TW202030877A - Thermal image sensing system and thermal image sensing method - Google Patents

Abstract

A thermal image sensing system including at least one thermal sensor, at least one light sensor, an image identification module, a storage module and a computing module is provided. The at least one thermal sensor senses thermal radiation emitted by an object and generates a thermal radiation image signal correspondingly. The at least one light sensor senses visible light reflected by the object and generates at least one visible image signal correspondingly. The image identification module receives the at least one visible image signal generated by the at least one light sensor and determines a material of the object according to the at least one visible image signal. The storage module stores a radiation coefficient of the material of the object. The computing module calculates a surface temperature of the object according to the radiation coefficient of the material of the object and the thermal radiation emitted by the object. A thermal image sensing method is also provided.

Description

Thermal image sensing system and thermal image sensing method

The present disclosure relates to an image sensing system and an image sensing method, and particularly relates to a thermal image sensing system and a thermal image sensing method.

Traditional thermal image sensing systems mainly use thermal sensors to sense the energy radiated by objects. The energy radiated by an object is a function of temperature and emissivity. Since the emissivity of most non-metallic substances is greater than that of most metallic substances, in the thermal image captured by the thermal imaging sensor system, if the emissivity of the metallic substance is not corrected, the surface of the metallic substance The temperature will be much underestimated.

The disclosed embodiments provide a thermal image sensing system and a thermal image sensing method, which can calibrate the surface temperature of a metal substance.

A thermal image sensing system according to an embodiment of the disclosure includes at least one thermal sensor, at least one optical sensor, an image recognition module, a storage module, and a computing module. The at least one thermal sensor senses the thermal radiation emitted by the object and correspondingly generates a thermal radiation image signal. The at least one light sensor senses the visible light reflected by the object and correspondingly generates at least one visible light image signal. The image recognition module receives the at least one visible light image signal generated by the at least one light sensor, and determines the material of the object according to the at least one visible light image signal. The storage module stores the emissivity of the material of the object. The computing module calculates the surface temperature of the object according to the emissivity of the material of the object and the heat radiation emitted by the object.

A thermal image sensing method according to an embodiment of the disclosure includes the following steps: sensing thermal radiation emitted by an object and correspondingly generating thermal radiation image signals; sensing visible light reflected by the object and correspondingly generating at least one visible light image signal; The at least one visible light image signal judges the material of the object; judges the emissivity of the material of the object according to the material of the object; and calculates the surface temperature of the object according to the emissivity of the material of the object and the heat radiation emitted by the object.

In order to make the above-mentioned features and advantages of the present disclosure more obvious and understandable, the following specific embodiments are described in detail in conjunction with the accompanying drawings.

The directional terms mentioned in the embodiments, such as "up", "down", "front", "rear", "left", "right", etc., are only directions with reference to the drawings. Therefore, the directional terms used are used to illustrate, but not to limit the disclosure.

In the drawings, each drawing depicts the general features of methods, structures, and/or materials used in specific exemplary embodiments. However, these drawings should not be interpreted as defining or limiting the scope or nature covered by these exemplary embodiments. For example, for the sake of clarity, the relative size, thickness, and position of each layer, region, and/or structure may be reduced or enlarged.

In the embodiments, the same or similar elements will use the same or similar reference numerals, and the redundant description will be omitted. In addition, the features in different exemplary embodiments can be combined without conflict, and simple equivalent changes and modifications made in accordance with this specification or the scope of the patent application still fall within the scope of this patent.

The terms "first" and "second" mentioned in this specification or the scope of the patent application are only used to name discrete components or to distinguish different embodiments or ranges, and are not used to limit the upper limit or the number of components. The lower limit is not used to limit the manufacturing order or the arrangement order of the components. Furthermore, the arrangement of one element/film layer on (or above) another element/film layer may include the presence or absence of additional elements/film layers between the two elements/film layers, in other words, the element The film layer can be directly or indirectly arranged on (or above) the other element/film layer. On the other hand, a device/film layer directly disposed on (or above) another device/film layer means that two devices/film layers are in contact with each other, and there is no additional device/film layer between the two devices/film layers.

In this context, the thermal image sensing system is suitable for acquiring thermal images of objects (also referred to as objects to be measured). The thermal image represents the image of the thermal radiation emitted by the surface of the object. According to the law of black body radiation, all objects whose temperature is higher than absolute zero emit thermal radiation (such as infrared radiation), and the energy radiated by the object increases with the increase in temperature. Therefore, the surface temperature of the object can be known from the thermal image of the object.

(黑體的輻射係數)的函數，其中

是斯特凡-波茲曼常數。

式1According to Stefan-Boltzmann law (Stefan-Boltzmann law), as shown in Equation 1, the total energy E radiated by the surface unit area of an object per unit time is the absolute temperature T and the emissivity

(The emissivity coefficient of a black body), where

Is the Stefan-Bozman constant.

Formula 1

Table 1 schematically lists the emissivity of many common non-metallic substances and metallic substances. According to Table 1, the emissivity of most non-metallic substances is greater than 0.9, and the emissivity of most metallic substances is less than 0.3. Therefore, in the thermal image captured by the thermal image sensing system, if the emissivity of the object (especially metal substance) is not corrected, the surface temperature of the metal substance will be much underestimated. Table I Non-metallic substance Emissivity Metallic substance Emissivity asbestos 0.95 Aluminum (unoxidized) 0.02-0.1 ceramics 0.95 Aluminum (oxidized) 0.02-0.4 cloth 0.95 Lead (polished) 0.05-0.1 Glass (flat) 0.85 Lead (rough) 0.4 Paint (no alcohol) 0.9-0.95 Lead (oxidized) 0.2-0.6 Paper (any color) 0.95 Brass (polished) 0.01-0.05 Plastic (opaque) 0.95 Brass (oxidized) 0.5 rubber 0.95 Zinc (polished) 0.03 Wood (natural) 0.9-0.95 Zinc (oxidized) 0.1

In order to solve the problem of underestimation of the surface temperature of the metal substance, the embodiments of the present disclosure provide a thermal image sensing system and a thermal image sensing method, which can calculate the surface temperature of the metal substance by calibrating the emissivity of the metal substance. The detailed method will be explained later.

FIG. 1 is a schematic diagram of the thermal image sensing system 1 of the first embodiment of the disclosure. 1, the thermal image sensing system 1 includes at least one thermal sensor (such as the thermal sensor 10), at least one light sensor (such as the light sensor 11), an image recognition module 12, and a storage module Group 13 and operation module 14. In this embodiment, as shown in FIG. 1, the number of thermal sensors and the number of light sensors included in the thermal image sensing system 1 may both be one, but the number of thermal sensors and the number of light sensors The number of devices can be changed according to requirements, and is not limited to that shown in Figure 1.

The at least one thermal sensor (such as the thermal sensor 10) is adapted to sense the thermal radiation R emitted by the object OBJ. For example, the thermal sensor 10 may be an infrared light sensor, and the thermal sensor 10 is adapted to sense infrared light from the object OBJ and correspondingly generate a thermal radiation image signal RS, but the thermal sensor 10 The type is not limited to this.

The at least one light sensor (such as the light sensor 11) is suitable for sensing the visible light L reflected by the object OBJ, receiving the visible light L, and correspondingly generating at least one visible light image signal SS. For example, the light sensor 11 can be a photodiode (photodiode), a charge coupled device (Charge Coupled Device, CCD), or a complementary metal oxide semiconductor (Complementary Metal Oxide Semiconductor, CMOS) device, but it is not limited to this. .

In this embodiment, as shown in FIG. 1, the light sensor 11 uses ambient light B to perform visible light image sensing of the object OBJ. Specifically, the light sensor 11 senses the visible light L reflected by the object OBJ under the illumination of the ambient light B emitted by the ambient light source 2. The environmental light source 2 may be the sun, outdoor lighting, indoor lighting, or the like. However, in another embodiment, the thermal image sensing system 1 may further include at least one light source (such as a visible light source) for visible light image sensing. In this way, the light sensor 11 can also operate in a dark environment.

In this embodiment, as shown in FIG. 1, the thermal sensor 10 and the light sensor 11 can form a dual-lens module M, but the disclosure is not limited to this. In another embodiment, the thermal sensor 10 and the light sensor 11 can be independently installed/erected.

The image recognition module 12 is adapted to receive the at least one visible light image signal SS generated by the at least one light sensor (such as the light sensor 11), and determine the object OBJ according to the at least one visible light image signal SS material. For example, the image recognition module 12 can use artificial intelligence (AI) or algorithms to analyze the surface topography and/or color of the object OBJ to determine the material of the object OBJ.

The image recognition module 12 can be implemented as a software module, a firmware module, or a hardware circuit. For example, the image recognition module 12 may include at least one graphics processing unit (GPU) or similar processing chip to perform machine vision image recognition. Alternatively, in one embodiment, the image recognition module 12 is a program code that can be loaded into the storage module 13 and can be executed by the computing module 14 or the processor. In addition, the image recognition module 12 may have an artificial intelligence architecture such as machine learning and can continuously improve its image recognition performance through training.

The storage module 13 stores the emissivity of the material of the object OBJ, but is not limited to this. In one embodiment, the storage module 13 can store the emissivity of various materials/substances and other required data. For example, the storage module 13 may be a volatile storage medium or a non-volatile storage medium in an electronic device. The volatile storage medium can be random access memory (RAM), and the non-volatile storage medium can be read only memory (ROM), solid state drive (SSD), or traditional hard drive (HDD). In an embodiment, the storage module 13 may also be a database stored in the cloud.

The calculation module 14 calculates the surface temperature of the object OBJ according to the emissivity of the material of the object OBJ and the heat radiation R emitted by the object OBJ. For example, the computing module 14 may include a central processing unit (Central Processing Unit, CPU) or other programmable general-purpose or special-purpose microprocessors, digital signal processors (DSP), and Programmable controller, Application Specific Integrated Circuits (ASIC), Programmable Logic Device (PLD) or other similar devices or combinations of these devices.

FIG. 2 is a schematic diagram of a thermal image sensing method 20 according to an embodiment of the disclosure. 2, the thermal image sensing method 20 includes the following steps: sensing thermal radiation emitted by an object and generating a thermal radiation image signal (step 200); sensing visible light reflected by the object and generating at least one visible light image signal ( Step 202); Determine the material of the object based on the at least one visible light image signal (Step 204); Determine the emissivity of the material of the object based on the material of the object (Step 206); and Determine the emissivity of the material of the object and the emissivity of the object The heat radiation calculates the surface temperature of the object (step 208).

In step 200, a thermal sensor can be used to sense the thermal radiation emitted by the object, thereby obtaining a thermal image of the object. In step 202, a light sensor can be used to sense the visible light reflected by the object, thereby obtaining a visible light image of the object. In step 204, the image recognition module can determine the material of the object according to the visible light image. For example, the analysis can be performed based on parameters such as the surface topography and/or color of the object in the visible light image. For example, the material of the object can be determined based on the metallic luster of the object in the visible light image, but it is not limited to this. In step 206, the image recognition module can search for the emissivity of the material of the object from the emissivity data stored in the storage module. In step 208, the arithmetic module can calculate the surface temperature of the object according to the found emissivity and the heat radiation emitted by the object (for example, nesting in formula 1), and optimize/correct the thermal image obtained in step 200 accordingly.

For example, the thermal image obtained by the thermal sensor can be matched with the visible light image obtained by the light sensor for feature matching (such as matching of position and object size), and the image recognition module can be used to identify the visible light image The object and distinguish the material of the object and find the emissivity of the material of the object. The computing module is then used to optimize the temperature of the area where the metal substance is located in the thermal image of step 200, so that the surface temperature of the object shown in the optimized thermal image matches the actual surface temperature of the object. In this way, compared with only using a thermal sensor to obtain a thermal image of an object, the thermal image of the object can be obtained by combining a thermal sensor with a light sensor to effectively avoid underestimating the surface temperature of the metal substance, and the thermal image The surface temperature of the displayed object is more consistent with the actual surface temperature of the object.

FIG. 3 is a schematic diagram of the thermal image sensing system 1A of the second embodiment of the disclosure. 3, the main difference between the thermal image sensing system 1A and the thermal image sensing system 1 in FIG. 1 is that the thermal image sensing system 1A further includes at least one polarizer (such as the polarizer 15). In this embodiment, as shown in FIG. 3, the number of polarizers included in the thermal image sensing system 1A is one, and the polarizer 15 is disposed on the object OBJ and the at least one light sensor (such as the light sensor).器11) Between. However, the number of polarizers included in the thermal image sensing system 1A can be changed according to requirements, and the polarizer 15 can also be disposed in the at least one light sensor (such as the light sensor 11).

The polarizer 15 is suitable for filtering light having a specific polarization direction in the visible light L. For example, s-polarized light has a strong reflectivity on a metal surface, which easily produces a white image (highly reflective area) in a visible light image. If the white screen obscures the object image, it will increase the difficulty of material recognition or reduce the accuracy of material recognition. Therefore, the polarizing plate 15 may be a polarizing plate that filters the s-polarized light LS in the visible light L and allows the p-polarized light LP in the visible light L to pass. The polarizer 15 is used to filter the s-polarized light LS in the visible light L and let the p-polarized light LP in the visible light L pass, which helps to eliminate the highly reflective area, and obtain a clearer/complete object image (visible light image) to improve material recognition The accuracy rate.

In the structure provided with the polarizer 15, in step 202 of FIG. 2, sensing the visible light reflected by the object and generating the at least one visible light image signal may include the following steps: using the polarizer 15 to filter the visible light reflected by the object OBJ The s-polarized light LS in L; and the p-polarized light LP in the visible light L reflected by the object OBJ is sensed and the first optical signal (such as the visible light image generated by the p-polarized light LP is generated. In Figure 3, the first Light signal). In addition, in step 204 of FIG. 2, determining the material of the object according to the at least one visible light image signal may include: determining the material of the object OBJ according to the first light signal SS1. Since the visible light image generated by the p-polarized light LP can have a clear/complete object image, it helps to improve the accuracy of material recognition.

Fig. 4 is a graph showing the relationship between the incident angle of visible light reflected by the metal substance and the reflectivity. Since light with different polarization directions has different reflectivity to metal materials, the reflectivity of light with different polarization directions to metal materials can be used for material identification. In FIG. 4, the curve C1 represents the reflectance of silver (Ag) to s-polarized light. Curve C2 represents the reflectance of silver to p-polarized light. The curve C3 represents the reflectivity of copper (Cu) to s-polarized light. Curve C4 represents the reflectivity of copper for p-polarized light. It can be seen from FIG. 4 that for the same metal substance, when s-polarized light and p-polarized light are incident on the metal substance obliquely, the s-polarized light and p-polarized light have different reflectivities. In addition, for different metal substances, p-polarized light (or s-polarized light) that is obliquely incident on the metal substance has different reflectivity. Therefore, the reflectivity of p-polarized light and/or s-polarized light can be used to assist material identification, thereby improving the accuracy of material identification.

Figures 5 and 6 are schematic diagrams of the other two front views of the polarizer in Figure 3, respectively. 5, the main differences between the polarizing plate 15A and the polarizing plate 15 of FIG. 3 are as follows. In FIG. 3, the polarizer 15 is a single type of polarizer, which is suitable for passing p-polarized light and filtering s-polarized light. In FIG. 5, the polarizing plate 15A is a combination of two polarizing plates. Specifically, the polarizer 15A includes a plurality of first parts P and a plurality of second parts S, and the plurality of first parts P are adapted to pass p-polarized light and filter s-polarized light. The plurality of second parts S are adapted to pass s-polarized light and filter p-polarized light. The plurality of first parts P and the plurality of second parts S may be arranged in an array and may be disposed in the at least one light sensor (such as the light sensor 11 in FIG. 3) and correspond to the light sensor 11 pixel settings.

Referring to FIG. 6, the main differences between the polarizing plate 15B and the polarizing plate 15A of FIG. 5 are as follows. In FIG. 6, the polarizing plate 15B is a combination of three kinds of polarizing plates. Specifically, in addition to the plurality of first parts P and the plurality of second parts S, the polarizing plate 15B further includes a plurality of third parts P+S. The plurality of third parts P+S are suitable for passing p-polarized light and s-polarized light, or the plurality of third parts P+S are suitable for filtering p-polarized light and s-polarized light. In addition, the plurality of first portions P, the plurality of second portions S, and the plurality of third portions P+S can be arranged in an array and can be disposed on the at least one light sensor (as shown in FIG. 3 The photo sensor 11) corresponds to the pixel setting of the photo sensor 11.

In the structure provided with the polarizer 15A or the polarizer 15B, the visible light image captured by a single light sensor (such as the light sensor 11 in FIG. 3) can be used for material identification. Specifically, as shown in Figure 4, for the same metal substance, when s-polarized light and p-polarized light are incident on the metal substance at an incident angle greater than or equal to 10 degrees and less than or equal to 90 degrees, the s-polarized light and p-polarized light have Different reflectivity. Therefore, under the structure provided with the polarizer 15A or the polarizer 15B, the ambient light source 2 can be placed obliquely above the object OBJ, so that the ambient light B enters the metal at an incident angle greater than or equal to 10 degrees and less than or equal to 90 degrees. The light sensor 11 is correspondingly arranged to sense the visible light L reflected by the object OBJ. By comparing the contrast difference between s-polarized light and p-polarized light, it helps to judge the metal material.

7 to 9 are schematic diagrams of the thermal image sensing system 1B to the thermal image sensing system 1D of the third embodiment to the fifth embodiment of the disclosure, respectively. Please refer to FIG. 7, the main difference between the thermal image sensing system 1B and the thermal image sensing system 1A of FIG. 3 is that the thermal image sensing system 1B includes a plurality of light sensors. Specifically, the thermal image sensing system 1B includes a first light sensor (such as the light sensor 11) and a second light sensor 16. The at least one polarizer (such as the polarizer 15) is arranged on the path of the visible light L transmitted toward the first light sensor (such as the light sensor 11), and the at least one polarizer is suitable for p-polarized light Pass and filter s-polarized light, or the at least one polarizer is adapted to pass s-polarized light and filter p-polarized light.

In this embodiment, the polarizer 15 is suitable for passing p-polarized light and filtering s-polarized light. In step 202 of FIG. 2, sensing the visible light reflected by the object and generating the at least one visible light image signal may include the following steps: using a polarizer 15 to filter the s-polarized light LS in the visible light reflected by the object OBJ; The light sensor (such as the light sensor 11) senses the p-polarized light LP in the visible light L reflected by the object OBJ and generates the first light signal SS1; and the second light sensor 16 is used to sense the reflection of the object OBJ The p-polarized light LP and the s-polarized light LS in the visible light L generate the second optical signal SS2. In addition, in step 204 of FIG. 2, determining the material of the object according to the at least one visible light image signal may include: determining the material of the object OBJ according to the first light signal SS1 and the second light signal SS2. Specifically, the second optical signal SS2 including p-polarized light LP and s-polarized light LS can be used to subtract the first optical signal SS1 including p-polarized light LP to obtain an optical signal with only s-polarized light LS, and use p-polarized light The reflectivity of LP and s-polarized light LS performs material identification.

Please refer to FIG. 8, the main differences between the thermal image sensing system 1C and the thermal image sensing system 1A of FIG. 3 are as follows. In FIG. 8, the thermal sensor 10 and the light sensor 11 are independently installed/installed. In addition, the thermal image sensing system 1C further includes a light splitting element 17. The spectroscopic element 17 is adapted to reflect one of infrared light (thermal radiation R) and visible light L, and allow the other of the infrared light (thermal radiation R) and visible light L to pass through, and the at least one polarizer (such as polarizer) The sheet 15) is arranged on the path of the visible light L transmitted from the light splitting element 17 to the at least one light sensor (such as the light sensor 11).

In this embodiment, the light splitting element 17 is suitable for reflecting infrared light (heat radiation R) and allowing visible light L to pass through, and the polarizing plate 15 is disposed between the light splitting element 17 and the light sensor 11. However, in another embodiment, the polarizing plate 15 may also be provided in the light sensor 11. In addition, the light splitting element 17 can also reflect visible light L and allow infrared light (thermal radiation R) to penetrate; correspondingly, the positions of the thermal sensor 10 and the light sensor 11 are interchanged, and the polarizing plate 15 is arranged on the light splitting element 17 Between the light sensor 11 or in the light sensor 11.

According to different requirements, the thermal image sensing system 1C may include other components. For example, the thermal image sensing system 1C may further include a light concentrating element 18. The condensing element 18 can provide the effect of converging light, and the concentrating element 18 is suitable for passing infrared light (heat radiation R) and visible light L. For example, the condensing element 18 may include at least one lens.

In FIG. 8, the polarizing plate 15 may be a polarizing plate that filters the s-polarized light LS in the visible light L and allows the p-polarized light LP in the visible light L to pass. The polarizer 15 is used to filter the s-polarized light LS in the visible light L and let the p-polarized light LP in the visible light L pass, which helps to eliminate the high reflection area, and obtain a clearer/complete object image (visible light image), which improves material recognition The accuracy rate. Alternatively, the polarizing plate 15 may be replaced with the polarizing plate 15A of FIG. 5 or the polarizing plate 15B of FIG. 6.

Please refer to FIG. 9, the main differences between the thermal image sensing system 1D and the thermal image sensing system 1C of FIG. 8 are as follows. In FIG. 9, the thermal image sensing system ID includes a plurality of light sensors. Specifically, the thermal image sensing system 1D may include a first light sensor (such as the light sensor 11) and a second light sensor 16. The at least one polarizer (such as the polarizer 15D) is disposed between the light splitting element 17 and the first light sensor (such as the light sensor 11) and between the light splitting element 17 and the second light sensor 16. The polarizer 15D is suitable for reflecting the s-polarized light LS in the visible light L and allowing the p-polarized light LP in the visible light L to penetrate. The first light sensor (such as the light sensor 11) receives the p-polarized light LP passing through the polarizing plate 15D, and the second light sensor 16 receives the s-polarized light LS reflected by the polarizing plate 15D.

Using two light sensors to capture images of different polarizations can also be used for material identification. Under the architecture of FIG. 9, in step 202 of FIG. 2, sensing the visible light reflected by the object and generating the at least one visible light image signal may include the following steps: using a polarizer 15D to convert the visible light L reflected by the object OBJ The s-polarized light LS is separated from the p-polarized light LP; the first light sensor (such as the light sensor 11) is used to sense the p-polarized light LP in the visible light L reflected by the object OBJ and generate the first optical signal SS1; and The second light sensor 16 is used to sense the s-polarized light LS in the visible light L reflected by the object OBJ and generate a third light signal SS3. In addition, in step 204 of FIG. 2, determining the material of the object according to the at least one visible light image signal may include: determining the material of the object OBJ according to the first light signal SS1 and the third light signal SS3.

FIG. 10 is a schematic front view of a sensing module MA applicable to the thermal image sensing system of the present disclosure. 10, the thermal image sensing system may include a plurality of thermal sensors 10 and a plurality of light sensors 11A, and the plurality of thermal sensors 10 and the plurality of light sensors 11A may be arranged Arrayed to form the sensing module MA shown in FIG. 10. In the sensing module MA, each light sensor 11A may include a plurality of sub-pixels, such as red sub-pixels, green sub-pixels, and blue sub-pixels, but not limited to this. In addition, each photo sensor 11A can be optionally provided with a polarizer (not shown), and the multiple polarizers of the photo sensors 11A can adopt the design of the polarizer 15 in FIG. 3 ( Filter s-polarized light or filter p-polarized light), the polarizer 15A design in FIG. 5 (array arrangement of multiple first parts P and multiple second parts S) or the polarizer 15B design in FIG. 6 (multiple first parts P, a plurality of second parts S and a plurality of third parts P+S array arrangement).

In summary, the thermal image sensing system and thermal image sensing method of the present disclosure can use visible light images to determine the material of an object, and thereby correct the surface temperature of the metal substance, so that the corrected/optimized thermal image shows the object The surface temperature matches the actual surface temperature of the object. In one embodiment, the highly reflective area can be eliminated by the arrangement of at least one polarizer, and a clearer/complete object image (visible light image) can be obtained, and the accuracy of material identification can be improved. In one embodiment, a combination of multiple polarizers can be used to help determine the material of the metal substance. In one embodiment, the arrangement of multiple light sensors and a single polarizer can assist in determining the material of the metal substance. In one embodiment, the thermal image sensing system may include a sensing module formed by arranging a plurality of thermal sensors and a plurality of light sensors in an array.

Although this disclosure has been disclosed in the above embodiments, it is not intended to limit the disclosure. Anyone with ordinary knowledge in the relevant technical field can make some changes and modifications without departing from the spirit and scope of this disclosure. Therefore, The scope of protection of this disclosure shall be subject to those defined by the attached patent scope.

1. 1A, 1B, 1C, 1D: thermal image sensing system 2: Ambient light source 10: Thermal sensor 11.11A: Light sensor 12: Image recognition module 13: Storage module 14: Computing module 15, 15A, 15B, 15D: Polarizer 16: second light sensor 17: Spectroscopic element 18: Condensing element 20: Thermal image sensing method 200, 202, 204, 206, 208: steps B: ambient light C1, C2, C3, C4: Curve L: Visible light LP: p-polarized light LS: s polarized light M: Dual lens module MA: Sensing module OBJ: Object P: Part One P+S: Part Three R: Thermal radiation RS: Thermal radiation image signal S: part two SS: Visible light image signal SS1: First optical signal SS2: second optical signal SS3: third optical signal

FIG. 1 is a schematic diagram of the thermal image sensing system of the first embodiment of the disclosure. FIG. 2 is a schematic diagram of a thermal image sensing method according to an embodiment of the disclosure. FIG. 3 is a schematic diagram of the thermal image sensing system of the second embodiment of the disclosure. Fig. 4 is a graph showing the relationship between the incident angle of visible light reflected by the metal substance and the reflectivity. Figures 5 and 6 are schematic diagrams of the other two front views of the polarizer in Figure 3, respectively. 7 to 9 are schematic diagrams of the thermal image sensing system of the third embodiment to the fifth embodiment of the disclosure, respectively. FIG. 10 is a schematic front view of a sensing module applicable to the thermal image sensing system of the present disclosure.

1: Thermal image sensing system

2: Ambient light source

10: Thermal sensor

11: Light sensor

12: Image recognition module

13: Storage module

14: Computing module

B: ambient light

L: Visible light

M: Dual lens module

OBJ: Object

R: Thermal radiation

RS: Thermal radiation image signal

SS: Signal

Claims (13)

A thermal image sensing system, including: At least one thermal sensor, which senses a thermal radiation emitted by an object and correspondingly generates a thermal radiation image signal; At least one light sensor for sensing a visible light reflected by the object and correspondingly generating at least one visible light image signal; An image recognition module, receiving the at least one visible light image signal generated by the at least one light sensor, and determining the material of the object according to the at least one visible light image signal; A storage module to store the emissivity of the material of the object; and An arithmetic module calculates the surface temperature of the object according to the emissivity of the material of the object and the heat radiation emitted by the object. The thermal image sensing system as described in item 1 of the scope of patent application further includes: At least one polarizer is arranged between the object and the at least one light sensor or in the at least one light sensor. According to the thermal image sensing system described in claim 2, wherein the at least one polarizer passes p-polarized light and filters s-polarized light. According to the thermal image sensing system described in claim 2, wherein the at least one polarizer includes a plurality of first parts and a plurality of second parts, the first parts allow p-polarized light to pass through and filter s-polarized light, the These second parts let s-polarized light pass and filter p-polarized light. According to the thermal image sensing system described in claim 4, wherein the at least one polarizer further includes a plurality of third parts, the third parts allow p-polarized light and s-polarized light to pass through, or the third parts Partially filters p-polarized light and s-polarized light. According to the thermal image sensing system described in claim 2, wherein the at least one light sensor includes a first light sensor and a second light sensor, and the at least one polarizer is arranged facing the On the path of the visible light transmitted by the first light sensor, the at least one polarizer allows p-polarized light to pass and filters s-polarized light, or the at least one polarizer allows s-polarized light to pass and filters p-polarized light. The thermal image sensing system according to the second item of the scope of patent application, wherein the thermal sensor is an infrared light sensor, and the infrared light sensor senses an infrared light from the object, and the thermal image The sensing system further includes: A light splitting element reflects one of the infrared light and the visible light, and allows the other of the infrared light and the visible light to pass through, and the at least one polarizer is disposed from the light splitting element toward the at least one light sensor The path of the visible light transmitted by the device. The thermal image sensing system according to claim 7, wherein the at least one light sensor includes a first light sensor and a second light sensor, and the at least one polarizer is disposed on the beam splitter Between the element and the first light sensor and between the light splitting element and the second light sensor, the at least one polarizer reflects the s-polarized light in the visible light and allows the p-polarized light in the visible light to pass through Transparent, the first light sensor receives p-polarized light passing through the at least one polarizer, and the second light sensor receives s-polarized light reflected by the at least one polarizer. The thermal image sensing system according to claim 1, wherein the thermal image sensing system includes a plurality of thermal sensors and a plurality of light sensors, and the thermal sensors and the light sensors The detectors are arranged in an array. A thermal image sensing method, including: Sensing a thermal radiation emitted by an object and correspondingly generating a thermal radiation image signal; Sensing a visible light reflected by the object and correspondingly generating at least one visible light image signal; Judging the material of the object according to the at least one visible light image signal; Determine the emissivity of the material of the object based on the material of the object; and The surface temperature of the object is calculated based on the emissivity of the material of the object and the heat radiation emitted by the object. The thermal image sensing method according to claim 10, wherein sensing the visible light reflected by the object and correspondingly generating the at least one visible light image signal includes: Filtering the s-polarized light in the visible light reflected by the object; and Sensing the p-polarized light in the visible light reflected by the object and generating a first optical signal, The material for judging the object based on the at least one visible light image signal includes: The material of the object is determined according to the first light signal. The thermal image sensing method of claim 10, wherein sensing the visible light reflected by the object and correspondingly generating the at least one visible light image signal includes: Filtering the s-polarized light in the visible light reflected by the object; Sensing the p-polarized light in the visible light reflected by the object and generating a first optical signal; and Sensing the p-polarized light and s-polarized light in the visible light reflected by the object and generating a second optical signal, The material for judging the object based on the at least one visible light image signal includes: The material of the object is determined according to the first light signal and the second light signal. The thermal image sensing method of claim 10, wherein sensing the visible light reflected by the object and correspondingly generating the at least one visible light image signal includes: Separating the s-polarized light and p-polarized light in the visible light reflected by the object; Sensing the p-polarized light in the visible light reflected by the object and generating a first optical signal; and Sensing the s-polarized light in the visible light reflected by the object and generating a third optical signal, The material for judging the object based on the at least one visible light image signal includes: The material of the object is determined according to the first light signal and the third light signal.

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