊四醇六丙烯酸酯或上述同樣之甲基丙烯酸酯類等。作為上述多官能低聚物或單體,亦可列舉1,4-丁二醇二丙烯酸酯、1,6-己二醇二丙烯酸酯、聚乙二醇二丙烯酸酯、市售之寡酯丙烯酸酯(oligoester acrylate)、上述同樣之甲基丙烯酸酯類等。該等多官能低聚物或單體可單獨使用,亦可併用2種以上。The adhesive composition of an embodiment of the present invention may also contain multifunctional oligomers or monomers. The above-mentioned polyfunctional oligomer or monomer preferably has a molecular weight of 10,000 or less, and more preferably has a molecular weight of 5,000 or less and the number of radically polymerizable unsaturated bonds in the molecule is 2 to 20, which can be efficiently To complete the three-dimensional reticulation of the adhesive layer by heating or light irradiation. Such more preferable multifunctional oligomers or monomers include, for example, trimethylolpropane triacrylate, tetramethylolmethane tetraacrylate, neopentaerythritol triacrylate, neopentaerythritol tetraacrylate, Dineopentaerythritol monohydroxy pentaacrylate, dineopentaerythritol hexaacrylate, or the same methacrylates mentioned above. As the above-mentioned multifunctional oligomer or monomer, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, polyethylene glycol diacrylate, and commercially available oligoester acrylic acid can also be cited. Esters (oligoester acrylate), the same methacrylates mentioned above, etc. These polyfunctional oligomers or monomers may be used alone or in combination of two or more kinds.

如上所述,本發明之一實施態樣之黏著劑組成物較佳為以作為硬化型黏著劑成分之聚合性聚合物作為主成分,且含有聚合起始劑之硬化型黏著劑組成物。上述聚合起始劑並無特別限定,例如可列舉光聚合起始劑、熱聚合起始劑等。 上述光聚合起始劑例如可列舉藉由照射250~800 nm之波長之光而活化者。此類光聚合起始劑例如可列舉:甲氧基苯乙酮等苯乙酮衍生物化合物;安息香丙醚、安息香異丁醚等安息香醚系化合物;苄基二甲基縮酮、苯乙酮二乙基縮酮等縮酮衍生物化合物等光自由基聚合起始劑。又,亦可列舉:膦氧化物衍生物化合物、雙(η5-環戊二烯基)二茂鈦衍生物化合物等光自由基聚合起始劑。進而亦可列舉:二苯基酮、米其勒酮、氯-9-氧硫𠮿

Figure 109107119-0000-3
、十二烷基-9-氧硫𠮿
Figure 109107119-0000-3
、二甲基-9-氧硫𠮿
Figure 109107119-0000-3
、二乙基9-氧硫𠮿
Figure 109107119-0000-3
、α-羥基環己基苯基酮、2-羥基甲基苯基丙烷等光自由基聚合起始劑。該等光聚合起始劑可單獨使用,亦可併用2種以上。As described above, the adhesive composition of one embodiment of the present invention is preferably a curable adhesive composition that has a polymerizable polymer as a curable adhesive component as a main component and contains a polymerization initiator. The above-mentioned polymerization initiator is not particularly limited, and examples thereof include photopolymerization initiators and thermal polymerization initiators. The above-mentioned photopolymerization initiator can be activated by irradiating light with a wavelength of 250 to 800 nm, for example. Examples of such photopolymerization initiators include acetophenone derivative compounds such as methoxyacetophenone; benzoin ether-based compounds such as benzoin propyl ether and benzoin isobutyl ether; benzyl dimethyl ketal and acetophenone Light radical polymerization initiators such as ketal derivative compounds such as diethyl ketal. In addition, photo-radical polymerization initiators such as phosphine oxide derivative compounds and bis(η5-cyclopentadienyl) titanocene derivative compounds can also be cited. Further examples may also be: diphenyl ketone, Michele ketone, chloro-9-oxysulfur 𠮿
Figure 109107119-0000-3
, Dodecyl-9-oxysulfur 𠮿
Figure 109107119-0000-3
, Dimethyl-9-oxysulfur 𠮿
Figure 109107119-0000-3
, Diethyl 9-oxysulfur 𠮿
Figure 109107119-0000-3
, Α-hydroxycyclohexyl phenyl ketone, 2-hydroxymethyl phenyl propane and other photo radical polymerization initiators. These photopolymerization initiators may be used alone or in combination of two or more kinds.

上述熱聚合起始劑例如可列舉藉由熱而分解,產生使聚合硬化開始之活性自由基者。具體而言,例如可列舉:二異丙苯基過氧化物(dicumyl peroxide)、二第三丁基過氧化物、第三丁基過氧化苯甲酸酯、第三丁基氫過氧化物、過氧化苯甲醯、異丙苯氫過氧化物、氫過氧化二異丙苯、對薄荷烷氫過氧化物、二第三丁基過氧化物等。Examples of the thermal polymerization initiator include those that decompose by heat to generate active radicals that initiate polymerization and hardening. Specifically, for example, dicumyl peroxide (dicumyl peroxide), di-tertiary butyl peroxide, tertiary butyl peroxybenzoate, tertiary butyl hydroperoxide, Benzoyl peroxide, cumene hydroperoxide, dicumyl hydroperoxide, p-menthane hydroperoxide, di-tertiary butyl peroxide, etc.

本發明之一實施態樣之黏著劑組成物含有聚矽氧系接枝共聚物。 所謂聚矽氧系接枝共聚物,意指聚矽氧部位成為接枝鏈之共聚物。若黏著劑組成物含有聚矽氧系接枝共聚物,則於將使用本發明之一實施態樣之黏著劑組成物的黏著帶供於高溫熱處理步驟時,聚矽氧系接枝共聚物聚集於黏著劑層與被黏著體之界面,因此可防止接著亢進。The adhesive composition of one embodiment of the present invention contains a polysiloxane-based graft copolymer. The so-called polysiloxane-based graft copolymer means a copolymer in which the polysiloxane part becomes a graft chain. If the adhesive composition contains a silicone-based graft copolymer, when the adhesive tape using the adhesive composition of one embodiment of the present invention is used in the high-temperature heat treatment step, the silicone-based graft copolymer aggregates It is at the interface between the adhesive layer and the adherend, so it can prevent the subsequent hyperactivity.

以往之聚矽氧化合物為於聚矽氧化合物之末端具有官能基之程度之結構,分子之大部分成為聚矽氧部位。因此,存在下述情形:於以可降低接著亢進之程度使用聚矽氧化合物之情形時,成為初始黏著力降低之原因。 於本發明之一實施態樣之黏著劑組成物中,聚矽氧化合物為聚矽氧系接枝共聚物,因此可藉由聚矽氧部位以外之部位使由黏著劑組成物所構成之黏著劑層之表面的極性為適當範圍,可抑制初始黏著力之降低。又,藉由使聚矽氧部位不為主鏈而為接枝鏈,可容易地增加聚矽氧部位之數,因此可發揮較高之接著亢進抑制性能。In the past, the polysiloxane compound has a structure to the extent that it has a functional group at the end of the polysiloxane compound, and most of the molecule becomes the polysiloxane part. Therefore, there are situations in which when the polysiloxane is used to a degree that can reduce the subsequent acceleration, it becomes the cause of the decrease in the initial adhesion. In the adhesive composition of one embodiment of the present invention, the polysiloxane compound is a polysiloxane-based graft copolymer, so the adhesive composition composed of the adhesive composition can be adhered by parts other than the polysiloxane part The polarity of the surface of the agent layer is in an appropriate range, which can suppress the decrease in initial adhesion. In addition, by making the polysiloxane site a graft chain instead of the main chain, the number of the polysiloxane site can be easily increased, and therefore, a high adhesion enhancement suppression performance can be exerted.

上述聚矽氧系接枝共聚物只要具有下述能夠與上述黏著劑成分交聯之官能基及含有聚矽氧基之接枝鏈,則無特別限定。其中,就可有利地進行初始黏著力及熱處理步驟後之黏著力之控制之觀點而言,較佳為使含有「具有能夠與黏著劑成分交聯之官能基之單體」、「聚矽氧巨單體」、及「視需要之其他單體」的原料單體混合物共聚而成者。The above-mentioned polysiloxane-based graft copolymer is not particularly limited as long as it has the following functional group capable of crosslinking with the above-mentioned adhesive component and a graft chain containing a polysiloxy group. Among them, from the viewpoint that the initial adhesive force and the adhesive force after the heat treatment step can be advantageously controlled, it is preferable to make a monomer containing a functional group capable of crosslinking with the adhesive component, and a polysiloxane It is formed by copolymerizing the raw material monomer mixture of "macro monomer" and "other monomers as needed".

作為上述聚矽氧巨單體,例如可列舉丙烯酸系聚矽氧巨單體、苯乙烯系聚矽氧巨單體等。其中,就耐熱性及耐候性優異之方面而言,較佳為丙烯酸系聚矽氧巨單體,更佳為如下述結構式(1)、(2)所示之丙烯酸系聚矽氧巨單體。Examples of the polysiloxane macromonomers include acrylic polysiloxane macromonomers, styrene polysiloxane macromonomers, and the like. Among them, in terms of excellent heat resistance and weather resistance, acrylic polysiloxane macromonomers are preferred, and acrylic polysiloxane macromonomers represented by the following structural formulas (1) and (2) are more preferred. body.

Figure 02_image001
Figure 02_image001

此處,R表示含(甲基)丙烯醯基之官能基、例如(甲基)丙烯醯基,X及Y分別獨立地表示0以上之整數。再者,X及Y之上限並無特別限定,例如為500以下,尤其是200以下。Here, R represents a (meth)acrylic group-containing functional group, such as a (meth)acrylic group, and X and Y each independently represent an integer of 0 or more. Furthermore, the upper limit of X and Y is not particularly limited, and is, for example, 500 or less, especially 200 or less.

上述原料單體混合物中之上述聚矽氧巨單體之含量較佳為1重量%以上且90重量%以下。藉由使上述聚矽氧巨單體之含量為上述範圍,可抑制於高溫下之接著亢進,並且所獲得之黏著劑組成物可發揮較高之初始黏著力。就進一步抑制接著亢進,進一步提高初始黏著力之觀點而言,上述原料單體混合物中之上述聚矽氧巨單體之含量之更佳下限為5重量%,進而較佳之下限為10重量%,更佳之上限為80重量%、進而較佳之上限為60重量%。 即,上述聚矽氧系接枝共聚物中之源自上述聚矽氧巨單體之結構單元之含量較佳為1重量%以上且90重量%以下。上述源自聚矽氧巨單體之結構單元之含量之更佳下限為5重量%,進而較佳之下限為10重量%,更佳之上限為80重量%,進而較佳之上限為60重量%。The content of the polysiloxane macromonomer in the raw material monomer mixture is preferably 1% by weight or more and 90% by weight or less. By setting the content of the polysiloxane macromonomer within the above-mentioned range, the adhesion increase at high temperature can be suppressed, and the obtained adhesive composition can exhibit higher initial adhesion. From the standpoint of further suppressing the subsequent increase and further improving the initial adhesion, the lower limit of the content of the polysiloxane macromonomer in the raw material monomer mixture is more preferably 5% by weight, and the more preferable lower limit is 10% by weight. A more preferable upper limit is 80% by weight, and a more preferable upper limit is 60% by weight. That is, the content of the structural unit derived from the polysiloxane macromonomer in the polysiloxane-based graft copolymer is preferably 1% by weight or more and 90% by weight or less. The lower limit of the content of the structural unit derived from the polysiloxane macromonomer is more preferably 5% by weight, still more preferably the lower limit is 10% by weight, the more preferable upper limit is 80% by weight, and the more preferable upper limit is 60% by weight.

上述聚矽氧系接枝共聚物具有能夠與上述黏著劑成分交聯之官能基。 藉由使聚矽氧系接枝共聚物具有能夠與黏著劑成分交聯之官能基,聚集在與被黏著體之界面之聚矽氧系接枝共聚物與黏著劑成分交聯而被固定,因此可提高接著亢進之抑制效果。又,藉由將聚矽氧系接枝共聚物固定於黏著劑成分,可抑制由聚矽氧系接枝共聚物所導致之被黏著體之污染。The polysiloxane-based graft copolymer has a functional group capable of crosslinking with the adhesive component. By making the polysiloxane-based graft copolymer have a functional group capable of crosslinking with the adhesive component, the polysiloxane-based graft copolymer gathered at the interface with the adherend and the adhesive component are cross-linked and fixed, Therefore, the suppression effect of subsequent hyperactivity can be improved. In addition, by fixing the silicone-based graft copolymer to the adhesive component, the contamination of the adherend caused by the silicone-based graft copolymer can be suppressed.

能夠與上述黏著劑成分交聯之官能基係根據上述黏著劑成分所具有之官能基而適當選擇,例如可列舉:羧基、自由基聚合性不飽和鍵、羥基、醯胺基、異氰酸基、環氧基等。作為具有能夠與上述黏著劑成分交聯之官能基之單體,例如可列舉:(甲基)丙烯酸等具有羧基之單體、2-(甲基)丙烯醯氧基乙基異氰酸酯等具有異氰酸基之單體等。又,作為具有能夠與上述黏著劑成分交聯之官能基之單體,例如亦可列舉:(甲基)丙烯酸2-羥基乙酯、(甲基)丙烯酸4-羥基丁酯等具有羥基之單體、(甲基)丙烯醯胺等具有醯胺基之單體、(甲基)丙烯酸環氧丙基酯等具有環氧基之單體等。其中,就可使交聯密度及由黏著劑組成物所構成之黏著劑層之彈性模數提高,更為抑制於高溫下之接著亢進之方面而言,能夠與上述黏著劑成分交聯之官能基較佳為自由基聚合性不飽和鍵。該等能夠與黏著劑成分交聯之官能基可單獨使用,亦可併用2種以上。 能夠與上述黏著劑成分交聯之官能基例如可藉由將「具有能夠與上述黏著劑成分交聯之官能基之單體」用於上述原料單體混合物而導入。又,於能夠與上述黏著劑成分交聯之官能基為自由基聚合性不飽和鍵之情形時,可藉由使含有「具有官能基之(甲基)丙烯酸系單體」的上述原料單體混合物自由基聚合,繼而,使具有自由基聚合性不飽和鍵及與上述官能基反應之官能基的單體反應而導入。The functional group that can be cross-linked with the adhesive component is appropriately selected according to the functional group possessed by the adhesive component. Examples include carboxyl groups, radically polymerizable unsaturated bonds, hydroxyl groups, amide groups, and isocyanate groups. , Epoxy and so on. Examples of monomers having functional groups capable of being crosslinked with the above-mentioned adhesive components include monomers having carboxyl groups such as (meth)acrylic acid, 2-(meth)acryloxyethyl isocyanate and the like having isocyanate Monomers of acid groups, etc. In addition, as a monomer having a functional group capable of being crosslinked with the above-mentioned adhesive component, for example, 2-hydroxyethyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, etc. may also be exemplified Monomers, monomers having amide groups such as (meth)acrylamide, monomers having epoxy groups such as glycidyl (meth)acrylate, etc. Among them, in terms of improving the crosslinking density and the elastic modulus of the adhesive layer composed of the adhesive composition, and further suppressing the increase in adhesion at high temperatures, it is a function capable of crosslinking with the adhesive composition The group is preferably a radically polymerizable unsaturated bond. These functional groups that can be cross-linked with the adhesive component may be used alone or in combination of two or more kinds. The functional group capable of being crosslinked with the adhesive component can be introduced, for example, by using "a monomer having a functional group capable of being crosslinked with the adhesive component" for the raw material monomer mixture. In addition, when the functional group that can be crosslinked with the adhesive component is a radically polymerizable unsaturated bond, the raw material monomer containing the "(meth)acrylic monomer having a functional group" can be used The mixture is radically polymerized, and then a monomer having a radically polymerizable unsaturated bond and a functional group that reacts with the above-mentioned functional group is reacted and introduced.

上述原料單體混合物中之「具有能夠與上述黏著劑成分交聯之官能基之單體」的含量較佳為0.1重量%以上且10重量%以下。藉由使「具有能夠與上述黏著劑成分交聯之官能基之單體」之摻合量為上述範圍,即便黏著劑成分與聚矽氧系接枝共聚物充分地交聯,於黏著劑成分內亦可構建充分之交聯結構,因此可更為抑制於高溫下之接著亢進。就進一步抑制於高溫下之接著亢進之觀點而言,「具有能夠與上述黏著劑成分交聯之官能基之單體」之摻合量更佳為0.5重量%以上,進而較佳為2重量%以上,更佳為8重量%以下,進而較佳為5重量%以下。 即,上述聚矽氧系接枝共聚物中之源自「具有能夠與上述黏著劑成分交聯之官能基之單體」之結構單元的含量較佳為0.1重量%以上且10重量%以下。源自「具有能夠與上述黏著劑成分交聯之官能基之單體」之結構單元的含量更佳為0.5重量%以上,進而較佳為2重量%以上,更佳為8重量%以下,進而較佳為5重量%以下。 又,於能夠與上述黏著劑成分交聯之官能基為自由基聚合性不飽和鍵之情形時,相對於原料單體混合物100重量%,供反應之「具有上述自由基聚合性不飽和鍵之單體」之摻合量較佳為0.5重量%以上,更佳為1重量%以上,進而較佳為2重量%以上。「具有上述自由基聚合性不飽和鍵之單體」之摻合量較佳為10重量%以下,更佳為8重量%以下,進而較佳為5重量%以下。The content of the "monomer having a functional group capable of crosslinking with the adhesive component" in the raw material monomer mixture is preferably 0.1% by weight or more and 10% by weight or less. By setting the blending amount of the "monomer having a functional group capable of crosslinking with the above-mentioned adhesive component" within the above range, even if the adhesive component and the silicone-based graft copolymer are sufficiently crosslinked, the adhesive component A sufficient cross-linking structure can also be constructed inside, so the adhesion acceleration at high temperature can be more suppressed. From the standpoint of further suppressing the adhesion enhancement at high temperature, the blending amount of the "monomer having a functional group capable of crosslinking with the adhesive component" is more preferably 0.5% by weight or more, and more preferably 2% by weight Above, it is more preferably 8% by weight or less, and still more preferably 5% by weight or less. That is, the content of the structural unit derived from the "monomer having a functional group capable of crosslinking with the adhesive component" in the polysiloxane-based graft copolymer is preferably 0.1% by weight or more and 10% by weight or less. The content of the structural unit derived from the "monomer having a functional group capable of crosslinking with the above-mentioned adhesive component" is more preferably 0.5% by weight or more, more preferably 2% by weight or more, more preferably 8% by weight or less, and further Preferably it is 5 weight% or less. In addition, when the functional group that can be crosslinked with the above-mentioned adhesive component is a radically polymerizable unsaturated bond, relative to 100% by weight of the raw material monomer mixture, the reaction "with the above-mentioned radically polymerizable unsaturated bond The blending amount of "monomer" is preferably 0.5% by weight or more, more preferably 1% by weight or more, and still more preferably 2% by weight or more. The blending amount of the "monomer having the aforementioned radically polymerizable unsaturated bond" is preferably 10% by weight or less, more preferably 8% by weight or less, and still more preferably 5% by weight or less.

能夠與上述黏著劑成分交聯之官能基較佳為藉由加熱而與上述黏著劑成分反應之官能基。 由於能夠與上述黏著劑成分交聯之官能基藉由加熱來反應,故而可利用高溫處理步驟之熱來進行交聯反應,因此可減少光硬化步驟等用以交聯之步驟,可提高生產性。作為藉由加熱而與上述黏著劑成分反應之「能夠與上述黏著劑成分交聯之官能基」,例如可列舉自由基聚合性不飽和鍵、酯交換反應性之羥基等。The functional group capable of crosslinking with the adhesive component is preferably a functional group that reacts with the adhesive component by heating. Since the functional groups that can be crosslinked with the above-mentioned adhesive components react by heating, the heat of the high-temperature treatment step can be used to carry out the crosslinking reaction. Therefore, the crosslinking steps such as photohardening steps can be reduced, and the productivity can be improved. . As the "functional group capable of crosslinking with the adhesive component" that reacts with the adhesive component by heating, for example, a radically polymerizable unsaturated bond, a transesterified hydroxyl group, and the like can be cited.

上述聚矽氧系接枝共聚物較佳為具有極性官能基。再者,此處所謂極性官能基設為包括下述兩者:作為能夠與上述黏著劑成分交聯之官能基之極性官能基、及不會與上述黏著劑成分交聯之極性官能基。 聚矽氧系接枝共聚物具有極性官能基,藉此可使所獲得之黏著劑組成物之初始黏著力提高。 作為上述極性官能基,例如可列舉羥基、羧基等。上述極性官能基可藉由將具有上述極性官能基之單體用於上述原料單體混合物而導入。 作為具有上述羥基之單體,例如可列舉:(甲基)丙烯酸4-羥基丁酯、(甲基)丙烯酸羥基丙酯、(甲基)丙烯酸2-羥基乙酯等。作為具有上述羧基之單體,可列舉:(甲基)丙烯酸、2-(甲基)丙烯醯氧基乙基丁二酸、2-(甲基)丙烯醯氧基乙基-酞酸、2-(甲基)丙烯醯氧基乙基六氫酞酸、(甲基)丙烯酸β-羧基乙酯等。The above-mentioned polysiloxane-based graft copolymer preferably has a polar functional group. In addition, the term “polar functional group” here includes both of the following: a polar functional group that is a functional group capable of being crosslinked with the adhesive component, and a polar functional group that is not crosslinked with the adhesive component. The polysiloxane-based graft copolymer has a polar functional group, which can improve the initial adhesion of the obtained adhesive composition. As said polar functional group, a hydroxyl group, a carboxyl group, etc. are mentioned, for example. The polar functional group can be introduced by using a monomer having the polar functional group for the raw material monomer mixture. Examples of the monomer having the above-mentioned hydroxyl group include 4-hydroxybutyl (meth)acrylate, hydroxypropyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, and the like. Examples of monomers having the above-mentioned carboxyl group include (meth)acrylic acid, 2-(meth)acryloxyethyl succinic acid, 2-(meth)acryloxyethyl-phthalic acid, 2 -(Meth)acryloyloxyethylhexahydrophthalic acid, β-carboxyethyl (meth)acrylate, etc.

上述原料單體混合物中之具有上述極性官能基之單體之含量較佳為0.1重量%以上且50重量%以下。藉由使具有上述極性官能基之單體之含量為上述範圍,可使所獲得之黏著劑組成物之初始黏著力更為提高,並且可使聚矽氧系接枝共聚物易於聚集在與被黏著體之界面。就使高初始黏著力進一步提高,使聚矽氧系接枝共聚物更易聚集在與被黏著體之界面之觀點而言,具有上述極性官能基之單體之含量更佳為0.5重量%以上,進而較佳為1重量%以上,進而更佳為2重量%以上。具有上述極性官能基之單體之含量更佳為40重量%以下,進而較佳為30重量%以下,進而更佳為10重量%以下,更進一步較佳為8重量%以下,最佳為5重量%以下。 即,上述聚矽氧系接枝共聚物中之源自具有上述極性官能基之單體之結構單元的含量較佳為0.1重量%以上且50重量%以下。源自具有上述極性官能基之單體之結構單元之含量更佳為0.5重量%以上,進而較佳為1重量%以上,進而更佳為2重量%以上。源自具有上述極性官能基之單體之結構單元之含量更佳為40重量%以下,進而較佳為30重量%以下,進而更佳為10重量%以下,更進一步較佳為8重量%以下,特佳為5重量%以下。The content of the monomer having the polar functional group in the raw material monomer mixture is preferably 0.1% by weight or more and 50% by weight or less. By making the content of the monomer having the polar functional group in the above range, the initial adhesive force of the obtained adhesive composition can be improved, and the polysiloxane-based graft copolymer can be easily aggregated in and The interface of the adhesive. From the viewpoint of further improving the high initial adhesion and making the polysiloxane-based graft copolymer more likely to aggregate at the interface with the adherend, the content of the monomer having the above-mentioned polar functional group is more preferably 0.5% by weight or more, It is more preferably 1% by weight or more, and still more preferably 2% by weight or more. The content of the monomer having the above-mentioned polar functional group is more preferably 40% by weight or less, still more preferably 30% by weight or less, still more preferably 10% by weight or less, still more preferably 8% by weight or less, most preferably 5 Weight% or less. That is, the content of the structural unit derived from the monomer having the polar functional group in the polysiloxane-based graft copolymer is preferably 0.1% by weight or more and 50% by weight or less. The content of the structural unit derived from the monomer having the aforementioned polar functional group is more preferably 0.5% by weight or more, still more preferably 1% by weight or more, and still more preferably 2% by weight or more. The content of the structural unit derived from the monomer having the above-mentioned polar functional group is more preferably 40% by weight or less, still more preferably 30% by weight or less, still more preferably 10% by weight or less, and still more preferably 8% by weight or less , Particularly preferably 5% by weight or less.

作為上述其他單體,例如可列舉:(甲基)丙烯酸烷基酯。作為上述(甲基)丙烯酸烷基酯,例如可列舉:丙烯酸2-乙基己酯、丙烯酸丁酯、(甲基)丙烯酸甲酯、(甲基)丙烯酸乙酯、(甲基)丙烯酸丙酯、(甲基)丙烯酸正丁酯、(甲基)丙烯酸第三丁酯、(甲基)丙烯酸2-乙基己酯、(甲基)丙烯酸正辛酯、(甲基)丙烯酸異辛酯、(甲基)丙烯酸異壬酯、(甲基)丙烯酸異肉豆蔻酯、(甲基)丙烯酸硬脂酯等。又,作為上述其他單體,例如亦可列舉:(甲基)丙烯酸環己酯、(甲基)丙烯酸異莰酯、(甲基)丙烯酸苄酯、(甲基)丙烯酸2-丁氧基乙酯、(甲基)丙烯酸2-苯氧基乙酯、(甲基)丙烯酸環氧丙基酯、(甲基)丙烯酸四氫糠酯、聚丙二醇單(甲基)丙烯酸酯等。其中,就可賦予適度之黏著力之方面而言,較佳為丙烯酸2-乙基己酯。Examples of the above-mentioned other monomers include alkyl (meth)acrylates. Examples of the alkyl (meth)acrylates include 2-ethylhexyl acrylate, butyl acrylate, methyl (meth)acrylate, ethyl (meth)acrylate, and propyl (meth)acrylate. , N-butyl (meth)acrylate, t-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, n-octyl (meth)acrylate, isooctyl (meth)acrylate, Isononyl (meth)acrylate, isomyristyl (meth)acrylate, stearyl (meth)acrylate, and the like. In addition, as the above-mentioned other monomers, for example, cyclohexyl (meth)acrylate, isobornyl (meth)acrylate, benzyl (meth)acrylate, 2-butoxyethyl (meth)acrylate Ester, 2-phenoxyethyl (meth)acrylate, glycidyl (meth)acrylate, tetrahydrofurfuryl (meth)acrylate, polypropylene glycol mono(meth)acrylate, etc. Among them, in terms of imparting a moderate adhesive force, 2-ethylhexyl acrylate is preferred.

上述聚矽氧系接枝共聚物較佳為具有下述結構式(3)所示之結構。 具有如下述結構式(3)之結構之聚矽氧系接枝共聚物由於聚矽氧部位為接枝鏈,故而可容易地調節聚矽氧部位之數,而可較以往之聚矽氧化合物更為抑制接著亢進。又,具有如下述結構式(3)之結構之聚矽氧系接枝共聚物具有自由基聚合性不飽和鍵作為能夠與黏著劑成分交聯之官能基,因此與黏著劑成分之交聯密度提高,可更為抑制接著亢進,並且可減少被黏著體之污染。進而,具有如下述結構式(3)之結構之聚矽氧系接枝共聚物由於具有極性官能基,故而初始黏著力提高,即便於增加了聚矽氧部位之情形時,亦可抑制初始黏著力之降低。The above-mentioned polysiloxy graft copolymer preferably has a structure represented by the following structural formula (3). The polysiloxane-based graft copolymer having a structure as shown in the following structural formula (3), because the polysiloxane part is a graft chain, the number of the polysiloxane part can be easily adjusted, and it can be compared with the previous polysiloxane compound More restrained and then hyperactive. In addition, the polysiloxane graft copolymer having a structure as the following structural formula (3) has a radically polymerizable unsaturated bond as a functional group that can be crosslinked with the adhesive component, so the crosslink density with the adhesive component Improved, can more inhibit the subsequent hyperactivity, and can reduce the pollution of the adherend. Furthermore, the polysiloxane-based graft copolymer having a structure such as the following structural formula (3) has a polar functional group, so the initial adhesion is improved, and even when the polysiloxane site is increased, the initial adhesion can be suppressed The reduction of power.

Figure 02_image003
Figure 02_image003

此處,R1 、R2 、R3 、R4 分別獨立地表示甲基或氫原子,R5 、R6 、R7 分別獨立地表示具有直鏈狀或支鏈狀碳鏈之1~18個碳原子之飽和烴基,R8 表示含(甲基)丙烯醯基之官能基,R9 表示含極性官能基之基。L、M、N、O及P分別獨立地表示0以上之整數。Here, R 1 , R 2 , R 3 , and R 4 each independently represent a methyl group or a hydrogen atom, and R 5 , R 6 , and R 7 each independently represent 1 to 18 having a linear or branched carbon chain A saturated hydrocarbon group with three carbon atoms, R 8 represents a functional group containing a (meth)acrylic acid group, and R 9 represents a polar functional group containing group. L, M, N, O, and P each independently represent an integer of 0 or more.

就被黏著體界面之極性之最佳化之觀點而言,上述結構式(3)中之上述具有直鏈狀或支鏈狀碳鏈之1~18個碳原子之飽和烴基的碳數較佳為3個以上,更佳為6個以上,且較佳為15個以下,更佳為12個以下。From the viewpoint of optimizing the polarity of the adherend interface, the above-mentioned saturated hydrocarbon group having a linear or branched carbon chain of 1 to 18 carbon atoms in the above structural formula (3) preferably has a carbon number It is 3 or more, more preferably 6 or more, and preferably 15 or less, and more preferably 12 or less.

作為上述結構式(3)中之上述含(甲基)丙烯醯基之官能基,例如可列舉具有1~18個碳原子(較佳為2~15個碳原子,更佳為3~12個碳原子)之含(甲基)丙烯醯基之官能基。As the functional group containing the (meth)acrylic acid group in the above structural formula (3), for example, it has 1 to 18 carbon atoms (preferably 2 to 15 carbon atoms, more preferably 3 to 12) (Carbon atoms) containing (meth)acrylic functional groups.

上述結構式(3)中之上述含極性官能基之基例如可列舉含有極性官能基之飽和烴基及不飽和烴基,就控制黏著力之觀點而言,較佳為含有極性官能基之飽和烴基,更佳為具有極性官能基之碳原子1~18個(進而較佳為3~15個碳原子)之飽和烴基。作為上述含極性官能基之基所含有之極性官能基,例如可列舉羧基、羥基。就抑制接著亢進之觀點而言,上述極性官能基較佳為羥基。In the above structural formula (3), the polar functional group-containing group includes, for example, a polar functional group-containing saturated hydrocarbon group and an unsaturated hydrocarbon group. From the viewpoint of controlling adhesion, a polar functional group-containing saturated hydrocarbon group is preferred. More preferably, it is a saturated hydrocarbon group having 1 to 18 carbon atoms (more preferably 3 to 15 carbon atoms) having a polar functional group. Examples of the polar functional group contained in the polar functional group-containing group include a carboxyl group and a hydroxyl group. From the viewpoint of suppressing subsequent increase, the polar functional group is preferably a hydroxyl group.

上述結構式(3)中之上述L、M、N、O及P分別獨立地為0以上,就更易聚集在與被黏著體之界面,有效地抑制接著亢進之觀點而言,較佳為10以上,更佳為50以上,進而較佳為100以上,且較佳為500以下,更佳為300以下,進而較佳為200以下之整數。The above-mentioned L, M, N, O and P in the above-mentioned structural formula (3) are each independently 0 or more, so that it is easier to gather at the interface with the adherend, and from the viewpoint of effectively suppressing the subsequent increase, it is preferably 10 Above, it is more preferably 50 or more, still more preferably 100 or more, and preferably 500 or less, more preferably 300 or less, and still more preferably an integer of 200 or less.

上述聚矽氧系接枝共聚物較佳為重量平均分子量為40萬以下。 若聚矽氧系接枝共聚物之分子量為上述範圍,則聚矽氧系接枝共聚物變得易於在黏著劑層中移動,而可更加聚集在與被黏著體之界面,因此可更為抑制接著亢進。就進一步抑制接著亢進之觀點而言,上述重量平均分子量較佳為20萬以下,進而較佳為10萬以下。上述重量平均分子量之上限並無特別限定,但就抑制對被黏著體之污染之觀點而言,較佳為5000以上。 再者,上述重量平均分子量例如可藉由GPC法以聚苯乙烯標準而求出。具體而言,例如可使用Water公司製造之「2690 Separations Module」作為測定機器,使用昭和電工公司製造之「GPC KF-806L」作為管柱,使用乙酸乙酯作為溶劑,於樣品流量1 mL/min、管柱溫度40℃之條件下進行測定。The above-mentioned polysiloxane-based graft copolymer preferably has a weight average molecular weight of 400,000 or less. If the molecular weight of the polysiloxane-based graft copolymer is in the above range, the polysiloxane-based graft copolymer becomes easy to move in the adhesive layer, and can be more concentrated at the interface with the adherend, so it can be more Inhibition followed by hyperactivity. From the viewpoint of further suppressing the subsequent increase, the weight average molecular weight is preferably 200,000 or less, and more preferably 100,000 or less. The upper limit of the weight average molecular weight is not particularly limited, but from the viewpoint of suppressing contamination of the adherend, it is preferably 5000 or more. In addition, the said weight average molecular weight can be calculated|required by a polystyrene standard by a GPC method, for example. Specifically, for example, the "2690 Separations Module" manufactured by Water Co., Ltd. can be used as the measuring device, the "GPC KF-806L" manufactured by Showa Denko Co., Ltd. can be used as the column, and ethyl acetate can be used as the solvent. The sample flow rate is 1 mL/min. , Measure the column temperature at 40℃.

上述聚矽氧系接枝共聚物之製造方法並無特別限制,可藉由使上述原料單體混合物於溶劑中進行自由基聚合而獲得。作為上述自由基聚合之聚合方法,可使用與上述黏著劑成分相同之方法。The production method of the above-mentioned polysiloxane-based graft copolymer is not particularly limited, and it can be obtained by radically polymerizing the above-mentioned raw material monomer mixture in a solvent. As the polymerization method of the above-mentioned radical polymerization, the same method as the above-mentioned adhesive component can be used.

本發明之一實施態樣之黏著劑組成物中之上述聚矽氧系接枝共聚物之含量較佳為0.1重量%以上且20重量%以下。 藉由使黏著劑組成物中之上述聚矽氧系接枝共聚物之含量為0.1重量%以上,可更為抑制高溫時之接著亢進。藉由使上述聚矽氧系接枝共聚物之含量為20重量%以下,可提高黏著劑組成物之初始黏著力,又,可抑制黏著劑組成物之白濁,而可隔著黏著劑組成物進行對準等使用光之步驟。又,由於聚矽氧系接枝共聚物易於聚集於被黏著體之界面,故而可以較以往之聚矽氧化合物更少之量抑制接著亢進。就更為抑制高溫時之接著亢進及白濁之觀點而言,黏著劑組成物中之上述聚矽氧系接枝共聚物之含量更佳為1.5重量%以上,進而較佳為3重量%以上。上述聚矽氧系接枝共聚物之含量更佳為15重量%以下,進而較佳為10重量%以下,進而更佳為8重量%以下,特佳為5重量%以下。The content of the polysiloxane-based graft copolymer in the adhesive composition of one embodiment of the present invention is preferably 0.1% by weight or more and 20% by weight or less. By making the content of the above-mentioned polysiloxane-based graft copolymer in the adhesive composition at least 0.1% by weight, it is possible to further suppress the increase in adhesion at high temperatures. By making the content of the above-mentioned polysiloxane-based graft copolymer 20% by weight or less, the initial adhesive force of the adhesive composition can be improved, and the white turbidity of the adhesive composition can be suppressed, and the adhesive composition can be separated Perform the steps of using light such as alignment. In addition, since the polysiloxane-based graft copolymer tends to accumulate at the interface of the adherend, it can suppress the adhesion increase in a smaller amount than the conventional polysiloxane compound. From the viewpoint of further suppressing the adhesion enhancement and white turbidity at high temperature, the content of the polysiloxane-based graft copolymer in the adhesive composition is more preferably 1.5% by weight or more, and more preferably 3% by weight or more. The content of the above-mentioned polysiloxane-based graft copolymer is more preferably 15% by weight or less, still more preferably 10% by weight or less, still more preferably 8% by weight or less, and particularly preferably 5% by weight or less.

本發明之一實施態樣之黏著劑組成物較佳為含有交聯劑。 藉由交聯劑,可使上述黏著劑成分與上述聚矽氧系接枝共聚物充分地交聯。又,藉由含有交聯劑,黏著劑組成物之凝集力提高,因此可使初始黏著力提高。 上述交聯劑並無特別限定,例如可列舉異氰酸酯系交聯劑、環氧系交聯劑、氮丙啶(aziridine)系交聯劑、金屬螯合系交聯劑等。其中,就黏著劑成分之凝集力更為提高之方面而言,較佳為環氧系交聯劑。The adhesive composition of one embodiment of the present invention preferably contains a crosslinking agent. The crosslinking agent can sufficiently crosslink the adhesive component and the polysiloxane-based graft copolymer. In addition, by containing the crosslinking agent, the cohesive force of the adhesive composition is improved, and therefore the initial adhesive force can be improved. The said crosslinking agent is not specifically limited, For example, an isocyanate type crosslinking agent, an epoxy type crosslinking agent, an aziridine type crosslinking agent, a metal chelate type crosslinking agent, etc. are mentioned. Among them, an epoxy-based crosslinking agent is preferred in terms of more improvement in the cohesive force of the adhesive component.

本發明之一實施態樣之黏著劑組成物中之上述交聯劑之含量較佳為0.01~20重量%。 藉由以上述範圍含有交聯劑,可使上述黏著劑成分與上述聚矽氧系接枝共聚物充分地交聯,並且可提高黏著劑成分之凝集力而更為提高初始黏著力。就使初始黏著力進一步提高之觀點而言,上述交聯劑之含量之更佳下限為0.05重量%,進而較佳之下限為0.1重量%,更佳之上限為10重量%,進而較佳之上限為5重量%。The content of the crosslinking agent in the adhesive composition of one embodiment of the present invention is preferably 0.01-20% by weight. By containing the crosslinking agent in the above range, the adhesive component and the polysiloxane-based graft copolymer can be sufficiently crosslinked, and the cohesive force of the adhesive component can be increased to further improve the initial adhesive force. From the viewpoint of further improving the initial adhesion, the lower limit of the content of the crosslinking agent is more preferably 0.05% by weight, furthermore preferably the lower limit is 0.1% by weight, the more preferable upper limit is 10% by weight, and the more preferable upper limit is 5 weight%.

本發明之一實施態樣之黏著劑組成物亦可視需要,含有藉由刺激而產生氣體之氣體產生劑、或無機填充劑、熱穩定劑、抗氧化劑、抗靜電劑、塑化劑、樹脂、界面活性劑、蠟等公知之添加劑。The adhesive composition of one embodiment of the present invention may also optionally contain a gas generator that generates gas by stimulation, or an inorganic filler, heat stabilizer, antioxidant, antistatic agent, plasticizer, resin, Well-known additives such as surfactants and waxes.

本發明之一實施態樣之黏著劑組成物之製造方法並無特別限定,例如可藉由如下方式獲得:於利用上述方法所製造之黏著劑成分之溶液中加入利用上述方法所製造之上述聚矽氧系接枝共聚物及視需要之其他添加劑並加以混合。The manufacturing method of the adhesive composition of one embodiment of the present invention is not particularly limited. For example, it can be obtained by: adding the above-mentioned polymer manufactured by the above-mentioned method to the solution of the adhesive component manufactured by the above-mentioned method. Silicon-oxygen graft copolymer and other additives as needed and mixed.

本發明之一實施態樣之黏著劑組成物之用途並無特別限定,可適宜地用作用以形成黏著帶之黏著劑層之黏著劑組成物。 又,本發明之一亦為一種黏著帶,其具有基材及積層於上述基材之至少一面之黏著劑層,且該黏著劑層由本發明之一實施態樣之黏著劑組成物所構成。The use of the adhesive composition of one embodiment of the present invention is not particularly limited, and can be suitably used as an adhesive composition for forming the adhesive layer of the adhesive tape. In addition, one aspect of the present invention is also an adhesive tape having a substrate and an adhesive layer laminated on at least one side of the substrate, and the adhesive layer is composed of an adhesive composition according to an embodiment of the present invention.

本發明之一實施態樣之黏著帶具有基材。 構成上述基材之材料較佳為具備耐熱性之材料。作為上述具備耐熱性之材料,例如可列舉:聚對酞酸乙二酯、聚萘二甲酸乙二酯、聚縮醛、聚醯胺、聚碳酸酯、聚苯醚、聚對酞酸丁二酯、超高分子量聚乙烯、間規聚苯乙烯(syndiotactic polystyrene)、聚芳酯、聚碸、聚醚碸、聚伸苯硫醚(polyphenylene sulfide)、聚醚醚酮、聚醯亞胺、聚醚醯亞胺、氟樹脂、液晶聚合物等。其中,就耐熱性優異之方面而言,較佳為聚醯亞胺。The adhesive tape of one embodiment of the present invention has a base material. The material constituting the aforementioned substrate is preferably a material having heat resistance. Examples of the above-mentioned materials with heat resistance include: polyethylene terephthalate, polyethylene naphthalate, polyacetal, polyamide, polycarbonate, polyphenylene ether, and polybutylene terephthalate. Ester, ultra-high molecular weight polyethylene, syndiotactic polystyrene, polyarylate, polyether, polyether sulfide, polyphenylene sulfide, polyether ether ketone, polyimide, poly Etherimines, fluororesins, liquid crystal polymers, etc. Among them, in terms of excellent heat resistance, polyimide is preferred.

上述基材之厚度並無特別限定,較佳之下限為25 μm,更佳之下限為50 μm,且較佳之上限為250 μm,更佳之上限為125 μm。藉由使上述基材為該範圍,可製成操作性優異之黏著帶。The thickness of the aforementioned substrate is not particularly limited, and the preferred lower limit is 25 μm, the more preferred lower limit is 50 μm, the preferred upper limit is 250 μm, and the more preferred upper limit is 125 μm. By setting the above-mentioned base material in this range, an adhesive tape excellent in handleability can be obtained.

本發明之一實施態樣之黏著帶具有積層於上述基材之至少一面之黏著劑層。 上述黏著劑層由本發明之一實施態樣之黏著劑組成物所構成。The adhesive tape of one embodiment of the present invention has an adhesive layer laminated on at least one side of the substrate. The adhesive layer is composed of the adhesive composition of one embodiment of the present invention.

上述黏著劑層之凝膠分率並無特別限定,較佳為未達90重量%。藉由使上述凝膠分率未達90重量%,可於貼附時發揮較高之黏著力。就進一步提高初始黏著力之觀點而言,上述黏著劑層之凝膠分率更佳為80重量%以下,進而較佳為70重量%以下。上述黏著劑層之凝膠分率之下限並無特別限定,就操作性之觀點而言,較佳為20重量%以上。 上述黏著劑層之凝膠分率可根據上述黏著劑成分之種類、上述交聯劑之種類及量等進行調節。 再者,於上述黏著劑層為硬化型黏著劑層之情形時,所謂上述黏著劑層之凝膠分率,意指利用紫外線等光之照射或加熱等進行硬化前之凝膠分率(初始凝膠分率)。The gel fraction of the adhesive layer is not particularly limited, but is preferably less than 90% by weight. By making the above-mentioned gel fraction less than 90% by weight, a higher adhesive force can be exerted during application. From the viewpoint of further improving the initial adhesive force, the gel fraction of the adhesive layer is more preferably 80% by weight or less, and more preferably 70% by weight or less. The lower limit of the gel fraction of the adhesive layer is not particularly limited, but from the viewpoint of handleability, it is preferably 20% by weight or more. The gel fraction of the adhesive layer can be adjusted according to the type of the adhesive component, the type and amount of the crosslinking agent, and the like. Furthermore, when the adhesive layer is a hardening type adhesive layer, the gel fraction of the adhesive layer means the gel fraction before curing by light such as ultraviolet rays or heating (initial Gel fraction).

再者,上述黏著劑層之凝膠分率具體而言,可藉由以下方法進行測定。 首先,自上述黏著劑層刮取0.1 g黏著劑,將之浸漬於50 mL甲苯中,藉由震盪器於溫度23℃、200 rpm之條件下震盪24小時。震盪後,使用金屬篩網(網眼#200網目),將甲苯與吸收甲苯而膨潤之黏著劑進行分離。使分離後之黏著劑於110℃之條件下乾燥1小時。測定乾燥後之包括金屬篩網之黏著劑之重量,使用下述式(1)算出凝膠分率。 凝膠分率(重量%)=100×(W1 -W2 )/W0 (1) (W0 :初始黏著劑重量、W1 :乾燥後之包含金屬篩網之黏著劑重量、W2 :金屬篩網之初始重量)In addition, the gel fraction of the adhesive layer can be specifically measured by the following method. First, scrape 0.1 g of the adhesive from the adhesive layer, immerse it in 50 mL of toluene, and shake it for 24 hours at a temperature of 23° C. and 200 rpm with a shaker. After shaking, use a metal screen (mesh#200 mesh) to separate the toluene from the adhesive that absorbs toluene and swells. Dry the separated adhesive at 110°C for 1 hour. Measure the weight of the adhesive including the metal mesh after drying, and calculate the gel fraction using the following formula (1). Gel fraction (weight %) = 100×(W 1- W 2 )/W 0 (1) (W 0 : initial adhesive weight, W 1 : dried adhesive weight including metal mesh, W 2 : The initial weight of the metal screen)

上述黏著劑層之厚度並無特別限定,但較佳為下限為3 μm且上限為100 μm。若上述黏著劑層之厚度為上述範圍,則可以充分之黏著力與支持體黏接。就同樣之觀點而言,上述黏著劑層之厚度之更佳之下限為5 μm,更佳之上限為50 μm。The thickness of the adhesive layer is not particularly limited, but preferably the lower limit is 3 μm and the upper limit is 100 μm. If the thickness of the adhesive layer is in the above range, it can be bonded to the support with sufficient adhesive force. From the same viewpoint, the lower limit of the thickness of the adhesive layer is more preferably 5 μm, and the upper limit is more preferably 50 μm.

本發明之一實施態樣之黏著帶之製造方法並無特別限定,可使用以往公知之方法。例如可藉由如下方式進行製造:於實施過脫模處理之膜上塗佈本發明之一實施態樣之黏著劑組成物之溶液,使之乾燥而形成黏著劑層並與基材進行貼合。The manufacturing method of the adhesive tape of one embodiment of the present invention is not particularly limited, and conventionally known methods can be used. For example, it can be manufactured by applying a solution of the adhesive composition of one embodiment of the present invention on a film that has undergone a mold release treatment, and drying it to form an adhesive layer and bonding it to the substrate .

本發明之一實施態樣之黏著帶之用途並無特別限定,就即便於高溫下亦難以發生接著亢進之方面而言,可於半導體裝置之製造等具有如超過200℃之熱處理步驟者之製造中適宜地用作保護構件之黏著帶。 [發明之效果]The use of the adhesive tape of one embodiment of the present invention is not particularly limited. As far as it is difficult to increase the adhesion even at high temperatures, it can be used in the manufacture of semiconductor devices, such as those with heat treatment steps exceeding 200°C. Suitable for use as an adhesive tape for protective components. [Effects of Invention]

根據本發明,可提供一種儘管於貼附時具有較高之黏著力,但即便供於高溫熱處理步驟亦可抑制接著亢進之黏著劑組成物及具有由該黏著劑組成物所構成之黏著劑層之黏著帶。According to the present invention, it is possible to provide an adhesive composition capable of suppressing subsequent proliferation even when applied to a high-temperature heat treatment step, and an adhesive layer composed of the adhesive composition. The adhesive tape.

於以下列舉實施例對本發明之態樣進一步詳細地進行說明,但本發明並不僅限定於該等實施例。The following examples are given to illustrate the aspects of the present invention in further detail, but the present invention is not limited to these examples.

(實施例1) (黏著劑成分A之製備) 準備具備溫度計、攪拌機、冷卻管之反應器,於該反應器內加入丙烯酸2-乙基己酯(2EHA)79重量份、丙烯酸(AAc)1重量份、丙烯酸4-羥基丁酯(4HBA)20重量份、月桂硫醇0.01重量份、乙酸乙酯80重量份後,加熱反應器而使回流開始。繼而,於上述反應器內添加1,1-雙(過氧化第三己基)-3,3,5-三甲基環己烷0.01重量份作為聚合起始劑,於回流下使聚合開始。其次,於聚合開始後1小時後及2小時後,分別添加1,1-雙(過氧化第三己基)-3,3,5-三甲基環己烷各0.01重量份,進而於聚合開始後4小時後添加過氧化三甲基乙酸第三己酯0.05重量份,而使聚合反應繼續。然後,於聚合開始後8小時後,獲得含官能基之丙烯酸系聚合物之乙酸乙酯溶液。其後,相對於所獲得之含官能基之丙烯酸系聚合物之乙酸乙酯溶液之樹脂固形份100重量份,加入2-甲基丙烯醯氧乙基異氰酸酯(於表中為MOI)8重量份而進行反應,藉此獲得了含黏著劑成分A之溶液。(Example 1) (Preparation of adhesive component A) Prepare a reactor equipped with a thermometer, agitator, and cooling tube. Add 79 parts by weight of 2-ethylhexyl acrylate (2EHA), 1 part by weight of acrylic acid (AAc), and 20 parts by weight of 4-hydroxybutyl acrylate (4HBA) into the reactor. After parts by weight, 0.01 parts by weight of lauryl mercaptan, and 80 parts by weight of ethyl acetate, the reactor was heated to start reflux. Then, 0.01 parts by weight of 1,1-bis(tertiary hexyl peroxide)-3,3,5-trimethylcyclohexane was added as a polymerization initiator in the above-mentioned reactor, and the polymerization was started under reflux. Next, after 1 hour and 2 hours after the initiation of the polymerization, 0.01 parts by weight of 1,1-bis(tertiary hexyl peroxide)-3,3,5-trimethylcyclohexane were added, and then at the start of the polymerization After 4 hours, 0.05 parts by weight of third hexyl peroxide trimethyl acetate was added to continue the polymerization reaction. Then, 8 hours after the start of polymerization, an ethyl acetate solution of a functional group-containing acrylic polymer was obtained. Then, with respect to 100 parts by weight of the resin solid content of the ethyl acetate solution of the functional group-containing acrylic polymer obtained, 8 parts by weight of 2-methacryloxyethyl isocyanate (MOI in the table) was added The reaction proceeds to obtain a solution containing the adhesive component A.

繼而,將所獲得之含黏著劑成分A之溶液藉由四氫呋喃(THF)稀釋至50倍,將所得之稀釋液利用孔徑0.2 μm之聚四氟乙烯製過濾器進行過濾。其後,將所獲得之濾液供給至凝膠滲透層析儀而進行GPC測定。測定黏著劑成分之聚苯乙烯換算分子量,而求出重量平均分子量(Mw)及分子量分佈(Mw/Mn)。其結果為,Mw:57萬,Mw/Mn:6.4。再者,測定機器及測定條件係如下所示。 凝膠滲透層析儀:e2695 Separations Module(Waters公司製造) 檢測器:示差折射計(2414,Waters公司製造) 管柱:GPC KF-806L(昭和電工公司製造) 標準試樣:STANDRAD SM-105,昭和電工公司製造 樣品流量:1 mL/min 管柱溫度:40℃Then, the obtained solution containing the adhesive component A was diluted to 50 times with tetrahydrofuran (THF), and the obtained diluted solution was filtered with a filter made of polytetrafluoroethylene with a pore size of 0.2 μm. After that, the obtained filtrate was supplied to a gel permeation chromatograph to perform GPC measurement. The polystyrene conversion molecular weight of the adhesive component is measured, and the weight average molecular weight (Mw) and molecular weight distribution (Mw/Mn) are obtained. As a result, Mw: 570,000, and Mw/Mn: 6.4. In addition, the measuring equipment and measuring conditions are as follows. Gel permeation chromatography: e2695 Separations Module (manufactured by Waters) Detector: Differential refractometer (2414, manufactured by Waters) String: GPC KF-806L (manufactured by Showa Denko Corporation) Standard sample: STANDRAD SM-105, manufactured by Showa Denko Corporation Sample flow rate: 1 mL/min Column temperature: 40℃

(黏著劑成分B之製備) 不使用2-甲基丙烯醯氧乙基異氰酸酯,除此以外,以與黏著劑成分A相同之方式獲得含黏著劑成分B之溶液,並測定Mw及Mw/Mn。(Preparation of adhesive component B) Except that 2-methacryloxyethyl isocyanate was not used, a solution containing adhesive component B was obtained in the same manner as adhesive component A, and Mw and Mw/Mn were measured.

(聚矽氧系接枝共聚物A之製備) 準備具備溫度計、攪拌機、冷卻管之反應器,於該反應器內加入丙烯酸2-乙基己酯(2EHA)89重量份、聚矽氧巨單體10重量份、丙烯酸(AAc)1重量份、月桂硫醇0.01重量份、及乙酸乙酯80重量份後,加熱反應器而使回流開始。繼而,於上述反應器內添加1,1-雙(過氧化第三己基)-3,3,5-三甲基環己烷0.01重量份作為聚合起始劑,於回流下使聚合開始。其次,於聚合開始後1小時後及2小時後,分別添加1,1-雙(過氧化第三己基)-3,3,5-三甲基環己烷各0.01重量份,進而於聚合開始後4小時後添加過氧化三甲基乙酸第三己酯0.05重量份,而使聚合反應繼續。然後,於聚合開始後8小時後,獲得聚矽氧系接枝共聚物A之乙酸乙酯溶液。針對所獲得之聚矽氧系接枝共聚物A,利用與黏著劑成分A之製備相同之方法測定Mw及Mw/Mn。再者,聚矽氧巨單體係使用以下所示者。 聚矽氧巨單體:KF-2012、單末端甲基丙烯醯基改質PDMS,信越化學公司製造(Preparation of polysiloxy graft copolymer A) Prepare a reactor equipped with a thermometer, agitator, and cooling tube. Add 89 parts by weight of 2-ethylhexyl acrylate (2EHA), 10 parts by weight of polysiloxane macromonomer, and 1 part by weight of acrylic acid (AAc) into the reactor. After 0.01 part by weight of lauryl mercaptan and 80 parts by weight of ethyl acetate, the reactor was heated to start reflux. Then, 0.01 parts by weight of 1,1-bis(tertiary hexyl peroxide)-3,3,5-trimethylcyclohexane was added as a polymerization initiator in the above-mentioned reactor, and the polymerization was started under reflux. Next, after 1 hour and 2 hours after the initiation of the polymerization, 0.01 parts by weight of 1,1-bis(tertiary hexyl peroxide)-3,3,5-trimethylcyclohexane were added, and then at the start of the polymerization After 4 hours, 0.05 parts by weight of third hexyl peroxide trimethyl acetate was added to continue the polymerization reaction. Then, 8 hours after the start of the polymerization, an ethyl acetate solution of the polysiloxane-based graft copolymer A was obtained. For the obtained polysiloxane-based graft copolymer A, Mw and Mw/Mn were measured by the same method as the preparation of the adhesive component A. Furthermore, the polysiloxane giant single system uses the following ones. Polysiloxane giant monomer: KF-2012, single-terminal methacrylic acid modified PDMS, manufactured by Shin-Etsu Chemical

(聚矽氧系接枝共聚物B之製備) 準備具備溫度計、攪拌機、冷卻管之反應器,於該反應器內加入丙烯酸2-乙基己酯(2EHA)39重量份、聚矽氧巨單體60重量份、丙烯酸4-羥基丁酯(4HBA)1重量份、月桂硫醇0.01重量份、乙酸乙酯80重量份後,加熱反應器而使回流開始。繼而,於上述反應器內添加1,1-雙(過氧化第三己基)-3,3,5-三甲基環己烷0.01重量份作為聚合起始劑,於回流下使聚合開始。其次,於聚合開始後1小時後及2小時後,分別添加1,1-雙(過氧化第三己基)-3,3,5-三甲基環己烷各0.01重量份,進而於聚合開始後4小時後添加過氧化三甲基乙酸第三己酯0.05重量份,而使聚合反應繼續。然後,於聚合開始後8小時後,獲得含官能基之丙烯酸系聚合物之乙酸乙酯溶液。其後,相對於所獲得之含官能基之丙烯酸系聚合物之乙酸乙酯溶液之樹脂固形份100重量份,加入2-甲基丙烯醯氧乙基異氰酸酯(於表中為MOI)0.5重量份而進行反應,藉此獲得含聚矽氧系接枝共聚物B之溶液。針對所獲得之聚矽氧系接枝共聚物B,利用與黏著劑成分A之製備相同之方法測定Mw及Mw/Mn。(Preparation of polysiloxy graft copolymer B) Prepare a reactor equipped with a thermometer, agitator, and cooling tube. Add 39 parts by weight of 2-ethylhexyl acrylate (2EHA), 60 parts by weight of polysiloxane macromonomer, and 4-hydroxybutyl acrylate (4HBA) into the reactor. ) After 1 part by weight, 0.01 part by weight of lauryl mercaptan, and 80 parts by weight of ethyl acetate, the reactor is heated to start reflux. Then, 0.01 parts by weight of 1,1-bis(tertiary hexyl peroxide)-3,3,5-trimethylcyclohexane was added as a polymerization initiator in the above-mentioned reactor, and the polymerization was started under reflux. Next, after 1 hour and 2 hours after the initiation of the polymerization, 0.01 parts by weight of 1,1-bis(tertiary hexyl peroxide)-3,3,5-trimethylcyclohexane were added, and then at the start of the polymerization After 4 hours, 0.05 parts by weight of third hexyl peroxide trimethyl acetate was added to continue the polymerization reaction. Then, 8 hours after the start of polymerization, an ethyl acetate solution of a functional group-containing acrylic polymer was obtained. Then, with respect to 100 parts by weight of the resin solid content of the ethyl acetate solution of the obtained functional group-containing acrylic polymer, 0.5 parts by weight of 2-methacryloxyethyl isocyanate (MOI in the table) was added The reaction proceeds to obtain a solution containing the polysiloxy graft copolymer B. With respect to the obtained polysiloxane-based graft copolymer B, Mw and Mw/Mn were measured by the same method as the preparation of the adhesive component A.

(聚矽氧系接枝共聚物C~E之製備) 將單體組成設為表1所示,除此以外,以與聚矽氧系接枝共聚物B之製備相同之方式獲得聚矽氧系接枝共聚物C~E,並測定Mw及Mw/Mn。(Preparation of polysiloxy graft copolymer C~E) The monomer composition was set as shown in Table 1. Except for this, the polysiloxane-based graft copolymer C to E was obtained in the same manner as the preparation of the polysiloxane-based graft copolymer B, and the Mw and Mw/ Mn.

(聚矽氧系接枝共聚物F之製備) 將單體組成設為表1所示,除此以外,以與聚矽氧系接枝共聚物A之製備相同之方式獲得聚矽氧系接枝共聚物F,並測定Mw及Mw/Mn。(Preparation of polysiloxy graft copolymer F) The monomer composition was set as shown in Table 1. Except for this, the polysiloxane-based graft copolymer F was obtained in the same manner as the preparation of the polysiloxane-based graft copolymer A, and Mw and Mw/Mn were measured.

[表1] 黏著劑成分A 黏著劑成分B 組成 2EHA 79 79 AAc 1 1 4HBA 20 20 MOI 8 - 分子量 Mw(萬) 57 57 分子量分佈 Mw/Mn 6.4 6.4 聚矽氧系接枝共聚物A 聚矽氧系接枝共聚物B 聚矽氧系接枝共聚物C 聚矽氧系接枝共聚物D 聚矽氧系接枝共聚物E 聚矽氧系接枝共聚物F 組成 2EHA 89 39 37 35 30 40 聚矽氧巨單體 10 60 60 60 60 60 AAc 1 - - - - - 4HBA - 1 3 5 10 - MOI - 0.5 1.5 2.5 5 - 分子量 Mw(萬) 7.1 4.9 5.3 5.2 5.6 5.6 分子量分佈 Mw/Mn 2.8 1.7 1.7 1.8 1.8 1.8 [Table 1] Adhesive component A Adhesive component B composition 2EHA 79 79 AAc 1 1 4HBA 20 20 MOI 8 - Molecular weight Mw (ten thousand) 57 57 The molecular weight distribution Mw/Mn 6.4 6.4 Polysiloxy graft copolymer A Polysiloxane graft copolymer B Polysiloxy graft copolymer C Polysiloxane graft copolymer D Polysiloxy graft copolymer E Polysiloxane graft copolymer F composition 2EHA 89 39 37 35 30 40 Polysiloxane giant monomer 10 60 60 60 60 60 AAc 1 - - - - - 4HBA - 1 3 5 10 - MOI - 0.5 1.5 2.5 5 - Molecular weight Mw (ten thousand) 7.1 4.9 5.3 5.2 5.6 5.6 The molecular weight distribution Mw/Mn 2.8 1.7 1.7 1.8 1.8 1.8

(實施例1) 相對於所獲得之含黏著劑成分A之溶液之固形份100重量份,加入作為剝離助劑之聚矽氧系接枝共聚物A 5.0重量份、熱聚合起始劑1.0重量份、環氧系交聯劑0.1重量份,而獲得黏著劑組成物溶液。其次,將黏著劑組成物溶液以乾燥皮膜之厚度成為40 μm之方式藉由刮刀塗佈於表面實施過脫模處理之聚對酞酸乙二酯膜之脫模處理面上,於110℃進行加熱乾燥5分鐘而獲得黏著劑層。將所獲得之黏著劑層與單面實施過電暈處理之厚度50 μm之透明聚萘二甲酸乙二酯膜的電暈處理面貼合,而獲得黏著帶。再者,作為熱聚合起始劑及交聯劑,使用以下者。 熱聚合起始劑:PERBUTYL O,日油公司製造 環氧系交聯劑:Tetrad C,三菱瓦斯化學公司製造(Example 1) With respect to 100 parts by weight of the solid content of the obtained solution containing adhesive component A, 5.0 parts by weight of polysiloxane-based graft copolymer A as a peeling aid, 1.0 part by weight of thermal polymerization initiator, and epoxy-based 0.1 parts by weight of the crosslinking agent was used to obtain an adhesive composition solution. Next, apply the adhesive composition solution to the mold release treatment surface of the polyethylene terephthalate film that has been subjected to mold release treatment with a doctor blade so that the thickness of the dried film becomes 40 μm, and perform it at 110°C Heat and dry for 5 minutes to obtain an adhesive layer. The obtained adhesive layer was bonded to the corona-treated surface of a transparent polyethylene naphthalate film with a thickness of 50 μm, which was corona-treated on one side, to obtain an adhesive tape. In addition, as the thermal polymerization initiator and the crosslinking agent, the following were used. Thermal polymerization initiator: PERBUTYL O, manufactured by NOF Corporation Epoxy crosslinking agent: Tetrad C, manufactured by Mitsubishi Gas Chemical Company

(實施例2~16、比較例1~5) 將所使用之黏著劑成分、剝離助劑、聚合起始劑及交聯劑之種類及摻合量設為表2、3所示,除此以外,以與實施例1相同之方式獲得黏著帶。再者,作為剝離助劑、聚合起始劑及交聯劑,使用以下者。 聚矽氧二丙烯酸酯:EBECRYL350,DAICEL-ALLNEX公司製造 聚矽氧油:KF-96-10cs,信越化學公司製造 光聚合起始劑:Esacure One,Nihon SiberHegner公司製造 異氰酸酯系交聯劑:Coronate L45,東曹公司製造(Examples 2 to 16, Comparative Examples 1 to 5) The types and blending amounts of the used adhesive components, peeling aids, polymerization initiators, and crosslinking agents were set as shown in Tables 2 and 3, except that the adhesive tape was obtained in the same manner as in Example 1 . In addition, as the peeling aid, polymerization initiator, and crosslinking agent, the following were used. Polysiloxane diacrylate: EBECRYL350, manufactured by DAICEL-ALLNEX Silicone oil: KF-96-10cs, manufactured by Shin-Etsu Chemical Co., Ltd. Photopolymerization initiator: Esacure One, manufactured by Nihon SiberHegner Isocyanate-based crosslinker: Coronaate L45, manufactured by Tosoh Corporation

[評價] 針對實施例及比較例中所獲得之黏著帶,藉由以下方法進行評價。 將結果示於表2、3。[Evaluation] The adhesive tapes obtained in Examples and Comparative Examples were evaluated by the following methods. The results are shown in Tables 2 and 3.

(初始凝膠分率) 自黏著帶之黏著劑層刮取0.1 g黏著劑,將之浸漬於50 mL甲苯中,利用震盪器於溫度23℃、200 rpm之條件下震盪24小時。震盪後,使用金屬篩網(網眼#200網目),將甲苯與吸收甲苯而膨潤之黏著劑分離。使分離後之黏著劑於110℃之條件下乾燥1小時。測定乾燥後之包括金屬篩網之黏著劑之重量,並使用下述式(1)算出凝膠分率。 凝膠分率(重量%)=100×(W1 -W2 )/W0 (1) (W0 :初始黏著劑重量、W1 :乾燥後之包含金屬篩網之黏著劑重量、W2 :金屬篩網之初始重量)(Initial gel fraction) Scrape 0.1 g of the adhesive from the adhesive layer of the adhesive tape, immerse it in 50 mL of toluene, and use a shaker to shake for 24 hours at a temperature of 23°C and 200 rpm. After shaking, use a metal screen (mesh#200 mesh) to separate the toluene from the adhesive that absorbs toluene and swells. Dry the separated adhesive at 110°C for 1 hour. Measure the weight of the adhesive including the metal mesh after drying, and use the following formula (1) to calculate the gel fraction. Gel fraction (weight %) = 100×(W 1- W 2 )/W 0 (1) (W 0 : initial adhesive weight, W 1 : dried adhesive weight including metal mesh, W 2 : The initial weight of the metal screen)

(初始黏著力及加熱後黏著力之評價) 將黏著帶切成25 mm寬而獲得試驗片。將所獲得之試驗片之黏著層載置於玻璃板(松浪玻璃工業公司製造,大型載玻片白色磨邊 No.2)上。其次,使2 kg之橡膠輥以300 mm/分鐘之速度於試驗片上往返一次,藉此貼合試驗片與玻璃板。其後,於23℃靜置1小時而製作試驗樣品。針對靜置後之試驗樣品,依據JIS Z0237以300 mm/分鐘之剝離速度進行180°方向之拉伸試驗,測定初始黏著力。 繼而,針對藉由與上述相同之方法所製作之測定樣品,進行220℃2小時之熱處理。放置冷卻後,藉由與上述相同之方法進行180°方向之拉伸試驗,測定加熱後黏著力。 再者,關於比較例2~4之加熱後黏著力,由於糊劑殘留於玻璃板整面,故而無法測定。(Evaluation of initial adhesion and adhesion after heating) The adhesive tape was cut into a width of 25 mm to obtain a test piece. Place the adhesive layer of the obtained test piece on a glass plate (manufactured by Songlang Glass Industry Co., Ltd., large glass slide with white edging No. 2). Secondly, a rubber roller of 2 kg was reciprocated on the test piece at a speed of 300 mm/min to bond the test piece and the glass plate. Then, it left still at 23 degreeC for 1 hour, and produced the test sample. For the test sample after standing, perform a 180° tensile test at a peeling speed of 300 mm/min in accordance with JIS Z0237 to determine the initial adhesion. Then, the measurement sample prepared by the same method as the above was heat-treated at 220°C for 2 hours. After leaving it to cool, perform a 180° tensile test by the same method as above to measure the adhesive force after heating. In addition, the adhesive strength after heating of Comparative Examples 2 to 4 could not be measured because the paste remained on the entire surface of the glass plate.

(污染性之評價) 目視觀察加熱後黏著力之測定後之玻璃板,以下述基準評價殘渣。 ◎:無殘渣 〇:於一部分存在殘渣(貼附面積之10%以下) △:於一部分存在殘渣(較貼附面積之10%更廣範圍且為30%以下) ×:整面存在殘渣(較貼附面積之30%更廣範圍)(Evaluation of pollution) The glass plate after the measurement of the adhesive force after heating was visually observed, and the residue was evaluated based on the following criteria. ◎: No residue ○: There is residue in a part (less than 10% of the attached area) △: There is residue in a part (a wider range than 10% of the attached area and less than 30%) ×: There are residues on the whole surface (a wider range than 30% of the attached area)

[表2]    實施例 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 黏著劑成分A 100 - 100 100 100 100 100 100 100 100 - 100 100 100 100 100 黏著劑成分B - 100 - - - - - - - - 100 - - - - - 剝離助劑 聚矽氧系接枝共聚物A 5.0 5.0 - - - - - - - - - - - - - - 聚矽氧系接枝共聚物B - - 5.0 - - - - - - - - - - - - - 聚矽氧系接枝共聚物C - - - 5.0 - - - - - - - - - - - - 聚矽氧系接枝共聚物D - - - - 5.0 - - - - - - - - - - - 聚矽氧系接枝共聚物E - - - - - 0.5 1.0 5.0 10.0 5.0 5.0 5.0 20.0 30.0 5.0 5.0 聚矽氧二丙烯酸酯 - - - - - - - - - - - - - - - - 聚矽氧油 - - - - - - - - - - - - - - - - 聚合起始劑 熱聚合起始劑 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 - 1.0 1.0 1.0 1.0 1.0 1.0 光聚合起始劑 - - - - - - - - - 1.0 - - - - - - 交聯劑 環氧系交聯劑 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 - 0.1 0.1 0.5 1.0 異氰酸酯系交聯劑 - - - - - - - - - - - 0.1 - - - - 評價 初始凝膠分率(重量%) 49 51 48 55 50 51 45 50 55 52 49 53 57 60 82 90 初始黏著力(N/25 mm) 2.5 2.5 2.8 3.0 3.0 2.5 1.9 1.8 1.5 1.8 2.0 2.0 1.3 1.1 0.9 0.7 加熱後黏著力(N/25 mm) 0.3 2.3 0.3 0.3 0.3 0.5 0.3 0.2 0.2 0.2 1.8 0.2 0.2 0.2 0.2 0.2 污染性評價 [Table 2] Example 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 Adhesive component A 100 - 100 100 100 100 100 100 100 100 - 100 100 100 100 100 Adhesive component B - 100 - - - - - - - - 100 - - - - - Stripping aid Polysiloxy graft copolymer A 5.0 5.0 - - - - - - - - - - - - - - Polysiloxane graft copolymer B - - 5.0 - - - - - - - - - - - - - Polysiloxy graft copolymer C - - - 5.0 - - - - - - - - - - - - Polysiloxane graft copolymer D - - - - 5.0 - - - - - - - - - - - Polysiloxy graft copolymer E - - - - - 0.5 1.0 5.0 10.0 5.0 5.0 5.0 20.0 30.0 5.0 5.0 Polysiloxane diacrylate - - - - - - - - - - - - - - - - Silicone oil - - - - - - - - - - - - - - - - Polymerization initiator Thermal polymerization initiator 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 1.0 - 1.0 1.0 1.0 1.0 1.0 1.0 Photopolymerization initiator - - - - - - - - - 1.0 - - - - - - Crosslinking agent Epoxy crosslinking agent 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 - 0.1 0.1 0.5 1.0 Isocyanate-based crosslinking agent - - - - - - - - - - - 0.1 - - - - Evaluation Initial gel fraction (weight%) 49 51 48 55 50 51 45 50 55 52 49 53 57 60 82 90 Initial adhesion (N/25 mm) 2.5 2.5 2.8 3.0 3.0 2.5 1.9 1.8 1.5 1.8 2.0 2.0 1.3 1.1 0.9 0.7 Adhesion after heating (N/25 mm) 0.3 2.3 0.3 0.3 0.3 0.5 0.3 0.2 0.2 0.2 1.8 0.2 0.2 0.2 0.2 0.2 Pollution evaluation

[表3]    比較例 1 2 3 4 5 黏著劑成分A 100 100 - 100 100 黏著劑成分B - - 100 - - 剝離助劑 聚矽氧系接枝共聚物A - - - - - 聚矽氧系接枝共聚物B - - - - - 聚矽氧系接枝共聚物C - - - - - 聚矽氧系接枝共聚物D - - - - - 聚矽氧系接枝共聚物E - - - - - 聚矽氧系接枝共聚物F - - - - 5.0 聚矽氧二丙烯酸酯 5.0 - - - - 聚矽氧油 - - - 5 - 聚合起始劑 熱聚合起始劑 1.0 1.0 1.0 - - 光聚合起始劑 - - - - - 交聯劑 環氧系交聯劑 0.1 0.1 0.1 0.1 0.1 異氰酸酯系交聯劑 - - - - - 評價 初始凝膠分率(重量%) 46 44 49 47 48 初始黏著力(N/25 mm) 0.2 3.5 2.5 2.0 2.5 加熱後黏著力(N/25 mm) 0.2 - - - - 污染性評價 × × × × [產業上之可利用性][table 3] Comparative example 1 2 3 4 5 Adhesive component A 100 100 - 100 100 Adhesive component B - - 100 - - Stripping aid Polysiloxy graft copolymer A - - - - - Polysiloxane graft copolymer B - - - - - Polysiloxy graft copolymer C - - - - - Polysiloxane graft copolymer D - - - - - Polysiloxy graft copolymer E - - - - - Polysiloxane graft copolymer F - - - - 5.0 Polysiloxane diacrylate 5.0 - - - - Silicone oil - - - 5 - Polymerization initiator Thermal polymerization initiator 1.0 1.0 1.0 - - Photopolymerization initiator - - - - - Crosslinking agent Epoxy crosslinking agent 0.1 0.1 0.1 0.1 0.1 Isocyanate-based crosslinking agent - - - - - Evaluation Initial gel fraction (weight%) 46 44 49 47 48 Initial adhesion (N/25 mm) 0.2 3.5 2.5 2.0 2.5 Adhesion after heating (N/25 mm) 0.2 - - - - Pollution evaluation X X X X [Industrial availability]

根據本發明,可提供一種儘管於貼附時具有較高之黏著力,但即便供於高溫熱處理步驟亦可抑制接著亢進之黏著劑組成物、及具有由該黏著劑組成物所構成之黏著劑層之黏著帶。According to the present invention, it is possible to provide an adhesive composition capable of suppressing subsequent acceleration even when applied to a high-temperature heat treatment step, and an adhesive composed of the adhesive composition. Layer of adhesive tape.

no

no

Claims (10)

一種黏著劑組成物,其含有黏著劑成分及聚矽氧系接枝共聚物,該聚矽氧系接枝共聚物具有能夠與上述黏著劑成分交聯之官能基。An adhesive composition contains an adhesive component and a polysiloxane-based graft copolymer. The polysiloxane-based graft copolymer has a functional group capable of crosslinking with the adhesive component. 如請求項1之黏著劑組成物,其中,上述黏著劑組成物係含有聚合起始劑之硬化型黏著劑組成物。The adhesive composition according to claim 1, wherein the adhesive composition is a hardened adhesive composition containing a polymerization initiator. 如請求項1或2之黏著劑組成物,其中,上述黏著劑成分於分子內具有自由基聚合性不飽和鍵。The adhesive composition of claim 1 or 2, wherein the adhesive component has a radically polymerizable unsaturated bond in the molecule. 2或3之黏著劑組成物,其中,上述聚矽氧系接枝共聚物中之能夠與上述黏著劑成分交聯之官能基係自由基聚合性不飽和鍵。The adhesive composition of 2 or 3, wherein the functional group in the polysiloxane-based graft copolymer that can be crosslinked with the adhesive component is a radically polymerizable unsaturated bond. 2、3或4之黏著劑組成物,其中,上述聚矽氧系接枝共聚物中之能夠與上述黏著劑成分交聯之官能基係藉由加熱而與上述黏著劑成分反應之官能基。The adhesive composition of 2, 3 or 4, wherein the functional group capable of crosslinking with the adhesive component in the polysiloxane-based graft copolymer is a functional group that reacts with the adhesive component by heating. 2、3、4或5之黏著劑組成物,其中,上述聚矽氧系接枝共聚物具有極性官能基。The adhesive composition of 2, 3, 4, or 5, wherein the above-mentioned polysiloxane-based graft copolymer has a polar functional group. 2、3、4、5或6之黏著劑組成物,其中,上述聚矽氧系接枝共聚物具有下述結構式所示之結構:
Figure 03_image005
, 此處,R1 、R2 、R3 、R4 分別獨立地表示甲基或氫原子,R5 、R6 、R7 分別獨立地表示具有直鏈狀或支鏈狀碳鏈之1~18個碳原子之飽和烴基,R8 表示含有(甲基)丙烯醯基之官能基,R9 表示含有極性官能基之基,L、M、N、O及P分別獨立地表示0以上之整數。
The adhesive composition of 2, 3, 4, 5 or 6, wherein the above-mentioned polysiloxy graft copolymer has a structure shown in the following structural formula:
Figure 03_image005
, Here, R 1 , R 2 , R 3 , and R 4 each independently represent a methyl group or a hydrogen atom, and R 5 , R 6 , and R 7 each independently represent 1 to 1 having a linear or branched carbon chain A saturated hydrocarbon group with 18 carbon atoms, R 8 represents a functional group containing (meth)acrylic acid group, R 9 represents a group containing polar functional group, L, M, N, O and P each independently represent an integer of 0 or more .
2、3、4、5、6或7之黏著劑組成物,其中,上述黏著劑組成物中之上述聚矽氧系接枝共聚物之含量為0.1~20重量%。The adhesive composition of 2, 3, 4, 5, 6, or 7, wherein the content of the polysiloxane-based graft copolymer in the adhesive composition is 0.1-20% by weight. 一種黏著帶,其具有基材及積層於上述基材之至少一面之黏著劑層,且上述黏著劑層由請求項1、2、3、4、5、6、7或8之黏著劑組成物所構成。An adhesive tape having a substrate and an adhesive layer laminated on at least one side of the substrate, and the adhesive layer is composed of the adhesive composition of claim 1, 2, 3, 4, 5, 6, 7 or 8. Constituted. 如請求項9之黏著帶,其中,上述黏著劑層之凝膠分率未達90重量%。Such as the adhesive tape of claim 9, wherein the gel fraction of the adhesive layer is less than 90% by weight.
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