TW202034747A - Substrate structure and manufacturing method thereof - Google Patents

Substrate structure and manufacturing method thereof Download PDF

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TW202034747A
TW202034747A TW108108424A TW108108424A TW202034747A TW 202034747 A TW202034747 A TW 202034747A TW 108108424 A TW108108424 A TW 108108424A TW 108108424 A TW108108424 A TW 108108424A TW 202034747 A TW202034747 A TW 202034747A
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substrate
flexible
copper foil
patterned circuit
circuit layer
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TW108108424A
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Chinese (zh)
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TWI729362B (en
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涂成一
黃秋佩
賈孟寰
洪培豪
劉逸群
李遠智
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同泰電子科技股份有限公司
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Priority to TW108108424A priority Critical patent/TWI729362B/en
Priority to CN201920637854.9U priority patent/CN209544311U/en
Priority to CN201910373496.XA priority patent/CN111696869A/en
Publication of TW202034747A publication Critical patent/TW202034747A/en
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Publication of TWI729362B publication Critical patent/TWI729362B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/142—Metallic substrates having insulating layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Geometry (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

A substrate structure including a substrate, a soft flexible board, a patterned circuit layer, a solder resist layer, and a protective layer is provided. The soft flexible board is disposed on the substrate. The stiffness of the substrate is greater than the stiffness of the soft flexible board. The patterned circuit layer is disposed on the soft flexible board. The solder resist layer is disposed on the patterned circuit layer. The solder resist layer has a plurality of openings. The openings expose a portion of the patterned circuit layer. The protective layer is disposed on the patterned circuit layer exposed by the openings of the solder resist layer.

Description

基板結構及其製作方法Substrate structure and manufacturing method thereof

本發明是有關於一種基板結構及其製作方法，且特別是有關於一種具有剛性承載的基板結構及其製作方法。The present invention relates to a substrate structure and a manufacturing method thereof, and more particularly to a substrate structure with rigid bearing and a manufacturing method thereof.

在一些電子元件的製造過程中，常使用軟性銅箔基板。而在軟性銅箔基板轉移過程中，常會有以下幾點的問題：(1)貼乘載膜流程中壓膜不良會造成折壓傷；(2)撕除承載膜後單面板兩面應力不同造成板翹；或(3)撕除後因不平整造成皺折。In the manufacturing process of some electronic components, flexible copper foil substrates are often used. In the process of soft copper foil substrate transfer, there are often the following problems: (1) Poor laminating film during the process of attaching the carrier film will cause fold and crush injuries; (2) The stress on both sides of the single panel after the carrier film is removed. Board warping; or (3) Wrinkles caused by unevenness after tearing off.

本發明提供一種基板結構及其製作方法，其可以省略貼乘載膜流程，而可以降低折壓傷及皺折問題。The present invention provides a substrate structure and a manufacturing method thereof, which can omit the process of attaching and riding a carrier film, and can reduce the problems of folding, crushing and wrinkle.

本發明的基板結構的製作方法包括以下步驟。配置軟性銅箔基板於基板上，其中基板的剛度大於軟性銅箔基板的剛度。圖案化基板上的軟性銅箔基板，以於基板上形成圖案化線路層。形成防焊層於圖案化線路層上，防焊層具有多個開口，且多個開口暴露出部分的圖案化線路層。形成保護層於多個開口所暴露出的圖案化線路層上。The manufacturing method of the substrate structure of the present invention includes the following steps. A flexible copper foil substrate is arranged on the substrate, wherein the rigidity of the substrate is greater than that of the flexible copper foil substrate. The flexible copper foil substrate on the patterned substrate is used to form a patterned circuit layer on the substrate. A solder mask layer is formed on the patterned circuit layer, the solder mask layer has a plurality of openings, and the plurality of openings expose part of the patterned circuit layer. A protective layer is formed on the patterned circuit layer exposed by the multiple openings.

在本發明的一實施例中，軟性銅箔基板的尺寸與基板的尺寸的比例範圍為1:0.8至1:1.2。In an embodiment of the present invention, the ratio of the size of the flexible copper foil substrate to the size of the substrate ranges from 1:0.8 to 1:1.2.

在本發明的一實施例中，軟性銅箔基板包括軟性可撓式基板及覆蓋於軟性可撓式基板上的銅箔。In an embodiment of the present invention, the flexible copper foil substrate includes a flexible flexible substrate and a copper foil covering the flexible flexible substrate.

在本發明的一實施例中，軟性銅箔基板由軟性可撓式基板及銅箔所組成。In an embodiment of the present invention, the flexible copper foil substrate is composed of a flexible flexible substrate and copper foil.

在本發明的一實施例中，基板為金屬板，軟性銅箔基板包括軟性可撓式基板及覆蓋於軟性可撓式基板上的銅箔，且配置軟性銅箔基板於基板上的步驟中，軟性銅箔基板與基板彼此電性分離。In an embodiment of the present invention, the substrate is a metal plate, the flexible copper foil substrate includes a flexible flexible substrate and a copper foil covering the flexible flexible substrate, and in the step of arranging the flexible copper foil substrate on the substrate, The flexible copper foil substrate and the substrate are electrically separated from each other.

在本發明的一實施例中，基板結構的製作方法更包括以下步驟。對保護層及防焊層進行外觀檢查。In an embodiment of the present invention, the manufacturing method of the substrate structure further includes the following steps. Visual inspection of the protective layer and solder mask.

在本發明的一實施例中，基板結構的製作方法更包括以下步驟。對保護層及圖案化線路層進行電性檢查。In an embodiment of the present invention, the manufacturing method of the substrate structure further includes the following steps. Conduct electrical inspections on the protective layer and patterned circuit layer.

本發明的基板結構包括基板、軟性可撓式基板、圖案化線路層、防焊層以及保護層。軟性可撓式基板位於基板上。基板的剛度大於軟性可撓式基板的剛度。圖案化線路層位於軟性可撓式基板上。防焊層位於圖案化線路層上。防焊層具有多個開口。開口暴露出部分的圖案化線路層。保護層位於防焊層的開口所暴露出的圖案化線路層上。The substrate structure of the present invention includes a substrate, a flexible flexible substrate, a patterned circuit layer, a solder mask and a protective layer. The soft flexible substrate is located on the substrate. The rigidity of the substrate is greater than that of the flexible flexible substrate. The patterned circuit layer is located on the flexible flexible substrate. The solder mask is located on the patterned circuit layer. The solder mask has a plurality of openings. The opening exposes part of the patterned circuit layer. The protective layer is located on the patterned circuit layer exposed by the opening of the solder mask.

在本發明的一實施例中，基板為單一材質的塊狀或片狀板材。In an embodiment of the present invention, the substrate is a block or sheet plate of a single material.

在本發明的一實施例中，基板為金屬板，且圖案化線路層與基板彼此電性分離。In an embodiment of the present invention, the substrate is a metal plate, and the patterned circuit layer and the substrate are electrically separated from each other.

在本發明的一實施例中，圖案化線路層與基板之間不具有導電材質。In an embodiment of the present invention, there is no conductive material between the patterned circuit layer and the substrate.

基於上述，本發明的基板結構使用具有剛性的基板作為整體結構的承載。因此，基板結構的製作方法中可以省略貼乘載膜流程，而可以降低折壓傷及皺折問題。Based on the above, the substrate structure of the present invention uses a rigid substrate as the carrier of the overall structure. Therefore, the process of attaching and riding the carrier film can be omitted in the manufacturing method of the substrate structure, and the problems of creasing, crushing and wrinkle can be reduced.

為讓本發明的上述特徵和優點能更明顯易懂，下文特舉實施例，並配合所附圖式作詳細說明如下。In order to make the above-mentioned features and advantages of the present invention more comprehensible, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

有關本發明之前述及其他技術內容、特點與功效，在以下配合參考圖式之各實施例的詳細說明中，將可清楚的呈現。以下實施例中所提到的方向用語，例如：「上」、「下」、「前」、「後」、「左」、「右」等，僅是參考附加圖式的方向。因此，使用的方向用語是用來說明，而並非用來限制本發明。並且，在下列各實施例中，相同或相似的元件將採用相同或相似的標號。The foregoing and other technical content, features and effects of the present invention will be clearly presented in the detailed description of each embodiment with reference to the drawings. The directional terms mentioned in the following embodiments, for example: "up", "down", "front", "rear", "left", "right", etc., are just directions for referring to the attached drawings. Therefore, the directional terms used are used to illustrate, but not to limit the present invention. In addition, in the following embodiments, the same or similar elements will use the same or similar reference numerals.

圖1至圖4依照本發明的一實施例的一種基板結構的製作方法的剖視示意圖。1 to 4 are schematic cross-sectional views of a method of fabricating a substrate structure according to an embodiment of the present invention.

請參照圖1，配置軟性銅箔基板（Flexible Copper Clad Laminate，FCCL）120於基板110上，其中基板110的剛度（Stiffness）大於軟性銅箔基板120的剛度。Please refer to FIG. 1, a flexible copper clad laminate (FCCL) 120 is disposed on the substrate 110, wherein the stiffness (Stiffness) of the substrate 110 is greater than the stiffness of the flexible copper foil substrate 120.

在本實施例中，基板110為金屬板。金屬板具有較佳的耐磨性、可彎折性或散熱性。因此，可以使基板結構100的安定性或散熱較佳。In this embodiment, the substrate 110 is a metal plate. The metal plate has better wear resistance, bendability or heat dissipation. Therefore, the stability or heat dissipation of the substrate structure 100 can be improved.

在本實施例中，作為基板110的金屬板為素基板（bare substrate）。換句話說，作為基板110的金屬板內不具有任何的電子元件（如：主動元件、被動元件及導線）。In this embodiment, the metal plate as the substrate 110 is a bare substrate. In other words, the metal plate serving as the substrate 110 does not have any electronic components (such as active components, passive components, and wires).

在本實施例中，軟性銅箔基板120包括軟性可撓式基板122及覆蓋於軟性可撓式基板122上的銅箔124。軟性可撓式基板122的材質例如為聚亞醯胺（polyimide，PI）或聚對苯二甲酸乙二酯（polyethylene terephthalate，PET），但本發明不限於此。銅箔124可以是壓延銅箔（俗稱：RA銅箔）或電解銅箔（俗稱：ED銅箔），但本發明不限於此。In this embodiment, the flexible copper foil substrate 120 includes a flexible flexible substrate 122 and a copper foil 124 covering the flexible flexible substrate 122. The material of the flexible flexible substrate 122 is, for example, polyimide (PI) or polyethylene terephthalate (PET), but the present invention is not limited thereto. The copper foil 124 may be rolled copper foil (commonly known as RA copper foil) or electrolytic copper foil (commonly known as ED copper foil), but the present invention is not limited thereto.

以圖1所繪示的實施例為例，軟性銅箔基板120由軟性可撓式基板122及銅箔124所組成。換句話說，軟性銅箔基板120可以是無接著劑型的軟板（俗稱：無膠系軟板基板（2 Layer FCCL）），但本發明不限於此。Taking the embodiment shown in FIG. 1 as an example, the flexible copper foil substrate 120 is composed of a flexible flexible substrate 122 and a copper foil 124. In other words, the flexible copper foil substrate 120 may be a non-adhesive type flexible board (commonly known as a non-adhesive flexible board (2 Layer FCCL)), but the present invention is not limited to this.

在一未繪示的實施例中，軟性銅箔基板由軟性可撓式基板（如：類似於軟性可撓式基板122的軟性可撓式基板）、銅箔（如：類似於銅箔124的銅箔）以及位於軟性可撓式基板及銅箔之間具有接著用途的膠層所組成。膠層的材質例如為環氧樹脂（Epoxy）、聚酯樹脂（Polyester）或壓克力樹脂（Acrylic），但本發明不限於此。換句話說，軟性銅箔基板可以是有接著劑型的軟板（俗稱：有膠系軟板基板（3 Layer FCCL））。In an embodiment not shown, the flexible copper foil substrate consists of a flexible flexible substrate (such as a flexible flexible substrate similar to the flexible flexible substrate 122), and copper foil (such as a copper foil 124 similar to the flexible substrate). Copper foil) and an adhesive layer for bonding between the flexible flexible substrate and the copper foil. The material of the adhesive layer is, for example, epoxy resin (Epoxy), polyester resin (Polyester) or acrylic resin (Acrylic), but the present invention is not limited thereto. In other words, the flexible copper foil substrate can be a flexible board with an adhesive (commonly known as: 3 Layer FCCL).

相較於有接著劑型的軟性可撓式基板，無接著劑型的軟性可撓式基板為軟性可撓式基板（如：軟性可撓式基板122）及銅箔（如：銅箔124）直接結合，而具有較佳的耐熱性高及耐撓折性。Compared with the adhesive type of flexible flexible substrate, the non-adhesive type of flexible flexible substrate is a soft flexible substrate (such as: soft flexible substrate 122) and copper foil (such as: copper foil 124) are directly combined , And has better heat resistance and flexibility.

在本實施例中，於配置軟性銅箔基板120於基板110上的步驟中，使軟性銅箔基板120的銅箔124與基板110彼此電性分離。換句話說，是將軟性銅箔基板120中絕緣的軟性可撓式基板122面向基板110的方式，以使軟性銅箔基板120直接貼合於基板110上。也就是說，銅箔124與基板110之間不具有其他的導電材質（因無，故無繪示）。In this embodiment, in the step of disposing the flexible copper foil substrate 120 on the substrate 110, the copper foil 124 of the flexible copper foil substrate 120 and the substrate 110 are electrically separated from each other. In other words, it is a method in which the insulated flexible flexible substrate 122 in the flexible copper foil substrate 120 faces the substrate 110 so that the flexible copper foil substrate 120 is directly attached to the substrate 110. In other words, there is no other conductive material between the copper foil 124 and the substrate 110 (they are not shown because they are not).

在一實施例中，基板110可以為鐵板、鋼板、鐵合金板、鎂鋁合金、鍍鋅鋼板或其他適宜的板材。在相同的尺寸下（如：相同的橫截面面積及長度下），鐵、鋼或鐵合金的楊氏模量（Young's modulus）大於銅或的楊氏模量。如此一來，作為基板110的鐵板、鋼板或鐵合金板可以提供良好的支持，以在後續的製程中乘載基板110上的構件，而可以降低被乘載於基板110上的構件產生撓曲的可能。In an embodiment, the substrate 110 may be an iron plate, a steel plate, an iron alloy plate, a magnesium-aluminum alloy, a galvanized steel plate, or other suitable plates. Under the same size (for example, the same cross-sectional area and length), the Young's modulus of iron, steel or iron alloy is greater than that of copper or copper. In this way, the iron plate, steel plate or ferroalloy plate used as the substrate 110 can provide good support to carry the components on the substrate 110 in the subsequent process, and can reduce the deflection of the components carried on the substrate 110 Possible.

在本實施例中，軟性銅箔基板120的尺寸與基板110的尺寸的比例範圍為1:0.8至1:1.2，但本發明不限於此。In this embodiment, the ratio of the size of the flexible copper foil substrate 120 to the size of the substrate 110 ranges from 1:0.8 to 1:1.2, but the present invention is not limited to this.

請參照圖2，圖案化基板110上的軟性銅箔基板120（繪示於圖1），以於基板110上形成圖案化線路層125。Please refer to FIG. 2, a flexible copper foil substrate 120 (shown in FIG. 1) on a patterned substrate 110 to form a patterned circuit layer 125 on the substrate 110.

舉例而言，可以藉由蝕刻的方式移除部份的銅箔124（繪示於圖1），以形成位於軟性可撓式基板122上的圖案化線路層125，但本發明不限於此。For example, part of the copper foil 124 (shown in FIG. 1) can be removed by etching to form the patterned circuit layer 125 on the flexible flexible substrate 122, but the invention is not limited to this.

請參照圖3，形成防焊層130於圖案化線路層125上，防焊層130具有多個開口131，且多個開口131暴露出部分的圖案化線路層125。3, a solder mask layer 130 is formed on the patterned circuit layer 125. The solder mask layer 130 has a plurality of openings 131, and the plurality of openings 131 expose part of the patterned circuit layer 125.

請參照圖4，形成保護層140於多個開口131所暴露出的圖案化線路層125上。4, a protective layer 140 is formed on the patterned circuit layer 125 exposed by the plurality of openings 131.

在一實施例中，保護層140例如是藉由電鍍的方式形成，且保護層140的材質可以包括金、鎳、錳、鎳、鋅或上述之組合，但本發明不限於此。In one embodiment, the protective layer 140 is formed by electroplating, and the material of the protective layer 140 may include gold, nickel, manganese, nickel, zinc or a combination of the above, but the invention is not limited thereto.

在一實施例中，保護層140例如是藉由陽極氧化處理的方式形成，且保護層140的材質可以包括金屬氧化物，但本發明不限於此。In an embodiment, the protective layer 140 is formed by, for example, anodizing, and the material of the protective layer 140 may include metal oxide, but the invention is not limited thereto.

經過上述製程後即可大致上完成本實施例之基板結構100的製作。上述之基板結構100包括基板110、軟性可撓式基板122、圖案化線路層125、防焊層130以及保護層140。軟性可撓式基板122位於基板110上。基板110的剛度大於軟性可撓式基板122的剛度。圖案化線路層125位於軟性可撓式基板122上。防焊層130位於圖案化線路層125上。防焊層130具有多個開口131。開口131暴露出部分的圖案化線路層125。保護層140位於防焊層130的開口131所暴露出的圖案化線路層125上。After the above-mentioned manufacturing process, the fabrication of the substrate structure 100 of this embodiment can be substantially completed. The above-mentioned substrate structure 100 includes a substrate 110, a flexible flexible substrate 122, a patterned circuit layer 125, a solder mask layer 130 and a protective layer 140. The flexible flexible substrate 122 is located on the substrate 110. The rigidity of the substrate 110 is greater than the rigidity of the flexible flexible substrate 122. The patterned circuit layer 125 is located on the flexible flexible substrate 122. The solder mask 130 is located on the patterned circuit layer 125. The solder mask 130 has a plurality of openings 131. The opening 131 exposes part of the patterned circuit layer 125. The protective layer 140 is located on the patterned circuit layer 125 exposed by the opening 131 of the solder mask layer 130.

本實施例之基板結構100可以作為最終的產品的一部份。也就是說，基板結構100中的任何構件皆不會被移除。因此，在大致上完成基板結構100的製作之後，可以對基板結構100進行成品檢驗（Final Inspection），以確認所完成的基板結構100為良品。The substrate structure 100 of this embodiment can be used as a part of the final product. In other words, none of the components in the substrate structure 100 will be removed. Therefore, after the fabrication of the substrate structure 100 is substantially completed, a final inspection (Final Inspection) can be performed on the substrate structure 100 to confirm that the completed substrate structure 100 is a good product.

舉例而言，請繼續參照圖4，在本實施例中，可以對保護層140及防焊層130進行外觀檢查及/或對保護層140及圖案化線路層125進行電性檢查。For example, please continue to refer to FIG. 4. In this embodiment, the appearance inspection of the protective layer 140 and the solder mask 130 and/or the electrical inspection of the protective layer 140 and the patterned circuit layer 125 may be performed.

在本實施例中，外觀檢查可以包括肉眼外觀檢測、自動光學檢測（Automated Optical Inspection，AOI）或最終檢測（Final Visual Inspection，FVI），但本發明不限於此。舉例而言，可以藉由光學檢測裝置20對基板結構100的保護層140及防焊層130進行破損、刮傷、缺角、異色、沾污、毛邊、氣泡、凹陷、短路、外觀瑕疵等一種或多種的外觀檢查。In this embodiment, the appearance inspection may include visual appearance inspection, automatic optical inspection (Automated Optical Inspection, AOI), or final inspection (Final Visual Inspection, FVI), but the present invention is not limited thereto. For example, the protective layer 140 and the solder mask 130 of the substrate structure 100 can be damaged, scratched, chipped, heterochromatic, stained, burrs, bubbles, dents, short circuits, appearance defects, etc., by the optical inspection device 20. Or a variety of visual inspections.

在本實施例中，電性檢測可以包括開路與短路測試（Open/Short test，O/S test），但本發明不限於此。舉例而言，可以藉由將飛針測試機（Flying probe tester）的一個或多個探針30伸入防焊層130的開口131內，並與保護層140接觸，以對圖案化線路層125進行電性測試。In this embodiment, the electrical testing may include Open/Short test (O/S test), but the present invention is not limited to this. For example, one or more probes 30 of a flying probe tester can be extended into the opening 131 of the solder mask 130 and contacted with the protective layer 140, so as to contrast the patterned circuit layer 125 Conduct electrical tests.

在本實施例中，基板110為單一材質的塊狀或片狀板材。In this embodiment, the substrate 110 is a block or sheet plate of a single material.

在本實施例中，基板110為金屬板，且圖案化線路層125與基板110彼此電性分離。In this embodiment, the substrate 110 is a metal plate, and the patterned circuit layer 125 and the substrate 110 are electrically separated from each other.

在本實施例中，圖案化線路層125與基板110之間不具有導電材質（因無，故無繪示）。In this embodiment, there is no conductive material between the patterned circuit layer 125 and the substrate 110 (it is not shown because it is not).

綜上所述，本發明的基板結構使用具有剛性的基板作為整體結構的承載。因此，基板結構的製作方法中可以省略貼乘載膜流程，而可以降低折壓傷及皺折問題。In summary, the substrate structure of the present invention uses a rigid substrate as the carrier of the overall structure. Therefore, the process of attaching and riding the carrier film can be omitted in the manufacturing method of the substrate structure, and the problems of creasing, crushing and wrinkle can be reduced.

雖然本發明已以實施例揭露如上，然其並非用以限定本發明，任何所屬技術領域中具有通常知識者，在不脫離本發明的精神和範圍內，當可作些許的更動與潤飾，故本發明的保護範圍當視後附的申請專利範圍所界定者為準。Although the present invention has been disclosed in the above embodiments, it is not intended to limit the present invention. Anyone with ordinary knowledge in the technical field can make some changes and modifications without departing from the spirit and scope of the present invention. The scope of protection of the present invention shall be determined by the scope of the attached patent application.

100:基板結構 110:基板 120:軟性銅箔基板 122:軟性可撓式基板 124:銅箔 125:圖案化線路層 130:防焊層 131:開口 140:保護層 20:光學檢測裝置 30:探針100: substrate structure 110: substrate 120: Flexible copper foil substrate 122: soft flexible substrate 124: Copper Foil 125: Patterned circuit layer 130: solder mask 131: opening 140: protective layer 20: Optical detection device 30: Probe

圖1至圖4依照本發明的一實施例的一種基板結構的製作方法的剖視示意圖。1 to 4 are schematic cross-sectional views of a method of fabricating a substrate structure according to an embodiment of the present invention.

100:基板結構 100: substrate structure

110:基板 110: substrate

122:軟性可撓式基板 122: soft flexible substrate

125:圖案化線路層 125: Patterned circuit layer

130:防焊層 130: solder mask

131:開口 131: opening

140:保護層 140: protective layer

20:光學檢測裝置 20: Optical detection device

30:探針 30: Probe

Claims (10)

一種基板結構的製作方法，包括： 配置軟性銅箔基板於基板上，其中所述基板的剛度大於所述軟性銅箔基板的剛度； 圖案化所述基板上的所述軟性銅箔基板，以於所述基板上形成圖案化線路層； 形成防焊層於所述圖案化線路層上，所述防焊層具有多個開口，且所述多個開口暴露出部分的所述圖案化線路層；以及 形成保護層於所述多個開口所暴露出的所述圖案化線路層上。A method for manufacturing a substrate structure includes: Disposing a flexible copper foil substrate on the substrate, wherein the rigidity of the substrate is greater than the rigidity of the flexible copper foil substrate; Patterning the flexible copper foil substrate on the substrate to form a patterned circuit layer on the substrate; Forming a solder mask layer on the patterned circuit layer, the solder mask layer having a plurality of openings, and the plurality of openings expose part of the patterned circuit layer; and A protective layer is formed on the patterned circuit layer exposed by the plurality of openings. 如申請專利範圍第1項所述的基板結構的製作方法，其中所述軟性銅箔基板的尺寸與所述基板的尺寸的比例範圍為1:0.8至1:1.2。According to the manufacturing method of the substrate structure described in the first item of the scope of patent application, the ratio of the size of the flexible copper foil substrate to the size of the substrate ranges from 1:0.8 to 1:1.2. 如申請專利範圍第1項所述的基板結構的製作方法，其中所述軟性銅箔基板包括軟性可撓式基板及覆蓋於所述軟性可撓式基板上的銅箔。According to the manufacturing method of the substrate structure described in the first item of the scope of patent application, the flexible copper foil substrate includes a flexible flexible substrate and a copper foil covering the flexible flexible substrate. 如申請專利範圍第3項所述的基板結構的製作方法，其中所述軟性銅箔基板由所述軟性可撓式基板及所述銅箔所組成。According to the manufacturing method of the substrate structure described in the third item of the scope of patent application, the flexible copper foil substrate is composed of the flexible flexible substrate and the copper foil. 如申請專利範圍第1項所述的基板結構的製作方法，其中： 所述基板為金屬板； 所述軟性銅箔基板包括軟性可撓式基板及覆蓋於所述軟性可撓式基板上的銅箔，且 於配置所述軟性銅箔基板於所述基板上的步驟中，所述軟性銅箔基板與所述基板彼此電性分離。The manufacturing method of the substrate structure as described in item 1 of the scope of patent application, wherein: The substrate is a metal plate; The flexible copper foil substrate includes a flexible flexible substrate and a copper foil covering the flexible flexible substrate, and In the step of arranging the flexible copper foil substrate on the substrate, the flexible copper foil substrate and the substrate are electrically separated from each other. 如申請專利範圍第1項所述的基板結構的製作方法，更包括： 對所述保護層及所述防焊層進行外觀檢查；及/或 對所述保護層及所述圖案化線路層進行電性檢查。The manufacturing method of the substrate structure as described in item 1 of the scope of patent application further includes: Perform visual inspection on the protective layer and the solder mask; and/or Electrical inspection is performed on the protective layer and the patterned circuit layer. 一種基板結構，包括： 基板； 軟性可撓式基板，位於所述基板上，其中所述基板的剛度大於所述軟性可撓式基板的剛度； 圖案化線路層，位於所述軟性可撓式基板上； 防焊層，位於所述圖案化線路層上，所述防焊層具有多個開口，且所述多個開口暴露出部分的所述圖案化線路層；以及 保護層，位於所述多個開口所暴露出的所述圖案化線路層上。A substrate structure, including: Substrate A flexible flexible substrate located on the substrate, wherein the rigidity of the substrate is greater than the rigidity of the flexible flexible substrate; The patterned circuit layer is located on the soft flexible substrate; A solder mask layer located on the patterned circuit layer, the solder mask layer has a plurality of openings, and the plurality of openings expose a part of the patterned circuit layer; and The protective layer is located on the patterned circuit layer exposed by the plurality of openings. 如申請專利範圍第7項所述的基板結構，其中所述基板為單一材質的塊狀或片狀板材。The substrate structure according to item 7 of the scope of patent application, wherein the substrate is a block or sheet plate of a single material. 如申請專利範圍第7項所述的基板結構，其中所述基板為金屬板，且所述圖案化線路層與所述基板彼此電性分離。The substrate structure according to the seventh item of the scope of patent application, wherein the substrate is a metal plate, and the patterned circuit layer and the substrate are electrically separated from each other. 如申請專利範圍第7項所述的基板結構，其中所述圖案化線路層與所述基板之間不具有導電材質。According to the substrate structure described in item 7 of the scope of patent application, there is no conductive material between the patterned circuit layer and the substrate.
TW108108424A 2019-03-13 2019-03-13 Substrate structure and manufacturing method thereof TWI729362B (en)

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