TW202033068A - Circuit board structure and manufacturing method thereof which use a filling resin to replace the traditional filling material - Google Patents

Abstract

The present invention relates to a circuit board structure and a manufacturing method thereof. In order to reduce the thickness and deformation of the printed circuit board, the present invention uses a filling resin to replace the traditional filling material. The manufacturing method includes the steps of arranging a circuit pattern on a substrate, defining at least one space on one side of the circuit pattern, covering the filling resin over the circuit pattern and the space, using an insulating material to be arranged on the filing resin, and performing a pressing process to obtain a circuit board.

Description

Circuit board structure and manufacturing method thereof

The invention relates to a circuit board, in particular to a circuit board structure and a manufacturing method thereof.

Printed Circuit Board (PCB for short) is a circuit board that is drawn into a circuit pattern through a circuit design and formed on a substrate by mechanical processing or surface treatment. This circuit board is also called a printed circuit Board, which is the substrate before soldering electronic parts. The printed circuit board uses the circuit imprisonment for connecting various electronic parts to play its role to achieve the purpose of processing various electronic signals.

Since the quality of printed circuit boards will directly affect the reliability of related electronic products, but also affect the overall performance and competitiveness of related electronic products, printed circuit boards are very important parts.

In 1950, Japan used silver paint on glass substrates for wiring, and paper phenolic resins (CCL) made of phenolic resins with copper foil for wiring, also known as copper foil substrates. This is for manufacturing printing The key basic material of the circuit board is a laminated board made of insulating paper, glass fiber cloth or other fiber materials with resin-impregnated adhesive sheets (Prepreg). It can be laminated on one or both sides under high temperature and high pressure. It is named after the addition of copper foil. In addition, in 1953, Motorola developed a double-layer board with electroplated through-hole method. This method was also applied to later multilayer circuit boards. Its dual technology has become increasingly mature, and printed circuit boards After the advent of the double-layer board, its multilayer printed circuit board also appeared on the market, which increased the ratio of the wiring of the printed circuit board to the substrate area. Then in 1961, the Hazeltine Corporation of the United States made reference to the electroplating through-hole method. Multi-layer boards were released, making multilayer printed circuit boards widely used.

The manufacturing process of printed circuit boards uses techniques such as printing, exposure, etching, and electroplating to produce precise wiring. It serves as an assembly board that supports the interconnection of electronic parts and circuits between parts. Therefore, it is high-density and multilayered. The wiring formation technology has become the mainstream of the development of the printed circuit board manufacturing industry.

However, today’s multilayer printed circuit boards are made by pressing discrete multilayer boards with PP film (composed of glass fiber reinforcement and impregnated resin) into the required number of layers and thickness. The pressing process will be affected by pressure and temperature. After the lamination pressing is completed, there is still stress in the printed circuit board. Therefore, if the two sides of the laminated printed circuit board are not uniform, the stress generated on the two sides of the printed circuit board will be different, and the printed circuit board will bend toward one side, which will affect the performance of the printed circuit board.

And the multilayer printed circuit board made by lamination and pressing method, even if it is on the same plane, when the circuit pattern is not uniformly distributed, the resin flow speed of the PP film will be different, resulting in a place with less circuit patterns on the printed circuit board The thickness is thinner, and the thickness is thicker where there are many circuit patterns. Therefore, in order to avoid the above problems, when designing the circuit pattern, the uniformity of the circuit pattern, the symmetry of the laminate, and the design and layout of the blind and buried vias are various The factors must be considered in detail.

In addition, the conventional multilayer printed circuit board has a multilayer printed circuit board obtained by laminating and pressing PP film, which will cause deformation caused by lamination and pressing, and the insulating layer between the inner layers of the multilayer printed circuit board PP film will increase the thickness of multilayer printed circuit boards.

Based on the above description, in order to solve the shortcomings of the conventional printed circuit board, the present invention provides a method for manufacturing a circuit board, which can reduce the number of PP films used, make the thickness of the printed circuit board thinner, and reduce the thickness of the printed circuit board. Deformation of printed circuit boards caused by pressing.

One purpose of the present invention is to solve the problem of conventional printed circuit boards that are thicker and deformed due to processing. Therefore, the present invention provides a method for manufacturing a circuit board to make the inner layer of the multilayer printed circuit board The thickness of the board becomes thinner, and the multilayer printed circuit board is not deformed due to the processing process.

In view of the above-mentioned objective, the present invention provides a method for manufacturing a circuit board, the steps of which are to arrange a conductive layer on a substrate and perform a dry film process to obtain a circuit pattern, wherein one side of the circuit pattern has at least one space, A filling resin is taken to cover the circuit pattern and the space, and an insulating material is taken to cover the circuit pattern substrate and pressed together, so that the insulating material is closely attached to the circuit pattern substrate.

The present invention provides an embodiment in which the steps of the dry film manufacturing process include taking a film and attaching it to the conductive layer, then placing a circuit pattern film on the film; and irradiating the circuit pattern film with ultraviolet light. Expose, transfer the circuit pattern film to the film; take a developer to dissolve the film that has not been irradiated by ultraviolet light, and expose part of the conductive layer; use an etching solution to etch part of the conductive layer and part of the film, To form the circuit pattern; and after stripping off part of the film on the circuit pattern, part of the conductive layer is exposed to obtain the circuit pattern.

The present invention provides an embodiment, which utilizes the step of removing the filling material above the circuit pattern after taking an insulating material to cover the circuit pattern substrate and pressing it together to make the insulating material adhere to the circuit pattern substrate.

The present invention provides an embodiment, wherein the filling resin is selected from one of resin and epoxy resin or any combination of the foregoing.

The present invention provides an embodiment, wherein the insulating material is selected from one of glass fiber and polyimide film or any combination of the foregoing.

Another object of the present invention is to provide a circuit board structure, which includes a substrate provided with a circuit pattern, and at least one space is provided on one side of the circuit pattern, and a filling resin is provided on the circuit pattern and Above the space, and an insulating material is arranged on the filling resin.

The present invention provides an embodiment, wherein the substrate material is selected from one of glass fiber board, phenolic cotton paper, and epoxy resin, or any combination thereof.

The present invention provides an embodiment, wherein the filling resin is selected from one of resin and epoxy resin or any combination of the foregoing.

The present invention provides an embodiment, wherein the insulating material is selected from one of glass fiber and polyimide film or any combination of the foregoing.

The present invention is a method for manufacturing circuit boards. It improves the disadvantages of traditional printed circuit boards that need to be covered with multiple layers of PP film to thicken the thickness of the printed circuit boards, and improves the disadvantages that the deformation of the printed circuit boards caused by the lamination pressing process affects the efficiency. The present invention uses filling resin to replace the traditional PP film to reduce the thickness and deformation of the printed circuit board.

In order to enable your reviewer to have a better understanding and understanding of the features of the present invention and the effects achieved, a preferred embodiment and detailed description are provided. The description is as follows:

Hereinafter, various embodiments of the present invention will be described in detail through the use of drawings. However, the concept of the present invention may be embodied in many different forms, and should not be construed as being limited to the exemplary embodiments described herein.

First, please refer to Figure 1, which is a flowchart of an embodiment of the present invention. As shown in the figure, the steps are: Step S10: Disposing a conductive layer on a substrate; Step S20: After performing a dry film manufacturing process, obtain a circuit pattern, wherein one side of the circuit pattern has at least one space; Step S30: take a filling resin to cover the circuit pattern and the space; and Step S40: Take an insulating material to cover the circuit pattern substrate and press it together, and then make the insulating material adhere to the circuit pattern substrate.

In step S10, as shown in FIG. 2A, which is a schematic diagram of the steps of the circuit board of the present invention, the conductive layer 14 is disposed on the substrate 10, wherein the conductive layer 14 is copper foil, which is executed Before a dry film process, it needs to be polished to remove the oxide layer on the copper surface and increase the roughness of the conductive layer.

In step S20, as shown in FIG. 2B, which is a schematic diagram of the steps of the circuit board of the present invention, after a dry film process is performed, a circuit pattern 18 is obtained, wherein the circuit pattern 18 has at least one space 16 on one side.

Wherein, the steps of the dry film manufacturing process mentioned in step S20 include taking a film and attaching it to the conductive layer, placing a circuit pattern film on the film, and then irradiating the circuit pattern film with ultraviolet light Expose, transfer the circuit pattern film to the film, then take a developer to dissolve the film that has not been irradiated with ultraviolet light, and expose part of the conductive layer; use an etching solution to etch part of the conductive layer and part of the film To form the circuit pattern, and after removing part of the film on the circuit pattern, part of the conductive layer is exposed to obtain the circuit pattern.

The developer used in the above steps is weakly alkaline, which is selected from one of sodium bicarbonate and sodium carbonate or any combination of the foregoing.

The etching solution used in the above step S20 may be an acid etching solution, which is selected from one of copper chloride or ferric chloride or any combination thereof.

In addition, the etching solution used in the above step S20 can also be an etching solution selected from one of copper sulfate or hydrogen peroxide, or any combination thereof, which is a preferred embodiment of the present invention. But not limited to this.

In step S30, as shown in Figure 2C, which is a schematic diagram of the steps of the circuit board of the present invention, a filling resin 20 is taken to cover the circuit pattern 18 and the space 16, wherein the filling resin 20 is selected from One of resin, epoxy resin, or any combination of the foregoing.

In step S40, as shown in FIG. 2D, which is a schematic diagram of the steps of the circuit board of the present invention, an insulating material 30 is taken to cover the circuit pattern 18 and pressed together, and then the insulating material 30 is made to adhere to the circuit pattern 18 , Wherein the insulating material 30 is selected from one of glass fiber or polyimide film or any combination of the foregoing.

In addition, part of the filling resin 20 located above the circuit pattern 18 can also be removed to make the insulating material more closely adhere to the circuit pattern 18 when pressing the insulating material.

Next, please refer to FIG. 3, which is a schematic structural diagram of the first embodiment of the circuit board of the present invention. As shown in the figure, the circuit board includes a substrate 10, a filling resin 20 and an insulating material 30.

The circuit board includes a substrate 10 provided with a circuit pattern 18, and at least one space 16 is provided on one side of the circuit pattern 18, and a filling resin 20 is provided on the circuit pattern 18 and the space 16, and An insulating material 30 is arranged on the filling resin 20.

As described in the above steps S10 to S40, the present invention provides an embodiment, as shown in Figs. 2A to 2D, which are the single-layer printed circuit boards of the manufacturing steps of the present invention, which uses the filling resin to replace the traditional PP film , Make the thickness of single-layer printed circuit board thinner.

Here is an example to explain the manufacturing method of the single-layer circuit board of the present invention. A 6oz of the conductive layer 14 is taken on the substrate 10, and the 6um conductive layer 14 is made into the desired circuit pattern 18 through a dry film process. In the present invention, the filling resin 20 is used to cover the circuit pattern 18, and then the insulating material 30 with a thickness of 2.5um is used to cover the circuit pattern 18, and the insulating material 18 is made to adhere to the circuit pattern through a pressing process 18. Obtain a single-layer printed circuit board.

Wherein, the thickness of the conductive layer 14 is 1oz, which is equal to 1.4um. Therefore, the above-mentioned single-layer circuit board thickness calculation method is: the thickness of the conductive layer 14 plus the thickness of the insulating material 30 is 10.9um; and the traditional The conventional single-layer printed circuit board requires a large amount of PP film to fill, which will vary according to the thickness of the conductive layer 14. Here, five sheets of PP film are used to calculate, one PP film is 2.5um, and the thickness of 5 sheets is 12.5um. The combined thickness is 8um, and the sum of the conductive layer 14 is 16.4um. Therefore, the circuit board of the present invention can significantly reduce the thickness of the single-layer printed circuit board.

Following the above, the present invention can also be applied to double-layer printed circuit boards. Please refer to Fig. 4, which is a schematic diagram of the double-layer printed circuit board of the present invention. The double-layer printed circuit board can be clearly disclosed. Layer printed circuit boards are the same. After the double-layer printed circuit board is manufactured, drill holes are carried out to reach the interconnection layer and the layer. After the drilling, the double-layer printed circuit board undergoes redox reaction in the sink copper tank to form a copper layer. The holes are metallized to deposit copper on the surface of the originally insulated substrate to achieve electrical communication between layers.

In the above-mentioned embodiments, the method of the present invention is a manufacturing method for manufacturing a circuit board, which uses filling resin to replace the traditional PP film, so as to reduce the thickness and deformation of the printed circuit board and increase the yield of the printed circuit board.

However, the above are only the preferred embodiments of the present invention, and are not used to limit the scope of implementation of the present invention. For example, the shapes, structures, features and spirits described in the scope of the patent application of the present invention are equally changed and modified. , Should be included in the scope of patent application of the present invention.

10: substrate 14: conductive layer 16: space 18: Circuit pattern 20: filled resin 30: insulating material Step S10: Place a conductive layer on a substrate Step S20: After performing a dry film process, a circuit pattern is obtained, wherein one side of the circuit pattern has at least one space Step S30: Take a filling resin to cover the circuit pattern and the space Step S40: Take an insulating material to cover the circuit pattern substrate and press it together, and then make the insulating material adhere to the circuit pattern substrate

Figure 1: It is a flow chart of the steps of the circuit board of the present invention; Figures 2A-2D: It is a schematic diagram of the steps of the circuit board of the present invention; Figure 3: It is a schematic diagram of the structure of the first embodiment of the circuit board of the present invention; and Figure 4: It is a schematic diagram of the second embodiment of the circuit board of the present invention;

10: substrate

14: conductive layer

16: space

18: Circuit pattern

20: filled resin

30: insulating material

Claims (9)

A method for manufacturing a circuit board, the steps are: Disposing a conductive layer on a substrate; After performing a dry film manufacturing process, a circuit pattern is obtained, wherein one side of the circuit pattern has at least one space; Take a filling resin to cover the circuit pattern and the space; and After taking an insulating material to cover the circuit pattern and pressing it together, the insulating material is made to adhere to the circuit pattern. The manufacturing method of the circuit board as described in item 1 of the scope of patent application, wherein the steps of the dry film manufacturing process include: After attaching a film to the conductive layer, place a circuit pattern negative on the film; Irradiate the circuit pattern film with ultraviolet light for exposure, and transfer the circuit pattern film to the film; Take a developer solution to dissolve the film that has not been irradiated by ultraviolet light, and expose part of the conductive layer; Use an etching solution to etch part of the conductive layer and part of the diaphragm to form the circuit pattern; and After stripping off part of the film on the circuit pattern, part of the conductive layer is exposed to obtain the circuit pattern. As described in the first item of the scope of patent application, the method for manufacturing a circuit board, wherein after taking an insulating material to cover the circuit pattern substrate and pressing, before the step of making the insulating material adhere to the circuit pattern substrate, it further includes removing the The filling material above the circuit pattern. According to the manufacturing method of the circuit board described in item 1 of the scope of the patent application, the filling resin is selected from one of resin and epoxy resin or any combination of the foregoing. According to the manufacturing method of the circuit board described in claim 1, wherein the insulating material is selected from one of glass fiber and polyimide film or any combination of the foregoing. A circuit board structure, which includes: A substrate, which is provided with a circuit pattern, and at least one space is provided on one side of the circuit pattern; A filling resin arranged on the circuit pattern and the space; and An insulating material is arranged on the filling resin. The circuit board structure described in item 6 of the scope of patent application, wherein the substrate material is selected from one of glass fiber board, phenolic tissue paper and epoxy resin, or any combination thereof. The circuit board structure described in item 6 of the scope of patent application, wherein the filling resin is selected from one of resin and epoxy resin or any combination of the foregoing. The circuit board structure described in item 6 of the scope of patent application, wherein the insulating material is selected from one of glass fiber and polyimide film or any combination of the foregoing.

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